[go: up one dir, main page]

WO2019182330A1 - Carte de circuit imprimé souple pour boîtier puce sur film connectant un panneau d'affichage et une carte de circuit d'attaque, et procédé de liaison d'une puce d'attaque sur ladite carte de circuit imprimé - Google Patents

Carte de circuit imprimé souple pour boîtier puce sur film connectant un panneau d'affichage et une carte de circuit d'attaque, et procédé de liaison d'une puce d'attaque sur ladite carte de circuit imprimé Download PDF

Info

Publication number
WO2019182330A1
WO2019182330A1 PCT/KR2019/003195 KR2019003195W WO2019182330A1 WO 2019182330 A1 WO2019182330 A1 WO 2019182330A1 KR 2019003195 W KR2019003195 W KR 2019003195W WO 2019182330 A1 WO2019182330 A1 WO 2019182330A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
circuit board
bonding
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/003195
Other languages
English (en)
Korean (ko)
Inventor
조성호
손대우
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amogreentech Co Ltd
Original Assignee
Amogreentech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180033261A external-priority patent/KR102175747B1/ko
Priority claimed from KR1020180071747A external-priority patent/KR102174163B1/ko
Application filed by Amogreentech Co Ltd filed Critical Amogreentech Co Ltd
Publication of WO2019182330A1 publication Critical patent/WO2019182330A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Definitions

  • the present invention relates to a flexible printed circuit board for a chip-on-film package connecting a display panel and a driving circuit board, and a method of bonding the device thereto, and more particularly, to a structure that can be stably bonded to an external terminal of a driving chip.
  • the present invention relates to a method of stably bonding a device to a flexible printed circuit board and a flexible printed circuit board for a chip-on film package.
  • Chip on film (COF) packages are one of the packaging technologies for mounting semiconductor chips on flexible printed circuit boards (FPCBs). Chip-on-film packages are widely used to transmit driving signals to display devices.In particular, chip-on-film packaging technology replaces chip-on-glass (COG) packaging technology in response to a trend of increasing resolution of display devices. Is going out.
  • COG chip-on-glass
  • the pitch of the printed circuit pattern of the flexible printed circuit board for chip-on-film is also miniaturized to cope with the high resolution of the display device.
  • the base film of the flexible printed circuit board may be deformed by the heat involved in the bonding process, which causes alignment between the terminals between the chip-on film and the driving chips. The problem is not easy.
  • An object of the present invention is to provide a flexible printed circuit board for a chip-on-film package connecting the display panel and the driving circuit board having a structure that can be stably bonded to the driving chip.
  • Another object of the present invention is to provide a method of more stably bonding a device to a flexible printed circuit board for a chip-on-film package connecting the display panel and the driving circuit board.
  • the flexible printed circuit board for achieving the above object of the present invention includes a base film, a first metal layer, And a second metal layer and a third metal layer.
  • the first metal layer is formed over the base film, and the second metal layer is formed over the first metal layer.
  • the third metal layer has a bonding surface formed on the second metal layer and bonded to the external terminal of the driving chip.
  • the third metal layer may include any one of gold (Au) and palladium (Pd), and the bonding surface of the third metal layer may directly contact the external terminal of the driving chip in the first bonding region to bond the external terminal of the driving chip. do.
  • Another flexible printed circuit board for achieving the above object of the present invention is a base film, a first metal layer formed on the base film and the first metal layer formed on the contact with the first metal layer and bonding with the external terminal of the driving chip And a second metal layer having a bonding surface to be formed.
  • the first metal layer includes copper (Cu), and the second metal layer includes gold (Au).
  • the bonding surface is in direct contact with the external terminal and bonded to the external terminal.
  • a method of bonding a device to a flexible printed circuit board for a chip-on-film package electrically connecting a display panel to a drive circuit board, the method of bonding the device to a flexible printed circuit board for achieving the above-described other object of the present invention As follows.
  • the bonding surface defined on the metal layers of the flexible printed circuit board and the external terminals of the device are aligned, and the bonding surface is bonded to the external terminals by providing ultrasonic waves to the bonding surfaces of the metal layers and the external terminals of the device.
  • the bonding surfaces of the metal layers are formed of a constituent material including any one of gold (Au) and palladium (Pd), and the bonding surfaces of the metal layers are directly contacted with external terminals of the device and bonded to the external terminals.
  • the driving chip may be directly bonded to the flexible printed circuit board for the chip-on-package using ultrasonic waves without a separate component such as an anisotropic conductive film. Therefore, the cost and time required for the bonding process can be reduced.
  • the driving chip is directly bonded to the flexible printed circuit board for the chip-on-package using ultrasonic waves, it is possible to lower the process temperature compared to the bonding process using the anisotropic conductive film. Therefore, the deformation of the base film of the flexible printed circuit board due to the high temperature is minimized, so that misalignment between the bonding surface of the flexible printed circuit board and the external terminal of the driving chip can be prevented.
  • the constituent material of the base film may be selected regardless of the coefficient of thermal expansion of the base film of the flexible printed circuit board. Therefore, the selection of the constituent materials of the base film can be made more extensive, and thus the manufacturing cost of the flexible printed circuit board can be reduced.
  • the thickness of the metal pattern layer of the flexible printed circuit film may be reduced.
  • the width of the metal pattern layer may also decrease as the thickness of the metal pattern layer decreases, so that the pitch of the circuit pattern printed on the flexible printed circuit board is reduced. It may be easier.
  • the bonding unit is bonded to the flexible printed circuit board.
  • the process of exposing both sides is not necessary.
  • FIG. 1 is a plan view of a flexible printed circuit board for a chip on package according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating a plane taken along line II ′ of FIG. 1.
  • FIG. 3 is a perspective view of a display panel assembly including the flexible printed circuit board illustrated in FIG. 1.
  • FIG. 4 is a side view of the display panel assembly shown in FIG. 3.
  • FIG. 5 is a diagram illustrating a state in which external terminals are bonded to the flexible printed circuit board of FIG. 2.
  • 6 and 7 illustrate a method of bonding a device to a flexible printed circuit board.
  • FIG. 8 is a cross-sectional view illustrating a flexible printed circuit board and external terminals bonded thereto according to another exemplary embodiment of the present invention.
  • FIG. 9 is a cross-sectional view illustrating an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another exemplary embodiment of the present invention.
  • FIG. 10 is a cross-sectional view illustrating an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • FIG. 12 is a cross-sectional view illustrating an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • FIG. 13 is a cross-sectional view illustrating external terminals of a flexible printed circuit board for a chip-on-film package and a display panel assembly bonded thereto according to another embodiment of the present invention.
  • FIG. 14 is a cross-sectional view illustrating an external terminal of a flexible printed circuit board for a chip-on-film package and a bonding panel display panel assembly according to another embodiment of the present invention.
  • the flexible printed circuit board 100 for a chip on film (COF) package implements a display panel assembly (500 of FIG. 3) for displaying an image on a display device. It can be applied to More specifically, the flexible printed circuit board 100 may electrically connect the display panel 200 (in FIG. 3) and the driving circuit board 300 in FIG. 3 to generate signals for controlling the driving of the display panel.
  • the driving chip (DC of FIG. 3) outputting data signals to the sea panel may be bonded to the flexible printed circuit board 100.
  • the flexible printed circuit board 100 defines a first bonding area BA1, a second bonding area BA2, and a third bonding area BA3.
  • the second bonding area BA2 may be defined at one end of the flexible printed circuit board 100
  • the third bonding area BA3 may be defined at the other end of the flexible printed circuit board 100, and may be defined as the first bonding area BA3.
  • the bonding area BA1 may be defined between the second bonding area BA2 and the third bonding area BA3.
  • the driving chip (DC in FIG. 3) is bonded to the flexible printed circuit board 100 in the first bonding area BA1, and the flexible printed circuit board 100 is driven in the second bonding area BA2.
  • the flexible printed circuit board 100 is bonded to the display panel 200 of FIG. 3 in the third bonding area BA3.
  • the flexible printed circuit board 100 may include a base film 10, a first metal layer M1, a second metal layer M2, a third metal layer M3, and an insulating film 80.
  • the constituent material of the base film 10 may include an insulating material.
  • the constituent material of the base film 10 may include a polymer material such as polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).
  • PI polyimide
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the thickness of the base film 10 may be several tens of micrometers to several hundred micrometers.
  • the thickness of the base film 10 may be 25 micrometers to 35 micrometers.
  • the first metal layer M1 is disposed on the base film 10, and the first metal layer M1 is disposed on the base film 10 along a circuit pattern printed on the flexible printed circuit board 100.
  • the constituent material of the first metal layer M1 may include copper.
  • the material of the first metal layer M1 may include a copper single metal, or the material of the first metal layer M1 may include a copper-based alloy, such as an alloy including copper and nickel.
  • the thickness of the first metal layer M1 may be about 3 micrometers to 6 micrometers.
  • the present invention is not limited to the thickness of the first metal layer M1, but is driven using ultrasonic waves in the first bonding surface BD1 of the first metal layer M1, which will be described later with reference to FIGS. 6 and 7.
  • the thickness of the first metal layer M1 may be reduced from about 7 micrometers to about 9 micrometers to about 3 micrometers to 6 micrometers. This will be described later in more detail with reference to FIGS. 6 and 7.
  • the second metal layer M2 is disposed on the first metal layer M1 and interposed between the first metal layer M1 and the third metal layer M3.
  • the third metal layer M3 may be formed using an electroless plating process, in which case the second metal layer M2 is a seed layer in the electroless plating process. Can play a role.
  • the material of the first metal layer M1 includes copper and the material of the third metal layer M3 contains gold (Au).
  • the material of the second metal layer M2 may include nickel (Ni).
  • the present invention is not limited to the type of constituent material of the second metal layer M2.
  • the material of the second metal layer M2 may include metals such as copper, tin, lead, silver, and chromium.
  • the second metal layer M2 is formed using an electroless plating process, and the thickness of the second metal layer M2 may be smaller than the thickness of the first metal layer M1, more specifically, the second metal layer.
  • the thickness of M2 may be from about 0.1 micrometers to about 2.0 micrometers.
  • the present invention is not limited to the method and thickness of the second metal layer M2.
  • the second metal layer M2 may be formed using a sputtering process to a thickness of several tens of angstroms to several hundred angstroms.
  • the third metal layer M3 is disposed on the second metal layer M2.
  • the constituent material of the third metal layer M3 may include gold (Au). More specifically, the material of the third metal layer M3 includes a single metal made of gold, or the material of the third metal layer M3 includes silver (Ag), copper (Cu), and nickel (Ni). And gold-based alloys to which other metals such as palladium (Pd) and zinc (Zn) are added.
  • the third metal layer M3 may be formed by an electroless plating process.
  • the second metal layer M2 may serve as a seed layer, and thus the third metal layer M3 may be formed on the second metal layer M2.
  • the third metal layer M3 may include palladium (Pd).
  • the third metal layer M3 may be formed by an electroless plating process using the second metal layer M2 as a seed layer, and the third metal layer M3 may be formed on the second metal layer M2. .
  • the cost required to form the third metal layer M3 is reduced than when the third metal layer M3 is formed of gold (Au). Effect can be generated.
  • the thickness of the third metal layer M3 may be smaller than the thickness of the first metal layer M1, and more specifically, the thickness of the third metal layer M3 may be about 0.1 micrometers to about 0.4 micrometers. Can be.
  • the present invention is not limited to the thickness of the third metal layer M3.
  • the thickness of the third metal layer M3 may be several tens of angstroms to several hundred angstroms.
  • a first bonding surface BD1, a second bonding surface BD2, and a third bonding surface BD3 are defined in the third metal layer M3, and the first bonding surface BD1, the second bonding surface BD2, and the like.
  • Each of the third bonding surfaces BD3 is positioned at the top of the third metal layer M3 and exposed to the outside. More specifically, the first bonding surface BD1 of the third metal layer M3 is defined in the first bonding region BA1, and the second bonding surface of the third metal layer M3 is defined in the second bonding region BA2.
  • BD2 is defined, and a third bonding surface BD3 of the third metal layer M3 is defined in the third bonding region BA3.
  • Each of the first bonding surface BD1, the second bonding surface BD2, and the third bonding surface BD3 is in direct contact with an external terminal of another device and bonded to the external terminal.
  • the first bonding surface BD1, the second bonding surface BD2, and the third bonding surface BD3 may be bonded to the external terminals of the components constituting the display panel assembly 500 of FIG. 3. . This will be described in more detail with reference to FIGS. 3, 4 and 5.
  • the first metal layer M1 faces the bonding surface of the third metal layer M3 in each of the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3.
  • the bottom surface is covered by the base film 10.
  • the first bonding surface BD1 of the third metal layer M3 is exposed to the outside in the first bonding region BA1, but the bottom of the first metal layer M1 facing the first bonding surface BD1 is exposed.
  • the surface BS is covered by the base film 10. Since the structure in which the bottom surface BS of the first metal layer M1 is covered by the base film 10 is related to the bonding method of the flexible printed circuit board 100, this will be described in more detail with reference to FIGS. 5 and 6. It will be described later.
  • each of the second metal layer M2 and the third metal layer M3 is selectively formed in the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3.
  • the second metal layer M2 is formed after the second metal layer M2 is selectively formed in the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3, the second metal layer M2 is formed.
  • the third metal layer M3 may be formed on the second metal layer M2. Therefore, the third metal layer M3 may be formed to be selectively plated in the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3.
  • the flexible printed circuit board 100 when the third metal layer M3 is selectively formed in the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3, the flexible printed circuit board 100 is provided. Since the content of gold (Au) contained in the entirety may be reduced, the manufacturing cost of the flexible printed circuit board 100 may be reduced.
  • the insulating film 80 is formed in the first wiring area WA1 and the second wiring area WA2 to cover the first metal layer M1. That is, the insulating film 80 is formed in the first wiring area WA1 and the second wiring area WA2, and the insulating film 80 is formed of the first bonding area BA1, the second bonding area BA2, and the third bonding area.
  • the first bonding surface BD1, the second bonding surface BD2, and the third bonding surface BD3 may be exposed to the outside due to a partially open shape corresponding to the area BA3.
  • the constituent material of the insulating film 80 may include a polymer material, and the insulating film 80 may be formed to a thickness of several micrometers to several hundred micrometers.
  • each of the flexible printed circuit boards 100 shown in FIG. 3 has the same structure as the flexible printed circuit board 100 described above with reference to FIGS. 1 and 2. Therefore, in the description of FIGS. 3, 4, and 5, duplicate descriptions of the flexible printed circuit boards 100 are omitted.
  • the display panel assembly 500 is a unit for displaying an image on a display device.
  • the display panel assembly 500 includes a display panel 200 and a driving circuit board. 300), driving chips (DC) and flexible printed circuit boards 100.
  • the display panel 200 displays an image through the display surface DS.
  • the display panel 200 may be an organic light emitting display panel.
  • the display panel 200 may be a liquid crystal display panel.
  • the display panel 200 includes a first substrate 110 and an opposing substrate 190 facing the first substrate 110.
  • the first substrate 110 may include a plurality of pixels, and the plurality of pixels may include organic light emitting diodes.
  • the display panel 200 displays an image using light generated from the plurality of organic light emitting diodes.
  • the driving circuit board 300 is electrically connected to the display panel 200 through the flexible printed circuit board 100.
  • the driving circuit board 300 generates signals for controlling driving of the display panel 200.
  • the timing controller TC mounted on the driving circuit board 300 generates gate driving control signals, image data, and data control signals.
  • the driving chips DC are mounted on the flexible printed circuit boards 100.
  • the driving chips DC are bonded to the flexible printed circuit boards 100 in a chip on film package manner in a one-to-one correspondence with the flexible printed circuit boards 100.
  • Each of DC) may be a driver IC that outputs data signals to the display panel 100.
  • the driving circuit board 300 may be disposed behind the display panel 200 to overlap the display panel 200. Accordingly, each of the flexible printed circuit boards 100 may electrically connect the display panel 200 to the driving circuit board 300, and each of the flexible printed circuit boards 100 may be formed of the display panel 200.
  • the second terminal part TP2 may be bent in the rotation direction RD toward the rear surface of the display panel 200. More specifically, each of the flexible printed circuit boards 100 in the bending area BDA is connected to the display panel 200 from one side of the display panel 200 from the second terminal portion TP2 of the display panel 200. It may have a shape bent toward the back of the).
  • the flexible printed circuit board 100 when the flexible printed circuit board 100 is electrically connected to the display panel 200 and the driving circuit board 300 to implement the display panel assembly 500, the flexible printed circuit board 100 may be formed.
  • the bonding surfaces are bonded to the external terminals of the display panel and the driving circuit board as follows.
  • the flexible printed circuit board 100 is bonded with the driving chip DC in the first bonding area BA1, and the flexible printed circuit board 100 is bonded with the driving circuit board 300 in the second bonding area BA2.
  • the flexible printed circuit board 100 is bonded to the display panel 200 in the third bonding area BA3.
  • the third metal layer M3 of the flexible printed circuit board 100 has a first bonding surface BD1, a second bonding surface BD2, and a third bonding surface BD3, and the first bonding surface BD1 is formed of a first bonding surface BD1. It is defined in the first bonding area BA1, the second bonding surface BD2 is defined in the second bonding area BA2, and the third bonding surface BD3 is defined in the third bonding area BA3.
  • the first external terminal TP1 of the driving chip DC is bonded to the first bonding surface BD1 of the third metal layer M3.
  • the first external terminal TP1 may be directly in contact with the first bonding surface BD1 and bonded to the first bonding surface BD1.
  • the first external terminal TP1 may be a bump of the driving chip DC, and the constituent material of the first external terminal TP1 may include gold (Au) or a gold-based alloy. .
  • the constituent material of the first external terminal TP1, which is the bump of the driving chip DC may be lead or lead alloy containing other elements such as tin.
  • the constituent material of the third metal layer M3 includes gold (Au) or a gold-based alloy
  • the constituent material of the third metal layer M3 is a constituent material of the first external terminal TP1. May be the same as Therefore, since the bonding between the third metal layer M3 and the first external terminal TP1 is performed between the same metals, the portion where the third metal layer M3 and the first external terminal TP1 are bonded is the third metal layer M3. A portion of and the portion of the first external terminal TP1 may be melted together to have an integrated shape.
  • the second external terminal TP2 of the display panel 200 is bonded to the second bonding surface BD2 of the third metal layer M3.
  • the second external terminal TP2 may be in direct contact with the second bonding surface BD2 and bonded to the second bonding surface BD2.
  • the second external terminal TP2 is electrically connected to wires formed on the first substrate 110 of the display panel 200, and the constituent material of the second external terminal TP2 is metal or transparent. It may include a conductive material.
  • the third external terminal TP3 of the driving circuit board 300 is bonded to the third bonding surface BD3 of the third metal layer M3.
  • the third external terminal TP3 may be directly in contact with the third bonding surface BD3 and bonded to the third bonding surface BD3.
  • the flexible printed circuit board 100 is prepared on a stage (not shown). In the flexible printed circuit board 100, the first bonding surface BD1 defined on the third metal layer M3 is exposed to the outside in the first bonding region BA1.
  • plasma cleaning may be performed on the first bonding surface BD1 before the flexible printed circuit board 100 is disposed on the stage.
  • the plasma cleaning is a process of removing a plating liquid or adhesive foreign matter from the first bonding surface BD1.
  • the plasma cleaning may improve the bonding characteristics of the first bonding surface BD1, and thus, the time required for the bonding process and The effect of reducing the bonding temperature may occur.
  • the driving chip DC is disposed on the flexible printed circuit board 100, and the first external terminal TP1 of the driving chip DC is connected to the first bonding surface of the flexible printed circuit board 100 ( BD1).
  • the alignment marks formed on the first bonding area BA1 and the alignment marks formed on the driving chip DC are aligned with each other so that the first external terminal TP1 is easily formed on the first bonding surface BD1. Can be sorted.
  • the ultrasonic bonding device 400 is driven and the first external terminal TP1 is brought into contact with the first bonding surface BD1 using the crimping head 410. Thereafter, the ultrasound wave 430 is provided to the first bonding surface BD1.
  • the power provided to the ultrasonic bonding equipment 400 side is converted into high frequency electric energy
  • the converted high frequency electric energy is converted into mechanical vibration energy by a vibrator
  • the converted mechanical vibration energy is amplified by a booster.
  • the ultrasound 430 is emitted through the ultrasound output unit 420.
  • the ultrasonic wave 430 is provided to the first bonding surface BD1 in a direction from the top of the driving chip DC toward the first bonding surface BD1, and as a result, to the first bonding surface BD1.
  • the frictional heat generated by the vibration may cause the first external terminal TP1 to be bonded to the first bonding surface BD1.
  • the bottom surface BT of the first metal layer M1 facing the first bonding surface BD1 may be bonded. There is no need to be exposed to the outside to receive the energy needed for the process. Accordingly, as described above, the bottom surface BT of the first metal layer M1 may be covered by the base film 10, in other words, the bottom surface BT of the first metal layer M1 may be covered by the base film 10. There is no need for a separate process to expose).
  • the first external terminal TP1 since the first external terminal TP1 is in direct contact with the first bonding surface BD1 and bonded to the first bonding surface BD1, the first external terminal TP1 is connected to the first bonding surface ( Electrical connection to BD1) No separate anisotropic conductive film is required. Therefore, in this embodiment, the time and cost required for the bonding process performed between the first external terminal TP1 and the first bonding surface BD1 can be reduced.
  • the bonding process using the anisotropic conductive film is accompanied by a high temperature and a high pressure for pressing the anisotropic conductive film, a high temperature of about 350 °C to about 500 °C °C around the portion to be bonded Can be generated. Therefore, deformation of the base film of the flexible printed circuit board may occur due to the high temperature, thereby causing misalignment between the bonding surface of the flexible printed circuit board and the external terminal of the driving chip.
  • the ultrasonic wave 430 is intensively provided on the first bonding surface BD1, bonding is performed between the first external terminal TP1 and the first bonding surface BD1.
  • the ambient process temperature can be lowered from about 200 ° C to about 300 ° C. Therefore, according to this embodiment, excessive heat is generated around the first external terminal TP1 and the first bonding surface BD1 so that the deformation of the base film 10 can be minimized. Misalignment between the terminal TP1 and the first bonding surface BD1 may be minimized.
  • the coefficient of thermal expansion of the base film 10 of the flexible printed circuit board 100 is greater than that of polyimide. It may be formed of other inexpensive polymeric materials. Therefore, the selection of the constituent materials of the base film 10 can be made more extensive, and thus, the manufacturing cost of the flexible printed circuit board 100 can be reduced.
  • the first metal layer M1 is about 7 micrometers to about 9 micrometers in order to make the first metal layer M1 durable for high temperature and high pressure processes.
  • the thickness of the meter is required.
  • the width of the first metal layer M1 may also decrease as the thickness of the first metal layer M1 is reduced. Can be reduced. Therefore, the pitch of the circuit pattern printed on the flexible printed circuit board 100 may be more finer.
  • FIG. 6 and 7 illustrate a process of bonding the driving chip DC to the flexible printed circuit board 100 using the ultrasonic bonding process, the second bonding surface (see FIG. 5).
  • BD2 may be bonded to the second terminal TP2 of the display panel 200 of FIG. 5, and a third bonding surface BD3 of FIG. 5 may be formed using the ultrasonic bonding process.
  • 5 may be bonded with the third terminal TP3 of FIG. 5.
  • FIG. 8 there is shown a cross section of a flexible printed circuit board and external terminals bonded thereto according to another embodiment of the present invention.
  • the same reference numerals denote the same elements, and redundant descriptions of the same elements will be omitted.
  • the flexible printed circuit board includes a base film 10, a first metal layer M1, a second metal layer M2-1, a third metal layer M3-1, and an insulating film 80.
  • the second metal layer (M2 of FIG. 2) and the third metal layer (M3 of FIG. 2) may include a first bonding region (BA1 of FIG. 1) and a second bonding region (of FIG. 1). BA2) and the third bonding region (BA3 in FIG. 1) have a selective partial plating, but in the embodiment shown in FIG. 8, the second metal layer M2-1 and the third metal layer M3-1 In addition to the first bonding area BA1, the second bonding area BA2, and the third bonding area BA3, the first wiring area WA1 and the second wiring area WA2 are formed.
  • the second metal layer M2-1 and the third metal layer M3-1 have a shape in which the entire metal is plated in the region where the first metal layer M1 is formed. Therefore, in FIG. 2, a process of patterning the second metal layer (M2 of FIG. 2) is required, but in the embodiment shown in FIG. 8, the second metal layer M2-1 may be patterned simultaneously with the first metal layer M1. Therefore, the manufacturing process of the flexible printed circuit board can be simplified. In addition, the mechanical strength of the first metal layer M1 is improved by the second metal layer M2-1 and the third metal layer M3-1 in the first wiring area WA1 and the second wiring area WA2. May be generated.
  • FIG. 9 is a cross-sectional view of a flexible printed circuit board and an external terminal of a driving chip bonded thereto according to another embodiment of the present invention.
  • components described above are denoted by reference numerals, and redundant descriptions of the components are omitted.
  • the flexible printed circuit board shown in FIG. 9 Comparing the structure of the flexible printed circuit board shown in FIG. 2 with the structure of the flexible printed circuit board shown in FIG. 9, the flexible printed circuit board shown in FIG. 9 further includes a first reinforcement layer 90 as a component. .
  • the second metal layer M2 and the third metal layer M3 are selectively formed in other bonding regions including the first bonding region BA1, and the first reinforcement layer 90 is a flexible printed circuit board. It is selectively formed in the bending area BDA of.
  • the flexible printed circuit board electrically connects the driving circuit board (300 in FIG. 4) to the display panel (200 in FIG. 4).
  • the first reinforcement layer 90 is formed on the base film 10 corresponding to the bending area BDA.
  • the first reinforcement layer 90 may be in contact with one surface of the first metal layer M1. Therefore, when the flexible printed circuit board is bent in the bending area BDA, the stress applied to the first metal layer M1 is distributed to the first reinforcing layer 90, so that cracks may be formed in the first metal layer M1 due to the stress. Generation can be prevented.
  • the first reinforcement layer 90 has a multilayer structure including the first sub reinforcement layer FL1 and the second sub reinforcement layer FL2, and the first sub reinforcement layer FL1 and the second sub reinforcement layer ( FL2 is sequentially laminated between the base film 10 and the first metal layer M1.
  • each of the first sub reinforcement layer FL1 and the second sub reinforcement layer FL2 may be formed on the base film 10 with a thickness of several tens of angstroms to several thousand angstroms by a sputtering method.
  • the material of the first sub reinforcement layer FL1 may include chromium
  • the material of the second sub reinforcement layer FL2 may include nickel.
  • the present invention is not limited to the constituent materials of the first sub reinforcement layer FL1 and the second sub reinforcement layer FL2.
  • the constituents of each of the first sub reinforcement layer FL1 and the second sub reinforcement layer FL2 may include other metals such as titanium, tin, and aluminum.
  • FIG. 10 there is shown a cross section of an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • components described above are denoted by reference numerals, and redundant descriptions of the components are omitted.
  • the flexible printed circuit board shown in FIG. 10 is formed of a component selectively formed in the bending area BDA as a component. 2 further includes a reinforcing layer (95). That is, in the embodiment illustrated in FIG. 9, the first reinforcement layer 90 is disposed on one surface of the first metal layer M1 in the bending area BDA. In the embodiment shown in FIG. 10, the second reinforcement layer 90 is further disposed on the other surface of the first metal layer M1 as well as the first reinforcement layer 90 in the bending area BDA.
  • the second reinforcement layer 95 has a multilayer structure including the third sub reinforcement layer FL3 and the fourth sub reinforcement layer FL4, and the third sub reinforcement layer FL3 and the fourth sub reinforcement layer ( FL4) is sequentially stacked on the first metal layer M1.
  • each of the third sub reinforcement layer FL3 and the fourth sub reinforcement layer FL2 may be formed on the first metal layer M1 in a thickness of several tens of angstroms to several thousand angstroms by a sputtering method.
  • the material of the third sub reinforcement layer FL3 may include nickel
  • the material of the fourth sub reinforcement layer FL4 may include chromium.
  • the present invention is not limited to the constituent materials of the third sub reinforcement layer FL3 and the fourth sub reinforcement layer FL4.
  • the constituents of each of the third sub reinforcement layer FL3 and the fourth sub reinforcement layer FL4 may include other metals such as titanium, tin, and aluminum.
  • FIG. 11 there is shown a cross section of an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • components described above are denoted by reference numerals, and redundant descriptions of the components are omitted.
  • the flexible printed circuit board includes a base film 10, a first metal layer M1, a second metal layer M2-2, a third metal layer M3, and an insulating film 80.
  • the second metal layer M2 of FIG. 2 has a shape selectively plated in the first bonding region BA1 of FIG. 1, but in the embodiment shown in FIG.
  • the metal layer M2-2 is formed in the bending region BDA as well as the first bonding region BA1. Accordingly, the second metal layer M2-2 is interposed between the first metal layer M1 and the base film 10 instead of the first reinforcement layer shown in FIG. 9 (90 in FIG. 9), and thus the first metal layer M1. It may be in contact with one side of the.
  • the stress applied to the first metal layer M1 is directed to the second metal layer M2-2. Dispersion may prevent cracking in the first metal layer M1 due to the stress.
  • the second metal layer M2-2 is collectively formed in the bending area BDA and the first bonding area BA1 to serve as a seed layer in the first bonding area BA1 and the bending area BDA. ) Can be easily formed to act as a reinforcing layer.
  • FIG. 12 there is shown a cross section of an external terminal of a flexible printed circuit board and a driving chip bonded thereto according to another embodiment of the present invention.
  • components described above are denoted by reference numerals, and redundant descriptions of the components are omitted.
  • the flexible printed circuit board includes a base film 10, a first metal layer M1, a second metal layer M2-2, a third metal layer M3-2, and an insulating film 80.
  • the second metal layer (M2 of FIG. 2) and the third metal layer (M3 of FIG. 2) have a shape selectively plated on the first bonding region (BA1 of FIG. 1),
  • each of the second metal layer M2-2 and the third metal layer M3-3 is formed in the bending region BDA as well as the first bonding region BA1.
  • the second metal layer M2-2 and the third metal layer M3-2 are disposed between the first metal layer M1 and the base film 10 instead of the first reinforcement layer shown in FIG. 9 (90 in FIG. 9).
  • the third metal layer M3-2 may be in contact with one surface of the first metal layer M1.
  • the second metal layer M2-2 and the third metal layer M3-2 are collectively formed in the bending area BDA and the first bonding area BA1 to bond characteristics in the first bonding area BA1.
  • a layer that serves as a reinforcing layer in the layer to be improved and the bending area BDA can be easily formed.
  • a flexible printed circuit board 101 for a chip-on-film package according to this embodiment includes a display panel assembly including a display panel such as a liquid crystal display panel and an organic light emitting display panel. 3, 500) can be applied.
  • the flexible printed circuit board 101 includes a first metal layer M1, a second metal layer M2, a third metal layer M33, and a fourth metal layer M44. That is, the flexible printed circuit board 100 (in FIG. 2) of the embodiment illustrated in FIG. 2 is implemented as a structure of metal layers stacked in three layers in each of the first to third bonding regions BA1, BA2, and BA3. The flexible printed circuit board 101 of the embodiment illustrated in FIG. 13 is implemented with a structure of metal layers stacked in four layers in each of the first to third bonding regions BA1, BA2, and BA3.
  • the first metal layer M1 is disposed on the base film 10, and the constituent material of the first metal layer M1 may include a copper single metal or a copper-based alloy including copper and nickel.
  • the second metal layer M2 is disposed on the first metal layer M1, and in this embodiment, the constituent material of the second metal layer M2 may include nickel (Ni). As described above with reference to FIG. 2, the second metal layer M2 may serve as a seed layer of the electroless plating process.
  • the third metal layer M33 is formed on the second metal layer M2.
  • the constituent material of the third metal layer M33 may include palladium (Pd).
  • the constituent material of the third metal layer M33 includes a palladium alloy to which palladium is added, such as silver (Ag), copper (Cu), gold (Au), platinum (Pt), and ruthenium (Ru). can do.
  • the fourth metal layer M44 is formed on the third metal layer M33.
  • the constituent material of the fourth metal layer M44 includes a single metal made of gold (Au), or the constituent material of the fourth metal layer M44 includes gold, silver, copper, nickel, and zinc. Added gold-based alloys.
  • the structure in which the second metal layer M2 including nickel, the third metal layer M33 including palladium and the fourth metal layer M44 including gold are sequentially stacked has an ENEPIG method (electroless). It can be implemented by performing nickel electroless palladium immersion gold. As the third metal layer M33 is interposed between the second metal layer M2 and the fourth metal layer M44, the thickness of the fourth metal layer M44 may be reduced several times to several tens of times. Therefore, the manufacturing cost of the flexible printed circuit board 101 may be reduced.
  • the fourth metal layer M44 includes the first bonding surface BD1
  • the fourth metal layer M44 includes the second bonding surface BD2.
  • the fourth metal layer M44 includes a third bonding surface BD3.
  • the first bonding surface BD1, the second bonding surface BD2, and the third bonding surface BD3 of the flexible printed circuit board 101 constitute parts of the display panel assembly 500 of FIG. 3. Can be bonded in direct contact with the external terminals of the device.
  • the first external terminal TP1 of the driving chip DC may be directly in contact with the first bonding surface BD1 of the fourth metal layer M44 and bonded to the first bonding surface BD1.
  • the first external terminal TP1 may be a bump of the driving chip DC, and the constituent material of the first external terminal TP1 may include gold (Au) or a gold-based alloy.
  • the material of the first external terminal TP1 may include lead or a lead alloy containing tin in the lead.
  • the second external terminal TP2 of the display panel 200 may be directly in contact with the second bonding surface BD2 of the fourth metal layer M44 and bonded to the second bonding surface BD2.
  • the second external terminal TP2 is electrically connected to the wirings formed on the substrate of the display panel 200.
  • the third external terminal TP3 of the driving circuit board 300 may be in direct contact with the third bonding surface BD3 of the fourth metal layer M4 and bonded to the third bonding surface BD3.
  • the first external terminal TP1, the second external terminal TP2, and the third external terminal TP3 are formed by performing the ultrasonic bonding process described above with reference to FIGS. 6 and 7.
  • One-to-one correspondence may be performed on the BD1, the second bonding surface BD2, and the third bonding surface BD3.
  • the second metal layer M2, the third metal layer M33, and the fourth metal layer M44 are formed in the first bonding region BA1, the second bonding region BA2, and the third bonding region BA3. It may have a partially plated shape.
  • the second metal layer M2, the third metal layer M33, and the fourth metal layer M44 may have a plated shape on the entire region where the first metal layer M1 is formed. That is, the second metal layer M2, the third metal layer M33, and the fourth metal layer M44 may have a plated shape on the first wiring area WA1 and the second wiring area WA2.
  • the flexible printed circuit board 102 (hereinafter, referred to as a flexible printed circuit board) for the chip-on-film package according to this embodiment may be applied to the display panel assembly 500 of FIG. 3.
  • the flexible printed circuit board 102 is disposed on the base film 10, the first metal layer M1 formed on the base film 10, and the first metal layer M1 to contact the first metal layer M1.
  • the second metal layer M22 is formed.
  • the constituent material of the first metal layer M1 may include a copper-based alloy such as a copper single metal or an alloy including copper and nickel.
  • the constituent material of the second metal layer M22 may include gold (Au), or may include a gold-based alloy to which other metals such as silver, copper, nickel, and zinc are added.
  • the flexible printed circuit board 100 of FIG. 2 of the embodiment illustrated in FIG. 2 has a structure of metal layers stacked in three layers in each of the first to third bonding regions BA1, BA2, and BA3. Is implemented.
  • the flexible printed circuit board 101 of the embodiment illustrated in FIG. 14 is implemented as a structure of metal layers stacked in two layers in each of the first to third bonding regions BA1, BA2, and BA3.
  • the flexible printed circuit board 102 shown in FIG. 14 omits a metal layer containing nickel as a component thereof.
  • the second metal layer M22 may be formed on the first metal layer M1 by performing an electroless plating method.
  • the second metal layer M22 in the first bonding region BA1, includes the first bonding surface BD1, and in the second bonding region BA2, the second metal layer M22 is the second bonding surface. (BD2), and in the third bonding region BA3, the second metal layer M22 includes a third bonding surface BD3.
  • the first external terminal TP1 of the driving chip DC constituting the display panel assembly 500 of FIG. 3 is in direct contact with the first bonding surface BD1 to be connected to the first bonding surface BD1. Can be bonded.
  • the second external terminal TP2 of the display panel 200 of FIG. 3 may directly contact the second bonding surface BD2 to be in contact with the second bonding surface BD2.
  • the third external terminal TP3 of the driving circuit board 300 may directly contact the third bonding surface BD3 to be in contact with the third bonding surface BD3.
  • the first external terminal TP1, the second external terminal TP2, and the third external terminal TP3 are formed by performing the ultrasonic bonding process described above with reference to FIGS. 6 and 7.
  • One-to-one correspondence may be performed on the BD1, the second bonding surface BD2, and the third bonding surface BD3.
  • the second metal layer M22 has a shape partially plated in the first to third bonding regions BA1, BA2, and BA3, but in another embodiment, the second metal layer M22 may have a first wiring.
  • the region WA1 and the second wiring region WA2 may be further plated and plated on the entire first metal layer M1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé souple pour un boîtier puce sur film connectant électriquement un panneau d'affichage à une carte de circuit imprimé d'attaque, comprenant un film de base, une première couche métallique, une deuxième couche métallique et une troisième couche métallique. La première couche métallique est formée sur le film de base, et la deuxième couche métallique est formée sur la première couche métallique. La troisième couche métallique est formée sur la deuxième couche métallique et présente une surface de liaison qui est liée à une borne externe de la puce d'attaque. La troisième couche métallique comprend de l'or (Au) ou du palladium (Pd), et la surface de liaison de la troisième couche métallique sur une première zone de liaison vient en contact direct avec la borne externe de la puce d'attaque et est liée à la borne externe de la puce d'attaque.
PCT/KR2019/003195 2018-03-22 2019-03-19 Carte de circuit imprimé souple pour boîtier puce sur film connectant un panneau d'affichage et une carte de circuit d'attaque, et procédé de liaison d'une puce d'attaque sur ladite carte de circuit imprimé Ceased WO2019182330A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2018-0033261 2018-03-22
KR1020180033261A KR102175747B1 (ko) 2018-03-22 2018-03-22 표시패널과 구동회로기판을 연결하는 칩온필름 패키지용 연성 인쇄회로기판 및 이에 구동칩을 본딩하는 방법
KR1020180071747A KR102174163B1 (ko) 2018-06-22 2018-06-22 표시패널과 구동회로기판을 연결하는 칩온필름 패키지용 연성 인쇄회로기판 및 이에 구동칩을 본딩하는 방법
KR10-2018-0071747 2018-06-22

Publications (1)

Publication Number Publication Date
WO2019182330A1 true WO2019182330A1 (fr) 2019-09-26

Family

ID=67987917

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2019/003195 Ceased WO2019182330A1 (fr) 2018-03-22 2019-03-19 Carte de circuit imprimé souple pour boîtier puce sur film connectant un panneau d'affichage et une carte de circuit d'attaque, et procédé de liaison d'une puce d'attaque sur ladite carte de circuit imprimé

Country Status (1)

Country Link
WO (1) WO2019182330A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114286503A (zh) * 2021-12-28 2022-04-05 武汉天马微电子有限公司 柔性电路板及其制备方法、显示模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060125450A (ko) * 2005-06-02 2006-12-06 삼성전자주식회사 구동회로필름 및 이를 갖는 액정표시장치
KR20090070719A (ko) * 2007-12-27 2009-07-01 엘지전자 주식회사 연성 필름 및 그를 포함하는 표시장치
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
KR20120063202A (ko) * 2010-12-07 2012-06-15 삼성전자주식회사 반도체 패키지 및 이를 포함하는 디스플레이 패널 어셈블리
US20160049356A1 (en) * 2014-08-13 2016-02-18 Samsung Electronics Co., Ltd. Chip-on-film package having bending part

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060125450A (ko) * 2005-06-02 2006-12-06 삼성전자주식회사 구동회로필름 및 이를 갖는 액정표시장치
KR20090070719A (ko) * 2007-12-27 2009-07-01 엘지전자 주식회사 연성 필름 및 그를 포함하는 표시장치
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
KR20120063202A (ko) * 2010-12-07 2012-06-15 삼성전자주식회사 반도체 패키지 및 이를 포함하는 디스플레이 패널 어셈블리
US20160049356A1 (en) * 2014-08-13 2016-02-18 Samsung Electronics Co., Ltd. Chip-on-film package having bending part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114286503A (zh) * 2021-12-28 2022-04-05 武汉天马微电子有限公司 柔性电路板及其制备方法、显示模组
CN114286503B (zh) * 2021-12-28 2024-02-09 武汉天马微电子有限公司 柔性电路板及其制备方法、显示模组

Similar Documents

Publication Publication Date Title
KR100321883B1 (ko) 반도체소자의실장구조및실장방법과,액정표시장치
US7948768B2 (en) Tape circuit substrate with reduced size of base film
US10903127B2 (en) Film for a package substrate
WO2021230502A1 (fr) Module d'affichage et procédé de fabrication associé
JPH09292624A (ja) テープキャリアパッケージ及び液晶表示装置
US6738123B1 (en) Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure
WO2020101277A1 (fr) Module d'affichage, appareil d'affichage le comprenant et procédé de fabrication de module d'affichage
CN112309268A (zh) 一种显示装置及显示装置制备方法
WO2022173119A1 (fr) Module d'affichage et son procédé de fabrication
WO2022114395A1 (fr) Module d'affichage, et son procédé de fabrication
WO2019182330A1 (fr) Carte de circuit imprimé souple pour boîtier puce sur film connectant un panneau d'affichage et une carte de circuit d'attaque, et procédé de liaison d'une puce d'attaque sur ladite carte de circuit imprimé
WO2021221454A1 (fr) Module d'affichage comportant une structure de jonction entre une micro-del et une couche de tft
US7791701B2 (en) Circuit film comprising a film substrate connected to the control board, wire board, and display panel
JP2019079032A (ja) パッケージ基板用フィルム、半導体パッケージ、ディスプレイ装置及びそれらの製造方法
KR20200000016A (ko) 표시패널과 구동회로기판을 연결하는 칩온필름 패키지용 연성 인쇄회로기판 및 이에 구동칩을 본딩하는 방법
JP2001264794A (ja) 液晶表示装置の製造方法
KR20200080617A (ko) 표시 장치 및 이의 제조 방법
JP3284916B2 (ja) 半導体装置およびその製造方法
KR100327921B1 (ko) 플렉시블회로기판및이를통합한액정표시장치
JP2009098625A (ja) 電気光学装置及びその製造方法並びに電子機器
KR102175747B1 (ko) 표시패널과 구동회로기판을 연결하는 칩온필름 패키지용 연성 인쇄회로기판 및 이에 구동칩을 본딩하는 방법
JP3601455B2 (ja) 液晶表示装置
JP3987288B2 (ja) 半導体素子の実装構造及び液晶表示装置
JP3608514B2 (ja) 半導体素子の実装構造及び電子装置
US20230326930A1 (en) Chip-on-film semiconductor package and display apparatus including the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19772023

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19772023

Country of ref document: EP

Kind code of ref document: A1