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WO2019233171A1 - 压力感应模组及其制作方法、电子设备 - Google Patents

压力感应模组及其制作方法、电子设备 Download PDF

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Publication number
WO2019233171A1
WO2019233171A1 PCT/CN2019/081230 CN2019081230W WO2019233171A1 WO 2019233171 A1 WO2019233171 A1 WO 2019233171A1 CN 2019081230 W CN2019081230 W CN 2019081230W WO 2019233171 A1 WO2019233171 A1 WO 2019233171A1
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WIPO (PCT)
Prior art keywords
pressure
pressure sensing
sensing electrode
flexible
flexible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/081230
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English (en)
French (fr)
Inventor
郭远征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/498,154 priority Critical patent/US20210405802A1/en
Publication of WO2019233171A1 publication Critical patent/WO2019233171A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present disclosure relates to the field of pressure sensing technology, and particularly to a pressure sensing module, a manufacturing method thereof, and an electronic device.
  • an embodiment of the present disclosure provides a method for manufacturing a pressure-sensing module, including: providing a carrier board; forming a flexible film on the carrier board; A first pressure-sensing electrode and a second pressure-sensing electrode at a horizontal plane, and the second pressure-sensing electrode is disposed corresponding to a gap between the adjacent first pressure-sensing electrodes; The distance from the second pressure-sensing electrode can be changed; a flexible protective film covering the first pressure-sensing electrode and the second pressure-sensing electrode is formed; and the flexible film is removed from the carrier board On peel.
  • the second pressure-sensing electrode corresponding to a gap between adjacent first pressure-sensing electrodes includes the first pressure-sensing electrode and the second pressure-sensing electrode in the gap.
  • the orthographic projections on the carrier board are staggered without overlapping each other.
  • the second pressure-sensing electrode corresponding to a gap between adjacent first pressure-sensing electrodes includes the first pressure-sensing electrode and the second pressure-sensing electrode in the gap.
  • the orthographic projections on the carrier board are staggered and partially overlap each other.
  • forming a flexible film on the carrier board includes: forming a release layer on the carrier board; and forming the flexible film on the release layer.
  • forming the first pressure-sensing electrode and the second pressure-sensing electrode at different levels on the flexible film includes: forming a plurality of spaced first electrodes on the flexible film.
  • forming the first pressure-sensing electrode and the second pressure-sensing electrode at different levels on the flexible film includes: forming a plurality of spaced first electrodes on the flexible film. A pressure sensing electrode; forming a first flexible layer covering the first pressure sensing electrode; forming a plurality of spaced second pressure sensing electrodes on the first flexible layer; forming a second pressure sensing electrode A second flexible layer; and removing the second flexible layer and at least a portion of the first flexible layer between adjacent second pressure sensing electrodes.
  • the removing at least a portion of the first flexible layer between adjacent second pressure-sensing electrodes includes removing a portion of the first flexible layer at a gap between the second pressure-sensing electrodes.
  • the flexible layer, or all the first flexible layers at the gap between the second pressure-sensing electrodes are removed, so that the first pressure-sensing electrode is exposed.
  • forming the first pressure-sensing electrode and the second pressure-sensing electrode at different horizontal planes on the flexible film includes: forming a first pressure-sensing electrode at a different horizontal plane by using metal on the flexible film. An electrode and a second pressure sensing electrode.
  • an embodiment of the present disclosure provides a pressure sensing module including: a flexible film; a first pressure sensing electrode and a second pressure sensing electrode on the flexible film, the first pressure The sensing electrode and the second pressure sensing electrode are located on different horizontal planes, and the second pressure sensing electrode is disposed corresponding to a gap between adjacent first pressure sensing electrodes.
  • the first pressure sensing electrode The distance to the second pressure-sensing electrode can be changed; and a flexible protective film covering the first pressure-sensing electrode and the second pressure-sensing electrode.
  • the pressure-sensing module specifically includes: a flexible film; a plurality of first pressure-sensing electrodes arranged at intervals on the flexible film; a pattern of the first flexible layer, the first The pattern of a flexible layer includes a plurality of grooves and protrusions arranged alternately, and the grooves are arranged corresponding to the first pressure sensing electrode; and a second pressure sensing electrode located on the protrusion.
  • the pressure-sensing module further includes a pattern of a second flexible layer covering the second pressure-sensing electrode, and the pattern of the second flexible layer on the flexible film is positive.
  • the projection falls into an orthographic projection of the protrusion on the flexible film.
  • the flexible film, the first flexible layer, and the second flexible layer are made of polyimide.
  • the flexible film, the first flexible layer, and the second flexible layer are made of transparent polyimide or yellow polyimide.
  • the orthographic projection of the gap between the first pressure sensing electrodes on the flexible film falls within the orthographic projection of the second pressure sensing electrode on the flexible film.
  • the orthographic projection of the second pressure sensing electrode on the flexible film falls into the orthographic projection of the gap between the first pressure sensing electrodes on the flexible film.
  • the orthographic projection of the gap between the first pressure sensing electrodes on the flexible film and the orthographic projection of the second pressure sensing electrode on the flexible film coincide.
  • the thickness of the flexible film is 5-20um
  • the thickness of the first flexible layer is 1-10um
  • the thickness of the second flexible layer is 5-20um
  • an embodiment of the present disclosure provides an electronic device including the pressure sensing module as described in the second aspect.
  • the flexible film, the first flexible layer, and the second flexible layer included in the pressure sensing module are all made of transparent polyimide. amine.
  • the flexible film, the first flexible layer, and the second flexible layer included in the pressure sensing module are all yellow polymer. Imide.
  • FIG. 1 is a schematic diagram after a release layer and a flexible film are formed on a carrier board according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram after a first pressure sensing electrode is formed according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram after a first flexible layer is formed according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram after a second pressure sensing electrode is formed according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram after the first flexible layer is etched according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram after a flexible protective film is formed according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram after peeling a flexible film from a carrier board according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of forming a second flexible layer according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of etching a first flexible layer and a second flexible layer according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram after a flexible protective film is formed according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram after peeling a flexible film from a carrier board according to an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide a pressure sensing module, a manufacturing method thereof, and an electronic device, which can be applied to flexible display products, robots, and wearable devices.
  • An embodiment of the present disclosure provides a method for manufacturing a pressure sensing module, including:
  • a first pressure-sensing electrode and a second pressure-sensing electrode at different horizontal planes (layers) are formed on the flexible film by using metal, and the second pressure-sensing electrode is disposed corresponding to a gap between adjacent first pressure-sensing electrodes , When the pressure is applied, the distance between the first pressure sensing electrode and the second pressure sensing electrode can change;
  • the flexible film is peeled from the carrier plate.
  • the setting of the gap between the second pressure sensing electrode corresponding to the adjacent first pressure sensing electrode includes: an orthographic projection of the first pressure sensing electrode and the second pressure sensing electrode on the carrier board
  • the first pressure sensing electrodes and the second pressure sensing electrodes are arranged alternately without overlapping with each other, or there is a partial overlap with each other.
  • the pressure-sensing module includes a first pressure-sensing electrode and a second pressure-sensing electrode located on a flexible film.
  • the pressure sensing module of this embodiment is composed of a flexible film, a first pressure sensing electrode, and a second pressure sensing electrode.
  • the first pressure sensing electrode and the second pressure sensing electrode are made of metal, so they are flexible and resistant to high and low temperatures.
  • the flexible film is peeled from the carrier board into two methods: mechanical peeling and laser peeling.
  • mechanical peeling In order to reduce the adhesion between the flexible film and the carrier board, It is also necessary to form a release layer between the flexible film and the carrier.
  • the method further includes:
  • the forming a flexible film on the carrier board is specifically:
  • the flexible film is formed on the release layer, and the release layer may be, for example, an inorganic insulating material.
  • the forming of the first pressure-sensing electrode and the second pressure-sensing electrode at different horizontal planes (layers) on the flexible film includes:
  • Second pressure sensing electrodes Forming a plurality of spaced second pressure sensing electrodes on the first flexible layer, and the second pressure sensing electrodes are disposed corresponding to a gap between adjacent first pressure sensing electrodes;
  • the forming of the first pressure-sensing electrode and the second pressure-sensing electrode at different horizontal planes on the flexible film includes:
  • Second pressure sensing electrodes Forming a plurality of spaced second pressure sensing electrodes on the first flexible layer, and the second pressure sensing electrodes are disposed corresponding to a gap between adjacent first pressure sensing electrodes;
  • the flexible film, the first flexible layer, and the second flexible layer may be made of organic materials, preferably polyimide.
  • Polyimide has excellent chemical resistance, mechanical properties, and insolubility. In organic solvents, it is stable to dilute acid, and does not appear cracks and wrinkles even after repeated bending. It also has high and low temperature resistance. It can work below 0 degrees Celsius, and it can also work at high temperatures of 400 degrees Celsius for a long time. The specific reliability range depends on the characteristics of the polyimide material used.
  • polyimide includes transparent polyimide (including fluorine-based polyimide) and yellow polyimide (including aromatic polyimide), and the transparent polyimide can be Stable at temperature, yellow polyimide can be stable at temperature from 0 to 400 degrees Celsius.
  • the prepared pressure sensing module can be applied to a display product.
  • the prepared pressure sensing module can be applied in non-optical fields, such as robots and wearable devices, and is resistant Solvent resistance is superior to high and low temperature and mechanical properties.
  • an embodiment of the present disclosure also provides a pressure sensing module, including:
  • the pressure-sensing module includes a first pressure-sensing electrode and a second pressure-sensing electrode located on a flexible film.
  • the pressure sensing module of this embodiment is composed of a flexible film, a first pressure sensing electrode, and a second pressure sensing electrode.
  • the first pressure sensing electrode and the second pressure sensing electrode are made of metal, so they are flexible and resistant to high and low temperatures.
  • the pressure sensing module includes:
  • a plurality of spaced first pressure sensing electrodes on the flexible film are A plurality of spaced first pressure sensing electrodes on the flexible film;
  • a pattern of the first flexible layer includes a plurality of grooves and protrusions arranged alternately, and the grooves are arranged corresponding to the first pressure sensing electrode;
  • a second pressure-sensing electrode on the protrusion A second pressure-sensing electrode on the protrusion.
  • the pressure sensing module further includes:
  • the pattern of the second flexible layer covering the second pressure-sensing electrode, the orthographic projection of the pattern of the second flexible layer on the flexible film falls into the orthographic projection of the protrusion on the flexible film.
  • the flexible film, the first flexible layer and the second flexible layer are made of polyimide.
  • the flexible film, the first flexible layer, and the second flexible layer may be made of organic materials, preferably polyimide.
  • Polyimide has excellent chemical resistance, mechanical properties, and insolubility. In organic solvents, it is stable to dilute acid, and does not appear cracks and wrinkles even after repeated bending. It also has high and low temperature resistance. It can work below 0 degrees Celsius, and it can also work at high temperatures of 400 degrees Celsius for a long time. The specific reliability range depends on the characteristics of the polyimide material used.
  • polyimide includes transparent polyimide (including fluorine-based polyimide) and yellow polyimide (including aromatic polyimide), and the transparent polyimide can be Stable at temperature, yellow polyimide can be stable at temperature from 0 to 400 degrees Celsius.
  • the prepared pressure sensing module can be applied to a display product.
  • the prepared pressure sensing module can be applied in non-optical fields, such as robots and wearable devices, and is resistant to Solvent resistance is superior to high and low temperature and mechanical properties.
  • the thickness of the flexible film is 5-20um
  • the thickness of the first flexible layer is 1-10um
  • the thickness of the second flexible layer is 5-20um.
  • Step 1 As shown in FIG. 1, a release layer 2 and a flexible film 3 are formed on the carrier board 1.
  • the carrier board 1 may be a glass substrate or a quartz substrate.
  • the release layer 2 may be made of an inorganic insulating material.
  • the flexible film 3 can be made of polyimide and has a thickness of 5-20um.
  • Step 2 As shown in FIG. 2, forming a first pressure sensing electrode 4 and a signal trace;
  • a metal layer can be deposited on the flexible film 3 by a sputtering or thermal evaporation method.
  • the metal layer can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W and other metals and these Metal alloy, the metal layer can be a single layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, Ti / Al / Ti, etc.
  • a layer of photoresist is coated on the metal layer, and the photoresist is exposed by using a mask, so that the photoresist forms a photoresist unreserved area and a photoresist reserved area, wherein the photoresist reserved area corresponds to In the area where the pattern of the first pressure sensing electrode 4 and the signal trace is located, the unreserved area of the photoresist corresponds to the area other than the above-mentioned pattern; the development of the photoresist in the unreserved area of the photoresist is completely removed, and the photoresist is removed.
  • the thickness of the photoresist in the reserved area remains unchanged; the metal layer of the unreserved area of the photoresist is completely etched by an etching process, and the remaining photoresist is stripped to form a first pressure sensing electrode 4 and a signal trace.
  • the pressure sensing electrodes 4 are arranged on the flexible film 3 at intervals. One end of the signal trace is connected to the first pressure sensing electrode 4 and the other end is connected to the processing circuit.
  • the first pressure sensing electrode 4 is not limited to being made of metal, and may also be made of a transparent conductive material, such as ITO.
  • Step 3 As shown in FIG. 3, a first flexible layer 5 is formed;
  • the first flexible layer 5 may be made of polyimide and has a thickness of 1-10 um. The thickness of the first flexible layer 5 is determined according to the capacitance between the first pressure sensing electrode 4 and the second pressure sensing electrode 6.
  • Step 4 As shown in FIG. 4, forming a second pressure sensing electrode 6 and a signal trace;
  • a metal layer may be deposited on the first flexible layer 5 by a sputtering or thermal evaporation method.
  • the metal layer may be a metal such as Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W or the like.
  • the metal layer can be a single-layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, Ti / Al / Ti, and the like.
  • a layer of photoresist is coated on the metal layer, and the photoresist is exposed by using a mask, so that the photoresist forms a photoresist unreserved area and a photoresist reserved area, wherein the photoresist reserved area corresponds to In the area where the pattern of the second pressure sensing electrode 6 and the signal trace is located, the unreserved area of the photoresist corresponds to the area other than the above-mentioned pattern; the development of the photoresist in the unreserved area of the photoresist is completely removed, and the photoresist is removed.
  • the thickness of the photoresist in the reserved area remains unchanged; the metal layer in the unreserved area of the photoresist is completely etched by an etching process, and the remaining photoresist is stripped to form a second pressure sensing electrode 6 and a signal trace.
  • the pressure-sensing electrodes 6 are arranged on the first flexible layer 5 at intervals, and a capacitance is formed between the pressure-sensing electrodes 6 and the first pressure-sensing electrode 4.
  • the second pressure-sensing electrode 6 is provided corresponding to the gap between the first pressure-sensing electrodes 4.
  • the orthographic projection of the gap between the first pressure-sensing electrode 4 on the flexible film falls into the orthographic projection of the second pressure-sensing electrode 6 on the flexible film, or the second pressure-sensing electrode 6 on the flexible film
  • the orthographic projection falls into the orthographic projection of the gap between the first pressure sensing electrode 4 on the flexible film, or the orthographic projection of the gap between the first pressure sensing electrode 4 on the flexible film and the second pressure sensing electrode 6
  • the orthographic projections on the flexible film coincide.
  • One end of the signal trace is connected to the second pressure sensing electrode 6, and the other end is connected to the processing circuit.
  • the second pressure sensing electrode 6 is not limited to being made of metal, and may also be made of a transparent conductive material, such as ITO.
  • Step 5 As shown in FIG. 5, removing at least part of the first flexible layer 5 at a gap between the second pressure sensing electrodes 6;
  • the first flexible layer 5 at the gap between the second pressure sensing electrodes 6 may be removed, or all of the first flexible layer 5 at the gap between the second pressure sensing electrodes 6 may be removed to expose the first pressure. Induction electrode 4. By removing at least part of the first flexible layer 5 in the gap between the second pressure-sensing electrodes 6, a pattern of the first flexible layer 5 in the shape of an island is formed, so that when the pressure is applied, the pattern of the first flexible layer 5 can be deformed.
  • Step 6 As shown in FIG. 6, a flexible protective film 8 is formed;
  • polyimide may be used as the flexible protective film 8.
  • Step 7 As shown in FIG. 7, the flexible film 3 is peeled from the carrier plate 1.
  • the pressure sensing module of this embodiment can be obtained through the above steps 1-7.
  • the pattern of the first flexible layer 5 can be deformed, so that the first pressure sensing electrode 4 and the second pressure sensing electrode 6 can be deformed.
  • the distance between them changes, and the capacitance between the first pressure-sensing electrode 4 and the second pressure-sensing electrode 6 also changes.
  • the signal of the force is converted into an electric signal, which realizes the function of pressure detection.
  • Step 1 As shown in FIG. 1, a release layer 2 and a flexible film 3 are formed on the carrier board 1.
  • the carrier board 1 may be a glass substrate or a quartz substrate.
  • the release layer 2 may be made of an inorganic insulating material.
  • the flexible film 3 can be made of polyimide and has a thickness of 5-20um.
  • Step 2 As shown in FIG. 2, forming a first pressure sensing electrode 4 and a signal trace;
  • a metal layer can be deposited on the flexible film 3 by a sputtering or thermal evaporation method.
  • the metal layer can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W and other metals and these Metal alloy, the metal layer can be a single layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, Ti / Al / Ti, etc.
  • a layer of photoresist is coated on the metal layer, and the photoresist is exposed by using a mask, so that the photoresist forms a photoresist unreserved area and a photoresist reserved area, wherein the photoresist reserved area corresponds to In the area where the pattern of the first pressure sensing electrode 4 and the signal trace is located, the unreserved area of the photoresist corresponds to the area other than the above-mentioned pattern; the development of the photoresist in the unreserved area of the photoresist is completely removed, The thickness of the photoresist in the reserved area remains unchanged; the metal layer of the unreserved area of the photoresist is completely etched by an etching process, and the remaining photoresist is stripped to form a first pressure sensing electrode 4 and a signal trace.
  • the pressure sensing electrodes 4 are arranged on the flexible film 3 at intervals. One end of the signal trace is connected to the first pressure sensing electrode 4 and the other
  • the first pressure sensing electrode 4 is not limited to being made of metal, and may also be made of a transparent conductive material, such as ITO.
  • Step 3 As shown in FIG. 3, a first flexible layer 5 is formed;
  • the first flexible layer 5 may be made of polyimide and has a thickness of 1-10 um. The thickness of the first flexible layer 5 is determined according to the capacitance between the first pressure sensing electrode 4 and the second pressure sensing electrode 6.
  • Step 4 As shown in FIG. 4, forming a second pressure sensing electrode 6 and a signal trace;
  • a metal layer may be deposited on the first flexible layer 5 by a sputtering or thermal evaporation method.
  • the metal layer may be a metal such as Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W or the like.
  • the metal layer can be a single-layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, Ti / Al / Ti, and the like.
  • a layer of photoresist is coated on the metal layer, and the photoresist is exposed by using a mask, so that the photoresist forms a photoresist unreserved area and a photoresist reserved area, wherein the photoresist reserved area corresponds to In the area where the pattern of the second pressure sensing electrode 6 and the signal trace is located, the unreserved area of the photoresist corresponds to the area other than the above-mentioned pattern; the development of the photoresist in the unreserved area of the photoresist is completely removed, and the photoresist is removed.
  • the thickness of the photoresist in the reserved area remains unchanged; the metal layer in the unreserved area of the photoresist is completely etched by an etching process, and the remaining photoresist is stripped to form a second pressure sensing electrode 6 and a signal trace.
  • the pressure-sensing electrodes 6 are arranged on the first flexible layer 5 at intervals, and a capacitance is formed between the pressure-sensing electrodes 6 and the first pressure-sensing electrode 4.
  • the second pressure-sensing electrode 6 is provided corresponding to the gap between the first pressure-sensing electrodes 4.
  • the orthographic projection of the gap between the first pressure sensing electrode 4 on the flexible film falls into the orthographic projection of the second pressure sensing electrode 6 on the flexible film, or the second pressure sensing electrode 6 on the flexible film
  • the orthographic projection falls into the orthographic projection of the gap between the first pressure sensing electrode 4 on the flexible film, or the orthographic projection of the gap between the first pressure sensing electrode 4 on the flexible film and the second pressure sensing electrode 6
  • the orthographic projections on the flexible film coincide.
  • One end of the signal trace is connected to the second pressure sensing electrode 6, and the other end is connected to the processing circuit.
  • the second pressure sensing electrode 6 is not limited to being made of metal, and may also be made of a transparent conductive material, such as ITO.
  • Step 5 As shown in FIG. 8, a second flexible layer 7 is formed;
  • the second flexible layer 7 may be made of polyimide, and the thickness may be 5-20um, and the specific thickness may be determined by the force detection range of the pressure detection.
  • Step 6 As shown in FIG. 9, all the second flexible layer 7 and at least part of the first flexible layer 5 at the gap between the second pressure sensing electrodes 6 are removed;
  • the first flexible layer 5 at the gap between the second pressure sensing electrodes 6 may be removed, or all of the first flexible layer 5 at the gap between the second pressure sensing electrodes 6 may be removed to expose the first pressure.
  • Induction electrode 4 By removing all of the second flexible layer 7 and at least part of the first flexible layer 5 in the gap between the second pressure-sensing electrodes 6, a pattern of the island-shaped first flexible layer 5 and the second flexible layer 7 is formed, so that it is under pressure When functioning, the pattern of the first flexible layer 5 can be deformed, so that the distance between the first pressure sensing electrode 4 and the second pressure sensing electrode 6 changes, and the distance between the first pressure sensing electrode 4 and the second pressure sensing electrode 6 is changed.
  • the capacitance also changes, and the signal of the force is converted into an electric signal, which realizes the function of pressure detection.
  • Step 7 As shown in FIG. 10, a flexible protective film 8 is formed;
  • polyimide may be used as the flexible protective film 8.
  • Step 8 As shown in FIG. 11, the flexible film 3 is peeled from the carrier plate 1.
  • the pressure sensing module of this embodiment can be obtained through the above steps 1-8.
  • the pattern of the first flexible layer 5 can be deformed, so that the first pressure sensing electrode 4 and the second pressure sensing electrode 6 can be deformed.
  • the distance between them changes, and the capacitance between the first pressure-sensing electrode 4 and the second pressure-sensing electrode 6 also changes.
  • the signal of the force is converted into an electric signal, which realizes the function of pressure detection.
  • An embodiment of the present disclosure further provides an electronic device including the pressure sensing module as described above.
  • the electronic device may be a display product, a robot, and a wearable device.
  • the flexible film layer in the pressure-sensing module is made of transparent materials, the prepared pressure-sensing module can be applied to display products, such as televisions, displays, digital photo frames, mobile phones, tablet computers and any other products with display functions. If the flexible film layer in the pressure sensing module is not made of transparent materials, the prepared pressure sensing module can be applied in non-optical fields, such as robots and wearable devices.
  • sequence numbers of the steps cannot be used to define the sequence of the steps.
  • sequence of the steps can be performed without paying any creative labor. Changes are also within the scope of this disclosure.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种压力感应模组及其制作方法、电子设备。该压力感应模组的制作方法包括：提供一载板（1）；在所述载板（1）上形成柔性薄膜（3）；在所述柔性薄膜（3）上形成位于不同水平面的第一压力感应电极（4）和第二压力感应电极（6），所述第二压力感应电极（6）对应相邻所述第一压力感应电极（4）之间的间隙设置，在受到压力作用时，所述第一压力感应电极（4）和所述第二压力感应电极（6）之间的距离能够发生变化；形成覆盖所述第一压力感应电极（4）和所述第二压力感应电极（6）的柔性保护膜（8）；将所述柔性薄膜（3）从所述载板（1）上剥离。

Description

压力感应模组及其制作方法、电子设备
相关申请的交叉引用
本申请主张在2018年6月7日在中国提交的中国专利申请号No.201810579465.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开文本涉及压力感应技术领域，特别是指一种压力感应模组及其制作方法、电子设备。
背景技术
近年来柔性显示产品迅猛发展，各大显示厂商都在如火如荼的推进柔性显示产品的量产，柔性显示产品的成熟提出了对于柔性压力感应模组的需求。另一方面，机器人特别是类人机器人的发展，要求机械手抓取物体的时候可以精确地感受力的大小，匹配抓取物体的动作，也提出了对于柔性压力感应模组的需求。
发明内容
在第一个方面中，本公开文本实施例提供了一种压力感应模组的制作方法，包括：提供一载板；在所述载板上形成柔性薄膜；在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；形成覆盖所述第一压力感应电极和所述第二压力感应电极的柔性保护膜；以及，将所述柔性薄膜从所述载板上剥离。
根据本公开文本的一些实施例，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置包括所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间没有重叠。
根据本公开文本的一些实施例，所述第二压力感应电极对应相邻所述第 一压力感应电极之间的间隙设置包括所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间存在部分重叠。
根据本公开文本的一些实施例，在所述载板上形成柔性薄膜包括：在所述载板上形成离型层；以及，在所述离型层上形成所述柔性薄膜。
根据本公开文本的一些实施例，所述在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；形成覆盖所述第一压力感应电极的第一柔性层；在所述第一柔性层上形成多个间隔排布的第二压力感应电极；以及，去除相邻所述第二压力感应电极之间的至少部分所述第一柔性层。
根据本公开文本的一些实施例，所述在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；形成覆盖所述第一压力感应电极的第一柔性层；在所述第一柔性层上形成多个间隔排布的第二压力感应电极；形成覆盖所述第二压力感应电极的第二柔性层；以及，去除相邻所述第二压力感应电极之间的所述第二柔性层和至少部分所述第一柔性层。
根据本公开文本的一些实施例，所述去除相邻所述第二压力感应电极之间的至少部分所述第一柔性层包括：去除所述第二压力感应电极之间间隙处的部分第一柔性层，或者，去除所述第二压力感应电极之间间隙处的全部第一柔性层，以便暴露出所述第一压力感应电极。
根据本公开文本的一些实施例，在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：在所述柔性薄膜上利用金属形成位于不同水平面的第一压力感应电极和第二压力感应电极。
在第二个方面中，本公开文本实施例提供了一种压力感应模组，包括：柔性薄膜；位于所述柔性薄膜上的第一压力感应电极和第二压力感应电极，所述第一压力感应电极和所述第二压力感应电极位于不同水平面，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；以及，覆盖所述第一压力感应电极和第二压力感应电极的柔性保护膜。
根据本公开文本的一些实施例，所述压力感应模组具体包括：柔性薄膜；位于所述柔性薄膜上的多个间隔排布的第一压力感应电极；第一柔性层的图形，所述第一柔性层的图形包括多个交替排布的凹槽和凸起，所述凹槽对应所述第一压力感应电极设置；以及，位于所述凸起上的第二压力感应电极。
根据本公开文本的一些实施例，所述压力感应模组还包括：覆盖所述第二压力感应电极的第二柔性层的图形，所述第二柔性层的图形在所述柔性薄膜上的正投影落入所述凸起在所述柔性薄膜上的正投影内。
根据本公开文本的一些实施例，所述柔性薄膜、所述第一柔性层和所述第二柔性层采用聚酰亚胺制成。
根据本公开文本的一些实施例，所述柔性薄膜、所述第一柔性层和所述第二柔性层采用透明聚酰亚胺或黄色聚酰亚胺制成。
根据本公开文本的一些实施例，所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影落入所述第二压力感应电极在所述柔性薄膜上的正投影内。
根据本公开文本的一些实施例，所述第二压力感应电极在所述柔性薄膜上的正投影落入所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影内。
根据本公开文本的一些实施例，所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影与所述第二压力感应电极在所述柔性薄膜上的正投影重合。
根据本公开文本的一些实施例，所述柔性薄膜的厚度为5-20um，所述第一柔性层的厚度为1-10um，所述第二柔性层的厚度为5-20um。
在第三个方面中，本公开文本实施例提供了一种电子设备，包括如第二个方面中所述的压力感应模组。
根据本公开文本的一些实施例，当所述压力感应模组应用于光学显示产品中时，所述压力感应模组包括的柔性薄膜、第一柔性层和第二柔性层均采用透明聚酰亚胺。
根据本公开文本的一些实施例，当所述压力感应模组应用于机器人或者可穿戴设备中时，所述压力感应模组包括的柔性薄膜、第一柔性层和第二柔 性层均采用黄色聚酰亚胺。
附图说明
为了更清楚地说明本公开文本实施例或相关技术中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开文本的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为根据本公开文本实施例在载板上形成离型层和柔性薄膜后的示意图；
图2为根据本公开文本实施例形成第一压力感应电极后的示意图；
图3为根据本公开文本实施例形成第一柔性层后的示意图；
图4为根据本公开文本实施例形成第二压力感应电极后的示意图；
图5为根据本公开文本实施例对第一柔性层进行刻蚀后的示意图；
图6为根据本公开文本实施例形成柔性保护膜后的示意图；
图7为根据本公开文本实施例将柔性薄膜从载板上剥离后的示意图；
图8为根据本公开文本实施例形成第二柔性层的示意图；
图9为根据本公开文本实施例对第一柔性层和第二柔性层进行刻蚀的示意图；
图10为根据本公开文本实施例形成柔性保护膜后的示意图；以及
图11为根据本公开文本实施例将柔性薄膜从载板上剥离后的示意图。
附图标记
1 载板
2 离型层
3 柔性薄膜
4 第一压力感应电极
5 第一柔性层
6 第二压力感应电极
7 第二柔性层
8 柔性保护膜
具体实施方式
为使本公开文本的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
本公开文本的实施例提供一种压力感应模组及其制作方法、电子设备，能够应用在柔性显示产品、机器人以及可穿戴设备中。
本公开文本实施例提供一种压力感应模组的制作方法，包括：
提供一载板；
在所述载板上形成柔性薄膜；
在所述柔性薄膜上利用金属形成位于不同水平面(层)的第一压力感应电极和第二压力感应电极，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；
形成覆盖所述第一压力感应电极和所述第二压力感应电极的柔性保护膜；
将所述柔性薄膜从所述载板上剥离。
这里，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置包括：所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间没有重叠，或者所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间存在部分重叠。
本实施例中，压力感应模组包括位于柔性薄膜上的第一压力感应电极和第二压力感应电极，在受到压力作用时，第一压力感应电极和第二压力感应电极之间的距离能够发生变化，从而使得第一压力感应电极和第二压力感应电极之间的电容发生变化，将力信号转化成电信号，实现压力检测的功能。并且本实施例的压力感应模组由柔性薄膜和第一压力感应电极、第二压力感应电极组成，第一压力感应电极、第二压力感应电极采用金属制成，因此具有柔性和耐高低温的特性，能够应用在柔性显示产品、机器人以及可穿戴设备中。
其中，将柔性薄膜从所述载板上剥离分为机械剥离和激光剥离两种方式，在将柔性薄膜从载板上机械剥离时，为了降低柔性薄膜与载板之间的粘附力， 事先还需要在柔性薄膜和载板之间形成离型层。进一步地，所述在所述载板上形成柔性薄膜之前，所述方法还包括：
在所述载板上形成离型层；
所述在所述载板上形成柔性薄膜具体为：
在所述离型层上形成所述柔性薄膜，其中，所述离型层可以例如采用无机绝缘材料。
一具体实施例中，所述在所述柔性薄膜上形成位于不同水平面(层)的第一压力感应电极和第二压力感应电极包括：
在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；
形成覆盖所述第一压力感应电极的第一柔性层；
在所述第一柔性层上形成多个间隔排布的第二压力感应电极，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置；
去除相邻所述第二压力感应电极之间的至少部分所述第一柔性层。
另一具体实施例中，所述在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：
在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；
形成覆盖所述第一压力感应电极的第一柔性层；
在所述第一柔性层上形成多个间隔排布的第二压力感应电极，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置；
形成覆盖所述第二压力感应电极的第二柔性层；
去除相邻所述第二压力感应电极之间的所述第二柔性层和至少部分所述第一柔性层。
其中，柔性薄膜、所述第一柔性层和所述第二柔性层可以采用有机材料制成，优选采用聚酰亚胺制成，聚酰亚胺具有优异的耐化学稳定性、力学性能，不溶于有机溶剂，对稀酸稳定，并且在经过多次弯折后也不会出现裂纹和褶皱，还具有耐高低温的特性，可以在0摄氏度以下工作，也可以在400摄氏度的高温长期工作，具体的信赖性使用范围和采用的聚酰亚胺材料的特性有关。其中，聚酰亚胺包括透明聚酰亚胺(包括含氟类聚酰亚胺)和黄色聚酰亚胺(包括芳香族聚酰亚胺)，透明聚酰亚胺能够在0～200摄氏度的温度 下稳定存在，黄色聚酰亚胺能够在0～400摄氏度的温度下稳定存在。如果柔性薄膜、所述第一柔性层和所述第二柔性层采用透明聚酰亚胺，则制备的压力感应模组能够应用在显示产品中。另外，如果柔性薄膜、所述第一柔性层和所述第二柔性层采用黄色聚酰亚胺，则制备的压力感应模组能够应用在非光学领域，比如机器人以及可穿戴设备中，而且耐溶剂性耐高低温和机械性能都会更加优异。
另外，本公开文本实施例还提供了一种压力感应模组，包括：
柔性薄膜；
位于所述柔性薄膜上、采用金属制成的第一压力感应电极和第二压力感应电极，所述第一压力感应电极和所述第二压力感应电极位于不同水平面，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；
覆盖所述第一压力感应电极和第二压力感应电极的柔性保护膜。
本实施例中，压力感应模组包括位于柔性薄膜上的第一压力感应电极和第二压力感应电极，在受到压力作用时，第一压力感应电极和第二压力感应电极之间的距离能够发生变化，从而使得第一压力感应电极和第二压力感应电极之间的电容发生变化，将力信号转化成电信号，实现压力检测的功能。并且本实施例的压力感应模组由柔性薄膜和第一压力感应电极、第二压力感应电极组成，第一压力感应电极、第二压力感应电极采用金属制成，因此具有柔性和耐高低温的特性，能够应用在柔性显示产品、机器人以及可穿戴设备中。
一具体实施例中，所述压力感应模组包括：
柔性薄膜；
位于所述柔性薄膜上的多个间隔排布的第一压力感应电极；
第一柔性层的图形，所述第一柔性层的图形包括多个交替排布的凹槽和凸起，所述凹槽对应所述第一压力感应电极设置；
位于所述凸起上的第二压力感应电极。
另一具体实施例中，所述压力感应模组还包括：
覆盖所述第二压力感应电极的第二柔性层的图形，所述第二柔性层的图形在所述柔性薄膜上的正投影落入所述凸起在所述柔性薄膜上的正投影内。
进一步地，所述柔性薄膜、所述第一柔性层和所述第二柔性层采用聚酰亚胺制成。
其中，柔性薄膜、所述第一柔性层和所述第二柔性层可以采用有机材料制成，优选采用聚酰亚胺制成，聚酰亚胺具有优异的耐化学稳定性、力学性能，不溶于有机溶剂，对稀酸稳定，并且在经过多次弯折后也不会出现裂纹和褶皱，还具有耐高低温的特性，可以在0摄氏度以下工作，也可以在400摄氏度的高温长期工作，具体的信赖性使用范围和采用的聚酰亚胺材料的特性有关。其中，聚酰亚胺包括透明聚酰亚胺(包括含氟类聚酰亚胺)和黄色聚酰亚胺(包括芳香族聚酰亚胺)，透明聚酰亚胺能够在0～200摄氏度的温度下稳定存在，黄色聚酰亚胺能够在0～400摄氏度的温度下稳定存在。如果柔性薄膜、所述第一柔性层和所述第二柔性层采用透明聚酰亚胺，则制备的压力感应模组能够应用在显示产品中。另外，如果柔性薄膜、所述第一柔性层和所述第二柔性层采用黄色聚酰亚胺，则制备的压力感应模组能够应用在非光学领域，比如机器人以及可穿戴设备中，而且耐溶剂性耐高低温和机械性能都会更加优异。
进一步地，所述柔性薄膜的厚度为5-20um，所述第一柔性层的厚度为1-10um，所述第二柔性层的厚度为5-20um。
下面结合附图以及具体的实施例对本公开文本的压力感应模组及其制作方法进行进一步介绍：
实施例一
本实施例的压力感应模组的制作方法包括以下步骤：
步骤1、如图1所示，在载板1上形成离型层2和柔性薄膜3；
其中，载板1可为玻璃基板或石英基板。离型层2可以采用无机绝缘材料。柔性薄膜3可以采用聚酰亚胺制作，厚度为5-20um。
步骤2、如图2所示，形成第一压力感应电极4和信号走线；
具体地，可以采用溅射或热蒸发的方法在柔性薄膜3上沉积金属层，金属层可以是Cu，Al，Ag，Mo，Cr，Nd，Ni，Mn，Ti，Ta，W等金属以及这 些金属的合金，金属层可以为单层结构或者多层结构，多层结构比如Cu\Mo,Ti\Cu\Ti，Mo\Al\Mo，Ti/Al/Ti等。在金属层上涂覆一层光刻胶，采用掩膜板对光刻胶进行曝光，使光刻胶形成光刻胶未保留区域和光刻胶保留区域，其中，光刻胶保留区域对应于第一压力感应电极4和信号走线的图形所在区域，光刻胶未保留区域对应于上述图形以外的区域；进行显影处理，光刻胶未保留区域的光刻胶被完全去除，光刻胶保留区域的光刻胶厚度保持不变；通过刻蚀工艺完全刻蚀掉光刻胶未保留区域的金属层，剥离剩余的光刻胶，形成第一压力感应电极4和信号走线，第一压力感应电极4间隔排布在柔性薄膜3上，信号走线的一端与第一压力感应电极4连接，另一端与处理电路连接。
当然，第一压力感应电极4并不局限于采用金属制成，也可以采用透明导电材料制成，比如ITO。
步骤3、如图3所示，形成第一柔性层5；
第一柔性层5可以采用聚酰亚胺，厚度为1-10um，第一柔性层5的厚度根据第一压力感应电极4和第二压力感应电极6之间的电容确定。
步骤4、如图4所示，形成第二压力感应电极6和信号走线；
具体地，可以采用溅射或热蒸发的方法在第一柔性层5上沉积金属层，金属层可以是Cu，Al，Ag，Mo，Cr，Nd，Ni，Mn，Ti，Ta，W等金属以及这些金属的合金，金属层可以为单层结构或者多层结构，多层结构比如Cu\Mo,Ti\Cu\Ti，Mo\Al\Mo，Ti/Al/Ti等。在金属层上涂覆一层光刻胶，采用掩膜板对光刻胶进行曝光，使光刻胶形成光刻胶未保留区域和光刻胶保留区域，其中，光刻胶保留区域对应于第二压力感应电极6和信号走线的图形所在区域，光刻胶未保留区域对应于上述图形以外的区域；进行显影处理，光刻胶未保留区域的光刻胶被完全去除，光刻胶保留区域的光刻胶厚度保持不变；通过刻蚀工艺完全刻蚀掉光刻胶未保留区域的金属层，剥离剩余的光刻胶，形成第二压力感应电极6和信号走线，第二压力感应电极6间隔排布在第一柔性层5上，与第一压力感应电极4之间形成电容，其中，第二压力感应电极6对应于第一压力感应电极4之间的间隙设置，可以是第一压力感应电极4之间的间隙在柔性薄膜上的正投影落入第二压力感应电极6在柔性薄膜上的正投影内，也可以是第二压力感应电极6在柔性薄膜上的正投影落入第一压力 感应电极4之间的间隙在柔性薄膜上的正投影内，还可以是第一压力感应电极4之间的间隙在柔性薄膜上的正投影与第二压力感应电极6在柔性薄膜上的正投影重合。其中，信号走线的一端与第二压力感应电极6连接，另一端与处理电路连接。
当然，第二压力感应电极6并不局限于采用金属制成，也可以采用透明导电材料制成，比如ITO。
步骤5、如图5所示，去除第二压力感应电极6之间间隙处的至少部分第一柔性层5；
其中，可以是去除第二压力感应电极6之间间隙处的部分第一柔性层5，也可以是去除第二压力感应电极6之间间隙处的全部第一柔性层5，暴露出第一压力感应电极4。通过去除第二压力感应电极6之间间隙处的至少部分第一柔性层5，形成岛状的第一柔性层5的图形，这样在受到压力作用时，第一柔性层5的图形能够发生形变，使得第一压力感应电极4与第二压力感应电极6之间的距离发生变化，第一压力感应电极4与第二压力感应电极6之间的电容也发生变化，力的信号转化为电信号，实现压力检测的功能。
步骤6、如图6所示，形成柔性保护膜8；
其中，柔性保护膜8也可以采用聚酰亚胺。
步骤7、如图7所示，将柔性薄膜3从载板1上剥离。
经过上述步骤1-7即可得到本实施例的压力感应模组，在受到压力作用时，第一柔性层5的图形能够发生形变，使得第一压力感应电极4与第二压力感应电极6之间的距离发生变化，第一压力感应电极4与第二压力感应电极6之间的电容也发生变化，力的信号转化为电信号，实现压力检测的功能。
实施例二
本实施例的压力感应模组的制作方法包括以下步骤：
步骤1、如图1所示，在载板1上形成离型层2和柔性薄膜3；
其中，载板1可为玻璃基板或石英基板。离型层2可以采用无机绝缘材料。柔性薄膜3可以采用聚酰亚胺制作，厚度为5-20um。
步骤2、如图2所示，形成第一压力感应电极4和信号走线；
具体地，可以采用溅射或热蒸发的方法在柔性薄膜3上沉积金属层，金 属层可以是Cu，Al，Ag，Mo，Cr，Nd，Ni，Mn，Ti，Ta，W等金属以及这些金属的合金，金属层可以为单层结构或者多层结构，多层结构比如Cu\Mo,Ti\Cu\Ti，Mo\Al\Mo，Ti/Al/Ti等。在金属层上涂覆一层光刻胶，采用掩膜板对光刻胶进行曝光，使光刻胶形成光刻胶未保留区域和光刻胶保留区域，其中，光刻胶保留区域对应于第一压力感应电极4和信号走线的图形所在区域，光刻胶未保留区域对应于上述图形以外的区域；进行显影处理，光刻胶未保留区域的光刻胶被完全去除，光刻胶保留区域的光刻胶厚度保持不变；通过刻蚀工艺完全刻蚀掉光刻胶未保留区域的金属层，剥离剩余的光刻胶，形成第一压力感应电极4和信号走线，第一压力感应电极4间隔排布在柔性薄膜3上，信号走线的一端与第一压力感应电极4连接，另一端与处理电路连接。
当然，第一压力感应电极4并不局限于采用金属制成，也可以采用透明导电材料制成，比如ITO。
步骤3、如图3所示，形成第一柔性层5；
第一柔性层5可以采用聚酰亚胺，厚度为1-10um，第一柔性层5的厚度根据第一压力感应电极4和第二压力感应电极6之间的电容确定。
步骤4、如图4所示，形成第二压力感应电极6和信号走线；
具体地，可以采用溅射或热蒸发的方法在第一柔性层5上沉积金属层，金属层可以是Cu，Al，Ag，Mo，Cr，Nd，Ni，Mn，Ti，Ta，W等金属以及这些金属的合金，金属层可以为单层结构或者多层结构，多层结构比如Cu\Mo,Ti\Cu\Ti，Mo\Al\Mo，Ti/Al/Ti等。在金属层上涂覆一层光刻胶，采用掩膜板对光刻胶进行曝光，使光刻胶形成光刻胶未保留区域和光刻胶保留区域，其中，光刻胶保留区域对应于第二压力感应电极6和信号走线的图形所在区域，光刻胶未保留区域对应于上述图形以外的区域；进行显影处理，光刻胶未保留区域的光刻胶被完全去除，光刻胶保留区域的光刻胶厚度保持不变；通过刻蚀工艺完全刻蚀掉光刻胶未保留区域的金属层，剥离剩余的光刻胶，形成第二压力感应电极6和信号走线，第二压力感应电极6间隔排布在第一柔性层5上，与第一压力感应电极4之间形成电容，其中，第二压力感应电极6对应于第一压力感应电极4之间的间隙设置，可以是第一压力感应电极4之间的间隙在柔性薄膜上的正投影落入第二压力感应电极6在柔性薄膜上的正 投影内，也可以是第二压力感应电极6在柔性薄膜上的正投影落入第一压力感应电极4之间的间隙在柔性薄膜上的正投影内，还可以是第一压力感应电极4之间的间隙在柔性薄膜上的正投影与第二压力感应电极6在柔性薄膜上的正投影重合。其中，信号走线的一端与第二压力感应电极6连接，另一端与处理电路连接。
当然，第二压力感应电极6并不局限于采用金属制成，也可以采用透明导电材料制成，比如ITO。
步骤5、如图8所示，形成第二柔性层7；
其中，第二柔性层7可以采用聚酰亚胺，厚度可以为5-20um，具体厚度可以由压力检测的力探测范围决定。
步骤6、如图9所示，去除第二压力感应电极6之间间隙处的全部第二柔性层7和至少部分第一柔性层5；
其中，可以是去除第二压力感应电极6之间间隙处的部分第一柔性层5，也可以是去除第二压力感应电极6之间间隙处的全部第一柔性层5，暴露出第一压力感应电极4。通过去除第二压力感应电极6之间间隙处的全部第二柔性层7和至少部分第一柔性层5，形成岛状的第一柔性层5和第二柔性层7的图形，这样在受到压力作用时，第一柔性层5的图形能够发生形变，使得第一压力感应电极4与第二压力感应电极6之间的距离发生变化，第一压力感应电极4与第二压力感应电极6之间的电容也发生变化，力的信号转化为电信号，实现压力检测的功能。
步骤7、如图10所示，形成柔性保护膜8；
其中，柔性保护膜8也可以采用聚酰亚胺。
步骤8、如图11所示，将柔性薄膜3从载板1上剥离。
经过上述步骤1-8即可得到本实施例的压力感应模组，在受到压力作用时，第一柔性层5的图形能够发生形变，使得第一压力感应电极4与第二压力感应电极6之间的距离发生变化，第一压力感应电极4与第二压力感应电极6之间的电容也发生变化，力的信号转化为电信号，实现压力检测的功能。
本公开文本实施例还提供了一种电子设备，包括如上所述的压力感应模组。
其中，该电子设备可以为显示产品、机器人以及可穿戴设备。如果压力感应模组中的柔性膜层采用透明材料制成，则制备的压力感应模组能够应用在显示产品中，比如电视、显示器、数码相框、手机、平板电脑等任何具有显示功能的产品。如果压力感应模组中的柔性膜层不是采用透明材料制成，则制备的压力感应模组能够应用在非光学领域，比如机器人以及可穿戴设备中。
在本公开文本各方法实施例中，所述各步骤的序号并不能用于限定各步骤的先后顺序，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，对各步骤的先后变化也在本公开文本的保护范围之内。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开文本所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
以上所述是本公开文本的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开文本所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开文本的保护范围。

Claims (20)

  1. 一种压力感应模组的制作方法，包括：
    提供一载板；
    在所述载板上形成柔性薄膜；
    在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；
    形成覆盖所述第一压力感应电极和所述第二压力感应电极的柔性保护膜；以及
    将所述柔性薄膜从所述载板上剥离。
  2. 根据权利要求1所述的压力感应模组的制作方法，其中，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置包括所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间没有重叠。
  3. 根据权利要求1所述的压力感应模组的制作方法，其中，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置包括所述第一压力感应电极和所述第二压力感应电极在所述载板上的正投影交错设置而相互之间存在部分重叠。
  4. 根据权利要求1至3中任一项所述的压力感应模组的制作方法，其中，在所述载板上形成柔性薄膜包括：
    在所述载板上形成离型层；以及
    在所述离型层上形成所述柔性薄膜。
  5. 根据权利要求1至4中任一项所述的压力感应模组的制作方法，其中，所述在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：
    在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；
    形成覆盖所述第一压力感应电极的第一柔性层；
    在所述第一柔性层上形成多个间隔排布的第二压力感应电极；以及
    去除相邻所述第二压力感应电极之间的至少部分所述第一柔性层。
  6. 根据权利要求1至4中任一项所述的压力感应模组的制作方法，其中，所述在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：
    在所述柔性薄膜上形成多个间隔排布的第一压力感应电极；
    形成覆盖所述第一压力感应电极的第一柔性层；
    在所述第一柔性层上形成多个间隔排布的第二压力感应电极；
    形成覆盖所述第二压力感应电极的第二柔性层；以及
    去除相邻所述第二压力感应电极之间的所述第二柔性层和至少部分所述第一柔性层。
  7. 根据权利要求5所述的压力感应模组的制作方法，其中，所述去除相邻所述第二压力感应电极之间的至少部分所述第一柔性层包括：去除所述第二压力感应电极之间间隙处的部分第一柔性层，或者，去除所述第二压力感应电极之间间隙处的全部第一柔性层，以便暴露出所述第一压力感应电极。
  8. 根据权利要求1至7中任一项所述的压力感应模组的制作方法，其中，在所述柔性薄膜上形成位于不同水平面的第一压力感应电极和第二压力感应电极包括：在所述柔性薄膜上利用金属形成位于不同水平面的第一压力感应电极和第二压力感应电极。
  9. 一种压力感应模组，包括：
    柔性薄膜；
    位于所述柔性薄膜上的第一压力感应电极和第二压力感应电极，所述第一压力感应电极和所述第二压力感应电极位于不同水平面，所述第二压力感应电极对应相邻所述第一压力感应电极之间的间隙设置，在受到压力作用时，所述第一压力感应电极和所述第二压力感应电极之间的距离能够发生变化；以及
    覆盖所述第一压力感应电极和第二压力感应电极的柔性保护膜。
  10. 根据权利要求9所述的压力感应模组，其中，所述压力感应模组具体包括：
    柔性薄膜；
    位于所述柔性薄膜上的多个间隔排布的第一压力感应电极；
    第一柔性层的图形，所述第一柔性层的图形包括多个交替排布的凹槽和凸起，所述凹槽对应所述第一压力感应电极设置；以及
    位于所述凸起上的第二压力感应电极。
  11. 根据权利要求10所述的压力感应模组，其中，所述压力感应模组还包括：
    覆盖所述第二压力感应电极的第二柔性层的图形，所述第二柔性层的图形在所述柔性薄膜上的正投影落入所述凸起在所述柔性薄膜上的正投影内。
  12. 根据权利要求11所述的压力感应模组，其中，所述柔性薄膜、所述第一柔性层和所述第二柔性层采用聚酰亚胺制成。
  13. 根据权利要求12所述的压力感应模组，其中，所述柔性薄膜、所述第一柔性层和所述第二柔性层采用透明聚酰亚胺或黄色聚酰亚胺制成。
  14. 根据权利要求9至13中任一项所述的压力感应模组，其中，所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影落入所述第二压力感应电极在所述柔性薄膜上的正投影内。
  15. 根据权利要求9至13中任一项所述的压力感应模组，其中，所述第二压力感应电极在所述柔性薄膜上的正投影落入所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影内。
  16. 根据权利要求9至13中任一项所述的压力感应模组，其中，所述第一压力感应电极之间的间隙在所述柔性薄膜上的正投影与所述第二压力感应电极在所述柔性薄膜上的正投影重合。
  17. 根据权利要求9至16中任一项所述的压力感应模组，其中，所述柔性薄膜的厚度为5-20um，所述第一柔性层的厚度为1-10um，所述第二柔性层的厚度为5-20um。
  18. 一种电子设备，包括如权利要求9至17中任一项所述的压力感应模组。
  19. 根据权利要求18所述的电子设备，其中，当所述压力感应模组应用于光学显示产品中时，所述压力感应模组包括的柔性薄膜、第一柔性层和第 二柔性层均采用透明聚酰亚胺。
  20. 根据权利要求18所述的电子设备，其中，当所述压力感应模组应用于机器人或者可穿戴设备中时，所述压力感应模组包括的柔性薄膜、第一柔性层和第二柔性层均采用黄色聚酰亚胺。
PCT/CN2019/081230 2018-06-07 2019-04-03 压力感应模组及其制作方法、电子设备 Ceased WO2019233171A1 (zh)

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