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WO2020043596A1 - Procédés de recuit de bits quantiques avec une puce d'antenne - Google Patents

Procédés de recuit de bits quantiques avec une puce d'antenne Download PDF

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Publication number
WO2020043596A1
WO2020043596A1 PCT/EP2019/072500 EP2019072500W WO2020043596A1 WO 2020043596 A1 WO2020043596 A1 WO 2020043596A1 EP 2019072500 W EP2019072500 W EP 2019072500W WO 2020043596 A1 WO2020043596 A1 WO 2020043596A1
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WIPO (PCT)
Prior art keywords
qubit
antenna
chip
josephson junction
annealing
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Ceased
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PCT/EP2019/072500
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English (en)
Inventor
Rasit Onur TOPALOGLU
Sami Rosenblatt
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IBM United Kingdom Ltd
International Business Machines Corp
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IBM United Kingdom Ltd
International Business Machines Corp
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Priority to CN201980053651.8A priority Critical patent/CN112567397B/zh
Priority to JP2021507763A priority patent/JP7335325B2/ja
Priority to EP19758403.0A priority patent/EP3844687A1/fr
Publication of WO2020043596A1 publication Critical patent/WO2020043596A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/383—Quantum effect devices, e.g. of devices using quantum reflection, diffraction or interference effects
    • H10D48/3835—Semiconductor qubit devices comprising a plurality of quantum mechanically interacting semiconductor quantum dots, e.g. Loss-DiVincenzo spin qubits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0912—Manufacture or treatment of Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/10—Junction-based devices
    • H10N60/12—Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/805—Constructional details for Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor

Definitions

  • the invention relates to qubit annealing, and more specifically, to methods for facilitating qubit annealing with an antenna chip.
  • the qubit e.g., quantum binary digit
  • the qubit is the quantum-mechanical analogue of the classical bit.
  • classical bits can take on only one of two basis states (e.g., 0 or 1)
  • qubits can take on superpositions of those basis states (e.g., a
  • 2 1), allowing a number of qubits to theoretically hold exponentially more information than the same number of classical bits.
  • quantum computers e.g., computers that employ qubits instead of solely classical bits
  • the efficacy of quantum computers can be improved by improving the fabrication and processing of multi-qubit chips. Due to the phenomenon of frequency collision and/or quantum cross-talk (e.g., multiple neighboring qubits having too similar resonant frequencies such that they have undesired interactions with each other), the ability to precisely tune and/or alter qubit frequencies is paramount in the construction of multi-qubit chips.
  • Traditional solutions for such frequency control include tuning of variable-frequency qubits and thermal annealing of fixed-frequency qubits.
  • Variable-frequency qubits have resonant frequencies that can be tuned by exposure to external magnetic fields; however, the additional tuning circuitry required on the qubit chip adds unnecessary complexity and noise.
  • Thermal annealing of fixed-frequency qubits which involves heating a qubit so as to change its physical properties (e.g., resonant frequency), does not introduce such noise during qubit operation (which is realized at cryogenic temperatures compatible with the superconducting regime).
  • thermal annealing of qubits has been performed by using a photonic chip with a laser source physically routed to different locations on the photonic chip via Mach-Zehnder switches (realized at room temperature or at temperatures outside the superconducting regime).
  • the maximum laser power (e.g., and thus the maximum annealing capability) at each location on the photonic chip depends on the amount of power routed to the other locations on the chip (e.g., if more power from the laser source is routed to location 1 , less power from the laser source is available to be simultaneously routed to location 2).
  • traditional laser annealing of qubits is best suited to serial annealing rather than concurrent/parallel annealing of qubits. Therefore, traditional qubit annealing cannot facilitate independent and/or concurrent localized annealing of one or more qubits on a multi-qubit chip.
  • a system can comprise a superconducting qubit chip having a first qubit, with a first Josephson junction, and a second qubit, with a second Josephson junction.
  • the system can also include an antenna chip positioned above the qubit chip.
  • a first antenna can be on the antenna chip.
  • the first antenna can direct a first electromagnetic wave toward the first qubit.
  • the system can have a first defined vertical gap, between the first antenna and the superconducting qubit chip.
  • a first length of the first defined vertical gap can be sized to cause the first electromagnetic wave to circumscribe a first set of one or more capacitor pads of the first qubit, thereby annealing the first Josephson junction of the first qubit.
  • An advantage of this is the facilitation of a new technique of thermally annealing one or more qubits (e.g., via antenna-based electromagnetic waves, instead of photonic lasers) that leverages the existing quantum circuitry on the superconducting qubit chip (e.g., anneals qubits without having to modify the existing structure/circuitry of the qubit or qubit chip).
  • An additional advantage of this is the facilitation of localized annealing of qubits (e.g., annealing one qubit without unwantedly affecting properties of neighboring qubits).
  • the first length of the first defined vertical gap can be a function of a model of a radiation pattern of the first electromagnetic wave as a cone.
  • the cone can originate from the first antenna on the antenna chip and can extend downward toward the superconducting qubit chip.
  • An advantage is to facilitate determining an appropriate distance that can be placed between the first antenna and the qubit chip so as to reliably perform localized annealing (e.g., such that the first electromagnetic wave
  • the system can further comprise a second antenna on the antenna chip.
  • the second antenna can direct a second electromagnetic wave toward the second qubit.
  • the system can include a second defined vertical gap, between the second antenna and the qubit chip. A second length of the second defined vertical gap can be sized to cause the second electromagnetic wave to circumscribe a second set of one or more capacitor pads of the second qubit, thereby annealing the second Josephson junction of the second qubit.
  • An advantage of this is to facilitate independent and/or concurrent/parallel localized annealing of multiple qubits on a multi-qubit chip (e.g., annealing more than one qubit on the same chip simultaneously and independently, such that each qubit can achieve a distinct level of annealing that can be different from the levels of annealing of neighboring qubits), thereby expediting the overall annealing process to save time as compared to serial annealing, as well as improving frequency allocation and reducing quantum cross-talk.
  • a computer-implemented method can comprise directing, via a first antenna on an antenna chip located above a superconducting qubit chip having a first qubit and a second qubit, a first electromagnetic wave toward the first qubit.
  • the method can also comprise annealing, by the first antenna, a first Josephson junction of the first qubit based on the directing.
  • a first length of a first defined vertical gap between the first antenna and the qubit chip can cause the first electromagnetic wave to circumscribe a first set of one or more capacitor pads of the first qubit. This can thereby heat the first Josephson junction of the first qubit.
  • the method can include moving the antenna chip to a second superconducting qubit chip in a manufacturing line to facilitate annealing of qubits on the second qubit chip.
  • Such moving can be facilitated via a micromanipulator, a piezocontroller, or a temporary attachment between the antenna chip and the qubit chips.
  • An advantage of this is to facilitate a new technique of thermally annealing qubits that leverages existing quantum circuitry on the qubit chip (e.g., elimination of need to alter existing quantum circuitry on the qubit chip).
  • An additional advantage of this is to facilitate localized annealing of qubits (e.g., annealing one qubit without unwantedly annealing and/or affecting neighboring qubits on the qubit chip).
  • the first length of the first defined vertical gap can be a function of a model of a radiation pattern of the first electromagnetic wave as a cone.
  • the cone can originate from the first antenna and can extend downward toward the qubit chip.
  • An advantage of this is to facilitate determining an appropriate distance to place between the first antenna and the qubit chip so as to reliably perform localized qubit annealing (e.g., annealing a target qubit/Josephson junction without accidentally affecting neighboring qubits/Josephson junctions).
  • the method can further include directing, via a second antenna on the antenna chip, a second electromagnetic wave toward the second qubit.
  • the method can comprise annealing, by the second antenna, a second Josephson junction of the second qubit based on the directing of the second electromagnetic wave.
  • a second length of a second defined vertical gap between the second antenna and the qubit chip can cause the second electromagnetic wave to circumscribe a second set of capacitor pads of the second qubit. This can thereby heat the second Josephson junction of the second qubit.
  • An advantage of this is to facilitate independent and concurrent (or sequential) localized annealing of multiple qubits on a multi-qubit chip (e.g., simultaneously annealing more than one qubit on a multi-qubit chip, such that each qubit on the chip can achieve a distinct level of annealing, and such that the distinct levels of annealing of the various qubits on the chip can be different).
  • a device can comprise a superconducting qubit chip having a first Josephson junction and a second Josephson junction.
  • the device can also comprise an antenna chip above the qubit chip.
  • a first antenna can be on the antenna chip and can emit a first electromagnetic wave toward the first Josephson junction.
  • a second antenna can be on the antenna chip and can emit a second electromagnetic wave toward the second Josephson junction.
  • the device can include a micromanipulator, a piezocontroller, or a temporary attachment that can position the antenna chip above the qubit chip, with a defined vertical gap between the antenna chip and the qubit chip.
  • a length of the defined vertical gap can be sized by the micromanipulator, piezocontroller, or temporary attachment to cause the first electromagnetic wave to circumscribe the first Josephson junction, thereby annealing the first Josephson junction, and to cause the second electromagnetic wave to circumscribe the second Josephson junction, thereby annealing the second Josephson junction.
  • the length of the defined vertical gap can be approximately equal to a height of a cone.
  • a base of the cone can circumscribe the first Josephson junction.
  • an apex angle of the cone can be approximately equal to a three-decibel angular beam width of a main lobe of a radiation pattern of the first electromagnetic wave.
  • a computer-implemented method can comprise positioning, via a micromanipulator, a piezocontroller, or a temporary attachment, an antenna chip above a superconducting qubit chip having a first Josephson junction and a second Josephson junction. There can be a defined vertical gap between the antenna chip and the qubit chip. Additionally, the method can include emitting, by the antenna chip, an electromagnetic wave toward the first Josephson junction. The method can further comprise annealing, by the antenna chip, the first Josephson junction based on the emitting. A length of the defined vertical gap can be sized by the micromanipulator, piezocontroller, or temporary attachment to cause the electromagnetic wave to circumscribe the first Josephson junction.
  • An advantage of this is to facilitate a new technique of qubit annealing that makes use of existing quantum circuitry on a superconducting qubit chip, thereby eliminating the need to retrofit the chip with specialized annealing/tuning circuitry.
  • Another advantage of this is to facilitate localized annealing of qubits (e.g., annealing at least one qubit on a multi-qubit chip without accidentally annealing neighboring qubits on the multi-qubit chip).
  • the length of the defined vertical gap can be a function of a model of a radiation pattern of the electromagnetic wave as a cone. The cone can originate from the antenna chip and can extend toward the qubit chip.
  • An advantage of this is to facilitate determining how far the antenna chip can be from the qubit chip so as to reliably perform localized annealing.
  • a computer-implemented method can comprise positioning, by a system, an antenna chip having an antenna above a first superconducting qubit chip having a first Josephson junction.
  • the method can also include annealing, by the antenna, the first Josephson junction by emitting, via the antenna, a first electromagnetic wave toward the first Josephson junction.
  • the method can further comprise positioning, by the system, the antenna chip above a second superconducting qubit chip having a second
  • the method can also include annealing, by the antenna, the second Josephson junction by emitting, via the antenna, a second electromagnetic wave toward the second Josephson junction.
  • FIGs. 1 A and 1 B are respectively top-view and side-view schematics of a system that facilitates antenna- based qubit annealing in accordance with an embodiment of the invention.
  • FIG. 2 is an equivalent circuit diagram of a system that facilitates antenna-based qubit annealing in accordance with an embodiment of the invention.
  • FIG. 3 is a side-view schematic of a system that facilitates antenna-based qubit annealing with a defined vertical gap in accordance with an embodiment of the invention.
  • FIG. 4 is a flow diagram of a computer-implemented method that facilitates antenna-based qubit annealing with a defined vertical gap in accordance with an embodiment of the invention.
  • FIG. 5 is a radiation pattern graph of a system that facilitates antenna-based qubit annealing in accordance with an embodiment of the invention.
  • FIGs. 6A-6C are perspective schematics of a system that facilitates localized antenna-based qubit annealing with a defined vertical gap in accordance with an embodiment of the invention.
  • FIG. 7 is a side-view schematic of a system that facilitates localizing antenna-based qubit annealing using spacers in accordance with an embodiment of the invention.
  • FIG. 8 is a side-view schematic of a system that facilitates antenna-based qubit annealing of multiple qubits in accordance with an embodiment of the invention.
  • FIG. 9 is a flow diagram of a computer-implemented method that facilitates annealing multiple qubits by antenna-based qubit annealing in accordance with an embodiment of the invention.
  • FIG. 10 is a flow diagram of a computer-implemented method that facilitates adjusting a wavelength of an emitted electromagnetic wave in accordance with an embodiment of the invention.
  • FIG. 11 is a side-view schematic of a system that facilitates antenna-based qubit annealing using a micromanipulator or piezocontroller in accordance with an embodiment of the invention.
  • FIG. 12 is a flow diagram of a computer-implemented method that facilitates antenna-based qubit annealing using a micromanipulator or piezocontroller in accordance with an embodiment of the invention.
  • FIG. 13 is a flow diagram of a computer-implemented method that facilitates antenna-based qubit annealing by moving an antenna chip across multiple superconducting qubit chips queued for annealing in accordance with an embodiment of the invention.
  • FIG. 14 is a block diagram of an operating environment in which one or more embodiments described herein can be facilitated.
  • Superconducting qubits offer a promising path toward constructing fully-operational quantum computers. This is because they can exhibit quantum-mechanical behavior (allowing them to be used for quantum information processing) at the macroscopic level (allowing them to be designed and fabricated by existing integrated circuit technologies).
  • the fundamental building-block of superconducting qubits is the Josephson junction. Josephson junctions can be formed by sandwiching a non-superconducting material between two superconducting materials, and can be modified by thermal annealing (e.g., heat treating).
  • the annealing of a qubit can change a transition frequency of the qubit (e.g., a resonant frequency marking the transition between a qubit’s ground state and an excited state).
  • a transition frequency of the qubit e.g., a resonant frequency marking the transition between a qubit’s ground state and an excited state.
  • Such manipulation of qubit transition frequencies can enable optimized frequency allocation, thereby minimizing frequency collisions and/or quantum cross-talk.
  • multiple qubits on a multi-qubit chip can be individually/independently annealed such that each qubit has a distinct transition frequency from those of its neighboring qubits, thereby decreasing the likelihood of neighboring qubits inappropriately responding to a computational and/or control signal meant to induce a response in only a certain qubit.
  • Embodiments of the present invention can provide solutions to this problem in the art.
  • Embodiments of the invention described herein include systems and computer-implemented methods, that facilitate concurrent and localized qubit annealing. More specifically, embodiments of the invention pertaining to methods for concurrent and/or localized qubit-annealing using antennas and/or electromagnetic emitters are described.
  • a radio frequency emitter/antenna can emit an electromagnetic signal/wave onto a set of one or more capacitor pads of a Josephson junction, wherein the Josephson junction is a component of a qubit on a superconducting qubit chip.
  • the set of pads can receive the electromagnetic signal/wave; that is, each pad can function as a receiving antenna (e.g., a patch antenna).
  • the electromagnetic signal can induce an alternating current and/or voltage in the set of one or more capacitor pads and/or at or within a defined distance from the Josephson junction (e.g., in the circuit lines electrically coupling the pads to the Josephson junction).
  • This alternating current/voltage can heat the Josephson junction.
  • Such heating can affect the properties of the Josephson junction, thereby modifying a transition frequency of the qubit.
  • localized qubit annealing can be performed without having to add and/or subtract circuitry to/from the qubit chip.
  • Multiple electromagnetic emitters/antennas can be implemented concurrently so as to perform localized annealing on multiple qubits simultaneously.
  • inventions described herein relate to systems and computer-implemented methods that employ highly technical hardware and/or software to technologically solve technological problems in the field of qubit annealing (e.g., thermal annealing of qubits).
  • the field of qubit annealing (which is entirely distinct and separate from the field of quantum annealing) suffers from a lack of scalable and efficient systems and/or computer-implemented methods for individually, independently, and/or concurrently annealing superconducting qubits on a superconducting qubit chip.
  • embodiments of the present invention can address this technical problem by providing a scalable and efficient system and/or computer-implemented method that utilizes electromagnetic transmitters/antennas to excite sets of capacitor pads of superconducting qubits on a superconducting qubit chip.
  • the transmitters/antennas can emit electromagnetic radiation (e.g.
  • a defined vertical gap between the transmitter/antenna and the qubit chip can be sized so as to cause the electromagnetic signal/wave to circumscribe/envelope capacitor pads of a target qubit/Josephson junction, thereby annealing the target qubit/Josephson junction, and to avoid circumscribing/enveloping capacitor pads of neighboring qubits/Josephson junctions, thereby avoiding unwanted/accidental annealing of the neighboring qubits/Josephson junctions.
  • Emitters/antennas can correspond in a one-to-one fashion to qubits on the qubit chip, wherein each emitter/antenna can be individually and/or independently voltage and/or frequency tunable. That is, each emitter/antenna can be controlled so as to manipulate a duration, a frequency, and/or a magnitude of the electromagnetic wave that it can generate. Each wave/signal can then induce a distinct amount of annealing of the qubit onto which it is emitted.
  • each qubit can be individually and/or independently annealed (e.g., by adjusting the voltage and/or frequency of its corresponding emitter/antenna) such that it receives a unique and/or defined level of annealing as compared to its neighboring qubits on the qubit chip.
  • each of the qubits can achieve a defined level of annealing via the systems and/or computer-implemented methods disclosed herein.
  • embodiments of the invention can facilitate annealing a first qubit by a first electromagnetic signal for a first time period, and annealing a second qubit by a second electromagnetic signal for a second time period, wherein the two time periods can be of the same length and/or of different lengths, and/or wherein the two signals can be of the same frequencies, wavelengths, and/or magnitudes and/or of different frequencies, wavelengths, and/or magnitudes.
  • the emitters/antennas can operate concurrently, thereby facilitating independent and/or concurrent (or sequential) localized annealing of the qubits (e.g., annealing a first qubit for a first time period, and annealing a second qubit for a second time period, wherein the two time periods can be overlapping and/or non-overlapping).
  • concurrent and localized annealing addresses problems in the prior art by saving time as compared to serial annealing and improving operation/functionality of multi-qubit chips by eliminating frequency collisions and/or quantum cross-talk.
  • a system 100 that can facilitate antenna-based qubit annealing of qubits on a superconducting qubit chip 102 can be used to facilitate antenna-based annealing of qubits/Josephson junctions on the qubit chip 102 regardless of the fabrication stage of the qubits/Josephson junctions.
  • the system 100 can be an antenna-based qubit annealing system that anneals qubits/Josephson junctions on the qubit chip 102, wherein the system 100 can be used for post-fabrication, pre-fabrication, and/or mid-fabrication processing/annealing of the qubits/Josephson junctions.
  • the qubit chip 102 can be fully
  • the qubit chip 102 is fully-fabricated and ready to be implemented in a quantum computer once a defined level of annealing is accomplished.
  • the qubits/Josephson junctions on the qubit chip 102 can undergo additional fabrication/processing after being annealed by the system 100.
  • the system 100 can be incorporated into a dedicated qubit-production and/or Josephson-junction- production process, wherein the qubit chip 102 is a dedicated platform/substrate on which one or more qubits/Josephson junctions are constructed, and wherein the qubits/Josephson junctions are removed from the qubit chip 102 after annealing to be incorporated into other quantum computing chips.
  • the qubit chip 102 can be a printed circuit board comprising one or more sheets/layers of conducting material (e.g., such as copper) laminated onto and/or between sheets/layers of non-conducting substrates. Any suitable conductors and/or non-conducting substrates known in the art can be used. In other embodiments of the invention, the qubit chip 102 can be any platform known in the art that is suitable to carry one or more
  • the qubit chip 102 can have on it one or more
  • superconducting qubits with a superconducting qubit comprising at least one Josephson junction.
  • the qubit chip 102 can have on it a superconducting qubit, wherein the
  • superconducting qubit can comprise a Josephson junction 104 (marked with“X” in the drawings) and a set of one or more capacitor pads 106.
  • the pads 106 can comprise any capacitor pad construction known in the art.
  • the Josephson junction 104 can be created by coupling two superconductors together via a weak link. As mentioned above, this can be accomplished by sandwiching a thin layer of non-superconducting material between two layers of superconducting material, wherein the layer of non-superconducting material is the weak link (e.g., S-N-S Josephson junction). This can also be accomplished by separating the superconductors with a thin insulating barrier, wherein the insulating barrier is the weak link (e.g., S-l-S Josephson junction).
  • the Josephson junction 104 is a macroscopic structure, it can be constructed by known integrated circuit technologies and/or techniques (e.g., photolithography, deposition, sputtering, evaporation, doping, and so on).
  • the Josephson junction 104 can exhibit a Cooper-pair quantum tunneling effect (e.g., electrons tunneling through the weak link in the absence of an applied voltage), thereby allowing for the flow of a supercurrent (e.g., electrical current flowing without resistance/dissipation) across the junction at sufficiently low temperatures.
  • This quantum-mechanical behavior at the macroscopic level can allow the Josephson junction 104 to function as (or as part of) a qubit (e.g., a device that can occupy discrete/quantized energy states as well as superpositions of those energy states).
  • the Josephson junction 104 can be a component of a transmon qubit (e.g., a type of charge qubit), the quantized energy states of which can correspond to integer numbers of Cooper-paired electrons that have crossed the Josephson junction 104 and/or are present on a superconducting island formed in part by the
  • the Josephson junction 104 can be a component of other types of qubits, such as a flux qubit (e.g., the quantized energy states of which can correspond to integer numbers of magnetic flux quanta penetrating a superconducting loop formed in part by the Josephson junction 104), a phase qubit (e.g., the quantized energy states of which can correspond to quantum charge oscillation amplitudes across the Josephson junction 104), and so on.
  • a flux qubit e.g., the quantized energy states of which can correspond to integer numbers of magnetic flux quanta penetrating a superconducting loop formed in part by the Josephson junction 104
  • a phase qubit e.g., the quantized energy states of which can correspond to quantum charge oscillation amplitudes across the Josephson junction 104
  • properties of the Josephson junction 104 can affect the transition frequencies between these quantized energy states, and so annealing (e.g., heat treating) of the Josephson junction 104 can be implemented to tune, modify, and/or alter transition frequencies of a qubit comprising the Josephson junction 104.
  • annealing e.g., heat treating
  • tuning, modification, and/or alteration can be implemented to reduce frequency collision and/or quantum cross-talk between multiple qubits, thereby improving the functionality and/or operation of multi-qubit chips.
  • transmon qubit design that is, a superconducting qubit in which the Josephson junction 104 is coupled in parallel to a capacitor, which has a set of one or more capacitor pads 106 (also called “transmon capacitor pads 106,”“capacitor pads 106,” and/or“pads 106”).
  • capacitor pads 106 also called “transmon capacitor pads 106,”“capacitor pads 106,” and/or“pads 106”.
  • capacitor pad configurations e.g. serial and/or parallel coupling
  • qubit designs that can be used with the qubit-annealing system 100 include other types of charge, phase, flux, fluxonium, xmon, and quantronium qubits, and so on.
  • transmon qubit e.g., transmon capacitor pads 106
  • systems and/or computer-implemented methods described herein can be implemented to leverage the existing quantum circuitry in other qubit designs to similarly facilitate annealing of those other qubits.
  • the systems and/or computer-implemented methods described herein can be implemented in conjunction with any type of quantum circuitry component, which can receive electromagnetic signals/waves as an antenna, to facilitate qubit annealing.
  • FIGs. 1 A and 1 B depict a qubit having only a single Josephson junction 104 and a single set of capacitor pads 106
  • a qubit on the qubit chip 102 can comprise any number of Josephson junctions 104 and/or any number of capacitor pads 106.
  • additional quantum circuitry e.g., readout resonators, flux bias lines, and so on
  • additional quantum circuitry can be incorporated onto the qubit chip 102, wherein such additional quantum circuitry is conductively, capacitively, and/or inductively coupled to the Josephson junction 104 and/or the set of pads 106.
  • the system 100 can include an emitter chip 108 (also called antenna chip 108 or semiconductor chip 108, and not depicted in FIG. 1A) and a radio frequency (RF) emitter 110 (also called antenna 110) on the emitter chip 108.
  • the emitter chip 108 can employ a printed circuit board construction and/or any other computer chip construction known in the art such that the RF emitter/antenna 110 can be operably soldered, etched, and/or attached onto the emitter chip 108.
  • the emitter chip 108 can be positioned above, mounted above, mounted on, and/or mounted onto the qubit chip 102, such that the RF emitter/antenna 110 is above the qubit chip 102.
  • the RF emitter/antenna 110 can be positioned directly or substantially directly vertically above the Josephson junction 104 and/or the set of pads 106 (as shown in FIG. 1 B). In other embodiments of the invention, the RF emitter/antenna 110 can be positioned such that it is above the qubit chip 102 and not directly or substantially directly vertically above the Josephson junction 104 and/or the set of pads 106.
  • the RF emitter/antenna 110 can emit, generate, localize, and/or direct an electromagnetic signal/wave 112 toward, on, and/or onto the set of pads 106.
  • the RF emitter/antenna 110 can be a microstrip antenna (e.g., a patch antenna) that can be etched, soldered, and/or otherwise attached onto the emitter chip 108.
  • the RF emitter/antenna 110 can be a dipole, monopole, array, loop, aperture, horn, parabolic, or plasma antenna, and so on.
  • the RF emitter/antenna 110 can be any device, antenna, and/or signal generator known in the art and that can propagate an electromagnetic signal/wave through space/air (and/or otherwise across a medium lacking electrical conductors).
  • the RF emitter/antenna 110 can be voltage and/or frequency tunable. That is, the RF emitter/antenna 110 can be controlled/manipulated (e.g., by controlling/manipulating an input alternating current and/or voltage that is fed to the RF emitter/antenna 110 to generate the propagating signal/wave 112) so as to control/manipulate the characteristics of the signal/wave 112.
  • the RF emitter/antenna 110 can control a duration, a frequency, and/or a magnitude of the signal/wave 112 to generate a defined level of the annealing of the Josephson junction 104.
  • the input alternating current and/or voltage that is fed to the RF emitter/antenna 110 to generate the propagating signal/wave 112 can be ceased (e.g., set to zero) to stop/cease the emitting of the signal/wave 112.
  • the RF emitter/antenna 110 can control a duration of the signal/wave 112 by ceasing the emitting based on achieving the defined level of annealing (e.g., ceasing the emitting after a defined period of time has elapsed from the RF emitter 110 beginning to emit the signal/wave 112).
  • the oscillation frequency of the input alternating current and/or voltage that is fed to the RF emitter/antenna 110 to generate the propagating signal/wave 112 can be increased, decreased, and/or otherwise controlled in order to increase, decrease, and/or otherwise control a frequency and/or wavelength of the signal/wave 112.
  • the RF emitter/antenna 110 can control a frequency and/or wavelength of the signal/wave 112 to hasten and/or slow the annealing of the Josephson junction 104.
  • the magnitude of the input alternating current and/or voltage that is fed to the RF emitter/antenna 110 to generate the propagating signal/wave 112 can be increased, decreased, and/or otherwise controlled in order to increase, decrease, and/or otherwise control a magnitude of the signal/wave 112.
  • the RF emitter/antenna 110 can control a magnitude of the signal/wave 112 to hasten and/or slow the annealing of the Josephson junction 104.
  • the RF emitter/antenna 110 can comprise one or more voltage- controlled oscillators (VCOs) that can be used to generate voltage tunable, current tunable, and/or frequency tunable signals to enable the RF emitter/antenna 110 to generate and control the signal/wave 112.
  • VCOs voltage- controlled oscillators
  • the signal/wave 112 can have a frequency that is greater than or equal to 150 GigaHertz (e.g., belonging to the microwave region of the electromagnetic spectrum (such as between 300 KiloHertz and 300 GigaHertz)).
  • the signal/wave 112 can have a maximum power of 1 Watt to limit damage to Josephson junctions.
  • the RF emitter/antenna 110 can emit/generate the signal/wave 112 such that the signal/wave 112 is substantially isotropic (e.g., the signal/wave 112 is radiated with substantially equal strength in every direction, thereby having a substantially spherical radiation pattern).
  • the RF emitter/antenna 110 can emit/generate and/or localize/direct the signal/wave 112 such that the signal/wave 112 is omnidirectional (e.g., the electromagnetic signal/wave 112 is radiated substantially symmetrically with respect to a given axis, thereby having a substantially torus-like radiation pattern).
  • the RF emitter/antenna 110 can emit/generate and/or localize/direct the signal/wave 112 such that the signal/wave 112 is directional (e.g., the signal/wave 112 is radiated more strongly in a given direction than in other directions, thereby having a radiation pattern with at least one main lobe).
  • the signal/wave 112 can be emitted by the RF emitter/antenna 110 toward, onto, and/or on the set of pads 106.
  • the set of pads 106 can receive and/or capture the signal/wave 112 as the signal/wave 112 propagates through space/air.
  • each pad of the set of pads 106 can function as a receiving antenna (e.g., a receiving patch antenna) that responds to being exposed to the signal/wave 112.
  • the reception of the signal/wave 112 by the pads 106 can cause annealing of the Josephson junction 104.
  • FIG. 2 there is illustrated a circuit diagram 200 that shows how the pads 106 and the Josephson junction 104 respond upon receiving the signal/wave 112.
  • each pad 106 can function as a receiving antenna, thereby receiving/capturing the signal/wave 112. Based on receiving the signal/wave 112, the pads 106 can generate an alternating current and/or voltage at or within a defined distance from the Josephson junction 104 (e.g., in the circuit lines electrically coupling the set of pads 106 to the Josephson junction 104). The generated alternating current and/or voltage can then heat the Josephson junction 104, thereby annealing the Josephson junction 104.
  • each pad 106 can be thought of as being individually coupled in series to the Josephson junction 104.
  • each pad 106 can receive/capture the signal/wave 112, thereby functioning as a receiving antenna.
  • the electrons in each of the pads 106 can begin to oscillate according to the characteristics/properties (e.g., frequency, wavelength, amplitude, magnitude, and so on) of the signal/wave 112.
  • each separate pad 106 based upon excitation by the signal/wave 112, can be considered a separate oscillating signal source 202 (e.g., an alternating current and/or voltage source), wherein each oscillating signal source 202 can generate an alternating current 206 and/or an alternating voltage 208.
  • FIG. 2 depicts two separate pads 106, FIG.
  • each pad 106 depicts two corresponding oscillating signal sources 202, each one generating an alternating current 206 and/or an alternating voltage 208.
  • additional and/or fewer capacitor pads can be incorporated.
  • the effect of emitting, via the RF emitter/antenna 110, the signal/wave 112 onto the set of pads 106 is to cause each pad 106 to separately replicate (or substantially replicate) the signal/wave 112 as an alternating current 206 and/or an alternating voltage 208 that flows through the pads 106 themselves and through the circuit lines coupling the pads 106 to the Josephson junction 104, rather than as waves/signals propagating through space/air.
  • the frequency and/or magnitude of the signal/wave 112 can be controlled so as to control the frequency and/or magnitude of the alternating current 206 and/or the alternating voltage 208.
  • the magnitude of the alternating voltage 208 can be limited to no more than 50 millivolts so as to avoid damaging the Josephson junction 104.
  • each alternating current 206 and/or alternating voltage 208 is generated at a corresponding oscillating signal source 202 (e.g., at a corresponding pad 106) and can run from the corresponding oscillating signal source 202 to the Josephson junction 104 through the circuit lines electrically connecting the corresponding oscillating signal source 202 to the Josephson junction 104.
  • “Z” represents the impedance 204 from each oscillating signal source 202 to the Josephson junction 104 (that is, impedance from each pad106 to the junction 104).
  • the pads 106 can be symmetric, and so the two impedances 204 can be equal.
  • the pads 106 can be asymmetric, and so the two impedances 204 can be unequal.
  • the complex formulation of Ohm’s law yields that the two alternating currents 206 can also be unequal, and thus can partially cancel at the Josephson junction 104.
  • the alternating currents 206 oscillate back and forth through the circuit lines leading from the oscillating signal sources 202 (e.g., from the pads 106) to the Josephson junction 104, and such oscillation can continue for as long as the RF emitter/antenna 110 emits the signal/wave 112.
  • the oscillation of the alternating current 206 can dissipate power in the form of heat, thereby heating the circuit lines connecting the oscillating signal sources 202 to the Josephson junction 104.
  • the oscillating signal sources 202 e.g., the pads 106) can, themselves, also heat up during this oscillation.
  • This heating of the capacitor pads 106 and the lines coupling the capacitor pads 106 to the Josephson junction 104 can then heat the Josephson junction 104 (e.g., via thermal conduction).
  • Such heating can alter the physical and/or electrical properties of the Josephson junction 104 (e.g., its critical current, its normal state resistance, and so on), thereby correspondingly altering a transition frequency of the qubit comprising the
  • Josephson junction 104 various embodiments of the present invention can leverage the existing quantum circuitry on the qubit chip to anneal qubits, thereby addressing/solving the prior art problem of having to incorporate specialized tuning circuitry onto the superconducting qubit chip to tune qubit frequencies.
  • the Josephson junction 104 can be heated in this way to achieve a defined and/or desired level of annealing.
  • the defined level of annealing can be based on a defined and/or desired transition frequency which the Josephson junction 104 is to achieve. For example, if the Josephson junction 104 is to have a transition frequency of A, then it must be annealed at B intensity for C amount of time.
  • the duration, frequency, and/or magnitude of the signal/wave 112 can be controlled/adjusted so as to provide the required B intensity for C amount of time.
  • the level of annealing performed on the Josephson junction 104 can be monitored by monitoring the normal state electrical resistance of the Josephson junction 104 (e.g., based on the Ambegaokar-Baratoff formula relating critical current to normal state resistance). Those of skill in the art will appreciate that such monitoring can be implemented by systems and methods known in the art (e.g., via an Ohmmeter, and so on).
  • FIG. 2 depicts a circuit diagram 200 that illustrates the electrical response of the capacitor pads 106 and the Josephson junction 104 to the reception of the signal/wave 112.
  • the drawings depict the set of pads 106 in a transmon configuration (e.g., pads of a capacitor, which is coupled in parallel to the Josephson junction 104), the systems and/or methods described herein can be implemented with various other electrical components coupled to the Josephson junction 104 in lieu of the capacitor pads 106 (e.g., any component that can receive the signal/wave 112 to generate an alternating current 206 and/or alternating voltage 208 can suffice).
  • any component that can receive the signal/wave 112 to generate an alternating current 206 and/or alternating voltage 208 can suffice.
  • a system 300 can comprise the qubit chip 102, the Josephson junction 104 having the set of capacitor pads 106, the emitter/semiconductor chip 108, and the RF emitter/antenna 110 that can be positioned above the qubit chip 102 and that can emit/direct the signal/wave 112 toward the Josephson junction 104.
  • the qubit chip 102 can further have a second qubit with a second Josephson junction 302 with a second set of one or more capacitor pads 304.
  • the system 300 can include a defined vertical gap 306 between the RF emitter/antenna 110 and the qubit chip 102.
  • a length of the defined vertical gap 306 e.g., a height of the gap 306 separating the antenna 110 and/or the antenna chip 108 from the qubit chip 102
  • a length of the defined vertical gap 306 can be sized to cause the signal/wave 112 to circumscribe the set of pads 106 of the Josephson junction 104. This can cause annealing of the Josephson junction 104, substantially as described above.
  • the distance separating the RF emitter/antenna 110 from the qubit chip 102 can be controlled/modulated (e.g., by robotic arms,
  • Controlling/modulating the length/height of the defined vertical gap 306 can change the amount of surface area of the qubit chip 102 that is circumscribed/enveloped by the signal/wave 112. That is, the amount of surface area of the qubit chip 102 that is within the propagation path of the signal/wave 112 (e.g., where the propagation path of signal/wave 112 is denoted by guidelines 308) can be changed/controlled.
  • the height/length of the defined vertical gap 306 shown in FIG. 3 can cause the signal/wave 112 to circumscribe the pads 106 (e.g., the pads 106 are within the guidelines 308, and are thus within the propagation path of the signal/wave 112) and to not circumscribe the pads 304 (e.g., the pads 304 are not within the guidelines 308, and so are not within the propagation path of the signal/wave 112).
  • the pads 106 can receive the signal/wave 112, thereby annealing the Josephson junction 104, while the pads 304 cannot receive the signal/wave 112, thereby preventing annealing of the second
  • the height/length of the defined vertical gap 306 can be changed/controlled. For example, if the height/length of the defined vertical gap 306 were sufficiently larger than that shown in FIG. 3, parts of the second set of pads 304 could then be placed within the propagation path of the signal/wave 112 (e.g., within the guidelines 308). In such case, at least some part of the pads 304 could receive the signal/wave 112, thereby annealing and/or otherwise affecting the second Josephson junction 302. That is, neighboring qubits/Josephson junctions can be mistakenly, accidentally, and/or unwantedly annealed/affected if the length/height of the defined vertical gap 306 is too large.
  • parts of the first set of pads 106 could then be placed outside the propagation path of the signal/wave 112 (e.g., outside the guidelines 308). In such case, at least some part of the pads 106 could not receive the signal/wave 112, thereby resulting in suboptimal annealing (or potentially no annealing) of the
  • Josephson junction 104 that is, insufficient/sub-optimal annealing of a target qubit/Josephson junction can occur if the length/height of the defined vertical gap 306 is too small.
  • an advantage of this is the facilitation of precise, accurate, and reliable localized annealing of at least one target qubit on a multi-qubit chip without unwantedly annealing neighboring qubits on the multi-qubit chip. More specifically, appropriately sizing the height/length of the defined vertical gap 306 can solve the problem of imprecise, inaccurate, and/or accidental annealing of neighboring qubits.
  • FIG. 3 depicts the RF emitter/antenna 110 as directly and/or substantially directly vertically above the Josephson junction 104, those of skill in the art will appreciate that the RF emitter/antenna 110 does not need to be positioned as such, and that other positions/configurations of the RF emitter/antenna 110 can be incorporated. Furthermore, even though FIG. 3 depicts the RF emitter/antenna 110 as directly and/or substantially directly vertically above the Josephson junction 104, those of skill in the art will appreciate that the RF emitter/antenna 110 does not need to be positioned as such, and that other positions/configurations of the RF emitter/antenna 110 can be incorporated. Furthermore, even though FIG.
  • FIG. 3 depicts only two Josephson junctions (e.g., a target junction 104 to be annealed and a neighboring junction 302 to not be annealed), those of skill in the art will understand that any number of target qubits/Josephson junctions 104 and/or any number of neighboring qubits/Josephson junctions 302 can be incorporated onto the qubit chip 102.
  • FIG. 3 shows only one RF emitter/antenna 110 on the emitter/semiconductor chip 108, those of ordinary skill will appreciate that any number of emitters/antennas 110 can be incorporated.
  • FIG. 4 depicts a computer-implemented method 400 that can be facilitated by the system 300 of FIG. 3.
  • a first antenna on an antenna chip located above a superconducting qubit chip having a first qubit and a second qubit, can direct a first electromagnetic wave toward the first qubit.
  • the first antenna can then anneal a first Josephson junction of the first qubit based on the directing, substantially as described above.
  • a first length of a first defined vertical gap between the first antenna (and/or the antenna chip) and the qubit chip can cause the first wave to circumscribe a first set of one or more capacitor pads of the first qubit. This can thereby heat the first Josephson junction of the first qubit.
  • the first length of the first defined vertical gap can prevent the first wave from circumscribing a second set of one or more capacitor pads of the second qubit, thereby preventing annealing of a second Josephson junction of the second qubit.
  • a micromanipulator, a piezocontroller, or a temporary attachment can move the antenna chip to a second superconducting qubit chip (e.g., such that the antenna chip is above the second qubit chip).
  • a second superconducting qubit chip e.g., such that the antenna chip is above the second qubit chip.
  • This can facilitate annealing of qubits on the second qubit chip, substantially as described above.
  • An advantage of this is to facilitate consistent and reliable qubit annealing across multiple qubit chips queued for annealing (e.g., such as in a qubit or Josephson junction manufacturing line).
  • FIG. 5 shows a graph 500 of the directional dependence of the strength of a signal/wave emitted and/or directed by the RF emitter/antenna 110.
  • the graph 500 depicts the RF emitter/antenna 110 on the emitter/semiconductor chip 108 and a corresponding radiation pattern 506 generated by the emitter/antenna 110.
  • the radiation pattern 506 represents the forward gain (e.g., strength) of an electromagnetic signal/wave 112 emitted by the RF emitter/antenna 110 as a function of direction (e.g., angle Q) in units of decibel isotropic (dBi). That is, the graph 500 represents the gain of the antenna 110 relative to a hypothetical isotropic antenna that can radiate waves equally in all directions.
  • FIG. 5 depicts two axes of measurement: direction and gain.
  • the gain is measured in decibel isotropic units (e.g., dBi) as a sequence of concentric circles centered about the RF emitter/antenna 110 (e.g., beginning at 0 dBi on the outer-most periphery of the graph 500, then progressing to -10 dBi, then to -20 dBi, and then to -30 dBi, and so on as the concentric circles get closer to the RF emitter/antenna 110).
  • decibel isotropic units e.g., dBi
  • a more negative forward gain in a particular direction represents a weaker signal in that direction
  • a more positive forward gain in a particular direction represents a stronger signal in that direction.
  • the radiation pattern 506 is illustrative only and is not to be interpreted as experimentally collected data or as referential data useful for industry applications. Instead, the radiation pattern 506 is exemplary and conceptual only.
  • that section of the radiation pattern 500 can represent a main lobe of the signal/wave 112 emitted by the RF emitter/antenna 110.
  • this portion of the radiation pattern 506 can contain one or more back/side lobes (e.g., three back/side lobes depicted in FIG. 5).
  • radiation patterns can vary by antenna, and so any other different and/or modified radiation pattern can be incorporated into various embodiments of the present invention depending on the RF emitter/antenna 110 (e.g., embodiments with more and/or fewer lobes, embodiments with different gain values, and so on).
  • the height/length of the defined vertical gap 306 can be a function of a model of the signal/wave 112 as a cone.
  • the main lobe of the radiation pattern 506 can be modeled/represented/approximated as a cone extending downward from the RF emitter/antenna 110.
  • graph 500 can show a projection of a cone 502 with an angular beam width 504. That is, the beam width 504 can represent the angular span of the apex angle of the cone 502.
  • the beam width 504 can represent a three-decibel angular beam width of the main lobe of the signal/wave 112 (e.g., of the main lobe of the radiation pattern 506).
  • a three-decibel angular beam width represented by points having a forward gain of -3 dBi, can correspond to the half-power points of the radiation pattern 506 (e.g., the points at which the strength of the radiation pattern 506 is approximately half the strength of an isotropic radiation pattern).
  • the three-decibel angular beam width (e.g., beam width 504) can be approximately 60 degrees (but other values are possible depending on the emitter 110).
  • angular beam width 504 depicts the angular beam width 504 as corresponding to a three-decibel angular beam width of the main lobe of the radiation pattern 506, those of ordinary skill in the art will appreciate that other values of the angular beam width 504 can be incorporated.
  • an apex angle e.g., angular beam width 504 of a cone (e.g., cone 502), which can mathematically approximate a main lobe of the radiation pattern, can be obtained/learned.
  • This angular beam width 504 can then be used in basic geometric calculations to determine an appropriate height/length of the defined vertical gap 306, as explained below.
  • FIGs. 6A-6C depict perspective/isometric views of the system 300, and can additionally show a three- dimensional perspective of the cone 502 having an apex angle approximately equal to the angular beam width 504.
  • the cone 502 can originate from the RF emitter/antenna 110 and can extend toward the qubit chip 102. That is, the cone 502 can represent/approximate the main lobe of the radiation pattern 506 of the signal/wave 112.
  • This model e.g., system 600
  • the length/height of the defined vertical gap 306 can be approximately equal to a height of the cone 502.
  • a base of the cone 502 can circumscribe the set of pads 106, and can avoid circumscribing the second set of pads 304.
  • an apex angle of the cone 502 can be approximately equal to a three-decibel angular beam width (e.g., beam width 504) of a main lobe of the radiation pattern of the signal/wave 112, as described above.
  • the angular beam width 504 can be learned/known from examining a radiation pattern graph, such as the graph 500. Moreover, assuming the dimensions of the set of pads 106 are known, the radius of the base of the cone 502 can be learned (e.g., the diameter of the base of the cone 502 can be large enough for the base to circumscribe the set of pads 106 and/or small enough to avoid circumscribing the set of pads 304). Thus, the height of the cone 502 can be obtained using trigonometry.
  • height radius / (tan((beam width)/2)
  • FIGs. 6B and 6C show perspective views of a system 600 having a significantly shorter and/or longer height/length of the defined vertical gap 306, respectively.
  • the cone 502 can fail to circumscribe the entirety of the set of pads 106 (e.g., at least some part of the pads 106 cannot be covered by the base of the cone 502).
  • portion 602 of the set of pads 106 can fail to be circumscribed by the cone 502.
  • at least some part of the pads 106 e.g., portion 602 cannot receive the signal/wave 112.
  • this can result in suboptimal annealing of the Josephson junction 104 since the pads 106 cannot be
  • the cone 502 can circumscribe at least some part of the second set of pads 304 (e.g., portion 604 of the second set of pads 304).
  • the pads 304 e.g., portion 604 can receive the signal/wave 112.
  • this can result in unwanted, accidental, and/or mistaken annealing (and/or other alteration) of the second Josephson junction 302 since the pads 304 can be partially excited by the signal/wave 112.
  • a radiation pattern graph e.g., graph 500
  • a suitable apex angle of the cone 502 e.g., beam width 504
  • an appropriate height/length of the defined vertical gap 306 can be obtained via basic trigonometry.
  • FIGs. 6A-6C are not drawn to scale.
  • system 700 can comprise the qubit chip 102, the first Josephson junction 104 with the set of pads 106, the second Josephson junction 302 with the second set of pads 304, the emitter/semiconductor chip 108, and the RF emitter/antenna 110 that can direct the signal/wave 112.
  • the system 700 can comprise one or more spacers 702.
  • the spacers 702 can be located in the defined vertical gap 306 between the RF emitter/antenna 110 (or the antenna chip 108) and the qubit chip 102. Additionally, a height of the spacers 702 can be approximately equal to the length/height of the defined vertical gap 306.
  • the spacers 702 can be placed in between the emitter/semiconductor chip 108 and the qubit chip 102 (and/or otherwise between the RF emitter/antenna 110 and the qubit chip 102) so as to separate the RF emitter/antenna 110 and the qubit chip 102 by enough space to facilitate localized annealing of the Josephson junction 104, substantially as described above.
  • the spacers 702 can be sized such that they cause the defined vertical gap 306 to be at a particular height, which causes the signal/wave 112 to circumscribe/envelope the set of pads 106 (e.g., pads 106 are within the guidelines 308), and to not circumscribe/envelope the second set of pads 304 (e.g., the pads 304 are not within the guidelines 308). As discussed above, this can cause annealing of the Josephson junction 104 without annealing the second Josephson junction 302. Those of skill will appreciate that other means of temporary attachment (e.g., mechanical clamps, spacing blocks, and so on) can be incorporated to separate the antenna chip 108 from the qubit chip 102 to appropriately size the defined vertical gap 306.
  • other means of temporary attachment e.g., mechanical clamps, spacing blocks, and so on
  • the height of the spacers 702 does not need to be exactly equal to the height of the defined vertical gap 306. Indeed, as can be seen in FIG. 7, the height of the spacers 702 can, be equal to the sum of the height/length of the defined vertical gap 306 and the vertical height/thickness of the RF emitter/antenna 110. Flowever, the RF emitter/antenna 110 can be substantially shorter (e.g., as thin as 0.035 millimeters for some patch antennas) than the spacers 702. Thus, those of skill in the art will appreciate that the height of the spacers 702 can still be said to be approximately equal to the height of the defined vertical gap 306.
  • the spacers 702 can be made of any suitable material known in the art that can reliably separate the antenna 110 from the qubit chip 102 without negatively affecting the annealing of the target junctions (e.g., insulators, plastics, wood, metal, ceramics, and so on).
  • a system 800 can comprise the qubit chip 102, the Josephson junction 104 having the set of pads 106, the second Josephson junction 302 having the second set of pads 304, the emitter/semiconductor chip 108, and the RF emitter/antenna 110 that can direct the electromagnetic signal/wave 112
  • the system 800 can comprise a second RF emitter/antenna 802 on the emitter chip 108.
  • the second RF emitter/antenna 802 can direct a second electromagnetic signal/wave 804 toward the second
  • the system 800 can also include a second defined vertical gap 806 between the second RF emitter/antenna 802 (or the emitter chip 108) and the qubit chip 102.
  • a second length of the second defined vertical gap 806 can be sized to cause the second electromagnetic signal/wave 804 to circumscribe the second set of pads 304 (e.g., the pads 304 are within the guidelines 808) of the second qubit, thereby annealing the second Josephson junction 302 of the second qubit. As explained above, this can cause the signal/wave 804 to not circumscribe the set of pads 106 (e.g., the pads 106 are not within the guidelines 808).
  • the length/height of the second defined vertical gap 806 can be approximately equal to or unequal to, and can be determined in substantially the same way as, the length/height of the defined vertical gap 306.
  • One of the antennas 110 and 802 can be closer to and/or farther from the qubit chip 102 than the other so as to control/modulate the number of qubits/Josephson junctions annealed and/or not annealed by each antenna 110 and 802, substantially as described above.
  • the defined vertical gap 306 can be substantially shorter than the second defined vertical gap 806, such that the RF emitter/antenna 110 anneals only one and/or a few target
  • the RF emitter/antenna 110 can direct the signal/wave 112 for a first time period.
  • the second RF emitter/antenna 802 can direct the second signal/wave 804 for a second time period.
  • the first time period and the second time period can be overlapping (e.g., the antennas 110 and 802 can anneal the Josephson junctions 104 and 302 simultaneously/concurrently).
  • the first time period and the second time period can be non-overlapping (e.g., serial annealing).
  • the first and second time periods can be of different lengths and/or of the same lengths (e.g., same and/or different durations of annealing).
  • durations and/or timing of operation of the antennas 110 and 802 can be controlled based on context and/or circumstances of industry applications (e.g., parallel annealing if less processing time is available, and so on).
  • each of the RF emitters/antennas 110 and 802 can be independently voltage and/or frequency tunable (e.g., so as to control the magnitude and/or frequency of the generated signals/waves 112 and 804).
  • This tunability can be used to achieve defined and/or distinct levels of annealing of the Josephson junctions 104 and 302 (e.g., annealing one junction more and/or less than another). In the case of concurrent annealing of the Josephson junctions 104 and 302, FIG.
  • the signal/wave 112 and the second signal/wave 804 can each be independently localized by their respective RF emitters/antennas, such that they can propagate through space/air and/or be received by their respective target qubits/capacitor pads without substantially interfering with each other. Since the magnitude and/or frequency of each wave 112 and 804 can be independently/individually
  • each Josephson junction 104 and 302 can be independently annealed to achieve a
  • annealing can occur simultaneously without the annealing of one junction substantially affecting the annealing of the other.
  • an advantage of this is to facilitate independent and concurrent localized annealing of multiple qubits on a multi-qubit chip, such that each target qubit can achieve a distinct level of annealing as compared to its neighboring qubits, and such that the annealing of each qubit does not necessarily affect the level of annealing of neighboring qubits.
  • FIG. 9 depicts a computer-implemented method 900 that can comprise the computer-implemented method 400 and that can further include annealing a second Josephson junction.
  • a first antenna on an antenna chip located above a superconducting qubit chip having a first qubit and a second qubit can direct a first electromagnetic wave toward the first qubit.
  • the first antenna can anneal a first Josephson junction of the first qubit based on the directing.
  • a first length of a first defined vertical gap between the first antenna and the qubit chip can cause the first wave to circumscribe a first set of one or more capacitor pads of the first qubit, thereby heating the first Josephson junction of the first qubit. As discussed above, this can cause the first wave to avoid circumscribing a second set of one or more capacitor pads of the second qubit, thereby not heating a second Josephson junction of the second qubit.
  • a second antenna on the antenna chip can direct a second electromagnetic wave toward the second Josephson junction.
  • the second antenna can anneal a second Josephson junction of the second qubit based on the directing of the second wave.
  • a second length of a second defined vertical gap between the second antenna and the qubit chip can cause the second wave to circumscribe the second set of capacitor pads of the second qubit, thereby heating the second Josephson junction of the second qubit. As explained above, this can cause the second wave to not circumscribe the first set of pads, thereby not heating the first Josephson junction of the first qubit.
  • each antenna can be individually/independently voltage and/or frequency tunable.
  • this can advantageously facilitate independent and/or concurrent (or sequential) localized annealing of multiple qubits on a multi-qubit chip, such that the annealing of one qubit does not substantially affect the annealing of another.
  • a micromanipulator, a piezocontroller, or a temporary attachment can move the antenna chip to a second superconducting qubit chip to facilitate annealing of qubits on the second qubit chip, as described above.
  • FIG. 10 is a flow diagram of a computer-implemented method that facilitates adjusting a wavelength of an emitted electromagnetic wave.
  • a first antenna on an antenna chip located above a superconducting qubit chip having a first qubit and a second qubit can direct a first electromagnetic wave toward the first qubit.
  • the first antenna can anneal a first Josephson junction of the first qubit based on the directing.
  • a first length of a first defined vertical gap between the first antenna and the qubit chip can cause the first wave to circumscribe a first set of one or more capacitor pads of the first qubit, thereby heating the first Josephson junction of the first qubit. As discussed above, this can cause the first wave to avoid circumscribing a second set of one or more capacitor pads of the second qubit, thereby not heating a second Josephson junction of the second qubit.
  • the first antenna can adjust a first wavelength of the first wave based on a first physical dimension of the first set of pads.
  • the first wavelength can be greater than or approximately equal to four times the first physical dimension of the first set of pads.
  • each pad of the first set can function as a receiving patch antenna.
  • patch antennas can efficiently receive/transmit signals/waves having wavelengths that are twice as long as their microstrip transmission lengths (e.g., the first physical dimension).
  • Such antennas can efficiently receive/transmit signals/waves having wavelengths that are four times as long as their antenna lengths.
  • An advantage of this is to control/tune the emitted/directed waves such that they can be reliably received by the capacitor pads.
  • a system 1100 can comprise a superconducting qubit chip 1102 having a first Josephson junction 1104 (with a first set of one or more capacitor pads 1106) and a second Josephson junction 1108 (with a second set of one or more capacitor pads 1110).
  • the system 1100 can also include an antenna chip 1120 above the qubit chip 1102.
  • a first antenna 1112 can be on the antenna chip 1120 and can emit a first electromagnetic wave 1114 toward the first Josephson junction 1104.
  • a second antenna 1122 can be on the antenna chip 1120 and can emit a second electromagnetic wave 1124 toward the second Josephson junction 1108.
  • system 1100 can comprise a micromanipulator or piezocontroller 1116 (and/or micromanipulator or a temporary attachment as described above, not depicted in FIG. 11) that can position the antenna chip 1120 above the qubit chip 1102, with a defined vertical gap 1118 between the antenna chip 1120 (and/or the antennas 1112 and 1122) and the qubit chip 1102.
  • a micromanipulator or piezocontroller 1116 and/or micromanipulator or a temporary attachment as described above, not depicted in FIG. 11
  • the system 1100 can comprise a micromanipulator or piezocontroller 1116 (and/or micromanipulator or a temporary attachment as described above, not depicted in FIG. 11) that can position the antenna chip 1120 above the qubit chip 1102, with a defined vertical gap 1118 between the antenna chip 1120 (and/or the antennas 1112 and 1122) and the qubit chip 1102.
  • a length/height of the defined vertical gap 1118 can be sized by the micromanipulator or piezocontroller 1116 to cause the first wave 1114 to circumscribe the first Josephson junction 1104 (and to not circumscribe the second Josephson junction 1108), thereby annealing the first Josephson junction 1104 (and not annealing the second Josephson junction 1108).
  • the length/height of the defined vertical gap can be sized to cause the second wave 1124 to circumscribe the second Josephson junction 1108 (and to not circumscribe the first Josephson junction 1104), thereby annealing the second Josephson junction 1108 (and not annealing the first Josephson junction 1104)
  • the micromanipulator/piezocontroller 1116 can be a device (e.g., a robotic arm, a mechatronic claw, some other micro-electromechanical device, and so on) that can physically interact with and/or physically move, manipulate, position, and/or orient the antenna chip 1120.
  • the micromanipulator/piezocontroller 1116 can be capable of three-axis control (e.g., can position the antenna chip 1120 along the x-, y-, and/or z-axes in three- dimensional space).
  • the micromanipulator/piezocontroller 1116 can position the antenna chip 1120 in three-dimensional space via moving according to spherical coordinates (e.g., controlling azimuth, elevation, and radius). In still other embodiments of the invention, fewer degrees of freedom can be incorporated (e.g., only able to position the antenna chip 1120 in a vertical direction, so as to vary/control the height of the defined vertical gap 1118; or only able to move in a plane parallel to the qubit chip 1102; and so on).
  • any mechanical-electrical device known in the art that can physically interact with and/or manipulate the antenna chip 1120 can be incorporated (e.g., actuated pistons, servo motors, DC motors, piezoelectric actuators, pneumatic actuators, microelectromechanical actuators, and so on).
  • a temporary attachment e.g., spacers, mechanical clamps, and so on
  • FIG. 11 depicts only a single micromanipulator/piezocontroller 1116 and two antennas 1112 and 1122, those of ordinary skill will appreciate that any number of micromanipulators and/or antennas can be incorporated.
  • the length of the defined vertical gap 1118 can be approximately equal to a height of a cone, as described above.
  • a base of the cone can circumscribe the first set of pads 1106 (e.g., circumscribe the Josephson junction 1104), and an apex angle of the cone can be approximately equal to a three-decibel angular beam width of a main lobe of the radiation pattern of the first electromagnetic wave 1114, substantially as described above.
  • FIG. 12 is a flow diagram of a computer-implemented method that facilitates antenna-based qubit annealing using a micromanipulator or piezocontroller.
  • a micromanipulator, a piezocontroller, or a temporary attachment can position an antenna chip above a superconducting qubit chip having a first Josephson junction and a second Josephson junction.
  • the micromanipulator, piezocontroller, or temporary attachment can create a defined vertical gap between the antenna chip and the qubit chip.
  • the antenna can emit an electromagnetic wave toward the first Josephson junction.
  • the antenna can anneal the first Josephson junction based on the emitting.
  • a length of the defined vertical gap can be sized by the micromanipulator, piezocontroller, or temporary attachment to cause the wave to circumscribe the first Josephson junction (e.g., and to avoid circumscribing the second Josephson junction), substantially as described above.
  • the length of the defined vertical gap can be a function of a model of the radiation pattern of the wave as a cone.
  • the cone can originate from the antenna chip and can extend toward the qubit chip.
  • the length of the defined vertical gap can be approximately equal to a height of the cone.
  • a base of the cone can circumscribe the first Josephson junction, and an apex angle of the cone can be approximately equal to a three-decibel angular beam width of a main lobe of a radiation pattern of the wave.
  • FIG. 13 is a flow diagram of a computer-implemented method that facilitates antenna-based qubit annealing by moving an antenna chip across multiple superconducting qubit chips queued for annealing.
  • a system can position an antenna chip having an antenna above a first superconducting qubit chip having a first Josephson junction.
  • the antenna can anneal the first Josephson junction by emitting a first electromagnetic wave toward the first Josephson junction.
  • the system can position the antenna chip above a second superconducting qubit chip having a second Josephson junction.
  • the antenna can anneal the second Josephson junction by emitting a second electromagnetic wave toward the second Josephson junction.
  • the method 1300 can facilitate moving an antenna chip (e.g., a semiconductor chip having emitters/antennas and that is in a dedicated qubit annealing fabrication process or manufacturing line) across multiple qubit chips that are desired/queued to be annealed.
  • the multiple qubit chips can be presented to the antenna chip via an assembly line and/or conveyor belt.
  • the antenna chip can have multiple antennas that are positioned so as to correspond in a one-to-one fashion to multiple qubits on a particular type/design of qubit chip.
  • a plurality of qubit chips (e.g., all matching that particular type/design) can be presented to the antenna chip to get annealed in assembly-line fashion.
  • a different type/design of qubit chip can require a different type/design of semiconductor chip (e.g., having multiple antennas positioned on the semiconductor chip in a different configuration, so as to correspond in a one-to-one fashion with the different type/design of qubit chip).
  • semiconductor chip e.g., having multiple antennas positioned on the semiconductor chip in a different configuration, so as to correspond in a one-to-one fashion with the different type/design of qubit chip.
  • the positioning of the antenna chip above the first qubit chip and the positioning the antenna chip above the second qubit chip can be performed with at least one of a micromanipulator, a piezocontroller, or a temporary attachment, substantially as described.
  • the antenna chip can be stationary and the qubit chips can be presented to the antenna chip for annealing.
  • FIG. 14 illustrates a block diagram of an example, non-limiting operating environment in which one or more embodiments described herein can be facilitated.
  • a suitable operating environment 1400 for implementing various aspects of this disclosure can also include a computer 1412.
  • the computer 1412 can also include a processing unit 1414, a system memory 1416, and a system bus 1418.
  • the system bus 1418 couples system components including, but not limited to, the system memory 1416 to the processing unit 1414.
  • the processing unit 1414 can be any of various available processors. Dual microprocessors and other multiprocessor architectures also can be employed as the processing unit 1414.
  • the system bus 1418 can be any of several types of bus structure(s) including the memory bus or memory controller, a peripheral bus or external bus, and/or a local bus using any variety of available bus architectures including, but not limited to, Industrial Standard Architecture (ISA), Micro-Channel Architecture (MSA), Extended ISA (EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB), Peripheral Component Interconnect (PCI), Card Bus, Universal Serial Bus (USB), Advanced Graphics Port (AGP), Firewire (IEEE 1394), and Small Computer Systems Interface (SCSI).
  • the system memory 1416 can also include volatile memory 1420 and nonvolatile memory 1422.
  • nonvolatile memory 1422 can include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, or nonvolatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM).
  • Volatile memory 1420 can also include random access memory (RAM), which acts as external cache memory.
  • RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), direct Rambus RAM (DRRAM), direct Rambus dynamic RAM (DRDRAM), and Rambus dynamic RAM.
  • SRAM static RAM
  • DRAM dynamic RAM
  • SDRAM synchronous DRAM
  • DDR SDRAM double data rate SDRAM
  • ESDRAM enhanced SDRAM
  • SLDRAM Synchlink DRAM
  • DRRAM direct Rambus RAM
  • DRAM direct Rambus dynamic RAM
  • Rambus dynamic RAM Rambus dynamic RAM
  • Computer 1412 can also include removable/non-removable, volatile/non-volatile computer storage media.
  • FIG. 14 illustrates, for example, a disk storage 1424.
  • Disk storage 1424 can also include, but is not limited to, devices like a magnetic disk drive, floppy disk drive, tape drive, Jaz drive, Zip drive, LS-100 drive, flash memory card, or memory stick.
  • the disk storage 1424 also can include storage media separately or in combination with other storage media including, but not limited to, an optical disk drive such as a compact disk ROM device (CD- ROM), CD recordable drive (CD-R Drive), CD rewritable drive (CD-RW Drive) or a digital versatile disk ROM drive (DVD-ROM).
  • CD-ROM compact disk ROM device
  • CD-R Drive CD recordable drive
  • CD-RW Drive CD rewritable drive
  • DVD-ROM digital versatile disk ROM drive
  • FIG. 14 also depicts software that acts as an intermediary between users and the basic computer resources described in the suitable operating environment 1400.
  • Such software can also include, for example, an operating system 1428.
  • Operating system 1428 which can be stored on disk storage 1424, acts to control and allocate resources of the computer 1412.
  • System applications 1430 take advantage of the management of resources by operating system 1428 through program modules 1432 and program data 1434, e.g., stored either in system memory 1416 or on disk storage 1424. It is to be appreciated that this disclosure can be implemented with various operating systems or combinations of operating systems.
  • Input devices 1436 include, but are not limited to, a pointing device such as a mouse, trackball, stylus, touch pad, keyboard, microphone, joystick, game pad, satellite dish, scanner, TV tuner card, digital camera, digital video camera, web camera, and the like. These and other input devices connect to the processing unit 1414 through the system bus 1418 via interface port(s) 1438.
  • Interface port(s) 1438 include, for example, a serial port, a parallel port, a game port, and a universal serial bus (USB).
  • Output device(s) 1440 use some of the same type of ports as input device(s) 1436.
  • a USB port can be used to provide input to computer 1412, and to output information from computer 1412 to an output device 1440.
  • Output adapter 1442 is provided to illustrate that there are some output devices 1440 like monitors, speakers, and printers, among other output devices 1440, which require special adapters.
  • the output adapters 1442 include, by way of illustration and not limitation, video and sound cards that provide a means of connection between the output device 1440 and the system bus 1418. It should be noted that other devices and/or systems of devices provide both input and output capabilities such as remote computer(s) 1444.
  • Computer 1412 can operate in a networked environment using logical connections to one or more remote computers, such as remote computer(s) 1444.
  • the remote computer(s) 1444 can be a computer, a server, a router, a network PC, a workstation, a microprocessor based appliance, a peer device or other common network node and the like, and typically can also include many or all of the elements described relative to computer 1412. For purposes of brevity, only a memory storage device 1446 is illustrated with remote computer(s) 1444.
  • Remote computer(s) 1444 is logically connected to computer 1412 through a network interface 1448 and then physically connected via communication connection 1450.
  • Network interface 1448 encompasses wire and/or wireless communication networks such as local-area networks (LAN), wide-area networks (WAN), cellular networks, etc.
  • LAN technologies include Fiber Distributed Data Interface (FDDI), Copper Distributed Data Interface (CDDI), Ethernet, Token Ring and the like.
  • WAN technologies include, but are not limited to, point-to-point links, circuit switching networks like Integrated Services Digital Networks (ISDN) and variations thereon, packet switching networks, and Digital Subscriber Lines (DSL).
  • ISDN Integrated Services Digital Networks
  • DSL Digital Subscriber Lines
  • Communication connection(s) 1450 refers to the hardware/software employed to connect the network interface 1448 to the system bus 1418. While communication connection 1450 is shown for illustrative clarity inside computer 1412, it can also be external to computer 1412.
  • the hardware/software for connection to the network interface 1448 can also include, for exemplary purposes only, internal and external technologies such as, modems including regular telephone grade modems, cable modems and DSL modems,
  • the present invention may be a system, a computer-implemented method, an apparatus and/or a computer program product at any possible technical detail level of integration
  • the computer program product can include a computer readable storage medium (or media) having computer readable program instructions thereon for causing a processor to carry out aspects of the present invention.
  • the computer readable storage medium can be a tangible device that can retain and store instructions for use by an instruction execution device.
  • the computer readable storage medium can be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing.
  • a non-exhaustive list of more specific examples of the computer readable storage medium can also include the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon, and any suitable combination of the foregoing.
  • RAM random access memory
  • ROM read-only memory
  • EPROM or Flash memory erasable programmable read-only memory
  • SRAM static random access memory
  • CD-ROM compact disc read-only memory
  • DVD digital versatile disk
  • memory stick a floppy disk
  • a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon
  • a computer readable storage medium is not to be construed as being transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission media (e.g., light pulses passing through a fiber-optic cable), or electrical signals transmitted through a wire.
  • computing/processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and/or a wireless network.
  • the network can comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers.
  • a network adapter card or network interface in each computing/processing device receives computer readable program instructions from the network and forwards the computer readable program instructions for storage in a computer readable storage medium within the respective computing/processing device.
  • Computer readable program instructions for carrying out operations of the present invention can be assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, configuration data for integrated circuitry, or either source code or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C++, or the like, and procedural programming languages, such as the "C" programming language or similar programming languages.
  • the computer readable program instructions can execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.
  • the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider).
  • electronic circuitry including, for example, programmable logic circuitry, field-programmable gate arrays (FPGA), or programmable logic arrays (PLA) can execute the computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry, in order to perform aspects of the present invention.
  • These computer readable program instructions can also be stored in a computer readable storage medium that can direct a computer, a programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer readable storage medium having instructions stored therein comprises an article of manufacture including instructions which implement aspects of the function/act specified in the flowchart and/or block diagram block or blocks.
  • the computer readable program instructions can also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational acts to be performed on the computer, other programmable apparatus or other device to produce a computer implemented process, such that the instructions which execute on the computer, other programmable apparatus, or other device implement the functions/acts specified in the flowchart and/or block diagram block or blocks.
  • each block in the flowchart or block diagrams can represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).
  • the functions noted in the blocks can occur out of the order noted in the Figures.
  • two blocks shown in succession can, in fact, be executed substantially concurrently, or the blocks can sometimes be executed in the reverse order, depending upon the functionality involved.
  • program modules include routines, programs, components, data structures, etc. that perform particular tasks and/or implement particular abstract data types.
  • inventive computer-implemented methods can be practiced with other computer system configurations, including single-processor or multiprocessor computer systems, mini-computing devices, mainframe computers, as well as computers, hand-held computing devices (e.g., PDA, phone), microprocessor-based or programmable consumer or industrial electronics, and the like.
  • the illustrated aspects can also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. However, some, if not all aspects of this disclosure can be practiced on stand-alone computers.
  • program modules can be located in both local and remote memory storage devices.
  • the terms“component,”“system,”“platform,”“interface,” and the like can refer to and/or can include a computer-related entity or an entity related to an operational machine with one or more specific functionalities.
  • the entities disclosed herein can be either hardware, a combination of hardware and software, software, or software in execution.
  • a component can be, but is not limited to being, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, and/or a computer.
  • an application running on a server and the server can be a component.
  • One or more components can reside within a process and/or thread of execution and a component can be localized on one computer and/or distributed between two or more computers.
  • respective components can execute from various computer readable media having various data structures stored thereon.
  • the components can communicate via local and/or remote processes such as in accordance with a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a network such as the Internet with other systems via the signal).
  • a component can be an apparatus with specific functionality provided by mechanical parts operated by electric or electronic circuitry, which is operated by a software or firmware application executed by a processor.
  • a component can be an apparatus that provides specific functionality through electronic components without mechanical parts, wherein the electronic components can include a processor or other means to execute software or firmware that confers at least in part the functionality of the electronic components.
  • a component can emulate an electronic component via a virtual machine, e.g., within a cloud computing system.
  • the terms“example” and/or“exemplary” are utilized to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples.
  • any aspect or design described herein as an“example” and/or “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art.
  • processor can refer to substantially any computing processing unit or device comprising, but not limited to, single-core processors; single-processors with software multithread execution capability; multi-core processors; multi-core processors with software multithread execution capability; multi-core processors with hardware multithread technology; parallel platforms; and parallel platforms with distributed shared memory.
  • a processor can refer to an integrated circuit, an application specific integrated circuit (ASIC), a digital signal processor (DSP), a field programmable gate array (FPGA), a
  • processors can exploit nano-scale architectures such as, but not limited to, molecular and quantum-dot based transistors, switches and gates, in order to optimize space usage or enhance performance of user equipment.
  • a processor can also be implemented as a combination of computing processing units.
  • terms such as“store,”“storage,”“data store,” data storage,”“database,” and substantially any other information storage component relevant to operation and functionality of a component are utilized to refer to “memory components,” entities embodied in a“memory,” or components comprising a memory.
  • nonvolatile memory can include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable ROM (EEPROM), flash memory, or nonvolatile random access memory (RAM)
  • ROM read only memory
  • PROM programmable ROM
  • EPROM electrically programmable ROM
  • EEPROM electrically erasable ROM
  • flash memory or nonvolatile random access memory (RAM)
  • Volatile memory can include RAM, which can act as external cache memory, for example.
  • RAM is available in many forms such as synchronous RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), direct Rambus RAM (DRRAM), direct Rambus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM).
  • SRAM synchronous RAM
  • DRAM dynamic RAM
  • SDRAM synchronous DRAM
  • DDR SDRAM double data rate SDRAM
  • ESDRAM enhanced SDRAM
  • SLDRAM Synchlink DRAM
  • DRRAM direct Rambus RAM
  • DRAM direct Rambus dynamic RAM
  • RDRAM Rambus dynamic RAM
  • a device comprising: a superconducting qubit chip having a first Josephson junction and a second Josephson junction; an antenna chip above the superconducting qubit chip; a first antenna on the antenna chip and that emits a first electromagnetic wave toward the first Josephson junction; a second antenna on the antenna chip and that emits a second electromagnetic wave toward the second Josephson junction; and a micromanipulator, a piezocontroller, or a temporary attachment that positions the antenna chip above the superconducting qubit chip, with a defined vertical gap between the antenna chip and the superconducting qubit chip, wherein a length of the defined vertical gap is sized by the
  • micromanipulator piezocontroller, or temporary attachment to cause the first electromagnetic wave to circumscribe the first Josephson junction, thereby annealing the first Josephson junction, and to cause the second
  • the length of the defined vertical gap is approximately equal to a height of a cone, a base of which cone circumscribes the first Josephson junction, and an apex angle of which cone is approximately equal to a three-decibel angular beam width of a main lobe of a radiation pattern of the first electromagnetic wave.
  • a computer-implemented method comprising: positioning, via a micromanipulator, a piezocontroller, or a temporary attachment, an antenna chip above a superconducting qubit chip having a first Josephson junction and a second Josephson junction, with a defined vertical gap between the antenna chip and the superconducting qubit chip; emitting, by the antenna chip, an electromagnetic wave toward the first Josephson junction; and annealing, by the antenna chip, the first Josephson junction based on the emitting, wherein a length of the defined vertical gap is sized by the micromanipulator, piezocontroller, or temporary attachment to cause the electromagnetic wave to circumscribe the first Josephson junction.
  • the length of the defined vertical gap is a function of a model of a radiation pattern of the electromagnetic wave as a cone, wherein the cone originates from the antenna chip and extends toward the superconducting qubit chip.
  • the length of the defined vertical gap is approximately equal to a height of the cone, a base of which cone circumscribes the first Josephson junction, and an apex angle of which cone is approximately equal to a three-decibel angular beam width of a main lobe of the radiation pattern of the electromagnetic wave.
  • a computer-implemented method comprising: positioning, by a system, an antenna chip having an antenna above a first superconducting qubit chip having a first Josephson junction; annealing, by the antenna, the first Josephson junction by emitting, via the antenna, a first electromagnetic wave toward the first Josephson junction; positioning, by the system, the antenna chip above a second superconducting qubit chip having a second Josephson junction; and annealing, by the antenna, the second Josephson junction by emitting, via the antenna, a second electromagnetic signal toward the second Josephson junction.
  • the positioning the antenna chip above the first superconducting qubit chip and the positioning the antenna chip above the second superconducting qubit chip are performed with at least one of a
  • micromanipulator a piezocontroller, or a temporary attachment.

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Abstract

L'invention concerne des systèmes, des procédés mis en œuvre par ordinateur et des techniques facilitant le recuit thermique reposant sur une antenne de bits quantiques. Dans un exemple, une première antenne peut être positionnée au-dessus d'une puce à bits quantiques supraconducteurs ayant une première jonction Josephson et une seconde jonction Josephson. La première antenne peut diriger une première onde électromagnétique vers la première jonction Josephson. Une première longueur d'un premier espace vertical défini, entre la première antenne et la puce à bits quantiques supraconducteurs, peut être dimensionnée pour amener la première onde électromagnétique à circonscrire un premier ensemble d'un ou plusieurs plots de condensateur de la première jonction Josephson, ce qui permet de recuire la première jonction Josephson, sans recuit de la seconde jonction Josephson. Dans un autre exemple, la première longueur du premier espace vertical défini peut être établie en fonction d'un modèle de la première onde électromagnétique sous forme de cône, le cône partant de la première antenne et s'étendant vers la puce à bits quantiques supraconducteurs.
PCT/EP2019/072500 2018-08-28 2019-08-22 Procédés de recuit de bits quantiques avec une puce d'antenne Ceased WO2020043596A1 (fr)

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