[go: up one dir, main page]

WO2019124929A1 - Substrat composite pour charge d'énergie sans fil - Google Patents

Substrat composite pour charge d'énergie sans fil Download PDF

Info

Publication number
WO2019124929A1
WO2019124929A1 PCT/KR2018/016111 KR2018016111W WO2019124929A1 WO 2019124929 A1 WO2019124929 A1 WO 2019124929A1 KR 2018016111 W KR2018016111 W KR 2018016111W WO 2019124929 A1 WO2019124929 A1 WO 2019124929A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic wave
base layer
wave absorbing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/016111
Other languages
English (en)
Korean (ko)
Inventor
임태극
한빈
정윤호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Corp
Original Assignee
Doosan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Corp filed Critical Doosan Corp
Publication of WO2019124929A1 publication Critical patent/WO2019124929A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/366—Electric or magnetic shields or screens made of ferromagnetic material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength

Definitions

  • the present invention can be applied to an electronic apparatus having a wireless charging (WPC) function, and can solve a short problem caused by protrusion of a magnetic filler provided in an electromagnetic wave absorption layer, And a composite substrate.
  • WPC wireless charging
  • mobile terminals that meet user's demands for mobility and portability such as smart phones, mobile phones, portable multimedia players (PMPs), MP3 players, digital cameras, notebooks, and tablet PCs have been widely used.
  • PMPs portable multimedia players
  • MP3 players digital cameras
  • notebooks notebooks
  • tablet PCs tablet PCs
  • mobile terminals have a built-in battery and recharge the battery when the battery is discharged.
  • a technique for wirelessly charging a battery to maximize the convenience of charging the battery is being developed.
  • an electromagnetic wave shielding composite substrate is made by attaching a poly magnetic sheet (PMS) composed of a magnetic powder and a polymer and a copper coated copper foil (RCC).
  • PMS poly magnetic sheet
  • RCC copper coated copper foil
  • the magnetic powder in the electromagnetic wave absorbing sheet protrudes, it easily penetrates not only the electromagnetic wave absorbing sheet but also the insulating adhesive layer of the RCC contacting with the electromagnetic wave absorbing sheet, resulting in a short problem, .
  • the conventional electromagnetic wave absorbing sheet generally has a low permeability and thus has a problem of lowering its sensitivity. Accordingly, there is a demand for a wireless charging technology capable of effectively absorbing and shielding electromagnetic waves while solving short issues.
  • the present invention has been conceived in order to solve the above-mentioned problems, and it is an object of the present invention to effectively improve the electromagnetic wave absorption / shielding function while easily solving short problems caused by protrusion of magnetic powder, And to provide a composite substrate for wireless power consortium (WPC) that can exhibit cost reduction.
  • WPC wireless power consortium
  • a second base layer And an electromagnetic wave absorbing layer disposed between the first base layer and the second base layer, wherein the first base layer, the electromagnetic wave absorbing layer, and the second base layer are integrated,
  • the second base layer is a flexible metal laminate including a metal layer and an insulating film layer, and has a magnetic permeability (u ') of 70 or more at a frequency of 3 MHz and a frequency of 100 kHz or more and 200 kHz or less do.
  • the composite substrate includes a first adhesive layer formed between the first base layer and the electromagnetic wave absorbing layer, a second adhesive layer formed between the second base layer and the electromagnetic wave absorbing layer, or both .
  • the flexible metal clad laminate includes (i) a copper foil layer; And a polyimide (PI) film layer disposed on one side of the copper foil layer, or (ii) a copper foil layer; A third adhesive layer formed on one surface of the copper foil layer; And a polyimide film layer disposed on the third adhesive layer.
  • PI polyimide
  • the polyimide film layer may have a glass transition temperature (Tg) of 300 to 400 ° C.
  • the polyimide film layer may further include at least one of a colorant and an inorganic filler.
  • the polyimide film layer may be a transparent polyimide, a colored polyimide, or a black polyimide.
  • the thickness of the polyimide film layer may be 5 to 25 ⁇ ⁇ .
  • each of the first adhesive layer to the third adhesive layer includes a thermosetting resin; And an adhesive composition comprising at least one selected from the group consisting of a thermoplastic resin, a curing agent, and an inorganic filler.
  • the electromagnetic wave absorbing layer is a cured product of a composition comprising a soft magnetic powder and a polymer resin, and the soft magnetic powder is contained in an amount of 70 to 93 wt% based on 100 wt% Can be.
  • the soft magnetic powder may be at least one selected from the group consisting of ferrite, iron, carbonyl iron, permalloy, Fe-Ni, Fe-Ni-Mo, sendust, Fe- (Al-Si alloy), silicon-based iron powder (Fe-Si-Cr), silicon steel (Fe-Si), alperm, Fe-Al, permendur, Fe- -Cr, Fe-Cr-Ni).
  • the polymer resin may include a thermosetting resin or a thermosetting resin and a thermoplastic resin.
  • the thermosetting resin may be at least one selected from the group consisting of an epoxy resin, a phenol resin, a melamine resin, a silicone resin, a urethane resin and a urea resin.
  • the thermoplastic resin is selected from the group consisting of polyethylene, polypropylene, polystyrene, polyimide, PTFE, acrylonitrile-butadiene rubber (NBR), styrene butadiene rubber (SBR), acrylonitrile- (1) selected from the group consisting of styrene rubber (ABS), carboxyl-terminated butadiene acrylonitrile rubber (CTBN), polybutadiene, and styrene-butadiene-ethylene resin It can be more than a species.
  • the mixing ratio of the thermosetting resin to the thermoplastic resin may be 20 to 80: 80 to 20 by weight based on 100 parts by weight of the polymer resin.
  • the electromagnetic wave absorbing layer may further include at least one of a silane coupling agent and a dispersing agent.
  • the thickness of the electromagnetic wave absorbing layer may be 20 to 100 ⁇ .
  • the total thickness of the composite substrate may be 30 to 500 ⁇ .
  • the present invention also relates to a liquid crystal display comprising: a first substrate layer; A second base layer; And an electromagnetic wave absorbing layer disposed between the first base layer and the second base layer, wherein the first base layer, the electromagnetic wave absorbing layer, and the second base layer are integrated,
  • the second base layer is a flexible metal laminate comprising a metal layer and an insulating film layer, wherein the peeling strength value of the electromagnetic wave absorbing layer to the first base layer or the second base layer is not less than 0.5 kgf / cm and a tensile strength, Is 70 MPa or more.
  • the insulating film layer and the electromagnetic wave absorbing layer are in close contact with each other due to an adhesive layer interposed therebetween, and the peeling strength value of the electromagnetic wave absorbing layer to the insulating film layer is 0.6 to 2.0 kgf / cm .
  • the present invention provides a semiconductor device comprising: a first base layer; A second base layer; And an electromagnetic wave absorbing layer disposed between the first base layer and the second base layer, wherein the first base layer, the electromagnetic wave absorbing layer, and the second base layer are integrated,
  • the second substrate layer is a flexible metal laminate including a metal layer and an insulating film layer, and the measurement time is from 60 seconds or longer until a blister is generated on the surface of the composite substrate in a 288 ⁇ water bath.
  • a second substrate is a flexible metal laminate including a metal layer and an insulating film layer
  • the composite substrate in which the soft metal layer-laminated plate having the metal layer and the insulating film layer are integrated with the electromagnetic wave absorbing layer, even if the soft magnetic powder in the electromagnetic wave absorbing layer protrudes, the occurrence of shorting can be prevented by the insulating film layer, roll-to-roll continuous production method can be easily applied to simplify the manufacturing process and reduce the process cost by increasing the yield.
  • the composition of the electromagnetic wave absorbing layer is optimally mixed, high permeability, high adhesive strength, excellent tensile strength, and improved crack characteristics can be secured at the same time, and heat resistance resin can be applied over the entire electromagnetic wave absorbing layer Reliability can be secured.
  • the composite substrate according to the present invention exhibits the effects of high permeability and heat resistance, and thus can be applied to a terminal device for wireless charging.
  • FIG. 1 is a schematic cross-sectional view of a composite substrate for wireless charging according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a composite substrate for wireless charging according to an embodiment of the present invention.
  • Fig. 3 is a picture for evaluating the crack resistance of the electromagnetic wave absorbing layer of the composite substrate manufactured in Example 4.
  • Fig. 4 is a photograph of the crack resistance evaluation of the electromagnetic wave absorbing layer of the composite substrate manufactured in Comparative Example 2.
  • FIG. 5 is a photograph showing the occurrence of a short circuit in the composite substrate manufactured in Example 4.
  • FIG. 6 is a photograph showing the occurrence of a short circuit in the composite substrate manufactured in Comparative Example 3.
  • FIG. 6 is a photograph showing the occurrence of a short circuit in the composite substrate manufactured in Comparative Example 3.
  • a monolithic wireless rechargeable composite substrate in which two base layers including a metal layer and an insulating film layer and an electromagnetic wave absorbing layer are laminated.
  • FIG. 1 and 2 schematically show a cross-sectional structure of a composite substrate for wireless charging according to an embodiment of the present invention.
  • a composite substrate 100 includes an electromagnetic wave absorbing layer 10; And a first base layer 20a and a second base layer 20a disposed on one surface and the other surface of the electromagnetic wave absorbing layer 10 respectively.
  • the first base layer 20a, the electromagnetic wave absorbing layer 10, And the second base layer 20a are integrally formed.
  • the first base layer 20a and the second base layer 20a are flexible metal laminate plates including a metal layer 21 and an insulating film layer 22, respectively.
  • the wireless charging composite substrate 100 may be manufactured through a roll-to-roll continuous process.
  • an electromagnetic wave absorbing layer 10 for example, an electromagnetic wave absorbing layer 10;
  • the first base layer 20a and the second base layer 20a which are respectively disposed on the upper and lower portions of the electromagnetic wave absorbing layer 10 may be in the form of a roll integrated with the longitudinal direction.
  • the electromagnetic wave absorbing layer The electromagnetic wave absorbing layer
  • the electromagnetic wave absorbing layer 10 absorbs and shields electromagnetic waves including a (soft) magnetic material and entering or radiating into the electronic device. And exhibits adhesion with other substrates (e.g., 20a and 20b), heat resistance, and interlayer adhesion.
  • the electromagnetic wave absorbing layer 10 may be in the form of an insulating layer or a film or sheet and may include a conventional soft magnetic powder 11 and a polymer resin 12 known in the art.
  • a polymer resin 12 known in the art.
  • a polymeric magnet sheet (PMS) can be used.
  • the soft magnetic powder (11) is not particularly limited as long as it is a component that absorbs and shields electromagnetic waves by being magnetized.
  • Non-limiting examples of usable soft magnetic powders include ferrite, iron, carbonyl iron, permalloy, Fe-Ni, Fe-Ni-Mo, sendust, Fe- Si alloy, Fe-Si-Cr, Fe-Si, Alperm, Fe-Al, permendur, Fe-Co, , Fe-Cr-Ni). These may be used alone or in combination of two or more.
  • the size and shape of the soft magnetic powder (11) are not particularly limited and can be appropriately adjusted within the ordinary range known in the art.
  • the average particle diameter of the magnetic powder may be from 10 ⁇ to 150 ⁇ , and preferably from 35 ⁇ to 65 ⁇ .
  • the average particle size may be a particle size based on D 50 .
  • the content of the soft magnetic powder 11 may be 70 to 93 parts by weight, preferably 75 to 92 parts by weight based on 100 parts by weight of the total amount of the electromagnetic wave absorbing layer 10, And more preferably 80 to 90 parts by weight.
  • the content of the soft magnetic powder is satisfied, high permeability is exhibited and the effect of improving the recognition rate can be exerted through the electromagnetic wave shielding and absorption enhancement effect.
  • the polymeric resin 12 may be any conventional thermosetting resin known in the art without limitation.
  • Non-limiting examples of usable thermosetting resins include epoxy resins, polyurethane resins, phenol resins, melamine resins, silicone resins, urea resins, vegetable rubidic phenolic resins, xylene resins, guanamine resins, diallyl phthalate resins, vinyl esters And may be at least one selected from the group consisting of a resin, an unsaturated polyester resin, a furan resin, a polyimide resin, a cyanate resin, a maleimide resin and a benzocyclobutene resin.
  • it is an epoxy resin, a phenol resin, a melamine resin, a silicone resin, a urethane resin, or a urea resin.
  • the double epoxy resin is preferable because it has excellent reactivity and heat resistance, and more preferably it is a halogen-free epoxy resin which does not contain a halogen element such as bromine (Br) in the molecule.
  • the epoxy resin may be any conventional epoxy resin known to those skilled in the art. It is preferable that two or more epoxy groups are present in the molecule without containing a halogen element.
  • examples of usable epoxy resins include, but are not limited to, bisphenol A type / F type / S type resin, novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type, aralkyl type, naphthol Naphthol type, dicyclopentadiene type, or mixed form thereof.
  • epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, naphthalene type epoxy resin, anthracene epoxy resin, biphenyl type epoxy resin, tetramethyl biphenyl type epoxy resin, Cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol S novolak type epoxy resin, biphenyl novolac type epoxy resin, naphthol novolak type epoxy resin, naphthol phenol coaxial novolak type epoxy resin , Naphthol cholizole co-novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resin, triphenyl methane type epoxy resin, tetraphenyl ethane type epoxy resin, dicyclopentadiene phenol addition reaction type epoxy resin, phenol aral A quarternary epoxy resin, a polyfunctional phenol resin, a naphthol aralkyl type epoxy resin There is. At this time,
  • the electromagnetic wave absorptive layer 10 further contains a thermoplastic resin, whereby it is possible to obtain an effect of improving adhesion, improving flexibility, and relaxing thermal stress.
  • thermoplastic resin a conventional thermoplastic resin, a thermoplastic rubber, or both may be used.
  • thermoplastic resins that can be used include polyolefins such as polyethylene, polypropylene, polystyrene, polyimide, PTFE, acrylonitrile-butadiene rubber (NBR), styrene butadiene rubber (SBR), acrylonitrile-butadiene- (ABS), carboxyl-terminated butadiene acrylonitrile rubber (CTBN), polybutadiene, styrene-butadiene-ethylene resin (SEBS), side chain having 1 to 8 carbon atoms Acrylic acid and / or methacrylic acid ester resin (acrylic rubber), or a mixture of at least one of these resins.
  • polyolefins such as polyethylene, polypropylene, polystyrene, polyimide, PTFE, acrylonitrile-butadiene rubber (NBR), styrene butadiene rubber (SBR), acrylonitrile-butadiene- (ABS), carboxyl-termin
  • thermoplastic resin specifically, rubber preferably contains a functional group capable of reacting with an epoxy resin which is a thermosetting resin. Specifically, it is at least one functional group selected from the group consisting of an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methoxy group, an isocyanate group, a vinyl group and a silanol group. These functional groups form a strong bond with the epoxy resin and are therefore preferred since they have improved heat resistance after curing.
  • an acrylonitrile-butadiene copolymer in consideration of adhesiveness, flexibility and effect of alleviating thermal stress, More preferably a carboxyl group as a functional group capable of reacting with a carboxyl group.
  • NBR acrylonitrile-butadiene copolymer
  • carboxyl group as a functional group capable of reacting with a carboxyl group.
  • Specific examples of the NBR having the carboxyl group include PNR-1H (manufactured by JSR Corporation), Nipol 1072J and Nipol DN631 (manufactured by Nippon Zeon Co., Ltd.).
  • the content of the polymer resin may be 6 to 30 parts by weight, preferably 7 to 20 parts by weight, more preferably 7.5 to 16 parts by weight, based on 100 parts by weight of the total amount of the electromagnetic wave absorbing layer.
  • the mixing ratio of the thermosetting resin to the thermoplastic resin may be 20 to 80: 80 to 20 by weight, preferably 50 To 60: 40 to 50 weight ratio.
  • the electromagnetic wave absorbing layer 10 according to the present invention may further include at least one of a silane coupling agent, a dispersant, and an antioxidant.
  • the silane coupling agent may be any of those conventionally known in the art, and is preferably a silane coupling agent having an epoxy group.
  • epoxy silane coupling agents that can be used include 3- (glycidyloxy) propyl) trimethoxysilane, 3- (glycidyloxy) propyltriethoxysilane, 2- (3,4-epoxy Cyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, epoxypropoxypropyltrimethoxysilane, and the like can be used.
  • the above-mentioned components may be used singly or in combination of two or more.
  • the content of the silane coupling agent is not particularly limited and may be, for example, more than 0 and 5 parts by weight, preferably 0.3 to 1.5 parts by weight based on 100 parts by weight of the total amount of the electromagnetic wave absorbing layer.
  • the dispersing agent serves to disperse each material constituting the composition for forming an electromagnetic wave absorbing layer containing the soft magnetic powder and the polymer resin and prevent the re-agglomeration through maintaining the distance, thereby exhibiting the uniform physical properties of the electromagnetic wave absorbing layer.
  • the dispersing agent those conventionally known in the art may be used.
  • a dispersant of a block copolymer type having a high molecular weight may be used.
  • a wetting dispersant is used.
  • Such a wettable dispersant can further improve the dispersibility of the soft magnetic powder mixed therewith.
  • the wetting and dispersing agent that can be used is not particularly limited as long as it is a conventional dispersion stabilizer used in the field of paints.
  • Disperbyk-110, 111, 161 and 180 of BYK Co., Ltd. can be mentioned.
  • the above-mentioned wettable dispersing agents may be used alone, or two or more kinds may be used in appropriate combination.
  • the content of the dispersant is not particularly limited and may be, for example, more than 0 and 5 parts by weight, preferably 0.1 to 2 parts by weight based on 100 parts by weight of the total amount of the electromagnetic wave absorbing layer.
  • the antioxidant may be any conventional one known in the art. Examples thereof include phenol-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Specific examples thereof include tetrakis [methylene-3- (3,5-tert- butyl-4-hydroxyphenyl) propionate] methane .
  • the content of the antioxidant is not particularly limited, and may be, for example, 0 to 5 parts by weight, preferably 0.1 to 2 parts by weight, based on 100 parts by weight of the electromagnetic wave absorbing layer.
  • the electromagnetic wave absorbing layer 10 comprises, based on 100 parts by weight of the electromagnetic wave absorbing layer, 70 to 93 parts by weight of the soft magnetic powder; 6 to 30 parts by weight of a polymer resin; More than 0, and not more than 5 parts by weight of silane coupling agent; And a dispersant in an amount of more than 0 and 5 parts by weight or less.
  • the present invention can be applied to a flame retardant generally known in the art, other thermosetting resins, thermoplastic resins and oligomers thereof not described above, if necessary, as long as the intrinsic properties of the electromagnetic wave absorbing layer 10 are not impaired
  • Other additives such as granules, metal deactivators and the like may be further included.
  • the thickness of the electromagnetic wave absorbing layer 10 is not particularly limited, and may be in the range of 20 to 100 mu m, preferably in the range of 25 to 80 mu m, and more preferably in the range of 30 to 60 mu m.
  • the electromagnetic wave absorbing layer 10 may be manufactured by a conventional method known in the art. For example, a thermosetting composition for forming an electromagnetic wave absorbing layer containing a soft magnetic powder, a solvent and a polymer resin is formed, Shaped and heated. In addition, the above-mentioned composition may be directly coated on the first base layer 20a or the second base layer 20a such as FCCL, and then laminated and cured by roll lamination to obtain an integral composite substrate.
  • a thermosetting composition for forming an electromagnetic wave absorbing layer containing a soft magnetic powder, a solvent and a polymer resin is formed, Shaped and heated.
  • the above-mentioned composition may be directly coated on the first base layer 20a or the second base layer 20a such as FCCL, and then laminated and cured by roll lamination to obtain an integral composite substrate.
  • the first base layer 20a and the second base layer 20a of the wireless rechargeable composite substrate 100 according to the present invention each include a conventional flexible metal laminate plate 20a including a metal layer and an insulating film layer, May be used without limitation.
  • the first base layer 20a and the second base layer 20a may be the same or different from each other.
  • the first base layer 20a and the second base layer 20a may be a flexible printed circuit board (FCCL) or a flexible printed circuit board (FPCB).
  • the flexible metal clad laminate 20a includes (i) a copper foil layer 21; And a polyimide (PI) film layer (22) disposed on one side of the copper foil layer; Or (ii) a copper foil layer 21; A third adhesive layer (shown at 24 in FIG. 2) formed on one side of the copper foil layer; And a polyimide film layer 22 disposed on the third adhesive layer.
  • PI polyimide
  • the copper foil layer 21 may be formed with a circuit pattern portion or an antenna pattern portion by a conventional dry or wet etching known in the art.
  • the antenna pattern unit may have a predetermined area, line width, shape, or the like to be the same or different depending on the use of the antenna module to be applied.
  • the thicknesses of the plurality of copper foil layers 21 may be the same or different and are not particularly limited. For example, 6 to 105 ⁇ each, and preferably 12 to 50 ⁇ .
  • the polyimide film layer 22 serves to firmly maintain physical bonding with the adjacent electromagnetic wave absorbing layer 100 and the copper foil layer 21, while insulating the copper foil layer 21 from the outside.
  • the polyimide film layer 22 is disposed adjacent to both sides of the electromagnetic wave absorptive layer 10, and basically has a structure in which the occurrence of a short which can be caused by the protrusion of the magnetic powder contained in the electromagnetic wave absorptive layer 10 .
  • the bending force is applied to the electromagnetic wave absorbing layer 10, it prevents the generation of cracks.
  • the polyimide (PI) resin is a polymer substance having an imide ring, and exhibits excellent flame retardancy, heat resistance, ductility, chemical resistance, abrasion resistance and weather resistance based on the chemical stability of the imide ring. Low thermal expansion rate, low air permeability and excellent electrical properties. Therefore, when the polyimide resin is provided between the electromagnetic wave absorbing layer 100 and the copper foil layer 21, the flame retardancy can be sufficiently secured due to the flame retardancy of the polyimide itself. In addition, the surface hardness is increased, scratch resistance is increased, heat resistance is increased due to a high glass transition temperature, and flexibility is higher than that of an epoxy resin.
  • the polyimide film layer 22 may be in the form of a conventional coating or film known in the art. At this time, the plurality of polyimide film layers 22 may have a configuration such as a polymer composition or a thickness, which are the same or different from each other, even if they are displayed identically.
  • the polyimide film layer 22 may be formed using a thermosetting polyimide resin film which is generally used, or may be a polyimide resin film layer made of soluble polyimide solution or polyamic acid solution, .
  • a thermosetting polyimide resin film which is generally used, or may be a polyimide resin film layer made of soluble polyimide solution or polyamic acid solution, .
  • usable polyimide resin include polyimide, polyamide, polyamideimide, polyamic acid resin, or a composite resin thereof.
  • the above-mentioned polyamic acid solution may include an aromatic dianhydride, an aromatic diamine, and a polar solution.
  • the aromatic dianhydride material contained in the polyamic acid solution is not particularly limited.
  • Non-limiting examples thereof include pyromellitic dianhydride (PMDA), 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA: 3,3', 4,4 -biphenyltetracarboxylic dianhydride, 3 ', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA: 3,3', 4,4'-benzophenonetetracarboxylic dianhydride), 4,4'- (ODPA: 4,4'-oxydiphthalic anhydride), 4,4 '- (4,4'-isopropylidene diphenoxy) -bis- (BPADA: 4,4'-isopropylidenediphenoxy) phthalic anhydride, 2,2'-bis- (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA
  • the aromatic diamine material contained in the polyamic acid solution is not particularly limited.
  • Non-limiting examples thereof include p-phenylenediamine (p-PDA), m-phenylene diamine (m-PDA), 4,4'-oxydianiline (4,4 ' -ODA: 3,4'-oxydianiline, 2,2-bis (4-4 [aminophenoxy] -phenyl) propane (BAPP: , 2,2'-dimethyl-4,4'-diaminobiphenyl, m-TB-HG, 1,3-bis (4-aminophenoxy (TPER: 1,3-bis (4-aminophenoxy) benzene), 2,2-bis 3-aminophenoxy] phenyl) sulfone, 4,4'-diamino benzanilide, 4,4'-bis (4-aminophenoxy) biphenyl '-bis (4-aminophenoxy) biphenyl, or a mixture of two or more thereof.
  • p-PDA
  • the polar solvent contained in the polyamic acid solution is not particularly limited.
  • NMP N-methylpyrrolidinone
  • DMAc N-dimethylacetamide
  • THF tetrahydrofuran
  • N N
  • the polyimide film layer 22 is mounted inside the terminal, it may be a transparent polyimide layer or a colored polyimide layer, and the colored polyimide layer may be a colored polyimide layer or a black polyimide layer.
  • the polyimide film layer 22 may be a colored polyimide layer.
  • the polyamic acid solution constituting the polyimide film layer 22 may further include a coloring agent.
  • the material usable as a colorant is not particularly limited, and examples thereof include at least one substance selected from the group consisting of carbon black, cobalt oxide, Fe-Mn-Bi black, iron oxide black, mica iron oxide, .
  • the polyimide film may have a color such as black, charcoal gray, blackish brown, and brownish brown.
  • the colorant may be present in an amount of 2 to 20% by weight based on the total weight of the colored polyimide layer.
  • the polyimide film layer 22 may be a black polyimide layer.
  • the polyamic acid solution constituting the polyimide film layer 22 may include both a colorant and an inorganic filler, and may include, for example, carbon black and silica particles.
  • the polyimide film layer 22 preferably contains 3 to 10% by weight of carbon black and 1 to 10% by weight of silica particles.
  • the polyimide film layer 22 is provided in the soft metal layer-laminated plate 20a to provide a glass transition of the polyimide film layer to provide heat resistance, durability,
  • the temperature (Tg) may be from 300 to 400 ° C, and the higher the glass transition temperature, the better.
  • the thickness of the polyimide film layer 22 formed of such a polyamic acid solution may be 5 to 25 ⁇ ⁇ , preferably 7.5 to 12.5 ⁇ ⁇ , in consideration of insulation, suppression of occurrence of short-circuit, and slimming of the substrate.
  • the flexible metal laminate sheet 20a according to the present invention may include a third adhesive layer 24 formed between the copper foil layer 21 and the polyimide film layer 22.
  • the third adhesive layer 24 serves to make the adhesion between the copper foil layer 21 and the polyimide film layer 22 physically contacting each other more rigid.
  • the plurality of third adhesive layers 24 may have the same or different polymer composition, even if they are represented as the same.
  • the third adhesive layer 24 may be composed of a conventional polymer resin known in the art.
  • a thermosetting resin may further comprise at least one selected from the group consisting of a thermoplastic resin, a curing agent, and an inorganic filler.
  • the epoxy resin may be any conventional epoxy resin known to those skilled in the art. It is preferable that two or more epoxy groups are present in the molecule without containing a halogen element.
  • examples of usable epoxy resins include, but are not limited to, bisphenol A type / F type / S type resin, novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type, aralkyl type, naphthol Naphthol type, dicyclopentadiene type, or mixed form thereof.
  • the halogen-free adhesive composition according to the present invention can obtain effects such as improvement in adhesiveness, improvement in flexibility and relaxation of thermal stress by containing a thermoplastic resin.
  • Non-limiting examples of usable thermoplastic resins include acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-ABS resin, polybutadiene, styrene-butadiene- (Acrylic rubber), polyvinylbutylal, polyamide, polyester, polyimide, polyamideimide, polyurethane, or a mixture of at least one of these resins, have.
  • NBR acrylonitrile-butadiene copolymer
  • ABS resin acrylonitrile-butadiene rubber-ABS resin
  • polybutadiene polybutadiene
  • styrene-butadiene- (Acrylic rubber) polyvinylbutylal
  • polyamide polyester
  • polyimide polyamideimide
  • polyurethane polyurethane
  • the thermoplastic resin preferably contains a functional group capable of reacting with the epoxy resin. Specifically, it is at least one functional group selected from the group consisting of an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methoxy group, an isocyanate group, a vinyl group and a silanol group. These functional groups form a strong bond with the epoxy resin and are therefore preferred since they have improved heat resistance after curing.
  • NBR acrylonitrile-butadiene copolymer
  • thermoplastic resin content is not particularly limited and can be, for example, 1 to 35% by weight, and preferably 5 to 30% by weight, based on the total weight of the adhesive composition. If it is out of the above range, sufficient adhesion can not be obtained and the heat resistance is lowered.
  • conventional curing agents known in the art can be used without limitation, and can be appropriately selected depending on the type of epoxy resin to be used.
  • usable curing agents include phenolic, anhydride, dicyanamide, and aromatic polyamine curing agents.
  • usable curing agents include phenolic curing agents such as phenol novolak, cresol novolac, bisphenol A novolac, naphthalene type and the like; And polyamine type curing agents such as metaphenylenediamine, diaminodiphenylmethane (DDM) and diaminodiphenylsulfone (DDS). These may be used singly or in combination of two or more kinds.
  • the content of the curing agent is not particularly limited, and may be, for example, in the range of 5 to 10 parts by weight based on the total weight (100 parts by weight) of the adhesive composition.
  • the present invention may include conventional inorganic fillers known in the art.
  • usable inorganic fillers include silicas such as natural silica, fused silica, amorphous silica, crystalline silica and the like; Alumina, aluminum hydroxide [Al (OH) 3 ], talc, spherical glass, calcium carbonate, magnesium carbonate, magnesia, clay, calcium silicate, titanium oxide, antimony oxide, glass fiber, boric acid Aluminum, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, boron nitride, silicon nitride, talc and mica. These inorganic fillers may be used singly or in combination of two or more.
  • the size of the inorganic filler is not particularly limited, and the average particle diameter may be in the range of 0.5 to 10 mu m.
  • the content of the inorganic filler is not particularly limited, and may be, for example, in the range of 5 to 20 parts by weight based on the total weight of the adhesive composition (100 parts by weight).
  • the adhesive composition of the present invention may contain other additives such as flame retardants generally known in the art or other thermosetting resins, thermoplastic resins and oligomers thereof
  • additives such as various polymers, solid rubber particles or ultraviolet absorbers, antioxidants, polymerization initiators, dyes, pigments, dispersants, thickeners, leveling agents and the like may further be included.
  • the thermosetting adhesive composition constituting the third adhesive layer (24) comprises 30 to 50 parts by weight of an epoxy resin based on 100 parts by weight of the composition; 5 to 40 parts by weight of a thermoplastic resin; 5 to 10 parts by weight of a curing agent (additive); And 5 to 30 parts by weight of an inorganic filler.
  • the epoxy resin can realize the chemical resistance and the bending property, and the thermoplastic resin exhibits the adhesive force and the bending property improvement and the thermal stress relaxation effect.
  • the thermosetting adhesive composition may include an organic solvent, and the amount of the organic solvent may be in the range of the remaining amount of 100 parts by weight of the composition.
  • thermosetting adhesive composition composed of the above-described components can be coated and dried on the first copper foil layer 21 and the second copper foil layer 21 to form the third adhesive layer 24.
  • the thickness of the third adhesive layer 24 is not particularly limited, and may range, for example, from 5 to 30 mu m, preferably from 7 to 15 mu m.
  • the wireless rechargeable composite substrate 100 of the present invention includes a first adhesive layer 23 formed between the first base layer 20a and the electromagnetic wave absorbing layer 10, a second adhesive layer 23 formed between the second base layer 20a and the electromagnetic wave absorbing layer 10, A second adhesive layer 23 formed between the first adhesive layer 10, or both of them.
  • the first adhesive layer 23 and the second adhesive layer 23 may have the same or different compositions, and preferably have the same composition as the third adhesive 24 described above.
  • the thicknesses of the first adhesive layer 23 and the second adhesive layer 23 can be appropriately adjusted in consideration of handling property of the composite substrate, physical rigidity, thinning of the substrate, and the like.
  • the thicknesses of the first adhesive layer 23 and the second adhesive layer 23 may be the same or different from each other.
  • the first adhesive layer 23 and the second adhesive layer 23 may each be in the range of 1 to 30 ⁇ m, preferably 5 to 15 ⁇ m.
  • the total thickness of the wireless rechargeable composite substrate 100 of the present invention may be 30 to 500 ⁇ , and may have various thicknesses depending on the application.
  • the wireless charging composite substrate 100 can exhibit high permeability, excellent adhesive strength, high heat resistance, cracking characteristics, and mechanical characteristics through control of mixing of the electromagnetic wave absorbing layer 10 and optimization of the binder component used .
  • Such a high permeability can improve the recognition performance of the wireless charging and significantly improve adhesion characteristics with other substrates.
  • the peeling strength of the electromagnetic wave absorbing layer 10 with respect to the first base layer 20a, 20b or the second base layer 20a, 20b in the wireless rechargeable composite substrate 100 Peel strength value (adhesive strength) of 0.5 kgf / cm or more and tensile strength of 70 MPa or more. More specifically, the insulating film layer (PI film layer 22) and the electromagnetic wave absorbing layer 10 are in close contact with each other due to the adhesive layer 24 interposed therebetween, and the electromagnetic wave absorbing layer 10 ) May be 0.6 to 2.0 kgf / cm, preferably 0.8 to 1.0 kgf / cm. The tensile strength may also be 70 to 150 MPa, preferably 80 to 150 MPa.
  • the peel strength value of the polyimide film layer 22 with respect to the copper foil layer 21 in the first and second base layers of the wireless charging composite substrate 100 is 1.3 kgf / cm, preferably in the range of 1.4 to 2.0 kgf / cm < 2 >.
  • the wireless charging composite substrate has a permeability (permeability, ⁇ ') of not less than 70 in a frequency band of not less than 3 MHz and not less than 100 kHz and not more than 200 kHz, Lt; / RTI >
  • the magnetic permeability ( ⁇ ') is 100 to 250, more preferably 150 to 250.
  • the investment loss ( ⁇ '') can range from 25 to 35.
  • the measurement time of the wireless rechargeable composite substrate until a blister is generated on the surface of the composite substrate in a 288 ° C water bath may be 60 seconds or more, May be 180 to 300 seconds.
  • the wireless rechargeable composite substrate according to the present invention may have the following two embodiments according to the structure of the flexible metal laminate plate applied as the first base layer and the second base layer.
  • the present invention is not limited thereto.
  • FIG. 1 is a cross-sectional view schematically showing a cross-sectional structure of a wireless charging composite substrate 100 according to an embodiment of the present invention.
  • the cross-sectional structure of a cross-sectional type flexible copper-clad laminate Is applied to the first base layer 20a and the second base layer 20a.
  • the composite substrate 100 includes a first base layer 20a and a second base layer 20a disposed on both sides of the upper and lower surfaces of the electromagnetic wave absorbing layer 10, and a first adhesive layer (23) and a second adhesive layer (23) are interposed between the first adhesive layer (23) and the second adhesive layer (23).
  • the first copper foil layer 21, the first polyimide film layer 22, the first adhesive layer 23, the electromagnetic wave absorbing layer 10, the second adhesive layer 23, the second polyimide film layer 22, and a second copper foil layer 21 are sequentially laminated.
  • the rechargeable composite substrate 200 includes a copper foil layer 21, a third adhesive layer 24, and a polyimide film layer 22 ) Is laminated as a first base layer 20b and a second base layer 20b.
  • the composite substrate 200 includes a first copper foil layer 21, a third adhesive layer 24, a first polyimide film layer 22, a first adhesive layer 23,
  • the first adhesive layer 10, the second adhesive layer 23, the second polyimide film layer 22, the third adhesive layer 24 and the second copper foil layer 21 are sequentially laminated, Structure.
  • the above-described two embodiments are exemplified.
  • the number of layers constituting the wireless rechargeable composite substrate and the order of lamination thereof are freely selected and configured according to the use.
  • the structure may have a multi-layer structure than the structure illustrated by changing the order of each layer 10, 20a, 20b, 21, 22, 23, 24, or introducing other layers conventional in the art.
  • the composite substrate of the present invention configured as described above can be applied to a wireless charging application using a conventional method known in the art.
  • at least one of the first copper layer and the second copper layer in the composite substrate may form an antenna pattern portion having a predetermined area, line width and shape.
  • the composite substrate may include at least one through hole passing through the first flexible metal laminate plate, the electromagnetic wave absorbing layer, and the second flexible metal laminate plate, Lt; / RTI >
  • the composite substrate according to the present invention is mounted inside a mobile terminal and may include a wireless power consortium (WPC) antenna pattern.
  • WPC wireless power consortium
  • it may further include at least one antenna pattern of a magnetic secure transmission (MST) antenna pattern and a near field communication (NFC) antenna pattern.
  • MST magnetic secure transmission
  • NFC near field communication
  • the present invention also provides a method of manufacturing the above-described composite substrate for wireless charging.
  • a composite substrate can be produced without limitation according to a conventional method known in the art, and can have the following two embodiments as follows.
  • the first embodiment for manufacturing the composite substrate includes (i) preparing an electromagnetic wave absorbing layer; (ii) coating and drying the adhesive composition, respectively, on one surface of the first flexible metal laminate plate and the second flexible metal laminate plate, respectively; And (iii) a first adhesive layer of the first flexible metal laminate plate and a second adhesive layer of the second flexible metal laminate plate are disposed so as to face each other, and an electromagnetic wave absorbing layer is interposed therebetween, followed by roll lamination, And curing and integrating them.
  • the electromagnetic wave absorptive layer 10 may be manufactured by a method known in the art. For example, a thermosetting composition for forming an electromagnetic wave absorbing layer containing a soft magnetic powder, a solvent and a polymer resin may be prepared, and then the composition may be molded into a thin sheet form on a release film or a carrier film and heated.
  • the thermosetting composition for forming an electromagnetic wave absorbing layer comprises 70 to 93 parts by weight of a soft magnetic powder relative to 100 parts by weight of the composition; 6 to 30 parts by weight of a polymer resin; And at least one of a silane coupling agent and a dispersant, and the content thereof may be more than 0 and not more than 5 parts by weight based on 100 parts by weight of the composition.
  • the adhesive composition is applied on one surface of the two flexible metal laminate plates 20a and 20b, for example, the first flexible metal laminate plate and the second flexible metal laminate plate, and then dried.
  • the thermosetting adhesive composition constituting the first adhesive / second adhesive layer 24 comprises 30 to 50 parts by weight of an epoxy resin based on 100 parts by weight of the composition; 5 to 40 parts by weight of a thermoplastic resin; 5 to 10 parts by weight of a curing agent (additive); And 5 to 30 parts by weight of an inorganic filler.
  • the method of applying the adhesive composition onto the flexible metal laminate is not particularly limited, and conventional coating methods known in the art can be used without limitation.
  • various methods such as a casting method, a dip coating method, a die coating method, a roll coating method, a slot die method, a comma coating method, or a combination thereof may be used.
  • the drying process may be suitably carried out under ordinary conditions known in the art. For example, the drying can be carried out at 100 to 200 ° C.
  • first adhesive layer 23 of the first flexible metal laminate plates 20a and 20b and the second adhesive layer 23 of the second flexible metal laminate plates 20a and 20b are disposed so as to face each other, and an electromagnetic wave absorbing layer is interposed therebetween
  • an electromagnetic wave absorbing layer is interposed therebetween
  • the conditions of the pressing process can be suitably adjusted within the conventional range known in the art.
  • thermocompression Lami The process (roll to roll) conditions can be performed at a temperature of 50 to 250 ° C, a pressure of 3 to 200 kgf / cm 2 , and a compression rate of 0.1 m / min to 20 m / min.
  • the first flexible metal laminate sheets 20a and 20b and the second flexible metal laminate sheets 20a and 20b and the electromagnetic wave absorbing layer 10 may be in the form of a sheet and may be formed by a roll- And can be rolled up in a rolled form after continuous lamination.
  • a sheet-to-sheet laminate, a roll-to-sheet laminate, or the like may be used.
  • the two flexible metal laminate plates 20a and 20b and the electromagnetic wave absorbing layer 10 including the copper foil layer 21, the polyimide layer 22 and the third adhesive layer 24 as described above are bonded to the adhesive layer 23, So that the composite substrates 100 and 200 can be formed. Accordingly, the present invention not only provides the effect of improving the recognition rate, heat resistance and durability according to the high permeability in the portable terminal equipped with the integrated multi-function device, but also the composite substrate can be applied in the roll-to-roll continuous mode.
  • thermosetting composition for forming an electromagnetic wave absorbing layer 1-1.
  • thermosetting composition for forming an electromagnetic wave absorbing layer were prepared by mixing according to the formulation example given in Table 1 below.
  • Table 1 the unit of usage of each composition is parts by weight, and the content of each component is expressed as a percentage based on 100 parts by weight of the soft magnetic powder.
  • Adhesive layer The components of the composition were prepared by mixing according to the formulation example given in Table 1 below.
  • Table 1 the unit of usage of each composition is parts by weight, and the content of each component is expressed as a percentage based on 100 parts by weight of epoxy resin.
  • An electromagnetic wave absorbing layer (PMS layer) was formed so as to have a thickness of 80 mu m after drying by coating the thermosetting composition for electromagnetic wave absorbing layer 1-1 described above on one surface of a release PET film layer (thickness: 25 mu m), followed by coating / drying An electromagnetic wave absorbing layer was produced.
  • a first flexible copper-clad laminate (first copper-clad laminated with a polyimide film layer) and a second flexible-copper-clad laminate (a second copper-clad with a polyimide film layer disposed thereon)
  • the adhesive epoxy composition was prepared in a semi-cured state by applying the above-mentioned dispersion with an applicator so as to have a thickness of 10 mu m after application of the adhesive layer composition of 1-2, and drying in an air blowing oven at 160 DEG C for 5 minutes.
  • Magnetic powder 1 Sendust alloy [Fe-Al-Si alloy]
  • Thermosetting resin 2 Bisphenol A epoxy resin, Kukdo Chemical YD-011
  • Thermoplastic resin 3 Carboxyl-terminated acrylonitrile butadiene rubber [CTBN (Carboxyl-Terminated Butadiene Acrylonitrile Rubber), Zippon Nippol 1072
  • Dispersant BYK, Disperbyk-110
  • Silane coupling agent Epoxy silane, Shin-Etsu, KBM 603
  • Example 1 The same procedure as in Example 1 was carried out except that the composition was changed as shown in Table 1 to prepare the composite substrates for wireless charging of Comparative Examples 1 and 2.
  • Example 3 Except that a polyimide film layer-free resin-coated copper foil (RCC, Resin coated copper) was used in place of the flexible copper-clad laminate (copper foil with the polyimide film layer disposed thereon) A composite substrate for wireless charging of Example 3 was prepared.
  • RCC resin-coated copper foil
  • the permeability was measured in the 3 MHz frequency band using the Impedance / Material Analyzer (E4991A).
  • PMS layer is peeled at a rate of 50 mm / minute in a direction of 90 degrees with respect to the surface of the polyimide (PI) layer of the flexible copper-clad laminate (FCCL) under the condition of 25 ° C in accordance with JIS C6471 The minimum value of the required force was measured and expressed as peel strength.
  • test piece was prepared by cutting the composite substrate to 25 mm sides, and the test piece was suspended on a 288 ⁇ solder bath. Then, the time until blister occurred on the surface of the composite substrate was measured.
  • the electromagnetic wave absorption layer (PMS layer) was repeatedly folded 180 degrees five times, and then the occurrence of cracks was confirmed.
  • X was evaluated as " C " when cracks were not generated, and " Cracks did not occur "
  • each composite substrate was uniformly sprayed with 5% by weight of salt water at 35 ° C using a salt spray tester (SST, Salt Spray Tester), and the surface was visually observed at intervals of 24 hours while being kept at 35 ° C for 72 hours Respectively. At this time, no discoloration, oxidation, corrosion and breakage were evaluated by Pass.
  • SST Salt Spray Tester
  • the mechanical properties (modulus, peak stress, and maximum elongation) of composite substrates were measured using an Instron universal testing machine (UTM). Specifically, after the copper foil layer was etched on the composite substrate, only the polyimide layer was cut. The cut was cut to 5 mm ⁇ 60 mm or more, and the gap between the grips was set to 40 mm, and the tensile strength was determined by pulling the sample at a rate of 20 mm / min Respectively.
  • 3 and 4 are photographs showing the occurrence of cracks after repeatedly 180 degrees folding the composite substrate of Example 4 and Comparative Example 2 five times.
  • Example 5 and 6 are photographs showing the occurrence of a short circuit in the composite substrate of Example 4 and Comparative Example 3, respectively.
  • the composite substrate of Comparative Example 3 is shot due to the protrusion of the magnetic powder contained in the electromagnetic wave absorption layer.
  • the composite substrate of Example 4 it was found that even if the magnetic powder protrudes to the outside of the electromagnetic wave absorbing layer, the occurrence of short is prevented by the polyimide film layer disposed adjacent to the electromagnetic wave absorbing layer (see FIGS. 5 to 6)

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention peut être appliquée à un appareil électronique ayant une fonction de charge d'énergie sans fil (WPC) et fournit un nouveau substrat composite qui peut résoudre un problème de court-circuit causé par la saillie d'une charge magnétique disposée dans une couche d'absorption d'ondes électromagnétiques, la simplicité et la faisabilité économique du procédé de fabrication pouvant ainsi être assurées.
PCT/KR2018/016111 2017-12-21 2018-12-18 Substrat composite pour charge d'énergie sans fil Ceased WO2019124929A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0177551 2017-12-21
KR1020170177551A KR102097193B1 (ko) 2017-12-21 2017-12-21 무선 충전용 복합기판

Publications (1)

Publication Number Publication Date
WO2019124929A1 true WO2019124929A1 (fr) 2019-06-27

Family

ID=66993580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/016111 Ceased WO2019124929A1 (fr) 2017-12-21 2018-12-18 Substrat composite pour charge d'énergie sans fil

Country Status (2)

Country Link
KR (1) KR102097193B1 (fr)
WO (1) WO2019124929A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210229325A1 (en) * 2020-01-24 2021-07-29 Arris Composites Inc. Fiber composites comprising a circuit, and method therefor
CN120264573A (zh) * 2025-02-28 2025-07-04 九江德福科技股份有限公司 一种复合线路板材料及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102673186B1 (ko) * 2020-12-17 2024-06-07 주식회사 위츠 스마트 워치용 차폐 시트
KR102488005B1 (ko) * 2021-05-07 2023-01-13 한국자동차연구원 밀리미터파 차폐 및 흡수용 복합소재
KR102515146B1 (ko) * 2021-11-26 2023-03-29 조의제 Fpcb기판 핫프레스 공정용 이형필름
KR102635561B1 (ko) * 2021-12-20 2024-02-08 (주)이녹스첨단소재 저유전 복합 방열시트
KR102714025B1 (ko) * 2022-05-30 2024-10-07 주식회사 코젼트솔루션 연성 동박 적층판
KR102726553B1 (ko) * 2024-05-30 2024-11-06 주식회사 씨앤씨머티리얼즈 전기전도성, 방열특성 및 전자파 차폐 특성이 우수한 페라이트 입자

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101321511B1 (ko) * 2013-05-21 2013-10-28 (주)켐스 커버레이 일체형 전자파 흡수시트의 제조방법 및 그에 의한 커버레이 일체형 전자파 흡수시트
KR101549988B1 (ko) * 2014-05-30 2015-09-03 (주)창성 커버레이 분리형 자성시트와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
KR20150137905A (ko) * 2014-05-30 2015-12-09 (주)창성 자성시트 일체형 커버레이와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
KR101617403B1 (ko) * 2014-12-18 2016-05-02 율촌화학 주식회사 전자파 흡수 시트용 조성물 및 이를 포함하는 시트
KR101772871B1 (ko) * 2016-07-11 2017-08-30 주식회사 두산 안테나 모듈 형성용 복합기판 및 이의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101321511B1 (ko) * 2013-05-21 2013-10-28 (주)켐스 커버레이 일체형 전자파 흡수시트의 제조방법 및 그에 의한 커버레이 일체형 전자파 흡수시트
KR101549988B1 (ko) * 2014-05-30 2015-09-03 (주)창성 커버레이 분리형 자성시트와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
KR20150137905A (ko) * 2014-05-30 2015-12-09 (주)창성 자성시트 일체형 커버레이와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
KR101617403B1 (ko) * 2014-12-18 2016-05-02 율촌화학 주식회사 전자파 흡수 시트용 조성물 및 이를 포함하는 시트
KR101772871B1 (ko) * 2016-07-11 2017-08-30 주식회사 두산 안테나 모듈 형성용 복합기판 및 이의 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210229325A1 (en) * 2020-01-24 2021-07-29 Arris Composites Inc. Fiber composites comprising a circuit, and method therefor
US12011854B2 (en) * 2020-01-24 2024-06-18 Arris Composites Inc. Fiber composites comprising a circuit, and method therefor
CN120264573A (zh) * 2025-02-28 2025-07-04 九江德福科技股份有限公司 一种复合线路板材料及其制备方法

Also Published As

Publication number Publication date
KR102097193B1 (ko) 2020-04-03
KR20190075725A (ko) 2019-07-01

Similar Documents

Publication Publication Date Title
WO2019124929A1 (fr) Substrat composite pour charge d'énergie sans fil
WO2018012668A1 (fr) Substrat composite destiné à la formation d'un module d'antenne et son procédé de fabrication
KR101140626B1 (ko) 폴리이미드 수지용 조성물 및 그 폴리이미드 수지용 조성물로 이루어지는 폴리이미드 수지
KR102485692B1 (ko) 폴리이미드계 접착제
WO2017111254A1 (fr) Film de protection d'onde électromagnétique et son procédé de fabrication
WO2019124936A1 (fr) Film d'absorption d'ondes électromagnétiques et substrat composite du type à absorption d'ondes électromagnétiques comprenant ce dernier
KR20170082130A (ko) 동피복 적층체 및 프린트 배선판
WO2018021623A1 (fr) Feuille complexe pour charge sans fil et procédé de fabrication de celle-ci
WO2015080445A1 (fr) Composition de résine thermodurcissable ayant des caractéristiques de résistance à la chaleur et de basse perte diélectrique, pré-imprégné l'utilisant, et stratifié revêtu de cuivre
WO2016108491A1 (fr) Film de polyimide multicouche de fusion thermique utilisant de l'acide de polyamide thermoplastique hydrosoluble réticulé, et son procédé de préparation
WO2016105131A1 (fr) Procédé de fabrication d'un film de blindage contre les ondes électromagnétiques pour carte de circuits imprimés souple
KR102224438B1 (ko) 저유전 접착제 조성물 및 이를 포함하는 커버레이 필름
WO2020096363A1 (fr) Film composite de polyimide ayant d'excellentes caractéristiques diélectriques et son procédé de formation
WO2020162668A1 (fr) Composition de résine thermodurcissable pour boîtier de semi-conducteur, préimpregné et stratifié gainé de métal
WO2020105889A1 (fr) Film de polyimide faiblement hygroscopique, et stratifié plaqué de feuille métallique flexible le comprenant
WO2021096245A2 (fr) Film de polyimide ultra-mince ayant une stabilité dimensionnelle améliorée et son procédé de fabrication
WO2015102461A1 (fr) Feuille de cuivre à laquelle est fixée une double couche de résine, carte de circuits imprimés multicouche la comprenant, et leur procédé de fabrication
WO2015105340A1 (fr) Film de blindage contre les ondes électromagnétiques pour carte de circuit imprimé souple et son procédé de fabrication
WO2016108490A1 (fr) Acide de polyamide thermoplastique hydrosoluble réticulé et son procédé de fabrication
WO2019139249A1 (fr) Film de polyimide ayant une résistance aux alcalis améliorée et son procédé de fabrication
WO2015088245A1 (fr) Composition de résine thermodurcissable pour haute fréquence ayant une faible perte diélectrique, préimprégné l'utilisant, et stratifié plaqué cuivre
WO2020209555A1 (fr) Film de polyimide multicouches ayant une excellente stabilité dimensionnelle et une excellente adhésivité, et son procédé de production
WO2020040347A1 (fr) Film de polyimide présentant une résistance améliorée aux agents alcalins et procédé pour le fabriquer
WO2020209524A1 (fr) Film polyimide multicouche à faible perte diélectrique ayant une excellente force adhésive et son procédé de fabrication
KR101566836B1 (ko) 금속 적층체 및 이의 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18892870

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18892870

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 20.01.2021)

122 Ep: pct application non-entry in european phase

Ref document number: 18892870

Country of ref document: EP

Kind code of ref document: A1