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WO2020098852A3 - Cutting, grinding and polishing disk, and method for machining workpieces - Google Patents

Cutting, grinding and polishing disk, and method for machining workpieces Download PDF

Info

Publication number
WO2020098852A3
WO2020098852A3 PCT/DE2019/000296 DE2019000296W WO2020098852A3 WO 2020098852 A3 WO2020098852 A3 WO 2020098852A3 DE 2019000296 W DE2019000296 W DE 2019000296W WO 2020098852 A3 WO2020098852 A3 WO 2020098852A3
Authority
WO
WIPO (PCT)
Prior art keywords
tool
cutting
disk
shaped
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2019/000296
Other languages
German (de)
French (fr)
Other versions
WO2020098852A2 (en
Inventor
Armin Wittmann
Jonas Ferring
Tobias EHLENZ
Dietmar Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hochschule Trier - Trier University of Applied Sciences
Original Assignee
Hochschule Trier - Trier University of Applied Sciences
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to RS20220568A priority Critical patent/RS63356B1/en
Priority to BR112021009305-2A priority patent/BR112021009305B1/en
Priority to ES19827595T priority patent/ES2920478T3/en
Priority to EA202191191A priority patent/EA202191191A1/en
Priority to MX2021005602A priority patent/MX2021005602A/en
Priority to CA3119695A priority patent/CA3119695A1/en
Priority to EP19827595.0A priority patent/EP3826807B8/en
Priority to HRP20220779TT priority patent/HRP20220779T1/en
Priority to DK19827595.0T priority patent/DK3826807T3/en
Priority to US17/293,747 priority patent/US20220009014A1/en
Application filed by Hochschule Trier - Trier University of Applied Sciences filed Critical Hochschule Trier - Trier University of Applied Sciences
Priority to SI201930265T priority patent/SI3826807T1/en
Priority to JP2021526454A priority patent/JP7621250B2/en
Priority to SG11202105026RA priority patent/SG11202105026RA/en
Priority to PL19827595.0T priority patent/PL3826807T3/en
Priority to CN201980081854.8A priority patent/CN113613840A/en
Priority to AU2019379955A priority patent/AU2019379955B2/en
Publication of WO2020098852A2 publication Critical patent/WO2020098852A2/en
Publication of WO2020098852A3 publication Critical patent/WO2020098852A3/en
Anticipated expiration legal-status Critical
Priority to ZA2021/03781A priority patent/ZA202103781B/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2205/00—Grinding tools with incorporated marking device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Milling Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

The invention relates to a disk-shaped cutting tool (1), to a radial cutting method for machining axially elongate workpieces, to a cutting device and to a use of a disk-shaped cutting tool. A disk-shaped cutting tool according to the invention has defined flexibility and a defined impact. In a radial cutting method according to the invention, lateral deflection of the axially stationarily rotating tool (1) brings the tool, by means of the at least one laterally applied grinding and polishing surface (6, 20, 21, 22), into axial effective contact with the workpiece to be machined. In a cutting device according to the invention, the cutting tool (1) can be moved only radially in order to machine the workpiece. A use, according to the invention, of a disk-shaped tool (1) serves the purpose of specimen preparation and subsequent surface analysis on a workpiece cut to length.
PCT/DE2019/000296 2018-11-13 2019-11-13 Disk-shaped tool and method for machining workpieces, cutting device, and use of a cutting, grinding and polishing disk to produce a surface structure on a workpiece Ceased WO2020098852A2 (en)

Priority Applications (17)

Application Number Priority Date Filing Date Title
RS20220568A RS63356B1 (en) 2018-11-13 2015-12-01 DISC FOR CUTTING, GRINDING AND POLISHING AND PROCEDURE FOR PROCESSING WORKPIECES
SI201930265T SI3826807T1 (en) 2018-11-13 2019-11-13 Cutting, grinding and polishing disk, and method for machining workpieces
EA202191191A EA202191191A1 (en) 2018-11-13 2019-11-13 DISC TOOL AND METHOD FOR PROCESSING BILLS, CUTTING DEVICE AND APPLICATION OF CUTTING GRINDING AND POLISHING DISC TO CREATE SURFACE STRUCTURE ON BILLET
MX2021005602A MX2021005602A (en) 2018-11-13 2019-11-13 DISC TOOL AND SYSTEM FOR MACHINING WORKPIECES, CUTTING DEVICE AND USE FOR CUTTING, GRINDING AND POLISHING DISCS WHICH ALLOWS THE CREATION OF A SURFACE STRUCTURE ON THE WORKPIECES.
CA3119695A CA3119695A1 (en) 2018-11-13 2019-11-13 Disk-shaped tool and method for machining workpieces, cutting device and use of a cutting, grinding and polishing disk to produce a surface structure on a workpiece
EP19827595.0A EP3826807B8 (en) 2018-11-13 2019-11-13 Cutting, grinding and polishing disk, and method for machining workpieces
HRP20220779TT HRP20220779T1 (en) 2018-11-13 2019-11-13 Cutting, grinding and polishing disk, and method for machining workpieces
DK19827595.0T DK3826807T3 (en) 2018-11-13 2019-11-13 CUTTING, GRINDING AND POLISHING DISC AND CUTTING DEVICE AS WELL AS PROCEDURE
US17/293,747 US20220009014A1 (en) 2018-11-13 2019-11-13 Disk-shaped tool and method for machining workpieces, cutting device, and use of a cutting, grinding and polishing disk to produce a surf ace structure on a workpiece
BR112021009305-2A BR112021009305B1 (en) 2018-11-13 2019-11-13 DISC-SHAPED TOOL AND METHOD FOR MACHINING PARTS, CUTTING DEVICE AND USING A CUTTING, GRINDING AND POLISHING DISC TO PRODUCE A SURFACE STRUCTURE IN ONE PART
SG11202105026RA SG11202105026RA (en) 2018-11-13 2019-11-13 Disk-shaped tool and method for machining workpieces, cutting device and use of a cutting, grinding and polishing disk to produce a surface structure on a workpiece
ES19827595T ES2920478T3 (en) 2018-11-13 2019-11-13 Cutting, grinding and polishing disc, and procedure for machining work pieces
JP2021526454A JP7621250B2 (en) 2018-11-13 2019-11-13 Disc-shaped tool and method for machining a workpiece, cutting device and use of cutting, grinding and abrasive discs for producing surface structures on a workpiece - Patents.com
PL19827595.0T PL3826807T3 (en) 2018-11-13 2019-11-13 Separating, grinding and polishing disc, separating device and method of processing workpieces
CN201980081854.8A CN113613840A (en) 2018-11-13 2019-11-13 Disk-shaped tool and method for machining a workpiece, cutting device and use of a cutting, grinding and polishing disk for producing a surface structure on a workpiece
AU2019379955A AU2019379955B2 (en) 2018-11-13 2019-11-13 Cutting, grinding and polishing disk, and method for machining workpieces
ZA2021/03781A ZA202103781B (en) 2018-11-13 2021-06-02 Cutting, grinding and polishing disk, and method for machining workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018008920.8 2018-11-13
DE102018008920.8A DE102018008920A1 (en) 2018-11-13 2018-11-13 Disc-shaped tool and method for machining workpieces, cutting device and use of a cutting, grinding and polishing disc to produce a surface structure on a workpiece

Publications (2)

Publication Number Publication Date
WO2020098852A2 WO2020098852A2 (en) 2020-05-22
WO2020098852A3 true WO2020098852A3 (en) 2020-07-09

Family

ID=69005173

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2019/000296 Ceased WO2020098852A2 (en) 2018-11-13 2019-11-13 Disk-shaped tool and method for machining workpieces, cutting device, and use of a cutting, grinding and polishing disk to produce a surface structure on a workpiece

Country Status (20)

Country Link
US (1) US20220009014A1 (en)
EP (1) EP3826807B8 (en)
JP (1) JP7621250B2 (en)
CN (1) CN113613840A (en)
AU (1) AU2019379955B2 (en)
CA (1) CA3119695A1 (en)
CL (1) CL2021001262A1 (en)
DE (1) DE102018008920A1 (en)
DK (1) DK3826807T3 (en)
EA (1) EA202191191A1 (en)
ES (1) ES2920478T3 (en)
HR (1) HRP20220779T1 (en)
HU (1) HUE059056T2 (en)
MX (1) MX2021005602A (en)
PL (1) PL3826807T3 (en)
RS (1) RS63356B1 (en)
SG (1) SG11202105026RA (en)
SI (1) SI3826807T1 (en)
WO (1) WO2020098852A2 (en)
ZA (1) ZA202103781B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114224537B (en) * 2021-12-31 2024-02-13 东莞市爱嘉义齿有限公司 Processing technology for durable clean dentures
IT202300001068A1 (en) * 2023-01-25 2024-07-25 Antonino Previti IMPROVED DIAMOND TOOL
CN119839692B (en) * 2025-01-24 2025-10-24 合肥工业大学 Electrochemical gradient thickening-excitation micro-motion composite conformal polishing ultra-precision manufacturing method and device

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US2064017A (en) * 1936-09-18 1936-12-15 Leschen & Sons Rope Company A Apparatus for cutting wire rope, cable, and the like
US4989372A (en) * 1988-07-27 1991-02-05 The Boeing Company Precision radial arm saw for composite materials
DE4409748A1 (en) * 1994-03-22 1995-09-28 Alfred Biermann Method of separating material for use in laboratories
GB2335161A (en) * 1998-03-11 1999-09-15 Scintilla Ag Tool with wear indicator
DE20108804U1 (en) * 2001-05-21 2001-08-23 Förster, Klaus, 53909 Zülpich Cut-off machine
DE20109636U1 (en) * 2001-06-08 2002-03-28 DIEWE Diamantwerkzeuge GmbH, 86510 Ried cutting wheel
JP2002252186A (en) * 2001-02-23 2002-09-06 Umc Japan Cutter for semiconductor wafer
US6632131B1 (en) * 2000-02-03 2003-10-14 Terry L. Buchholz Combination rotary cutting and sanding blade
US20050224063A1 (en) * 2004-03-09 2005-10-13 Noritake Co., Limited Rotary cutting saw with improved heat dissipation performance
WO2008025045A1 (en) * 2006-08-29 2008-03-06 Schaepermeier Egbert Method for the machining of mineral materials by material removal and tool for carrying out the method
WO2011029106A2 (en) * 2010-12-16 2011-03-10 Saint-Gobain Abrasives, Inc. A slot wear indicator for a grinding tool

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US3081584A (en) * 1962-06-12 1963-03-19 George H Bullard Co Inc Abrasive wheel
US3867795A (en) * 1973-10-16 1975-02-25 Norton Co Composite resinoid bonded abrasive wheels
JPS57157460U (en) * 1981-03-26 1982-10-02
JPS5859566U (en) * 1981-10-15 1983-04-22 山一電機工業株式会社 Rotary polishing machine for optical fiber
JPS59143651U (en) * 1983-03-17 1984-09-26 額賀　義盛 cutting “to” stone
US4962748A (en) * 1987-11-09 1990-10-16 Schweickhardt Karl B Diamond abrasive saw blade and method of dry sawing concrete
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Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2064017A (en) * 1936-09-18 1936-12-15 Leschen & Sons Rope Company A Apparatus for cutting wire rope, cable, and the like
US4989372A (en) * 1988-07-27 1991-02-05 The Boeing Company Precision radial arm saw for composite materials
DE4409748A1 (en) * 1994-03-22 1995-09-28 Alfred Biermann Method of separating material for use in laboratories
GB2335161A (en) * 1998-03-11 1999-09-15 Scintilla Ag Tool with wear indicator
US6632131B1 (en) * 2000-02-03 2003-10-14 Terry L. Buchholz Combination rotary cutting and sanding blade
JP2002252186A (en) * 2001-02-23 2002-09-06 Umc Japan Cutter for semiconductor wafer
DE20108804U1 (en) * 2001-05-21 2001-08-23 Förster, Klaus, 53909 Zülpich Cut-off machine
DE20109636U1 (en) * 2001-06-08 2002-03-28 DIEWE Diamantwerkzeuge GmbH, 86510 Ried cutting wheel
US20050224063A1 (en) * 2004-03-09 2005-10-13 Noritake Co., Limited Rotary cutting saw with improved heat dissipation performance
WO2008025045A1 (en) * 2006-08-29 2008-03-06 Schaepermeier Egbert Method for the machining of mineral materials by material removal and tool for carrying out the method
WO2011029106A2 (en) * 2010-12-16 2011-03-10 Saint-Gobain Abrasives, Inc. A slot wear indicator for a grinding tool

Also Published As

Publication number Publication date
BR112021009305A2 (en) 2021-08-10
SI3826807T1 (en) 2022-08-31
CA3119695A1 (en) 2020-05-22
HRP20220779T1 (en) 2022-10-14
US20220009014A1 (en) 2022-01-13
DE102018008920A1 (en) 2020-05-14
JP7621250B2 (en) 2025-01-24
SG11202105026RA (en) 2021-06-29
WO2020098852A2 (en) 2020-05-22
CL2021001262A1 (en) 2021-12-24
RS63356B1 (en) 2022-07-29
AU2019379955A1 (en) 2021-06-17
EA202191191A1 (en) 2021-10-12
EP3826807A2 (en) 2021-06-02
HUE059056T2 (en) 2022-10-28
PL3826807T3 (en) 2022-08-01
JP2022507483A (en) 2022-01-18
ZA202103781B (en) 2022-04-28
EP3826807B8 (en) 2022-05-18
AU2019379955B2 (en) 2024-11-07
CN113613840A (en) 2021-11-05
ES2920478T3 (en) 2022-08-04
MX2021005602A (en) 2021-09-21
DK3826807T3 (en) 2022-06-27
EP3826807B1 (en) 2022-04-13

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