WO2019186629A1 - Vapor deposition mask, vapor deposition mask set, vapor deposition mask manufacturing method, vapor deposition mask set manufacturing method, and display device manufacturing method - Google Patents

Abstract

In the present invention, among a plurality of TEG holes formed on a mask sheet (15) of a vapor deposition mask (10), some of the TEG holes overlap with an opening (13a) formed on a housing sheet (13), whereas the remaining TEG holes are shielded by the housing sheet (13).

Description

Vapor deposition mask, vapor deposition mask set, vapor deposition mask manufacturing method, vapor deposition mask set manufacturing method, and display device manufacturing method

The present invention relates to an evaporation mask, an evaporation mask set, an evaporation mask manufacturing method, an evaporation mask set manufacturing method, and a display device manufacturing method.

There are cases where a plurality of layers are stacked by vapor deposition to form a pattern on the vapor deposition substrate. In this case, as described in Patent Document 1, the vapor deposition process (film formation process) is managed in a region other than a region where the first layer and the second layer are stacked and patterned on the deposition target substrate. As a TEG (Test Element Group) pattern, only the first layer of the first layer and the second layer is formed, and only the second layer is formed in another region. By measuring the film thickness or position of the TEG pattern formed in this way, it is possible to manage the vapor deposition states of the first layer and the second layer.

Japanese Patent Publication “Japanese Patent Laid-Open No. 2014-066536”

In Patent Document 1, each of the first layer and the second layer is formed using different vapor deposition masks. However, since the vapor deposition mask is expensive, creating different types of vapor deposition masks (vapor deposition masks having different opening patterns) by the number of layers to be stacked causes an increase in the manufacturing cost of the vapor deposition mask. As a result, the manufacturing cost of a device manufactured using this vapor deposition mask also increases.

An object of one embodiment of the present invention is to realize a reduction in the types of mask sheets in which vapor deposition holes are patterned.

In order to solve the above problems, a deposition mask according to one embodiment of the present invention is a deposition mask for depositing a deposition layer on a deposition target substrate, and is attached to the mask frame and the mask frame, and includes a plurality of masks. A mask sheet in which a plurality of effective portions, which are regions where vapor deposition holes are formed, and a plurality of TEG holes provided in regions outside the effective portions are formed, and the mask sheet is a different member, and Among the plurality of TEG holes, there is a shielding member disposed relatively to the mask sheet so as not to shield some of the TEG holes but to shield the remaining TEG holes.

In order to solve the above problems, a method of manufacturing a vapor deposition mask according to one embodiment of the present invention is a method of manufacturing a vapor deposition mask for depositing a vapor deposition layer on a deposition target substrate, and a plurality of vapor deposition holes are formed. A mask sheet forming step of forming a mask sheet by forming a plurality of effective portions that are areas and a plurality of TEG holes provided in a region outside the effective portion, and the mask sheet are different members. A TEG hole shielding step in which the shielding member and the mask sheet are relatively arranged such that the shielding member does not shield some of the plurality of TEG holes and shields the remaining TEG holes. It is characterized by including.

In order to solve the above problems, a method of manufacturing a vapor deposition mask according to one embodiment of the present invention is a method of manufacturing a vapor deposition mask for depositing a vapor deposition layer on a deposition target substrate, and a plurality of vapor deposition holes are formed. A mask sheet forming step of forming a mask sheet by forming a plurality of effective portions, which is a region, a mask sheet attaching step of attaching the mask sheet to the mask frame, and the mask sheet attached to the mask frame And a TEG hole forming step of forming one or a plurality of TEG holes in a region outside the effective portion and not overlapping with other members.

According to one aspect of the present invention, there is an effect that it is possible to realize a reduction in the types of mask sheets on which vapor deposition holes are patterned.

5 is a diagram illustrating a manufacturing process of the organic EL display panel according to Embodiment 1. FIG. 1 is a cross-sectional view illustrating a configuration of an organic EL display device according to Embodiment 1. FIG. It is a schematic diagram which shows the mode of the vapor deposition process at the time of forming the vapor deposition layer of the organic electroluminescence display which concerns on Embodiment 1. FIG. FIG. 3 is an enlarged view of a part of an active region in the organic EL display device according to the first embodiment. 6 is a diagram illustrating a manufacturing process of a vapor deposition mask according to Embodiment 1. FIG. It is a figure showing a mode that the vapor deposition mask which concerns on Embodiment 1 is produced. 2 is a plan view illustrating a configuration of a howling sheet according to Embodiment 1. FIG. It is a figure showing the structure of the mask sheet | seat of Embodiment 1. FIG. It is an enlarged view of the intersection of the mask sheet and the howling sheet in the vapor deposition mask of Embodiment 1. FIG. 10 is an enlarged view of a TEG pattern at an intersection in FIG. 9. It is an enlarged view of the intersection part of the mask sheet | seat and howling sheet | seat of the vapor deposition mask which concerns on the comparative example of Embodiment 1. FIG. It is an enlarged view of the intersection part of the mask sheet | seat and howling sheet | seat in the vapor deposition mask which concerns on the comparative example of the vapor deposition mask of Embodiment 1. FIG. It is a figure showing the structure of the cover sheet with which the vapor deposition mask of Embodiment 2 is provided. It is an enlarged view of the TEG pattern in the vapor deposition mask of Embodiment 2. It is a figure showing the preparation process of the vapor deposition mask which concerns on Embodiment 3. FIG. It is an enlarged view of the TEG pattern in the vapor deposition mask of Embodiment 3. It is a figure showing the structure of the mask sheet attachment apparatus with the film-forming function which concerns on Embodiment 3. FIG. It is a figure showing the preparation process of the vapor deposition mask which concerns on Embodiment 4. FIG. It is an enlarged view of the TEG hole of the vapor deposition mask of Embodiment 4. It is a figure showing the structure of the mask sheet attachment apparatus with a TEG hole formation function which concerns on Embodiment 4. FIG.

Embodiment 1
Hereinafter, an embodiment of the present invention will be described in detail.

(Outline of manufacturing method of organic EL display panel)
FIG. 1 is a diagram illustrating a manufacturing process of the organic EL display panel according to the first embodiment. FIG. 2 is a cross-sectional view illustrating a configuration of the organic EL display device (display device) 1 according to the first embodiment. FIG. 2 shows the configuration of the active area in the organic EL display device 1. The active area is an area where an image is displayed by providing the pixel pix.

As shown in FIGS. 1 and 2, first, a TFT substrate 30 is manufactured in a TFT process S11. The TFT substrate 30 has a resin layer (not shown) and a barrier layer (not shown) formed on a translucent support substrate 31 such as mother glass, and is disposed on each pixel pix by a known method. A TFT (transistor, driving element) 32 included in the pixel circuit, various wirings 33 including a gate wiring and a source wiring are formed, a passivation film (protective film) 34, an interlayer insulating film (planarization film) 35, and the like are formed. Further, a reflective electrode layer (first electrode) 36 in contact with the anode, an ITO layer, and a pixel bank 39 for defining a light emitting region are formed on the interlayer insulating film 35.

Examples of the material for the resin layer (not shown) include polyimide, epoxy, polyamide, and the like.

The barrier layer (not shown) is a layer that prevents moisture and impurities from reaching the TFT 32 and the EL layer 40 when the display device is used. For example, a silicon oxide film or a silicon nitride film formed by CVD. Or a silicon oxynitride film or a laminated film thereof.

The TFT 32 is a driving transistor for supplying a driving current to the EL layer 40. Although not shown, the TFT 32 has a semiconductor layer, a gate electrode, a drain electrode, and a source electrode.

The passivation film 34 is formed so as to cover the TFT 32. Thereby, the passivation film 34 prevents the metal film from being peeled off in the TFT 32 and protects the TFT 32. The passivation film 34 is an inorganic insulating film made of silicon nitride, silicon oxide, or the like.

The interlayer insulating film 35 is formed on the passivation film 34. The interlayer insulating film 35 is a flattening film that flattens unevenness on the passivation film 34. The interlayer insulating film 35 is an organic insulating film made of a photosensitive resin such as acrylic or a thermoplastic resin such as polyimide.

The anode 36 is individually patterned in an island shape for each pixel pix, and the end of the anode 36 is covered with a pixel bank 39. Each anode 36 is connected to the TFT 32 through a contact hole provided in the passivation film 34 and the interlayer insulating film 35.

The anode 36 functions as an electrode for injecting holes into the EL layer 40. In the present embodiment, the anode 36 has a configuration in which a translucent electrode 38 is laminated on a reflective film 37. Note that the anode 36 may have a single-layer structure made of the reflective film 37, or a layer other than the translucent electrode 38 may be laminated.

Examples of the material of the reflective film 37 include black electrode materials such as tantalum (Ta) or carbon (C), Al, Ag, gold (Au), Al—Li alloy, Al—neodymium (Nd) alloy, and Ag. Examples thereof include a reflective metal electrode material such as an alloy or an Al-silicon (Si) alloy.

As a material of the translucent electrode 38, for example, a transparent electrode material such as indium tin oxide (ITO), tin oxide (SnO ₂ ), indium zinc oxide (IZO), gallium-doped zinc oxide (GZO), or the like may be used. Alternatively, a translucent electrode material such as Ag made into a thin film may be used.

The pixel bank 39 is arranged so as to delimit adjacent pixels pix. The pixel bank 39 is an insulating layer and is made of, for example, a photosensitive resin. The pixel bank 39 is formed so as to cover the end of the anode 36. The pixel bank 39 functions as an edge cover that prevents the end of the anode 36 and the cathode 47 from being short-circuited even when the end of the EL layer 40 becomes thin. The pixel bank 39 also functions as a pixel separation film so that current does not leak to the adjacent pixels pix.

Further, when forming the active region, a frame bank (not shown) surrounding the active region in a frame shape is also formed on the TFT substrate 30. The frame-like bank is made of a photosensitive resin such as acrylic or a thermoplastic resin such as polyimide.

Next, in the EL step S12, the EL layer 40 and the cathode 47 are formed on the TFT substrate 30.

For example, a hole injection layer 41, a hole transport layer 42, a light emitting layer 43, a hole blocking layer 44, and an electron are formed on the TFT substrate 30 created in the TFT step S11 from the anode 36 side by vapor deposition or the like. The transport layer 45 and the electron injection layer 46 are stacked in this order. Thereby, the EL layer 40 is formed on the TFT substrate 30. Next, a cathode 47 is formed so as to cover the EL layer 40 formed on the TFT substrate 30.

The hole transport layer 42 and the light emitting layer 43 are formed in an island shape for each pixel pix by a vapor deposition method using a vapor deposition mask, but the other hole injection layer 41, hole blocking layer 44, and electron transport layer are formed. 45, the electron injection layer 46, and the cathode 47 are each configured by a solid common layer formed across a plurality of pixels pix, as illustrated in the figure. A configuration in which one or more of the hole injection layer 41, the hole blocking layer 44, the electron transport layer 45, and the electron injection layer 46 are not formed is also possible.

In addition, like the hole transport layer 42 and the light emitting layer 43, a layer that is deposited for each pixel pix using a deposition mask is referred to as a deposition layer.

The cathode 47 is made of a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

The light emitting layer 43 and the hole transport layer 42 are formed in the pixel pix for each emission color of the pixel pix. For example, when the pixel pix is one of a red pixel Rpix that emits red light, a green pixel Gpix that emits green light, and a blue pixel Bpix that emits blue light, the red pixel Rpix has a red light emitting layer 43R. And the red hole transport layer 42R, the green light emitting layer 43G and the green hole transport layer 42G are formed in the green pixel Gpix, and the blue light emitting layer 43B and the blue hole transport layer 42B are formed in the blue pixel Bpix. The

The hole injection layer 41 is a layer that includes a hole injecting material and has a function of increasing the efficiency of hole injection into the light emitting layer 43.

The hole transport layer 42 contains a hole transport material and has a function of increasing the efficiency of transporting holes injected from the anode 36 and transported through the hole injection layer 41 to the light emitting layer 43. The red hole transport layer 42R increases the efficiency of transporting holes to the red light emitting layer 43R, the green hole transport layer 42G increases the efficiency of transporting holes to the green light emitting layer 43G, and the blue hole transport layer 42B is blue. The efficiency of transporting holes to the light emitting layer 43B is increased.

The hole blocking layer 44 includes a material that blocks the movement of holes, and is a layer that blocks holes from being transported to the electron transport layer 45 through the light emitting layer 43.

The electron injection layer 46 is a layer that includes an electron injecting material and has a function of increasing the efficiency of electron injection into the light emitting layer 43. The electron transport layer 45 is a layer that includes an electron transport material and has a function of improving the efficiency of transporting electrons to the light emitting layer 43.

The holes injected from the anode 36 to the light emitting layer 43 and the electrons injected from the cathode 47 to the light emitting layer 43 are recombined in the light emitting layer 43, thereby forming excitons. The formed excitons emit light when deactivated from the excited state to the ground state. Thereby, the red light emitting layer 43R emits red light, the green light emitting layer 43G emits green light, and the blue light emitting layer 43B emits blue light.

The red hole transport layer 42R, the red light emitting layer 43R, the green hole transport layer 42G, the green light emitting layer 43G, the blue hole transport layer 42B, and the blue light emitting layer 43B are sequentially used in the vapor deposition process using a vapor deposition mask. It is formed in the pixel pix. The vapor deposition mask used in this vapor deposition step is prepared in advance for each emission color by the vapor deposition mask production step S20 before the vapor deposition step.

Details of the deposition mask manufacturing step S20 will be described later. The layer formed using this vapor deposition mask is not limited to the hole transport layer 42 and the light emitting layer 43, and may be a layer formed for each pixel pix (that is, in the opening of the pixel bank 39).

In addition, although the case where the light emitting element layer having the anode 36, the EL layer 40, and the cathode 47 constitutes an OLED element has been described, the light emitting element layer is not limited to the case where the OLED element is constituted, and an inorganic light emitting diode or quantum dot A light emitting diode may be configured.

Then, in the sealing step S13, the sealing layer 5 is formed on the cathode 47. As an example, the sealing layer 5 may have a three-layer structure in which an inorganic film, an organic film, and an inorganic film are stacked in this order from the TFT substrate 30 side. Since the frame-like bank (not shown) is formed, the organic film can be formed thick, for example, 1.0 μm or more.

When making a display device flexible, after forming this sealing layer 5, you may perform flexible process S14. In flexible process S14, a mother substrate (mother glass) is peeled off, and a film or the like to be a support is pasted.

Then, in the individualization step S15, each EL display panel is cut out. Thereby, each EL display panel is separated into individual pieces, and a flexible display panel (organic EL display panel) is formed.

Next, in the mounting step S16, a member such as a driver is mounted on each of the separated EL display panels. Thereby, the organic EL display device (display device) 1 is completed.

FIG. 3 is a schematic diagram showing a state of a vapor deposition process when forming a vapor deposition layer of the organic EL display device 1 according to the first embodiment.

In the vapor deposition process, the vapor deposition mask 10 is disposed between the TFT substrate 30 and the vapor deposition source 70. A vapor deposition mask 10 provided with a mask sheet having a plurality of through holes is brought into close contact with the TFT substrate 30, and the vapor deposition particles Z (for example, organic light emitting material) evaporated by the vapor deposition source 70 are applied to the TFT substrate over the mask sheet under vacuum. Vapor deposition is performed on the pixels of the substrate 30. Thereby, the red light emitting layer 43R, the red hole transport layer 42R, the green light emitting layer 43G, the green hole transport layer 42G, the blue light emitting layer 43B, and the blue light are formed on the TFT substrate 30 in a pattern corresponding to the through hole of the mask sheet. Any of the hole transport layers 42B is deposited.

The vapor deposition step shown in FIG. 3 is performed for each type of vapor deposition layer deposited on the pixel pix. That is, in the present embodiment, in the process of manufacturing the display device, the vapor deposition process is performed at least by the red hole transport layer 42R, the red light emission layer 43R, the green hole transport layer 42G, the green light emission layer 43G, and the blue hole transport layer 42B. In addition, the deposition process is performed six times in order to deposit each of the blue light emitting layers 43B for each pixel pix.

FIG. 4 is an enlarged view of a part of the active region in the organic EL display device according to the first embodiment. In the active area, pixels pix contributing to image display are arranged side by side. In the pixel pix, a peripheral area surrounding the pixel pix is a pixel bank 39.

As an example, in FIG. 5, a red pixel Rpix having a red hole transport layer 42R and a red light emitting layer 43R, a green pixel Gpix having a green hole transport layer 42G and a green light emitting layer 43G, and a blue hole. The blue pixel Bpix on which the transport layer 42B and the blue light emitting layer 43B are formed has a pen tile arrangement. However, the pixel arrangement is not particularly limited to the pen tile arrangement, and may be another arrangement such as a stripe arrangement.

The shape of the hole transport layer 42 and the light emitting layer 43 is the shape of the opening of the pixel bank 39 in which the light emitting layer 43 and the hole transport layer 42 are formed.

In the example illustrated in FIG. 4, the red pixel Rpix and the blue pixel Bpix have the same resolution (the pitch between adjacent pixels is the same), but the green pixel Gpix has a higher resolution than the red pixel Rpix and the blue pixel Bpix ( The pitch between adjacent pixels is small). As described above, there is a case where high resolution is required only for the pixel pix having a specific light emission color among the respective light emission colors.

Note that the emission colors of the pixels pix are not limited to red, green, and blue, but may be other colors, and the number of emission colors is not limited to three, but two or four or more colors. Also good.

(Deposition mask)
Next, the structure of the vapor deposition mask used in the vapor deposition step and the vapor deposition mask manufacturing step S20 will be described.

FIG. 5 is a diagram illustrating a manufacturing process of a vapor deposition mask according to the first embodiment. In order to produce a vapor deposition mask for vapor deposition of the vapor deposition layer (the hole transport layer 42 and the light emitting layer 43), the vapor deposition mask production step S20 is performed for each type of vapor deposition layer (that is, the red hole transport layer 42R, red For each of the light emitting layer 43R, the green hole transporting layer 42G, the green light emitting layer 43G, the blue hole transporting layer 42B, and the blue light emitting layer 43B). FIG. 6 is a diagram illustrating a state in which the vapor deposition mask according to the first embodiment is manufactured.

First, as shown in step Sa of FIG. 5 and FIGS. 6A and 6B, a frame-shaped mask frame 11 having a frame opening 11a in a region surrounded by a frame has a plurality of cover sheets (lower layer sheets). ) 12 is attached (cover sheet attaching step).

The mask frame 11 is made of, for example, an invar material having a thickness of 20 mm to 30 mm with very little thermal expansion as a base material. It is sufficiently thicker than the mask sheet 15 (FIG. 6 (e)) and has high rigidity so that sufficient accuracy can be secured even when the mask sheet 15 is stretched and welded.

The cover sheet 12 plays a role of filling a gap between the mask sheets 15 to be attached to the mask frame 11 later, or closing a dummy pattern formed on the mask sheet 15.

Of the two surfaces of the mask sheet 15 to be attached to the mask frame 11 later, when the surface far from the TFT substrate 30 is the lower surface in the vapor deposition step, the cover sheet 12 is disposed on the lower surface side of the mask sheet 15, so Sometimes referred to as a sheet.

For the cover sheet 12, for example, an invar material having a thickness of 30 μm to 50 μm is used as a base material. The cover sheet 12 has an elongated shape and extends linearly from one end to the other end.

When the cover sheet 12 is attached to the mask frame 11, as shown by the arrow F1 in FIG. 6B, the cover sheet 12 is stretched by applying a force in the outward direction (direction away from each other) to each of both end portions of the cover sheet 12. While (pulling), both end portions of the cover sheet 12 are welded to predetermined positions in the grooves provided in the mask frame 11. And the unnecessary part outside a welded part in the cover sheet 12 is cut.

Thereby, each cover sheet 12 is attached to a predetermined position of the mask frame 11. In the present embodiment, each cover sheet 12 is attached to the mask frame 11 so as to be parallel to the short side direction of the mask frame 11. Each cover sheet 12 is attached to the mask frame 11 so as to be parallel to each other along the long side of the mask frame 11.

Next, as shown in step Sb of FIG. 5 and FIG. 6C, a howling sheet (shielding member, lower layer sheet, support sheet) 13 is attached to the mask frame 11 to which the cover sheet 12 is attached (howling sheet). Attachment process, TEG hole shielding process).

The howling sheet 13 normally plays a role of crossing and supporting a mask sheet to be attached to the mask frame 11 so as not to loosen, or closing a dummy pattern of vapor deposition holes formed in the mask sheet 15. Note that the howling sheet 13 may be referred to as a lower layer sheet because it is disposed on the lower surface side of the mask sheet to be attached to the mask frame 11 later.

In the howling sheet 13, for example, an invar material having a thickness of 30 μm to 100 μm is used as a base material. The width of the howling sheet 13 is, for example, about 8 mm to 10 mm, and is determined by the layout on the mother board on which the display panel is arranged.

FIG. 7 is a plan view showing the configuration of the howling sheet 13 according to the first embodiment. As shown in FIG. 7, the howling sheet 13 extends linearly from one end to the other end. The howling sheet 13 may be provided with irregularities that define the outer diameter shape (for example, rounded corners) of the active region.

The howling sheet 13 is formed with a plurality of openings 13 a that have an area that overlaps some of the TEG holes that constitute the TEG pattern formed in the mask sheet 15 and penetrate the howling sheet. ing. Note that the TEG pattern formed on the mask sheet 15 is a pattern for detecting the misalignment of the vapor deposition layer.

As shown by an arrow F2 in FIG. 6C, when the howling sheet 13 is attached to the mask frame 11, it is stretched by applying a force in the outward direction (a direction away from each other) to both ends of the howling sheet 13. While (pulling), both ends of the howling sheet 13 are welded to predetermined positions in the grooves provided in the mask frame 11. And the unnecessary part outside a welded part in the howling sheet 13 is cut. Thereby, each howling sheet 13 is attached to a predetermined position of the mask frame 11.

In this embodiment, each howling sheet 13 is attached to the mask frame 11 so as to be parallel to the long side of the mask frame 11. The howling sheets 13 are attached to the mask frame 11 so as to be parallel to each other in the short-side direction of the mask frame 11.

The order of attaching the cover sheet 12 and the howling sheet 13 to the mask frame 11 is reversed (replacement of the steps Sa and Sb in FIG. 5), and the howling sheet 13 is first attached to the mask frame 11. Then, you may attach the cover sheet | seat 12 next.

As shown in FIG. 6 (c), by attaching a plurality of cover sheets 12 and a plurality of howling sheets 13 to the mask frame 11 in a lattice pattern, the cover sheets 12 facing each other and the howling sheets facing each other. 13 are formed side by side.

Next, as shown in Step Sc of FIG. 5 and FIG. 6D, the alignment sheet 14 on which alignment marks (not shown) are formed is attached to the mask frame 11 so that the alignment marks are in a predetermined position ( Alignment sheet attaching step).

When the alignment sheet 14 is attached to the mask frame 11, as indicated by an arrow F <b> 3 in FIG. 6 (d), both ends of the alignment sheet 14 are directed outward (directions away from each other) and are short of the mask frame 11. It is welded to a predetermined position of the mask frame 11 while being stretched (pulled) by applying a force in a direction parallel to the hand direction. Then, an unnecessary portion outside the welded portion in the alignment sheet 14 is cut. Thereby, each alignment sheet 14 is attached to a predetermined position of the mask frame 11. In the present embodiment, the two alignment sheets 14 are attached to the mask frame 11 so as to be parallel to each other along the short side of the frame opening 11 a of the mask frame 11.

Next, as shown in step Sd of FIG. 5 and FIG. 6E, a plurality of mask sheets 15 are attached to the mask frame 11 (mask sheet attaching step, TEG hole shielding step). The mask sheet 15 is a sheet for patterning a vapor deposition layer in the pixel pix in the active region shown in FIGS. 2 and 4. That is, in this embodiment, any one of the red hole transport layer 42R, the red light emitting layer 43R, the green hole transport layer 42G, the green light emitting layer 43G, the blue hole transport layer 42B, and the blue light emitting layer 43B is formed in the pixel pix. It is a sheet for doing.

Before step Sd, as step S101, before attaching mask sheet 15 to mask frame 11, effective portion YA provided with a plurality of vapor deposition holes and TEG pattern 20 provided with a plurality of TEG holes are masked. It forms in the sheet | seat 15 (mask sheet formation process). The effective portion YA is formed for each active region and has an area covering the active region. The TEG pattern 20 is formed adjacent to each effective portion YA. Details of the effective portion YA and the TEG pattern 20 will be described later.

In step Sd, as shown by an arrow F4 in FIG. 6E, when the mask sheet 15 is attached to the mask frame 11, a force is applied to each of both end portions of the mask sheet 15 in an outward direction (a direction away from each other). While being stretched (pulled), the mask sheet 15 is placed on the mask frame 11 so that the vapor deposition holes constituting the effective portion YA are at predetermined positions with reference to the alignment marks formed on the alignment sheet 14. Align.

In addition, among the plurality of TEG holes constituting the TEG pattern 20, a part of the TEG holes overlaps with the opening 13 a of the howling sheet 13 to become a through hole, and the remaining TEG holes overlap with the howling sheet 13 to shield. As described above, the mask sheet 15 is aligned with the mask frame 11.

In other words, the howling sheet 13 and the mask sheet 15 are arranged such that the howling sheet 13 does not shield some TEG holes among the plurality of TEG holes constituting the TEG pattern 20 and shields the remaining TEG holes. Arrange relatively.

When the mask sheet 15 is aligned with the mask frame 11 (in other words, with respect to the howling sheet 13), both ends of the mask sheet 15 are welded to the mask frame 11 with high accuracy.

In addition, when the mask sheet 15 is stretched and welded, it is stretched and welded while applying a counter force to the mask frame 11 in accordance with the amount of deformation of the mask sheet 15 after stretching and welding. Thereby, the mask sheet 15 is attached to the mask frame 11 so that the extending direction of the effective portion YA and the extending direction of each howling sheet 13 are orthogonal to each other.

Then, as shown in FIG. 6 (f), the mask sheet 15 is all necessary so that all the openings 53 defined by the cover sheet 12 and the howling sheet 13 that intersect each other are covered with the effective portion YA. After the mask sheet 15 for the sheet is attached to the mask frame 11, unnecessary portions outside the welded portions of each mask sheet 15 are cut out as shown in Step Se of FIG. 5 and (f) of FIG.

Thereby, the vapor deposition mask 10 is completed. The deposition mask 10 is a mask for depositing any one of the red hole transport layer 42R, the red light emitting layer 43R, the green hole transport layer 42G, the green light emitting layer 43G, the blue hole transport layer 42B, and the blue light emitting layer 43B. is there.

Next, as shown in step Sf of FIG. 5, various mask inspections such as foreign matter inspection and accuracy inspection are performed. Thereafter, the vapor deposition mask 10 having no problem in the mask inspection is stored in a stocker and supplied to a vapor deposition apparatus used in the vapor deposition process as necessary.

(Mask sheet 15)
FIG. 8 is a diagram illustrating the configuration of the mask sheet 15 of the first embodiment. 8A is a plan view of the mask sheet 15, FIG. 8B is an enlarged view of the effective portion shown in FIG. 8A, and FIG. 8C is a sectional view taken along line BB shown in FIG. 8B. , (D) is a cross-sectional view taken along the line CC shown in (b).

As shown in FIG. 8A, the mask sheet 15 has a strip shape, and as a base material, for example, an invar material having a thickness of 10 μm to 50 μm, preferably about 25 μm is used. The mask sheet 15 is formed with a small thickness in order to prevent the thickness of the deposited layer from becoming uneven.

A plurality of effective portions YA arranged in the longitudinal direction of the mask sheet 15 are formed between both end portions of the mask sheet 15. In the effective portion YA, a plurality of vapor deposition holes H corresponding to the pixels pix are formed so as to be spaced apart from each other. The effective portion YA is formed for each active region of the TFT substrate 30. At the time of vapor deposition of the vapor deposition layer, the vapor deposition mask 10 and the TFT substrate 30 are arranged to face each other so that the effective portion YA overlaps the active region.

The effective portion YA is a region of the mask sheet 15 where the vapor deposition holes H are formed at an equal pitch. In each effective portion YA, the vapor deposition hole H is formed to have a pattern of any one of the red pixel Rpix, the green pixel Gpix, and the blue pixel Bpix (FIGS. 2 and 4).

That is, the mask sheet 15 having the effective portion YA in which the vapor deposition holes H are formed in a pattern corresponding to the red pixel Rpix is applied to the vapor deposition mask 10 for forming the red hole transport layer 42R in the process Sd (FIG. 5). And attached to the mask frame 11. For the vapor deposition mask 10 for forming the red light emitting layer 43R, the mask sheet 15 having the effective portion YA in which the vapor deposition holes H are formed in a pattern corresponding to the red pixel Rpix is used in the process Sd (FIG. 5). 11 is attached.

Further, in the deposition mask 10 for forming the green hole transport layer 42G, the mask sheet 15 having the effective portion YA in which the deposition holes H are formed in a pattern corresponding to the green pixel Gpix is formed in the process Sd (FIG. 5). And attached to the mask frame 11. For the vapor deposition mask 10 for forming the green light emitting layer 43G, the mask sheet 15 having the effective portion YA in which the vapor deposition holes H are formed in a pattern corresponding to the green pixel Gpix is used in the process Sd (FIG. 5). 11 is attached.

Further, in the deposition mask 10 for forming the blue hole transport layer 42B, the mask sheet 15 having the effective portion YA in which the deposition holes H are formed in a pattern corresponding to the blue pixel Bpix is formed in the process Sd (FIG. 5). And attached to the mask frame 11. For the vapor deposition mask 10 for forming the blue light emitting layer 43B, the mask sheet 15 having the effective portion YA in which the vapor deposition holes H are formed in a pattern corresponding to the blue pixel Bpix is used in the process Sd (FIG. 5). 11 is attached.

The outer shape of each effective portion YA is preferably not a deformed shape but a square or a rectangle so that the stress applied to each effective portion YA is as uniform as possible when the mask sheet 15 is stretched. In the present embodiment, the outer shape of each effective portion YA is a rectangle.

In the vapor deposition process, the vapor deposition layer is vapor-deposited on the pixel pix in the active region of the TFT substrate 30 through the vapor deposition hole H constituting the effective portion YA of the mask sheet 15.

Further, the TEG pattern 20 is formed on the mask sheet 15 in an area outside the effective portion YA and adjacent to the effective portion YA. The TEG pattern 20 is a pattern in which a plurality of TEG holes penetrating the mask sheet 15 for depositing a dummy pattern outside the active region of the TFT substrate 30 using the deposition mask 10 are formed side by side. The dummy pattern is a pattern for verifying the vapor deposition conditions by inspecting the vapor deposition state (film thickness, vapor deposition position, etc.) of the vapor deposition layer deposited in the vapor deposition step.

The TEG pattern 20 is formed at a position that does not overlap the active region of the TFT substrate 30 when the vapor deposition mask 10 is superimposed on the TFT substrate 30 in the vapor deposition step. A plurality of TEG holes constituting the TEG pattern 20 are formed in the same process as the vapor deposition holes H of the effective portion YA.

The effective portion YA and the TEG pattern 20 of the mask sheet 15 are formed, for example, by forming the vapor deposition holes H and TEG holes as follows in step S101 shown in FIG.

Of both surfaces of the mask sheet 15, the surface closer to the TFT substrate 30 during vapor deposition (the surface facing the TFT substrate) is referred to as a first surface (upper surface) 15 b, and the surface far from the TFT substrate 30 is the second surface. It is referred to as a surface (lower surface) 15c.

First, a negative or positive photosensitive resist material is applied to both sides of a long plate made of an invar material or the like, and a resist film is formed on both main surfaces (first surface 15b and second surface 15c).

Next, a resist pattern is formed on both sides of the long plate by exposing and developing the resist films on the first surface 15b and the second surface 15c using an exposure mask. Next, using the resist pattern on the first surface 15b as a mask, the first surface 15b of the mask sheet 15 is etched (the upper surface of the edge is not etched), and an opening K is formed in the pattern on the first surface 15b (penetrated at this stage). It does not become a vapor deposition hole).

Next, the first surface 15b is covered with a resistant resin having etching resistance, and the lower surface is etched using the resist pattern on the second surface 15c as a mask. Thereby, in the effective portion YA, the vapor deposition hole H (through hole) and the TEG pattern 20 are formed by erosion from the second surface 15c side, and a plurality of dents are formed on the lower surface of the edge portion.

The plurality of vapor deposition holes H of the effective portion YA are formed in a matrix shape or an oblique lattice shape in the longitudinal direction and the short direction (width direction) of the mask sheet 15, and the openings K (openings on the upper surface) are formed on the deposition target substrate. In order to correspond to the opening shape of the pixel bank 39, the shape is a quadrangular shape with rounded corners, or a circular or elliptical shape. In the effective portion YA, etching is performed on the second surface 15c side more extensively and deeply than the first surface 15b side with respect to each vapor deposition hole H, so that a shadowed portion (the partition height between two adjacent vapor deposition holes is high). And the deposition accuracy and deposition efficiency for the substrate to be deposited are increased.

In the effective portion YA, when the cross section is taken along the line BB passing through the centers of the two openings K adjacent in the lateral direction, the base material is minimum (the cavity is maximum) as shown in FIG. When the cross section is taken along the CC line parallel to the BB line through a point equidistant from the two adjacent openings K in the vertical direction, the base material is maximum as shown in FIGS. The structure (maximum thickness is the thickness Ti of the base material) is obtained. The TEG hole in the TEG (Test Element Group) pattern 20 is formed in the same manner as the vapor deposition hole H.

The plurality of TEG holes constituting the TEG pattern 20 are holes formed so as to penetrate the mask sheet 15 in order to detect displacement of the deposited layer deposited on the deposition target substrate through the mask sheet 15.

Thereby, the mask sheet 15 is produced.

(TEG pattern 20 and howling sheet 13)
FIG. 9 is an enlarged view of the intersection of the mask sheet 15 and the howling sheet 13 in the vapor deposition mask 10. FIG. 10 is an enlarged view of the TEG pattern 20 at the intersection of the vapor deposition mask 10 in FIG. FIG. 11 is an enlarged view of the TEG pattern 20 in the vapor deposition mask in which the position of the TEG hole penetrating from the vapor deposition mask 10 in FIG. 10 is changed.

As shown in FIG. 9, the howling sheet 13 is disposed below the mask sheet 15. The howling sheet 13 does not shield the part of the TEG pattern 20 formed in the mask sheet 15 and the opening part 13a so that the part of the TEG pattern 20 is not shielded. And the remaining TEG holes are shielded.

Specifically, as shown in FIG. 10, the TEG pattern 20 has a first TEG hole 21 to a sixth TEG hole 26 that are a set of a pair of TEG holes. The first TEG hole 21 to the sixth TEG hole 26 are formed at positions different from each other outside the effective portion YA in the mask sheet 15 and penetrate the mask sheet 15. The first TEG hole 21 to the sixth TEG hole 26 are formed in the same process as the vapor deposition hole H of the effective portion YA.

The number of TEG holes included in the TEG pattern 20 is at least the number of types of vapor deposition layers formed for each pixel pix (that is, the number of types of necessary vapor deposition masks 10). In the present embodiment, there are six types of vapor deposition layers formed for each pixel pix (red hole transport layer 42R, red light emitting layer 43R, green hole transport layer 42G, green light emitting layer 43G, blue hole transport layer 42B). And the blue light emitting layer 43B), the TEG pattern 20 also has six TEG holes.

This is because a dummy pattern is formed on the TFT substrate 30 for each type of the vapor deposition layer through the TEG hole which is a through hole in the vapor deposition mask 10 without being stacked on each other. The dummy pattern of a vapor deposition layer is a pattern for verifying the vapor deposition state of each vapor deposition layer, and is a pattern which does not contribute to the image display of a display device.

Note that the number of TEG holes included in the TEG pattern 20 may be larger than the number of types of vapor deposition layers formed for each pixel pix.

Then, the opening 13a of the howling sheet 13 disposed in the lower layer of the mask sheet 15 overlaps with any one of the first TEG hole 21 to the sixth TEG hole 26, for example. Thereby, of the first TEG hole 21 to the sixth TEG hole 26, the TEG hole overlapping the opening 13 a becomes a through hole in the vapor deposition mask 10, and the other TEG holes are shielded by the howling sheet 13.

Although not shown in FIG. 10, the cover sheet 12 does not overlap the first TEG hole 21 to the sixth TEG hole 26.

In the present embodiment, the first TEG hole 21 to the sixth TEG hole 26 are linearly arranged along the extending direction of the mask sheet 15, but the arrangement pattern of the first TEG hole 21 to the sixth TEG hole 26 is a straight line. However, the present invention is not limited to this, and it may be set as appropriate according to the type of TFT substrate 30 (the shape, size, spacing, etc. of the active region).

For example, the vapor deposition mask 10 shown in FIG. 10 is the vapor deposition mask 10R1 (first vapor deposition mask) for patterning the red hole transport layer 42R (FIGS. 2 and 4: first vapor deposition layer) on the red pixel Rpix. Shall.

As shown in FIG. 10, in the vapor deposition mask 10R1, the first TEG hole 21 is overlapped with the opening 13a of the howling sheet 13 to form a through hole, and the second TEG hole 22 to the sixth TEG hole 26 are shielded by the howling sheet 13. In addition, the howling sheet 13 and the mask sheet 15 are relatively disposed. If the effective portion YA of the mask sheet 15 included in the vapor deposition mask 10R1 is the effective portion YAR, the vapor deposition holes H are formed in the effective portion YAR in the same pattern as the red pixel Rpix in the TFT substrate 30.

By depositing the red hole transport layer 42R on the red pixel Rpix in the deposition process using the deposition mask 10R1, the red hole transport layer 42R is placed in the red pixel Rpix through the deposition hole H of the effective portion YAR in the mask sheet 15. In addition, the dummy pattern of the red hole transport layer 42R can be formed outside the active region of the TFT substrate 30 through the penetrating first TEG hole 21 and the opening 13a.

Then, by measuring the position of the dummy pattern of the red hole transport layer 42R deposited on the deposition substrate through the first TEG hole 21 and the opening 13a, the red hole transport layer 42R is formed on the deposition substrate. It can be inspected whether or not it has been deposited at a desired position.

For example, the vapor deposition mask 10 shown in FIG. 11 is the vapor deposition mask 10R1 (second vapor deposition mask) for patterning the red light emitting layer 43R (FIGS. 2 and 4: second vapor deposition layer) on the red pixel Rpix. To do.

When the vapor deposition mask 10R1 for forming the pattern of the red light emitting layer 43R is manufactured, in the step Sb (FIG. 5), among the first TEG hole 21 to the sixth TEG hole 26, for example, the opening 13a is formed in the sixth TEG hole 26. The howling sheet 13 that overlaps the other first TEG holes 21 to 25 may be attached to the mask frame 11.

Then, in step Sd (FIG. 5), by attaching the mask sheet 15 to the mask frame 11, among the first TEG hole 21 to the sixth TEG hole 26 formed in the mask sheet 15, the sixth TEG hole 26 is connected to the opening 13a. The howling sheet 13 and the mask sheet 15 are relatively arranged such that the overlapping holes form a through hole, and the first TEG hole 21 to the fifth TEG hole 25 are shielded by the howling sheet 13.

For this reason, the position of the 6th TEG hole 26 used as a penetration hole among a plurality of TEG holes formed in mask mask 15 in vapor deposition mask 10R2 is a plurality of TEG holes formed in mask sheet 15 in vapor deposition mask 10R1. Is different from the position of the first TEG hole 21 which is a through hole.

The red light emitting layer 43R is vapor-deposited in the vapor deposition process using the vapor deposition mask 10R2 produced in this manner, so that the red light emitting layer 43R is red in the red pixel Rpix through the vapor deposition hole H of the effective portion YAR in the mask sheet 15. The hole transport layer 42R is laminated and formed so as not to be stacked with the dummy pattern of the red hole transport layer 42R outside the active region and at a position different from the dummy pattern of the red hole transport layer 42R. A dummy pattern of the red light emitting layer 43R can be formed through the 6TEG hole 26 and the opening 13a.

Then, by measuring the position of the dummy pattern of the red light emitting layer 43R deposited on the deposition substrate through the sixth TEG hole 26 and the opening 13a, the red light emitting layer 43R is placed at a desired position on the deposition substrate. It can be inspected whether or not it has been deposited.

As described above, the effective portion YAR of the mask sheet 15 included in the vapor deposition mask 10R1 and the effective portion YAR of the mask sheet 15 included in the vapor deposition mask 10R2 are formed in the same pattern as the red pixel Rpix in the TFT substrate 30. Has been.

On the other hand, in the vapor deposition mask 10R1, the position of the first TEG hole 21 that is a through hole among the plurality of TEG holes formed in the mask sheet 15 is the position of the plurality of TEG holes formed in the mask sheet 15 in the vapor deposition mask 10R2. Is different from the position of the sixth TEG hole 26 serving as a through hole.

Note that a set of vapor deposition masks 10 (first vapor deposition mask and second vapor deposition mask) having the same pattern of vapor deposition holes H in the effective portion YA and different positions of TEG holes that are through holes in the vapor deposition mask 10 are vapor deposition masks. This is called a set. The vapor deposition mask set is a set of a pair of vapor deposition masks of different types required in the manufacturing process of the display device in order to form a plurality of vapor deposition layers stacked in the pixel of the display device.

The same applies to a vapor deposition mask that forms a vapor deposition layer on a pixel that emits light of other colors.

For example, when producing the vapor deposition mask 10 (first vapor deposition mask) for patterning the green hole transport layer 42G (FIGS. 2 and 4: first vapor deposition layer) on the green pixel Gpix, in step Sb, for example, The howling sheet 13 is attached to the mask frame 11 so that the opening 13a overlaps the second TEG hole 22 and shields the other first TEG hole 21, and the third TEG hole 23 to the sixth TEG hole 26.

Then, when the mask sheet 15 is attached to the mask frame 11 in step Sd, the second TEG hole 22 becomes a through hole by overlapping the opening 13a, and the first TEG hole 21, the third TEG hole 23 to the sixth TEG hole 26 become the howling sheet 13. It is shielded by.

The green hole transport layer 42G is formed in the green pixel Gpix through the deposition hole H of the effective portion YA by depositing the green hole transport layer 42G in the deposition process using the deposition mask 10 thus manufactured. In addition, the dummy pattern of the green hole transport layer 42G, the dummy pattern of the red hole transport layer 42R, and the dummy pattern of the red light emitting layer 43R are passed through the second TEG hole 22 and the opening 13a outside the active region of the TFT substrate 30. Can be formed at different positions so as not to be stacked with the dummy pattern of the red hole transport layer 42R and the dummy pattern of the red light emitting layer 43R.

Further, when the vapor deposition mask 10 (second vapor deposition mask) for patterning the green light emitting layer 43G (FIG. 2 and FIG. 4: second vapor deposition layer) on the green pixel Gpix is produced, in step Sb, for example, a fifth TEG hole is formed. The howling sheet 13 that covers the first TEG hole 21 to the fourth TEG hole 24 and the sixth TEG hole 26 is attached to the mask frame 11.

When the mask sheet 15 is attached to the mask frame 11 in step Sd, the fifth TEG hole 25 becomes a through hole by overlapping the opening 13a, and the first TEG hole 21 to the fourth TEG hole 24 and the sixth TEG hole 26 become the howling sheet 13. It is shielded by.

The green light emitting layer 43G is vapor-deposited in the vapor deposition process using the vapor deposition mask 10 produced in this manner, whereby the green light emitting layer 43G is placed in the green pixel Rpix through the vapor deposition hole H of the effective portion YA. And a dummy pattern of the green light emitting layer 43G, a dummy pattern of the red hole transport layer 42R, and a red light emitting layer 43R through the fifth TEG hole 25 and the opening 13a outside the active region of the TFT substrate 30. The dummy pattern of the red hole transport layer 42R, the dummy pattern of the red light emitting layer 43R, and the dummy pattern of the green hole transport layer 42G should not be stacked at positions different from the dummy pattern of the green hole transport layer 42G and the dummy pattern of the green hole transport layer 42G. Can be formed.

The effective portion YA of the mask sheet 15 included in the vapor deposition mask 10 (first vapor deposition mask) for patterning the green hole transport layer 42G on the green pixel Gpix and the green light emitting layer 43G are patterned on the green pixel Gpix. The vapor deposition holes H are formed in the same pattern as the green pixels Gpix in the TFT substrate 30 together with the effective portion YA of the mask sheet 15 included in the vapor deposition mask 10 (second vapor deposition mask).

On the other hand, the position of the penetrating TEG hole in the mask sheet 15 included in the vapor deposition mask 10 (first vapor deposition mask) for patterning the green hole transport layer 42G on the green pixel Gpix, and the green light emitting layer 43G as a green pixel. It differs from the position of the TEG hole which penetrates in the mask sheet | seat 15 which the vapor deposition mask 10 (2nd vapor deposition mask) for patterning in Gpix has.

A vapor deposition mask 10 (first vapor deposition mask) for patterning the green hole transport layer 42G on the green pixel Gpix and a vapor deposition mask 10 (second vapor deposition mask) for patterning the green light emitting layer 43G on the green pixel Gpix. ) Is a vapor deposition mask set.

Further, for example, in the case of producing the vapor deposition mask 10 (first vapor deposition mask) for patterning the blue hole transport layer 42B (FIGS. 2 and 4: first vapor deposition layer) on the blue pixel Bpix, in step Sb, For example, the opening 13 a overlaps the third TEG hole 23, and the howling sheet 13 that shields the first TEG hole 21, the second TEG hole 22, and the fourth TEG hole 24 to the sixth TEG hole 26 is attached to the mask frame 11.

Then, when the mask sheet 15 is attached to the mask frame 11 in step Sd, the third TEG hole 22 overlaps the opening 13a to form a through hole, and the first TEG hole 21, the second TEG hole 22, and the fourth TEG hole 24 to the sixth TEG hole. 26 is shielded by the howling sheet 13.

A blue hole transport layer 42B is formed in the blue pixel Bpix through the vapor deposition hole H of the effective portion YA by depositing the blue hole transport layer 42B in the vapor deposition process using the vapor deposition mask 10 thus manufactured. The dummy pattern of the blue hole transport layer 42B, the dummy pattern of the red hole transport layer 42R, the dummy pattern of the red light emitting layer 43R through the third TEG hole 23 and the opening 13a outside the active region of the TFT substrate 30. A dummy pattern of the red hole transport layer 42R, a dummy pattern of the red light emission layer 43R, and a dummy of the green hole transport layer 42G are located at positions different from the dummy pattern of the green hole transport layer 42G and the dummy pattern of the green light emission layer 43G. The pattern and the dummy pattern of the green light emitting layer 43G can be formed so as not to be stacked.

Further, when the vapor deposition mask 10 (second vapor deposition mask) for patterning the blue light emitting layer 43B (FIGS. 2 and 4: second vapor deposition layer) on the blue pixel Bpix is produced, in the step Sb, for example, a fourth TEG is used. The howling sheet 13 that covers the first TEG hole 21 to the third TEG hole 23, the fifth TEG hole 25, and the sixth TEG hole 26 is attached to the mask frame 11 so that the opening 13a overlaps the hole 24.

Then, when the mask sheet 15 is attached to the mask frame 11 in step Sd, the fourth TEG hole 24 becomes a through hole by overlapping the opening 13a, and the first TEG hole 21 to the third TEG hole 23, the fifth TEG hole 25, and the sixth TEG hole. 26 is shielded by the howling sheet 13.

By depositing the blue light emitting layer 43B in the vapor deposition process using the vapor deposition mask 10 thus produced, the blue light emitting layer 43B is placed in the blue pixel Rpix through the vapor deposition hole H of the effective portion YA. And a dummy pattern of the blue light emitting layer 43B, a dummy pattern of the red hole transport layer 42R, and a red light emitting layer 43R through the fourth TEG hole 24 and the opening 13a outside the active region of the TFT substrate 30. The dummy pattern of the red hole transport layer 42R, the dummy pattern of the red hole transport layer 42G, the dummy pattern of the green hole transport layer 42G, the dummy pattern of the green light emitting layer 43G, and the dummy pattern of the blue hole transport layer 42B 43R dummy pattern, green hole transport layer 42G dummy pattern, green light emitting layer 43G dummy pattern, and blue hole transport layer 42B dummy pattern It can be formed so as not laminated with.

The effective portion YA of the mask sheet 15 included in the vapor deposition mask 10 (first vapor deposition mask) for patterning the blue hole transport layer 42B on the blue pixel Bpix and the blue light emitting layer 43B are patterned on the blue pixel Bpix. The vapor deposition holes H are formed in the same pattern as the blue pixels Bpix on the TFT substrate 30 together with the effective portion YA of the mask sheet 15 included in the vapor deposition mask 10 (second vapor deposition mask).

On the other hand, the position of the penetrating TEG hole in the mask sheet 15 included in the vapor deposition mask 10 (first vapor deposition mask) for patterning the blue hole transport layer 42B on the blue pixel Bpix, and the blue light emitting layer 43B in the blue pixel It differs from the position of the TEG hole which penetrates in the mask sheet | seat 15 which the vapor deposition mask 10 (2nd vapor deposition mask) for patterning in Bpix has.

A vapor deposition mask 10 (first vapor deposition mask) for patterning the blue hole transport layer 42B on the blue pixel Bpix and a vapor deposition mask 10 (second vapor deposition mask) for patterning the blue light emitting layer 43B on the blue pixel Bpix. ) Is a vapor deposition mask set.

FIG. 12 is an enlarged view of the intersection of the mask sheet 115 and the howling sheet 113 of the vapor deposition mask 110 according to the comparative example of the vapor deposition mask 10.

The mask sheet 115 is different from the mask sheet 15 in that only one of the first TEG hole 21 to the sixth TEG hole 26 is formed and the other five TEG holes are not formed. Other configurations of the mask sheet 115 are the same as those of the mask sheet 15.

The howling sheet 113 is different in that an opening 113 a is formed instead of the opening 13 a of the howling sheet 13. The other structure of the howling sheet 113 is the same as that of the howling sheet 13. The opening 113a is a through hole having a larger area than the opening 13a, and even if all of the first TEG hole 21 to the sixth TEG hole 26 are formed in the mask sheet 115, the opening 113a is large enough to overlap with the first TEG hole 21 to the sixth TEG hole 26. Have an area of

When the vapor deposition mask 110 for patterning the red hole transport layer 42R is produced, in step S101 (FIG. 5), the effective portion YA is formed in the mask sheet 115 and the first TEG hole 21 to the sixth TEG hole 26 are formed. Of these, only the first TEG hole 21 is formed. In step Sb, the howling sheet 113 in which the opening 113a is formed is attached to the mask frame 11. Next, when the mask sheet 115 is attached to the mask frame 11 in step Sd, the first TEG hole 21 overlaps the opening 113a, thereby forming a through hole.

By depositing the red hole transport layer 42R using the deposition mask 110 thus manufactured, the red hole transport layer 42R is formed in the red pixel Rpix through the deposition hole H of the effective portion YA, and the TFT substrate. A dummy pattern for confirming the deposition state of the red hole transport layer 42R can be formed outside the 30 active regions through the first TEG hole 21 and the opening 113a.

Similarly, when producing the vapor deposition mask 110 for patterning the red light emitting layer 43R, the vapor deposition mask 110 is formed by using the mask sheet 115 in which only the sixth TEG hole 26 among the first TEG hole 21 to the sixth TEG hole 26 is formed. Is made. In the case of producing the vapor deposition mask 110 for patterning the green hole transport layer 42G, the vapor deposition mask is used by using the mask sheet 115 in which only the second TEG hole 22 among the first TEG hole 21 to the sixth TEG hole 26 is formed. 110 is produced. Further, when the vapor deposition mask 110 for patterning the green light emitting layer 43G is manufactured, the vapor deposition mask 110 is formed using the mask sheet 115 in which only the fifth TEG hole 25 among the first TEG hole 21 to the sixth TEG hole 26 is formed. Make it. In the case of producing the vapor deposition mask 110 for patterning the blue hole transport layer 42B, the vapor deposition mask is used by using the mask sheet 115 in which only the third TEG hole 23 among the first TEG hole 21 to the sixth TEG hole 26 is formed. 110 is produced. Further, when the vapor deposition mask 110 for patterning the blue light emitting layer 43B is manufactured, the vapor deposition mask 110 is formed using the mask sheet 115 in which only the fourth TEG hole 24 is formed among the first TEG hole 21 to the sixth TEG hole 26. Make it.

Thereby, a dummy pattern of the red hole transport layer 42R, a dummy pattern of the red light emitting layer 43R, a dummy pattern of the green hole transport layer 42G, a dummy pattern of the green light emitting layer 43G, a dummy pattern of the blue hole transport layer 42B, and Each of the blue light emitting layers 43B can be formed without being laminated.

However, according to the vapor deposition mask 110, the mask sheet 115 for forming the red hole transport layer 42R and the mask sheet 115 for forming the red light emitting layer 43R have the same pattern of the vapor deposition holes H of the effective portion YA. Nevertheless, since the positions of the TEG holes are different (for example, the first TEG hole 21 and the sixth TEG hole 26), it is necessary to manufacture different mask sheets 115 respectively.

Similarly, although the mask sheet 115 for forming the green hole transport layer 42G and the mask sheet 115 for forming the green light emitting layer 43G have the same pattern of the vapor deposition holes H of the effective portion YA. Since the positions of the TEG holes are different, it is necessary to manufacture different mask sheets 115 respectively. Further, the mask sheet 115 for forming the blue hole transport layer 42B and the mask sheet 115 for forming the blue light emitting layer 43B are both the same in the pattern of the vapor deposition holes H of the effective portion YA. Since the positions of the TEG holes are different, it is necessary to produce different mask sheets 115 respectively.

That is, according to the configuration of the vapor deposition mask 110, it is necessary to produce the mask sheets 115 of the number of types (for example, six types) of vapor deposition layers formed on the pixels. Since the mask sheet 115 needs to form a plurality of vapor deposition holes H that require high positional accuracy, the mask sheet 115 and other sheet members in the vapor deposition mask 110 (for example, howling sheet 113, cover sheet 12, alignment sheet 14 and the like) Compared to expensive. For this reason, it is preferable to reduce the kind of the mask sheet 115 used for manufacturing a display device from a viewpoint of reducing the manufacturing cost of the display device using a vapor deposition mask and a vapor deposition mask.

Therefore, as shown in FIGS. 10 and 11, according to the vapor deposition mask 10 according to the present embodiment, the mask sheet 15 has a plurality of TEG holes (first TEGs) constituting the TEG pattern 20 in the region outside the effective portion YA. Hole 21 to sixth TEG hole 26) are formed. Further, the howling sheet 13 which is a member different from the mask sheet 15 and overlaps the mask sheet 15 overlaps some of the TEG holes (the first TEG hole 21 to the sixth TEG hole 26) with some TEG holes. An opening 13 a having an overlapping area is formed for each TEG pattern 20 of the mask sheet 15.

The opening 13a formed in the howling sheet 13 does not overlap all of the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) constituting the TEG pattern 20 of the mask sheet 15, and a part of the TEG pattern 20 is formed. Since the area overlaps with the TEG hole (for example, the first TEG hole 21), a part of the TEG hole (for example, the first TEG hole 21) that overlaps the opening 13a becomes a through hole in the vapor deposition mask 10, and a plurality of TEG holes Of the TEG holes (the first TEG hole 21 to the sixth TEG hole 26), the remaining TEG holes (for example, the second TEG hole 22 to the sixth TEG hole 26) are shielded by the howling sheet 13.

Thus, according to the vapor deposition mask 10, a plurality of TEG holes constituting the TEG pattern 20 are formed in the mask sheet 15 in advance. And the position of the TEG hole used as a through-hole in the vapor deposition mask 10 among several TEG holes which comprise the TEG pattern 20 is changed by changing the position of the opening part 13a formed in the howling sheet | seat 13 which overlaps with this mask sheet | seat 15. It is different.

For this reason, the pattern of the several TEG hole which comprises the TEG pattern 20 can be made the same by the mask sheets of the multiple types of vapor deposition mask used for the vapor deposition process of a display device.

Thereby, among the mask sheets 15 of each of the plurality of types of vapor deposition masks, the mask sheets 15 having the same pattern of the vapor deposition holes H of the effective portion YA have a plurality of patterns of the vapor deposition holes H of the effective portion YA and the plurality of TEG patterns 20. The pattern of the TEG holes becomes the same, and the type of the mask sheet 15 can be made the same type.

That is, for example, the mask sheet 15 of the vapor deposition mask 10R1 and the mask sheet 15 of the vapor deposition mask 10R2 have the same pattern of the vapor deposition holes H of the effective portion YAR, and the first TEG hole 21 to the sixth TEG hole 26 of the TEG pattern 20 are used. Since the patterns are also the same, the same type of mask sheet 15 can be used.

Thus, since the types of the mask sheets 15 of the vapor deposition masks constituting the vapor deposition mask set can be made the same, the number of types of mask sheets necessary for the vapor deposition process of the display device can be reduced.

Thereby, the manufacturing cost of the vapor deposition mask 10 can be reduced, and as a result, the manufacturing cost of the display device manufactured using the vapor deposition mask 10 can be reduced.

For example, in this embodiment, the mask sheet 15 of the vapor deposition mask 10 for vapor-depositing the red hole transport layer 42R and the mask sheet 15 of the vapor deposition mask 10 vapor-depositing the red light-emitting layer 43R can be the same type. . Moreover, the mask sheet 15 of the vapor deposition mask 10 for vapor-depositing the green hole transport layer 42G and the mask sheet 15 of the vapor deposition mask 10 for vapor-depositing the green light emitting layer 43G can be the same type. Moreover, the mask sheet 15 of the vapor deposition mask 10 for vapor-depositing the blue hole transport layer 42B and the mask sheet 15 of the vapor deposition mask 10 for vapor-depositing the blue light emitting layer 43B can be the same type.

For this reason, there are six types of vapor deposition layers deposited on the display device (red hole transport layer 42R, red light emission layer 43R, green hole transport layer 42G, green light emission layer 43G, blue hole transport layer 42B, blue light emission). As for the layer 43B), only three types of mask sheets 15 are required.

In addition, it is necessary to produce the six kinds of howling sheets 13 in which the positions of the openings 13a are different so that the howling sheets 13 overlap the first TEG holes 21 to the sixth TEG holes 26 of the TEG pattern 20, respectively.

However, the howling sheet 13 is cheaper because it can be produced more easily than the mask sheet 15. For this reason, even if the number of types of howling sheets 13 increases, reducing the number of types of mask sheets 15 that are much more expensive than the howling sheets 13 has a high effect of reducing the manufacturing cost of the vapor deposition mask 10.

[Embodiment 2]
You may shield a part of several TEG hole which comprises a TEG pattern with a cover sheet instead of a howling sheet among lower layer sheets.

FIG. 13 is a diagram illustrating a configuration of a cover sheet (shielding member) 12A included in the vapor deposition mask of the second embodiment. FIG. 14 is an enlarged view of a TEG pattern in the vapor deposition mask of the second embodiment.

As illustrated in FIGS. 13 and 14, the vapor deposition mask 10 </ b> A according to the second embodiment is provided with a cover sheet 12 </ b> A and a howling sheet 113 instead of the cover sheet 12 and the howling sheet 13 included in the vapor deposition mask 10. Different.

The other structure of the vapor deposition mask 10A is the same as that of the vapor deposition mask 10. Further, the manufacturing process of the evaporation mask 10A is the same as the evaporation mask manufacturing process S20 shown in FIG.

In the step Sa of the deposition mask manufacturing step S20 (FIG. 5), the cover sheet 12A attached to the mask frame 11 has the configuration shown in FIG.

The cover sheet 12A extends along the extending direction of the mask sheet 15 attached to the mask frame 11 and the second surface 15c (lower surface) of the mask sheet 15 attached to the mask frame 11 from the extending part 12Aa. And protruding convex portion 12Ab.

Of the cover sheet 12A, the vicinity of both ends of the extending portion 12Aa is attached by welding to the mask frame 11 in the step Sa of the deposition mask manufacturing step S20 (FIG. 5) (cover sheet attaching step, TEG hole shielding step). .

Next, in step Sb, attachment is performed by welding the vicinity of both ends of the howling sheet 113 to the mask frame 11 to which the cover sheet 12A is attached.

This howling sheet 113 has the same shape as that shown in FIG. 12, and an opening 113a having an area that overlaps the entire plurality of TEG holes constituting the TEG pattern 20 of the mask sheet 15 to be attached to the mask frame 11 later is formed. Has been. That is, in this embodiment, the howling sheet 113 does not shield the TEG pattern 20 of the mask sheet 15.

Next, the alignment sheet 14 is attached to the mask frame 11 in step Sc (FIG. 5), and the TEG pattern 20 of the mask sheet 15 is formed on the mask frame 11 to which the cover sheet 12A is attached in step Sd (FIG. 5). The mask sheet 15 is attached so that some of the TEG holes do not overlap with the cover sheet 12A and the remaining TEG holes overlap the convex portions 12Ab of the cover sheet 12A (mask sheet attaching step).

In other words, among the plurality of TEG holes constituting the TEG pattern 20 of the mask sheet 15, the cover sheet 12 </ b> A does not shield some TEG holes but covers the remaining TEG holes and the mask sheet 15 and the cover. The sheet 12A is relatively disposed.

Then, the vapor deposition mask 10A is completed through the steps Se and Sf.

As shown in FIG. 14, according to the vapor deposition mask 10A, a plurality of TEG holes (first TEG hole 21 to sixth TEG hole 26) constituting the TEG pattern 20 are formed in the mask sheet 15 in an area outside the effective portion YA. Has been. The cover sheet 12A, which is a member different from the mask sheet 15 and extends along the extending direction of the mask sheet 15, is provided with a plurality of convex portions 12Ab in the extending portion 12Aa.

The convex portion 12Ab of the cover sheet 12A does not overlap with some of the TEG holes (for example, the first TEG hole 21) among the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26), and the remaining TEGs. It has a shape overlapping with the holes (for example, the second TEG hole 22 to the sixth TEG hole 26), and is formed for each TEG pattern 20 of the mask sheet 15.

In the present embodiment, the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) of the mask sheet 15 are arranged side by side in the extending direction of the mask sheet 15. And the length of the extending direction of the mask sheet 15 in the convex portion 12Ab is shorter than the length in which the plurality of TEG holes of the mask sheet 15 are arranged.

The plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) all overlap with the opening 113a of the howling sheet 113.

For this reason, of the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26), a part of the TEG holes (for example, the first TEG holes 21) that do not overlap the convex portion 12Ab are through holes in the vapor deposition mask 10A. Of the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26), the remaining TEG holes (for example, the second TEG hole 22 to the sixth TEG hole 26) are shielded by the convex portion 12Ab.

Thus, according to the vapor deposition mask 10A, a plurality of TEG holes constituting the TEG pattern 20 are formed in the mask sheet 15 in advance. Then, by changing the position of the convex portion 12Ab of the cover sheet 12 overlapping the mask sheet 15, among the plurality of TEG holes constituting the TEG pattern 20, the positions of the TEG holes serving as through holes in the vapor deposition mask 10A are different. It is When a TEG hole (second TEG hole 22 to fifth TEG hole 25) sandwiched between both ends among the plurality of TEG holes is to be a through hole, the TEG hole (second TEG hole) sandwiched between both ends of the convex portion 12Ab. A hole or a slit may be provided in a region overlapping with the hole 22 to the fifth TEG hole 25).

For this reason, among the mask sheets 15 of each of the plurality of types of vapor deposition masks, the mask sheets 15 having the same pattern of the vapor deposition holes H of the effective portion YA are the patterns of the vapor deposition holes H of the effective portion YA and the plurality of TEG patterns 20. The pattern of the TEG holes becomes the same, and the type of the mask sheet 15 can be made the same type.

As described above, since the types of the mask sheets 15 of the vapor deposition masks 10A constituting the vapor deposition mask set can be made the same, the number of types of the mask sheets 15 necessary for the vapor deposition process of the display device can be reduced.

Thereby, the manufacturing cost of the vapor deposition mask 10A can be reduced, and as a result, the production cost of the display device manufactured using the vapor deposition mask 10A can be reduced.

Note that the cover sheet 12A needs to produce six types of cover sheets 12A in which the positions or shapes of the convex portions 12Ab are different so as not to overlap any of the first TEG hole 21 to the sixth TEG hole 26 of the TEG pattern 20. is there.

However, the cover sheet 12A is cheaper because it can be more easily produced than the mask sheet 15. For this reason, even if the types of the cover sheet 12A increase, reducing the number of types of the mask sheet 15 that is much more expensive than the cover sheet 12A has a high manufacturing cost reduction effect for the vapor deposition mask 10A.

In the present embodiment, the howling sheet 113 has an area that overlaps with all of the plurality of TEG holes (the second TEG hole 22 to the fifth TEG hole 25) constituting the TEG pattern 20. For this reason, the thing of the same kind can be used for the howling sheet 113 between 10A of vapor deposition masks from which a kind differs.

[Embodiment 3]
A shielding member that shields part of the plurality of TEG holes constituting the TEG pattern may be formed on the mask sheet 15.

FIG. 15 is a diagram illustrating a deposition mask manufacturing step S20B according to the third embodiment. The vapor deposition mask manufacturing step S20B of the third embodiment is the same as the vapor deposition mask manufacturing step S20 shown in FIG. 5 up to the steps S101 and Sa to Sc. FIG. 16 is an enlarged view of a TEG pattern in the vapor deposition mask 10B of the third embodiment.

As shown in FIGS. 15 and 16, after steps S101 and Sa to Sc, the mask frame 11 (FIG. 6), the cover sheet 12 (FIG. 6), the howling sheet 113, and the alignment sheet 14 (FIG. 6) Install.

Next, in step Sd, the mask sheet 15 on which the effective portion YA and the TEG pattern 20 are formed is attached to the mask frame 11 (mask sheet attaching step).

However, in the present embodiment, the lower layer sheet does not overlap with the TEG pattern of the mask sheet 15.

That is, the cover sheet 12 does not overlap the TEG pattern 20 of the mask sheet 15. Further, the opening 113 a formed in the howling sheet 113 intersecting with the mask sheet 15 overlaps with all of the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) constituting the TEG pattern 20 of the mask sheet 15.

For this reason, in the present embodiment, at the stage where the mask sheet 15 is attached to the mask frame 11, the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) constituting the TEG pattern 20 are all through holes. .

In Step Sg, the shielding member 76a is masked so as not to shield some of the plurality of TEG holes constituting the TEG pattern 20 of the mask sheet 15 attached to the mask frame 11 and to shield the remaining TEG holes. It forms in the sheet | seat 15 (TEG hole shielding process).

In other words, in the TEG hole shielding step, the shielding member 76a which is a member different from the mask sheet 15 does not shield some TEG holes among the plurality of TEG holes, and shields the remaining TEG holes. The shielding member 76a and the mask sheet 15 are relatively arranged.

Thereby, only the TEG hole which is not shielded by the shielding member 76a among the plurality of TEG holes constituting the TEG pattern 20 becomes the through hole in the vapor deposition mask 10B.

The formation of the shielding member 76a on the mask sheet 15 is performed, for example, by the deposition unit 76 using deposition or the like. The film forming unit 76 may fill the shielding member 76a in each of the plurality of TEG holes to be shielded, or may be formed on the mask sheet 15 with an area extending over the plurality of TEG holes to be shielded.

The material of the shielding member 76a may be a metal material or a resin material. However, when the completed deposition mask 10B is washed and used repeatedly, a metal material is preferable because it is less likely to peel off from the mask sheet 15 even after washing.

Alternatively, when the shielding member 76a formed on the mask sheet 15 is peeled off and the position of the TEG hole as a through hole among the plurality of TEG holes is changed and the shielding member 76a is formed again on the mask sheet 15, the resin material is better. The shielding member 76a is preferable because it can be easily peeled off from the mask sheet 15.

And the vapor deposition mask 10B which passed through process Se * Sf is used in a vapor deposition process.

The film forming unit 76 may be provided separately from the apparatus for attaching the mask sheet 15 to the mask frame 11, or may be provided integrally with the apparatus for attaching the mask sheet 15 to the mask frame 11.

FIG. 17 is a diagram illustrating a configuration of a mask sheet attaching apparatus 79 with a film forming function according to the third embodiment. A mask sheet attaching device 79 shown in FIG. 17 is an example of an apparatus that performs the processes Sd and Sg.

The mask sheet attaching device 79 includes a control unit 71, a mounting table 72, an imaging unit 73, a gripping unit 74, a display unit 75, and a film forming unit 76.

The control unit 71 controls each part of the mask sheet attaching device 79 in an integrated manner. For example, the control unit 71 controls the operation of the mounting table 72, acquires an image from the imaging unit 73 and displays it on the display unit 75, controls the operation of the gripping unit 74, and controls the operation of the display unit 75. And the operation of the film forming unit 76 is controlled.

The mounting table 72 is a table on which the mask frame 11 on which the cover sheet 12, the howling sheet 113, and the alignment sheet 14 are formed is mounted.

The photographing unit 73 photographs the mask frame 11 placed on the placing table 72 and the mask sheet 15 being attached to the mask frame 11, and the photographed image is displayed on the display unit 75 via the control unit 71. Display.

The gripping part 74 grips both ends of the mask sheet 15 to be attached to the mask frame 11 mounted on the mounting table 72. Then, the mask sheet 15 is stretched so that the edge of the effective portion YA is at a predetermined position by an instruction from the control unit 71 or by an operation by an operator.

As shown in FIG. 16, according to the vapor deposition mask 10B, a plurality of TEG holes (first TEG hole 21 to sixth TEG hole 26) constituting the TEG pattern 20 are formed in the mask sheet 15 in an area outside the effective portion YA. Has been.

Further, the shielding member 76a, which is a member different from the mask sheet 15, is formed in the mask sheet 15, and some of the TEG holes (for example, the first TEG hole 21 to the sixth TEG hole 26) (for example, The first TEG hole 21) is not shielded, and is formed in the mask sheet 15 for each TEG pattern 20 of the mask sheet 15 so as to shield the remaining TEG holes (for example, the second TEG hole 22 to the sixth TEG hole 26). . Further, the shielding member 76a may be formed in the mask sheet 15 for each TEG hole to be shielded (for example, the second TEG hole 22 to the sixth TEG hole 26).

The plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) all overlap with the opening 113a of the howling sheet 113.

Therefore, some TEG holes (for example, the first TEG holes 21) that are not shielded by the shielding member 76a among the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) are through holes in the vapor deposition mask 10B. Thus, the remaining TEG holes (for example, the second TEG hole 22 to the sixth TEG hole 26) among the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) are shielded by the shielding member 76a.

Thus, according to the vapor deposition mask 10B, a plurality of TEG holes constituting the TEG pattern 20 are formed in the mask sheet 15 in advance. And the TEG hole used as a through-hole in the vapor deposition mask 10B among several TEG holes which comprise the TEG pattern 20 by changing the formation position to the mask sheet 15 of the shielding member 76a which is a member which overlaps with this mask sheet 15 The position of can be different.

For this reason, among the mask sheets 15 of each of the plurality of types of vapor deposition masks 10B, the mask sheets 15 having the same pattern of the vapor deposition holes H of the effective portion YA are the plurality of patterns of the vapor deposition holes H and the TEG patterns 20 of the effective portion YA. The patterns of the TEG holes are the same, and the mask sheet 15 can be of the same type.

Thus, since the types of the mask sheets 15 of the vapor deposition masks 10B constituting the vapor deposition mask set can be made the same, the number of types of the mask sheets 15 necessary for the vapor deposition process of the display device can be reduced.

Thereby, the manufacturing cost of the vapor deposition mask 10B can be reduced, and as a result, the manufacturing cost of the display device manufactured using the vapor deposition mask 10B can be reduced.

[Embodiment 4]
After attaching the mask sheet 15 to the mask frame 11, TEG holes may be formed at necessary positions in the mask sheet 15.

FIG. 18 is a diagram illustrating a deposition mask manufacturing process S20C according to the fourth embodiment. FIG. 19 is an enlarged view of the TEG hole of the vapor deposition mask 10C of the fourth embodiment.

The vapor deposition mask production step S20C of the fourth embodiment is the same as the vapor deposition mask production step S20B shown in FIG.

As shown in FIG. 18, in the fourth embodiment, in the step S101C performed before the step Sd, the effective portion YA including a plurality of vapor deposition holes arranged in the mask sheet 15C is formed. Is not formed (mask sheet forming step).

Then, as shown in FIGS. 18 and 19, through steps Sa to Sc, the mask frame 11 (FIG. 6), the cover sheet 12 (FIG. 6), the howling sheet 113, and the alignment sheet 14 (FIG. 6) Install.

Next, in step Sd, the mask sheet 15C on which the effective portion YA is formed is attached to the mask frame 11 (mask sheet attaching step). However, at the stage where the mask sheet 15C is attached to the mask frame 11, no TEG hole is formed in the mask sheet 15C.

Next, in step Sh, 1 or in an area outside the effective portion YA in the mask sheet 15C attached to the mask frame 11 and not overlapping with other members (that is, the mask frame 11, the cover sheet 12, and the howling sheet 13). A plurality of TEG holes are formed (TEG hole forming step).

Thereby, the TEG hole formed in the mask sheet 15C becomes a through hole in the vapor deposition mask 10C.

The TEG hole is formed in the mask sheet 15C by, for example, the TEG hole forming unit 76C irradiating the mask sheet 15C with a laser 76Ca.

And the vapor deposition mask 10C which passed through process Se * Sf is used in a vapor deposition process.

The TEG hole forming unit 76C may be provided separately from the apparatus for attaching the mask sheet 15C to the mask frame 11, or may be provided integrally with the apparatus for attaching the mask sheet 15C to the mask frame 11.

FIG. 20 is a diagram illustrating a configuration of a mask sheet attaching device 79C with a TEG hole forming function according to the fourth embodiment. A mask sheet attachment device 79C shown in FIG. 20 is an example of a device that performs the processes Sd and Sh. The mask sheet attaching device 79C has a configuration in which the film forming unit 76 of the mask sheet attaching device 79 shown in FIG. 17 is changed to a TEG hole forming unit 76C. In response to an instruction from the control unit 71, the TEG hole forming unit 76C irradiates a position where a TEG hole in the mask sheet 15C should be formed with a laser 76Ca or the like.

As shown in FIG. 19, according to the vapor deposition mask 10C, the howling sheet 113 has an opening having an overlapping area even if a plurality of TEG holes (first TEG hole 21 to sixth TEG hole 26) are formed in the mask sheet 15C. 113a is formed.

In step Sh, any one of the plurality of TEG holes (the first TEG hole 21 to the sixth TEG hole 26) is formed in the region overlapping the opening 113a in the mask sheet 15C attached to the mask frame 11. Form. Since the formed TEG hole does not overlap with the mask frame 11, the cover sheet 12, and the howling sheet 13, it becomes a through hole in the vapor deposition mask 10C. For example, in the example shown in FIG. 19, only the first TEG hole 21 among the first TEG hole 21 to the sixth TEG hole 26 is formed in the mask sheet 15C.

Thus, according to the vapor deposition mask 10C, a necessary position and a necessary number of TEG holes are formed in the mask sheet 15C after being attached to the mask frame 11. And the position of the TEG hole used as a through-hole in the vapor deposition mask 10C can be varied between multiple types of vapor deposition mask 10C by changing the formation position of the TEG hole formed in this mask sheet 15C.

For this reason, among the mask sheets 15C of the plurality of types of vapor deposition masks 10C, the mask sheets 15C having the same pattern of the vapor deposition holes H of the effective portion YA have the patterns of the vapor deposition holes H and TEG holes of the effective portion YA. It becomes the same and can make the kind of mask sheet 15C the same kind.

As described above, since the types of the mask sheets 15C of the vapor deposition masks 10 constituting the vapor deposition mask set can be made the same, the number of types of the mask sheets 15C necessary for the vapor deposition process of the display device can be reduced.

Thereby, the manufacturing cost of the evaporation mask 10C can be reduced, and as a result, the manufacturing cost of the display device manufactured using the evaporation mask 10C can be reduced.

[Other displays]
The display (display device) according to the first to fourth embodiments is not particularly limited as long as the display panel includes a display element. The display element is a display element whose luminance and transmittance are controlled by current. As a current-controlled display element, an organic EL (Electro Luminescence) having an OLED (Organic Light Emitting Diode) is used. ) A display, or an EL display QLED (Quantum dot Light Emitting Diode) such as an inorganic EL display provided with an inorganic light emitting diode, or the like.

[Summary]
The vapor deposition mask which concerns on aspect 1 of this invention is a vapor deposition mask for vapor-depositing a vapor deposition layer on a to-be-deposited board | substrate, Comprising: It is the area | region where it was attached to the mask frame and the said mask frame, and several vapor deposition holes were formed. A mask sheet in which a plurality of effective portions and a plurality of TEG holes provided in a region outside the effective portion are formed, and the mask sheet are different members, and some of the plurality of TEG holes And a shielding member disposed relative to the mask sheet so as to shield the remaining TEG holes without shielding the TEG holes.

According to the above configuration, a plurality of TEG holes are formed in the mask sheet. And the position of the TEG hole which is not shielded among a plurality of TEG holes can be changed by changing the position of the shielding member. Thereby, the mask sheet | seats with the same pattern of a vapor deposition hole can be made the same among the mask sheets of multiple types of vapor deposition mask required for vapor deposition of a to-be-deposited board | substrate. As a result, the number of types of mask sheets of a plurality of types of vapor deposition masks necessary for vapor deposition of the vapor deposition substrate can be reduced, and the manufacturing cost of the vapor deposition mask can be reduced.

When the vapor deposition mask which concerns on aspect 2 of this invention vapor-deposits the said vapor deposition layer on the said to-be-deposited board | substrate among both surfaces of the said mask sheet | seat, when the surface which becomes the side far from the said to-be-deposited substrate is made into a lower surface, the said shielding member May be a lower layer sheet that is attached to the mask frame so as to be the lower surface of the mask sheet and supports the mask sheet.

In the vapor deposition mask according to Aspect 3 of the present invention, the lower layer sheet includes a howling sheet that is the shielding member that is stretched so as to intersect the mask sheet and is attached to the mask frame. An opening having an area overlapping with the part of the TEG holes among the plurality of TEG holes is formed, and the howling sheet includes the part of the TEG holes and the opening of the plurality of TEG holes. May be attached to the mask frame so as to overlap and shield the remaining TEG hole and the howling sheet.

In the vapor deposition mask according to the fourth aspect of the present invention, the lower layer sheet includes a cover sheet that is the shielding member that extends along the extending direction of the mask sheet and is attached to the mask frame. Includes a stretching portion that extends along the stretching direction of the mask sheet, and a convex portion that projects from the stretching portion along the lower surface of the mask sheet, and the cover sheet includes the plurality of TEG holes. Among these, the part of the TEG holes and the convex part may not be overlapped, and the remaining TEG hole and the convex part may be attached to the mask frame so as to be overlapped and shielded.

In the vapor deposition mask according to aspect 5 of the present invention, the shielding member may be formed on the mask sheet so as not to shield the part of the TEG holes but to shield the remaining TEG holes.

When the vapor deposition mask which concerns on aspect 6 of this invention vapor-deposits the said vapor deposition layer on the said vapor deposition substrate among both surfaces of the said mask sheet, when the surface away from the said vapor deposition substrate is made into a lower surface, The howling sheet is attached to the mask frame by extending so as to intersect with the mask sheet so as to be the lower surface, and the howling sheet has an area overlapping with all of the plurality of TEG holes. An opening is formed, and the opening may overlap with all of the plurality of TEG holes.

In the vapor deposition mask according to aspect 7 of the present invention, the number of the plurality of TEG holes may be equal to or greater than the number of types of vapor deposition layers deposited for each pixel of the vapor deposition substrate.

The vapor deposition mask set according to aspect 8 of the present invention includes a plurality of the above-described vapor deposition masks, and is a vapor deposition mask set for vapor-depositing a plurality of types of vapor deposition layers on the deposition target substrate, A first vapor deposition layer and a second vapor deposition layer, wherein the first vapor deposition layer and the second vapor deposition layer are formed in pixels having the same emitted light in the vapor deposition substrate, and the second vapor deposition layer is The plurality of deposition masks stacked on the first deposition layer includes a first deposition mask for depositing the first deposition layer and a second deposition mask for depositing the second deposition layer, The first vapor deposition mask and the second vapor deposition mask have the same vapor deposition hole pattern included in each effective portion, and are through-holes among a plurality of TEG holes arranged in a region outside the effective portion. The positions of the TEG holes may be different.

The vapor deposition mask set according to the ninth aspect of the present invention is formed on the mask sheet of the plurality of TEG holes formed in the mask sheet of the first vapor deposition mask and the mask sheet of the second vapor deposition mask. The pattern of the plurality of TEG holes may be the same.

The manufacturing method of the vapor deposition mask which concerns on aspect 10 of this invention is a manufacturing method of the vapor deposition mask for vapor-depositing a vapor deposition layer on a to-be-deposited board | substrate, Comprising: The several effective part which is the area | region in which the several vapor deposition hole was formed, A mask sheet forming step of forming a mask sheet by forming a plurality of TEG holes provided in a region outside the effective portion, and a shielding member that is a member different from the mask sheet includes the plurality of TEG holes The TEG hole shielding step of relatively arranging the shielding member and the mask sheet so as to shield the remaining TEG holes without shielding some of the TEG holes.

In the method for manufacturing a vapor deposition mask according to aspect 11 of the present invention, the TEG hole shielding step includes a howling sheet attachment step of attaching a howling sheet in which an opening overlapping the part of the TEG holes is formed on the mask frame, A mask sheet attaching step for attaching the mask sheet to the mask frame to which the howling sheet is attached, so that the part of the TEG holes overlaps the opening and the remaining TEG holes overlap the howling sheet. May be included.

In the method for manufacturing a vapor deposition mask according to aspect 12 of the present invention, the TEG hole shielding step includes a cover sheet attaching step of attaching a cover sheet having an extending portion and a protruding portion protruding from the extending portion to the mask frame, A mask sheet attaching step of attaching the mask sheet to the mask frame to which the cover sheet is attached so that the part of the TEG holes do not overlap the cover sheet and the remaining TEG holes overlap the convex part. And may be included.

In the manufacturing method of the vapor deposition mask which concerns on aspect 13 of this invention, it has a mask sheet attachment process which attaches the said mask sheet to a mask frame, In the said TEG hole shielding process, the said mask sheet attached to the said mask frame in the said TEG hole shielding process The shielding member may be formed so as to shield the remaining TEG holes without shielding the part of the TEG holes.

A vapor deposition mask manufacturing method according to aspect 14 of the present invention is a vapor deposition mask manufacturing method for vapor-depositing a vapor deposition layer on a substrate to be vapor-deposited, and includes a plurality of effective portions that are regions in which a plurality of vapor deposition holes are formed. A mask sheet forming step of forming a mask sheet by forming, a mask sheet attaching step of attaching the mask sheet to the mask frame, and outside the effective portion of the mask sheet attached to the mask frame And a TEG hole forming step of forming one or a plurality of TEG holes in a region that does not overlap the member.

The manufacturing method of the vapor deposition mask which concerns on aspect 15 of this invention is manufactured by the manufacturing method of the said vapor deposition mask, The manufacturing method of the vapor deposition mask set containing a several vapor deposition mask in order to vapor-deposit a multiple types of vapor deposition layer on the said vapor deposition substrate. The plurality of types of vapor deposition layers include a first vapor deposition layer formed on a pixel having the same emitted light in the vapor deposition substrate, and a first vapor deposition layer formed on the pixel by being stacked on the first vapor deposition layer. The plurality of deposition masks includes a first deposition mask for depositing the first deposition layer and a second deposition mask for depositing the second deposition layer, and the first deposition mask. The first vapor deposition mask and the second vapor deposition mask are formed so that the patterns of the vapor deposition holes included in the respective effective portions are the same, and the through-holes among the plurality of TEG holes arranged in the region outside the effective portion. The position of the TEG hole It may be formed differently.

In the method for manufacturing a display device according to the sixteenth aspect of the present invention, the first vapor deposition layer is formed on the pixel using the vapor deposition mask set produced by the method for producing the vapor deposition mask set, and the first vapor deposition layer is formed on the first vapor deposition layer. You may have the process of laminating | stacking and forming the said 2nd vapor deposition layer in the said pixel.

In the display device manufacturing method according to Aspect 17 of the present invention, the first vapor deposition layer may be a hole transport layer, and the second vapor deposition layer may be a light emitting layer.

The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

1 Organic EL display device (display device)
10, 10A to 10C, 10R1, 10R2 Deposition mask 11 Mask frame 11a Frame opening 12 Cover sheet (lower layer sheet)
12A Cover sheet (shielding member, lower layer sheet)
12Aa Extension part 12Ab Protrusion part 13 Howling sheet (shielding member, lower layer sheet)
113 Howling sheet (lower sheet)
14 Alignment sheet 15, 15 C Mask sheet 20 TEG patterns 21 to 26 1st TEG hole to 6th TEG hole (TEG hole)
30 TFT substrate (deposition substrate)
36 Anode 39 Pixel bank 41 Hole injection layer 42 Hole transport layer (deposition layer, first deposition layer)
42B Blue hole transport layer (deposition layer, first deposition layer)
42G Green hole transport layer (deposition layer, first deposition layer)
42R Red hole transport layer (deposition layer, first deposition layer)
43 Light emitting layer (deposition layer, second deposition layer)
43B Blue light emitting layer (deposition layer, second deposition layer)
43G Green light emitting layer (deposition layer, second deposition layer)
43R Red light emitting layer (deposition layer, second deposition layer)
44 Hole blocking layer 45 Electron transport layer 46 Electron injection layer 47 Cathode 76 Deposition unit 76a Shielding member H Deposition hole pix Pixel YA Effective portion

Claims (17)

A deposition mask for depositing a deposition layer on a deposition substrate,
Mask frame,
A mask sheet that is attached to the mask frame and has a plurality of effective portions that are regions in which a plurality of vapor deposition holes are formed, and a plurality of TEG holes that are provided in regions outside the effective portions,
It is a member different from the mask sheet, and is disposed relative to the mask sheet so as not to shield some TEG holes and shield the remaining TEG holes among the plurality of TEG holes. A vapor deposition mask comprising a shielding member. Of the both sides of the mask sheet, when vapor-depositing the vapor-deposited layer on the vapor-deposited substrate, when the surface that is far from the vapor-deposited substrate is the lower surface,
The vapor deposition mask according to claim 1, wherein the shielding member is a lower layer sheet that is attached to the mask frame so as to be the lower surface of the mask sheet and supports the mask sheet. The lower layer sheet includes a howling sheet that is the shielding member that extends and intersects the mask sheet and is attached to the mask frame,
In the howling sheet, an opening having an area overlapping with the part of the TEG holes among the plurality of TEG holes is formed.
The howling sheet is attached to the mask frame such that, among the plurality of TEG holes, the part of the TEG holes and the opening overlap, and the remaining TEG holes and the howling sheet overlap. The vapor deposition mask according to claim 2, wherein: The lower layer sheet includes a cover sheet that is the shielding member that extends along the extending direction of the mask sheet and is attached to the mask frame,
The cover sheet includes an extending portion that extends along the extending direction of the mask sheet, and a convex portion that protrudes along the lower surface of the mask sheet from the extending portion,
The cover sheet is formed on the mask frame so that the TEG holes in the plurality of TEG holes and the convex portions do not overlap with each other, and the remaining TEG holes and the convex portions are overlapped and shielded. The vapor deposition mask according to claim 2, wherein the vapor deposition mask is attached. 2. The vapor deposition mask according to claim 1, wherein the shielding member is formed on the mask sheet so as not to shield the part of the TEG holes but to shield the remaining TEG holes. Of the both sides of the mask sheet, when vapor-depositing the vapor-deposited layer on the vapor-deposited substrate, when the surface away from the vapor-deposited substrate is the lower surface,
It has a howling sheet that is attached to the mask frame by extending so as to intersect the mask sheet so as to be the lower surface of the mask sheet,
In the howling sheet, an opening having an area overlapping with all of the plurality of TEG holes is formed,
The vapor deposition mask according to claim 1, wherein the opening portion overlaps all of the plurality of TEG holes. The vapor deposition mask according to any one of claims 1 to 6, wherein the number of the plurality of TEG holes is equal to or greater than the number of types of vapor deposition layers deposited for each pixel of the deposition target substrate. A plurality of vapor deposition masks according to any one of claims 1 to 7, wherein the vapor deposition mask set is for vapor-depositing a plurality of types of vapor deposition layers on the deposition substrate,
The plurality of types of vapor deposition layers include a first vapor deposition layer and a second vapor deposition layer,
The first vapor deposition layer and the second vapor deposition layer are formed on pixels having the same emitted light in the vapor deposition substrate, the second vapor deposition layer is stacked on the first vapor deposition layer,
The plurality of deposition masks includes a first deposition mask for depositing the first deposition layer and a second deposition mask for depositing the second deposition layer,
The first vapor deposition mask and the second vapor deposition mask have the same vapor deposition hole pattern included in each effective portion, and become through holes among a plurality of TEG holes arranged in a region outside the effective portion. A vapor deposition mask set characterized by different positions of TEG holes. The pattern of the plurality of TEG holes formed in the mask sheet of the first vapor deposition mask is the same as the pattern of the plurality of TEG holes formed in the mask sheet of the second vapor deposition mask. The vapor deposition mask set according to claim 8. A method of manufacturing a deposition mask for depositing a deposition layer on a deposition substrate,
A mask sheet forming step of forming a mask sheet by forming a plurality of effective portions that are regions in which a plurality of vapor deposition holes are formed, and a plurality of TEG holes provided in regions outside the effective portions;
The shielding member and the mask sheet are arranged such that a shielding member which is a member different from the mask sheet does not shield some of the TEG holes but shields the remaining TEG holes. A method for manufacturing a vapor deposition mask, comprising: a TEG hole shielding step that is relatively disposed. The TEG hole shielding step includes:
A howling sheet attaching step for attaching a howling sheet in which an opening overlapping the part of the TEG holes is formed on the mask frame;
A mask sheet attaching step for attaching the mask sheet to the mask frame to which the howling sheet is attached, so that the part of the TEG holes overlaps the opening and the remaining TEG holes overlap the howling sheet. The manufacturing method of the vapor deposition mask of Claim 10 characterized by the above-mentioned. The TEG hole shielding step includes:
A cover sheet attaching step for attaching a cover sheet having an extending portion and a protruding portion protruding from the extending portion to the mask frame;
A mask sheet attaching step of attaching the mask sheet to the mask frame to which the cover sheet is attached so that the part of the TEG holes do not overlap the cover sheet and the remaining TEG holes overlap the convex part. The manufacturing method of the vapor deposition mask of Claim 10 characterized by the above-mentioned. A mask sheet attaching step for attaching the mask sheet to the mask frame,
In the TEG hole shielding step, the shielding member is formed on the mask sheet attached to the mask frame so as not to shield the part of the TEG holes and to shield the remaining TEG holes. The manufacturing method of the vapor deposition mask of Claim 10. A method of manufacturing a deposition mask for depositing a deposition layer on a deposition substrate,
A mask sheet forming step of forming a mask sheet by forming a plurality of effective portions that are regions in which a plurality of vapor deposition holes are formed;
A mask sheet attaching step for attaching the mask sheet to the mask frame;
A vapor deposition mask comprising: a TEG hole forming step of forming one or a plurality of TEG holes in an area outside the effective portion of the mask sheet attached to the mask frame and not overlapping with other members. Manufacturing method. A method for producing a vapor deposition mask set, which is produced by the vapor deposition mask production method according to any one of claims 10 to 14, and includes a plurality of vapor deposition masks for vapor-depositing a plurality of types of vapor deposition layers on the deposition target substrate. And
The plurality of types of vapor deposition layers include: a first vapor deposition layer formed on a pixel having the same emitted light on the vapor deposition substrate; a second vapor deposition layer formed on the pixel by being stacked on the first vapor deposition layer; Including
The plurality of deposition masks includes a first deposition mask for depositing the first deposition layer and a second deposition mask for depositing the second deposition layer,
The first vapor deposition mask and the second vapor deposition mask are formed so that the pattern of vapor deposition holes included in each effective portion is the same, and the plurality of TEG holes arranged in a region outside the effective portion are penetrated. A method for manufacturing a vapor deposition mask set, wherein the positions of TEG holes serving as holes are different. The first vapor deposition layer is formed on the pixel using the vapor deposition mask set manufactured by the method for manufacturing the vapor deposition mask set according to claim 15, and the second vapor deposition layer is laminated on the first vapor deposition layer. A method for manufacturing a display device, comprising a step of forming the pixel. The method for manufacturing a display device according to claim 16, wherein the first vapor-deposited layer is a hole transport layer, and the second vapor-deposited layer is a light-emitting layer.

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