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WO2019190031A1 - Dispositif de transfert de micro-éléments et procédé de transfert de micro-éléments - Google Patents

Dispositif de transfert de micro-éléments et procédé de transfert de micro-éléments Download PDF

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Publication number
WO2019190031A1
WO2019190031A1 PCT/KR2018/016991 KR2018016991W WO2019190031A1 WO 2019190031 A1 WO2019190031 A1 WO 2019190031A1 KR 2018016991 W KR2018016991 W KR 2018016991W WO 2019190031 A1 WO2019190031 A1 WO 2019190031A1
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WO
WIPO (PCT)
Prior art keywords
adsorption
transfer film
transfer
target substrate
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/016991
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English (en)
Korean (ko)
Inventor
황보윤
김재현
윤성욱
김경식
김창현
최병익
김정엽
장봉균
김광섭
이학주
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Machinery and Materials KIMM
Center for Advanced Meta Materials
Original Assignee
Korea Institute of Machinery and Materials KIMM
Center for Advanced Meta Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Institute of Machinery and Materials KIMM, Center for Advanced Meta Materials filed Critical Korea Institute of Machinery and Materials KIMM
Publication of WO2019190031A1 publication Critical patent/WO2019190031A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other

Definitions

  • the present invention relates to a micro element transfer apparatus and a micro element transfer method, and more particularly, to a micro element transfer apparatus and a transfer method for transferring a micro element to a target substrate.
  • Displays using micro devices such as LEDs are in the spotlight as the next generation of advanced displays that will replace conventional displays.
  • the key to making these displays is the technology of transferring each LED device to a modular circuit board.
  • Another method is to transfer the device using an electrostatic chuck technique.
  • the device when applied to a thin device, the device may be damaged by static electricity and may be affected by surface contamination of the device. This can be degraded.
  • a thin film device having a very thin thickness may employ a technology of continuously transferring the adhesive force using a micro / nano scale.
  • the micro device array arranged on the source substrate is adhered to the transfer film, and the micro device is adhered to the solder applied to the electrode of the target substrate to transfer the micro device to the target substrate.
  • Such a transfer method may be largely divided into a method using a roller and a method using a pressure plate according to a method of pressing the micro device onto the target substrate.
  • the adhesive force of the solder in order to increase the transfer efficiency of the micro device, must be greater than the adhesive force between the transfer film and the micro device so that the micro device can be easily separated from the transfer film while the micro device is adhered to the target substrate. have.
  • Embodiments of the present invention provide a micro device transfer apparatus and a micro device transfer method capable of improving the transfer process efficiency of the micro device.
  • a micro device transferring apparatus includes: a first adsorption part to which a micro film adhered to a transfer film is adsorbed, a target substrate is seated, and a transfer film provided from the first adsorption part is adsorbed to the micro device; A second adsorption part, a transfer part for transferring the second adsorption part in a first horizontal direction, a pressurizing part for transferring the micro element to the target substrate by pressing the transfer film to be transferred, and the first adsorption part in the first horizontal direction; And a guide part provided at a front end of the pressing part in a transport path of the guide part to guide the transfer film passing through the pressing part away from the target substrate to separate the transfer film from the micro device.
  • the first adsorption part may include a first bed on which the transfer film is adsorbed, a first negative pressure providing groove formed on one surface of the first bed, and providing a negative pressure between the first bed and the transfer film and the transfer film.
  • the micro device may include a rotating part for rotating the first bed to face the target substrate of the second adsorption part.
  • the display device may further include an alignment unit for aligning the position of the second adsorption unit so that the target substrate and the transfer film are aligned.
  • the alignment unit includes a base disposed on the transfer unit, a first slider coupled to the base to be slidable in the first horizontal direction, and sliding to a second horizontal direction perpendicular to the first horizontal direction on the first slider.
  • a rotator provided on the second slider coupled to the second slider and capable of supporting the second adsorption unit, and rotating the second adsorption unit about a vertical axis perpendicular to the first horizontal direction and the second horizontal direction; It may include.
  • a first alignment mark may be formed on the transfer film, and a second alignment mark may be formed on the target substrate, and the photographing unit may further include a photographing unit configured to photograph positions of the first alignment mark and the second alignment mark. have.
  • the first adsorption part is located above the second adsorption part, the first bed is made of an opaque material, a through hole is formed at a position corresponding to the second alignment mark, and the photographing part is the first adsorption part. It is provided on the upper side can take the second alignment mark through the through hole.
  • the first adsorption part is located above the second adsorption part, the first bed is made of a transparent material, and the photographing part is provided on the upper side of the first adsorption part, and passes through the first bed to the second surface. You can shoot inmarks.
  • the second adsorption part may include a second bed having a mounting recess formed on an upper surface of the second substrate to be seated on the target substrate, and the transfer film and the second bed provided on one surface of the second bed. It may include a second negative pressure providing groove for providing a negative pressure therebetween to temporarily adhere the micro device of the transfer film on the target substrate.
  • the guide portion may be moved to adjust a bending angle of bending the transfer film passing through the pressing portion.
  • the pressing unit may include a pressing roller for pressing the transfer film disposed on the second adsorption unit toward the target substrate, and the guide unit may be rotated about a rotation axis of the pressing roller to adjust the bending angle.
  • micro device transfer method the first adsorption step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit, the second adsorption step of adsorbing the target substrate to the second adsorption unit And provisionally attaching the transfer film to the second adsorption part by attaching the micro element of the transfer film to the target substrate, and a transfer unit transfers the second adsorption part in a first horizontal direction.
  • the transfer step the pressing portion presses the transfer film of the second adsorption portion to transfer the micro device to the target substrate and the guide portion provided at the front end of the pressing portion in the transfer path in the first horizontal direction
  • the transfer film is positioned on the first adsorption part, and a negative pressure is provided between the first adsorption part and the transfer film through a first subcompression providing groove to transfer the transfer film to the first adsorption part. Can be adsorbed.
  • the target substrate may be positioned in a seating groove of the second adsorption part, and a negative pressure may be provided between the seating recess and the target substrate to adsorb the target substrate to the second adsorption part.
  • the alignment step may include a rotation step of rotating the first adsorption part such that the micro device adhered to the transfer film of the first adsorption part faces the target substrate, a first alignment mark in which a photographing part is formed on the transfer film;
  • a photographing step of photographing a second alignment mark formed on the target substrate and the alignment unit move the second suction unit in a second horizontal direction perpendicular to the first horizontal direction and the first horizontal direction, and the first horizontal direction.
  • the photographing part is disposed above the first adsorption part made of an opaque material, and marks the second alignment mark positioned below the first adsorption part through a through hole formed in the first adsorption part. You can shoot.
  • the photographing part may be disposed above the first adsorption part made of a transparent material, and may photograph the second alignment mark positioned below the first adsorption part by passing through the first adsorption part.
  • the descending step of lowering the first adsorption part toward the second adsorption part after the positioning step by providing a negative pressure between the transfer film and the second adsorption part disposed in the correct position the transfer film It may include a fixing step for fixing to the second adsorption portion.
  • the guide portion is moved to adjust the bending angle of the transfer film bent past the pressing portion.
  • Embodiments of the present invention can provide a micro device transfer device and a micro device transfer method that can effectively improve the transfer process efficiency of the micro device.
  • FIG. 1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • FIG. 2 is an exemplary view showing a first adsorption part and a second adsorption part of a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • FIG 3 is an operation example showing a center of the first adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG 4 is an operation example showing the first adsorption portion and the second adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG. 5 is an enlarged exemplary view illustrating a micro device and a target substrate of FIG. 4.
  • FIG. 6 is an exemplary view showing a pressing part and a guide part of the micro device transferring apparatus according to the exemplary embodiment of the present invention.
  • Figure 7 is an exemplary view showing an operation example centering on the pressing portion and the guide portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG 8 is an exemplary view showing an operation example centering on the guide of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG. 9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
  • a component when referred to as being 'connected' or 'connected' to another component, the component may be directly connected to or connected to the other component, but in between It will be understood that may exist.
  • a component when referred to as 'directly connected' or 'directly connected' to another component, it should be understood that there is no other component in between.
  • the term 'comprises' or 'having' is only intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more. It is to be understood that it does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, actions, components, parts or combinations thereof.
  • 'and / or' includes any combination of the plurality of listed items or any of the plurality of listed items.
  • 'A or B' may include 'A', 'B', or 'both A and B'.
  • the front / front and rear / rear ends will be described based on the transfer direction of the transfer film 10. That is, when the transfer film 10 is moved from the first point to the second point, it will be described with the first point as the front end / front end and the second point as the rear end / back end.
  • FIG. 1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • the micro device electronic device may include a first adsorption part 100, a second adsorption part 200, an alignment part 300, a transfer part 400, and a pressing part ( 500 and the guide 600.
  • the transfer film 10 to which the micro device is attached may be adsorbed to the first adsorption part 100.
  • the second adsorption part 200 may be provided below the first adsorption part 100, and a target substrate on which the micro device adhered to the transfer film 10 may be adsorbed to the second adsorption part 200. have.
  • the alignment unit 300 may be provided at the lower side of the second adsorption unit 200 to align the positions of the second adsorption unit 200 such that the target substrate and the transfer film 10 are aligned.
  • the transfer unit 400 may transfer the alignment unit 300 and the second adsorption unit 200 in the first horizontal direction.
  • the second adsorption part 200 may be provided in a state where the micro elements of the target substrate 30 and the transfer film 10 are temporarily attached.
  • the pressing unit 500 may be provided on a transfer path in the first horizontal direction in which the second adsorption unit 200 is transferred.
  • the pressing unit 500 may press the transfer film 10 on the upper portion of the second adsorption unit 200 to allow the micro device to be transferred to the target substrate.
  • the guide part 600 may be provided at the front end of the pressing part on a transport path in the first horizontal direction in which the second suction part 200 is transferred.
  • the guide part 600 may guide the transfer film 10 to be bent upwards at a point passing through the pressing part 500.
  • the transfer film 10 may be separated from the micro device being transferred while moving upward. That is, since the micro device is pressed by the pressing unit 500 at the time when the transfer film 10 is separated from the micro device, the micro device may be prevented from sticking back to the transfer film 10 and falling off the target substrate. Can be.
  • the transfer element 10 may be separated from the transferred micro element while the micro element is pressed by the pressing unit 500 to be transferred to the target substrate 30, the transfer film 10 and the micro element may be separated. Stable transfer can be achieved without precise control of adhesion to the liver.
  • the micro device is pressed by the pressing unit 500, so that the micro device is a target substrate even if the transfer film 10 is separated from the micro device.
  • the state transferred to 30 can be effectively maintained.
  • FIG. 2 is an exemplary view showing a first adsorption portion and a second adsorption portion of a micro device transfer apparatus according to an embodiment of the present invention
  • FIG. 3 is a first view of the micro device transfer apparatus according to an embodiment of the present invention.
  • 4 is an operation example showing the adsorption unit
  • FIG. 4 is an operation example showing the first adsorption unit and the second adsorption unit
  • FIG. 5 is a micro diagram of FIG. 4 according to an embodiment of the present invention.
  • the first adsorption part 100 may have a first bed 110, a first negative pressure providing groove 111, and a rotating part 120.
  • the transfer film 10 to which the micro device 20 is adhered may be adsorbed onto the first bed 110.
  • the micro device 20 may be provided in an array form.
  • the first alignment mark 11 may be formed on the transfer film 10. A plurality of first alignment marks 11 may be formed.
  • the first negative pressure providing groove 111 may be formed on an upper surface of the first bed 110. At least a portion of the first negative pressure providing groove 111 may be connected to the lower surface of the first bed 110 through the first bed 110 and may be connected to a negative pressure generating unit (not shown).
  • the negative pressure generated by the negative pressure generating unit may provide a negative pressure between the upper surface and the transfer film 10 placed on the upper surface of the first bed 110 through the first negative pressure providing groove 111. 10 may be adsorbed onto the first bed 110.
  • the negative pressure may include a vacuum pressure.
  • the first negative pressure providing groove 111 may be entirely formed on the upper surface of the first bed 110 so that the adsorption force between the upper surface of the first bed 110 and the transfer film 10 may be stably generated.
  • the rotating part 120 may be provided under the first bed 110 and may rotate the first bed 110.
  • the micro device 20 may be in a state of being adhered to the upper surface of the transfer film 10.
  • the transfer film 10 adsorbed on the upper surface of the first bed 110 moves to the lower portion of the first bed 110.
  • the position is moved, and the micro device 20 adhered to the transfer film 10 may be positioned to face the upper surface of the target substrate 30.
  • the first bed 110 may be made of an opaque material, and the through hole 112 may be formed in the thickness of the first bed 110 in the first bed 110.
  • the second alignment mark 31 may be formed on the target substrate 30 so as to correspond to the first alignment mark 11, and the through hole 112 may include the first alignment mark 11 and the second alignment. It may be formed at a position corresponding to the mark 31.
  • the second adsorption part 200 may have a second bed 210 and a second negative pressure providing groove 212.
  • a mounting groove 211 may be formed in an upper portion of the second bed 210, and a target substrate 30 may be mounted in the mounting groove 211.
  • the second alignment mark 31 may be formed on the upper surface of the target substrate 30.
  • the upper surface of the target substrate 30 may correspond to the upper surface of the second bed 210. That is, the upper surface of the target substrate 30 seated in the seating groove 211 may be disposed on the same plane as the upper surface of the second bed 210.
  • the second negative pressure providing groove 212 may be formed on an upper surface of the second bed 210. Specifically, the second negative pressure providing groove 212 may be formed on the outside of the mounting groove 211. At least a portion of the second negative pressure providing groove 212 may be connected to the lower surface of the second bed 210 through the second bed 210 and may be connected to a negative pressure generating unit (not shown).
  • the micro device transfer device may include a photographing unit 700.
  • the photographing unit 700 may be provided on the upper side of the first adsorption unit 100, and the first adsorption unit 100 is rotated 180 degrees so that the micro device 20 faces the upper surface of the target substrate 30. In the through hole 112, the first alignment mark 11 and the second alignment mark 31 may be photographed.
  • the alignment unit 300 may be provided under the second adsorption unit 200, and may include a base 310, a first slider 320, a second slider 330, and a rotator 340. )
  • the base 310 may be provided at an upper portion of the transfer part 400, and may have a first guide 311 extending in a first horizontal direction (X-axis direction).
  • the first slider 320 is provided on the upper part of the base 310 and slidably coupled to the first guide 311 to reciprocate in the first horizontal direction (X-axis direction), thereby allowing the first slider ( 320 may move the second adsorption part 200 in the first horizontal direction (X-axis direction).
  • the first slider 320 may have a second guide 321 extending in a second horizontal direction (Y-axis direction) perpendicular to the first horizontal direction (X-axis direction).
  • the second slider 330 is provided on the upper part of the first slider 320 and slidably coupled to the second guide 321 to be reciprocated in the second horizontal direction (Y-axis direction).
  • the slider 330 may move the second adsorption part 200 in the second horizontal direction (Y-axis direction).
  • the rotator 340 may be provided at an upper portion of the second slider 330 and may be provided at a lower portion of the second adsorption portion 200.
  • the rotator 340 may be rotated about a vertical axis (Z axis) perpendicular to the first horizontal direction (X axis direction) and the second horizontal direction (Y axis direction). Through this, the rotator 340 may rotate the second adsorption part 200 about the vertical axis (Z axis).
  • the alignment unit 300 moves the second adsorption unit 200 in a first horizontal direction (X-axis) based on the first alignment mark 11 and the second alignment mark 31 photographed by the imaging unit 700.
  • Direction and the second horizontal direction (Y-axis direction) and rotate about the vertical axis (Z-axis) to adjust the position of the target substrate 30.
  • the second alignment mark 31 may be aligned with the first alignment mark 11, and the target substrate 30 and the micro device 20 may be aligned.
  • the first adsorption portion 100 may be lowered along the vertical guide 150.
  • the first bed 110 may be made of a transparent material.
  • the second alignment mark 31 formed on the target substrate 30 may be photographed by the photographing unit 700 through the first bed 110, and the above-described configuration of the through hole may be omitted. Can be.
  • the first terminal 21 of the micro device 20 is aligned on the upper side of the second terminal 32 of the target substrate 30. Can be located.
  • the solder 40 may be provided between the first terminal 21 and the second terminal 32.
  • the supply of the negative pressure is stopped in the first negative pressure providing groove 111, and the second negative pressure providing groove 212 is stopped.
  • negative pressure is formed between the upper surface of the second bed 210 and the transfer film 10 so that the transfer film 10 may be absorbed by the second bed 210.
  • the first terminal 21 and the second terminal 32 may be temporarily attached (see FIG. 5), and the transfer film 10 may be attached to the transfer unit 400 in a state of being adsorbed by the second bed 210. Can be transported by
  • a negative pressure providing groove may be further formed on the bottom surface of the mounting groove 211, and a negative pressure may be formed between the bottom surface of the target substrate 30 and the bottom surface of the mounting groove 211 through the negative pressure providing groove.
  • FIG. 6 is an exemplary view showing a pressing part and a guide of a micro device transferring apparatus according to an exemplary embodiment of the present invention
  • FIG. 7 illustrates a pressing part and a guide of a micro device transferring apparatus according to an embodiment of the present invention
  • 8 is an exemplary view showing an operation example
  • FIG. 8 is an exemplary view showing an operation example centering on a guide of a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • the pressing unit 500 may have a pressing roller 510 extending in the second horizontal direction (Y-axis direction).
  • the pressure roller 510 may be rotated about the rotation shaft 511 extending in the second horizontal direction (Y-axis direction).
  • the pressure roller 510 may be provided at the front end of the second adsorption part 200 on a transport path in the first horizontal direction (X-axis direction) in which the second adsorption part 200 is transferred.
  • the pressure roller 510 may press the transfer film 10 transferred in the first horizontal direction (X-axis direction).
  • the micro devices provided in the second horizontal direction (Y-axis direction) in the micro device 20 array transferred to the transfer film 10 may be simultaneously pressed by the pressure roller 510, and the target may be simultaneously pressed. It may be transferred to the substrate 30.
  • the guide part 600 may have a first guide roller 610 and a second guide roller 620, and the first guide roller 610 and the second guide roller 620. It may be provided at the front end of the pressure roller 510.
  • the first guide roller 610 may be provided extending in the second horizontal direction (Y-axis direction), and the lower surface of the transfer film 10 transferred in the first horizontal direction (X-axis direction). I can support it.
  • the second guide roller 620 may be provided in parallel with the first guide roller 610 on the upper side of the first guide roller 610, and may be provided spaced apart from the first guide roller 610 in the Z-axis direction. have.
  • a transfer film 10 transferred in the first horizontal direction (X-axis direction) may be inserted between the first guide roller 610 and the second guide roller 620.
  • the first guide roller 610, the second guide roller 620 and the pressure roller 510 may be coupled to the flange 630.
  • the first guide roller 610 and the second guide roller 620 may be rotated in the vertical direction about the rotation axis 511 of the pressure roller 510, through which, as shown in Figure 8 transfer film
  • the bending angle A of 10 may be adjusted.
  • the transfer film 10 It may be introduced between the first guide roller 610 and the second guide roller 620 (see Fig. 7 (a)).
  • the transfer film 10 is pressurized. It may be pressed by the roller 510. At this time, the transfer film 10 may be bent upward at the point passing the pressure roller 510 (see (b) of Figure 7).
  • the micro device 20 adhered to the transfer film 10 may be pressed by the pressure roller 510 to be transferred to the target substrate 30, and the micro device 20 may be transferred to the target substrate 30.
  • the transfer film 10 may be separated from the micro device 20 to be transferred.
  • the microfilm 20 is pressed by the pressure roller 510 and transferred to the target substrate 30, and at the same time, the transfer film 10 may be separated from the microdevice being transferred. Since the transfer film 10 and the micro device 20 can be a stable transfer without the precise level of adhesion control. That is, even when the adhesive force between the transfer film 10 and the micro element 20 is too strong, since the micro element 20 is pressed by the pressure roller 510, the transfer film 10 is the micro element 20. The micro device 20 may be transferred to the target substrate 30 even if the micro device 20 is removed from the target substrate 30.
  • the first guide roller 610 and the second guide roller 620 may adjust the bending angle A of the transfer film 10 according to the size, thickness, and surface state of the micro device 20. That is, since the adhesion between the micro device 20 and the transfer film 10 may vary according to the size, thickness, and surface state of the micro device 20, in order to separate the transfer film 10 from the transferred micro device. According to the adhesive force, appropriate strain strain (Strain Mismatch) of the transfer film 10 is required. If the size, thickness and surface state of the micro device to be transferred and the information on the transfer film 10 are confirmed in advance, the required bending deformation of the transfer film 10 can be calculated, and accordingly, the first guide roller 610. And the rotation angle of the second guide roller 620 may be adjusted.
  • FIG. 9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
  • the micro device transfer method includes a first adsorption step (S810), a second adsorption step (S820), an alignment step (S830), a temporary adhesion step (S840), a transfer step (S850), and a transfer step ( S860) and may include a separation step (S870).
  • the first adsorption step S810 may be a step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit.
  • the transfer film to which the micro device is attached may be placed on the first adsorption part, and a negative pressure may be provided between the first adsorption part and the transfer film to adsorb the transfer film to the first adsorption part.
  • the second adsorption step (S820) may be a step of adsorbing the target substrate to which the micro device is transferred to the second adsorption unit provided under the first adsorption unit.
  • the target substrate may be positioned on the second adsorption unit, and a negative pressure may be provided between the second adsorption unit and the target substrate to adsorb the target substrate to the second adsorption unit.
  • the alignment step S830 may be a step of aligning the position of the second adsorption unit such that the target substrate and the transfer film are aligned.
  • the alignment step S830 may have a rotation step S831, a photographing step S832, and an exact position step S833.
  • the rotating step S831 may be a step of rotating the first adsorption part such that the micro device adhered to the transfer film faces the upper surface of the target substrate.
  • the photographing step (S832) may be a step of photographing the first alignment mark formed on the transfer film and the second alignment mark formed on the target substrate through the first adsorption unit provided on the upper side of the first adsorption unit.
  • the photographing part may photograph the second alignment mark through the through hole formed in the first adsorption part.
  • the photographing part may pass through the first adsorption part to photograph the second alignment mark.
  • the alignment unit reciprocates the second adsorption unit in the first horizontal direction and in the second horizontal direction perpendicular to the first horizontal direction, and rotates the second absorption unit about the vertical axis perpendicular to the first horizontal direction.
  • the alignment mark may be aligned with the first alignment mark so that the target substrate and the micro device may be aligned.
  • the exact position step S833 may be performed simultaneously with the photographing step S832.
  • the temporary adhesion step S840 may be a step of lowering the first adsorption unit and temporarily attaching the micro device to the target substrate.
  • the temporary adhesion step S840 may have a descending step S841 and a fixing step S842.
  • the lowering step S841 may be a step of lowering the first adsorption part after the correct position step S833.
  • the fixing step S842 may be a step of providing and fixing a negative pressure between the second adsorption part and the transfer film in a state in which the first terminal of the micro device is positioned at the second terminal of the target substrate seated in the mounting groove. .
  • the transfer step S850 may be a step of transferring the alignment unit and the second adsorption unit in the first horizontal direction.
  • the transferring step (S860) may be a step of transferring the micro device to the target substrate by pressing the transfer film on the upper portion of the second adsorption portion is conveyed in a state that the pressing portion provided on the transfer path in the first horizontal direction. .
  • the pressing roller extending in the second horizontal direction perpendicular to the first horizontal direction may simultaneously press the micro devices provided in the second horizontal direction in the micro device array supplied.
  • Separation step (S870) is a guide portion provided at the front end of the pressing portion on the transfer path in the first horizontal direction to guide the transfer film is bent to move upwards at the point where the transfer film passes the pressing portion, the transfer film from the transferred micro device It may be a step of separating.
  • the guide portion is moved in the vertical direction to adjust the bending angle of the transfer film bent in the pressing portion.
  • the guide portion can adjust the bending angle of the transfer film according to the size, thickness and surface state of the micro device, and through this, when the micro device is transferred, the transfer film can be effectively removed.
  • transfer film 20 micro device
  • target substrate 100 first adsorption portion
  • first guide roller 620 second guide roller

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de transfert de micro-éléments et un procédé de transfert de micro-éléments. Un dispositif de transfert de micro-éléments selon un mode de réalisation de la présente invention comprend: une première partie d'aspiration sur laquelle un film de transfert ayant un micro-élément fixé à celui-ci est aspiré; une seconde partie d'aspiration sur laquelle un substrat cible est placé de manière stable et sur laquelle le film de transfert fourni par la première partie d'aspiration est aspiré; une partie de chariot pour transporter la seconde partie d'aspiration dans une première direction horizontale; une partie de pression pour presser le film de transfert de la seconde partie d'aspiration qui est transporté, de façon à transférer le micro-élément vers le substrat cible; et une partie de guidage qui est agencée au niveau de l'extrémité avant de la partie de pression sur un trajet de chariot dans la première direction horizontale, et guide le film de transfert passant à travers la partie de pression pour s'éloigner du substrat cible et sépare ainsi le film de transfert du micro-élément.
PCT/KR2018/016991 2018-03-30 2018-12-31 Dispositif de transfert de micro-éléments et procédé de transfert de micro-éléments Ceased WO2019190031A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0037370 2018-03-30
KR1020180037370A KR102012692B1 (ko) 2018-03-30 2018-03-30 마이크로 소자 전사장치 및 마이크로 소자 전사방법

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WO2019190031A1 true WO2019190031A1 (fr) 2019-10-03

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KR102378712B1 (ko) * 2020-04-17 2022-03-25 주식회사 에스에프에이 엘이디 칩 전사용 기판 합착장치
KR102176615B1 (ko) * 2020-07-03 2020-11-09 (주)디바이스이엔지 디스플레이 소자의 트랜스퍼 장치 및 트랜스퍼 방법
KR102238491B1 (ko) 2020-10-22 2021-04-09 (주)디바이스이엔지 디스플레이 소자의 이송 장치
KR102426343B1 (ko) 2020-10-22 2022-07-29 (주)디바이스이엔지 마이크로 엘이디 전사장치 및 전사방법

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