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WO2019228193A1 - Corps composite métal-plastique, son procédé de fabrication et son utilisation - Google Patents

Corps composite métal-plastique, son procédé de fabrication et son utilisation Download PDF

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Publication number
WO2019228193A1
WO2019228193A1 PCT/CN2019/087236 CN2019087236W WO2019228193A1 WO 2019228193 A1 WO2019228193 A1 WO 2019228193A1 CN 2019087236 W CN2019087236 W CN 2019087236W WO 2019228193 A1 WO2019228193 A1 WO 2019228193A1
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WIPO (PCT)
Prior art keywords
metal
resin particles
plastic
layer
plating
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Ceased
Application number
PCT/CN2019/087236
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English (en)
Chinese (zh)
Inventor
黄少华
周明
连俊兰
陈帆
林宏业
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BYD Co Ltd
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BYD Co Ltd
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Filing date
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Publication of WO2019228193A1 publication Critical patent/WO2019228193A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16S—CONSTRUCTIONAL ELEMENTS IN GENERAL; STRUCTURES BUILT-UP FROM SUCH ELEMENTS, IN GENERAL
    • F16S1/00—Sheets, panels, or other members of similar proportions; Constructions comprising assemblies of such members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/06—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present application relates to the field of preparation of metal-plastic composites, and in particular, to a metal-plastic composite, a preparation method and applications thereof.
  • plastics with metal, ceramic, glass and other substrates to form composites.
  • the commonly used methods for combining plastic and metal, ceramic, glass and other substrates to form a composite body include adhesive bonding, using rivets, and buckle bonding.
  • the above method increases the process flow, and the bonding strength of the substrate such as plastic and metal is low, and the sealing of the bonding interface is poor, which cannot meet the use requirements of electronic equipment and vehicles. Therefore, without the use of adhesives, rivets, etc., the direct integration of various substrates and plastics has become an industrial development requirement.
  • One aspect of the present application is to provide a metal plastic composite body, which includes a metal substrate; a metal resin particle composite plating layer, the metal resin particle composite plating layer is located on the metal substrate; a plastic layer, the plastic The layer is located on a side of the metal resin particle composite plating layer away from the metal substrate, wherein the metal resin particle composite plating layer includes a matrix metal layer and resin particles dispersed in the matrix metal layer, and at least part of the Resin particles are combined with the plastic layer. Therefore, the structure of the metal-plastic composite substrate is simple, the bonding strength of the plastic layer and the metal substrate is high, and the performance is good.
  • the metal plastic composite includes a metal substrate, a metal resin particle composite plating layer formed on the metal substrate, and a plastic layer formed on the metal resin particle composite plating layer, wherein the metal
  • the resin particle composite plating layer includes a matrix metal layer and resin particles dispersed in the matrix metal layer, and at least part of the resin particles are combined with the plastic layer. Therefore, the structure of the metal-plastic composite substrate is simple, the bonding strength of the plastic layer and the metal substrate is high, and the performance is good.
  • the resin particles and the plastic layer combined with the plastic layer are an integrated structure.
  • the metal-resin particle composite plating layer is formed by co-depositing the resin particles and a matrix metal on a surface of the metal substrate by a dispersion plating method.
  • the matrix metal includes one or more selected from the group consisting of nickel, copper, gold, iron, palladium, and tin.
  • the thickness of the matrix metal layer is 5-50 ⁇ m.
  • the material forming the resin particles includes a material selected from the group consisting of polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyamide, polyphenylene sulfide, polyphenylene ether, polypropylene, polyethylene, and styrene.
  • a butadiene-styrene block copolymer a styrene-ethylene-butene-styrene block copolymer
  • a thermoplastic polyurethane elastomer a material selected from the group consisting of polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyamide, polyphenylene s
  • the particle diameter of the resin particles is not greater than 30 ⁇ m.
  • the metal substrate includes one or more of a stainless steel metal substrate, an aluminum metal substrate, a nickel metal substrate, and a copper metal substrate.
  • the thickness of the metal substrate is 0.1-50 mm.
  • the material forming the plastic layer includes a material selected from the group consisting of polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyamide, polyphenylene sulfide, polyphenylene ether, polypropylene, polyethylene, and styrene.
  • a butadiene-styrene block copolymer a styrene-ethylene-butene-styrene block copolymer
  • a thermoplastic polyurethane elastomer a material selected from the group consisting of polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyamide, polyphenylene s
  • the thickness of the plastic layer is 0.5-50 mm.
  • the resin particles are formed from the same material as the plastic layer.
  • the present application also provides a method for preparing a metal-plastic composite, which includes the following steps: co-depositing resin particles and matrix metal on the surface of a metal substrate by a dispersion plating method to form a metal-resin particle composite plating layer;
  • the resin particle composite plating layer is plastic injection-molded on a side far from the metal substrate, and the resin particles on the surface of the metal resin particle composite plating layer are at least partially combined with the plastic layer formed by injection molding.
  • the method has a simple manufacturing process, and does not need to make holes on the surface of the metal substrate by physical or chemical methods, and the formed metal resin particle composite coating layer does not need to undergo subsequent chemical treatment (such as hole expansion treatment or immersion in chemical solution to increase the plastic Adhesion, etc.), and the metal-plastic composite produced has high bonding strength and good performance.
  • the dispersion electroplating method further includes: immersing the metal substrate in a plating solution for plating, wherein the liquid temperature of the plating solution is 50-90 ° C, the pH value is 3.5-5.5, Application time is 30-120 minutes.
  • the plating solution includes a mixed solution of a metal plating solution and an aqueous dispersion of resin particles.
  • the concentration of the aqueous dispersion of the resin particles is 5-50 g / L.
  • the aqueous dispersion of the resin particles includes the resin particles and a surfactant, and the surfactant includes a nonionic surfactant and a cationic surfactant.
  • the content of the resin particles is 0.05-0.25 g / mL
  • the mass of the non-ionic surfactant is 5-20 wt% of the resin particles
  • the mass of the cationic surfactant is 0.2-2.0 of the resin particles wt%.
  • the plating solution includes: 25-30g / L nickel sulfate hexahydrate, 0.5-10g / L borax, 5-15g / L aqueous dispersion of the resin particles, 10-50g / L malic acid , 10-50 / L succinic acid, 20-50g / L sodium hypophosphite.
  • the application also provides the application of the metal-plastic composite of the present application as a metal casing of a communication device.
  • FIG. 1 shows a schematic structural diagram of a metal-plastic composite according to an embodiment of the present application.
  • FIG. 2 shows a method flowchart of a method for preparing a metal-plastic composite according to an embodiment of the present application.
  • 1000 metal plastic composite
  • 100 metal substrate
  • 200 metal resin particle composite coating
  • 300 plastic layer.
  • Hole-making methods include anodic oxidation-strong acid treatment process, laser engraving process, immersion, etching and other treatment processes. All of the above methods have problems such as tedious process and high cost, and the treated metal substrate cannot be stored for a long time and needs to be stored in a short time. Proceed to the next stage of production.
  • the present application proposes a metal-plastic composite.
  • the metal-plastic composite 1000 of the present application includes a metal substrate 100 and a metal resin particle composite plating layer 200 formed on the metal substrate 100. And a plastic layer 300 formed on the metal resin particle composite plating layer 200, wherein the metal resin particle composite plating layer 200 includes a matrix metal layer and resin particles (not shown in the figure) dispersed in the matrix metal layer, and at least part of the resin The particles are combined with the plastic layer 300. Therefore, the metal-plastic composite 1000 has a simple structure, a high bonding strength between the metal substrate 100 and the plastic layer 300, and good useability.
  • the composite coating of metal resin particles includes a matrix metal layer and resin particles dispersed in the matrix metal layer, and at least part of the resin particles are combined with the plastic layer
  • the resin particles are dispersed on the inside and the surface of the matrix metal layer, And at least part of the resin particles dispersed on the surface of the matrix metal layer is combined with the plastic layer.
  • all the resin particles dispersed on the surface of the matrix metal layer can be combined with the plastic layer.
  • the resin particles combined with the plastic layer and the plastic layer may be an integrated structure, and thus, the bonding force between the metal substrate and the plastic layer may be further improved.
  • the metal-resin particle composite plating layer may be formed by a dispersion plating method, and the dispersion plating method may include co-depositing the resin particles and the matrix metal on the surface of the metal substrate.
  • the resin particles can be uniformly distributed in the matrix metal to form a metal resin particle composite coating layer.
  • the resin particles on the surface of the metal resin particle composite coating layer can be well fused with the plastic layer, and the metal substrate and plastic can be significantly improved. Cohesion between layers.
  • the matrix metal may be various metals commonly used in the art for dispersion plating.
  • the matrix metal may include one or more selected from nickel, copper, gold, iron, palladium, and tin.
  • the matrix metal may be nickel, may be copper, may be gold, may be iron, or may be Palladium may be tin, nickel copper, nickel palladium, nickel copper gold, or the like; specifically, the matrix metal may be nickel.
  • the material for forming the resin particles may include a material selected from polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polyamide (PA), polyphenylene sulfide (PPS ), Polyphenylene ether (PPO), polypropylene (PP), polyethylene (PE), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butene-styrene block One or more of a copolymer (SEBS) and a thermoplastic polyurethane elastomer (TPU).
  • the material forming the resin particles may be selected from one or more of PC, ABS, PA, and PPS.
  • the material forming the resin particles may be PA.
  • the particle diameter of the resin particles may be 30 ⁇ m or less, that is, the particle diameter of the resin particles may not be greater than 30 ⁇ m; for example, the particle diameter of the resin particles may be 20 ⁇ m or less, and the particle diameter of the resin particles may be 1-10 ⁇ m, which may be 5 ⁇ m, and may be 8 ⁇ m or the like. Therefore, the particle diameter of the resin particles is within the above range, and the dispersion stability of the resin particles is good.
  • the thickness of the matrix metal layer may be 5-50 ⁇ m, for example, 10-30 ⁇ m, 15 ⁇ m, or 20 ⁇ m. It may be 25 ⁇ m, 40 ⁇ m, or the like.
  • the metal substrate may include one or more of a stainless steel metal substrate, an aluminum metal substrate, a nickel metal substrate, and a copper metal substrate.
  • the metal substrate may be a stainless steel metal substrate, an aluminum metal substrate, or a nickel metal substrate.
  • the thickness of the metal substrate is not particularly limited, and a person skilled in the art can appropriately select according to its use.
  • the thickness of the metal substrate can be selected from 0.1-50 mm, 0.2-25 mm, 0.5-10 mm, and 1-5 mm.
  • the material forming the plastic layer may include one or more selected from the group consisting of PC, ABS, PA, PPS, PPO, PP, PE, SBS, SEBS, and TPU; more optionally, The material forming the plastic layer may include one or more selected from PC, ABS, PA, PPS, PP, PE, and PPO; further optionally, the material forming the plastic layer may be selected from PC, ABS, PA, and PPS One or more of them.
  • the materials forming the resin particles and the plastic layer may be the same.
  • the resin particles on the surface of the composite plating layer of the metal resin particles and the plastic layer can be better integrated into one body, and the bonding force between the metal substrate and the plastic layer is further improved.
  • the thickness of the plastic layer may be 0.5-50 mm, may be 0.5-20 mm, more may be 1-10 mm, and further may be 1-3 mm.
  • the present application also provides a method for preparing a metal-plastic composite.
  • the method can prepare the metal-plastic composite body described above. Therefore, the metal-plastic composite body prepared by the method has all the features and advantages of the metal-plastic composite body described above. No longer.
  • the method includes the following steps:
  • step 2) A step of injection-molding plastic on the metal substrate having the composite plating layer obtained in step 1), and at least partially combining resin particles on the surface of the composite plating layer with the injection-molded plastic layer.
  • resin particles and metal are co-deposited on the surface of a metal substrate by a dispersion plating method, thereby obtaining a metal-resin particle composite plating layer in which a resin particle structure is uniformly distributed in a matrix metal (or called host metal) layer
  • a metal-resin particle composite plating layer in which a resin particle structure is uniformly distributed in a matrix metal (or called host metal) layer
  • the resin particles on the surface of the metal resin particle composite plating layer can be integrated with the injection molded plastic layer, thereby significantly improving the metal substrate and the injection molding formed. Bonding force between plastic layers.
  • the preparation process is simple, there is no need to make holes on the surface of the metal substrate by physical or chemical methods, and the formed metal resin particle composite coating does not need to be subjected to subsequent chemical treatments (such as hole expansion treatment or immersion in chemical solution to increase the adhesion of plastics). Etc.), environmentally friendly.
  • the method includes the following steps:
  • the resin particles and the matrix metal are co-deposited on the surface of the metal substrate by a dispersion plating method to form a metal-resin particle composite plating layer.
  • the matrix metal may be various metals commonly used in the art for dispersion electroplating.
  • the matrix metal may include one or more selected from the group consisting of nickel, copper, gold, iron, palladium, and tin; alternatively, the matrix metal may be nickel.
  • the material forming the resin particles may include one or more selected from the group consisting of PC, ABS, PA, PPS, PPO, PP, PE, SBS, SEBS, and TPU; more optionally, forming the resin particles
  • the material may include one or more selected from PC, ABS, PA, and PPS; optionally, the material forming the resin particles may be PA.
  • the particle diameter of the resin particles may be 30 ⁇ m or less; more alternatively, the particle diameter of the resin particles may be 20 ⁇ m or less; and more alternatively, the particle diameter of the resin particles may be 1-10 ⁇ m.
  • the particle diameter of the resin particles is within the above range, the dispersion stability of the resin particles is good.
  • the formed metal-resin particle composite plating layer includes a matrix metal layer and resin particles dispersed in the matrix metal layer.
  • the resin particles can be dispersed in the interior and surface layers of the matrix metal layer, and the resin particles dispersed in the surface layer of the matrix metal layer can be well combined with the plastic layer, further improving the bond between the metal substrate and the plastic layer formed by injection molding. force.
  • the thickness of the matrix metal layer may be selected from 5-50 ⁇ m, and may be selected from 10-30 ⁇ m.
  • the metal substrate may include one or more of a stainless steel metal substrate, an aluminum metal substrate, a nickel metal substrate, and a copper metal substrate; the stainless steel metal substrate and the aluminum metal substrate may be selected. Or nickel metal substrate.
  • the thickness of the metal substrate is not particularly limited, and those skilled in the art can appropriately select according to its use.
  • the thickness of the metal substrate can be selected from 0.1-50 mm, 0.2-25 mm, 0.5-10 mm, and 1-5 mm.
  • the above-mentioned dispersion plating can be performed in a plating solution containing metal ions and resin particles dispersed.
  • the plating solution may include a mixed solution of a metal plating solution and an aqueous dispersion of resin particles.
  • the aqueous dispersion of resin particles may include resin particles and a surfactant.
  • the content of the resin particles may be 0.05-0.25 g / mL, and may be 0.1-0.2 g / mL.
  • the surfactant may be various surfactants commonly used in the art, and optionally, the surfactant may be one or more of a nonionic surfactant and a cationic surfactant.
  • the nonionic surfactant may include one or more of an alkylphenol polyoxyethylene ether, a fatty alcohol polyoxyethylene ether, and a polyether type nonionic surfactant.
  • alkylphenol polyoxyethylene ether examples include OP-10; examples of the fatty alcohol polyoxyethylene ether include AEO-9; and examples of the polyether nonionic surfactant include polypropylene glycol ethylene oxide adduct .
  • the cationic surfactant may include a quaternary ammonium salt type cationic surfactant.
  • the amount of the surfactant may be 5-20% by weight of the resin particles, and may be 8-15% by weight of the resin particles.
  • the aqueous dispersion of the resin particles may be prepared by a method generally used in the art to form an aqueous dispersion.
  • the resin particle aqueous dispersion is formed by the following steps:
  • drying conditions include: a drying temperature of 80-100 ° C, and a drying time of 1-10 hours;
  • the mixed powder is dispersed with water, and the amount of the cationic surfactant is 0.2-2.0% by weight of the resin particles.
  • the amount of the aqueous dispersion of resin particles in the plating solution can be determined according to the amount of the plating metal source compound.
  • the amount of the aqueous dispersion of the resin particles may be 5-50 g / L, and more preferably 5-15 g / L.
  • the metal plating solution in the plating solution may include a nickel plating plating solution
  • the aqueous dispersion of the resin particles may be an aqueous dispersion prepared by the above-mentioned optional embodiment.
  • composition of the plating solution for dispersion plating is as follows:
  • the dispersion plating method may further include: immersing the metal substrate in a plating solution to perform composite plating, and the conditions of the dispersion plating may include: the liquid temperature of the plating solution is 50-90 ° C , PH value is 3.5-5.5, plating time is 30-120 minutes.
  • the metal-resin particle composite plating layer formed in the previous step is injection-molded on the side far from the metal substrate, and the resin particles on the surface of the metal-resin particle composite plating layer are at least partially combined with the plastic layer formed by injection molding.
  • the conditions for injection molding can be various conditions commonly used in injection molding in the art, which are not repeated here.
  • the injection-molded plastic may include one or more selected from the group consisting of PC, ABS, PA, PPS, PPO, PP, PE, SBS, SEBS, and TPU; more optionally, injection molding
  • the plastic can be selected from one or more of PC, ABS, PA, PPS, PP, PE, and PPO; further optionally, the injection molded plastic can be selected from one or more of PC, ABS, PA, and PPS Species.
  • the material of the resin particles and the injection-molded plastic may be the same.
  • the resin particles on the surface of the metal resin particle composite plating layer and the plastic layer formed by injection molding can be better integrated into one body, and the bonding force between the metal substrate and the plastic layer formed by injection molding can be improved.
  • the thickness of the formed plastic layer can be 0.5-50 mm, optionally 0.5-20 mm, more preferably 1-10 mm, and further 1-3 mm.
  • the application also provides a metal plastic composite prepared by the preparation method of the application. Therefore, the metal-plastic composite has all the features and advantages of the metal-plastic composite prepared by the method for preparing a metal-plastic composite, which is not described herein again.
  • the present application also provides the application of the metal-plastic composite of the present application as a metal casing of a communication device.
  • This preparation example is used to explain the preparation of an aqueous nylon dispersion.
  • This example is used to illustrate the preparation of an aqueous nylon dispersion.
  • This preparation example is used to explain the preparation of an aqueous nylon dispersion.
  • Nickel sulfate hexahydrate 25g / L
  • Nylon water dispersion W 1 7.5g / L
  • Lactic acid 20g / L
  • a stainless steel substrate (sus304, 1 mm thick) was immersed in the plating solution A for dispersion plating to obtain a metal substrate with a composite plating layer formed on the surface.
  • the conditions for the dispersion plating were: the liquid temperature was 90 ° C and the pH was 4.5. , Wetting the plated substrate with the plating solution for 45 minutes to perform composite plating, and plating a composite coating film with uniformly distributed nylon particles in a Ni-P matrix on the surface of the substrate, the thickness of the coating film is 10 ⁇ m;
  • the obtained metal substrate was put into a mold, and injection molding was performed at 290 ° C using commercially available nylon particles (PA6-8233G, BASF, Germany), and the mold temperature was 90 ° C to obtain a metal-plastic composite A 1 .
  • the thickness of the injection-molded plastic layer of the obtained metal-plastic composite was 2 mm.
  • the plating solution B was prepared according to the following composition.
  • Nickel sulfate hexahydrate 25g / L
  • Nylon water dispersion W 2 7.5g / L
  • Lactic acid 20g / L
  • a stainless steel substrate (sus304, thickness: 1 mm) was immersed in the plating solution B for dispersion plating to obtain a metal substrate with a composite plating layer formed on the surface.
  • the conditions for the dispersion plating were: the liquid temperature was 90 ° C and the pH was 4.5 , Wetting the plated substrate with a plating solution for 60 minutes to perform composite plating, and plating a composite coating film with a uniform distribution of nylon particles in a Ni-P matrix on the surface of the substrate, the thickness of the coating film is 16 ⁇ m;
  • the obtained metal substrate was put into a mold, and injection molding was performed at 290 ° C using commercially available nylon particles (PA6-8233G, BASF, Germany), and the mold temperature was 90 ° C to obtain a metal-plastic composite A 2 .
  • the thickness of the injection-molded plastic layer of the obtained metal-plastic composite was 2 mm.
  • a plating solution C was prepared according to the following composition.
  • Nickel sulfate hexahydrate 25g / L
  • Nylon water dispersion W 3 7.5g / L
  • Lactic acid 20g / L
  • a stainless steel substrate (sus304, 1 mm thick) was immersed in the plating solution C for dispersion plating to obtain a metal substrate with a composite plating layer formed on the surface.
  • the conditions for the dispersion plating were that the liquid temperature was 90 ° C and the pH was 4.5. , Wetting the plated substrate with a plating solution for 90 minutes to perform composite plating, and plating a composite coating film with uniformly distributed nylon particles in a Ni-P matrix on the surface of the substrate, the thickness of the coating film is 25 ⁇ m;
  • the obtained metal substrate was put into a mold, and injection molding was performed at 290 ° C with commercially available nylon particles (PA6-8233G, BASF, Germany), and the mold temperature was 90 ° C to obtain a metal-plastic composite A 3 , and the obtained metal-plastic composite
  • the thickness of the injection-molded plastic layer is 2mm.
  • Example 1 The method according to Example 1 was performed, except that the metal substrate was an aluminum metal substrate to obtain a metal-plastic composite A 4 .
  • the method was carried out according to Example 1, except that the amount of the nylon aqueous dispersion W 1 was 15 g / L to obtain a metal-plastic composite A 5 .
  • test samples The metal substrates coated with the composite coating on the surface of the substrate were prepared according to the steps (1) and (2) of Examples 1-5, and then the metal substrates obtained in step (2) were prepared. Put it into a mold, and use commercially available nylon particles (PA6-8233G, BASF, Germany) to perform injection molding at 290 ° C, and the mold temperature is 90 ° C to obtain metal-plastic composite test samples S 1 -S 5 and test samples S 1 -S 5
  • the size of the plastic part is 1 mm ⁇ 45 mm ⁇ 5 mm, and the bonding surface with the metal substrate is 0.5 cm 2 (10 mm ⁇ 5 mm).
  • Test method After 24 hours of injection, S 1 -S 5 and D 1 were tested on a universal testing machine for pull-out bond strength. The results are shown in Table 1.
  • the embodiments 1-5 using the method of the present application do not need to make holes on the surface of the metal substrate by physical or chemical methods, and do not need to perform chemical treatment after plating (such as Reaming treatment or immersion of chemical solution to increase the adhesion of plastics) has the advantages of simple process and environmental friendliness, and the obtained metal-plastic composite has high binding force between metal and plastic.

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Abstract

La présente invention concerne un corps composite métal-plastique, un procédé pour le fabriquer et une utilisation correspondante. Le corps composite métal-plastique comprend un substrat métallique, un revêtement composite métal-particules de résine formé sur le substrat métallique et une couche de plastique formée sur le revêtement composite métal-particules de résine, le revêtement composite métal-particules de résine comprenant une couche de métal de matrice et des particules de résine dispersées dans la couche de métal de matrice, une partie au moins des particules de résine se liant avec la couche de plastique.
PCT/CN2019/087236 2018-05-31 2019-05-16 Corps composite métal-plastique, son procédé de fabrication et son utilisation Ceased WO2019228193A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810553630.X 2018-05-31
CN201810553630.XA CN110553134A (zh) 2018-05-31 2018-05-31 金属塑料复合体及其制备方法和应用

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WO2019228193A1 true WO2019228193A1 (fr) 2019-12-05

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