WO2019116506A1 - Workpiece processing device - Google Patents

Abstract

This workpiece processing device (1) is configured such that a workpiece is placed on a carrying member (80) when the workpiece (P) is to be transferred by a head (31) to a holding unit (6), and the workpiece and the carrying member can move relative to one another in a separating direction (M1) when the workpiece is to be subjected to a work process by the head after having been transferred to the holding unit.

Description

Work machine

The present invention relates to a work work apparatus, and more particularly to a work work apparatus including a mounting member on which a work having a three-dimensional shape is placed.

BACKGROUND Conventionally, there is known a work work apparatus provided with a mounting member on which a work having a three-dimensional shape is mounted. The work work apparatus is disclosed, for example, in Japanese Patent Laid-Open No. 2016-127187.

In the above-mentioned Japanese Patent Laid-Open No. 2016-127187, there is provided a chip component mounting apparatus including a work having a side surface serving as a mounting surface on which chip components (parts) are mounted, and a stage disposed on a base and holding the work Work work apparatus) is disclosed. The chip component mounting apparatus includes a dispenser (head) for applying a conductive paste to a workpiece, and a suction nozzle (head) for mounting a chip component on a workpiece to which the conductive paste is applied.

In the chip component mounting apparatus described in JP-A-2016-127187, the conductivity to the side surface of the work is achieved by inclining the dispenser and the suction nozzle in accordance with the inclination with respect to the horizontal direction of the side surface which becomes the work mounting surface. The work of paste application and chip part mounting is being carried out.

JP, 2016-127187, A

However, in the chip component mounting apparatus described in the above-mentioned JP-A-2016-127187, when applying the conductive paste and mounting the chip component on the end portion on the stage side in the side surface of the work, the stage and work for holding the work When the position (mounting or application position) is close, for example, there is a disadvantage that the dispenser and the suction nozzle may interfere with the stage. Here, in order to avoid interference with the stage of the dispenser and the suction nozzle, it is conceivable to provide a gap between the work and the stage that holds the work. However, since the height position of the work from the stage is increased by the gap, for example, when the work is moved together with the stage by moving the suction nozzle in a state where the stage is suctioned and held by the suction nozzle, It is considered that there is a disadvantage that the dispenser and the other suction nozzles may interfere with the work. For these reasons, it is considered that there is a problem that the work position on the work is limited and the height of the work on the stage is limited.

The present invention has been made to solve the problems as described above, and one object of the present invention is to provide a working position of a part on a workpiece having a three-dimensional shape and the height of the workpiece on the mounting member It is to provide a work work apparatus capable of suppressing the restriction of

A work work apparatus according to one aspect of the present invention transfers a work onto a mounting member on which a work having a three-dimensional shape is mounted, a holding unit for holding the work via the mounting member, and the holding unit And a head unit having a head that performs at least one of application of a liquid and / or mounting of parts on a workpiece, and the workpiece is placed on the mounting member when the workpiece is transferred by the head to the holding unit. When the work is carried out by the head after the work is transferred onto the holding unit, the work and the placement member are configured to be relatively movable in the direction in which the work and the placement member are separated.

In the work work apparatus according to one aspect of the present invention, as described above, when the work is transferred, the work is placed on the placement member, whereby the work and the load are transferred when the work is transferred. Since the placement member is not separated, it is possible to suppress the interference between the placement member and heads other than the head for transferring the work. Further, when the work by the head is performed on the work, the work position and the mounting member can be separated by separating the work and the mounting member, so the end portion of the work mounting member side It is possible to suppress the interference between the head and the mounting member due to the work. By these, it can suppress that the working position of a workpiece | work and the height of the workpiece | work on a mounting member are restrict | limited. As a result, while being able to work in a wide range of the work, it is possible to improve the freedom of the shape (height) of the work to be worked.

In the work work apparatus according to the above-described aspect, preferably, the work or the placement member has a gap between the work and the placement member by holding the placement member of the holding unit after the work is transferred onto the holding unit. It is configured to move relatively in the direction of increasing. According to this structure, without providing an additional member for increasing the distance between the work and the mounting member, the holding of the mounting member by the holding unit is used to increase the distance between the work and the mounting member. As a result, it is possible to suppress an increase in the size of the work work apparatus and an increase in the number of parts.

In the work operation apparatus in which the work and the mounting member move relative to each other by holding the holding unit, preferably, the mounting member includes a slide portion that moves in the first movement direction by holding by the holding unit. The distance between the work and the placement member is configured to increase with the movement of the slide portion in the first movement direction. According to this structure, the distance between the work and the placement member can be increased by the amount of movement of the slide portion in the first movement direction, so that the required space between the work and the placement member can be easily made. It can be provided.

In the work operation apparatus including the slide portion, preferably, the placement member further includes a biasing member for biasing the slide portion in a second movement direction opposite to the first movement direction, and the work and the placement member The distance between the two is made smaller with the movement of the slide portion in the second movement direction by the biasing of the biasing member. According to this structure, when the slide portion is moved in the first movement direction, the slide member can be automatically moved in the second movement direction by the biasing member. As a result, the configuration of the mounting member can be further suppressed from being complicated as compared with the case where the slide unit is moved in the first movement direction and the second movement direction using the sensor and the motor. Note that “the distance between the work and the placement member is reduced” means not only the state where the gap between the work and the placement part is reduced but also the state where the work and the placement part are in contact (the spacing is 0 State) is a broad concept.

In the work operation apparatus including the slide portion, preferably, the mounting member further includes a mounting member main body integrally including the slide portion and on which the workpiece is to be mounted, and a fixing portion to which the workpiece is attached; The gap between the work and the placement member is determined by the gap between the work and the placement member main body as the placement member main body moves in the first movement direction along with the movement of the slide portion in the first movement direction. It is comprised so that it may become large by becoming large. According to this structure, since the placement member main body of the placement member is moved in the first movement direction, not the work, the position of the work on the placement member is more than when the work is moved in the first movement direction. Deviation can be suppressed.

In the work operation apparatus including the slide portion, preferably, the mounting member further includes a fixing portion integrally having a mounting member main body on which the workpiece is mounted, the workpiece being attached to the slide portion, the workpiece The gap between the mounting member and the mounting member is large because the gap between the workpiece and the mounting member main body becomes large as the workpiece moves in the first moving direction along with the movement of the slide portion in the first moving direction. It is configured to be According to this structure, not the placement member main body of the placement member but the work is moved in the first movement direction, unlike the case where the placement member main body of the placement member is moved in the first movement direction, Since the placement member does not move along with the movement of the slide portion, it can be suppressed that the placement member is inclined.

In the work work apparatus including the slide portion, preferably, the holding unit holds the holding portion holding the work via the mounting member, and the tilt moving portion which tilts the holding portion around the tilt axis orthogonal to the vertical direction. In addition, while the holding unit holds the work and the holding unit is inclined by the inclined movement unit, the distance between the work and the placement member is increased by holding the holding unit of the holding unit. According to this structure, even in a state where the work is inclined by the inclination moving portion, the distance between the work and the mounting member can be increased. Therefore, the mounting member is inclined by the inclination moving portion. Even when the component is mounted on the end portion of the side surface portion on the mounting member side, interference between the head and the mounting member can be suppressed.

In this case, preferably, the head unit has a plurality of mounting heads as a head mounted on a work by adsorbing parts, and a predetermined mounting head of the plurality of mounting heads adsorbs the mounting member and holds the mounting unit In the state of being transferred, the work is placed in contact with the placement member. According to this structure, in a state in which the work is transferred to the holding unit, the work is not disposed at a position apart from the mounting member but is in contact with each other, and therefore, between the work and the mounting member The occurrence of the gap can be suppressed more reliably. Thereby, interference with the mounting head other than the predetermined mounting head and the work can be reliably suppressed.

In the work operation apparatus that holds the placement member by the holding unit, preferably, the slide unit has an inclined portion that is inclined toward the holding unit of the holding unit as it moves in the first movement direction, and the holding unit holding unit Causes the slide portion to move in the first movement direction along the inclination of the inclined portion and causes the mounting member main body or the work to move in the first movement direction by abutting and holding the inclined portion of the slide portion It is configured. According to this structure, movement of the mounting member main body or the work in the first movement direction can be realized by utilizing the simple configuration of the inclined portion provided in the slide portion, and thus the configuration of the mounting member Can be further suppressed.

The work work apparatus including the placement member provided with the placement member main body preferably further includes a height measurement unit that measures the height position of the surface of the placement member main body on the work side or the surface of the work. With this configuration, it is possible to determine whether the height position of the work-side surface of the mounting member main body or the surface of the work is lower or higher than the reference height position. By holding, whether or not the mounting member main body and the work relatively move in the separating direction can be reliably recognized.

According to the present invention, as described above, there is provided a work operation device capable of suppressing the restriction of the work position of the part on the work having a three-dimensional shape and the height of the work on the placement member. it can.

It is the top view which showed the whole structure of the component mounting apparatus by 1st and 2nd embodiment of this invention. It is the side view which showed the whole structure of the component mounting apparatus by 1st and 2nd embodiment of this invention. It is the perspective view which showed the holding | maintenance unit of the component mounting apparatus by 1st and 2nd embodiment of this invention. FIG. 6 is a block diagram showing a control device and a control configuration of the component mounting device according to the first and second embodiments of the present invention. It is the perspective view which showed the conveyance member of the component mounting apparatus by 1st and 2nd embodiment of this invention. It is the perspective view which showed the state by which the three-dimensional board | substrate was arrange | positioned on the mounting member of the component mounting apparatus by 1st and 2nd embodiment of this invention. FIG. 7A is a schematic view showing a state in which the electronic component is mounted on the end portion on the mounting member side of the side surface portion of the three-dimensional substrate in the comparative example. FIG. 7B is a schematic view showing a state in which the three-dimensional substrate in the comparative example is transferred. FIG. 8A is a schematic view showing a state in which the electronic component is mounted on the end portion on the mounting member side of the side surface portion of the three-dimensional substrate in the first embodiment. FIG. 8B is a schematic view showing a state in which the three-dimensional substrate in the first embodiment is transferred. It is the perspective view which showed the state which has arrange | positioned the three-dimensional board | substrate on the mounting member of the component mounting apparatus by 1st Embodiment of this invention. It is a disassembled perspective view of the mounting member of the component mounting apparatus by 1st Embodiment of this invention, and a three-dimensional board | substrate. FIG. 11A is a cross-sectional view showing a non-holding state in which the mounting member is not held by the holding portion of the holding unit. FIG. 11B is a cross-sectional view showing a holding state in which the mounting member is held by the holding portion of the holding unit. It is a flowchart of the three-dimensional board | substrate transfer processing flow performed in the control apparatus of the component mounting apparatus by 1st Embodiment of this invention. FIG. 13A is a schematic view showing the mounting head and the mounting member when transferring the mounting member. FIG. 13B is a schematic view showing the mounting member when the holding unit holds the mounting member. FIG. 13C is a schematic view showing a laser measurement unit that measures the height position of the mounting body in a state where the holding unit holds the mounting member. The component mounting apparatus by 1st Embodiment of this invention WHEREIN: It is the model which showed the state which mounts an electronic component in the edge part by the side of the mounting member of a three-dimensional board in the state which made the three-dimensional board inclined by the inclination mechanism part. It is the perspective view which showed the state which has arrange | positioned the three-dimensional board | substrate on the mounting member of the component mounting apparatus by 2nd Embodiment of this invention. It is a disassembled perspective view of the mounting member of the component mounting apparatus by 2nd Embodiment of this invention, and a three-dimensional board | substrate. FIG. 17A is a cross-sectional view showing a non-holding state in which the mounting member is not held by the holding portion of the holding unit. FIG. 17B is a cross-sectional view showing a holding state in which the mounting member is held by the holding portion of the holding unit. It is a flowchart of the three-dimensional board | substrate transfer processing flow performed in the control apparatus of the component mounting apparatus by 2nd Embodiment of this invention. FIG. 19A is a schematic view showing the mounting head and the mounting member when transferring the mounting member. FIG. 19B is a schematic view showing the mounting member when the holding unit holds the mounting member. FIG. 19C is a schematic view showing a laser measurement unit which measures the height position of the mounting body in a state where the holding unit holds the mounting member. FIG. 20A is a cross-sectional view showing a state in which a three-dimensional substrate is disposed on the placement member of the first modified example according to the first and second embodiments of the present invention. FIG. 20B is a cross-sectional view showing a state in which the mounting member and the three-dimensional substrate of the first modified example according to the first and second embodiments of the present invention are separated. FIG. 14 is a schematic view showing a partial configuration of a component mounting apparatus of a second modification according to the first and second embodiments of the present invention.

Hereinafter, an embodiment of the present invention will be described based on the drawings.

First Embodiment
A component mounting apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 13. Here, the conveyance direction of the conveyance member 71 on which the three-dimensional substrate P is placed and the opposite direction are taken as the X direction, and the direction orthogonal to the X direction in the horizontal direction is taken as the Y direction. Further, a direction orthogonal to the X direction and the Y direction is taken as a Z direction. The component mounting apparatus 1 is an example of the “work work apparatus” in the claims. The three-dimensional substrate P is an example of the “work” in the claims.

(Configuration of component mounting device)
The configuration of the component mounting apparatus 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

As shown in FIGS. 1 and 2, the component mounting apparatus 1 is a component mounting apparatus 1 for mounting an electronic component E such as an IC, a transistor, a capacitor, and a resistor on a three-dimensional substrate P. The electronic component E is an example of the “component” in the claims.

The component mounting apparatus 1 includes a transport unit 2, a head unit 3, a tape feeder 4, a head horizontal movement mechanism unit 5, a holding unit 6, a component imaging unit 7, a mark imaging unit 8, and a laser measurement unit 9. And the control device 10. The laser measurement unit 9 is an example of the “height measurement unit” in the claims.

The transport unit 2 is a transport device that carries in, transports, and unloads the transport member 71 (see FIG. 5) in which a plurality of placement members 80 on which the three-dimensional substrate P is placed is disposed. Specifically, the transport unit 2 has a pair of conveyors 21 arranged at positions separated from each other in the Y direction, and supports the both ends of the transport member 71 from below by the pair of conveyors 21. While conveying the conveying member 71 in the X direction. Further, the transport unit 2 transports the carried-in transport member 71 to the stop position ST and stops the transport member 71 at the stop position ST.

The head unit 3 includes a plurality of (six) mounting heads 31 for holding the electronic component E and mounting the held electronic component E on the three-dimensional substrate P, and is configured to be movable in the horizontal plane (in the XY plane) It is done. In the component mounting apparatus 1, a plurality of tape feeders 4 for supplying the electronic components E mounted on the three-dimensional substrate P are disposed on both sides (Y1 side and Y2 side) in the Y direction. The mounting head 31 of the head unit 3 holds the electronic component E supplied from the tape feeder 4. The mounting head 31 is an example of the “head” in the claims.

The plurality of mounting heads 31 are arranged in a line at equal intervals along the X direction, as shown in FIG. The plurality of mounting heads 31 have the same configuration. At the tip of the mounting head 31, a suction nozzle 31a for holding the electronic component E is detachably mounted. The mounting head 31 is connected to a vacuum source (not shown) provided in the component mounting apparatus 1. The mounting head 31 holds the electronic component E by adsorbing the electronic component E to the suction nozzle 31 a by negative pressure supplied from a vacuum source. In addition, the mounting head 31 releases the holding (suction) of the electronic component E by stopping the supply of the negative pressure from the vacuum source. Thus, the electronic component E is mounted on the three-dimensional substrate P.

The head unit 3 also includes a plurality of Z-axis moving mechanism units 32 provided for each mounting head 31. Each of the plurality of Z-axis moving mechanism units 32 has the same configuration. The Z-axis moving mechanism unit 32 is configured to move the mounting head 31 in the vertical direction (Z direction) by a ball screw shaft mechanism.

As shown in FIGS. 1 and 2, the head horizontal movement mechanism 5 is configured to move the head unit 3 in the horizontal plane (in the XY plane) above the three-dimensional substrate P (the transport member 71). There is. Specifically, the head horizontal movement mechanism 5 includes an X-axis movement mechanism 51 and a pair of Y-axis movement mechanisms 52.

The head unit 3 is attached to the X-axis moving mechanism 51, and the ball screw shaft mechanism is configured to move the head unit 3 in the X direction. The pair of Y-axis moving mechanism units 52 has an X-axis moving mechanism unit 51 attached, and is configured to move the X-axis moving mechanism unit 51 and the head unit 3 in the Y direction by a ball screw shaft mechanism. .

The holding unit 6 is configured to hold the three-dimensional substrate P via the placement member 80 (see FIG. 9) when the electronic component E is mounted on the three-dimensional substrate P by the head unit 3. Further, the holding unit 6 is configured to move, rotate, or tilt the held three-dimensional substrate P along the Z direction (vertical direction).

Specifically, as shown in FIG. 3, the holding unit 6 includes an elevation mechanism 61, an inclination mechanism 62, a rotation mechanism 63, and a holding portion 64. In the holding unit 6, the holding portion 64 is attached to the rotation mechanism portion 63, the rotation mechanism portion 63 is attached to the inclination mechanism portion 62, and the inclination mechanism portion 62 is attached to the elevating mechanism portion 61. In addition, the inclination mechanism part 62 is an example of the "inclination movement part" of a claim.

The elevating mechanism 61 has a drive motor 61a, and moves the three-dimensional substrate P held by the holder 64 along the vertical direction (Z direction) by the driving force of the drive motor 61a and the ball screw shaft mechanism. It is configured. The tilt mechanism portion 62 has a drive motor 62a, and is configured to rotate the three-dimensional substrate P held by the holding portion 64 around the rotation axis A1 extending along the horizontal direction by the drive force of the drive motor 62a. ing. Thus, the tilt mechanism unit 62 is configured to tilt the three-dimensional substrate P held by the holding unit 64. The rotation mechanism portion 63 has a drive motor 63a, and rotates the three-dimensional substrate P held by the holding portion 64 around a rotation axis A2 extending in a direction substantially orthogonal to the rotation axis A1 by the driving force of the drive motor 63a. Is configured as.

The holding unit 64 is configured to hold the three-dimensional substrate P via the mounting member 80. Specifically, the holding portion 64 has a plurality of (three) claw portions 64a, and the plurality of claw portions 64a are configured to hold and fix the placement member 80.

The component imaging unit 7 is a camera for component recognition that captures an image of the electronic component E absorbed by the mounting head 31 prior to the mounting operation of the electronic component E, as shown in FIG. 1. The mark imaging unit 8 is a camera for mark recognition that picks up a position recognition mark (not shown) attached to the three-dimensional substrate P prior to the mounting operation of the electronic component E. The position recognition mark is a mark for recognizing the position of the three-dimensional substrate P.

The laser measurement unit 9 is configured to measure the height position of the three-dimensional substrate P and the height position of the placement member 80. Specifically, the laser measurement unit 9 applies a laser beam to the three-dimensional substrate P or the placement member 80, and the three-dimensional substrate P (see FIG. 13C) or the placement member 80 (see FIG. 19C). By measuring the distance from the lower end position of the laser measurement unit 9 to the measurement position of the upper surface of the three-dimensional substrate P or the upper surface of the mounting member 80. Here, the height position is calculated based on the distance measured by the laser measurement unit 9 from the lower end position of the laser measurement unit 9 to the measurement position of the upper surface of the three-dimensional substrate P or the upper surface of the mounting member 80.

A plurality of (two) laser measurement units 9 are attached to the back side (the Y1 direction) of the head unit 3. The plurality of laser measurement units 9 are disposed on the X1 side and the X2 side, respectively. The laser measurement unit 9 is movable with the head unit 3 in the horizontal direction (X direction and Y direction) above the base.

As shown in FIG. 4, the control device 10 includes a memory 10 b having a CPU 10 a (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), etc., and controls the operation of the component mounting apparatus 1. Is configured as. Specifically, the control device 10 includes the transport unit 2, the head unit 3, the tape feeder 4, the X-axis moving mechanism unit 51, the Y-axis moving mechanism unit 52, the holding unit 6, the component imaging unit 7, the mark imaging unit 8 and The laser measurement unit 9 and the like are controlled according to a program stored in advance.

<Transporting member>
In the component mounting apparatus 1, as shown in FIG. 5, the three-dimensional substrate P is carried in the apparatus while being placed on the transport member 71, and is transported. The conveyance member 71 includes a plurality of placement members 80 and a conveyance body 72 placed on the conveyance unit 2. The three-dimensional substrate P is placed on each of the plurality of placement members 80. A plurality of placement members 80 are placed on the transport body 72. In the component mounting apparatus 1, by mounting the plurality of placement members 80 on the single conveyance body 72, it is possible to carry the plurality of three-dimensional substrates P into the component mounting apparatus 1 at one time. Further, the plurality of placement members 80 are placed so as to be separated from the carrier 72. In the component mounting apparatus 1, it is possible to separate the single mounting member 80 from the transport body 72 of the transport member 71 and to move the three-dimensional substrate P together with the separated mounting member 80.

That is, in the transport member 71, a plurality of (two) mounting heads 31 adsorb a portion other than the three-dimensional substrate P of the mounting member 80, whereby a single mounting member 80 is transported from the transport body 72 of the transport member 71. It is separated. Then, the separated mounting member 80 can be moved together with the head unit 3 by the X-axis moving mechanism unit 51 and the Y-axis moving mechanism unit 52 in a state where the mounting member 80 is adsorbed by the plurality of mounting heads 31. The separated three-dimensional substrate P is thus moved from the stop position ST (see FIG. 1) of the transport member 71 to the transfer position L (see FIG. 1) at which the mounting member 80 is transferred to the holding unit 64 on the holding unit 6. It is possible to move.

<Three-dimensional board>
As shown in FIG. 6, the three-dimensional substrate P has a three-dimensional shape compared to a flat plate shape. The three-dimensional substrate P may have any shape as long as it has a three-dimensional shape as compared to a flat plate shape, and the mounting head 31 has a plurality of mounted surfaces on which the electronic component E is mounted. It may be done. Further, a plurality of (two) engagement holes 73 for attaching the three-dimensional substrate P to the mounting member 80 are provided in the surface portion on the Z2 side (lower side) of the three-dimensional substrate P.

<Placement member>
Here, in the component mounting apparatus of the comparative example shown in FIG. 7A, the end portion on the mounting member side of the three-dimensional substrate P is in a state where the three-dimensional substrate P is inclined 90 degrees by the inclination mechanism portion of the holding unit. When mounting the electronic component E, the mounting head 31 and the mounting member interfere with each other. In order to avoid this interference, it is conceivable to arrange the spacer SP between the three-dimensional substrate P and the mounting member as in the component mounting apparatus of the comparative example shown in FIG. 7 (B). However, since the height position of the three-dimensional board P from the mounting member becomes high, the predetermined mounting head 31 sucks the mounting member to move the mounting member from the stop position to the transfer position. The mounting head 31 (or the mark imaging unit 8 or the like) other than the mounting head 31 may interfere with the three-dimensional substrate P. Therefore, in the component mounting apparatus, the mounting head 31 does not interfere with the mounting member when mounting the electronic component E, and the mounting head 31 does not interfere with the three-dimensional board P when transferring the mounting member. It will be necessary.

Therefore, the component mounting apparatus 1 according to the first embodiment can avoid interference between the mounting head 31 and the mounting member 80 when mounting the electronic component E, as shown in FIG. As shown to 8 (B), the mounting member 80 which can avoid interference with the mounting head 31 and the three-dimensional board | substrate P at the time of transfer of the mounting member 80 is provided. Hereinafter, the mounting member 80 will be described with reference to FIGS. 9 to 13. Here, the placement member 80 is a jig for holding the three-dimensional substrate P by the holding portion 64 of the holding unit 6.

The mounting member 80 is configured to be mounted such that the three-dimensional substrate P is in contact with the mounting member 80 when the three-dimensional substrate P is transferred onto the holding unit 6 by the mounting head 31. Furthermore, after the three-dimensional substrate P is transferred onto the holding portion 64 of the holding unit 6, the mounting member 80 performs the mounting operation of the electronic component E on the three-dimensional substrate P by the mounting head 31. The mounting member 80 is configured to be relatively movable in the direction in which the mounting member 80 and the mounting member 80 are separated. Specifically, as shown in FIGS. 9 and 10, the mounting member 80 includes the mounting member main body 81 and , A biasing member 82, and a fixing portion 83.

The placement member main body 81 is configured to be movable relative to the three-dimensional substrate P while the three-dimensional substrate P is placed. Specifically, the placement member main body 81 has a placement body 91 and a slide portion 92 provided integrally with the placement body 91. The mounting body 91 is formed in a flat plate shape larger than the surface portion on the mounting member main body 81 side of the three-dimensional substrate P. The mounting body 91 is formed in a rectangular shape in plan view. Further, in the mounting body 91, an insertion hole 93 through which the fixing portion 83 is inserted is formed at a substantially central portion. The insertion hole 93 penetrates the mounting body 91.

Here, the placement member main body 81 is configured to move relative to the three-dimensional substrate P in the direction in which the distance between the three-dimensional substrate P and the placement member 80 is increased. That is, with the movement of the slide portion 92 in the first movement direction M1 by the holding of the holding unit 6, the placement member main body 81 moves in the same first movement direction M1 as the movement direction of the slide portion 92. At this time, when the mounting member main body 81 is moved in the first movement direction M1, the height position of the three-dimensional substrate P is maintained by being fixed to the fixing portion 83. The first movement direction M1 is a direction in which the three-dimensional substrate P and the placement member 80 are separated.

The slide portion 92 is a first protrusion 92 a protruding from the surface of the mounting body 91 opposite to the three-dimensional substrate P, and a tip protruding from the tip of the first protrusion 92 a to the opposite side to the insertion hole 93. It has the 2 protrusion part 92b and the inclination part 92c provided in the front-end | tip part of the 2nd protrusion part 92b. The first protrusion 92a is formed in a quadrangular prism shape extending in a direction along the first movement direction M1. The second protrusion 92 b is formed in a quadrangular prism shape extending in a direction opposite to the insertion hole 93 in the direction orthogonal to the first movement direction M1. The inclined portion 92c is inclined to the opposite side to the insertion hole 93 as it goes in the first movement direction M1. Further, as shown in FIG. 11, since the inclined portion 92c is disposed at a position facing the holding portion 64, the inclined portion 92c is inclined toward the holding portion 64 in the first movement direction M1. Thus, the slide portion 92 is formed in an L shape.

As shown in FIG. 10, a plurality of (three) slide portions 92 are arranged on the mounting body 91. As shown in FIG. The plurality of slide portions 92 are arranged at equal intervals along the circumferential direction of the insertion hole 93. Here, as shown in FIG. 11, the plurality of slide portions 92 are disposed at positions corresponding to the plurality of claw portions 64 a provided in the holding portion 64 of the holding unit 6. The plurality of slide portions 92 respectively face the plurality of claw portions 64a. The plurality of claws 64a have the same configuration.

The biasing member 82 is configured to bias the slide portion 92 in a second movement direction M2 opposite to the first movement direction M1. Specifically, as shown in FIG. 11A, the biasing member 82 has one end attached to the surface of the mounting body 91 opposite to the three-dimensional substrate P, and the other end to the fixing portion 83. It is attached. Thus, the biasing member 82 extends in the second movement direction M2 on the basis of the other end attached to the fixed portion 83. Then, as shown in FIG. 11B, the biasing member 82 performs the first movement by the placement body 91 which moves in the first movement direction M1 along with the movement of the slide portion 92 in the first movement direction M1. It is compressed in the direction M1. Here, the biasing member 82 is configured by a coil spring. The second movement direction M2 is a direction in which the three-dimensional substrate P and the placement member 80 approach each other.

The fixing unit 83 is configured to fix the relative positional relationship of the three-dimensional substrate P mounted on the mounting member 80 with respect to the holding unit 64. Specifically, as shown in FIG. 10, the fixing portion 83 has a base portion 95 and a projecting portion 96.

The base portion 95 is formed in a cylindrical shape. The base portion 95 is formed larger than the biasing member 82 in a plan view. The slide portion 92 is inserted into the base portion 95, and a guide groove 95a is formed to guide the movement of the slide portion 92 in the first movement direction M1 and the second movement direction M2. The guide groove 95a is formed in a concave shape in which the outer peripheral portion of the base portion 95 is recessed radially inward. The guide groove 95a penetrates the base portion 95 in the first movement direction M1.

As shown in FIG. 11A, the protrusion 96 protrudes from the base 95 in the second movement direction M2. The projecting portion 96 is formed in a cylindrical shape (see FIG. 10) having a diameter that can be inserted into the insertion hole 93 of the mounting body 91. The protruding portion 96 has an engaging portion 96a provided at an end portion on the second movement direction M2 side so that the three-dimensional substrate P can be attached detachably. The engagement portion 96 a is configured to engage with the engagement hole 73 of the three-dimensional substrate P. Thus, the relative positional relationship of the three-dimensional substrate P placed on the placement member 80 with respect to the holder 64 can be prevented from being changed.

<Relative movement of the mounting member body relative to the three-dimensional substrate>
The relative movement of the placement member main body 81 with respect to the three-dimensional substrate P will be described below with reference to FIG.

As shown in FIG. 11A, in the non-holding state in which the mounting member 80 is not held by the holding portion 64 of the holding unit 6, the biasing member 82 performs the second movement with reference to the base portion 95 of the fixing portion 83. By extending in the direction M2, the slide portion 92 moves in the second moving direction M2 as the mounting body 91 of the mounting member main body 81 is pushed in the second moving direction M2. As described above, in the non-holding state, the distance between the three-dimensional substrate P and the placement member 80 decreases with the movement of the slide portion 92 in the second movement direction M2 due to the biasing of the biasing member 82. That is, the three-dimensional substrate P is placed in contact with the placement member 80. At this time, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 91 of the mounting member 80 and the holding portion 64 is separated.

As shown in FIG. 11B, in the holding state in which the mounting member 80 is held by the holding portion 64 of the holding unit 6, the claw portion 64a of the holding portion 64 abuts on the inclined portion 92c of the slide portion 92 and held. By doing this, the slide part 92 moves in the first movement direction M1 along the inclination of the inclined part 92c. The mounting body 91 also moves in the first movement direction M1 along with the movement of the slide portion 92 in the first movement direction M1. As a result, the biasing member 82 is compressed in the first movement direction M1 with reference to the base portion 95 of the fixing portion 83. As described above, in the holding state, the distance between the three-dimensional substrate P and the placement member 80 increases with the movement of the slide portion 92 in the first movement direction M1. At this time, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 91 of the mounting member 80 and the holding portion 64 becomes close.

(Flowchart of three-dimensional substrate transfer processing flow)
The three-dimensional substrate transfer processing flow will be described below with reference to FIGS. 12 and 13. In the three-dimensional substrate transfer processing flow, the three-dimensional substrate P in a state of being mounted on the mounting member 80 is moved from the stop position ST to the transfer position L, and the transfer unit L at the transfer position L P is a process of holding the sheet P via the mounting member 80.

As shown in FIG. 12, in step S <b> 1, the control device 10 causes the transport unit 2 to transport the transport member 71 to the stop position ST. In step S2, the control device 10 moves the head unit 3 to the stop position ST by the X-axis moving mechanism unit 51 and the Y-axis moving mechanism unit 52. In step S <b> 3, the control device 10 causes the Z-axis moving mechanism unit 32 to lower the mounting head 31 to adsorb the mounting body 91 of the mounting member 80. That is, as shown in FIG. 13A, in a state where the predetermined mounting head 31 of the plurality of mounting heads 31 sucks the mounting body 91 of the mounting member 80 and transfers it onto the holding unit 6, the three-dimensional substrate P Are placed in contact with the mounting body 91 of the mounting member 80. This prevents the mounting heads 31 other than the predetermined mounting head 31 from interfering with the three-dimensional substrate P.

As shown in FIG. 12, in step S4, the controller 10 raises the mounting head 31 to the transfer position L by the Z-axis moving mechanism 32, the X-axis moving mechanism 51, and the Y-axis moving mechanism 52. Let In step S5, the control device 10 causes the Z-axis movement mechanism unit 32 to lower the mounting head 31 to release the suction of the mounting body 91 of the mounting member 80 in step S5. In step S <b> 6, the control device 10 causes the holding portion 64 of the holding unit 6 to hold the placement member 80. That is, as shown in FIG. 13B, after the suction of the mounting body 91 by the mounting head 31 is released, the holding portion 64 of the holding unit 6 moves in the direction indicated by the arrow, and is mounted by the holding portion 64. In the holding state in which the placement member 80 is held, the placement member 80 moves relative to the three-dimensional substrate P, and the three-dimensional substrate P and the placement member 80 do not contact with each other. At this time, the distance between the three-dimensional substrate P and the placement body 91 of the placement member 80 is the movement of the placement body 91 of the placement member main body 81 in the first movement direction M1 as the slide portion 92 moves in the first movement direction M1. Along with the movement to the side, the gap S between the three-dimensional substrate P and the mounting body 91 of the mounting member main body 81 becomes larger as it becomes larger.

In step S <b> 7, the control device 10 causes the Z-axis moving mechanism unit 32 to raise the mounting head 31. In step S8, the control device 10 measures the height position of the surface of the mounting body 91 of the mounting member 80 on the side of the three-dimensional substrate P by the two laser measurement units 9. That is, as shown in FIG. 13C, the control device 10 measures the height position of the surface on the three-dimensional substrate P side of the mounting body 91 at an arbitrary first position by one laser measurement unit 9. Further, in the control device 10, the height position of the surface on the three-dimensional substrate P side of the mounting body 91 at the second position opposite to the first position via the three-dimensional substrate P is determined by the other laser measurement unit 9. measure. At this time, the control device 10 acquires the height position of the surface of the mounting body 91 on the three-dimensional substrate P side.

In step S9, the control device 10 determines whether the surface of the mounting body 91 on the side of the three-dimensional substrate P is disposed below the reference position. The control device 10 places the mounting member 80 by the holding portion 64 of the holding unit 6 when the surface on the three-dimensional substrate P side of the mounting body 91 is not disposed below the reference position (see FIG. 13C). Is determined not to be properly held, and the operation of the component mounting apparatus 1 is stopped. The control device 10 ends the three-dimensional substrate transfer processing flow when the surface on the three-dimensional substrate P side of the mounting body 91 is disposed below the reference position. Preferably, the surface of the mounting body 91 on the side of the three-dimensional substrate P is located below the threshold than the reference position.

(Mounting of electronic components with the three-dimensional substrate inclined)
A case will be described where the electronic component E is mounted on a portion of the side surface portion of the three-dimensional substrate P on the mounting member 80 side after such a three-dimensional substrate transfer processing flow is performed.

As shown in FIG. 14, the holding unit 64 of the holding unit 6 holds the three-dimensional substrate P via the placement member 80, and the three-dimensional substrate P is inclined by the inclination mechanism unit 62. The holding portion 64 holds a state in which the gap S is provided between the three-dimensional substrate P and the placement body 91 of the placement member main body 81. This makes it possible to avoid interference between the mounting head 31 for mounting the electronic component E on the portion on the mounting member 80 side of the side surface portion of the three-dimensional substrate P and the mounting member main body 81.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, in the component mounting apparatus 1, when the mounting member 80 is transferred by the mounting head 31 to the holding unit 6, the three-dimensional substrate P is mounted on the mounting member 80. Ru. Further, in the component mounting apparatus 1, when the electronic component E is mounted on the three-dimensional substrate P by the mounting head 31 after the three-dimensional substrate P is transferred to the holding unit 6, the three-dimensional substrate P and the mounting member 80 And are relatively movable in the direction away from each other. Thus, when the three-dimensional substrate P is transferred, the three-dimensional substrate P is mounted on the mounting member 80, whereby the three-dimensional substrate P and the mounting member 80 are transferred when the three-dimensional substrate P is transferred. Since the height position of the three-dimensional substrate P with respect to the placement body 91 of the placement member main body 81 does not change without separation, interference between the placement head 31 and the placement member 80 other than the placement head 31 for transferring the three-dimensional substrate P Can be suppressed. In addition, when the mounting operation by the mounting head 31 is performed on the three-dimensional substrate P, the three-dimensional substrate P and the placement member 80 are separated, so the placement position and the placement member 80 can be separated. The interference between the mounting head 31 and the mounting member 80 due to the mounting operation performed on the end of the three-dimensional substrate P on the mounting member 80 side can be suppressed. It can suppress that the mounting position of the three-dimensional board | substrate P and the height of the three-dimensional board | substrate P on the mounting member 80 are restrict | limited by these. As a result, mounting can be performed in a wide range of the three-dimensional substrate P, and the degree of freedom of the shape (height) of the three-dimensional substrate P can be improved.

In the first embodiment, as described above, the placement member 80 holds the three-dimensional substrate P and the placement member 80 by holding the placement member 80 of the holding unit 6 after the three-dimensional substrate P has been transferred onto the holding unit 6. It is configured to relatively move in the direction in which the distance from the placement member 80 is increased. As a result, without providing a new configuration for increasing the distance between the three-dimensional substrate P and the placement member 80, the distance between the three-dimensional substrate P and the placement member 80 using the holding of the placement member 80 by the holding unit 6 Can be increased, so that the increase in the size of the configuration of the component mounting apparatus 1 and the increase in the number of components can be suppressed.

Further, in the first embodiment, as described above, the placement member 80 includes the slide portion 92 which is moved in the first movement direction M1 by being held by the holding unit 6. The distance between the three-dimensional substrate P and the placement member 80 is configured to increase with the movement of the slide portion 92 in the first movement direction M1. As a result, the distance between the three-dimensional substrate P and the placement member 80 can be increased by the amount of movement of the slide portion 92 in the first movement direction M1, so that the space between the three-dimensional substrate P and the placement member 80 is necessary. The spacing can be easily provided.

In the first embodiment, as described above, the placement member 80 includes the biasing member 82 that biases the slide portion 92 in the second movement direction M2 opposite to the first movement direction M1. . The space between the three-dimensional substrate P and the placement member 80 is configured to be smaller along with the movement of the slide portion 92 in the second movement direction M2 due to the biasing of the biasing member 82. Thus, in a state where the slide portion 92 has moved in the first movement direction M1, the slide member 92 can be automatically moved in the second movement direction M2 by the biasing member 82. As a result, it is possible to suppress the complication of the configuration of the mounting member 80 more than when moving the slide portion 92 in the first movement direction M1 and the second movement direction M2 using a sensor and a motor.

In the first embodiment, as described above, the mounting member 80 integrally includes the slide portion 92, and the mounting member main body 81 on which the three-dimensional substrate P is mounted and the three-dimensional substrate P are attached. And a fixing portion 83. The space between the three-dimensional substrate P and the placement member 80 is determined by the movement of the placement member main body 81 in the first movement direction M1 along with the movement of the slide portion 92 in the first movement direction M1. The gap S with the positioning member main body 81 is configured to be larger as it is larger. Thereby, not the three-dimensional substrate P but the placement member main body 81 of the placement member 80 is moved in the first movement direction M1, so the placement member 80 is more than the case where the three-dimensional substrate P is moved in the first movement direction M1. Positional displacement of the upper three-dimensional substrate P can be suppressed.

In the first embodiment, as described above, the holding unit 6 holds the three-dimensional substrate P via the mounting member 80 and inclines the holding portion 64 about the tilt axis orthogonal to the vertical direction. And an inclination mechanism 62. While the holding unit 64 holds the three-dimensional substrate P and the holding unit 64 is inclined by the inclination mechanism unit 62, the distance between the three-dimensional substrate P and the placement member 80 is large by holding the holding unit 64 of the holding unit 6. It is configured to be Thus, even in a state where the three-dimensional substrate P is inclined by the inclination mechanism 62, the distance between the three-dimensional substrate P and the mounting member 80 can be increased. Even when the component is mounted on the end portion of the side surface portion of the three-dimensional substrate P on the mounting member 80 side by tilting, interference between the mounting head 31 and the mounting member 80 can be suppressed.

In the first embodiment, as described above, the head unit 3 has the mounting head 31 mounted on the three-dimensional substrate P by adsorbing the electronic component E. Then, in a state where the predetermined mounting head 31 of the plurality of mounting heads 31 sucks the mounting member 80 and transfers it onto the holding unit 6, the three-dimensional substrate P is mounted so as to contact the mounting member 80. It is done. Thus, in a state where the three-dimensional substrate P is transferred to the holding unit 6, the three-dimensional substrate P is not disposed at a position apart from the placement member 80 but contacts each other. Generation of the gap S can be more reliably suppressed. As a result, since the height position of the three-dimensional substrate P with respect to the mounting body 91 of the mounting member main body 81 does not change, the interference between the mounting head 31 other than the predetermined mounting head 31 and the three-dimensional substrate P can be reliably suppressed. it can.

Further, in the first embodiment, as described above, the slide portion 92 has the inclined portion 92c which is inclined toward the holding portion 64 of the holding unit 6 as it goes in the first movement direction M1. The holding portion 64 of the holding unit 6 abuts on and holds the inclined portion 92c of the slide portion 92, whereby the slide portion 92 moves in the first movement direction M1 along the inclination of the inclined portion 92c, and the mounting member main body 81 or the three-dimensional substrate P is configured to move in the first movement direction M1. Thus, movement of the placement member main body 81 or the three-dimensional substrate P in the first movement direction M1 can be realized by utilizing the simple configuration of the inclined part 92c provided in the slide part 92. It is possible to further suppress the complexity of the 80 configuration.

In the first embodiment, as described above, the component mounting apparatus 1 includes the laser measurement unit 9 that measures the height position of the surface of the mounting member main body 81 on the side of the three-dimensional substrate P or the surface of the three-dimensional substrate P. ing. This makes it possible to determine whether the height position of the surface of the mounting member main body 81 on the side of the three-dimensional substrate P or the surface of the three-dimensional substrate P is lower or higher than the reference height position. It is possible to reliably recognize whether or not the mounting member main body 81 and the three-dimensional substrate P have moved relative to each other in the separation direction by holding 6.

Second Embodiment
Next, the configuration of a component mounting apparatus 201 according to a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, unlike the first embodiment in which the placement member 80 moves in the direction away from the three-dimensional substrate P, the example in which the three-dimensional substrate P moves in the direction away from the placement body 291 of the placement member 280 explain. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

<Placement member>
As shown in FIGS. 15 and 16, the placement member 280 includes a placement member main body 281, a biasing member 82, and a slide portion 283.

The mounting member main body 281 is configured such that the three-dimensional substrate P is mounted. Specifically, the placement member main body 281 includes a placement body 291 and a fixing portion 292 provided integrally with the placement body 291.

The fixing portion 292 is configured such that the relative positional relationship of the mounting body 291 of the mounting member 280 with respect to the holding portion 64 does not change. Specifically, the fixing portion 292 has a base portion 295 and a receiving portion 296, as shown in FIG.

The base portion 295 is formed in a cylindrical shape. The base portion 295 is formed with an insertion hole 295 a into which the slide portion 283 is inserted. The base portion 295 is formed larger than the biasing member 82 in a plan view.

The plurality of (three) receiving portions 296 project from the base portion 295 in the second movement direction M2. The plurality of receiving portions 296 are arranged at regular intervals in the circumferential direction of the insertion hole 295 a of the base portion 295 with a predetermined gap. The slide portion 283 is inserted in the predetermined gap, and has a function of guiding the movement of the slide portion 283 in the first movement direction M1 and the second movement direction M2. Further, in a space surrounded by the plurality of receiving portions 296, an insertion space into which the slide portion 283 is inserted is formed. The plurality of receiving portions 296 are formed in a fan shape in bottom view.

Here, the three-dimensional substrate P is configured to move relative to the placement member main body 281 in the direction in which the distance between the three-dimensional substrate P and the placement member 280 becomes large. That is, the three-dimensional substrate P moves in the first movement direction M1 that is the same as the movement direction of the slide portion 283 as the slide portion 283 moves in the first movement direction M1 due to the holding of the holding unit 6. At this time, when the three-dimensional substrate P moves in the first movement direction M1, the height position of the placement member main body 281 is held.

Specifically, as shown in FIG. 16, the slide portion 283 has a cylindrical core portion 283 a and a quadrangular prism-shaped projection 283 b. An engaging portion 96a is provided on an end face of the core 283a on the side of the three-dimensional substrate P so that the three-dimensional substrate P can be detachably attached. The length in the first movement direction M1 of the core portion 283a is such a length that the engagement portion 96a can be engaged with the engagement hole 73 of the three-dimensional substrate P after passing through the insertion space, the insertion hole 295a and the insertion hole 93. Have

The protrusion 283 b protrudes radially outward from the core 283 a. Further, the projecting portion 283 b has an inclined portion 283 c provided at an end opposite to the core portion 283 a. The inclined portion 283c is inclined to the opposite side to the core portion 283a as it goes in the first movement direction M1. That is, as shown in FIG. 17A, since the inclined portion 283c is disposed at a position facing the claw portion 64a of the holding portion 64, the inclined portion 283c is inclined toward the holding portion 64 in the first movement direction M1. doing.

As shown in FIG. 16, a plurality of (three) protruding portions 283 b are arranged on the core portion 283 a. The plurality of projecting portions 283 b are arranged at equal intervals along the circumferential direction of the core portion 283 a. Here, as shown in FIG. 17, the plurality of projecting portions 283 b are disposed at positions corresponding to the plurality of claw portions 64 a provided in the holding portion 64 of the holding unit 6. The plurality of protruding portions 283 b respectively face the plurality of claws 64 a.

As shown in FIG. 17A, the biasing member 82 has one end attached to the base 295 of the fixed portion 292 and the other end attached to the projection 283 b of the slide 283. Thus, the biasing member 82 extends in the second movement direction M2 based on the other end portion attached to the fixed portion 292. Then, as shown in FIG. 17B, the biasing member 82 is compressed in the first movement direction M1 as the slide portion 283 moves in the first movement direction M1. The remaining structure of the second embodiment is similar to that of the first embodiment.

<Relative movement of the mounting member body relative to the three-dimensional substrate>
The relative movement of the placement member body 281 relative to the three-dimensional substrate P will be described below with reference to FIG.

As shown in FIG. 17A, in the non-holding state in which the mounting member 280 is not held by the holding portion 64 of the holding unit 6, the biasing member 82 performs the second movement with reference to the base portion 295 of the fixing portion 292. By extending in the direction M2, the protrusion 283b of the slide portion 283 is pushed in the second movement direction M2, and the three-dimensional substrate P is moved in the second movement direction M2. As described above, in the non-holding state, the distance between the three-dimensional substrate P and the placement member 280 decreases with the movement of the slide portion 283 in the second movement direction M2 due to the biasing of the biasing member 82. That is, the three-dimensional substrate P is placed in contact with the placement member 80. Further, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 291 of the mounting member 280 and the holding portion 64 is close.

As shown in FIG. 17B, in the holding state where the mounting member 280 is held by the holding portion 64 of the holding unit 6, the claw portion 64a of the holding portion 64 abuts on the inclined portion 283c of the slide portion 283 and held As a result, the slide portion 283 moves in the first movement direction M1 along the inclination of the inclined portion 283c. Here, the holding portion 64 suppresses the movement of the mounting member main body 281 in the first movement direction M1 by the claw portions 64a being in contact with the surface portions of both end portions in the circumferential direction of the plurality of receiving portions 296 . Then, along with the movement of the slide portion 283 in the first movement direction M1, the three-dimensional substrate P is also moved in the first movement direction M1. At this time, the biasing member 82 is compressed in the first movement direction M1 with reference to the base portion 295 of the fixed portion 292. Thus, in the holding state, the distance between the three-dimensional substrate P and the placement member 280 increases with the movement of the slide portion 283 in the first movement direction M1. That is, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 becomes close, and the relative positional relationship between the mounting body 291 of the mounting member 280 and the holding portion 64 does not change.

(Flowchart of three-dimensional substrate transfer processing flow)
The three-dimensional substrate transfer processing flow will be described below with reference to FIGS. 18 and 19.

As shown in FIG. 18, steps S1 to S3 are the same processing as the three-dimensional substrate transfer processing flow of the first embodiment, so the description will be omitted. Here, in the process of step S3, as shown in FIG. 19A, the predetermined mounting head 31 of the plurality of mounting heads 31 sucks the mounting body 291 of the mounting member 280 and transfers it onto the holding unit 6. In this state, the three-dimensional substrate P is placed in contact with the placement body 291 of the placement member 280. This prevents the mounting heads 31 other than the predetermined mounting head 31 from interfering with the three-dimensional substrate P.

As shown in FIG. 18, steps S4 to S6 are the same processing as the three-dimensional substrate transfer processing flow of the first embodiment, so the description will be omitted. Here, in the process of step S6, as shown in FIG. 19B, after the suction of the mounting body 291 by the mounting head 31 is released, the holding portion 64 of the holding unit 6 holds the mounting member 280. In the state, the three-dimensional substrate P moves relative to the placement member 280, and the three-dimensional substrate P and the placement member 280 do not contact with each other. At this time, the distance between the three-dimensional substrate P and the placement body 291 of the placement member 280 is in accordance with the movement of the three-dimensional substrate P in the first movement direction M1 as the slide portion 283 moves in the first movement direction M1. The gap S between the three-dimensional substrate P and the mounting body 291 of the mounting member main body 281 becomes larger as it becomes larger.

Step S7 is the same processing as the three-dimensional substrate transfer processing flow of the first embodiment, so the description will be omitted. In step S21, the control device 10 causes the laser measurement unit 9 to measure the height position of the surface of the three-dimensional substrate P opposite to the mounting member 280 (see FIG. 19C).

In step S22, the control device 10 determines whether or not the surface of the three-dimensional substrate P opposite to the mounting member 280 side is disposed upward from the reference position (see FIG. 19C). In the control device 10, when the surface opposite to the mounting member 280 side of the three-dimensional substrate P is not disposed above the reference position, the holding of the mounting member 280 by the holding portion 64 of the holding unit 6 is appropriate. It is determined that the operation of the component mounting apparatus 201 is stopped. The control device 10 ends the three-dimensional substrate transfer processing flow when the surface of the three-dimensional substrate P opposite to the mounting member 280 is disposed above the reference position.

(Effect of the second embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the placement member 280 further includes the fixing portion 292 integrally including the placement member main body 281 on which the three-dimensional substrate P is placed. The three-dimensional substrate P is attached to the slide portion 283. The space between the three-dimensional substrate P and the placement member 280 is the three-dimensional substrate P and the placement member main body as the three-dimensional substrate P moves in the first movement direction M1 along with the movement of the slide portion 283 in the first movement direction M1. It is configured to be increased by increasing the gap S between it and 281. Thus, since the three-dimensional substrate P is moved in the first movement direction M1 instead of the mounting member main body 281, the mounting member 280 slides as in the case of moving the mounting member main body 281 in the first movement direction M1. Since it does not move with the movement of the part 283, it can suppress that the mounting member 280 inclines. The remaining effects of the second embodiment are similar to those of the first embodiment.

(Modification)
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the above description of the embodiment but by the scope of claims, and further includes all modifications (variations) within the meaning and scope equivalent to the scope of claims.

For example, in the first and second embodiments, the slide portion 92 (283) is moved in the first movement direction M1 by the holding portion 64 to increase the distance between the three-dimensional substrate P and the placement member 80 (280). Although an example is shown, the present invention is not limited to this. In the present invention, as shown in FIG. 20 as a first modified example of the first and second embodiments, the holder 64 has a cylinder 301 movable in the first movement direction M1 and the second movement direction M2. It is also good. In this case, as shown in FIG. 20A, the slide portion 392 moves in the first movement direction M1 by moving the cylinder 301 in the first movement direction M1. Then, as shown in FIG. 20B, by moving the cylinder 301 in the second movement direction M2, the slide portion 392 moves in the second movement direction M2 by the biasing force of the biasing member 82.

In the first and second embodiments, the predetermined mounting head 31 sucks the mounting body 91 (291) of the mounting member 80 (280) to reach the transfer position L to the transfer position L (280 Although the example which moves upper three-dimensional substrate P was shown, the present invention is not limited to this. In the present invention, as shown in FIG. 21 as a second modification of the first and second embodiments, the transport unit 2 directly transports the placement member 80 (280), and the holding unit 6 is directly held at the stop position ST. The portion 64 may hold the mounting member 80 (280).

In the first and second embodiments, the component mounting apparatus 1 (201) includes the head unit 3 having the mounting head 31 for mounting the electronic component E on the three-dimensional substrate P as a head. Although shown, the present invention is not limited to this. In the present invention, the component mounting apparatus may be a composite component mounting apparatus including a head unit having a dispensing head for applying a liquid such as an adhesive as well as the mounting head as a head.

Moreover, although the component mounting apparatus 1 (201) showed the example provided with the mounting member 80 (280) in said 1st and 2nd embodiment, this invention is not limited to this. In the present invention, the coating device may include the placement member.

Further, in the first and second embodiments, in the transport member 71, the plurality of (two) mounting heads 31 adsorb the portion other than the three-dimensional substrate P of the placement member 80 (280), thereby the transport member 71. Although the example which isolate | separates the single mounting member 80 (280) from the conveyance body 72 of is shown, this invention is not limited to this. In the present invention, a single mounting member may be separated from the carrier of the carrier by one or more mounting heads.

In the first and second embodiments, for convenience of explanation, the processing operation of the control device 10 has been described using a flow drive type flowchart that sequentially processes along the processing flow, but the present invention It is not limited. In the present invention, the processing operation of the control device may be performed by an event driven type (event driven type) processing that executes processing on an event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

Moreover, in the said, 1st and 2nd embodiment, although the three-dimensional board | substrate P was shown as an example of a "work" of a claim, this invention is not limited to this. In the present invention, the “workpiece” in the claims may be an object other than the three-dimensional substrate.

Moreover, in the said, 1st and 2nd embodiment, although the component mounting apparatus 1 was shown as an example of the "work work apparatus" of a claim, this invention is not limited to this. In the present invention, the “work work device” in the claims may be a workpiece work device that carries out work on a three-dimensional object on which the electronic component is mounted by the mounting head.

In the first and second embodiments, the plurality (two) of laser measurement units 9 are attached to the back side (the Y1 direction) of the head unit 3, but the present invention is not limited thereto. I can not. In the present invention, one or three or more laser measurement units may be attached to the back side (the Y1 direction) of the head unit.

1, 201 Component mounting device (work work device)
3 Head unit 6 Holding unit 9 Laser measurement unit (height measurement unit)
31 Mounting head (head)
62 Tilting mechanism (tilting moving part)
64 holding portion 80, 280 mounting member 81, 281 mounting member main body 82 biasing member 83, 292 fixing portion 92, 283 sliding portion 92c, 283c inclined portion M1 first moving direction M2 second moving direction P three-dimensional substrate (workpiece )
S gap

Claims (10)

A mounting member on which a workpiece having a three-dimensional shape is mounted;
A holding unit for holding the work via the mounting member;
A head unit having a head for transferring the work onto the holding unit and performing at least one of application of a liquid agent and mounting of a part on the work;
When the work is transferred onto the holding unit by the head, the work is placed on the placing member, and after the work is transferred onto the holding unit, the head is moved to the work by the head. A work work apparatus configured to be relatively movable in a direction in which the work and the placement member are separated when the work is performed. The workpiece or the placement member is relative to the workpiece in a direction in which the distance between the workpiece and the placement member is increased by holding the placement member of the holding unit after the work is transferred to the holding unit. The work work apparatus according to claim 1, wherein the work work apparatus is configured to move in a stationary manner. The placement member includes a slide portion which moves in a first movement direction by being held by the holding unit,
The work work apparatus according to claim 2, wherein a distance between the work and the placement member is configured to increase as the slide portion moves in the first movement direction. The placement member further includes a biasing member for biasing the slide portion in a second movement direction opposite to the first movement direction,
4. The apparatus according to claim 3, wherein a distance between the work and the placement member decreases as the slide portion is moved in the second movement direction by biasing of the biasing member. Work work equipment. The mounting member further includes a mounting member main body integrally including the slide portion and on which the work is mounted, and a fixing portion to which the work is mounted;
The space between the work and the placing member is determined by the movement of the placing member main body in the first movement direction along with the movement of the slide portion in the first movement direction. The work work apparatus according to claim 3, wherein the work work apparatus is configured to be larger as a gap between the main body and the member main body is larger. The placement member further includes a fixing portion integrally including a placement member main body on which the work is placed;
The work is attached to the slide portion,
The distance between the work and the placement member is determined by the movement of the work in the first movement direction along with the movement of the slide portion in the first movement direction. The work work apparatus according to claim 3, wherein the work work apparatus is configured to become larger as the gap between the two becomes larger. The holding unit includes a holding portion for holding the work via the mounting member, and a tilt moving portion for tilting the holding portion around a tilt axis orthogonal to the vertical direction,
In a state where the holding unit holds the work and the holding unit is inclined by the inclined moving unit, the distance between the work and the placing member is increased by holding the holding unit of the holding unit. The work work apparatus according to any one of claims 3 to 6, which is configured in The head unit has a plurality of mounting heads as the head mounted on the work by sucking the parts.
In a state where a predetermined mounting head of the plurality of mounting heads sucks the mounting member and transfers the mounting member to the holding unit, the work is mounted so as to be in contact with the mounting member. The work work apparatus according to claim 7. The slide portion has an inclined portion which inclines toward the holding portion side of the holding unit as it goes in the first movement direction,
When the holding portion of the holding unit abuts on and holds the inclined portion of the slide portion, the slide portion moves in the first movement direction along the inclination of the inclined portion, and the placing member The work work apparatus according to claim 7, wherein the main body or the work is configured to move in the first movement direction. 7. The work work apparatus according to claim 5, further comprising: a height measurement unit configured to measure a height position of the surface on the workpiece side of the placement member main body or the surface of the workpiece.

Images