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WO2020019940A1 - Composant photosensible, panneau de composant photosensible, panneau de composant de moulage et procédé de fabrication - Google Patents

Composant photosensible, panneau de composant photosensible, panneau de composant de moulage et procédé de fabrication Download PDF

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Publication number
WO2020019940A1
WO2020019940A1 PCT/CN2019/093883 CN2019093883W WO2020019940A1 WO 2020019940 A1 WO2020019940 A1 WO 2020019940A1 CN 2019093883 W CN2019093883 W CN 2019093883W WO 2020019940 A1 WO2020019940 A1 WO 2020019940A1
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WO
WIPO (PCT)
Prior art keywords
cutting
molding
area
circuit board
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/093883
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English (en)
Chinese (zh)
Inventor
赵波杰
梅其敏
梅哲文
袁栋立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201821197077.2U external-priority patent/CN208581292U/zh
Priority claimed from CN201810834114.4A external-priority patent/CN110855853B/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of WO2020019940A1 publication Critical patent/WO2020019940A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera modules, and more specifically, to a photosensitive component, a photosensitive component panel, a molded component panel, and a manufacturing method, so as to avoid the influence of the connector size on cutting manufacturing.
  • the connector width of the camera module is greater than its light sensitivity.
  • Camera module with the entire width of the module is greater than its light sensitivity.
  • the production of camera modules generally uses a jigsaw process, as shown in Figure 1.
  • a circuit board puzzle is correspondingly molded or injection-molded to form a mirror seat puzzle, thereby forming a photosensitive component puzzle.
  • a plurality of connectors are respectively on two sides of the photosensitive component puzzle plate, and are electrically connected to corresponding photosensitive components.
  • the lens holder jigsaw and the circuit board jigsaw are cut by knife cutting or laser cutting to form a plurality of photosensitive component units.
  • the size of the connector is larger than the overall size of the photosensitive component, if a blade is used for cutting, the larger connector hinders the cutting of the photosensitive component product.
  • the blade is used to cut the mirror seat panel and the circuit board, it is easy to cut to the connector. It takes time and effort, and the yield is not high. Therefore, in order to avoid damage to the connector, the manufacturer will use other cutting methods, such as laser cutting, to cut the panel of the photosensitive component.
  • the lens holder of some camera modules will cover the capacitors on the edge of the circuit board, or even the edge part of the photosensitive chip, in order to increase the strength of the circuit board and reduce the size of the circuit board.
  • Purpose such as MOB and MOC processes. Therefore, during production, the mirror base panel will also cover the corresponding capacitor, or even the edge portion of the photosensitive chip, so as to achieve the aforementioned structure and purpose.
  • laser cutting takes a long time, and the long-term use of laser cutting EMC materials will cause high temperatures and other electronic components such as capacitors, gold wires, and even light-sensitive chips near the cutting point. It will also be damaged.
  • the current production and cutting solutions are not suitable for camera modules with connector sizes larger than the overall width of the photosensitive component. Blade cutting will damage the connector, and laser cutting will damage the photosensitive component, resulting in overall camera module production costs. High, high process requirements.
  • An object of the present invention is to provide a photosensitive component, a photosensitive component puzzle, a molded component puzzle, and a manufacturing method, wherein the photosensitive component puzzle is cut using a combination of mechanical cutting and laser cutting to avoid damage to connectors and electronic components. .
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component panel, a molded component panel, and a manufacturing method, wherein the manufacturing method is suitable for producing a camera module with a connector width greater than the entire width of the photosensitive component, without Breaking the connector will not affect the internal electronic components.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component puzzle, a molded component puzzle, and a manufacturing method, wherein the length of the photosensitive component puzzle (the two opposite sides with a connector are long) is used in the direction Mechanical cutting to avoid injury caused by laser cutting for a long time, and laser cutting is used in the width direction of the photosensitive component panel (the two opposite sides without the connector are set wide) to ensure that the connector will not hinder cutting.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component puzzle, a molded component puzzle, and a manufacturing method, wherein a circuit board puzzle of the photosensitive component puzzle is provided on two adjacent molds arranged along a length array. There is a cutting area between the plastic areas to provide space for laser cutting.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component puzzle, a molded component puzzle, and a manufacturing method, wherein the cutting area is not molded, that is, the molded photosensitive component is molded.
  • the plate forms a cutting gap in the cutting area, and the laser cutting cuts in the cutting gap, which is less difficult than directly cutting the molded lens holder, and the time required and the thickness of the cutting are reduced.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component jigsaw, a molded component jigsaw, and a manufacturing method, in which a laser is cut at the cutting gap to prevent the laser from directly acting on the mirror base jig, thereby reducing the possibility of laser cutting The damage.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component puzzle, a molded component puzzle, and a manufacturing method, in which a laser cuts the width direction of the photosensitive component puzzle along the cutting gap, and does not touch the photosensitive module puzzle.
  • Side connector so as to avoid damage to the connector, compared with the mechanical cutting method to cut the width direction, it is easier to control and reduce the difficulty.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component jigsaw, a molded component jigsaw, and a manufacturing method, wherein the longitudinal direction of the photosensitive element jig is mechanically cut, and the width direction is lasered along the cutting gap.
  • the cutting will not cause damage, so compared with the existing cutting method, the present invention has a higher yield and simple process.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component panel, a molded component panel, and a manufacturing method, wherein a mold is provided with a cutting area indenter corresponding to the cutting area, thereby ensuring that the molding material will not cover The cutting area forms the cutting gap, thereby ensuring that the laser can smoothly separate the cutting area.
  • Another object of the present invention is to provide a photosensitive component, a photosensitive component panel, a molded component panel, and a manufacturing method, wherein the photosensitive component panel is cut to form a plurality of photosensitive components.
  • the other peripheral surface of the photosensitive component is set as an inclined draft surface, thereby facilitating drafting.
  • the present invention further provides a photosensitive component puzzle including:
  • a circuit board assembly wherein the circuit board assembly has a plurality of molding areas, a plurality of cutting areas, a circulation area, and a plurality of installation areas, wherein the molding area and the circulation area border each other. , The molding material flows into the molding area through the circulation area, wherein the cutting area is arranged between adjacent molding areas;
  • a mirror base puzzle wherein the mirror base puzzle is integrally formed on the circuit board puzzle, covering the molding area and the circulation area, wherein the mirror base puzzle defines a plurality of The cutting gap of the cutting area;
  • a plurality of photosensitive chips wherein the photosensitive chip is installed in the installation area, and is electrically connected to the circuit board puzzle, and the mirror seat puzzle has a plurality of light windows corresponding to the photosensitive chip.
  • the molding area and the cutting area of the same row are arranged at intervals from each other in the length direction.
  • the molding areas and the cutting areas in adjacent rows are arranged in the same order, forming mutually spaced molding area columns and cutting area columns, wherein the cutting areas in the same column are replaced by The circulation area interval, wherein a molding material circulates between the adjacent molding area rows through the circulation area during molding.
  • the cutting area is implemented as a cutting hole.
  • the light window size gradually increases from low to high size.
  • the size of the cutting gap is gradually increased from low to high.
  • the cutting gap size gradually decreases from low to high size.
  • the circuit board jigsaw includes a plurality of connectors, wherein the connectors are correspondingly disposed on a length side of the circuit board jigsaw, and wherein the size of the connector is larger than that of the die.
  • the size of the plastic area is a plurality of connectors, wherein the connectors are correspondingly disposed on a length side of the circuit board jigsaw, and wherein the size of the connector is larger than that of the die. The size of the plastic area.
  • the lens holder puzzle plate encapsulates an edge region of each photosensitive chip.
  • the lens holder puzzle plate surrounds the outside of each photosensitive chip.
  • the present invention further provides a method for manufacturing a panel of a photosensitive component, including:
  • circuit board assembly fixing a circuit board assembly to a lower mold, wherein the circuit board assembly has a plurality of molding areas and a plurality of cutting areas, wherein the molding areas and the cutting areas of the same row are arranged at intervals from each other, Clamping an upper mold to the lower mold, pressing the upper mold to the cutting area, and forming a molding space between the upper mold and the molding area of the circuit board imposition;
  • the upper mold of the mold in the step (1) includes a plurality of second protruding portions, wherein the second protruding portions are formed by protruding the bottom surface of the upper mold, The second raised portion is pressed against the cutting area.
  • the cutting area in the step (1) is implemented as a cutting hole, wherein the second protruding portion blocks the cutting hole for preventing the molding material from entering the cutting hole.
  • the cutting area in the step (1) is implemented as a cutting hole, wherein a lower mold of the mold includes a plurality of second protrusions, and the second protrusions are formed by The upper surface of the lower mold is raised to fill the cutting hole, and abuts against the bottom surface of the upper mold of the mold.
  • the size of the second protrusion is smaller and smaller along the protrusion direction.
  • the molding regions and the cutting regions in adjacent rows in the step (1) are arranged in the same order, forming mutually spaced molding region columns and cutting region columns, wherein the same column
  • the cutting regions are arranged at intervals.
  • the circuit board has a plurality of mounting areas, wherein the mounting area is closedly surrounded by the corresponding molding area, wherein the upper mold of the mold The bottom surface is raised to form a plurality of first raised portions covering the mounting area.
  • the size of the first protrusion is smaller and smaller along the protrusion direction.
  • the step (4) further includes the steps:
  • the circuit board assembly in the step (1) is provided with a corresponding photosensitive chip, wherein an edge region of the photosensitive chip is located in the molding region, so that the step (3)
  • the lens mount is encapsulated in the edge area of the photosensitive chip.
  • the present invention further provides a method for manufacturing a photosensitive component, including:
  • the step (e) further includes the steps:
  • Laser cutting along the edges of the cutting area removes the cutting area and separates the molding areas of adjacent rows.
  • the step (f) further includes the steps:
  • the present invention further provides a photosensitive assembly, including:
  • At least one photosensitive chip At least one photosensitive chip
  • At least one circuit board wherein the photosensitive chip is operatively attached to the circuit board;
  • At least one connector wherein the connector is operatively disposed on one side of the circuit board;
  • At least one mirror base portion wherein the mirror base portion is integrally molded with the circuit board, wherein the respective outer side surfaces of the mirror base portion and the connector mounting side and their adjacent outer side surfaces are implemented as inclined Draft surface.
  • an outer side surface of the mirror seat portion and an opposite side of the connector mounting side is perpendicular to the circuit board.
  • the lens base portion integrally encapsulates an edge region of a photosensitive chip.
  • the edge of the circuit board corresponding to the draft surface adjacent to the connector mounting side is formed by laser cutting.
  • a dimension in a length direction of the circuit board is smaller than a dimension in a length direction of the connector.
  • the present invention further provides a molded component panel comprising:
  • a circuit board assembly wherein the circuit board assembly has a plurality of molding areas, a plurality of cutting areas, a circulation area, and a plurality of installation areas, wherein the molding area and the circulation area border each other.
  • the molding material enters the molding area through the circulation area, wherein the cutting area is arranged between the adjacent molding areas, and the mounting area is surrounded by the corresponding molding area for mounting photosensitive Chips and / or at least one electronic component;
  • a mirror base puzzle wherein the mirror base puzzle is integrally formed on the circuit board puzzle, covering the molding area and the circulation area, wherein the mirror base puzzle defines a plurality of The cutting gap of the cutting area is described.
  • FIG. 1 is a schematic structural diagram of a circuit board of a photosensitive module according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a circuit board according to the above preferred embodiment of the present invention after being molded.
  • FIG 3 is a cross-sectional view of a circuit board during the molding process according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a circuit board jigsaw of a photosensitive element jigsaw according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a circuit board molding process according to another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of another molding process of a circuit board jig according to another embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of a photosensitive component according to an embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of a photosensitive member according to another embodiment of the present invention.
  • 9A and 9B are schematic process flow diagrams of a method for manufacturing a photosensitive component according to an embodiment of the present invention.
  • FIG. 10 is a schematic flowchart of a method for manufacturing a photosensitive device according to an embodiment of the present invention.
  • the present invention provides a photosensitive component, a photosensitive component puzzle, a molded component puzzle and a manufacturing method, which can be applied to a camera module with a connector 20 larger than the overall size of the photosensitive component 110 without Breaking the connector 20 will not affect the internal photosensitive chip 111 and the electronic components 112.
  • a camera module suitable for a connector 20 having a size larger than the overall size of its photosensitive component can better embody the advantages of the present invention.
  • the photosensitive module of the camera module generally adopts a jigsaw process.
  • a circuit board jig 10 suitable for the photosensitive component jigsaw 100 according to the present invention wherein a plurality of connectors 20 are correspondingly disposed on both sides of the circuit board jig 10 and electrically connected to
  • the area corresponding to the circuit board assembly 10 is prepared for cutting into a plurality of photosensitive components 110.
  • two opposite sides of the connector 20 are set as the length of the circuit board jigsaw 10, and two opposite sides of the connector 20 are not provided as the width of the circuit board jigsaw 10 . That is, a direction extending along the long direction of the circuit board jigsaw 10 is the length direction, and a direction extending along the width of the circuit board jigsaw 10 is the width direction.
  • the elements are arranged in a row along the length direction and in a column along the width direction. This is only for convenience of explanation and is not a limitation.
  • the circuit board assembly 10 has a plurality of molding areas 11, a plurality of cutting areas 12, a circulation area 13, and a plurality of mounting areas 14, wherein the molding areas 11 are arranged in an array on the circuit board.
  • the jigsaw 10 is used for curing the molding material and the molding area 11 to form a mirror base jigsaw 30.
  • the cutting area 12 is not covered by the molding material to form a cutting gap 40 to provide space for laser cutting.
  • the circulation area 13 and each of the molding areas 11 border each other, so that a molding material can be circulated between the columns of the molding areas 11 through the circulation area 13, wherein the installation area 14 is used for installing a photosensitive Chips 111 and other components, wherein the molding area 11 is closed around the mounting area 14 so that the corresponding components can be packaged after the lens holder jig 30 is molded.
  • the components installed in the mounting area 14 may be different.
  • the mounting area is used to mount the photosensitive chip 111, and other electronic components 112 such as gold wires and capacitors are mounted to the molding area 11.
  • the photosensitive chip 111 and the The electronic components 112 are all installed in the installation area 14, and so on.
  • the circulation area 13 extends from one width end to the other width end of the circuit board panel 10.
  • the molding area 11 and the cutting area 12 are respectively arranged on both sides of the circulation area 13, and the molding area 11 and the cutting area 12 located on the same side of the circulation area 13 are spaced apart from each other. That is, the adjacent molding regions 11 arranged in an array along the length direction are spaced by the cutting regions 12.
  • the molding area 11 and the cutting area 12 are arranged in the same order on both sides of the circulation area 13, that is, both sides of the same section of the circulation area 13 are the molding area 11, A molding region row is formed, or both of the cutting regions 12 form a cutting region row.
  • the molding region rows and the cutting region rows are arranged at intervals to facilitate cutting the cutting region rows at one time, separating adjacent molding region rows, and simplifying the process.
  • the cutting area 12 is preferably a narrow and long area, which provides a certain space for cutting and reduces the occupied area.
  • the cutting region 12 extends from a long side of the circuit board assembly 10 in a width direction.
  • two cutting regions 12 in the same row opposite to each other are disposed at intervals to form the circulation region 13. That is, the adjacent cutting regions 12 arranged in an array in the width direction are spaced by the flow-through regions 13.
  • the circulation area 13 is bordered by two rows of the molding areas 11 on both sides thereof, and the molding material can be circulated between the rows of the molding areas 11 through the circulation area 13.
  • the molding regions 11 and the cutting regions 12 in the same row are disposed at intervals from each other.
  • the molding region 11 and the circulation region 13 in the same row are adjacent, and the cutting regions 12 in the same row are spaced by the circulation region 13.
  • the mold 200 used in the molding process of the present invention includes an upper mold 220 and a lower mold 230, wherein the upper mold 220 and the lower mold 230 are closed to define a molding space 210, in which a fluid
  • the shaped molding material enters the molding space 210 to perform steps such as molding.
  • the molding part of the mold 200 is the same as the conventional mold, except that the bottom surface of the mold 200 of the present invention is pressed against the cutting area 12 of the circuit board layout 10 to prevent the cutting area 12 from being damaged. Covering and molding to form the cutting gap 40.
  • the upper mold 220 and the lower mold 230 are closed, and the molding space 210 defined by the two corresponds to the molding.
  • the region 11 and the circulation region 13 are used for forming a fluid-state molding material to form the mirror base panel 30 at least integrally formed on the circuit board panel 10 after curing.
  • the upper mold 210 further includes a plurality of first raised portions 221 corresponding to the mounting area 14 and a plurality of second raised portions 222 corresponding to the cutting area 12, wherein the first raised portions 221 And the second convex portion 222 is convexly formed from the bottom surface of the upper mold 210.
  • the second protrusions 222 in the same row are spaced a predetermined distance apart to form a channel space 211 corresponding to the circulation area 13. That is, the flow of the molding material in the length direction is not blocked, so that the molding space 210 is filled, and the flow in the width direction in the cutting area 12 and the mounting area 14 is covered by the second protrusion 222. Blocked by the first raised portion 221 to form a reserved space.
  • the molding space 210 includes a channel space 211 and a plurality of molding unit spaces 212, wherein the channel space 211 corresponds to the circulation area 13, and the molding unit space 212 corresponds to the molding area 11, where each Each of the molding unit spaces 212 and the channel space 211 communicate with each other, and molding material flows from the channel space 11 to and fills the molding unit space.
  • the second raised portion 222 covers the cutting area 12, blocks a molding material, and forms the cutting gap 40.
  • the molding monomer space 212 covers the molding area 11, provides a curing space for the molding material, and forms a plurality of lens base portions 31.
  • the passage space 211 covers the circulation area 13 to form a connection portion 32.
  • the first protruding portion 221 covers the mounting area 14, prevents the molding material from contaminating the photosensitive chip 111, and forms a plurality of light windows 113.
  • the photosensitive chip 111 and the electronic component 112 may be installed first and then molded, and the bottom surface of the first protruding portion 221 is abutted against the surface of the photosensitive chip 111; in the MOB process, it may be molded first
  • the photosensitive chip 111 and the electronic component 112 are mounted, and the bottom surface of the first protruding portion 221 is abutted against the surface of the circuit board corresponding to the mounting area 14, which is merely an example and is not limited herein.
  • the cutting region 12 is implemented as a cutting hole.
  • the cutting holes are formed in the circuit board jigsaw 10 by presetting the spaces, so that the molding areas of the counterparts are intermittently set, wherein the adjacent molding area rows pass through the corresponding portions of the circulation area 13 connection.
  • the second protruding portion 222 may fill and fit into the cutting hole to prevent a molding material from flowing in, thereby forming the cutting gap 40.
  • the second protruding portion 222 covers, but does not embed or fill, the cutting hole, which can also prevent the molding material from flowing in.
  • the first raised portion 221 and the second raised portion 222 gradually increase in size from low to high.
  • the sizes of the light window 113 and the cutting gap 40 gradually increase from low to high sizes.
  • the other peripheral surface of the lens base portion 31 is implemented as an inclined draft surface, wherein the draft surface is inclined at an obtuse angle with respect to the cutting area 12. Is inclined at an acute angle with respect to the molding region 11. That is, the size of the second protruding portion 222 is smaller and smaller along its protruding direction.
  • FIG. 6 it is a modified embodiment of another embodiment of the present invention.
  • the second protruding portion 222 is provided on the lower mold 230 and is formed by protruding the upper surface of the lower mold 230.
  • the second raised portion 222 is passed through the cutting hole of the circuit board imposition 10 correspondingly, so as to position and fix the circuit board imposition 10 on the lower mold 230.
  • the top surface of the second protruding portion 222 abuts the bottom surface of the upper mold 220, thereby preventing the molding material from covering the cutting hole and forming the Cutting gap 40.
  • the size of the second protrusion 222 gradually decreases from low to high.
  • the size of the cutting gap 40 is gradually reduced from low to high, which is opposite to the foregoing embodiment.
  • the inclination angle of the draft surface of the lens base portion 31 may be different.
  • the draft surface is inclined at an obtuse angle with respect to the corresponding molding region 11.
  • the size of the first protrusion 221 is gradually increased from low to high.
  • the size of the light window 113 gradually increases from low to high. That is, the size of the second protruding portion 222 is smaller and smaller along its protruding direction.
  • the mirror base assembly 30 includes the connection portion 32 and a plurality of the lens base portions 31, wherein the lens base portion 31 is connectedly disposed on both sides of the connection portion 32, that is, the connection The section 32 is connected to each of the mirror seat sections 31, wherein the mirror seat sections 31 and the cutting gap 40 of the same row are arranged at intervals, and the cutting gaps 40 in the same row are spaced by the connecting section 32, The mirror base portion 31 is connected to the connecting portion 32.
  • the light-sensitive component jigsaw 100 has a plurality of cutting gaps 40, and includes the circuit board jigsaw 10, a plurality of the connectors 20, the mirror seat jigsaw 30, a plurality of A photosensitive chip 111 and a plurality of electronic components 112, wherein the photosensitive chip 111 and the electronic components 112 are electrically connected to each other in a region corresponding to the circuit board assembly 10, and the connectors 20 are correspondingly disposed in The length side of the circuit board jigsaw 10, wherein the mirror base jigsaw 30 is integrally molded on the circuit board jigsaw 10, and the mirror base portion 31 of the mirror base jigsaw 30 covers the mold.
  • the connecting portion 32 covers the circulation area 13, wherein the lens base portion 31 encapsulates the photosensitive chip 111 and the electronic component 112, and defines a light window 113 corresponding to the photosensitive chip 111, wherein the cutting gap 40
  • the mirror seat portions 31 adjacent to each other are separated, and the cutting gaps 40 in the same row are separated by the connection portion 32.
  • a laser is used to cut the width direction of the photosensitive component jigsaw 100 to separate the mirror seat portion 31 and the corresponding circuit board jigs 10 area of adjacent columns;
  • the connecting portion 32 is mechanically cut, such as a blade, to cut the length direction of the photosensitive component jigsaw 100, and to separate the areas of the mirror seat 31 and the corresponding circuit board jigs 10 in adjacent rows, so that A plurality of photosensitive components 110 are obtained.
  • the laser cutting is directed to the cutting gap 40, it does not directly affect the lens base portion 31, and at the same time, the cutting thickness is reduced, the time and process requirements for cutting are reduced, and damage to the packaged photosensitive chip 111 and electronic components 112 is reduced. Possible.
  • it is not affected by the size of the connector 20. The cutting in the longitudinal direction does not need to worry about the size of the connector 20, and the mechanical cutting process such as blade cutting is simple and the operation direction.
  • FIG. 7 and FIG. 8 are cross-sectional views of the photosensitive module 110 obtained after cutting.
  • the photosensitive component 110 includes a circuit board 114, the photosensitive chip 111, the electronic components 112, and the mirror base portion 31.
  • the basic structure of the photosensitive module 110 is the same as the conventional structure.
  • the photosensitive chip 111 and the electronic component 112 are electrically connected to the circuit board 114.
  • the mirror base 31 encapsulates the photosensitive chip 111 and the electronic component.
  • Device 112. According to different processes, the manner of packaging the lens base portion 31 is different. As shown in the figure, processes such as MOB, MOC, etc. may be used, and the present invention is not limited.
  • the circuit board 114 and the mirror base portion 31 are respectively obtained by cutting the circuit board jigsaw 10 and the mirror base jigsaw 30 through laser cutting and mechanical cutting.
  • the photosensitive member 110 is a cross-sectional view along the AA direction (that is, the length direction), and the two width end surfaces 312 and 313 of the lens base portion 31 are implemented as inclined drafting surfaces.
  • the circuit board 114 is inclined at an acute angle, and the two width end surfaces 312 and 313 are separated by laser cutting.
  • the two width ends 1141 and 1142 of the circuit board 114 are also separated by laser cutting, and have traces of burning after laser cutting.
  • the cutting area 12 when the cutting area 12 is implemented as a cutting hole, there may be fewer or no burn marks on the two width ends 1141 and 1142 of the circuit board 114.
  • the photosensitive member 110 is a cross-sectional view along the BB direction (that is, the width direction), and a long end surface 314 of the lens base portion 31 near the connector 20 is implemented as an inclined pull.
  • the mold surface is inclined at an acute angle with respect to the circuit board, and the other length end surface away from the connector 20 is implemented as a connection surface 311, which is substantially perpendicular to the circuit board, wherein the connection surface 311 of the mirror seat 31 is mechanically cut Income.
  • the other length end 1143 of the circuit board 114 on the same side as the connection surface 311 of the mirror base portion 31 is also obtained by mechanical cutting, and has traces of mechanical cutting.
  • traces exist only to illustrate the differences of the photosensitive components according to the present invention, and are not a limitation. Burning marks and mechanical cutting marks can be removed in a later step.
  • the manufacturing method of the present invention does not limit the structure of the module package, and can be applied to package structures such as MOC, MOB, COB, etc., which will not be repeated here.
  • the inclination angle and direction of the draft surface are merely examples, and are not limiting. When using a mold as shown in FIG. 6, the inclination angle and direction of the draft surface are opposite to those in the embodiment.
  • the present invention further provides a method for manufacturing a photosensitive component, which is applicable to the above-mentioned photosensitive component 110 to achieve the object of the present invention and solve the problems of the present invention.
  • Step 301 Fix a circuit board imposition to a lower mold, wherein the circuit board jig has a plurality of molding areas and a plurality of cutting areas, and the molding areas and the cutting areas in a same row are arranged at a distance from each other.
  • An upper mold is clamped to the lower mold, the upper mold is pressed to the cutting area, and a forming space is formed between the upper mold and the molding area of the circuit board imposition.
  • the bottom surface of the upper mold covers the cutting area in order to prevent a molding material from covering the cutting area, so that a cutting gap can be formed between adjacent molding areas.
  • the cutting areas are arranged intermittently between the adjacent two rows of the molding areas in order to ensure that the flow path in the length direction of the molding space is unblocked, and the molding material can be prevented from flowing from one width end to the other width end.
  • the bottom surface of the mold covers the mounting area of the component such as the photosensitive chip, thereby preventing the molding material from covering.
  • the molding material is a light-transmitting material
  • the molding material does not need to be avoided, that is, the bottom surface of the mold can be set at a preset distance from the mounting area of a component such as a photosensitive chip. That is, the circuit board may be provided with a photosensitive chip or not.
  • Step 303 Inject a molding material into the molding space.
  • the molding material may be a liquid material or a solid particulate material or a mixture of liquid and solid particles. It may be understood that whether the molding material is implemented as a liquid material or a solid particulate material or as a liquid and solid particle After being mixed into the molding space of the mold, the mixed material can be cured and molded.
  • Step 305 The molding material is cured to form a mirror base panel corresponding to the molding area.
  • the curing method may be different, such as thermosetting, and the present invention is not limited.
  • the formed mirror base panel covers the molding area and is integrally attached to the circuit board panel.
  • Step 307 Remove the mold to form a light-sensitive component puzzle.
  • the mold can be removed to obtain the photosensitive component jigsaw.
  • the photosensitive chip and a series of electronic components of the photosensitive component jigsaw may be installed at the corresponding positions of the circuit board jigsaw before step 303, or may be after the mold is removed in step 307. And is installed at a corresponding position to form the photosensitive component panel, which is not limited herein.
  • a bottom surface of the mold covers a mounting area of components such as the photosensitive chip, thereby forming a mounting space
  • Step 309 laser cut the photosensitive component circuit board along the cutting area, and separate the molding area and the corresponding mirror seat board from adjacent columns.
  • Laser cutting is very suitable for modules whose connector size is larger than the overall size of the photosensitive component.
  • the cutting area is not molded, and the formed cutting gap provides space for laser cutting, reducing the energy and time required for laser cutting.
  • Step 311 Separate the molding areas of the adjacent rows and the corresponding mirror base puzzle pieces by mechanical cutting.
  • the molding areas of the adjacent rows and the corresponding mirror block puzzle parts are mechanically cut to protect the internal photosensitive chips and electronic components and avoid the disadvantages of laser cutting.
  • step 309 and step 311 is not limited, and those skilled in the art may perform step 311 before performing step 309. Therefore, the mechanical cutting and laser cutting methods adopted in the present invention are used for cutting to avoid damaging the connector and electronic components. The workability is high and the process requirements are simple.
  • laser cutting removes the entire cutting area 12 along the edge of the cutting area 12. In the actual cutting process, it may be necessary to perform laser cutting twice along the two broad sides of the cutting area 12 respectively. Alternatively, mechanically cutting along the edges of the circulation area 13 while separating the circulation area and the corresponding connection portion 32, separating the molding area 13 of the adjacent row and the corresponding mirror block puzzle portion . Of course, those skilled in the art may first perform laser cutting in the extending direction of the cutting area, and perform mechanical cutting along the circulation area once to form the photosensitive component single body, and then cut off the excess one by one, which is not limited by the present invention.
  • the photosensitive component jigsaw 100 can be produced, and details are not described herein again.
  • the molded component panel can be obtained by firstly obtaining a molded component panel through steps 301 to 305, and then installing the photosensitive chip and the electronic component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un composant photosensible, un panneau de composant photosensible, un panneau de composant de moulage et un procédé de fabrication. Le panneau de composant photosensible comprend : un panneau de carte de circuit imprimé, le panneau de carte de circuit imprimé ayant une pluralité de régions de moulage, une pluralité de régions de coupe, une région de circulation, et une pluralité de régions de montage, les régions de moulage bordant la région de circulation, et les régions de coupe étant agencées entre des régions de moulage adjacentes; un panneau de base de lentille, le panneau de base de lentille étant formé d'un seul tenant sur le panneau de carte de circuit imprimé pour recouvrir les régions de moulage, le panneau de base de lentille définissant une pluralité d'espaces de coupe correspondant aux régions de coupe; et une pluralité de puces photosensibles, les puces photosensibles étant montées sur les régions de montage et électriquement connectées au panneau de carte de circuit imprimé, et le panneau de base de lentille ayant une pluralité de fenêtres de lumière correspondant aux puces photosensibles. Par conséquent, la présente invention utilise une combinaison de découpe mécanique et de découpe au laser pour réduire la probabilité d'endommagement de composant.
PCT/CN2019/093883 2018-07-26 2019-06-28 Composant photosensible, panneau de composant photosensible, panneau de composant de moulage et procédé de fabrication Ceased WO2020019940A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201821197077.2U CN208581292U (zh) 2018-07-26 2018-07-26 感光组件、感光组件拼板以及模塑组件拼板
CN201810834114.4A CN110855853B (zh) 2018-07-26 2018-07-26 感光组件、感光组件拼板、模塑组件拼板以及制造方法
CN201810834114.4 2018-07-26
CN201821197077.2 2018-07-26

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WO2020019940A1 true WO2020019940A1 (fr) 2020-01-30

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080160658A1 (en) * 2007-01-03 2008-07-03 Harvatek Corporation Mold structure for packaging led chips and method thereof
CN102244064A (zh) * 2010-05-12 2011-11-16 矽品精密工业股份有限公司 条状封装基板及其排版结构
CN102496622A (zh) * 2011-11-25 2012-06-13 格科微电子（上海）有限公司 图像传感器芯片的封装方法以及摄像模组
CN107466159A (zh) * 2016-06-06 2017-12-12 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
CN107682596A (zh) * 2016-08-01 2018-02-09 宁波舜宇光电信息有限公司 模塑感光组件及其拼板和制作方法
CN208581292U (zh) * 2018-07-26 2019-03-05 宁波舜宇光电信息有限公司 感光组件、感光组件拼板以及模塑组件拼板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080160658A1 (en) * 2007-01-03 2008-07-03 Harvatek Corporation Mold structure for packaging led chips and method thereof
CN102244064A (zh) * 2010-05-12 2011-11-16 矽品精密工业股份有限公司 条状封装基板及其排版结构
CN102496622A (zh) * 2011-11-25 2012-06-13 格科微电子（上海）有限公司 图像传感器芯片的封装方法以及摄像模组
CN107466159A (zh) * 2016-06-06 2017-12-12 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
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CN208581292U (zh) * 2018-07-26 2019-03-05 宁波舜宇光电信息有限公司 感光组件、感光组件拼板以及模塑组件拼板

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