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WO2019223953A1 - Combinaison d'un enrobage transparent sur toute une surface avec un enrobage de bord (non-transparent) à teneur élevée en sorbeur - Google Patents

Combinaison d'un enrobage transparent sur toute une surface avec un enrobage de bord (non-transparent) à teneur élevée en sorbeur Download PDF

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Publication number
WO2019223953A1
WO2019223953A1 PCT/EP2019/060774 EP2019060774W WO2019223953A1 WO 2019223953 A1 WO2019223953 A1 WO 2019223953A1 EP 2019060774 W EP2019060774 W EP 2019060774W WO 2019223953 A1 WO2019223953 A1 WO 2019223953A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
organic electronic
layer
electronic device
desiccant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/060774
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German (de)
English (en)
Inventor
Julia ROMPF
Bastian Wedel
Klaus KEITE-TELGENBÜSCHER
Thorsten Krawinkel
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Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to EP19721250.9A priority Critical patent/EP3803997A1/fr
Priority to CN201980034581.1A priority patent/CN112424970B/zh
Publication of WO2019223953A1 publication Critical patent/WO2019223953A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present invention relates to a protective method for protecting an organic electronic device disposed on a substrate, comprising the steps of attaching a cover over the organic electronic device such that the organic electronic device is at least partially covered, and adhering the cover to at least one layer a first adhesive and at least one layer of a second adhesive. Furthermore, the invention relates to an organic electronic structure, comprising a substrate, an organic electronic arrangement arranged on the substrate and a cover which at least partially covers the organic electronic arrangement and adheres at least partially to the substrate and / or to the organic electronic arrangement is.
  • Such arrangements include inorganic or organic electronic structures, such as organic, organometallic or polymeric semiconductors or combinations thereof. These arrangements and products are rigid or flexible depending on the desired application, whereby there is an increasing demand for flexible arrangements.
  • the production of such arrangements is effected for example by printing processes such as high-pressure, intaglio, screen printing, planographic printing or as well as so-called “non-impact printing” such as thermal transfer inkjet printing or digital printing.
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • PECVD plasma-enhanced chemical or physical deposition
  • sputtering etching or vapor deposition
  • Electrophoretic or electrochromic structures or displays, organic or polymeric light-emitting diodes (OLEDs or PLEDs) in display and display devices or as illumination may be mentioned as examples of (commercial) electronic applications that are already commercially interesting or in their market potential.
  • organic solar cells preferably dye or polymer solar cells
  • inorganic solar cells preferably thin-film solar cells, in particular based on silicon, germanium, copper, indium and selenium, organic field effect transistors, organic switching elements, organic optical amplifiers, organic laser diodes, organic or inorganic sensors or also organic or inorganic based RFID transponders.
  • an organic (opto) electronic arrangement is understood to mean an electronic arrangement which comprises at least one electronically functional, at least partially organic component, such as, for example, organometallic compounds.
  • Permeates may be a variety of low molecular weight organic or inorganic compounds, especially water vapor and oxygen.
  • a catcher material e.g. to provide a desiccant to provide barrier action against the permeating permeates.
  • the oxygen transmission rate OTR oxygen transmission rate
  • the water vapor transmission rate WVTR water vapor transmission rate
  • the respective rate indicates the area- and time-related flow of oxygen or water vapor through a film under specific conditions of temperature and partial pressure and optionally other measurement conditions such as relative humidity. The lower these values are, the better the respective material is suitable for encapsulation.
  • the specification of the permeation is based not only on the values for WVTR or OTR, but always includes an indication of the mean path length of the permeation such as the thickness of the material or a normalization to a certain path length.
  • the permeability P is a measure of the permeability of a body to gases and / or liquids. A low P value indicates a good barrier effect.
  • the permeability P is a specific value for a defined material and a defined permeate under steady state conditions at a certain permeation path length, partial pressure and temperature.
  • the solubility term S predominantly describes the affinity of the barrier adhesive to the permeate. For example, in the case of water vapor, a small value for S of hydrophobic materials is achieved.
  • the diffusion term D is a measure of the mobility of the permeate in the barrier material and is directly dependent on properties such as molecular mobility or free volume. They are often added strongly cross-linked or highly crystalline materials for D achieved relatively low values. However, highly crystalline materials tend to be less transparent, and greater crosslinking results in less flexibility.
  • the permeability P usually increases with an increase in molecular mobility, such as when the temperature is increased or the glass transition point is exceeded.
  • a low solubility term S alone is usually insufficient to achieve good barrier properties.
  • a classic example of this is in particular siloxane elastomers.
  • the materials are extremely hydrophobic (small solubility term), but have a comparatively low barrier to water vapor and oxygen due to their freely rotatable Si-O bond (large diffusion term). For a good barrier effect, therefore, a good balance between solubility term S and diffusion term D is necessary.
  • Encapsulating adhesives already at a level of 2% by weight of the haze are significantly greater than 5%.
  • Transparency and haze-preserving desiccants such as silanes are known but less efficient.
  • marginal encapsulation can also be carried out in order to maintain transparency in the relevant region of the structure, with only one surface enclosing the electronic structure having the Encapsulating adhesive is provided.
  • This can be filled to a high degree with efficient desiccant since no special optical requirements have to be met in the edge area.
  • the disadvantage here is the remaining cavity in the encapsulated arrangement. Arrangements are therefore also known in which an edge encapsulation and a full-surface encapsulation are combined.
  • An edge encapsulation with a sealant is known, for example, from W02009085736.
  • the sealing material is applied in liquid form from the melt.
  • US 2008/0289681 A1 discloses a solar cell module in which solar cells are applied to a substrate via a potting compound layer. Another layer of potting compound covers the solar cells with a transparent cover layer.
  • the module may further comprise a desiccant-containing edge encapsulation, which has a width of 5 - 20 mm.
  • a desiccant zeolite is used as a desiccant zeolite.
  • No. 6,936,131 B2 describes the use of desiccant-filled transfer adhesive tapes which can be used as full-surface encapsulation or as edge encapsulation. As a desiccant inorganic particles are described. The particles used in the examples lead to a high haze of the adhesive.
  • US20070013292A1 discloses an organic electronic structure which is provided with a desiccant-containing edge encapsulation. This can be designed as a curable adhesive, also as an adhesive tape. The width of the edge encapsulation is preferably carried out above 2 mm.
  • the object of the present invention was therefore to provide an improved encapsulation of a narrow-edged organic electronic structure, which allows an improved utilization of the narrow edge for the permeation barrier and thus better protects the encapsulated object against the ingress of moisture, without impairing the optical properties of the organic electronic structure with it.
  • the at least one layer of the first adhesive at least partially covers the organic electronic device and has a transparency of more than 80% and a haze of less than 5% and the at least one layer the second adhesive comprising at least one layer of the first adhesive at its periphery to form an edge encapsulation, wherein the width of the edge encapsulation with the second adhesive is not more than 2 mm (ie two mm or less), and wherein the second adhesive a water absorption capacity, ie Water absorption capacity, of more than 5 wt .-%.
  • an organic electronic structure of the aforementioned type wherein the structure further comprises at least one layer of a first adhesive at least partially covering the organic electronic device and a transparency of more than 80% and a haze of less than 5%, as well as at least one layer of a second adhesive comprising the at least one layer of the first adhesive at its periphery comprises, so that it forms a Randverkapselung, wherein the width of the edge encapsulation with the second adhesive is not more than 2 mm, and having a water absorbency of more than 5 wt .-% comprises.
  • Preferred embodiments of the method and the organic electronic structure are in the subclaims.
  • the preferred embodiments of the method apply analogously to the organic electronic structure and vice versa.
  • a polymer is a chemical compound consisting of usually organic chain or branched molecules (macromolecule) consisting of the same, similar or different units (the so-called monomers).
  • the macromolecule consists of only one type of monomer.
  • Copolymers are made up of various monomers which can be distributed randomly in the macromolecule, distributed regularly or in blocks. Polymers contain at least three identical monomer units.
  • a monomer unit within the meaning of this definition is the bonded form of a monomer in a polymer.
  • a structure is particularly favorable, in which the organic electronic device is located directly on the substrate.
  • a construction is particularly favorable in which the organic electronic arrangement arranged on a substrate is already provided with a primary encapsulation, for example a thin-layer encapsulation, and the method claimed here Secondary encapsulation is performed on one or both sides of the arranged on the substrate electronic device.
  • a primary encapsulation for example a thin-layer encapsulation
  • the cover at least partially covers the organic electronic device. Preferably, it completely covers the organic electronic device.
  • the at least one layer of the first adhesive at least partially covers the organic electronic device. Preferably, it completely covers the organic electronic device.
  • the distance at which the adhesive is applied to the organic electronic arrangement is preferably from 0.1 mm to 2 mm, in particular from 0.2 mm to 1 mm and particularly preferably from 0.2 mm to 0.5 mm.
  • the distance formed in this way is filled with the first adhesive. If the organic electronic arrangement is surrounded by a primary encapsulation, then in another preferred embodiment the distance is filled by the material of the primary encapsulation. In a further preferred embodiment, the distance is filled by the material of the primary encapsulation and the first adhesive.
  • the adhesives can be presented as liquid or pasty adhesives or in the form of adhesive tapes.
  • the use of adhesive tapes is particularly preferred because it allows a good, namely particularly accurate and very simple, application of the adhesive.
  • the thickness of the adhesive layer of first or second adhesive is preferably between about 4 pm and about 250 pm.
  • the adhesive thickness is particularly preferably not more than 50 ⁇ m, in particular not more than 25 ⁇ m.
  • any adhesive described in the prior art for example in G. Habenicht: Kleben, 6th edition, Springer 2009
  • Examples of such adhesives are, without thereby wanting to unnecessarily limit the invention, those based on vinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyvinyl chloride, (meth) acrylate, polyamide and its copolymers, cellulose, urea, melamine resin, phenolic resin, epoxy, polyurethane, polyester , Polyaromatic, chloroprene, nitrile rubber, styrene, butyl rubber, polysulfide or silicone. Also mixtures are according to the invention. Preferably, an activatable adhesive is used.
  • the first adhesive is preferably a pressure-sensitive adhesive. Activatable PSAs are particularly preferably used. More preferably, the first adhesive is presented as a pressure-sensitive adhesive tape. This facilitates the processing of the adhesive.
  • Adhesive adhesives are adhesives which, even under relatively slight pressure, permit a permanent bond with the primer and, after use, can be removed again from the primer without leaving any residue.
  • Pressure-sensitive adhesives are permanently tacky at room temperature and therefore have a sufficiently low viscosity and high tack, so that they wet the surface of the respective adhesive base even at low pressure.
  • the adhesiveness of the adhesives is based on their adhesive properties and the removability on their cohesive properties. As a basis for PSAs, various compounds come into question.
  • PSAs it is possible to use all PSAs known to the person skilled in the art, for example those based on acrylates and / or methacrylates, polyurethanes, natural rubbers, synthetic rubbers, styrene block copolymer compositions with an elastomeric block of unsaturated or hydrogenated polydiene blocks (polybutadiene, polyisoprene, copolymers of both, and others). Elastomer blocks familiar to the person skilled in the art), polyolefins, fluoropolymers and / or silicones.
  • compositions which have pressure-sensitive adhesive properties in accordance with the Handbook of Pressure Sensitive Adhesive Technology by Donatas Satas (Satas & Associates, Warwick 1999).
  • Adhesive systems are considered as activatable adhesives, in which the production of the final adhesion by an energy input, for example by actinic radiation or heat takes place.
  • activatable adhesive it is possible in principle to use all customary adhesively bonded adhesive systems that are activated. Activation is usually via an energy input, e.g. by actinic radiation, heat or mechanical energy, such. As ultrasound or friction.
  • Heat-activated adhesive adhesives can basically be classified into two categories: thermoplastic heat-activated adhesives (hot-melt adhesives) and reactive heat-activated adhesives (reactive adhesives). This classification also contains such adhesives, which can be assigned to both categories, namely reactive thermoplastic heat-activated adhesive adhesives (reactive hot melt adhesives).
  • Thermoplastic adhesives are based on polymers that reversibly soften when heated and solidify again during cooling.
  • Particularly suitable thermoplastic adhesives have been found to be advantageous on the basis of polyolefins and copolymers of polyolefins and of their acid-modified derivatives, of ionomers, of thermoplastic polyurethanes, of polyamides and polyesters and copolymers thereof, and also of block copolymers such as styrene block copolymers.
  • reactive heat-activated adhesive adhesives contain reactive components.
  • the latter constituents are also referred to as "reactive resins” in which the heating initiates a crosslinking process which, upon completion of the crosslinking reaction, ensures a permanent stable compound.
  • Such adhesives preferably also contain elastic components, for example synthetic nitrile rubbers or styrene block copolymers. Due to their high flow viscosity, such elastic components impart to the heat-activated adhesive composition a particularly high dimensional stability, even under pressure. Radiation-activated adhesives are also based on reactive
  • compositions may e.g. include polymers or reactive resins in which the irradiation initiates a crosslinking process which, upon completion of the crosslinking reaction, ensures a durable, stable compound.
  • adhesives preferably also contain elastic components, as stated above.
  • Radiation-activable PSAs are to be distinguished from radiation-crosslinked PSAs in which the pressure-sensitively adhesive properties are set by radiation crosslinking during the production of the adhesive tape.
  • the radiation activation takes place during application. After radiation activation, the adhesive is generally no longer tacky.
  • Activatable pressure-sensitive adhesive tapes also comprise pressure-sensitive adhesive tapes assembled from two or more adhesive films, as disclosed in DE 10 2013 222739 A1. These are activated by contacting the two or more adhesive films.
  • activatable (adhesive) adhesive compositions which are prepared from compounds which have at least one of the following functional groups: epoxides, amines, ureido groups, hydroxyl groups, ether groups, acid groups, in particular carboxylic acid groups, preferably acrylic acid and methacrylic acid groups, and carboxylic anhydride groups, ester groups and amide groups, isocyanates, imidazoles, phenolic groups, urea groups, silane groups, ethylenic double bonds, especially in combination with initiator groups that can initiate radical polymerization or with sulfur-containing vulcanizing agents.
  • the activatable (adhesive) adhesives may optionally contain one or more other formulation ingredients such as hardeners, reaction accelerators, catalysts, initiators, fillers, microspheres, tackifier resins, non-reactive resins, plasticizers, binders, bitumen, anti-aging agents (antioxidants), light stabilizers, UV Absorber, rheological additives, and other auxiliaries and additives may be included.
  • other formulation ingredients such as hardeners, reaction accelerators, catalysts, initiators, fillers, microspheres, tackifier resins, non-reactive resins, plasticizers, binders, bitumen, anti-aging agents (antioxidants), light stabilizers, UV Absorber, rheological additives, and other auxiliaries and additives may be included.
  • (barrier) adhesives which are particularly suitable for the present invention can be found in US 2006/0100299 A1, WO 2007/087281 A1, EP 2166593 A1, EP 2279537 B1, EP 2465149 B1, EP 2768919 B1, EP 2768918 A1, EP 2838968 A1, EP 2838968 A1 or WO 2016066435 A1, this list being purely exemplary and in no way exhaustive.
  • the second adhesive may also be a pressure-sensitive adhesive and also be designed as a pressure-sensitive adhesive tape. However, particularly preferred is the execution of the second adhesive as a liquid adhesive.
  • the second adhesive contains a desiccant.
  • the water-catching property may also be due to the adhesive itself.
  • not fully reacted epoxide may be mentioned here.
  • desiccant in the second adhesive can be used in principle all known in the art desiccant. If desiccants are also used in the first adhesive, these are preferably those which do not or only slightly impair the transparency of the adhesive.
  • Desiccants are also referred to in the literature as “getters,” “scavengers.”
  • the term “desiccant” is used herein to refer to either the adsorption of silica gel, molecular sieves, zeolites or sodium sulphate, such as alkoxysilanes, oxazolidines, isocyanates, Barium oxide, phosphorus pentoxide, alkali metal and alkaline earth metal oxides (such as, for example, calcium oxide), metallic calcium or metal hydrides are bonded (WO 2004/009720 A2)
  • many fillers are not suitable for the transparent bonding of, for example, displays with the first adhesive, since the transparency and in particular the haze of the adhesive is reduced.
  • adhesives mainly inorganic fillers such as calcium chloride or various oxides (see US 5,304,419 A, EP 2 380 930 A1 or US 6,936,131 A).
  • adhesives dominate in the case of edge encapsulation, that is to say in cases in which only edges are to be glued.
  • adhesives containing such getters are unsuitable since, as stated above, they reduce the transparency and in particular the haze.
  • Organic getters are also described in adhesives.
  • EP 2 597 697 A1 in which polymeric alkoxysilanes are used as drying agents.
  • Numerous different silanes as drying agents in adhesives are mentioned in WO 2014/001005 A1. According to this document, the maximum amount of desiccant to be used is 2% by weight, since the use of larger mass fractions would damage the sensitive electronic structure to be encapsulated.
  • the organic desiccants used are usually very reactive and cause damage (so-called "dark spots") on contact with the sensitive organic electronics in the full-surface encapsulation.Adhesives containing such desiccants are thus preferably suitable for edge encapsulation (second adhesive) in which there is no direct contact of the adhesive with the electronic device.
  • the desiccant content of the second adhesive is 15% by weight or more, more preferably 30% by weight or more.
  • the administration is preferred as a liquid adhesive, since the high filler content affects the pressure-sensitive adhesive properties of an adhesive tape.
  • the desiccant content of an adhesive is more than 20 wt .-%, said desiccant having a water absorption capacity of more than 10 wt .-%, particularly preferably more than 20 wt .-%, having.
  • a desiccant-containing second adhesive which has a water absorption capacity of more than 5% by weight, in particular more than 10% by weight, very particularly more than 14% by weight.
  • the first adhesive preferably also has water-catching properties, in particular the first adhesive, which is preferably a full-surface encapsulation, contains a water scavenger, typically a desiccant.
  • the first adhesive preferably contains less than 2% by weight particulate desiccant, in particular calcium oxide, since the high refractive index of many desiccants (calcium oxide: 1.86) in conventional encapsulation adhesives already accounts for more than 2% by weight of the haze usually greater than 5%.
  • the base adhesive ie the adhesive formulation without any added desiccant
  • the first adhesive and / or the second adhesive has a water vapor transmission rate (WVTR) of less than 100 g / m 2 d at 38 ° C / 90% relative humidity, based on a Layer thickness of 50 pm, more preferably less than 20 g / m 2 d.
  • WVTR water vapor transmission rate
  • WO2013057265 copolymers of isobutylene or butylene
  • DE102008047964A1 vinyllaromatic block copolymers
  • US8557084B2 crosslinked vinylaromatic block copolymers
  • EP2200105 polyolefins
  • US8460969B2 butylene block copolymer
  • WO02007087281A1 hydrogenated cycloolefin polymers with PIB
  • W02009148722 PIB with acrylate reactive resin
  • EP2502962A1 PiB-epoxy
  • JP2015197969 PIB
  • the first adhesive, the full-area encapsulant, and the second adhesive, the edge-encapsulant are based on the same Base adhesive.
  • the components of the adhesives which dominate the adhesive performance are substantially the same, and the proportions of the constituents are also substantially the same.
  • the base polymer or the base polymers of both adhesives is the same.
  • Base adhesive means in this case that the properties of the adhesive are at least strongly determined by the basic properties of the base adhesive or of one or more base polymers or monomers, it being understood that it is not excluded that that these are additionally influenced by the use of modifying auxiliaries or additives or by other polymers or monomers in the composition. In particular, this may mean that the proportion of the base polymer or of the base polymers and optionally of the monomers in the total mass of the polymeric phase is more than 50% by weight.
  • the transparent first adhesive is a desiccant which has a similar refractive index as typical encapsulating adhesives and thus enables a highly transparent adhesive.
  • a similar refractive index is understood to mean a difference in refractive index between the first adhesive and desiccant of not more than 0.02.
  • Hydrotalcite is particularly preferably used as drying agent.
  • the synthetic hydrotalcite Mg 6 Al 2 (C0 3 ) (0H) i 6 4H 2 0, product number 652288
  • the particular full-surface first adhesive is free of particulate fillers, as these increase the Haze.
  • the transparent first adhesive comprises a molecularly dispersed desiccant.
  • the first adhesive is applied as a sheet (adhesive tape), the second as a liquid adhesive.
  • the width of the edge encapsulation with the second (encapsulant) adhesive is not more than two millimeters, more preferably less than one millimeter, because it maximizes the ratio of active area to total area of the electronic package.
  • the width of the edge encapsulation with the second (encapsulant) adhesive is not more than two millimeters, more preferably less than one millimeter, because it maximizes the ratio of active area to total area of the electronic package.
  • the width of the edge encapsulation with the second (encapsulant) adhesive is not more than two millimeters, more preferably less than one millimeter, because it maximizes the ratio of active area to total area of the electronic package.
  • the particular combination of the two adhesives according to the present invention makes it possible to provide an acceptable lag-time for an organic electronic structure even with very small edge widths in a range of not more than 2 mm.
  • Fig. 1 shows a calcium test as a measure for determining the life of an electronic structure.
  • 2 shows by way of example a curve as it results from the measured data of the test.
  • FIG. 3 shows by way of example the breakthrough time as a function of the water scavenger content.
  • Three individually preferred embodiments of organic electronic structures according to the invention are shown in the attached Figures 4 to 6.
  • 4 shows an organic electronic structure in a simple form with organic electronic arrangement applied to the substrate and the cover applied by means of the two adhesives;
  • Fig. 5 is an organic electronic structure having a primary encapsulation and a second cover in addition to the basic components of the structure shown in Fig. 4; and
  • FIG. 6 shows an organic electronic structure having a primary encapsulation in addition to the basic components of the structure shown in FIG. It means:
  • the organic electronic structure 1 shown in FIG. 4 includes an organic electronic device 3 mounted on a substrate 2.
  • the organic electronic device 3 is completely surrounded by a second adhesive 6, with a certain distance from the organic electronic device 3.
  • the second adhesive 6 has a good water absorbency.
  • the organic electronic device 3 is covered with a first adhesive 5. This also fills the gap between the organic electronic device 3 and the second adhesive 6.
  • the layer of the first adhesive 5 has a transparency of> 80%, so that there are no impairments in the function of the underlying organic electronic device 3.
  • the organic electronic structure 1 shown in FIG. 5 corresponds in its basic structure to that shown in FIG. 4.
  • it includes a primary encapsulation 7. This may be, for example, a thin-layer encapsulation.
  • the primary encapsulant 7 shown in FIG. 5 completely covers the organic electronic device 3 and also fills the gap between the second adhesive 6 and the organic electronic device 3.
  • this organic electronic structure also has a second cover 8, which is arranged on the surface of the structure opposite the first cover 4.
  • the organic electronic structure 1 shown in FIG. 6 corresponds in its basic structure to that shown in FIG. 4.
  • it includes a primary encapsulation 7. This may be, for example, a thin-layer encapsulation.
  • the primary encapsulation 7 shown in FIG. 5 completely covers the organic electronic device 3 and fills a partial area of the distance between the second adhesive 6 and the organic electronic device 3. Another portion of the gap is filled by the first adhesive.
  • the second adhesive is bonded to at least a portion of the primary encapsulation.
  • WVTR Water vapor permeation rate
  • the WVTR is measured at 38 ° C and 90% relative humidity according to ASTM F-1249-13. In each case a double determination is carried out and the mean value is formed. The specified value is normalized to a thickness of 50 ⁇ m.
  • the adhesives in particular transfer adhesive tapes, are bonded to a highly permeable polysulfone membrane (available from Sartorius) for the measurements, which itself does not contribute to the permeation barrier.
  • the water absorption is determined according to DIN EN ISO 62: 2008-05 (gravimetric method, method 4) after storage of the test specimen for 7 days at 23 ° C and 50% relative humidity. In each case, a triple determination is carried out on a specimen having an area of 250 cm 2 and a thickness of 50 ⁇ m.
  • the water content is the arithmetic mean of the measurements in% by weight.
  • the water absorption is determined in accordance with DIN EN ISO 62: 2008-05 (gravimetric method, method 4) after storage of the test specimen for 7 days at 23 ° C and 50% relative humidity. In each case a triple determination is carried out on about 10 g of the drying agent.
  • the water content is the arithmetic mean of the measurements in% by weight. Determination of the breakthrough time (lag time):
  • a calcium test was used. This is shown in FIG.
  • a usually 10 x 10 mm 2 large, thin calcium layer 23 is deposited on a glass plate 21 in a vacuum and then stored under a nitrogen atmosphere.
  • the thickness of the calcium layer 23 is about 100 nm.
  • a layer (23 ⁇ 23 mm 2 ) with the adhesive 22 to be tested and a thin glass pane 24 (35 ⁇ m, Schott) is used as the carrier material.
  • the thin glass pane was laminated with a 100 ⁇ m thick PET film 26 by means of a 50 ⁇ m thick transfer adhesive tape 25 of an optically highly transparent acrylic PSA.
  • the adhesive 22 is applied to the glass plate 21 in such a way that the adhesive 22 covers the calcium mirror 23 with an edge of 6.5 mm (AA) protruding on all sides.
  • the size of the calcium level is varied.
  • the adhesive layer 22 was, unless stated otherwise, made of a transparent first encapsulant adhesive which covers the Ca level and of a desiccant-filled second encapsulant which covers the peripheral edge area of the width A-A. Due to the opaque glass carrier 24, only the permeation through the adhesive or along the interfaces is determined.
  • the test is based on the reaction of calcium with water vapor and oxygen, as described for example by AG Erlat et. al. in "47th Annual Technical Conference Proceedings Society of Vacuum Coaters", 2004, pages 654 to 659, and by ME Gross et al., in “46th Annual Technical Conference Proceedings Society of Vacuum Coaters", 2003, pages 89 to 92 are.
  • the light transmission of the calcium layer is monitored, which increases by the conversion into calcium hydroxide and calcium oxide. This takes place in the described test setup from the edge, so that the visible surface of the calcium level is reduced. It is called the time to halving the light absorption of the calcium level as a lifetime.
  • the measurement conditions selected were 85 ° C and 85% relative humidity (RH).
  • the samples were glued with a layer thickness of the adhesive of 25 pm over the entire surface and without bubbles, unless stated otherwise.
  • the degradation of the Ca level is monitored by transmission measurements.
  • the measured value (in h) is the average of three individual measurements. 2 shows by way of example a curve as it results from the measured data of the test.
  • the molecular weight determinations of the number-average molecular weights M n and the weight-average molecular weights M w were carried out by means of gel permeation chromatography (GPC).
  • the eluent used was THF (tetrahydrofuran) containing 0.1% by volume of trifluoroacetic acid. The measurement was carried out at 25 ° C.
  • the precolumn used was PSS-SDV, 5 m, 10 3 A, ID 8.0 mm ⁇ 50 mm.
  • the columns PSS-SDV, 5 m, 10 3 ⁇ and 10 5 ⁇ and 10 6 ⁇ were used with each ID 8.0 mm x 300 mm.
  • the sample concentration was 4 g / l, the flow rate 1, 0 ml per minute. It was measured against polystyrene standards.
  • the adhesive resin softening temperature is carried out according to the relevant method known as Ring and Ball, which is standardized according to ASTM E28-14.
  • a ring-ball automat HRB 754 from Herzog is used to determine the adhesive resin softening temperature of the resins. Resin patterns are first finely pounded. The resulting powder is placed in a brass cylinder with bottom opening (inner diameter at the upper part of the cylinder 20 mm, diameter of the bottom opening of the cylinder 16 mm, height of the cylinder 6 mm) and melted on a heating table. The filling quantity is chosen so that the resin after melting completely fills the cylinder without supernatant.
  • the resulting specimen including the cylinder, is inserted in the sample holder of the HRB 754.
  • Glycerol is used to fill the tempering bath, provided that the adhesive resin softening temperature is between 50 ° C and 150 ° C. At lower Klebharzerweichungstemperaturen can also be used with a water bath.
  • the test balls have a diameter of 9.5 mm and weigh 3.5 g.
  • the ball is placed above the specimen in the temperature control bath and deposited on the specimen. 25 mm below the cylinder bottom there is a catch plate, 2 mm above this a light barrier. During the measuring process, the temperature is increased at 5 ° C / min.
  • the ball In the temperature range of the adhesive resin softening temperature, the ball begins to move through the bottom opening of the cylinder until it eventually stops on the catch plate. In this position, it is detected by the photocell and registered at this time, the temperature of the bath. There is a double determination.
  • the adhesive resin softening temperature is the average of the two individual measurements.
  • the MMAP is the methylcyclohexane aniline cloud point determined using a modified ASTM D-5773-17e1 method.
  • test substance the adhesive resin sample to be examined
  • 10 mL of dry aniline CAS [62-53-3],> 99.5%, Sigma-Aldrich # 51788 or equivalent
  • 5 mL dry methylcyclohexane CAS [108-87-2],> 99%, Sigma-Aldrich # 300306 or equivalent.
  • the sample glass is shaken until the test substance has completely dissolved. For this purpose, the solution is heated to 100 ° C.
  • the sample glass with the resin solution is then introduced into a cloud point measuring device Chemotronic Cool from Novomatics and there tempered to 1 10 ° C. With a cooling rate of 1, 0 K / min is cooled. The cloud point is optically detected. For this purpose, the temperature is recorded at which the turbidity of the solution is 70%. The result is given in ° C. The lower the MMAP value, the higher the aromaticity of the test substance.
  • the DACP is the diacetone cloud point.
  • test substance the adhesive resin sample to be investigated
  • xylene mixture of isomers, CAS [1330-20-7],> 98.5%, Sigma-Aldrich # 320579 or similar. bar.
  • the test substance is dissolved and then cooled to 80 ° C. Any escaped xylene is filled in with additional xylene, so that again 5.0 g of xylene are present.
  • 5.0 g of diacetone alcohol (4-hydroxy-4-methyl-2-pentanone, CAS [123-42-2], 99%, Aldrich # H41544 or equivalent
  • the sample glass is shaken until the test substance has completely dissolved.
  • the solution is heated to 100 ° C.
  • the sample glass with the resin solution is then introduced into a cloud point measuring device Chemotronic Cool from Novomatics and tempered there to 1 10 ° C. With a cooling rate of 1, 0 K / min is cooled.
  • the cloud point is optically detected.
  • the temperature is recorded at which the turbidity of the solution is 70%. The result is given in ° C.
  • the lower the DACP value the higher the polarity of the test substance.
  • the transparency (transmission) of the adhesive layer was determined in accordance with ASTM D1003-13 (Procedure A (Hazard Byk Haze-gard Dual), standard illuminant D65). A correction of interfacial reflection losses is not made.
  • the HAZE value describes the proportion of the transmitted light, which is scattered by the irradiated sample (adhesive layer) forward at a large angle. Thus, the HAZE value quantifies structures in the surface or in the volume that interfere with clear vision.
  • the method for measuring the Haze value is described in the Standard ASTM D 1003-13 described. The standard requires the measurement of four transmission measurements. For each transmission measurement, the light transmittance is calculated. The four transmittances are calculated as the percentage Haze value. The HAZE value is measured using a Haze-gard Dual from Byk-Gardner GmbH.
  • the refractive index is determined on the basis of ISO 489 (method A, measuring wavelength 589 nm) at a temperature of 20 ° C. and a relative air humidity of 50%. Cinnamon oil was used as the contact liquid in the measurement.
  • the refractive index is determined according to ISO 489 (method B, measurement wavelength 589 nm).
  • Glass transition points - referred to interchangeably as glass transition temperatures - are reported as the result of differential scanning calorimetry (DSK) measurements in accordance with DIN 53 765: 1994-03; in particular Sections 7.1 and 8.1, but with uniform heating and cooling rates of 10 K / min in all heating and cooling steps (see DIN 53 765: 1994-03, Section 7.1, note 1).
  • the sample weight is 20 mg.
  • SibStar 62 M SiBS (polystyrene block polyisobutylene block copolymer) from Kaneka with 20 wt .-% block polystyrene content.
  • M w 60,000 g / mol, the glass transition temperature of the polystyrene blocks is 100 ° C and that of the polyisobutylene blocks -60 ° C.
  • Uvacure 1500 cycloaliphatic diepoxide (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) from Cytec, viscosity at 23 ° C. about 300 mPas
  • TerPIB 950 polyisobutylene from TerHell with a weight-average molecular weight of 950 g / mol
  • Triarylsulfonium hexafluoroantimonate cationic photoinitiator from Sigma-Aldrich.
  • the photoinitiator has an absorption maximum in the range from 320 nm to 360 nm and was present as a 50% strength by weight solution in propylene carbonate.
  • Caloxol CP2 Calcium oxide from Omya Chemicals, water absorption capacity approx. 40% by weight
  • Hydrotalcite synthetic hydrotalcite (Mg 6 Al 2 (CO 3 ) (OH) i 6 4H 2 O, product number 652288) from Sigma-Aldrich, dried at 200 ° C. for 8 hours in a hot-air oven, water absorption capacity about 12% by weight
  • TEE 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane (TEE): triethoxysilane with cycloaliphatic epoxide group, water uptake capacity (calculated as 3 moles of water per 1 mol of TEE) 19% by weight
  • Table 1 lists two formulations of transparent first PSAs according to the invention (the amount of photoinitiator relates to the amount of epoxy resin used; the data are given in percent by weight based on the epoxy resin).
  • An activatable encapsulant PSA (T1) and a desiccant-filled PSA (T2) were prepared.
  • the refractive index of the encapsulant PSA T2 without hydrotalcite was determined to be 1.53, that of hydrotalcite to 1.51.
  • the formulations were coated from solution onto a siliconized PET liner as a backing and dried at 120 ° C for 15 minutes.
  • the thickness of the dried PSAs was 25 ⁇ m.
  • the patterns were covered with another layer of a siliconized but more easily separating PET liner as a topcoat.
  • Table 2 lists three formulations for second compositions of the invention filled with dryers and three comparative adhesives. Both Adhesives according to the invention are two PSAs
  • the amount of photoinitiator relates to the amount of epoxy resin used (the information is given in percent by weight based on the epoxy resin).
  • the preparation and drying of the desiccant-filled second adhesives was carried out in the case of the PSAs as described for the first transparent PSAs. The same applies to the comparative adhesives.
  • the preparation of the liquid adhesive LA1 was carried out at room temperature by dispersing the Triarylsulfoniumhexa ⁇ fluoroantimonats and the calcium oxide in Uvacure.
  • the photoinitiator-added activatable adhesives were cured with a UV-C dose of at least 400 mJ / cm 2 by means of a medium pressure mercury radiator.
  • the breakthrough time for various edge widths was determined (Table 3), in which case the entire surface of the adhesive layer 22 was made of the adhesive used, since only material parameters should be determined.
  • the desiccant-filled liquid adhesive LA1 was applied here by adding a few monodisperse PMMA spheres in a thickness of 15 pm, the remaining adhesives in a thickness of 25 pm.
  • FIG 3 shows the breakthrough time as a function of the water scavenger content (i.e., desiccant content, here CaO) for an edge width of 1 mm, with the entire area 22 of adhesives also being made analogous to the PSA2 adhesive (with varying desiccant content). It is striking that only from a desiccant content of 15 wt .-%, a technically exploitable breakthrough time is achieved. This is accompanied by a water absorption capacity of the second adhesive of more than 5 wt .-%.
  • desiccant content here CaO
  • the desiccant-filled liquid adhesive layer LA1 was produced here (like all other adhesive layers also) in a thickness of 25 ⁇ m, the first adhesive acting as a spacer. Adhesive material squeezed out laterally was removed.
  • the active area of the electronic arrangement remains encapsulated in a transparent manner and the edge area is sealed in an improved manner by a highly desiccant-filled adhesive.

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne une structure électronique organique comprenant un substrat, un dispositif électronique organique disposé sur le substrat, un revêtement qui recouvre au moins partiellement le dispositif électronique organique et qui est collé sur au moins une partie de la surface du substrat et/ou du dispositif électronique. La structure comprend en outre au moins une couche d'un premier adhésif recouvrant au moins partiellement le dispositif électronique organique et ayant une transparence de plus de 80 % et une turbidité de moins de 5 %, et au moins une couche d'un deuxième adhésif comprenant au moins une couche du premier adhésif à sa périphérie de façon à former un enrobage de bord. La largeur de l'enrobage de bord pourvue du deuxième adhésif ne dépasse pas 2 mm, et le deuxième adhésif a une capacité d'absorption d'eau supérieure à 5 % en poids, ce qui permet de petites largeurs pour les régions de bord autour des dispositifs d'affichage ou d'autres structures électroniques organiques.
PCT/EP2019/060774 2018-05-24 2019-04-26 Combinaison d'un enrobage transparent sur toute une surface avec un enrobage de bord (non-transparent) à teneur élevée en sorbeur Ceased WO2019223953A1 (fr)

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EP19721250.9A EP3803997A1 (fr) 2018-05-24 2019-04-26 Combinaison d'un enrobage transparent sur toute une surface avec un enrobage de bord (non-transparent) à teneur élevée en sorbeur
CN201980034581.1A CN112424970B (zh) 2018-05-24 2019-04-26 透明全区域封装与具有高吸气剂含量的非透明边缘封装的组合

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DE102018208168.9A DE102018208168A1 (de) 2018-05-24 2018-05-24 Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
DE102018208168:9 2018-05-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115290539A (zh) * 2022-06-30 2022-11-04 上海回天新材料有限公司 一种使用x-ray检测导热界面材料的装置及方法

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
WO2004009720A2 (fr) 2002-07-24 2004-01-29 Adhesives Research, Inc. Ruban adhesif autocollant transformable et utilisation de celui-ci dans des ecrans d'affichage
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
US20070013292A1 (en) 2003-02-04 2007-01-18 Hirotada Inoue Organic electroluminescent device and method for manufacturing same
WO2007087281A1 (fr) 2006-01-24 2007-08-02 3M Innovative Properties Company Film de composition d’encapsulation adhesive et dispositif electroluminescent organique
US20080289681A1 (en) 2007-02-27 2008-11-27 Adriani Paul M Structures for low cost, reliable solar modules
WO2009085736A2 (fr) 2007-12-20 2009-07-09 Truseal Technologies, Inc. Matériau d'étanchéité thermofusible contenant un desséchant destiné à être utilisé dans des modules photovoltaïques
WO2009148722A2 (fr) 2008-06-02 2009-12-10 3M Innovative Properties Company Composition encapsulante adhésive et dispositifs électroniques faits avec celle-ci
EP2166593A1 (fr) 2008-09-18 2010-03-24 tesa SE Procédé d'encapsulation d'un agencement électronique
EP2200105A2 (fr) 2008-12-16 2010-06-23 tesa SE Procédé d'encapsulation d'un agencement électronique
EP2279537A1 (fr) 2008-12-03 2011-02-02 Tesa Se Procédé d'encapsulage d'un dispositif électronique
EP2380930A1 (fr) 2010-04-09 2011-10-26 Nitto Denko Corporation Composition d'étanchéité, vitre multiple et panneau de cellule solaire
EP2465149A1 (fr) 2009-08-12 2012-06-20 Tesa Se Procédé d'encapsulation d'un ensemble électronique
EP2502962A1 (fr) 2009-11-18 2012-09-26 Ajinomoto Co., Inc. Composition de résine
WO2013057265A1 (fr) 2011-10-21 2013-04-25 Tesa Se Matière adhésive, en particulier pour encapsuler un système électronique
EP2597697A1 (fr) 2011-11-28 2013-05-29 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Dispositif à couche mince étanche et procédé de réparation, système de réparation et produit de programme informatique
US8557084B2 (en) 2009-08-12 2013-10-15 Tesa Se Method of encapsulating an electronic arrangement
WO2014001005A1 (fr) 2012-06-29 2014-01-03 Tesa Se Ruban adhésif pour l'encapsulation d'un système électronique organique
EP2768918A1 (fr) 2011-10-21 2014-08-27 Tesa SE Matière adhésive, en particulier pour encapsuler un système électronique
DE102013222739A1 (de) 2013-06-17 2014-12-18 Tesa Se Reaktives 2-Komponentenklebesystem in Filmform
EP2838968A1 (fr) 2012-04-17 2015-02-25 Tesa SE Matière adhésive réticulable présentant des blocs durs et mous en tant que barrière de perméation
JP2015197969A (ja) 2014-03-31 2015-11-09 古河電気工業株式会社 有機電子デバイス素子封止用樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
WO2016066435A1 (fr) 2014-10-29 2016-05-06 Tesa Se Matières adhésives à matériaux getter activables

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6105063B2 (ja) * 2012-08-03 2017-03-29 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
WO2016153296A1 (fr) * 2015-03-24 2016-09-29 주식회사 엘지화학 Composition adhésive

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
WO2004009720A2 (fr) 2002-07-24 2004-01-29 Adhesives Research, Inc. Ruban adhesif autocollant transformable et utilisation de celui-ci dans des ecrans d'affichage
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
US20070013292A1 (en) 2003-02-04 2007-01-18 Hirotada Inoue Organic electroluminescent device and method for manufacturing same
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
WO2007087281A1 (fr) 2006-01-24 2007-08-02 3M Innovative Properties Company Film de composition d’encapsulation adhesive et dispositif electroluminescent organique
US20080289681A1 (en) 2007-02-27 2008-11-27 Adriani Paul M Structures for low cost, reliable solar modules
WO2009085736A2 (fr) 2007-12-20 2009-07-09 Truseal Technologies, Inc. Matériau d'étanchéité thermofusible contenant un desséchant destiné à être utilisé dans des modules photovoltaïques
WO2009148722A2 (fr) 2008-06-02 2009-12-10 3M Innovative Properties Company Composition encapsulante adhésive et dispositifs électroniques faits avec celle-ci
EP2166593A1 (fr) 2008-09-18 2010-03-24 tesa SE Procédé d'encapsulation d'un agencement électronique
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
EP2279537A1 (fr) 2008-12-03 2011-02-02 Tesa Se Procédé d'encapsulage d'un dispositif électronique
US8460969B2 (en) 2008-12-03 2013-06-11 Tesa Se Method for encapsulating an electronic arrangement
EP2200105A2 (fr) 2008-12-16 2010-06-23 tesa SE Procédé d'encapsulation d'un agencement électronique
EP2465149A1 (fr) 2009-08-12 2012-06-20 Tesa Se Procédé d'encapsulation d'un ensemble électronique
US8557084B2 (en) 2009-08-12 2013-10-15 Tesa Se Method of encapsulating an electronic arrangement
EP2502962A1 (fr) 2009-11-18 2012-09-26 Ajinomoto Co., Inc. Composition de résine
EP2380930A1 (fr) 2010-04-09 2011-10-26 Nitto Denko Corporation Composition d'étanchéité, vitre multiple et panneau de cellule solaire
WO2013057265A1 (fr) 2011-10-21 2013-04-25 Tesa Se Matière adhésive, en particulier pour encapsuler un système électronique
EP2768918A1 (fr) 2011-10-21 2014-08-27 Tesa SE Matière adhésive, en particulier pour encapsuler un système électronique
EP2768919A1 (fr) 2011-10-21 2014-08-27 Tesa SE Matière adhésive, en particulier pour encapsuler un système électronique
EP2597697A1 (fr) 2011-11-28 2013-05-29 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Dispositif à couche mince étanche et procédé de réparation, système de réparation et produit de programme informatique
EP2838968A1 (fr) 2012-04-17 2015-02-25 Tesa SE Matière adhésive réticulable présentant des blocs durs et mous en tant que barrière de perméation
WO2014001005A1 (fr) 2012-06-29 2014-01-03 Tesa Se Ruban adhésif pour l'encapsulation d'un système électronique organique
DE102013222739A1 (de) 2013-06-17 2014-12-18 Tesa Se Reaktives 2-Komponentenklebesystem in Filmform
JP2015197969A (ja) 2014-03-31 2015-11-09 古河電気工業株式会社 有機電子デバイス素子封止用樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
WO2016066435A1 (fr) 2014-10-29 2016-05-06 Tesa Se Matières adhésives à matériaux getter activables

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
A.G. ERLAT, 47TH ANNUAL TECHNICAL CONFERENCE PROCEEDINGS—SOCIETY OF VACUUM COATERS, 2004, pages 654 - 659
DONATAS SATAS: "Handbook of Pressure Sensitive Adhesive Technology", 1999, SATAS & ASSOCIATES
M. E. GROSS ET AL., 46TH ANNUAL TECHNICAL CONFERENCE PROCEEDINGS—SOCIETY OF VACUUM COATERS, 2003, pages 89 - 92
See also references of EP3803997A1

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115290539A (zh) * 2022-06-30 2022-11-04 上海回天新材料有限公司 一种使用x-ray检测导热界面材料的装置及方法

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