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WO2020082212A1 - Substrat flexible, panneau flexible et appareil électronique - Google Patents

Substrat flexible, panneau flexible et appareil électronique Download PDF

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Publication number
WO2020082212A1
WO2020082212A1 PCT/CN2018/111236 CN2018111236W WO2020082212A1 WO 2020082212 A1 WO2020082212 A1 WO 2020082212A1 CN 2018111236 W CN2018111236 W CN 2018111236W WO 2020082212 A1 WO2020082212 A1 WO 2020082212A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
region
flexible
hardness
hard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/111236
Other languages
English (en)
Chinese (zh)
Inventor
雷晓华
李贺
胡康军
陈鑫
朱林
袁泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/111236 priority Critical patent/WO2020082212A1/fr
Priority to CN201880096022.9A priority patent/CN112889144A/zh
Publication of WO2020082212A1 publication Critical patent/WO2020082212A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the invention relates to the technical field of electronics, in particular to a flexible substrate, a flexible panel and electronic equipment.
  • Flexible electronic devices such as flexible touch panels
  • have outstanding characteristics such as easy bending, convenient carrying, and bending resistance, and have attracted more and more attention.
  • the functional layer (such as the touch electrode layer) provided on the flexible substrate needs to be led out and bonded to the electronic device on the flexible substrate, however, the temperature and pressure applied during the bonding and bonding are high Higher, it is easy to damage the flexible substrate, so the flexible substrate cannot meet the process implementation conditions of the binding material and cannot be effectively bound and connected.
  • embodiments of the present invention disclose a flexible substrate, a flexible panel, and an electronic device that are not easily damaged.
  • a flexible substrate including a first region and a second region connected to the first region, a portion of the flexible substrate located in the second region has a hardness greater than that of the flexible substrate located in the first region
  • the hardness of the part of the area, and the second area of the flexible substrate is used for binding bonding of electronic devices.
  • a flexible panel includes the flexible substrate as described above.
  • An electronic device includes the flexible panel as described above.
  • the flexible substrate, the flexible panel and the electronic equipment provided by the present invention because the flexible substrate includes a second area for bonding and bonding of electronic devices, so that when the electronic device is bonding and bonding in the second area,
  • the flexible substrate is not easy to be damaged and deformed, prolongs the service life of the flexible substrate, and solves the problem that the flexible substrate cannot be effectively bound and connected.
  • FIG. 1 is a schematic perspective view of a flexible substrate provided by the first embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a hard structure provided by an embodiment of the present invention.
  • FIG 3 is a perspective schematic view of a flexible substrate provided by a second embodiment of the present invention.
  • FIG. 4 is a perspective schematic view of a flexible substrate provided by a third embodiment of the present invention.
  • FIG. 5 is a perspective schematic view of a flexible substrate provided by a fourth embodiment of the present invention.
  • FIG. 6 is a schematic perspective view of a flexible substrate provided by a fifth embodiment of the present invention.
  • FIG. 7 is a schematic perspective view of a flexible panel provided by an embodiment of the present invention.
  • FIG. 8 is a schematic front view of an electronic device provided by an embodiment of the present invention.
  • FIG. 1 is a three-dimensional schematic diagram of a flexible substrate according to a first embodiment of the present invention.
  • the flexible substrate 10 includes a first region 11 and a second region 13 connected to the first region 11.
  • the portion of the flexible substrate 10 located in the second region 13 has a greater hardness than the portion located in the first region 11.
  • the second region 13 Used for bonding bonding of electronic devices (not shown). Since the flexible substrate 10 includes the second region 13 for bonding and bonding with the electronic device, when the electronic device is bonding and bonding on the second region 13, the flexible substrate 10 is not easily damaged and deformed, and the flexible substrate is extended The service life of wood 10.
  • the manufacturing material of the flexible substrate 10 located in the first region 11 portion is the first material
  • the manufacturing material of the flexible substrate 10 located in the second region 13 portion is the second material
  • the second material is different from the first material
  • the second material includes a hard material.
  • the hardness of the first material is less than the hardness of the second material. That is, the material of the flexible substrate 10 located in the second region 13 includes a hard material.
  • the flexible substrate 10 is substantially plate-shaped.
  • the flexible substrate 10 further includes a flexible body 15 and a hard structure 17, the hard material is combined with the flexible body 15 to form the second region 13 of the flexible substrate 10, the hard material is located in the The second region forms a hard structure 17, and the first region 11 of the flexible substrate 10 is provided with only the flexible body 15, so that the portion of the flexible substrate 10 located in the second region 13 is harder than the portion located in the first region 11 hardness.
  • the hard material is used to increase the hardness of the flexible substrate 10 in the second region 13 and further improve the mechanical and mechanical properties of the flexible substrate 10 in the second region 13 so that the flexible substrate 10 is located in the second region
  • the part 13 is resistant to high temperature and pressure.
  • the hard structure 17 is a three-dimensional network structure, and the flexible body 15 and the chain structure of the hard material are fitted into one body.
  • the height of the second region 13 is the same as the thickness of the flexible substrate 10, so that the flexible substrate 10 forms a structure with a flat surface and improved surface hardness in the second region 13, which facilitates binding of electronic devices in the second region 13.
  • the first material may be a thermoplastic elastomer plastic material such as polyurethane, silicone, rubber, or the like.
  • the flexible body 15 can be formed into a film by processes such as blow molding, calendering, casting, and casting.
  • the hard material includes an insulated metal.
  • the insulation treatment may be an insulation treatment method such as coating an insulation material on the metal surface. It can be understood that the material of the hard structure 17 is not limited to insulated metal, but may be at least insulated metal, high-strength polyester nylon, glass fiber, and insulated high-strength carbon fiber. One kind.
  • the first material may also be a thermosetting plastic material, such as vulcanized rubber.
  • the hard material forms a hard structure 17 to form the second region 13 of the flexible substrate 10.
  • the first material may flow into a liquid or semi-liquid state, and the hard material is mixed and filled in the local area to form a hard structure 17 to form Second area 13.
  • the heating temperature is 130-180 degrees Celsius, a pressure of 0.1-5 MPa is applied, and the temperature is maintained for 10-30 seconds, the flexible body 15 is made
  • the material is in a flowing liquid state or a semi-liquid state; after cooling, the hard structure 17 formed of the hard material is integrated with the flexible body 15 at the position of the second region 13 as a mechanical skeleton to form the second region 13 of the flexible substrate 10, in other words
  • the flexible body 15 and the segment structure of the hard material are fitted with each other to form an integral body.
  • the overall material hardness after compounding is between the hardness of each component.
  • the first material with low hardness is liquid or semi-liquid
  • a hard material is filled in a predetermined area, thereby generating a portion of the flexible substrate 10 located in the second area 13 having a hardness higher than that of the first material.
  • the local area of the prefabricated base material is heated and pressed to fill or embed the hard structure 17 into the local area. After cooling, a flexible substrate 10 with a uniform thickness is finally formed.
  • the bonding temperature range is usually 150-160 degrees Celsius
  • the applied pressure range is 1-3Mpa
  • the time is 10-20 seconds, which is calculated according to the pencil hardness standard.
  • the hardness of the flexible substrate 10 in the second region 13 is greater than the hardness of HB.
  • the second region 13 of the flexible substrate 10 will not be affected by Damaged by binding temperature and pressure.
  • the hard structure 17 may not be a three-dimensional network structure, and the hard structure 17 may be a two-dimensional network structure, that is, as shown in FIG. 2, the hard structure may also be a sheet-like network structure.
  • the hard structure 17 may also be a non-network structure.
  • the hard structure 17 may be a sheet.
  • the flexible body 15 forms a receiving slot in the second region 13. The hard structure 17 is received in the receiving slot and is connected to the receiving The side walls of the groove are joined together.
  • FIG. 3 is a perspective schematic view of a flexible substrate provided by a second embodiment of the present invention.
  • the flexible substrate 20 is similar in structure to the flexible substrate 10 provided in the first embodiment.
  • the flexible substrate 20 includes a first region 21 and a second region 23 connected to the first region 21.
  • the hardness of the portion of the flexible substrate 20 located in the second region 23 is greater than the hardness of the portion of the flexible substrate 20 located in the first region 21.
  • the second area 23 is used for bonding of electronic devices.
  • the flexible substrate 20 is different from the flexible substrate 10 provided in the first embodiment in that the hard material in the material of the flexible substrate 20 located in the portion of the second region 23 is micro-nano particles.
  • the manufacturing material of the flexible substrate 20 provided in the first region 21 is the first material
  • the manufacturing material of the flexible substrate 20 located in the second region 23 is the second material.
  • the second material is made by doping the first material with a mixed hard material.
  • the first material is an organic material
  • the micro-nano particles are inorganic particulate silicon powder.
  • the surface of the inorganic particle powder is modified, such as lipophilic treatment, and polymer dispersion is added
  • the agent is coated on the surface of the particles, and the particles are treated with a coupling agent to provide affinity groups of organic and inorganic materials to improve the fusion effect.
  • micro-nano particles are not limited, for example, the micro-nano particles include calcium powder, silicon nitride powder, silica powder, alumina powder, micro-nano-length glass fiber, insulation-treated micro-nano-length carbon fiber, hard At least one of qualitative plastic micro-nano particles.
  • FIG. 4 is a perspective schematic view of a flexible substrate provided by a third embodiment of the present invention.
  • the flexible substrate 30 is similar in structure to the flexible substrate 20 provided in the second embodiment, except that the flexible substrate 30 further includes a third region 35, and the portion of the flexible substrate 30 located in the third region 35 has a hardness less than that of the flexible substrate The hardness of the material 30 located in the second region 33 and the hardness of the third region 35 are greater than the hardness of the flexible substrate 30 located in the first region 31.
  • the third region 35 is used to reduce the influence of mechanical differences caused by materials in different regions of the flexible substrate 30 and improve the bonding strength between the regions of the flexible substrate 30.
  • the number of the third regions 35 is two, which are located on both sides of the second region 33, and the sides of each third region 35 are respectively adjacent to the second region 33 and the adjacent first region 31. The two sides of the second area 33 and the first area 31 on both sides of the second area 33 are connected together.
  • the manufacturing material of the flexible substrate 30 in the second region 33 and the manufacturing material of the flexible substrate 30 in the third region 35 both include micro-nano particles.
  • the density of the micro-nano particles in the third region 35 is less than the density of the micro-nano particles in the second region 33, so that the hardness of the flexible substrate 30 located in the third region 35 is less than that of the flexible substrate 30
  • the hardness of the second region 33 is described. It is assumed that the manufacturing material of the flexible substrate 30 in the first region 31 is the first material, the manufacturing material of the flexible substrate 30 in the second region 33 is the second material, and the manufacturing material of the flexible substrate 30 in the third region 35 is The finished material is a third material.
  • the second material and the third material are formed by doping and mixing hard micro-nano particles in the first material, but the proportion of micro-nano particles mixed and filled in the second region 33 is higher than In the third region 35, the proportion of filled micro-nano particles is mixed.
  • the mass ratio of the first material to the micro-nano particles in the second region 33 is 1: 1; in the third region 35, the filling ratio is reduced, such as the third region 35
  • the mass ratio of the first material to the micro-nano particles is reduced to 1: 0.5, so that the density of the micro-nano particles in the second region 33 is greater than the density of the micro-nano particles in the third region 35, reaching the flexible substrate 30 in
  • the hardness of the second region 33 is greater than the hardness of the third region 35.
  • FIG. 5 is a schematic perspective view of a flexible substrate according to a fourth embodiment of the present invention.
  • the flexible substrate 40 is similar in structure to the flexible substrate 10 provided in the first embodiment.
  • the flexible substrate 40 includes a first region 41 and a second region 43 connected to the first region 41.
  • the hardness of the flexible substrate 40 located in the second region 43 is greater than the hardness of the flexible substrate 40 located in the first region 41.
  • the area 43 is used for bonding and bonding of electronic devices.
  • the manufacturing material of the flexible substrate 40 provided in the first region 41 is the first material
  • the manufacturing material of the flexible substrate 40 located in the second region 43 is the second material.
  • the flexible substrate 40 differs from the flexible substrate 10 provided in the first embodiment in that the second material is made after adjusting the synthetic formula of the first material.
  • the adjustment includes increasing the curing crosslink density, Add at least one of hard functional groups and reactive short-branched chains to improve the mechanical and mechanical properties of the flexible substrate 40 located in the second region 43, so that the hardness of the flexible substrate 40 located in the second region 43 is greater than the flexibility
  • the hardness of the base material 40 is located in the remaining area.
  • an additive is added to the synthetic formula of the first material for adjustment, and the additive includes a high-functionality, low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyol, a heterocyclic polyol, At least one of aromatic polyisocyanates such as diphenylmethane diisocyanate, aromatic diamines such as 3,3'dichloro-4,4'-benzylalkyldiamine, and aromatic polyamines.
  • the additive can be used as a cross-linking agent and a chain extender, so that there are many hard segments in the polymer segment, thereby increasing the hardness of the elastomer.
  • the second material is filled between the first regions 41, the first material and the second material are melted and After cooling, the hybrid spliced flexible substrate 40 is formed.
  • FIG. 6 is a perspective schematic view of a flexible substrate provided by a fifth embodiment of the present invention.
  • the flexible substrate 50 is similar in structure to the flexible substrate 40 provided in the fourth embodiment.
  • the flexible substrate 50 includes a first region 51 and a second region 53 connected to the first region 51.
  • the hardness of the flexible substrate 50 located in the second region 53 is greater than the hardness of the flexible substrate 50 located in the first region 51.
  • the area 53 is used for bonding and bonding of electronic devices.
  • the flexible substrate 50 differs from the flexible substrate 40 provided in the fourth embodiment in that the flexible substrate 50 further includes a third region 55.
  • the third region 55 is located between the first region 51 and the second region 53.
  • the flexible substrate The hardness of the portion 50 located in the third region 55 is less than the hardness of the portion of the flexible substrate 50 located in the second region 53, and the hardness of the portion of the flexible substrate 50 located in the third region 55 is greater than the hardness of the portion of the flexible substrate 50 located in the first region 51.
  • the manufacturing material of the flexible substrate 50 located in the first region 51 is the first material
  • the manufacturing material of the flexible substrate 50 located in the second region 53 is the second material
  • the manufacturing material of the flexible substrate 50 is located in the third region 55
  • the finished material is the third material.
  • the first material may be a thermoplastic elastomer plastic material such as polyurethane, silicone, rubber, or the like.
  • the second material is made by adjusting the synthetic formula of the first material, and the adjusting includes at least one of increasing curing crosslink density, increasing hard functional groups, and increasing reactive short-chain branches.
  • an additive is added to the monomer synthesis formulation of the first material for adjustment, and the additive includes a high-functionality and low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyol, and a heterocyclic polyhydric At least one of aromatic polyisocyanates such as alcohol, diphenylmethane diisocyanate, and aromatic diamines such as 3,3'dichloro-4,4'- benzhydrylalkanediamine and aromatic polyamines.
  • the additive can be used as a cross-linking agent and a chain extender to increase the hardness of the elastomer by increasing the number of hard segments in the polymer segment.
  • the third material is a mixed hard material of the first material.
  • the hard material is micro-nano particles, and the micro-nano particles are inorganic particle silicon fine powder.
  • the material of the hard micro-nano particles is not limited, it can make the hardness of the flexible substrate 50 in the third region 55 is greater than the hardness in the first region 51, and the flexible substrate 50 in the third region 55 The hardness of the part is less than the hardness of the flexible substrate 50 in the second region 53 and it does not have to adversely affect the binding.
  • the hard micro-nano particles include at least one of calcium powder, silicon nitride powder, silica powder, alumina powder, micro-nano-length glass fibers, insulation-treated micro-nano-length carbon fibers, and rigid plastic micro-nano particles Species. It can be understood that the hard material is not limited to micro-nano particles, and the hard material may be a hard network structure, a hard layer structure, or the like.
  • the manufacturing material of the flexible substrate 50 located in the second region 53 is not limited, and the manufacturing material of the flexible substrate 50 located in the third region 55 is not limited.
  • the hardness of the region 53 is greater than the hardness of the flexible substrate 50 located in the third region 55, and the hardness of the flexible substrate 50 located in the third region 55 is greater than the hardness of the flexible substrate 50 located in the first region 51, for example, the flexible substrate
  • the manufacturing material of the portion 50 located in the second region 53 may be a third material, and the manufacturing material of the portion of the flexible substrate 50 located in the third region 55 may be the second material.
  • the present invention also provides a flexible panel 100 including a flexible substrate 60, a first electronic device 101 and a second electronic device 103.
  • the flexible substrate 60 may be the flexible substrate 10 provided in the first embodiment One of the flexible substrate 20 provided in the second embodiment, the flexible substrate 30 provided in the third embodiment, the flexible substrate 40 provided in the fourth embodiment, and the flexible substrate 50 provided in the fifth embodiment.
  • the flexible panel 100 is a touch panel
  • the first electronic device 101 is a touch electrode
  • the second electronic device 103 is a flexible circuit board.
  • the flexible panel 100 may be other structures or functional modules, for example, the flexible panel 100 may be a flexible display panel, the first electronic device 101 may be other devices, and the second electronic device 103 may be other devices.
  • the flexible substrate 60 includes a first area 61 and a second area 63. Among them, the first electronic device 101 and the second electronic device 103 are bonded in the second region 63 by binding. Further, the first electronic device 101 is provided on the first region 61 of the flexible substrate 60, and the terminal 1011 of the first electronic device 101 and the second electronic device 103 are bonded in the second region 63 by binding, thereby achieving The first electronic device 101 and the second electronic device 103 are joined in the second region 63 by binding.
  • the first electronic device 101 and the second electronic device 103 are conductively thermocompression bonded by anisotropic conductive film (Anisotropic Conductive Film, ACF).
  • an anisotropic conductive adhesive at a low pressure combination temperature such as an anisotropic conductive adhesive composed of Sn and Bi low-melting alloy microparticles, an anisotropic conductive adhesive with a low curing temperature epoxy curing system, or a thermoplastic
  • the rubber resin system is an anisotropic conductive adhesive of the curing system.
  • the binding temperature can also be reduced to 100-130 degrees.
  • the applied pressure range is 1-3Mpa, the time is 10-20 seconds, and the pressure can reach 7-20N / cm. After bonding strength.
  • the hardness of the flexible substrate 60 in the second region 63 is relatively high, it can withstand high temperature and pressure, and avoid damage to the flexible substrate 60, which is beneficial to increase the service life of the flexible substrate 60 and solves the problem that the flexible substrate cannot be effectively The problem of binding connection.
  • the present invention also provides a schematic front view of an electronic device 200 having the flexible panel 100 described above.
  • the electronic device 200 may be a mobile phone, a tablet computer, a reader, a game machine, and so on.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention concerne un substrat flexible (10) comprenant une première région (11) et une seconde région (13) connectée à la première région (11). Une partie du substrat flexible (10) au niveau de la seconde région (13) a une rigidité supérieure à celle d'une partie du substrat flexible (10) au niveau de la première région (11). La seconde région (13) du substrat flexible (10) est configurée de telle sorte qu'un dispositif électronique peut être lié et connecté à celui-ci. L'agencement ci-dessus réduit l'endommagement ou la déformation du substrat flexible (10) lorsqu'un dispositif électronique est lié et connecté à la seconde région (13), prolongeant ainsi la durée de vie du substrat flexible (10), et résolvant le problème dans lequel des opérations de liaison et de connexion ne peuvent pas être réalisées efficacement sur un substrat flexible. De plus, la présente invention concerne un panneau flexible et un appareil électronique.
PCT/CN2018/111236 2018-10-22 2018-10-22 Substrat flexible, panneau flexible et appareil électronique Ceased WO2020082212A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2018/111236 WO2020082212A1 (fr) 2018-10-22 2018-10-22 Substrat flexible, panneau flexible et appareil électronique
CN201880096022.9A CN112889144A (zh) 2018-10-22 2018-10-22 柔性基材、柔性面板及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/111236 WO2020082212A1 (fr) 2018-10-22 2018-10-22 Substrat flexible, panneau flexible et appareil électronique

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WO2020082212A1 true WO2020082212A1 (fr) 2020-04-30

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8736785B2 (en) * 2011-07-12 2014-05-27 Fujitsu Mobile Communications Limited Liquid crystal display device and electronic device
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN107665854A (zh) * 2017-09-21 2018-02-06 京东方科技集团股份有限公司 背膜结构及其制备方法、柔性显示屏

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107968154A (zh) * 2016-10-20 2018-04-27 上海和辉光电有限公司 一种显示装置
CN107768415B (zh) * 2017-10-30 2024-03-08 京东方科技集团股份有限公司 柔性显示器件、显示装置以及制造方法
CN207303146U (zh) * 2017-10-30 2018-05-01 京东方科技集团股份有限公司 柔性显示器件和显示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8736785B2 (en) * 2011-07-12 2014-05-27 Fujitsu Mobile Communications Limited Liquid crystal display device and electronic device
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN107665854A (zh) * 2017-09-21 2018-02-06 京东方科技集团股份有限公司 背膜结构及其制备方法、柔性显示屏

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