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WO2020020883A1 - Procédé pour la fabrication d'un profilé d'extrusion comportant au moins un composant électronique - Google Patents

Procédé pour la fabrication d'un profilé d'extrusion comportant au moins un composant électronique Download PDF

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Publication number
WO2020020883A1
WO2020020883A1 PCT/EP2019/069793 EP2019069793W WO2020020883A1 WO 2020020883 A1 WO2020020883 A1 WO 2020020883A1 EP 2019069793 W EP2019069793 W EP 2019069793W WO 2020020883 A1 WO2020020883 A1 WO 2020020883A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
structural layer
extrusion profile
electrical conductor
extrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/069793
Other languages
German (de)
English (en)
Inventor
Stefan Eibl
Ansgar NIEHOFF
Constanze Ranfeld
Steven Schmidt
Amin SHABANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rehau Automotive SE and Co KG
Original Assignee
Rehau AG and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rehau AG and Co filed Critical Rehau AG and Co
Publication of WO2020020883A1 publication Critical patent/WO2020020883A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154—Coating solid articles, i.e. non-hollow articles
    • B29C48/155—Partial coating thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0021—Combinations of extrusion moulding with other shaping operations combined with joining, lining or laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0023—Combinations of extrusion moulding with other shaping operations combined with printing or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/12—Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a method for producing an extrusion profile having at least one electronic component, a structural layer of the extrusion profile being extruded first, after which the electronic component, preferably as film-like tape, is expediently applied to the structural layer in a cohesive manner, e.g. is laminated on, and wherein the electronic component, preferably oriented in the form of a strand in the direction of extrusion, has at least one connection element for the electrical power supply.
  • touch foils are laminated onto the back of plastic components.
  • the touch foil is regularly connected to a central evaluation unit and a power supply.
  • the surface of the plastic component thus becomes a touch control panel, which can be used, for example, to control electrical consumers. Up to a certain length of the component (approx. 60 cm) only a central evaluation unit is required.
  • touch foils can also be laminated onto endless profiles.
  • Printed electronics is a new form of electronic components (eg OLED lighting elements) that are very thin, light and flexible. This enables new applications, for example through integration into previously inaccessible processes. So far, these new types of components have generally been processed using batch processes. More recent approaches envisage integrating OLEDs into extrusion products (eg edge bands, surface lights, etc.) ⁇ The length of the electrified extrudates should be cut as required.
  • the OLEDs are fed into the extrusion process as roll goods or individually on a roll roll carrier. After extrusion, the OLEDs are completely enclosed with the corresponding polymer. In order to be able to produce the functionality, the surrounding polymer must be opened so that the electrical connection elements of the OLEDs are accessible. However, this is problematic since the connecting elements have only a very small thickness and can therefore be easily damaged during mechanical processing to remove the polymer as desired (eg drilling, milling or punching).
  • the invention has for its object to provide a method with the features described above, which enables simplified electrical contacting of the connection element.
  • the object is achieved in that an electrically conductive, powdery or flowable substance is applied, in particular printed or sintered, to the connection element by means of a layering process, so that the at least one electrical conductor track resulting from the layering process is used for electrical connection points of the extrusion profile for forms the electronic component.
  • the flowable substance can be liquid or also pasty.
  • the substance can be, for example, an electrically conductive ink that is printed on the connection element.
  • screen printing, gravure and flexographic printing can be used as the printing process.
  • digital layering processes such as digital printing, dispensing or sintering processes, are also within the scope of the invention.
  • the electrical conductor track can be designed as an electrode.
  • the electrical conductor track represents a mechanical protective cover for the connection element.
  • the electrical conductor track is mechanically comparatively robust and provides a large contact available.
  • the electrical conductor track in particular when it is applied continuously along the structural layer, permits position-independent electrical contacting of the extrusion profile.
  • the electrical conductor track can supply the electronic component with current and / or data.
  • the electrical conductor track expediently has a layer thickness of at least 200 nm, in particular at least 1 pm. It is also within the scope of the invention that the electrically conductive substance contains electrically conductive particles with an average grain size of at most 5 pm, preferably at most 100 nm.
  • the electronic component is preferably designed to be light-emitting, in particular as an OLED or LED.
  • other electronic components such as e.g. Displays, sensors, in particular touch-sensitive foils or the like.
  • the electronic component expediently has at least two connection elements, and at least two electrical conductor tracks spaced apart from one another and preferably running parallel in the extrusion direction are provided for electrically contacting these connection elements.
  • the electronic component can be applied to the back of the structural layer.
  • the extrusion profile expediently comprises a plurality of electronic components arranged one behind the other in the extrusion direction. These can e.g. exist coherently as film-like tape goods or roll goods.
  • the rear side of the structural layer is provided with an adhesive material, preferably an adhesive (e.g. hot melt adhesive).
  • the adhesive material can also contain or consist of a copolymer, preferably a graft copolymer, particularly preferably a maleic anhydride-grafted polypropylene.
  • the adhesive material can also contain laser pigments so that it can be activated by means of laser radiation.
  • the adhesive material is expediently extruded or else liquid, e.g. by means of a dispenser. Subsequent activation of the adhesive martial allows the extrusion profile to be attached to other objects, e.g. Furniture panels, doors, windows or the like can be attached.
  • the adhesive material is expediently applied to the structural layer on both sides at the edge (possibly only on the edge) and thereby frames the electronic component provided with the electrical conductor track.
  • the electronic component is preferably first connected to the structural layer and then the connecting element of the electronic component is provided with the electrical conductor track.
  • This has the advantage that the extrusion of the structural layer on the one hand and the layering process on the other hand are decoupled from one another and can each be optimized in terms of process technology. It is also advantageous in terms of production technology if the structure layer serves as a stabilizing base under the electronic component to be coated during the layering process.
  • the connection between the structural layer and the electronic component can e.g. be produced by means of lamination or lamination.
  • the connecting element expediently has a cross-sectional thickness of at most 20 pm, preferably at most 2 pm.
  • the structural layer can have a cross-sectional thickness of at least 200 pm, preferably at least 500 pm.
  • the connection element is thus very thin compared to the structural layer.
  • the cross-sectional width B of the structural layer is expediently more than 0.5 cm, in particular more than 2 cm, e.g. 0.5 to 10 cm or 2 to 10 cm.
  • the structural layer is expediently designed as a, preferably transparent or translucent, plastic layer.
  • the transparency of the structure layer is particularly expedient if the electronic component is light-emitting (for example LED, OLED) and has been applied to the structure layer on the back.
  • the plastic layer can contain PMMA and / or PC and / or PP and / or PET and / or TPU and / or EVA or made of PMMA and / or PC and / or PP and / or PET and / or TPU and / or EVA exist.
  • a preferably rear cavity is formed in the structure layer - expediently during extrusion - which forms a receiving recess for the electronic component.
  • the cross-sectional shape of the cavity is expediently adapted to the cross-sectional shape of the electronic component. In particular, a flush termination between the electrical component and the surface of the structural layer can thus be produced.
  • this can simplify the layering process according to the invention on the connection element in terms of production technology.
  • extrusion profiles produced with the method according to the invention can be used in a variety of ways, for example as an edge band for furniture panels, as a door or window component, as a lighting element in motor vehicle or aircraft applications (for example light lens or room lighting) or as a labeling strip for supermarket shelves.
  • the extrusion profile can be designed as a luminous edge band, which is mounted on a narrow side of a table top for the purpose of generating atmospheric lighting.
  • the fields of application of the extrusion profile are not limited to the aforementioned applications.
  • the invention also relates to an extrusion profile produced using the above-described method according to the invention.
  • FIG. 3 shows a further embodiment of the invention in one of Fig. 1 d corresponding
  • Presentation. 1a to 1d show sequentially each in cross-section a method for producing an extrusion profile 2 having several electronic components 1 arranged one behind the other in the extrusion direction x (see FIGS. 2a-2c).
  • a structural layer 30 of the extrusion profile 2 is first extruded from a plastic material by means of an extrusion device (not shown) (FIG. 1 a).
  • the lined up electronic components 1, which in the exemplary embodiment are present as film-like tape goods are applied to the structural layer 30, for example by lamination.
  • the electronic components 1, one behind the other in the form of a strand in the direction of extrusion x each have two connection elements 3 in the form of a positive and a negative pole for the electrical power supply (see FIG. 2a).
  • an electrically conductive, powdery or flowable, in particular liquid or pasty substance 70 is applied to the connection elements 3 by means of a layering process (not shown in more detail) —printed or sintered on in the exemplary embodiment — so that the two resulting from the layering process , electrical conductor tracks 50 (see FIG. 2 b) aligned in the extrusion direction x form electrical connection points of the extrusion profile 2 for the electronic components 1.
  • the substance 70 can be, for example, an electrically conductive ink that is printed on the connection elements 3. Screen printing, gravure and also flexo printing or digital printing processes can be used as the printing process.
  • a drying process (not shown), e.g. by applying heat to dry the substance 70.
  • the electrical conductor tracks 50 can be designed as electrodes and can now supply the electronic components 1 with current and / or data. 2b, c that the electrical conductor tracks 50 electrically connect the electronic components 1 arranged one behind the other.
  • the electrical conductor tracks 50 have a layer thickness s of at least 200 nm, e.g. 500 nm to 1 pm.
  • the width b of the electrical conductor tracks is at least 1 mm, e.g. 2 mm to 5 mm.
  • the electrically conductive substance 70 contains electrically conductive particles (not shown) with an average grain size of at most 5 pm, e.g. 100 nm to 1 pm.
  • the electronic components 1 can be designed to emit light, in particular as an OLED or LED. However, other electronic components, such as displays, sensors, in particular touch-sensitive foils or the like, are also within the scope of the invention. As can be seen from FIGS. 2a-c, the electronic components each have two connection elements 3 on (positive and negative pole) and for electrical contacting of these connection elements 3, two electrical conductor tracks 50 spaced apart from one another and running parallel in the extrusion direction x are provided. It can also be seen that the electronic components 1 are applied to the back of the structural layer 30 (pointing upwards in FIGS. 1 a - d).
  • the rear side of the structural layer 30 is additionally coated with an adhesive material 6, e.g. a hot melt adhesive (Fig. 1 d).
  • the adhesive material 6 can also contain or consist of a copolymer, preferably a graft copolymer, particularly preferably a maleic anhydride-grafted polypropylene.
  • the adhesive material 6 can also contain laser pigments in order to be able to be activated by means of laser radiation.
  • the adhesive material 6 can be extruded or else liquid, e.g. by means of a dispenser, applied to the structure layer 30 or to the electronic components 1.
  • the production process of the extrusion profile 2 can also be ended in the state according to FIG. 1c. Any necessary attachment of the profile 2 to other objects can then e.g. through a subsequent application of an adhesive material, e.g. an adhesive, or in another way (riveting, screwing, etc.).
  • an adhesive material e.g. an adhesive
  • the adhesive material 6 is applied to the structure layer 30 on both sides at the edge in the form of tracks 100 in the extrusion direction x and thereby frames the electronic components 1 provided with the electrical conductor tracks 50 on.
  • another path 100 ′ made of adhesive material 6 is applied directly to the electronic components 1 in the middle between the two electrical conductor paths 50.
  • the webs 100, 100 'each have a width b H of at least 10% of the total width B of the profile 2, for example 1 mm to 6 mm. It can be seen from FIG.
  • the electronic components 1 are first connected to the structural layer 30, e.g. by means of a lamination or lamination process, and then provide the connecting elements 3 of the electronic components 1 with the electrical conductor tracks 50.
  • the connection elements 3 expediently have a cross-sectional thickness d of at most 20 pm, preferably at most 2 pm.
  • the structure layer 30 has a cross-sectional thickness D of at least 200 pm, preferably at least 500 pm.
  • the connection elements 3 are thus made very thin in comparison to the structural layer 30.
  • the cross-sectional width B of the structural layer 30 is more than 0.5 cm, in particular more than 2 cm, e.g. 0.5 to 10 cm or 2 to 10 cm.
  • the finished extrusion profile 2 shown in Fig. 2c can be cut to length between the individual electronic components 1, e.g. along the section line F.
  • the structural layer 30 is designed as a transparent or translucent and thus transparent plastic layer.
  • the electronic components 1 e.g. LED, OLED
  • the plastic layer can e.g. consist of PMMA.
  • a rear cavity 300 is formed in the structural layer 30 - expediently already by means of the extrusion - which forms a receiving recess for the electrical components 1.
  • the cross-sectional shape of the cavity 300 is adapted to the cross-sectional shape of the electronic components 1.
  • a flush seal is thereby produced on the rear side of the extrusion profile 2 between the electrical components 1 and the rear surface of the structural layer 30 (represented by the common plane E ′).
  • extrusion profiles 2 produced with the method according to the invention can be used in a variety of ways, for example as an edge band for narrow sides of furniture components, as a door or window component, as a lighting element in aircraft applications or as a labeling strip for supermarket shelves.
  • the extrusion profile 2 can be designed as a luminous edge band, which is used to create an atmospheric lighting device is mounted on a narrow side of a table top.
  • the areas of application of the extrusion profile 2 are, however, not limited to the aforementioned applications.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un procédé pour la fabrication d'un profilé d'extrusion (2) comportant au moins un composant (1) électronique. Une couche structurelle (30) du profilé d'extrusion (2) est dans un premier temps extrudée. Puis le composant (1) électronique est appliqué de préférence sous la forme d'un article en bande de type film, sur la couche structurelle (30). Le composant (1) électronique orienté de préférence à la manière d'un brin dans la direction d'extrusion (x) comporte au moins un élément de raccordement (3) servant à l'alimentation en courant électrique. Selon l'invention, une substance pulvérulente ou pouvant s'écouler électriquement conductrice est appliquée, en particulier par impression ou par frittage, sur l'élément de raccordement (3) au moyen d'une opération d'empilement de sorte que la ou les pistes conductrices (50) électriques se formant du fait de l'opération d'empilement forment des emplacements de raccordement électriques du profilé d'extrusion (2) pour le composant (1) électronique.
PCT/EP2019/069793 2018-07-24 2019-07-23 Procédé pour la fabrication d'un profilé d'extrusion comportant au moins un composant électronique Ceased WO2020020883A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018117805.0A DE102018117805A1 (de) 2018-07-24 2018-07-24 Verfahren zur Herstellung eines mindestens eine elektronische Komponente aufweisenden Extrusionsprofils
DE102018117805.0 2018-07-24

Publications (1)

Publication Number Publication Date
WO2020020883A1 true WO2020020883A1 (fr) 2020-01-30

Family

ID=67513486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/069793 Ceased WO2020020883A1 (fr) 2018-07-24 2019-07-23 Procédé pour la fabrication d'un profilé d'extrusion comportant au moins un composant électronique

Country Status (2)

Country Link
DE (1) DE102018117805A1 (fr)
WO (1) WO2020020883A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021112435A1 (de) 2021-05-12 2022-11-17 Homag Gmbh Verfahren zum Herstellen eines Möbel- oder Bauelements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010015420A1 (fr) * 2008-08-08 2010-02-11 Pp-Mid Gmbh Corps moulé polymère et système à circuit imprimé, ainsi que procédé de fabrication associé
EP2647269A1 (fr) * 2010-12-03 2013-10-09 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Procédé et appareil d'assemblage de composants électriques sur un substrat flexible et assemblage d'un composant électrique avec un substrat flexible
WO2018050827A2 (fr) * 2016-09-16 2018-03-22 Nordic Flex S.L Procédé de fabrication de film multicouche, film multicouche, dispositif capteur, feuille de capteur, équipement de sport, et procédé de détection de mouvements d'une cible

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012213309A1 (de) * 2012-07-30 2014-01-30 Osram Gmbh Verfahren zum Herstellen eines Leuchtbands und Leuchtband
DE102014221721B4 (de) * 2014-10-24 2017-09-21 Osram Gmbh Verfahren zur Herstellung eines bandförmigen Leuchtmoduls und nach diesem Verfahren hergestelltes Leuchtmodul
DE102017106291A1 (de) * 2016-10-12 2018-04-12 Gerhard Kager Verfahren zum Herstellen eines Leuchtdiodenbandes und Leuchtdiodenband

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010015420A1 (fr) * 2008-08-08 2010-02-11 Pp-Mid Gmbh Corps moulé polymère et système à circuit imprimé, ainsi que procédé de fabrication associé
EP2647269A1 (fr) * 2010-12-03 2013-10-09 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Procédé et appareil d'assemblage de composants électriques sur un substrat flexible et assemblage d'un composant électrique avec un substrat flexible
WO2018050827A2 (fr) * 2016-09-16 2018-03-22 Nordic Flex S.L Procédé de fabrication de film multicouche, film multicouche, dispositif capteur, feuille de capteur, équipement de sport, et procédé de détection de mouvements d'une cible

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