WO2019208513A1 - Resin composition, resin sheet and multilayer body - Google Patents

Abstract

A resin composition which contains (A) a thermosetting component, and which is characterized in that: the thermosetting component (A) contains (A1) a maleimide resin and (A2) a phosphorus-based curing accelerator; and the peel strength after thermal curing of a sheet-like product, which is formed from this resin composition and has a thickness of 25 μm, is 2.0 N/10 mm or more.

Description

Resin composition, resin sheet and laminate

The present invention relates to a resin composition, a resin sheet, and a laminate.

As a sealing material such as a power semiconductor, a resin composition having high heat resistance is used.
For example, Patent Document 1 includes a maleimide compound, a compound having at least one of an allyl group and an epoxy group, an amine compound, and a radical generator containing at least one of an acetophenone derivative and a tetraphenylethane derivative. A resin composition is disclosed.

Japanese Patent Laying-Open No. 2015-147849

However, the resin composition described in Patent Document 1 was not cured under low temperature and short time thermosetting conditions. Moreover, in the resin composition described in Patent Document 1, there is a concern that the peel strength after thermosetting is lowered.

An object of the present invention is to provide a resin composition, a resin sheet, and a laminate that can achieve both low-temperature and short-time thermosetting conditions and peel strength after thermosetting.

The resin composition which concerns on 1 aspect of this invention is a resin composition containing (A) thermosetting component, Comprising: Said (A) thermosetting component is (A1) maleimide resin, and (A2) phosphorus A peel strength after thermal curing of a sheet-like material having a thickness of 25 μm formed of the resin composition and containing a system curing accelerator is 2.0 N / 10 mm or more.

In the resin composition according to one embodiment of the present invention, the (A2) phosphorus curing accelerator is preferably a compound having a structure in which a phosphorus atom and an aryl group are bonded.

In the resin composition according to one embodiment of the present invention, the (A2) phosphorus-based curing accelerator is preferably a phosphonium salt.

In the resin composition according to one embodiment of the present invention, the content of the (A2) phosphorus curing accelerator is preferably 1% by mass or less based on the total solid content of the resin composition.

In the resin composition according to an aspect of the present invention, the content of the (A2) phosphorus curing accelerator is 2% by mass or less based on the total amount of the solid content of the (A) thermosetting component. preferable.

In the resin composition according to one embodiment of the present invention, it is preferable to further contain (A3) an allyl resin.

In the resin composition according to one embodiment of the present invention, it is preferable to further contain (B) a binder component.

In the resin composition according to one embodiment of the present invention, the (B) binder component is preferably a phenoxy resin.

The resin composition according to one embodiment of the present invention preferably further contains (C) an inorganic filler.

The resin composition according to one embodiment of the present invention preferably further contains (D) a coupling agent.

The resin composition according to one embodiment of the present invention is preferably used for sealing a semiconductor element or interposing between the semiconductor element and another electronic component.

The resin composition according to one embodiment of the present invention is preferably used for sealing a power semiconductor element or interposing between the power semiconductor element and another electronic component.

The resin composition according to one embodiment of the present invention seals a semiconductor element using any one or more of silicon carbide and gallium nitride, or uses any one or more of the silicon carbide and gallium nitride. It is preferably used for interposing between the conventional semiconductor element and other electronic components.

The resin sheet which concerns on 1 aspect of this invention is a resin sheet formed from the resin composition containing (A) thermosetting component, Comprising: Said (A) thermosetting component is (A1) maleimide resin, And (A2) containing a phosphorus-based curing accelerator and having a peel strength after thermosetting of 2.0 N / 10 mm or more.

The laminate according to one embodiment of the present invention includes the above-described resin sheet according to one embodiment of the present invention and a release material, and the release material includes a release agent layer containing an alkyd resin release agent. It is characterized by that.

According to one embodiment of the present invention, it is possible to provide a resin composition, a resin sheet, and a laminate that can achieve both low-temperature and short-time thermosetting conditions and peel strength after thermosetting.

It is a section schematic diagram of a layered product concerning one embodiment.

[Resin composition]
The resin composition according to the present embodiment contains (A) a thermosetting component. The (A) thermosetting component according to this embodiment contains (A1) a maleimide resin and (A2) a phosphorus-based curing accelerator. The peel strength after thermosetting of a sheet-like material having a thickness of 25 μm formed from the resin composition according to the present embodiment is 2.0 N / 10 mm or more.
In the resin composition according to the present embodiment, thermosetting under low temperature and short time thermosetting conditions is possible, and process suitability can be improved.
When the peel strength after thermosetting of a sheet material having a thickness of 25 μm formed from the resin composition according to the present embodiment is less than 2.0 N / 10 mm, when the resin composition is used as a sealing material or the like, the metal The peel strength with respect to the adherend such as the surface becomes insufficient.
The peel strength after thermosetting of the sheet-like material formed from the resin composition according to the present embodiment is adjusted, for example, by the type of component used for the resin composition (particularly, the type of phosphorus curing accelerator) and the blending amount. By doing so, it is possible to adjust to the above range.
In addition, the peel strength after thermosetting of a sheet-like material having a thickness of 25 μm formed from the resin composition according to the present embodiment is a sheet-like material in which the resin composition is formed into a sheet shape using a measurement method described later. In connection with the above, it was obtained by performing a peeling test with a peeling angle of 90 degrees between the sheet-like material after heat curing and the adherend. Specifically, a test piece was prepared and a peel test was performed as follows.
(I) Preparation method of test piece: Substrate: copper foil (size 50 mm × 10 mm, thickness 150 μm, JIS H 3100: 2018 specification)
-Resin composition thickness: 25 μm
・ Lamination machine: “V-130” manufactured by Nikko Materials
-Crimping conditions: Laminating temperature 130 ° C, ultimate pressure 100Pa, time 60 seconds-Resin composition thermosetting conditions: thermosetting temperature 180 ° C, thermosetting time 1 hour (ii) Peel test method-Equipment used: Tensile test Machine (Shimadzu Corporation "Autograph AG-IS")
・ Peeling method: The adherend is peeled off from the cured sheet.
・ Peeling speed: 50 mm / min ・ Peeling angle: 90 degrees ・ Measurement environment: 23 ° C., 50% relative humidity environment

((A) thermosetting component)
The (A) thermosetting component (hereinafter sometimes simply referred to as “component (A)”) has a property of forming a three-dimensional network when heated and firmly bonding the adherend. As described above, the (A) thermosetting component in this embodiment is (A1) a maleimide resin (hereinafter sometimes simply referred to as “(A1) component”) and (A2) a phosphorus-based curing accelerator (hereinafter, referred to as “A1”). It may be simply referred to as “component (A2)”.

(A1) Maleimide resin (A1) Maleimide resin in this embodiment will not be specifically limited if it is a maleimide resin which contains two or more maleimide groups in 1 molecule.

The (A1) maleimide resin in the present embodiment preferably includes, for example, a benzene ring, and more preferably includes a structure in which a maleimide group is linked to the benzene ring, from the viewpoint of heat resistance. In addition, the maleimide compound preferably includes two or more structures in which a maleimide group is linked to a benzene ring.

The (A1) maleimide resin in the present embodiment is a maleimide resin containing two or more maleimide groups and one or more biphenyl skeletons in one molecule (hereinafter sometimes simply referred to as “biphenyl maleimide resin”). Is preferred.

(A1) The maleimide resin in this embodiment is preferably represented by the following general formula (1) from the viewpoint of heat resistance and adhesiveness.

In the general formula (1), k is an integer of 1 or more, and the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and 1 or more and 3 or less. More preferably it is. m1 and m2 are each independently an integer of 1 or more and 6 or less, preferably an integer of 1 or more and 3 or less, and more preferably 1. n1 and n2 are each independently an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 2 or less, and more preferably 0. R ¹ and R ² are each independently an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. Several R < ¹ > is mutually the same or different. Several R < ² > is mutually the same or different.

Specific examples of the maleimide resin represented by the general formula (1) in the present embodiment include compounds represented by the following general formula (2) or the following general formula (3).

In the general formulas (2) and (3), k is the same as k in the general formula (1). In the general formula (2), n1, n2, ^{R 1} and ^{R 2} are the same as n1, n2, ^{R 1} and ^{R 2} in the general formula (1).
Examples of the maleimide resin product represented by the general formula (3) include “MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd.

In addition, the (A1) maleimide resin in this embodiment is preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule. From the viewpoint of increasing solubility in a solvent and improving sheet formability, it is preferable to have a substituent on the phenylene group. Examples of the substituent include an alkyl group such as a methyl group and an ethyl group, and an alkylene group.
In addition, the maleimide resin (A1) in this embodiment is preferably a maleimide resin having an ether bond between a maleimide group and a phenylene group from the viewpoint of sheet formability.

The maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule is represented, for example, by the following general formula (4).

In the general formula (4), R ³ to R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L ¹ is an alkylene group having 1 to 6 carbon atoms, and L ² And L ³ are each independently an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 10 carbon atoms, and p and q are each independently 0 or 1.

The maleimide resin represented by the general formula (4) in the present embodiment is specifically represented by, for example, the following general formula (5) or the following general formula (6).

In the general formulas (5) and (6), L ¹ is an alkylene group having 1 to 6 carbon atoms.
In the general formula (5), R ³ to R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Specific examples of the (A1) maleimide resin in the present embodiment include, for example, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane from the viewpoint of obtaining a cured product having high sheet formability and high heat resistance. N, N′-1,3-phenylenedimaleimide, 4-methyl-1,3-phenylenebismaleimide, polyphenylmethanemaleimide, or 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane From the viewpoint of sheet formability, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane is more preferable.

In this embodiment, the content of the component (A1) in the component (A) is based on the total solid content of the component (A) (that is, the nonvolatile content of the component (A) excluding the solvent for dilution is 100% by mass). ) Is preferably 50% by mass or more, and more preferably 55% by mass or more.

(A2) Phosphorus curing accelerator The (A2) phosphorus curing accelerator in the present embodiment is not particularly limited as long as it is a compound that contains a phosphorus atom and accelerates the polymerization reaction of (A1) maleimide resin.
Examples of the (A2) phosphorus curing accelerator in the present embodiment include alkyl phosphine compounds, aryl phosphine compounds, alkyl aryl phosphine compounds, phosphine oxide compounds, and phosphonium salts.

Specific examples of the alkylphosphine compound include trimethylphosphine, triethylphosphine, tri (n-propyl) phosphine, tri (n-butyl) phosphine, tri (n-hexyl) phosphine, tri (n-octyl) phosphine, and And tricyclohexylphosphine.

Specific examples of the aryl phosphine compound include triphenylphosphine, tri (p-tolyl) phosphine, tri (m-tolyl) phosphine, tri (o-tolyl) phosphine, tris (2,3-dimethylphenyl) phosphine, Tris (2,4-dimethylphenyl) phosphine, tris (2,5-dimethylphenyl) phosphine, tris (2,6-dimethylphenyl) phosphine, tris (3,4-dimethylphenyl) phosphine, tris (3,5- Examples thereof include dimethylphenyl) phosphine, tribenzylphosphine, bis (diphenyl) phosphinoethane, and bis (diphenyl) phosphinobutane.

Specific examples of the alkylarylphosphine compound include cyclohexyldiphenylphosphine, dicyclohexylphenylphosphine, butyldiphenylphosphine, dibutylphenylphosphine, n-octyldiphenylphosphine, and di (n-octyl) phenylphosphine.

Specific examples of the phosphine oxide compound include triethylphosphine oxide, tri (n-propyl) phosphine oxide, tri (n-butyl) phosphine oxide, tri (n-hexyl) phosphine oxide, and tri (n-octyl) phosphine oxide. , Triphenylphosphine oxide, and tris (3-hydroxypropyl) phosphine oxide.

The phosphonium salt is a salt composed of a cation represented by PR ₄ ⁺ and an anion represented by X ⁻ .
Examples of the cation represented by PR ₄ ⁺ in the phosphonium salt include tetraethylphosphonium ion, triethylbenzylphosphonium ion, tetra (n-butyl) phosphonium ion, tri (n-butyl) methylphosphonium ion, and tri (n-butyl) octylphosphonium. Ion, tri (n-butyl) hexadecylphosphonium ion, tetraphenylphosphonium ion, tri (n-butyl) allylphosphonium ion, tri (n-butyl) benzylphosphonium ion, tri (n-octyl) ethylphosphonium ion, tetrakis ( Hydroxymethyl) phosphonium ion, ethyltriphenylphosphonium ion, and the like.
Examples of the anion represented by X ⁻ in the phosphonium salt include bromide ion, chloride ion, iodide ion, o, o-diethyl phosphorodithioate ion, hydrogen hexahydrophthalate ion, sulfate ion, tetraphenylborate ion, and Examples thereof include tetrakis (4-methylphenyl) borate ion.

Specific examples of the phosphonium salt include tetraethylphosphonium bromide, triethylbenzylphosphonium chloride, tetra (n-butyl) phosphonium bromide, tetra (n-butyl) phosphonium chloride, tetra (n-butyl) phosphonium iodide, tri (n -Butyl) methylphosphonium iodide, tri (n-butyl) octylphosphonium bromide, tri (n-butyl) hexadecylphosphonium bromide, tri (n-butyl) allylphosphonium bromide, tri (n-butyl) benzylphosphonium chloride, tetra Phenylphosphonium bromide, tetra (n-butyl) phosphonium-o, o-diethyl phosphorodithioate, tetra (n-butyl) phosphonium hydrogen hexahydro Tallate, tri (n- octyl) ethyl phosphonium bromide, tetrakis (hydroxymethyl) phosphonium sulphate, ethyltriphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, and tetraphenylphosphonium tetrakis (4-methylphenyl) borate and the like.

Other (A2) phosphorus curing accelerators include tris (3-hydroxypropyl) phosphine, bisdiphenylphosphinoferrocene, and tri (n-butyl) phosphine sulfide.

In the present embodiment, (A2) the phosphorus-based curing accelerator includes a phosphorus atom and an aryl group directly from the viewpoint of increasing the peel strength of the cured product of the sheet-like product formed from the resin composition. A compound having a bonded structure is preferred.
(A2) The aryl group directly bonded to the phosphorus atom of the compound in the phosphorus-based curing accelerator is preferably a substituted or unsubstituted aryl group having 6 to 30 ring carbon atoms, and among them, a phenyl group, a tolyl group and a xylyl group Is more preferable.
Specific examples of the compound having a structure in which a phosphorus atom and a phenyl group are directly bonded include triphenylphosphine, bisdiphenylphosphinoethane, bisdiphenylphosphinobutane, cyclohexyldiphenylphosphine, triphenylphosphine oxide, tetra Examples thereof include phenylphosphonium tetraphenylborate and tetraphenylphosphonium tetrakis (4-methylphenyl) borate.
Specific examples of the compound having a structure in which a phosphorus atom and a tolyl group are directly bonded include the aforementioned tri-p-tolylphosphine.
Specific examples of the compound having a structure in which a phosphorus atom and a xylyl group are directly bonded include the aforementioned tris (2,3-dimethylphenyl) phosphine.

The phosphorus-based curing accelerator (A2) in this embodiment is preferably a phosphonium salt from the viewpoint of the peel strength and reaction temperature of the cured product of the sheet-like material formed from the resin composition.
(A2) When a phosphonium salt is used as the phosphorus-based curing accelerator, the peel strength is hardly lowered even if the amount of (A2) phosphorus-based curing accelerator is increased.

In the present embodiment, the content of the (A2) phosphorus curing accelerator in the resin composition is based on the total solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass). ) Is preferably 1% by mass or less, and more preferably 0.75% by mass or less. The content of the (A2) phosphorus curing accelerator in the resin composition is preferably 0.05% by mass or more and 0.1% by mass or more based on the total solid content of the resin composition. More preferred.
(A2) When the content of the phosphorus curing accelerator is within the above range, the above peel strength can be obtained regardless of the type of (A2) phosphorus curing accelerator.
From the same viewpoint, the content of the (A2) phosphorus curing accelerator is based on the total solid content of the component (A) (that is, when the nonvolatile content of the component (A) excluding the solvent for dilution is 100% by mass). ) Is preferably from 0.1% by mass to 2% by mass, and more preferably from 0.3% by mass to 1.5% by mass.

In this embodiment, the (A2) phosphorus-based curing accelerator in the resin composition can be used singly or in combination of two or more.

(A3) Allyl Resin The (A) thermosetting component contained in the resin composition in the present embodiment preferably further contains (A3) an allyl resin. The (A3) allyl resin (hereinafter sometimes simply referred to as “(A3) component”) is preferably liquid at room temperature. (A) When a thermosetting component contains an allyl resin, a network can be adjusted to an appropriate range after the resin composition is cured.

In the present embodiment, the mass ratio (A1 / A3) of (A1) maleimide resin to (A3) allyl resin is preferably 1.5 or more, and more preferably 4.5 or more.
If mass ratio (A1 / A3) is the said range, there exists a tendency for the storage elastic modulus E 'in 250 degreeC of the hardened | cured material of a resin composition to rise.
Moreover, if mass ratio (A1 / A3) is the said range, the heat resistance of a resin composition can be improved.
Further, if the mass ratio (A1 / A3) is in the above range, the complex viscosity η of the resin composition is appropriately adjusted, and the fluidity of the resin composition at the time of application to an adherend is secured, while the resin composition Further improvement in heat resistance after curing of the product is realized. Furthermore, if mass ratio (A1 / A3) is the said range, the bleed out of the allyl resin from a resin composition will also be suppressed. The upper limit value of the mass ratio (A1 / A3) is not particularly limited. For example, the mass ratio (A1 / A3) may be 50 or less.

The (A3) allyl resin in the present embodiment is not particularly limited as long as it is a resin having an allyl group. The (A3) allyl resin in this embodiment is preferably an allyl resin containing two or more allyl groups in one molecule, for example.
The allyl resin in the present embodiment is more preferably represented by the following general formula (7).

In the general formula (7), R ⁷ and R ⁸ are each independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, and preferably an alkyl group having 1 to 4 carbon atoms. More preferred is an alkyl group selected from the group consisting of a methyl group and an ethyl group.

Specific examples of the (A3) allyl resin in the present embodiment include diallyl bisphenol A (2,2-bis (3-allyl-4-hydroxyphenyl) propane).

As long as the (A) thermosetting component of this embodiment does not impair the object of the present invention, the thermosetting resin other than the component (A1), the curing accelerator other than the component (A2), and the component other than the component (A3) The cured resin may be contained.
The thermosetting resin other than the component (A1) may be any thermosetting resin having high heat resistance, and examples thereof include an epoxy resin, a benzoxazine resin, a cyanate resin, and a melamine resin. These thermosetting resins can be used alone or in combination of two or more.
Examples of the curing accelerator other than the component (A2) include imidazole compounds (for example, 2-ethyl-4-methylimidazole) and the like. These curing accelerators can be used alone or in combination of two or more.
Examples of the cured resin other than the component (A3) include resins such as a phenol resin and a resin having a C═C double bond other than the component (A3), and amines, acid anhydrides, and formaldehyde. . These curable resins can be used alone or in combination of two or more.
When a thermosetting resin other than the component (A1), a curing accelerator other than the component (A2), or a cured resin other than the component (A3) is used, the content of these components is the total solid content of the component (A). It is preferably 10% by mass or less, more preferably 5% by mass or less on the basis (that is, when the nonvolatile content of the component (A) excluding the diluent solvent is 100% by mass).

In the present embodiment, the content of the thermosetting component (A) in the resin composition is based on the total solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass). It is preferably 2% by mass or more and 75% by mass or less, and more preferably 5% by mass or more and 70% by mass or less. (A) Handling property of a resin composition, sheet formability, and the heat resistance of a resin sheet improve because content of a thermosetting component exists in the said range.

((B) binder component)
In the present embodiment, the resin composition preferably includes (B) a binder component (hereinafter, may be simply referred to as “(B) component”) in addition to the (A) component. When the resin composition of the present embodiment further includes (B) a binder component, film forming properties can be imparted and the resin composition can be easily formed into a sheet.
The binder component (B) of this embodiment is a resin component other than the component (A), and has a function of joining the component (A) or other components. (B) The binder component is preferably a thermoplastic resin or the like. The component (B) may have a functional group as long as it has a function of bonding the component (A) or other components. Thus, in the present invention, when the (B) binder component has a functional group, the (B) binder component can be involved in the curing of the resin composition by heat. Differentiated from curable components.
(B) The binder component can be selected from various resins, and may be an aliphatic compound or an aromatic compound. (B) The binder component is preferably at least one resin selected from the group consisting of, for example, a phenoxy resin, an acrylic resin, a methacrylic resin, a polyester resin, a urethane resin, and a polyamideimide resin. To phenoxy resin is more preferable. The polyester resin is preferably a wholly aromatic polyester resin. (B) A binder component can be used individually by 1 type or in combination of 2 or more types.

Examples of the phenoxy resin include a bisphenol A skeleton (hereinafter, bisphenol A may be referred to as “BisA”), a bisphenol F skeleton (hereinafter, bisphenol F may be referred to as “BisF”), a biphenyl skeleton, and a naphthalene skeleton. A phenoxy resin having one or more skeletons selected from the group consisting of bisphenol A skeleton and bisphenol F skeleton is more preferable.

(B) The weight average molecular weight (Mw) of the binder component is preferably from 100 to 1,000,000, preferably from 1,000 to 800,000 from the viewpoint of easily adjusting the complex viscosity of the resin composition to a desired range. More preferably, it is more preferably 10,000 or more and 100,000 or less. The weight average molecular weight in the present specification is a standard polystyrene equivalent value measured by a gel permeation chromatography (GPC) method.

In the present embodiment, the content of the binder component (B) in the resin composition is based on the total solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), It is preferably 0.1% by mass or more and 50% by mass or less, and more preferably 1% by mass or more and 40% by mass or less. By making the content of the (B) binder component in the resin composition within the above range, it becomes easy to adjust the complex viscosity of the resin composition before curing to a desired range, and the sheet formability of the resin composition and the resin Sheet handling is improved.

In the present embodiment, the content of the component (A1) is based on the total amount of the solid contents of the component (A) and the component (B) (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass). 20 mass% or more and 80 mass% or less is preferable. If content of (A1) component is 20 mass% or more, the heat resistance of a resin composition can further be improved. On the other hand, if content of (A1) component is 80 mass% or less, a resin composition can be easily shape | molded in a sheet form.

((C) inorganic filler)
In the present embodiment, the resin composition preferably includes (C) an inorganic filler (hereinafter, sometimes simply referred to as “(C) component”) in addition to the (A) component and the (B) component. The component (C) can improve at least one of the thermal characteristics and mechanical characteristics of the resin composition.
(C) As an inorganic filler, a silica filler, an alumina filler, a boron nitride filler, etc. are mentioned. Among these, silica filler is preferable.
Examples of the silica filler include fused silica and spherical silica.
(C) An inorganic filler can be used individually by 1 type or in combination of 2 or more types. Moreover, (C) the inorganic filler may be surface-treated.

(C) The average particle size of the inorganic filler is not particularly limited. (C) The average particle diameter of the inorganic filler is preferably from 0.1 nm to 100 μm, more preferably from 10 nm to 10 μm, as determined from a general particle size distribution meter. In this specification, the average particle size of the inorganic filler (C) is a value measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name “Nanotrack Wave-UT151”). To do.

The content of the inorganic filler (C) in the resin composition is 10% by mass or more and 90% by mass based on the total solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass). It is preferable that it is mass% or less, and it is more preferable that it is 20 mass% or more and 80 mass% or less.

((D) coupling agent)
In the present embodiment, the resin composition preferably further contains (D) a coupling agent in addition to the components (A) to (C).
The coupling agent preferably has a functional group that the above-described (A) thermosetting component has, or (B) a functional group that reacts with the functional group that the binder component has, and (A) the functional group that the thermosetting component has. It is more preferable to have a group that reacts with.

(D) By using the coupling agent, the peel strength between the cured product of the sheet-like material formed from the resin composition and the adherend is improved.

(D) The coupling agent is preferably a silane (silane coupling agent) because of its versatility and cost merit. (D) A coupling agent can be used individually by 1 type or in combination of 2 or more types. In addition, the coupling agent as described above is usually 0.1 parts by mass or more with respect to 100 parts by mass of the total amount of the solid content (nonvolatile content excluding the diluent solvent) of the component (A) and the component (B). It mix | blends in the ratio of 20 mass parts or less, Preferably it mix | blends in the ratio of 0.3 to 15 mass parts, More preferably, it mix | blends in the ratio of 0.5 to 10 mass parts.

As an example of the resin composition which concerns on this embodiment, the resin composition containing only (A) thermosetting component, (B) binder component, (C) inorganic filler, and (D) coupling agent is mentioned. .
Moreover, as another example of the resin composition which concerns on this embodiment, as follows, (A) thermosetting component, (B) binder component, (C) inorganic filler, (D) coupling agent, and the said Examples of the resin composition include components other than the components (A) to (D).

(Other ingredients)
In the present embodiment, the resin composition may further contain other components. Examples of other components include at least one selected from the group consisting of a crosslinking agent, pigment, dye, antifoaming agent, leveling agent, ultraviolet absorber, foaming agent, antioxidant, flame retardant, and ion scavenger. Of the ingredients.
For example, the resin composition may further contain a crosslinking agent in order to adjust initial adhesiveness before curing and cohesion.
Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds. A crosslinking agent can be used individually by 1 type or in combination of 2 or more types.

Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, and trimers of these polyvalent isocyanate compounds, and Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting these polyvalent isocyanate compounds and polyol compounds.
More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, and 1,4-xylene diene. Isocyanate, diphenylmethane-4,4′-diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4 Examples include '-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate. An organic polyvalent isocyanate compound can be used individually by 1 type or in combination of 2 or more types.

Specific examples of the organic polyvalent imine compound include, for example, N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetra And methylolmethane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine. An organic polyvalent imine compound can be used individually by 1 type or in combination of 2 or more types.

The crosslinking agent as described above is usually blended at a ratio of 0.01 parts by weight or more and 12 parts by weight or less, preferably 0.1 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the above-mentioned (B) binder component. The

The resin composition according to this embodiment is preferably used for a semiconductor element. Specifically, the resin composition according to this embodiment is preferably used for sealing a semiconductor element. Moreover, it is preferable that the resin composition which concerns on this embodiment is used for interposing between a semiconductor element and another electronic component.
The semiconductor element is preferably a power semiconductor element.
Since the resin composition according to this embodiment is excellent in heat resistance, it seals a power semiconductor element that is assumed to operate at a high temperature of 200 ° C. or higher, or is interposed between the power semiconductor element and another electronic component. Can be used.
In addition, the use of the resin composition which concerns on this embodiment is not limited to these uses.

Moreover, it is preferable that the resin composition which concerns on this embodiment is used for sealing the semiconductor element using any 1 or more types of silicon carbide and gallium nitride. Alternatively, the resin composition according to the present embodiment is preferably used for interposing between a semiconductor element using any one or more of silicon carbide and gallium nitride and another electronic component. Examples of other electronic components include a printed wiring board and a lead frame.
Since the upper limit of the operating temperature of the silicon semiconductor element is about 175 ° C., it is preferable to use a semiconductor element using at least one of silicon carbide and gallium nitride capable of high temperature operation as the power semiconductor element.
Since the resin composition according to the present embodiment is excellent in heat resistance, sealing a semiconductor element using any one or more of silicon carbide and gallium nitride assumed to operate at a high temperature of 200 ° C. or higher, or carbonizing. It can be used for interposing between a semiconductor element using any one or more of silicon and gallium nitride and another electronic component.

(Exothermic peak temperature before thermosetting)
In the resin composition according to the present embodiment, the resin composition before curing has an exothermic peak temperature of 170 ° C. or higher and 210 ° C. or lower as measured at a heating rate of 10 ° C./min by a differential scanning calorimetry (DSC) method. Preferably there is. In addition, the said exothermic peak temperature is the temperature which the exothermic peak with the largest intensity | strength shows in the DSC measurement data of the resin composition before hardening. When the exothermic peak temperature is in the above-described range, when the resin composition is cured, thermosetting at a low temperature and in a short time can be realized. Therefore, the tact time in the semiconductor manufacturing process can be effectively shortened by the short time until the resin composition is cured. In addition, when a laminated circuit is manufactured by laminating a plurality of semiconductor chips, a plurality of resin compositions existing between the semiconductor chips are added after laminating (temporarily placing) the semiconductor chips in order to improve process efficiency. It may be cured at once. Even in such a case, since the exothermic peak temperature is in the above-mentioned range, the resin composition attached to the semiconductor chip laminated at the initial stage of the process in an unintended stage such as before the completion of the lamination of the semiconductor chips. Can be cured.

In addition, the measuring method of the exothermic peak temperature by differential scanning calorimetry is as shown in the Example mentioned later.

(Thermosetting conditions)
In the thermosetting conditions in the resin composition according to this embodiment, the heating temperature is preferably 50 ° C. or higher and 200 ° C. or lower, and preferably 100 ° C. or higher and 190 ° C. or lower.
In the thermosetting conditions in the resin composition according to this embodiment, the heating time is preferably 30 minutes or longer and 2 hours or shorter, and more preferably 45 minutes or longer and 1 hour 30 minutes or shorter.
When the thermosetting conditions in the resin composition are in the above range, the resin composition can be thermoset at a low temperature and in a short time.

(Peel strength after thermosetting)
The peel strength after thermosetting of a sheet-like material having a thickness of 25 μm formed from the resin composition according to the present embodiment is 2.0 N / 10 mm or more. Further, the peel strength after thermosetting is preferably 3.0 N / 10 mm or more and 50 N / 10 mm or less, and more preferably 3.0 N / 10 mm or more and 40 N / 10 mm or less.
When the peel strength after thermosetting of the resin composition is in the above range, it is possible to maintain high adhesion to the adherend.

[Resin sheet]
The resin sheet according to the present embodiment is formed from a resin composition containing (A) a thermosetting component, and (A) the thermosetting component is (A1) a maleimide resin and (A2) a phosphorus-based curing accelerator. Containing. The (A) thermosetting component, (A1) maleimide resin, and (A2) phosphorus-based curing accelerator are the same as those described above. Moreover, at least any component selected from the group which consists of (C) inorganic filler mentioned above, (D) coupling agent, and another component may be mix | blended with the resin composition. In the resin sheet which concerns on this embodiment, thermosetting on the low temperature and short time thermosetting conditions is attained, and process suitability can be improved.
The peel strength after thermosetting of the resin sheet according to the present embodiment is 2.0 N / 10 mm or more.
When the peel strength after thermosetting of the resin sheet according to the present embodiment is less than 2.0 N / 10 mm, the peel strength for the adherend such as a metal surface is insufficient when the resin composition is used as a sealing material. Become.
The peel strength after thermosetting of the resin sheet according to the present embodiment is adjusted to the above range by adjusting, for example, the type of component used for the resin composition (particularly, the type of phosphorus-based curing accelerator) and the blending amount. can do.
In addition, the peeling strength after thermosetting of the resin sheet according to the present embodiment was determined by performing a peeling test with a peeling angle of 90 degrees between the resin sheet after thermosetting and the adherend using the measurement method described later. Sought by doing. Specifically, a test piece was prepared and a peel test was performed as follows.
(I) Preparation method of test piece: Substrate: copper foil (size 50 mm × 10 mm, thickness 150 μm, JIS H 3100: 2018 specification)
・ Lamination machine: “V-130” manufactured by Nikko Materials
-Crimping conditions: Laminating temperature 130 ° C, ultimate pressure 100Pa, time 60 seconds-Resin composition thermosetting conditions: thermosetting temperature 180 ° C, thermosetting time 1 hour (ii) Peel test method-Equipment used: Tensile test Machine (Shimadzu Corporation "Autograph AG-IS")
・ Peeling method: The adherend is peeled off from the cured sheet.
・ Peeling speed: 50 mm / min ・ Peeling angle: 90 degrees ・ Measurement environment: 23 ° C., 50% relative humidity environment Note that the thickness of the test piece is measured without changing from the thickness where the resin sheet is provided. To do.
The resin sheet according to the present embodiment obtained by forming the resin composition into a sheet is simple to apply to an adherend, and particularly easy to apply to a large-area adherend.
Since the resin composition can be formed in advance into a shape suitable for the shape after the sealing step when the resin composition is processed into a sheet shape, the resin sheet can be applied to the adherend to achieve uniformity in thickness and component ratio. It functions as a maintained sealing material. Further, if the resin composition is in the form of a sheet, it is excellent in handleability because it has no fluidity.

The method for forming the resin composition into a sheet is not particularly limited, and a conventionally known method for forming a sheet can be employed. The resin sheet according to the present embodiment may be a belt-shaped sheet or may be provided in a state of being wound in a roll shape. The resin sheet according to the present embodiment wound up in a roll shape can be used by being unwound from a roll and cut into a desired size.

For example, the thickness of the resin sheet according to this embodiment is preferably 10 μm or more, and more preferably 20 μm or more. Further, the thickness of the resin sheet according to the present embodiment is preferably 500 μm or less, more preferably 400 μm or less, and further preferably 300 μm or less.

The resin sheet according to the present embodiment is used for sealing a semiconductor element, or is interposed between the semiconductor element and another electronic component, like the resin composition according to another embodiment. It is preferable. Moreover, it is preferable that the resin sheet which concerns on this embodiment is applied collectively to a several semiconductor element. For example, if the resin composition is in the form of a sheet, the resin sheet is applied to the structure in which the semiconductor elements are arranged for each gap of the frame provided with a plurality of gaps, and the frame and the semiconductor elements are collectively It can be used for a so-called panel level package for sealing.
In addition, the use of the resin sheet which concerns on this embodiment is not limited to these uses.

[Laminate]
FIG. 1 shows a schematic cross-sectional view of a laminate 1 according to this embodiment.
The laminate 1 of the present embodiment includes a first release material 2, a second release material 4, and a resin sheet 3 provided between the first release material 2 and the second release material 4. The resin sheet 3 is a resin sheet according to the present embodiment.

The first release material 2 and the second release material 4 have releasability, and there is a difference between the release force of the first release material 2 on the resin sheet 3 and the release force of the second release material 4 on the resin sheet 3. It is preferable. The material of the first release material 2 and the second release material 4 is not particularly limited. The ratio (P2 / P1) of the peeling force P2 of the second peeling material 4 to the peeling force P1 of the first peeling material 2 is preferably 0.02 ≦ P2 / P1 <1 or 1 <P2 / P1 ≦ 50. .

The first release material 2 and the second release material 4 may be, for example, a member having a release property, a member subjected to a release treatment, or a member having a release agent layer laminated thereon. Good. In the case where the first release material 2 and the second release material 4 are not subjected to the release treatment, examples of the material of the first release material 2 and the second release material 4 include an olefin resin and a fluorine resin. Can be mentioned.
The first release material 2 and the second release material 4 can be a release material including a release substrate and a release agent layer formed by applying a release agent on the release substrate. A release material comprising a release substrate and a release agent layer is easy to handle. Moreover, the 1st peeling material 2 and the 2nd peeling material 4 may be equipped with the releasing agent layer only on the single side | surface of the peeling base material, and may be equipped with the peeling agent layer on both surfaces of the peeling base material.

Examples of the peeling base material include a paper base material, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper base material, and a plastic film. Examples of the paper substrate include glassine paper, coated paper, and cast coated paper. Examples of the plastic film include polyester films (for example, polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate), polyolefin films (for example, polypropylene, polyethylene, and the like), and the like. Among these, a polyester film is preferable.

Examples of the release agent include a silicone-based release agent composed of a silicone resin; a long-chain alkyl group-containing compound-based release agent composed of a compound containing a long-chain alkyl group such as polyvinyl carbamate and an alkylurea derivative; alkyd Alkyd resin-based release agents composed of resins (for example, non-convertible alkyd resins and convertible alkyd resins); olefin resins (for example, polyethylene (for example, high density polyethylene, low density polyethylene, and linear low density) Polyethylene, etc.), propylene homopolymers having an isotactic structure or syndiotactic structure, and crystalline polypropylene resins such as propylene-α-olefin copolymers, etc.); , And synthetic rubber (eg, butadiene rubber, isoprene) Rubber release agent composed of rubber such as styrene-butadiene rubber, methyl methacrylate-butadiene rubber, and acrylonitrile-butadiene rubber; and acrylic resin such as (meth) acrylate copolymer Various release agents such as an acrylic resin release agent are listed. These release agents can be used alone or in combination of two or more. Of these release agents, alkyd resin release agents are preferred. In particular, when a phenoxy resin is used as the (B) binder component of the resin composition included in the resin sheet 3, when a general silicone release agent is used, the release material is not intended and the resin sheet 3 is not used. Therefore, it is preferable to use an alkyd resin release agent.

The thickness of the first release material 2 and the second release material 4 is not particularly limited. The thicknesses of the first release material 2 and the second release material 4 are usually 1 μm or more and 500 μm or less, and preferably 3 μm or more and 100 μm or less.
The thickness of the release agent layer is not particularly limited. When a release agent layer is formed by applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less.

The manufacturing method of the laminated body 1 is not specifically limited. For example, the laminated body 1 is manufactured through the following processes. First, a resin composition is applied on the first release material 2 to form a coating film. Next, this coating film is dried to form the resin sheet 3. Next, the laminated body 1 is obtained by bonding the resin sheet 3 and the second release material 4 at room temperature.

[Effect of the embodiment]
According to the resin composition, resin sheet, and laminate of the present embodiment, both low temperature and short time thermosetting conditions and peel strength after thermosetting can be achieved.

As described above, the resin composition according to this embodiment can be suitably used for a power semiconductor element. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a power semiconductor element. The power semiconductor element is also assumed to operate at a high temperature of 200 ° C. or higher. A material used for a semiconductor device having a power semiconductor element is required to have heat resistance. Since the resin composition and the resin sheet according to the present embodiment are excellent in heat resistance, they are used to cover the power semiconductor element in the semiconductor device or to be interposed between the power semiconductor element and other components. Is preferably used.

As described above, the resin composition according to the present embodiment can be suitably used for a semiconductor element using any one or more of silicon carbide and gallium nitride. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a semiconductor element using at least one of silicon carbide and gallium nitride. Since a semiconductor element using at least one of silicon carbide and gallium nitride has characteristics different from those of a silicon semiconductor element, a power semiconductor element, a high-power device for a base station, a sensor, a detector, a Schottky barrier diode, etc. It is preferably used for In these applications, attention is also paid to the heat resistance of the semiconductor element using any one or more of silicon carbide and gallium nitride, and the resin composition and resin sheet of the present embodiment are excellent in heat resistance. It is preferably used in combination with a semiconductor element using at least one of silicon carbide and gallium nitride.

[Modification of Embodiment]
The present invention is not limited to the above-described embodiment, and modifications and improvements as long as the object of the present invention can be achieved are included in the present invention.

In the said embodiment, although the laminated body which has the 1st peeling material, the 2nd peeling material, and the resin sheet provided between the 1st peeling material and the 2nd peeling material was demonstrated, this invention is such It is not limited to the laminated body of a various aspect. As another aspect, for example, a laminate having a resin sheet and a release material provided only on one surface of the resin sheet may be used.

In the embodiment of the semiconductor device, the semiconductor sealing application has been described. However, the resin composition and the resin sheet of the present invention can be used in addition to insulating materials for circuit boards (for example, hard printed wiring board materials, flexible wirings). Substrate materials, build-up substrate interlayer insulating materials, etc.), build-up adhesive films, adhesives, and the like. Applications of the resin composition and the resin sheet of the present invention are not limited to these applications.

Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to these examples.

[Preparation of resin composition]
Resin compositions according to Examples 1 to 6 and Comparative Examples 1 to 7 were prepared at a blending ratio (mass% (solid content conversion ratio)) shown in Table 1.
The materials used for the preparation of the resin composition are as follows.

(Thermosetting component)
Maleimide resin: Maleimide resin having a biphenyl group (maleimide resin represented by the general formula (3), “MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd.)
Curing accelerator-1: Tetraphenylphosphonium tetrakis (4-methylphenyl) borate (“TPP-MK” and “TPP-MK” manufactured by Hokuko Chemical Co., Ltd. are registered trademarks)
Curing accelerator-2: Triphenylphosphine ("Hokuko TPP" and "Hokuko TPP" manufactured by Hokuko Chemical Co., Ltd. are registered trademarks)
Curing accelerator-3: Tetrabutylphosphonium hydrogen hexahydrophthalate (“TBP-3S” manufactured by Hokuko Chemical Co., Ltd.)
Curing accelerator-4: 2-ethyl-4-methylimidazole (“2E4MZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.)
Allyl resin: diallyl bisphenol A ("DABPA" manufactured by Daiwa Kasei Kogyo Co., Ltd.)

(Binder component)
Binder resin: BisA / BisF mixed type phenoxy resin (“ZX-1356-2” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., weight average molecular weight 65,000)

(Inorganic filler)
Silica filler: fused silica (epoxysilane modification, average particle size 0.5 μm, maximum particle size 2.0 μm)

(Coupling agent)
・ Coupling agent: 3-glycidoxypropyltriethoxysilane

<Evaluation of resin composition before thermosetting>
[Production of laminate including resin sheet]
Coating prepared by dissolving resin varnish (resin composition in methyl ethyl ketone) with a die coater on the first release material (polyethylene terephthalate film provided with a release layer formed from an alkyd resin release agent, thickness 38 μm) The solution and the solid content concentration were changed in the range of 51% by mass to 62% by mass in each example and comparative example.) And applied, and dried in a drying oven at 100 ° C. for 2 minutes. The thickness of the resin composition after drying was 25 μm. Immediately after taking out the first release material and the resin composition from the drying furnace, the dried resin composition and the second release material (polyethylene terephthalate film provided with a release layer formed from a silicone-based release agent, thickness 38 μm) And a first release material, a resin sheet made of a resin composition, and a second release material were laminated in this order.

[Measurement of exothermic peak temperature by differential scanning calorimetry (DSC) method]
Two of the obtained resin sheets were laminated to produce a resin sheet laminate having a thickness of 50 μm. Further, two of the resin sheet laminates were laminated to produce a 100 μm resin sheet laminate. By repeating this procedure, a measurement sample having a thickness of 200 μm was produced. Using the differential scanning calorimeter (“DSC (Q2000)” manufactured by TA Instruments Co., Ltd.), the measurement sample thus obtained was measured in the temperature range from 50 ° C. to 400 ° C. at a temperature rising rate of 10 ° C./min. The exothermic peak temperature was determined from the DSC curve obtained by the implementation. The obtained results are shown in Table 1.

<Evaluation of resin composition after thermosetting>
[Production of laminate including resin sheet]
A laminate was produced in the same manner as the laminate production method described in the item of evaluation of the resin composition before thermosetting.

[Measurement of peel strength]
One surface of the resin sheet in the obtained laminate was bonded to a wafer piece (thickness 800 μm) obtained by previously cutting a 6-inch Si wafer into four equal parts by pressure-bonding under reduced pressure under the following bonding conditions.
<Bonding conditions>
Laminating apparatus: “V-130” manufactured by Nikko Materials, Inc .;
Pressure bonding conditions: Laminating temperature 130 ° C., ultimate pressure 100 Pa, time 60 seconds

Subsequently, a copper foil (size 50 mm × 10 mm, thickness 150 μm, JIS H 3100 specification) was bonded to the other surface of the resin sheet by pressure-bonding under the same conditions as the above <bonding conditions>. In addition, the 1st peeling material and 2nd peeling material of the resin sheet in a laminated body peeled, before affixing on a Si wafer and a copper plate, respectively. Thereafter, the resin composition was cured under the thermosetting conditions shown in Table 1 to prepare a sample. About this sample, using a tensile tester (“Autograph AG-IS” manufactured by Shimadzu Corporation), the copper foil was peeled off from the cured resin sheet under the conditions of a peeling speed of 50 mm / min and a peeling angle of 90 degrees. The peel strength (unit: N / 10 mm) between the copper foil and the cured resin sheet was measured. The measurement was performed in an environment of 25 ° C. and a relative humidity of 50%. The obtained results are shown in Table 1. Since Comparative Example 1 did not adhere under the heat curing conditions of 180 ° C. for 1 hour, it was cured under the heat curing conditions of 200 ° C. for 4 hours. In Comparative Examples 2, 4, 6 and 7, the peel strength between the cured resin and the copper foil was so low that it could not be measured.

It was confirmed that the resin compositions according to Examples 1 to 6 can achieve both low-temperature and short-time thermosetting conditions and peel strength after thermosetting as compared with the resin compositions according to Comparative Examples 1 to 7.

1 ... laminate, 2 ... first release material, 3 ... resin sheet, 4 ... second release material.

Claims (15)

(A) a resin composition containing a thermosetting component,
The (A) thermosetting component contains (A1) maleimide resin, and (A2) a phosphorus-based curing accelerator,
A resin composition, wherein a 25 μm-thick sheet-like product formed from the resin composition has a peel strength after thermosetting of 2.0 N / 10 mm or more. In the resin composition of claim 1,
The (A2) phosphorus curing accelerator is a compound having a structure in which a phosphorus atom and an aryl group are bonded. In the resin composition according to claim 1 or 2,
The resin composition, wherein the (A2) phosphorus curing accelerator is a phosphonium salt. In the resin composition according to any one of claims 1 to 3,
Content of said (A2) phosphorus hardening accelerator is 1 mass% or less on the basis of the total amount of solid content of the resin composition. In the resin composition according to any one of claims 1 to 3,
Content of said (A2) phosphorus hardening accelerator is 2 mass% or less on the basis of the total amount of solid content of said (A) thermosetting component. Resin composition characterized by the above-mentioned. In the resin composition according to any one of claims 1 to 5,
Furthermore, (A3) allyl resin is contained. The resin composition characterized by the above-mentioned. In the resin composition according to any one of claims 1 to 6,
Furthermore, (B) a binder component is contained. The resin composition characterized by the above-mentioned. The resin composition according to claim 7,
The (B) binder component is a phenoxy resin. In the resin composition according to any one of claims 1 to 8,
Furthermore, (C) An inorganic filler is contained. The resin composition characterized by the above-mentioned. In the resin composition according to any one of claims 1 to 9,
Furthermore, (D) a coupling agent is contained. The resin composition characterized by the above-mentioned. In the resin composition according to any one of claims 1 to 10,
A resin composition, which is used for sealing a semiconductor element or interposing between the semiconductor element and another electronic component. In the resin composition according to any one of claims 1 to 11,
A resin composition, which is used for sealing a power semiconductor element or interposing between the power semiconductor element and another electronic component. In the resin composition according to any one of claims 1 to 11,
Sealing a semiconductor element using any one or more of silicon carbide and gallium nitride, or between a semiconductor element using any one or more of silicon carbide and gallium nitride and another electronic component; A resin composition characterized by being used for interposition. (A) a resin sheet formed from a resin composition containing a thermosetting component,
The (A) thermosetting component contains (A1) maleimide resin, and (A2) a phosphorus-based curing accelerator,
A resin sheet having a peel strength after thermosetting of 2.0 N / 10 mm or more. The resin sheet according to claim 14 and a release material,
The release material has a release agent layer containing an alkyd resin release agent.

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