WO2019130519A1 - Placing device - Google Patents

Abstract

This placing device is provided with: a placing unit that places a member on a substrate; a moving device that moves the placing unit with respect to the substrate; and a control device that controls operations of the moving device and the placing unit. In the cases of aligning the placing unit by moving the placing unit toward the substrate, the control device moves the placing unit at a first deceleration rate by means of the moving device, then, aligns the placing unit by moving the placing unit at a second deceleration rate that is higher than the first deceleration rate, and in the cases of separating the placing unit after placing the member on the substrate, the control device moves the placing unit at a first acceleration rate by means of the moving device, then, moves, by means of the moving device, the placing unit at a second acceleration rate that is higher than the first acceleration rate. The second deceleration rate and the first acceleration rate can be separately set.

Description

Mounting device

The technology disclosed in the present specification relates to a mounting apparatus.

According to Patent Document 1 (Japanese Patent Laid-Open No. 2006-261367), a mounting unit for mounting a member on a substrate, a moving device for moving the mounting unit with respect to the substrate, and operations of the moving device and the mounting unit And a control device for controlling When the control device places the member on the substrate and then separates the placement portion, the control device causes the moving device to move the placement portion at the first acceleration, and then causes the second acceleration to be larger than the first acceleration. Move with acceleration.

In the mounting device of Patent Document 1, when the mounting portion is separated after mounting the member on the substrate, the operation is started with the first acceleration smaller than the second acceleration, whereby the substrate is mounted on the substrate. It is prevented that the placed member deviates from the placed position. However, in the mounting apparatus of Patent Document 1, although the positional deviation in the case of moving the mounting part from the substrate is considered, the positional deviation in the case of moving the mounting part toward the substrate and positioning is considered. Because the loading unit is not installed, there is a possibility that the loading unit can not be loaded at a desired position. The present specification provides a technique capable of mounting a member at a desired position on a substrate.

The mounting apparatus disclosed in the present specification mounts a member on a substrate. The mounting apparatus includes a mounting unit for mounting the member on a substrate, a moving device for moving the mounting unit with respect to the substrate, and a control device for controlling operations of the moving device and the mounting unit. And. When the control unit moves the placement unit toward the substrate and positions the placement unit, the control unit causes the movement unit to move the placement unit at a first deceleration, and then performs the first deceleration. In the case where the positioning unit is moved by a large second deceleration and positioned, and the mounting unit is separated after mounting the member on the substrate, the mounting unit is moved by the moving device with a first acceleration. It is moved and then moved at a second acceleration that is larger than the first acceleration. The second deceleration and the first acceleration can be set individually.

According to the above configuration, when the control unit moves the mounting unit toward the substrate and positions it, the control unit moves the mounting unit at the first deceleration, and then performs the first deceleration more than the first deceleration. Move and position at a large second deceleration. That is, when the placement unit approaches the substrate the most, the placement unit moves at a second deceleration larger than the first deceleration. Therefore, in the state in which the placement unit is moving at the first deceleration, the placement unit can be properly positioned relative to the substrate as compared to the case where the placement unit is positioned on the substrate. By appropriately positioning the mounting portion with respect to the substrate, the member can be mounted at a desired position on the substrate. Further, in the case where the control unit places the member on the substrate and then separates the mounting unit, the control unit moves the mounting unit with the first acceleration, and thereafter, performs the second larger than the first acceleration. Move with acceleration. Therefore, when the mounting unit is moved and positioned toward the substrate, the mounting unit can be positioned at a desired position, and the mounting unit can be separated after mounting the member on the substrate. In this case, displacement of the position of the member on the substrate is prevented. In addition, by providing a period for moving the placement unit using the relatively large first deceleration and second acceleration, the time required for placing a member on the substrate can be shortened. .

It is a side view which represents the structure of a component mounting machine typically. It is a block diagram showing composition of a control system of a component mounting machine. It is a flowchart figure of trial processing performed by a component mounting machine. It is a flowchart figure of the mounting process performed by a component mounting machine. It is a figure which shows the speed of the adsorption nozzle at the time of trial process and mounting process. It is a figure which shows the adsorption nozzle before descent | fall in order to adsorb | suck the electronic component on components feeder. It is a figure which shows the adsorption nozzle before raising after adsorb | sucking the electronic component on components feeder. It is a figure which shows the adsorption nozzle before descent | fall in order to mount an electronic component in a board | substrate. It is a figure which shows the adsorption | suction nozzle before raising after mounting an electronic component in a board | substrate.

In the mounting apparatus disclosed herein, the memory of the control device may store in advance a first deceleration, a second deceleration, a first acceleration, and a second acceleration. In this case, the second deceleration and the first acceleration may be set based on the receiver information associated with the receiver and the member information associated with the member.

In the mounting apparatus disclosed herein, the memory of the control device may store in advance a first deceleration, a second deceleration, a first acceleration, and a second acceleration. In this case, the control device is configured to be able to adjust the second deceleration and the first acceleration based on the result of operating the moving device using the second deceleration and the first acceleration. It may be

In the mounting apparatus disclosed in the present specification, the control device performs a second process based on a trial process of trying to mount the member on the substrate and a placement state of the member on the substrate in the trial process. An adjusting step of adjusting the deceleration and the first acceleration may be configured to be executable. In the trial process, the mounting portion is moved and positioned toward the substrate using the first deceleration and the second deceleration, and the operation of the mounting portion is controlled to mount the member on the substrate. The placement portion may be spaced apart from the substrate using the first acceleration and the second acceleration.

In the mounting device disclosed in the present specification, the control device repeatedly executes the member mounting step, and adjusts the second deceleration and the first acceleration based on the mounting state stored in the memory. The adjustment process may be configured to be executable. In the member mounting step, the mounting portion is moved and positioned toward the substrate using the first deceleration and the second deceleration, and the operation of the mounting portion is controlled to move the member onto the substrate. The first acceleration and the second acceleration may be used to separate the mounting portion from the substrate, and the mounting state of the member on the mounted substrate may be stored in the memory.

(Example)
The component mounter 10 will be described with reference to FIGS. 1 and 2. The component mounter 10 is a device for mounting the electronic component 4 on the substrate 2. The component mounter 10 is also called a surface mounter or a chip mounter. Generally, the component mounting machine 10 is juxtaposed with a solder printer, other component mounting machines and a board inspection machine to constitute a series of mounting lines.

As shown in FIG. 1, the component mounter 10 includes a plurality of component feeders 12, a feeder holding unit 14, an upper surface imaging camera 16, a lower surface imaging camera 18, a transfer head 20, a transfer head 20 and an upper surface. A moving mechanism 22 for moving the imaging camera 16, a substrate conveyor 24, an operation panel 26, and a control device 30 are provided.

Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding unit 14 and supplies the electronic component 4 to the transfer head 20. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder for storing a plurality of electronic components 4 on a wound tape, a tray-type feeder for storing a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. May be any of the bulk type feeders that accommodates at random.

The moving mechanism 22 moves the transfer head 20 and the top imaging camera 16 between the upper side of the component feeder 12 and the upper side of the substrate 2. The moving mechanism 22 of the present embodiment is an XY robot that moves the moving base 22 a in the X-axis direction and the Y-axis direction. The moving mechanism 22 includes a guide rail for guiding the moving base 22a, a moving mechanism for moving the moving base 22a along the guide rail, a motor for driving the moving mechanism, and the like. The moving mechanism 22 is disposed above the component feeder 12 and the substrate 2. The transfer head 20 and the top imaging camera 16 are attached to the movement base 22a. The transfer head 20 and the top imaging camera 16 are moved by the movement mechanism 22 from above the component feeder 12 to above the substrate 2.

The transfer head 20 is provided with a suction nozzle 6 for suctioning the electronic component 4. The suction nozzle 6 is attachable to and detachable from the transfer head 20. The suction nozzle 6 is attached to the transfer head 20 so as to be movable in the Z-axis direction (vertical direction in the drawing). The suction nozzle 6 is vertically moved up and down by an actuator (not shown) accommodated in the transfer head 20 and is configured to be able to suction the electronic component 4. In order to mount the electronic component 4 on the substrate 2 by the transfer head 20, first, the suction nozzle 6 is lowered until the suction surface (lower surface) 6a of the suction nozzle 6 abuts on the electronic component 4 housed in the component feeder 12. Move to Then, the electronic component 4 is adsorbed to the suction nozzle 6 and the suction nozzle 6 is moved upward. Next, the transfer head 20 is positioned relative to the substrate 2 by the moving mechanism 22. Then, the suction nozzle 6 is lowered toward the substrate 2 to mount the electronic component 4 on the substrate 2. In the component mounter 10, a nozzle station (not shown) in which a plurality of suction nozzles 6 of different types are mounted is disposed.

The top imaging camera 16 is attached to the moving base 22a. The upper surface imaging camera 16 images the upper surface of the substrate 2. The lower surface imaging camera 18 is disposed between the feeder holding unit 14 and the substrate conveyor 24. The lower surface imaging camera 18 images the electronic component 4 in a state of being sucked by the suction nozzle 6.

The substrate conveyor 24 is a device for carrying the substrate 2 into the component mounter 10, positioning the component 2 into the component mounter 10, and carrying out the component mounter 10. The substrate conveyor 24 of this embodiment may be constituted by, for example, a pair of belt conveyors, a supporting device (not shown) attached to the belt conveyor and supporting the substrate 2 from below, and a driving device for driving the belt conveyor. it can. The operation panel 26 is an input device that receives an instruction from the operator, and is also a display device that displays various types of information to the operator.

The control device 30 is configured using a computer provided with a CPU, a ROM, and a RAM. As shown in FIG. 2, in the control device 30, the suction nozzle 6, the component feeder 12, the transfer head 20, the moving mechanism 22, the upper surface imaging camera 16, the lower surface imaging camera 18, and the operation panel 26. , Are communicably connected. Control device 30 includes memory 32. The control device 30 executes trial processing (FIG. 3), mounting processing (FIG. 4) and the like described later according to the program 34 stored in the memory 32. Further, the mounting table 36 is stored in the memory 32. The mounting table 36 is configured of a first table 36 a and a second table 36 b. The first table 36 a is a table used when the suction nozzle 6 sucks the electronic component 4 on the component feeder 12. In the first table 36a, the electronic components 4a to 4c, the suction nozzles 6a and 6b, the first suction deceleration degree, the second suction deceleration degree, the first suction acceleration, and the second suction acceleration are associated with one another. ing. The electronic components 4a to 4c are components of different types, for example, different in size, weight, shape and the like. The suction nozzles 6a, 6b are different types of nozzles, and for example, the sizes, maximum flow rates, etc. are different. The first suction deceleration, the second suction deceleration, the first suction acceleration, and the second suction acceleration are preset by the administrator based on the type of the electronic component 4 and the type of the suction nozzle 6. A value larger than the first adsorption deceleration is set for the second adsorption deceleration. A value larger than the first adsorption acceleration is set to the second adsorption acceleration. The second table 36 b is a table used when the electronic component 4 sucked by the suction nozzle 6 is mounted on the substrate 2. In the second table 36b, the electronic components 4a to 4c, the suction nozzles 6a and 6b, the first attachment deceleration degree, the second attachment deceleration degree, the first attachment acceleration, and the second attachment acceleration are associated with each other. ing. The first attachment acceleration, the second attachment acceleration, the first attachment acceleration, and the second attachment acceleration are preset by the administrator based on the type of the electronic component 4 and the type of the suction nozzle 6. The second attachment deceleration is set to a value larger than the first attachment deceleration. A value larger than the first mounting acceleration is set as the second mounting acceleration.

(Mounting process; FIGS. 3 to 9)
Subsequently, processing executed by the control device 30 of the component mounter 10 will be described with reference to FIGS. 3 to 9. The control device 30 first executes trial processing (FIG. 3), and then executes mounting processing (FIG. 4).

(Trial process; Figure 3)
The contents of the trial process will be described with reference to FIGS. 3 and 5 to 9. The trial process is a process for adjusting the second adsorption deceleration, the first adsorption acceleration, the second attachment deceleration, and the first attachment acceleration before the mounting process is performed.

At S <b> 10, control device 30 receives electronic component information including the type of electronic component 4. The type of the electronic component 4 may be transmitted from the operation panel 26 by an operation by the operator on the operation panel 26, or transmitted from an external management device (not shown) communicably connected to the control device 30. It is also good.

In S12, based on the type of the electronic component 4 received in S10, the control device 30 specifies the type of suction nozzle 6 (hereinafter referred to as "mounting nozzle 6") used for mounting the electronic component 4. For example, when the type of the electronic component 4 received in S10 is the electronic component 4a, the control device 30 specifies the suction nozzle 6a as the mounting nozzle 6.

In S14, the control device 30 mounts the mounting nozzle 6 specified in S12 on the transfer head 20. First, the control device 30 moves the transfer head 20 onto the nozzle station by driving the moving mechanism 22. Then, the control device 30 places the suction nozzle 6 mounted on the transfer head 20 on the nozzle station, and the mounting nozzle 6 on the tool station (that is, the mounting nozzle 6 specified in S12) is transferred to the transfer head Attach to 20. When the mounting nozzle 6 specified in S12 is mounted on the transfer head 20, the control device 30 omits S14 and proceeds to S16.

In S16, the control device 30 uses the type of the electronic component 4 received in S10, the first table 36a, and the second table 36b to perform the first and second suction decelerations corresponding to the mounting nozzle 6, and the first and second suction decelerations. The adsorption acceleration, the first and second attachment decelerations, and the first and second attachment accelerations are specified. For example, when the type of the electronic component 4 received in S10 is the electronic component 4a, the control device 30 sets each deceleration and each acceleration of the top row of the first table 36a and the second table 36b to the first , 2 adsorption deceleration, first and second adsorption acceleration, first and second attachment deceleration, and first and second attachment acceleration (see FIG. 2).

In S <b> 20, the control device 30 executes a suction process for suctioning the electronic component 4 on the component feeder 12 to the mounting nozzle 6. The operation at the time of suction processing will be described with reference to FIGS. 5 to 7. The vertical axis of FIG. 5 indicates the absolute value of the velocity of the mounting nozzle 6 in the Z-axis direction, and the horizontal axis indicates time. At time t0 to time t4 and time t8 to time t12, the mounting nozzle 6 moves downward (ie, descends). Further, at time t4 to time t7 and time t12 to time t15, the mounting nozzle 6 moves (ie, rises) upward. The adsorption process is a process performed between time t0 and time t7. The mounting nozzle 6 can be moved in the X-axis direction and the Y-axis direction simultaneously with the movement in the Z-axis direction, but in the following, the movement in the Z-axis direction is particularly described for ease of understanding. Do. Further, in the suction process, the mounting nozzle 6 is moved by driving the transfer head 20. Therefore, in the following description, the description “by driving the transfer head 20” is omitted unless it is particularly necessary.

At time t0 in FIG. 5, the control device 30 moves the mounting nozzle 6 downward. At time t0, the distance between the electronic component 4 on the component feeder 12 and the mounting nozzle 6 is separated by a distance D1 (see FIG. 6). Hereinafter, the position in the Z-axis direction of the mounting nozzle 6 at time t0 is referred to as a “reference position”. When the lowering speed of the mounting nozzle 6 reaches the maximum speed V1 at time t1, the control device 30 sets the acceleration of the mounting nozzle 6 to zero. At time t2, when the distance between the mounting nozzle 6 and the electronic component 4 decreases to the first predetermined distance, the control device 30 decelerates the lowering speed of the mounting nozzle 6 at the first suction deceleration. Then, at time t3, when the distance between mounting nozzle 6 and electronic component 4 decreases to distance D2 (see FIG. 6), control device 30 sets the deceleration of mounting nozzle 6 to be larger than the first adsorption deceleration. Switch to the second adsorption deceleration. Further, the control device 30 drives a suction device (not shown) to cause the mounting nozzle 6 to suck the electronic component 4 on the component feeder 12. As mentioned above, the second adsorption rate is greater than the first adsorption rate. In addition, at time t2, the mounting nozzle 6 is not in contact with the electronic component 4 yet. Therefore, the mounting nozzle 6 contacts the electronic component 4 in a state where the mounting nozzle 6 is operating at the second suction deceleration. As a result, the lower surface of the mounting nozzle 6 can be properly brought into contact with the upper surface of the electronic component 4 as compared with the case where the mounting nozzle 6 contacts the electronic component 4 in the state of operating at the first suction deceleration. it can.

At time t4, control device 30 moves mounting nozzle 6 upward. At this time, the mounting nozzle 6 sucks the electronic component 4 (see FIG. 7). The control device 30 moves the mounting nozzle 6 upward at the first adsorption acceleration. Then, at time t5, when the distance between mounting nozzle 6 and electronic component 4 increases to distance D3 (see FIG. 7), controller 30 accelerates mounting nozzle 6 from the first adsorption acceleration to the second adsorption acceleration. Switch to At time t6, when the rising speed of the mounting nozzle 6 reaches the maximum speed V1, the controller 30 sets the acceleration of the mounting nozzle 6 to zero. Thereafter, the control device 30 decelerates the mounting nozzle 6 so that the mounting nozzle 6 stops at the reference position. At time t7, the mounting nozzle 6 stops at the reference position, and the suction process (S20 in FIG. 3) ends.

In S22, the control device 30 drives the moving mechanism 22, moves the transfer head 20 above the lower surface imaging camera 18, and uses the image data captured by the lower surface imaging camera 18 to attract the electronic component 4 Determine if the condition is normal. The case where the suction state of the electronic component 4 is abnormal is, for example, when the electronic component 4 is not sucked at an appropriate position of the mounting nozzle 6, or when the electronic component 4 is inclined. When it is determined that the suction state of the electronic component 4 is abnormal, the control device 30 determines NO in S22, and proceeds to S24. In addition, the control device 30 moves the transfer head 20 above the lower surface imaging camera 18 while moving the mounting nozzle 6 upward (during the time t4 to t7 in FIG. 5) in the suction process of S20. It is preferable to

Since it is determined that the suction state is abnormal, in S24, the control device 30 adjusts the second suction deceleration and the first suction acceleration in the first table 36a. Specifically, control device 30 increases the second adsorption deceleration and reduces the first adsorption acceleration. When S24 ends, the control device 30 returns to S20. Note that, in the modification, the control device 30 is configured to first adjust one of the second adsorption deceleration and the first adsorption acceleration, and then adjust the other when it is determined NO in S22. May be That is, every time when it is judged as NO in S22, the second adsorption deceleration and the first adsorption acceleration may be alternately adjusted.

On the other hand, when it is determined that the suction state of the electronic component 4 is normal, the control device 30 determines YES in S22, and proceeds to S30. In S <b> 30, the control device 30 executes a mounting process of mounting the electronic component 4 sucked by the mounting nozzle 6 on the substrate 2. The operation at the time of the mounting process will be described with reference to FIGS. 5, 8 and 9. FIG. The mounting process is a process executed during time t8 to time t15 in FIG.

At time t8, control device 30 moves mounting nozzle 6 downward. At time t8, the mounting nozzle 6 is located at the reference position. The distance between the mounting nozzle 6 and the electronic component 4 at this time is the distance D4 (see FIG. 8). At time t9, when the lowering speed of the mounting nozzle 6 reaches the maximum speed V1, the controller 30 sets the acceleration of the mounting nozzle 6 to zero. At time t10, when the distance between the mounting nozzle 6 and the electronic component 4 decreases to the second predetermined distance, the control device 30 reduces the lowering speed of the mounting nozzle 6 at the first mounting deceleration. Then, at time t11, when the distance between the mounting nozzle 6 and the electronic component 4 decreases to the distance D5 (see FIG. 8), the control device 30 sets the deceleration of the mounting nozzle 6 larger than the first attachment deceleration. Switch to the 2nd attachment deceleration. As mentioned above, the second attachment deceleration is greater than the first attachment deceleration. Therefore, as compared with the case where the electronic component 4 is brought close to the substrate 2 in a state in which the mounting nozzle 6 is operating at the first mounting deceleration, the electronic component 4 is accurately disposed at a desired position on the substrate 2 Can.

At time t12, the control device 30 stops driving the suction device (not shown) and moves the mounting nozzle 6 upward. As a result, the electronic component 4 is released from the mounting nozzle 6. The control device 30 moves the mounting nozzle 6 upward at the first mounting acceleration. Then, at time t13, the control device 30 switches the acceleration of the mounting nozzle 6 from the first mounting acceleration to the second mounting acceleration. The time t13 is a time obtained by adding the time from the stop of the driving of the mounting nozzle 6 to the completion of the vacuum destruction at the time t12. By moving the mounting nozzle 6 with the first mounting acceleration with a relatively small acceleration until the vacuum destruction is completed, it is possible to suppress the electronic component 4 mounted on the substrate 2 from shifting from the mounting position. At time t14, when the rising speed of the mounting nozzle 6 reaches the maximum speed V1, the controller 30 sets the acceleration of the mounting nozzle 6 to zero. Thereafter, the control device 30 decelerates the mounting nozzle 6 so that the mounting nozzle 6 stops at the reference position. At time t15, the mounting nozzle 6 stops at the reference position, and the mounting process (S30) ends.

In S32, the control device 30 determines whether the mounting state of the electronic component 4 on the substrate 2 is normal by using the image data captured by the upper surface imaging camera 16. The case where the mounting state of the electronic component 4 is abnormal is, for example, the case where the position at which the electronic component 4 is mounted on the substrate 2 is not appropriate. When it is determined that the mounting state of the electronic component 4 is abnormal, the control device 30 determines NO in S32, and proceeds to S34.

Since it is determined that the mounting state is abnormal, in S34, the control device 30 adjusts the second mounting deceleration and the first mounting acceleration in the second table 36b. Specifically, control device 30 increases the second attachment deceleration and reduces the first attachment acceleration. When S34 ends, the control device 30 returns to S20. In the modification, first, control device 30 is configured to adjust one of the second attachment deceleration and the first attachment acceleration, and next adjust the other when it is determined NO in S32. May be That is, the control device 30 may adjust the second attachment deceleration and the first attachment acceleration alternately each time the determination in S32 is NO. In another modification, control device 30 may extend the time to be added to time t12. That is, the time from when the suction device is stopped to when the vacuum breaking is completed may be extended.

On the other hand, when it is determined that the mounting state of the electronic component 4 is normal, the control device 30 determines YES in S32, and proceeds to S40. Note that the control device 30 increases the number of successes in the memory 32 by one when it is determined as YES in S32. In S40, control device 30 determines whether the number of successes matches the predetermined number. If the number of successes matches the predetermined number, the control device 30 determines YES in S40, and ends the processing of FIG. On the other hand, when the number of successes does not match the predetermined number, the control device 30 determines NO in S40, and returns to S20. Therefore, the processes of S20 to S34 are repeatedly executed until the number of successes reaches a predetermined number. In the modification, the trial process may be ended by the operator of the component mounter 10 performing an operation for ending the trial process on the operation panel 26.

(Mounting process; Fig. 4)
The contents of the mounting process will be described with reference to FIG. The mounting process is a process for mounting the electronic component 4 on the substrate 2.

In S60, control device 30 sets the first and second adsorption decelerations, the first and second adsorption accelerations, the first and second attachment decelerations, and the first and second attachment accelerations adjusted in the trial process of FIG. Identify as the deceleration and acceleration to be used in the mounting process.

The processes executed in S70 and S72 are similar to the processes executed in S20 and S22 of FIG. In S72, when it is determined that the suction state of the electronic component 4 is abnormal, the control device 30 determines NO in S72, and proceeds to S74. On the other hand, when it is determined that the suction state of the electronic component 4 is normal, the control device 30 determines YES in S72, and proceeds to S80. When the controller 30 determines YES in S72, the controller 32 causes the memory 32 to store suction information indicating that the suction state of the electronic component 4 is normal. In the present embodiment, the memory 32 is configured to be able to store 100 pieces of suction information.

In S74, the control device 30 causes the memory 32 to store suction information indicating that the suction state of the electronic component 4 is abnormal.

In S76, the control device 30 determines whether the adsorption error rate of the adsorption information stored in the memory 32 is larger than the first error rate set in advance. The suction error rate is a ratio of information indicating that the suction state of the electronic component 4 is abnormal among the suction information stored in the memory 32. When the adsorption error rate is equal to or less than the first error rate, the control device 30 determines NO in S76, and returns to S70. On the other hand, when the suction error rate is larger than the first error rate, the control device 30 determines YES in S76, and proceeds to S78.

In S78, the control device 30 adjusts the second adsorption deceleration and the first adsorption acceleration in the first table 36a. Specifically, control device 30 increases the second adsorption deceleration and reduces the first adsorption acceleration. When adjusting the second adsorption deceleration and the first adsorption acceleration, the control device 30 erases all the adsorption information stored in the memory 32 at that time. In the modification, control device 30 is configured to first adjust one of the second adsorption deceleration and the first adsorption acceleration, and then adjust the other when it is determined YES in S76. May be That is, the second adsorption deceleration and the first adsorption acceleration may be alternately adjusted each time the determination in S76 is YES.

Further, the processing executed in S80 and S82 is the same as the processing executed in S30 and S32 of FIG. When it is determined in S82 that the mounting state of the electronic component 4 on the substrate 2 is abnormal in S82, the control device 30 determines NO in S82, and proceeds to S84. On the other hand, when it is determined that the mounting state of the electronic component 4 is normal, the control device 30 determines YES in S82, and returns to S70. When the control device 30 determines YES in S82, the control device 30 causes the memory 32 to store mounting information indicating that the mounting state of the electronic component 4 is normal. In the present embodiment, the memory 32 is configured to be able to store 100 pieces of mounting information.

In S84, the control device 30 causes the memory 32 to store mounting information indicating that the mounting state of the electronic component 4 is abnormal.

In S86, the control device 30 determines whether the mounting error rate of the mounting information stored in the memory 32 is larger than a second error rate set in advance. The mounting error rate is a ratio of information indicating that the mounting state of the electronic component 4 is abnormal among the mounting information stored in the memory 32. When the mounting error rate is equal to or less than the second error rate, the control device 30 determines NO in S86, and returns to S70. On the other hand, when the mounting error rate is larger than the second error rate, the control device 30 determines YES in S86, and proceeds to S88.

In S88, the control device 30 adjusts the second mounting deceleration and the first mounting acceleration in the mounting table 36. Specifically, control device 30 increases the second attachment deceleration and reduces the first attachment acceleration. When adjusting the second attachment deceleration and the first attachment acceleration, control device 30 erases all attachment information stored in memory 32. Note that, in the modification, first, the control device 30 is configured to adjust one of the second attachment deceleration and the first attachment acceleration, and next adjust the other when it is determined to be ES in S86. May be That is, the second attachment deceleration and the first attachment acceleration may be alternately adjusted each time the determination in S86 is YES. The control device 30 performs the second suction deceleration, the first suction acceleration, the second attachment deceleration, and the like when replacing the suction nozzle 6 or when the production lot of the supplied electronic component 4 is switched. The first attachment acceleration is configured to return to the initial value.

As described above, when the suction nozzle 6 is moved toward the substrate 2 and positioned as described above, the control device 30 moves the suction nozzle 6 at the first attachment deceleration (from time t10 to time t11 in FIG. 5); Thereafter, it is moved and positioned at a second attachment deceleration larger than the first attachment deceleration (time t11 to t12 in FIG. 5). That is, when the suction nozzle 6 comes closest to the substrate 2, the suction nozzle 6 is moved at a second attachment deceleration larger than the first attachment deceleration. In this case, in a state where the suction nozzle 6 is moving at the first attachment deceleration, positioning the suction nozzle 6 appropriately with respect to the substrate 2 as compared with the case where the suction nozzle 6 approaches the substrate 2 most closely. Can. By appropriately positioning the suction nozzle 6 with respect to the substrate 2, the electronic component 4 can be accurately placed at a desired position on the substrate 2. In addition, when separating the suction nozzle 6 after placing the electronic component 4 on the substrate 2, the control device 30 moves the suction nozzle 6 at the first mounting acceleration (time t12 to time t13 in FIG. 5). , And then move at a second mounting acceleration larger than the first mounting acceleration (time t13 to time t14 in FIG. 5). Therefore, when the suction nozzle 6 is moved and positioned toward the substrate 2, the suction nozzle 6 can be accurately positioned at a desired position, and the electronic component 4 is placed on the substrate 2. When the suction nozzle 6 is separated, the displacement of the position of the member on the substrate 2 is prevented. Further, by providing a period (from time t10 to time t11 to time t13 to time t14 in FIG. 5) in which the suction nozzle 6 is moved using the relatively large first adsorption deceleration and second attachment acceleration, the substrate It is possible to shorten the time required to mount the electronic component 4 on 2. Therefore, the time required for mounting the electronic component 4 on the substrate 2 can be shortened, and the electronic component 4 can be mounted at a desired position on the substrate 2 with high accuracy.

In addition, the memory 32 stores in advance a first attachment deceleration, a second attachment deceleration, a first attachment acceleration, and a second attachment acceleration based on the type of the electronic component 4 and the type of the suction nozzle 6. There is. That is, each acceleration and each deceleration are optimized for each type of electronic component 4 and each type of suction nozzle 6. Therefore, by using the first attachment deceleration, the second attachment deceleration, the first attachment acceleration, and the second attachment acceleration, the electronic component 4 can be properly placed on the substrate 2 at a desired position. it can.

Further, the control device 30 is configured to execute the trial process (FIG. 3) before the mounting process (FIG. 4) to adjust the second attachment deceleration and the first attachment acceleration (see FIG. 4). S34 of 3). Since the trial process is performed before the process of actually manufacturing the product (mounting process), the possibility of the electronic component 4 not being placed at the desired position on the substrate 2 in the mounting process is reduced. be able to.

Further, the control device 30 stores the mounting information of the electronic component 4 in the mounting process (FIG. 4) in the memory 32 (S82, S84 in FIG. 4). Then, when the mounting error rate of the mounting information stored in the memory 32 exceeds the second error rate (YES in S86 of FIG. 4), the control device 30 adjusts the second mounting deceleration and the first mounting acceleration. . By adjusting the second attachment deceleration and the first attachment acceleration even after the mounting process is started, it is possible to reduce the probability that the attachment state of the electronic component 4 becomes abnormal thereafter.

(Correspondence relationship)
The electronic component 4, the suction nozzle 6, the transfer head 20, and the moving mechanism 22 are examples of the “member”, the “mounting unit”, and the “moving device”, respectively. The first attachment deceleration, the second attachment deceleration, the first attachment acceleration, and the second attachment acceleration are respectively “first deceleration”, “second deceleration”, “first acceleration”, and “second acceleration”. An example of The type of the electronic component 4 and the type of the suction nozzle 6 are examples of the “member information” and the “mounting portion information”, respectively.

Although the embodiments according to the technology disclosed in the present specification have been described above in detail, these are merely examples, and do not limit the scope of the claims. The art set forth in the claims includes various variations and modifications of the specific examples illustrated above.

(Modification 1) The "member" may be solder, glue or the like. In this case, the “loading device” is a coating device that applies solder, glue or the like to the substrate 2.

(Modification 2) In the movement of the suction nozzle 6 in the X-axis direction and the movement in the Y-axis direction as well, the first attachment deceleration and the second attachment are provided for each velocity data that defines the movement in the X-axis direction The deceleration, the first attachment acceleration, and the second attachment acceleration may be set. In the case of movement in the X-axis direction or Y-axis direction, in FIG. 5, the speed does not become 0 between adsorption and mounting. That is, the speed is 0 only at the time of adsorption and attachment.

(Modification 3) The control device 30 may not execute the trial process (FIG. 3). That is, the process of FIG. 3 can be omitted. In another modification, control device 30 may not adjust the second adsorption deceleration, the second adsorption acceleration, the second attachment deceleration, and the second attachment acceleration in the mounting process. That is, S74 to S78 and S84 to S88 in FIG. 4 can be omitted.

(Modification 4) The control device 30 can adjust the first and second attachment deceleration and the first and second attachment acceleration when it is determined that the attachment state of the electronic component 4 is not normal in the trial process of FIG. 3 It may be

The technical elements described in the present specification or the drawings exhibit technical usefulness singly or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques illustrated in the present specification or the drawings simultaneously achieve a plurality of purposes, and achieving one of the purposes itself has technical utility.

2: substrate 4: electronic component 6: suction nozzle 10: component mounter 12: component feeder 14: feeder holding portion 16: upper surface imaging camera 18: lower surface imaging camera 20: transfer head 22: moving mechanism 22a: moving base 24: Substrate conveyor 26: Operation panel 30: Control device 32: Memory 34: Program 36: Mounting table 36a: First table 36b: Second table

Claims (5)

A mounting apparatus for mounting a member on a substrate, wherein
A placement unit for placing the member on a substrate;
A moving device for moving the placement unit relative to the substrate;
And a control device that controls the operation of the moving device and the placing unit.
The controller is
In the case of moving and positioning the placing unit toward the substrate, the moving unit causes the placing unit to move at a first deceleration, and thereafter, a second larger than the first deceleration. Move at deceleration and position
In the case where the mounting portion is separated after mounting the member on the substrate, the mounting portion is moved at a first acceleration by the moving device, and thereafter, the displacement is larger than the first acceleration. Move at a second acceleration,
The second deceleration and the first acceleration can be set individually.
Mounting device. In the memory of the control device, the first deceleration, the second deceleration, the first acceleration, and the second acceleration are stored in advance.
The mounting device according to claim 1, wherein the second deceleration and the first acceleration are set based on mounting portion information related to the mounting portion and member information related to the member. . In the memory of the control device, the first deceleration, the second deceleration, the first acceleration, and the second acceleration are stored in advance.
The control device can adjust the second deceleration and the first acceleration based on the result of operating the moving device using the second deceleration and the first acceleration. It is configured,
The mounting apparatus according to claim 1. The controller is
A trial process of trying to place the member on the substrate,
Moving and positioning the placement portion towards the substrate using the first deceleration and the second deceleration;
Controlling the operation of the placement unit to place the member on the substrate;
The trial step of separating the placement portion from the substrate using the first acceleration and the second acceleration;
The adjustment step of adjusting the second deceleration and the first acceleration based on the mounting state of the member on the substrate in the trial step is configured to be executable. The mounting device described in. The controller is
Moving and positioning the placement portion towards the substrate using the first deceleration and the second deceleration;
Controlling the operation of the placement unit to place the member on the substrate;
Separating the receiver from the substrate using the first acceleration and the second acceleration;
The member placing step of storing the placement state of the member on the placed substrate in the memory is repeatedly executed, and
The mounting device according to claim 3, wherein an adjustment step of adjusting the second deceleration and the first acceleration is executable based on the placement state stored in the memory.

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