WO2020050844A1

WO2020050844A1 - Decorated panels for electronic devices

Info

Publication number: WO2020050844A1
Application number: PCT/US2018/049720
Authority: WO
Inventors: Ya-Ting Yeh; Kuan-Ting Wu; Te-Shun LEE
Original assignee: Hewlett Packard Development Co LP
Current assignee: Hewlett Packard Development Co LP
Priority date: 2018-09-06
Filing date: 2018-09-06
Publication date: 2020-03-12
Anticipated expiration: 2021-03-06
Also published as: TW202022541A; TWI725389B

Abstract

The present disclosure is drawn to decorated panels for electronic devices. In one example, a decorated panel for an electronic device can include a substrate, a primer layer on the substrate, an adhesive layer on the primer layer, and an overmolded layer on the adhesive layer. The substrate can include metal, metal alloy, or carbon fiber. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. The overmolded layer can include a non-conductive vacuum metallized pattern.

Description

DECORATED PANELS FOR ELECTRONIC DEVICES

BACKGROUND

[0001] The use of personal electronic devices of all types continues to increase. Cellular phones, including smartphones, have become nearly ubiquitous. Tablet computers have also become widely used in recent years. Portable laptop computers continue to be used by many for personal, entertainment, and business purposes. For portable electronic devices in particular, much effort has been expended to make these devices more useful and more powerful while at the same time making the devices smaller, lighter, and more durable. The aesthetic design of personal electronic devices is also of concern in this competitive market.

BRIEF DESCRIPTION OF THE DRAWING

[0002] FIG. 1 is a cross-sectional view illustrating an example decorated panel for an electronic device in accordance with examples of the present disclosure;

[0003] FIG. 2 is a cross-sectional view illustrating another example decorated panel in accordance with examples of the present disclosure;

[0004] FIG. 3 is a cross-sectional view illustrating yet another example decorated panel in accordance with examples of the present disclosure;

[0005] FIG. 4 is a cross-sectional view illustrating an example electronic device in accordance with examples of the present disclosure; and

[0006] FIG. 5 is a flowchart illustrating an example method of making a decorated panel for an electronic device in accordance with examples of the present disclosure. DETAILED DESCRIPTION

[0007] The present disclosure describes decorated panels for electronic devices. In some examples, a decorated panel for an electronic device can include a substrate such as metal, metal alloy, or carbon fiber. A primer layer can be on the substrate. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. An adhesive layer can be on the primer layer, and an overmolded layer can be on the adhesive layer. The overmolded layer can include a non-conductive vacuum metallized pattern. In another example, the substrate can include a micro-arc oxidation layer in contact with the primer layer. In yet another example, the substrate can include a passivation layer in contact with the primer layer. The passivation layer can include a molybdate, vanadate, phosphate, chromate, stannate, manganese salt, or a combination thereof. In certain examples, the substrate can include aluminum, magnesium, titanium, lithium, niobium, or an alloy thereof. In a particular example, the substrate can include an alloy of aluminum and magnesium. In yet another example, the substrate can also include a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber. The primer layer can extend across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay. In a further example, the overmolded layer can also include an inked pattern. In a still further example, a clear coat layer can be on the overmolded layer.

[0008] In another example, an electronic device can include a chassis that includes a metal, metal alloy, or carbon fiber. A primer layer can be on the chassis. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. An adhesive layer can be on the primer layer. An overmolded layer can be on the adhesive layer. The overmolded layer can include a

non-conductive vacuum metallized pattern. In one example, the chassis can include a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber. The primer layer can extend across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay. In another example, the chassis can include an aluminum and magnesium metal alloy portion insert molded with a plastic overlay. In yet another example, the chassis can include a chamfered edge.

[0009] The present disclosure also extends to methods of making decorated panels for electronic devices. In one example, a method of making a decorated panel for an electronic device can include applying a primer layer on a substrate. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. The substrate can include metal, metal alloy, or carbon fiber. An adhesive layer can be applied on the primer layer. A decoration layer can be overmolded on the adhesive layer to form an overmolded layer of a

non-conductive vacuum metallized pattern. In another example, the substrate can include a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber. The primer layer can be applied across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay. In yet another example, the substrate can be treated with micro-arc oxidation or a passivation treatment, wherein the passivation treatment includes treating the substrate with a molybdate, vanadate, phosphate, chromate, stannate, manganese salt, or a combination thereof.

[0010] It is noted that when discussing either the decorated panel, the electronic device, or the methods herein, such discussions can be considered applicable to one another whether or not they are explicitly discussed in the context of that example. Thus, for example, when discussing primer layer in the context of one of the decorated panel examples, such disclosure is also relevant to and directly supported in the context of the electronic device and/or method, and vice versa. It is also understood that terms used herein will take on their ordinary meaning in the relevant technical field unless specified otherwise. In some instances, there are terms defined more specifically throughout or included at the end of the present disclosure, and thus, these terms are supplemented as having a meaning described herein.

[001 1] In further detail, it is noted that the spatial relationship between layers is often described herein as positioned“on” or applied“on” another layer and does not infer that this layer is positioned directly on the layer to which it refers, but could have intervening layers therebetween. That being stated, a layer described as being positioned on another layer can be positioned directly on that other layer, and thus such a description finds support herein for being positioned directly on the referenced layer. [0012] Decorated Panels

[0013] The decorated panels described herein can be used on a variety of electronic devices to provide decorative designs such as shiny, metallized patterns, colored inked patterns, and glossy or matte finishes. In some examples, electronic devices such as laptops, smartphones, tablets, televisions, and others can have a chassis made of materials such as light metals, carbon fiber, and/or plastic. Light metals, such as aluminum, magnesium, titanium, lithium, niobium, and alloys thereof, are sometimes used for the chassis due to their low weight high strength. Carbon fiber can be used for the same reasons. These materials may also be selected for their particular look and feel. However, in many cases the appearance of an electronic device can benefit from additional the additional decorations that can be provided by the methods described herein. For example, an overmolded decoration layer can be adhered to the chassis to provide non-conductive vacuum metallized patterns, inked patterns, and clear overcoat layers.

[0014] In some cases, it can be difficult to adhere an overmolded decoration layer onto certain chassis materials, including light metals and carbon fiber. However, using a primer as described herein can help strengthen the adherence of the overmolded layer to the chassis substrate. The primer can include a polyurethane, polyurethane copolymer, or alkyd resin. Additionally, in many electronic devices the chassis can include portions made from metal, metal alloy, or carbon fiber and portions made from plastic in the form of a plastic overlay. The plastic overlay can be bonded to the metal, metal alloy, or carbon fiber through thermal bonding or another boding method. In other examples, the plastic overlay can be insert molded with the metal or carbon fiber portion. In some cases there can be a slight gap or uneven surface at the interface between the plastic overlay and the metal or carbon fiber portion of the chassis. This gap or uneven surface can also interfere with adherence between the chassis and the overmolded layer. The primer mentioned above can also help with this issue, as the primer can fill in gaps and smooth over uneven surfaces.

[0015] FIG. 1 shows an example decorated panel 100 for an electronic device. The decorated panel includes a substrate 1 10, such as a metal, metal alloy, or carbon fiber substrate, and a primer layer 120 on the substrate. An adhesive layer 130 is also shown on the primer layer, and an overmolded layer 140 on the adhesive layer. The overmolded layer can include a non-conductive vacuum metallized pattern. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. The substrate can include metal, metal alloy, or carbon fiber.

[0016] In further examples, the substrate can be treated with a micro-arc oxidation or passivation treatment. This can be particularly useful for light metal substrates such as magnesium and magnesium alloys. The micro-arc oxidation or passivation treatment can create a protective micro-arc oxidation layer or passivated layer at the surface of the substrate. FIG. 2 shows another example decorated panel 200 in accordance with the present disclosure. This panel includes a substrate 210, such as a metal, metal alloy, or carbon fiber substrate, and a primer layer 220 on the substrate. An adhesive layer 230 is on the primer layer, and an overmolded layer 240 on the adhesive layer. In this example, however, the substrate includes a micro-arc oxidation layer 215 on the surface of the substrate layer in contact with the primer layer. A second micro-arc oxidation layer 217 can also be present on the rear or opposite surface of the substrate relative to the micro-arc oxidation layer.

[0017] FIG. 3 shows another example decorated panel 300 according to the present disclosure. In this example, the panel includes a substrate 310, such as a metal or metal alloy substrate, a primer layer 320, and adhesive layer 330, and an overmolded layer 340 as in the previous examples. The substrate also includes a passivation layer 315 in contact with the primer layer, and a second passivation layer 317 on the rear or opposite surface of the substrate. A clear coat layer 350 and a release film 360 are placed on the overmolded layer. In addition to the substrate of metal or metal alloy, the substrate in this example can also include a plastic overlay 312. The plastic overlay can be insert molded or bonded to the substrate. The primer layer 320 extends across the interface between the plastic overlay and the metal portion relative to the micro-arc oxidation layer.

[0018] Substrates

[0019] A substrate can be a light metal such as aluminum, magnesium, titanium, lithium, niobium, or an alloy thereof. In some examples, alloys of these metals can include additional metals, such as bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium, antimony, zinc, cerium, lanthanum, or others. In a particular example, the substrate can be pure magnesium or an alloy including 99% magnesium or greater. In another particular example, the substrate can be made of an alloy including magnesium and aluminum. Examples of

magnesium-aluminum alloys can include alloys made up of from 91 % to 99% magnesium by weight and from 1 % to 9% aluminum by weight, and alloys made up of 0.5% to 13% magnesium by weight and 87% to 99.5% aluminum by weight. Specific examples of magnesium-aluminum alloys can include AZ63, AZ81 ,

AZ91 , AM50, AM60, AZ31 , AZ31 B, AZ61 , AZ80, AE44, AJ62A, ALZ391 , AMCa602, LZ91 , and Magnox. Specific examples of aluminum-magnesium alloys can include 1050, 1060, 1 199, 2014, 2024, 2219, 3004, 4041 , 5005, 5010, 5019, 5024, 5026, 5050, 5052, 5056, 5059, 5083, 5086, 5154, 5182, 5252, 5254,

5356, 5454, 5456, 5457, 5557, 5652, 5657, 5754, 6005, 6005A, 6060, 6061 , 6063, 6066, 6070, 6082, 6105, 6162, 6262 ,6351 , 6463, 7005, 7022, 7068, 7072, 7075 ,7079, 7116, 7129, 7178. In a particular example, the substrate can be made from AZ31 or AZ91 .

[0020] In further examples, the substrate can include carbon fiber. In particular, the substrate can be a carbon fiber composite. The carbon fiber composite can include carbon fibers in a plastic material such as a thermoset resin or a thermoplastic polymer. Non-limiting examples of the polymer can include epoxies, polyesters, vinyl esters, and polyamides. Because carbon fiber can often be a more expensive material, carbon fiber may sometimes be used for portions of an electronic device chassis instead of the entire chassis. For example, carbon fiber panels can be combined with a metal chassis in some examples.

[0021] In various examples, the substrate can be formed by molding, casting, machining, bending, working, or another process. In certain examples, the substrate can be a chassis for an electronic device that is milled from a single block of metal or metal alloy. In other examples, an electronic device chassis can be made from multiple panels. As an example, laptops sometimes include four separate pieces forming the chassis or cover of the laptop, with the electronic components of the laptop protected inside the chassis. The four separate pieces of the laptop chassis are often designated as cover A (back cover of the monitor portion of the laptop), cover B (front cover of the monitor portion), cover C (top cover of the keyboard portion) and cover D (bottom cover of the keyboard portion). In certain examples, one of these covers or more than one of these covers can include metal, metal alloy, or carbon fiber. These covers can be made by machining, casting, molding, bending, or with other forming methods. Other types of electronic device chasses can also be the substrate referred to above, such as a smartphone, tablet, or television chassis. These substrates can be made using the same forming methods.

[0022] Magnesium or magnesium alloys can be used as the substrate in certain examples. Magnesium can be selected as a material for an electronic device chassis because of its high strength to weight ratio. However, magnesium can present certain difficulties. Magnesium tends to oxidize easily on the surface, which prevents a metallic luster appearance. Additionally, magnesium can have poor color stability, hardness, and chemical resistance. Adding the primer layer, adhesive layer, and overmolded layer as described herein can give a magnesium or magnesium alloy chassis an attractive finish with good hardness, chemical resistance, and durability.

[0023] The substrate is not particularly limited with respect to thickness. However, when used as a panel for an electronics device, such as for a housing or chassis, the thickness of the substrate chosen, the density of the material (for purposes of controlling weight, for example), the hardness of the material, the malleability of the material, the material aesthetic, etc. In some examples, however, the thickness of the substrate can be from about 0.5 mm to about 2 cm, from about 1 mm to about 1.5 cm, from about 1.5 mm to about 1.5 cm, from about 2 mm to about 1 cm, from about 3 mm to about 1 cm, from about 4 mm to about 1 cm, or from about 1 mm to about 5 mm, though thicknesses outside of these ranges can be used.

[0024] Surface-treatment Layers

[0025] A substrate may be treated with a surface-treatment layer, such as a micro-arc oxidation, a passivation layer, or the like. The micro-arc oxidation (MAO) layer, for example, can also be known as plasma electrolytic oxidation. Micro-arc oxidation is an electrochemical process where the surface of a metal is oxidized using micro-discharges of compounds on the surface of the substrate when immersed in a chemical or electrolytic bath, for example. The electrolytic bath may include predominantly water with about 1 wt% to about 5 wt% electrolytic compound(s), e.g., alkali metal silicates, alkali metal hydroxide, alkali metal fluorides, alkali metal phosphates, alkali metal aluminates, the like, and combinations thereof. The electrolytic compounds may likewise be included at from about 1.5 wt% to about 3.5 wt%, or from about 2 wt% to about 3 wt%, though these ranges are not considered limiting. In one example, a high-voltage alternating current can be applied to the substrate to create plasma on the surface of the substrate. In this process, the substrate can act as one electrode immersed in the electrolyte solution, and the counter electrode can be any other electrode that is also in contact with the electrolyte. In some examples, the counter electrode can be an inert metal such as stainless steel. In certain examples, the bath holding the electrolyte solution can be conductive and the bath itself can be used as the counter electrode. A high direct current or alternating voltage can be applied to the substrate and the counter electrode. In some examples, the voltage can be 200 V or higher, such as about 200 V to about 600 V, about 250 V to about 600 V, about 250 V to about 500 V, or about 200 V to about 300 V. Temperatures can be from about 20 °C to about 40 °C, orfrom about 25 °C to about 35 °C, for example, though temperatures outside of these ranges can be used. This process can oxidize the surface to form an oxide layer from the substrate material. Various metal or metal alloy substrates can be used, including aluminium, titanium, lithium, magnesium, and/or alloys thereof, for example. The oxidation can extend below the surface to form thick layers, as thick as 250 pm or more. In some examples the oxide layer can have a thickness from about 1 pm to about 250 pm, from about 1 pm to about 200 pm, or from about 2 pm to about 20 pm. Thickness can likewise be from about 2 pm to about 15 pm, from about 3 pm to about 10 pm, or from about 4 pm to about 7 pm. The oxide layer can, in some instances, improve the mechanical, wear, thermal, dielectric, and corrosion properties of the substrate. The electrolyte solution can include a variety of electrolytes, such as a solution of potassium hydroxide. In some examples, the substrate can include a micro-arc oxidation layer on one side, or on both sides as shown in FIG. 2.

[0026] Another example of a surface-treatment layer for the substrate can be a passivation layer. In some examples, a passivation treatment process to generate a passivation layer can include dissolving a passivating compound in a solution and immersing the substrate in the solution to form a layer of the passivating compound on the substrate. Examples of passivation treatments process that can be implemented to generate passivation layers can include chromate conversion coating, phosphate conversion coating, molybdate conversion coating, vanadate conversion coating, stannate conversion coating, and others. In some examples, the substrate can be passivated on one side, or on both sides as shown in FIG. 3.

[0027] Primer Layers

[0028] A primer layer can be applied either on the bare (untreated) substrate or on the substrate treated with a surface-treatment layer, e.g., micro-arc oxidation or passivation layer. In some examples, the primer layer can include a polyurethane or polyurethane copolymer. In certain examples, the polyurethane or polyurethane copolymer can be formed by polymerizing a polyisocyanate and a polyol. Non-limiting examples of polyisocyanates that can be used include toluene diisocyanate, methylene diphenyl diisocyanate, 1 ,6-hexamethylene diisocyanate, isophorone diisocyanate, 4,4’-diisocyanato dicyclohexylmethane, trimethylhexamethylene diisocyanate, and others. The polyol can, in some examples, be a polyether polyol or a polyester polyol having a weight average molecular from about 100 to about 10,000 or from about 200 to about 5,000. In certain examples, the polyol can be a diol that includes two hydroxyl groups. In further examples, the primer layer can have a thickness from about 1 pm to about 50 pm, from about 2 pm to about 25 pm, or from about 5 pm to about 15 pm.

[0029] In certain examples, the primer can include a moisture-cured polyurethane. Moisture-cured polyurethanes can include isocyanate-terminated prepolymers that can be cured with ambient water. In a particular example, the primer can include Airethane™ 1204 polyurethane or other Airethane™ 1000 series polyurethanes (Fairmont Industries).

[0030] In other examples, the primer can include an alkyd resin. Alkyd resins are thermoplastic resins made from polyhydric alcohols and polybasic acids or their anhydrides. In some examples, alkyd resins can be made by a polycondensation reaction of a polyol with a dicarboxylic acid or its anhydride. Non-limiting examples of other polybasic acids that can be used in alkyd resins include phthalic anhydride, isphthalic anhydride, maleic anhydride, fumaric acid, and others. Non-limiting examples of polyols that can be used in alkyd resins include glycerol, tremethylolethane, trimethylolpropane, pentaerythritol, ethylene glycol, and neopentyl glycol. In some examples, a monobasic acid can also be included in the reaction to modify the alkyd resin. In specific examples, the primer can include a resin from the DOMALKYD™ line of resins, such as DOMALKYD™ 4161 (Helios).

[0031] Adhesive Layers

[0032] An adhesive layer can be applied on the primer layer. In some examples, the adhesive layer can have a thickness from about 1 pm to about 100 pm, from about 2 pm to about 50 pm, or from about 5 pm to about 30 pm.

Non-limiting examples of adhesive materials that can be used include ethylene vinyl acetate copolymers, ethylene ethyl acrylate copolymers, ionomers, poly(ethyl acrylate), phenoxy resins, polyamides, polyesters, polyvinyl acetate, polyvinyl butyral, polyvinyl ethers, and others.

[0033] Overmolded layers

[0034] An overmolded layer can be overmolded on the adhesive layer. In some examples, the overmolded layer can include a plastic such as acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyamide (PA), polymethyl methacrylate (PMMA), styrene ethylene butadiene styrene (SEBS),

polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyphenylene ether (PPE), polyphenylene oxide (PPO), or a combination thereof. The thickness of the overmolded layer can in some examples by from about 50 pm to about 150 pm. In further examples, the thickness can be from about 65 pm to about 1 10 pm or from about 70 pm to about 100 pm. The overmolded layer can also include a non-conductive vacuum metallized pattern.

[0035] The overmolded layer can be applied by non-conductive vacuum metallization, for example.“Non-conductive vacuum metallization” is a process that can form a film that appears to be a continuous, shiny metallic film, but is in fact a layer of isolated metallic spots or islands on the surface. Because the metallized layer is not a continuous metallic film, the layer is not electrically conductive. The use of this type of film can provide a shiny, metallic appearance in some examples, but can still be useful in electronic devices that send and receive wireless signal, such as radio, Wi-Fi, Satellite (GPS), Bluetooth®, and cellular signal. Conversely, conductive metal films can interfere these types of electromagnetic signals. Thus, in one aspect of the present disclosure, a portion of the surface, or in some instances, the entire surface of a decorated panel can be covered by non-conductive vacuum metallization. If covered in part, the non-conductive vacuum metallization can be limited to a smaller pattern on the panel that is decorative or otherwise covers a defined portion of the surface. For example, non-conductive vacuum metallization may be applied to an edge of a device, to a bezel around a screen, to a central portion of a panel, to a portion that includes a decorative pattern, and so on. In one example, the non-conductive vacuum metallization can also be used to form a logo or customized design on the panel. In some examples, the non-conductive metallized pattern can have a film thickness from about 5 nm to about 500 nm, from about 10 nm to about 200 nm, or from about 10 nm to about 100 nm. Materials that can be used in non-conductive vacuum metallization can include titanium, chromium, nickel, zinc, zirconium, manganese, copper, aluminum, tin, molybdenum, tantalum, tungsten, hafnium, gold, vanadium, silver, platinum, graphite, and alloys thereof.

[0036] In further examples, the overmolded layer can also include an inked pattern. For example, a specific ink color or group of colors color can be printed by an analog or digital printing method to form a pattern. Alternatively, ink can likewise be added to an entire surface by analog or digital printing, or using other coating methods such as spray coating, roller coating, blade coating, and so on. In certain examples, a non-conductive vacuum metallized pattern and an inked pattern can both be used on different portions of the overmolded layer. In other examples, they can be applied in a layered manner with the same or with a different application footprint. In still other examples, the inked pattern can have a film thickness from about 1 pm to about 40 pm, from about 2 pm to about 30 pm, or from about 5 pm to about 20 pm.

[0037] Various inks can be used to form the inked pattern, such as pigmented inks or dye-based inks. In some examples, the ink can include a colorant such as a pigment or dye, a binder, and a dispersant. These components can be dispersed in a liquid vehicle such as water or an organic solvent.

Non-limiting examples of the binder in the ink can include polyester acrylate copolymers, polyether polyol copolymers, polyester polyol copolymers, polyester urethane copolymers, polyurethane/ureas, polyesters, polyacrylates,

polyurethanes, and others. Non-limiting examples of the dispersant can include sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium dodecyl sulfate, and others.

[0038] Clear Coat Layers and Release Layers

[0039] The decorated panels can, in some examples, also include clear coat layer as a protective coating on the overmolded layer. In some cases, the clear coat layer can be applied on the overmolded layer. The clear coat layer can be clear polyacrylic or clear polyurethane coating, for example. In certain examples, the clear coat layer can be a layer of polyacrylic with a thickness from about 1 pm to about 50 pm, from about 2 pm to about 30 pm, or from about 5 pm to about 15 pm. In other examples, the clear coat layer can be a polyurethane with a thickness from about 20 pm to about 100 pm, from about 30 pm to about 75 pm, or from about 40 pm to about 50 pm.

[0040] In some examples, the decorated panel can include a removable release film that is applied on the clear coat layer. In other examples, the release film can be applied on an overmolded layer to protect the overmolded layer, even if a clear coat layer for protection is not included. Either way, the release film can be a transparent plastic film, such as a polyethylene terephthalate (PET) film or a polycarbonate (PC) film, for example. In some examples, the release film can be siliconized by coating a surface of the film with a silicone compound. [0041 ] Plastic Overlays

[0042] In some examples, plastic can be applied on metal (or carbon fiber) portions of the metal, metal alloy, or carbon fiber substrate to form a plastic overlaid substrate that includes the metal, metal alloy, or carbon fiber with the a layer of plastic applied thereto. For example, plastic can be insert molded or bonded to the metal, metal alloy, or carbon fiber at a portion of an electronic device chassis where the properties of plastic can be more useful than metal or carbon fiber. To illustrate, a plastic overlay can be located near an antenna to allow radio waves to travel through the chassis. In another example, a plastic overlay can be located at corners of the device while flat panels of metal or carbon fiber can make up the majority of the flat surfaces of the device. In further examples, a plastic overlay can be used in locations where molded features are desired, such as buttons, speaker and microphone openings, camera lens housings, and others. The plastic overlay can be made from any rigid plastic material, such as ABS, PC, PA, PMMA, SEBS, PPE, PBT, PPS, PPO, or a combination thereof.

[0043] In some instances, a gap or uneven surface can be found at an interface between the metal, metal alloy, or carbon fiber (in some instances including the surface-treatment layer, if present) and the plastic overlay. Applying the primer layer across the interface (where the plastic overlay joins with metal, metal alloy, or carbon fiber substrate) can smooth out the uneven surface and/or fill in the gap so that the surface is smooth, even across the interface, for application of the overmolded layer. This can in some instances improve the adherence of the overmolded layer to the substrate.

[0044] In further examples, the plastic overlay can be insert molded with the metal, metal alloy, or carbon fiber portion to form a substrate having these various types of materials connected together, e.g., metal, metal ally, or carbon fiber composited with a plastic overlay. Insert molding involves placing the substrate portion into a mold, where a plastic material is then injection molded in the mold around the metal, metal alloy, or carbon fiber. In some case, the metal, metal alloy, or carbon fiber substrate can include an undercut shape and the molten plastic can flow into the undercut during injection molding. When the plastic hardens, the undercut can provide a strong connection between the metal or carbon fiber and the plastic.

[0045] In other examples, the metal, metal alloy, or carbon fiber and a plastic overlay can be bonded together, such as by joining the two structures together using an adhesive. Non-limiting examples of adhesives can include epoxies, cyanoacrylates, ultraviolet curing adhesives, ethylene vinyl acetate copolymers, ethylene ethyl acrylate copolymers, ionomers, poly(ethyl acrylate), phenoxy resins, polyamides, polyesters, polyvinyl acetate, polyvinyl butyral, polyvinyl ethers, and others. In other examples, the plastic overlay can be thermally bonded to the metal or carbon fiber portion.

[0046] The term“overlay” does not infer a spatial relationship with respect to the decorated panels or electronics devices per se, but rather merely describes the relationship between the materials that may both be present on a substrate or a chassis, e.g., the plastic overlay is an“overlay” with respect to its application to a metal, metal alloy, or carbon fiber. Thus, if another structure or material were to be applied to the plastic overlay, it would still be considered an overlay with respect to the metal, metal alloy, or carbon fiber. [0047] Electronic Devices with Decorated Panels

[0048] The present disclosure also extends to electronic devices that include the decorated panels described above. Thus, the details related to the decorated panel described above are directly relevant to the electronic devices shown and described herein. More specifically, FIG. 4 shows an example electronic device 400 according to the present disclosure. The electronic device includes a chassis 410, which in this instance can include a metal material and a plastic overlay 412. The plastic overlay can be insert molded with the substrate. A primer layer 420 is on the outer surface of the chassis. As mentioned above, the primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. An adhesive layer 430 is on the primer layer. An overmolded layer that includes a non-conductive vacuum metallized pattern 440 is on the adhesive layer. In this example, the overmolded layer also includes inked patterns 442 on chamfered edges 452 of the electronic device. A clear coat layer 450 is applied on the overmolded layer. Electronic components 470 can be located inside the interior of the chassis. Depending on the electronic device, the electronic components can include a wide variety of components, such as screens, processors, memory, batteries, and so on.

[0049] Electronic devices can include any of the components and features of decorated panels described above. For example, an electronic device can be made similar to that shown in FIG. 4 but with carbon fiber used as the substrate for the chassis instead of metal or metal alloy. In other examples, the chassis can include a metal alloy, such as an alloy of aluminum and magnesium. [0050] Methods of Making Decorated Panels for Electronic Devices

[0051] The present disclosure also extends to methods of making decorated panels for electronic devices. Thus, the details related to the decorated panel described above are directly relevant to the present methods. In further detail, FIG. 5 is a flowchart of one example method 500 of making a decorated panel for an electronic device. The method can include applying 510 a primer layer on a substrate, wherein the primer layer includes a polyurethane, polyurethane copolymer, or alkyd resin, and wherein the substrate includes metal, metal alloy, or carbon fiber. Additionally, the method can include applying 520 an adhesive layer on the primer layer, and overmolding 530 a decoration on the adhesive layer to form an overmolded layer of a non-conductive vacuum metallized pattern.

[0052] In further examples, the substrate can further include a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber, and the method can include applying the primer layer across and interface between a plastic overlay and the metal, metal alloy, or carbon fiber. In other examples, the method can include applying a surface-treatment layer to the metal, metal alloy, or carbon fiber, e.g., treating the substrate with micro-arc oxidation or a passivation treatment to form a micro-arc oxidation layer or a passivation layer, respectively.

[0053] Definitions

[0054] It is noted that, as used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise.

[0055] The term "about" as used herein, when referring to a numerical value or range, allows for a degree of variability in the value or range, for example, within 5% or other reasonable added range breadth of a stated value or of a stated limit of a range. The term“about” when modifying a numerical range is also understood to include the exact numerical value indicated, e.g., the range of about 1 wt% to about 5 wt% includes 1 wt% to 5 wt% as an explicitly supported sub-range.

[0056] As used herein, a plurality of items, structural elements, compositional elements, and/or materials may be presented in a common list for convenience. However, these lists should be construed as though each member of the list is individually identified as a separate and unique member. Thus, no individual member of such list should be construed as a de facto equivalent of any other member of the same list solely based on their presentation in a common group without indications to the contrary. [0057] Concentrations, dimensions, amounts, and other numerical data may be presented herein in a range format. It is to be understood that such range format is used merely for convenience and brevity and should be interpreted flexibly to include the numerical values explicitly recited as the limits of the range, and also to include all the individual numerical values or sub-ranges

encompassed within that range as if each numerical value and sub-range is explicitly recited. For example, a layer thickness from about 0.1 pm to about 0.5 pm should be interpreted to include the explicitly recited limits of 0.1 pm to 0.5 pm, and to include thicknesses such as about 0.1 pm and about 0.5 pm, as well as subranges such as about 0.2 pm to about 0.4 pm, about 0.2 pm to about 0.5 pm, about 0.1 pm to about 0.4 pm etc.

[0058] The following illustrates an example of the present disclosure. However, it is to be understood that the following is illustrative of the application of the principles of the present disclosure. Numerous modifications and alternative compositions, methods, and systems may be devised without departing from the spirit and scope of the present disclosure. The appended claims are intended to cover such modifications and arrangements.

EXAMPLE

[0059] Preparation of a Decorated Panel for an Electronic Device

[0060] An example decorated panel for an electronic device is prepared as follows:

1 ) A magnesium-aluminum-zinc alloy panel (AZ31 , which is 3 wt%

aluminum, 1 wt% zinc, and 96 wt% magnesium) is treated with micro-arc oxidation to form an oxide layer about 10 pm in thickness on both sides of the magnesium alloy panel.

2) A plastic overlay in the form of plastic edging made of ABS plastic is applied to the metal alloy panel. Thus, the substrate includes the metal alloy, the micro-arc oxidation layers, and a plastic overly in the form of plastic edging.

3) A primer layer about 10 pm thick is applied to the surface of the substrate, including both the metal alloy (with oxidation layer) and the plastic overlay edging. The primer used is Airethane™ 1204 from Fairmont Industries.

4) An adhesive layer is then applied on the primer layer at a thickness of about 20 pm. The adhesive layer includes ethylene vinyl acetate copolymer.

5) An overmolded decoration layer is formed by overmolding a layer of

ABS plastic having a non-conductive vacuum metallized pattern. The overmolded decoration layer has a thickness of about 65 pm. The non-conductive vacuum metallized pattern includes layer of silver metal islands, which are not touching, or not touching sufficiently, so that the pattern is non-electrically conductive.

6) A clear coat layer is applied on the overmolded decoration layer at a thickness of about 30 pm. The clear coat layer includes a clear polyacrylic.

[0061] The finished decorated panel has a glossy appearance with a shiny metallic NCVM pattern, and the decoration layers show good adhesion to the magnesium alloy and plastic substrate, and furthermore, are non-conductive. [0062] What has been described and illustrated herein is an example of the disclosure along with some of its variations. The terms, descriptions, and figures used herein are set forth by way of illustration only and are not meant as limitations. Many variations are possible within the spirit and scope of the disclosure, which is intended to be defined by the following claims - and their equivalents - in which all terms are meant in their broadest reasonable sense unless otherwise indicated.

Claims

What is claimed is: 1. A decorated panel for an electronic device, the decorated panel comprising:

a substrate comprising metal, metal alloy, or carbon fiber;

a primer layer on the substrate, wherein the primer layer comprises a polyurethane, polyurethane copolymer, or alkyd resin;

an adhesive layer on the primer layer; and

an overmolded layer on the adhesive layer, wherein the overmolded layer comprises a non-conductive vacuum metallized pattern.

2. The decorated panel of claim 1 , wherein the substrate includes a micro-arc oxidation layer in contact with the primer layer.

3. The decorated panel of claim 1 , wherein the substrate includes a passivation layer in contact with the primer layer, wherein the passivation layer comprises a molybdate, vanadate, phosphate, chromate, stannate, or a combination thereof.

4. The decorated panel of claim 1 , wherein the substrate comprises aluminum, magnesium, titanium, lithium, niobium, or an alloy thereof.

5. The decorated panel of claim 1 , wherein the substrate comprises an alloy of aluminum and magnesium.

6. The decorated panel of claim 1 , wherein the substrate further comprises a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber, and wherein the primer layer extends across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay.

7. The decorated panel of claim 1 , wherein the overmolded layer further comprises an inked pattern.

8. The decorated panel of claim 1 , further comprising a clear coat layer on the overmolded layer.

9. An electronic device comprising:

a chassis comprising metal, metal alloy, or carbon fiber;

a primer layer on the chassis, wherein the primer layer comprises a polyurethane, polyurethane copolymer, or alkyd resin;

an adhesive layer on the primer layer; and

10. The electronic device of claim 9, wherein the chassis further comprises a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber, and wherein the primer layer extends across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay.

1 1. The electronic device of claim 10, wherein the metal, metal alloy, or carbon fiber includes an aluminum and magnesium alloy insert molded with the plastic overlay.

12. The electronic device of claim 9, wherein the chassis comprises a chamfered edge.

13. A method of making a decorated panel for an electronic device comprising:

applying a primer layer on a substrate, wherein the primer layer comprises a polyurethane, polyurethane copolymer, or alkyd resin, and wherein the substrate comprises metal, metal alloy, or carbon fiber;

applying an adhesive layer on the primer layer; and overmolding a decoration on the adhesive layer to form an overmolded layer of a non-conductive vacuum metallized pattern.

14. The method of claim 13, wherein the substrate further comprises a plastic overlay bonded to or insert molded with the metal, metal alloy, or carbon fiber, and wherein the primer layer is applied across an interface between the metal, metal alloy, or carbon fiber and the plastic overlay.

15. The method of claim 13, further comprising applying a surface- treatment layer to the metal, metal alloy, or carbon fiber.