WO2019132090A1 - Hot stamping mold apparatus - Google Patents

Abstract

Proposed is a hot stamping mold apparatus having subassemblies each being configured such that a plurality of plates adjacently arranged in surface contact with each other. A first cooling channel is provided extending along the contact surfaces of adjacent plates by forming grooves corresponding to each other on the contact surfaces of the adjacent plates. At least one of the subassemblies is provided with a second cooling channel extending longitudinally through a corresponding subassembly.

Description

Hot stamping mold device

The present invention relates to a hot stamping mold apparatus, particularly to a hot stamping mold apparatus having excellent cooling performance.

Recently, weight reduction and strengthening of vehicle parts have become the biggest issues due to fuel efficiency regulations and safety regulations. As a result, the application of hot stamping parts has been greatly expanded in domestic and overseas vehicle manufacturing industry. Hot stamping has been introduced in British Patent No. 1490535.

Hot stamping is characterized in that a steel sheet is heated at a temperature not lower than the austenitizing temperature, for example, 900 占 폚 or higher, and then press-formed and simultaneously quenched to produce a high-strength steel component. Due to the high-temperature heating of the steel sheet, a steel plate coated with Al or Zn is used to prevent oxidation. An example of an Al-coated steel sheet is the Usibor 1500 based on Boron steel 22MnB5.

Product and quality are of great interest in the manufacture of automotive components by hot stamping. As a method for improving the productivity of the hot stamping process, US Pat. No. 9,631,248 proposed a heating furnace in which an induction furnace is mixed with an electric furnace. One of the major factors affecting the quality of hot stamping parts is the cooling performance of the mold.

As shown in FIG. 1, the conventional hot stamping mold 500 is manufactured by assembling a plurality of subassemblies 502 having molding surfaces 504. The cooling channel 506 of the mold 500 may be provided by machining a plurality of holes longitudinally in the subassemblies 502 by gun drilling. The shorter the distance between the molding surface 504 and the cooling channel 506 is, the better the cooling performance. However, since the mold 500 has a three-dimensional complex shape, it is not easy to shorten the distance.

SUMMARY OF THE INVENTION The present invention is based on the recognition of the prior art as described above, and aims to provide an improved hot stamping mold apparatus having excellent cooling performance.

Another object of the present invention is to provide a hot stamping mold apparatus capable of uniformly and effectively cooling a molding surface of a mold even if the molded product to be manufactured has a complicated shape and correspondingly complicates the molding surface shape of the mold.

The problems to be solved by the present invention are not necessarily limited to those described above, and other tasks not mentioned in the present invention may be understood by the following.

According to an aspect of the present invention, there is provided a hot stamping mold apparatus comprising: a first mold having a first molding surface; And a second mold having a second molding surface corresponding to the first molding surface, wherein the first and second molds each have a plurality of subassemblies coupled to each other.

According to the present invention, the sub-assemblies may be constructed by stacking a plurality of plates and sequentially superimposing them on a face-to-face basis. A first cooling channel extending along the overlapping surfaces may be provided by forming grooves corresponding to each other on the overlapping surfaces of the plates adjacent to each other.

According to the present invention, at least one of the subassemblies is provided with a second cooling channel penetrating the subassembly in the longitudinal direction, and the second cooling channel is formed between the molding surface of the subassembly and the first cooling channel .

According to the present invention, when the first and second molds are assembled, the first overlapping surfaces between the sub-assemblies constituting the first mold and the second overlapping surfaces between the sub-assemblies constituting the second mold are aligned .

According to the present invention, at least one of the first and second molds includes an array of first sub-assemblies in which the plates are arranged in the longitudinal direction of the mold, and a second sub-assembly arrangement in which the plates are arranged in the width direction of the mold .

According to the present invention as described above, it is possible to form a cooling channel in the form of a bend or a shape of the forming surface close to the forming surface. The cooling performance of the mold is improved.

Further, according to the present invention, even if the molded product has a complicated shape and the mold surface shape of the mold is correspondingly complicated, the mold surface of the mold can be uniformly and effectively cooled.

FIG. 1 is a drawing showing an example of a conventional hot stamping mold,

2 is a view showing a hot stamping mold according to an embodiment of the present invention,

3 is a view showing a mold plate according to an embodiment of the present invention,

4 is a view illustrating an example of a subassembly comprising mold plates according to an embodiment of the present invention.

5 illustrates a cooling channel structure within a subassembly according to an embodiment of the present invention;

6 is a view showing a hot stamping mold according to another embodiment of the present invention;

7A and 7B are views for explaining a hot stamping mold apparatus according to an embodiment of the present invention,

FIG. 8 illustrates a sub-assembly according to another embodiment of the present invention; FIG.

9 is a view showing an example of mold plates constituting the subassembly as shown in FIG. 9,

10 is a view showing a mold plate according to another embodiment of the present invention,

11 is a view showing a mold plate according to another embodiment of the present invention,

12 is a view showing a structure of a cooling channel in a case where a subassembly is formed using the mold plates as shown in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or equivalent components or parts are denoted by the same reference numerals as much as possible for convenience of description, and the drawings are exaggerated and schematically shown for clarity and explanation of the features of the present invention. have.

In the description of the present invention, unless the second element is disposed on the first element or " connected " to each other, unless otherwise specified, it is to be understood that both elements are directly contacted or connected with each other, To allow the first and second elements to relate to each other. Directional expressions such as forward, backward, left and right, and up and down are merely for convenience of explanation.

FIG. 2 shows a mold 10 according to an embodiment. Referring to FIG. 2, the mold 10 is composed of four subassemblies 11a, 11b, 11c, and 11d. The upper surface of each subassembly 11 forms a forming surface F for imparting a shape to the part and the lower part can be fixed by a clamp C. [ Each subassembly 11 is composed of a plurality of plates.

Referring to FIG. 3, a groove constituting the cooling channel 23 is formed on one surface 21 of the plate 20. O-rings (not shown) are inserted into the sealing grooves 24 for sealing the cooling channels 23 along both widthwise edges of the grooves. It is preferable that the cooling channel 23 is formed as close as possible to the molding surface F. Since the groove is formed on the surface of the plate 20, the cooling channel can be formed close to the molding surface even if the molding surface F has a complicated shape. The cooling channel 23 may be supplied at the right inlet along the face of the plate () and discharged to the left outlet.

Referring to FIG. 4, the subassembly 11 is manufactured by stacking a plurality of plates 20 and sequentially superimposing them on a face-to-face basis. Between each of the plates 20, a fixing member for assembling them may be provided, and the upper surface of each plate 20 forms a molding surface F. Grooves corresponding to each other are formed on the overlapping surfaces between the adjacent plates 20 so as to form a circular cooling channel 23.

The two plates 20a and 20e arranged at the outermost out of the five plates superimposed one after another in Fig. 4 have only one overlapping surface with the adjacent plate. These plates 20a and 20e have grooves formed on only one side. The remaining three plates 20b, 20c and 20d are formed with grooves on both sides. The surface of the plat 20e indicated by 21 in Fig. 4 is a surface in contact with the other subassembly, and the cooling channel 23 is not formed here. The cooling channels 23 may not be formed on both side surfaces of the subassembly 11 in consideration of the assembling convenience between the subassemblies 11 and the sealing of the cooling channels 23. [

Figure 5 shows the cooling channel () inside the subassembly 11. The subassembly 11 is fixed to a base (not shown) of the mold apparatus, and a flow path for supplying cooling water to the base through the cooling channel () is provided. The cooling water supplied through the supply flow path 101 flows along the cooling channel () provided on the surface of the plate 20, and then is discharged to the discharge flow path 102. The inlet and outlet of the cooling channel () may be provided on the overlapping surfaces between the plates 20, respectively.

Fig. 6 shows a mold according to another embodiment. Referring to FIG. 6, four subassemblies 11a, 11b, 11c, and 11d form an array of first subassemblies arranged in the longitudinal direction of the mold, and three subassemblies 12a and 12b12c form an array of first subassemblies A second subassembly arrangement arranged in the width direction. Since the cooling channels 23 are not formed on both side surfaces of the sub-assembly 11, when the sub-assemblies are arranged in only one direction, the contact areas between the sub-assemblies 11 are regularly arranged, . ≪ / RTI >

7A shows a hot stamping mold apparatus according to an embodiment. As shown in FIG. 7A, the first overlapping surface between the sub-assemblies 1a, 2a, 3a, 4a and 5a constituting the upper molds is the sub-assemblies 1b, 2b, 3b, 4b, 5b, the cooling performance of the portions indicated by X and Y in the figure is lowered.

7B shows a hot stamping mold apparatus according to another embodiment. 7b, the first overlapping surface between the sub-assemblies 1a, 2a, 3a, 4a, 5a and 6a constituting the upper molds is the sub-assemblies 1b, 2b, 3b, 4b, and 5b but are not aligned with each other. There is no regular cooling deterioration part as in the example of Fig. 7A.

8 shows a subassembly 13 according to another embodiment. An inlet 23a of the cooling channel is provided on one side of the subassembly 13 and an outlet 23b is provided on the other side of the subassembly 13. The cooling water flows through the plates 20. Grooves constituting the cooling channel () are formed on the overlapping surfaces between the plates (20) as in the previous embodiment. A connection hole (see FIG. 9) is provided on the plate so that the cooling channel 23 formed on one side of the plate can be connected to the cooling channel 23 formed on the other side of the plate.

FIG. 9 shows the plates 20 and the subassembly 13 shown in FIG.

Referring to FIG. 9, a cooling channel is not formed on one surface 21 of the first plate 20a, and a cooling channel is formed on the other surface. One surface of the second plate 20b is superimposed on the other surface of the first plate 20a. A cooling channel having a shape corresponding to a cooling channel formed on one surface 21 of the second plate 20b is formed on the other surface of the first plate 20a. The second plate 20b 'is provided with a through hole so that the cooling water flowing through the cooling channel formed on one surface 21 of the second plate 20b' can be supplied to the third plate 20c '. One surface of the third plate 20c 'is superimposed on the other surface of the second plate 20b'. On the other surface of the second plate 20b ', a cooling channel having a shape corresponding to the cooling channel formed on one surface of the third plate 20c' is formed. The third plate (20c ') is also provided with a through hole so that cooling water can be supplied to the fourth plate (20d') side.

Referring to Fig. 10, the protrusion 35 may be formed on the molding surface side of the plate 30. Fig. In this case, to form the cooling channel 33 along the molding surface as much as possible, a bent cooling channel such as indicated by 35a may be formed. However, in the case where the cooling channel 35a which is slightly bent is formed in this way, the flow of the cooling water is not good and a portion which is not sufficiently cooled around the bent cooling channel 35a is generated. Reference numeral 34 denotes an O-ring groove.

11 and 12, when there is a portion of the subassembly that is not easily cooled, such as the protrusion 35 in the longitudinal direction, the subassembly may be provided with a second cooling channel 36 ) May be provided. A second cooling channel (36) is disposed between the molding surface of the subassembly and the first cooling channel (33).

While the invention has been shown and described with respect to the specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit of the invention as set forth in the following claims.

Claims (3)

A first mold having a first molding surface; And And a second mold having a second molding surface corresponding to the first molding surface, Wherein the first and second molds have a plurality of subassemblies coupled to each other, Wherein the subassemblies are constructed by stacking a plurality of plates and successively face-to-face overlapping, wherein a first cooling channel is provided extending along the overlapping surfaces by forming grooves corresponding to each other on overlapping faces of adjacent plates, At least one of the subassemblies is provided with a second cooling channel penetrating the subassembly in the longitudinal direction and the second cooling channel is disposed between the forming surface of the subassembly and the first cooling channel To the hot stamping mold apparatus. The method according to claim 1, wherein when the first and second molds are assembled, the first overlapping surfaces between the subassemblies constituting the first mold and the second overlapping surfaces between the subassemblies constituting the second mold are aligned The hot stamping mold apparatus comprising: The method of claim 1, wherein at least one of the first and second molds comprises an array of first subassemblies in which the plates are arranged in the longitudinal direction of the mold, and a second subassembly arrangement in which the plates are arranged in the width direction of the mold Wherein the hot stamping mold apparatus comprises:

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