[go: up one dir, main page]

WO2019172003A1 - Method for producing thermoplastic-resin-containing particles, resin composition for three-dimensional forming, and method for producing three-dimensional shape from said resin composition - Google Patents

Method for producing thermoplastic-resin-containing particles, resin composition for three-dimensional forming, and method for producing three-dimensional shape from said resin composition Download PDF

Info

Publication number
WO2019172003A1
WO2019172003A1 PCT/JP2019/007110 JP2019007110W WO2019172003A1 WO 2019172003 A1 WO2019172003 A1 WO 2019172003A1 JP 2019007110 W JP2019007110 W JP 2019007110W WO 2019172003 A1 WO2019172003 A1 WO 2019172003A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoplastic resin
resin
containing particles
water
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/007110
Other languages
French (fr)
Japanese (ja)
Inventor
なつめ 吉良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP2020504933A priority Critical patent/JP7136186B2/en
Publication of WO2019172003A1 publication Critical patent/WO2019172003A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/10Pre-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/165Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/307Handling of material to be used in additive manufacturing
    • B29C64/314Preparation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • B33Y70/10Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating

Definitions

  • the present invention relates to a method for producing thermoplastic resin-containing particles, a resin composition for three-dimensional modeling, and a method for manufacturing a three-dimensional model using the same.
  • a thin layer made of resin particles containing a thermoplastic resin is formed, and resin particles in a desired region are sintered or melt bonded (hereinafter simply referred to as “melt bonding”). And a method of obtaining a three-dimensional model.
  • the three-dimensional modeled manufacturing method using resin particles can produce a three-dimensional modeled object with relatively high modeling accuracy compared to other methods.
  • One of the methods for manufacturing such a three-dimensional model is a powder bed fusion bonding method.
  • resin particles are laid flat to form a thin layer, and the thin layer is irradiated with laser light in a pattern (a pattern obtained by finely dividing a three-dimensional structure in the thickness direction).
  • the resin particles in the region irradiated with the laser beam are selectively melt-bonded.
  • resin particles are further spread on the obtained shaped article layer, and laser light irradiation is repeated in the same manner to obtain a three-dimensional shaped article having a desired shape.
  • MJF method Multi Jet Fusion method
  • Patent Document 1 a Multi Jet Fusion method
  • resin particles are laid flat to form a thin layer.
  • an energy absorbent or the like is applied to a region where the resin particles are melt-bonded (hereinafter also referred to as “cured region”), and energy is irradiated.
  • resin particles are further spread on the obtained shaped article layer, and the same process is repeated to obtain a three-dimensional shaped article having a desired shape.
  • resin particles have been prepared by dissolving a thermoplastic resin in a solvent heated to a high temperature and then precipitating it with stirring.
  • a resin having a high mechanical strength and a high elastic modulus generally has a high melting temperature. Therefore, when preparing the resin particles by the method, the solvent and the resin must be heated to a high temperature, and there is a problem that the production efficiency is low.
  • thermoplastic resin a thermoplastic resin is dispersed in a water-soluble resin by kneading, and then the water-soluble resin is removed to obtain desired thermoplastic resin-containing particles.
  • water-soluble resin polyethylene glycol, polyethylene oxide and the like have been proposed.
  • the present invention has been made in view of the above problems. That is, the present invention relates to a method for efficiently producing thermoplastic resin-containing particles by a simple method, a resin composition for three-dimensional modeling including the thermoplastic resin-containing particles obtained thereby, and a three-dimensional molded article using the same.
  • the purpose is to provide a method.
  • the present invention provides the following method for producing thermoplastic resin-containing particles.
  • the method for producing thermoplastic resin-containing particles according to [4], wherein the polypropylene has an elastic modulus at 27 ° C. of 1500 MPa to 2500 MPa.
  • grains as described in any one of.
  • thermoplastic resin according to any one of [1] to [6], further including a washing step of washing the thermoplastic resin-containing particles with water or a second solvent containing an organic solvent after the separation step. Production method of contained particles.
  • the washing step is a step of washing the thermoplastic resin-containing particles until the content of the water-soluble resin with respect to the mass of the thermoplastic resin-containing particles is 5% by mass or less.
  • the washing step is a step of washing the thermoplastic resin-containing particles with an organic solvent. After the washing step, the organic solvent and the water-soluble resin are separated, and the organic solvent is recovered.
  • the dissolving step is a step of dissolving the water-soluble resin in an organic solvent, and after the dissolving step, the organic solvent and the water-soluble resin are separated, and the first solvent recovery for recovering the organic solvent
  • the first solvent and / or the second solvent is selected from the group consisting of acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, acetone, and ethyl acetate.
  • thermoplastic resin-containing particle comprising a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, wherein the amount of the water-soluble resin is 0.001% by mass to 5% by mass.
  • the resin composition for three-dimensional modeling according to [15], wherein the polypropylene has an elastic modulus at 27 ° C. of 1500 MPa to 2500 MPa.
  • the present invention provides the following manufacturing method of a three-dimensional model.
  • the manufacturing method of a three-dimensional molded item which forms a three-dimensional molded item by doing.
  • a thin layer forming step for forming a thin layer containing the resin composition for three-dimensional modeling according to any one of [12] to [16] above, and a binding fluid containing an energy absorbing agent Applying a fluid to the specific area and irradiating the thin layer after the fluid application process with energy to form a shaped article layer in which the thermoplastic resin-containing particles are melted in the area where the binding fluid is applied.
  • Manufacturing a three-dimensional structure including an energy irradiation step, forming the three-dimensional structure by repeating the thin layer forming step, the fluid application step, and the energy irradiation step a plurality of times and laminating the three-dimensional object layer.
  • thermoplastic resin-containing particles can be efficiently produced by a simple method. Moreover, the resin composition for three-dimensional modeling containing the thermoplastic resin containing particle obtained by the said method, and the manufacturing method of a three-dimensional molded item using the same are provided.
  • thermoplastic resin-containing particles of the present invention includes a mixing step of obtaining a mixture of a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, and kneading of the mixture.
  • grains may include the washing
  • recovery process which collect
  • thermoplastic resin having a high viscosity or a thermoplastic resin having a high elastic modulus is considered to be dispersed in a water-soluble resin such as polyethylene glycol by kneading for a long time or heating to a high temperature. It is done.
  • a thermoplastic resin is kneaded with polyethylene glycol or the like, the viscosity of polyethylene glycol or the like is excessively lowered during kneading, and it is difficult to mix with the thermoplastic resin, or polyethylene glycol or the like decomposes. It became clear that.
  • thermoplastic resin When kneading is continued in such a state, it is difficult for the thermoplastic resin to become uniform particles, and even if they become particles, they tend to bond again.
  • a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower is less likely to have an excessively low viscosity at the time of kneading, and is not easily decomposed by heat. Therefore, it has been found that the thermoplastic resin is easily dispersed uniformly and desired thermoplastic resin-containing particles can be obtained.
  • thermoplastic resin-containing particles of the present invention will be described in detail.
  • thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower are mixed to obtain a mixture.
  • the mixing method of the thermoplastic resin and the water-soluble resin is not particularly limited, and can be performed with a known mixing / stirring apparatus.
  • the mixing of the thermoplastic resin and the water-soluble resin may be performed at room temperature or while heating.
  • the mixing ratio (mass ratio) of the thermoplastic resin and the water-soluble resin is preferably 1: 9 to 5: 5, more preferably 4: 6 to 5: 5, and more preferably 4: 5 to 5. More preferably, it is 5: 5. If the amount of the thermoplastic resin is excessively large, it becomes difficult to sufficiently disperse the thermoplastic resin in the water-soluble resin in the kneading step described later. However, if the mixing ratio is 5: 5 or less, the thermoplastic resin is water-soluble. It becomes easy to disperse in the functional resin. On the other hand, from the viewpoint of productivity of the thermoplastic resin-containing particles, the mixing ratio is preferably 1: 9 or more.
  • the thermoplastic resin is not particularly limited, but is a relatively high elasticity thermoplastic resin from the viewpoint of sufficiently obtaining the effects of the present invention, and further from the viewpoint of increasing the elastic modulus of the resulting three-dimensional structure. Is preferred.
  • the elastic modulus at 27 ° C. of the thermoplastic resin is preferably 1400 MPa or more, and more preferably 1700 MPa or more.
  • the elastic modulus at 27 ° C. of the thermoplastic resin is preferably 2500 MPa or less, and more preferably 2300 MPa or less.
  • the elastic modulus of the thermoplastic resin is measured by a tensile tester according to ISO 527-1: 2017.
  • thermoplastic resin examples include polyamide 12, polypropylene, polylactic acid, polyethylene, polyethylene terephthalate, polystyrene, acrylonitrile / butadiene / styrene copolymer thia, ethylene / vinyl acetate copolymer, styrene / acrylonitrile copolymer, and poly Caprolactone and the like are included.
  • polyamide 12 and polypropylene are preferable, and polypropylene is particularly preferable from the viewpoints of high elastic modulus and high mechanical strength.
  • a thermoplastic resin may use only 1 type and may use it in combination of 2 or more type.
  • the elastic modulus at 27 ° C. of the polypropylene is preferably 1500 MPa or more and 2500 MPa or less, more preferably 2000 MPa or more and 2500 MPa or less, and 2300 MPa or more and 2500 MPa or less. Further preferred. When the elastic modulus of polypropylene is within this range, a highly versatile three-dimensional modeled object can be easily obtained.
  • the shape of the thermoplastic resin mixed in this step is not particularly limited, and may be, for example, a lump shape, a particle shape, or a pellet shape.
  • the water-soluble resin to be mixed in this step is not particularly limited as long as it has a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, is water-soluble, and has low compatibility with the above-described thermoplastic resin.
  • the “heat-resistant temperature” of the water-soluble resin means the upper limit of the decomposition temperature of the water-soluble resin, and is measured by raising the temperature until a change in storage elastic modulus occurs with a rheometer. Value.
  • “having water solubility” means a case where 10 g or more is dissolved in 100 g of water.
  • the viscosity of the thermoplastic resin at 150 ° C. is 1, the viscosity of the water-soluble resin at 150 ° C. is preferably 0.8 to 1.2, more preferably 0.9 to 1. .
  • the viscosity is a value measured when the temperature is raised to 100 ° C. to 200 ° C. with a rheometer.
  • the ethylene oxide / propylene oxide copolymer preferably has a weight average molecular weight of 50,000 to 150,000, more preferably 50,000 to 120,000, and even more preferably 50,000 to 100,000.
  • the weight average molecular weight is a molecular weight (in terms of styrene) measured by gel permeation chromatography (GPC). If the weight average molecular weight of the ethylene oxide / propylene oxide copolymer is excessively large, it may be difficult to dissolve in water or an organic solvent, but if it is 150,000 or less, it can be sufficiently dissolved therein.
  • the viscosity of the ethylene oxide / propylene oxide and the viscosity of the thermoplastic resin at the time of kneading tend to be close.
  • the ethylene oxide / propylene oxide copolymer may be any copolymer of an ethylene oxide monomer and a propylene oxide monomer, but the polymerization ratio of the ethylene oxide monomer to the propylene oxide monomer is 12: 1 to 10: 1. Preferably, it is 8: 1 to 7: 1, more preferably 6: 1 to 5: 1. If the structure derived from the ethylene oxide monomer is contained in a certain amount or more, the solubility of the ethylene oxide / propylene oxide copolymer in water or an organic solvent is improved in the dissolution step described later.
  • the shape of the water-soluble resin at the time of mixing in this step is not particularly limited, and may be, for example, a lump shape, a particle shape, or a pellet shape.
  • Kneading step The mixture prepared in the above-described mixing step is heated and kneaded at a temperature equal to or higher than the softening point of the mixture.
  • the softening point of the mixture was raised from 0 ° C. to 200 ° C. under a differential scanning calorimeter (DSC) at 10 ° C./min, annealed for 10 minutes, lowered from 200 ° C. to 0 ° C., and further 0 ° C. To 200 ° C.
  • DSC differential scanning calorimeter
  • the temperature at the time of kneading may be equal to or higher than the softening point of the above-mentioned mixture, but is preferably 10 to 200 ° C. higher than the softening point, more preferably 20 to 150 ° C. higher.
  • the temperature at the time of kneading is 10 ° C. or more higher than the softening point, the thermoplastic resin is easily dispersed uniformly in the water-soluble resin.
  • the temperature during kneading to a temperature that is 200 ° C. or less higher than the softening point, it becomes difficult for the water-soluble resin or thermoplastic resin to decompose during kneading.
  • the kneading time is not particularly limited as long as the thermoplastic resin can be dispersed in the water-soluble resin until a desired average particle size is obtained. Usually, it can be 10 to 40 minutes, more preferably 10 to 30 minutes, and further preferably 15 to 20 minutes. When the kneading time is excessively long, the production efficiency is lowered, or the water-soluble resin is easily decomposed. On the other hand, if the kneading time is excessively short, it is difficult to sufficiently disperse the thermoplastic resin.
  • the thermoplastic resin dispersed in the water-soluble resin is preferably kneaded so that the average particle size is about 20 to 100 ⁇ m, more preferably about 30 to 70 ⁇ m. preferable.
  • the average particle diameter of particles containing a thermoplastic resin also referred to as “thermoplastic resin-containing particles” in the present application
  • thermoplastic resin-containing particles it is preferable that it is 20 micrometers or more from a viewpoint of providing sufficient fluidity
  • the particle size distribution of the particle diameter of each thermoplastic resin containing particle is narrow.
  • the polydispersity (Mw / Mn) of the thermoplastic resin-containing particles is preferably 2.0 or less, more preferably 1.8 or less, and even more preferably 1.5 or less.
  • the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the thermoplastic resin-containing particles can be measured by GPC. When the polydispersity (Mw / Mn) is low, the particle size distribution of the particle size is likely to be low.
  • the average particle size can be specified by extracting a part of the kneaded material, dissolving the water-soluble resin in the first solvent described later, and then measuring the average particle size of the remaining particulate component. Specifically, the volume average particle diameter is measured by a dynamic light scattering method. The volume average particle diameter can be measured by a laser diffraction particle size distribution measuring apparatus (manufactured by Microtrack Bell Co., Ltd., MT3300EXII) equipped with a wet disperser.
  • the kneaded product may be slowly cooled or rapidly cooled.
  • the method for cooling the kneaded product is not particularly limited.
  • the kneaded product may be cooled by leaving it at room temperature, or may be cooled using a known cooling device or the like. Slowly cooling the kneaded product is preferable because the particles grow slowly, and a method of leaving the mixture at room temperature is particularly preferable.
  • Dissolution Step After the cooling step, the kneaded product is mixed with a first solvent containing water or an organic solvent, and the water-soluble resin is dissolved in the first solvent.
  • the first solvent may be any solvent that can dissolve the water-soluble resin and does not dissolve the thermoplastic resin, such as water, acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, acetone, ethyl acetate, or the like. It can be an organic solvent. One kind of these may be contained in the first solvent, or two or more kinds thereof may be contained. Among these, acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, and acetone are preferable from the viewpoint that the water-soluble resin is easily dissolved.
  • a method of dissolving the water-soluble resin in the first solvent a method of immersing the kneaded material in the first solvent can be used. At this time, the kneaded product may be crushed with a crusher or the like and then immersed in the first solvent so that the water-soluble resin is easily dissolved. Furthermore, after the kneaded product is immersed, the first solvent may be stirred as necessary.
  • the time for bringing the first solvent into contact with the kneaded product is appropriately selected according to the solubility of the water-soluble resin and the like, but can be usually 1 to 5 hours, and more preferably 3 to 7 hours. preferable.
  • the water-soluble resin is dissolved so that the amount of the water-soluble resin in the thermoplastic resin-containing particles is 0.001% to 5% by mass or less with respect to the mass of the thermoplastic resin-containing particles. It is preferable to make it.
  • the amount of the water-soluble resin is 0.001% to 5% by mass or less, the strength or the like of the three-dimensional model is likely to be sufficiently high when the three-dimensional model is manufactured using the thermoplastic resin-containing particles.
  • the amount of the water-soluble resin in the thermoplastic resin-containing particles can be specified by comparing the peak derived from the thermoplastic resin and the peak derived from the water-soluble resin by NMR measurement.
  • thermoplastic resin-containing particles Separation step After the dissolution step, the solid content contained in the solution is separated to obtain thermoplastic resin-containing particles.
  • the solid content separation method is not particularly limited, and can be, for example, centrifugal separation, filtration, or a combination thereof. If necessary, the thermoplastic resin-containing particles may be dried by a known drying method.
  • washing step After the separation step described above, a washing step for washing the obtained thermoplastic resin-containing particles may be performed as necessary.
  • the washing step can be a step of washing the thermoplastic resin-containing particles with a second solvent containing, for example, water or an organic solvent.
  • the water-soluble resin in the thermoplastic resin-containing particles can be further removed, and the amount of the thermoplastic resin in the thermoplastic resin-containing particles can be increased. As a result, it is possible to increase the strength of the three-dimensional structure produced using the thermoplastic resin-containing particles.
  • the washing step can be a step of immersing the thermoplastic resin-containing particles separated in the separation step in a second solvent.
  • the second solvent the same solvents as those described above can be used. Note that the first solvent and the second solvent may be the same or different.
  • the temperature of the second solvent at the time of performing the washing step may be a temperature not higher than the boiling point of the second solvent, and may be appropriately heated as necessary.
  • the second solvent when ethyl acetate or ethanol is used as the second solvent, it is preferable to heat the second solvent to 50 ° C. or higher from the viewpoint of enhancing the solubility of the water-soluble resin in the second solvent.
  • the second solvent and the thermoplastic resin-containing particles may be mixed at room temperature.
  • the thermoplastic resin-containing particles are preferably washed so that the amount of the water-soluble resin in the thermoplastic resin-containing particles is 5% by mass or less with respect to the mass of the thermoplastic resin-containing particles.
  • the amount of the water-soluble resin is 5% by mass or less, the strength and the like of the three-dimensional model are likely to be sufficiently high when the three-dimensional model is manufactured using the thermoplastic resin-containing particles.
  • the amount of the water-soluble resin in the thermoplastic resin-containing particles can be specified by the same method as described above.
  • Solvent recovery step (first solvent recovery step and second solvent recovery step)
  • a solvent recovery step for recovering the first solvent and / or the second solvent may be performed as necessary.
  • the water-soluble resin is removed from the first solvent and the second solvent in which the water-soluble resin is dissolved, and each solvent is reused.
  • the method for recovering the solvent is not particularly limited.
  • the solvent and the water-soluble resin can be separated by distillation or the like, and the solvent can be collected.
  • thermoplastic resin-containing particles produced by the above-described method can be applied to a three-dimensional modeling resin composition.
  • molding containing a thermoplastic resin containing particle is demonstrated.
  • molding of this invention is used for the method of melt-bonding thermoplastic resin containing particle
  • the three-dimensional modeling resin composition can be a composition containing thermoplastic resin-containing particles and various additives, a flow agent, and the like as necessary.
  • the thermoplastic resin-containing particles include a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or more and 200 ° C. or less, and the amount of the water-soluble resin with respect to the total amount of the thermoplastic resin-containing particles is 0.001% by mass or more. 5% by mass or less. If the thermoplastic resin-containing particles contain 0.001% by mass or more of a water-soluble resin, the water-soluble resin in the thermoplastic resin-containing particles is softened during molding, thereby improving the interfacial fusion property and breaking elongation. Has the effect of improving. Furthermore, there is an effect that crystallization of the surface of the molded article is suppressed by the water-soluble resin.
  • the amount of the water-soluble resin is 5% by mass or less, the heat resistance and mechanical strength of the three-dimensional model to be manufactured are improved.
  • the amount of the water-soluble resin is more preferably 0.001 to 3% by mass, and further preferably 0.001 to 1% by mass. Since the thermoplastic resin-containing particles are produced by the above-described method for producing thermoplastic resin-containing particles, detailed description thereof is omitted here.
  • the filler included in the three-dimensional modeling resin composition as needed is not particularly limited as long as the object and effect of the present invention are not impaired.
  • the filler is contained in the three-dimensional modeling resin composition, the energy irradiated at the time of three-dimensional modeling is easily transmitted, or the strength of the three-dimensional modeling obtained is increased.
  • fillers examples include talc, calcium carbonate, zinc carbonate, wollastonite, silica, alumina, magnesium oxide, calcium silicate, sodium aluminate, calcium aluminate, sodium aluminosilicate, magnesium silicate, glass balloon, glass cut fiber , Glass milled fiber, glass flake, glass powder, silicon carbide, silicon nitride, gypsum, gypsum whisker, calcined kaolin, carbon black, zinc oxide, antimony trioxide, zeolite, hydrotalcite, metal fiber, metal whisker, metal powder, Inorganic fillers such as ceramic whiskers, potassium titanate, boron nitride, graphite, layered clay minerals, carbon fibers; organic fillers such as polysaccharide nanofibers; various polymers, and the like. In the three-dimensional modeling resin composition, only one kind of filler may be contained, or two or more kinds may be contained.
  • the average particle diameter of the filler is preferably about 0.01 to 50 ⁇ m from the viewpoint of not inhibiting the bonding between the thermoplastic resin-containing particles during the production of the three-dimensional structure.
  • the average particle diameter of the filler is the volume average particle diameter, and is determined by measuring with a laser diffraction particle size distribution measuring device after removing the thermoplastic resin-containing particles from the three-dimensional resin composition with a solvent or the like. it can.
  • the filler is a spherical particle having a diameter of 1 to 1000 nm from the viewpoint of good conductivity of the energy irradiated during preparation of the three-dimensional structure, and easy improvement of the mechanical strength and ductility of the three-dimensional structure. Further, it is preferably a tabular particle having a thickness of 1 to 1000 nm or a fiber particle having a fiber diameter of 1 to 1000 nm.
  • the spherical particles may be either particles made of an inorganic material or particles made of an organic material, and examples thereof include silica fine particles, alumina fine particles, titanium oxide fine particles, zirconia fine particles and the like.
  • the thickness of the tabular grain is more preferably 50 to 500 nm, further preferably 100 to 400 nm, and particularly preferably 150 to 300 nm.
  • tabular grains have two main planes facing each other, and the distance (thickness) between these two main planes is sufficiently small with respect to the maximum diameter and minimum diameter of the main plane.
  • the shape of the main plane of the tabular grains may be circular, elliptical, or polygonal.
  • the width of the main plane of the tabular grains is preferably 1 to 10 ⁇ m, and more preferably 2 to 8 ⁇ m.
  • the ratio of the maximum diameter of the main plane to the thickness of the tabular grains is preferably 5 to 15, and more preferably 10 to 12.
  • tabular grains include the above-mentioned layered clay minerals (for example, kaolin; talc; mica; smectite minerals such as montmorillonite, beidellite, hectorite, saponite, nontronite, stevensite; vermiculite; bentonite; kanemite, Kenya. Layered sodium silicate such as knight and macanite; mica group clay minerals such as Na type tetrasilicic fluorine mica, Li type tetrasilicic fluorine mica, Na type fluorine teniolite, Li type fluorine teniolite). Such tabular grains may be obtained from natural minerals or may be chemically synthesized. Further, the tabular grains may be those whose surfaces are modified (surface treatment) with an ammonium salt or the like.
  • layered clay minerals for example, kaolin; talc; mica; smectite minerals such as montmorillonite, beidellite, hectorite, saponite, non
  • the fiber diameter is preferably 3 to 30 nm, more preferably 5 to 20 nm from the viewpoint of dispersibility and the like.
  • the fiber length of the fibrous filler is preferably 200 to 10,000 nm, and more preferably 250 to 10,000 nm.
  • strength of the three-dimensional molded item obtained as the fiber length is 200 nm or more becomes easy to increase.
  • examples of the fibrous filler include carbon fiber, polysaccharide nanofiber, and the like.
  • the amount of the filler in the resin composition for three-dimensional modeling is preferably 5 to 30 parts by mass, more preferably 10 to 25 parts by mass, when the content of the thermoplastic resin-containing particles is 100 parts by mass.
  • the amount is preferably 15 to 20 parts by mass.
  • the amount of the filler is 5 parts by mass or more, the mechanical strength of the three-dimensional structure obtained from the three-dimensional resin composition is likely to increase.
  • the amount of the filler is 30 parts by mass or more, the ductility of the three-dimensional structure to be obtained tends to decrease.
  • examples of various additives included in the three-dimensional modeling resin composition as necessary include antioxidants, acidic compounds and derivatives thereof, lubricants, ultraviolet absorbers, light stabilizers, nucleating agents, flame retardants, and impacts.
  • An improving agent, a foaming agent, a coloring agent, an organic peroxide, a spreading agent, an adhesive, and the like are included. Only one of these may be contained in the three-dimensional modeling resin composition, or two or more of them may be contained. Moreover, these may be apply
  • the flow agent may be a material having a small friction coefficient and self-lubricating property.
  • examples of such flow agents include silicon dioxide and boron nitride.
  • the resin composition for three-dimensional modeling may contain only one type of flow agent or two types of flow agents.
  • the amount of the flow agent can be appropriately set within a range in which the fluidity of the thermoplastic resin-containing particles and the like is improved and the melt bonding of the thermoplastic resin-containing particles is sufficiently generated. For example, it can be more than 0% by mass and less than 2% by mass with respect to the mass of the thermoplastic resin-containing particles.
  • the three-dimensional modeling resin composition used in the powder bed melt bonding method described later may contain a laser absorber or the like.
  • the laser absorber include carbon powder, nylon resin powder, pigment, dye, and the like.
  • the three-dimensional modeling resin composition may contain only one type of laser absorber, or may contain two or more types.
  • the resin composition for three-dimensional modeled object can be used in a method for manufacturing a three-dimensional modeled object by the powder bed bonding melting method or the MJF method.
  • the three-dimensional modeling method using the said resin composition is each demonstrated, this invention is not restrict
  • Method for manufacturing a three-dimensional structure by a powder bed bonding melting method In a method for manufacturing a three-dimensional structure by a powder bed bonding melting method, the method is the same as a normal powder bed bonding melting method except that the resin composition for three-dimensional modeling is used. Can do. Specifically, (1) a thin layer forming step of forming a thin layer containing the resin composition for three-dimensional modeling described above, and (2) a thermoplastic resin containing by selectively irradiating the thin layer with laser light And a laser beam irradiation step of forming a shaped article layer in which particles are melt-bonded.
  • a three-dimensional molded item can be manufactured by repeating a process (1) and a process (2) in multiple times, and laminating
  • the manufacturing method of the said three-dimensional molded item may include the other process as needed, for example, may include the process etc. which preheat the resin composition for three-dimensional modeling.
  • a thin layer containing the three-dimensional modeling resin composition is formed.
  • the resin composition for three-dimensional modeling supplied from the powder supply unit of the three-dimensional modeling apparatus is laid flat on the modeling stage by a recoater.
  • the thin layer may be formed directly on the modeling stage, or may be formed on the resin composition for three-dimensional modeling that has already been spread, or on the modeling object layer that has already been formed.
  • you may mix a flow agent and a laser absorber with the said resin composition for three-dimensional modeling separately as needed, and may form a thin layer.
  • the thickness of the thin layer is the same as the thickness of the desired object layer.
  • the thickness of a thin layer can be arbitrarily set according to the precision of the three-dimensional molded item to manufacture, it is 0.01 mm or more and 0.30 mm or less normally.
  • the thickness of the thin layer 0.01 mm or more, it is possible to prevent the resin composition for three-dimensional modeling of the lower layer from being melt-bonded by laser light irradiation for forming the next modeled product layer, Furthermore, uniform spread is possible.
  • the thickness of the thin layer to 0.30 mm or less, the energy of the laser beam is conducted to the lower portion of the thin layer, and the three-dimensional modeling resin composition constituting the thin layer is sufficient over the entire thickness direction. Can be melt bonded.
  • the thickness of the thin layer is more preferably 0.01 mm or more and 0.10 mm or less. Further, from the viewpoint of sufficiently melt-bonding the resin composition for three-dimensional modeling and making it difficult to cause cracks in the modeled object layer, the difference between the thickness of the thin layer and the beam spot diameter of the laser beam described later is 0.10 mm. It is preferable to set the thickness of the thin layer so as to be within the range.
  • the wavelength of a laser beam is just to set within the range of the wavelength which the resin composition for three-dimensional modeling (thermoplastic resin containing particle
  • the wavelength of the laser beam can be, for example, not less than 0.8 ⁇ m and not more than 12 ⁇ m.
  • the power at the time of laser beam output may be set within a range in which the three-dimensional modeling resin composition (thermoplastic resin-containing particles) is sufficiently melt-bonded at the laser beam scanning speed described later. Specifically, it can be set to 5.0 W or more and 60 W or less. From the viewpoint of reducing the energy of the laser beam, reducing the manufacturing cost, and simplifying the configuration of the manufacturing apparatus, the power at the output of the laser beam is preferably 30 W or less, preferably 20 W or less. More preferably.
  • the scanning speed of the laser light may be set within a range that does not increase the manufacturing cost and does not excessively complicate the apparatus configuration. Specifically, it is preferably 1 m / second or more and 10 m / second or less, more preferably 2 m / second or more and 8 m / second or less, and further preferably 3 m / second or more and 7 m / second or less.
  • the beam diameter of the laser light can be appropriately set according to the accuracy of the three-dimensional structure to be manufactured.
  • the preheating temperature is set to a temperature lower than the melting temperature of the thermoplastic resin contained in the thermoplastic resin-containing particles so that the resin composition for three-dimensional modeling (thermoplastic resin-containing particles) is not melt-bonded.
  • the preheating temperature is appropriately selected according to the melting temperature of the thermoplastic resin, and can be, for example, 50 ° C. or higher and 300 ° C. or lower, more preferably 100 ° C. or higher and 230 ° C. or lower, and 150 ° C. or higher and 190 ° C. or lower. More preferably, it is as follows.
  • the heating time is preferably 1 to 30 seconds, more preferably 5 to 20 seconds.
  • step (2) is performed under reduced pressure or in an inert gas atmosphere.
  • the pressure at which the pressure is reduced is preferably 10 ⁇ 2 Pa or less, and more preferably 10 ⁇ 3 Pa or less.
  • examples of the inert gas that can be used include nitrogen gas and rare gas. Among these inert gases, nitrogen (N 2 ) gas, helium (He) gas, or argon (Ar) gas is preferable from the viewpoint of availability. From the viewpoint of simplifying the production process, it is preferable to perform both step (1) and step (2) under reduced pressure or in an inert gas atmosphere.
  • the manufacturing method of the three-dimensional modeled object of this embodiment is (1) the thin layer formation process which forms the thin layer containing the resin composition for three-dimensional modeling mentioned above, and (2) energy absorption.
  • a fluid application step in which a bonding fluid containing an agent is applied to a specific region of the thin layer; and (3) a thermoplastic resin in the region where the bonding fluid is applied by irradiating energy to the thin layer after the fluid application step.
  • the manufacturing method of the said three-dimensional molded item may include the other process as needed, for example, may include the process etc. which preheat the resin composition for three-dimensional modeling.
  • the thin layer which mainly contains the above-mentioned three-dimensional modeling resin composition is formed.
  • the method for forming the thin layer is not particularly limited as long as a layer having a desired thickness can be formed.
  • this step can be a step in which the resin composition for three-dimensional modeling supplied from the resin composition supply unit of the three-dimensional modeling apparatus is laid flat on the modeling stage by the recoater.
  • the thin layer may be formed directly on the modeling stage, or may be formed so as to be in contact with the resin composition for three-dimensional modeling that has already been laid or the modeling object layer that has already been formed.
  • the thickness of the thin layer is the same as the thickness of the desired object layer.
  • the thickness of a thin layer can be arbitrarily set according to the precision of the three-dimensional molded item to manufacture, it is 0.01 mm or more and 0.30 mm or less normally.
  • the thickness of the thin layer is 0.01 mm or more, the already formed object layer is melted by energy irradiation for forming a new object layer (energy irradiation in the energy irradiation process described later). Can be prevented.
  • the thickness of the thin layer is more preferably 0.01 mm or more and 0.20 mm or less.
  • a binding fluid containing an energy absorbent is applied to a specific region of the thin layer formed in the thin layer formation step.
  • a peeling fluid that absorbs less energy than the bonding fluid may be applied to a region where the bonding fluid is not applied.
  • the bonding fluid may be selectively applied to a position where the shaped article layer is to be formed, and the peeling fluid may be applied to a region where the shaped article layer is not formed.
  • the method for applying the bonding fluid and the peeling fluid is not particularly limited.
  • the bonding fluid and the peeling fluid can be applied by a dispenser, the ink jet method, the spray coating, and the like. It is preferable to apply at least one by the ink jet method from the viewpoint that it can be applied, and it is more preferable to apply both by the ink jet method.
  • the application amount of the bonding fluid and the peeling fluid is preferably 0.1 to 50 ⁇ L, more preferably 0.2 to 40 ⁇ L per 1 mm 3 of the thin layer.
  • the bonding fluid and the peeling fluid are respectively added to the three-dimensional modeling resin composition in the region where the modeling object layer is formed and in the region where the modeling layer is not formed. Can be sufficiently impregnated, and a three-dimensional modeled object with good dimensional accuracy can be formed.
  • the binding fluid applied in this step can be the same as the binding fluid used in the conventional MJF method, and can be, for example, a composition containing at least an energy absorbent and a solvent.
  • the binding fluid may contain a known dispersant or the like as necessary.
  • the energy absorbent is not particularly limited as long as it can absorb the energy irradiated in the energy irradiation step described later and can efficiently increase the temperature of the region where the binding fluid is applied.
  • energy absorbers include infrared absorbers such as carbon black, ITO (indium tin oxide), ATO (antimony tin oxide), cyanine dyes, phthalocyanine dyes centered on aluminum and zinc, various naphthalocyanine compounds, flat surfaces
  • Infrared absorbing dyes such as nickel dithiolene complexes, squalium dyes, quinone compounds, diimmonium compounds and azo compounds having a tetracoordinate structure are included.
  • an infrared absorber is preferable, and carbon black is more preferable.
  • the shape of the energy absorber is not particularly limited, but is preferably particulate.
  • the average particle diameter is preferably 0.1 to 1.0 ⁇ m, more preferably 0.1 to 0.5 ⁇ m. If the average particle size of the energy absorber is excessively large, the energy absorber will not easily enter the gap between the thermoplastic resin-containing particles when the binding fluid is applied onto the thin layer. On the other hand, if the average particle size of the energy absorbent is 0.1 ⁇ m or more, heat can be efficiently transferred to the thermoplastic resin-containing particles in the energy irradiation step described later, and the surrounding thermoplastic resin-containing particles are melted. It becomes possible.
  • the binding fluid preferably contains 0.1 to 10.0% by mass of energy absorber, and more preferably 1.0 to 5.0% by mass.
  • the amount of the energy absorbent is 0.1% by mass or more, it is possible to sufficiently increase the temperature of the region where the binding fluid is applied in the energy irradiation process described later.
  • the amount of the energy absorbent is 10.0% by mass or less, the energy absorbent is less likely to aggregate in the coupling fluid, and the application stability of the coupling fluid is likely to increase.
  • the binding fluid preferably contains 90.0 to 99.9% by mass of the solvent, and more preferably 95.0 to 99.0% by mass.
  • the amount of the solvent in the bonding fluid is 90.0% by mass or more, the fluidity of the bonding fluid increases, and it becomes easy to apply, for example, by an ink jet method.
  • the viscosity of the binding fluid is preferably 0.5 to 50.0 mPa ⁇ s, and more preferably 1.0 to 20.0 mPa ⁇ s.
  • the viscosity of the bonding fluid is 0.5 mPa ⁇ s or more, diffusion when the bonding fluid is applied to the thin layer is easily suppressed.
  • the viscosity of the bonding fluid is 50.0 mPa ⁇ s or less, the coating stability of the bonding fluid is likely to increase.
  • the peeling fluid applied in this step may be a fluid that absorbs relatively less energy than the bonding fluid, and may be, for example, a fluid containing water as a main component.
  • the peeling fluid preferably contains 90% by mass or more, more preferably 95% by mass or more of water.
  • the amount of water in the peeling fluid is 90% by mass or more, it becomes easy to apply, for example, by an ink jet method.
  • the type of energy irradiated in this step is appropriately selected according to the type of energy absorbent included in the binding fluid.
  • Specific examples of the energy include infrared light and white light.
  • the thermoplastic resin-containing particles can be efficiently melted.
  • infrared light is preferable from the viewpoint that the temperature of the thin layer does not rise easily, light having a wavelength of 780 to 3000 nm is more preferable, and a wavelength of 800 to 2500 nm is preferable. More preferably, it is light.
  • the time for irradiating energy in this step is appropriately selected according to the type of thermoplastic resin-containing particles (particularly thermoplastic resin) contained in the three-dimensional modeling resin composition, but is usually 5 to 60 seconds. It is preferably 10 to 30 seconds.
  • the energy irradiation time is usually 5 to 60 seconds or more, it becomes possible to sufficiently melt the thermoplastic resin-containing particles and bond them.
  • the preheating of the three-dimensional modeling resin composition may be performed after the thin layer formation (step (1)) or before the thin layer formation (step (1)). Moreover, you may carry out by both of these. By performing preheating, it is possible to reduce the amount of energy irradiated in the (3) energy irradiation step. Furthermore, it becomes possible to form a molded article layer efficiently in a short time.
  • the preheating temperature is preferably a temperature lower than the melting temperature of the thermoplastic resin and (2) a temperature lower than the boiling point of the solvent contained in the bonding fluid or the peeling fluid applied in the fluid application step.
  • the temperature is preferably 50 ° C. to 5 ° C. lower than the melting point of the thermoplastic resin in the thermoplastic resin-containing particles and the boiling point of the solvent contained in the bonding fluid or the peeling fluid, and 30 ° C. to 5 ° C. It is more preferable that the temperature is lower.
  • the heating time is preferably 1 to 60 seconds, more preferably 3 to 20 seconds.
  • Thermoplastic Resin-Containing Particles (Resin Composition for Three-Dimensional Modeling)
  • the elastic modulus of the thermoplastic resin was measured at 27 ° C. with a tensile tester according to ISO 527-1: 2017.
  • the weight average molecular weight of water-soluble resin was specified by gel permeation (GPC, styrene conversion).
  • the heat-resistant temperature of the water-soluble resin was specified by raising the temperature until a change in storage elastic modulus occurred with a rheometer.
  • the softening point of the mixture was raised from 0 ° C. to 200 ° C. under a differential scanning calorimeter (DSC) at 10 ° C./min, annealed for 10 minutes, lowered from 200 ° C. to 0 ° C., and further 0 ° C. To 200 ° C.
  • DSC differential scanning calorimeter
  • Example 1 45 parts by mass of a metallocene polypropylene resin (manufactured by Nippon Polypro, WMH02, elastic modulus 2300 MPa), an ethylene oxide / propylene oxide (EO / PO) copolymer (manufactured by Meisei Chemical Industry Co., Ltd., EP1010N, heat resistant temperature 200 ° C., molecular weight of about 100,000) and 55 parts by mass.
  • the softening point of the mixture was 160 ° C.
  • the mixture was heated to 180 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15). The kneaded product was cooled to 30 ° C.
  • thermoplastic resin-containing particles containing polypropylene resin were collected. Further, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 1 containing a polypropylene resin.
  • the average particle diameter of the thermoplastic resin-containing particles 1 was 40 ⁇ m.
  • the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 1 was 0.01% by mass.
  • thermoplastic resin-containing particles 2 were obtained in the same manner as in Example 1 except that the temperature of the first solvent when mixing with the kneaded product was 27 ° C.
  • the average particle diameter of the thermoplastic resin-containing particles 2 was 40 ⁇ m.
  • the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 2 was 7% by mass.
  • thermoplastic resin-containing particles 3 are obtained in the same manner as in Example 1 except that the first solvent and the second solvent are water and the temperature of the first solvent when mixing with the kneaded product is 27 ° C. It was.
  • the average particle diameter of the thermoplastic resin-containing particles 3 was 50 ⁇ m. Further, the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 3 was 0.1% by mass.
  • Example 4 45 parts by mass of polyamide resin (manufactured by Daicel-Evonik Co., Ltd., Daiamide L1600, elastic modulus 1430 MPa), 55 parts by mass of ethylene oxide / propylene oxide copolymer (manufactured by Meisei Chemical Industry Co., Ltd., EP1010N, heat resistant temperature 200 ° C., molecular weight about 100,000) Part.
  • the softening point of the mixture was 160 ° C.
  • the mixture was heated to 200 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15). The kneaded product was cooled to 30 ° C.
  • thermoplastic resin-containing particles containing a polyamide resin were collected. Furthermore, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 4 containing a polyamide resin.
  • the average particle diameter of the thermoplastic resin-containing particles 4 was 40 ⁇ m.
  • the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 4 was 0.01% by mass.
  • thermoplastic resin-containing particles 5 were obtained in the same manner as in Example 4 except that the temperature of the first solvent when mixing with the kneaded product was 27 ° C.
  • the average particle diameter of the thermoplastic resin-containing particles 5 was 40 ⁇ m.
  • the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 5 was 7% by mass.
  • thermoplastic resin-containing particles 6 are obtained in the same manner as in Example 4 except that the first solvent and the second solvent are water and the temperature of the first solvent when mixing with the kneaded product is 27 ° C. It was.
  • the average particle diameter of the thermoplastic resin-containing particles 6 was 50 ⁇ m.
  • the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 6 was 0.1% by mass.
  • the softening point of the mixture was 160 ° C.
  • the mixture was heated to 180 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15). The kneaded product was cooled to 30 ° C.
  • thermoplastic resin-containing particles containing a polyamide resin were collected. Further, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 7 containing a polyamide resin.
  • the average particle diameter of the thermoplastic resin-containing particles 7 was 30 ⁇ m.
  • the amount of ethylene oxide in the thermoplastic resin-containing particles 7 was 10% by mass.
  • thermoplastic resin-containing particles containing polypropylene resin were collected. Furthermore, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 8 containing a polypropylene resin.
  • the average particle diameter of the thermoplastic resin-containing particles 8 was 20 ⁇ m.
  • the amount of polyethylene glycol in the thermoplastic resin-containing particles 8 was 10% by mass.
  • a polyamide resin is included as in Comparative Example 2 except that a polyamide resin (manufactured by Daicel-Evonik, Daiamide L1600, elastic modulus 1430 MPa) is used instead of the polypropylene resin (manufactured by Sun Allomer, PM600A, elastic modulus 1320 MPa).
  • Thermoplastic resin-containing particles 9 were obtained.
  • the average particle diameter of the thermoplastic resin-containing particles 9 was 20 ⁇ m.
  • the amount of polyethylene glycol in the thermoplastic resin-containing particles 9 was 10% by mass.
  • thermoplastic resin containing particle (resin composition for three-dimensional modeling) produced by each Example and the comparative example, or the state in the manufacturing stage, it evaluated as follows. The results are shown in Table 1.
  • thermoplastic resin amount The water-soluble resin in the obtained thermoplastic resin-containing particles was quantified by comparing the peak derived from the thermoplastic resin and the peak derived from the water-soluble resin by NMR measurement.
  • thermoplastic resin-containing particles (resin composition for three-dimensional modeling) produced in the above-described examples and comparative examples were spread on a modeling stage placed on a hot plate to form a thin layer having a thickness of 0.1 mm. By adjusting the temperature of the hot plate, each was heated to a preheating temperature of 160 ° C. This thin layer was irradiated with laser light in a range of 15 mm long ⁇ 20 mm wide from a CO 2 laser equipped with a galvanometer scanner for YAG wavelength under the following conditions to produce a shaped article layer.
  • thermoplastic resin-containing particle As shown in Table 1, when a thermoplastic resin-containing particle is produced by mixing a thermoplastic resin having a relatively high elastic modulus and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, In any case, thermoplastic resin-containing particles having a desired average particle diameter could be obtained (Examples 1 to 6). Moreover, when the three-dimensional molded item was produced from the three-dimensional molded resin composition containing the thermoplastic resin-containing particles, the elongation at break was excellent. It is considered that even when a small amount of the water-soluble resin is contained, the fusion property of the interface at the time of three-dimensional modeling is improved and the elongation at break is improved.
  • thermoplastic resin-containing particle is prepared by mixing a thermoplastic resin having a relatively high elastic modulus and a water-soluble resin having a heat resistant temperature of less than 130 ° C.
  • the thermoplastic resin is sufficiently dispersed.
  • the water-soluble resin was decomposed. That is, when these were combined, desired thermoplastic resin-containing particles could not be obtained (Comparative Example 4).
  • thermoplastic resin-containing particles are produced by mixing a thermoplastic resin having a relatively low elastic modulus and a water-soluble resin having a heat-resistant temperature of less than 130 ° C., the desired thermoplastic resin-containing particles are obtained.
  • the evaluation of elongation at break was low, and it was difficult to apply it to uses requiring durability such as an orthosis (Comparative Examples 1 to 3).
  • the three-dimensional modeling object is accurately formed by any method such as the powder bed fusion bonding method or the MJF method. It is possible. Moreover, the three-dimensional molded item obtained has both high mechanical strength and high elastic modulus. Therefore, it is considered that the present invention contributes to further spread of the three-dimensional modeling method.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Civil Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

The present invention addresses the problem of providing: a method for easily and efficiently producing thermoplastic-resin-containing particles; a resin composition for three-dimensional forming which includes thermoplastic-resin-containing particles obtained by the method; and a method for producing a three-dimensional shape from the resin composition. For solving the problem, the method for producing thermoplastic-resin-containing particles comprises: a mixing step in which a thermoplastic resin is mixed with a water-soluble resin having a heat resistance temperature of 130-200°C to obtain a mixture; a kneading step in which the mixture is heated to a temperature not lower than the softening point of the mixture and kneaded to obtain a kneaded mixture; a cooling step in which the kneaded mixture is cooled to a temperature lower than the softening point; a dissolution step in which after the cooling step, the kneaded mixture is mixed with a first solvent, which comprises water or an organic solvent, thereby dissolving the water-soluble resin in the first solvent; and a separation step in which after the dissolution step, the solid matter is taken out to obtain thermoplastic-resin-containing particles.

Description

熱可塑性樹脂含有粒子の製造方法、立体造形用樹脂組成物、およびこれを用いた立体造形物の製造方法Method for producing thermoplastic resin-containing particles, resin composition for three-dimensional modeling, and method for producing three-dimensional molded article using the same

 本発明は、熱可塑性樹脂含有粒子の製造方法、立体造形用樹脂組成物、およびこれを用いた立体造形物の製造方法に関する。 The present invention relates to a method for producing thermoplastic resin-containing particles, a resin composition for three-dimensional modeling, and a method for manufacturing a three-dimensional model using the same.

 近年、複雑な形状の立体造形物を比較的容易に製造できる様々な方法が開発されており、このような手法を利用したラピッドプロトタイピングやラピッドマニュファクチュアリングが注目されている。 In recent years, various methods capable of relatively easily manufacturing a three-dimensional object having a complicated shape have been developed, and rapid prototyping and rapid manufacturing using such a method have attracted attention.

 従来、これらの造形物作製方法は、モデリングの分野で広く使用されてきたが、近年、これらの手法を直接製造に展開する動きが活発になっている。例えば、機能的な義肢装具等を作製すること等も検討されている。ただし、義肢装具等は、機械的強度が高く、さらには薄肉で高い弾性率を有することが要求される。 Conventionally, these three-dimensional object manufacturing methods have been widely used in the field of modeling, but in recent years, there has been an active movement to directly apply these techniques to manufacturing. For example, the production of functional prosthetic orthoses and the like has been studied. However, a prosthetic limb orthosis or the like is required to have high mechanical strength, and to be thin and have a high elastic modulus.

 ここで、立体造形物の製造方法の一つに、熱可塑性樹脂を含む樹脂粒子からなる薄層を形成し、所望の領域の樹脂粒子どうしを焼結もしくは溶融結合(以下、単に「溶融結合」とも称する)させて、立体造形物を得る方法がある。各種立体造形物の製造方法の中でも、樹脂粒子を用いる立体造形物の製造方法は、他の方式に比べて比較的高い造形精度で立体造形物を作製できる。 Here, in one of the methods for producing a three-dimensional structure, a thin layer made of resin particles containing a thermoplastic resin is formed, and resin particles in a desired region are sintered or melt bonded (hereinafter simply referred to as “melt bonding”). And a method of obtaining a three-dimensional model. Among the manufacturing methods of various three-dimensional modeled objects, the three-dimensional modeled manufacturing method using resin particles can produce a three-dimensional modeled object with relatively high modeling accuracy compared to other methods.

 このような立体造形物の製造方法の一つに、粉末床溶融結合法がある。粉末床溶融結合法では、樹脂粒子を平らに敷き詰めて薄層を形成し、当該薄層にパターン状(立体造形物を厚さ方向に微分割したパターン状)にレーザ光を照射する。これにより、レーザ光が照射された領域の樹脂粒子が選択的に溶融結合する。さらに、得られた造形物層上に樹脂粒子をさらに敷き詰め、同様にレーザ光照射を繰り返し行うことで、所望の形状の立体造形物が得られる。 One of the methods for manufacturing such a three-dimensional model is a powder bed fusion bonding method. In the powder bed fusion bonding method, resin particles are laid flat to form a thin layer, and the thin layer is irradiated with laser light in a pattern (a pattern obtained by finely dividing a three-dimensional structure in the thickness direction). As a result, the resin particles in the region irradiated with the laser beam are selectively melt-bonded. Further, resin particles are further spread on the obtained shaped article layer, and laser light irradiation is repeated in the same manner to obtain a three-dimensional shaped article having a desired shape.

 また、樹脂粒子を用いる立体造形物の製造方法の他の例に、Multi Jet Fusion法(以下、「MJF法」とも称する)がある(例えば特許文献1)。MJF法では、まず樹脂粒子を平らに敷き詰めて薄層を形成する。そして当該薄層のうち、樹脂粒子どうしを溶融結合させる領域(以下、「硬化領域」とも称する)にエネルギー吸収剤等を塗布し、エネルギーを照射する。さらに、得られた造形物層上に樹脂粒子をさらに敷き詰め、同様の工程を繰返し行うことで、所望の形状の立体造形物を得る。 Further, as another example of a method for manufacturing a three-dimensional structure using resin particles, there is a Multi Jet Fusion method (hereinafter also referred to as “MJF method”) (for example, Patent Document 1). In the MJF method, first, resin particles are laid flat to form a thin layer. In the thin layer, an energy absorbent or the like is applied to a region where the resin particles are melt-bonded (hereinafter also referred to as “cured region”), and energy is irradiated. Furthermore, resin particles are further spread on the obtained shaped article layer, and the same process is repeated to obtain a three-dimensional shaped article having a desired shape.

 上述の粉末床溶融結合法や、MJF法で得られる立体造形物の物性は、用いる樹脂粒子の種類や物性に大きく依存する。そして、樹脂粒子は従来、高温に加熱した溶媒中に熱可塑性樹脂を溶解させた後、攪拌しながら析出させること等により調製されてきた。しかしながら、機械的強度が高く、かつ弾性率の高い樹脂は、一般的に溶融温度が高い。そのため、当該方法で樹脂粒子を調製する場合、溶媒や樹脂を高温まで加熱しなければならず、製造効率が低いという課題があった。 The physical properties of the three-dimensional structure obtained by the above-described powder bed fusion bonding method and MJF method greatly depend on the type and physical properties of the resin particles used. Conventionally, resin particles have been prepared by dissolving a thermoplastic resin in a solvent heated to a high temperature and then precipitating it with stirring. However, a resin having a high mechanical strength and a high elastic modulus generally has a high melting temperature. Therefore, when preparing the resin particles by the method, the solvent and the resin must be heated to a high temperature, and there is a problem that the production efficiency is low.

 一方、粉末床溶融結合法や、MJF法に用いる樹脂粒子の調製方法として、熱可塑性樹脂と、水溶性樹脂とを混練する方法等も提案されている(例えば、特許文献1および特許文献2)。当該方法では、水溶性樹脂中に熱可塑性樹脂を混練によって分散させた後、水溶性樹脂を除去することで、所望の熱可塑性樹脂含有粒子を得る。上記水溶性樹脂としては、ポリエチレングリコールや、ポリエチレンオキサイド等が提案されている。 On the other hand, a method of kneading a thermoplastic resin and a water-soluble resin has also been proposed as a method for preparing resin particles used in the powder bed melt bonding method and the MJF method (for example, Patent Document 1 and Patent Document 2). . In this method, a thermoplastic resin is dispersed in a water-soluble resin by kneading, and then the water-soluble resin is removed to obtain desired thermoplastic resin-containing particles. As the water-soluble resin, polyethylene glycol, polyethylene oxide and the like have been proposed.

特開2006-321711号公報JP 2006-321711 A 特開2007-277546号公報JP 2007-277546 A

 しかしながら、粘度の高い樹脂や、弾性率の高い樹脂を、ポリエチレングリコール等に分散させることは難しく、特許文献1や特許文献2に記載の方法で、均一な樹脂粒子を調製することが困難であった。 However, it is difficult to disperse a resin having a high viscosity or a resin having a high elastic modulus in polyethylene glycol or the like, and it is difficult to prepare uniform resin particles by the methods described in Patent Document 1 and Patent Document 2. It was.

 本発明は、上記課題を鑑みてなされたものである。すなわち本発明は、簡便な方法で効率よく熱可塑性樹脂含有粒子を製造する方法、およびこれにより得られる熱可塑性樹脂含有粒子を含む立体造形用樹脂組成物、ならびにこれを用いた立体造形物の製造方法の提供を目的とする。 The present invention has been made in view of the above problems. That is, the present invention relates to a method for efficiently producing thermoplastic resin-containing particles by a simple method, a resin composition for three-dimensional modeling including the thermoplastic resin-containing particles obtained thereby, and a three-dimensional molded article using the same. The purpose is to provide a method.

 本発明は、以下の熱可塑性樹脂含有粒子の製造方法を提供する。
 [1]熱可塑性樹脂および耐熱温度130℃以上200℃以下の水溶性樹脂を混合し、混合物を得る混合工程と、前記混合物を、前記混合物の軟化点以上に加熱して混練し、混練物を得る混練工程と、前記混練物を前記軟化点未満に冷却する冷却工程と、前記冷却工程後、前記混練物を水または有機溶媒を含む第1の溶媒と混合し、前記水溶性樹脂を前記第1の溶媒に溶解させる溶解工程と、前記溶解工程後、固形分を分離し、熱可塑性樹脂含有粒子を得る分離工程と、を含む、熱可塑性樹脂含有粒子の製造方法。
The present invention provides the following method for producing thermoplastic resin-containing particles.
[1] A mixing step of mixing a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower to obtain a mixture, and heating and kneading the mixture to a temperature above the softening point of the mixture. A kneading step to obtain, a cooling step for cooling the kneaded material below the softening point, and after the cooling step, the kneaded material is mixed with a first solvent containing water or an organic solvent, and the water-soluble resin is mixed with the first water-soluble resin. The manufacturing method of the thermoplastic resin containing particle | grains including the melt | dissolution process melt | dissolved in 1 solvent, and the isolation | separation process of isolate | separating solid content after the said melt | dissolution process and obtaining a thermoplastic resin containing particle | grain.

 [2]前記水溶性樹脂が、エチレンオキサイド/プロピレンオキサイド共重合体を含む、[1]に記載の熱可塑性樹脂含有粒子の製造方法。
 [3]前記エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が50000以上150000以下である、[2]に記載の熱可塑性樹脂含有粒子の製造方法。
 [4]前記熱可塑性樹脂が、ポリプロピレンを含む、[1]~[3]のいずれかに記載の熱可塑性樹脂含有粒子の製造方法。
 [5]前記ポリプロピレンの27℃における弾性率が、1500MPa以上2500MPa以下である、[4]に記載の熱可塑性樹脂含有粒子の製造方法。
 [6]前記混合工程が、前記熱可塑性樹脂および前記水溶性樹脂を、質量比1:9~5:5で混合し、前記混合物を得る工程である、[1]~[5]のいずれかに記載の熱可塑性樹脂含有粒子の製造方法。
[2] The method for producing thermoplastic resin-containing particles according to [1], wherein the water-soluble resin contains an ethylene oxide / propylene oxide copolymer.
[3] The method for producing thermoplastic resin-containing particles according to [2], wherein the ethylene oxide / propylene oxide copolymer has a weight average molecular weight of 50,000 to 150,000.
[4] The method for producing thermoplastic resin-containing particles according to any one of [1] to [3], wherein the thermoplastic resin includes polypropylene.
[5] The method for producing thermoplastic resin-containing particles according to [4], wherein the polypropylene has an elastic modulus at 27 ° C. of 1500 MPa to 2500 MPa.
[6] Any of [1] to [5], wherein the mixing step is a step of mixing the thermoplastic resin and the water-soluble resin at a mass ratio of 1: 9 to 5: 5 to obtain the mixture. The manufacturing method of the thermoplastic resin containing particle | grains as described in any one of.

 [7]前記分離工程後に、前記熱可塑性樹脂含有粒子を水または有機溶媒を含む第2の溶媒で洗浄する洗浄工程をさらに含む、[1]~[6]のいずれかに記載の熱可塑性樹脂含有粒子の製造方法。
 [8]前記洗浄工程は、前記熱可塑性樹脂含有粒子の質量に対する前記水溶性樹脂の含有量が5質量%以下になるまで、前記熱可塑性樹脂含有粒子を洗浄する工程である、[7]に記載の熱可塑性樹脂含有粒子の製造方法。
 [9]前記洗浄工程が、有機溶媒で前記熱可塑性樹脂含有粒子を洗浄する工程であり、前記洗浄工程後に、前記有機溶媒と前記水溶性樹脂とを分離し、前記有機溶媒を回収する第2溶媒回収工程をさらに含む、[7]または[8]に記載の熱可塑性樹脂含有粒子の製造方法。
[7] The thermoplastic resin according to any one of [1] to [6], further including a washing step of washing the thermoplastic resin-containing particles with water or a second solvent containing an organic solvent after the separation step. Production method of contained particles.
[8] The washing step is a step of washing the thermoplastic resin-containing particles until the content of the water-soluble resin with respect to the mass of the thermoplastic resin-containing particles is 5% by mass or less. The manufacturing method of the thermoplastic resin containing particle | grains of description.
[9] The washing step is a step of washing the thermoplastic resin-containing particles with an organic solvent. After the washing step, the organic solvent and the water-soluble resin are separated, and the organic solvent is recovered. The method for producing thermoplastic resin-containing particles according to [7] or [8], further comprising a solvent recovery step.

 [10]前記溶解工程が、前記水溶性樹脂を有機溶媒に溶解させる工程であり、前記溶解工程後に、前記有機溶媒と前記水溶性樹脂とを分離し、前記有機溶媒を回収する第1溶媒回収工程をさらに含む、[1]~[9]のいずれかに記載の熱可塑性樹脂含有粒子の製造方法。
 [11]前記第1の溶媒および/または前記第2の溶媒が、アセトニトリル、ジクロロメタン、メタノール、エタノール、トルエン、テトラヒドロフラン、アセトン、および酢酸エチルからなる群から選ばれる、[9]または[10]に記載の熱可塑性樹脂含有粒子の製造方法。
[10] The dissolving step is a step of dissolving the water-soluble resin in an organic solvent, and after the dissolving step, the organic solvent and the water-soluble resin are separated, and the first solvent recovery for recovering the organic solvent The method for producing thermoplastic resin-containing particles according to any one of [1] to [9], further comprising a step.
[11] In [9] or [10], the first solvent and / or the second solvent is selected from the group consisting of acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, acetone, and ethyl acetate. The manufacturing method of the thermoplastic resin containing particle | grains of description.

 本発明は、以下の立体造形用樹脂組成物を提供する。
 [12]熱可塑性樹脂と、耐熱温度130℃以上200℃以下の水溶性樹脂と、を含み、前記水溶性樹脂の量が0.001質量%以上5質量%以下である、熱可塑性樹脂含有粒子を含む、立体造形用樹脂組成物。
The present invention provides the following three-dimensional modeling resin composition.
[12] A thermoplastic resin-containing particle comprising a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, wherein the amount of the water-soluble resin is 0.001% by mass to 5% by mass. A resin composition for three-dimensional modeling.

 [13]前記水溶性樹脂が、エチレンオキサイド/プロピレンオキサイド共重合体を含む、[12]に記載の立体造形用樹脂組成物。
 [14]前記エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が50000以上150000以下である、[13]に記載の立体造形用樹脂組成物。
 [15]前記熱可塑性樹脂が、ポリプロピレンを含む、[12]~[14]のいずれかに記載の立体造形用樹脂組成物。
 [16]前記ポリプロピレンの27℃における弾性率が、1500MPa以上2500MPa以下である、[15]に記載の立体造形用樹脂組成物。
[13] The resin composition for three-dimensional modeling according to [12], wherein the water-soluble resin includes an ethylene oxide / propylene oxide copolymer.
[14] The resin composition for three-dimensional modeling according to [13], wherein the ethylene oxide / propylene oxide copolymer has a weight average molecular weight of 50,000 to 150,000.
[15] The resin composition for three-dimensional modeling according to any one of [12] to [14], wherein the thermoplastic resin includes polypropylene.
[16] The resin composition for three-dimensional modeling according to [15], wherein the polypropylene has an elastic modulus at 27 ° C. of 1500 MPa to 2500 MPa.

 本発明は、以下の立体造形物の製造方法を提供する。
 [17]上記[12]~[16]のいずれかに記載の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、前記薄層にレーザ光を選択的に照射して、複数の前記熱可塑性樹脂含有粒子が溶融結合した造形物層を形成するレーザ光照射工程と、を含み、前記薄層形成工程、および前記レーザ光照射工程を複数回繰り返し、前記造形物層を積層することで立体造形物を形成する、立体造形物の製造方法。
 [18]上記[12]~[16]のいずれかに記載の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、エネルギー吸収剤を含む結合用流体を、前記薄層の特定の領域に塗布する流体塗布工程と、前記流体塗布工程後の前記薄層にエネルギーを照射し、前記結合用流体を塗布した領域の前記熱可塑性樹脂含有粒子が溶融した造形物層を形成するエネルギー照射工程と、を含み、前記薄層形成工程、前記流体塗布工程、および前記エネルギー照射工程を複数回繰り返し、前記造形物層を積層することで立体造形物を形成する、立体造形物の製造方法。
The present invention provides the following manufacturing method of a three-dimensional model.
[17] A thin layer forming step of forming a thin layer containing the three-dimensional modeling resin composition according to any one of [12] to [16], and selectively irradiating the thin layer with laser light, A laser beam irradiation step of forming a molded article layer in which a plurality of the thermoplastic resin-containing particles are melt-bonded, and the thin layer forming step and the laser beam irradiation step are repeated a plurality of times to laminate the molded article layer The manufacturing method of a three-dimensional molded item which forms a three-dimensional molded item by doing.
[18] A thin layer forming step for forming a thin layer containing the resin composition for three-dimensional modeling according to any one of [12] to [16] above, and a binding fluid containing an energy absorbing agent Applying a fluid to the specific area and irradiating the thin layer after the fluid application process with energy to form a shaped article layer in which the thermoplastic resin-containing particles are melted in the area where the binding fluid is applied. Manufacturing a three-dimensional structure including an energy irradiation step, forming the three-dimensional structure by repeating the thin layer forming step, the fluid application step, and the energy irradiation step a plurality of times and laminating the three-dimensional object layer. Method.

 本発明の熱可塑性樹脂含有粒子の製造方法によれば、簡便な方法で効率よく熱可塑性樹脂含有粒子を製造することができる。また、当該方法により得られる熱可塑性樹脂含有粒子を含む立体造形用樹脂組成物、ならびにこれを用いた立体造形物の製造方法が提供される。 According to the method for producing thermoplastic resin-containing particles of the present invention, thermoplastic resin-containing particles can be efficiently produced by a simple method. Moreover, the resin composition for three-dimensional modeling containing the thermoplastic resin containing particle obtained by the said method, and the manufacturing method of a three-dimensional molded item using the same are provided.

 1.熱可塑性樹脂含有粒子の製造方法
 本発明の熱可塑性樹脂含有粒子の製造方法には、熱可塑性樹脂および耐熱温度130℃以上200℃以下の水溶性樹脂の混合物を得る混合工程と、当該混合物の混練物を得る混練工程と、得られた混練物を冷却する冷却工程と、混練物中の水溶性樹脂を第1の溶媒に溶解させる溶解工程と、固形分を分離し、熱可塑性樹脂含有粒子を得る分離工程と、が含まれる。なお、当該熱可塑性樹脂含有粒子の製造方法には、必要に応じて、得られた熱可塑性樹脂含有粒子を第2の溶媒で洗浄する洗浄工程等が含まれていてもよい。また、溶解工程や洗浄工程後に、第1の溶媒や第2の溶媒を回収する溶媒回収工程が含まれていてもよい。
1. Method for Producing Thermoplastic Resin-Containing Particles The method for producing thermoplastic resin-containing particles of the present invention includes a mixing step of obtaining a mixture of a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, and kneading of the mixture. A kneading step for obtaining the product, a cooling step for cooling the obtained kneaded product, a dissolving step for dissolving the water-soluble resin in the kneaded product in the first solvent, and separating the solids, and containing the thermoplastic resin-containing particles. A separation step to be obtained. In addition, the manufacturing method of the said thermoplastic resin containing particle | grains may include the washing | cleaning process etc. which wash | clean the obtained thermoplastic resin containing particle | grains with a 2nd solvent as needed. Moreover, the solvent collection | recovery process which collect | recovers a 1st solvent or a 2nd solvent may be included after a melt | dissolution process and a washing | cleaning process.

 上述のように従来、熱可塑性樹脂と、ポリエチレングリコールや、ポリエチレンオキサイド等の水溶性樹脂とを混練し、熱可塑性樹脂を水溶性樹脂中に粒子状に分散させる方法が提案されている。しかしながら、粘度が高い熱可塑性樹脂や弾性率の高い熱可塑性樹脂は、ポリエチレングリコール等に均一に分散させることが難しく、従来の方法では、所望の熱可塑性樹脂含有粒子が得られない、との課題があった。 As described above, conventionally, a method has been proposed in which a thermoplastic resin is kneaded with a water-soluble resin such as polyethylene glycol or polyethylene oxide, and the thermoplastic resin is dispersed in a particulate form in the water-soluble resin. However, a thermoplastic resin having a high viscosity or a thermoplastic resin having a high modulus of elasticity is difficult to uniformly disperse in polyethylene glycol or the like, and the conventional method cannot obtain desired thermoplastic resin-containing particles. was there.

 一般的に、粘度が高い熱可塑性樹脂や弾性率の高い熱可塑性樹脂は、長時間混練したり、高い温度まで加熱したりすることで、ポリエチレングリコール等の水溶性樹脂中に分散させられると考えられる。しかしながら、本発明者が鋭意検討したところ、ポリエチレングリコール等と共に熱可塑性樹脂を混練すると、混練時にポリエチレングリコール等の粘度が過度に低下して、熱可塑性樹脂と混ざりにくかったり、ポリエチレングリコール等が分解したりすることが明らかとなった。そして、このような状態で混練を続けると、熱可塑性樹脂が均一な粒子状になり難く、さらには粒子状となっても、再度これらが結合してしまいやすかった。これに対し、耐熱温度130℃以上200℃以下の水溶性樹脂は、混練時に粘度が過度に低下し難く、さらには熱によっても分解し難い。したがって、熱可塑性樹脂が均一に分散されやすく、所望の熱可塑性樹脂含有粒子が得られることが見出された。 In general, a thermoplastic resin having a high viscosity or a thermoplastic resin having a high elastic modulus is considered to be dispersed in a water-soluble resin such as polyethylene glycol by kneading for a long time or heating to a high temperature. It is done. However, as a result of intensive studies by the present inventors, when a thermoplastic resin is kneaded with polyethylene glycol or the like, the viscosity of polyethylene glycol or the like is excessively lowered during kneading, and it is difficult to mix with the thermoplastic resin, or polyethylene glycol or the like decomposes. It became clear that. When kneading is continued in such a state, it is difficult for the thermoplastic resin to become uniform particles, and even if they become particles, they tend to bond again. On the other hand, a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower is less likely to have an excessively low viscosity at the time of kneading, and is not easily decomposed by heat. Therefore, it has been found that the thermoplastic resin is easily dispersed uniformly and desired thermoplastic resin-containing particles can be obtained.

 以下、本発明の熱可塑性樹脂含有粒子の製造方法の各工程について、詳しく説明する。 Hereinafter, each step of the method for producing the thermoplastic resin-containing particles of the present invention will be described in detail.

 1-1.混合工程
 混合工程では、熱可塑性樹脂と耐熱温度が130℃以上200℃以下の水溶性樹脂とを混合し、混合物を得る。熱可塑性樹脂および水溶性樹脂の混合方法は特に制限されず、公知の混合・攪拌装置で行うことができる。また、熱可塑性樹脂および水溶性樹脂の混合は、室温で行ってもよく、加熱しながら行ってもよい。
1-1. Mixing Step In the mixing step, a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower are mixed to obtain a mixture. The mixing method of the thermoplastic resin and the water-soluble resin is not particularly limited, and can be performed with a known mixing / stirring apparatus. The mixing of the thermoplastic resin and the water-soluble resin may be performed at room temperature or while heating.

 ここで、熱可塑性樹脂および水溶性樹脂の混合比(質量比)は、1:9~5:5であることが好ましく、4:6~5:5であることがより好ましく、4:5~5:5であることがさらに好ましい。熱可塑性樹脂の量が過度に多くなると、後述の混練工程にて水溶性樹脂中に熱可塑性樹脂を十分に分散させにくくなるが、混合比が5:5以下であれば、熱可塑性樹脂を水溶性樹脂中に分散させやすくなる。一方、熱可塑性樹脂含有粒子の生産性の観点から、上記混合比を1:9以上とすることが好ましい。 Here, the mixing ratio (mass ratio) of the thermoplastic resin and the water-soluble resin is preferably 1: 9 to 5: 5, more preferably 4: 6 to 5: 5, and more preferably 4: 5 to 5. More preferably, it is 5: 5. If the amount of the thermoplastic resin is excessively large, it becomes difficult to sufficiently disperse the thermoplastic resin in the water-soluble resin in the kneading step described later. However, if the mixing ratio is 5: 5 or less, the thermoplastic resin is water-soluble. It becomes easy to disperse in the functional resin. On the other hand, from the viewpoint of productivity of the thermoplastic resin-containing particles, the mixing ratio is preferably 1: 9 or more.

 上記熱可塑性樹脂は特に制限されないが、本発明の効果を十分に得るとの観点、さらには得られる立体造形物の弾性率を高めるとの観点から、比較的高弾性の熱可塑性樹脂であることが好ましい。具体的には、熱可塑性樹脂の27℃における弾性率は1400MPa以上であることが好ましく、1700MPa以上であることがより好ましい。一方、弾性率が過度に高い場合には、水溶性樹脂中に分散させ難くなりやすい。そこで、熱可塑性樹脂の27℃における弾性率は、2500MPa以下であることが好ましく、2300MPa以下であることがより好ましい。熱可塑性樹脂の弾性率は、ISO527-1:2017に準拠して、引張試験器により測定される。 The thermoplastic resin is not particularly limited, but is a relatively high elasticity thermoplastic resin from the viewpoint of sufficiently obtaining the effects of the present invention, and further from the viewpoint of increasing the elastic modulus of the resulting three-dimensional structure. Is preferred. Specifically, the elastic modulus at 27 ° C. of the thermoplastic resin is preferably 1400 MPa or more, and more preferably 1700 MPa or more. On the other hand, when the elastic modulus is excessively high, it is difficult to disperse in the water-soluble resin. Therefore, the elastic modulus at 27 ° C. of the thermoplastic resin is preferably 2500 MPa or less, and more preferably 2300 MPa or less. The elastic modulus of the thermoplastic resin is measured by a tensile tester according to ISO 527-1: 2017.

 上記熱可塑性樹脂の例には、ポリアミド12、ポリプロピレン、ポリ乳酸、ポリエチレン、ポリエチレンテレフタレート、ポリスチレン、アクリロニトリル・ブタジエン・スチレン共重合チア、エチレン・酢酸ビニル共重合体、スチレン・アクリロニトリル共重合体、およびポリカプロラクトン等が含まれる。これらの中でも、弾性率が高く、かつ機械的強度が高いとの観点から、ポリアミド12およびポリプロピレンが好ましく、ポリプロピレンが特に好ましい。なお、熱可塑性樹脂は、一種のみを用いてもよく、二種以上を組み合わせて用いてもよい。 Examples of the thermoplastic resin include polyamide 12, polypropylene, polylactic acid, polyethylene, polyethylene terephthalate, polystyrene, acrylonitrile / butadiene / styrene copolymer thia, ethylene / vinyl acetate copolymer, styrene / acrylonitrile copolymer, and poly Caprolactone and the like are included. Among these, polyamide 12 and polypropylene are preferable, and polypropylene is particularly preferable from the viewpoints of high elastic modulus and high mechanical strength. In addition, a thermoplastic resin may use only 1 type and may use it in combination of 2 or more type.

 ここで、熱可塑性樹脂がポリプロピレンである場合、ポリプロピレンの27℃における弾性率は、1500MPa以上2500MPa以下であることが好ましく、2000MPa以上2500MPa以下であることがより好ましく、2300MPa以上2500MPa以下であることがさらに好ましい。ポリプロピレンの弾性率が当該範囲であると、汎用性の高い立体造形物が得られやすくなる。 Here, when the thermoplastic resin is polypropylene, the elastic modulus at 27 ° C. of the polypropylene is preferably 1500 MPa or more and 2500 MPa or less, more preferably 2000 MPa or more and 2500 MPa or less, and 2300 MPa or more and 2500 MPa or less. Further preferred. When the elastic modulus of polypropylene is within this range, a highly versatile three-dimensional modeled object can be easily obtained.

 なお、本工程で混合する熱可塑性樹脂の形状は特に制限されず、例えば塊状であってもよく、粒子状であってもよく、ペレット状であってもよい。 The shape of the thermoplastic resin mixed in this step is not particularly limited, and may be, for example, a lump shape, a particle shape, or a pellet shape.

 一方、本工程で混合する水溶性樹脂は、耐熱温度が130℃以上200℃以下であり、水溶性を有し、かつ上述の熱可塑性樹脂と相溶性の低い樹脂であれば特に制限されない。ここで、本明細書において、水溶性樹脂の「耐熱温度」とは、水溶性樹脂の分解温度の上限を意味し、レオメーターにより、貯蔵弾性率の変化が起きるまで昇温させることによって測定される値をいう。また、「水溶性を有する」とは、100gの水に10g以上溶解する場合のことをいう。 On the other hand, the water-soluble resin to be mixed in this step is not particularly limited as long as it has a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, is water-soluble, and has low compatibility with the above-described thermoplastic resin. Here, in the present specification, the “heat-resistant temperature” of the water-soluble resin means the upper limit of the decomposition temperature of the water-soluble resin, and is measured by raising the temperature until a change in storage elastic modulus occurs with a rheometer. Value. Further, “having water solubility” means a case where 10 g or more is dissolved in 100 g of water.

 後述の混練工程において、水溶性樹脂中に熱可塑性樹脂を均一に分散させるとの観点から、水溶性樹脂として、熱可塑性樹脂と流動性の挙動が近いものを選択することが好ましい。例えば、150℃における熱可塑性樹脂の粘度を1としたとき、150℃における水溶性樹脂の粘度は、0.8~1.2であることが好ましく、0.9~1であることがより好ましい。なお粘度は、レオメーターにより100℃~200℃に昇温した際に測定される値とする。 In the kneading step described later, it is preferable to select a water-soluble resin having a fluidity behavior close to that of the thermoplastic resin from the viewpoint of uniformly dispersing the thermoplastic resin in the water-soluble resin. For example, when the viscosity of the thermoplastic resin at 150 ° C. is 1, the viscosity of the water-soluble resin at 150 ° C. is preferably 0.8 to 1.2, more preferably 0.9 to 1. . The viscosity is a value measured when the temperature is raised to 100 ° C. to 200 ° C. with a rheometer.

 水溶性樹脂の具体例には、エチレンオキサイド/プロピレンオキサイド共重合体、ポリアクリルアミド等が含まれる。水溶性樹脂は、一種のみ用いてもよく、二種以上を混合して用いてもよい。これらの中でも特に、後述の溶解工程において、有機溶媒に溶解させることが可能であり、かつ耐熱性が高いという観点で、エチレンオキサイド/プロピレンオキサイド共重合体が好ましい。 Specific examples of the water-soluble resin include ethylene oxide / propylene oxide copolymer, polyacrylamide and the like. Only one kind of water-soluble resin may be used, or two or more kinds of water-soluble resins may be mixed and used. Among these, an ethylene oxide / propylene oxide copolymer is preferable from the viewpoint that it can be dissolved in an organic solvent and has high heat resistance in the dissolution step described later.

 ここで、エチレンオキサイド/プロピレンオキサイド共重合体は、重量平均分子量が50000以上150000以下であることが好ましく、50000以上120000以下であることがより好ましく、50000以上100000以下であることがさらに好ましい。重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)により測定される分子量(スチレン換算)である。エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が過度に大きいと、水や有機溶媒に溶解し難くなることがあるが、150000以下であれば、これらに十分に溶解させることが可能である。また、エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が50000以上であると、混練時における、エチレンオキサイド/プロピレンオキサイドの粘度と、熱可塑性樹脂の粘度とが近くなりやすい。 Here, the ethylene oxide / propylene oxide copolymer preferably has a weight average molecular weight of 50,000 to 150,000, more preferably 50,000 to 120,000, and even more preferably 50,000 to 100,000. The weight average molecular weight is a molecular weight (in terms of styrene) measured by gel permeation chromatography (GPC). If the weight average molecular weight of the ethylene oxide / propylene oxide copolymer is excessively large, it may be difficult to dissolve in water or an organic solvent, but if it is 150,000 or less, it can be sufficiently dissolved therein. When the weight average molecular weight of the ethylene oxide / propylene oxide copolymer is 50000 or more, the viscosity of the ethylene oxide / propylene oxide and the viscosity of the thermoplastic resin at the time of kneading tend to be close.

 エチレンオキサイド/プロピレンオキサイド共重合体は、エチレンオキサイドモノマーとプロピレンオキサイドモノマーとを共重合したものであればよいが、エチレオキサイドモノマーとプロピレンオキサイドモノマーとの重合比は、12:1~10:1であることが好ましく、8:1~7:1であることがより好ましく、6:1~5:1であることがさらに好ましい。エチレンオキサイドモノマー由来の構造が、一定以上含まれると、後述する溶解工程において、エチレンオキサイド/プロピレンオキサイド共重合体の水や有機溶媒に対する溶解性が良好になる。 The ethylene oxide / propylene oxide copolymer may be any copolymer of an ethylene oxide monomer and a propylene oxide monomer, but the polymerization ratio of the ethylene oxide monomer to the propylene oxide monomer is 12: 1 to 10: 1. Preferably, it is 8: 1 to 7: 1, more preferably 6: 1 to 5: 1. If the structure derived from the ethylene oxide monomer is contained in a certain amount or more, the solubility of the ethylene oxide / propylene oxide copolymer in water or an organic solvent is improved in the dissolution step described later.

 なお、本工程で混合する際の水溶性樹脂の形状も特に制限されず、例えば塊状であってもよく、粒子状であってもよく、ペレット状であってもよい。 In addition, the shape of the water-soluble resin at the time of mixing in this step is not particularly limited, and may be, for example, a lump shape, a particle shape, or a pellet shape.

 1-2.混練工程
 上述の混合工程で調製した混合物を、当該混合物の軟化点以上に加熱して混練する。混合物の軟化点は、示差走査熱量計(DSC)により、10℃/minの条件で0℃から200℃まで昇温させ、10分間アニーリングをし、200℃から0℃まで降温させ、更に0℃から200℃まで昇温させることにより特定される。
1-2. Kneading step The mixture prepared in the above-described mixing step is heated and kneaded at a temperature equal to or higher than the softening point of the mixture. The softening point of the mixture was raised from 0 ° C. to 200 ° C. under a differential scanning calorimeter (DSC) at 10 ° C./min, annealed for 10 minutes, lowered from 200 ° C. to 0 ° C., and further 0 ° C. To 200 ° C.

 混練時の温度は、上述の混合物の軟化点以上であればよいが、当該軟化点より10~200℃高い温度であることが好ましく、20~150℃高い温度であることがより好ましい。混練時の温度が軟化点より10℃以上高いと、水溶性樹脂中に熱可塑性樹脂が均一に分散されやすくなる。一方で、混練時の温度を、軟化点より200℃以下高い温度とすることで、水溶性樹脂や熱可塑性樹脂が混練時に分解し難くなる。 The temperature at the time of kneading may be equal to or higher than the softening point of the above-mentioned mixture, but is preferably 10 to 200 ° C. higher than the softening point, more preferably 20 to 150 ° C. higher. When the temperature at the time of kneading is 10 ° C. or more higher than the softening point, the thermoplastic resin is easily dispersed uniformly in the water-soluble resin. On the other hand, by setting the temperature during kneading to a temperature that is 200 ° C. or less higher than the softening point, it becomes difficult for the water-soluble resin or thermoplastic resin to decompose during kneading.

 また、混練時間は、水溶性樹脂中で熱可塑性樹脂が所望の平均粒子径となるまで分散可能な時間であれば特に制限されない。通常10~40分とすることができ、10~30分とすることがより好ましく、15~20分とすることがさらに好ましい。混練時間が過度に長いと、製造効率が低下したり、水溶性樹脂が分解しやすくなったりする。一方、混練時間が過度に短いと、十分に熱可塑性樹脂を分散させることが難しい。 The kneading time is not particularly limited as long as the thermoplastic resin can be dispersed in the water-soluble resin until a desired average particle size is obtained. Usually, it can be 10 to 40 minutes, more preferably 10 to 30 minutes, and further preferably 15 to 20 minutes. When the kneading time is excessively long, the production efficiency is lowered, or the water-soluble resin is easily decomposed. On the other hand, if the kneading time is excessively short, it is difficult to sufficiently disperse the thermoplastic resin.

 なお、本工程では、水溶性樹脂中に分散される熱可塑性樹脂の平均粒子径が、20~100μm程度となるように混練することが好ましく、30~70μm程度となるように混練することがより好ましい。熱可塑性樹脂を含む粒子(本願では「熱可塑性樹脂含有粒子」とも表す)の平均粒子径が100μm以下であると、当該熱可塑性樹脂含有粒子を用いて、微細な構造の立体造形物を作製することが可能となる。一方、立体造形物の作製時に、熱可塑性樹脂含有粒子に十分な流動性を付与し、かつ取り扱い性を良好にする等の観点から20μm以上であることが好ましい。また、各熱可塑性樹脂含有粒子の粒子径の粒度分布は狭いことが好ましい。なお、熱可塑性樹脂含有粒子の多分散度(Mw/Mn)は、2.0以下であることが好ましく、1.8以下であることがより好ましく、1.5以下であることがさらに好ましい。熱可塑性樹脂含有粒子の重量平均分子量(Mw)および数平均分子量(Mn)は、GPCにより測定できる。当該多分散度(Mw/Mn)が低くなると、粒子径の粒度分布も低くなりやすい。 In this step, the thermoplastic resin dispersed in the water-soluble resin is preferably kneaded so that the average particle size is about 20 to 100 μm, more preferably about 30 to 70 μm. preferable. When the average particle diameter of particles containing a thermoplastic resin (also referred to as “thermoplastic resin-containing particles” in the present application) is 100 μm or less, a three-dimensional structure having a fine structure is produced using the thermoplastic resin-containing particles. It becomes possible. On the other hand, it is preferable that it is 20 micrometers or more from a viewpoint of providing sufficient fluidity | liquidity to a thermoplastic resin containing particle at the time of preparation of a three-dimensional molded item, and making a handleability favorable. Moreover, it is preferable that the particle size distribution of the particle diameter of each thermoplastic resin containing particle is narrow. The polydispersity (Mw / Mn) of the thermoplastic resin-containing particles is preferably 2.0 or less, more preferably 1.8 or less, and even more preferably 1.5 or less. The weight average molecular weight (Mw) and the number average molecular weight (Mn) of the thermoplastic resin-containing particles can be measured by GPC. When the polydispersity (Mw / Mn) is low, the particle size distribution of the particle size is likely to be low.

 上記平均粒子径は、混練物の一部を抜きとり、水溶性樹脂を後述の第1の溶媒等に溶解させた後、残留する粒子状の成分の平均粒子径を測定することで特定できる。具体的には、動的光散乱法によって測定した体積平均粒子径とする。体積平均粒子径は、湿式分散機を備えたレーザ回折式粒度分布測定装置(マイクロトラックベル社製、MT3300EXII)により測定することができる。 The average particle size can be specified by extracting a part of the kneaded material, dissolving the water-soluble resin in the first solvent described later, and then measuring the average particle size of the remaining particulate component. Specifically, the volume average particle diameter is measured by a dynamic light scattering method. The volume average particle diameter can be measured by a laser diffraction particle size distribution measuring apparatus (manufactured by Microtrack Bell Co., Ltd., MT3300EXII) equipped with a wet disperser.

 ここで、本工程における混練方法は特に制限されず、例えばロール、バンバリーミキサー、ニーダー、単軸押出機、二軸押出機等が含まれる。これらの中でも、得られる熱可塑性樹脂含有粒子の平均粒子径を均一にするとの観点から、二軸押出機が好ましい。なお、混練後の混練物を、塊状のままとしてもよいが、シート状やストランド状、ペレット状等、各種形状に加工してもよい。 Here, the kneading method in this step is not particularly limited and includes, for example, a roll, a Banbury mixer, a kneader, a single screw extruder, a twin screw extruder, and the like. Among these, a twin screw extruder is preferable from the viewpoint of making the average particle diameter of the obtained thermoplastic resin-containing particles uniform. The kneaded material after kneading may be left in a lump shape, but may be processed into various shapes such as a sheet shape, a strand shape, and a pellet shape.

 1-3.冷却工程
 上記混練工程後、混練物をその軟化点未満まで冷却する。本工程では、混練物を軟化点より110℃以上低い温度まで冷却することが好ましく、120℃以上低い温度まで冷却することがより好ましい。冷却工程で十分に冷却することで、熱可塑性樹脂が固化し、後述の溶解工程や分離工程等において熱可塑性樹脂含有粒子(熱可塑性樹脂)どうしが融着し難くなる。なお、冷却工程では、混練物の内部まで均一な温度となるように冷却することが好ましい。
1-3. Cooling step After the kneading step, the kneaded product is cooled to below its softening point. In this step, the kneaded product is preferably cooled to a temperature 110 ° C. or more lower than the softening point, and more preferably 120 ° C. or lower. By sufficiently cooling in the cooling step, the thermoplastic resin is solidified, and the thermoplastic resin-containing particles (thermoplastic resin) are hardly fused in the dissolution step and the separation step described later. In the cooling step, it is preferable to cool the kneaded product so that the temperature is uniform.

 混練物は、徐冷してもよく、急冷してもよい。混練物の冷却方法は特に制限されず、例えば混練物を室温に放置することで、冷却してもよく、公知の冷却装置等を用いて冷却してもよい。混練物は徐冷したほうが、粒子がゆっくり成長するため好ましく、室温に放置する方法が特に好ましい。 The kneaded product may be slowly cooled or rapidly cooled. The method for cooling the kneaded product is not particularly limited. For example, the kneaded product may be cooled by leaving it at room temperature, or may be cooled using a known cooling device or the like. Slowly cooling the kneaded product is preferable because the particles grow slowly, and a method of leaving the mixture at room temperature is particularly preferable.

 1-4.溶解工程
 上記冷却工程後、上述の混練物を、水または有機溶媒を含む第1の溶媒と混合し、水溶性樹脂を第1の溶媒に溶解させる。
1-4. Dissolution Step After the cooling step, the kneaded product is mixed with a first solvent containing water or an organic solvent, and the water-soluble resin is dissolved in the first solvent.

 第1の溶媒は、水溶性樹脂を溶解可能であり、かつ熱可塑性樹脂を溶解しない溶媒であればよく、水、もしくは、アセトニトリルや、ジクロロメタン、メタノール、エタノール、トルエン、テトラヒドロフラン、アセトン、酢酸エチル等の有機溶媒とすることができる。第1の溶媒には、これらが一種の含まれていてもよく、二種以上含まれていてもよい。これらの中でも、水溶性樹脂を溶解させやすいとの観点で、アセトニトリル、ジクロロメタン、メタノール、エタノール、トルエン、テトラヒドロフラン、およびアセトンが好ましい。 The first solvent may be any solvent that can dissolve the water-soluble resin and does not dissolve the thermoplastic resin, such as water, acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, acetone, ethyl acetate, or the like. It can be an organic solvent. One kind of these may be contained in the first solvent, or two or more kinds thereof may be contained. Among these, acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, and acetone are preferable from the viewpoint that the water-soluble resin is easily dissolved.

 第1の溶媒に水溶性樹脂を溶解させる方法としては、上述の混練物を第1の溶媒に浸漬させる方法等とすることができる。このとき、水溶性樹脂が溶解しやすいように、混練物をクラッシャー等で破砕してから、第1の溶媒に浸漬させてもよい。さらに、混練物を浸漬後、必要に応じて第1の溶媒を攪拌してもよい。 As a method of dissolving the water-soluble resin in the first solvent, a method of immersing the kneaded material in the first solvent can be used. At this time, the kneaded product may be crushed with a crusher or the like and then immersed in the first solvent so that the water-soluble resin is easily dissolved. Furthermore, after the kneaded product is immersed, the first solvent may be stirred as necessary.

 第1の溶媒と混練物とを混合する際の第1の溶媒の温度は、第1の溶媒の沸点以下の温度であればよく、必要に応じて加熱してもよい。例えば、第1の溶媒として、酢酸エチルまたはエタノールを用いる場合には、水溶性樹脂の第1の溶媒への溶解性を高める観点から、第1の溶媒を50℃以上に加熱して、混練物と混合することが好ましい。一方、その他の溶媒を用いる場合には、室温で第1の溶媒と上述の混練物とを混合してもよい。 The temperature of the first solvent at the time of mixing the first solvent and the kneaded material may be a temperature not higher than the boiling point of the first solvent, and may be heated as necessary. For example, when ethyl acetate or ethanol is used as the first solvent, the first solvent is heated to 50 ° C. or higher from the viewpoint of enhancing the solubility of the water-soluble resin in the first solvent, and then kneaded. It is preferable to mix with. On the other hand, when other solvents are used, the first solvent and the kneaded material described above may be mixed at room temperature.

 第1の溶媒と混練物とを接触させる時間は、水溶性樹脂の溶解性等に応じて適宜選択されるが、通常1~5時間とすることができ、3~7時間とすることがより好ましい。なお、溶解工程では、熱可塑性樹脂含有粒子中の水溶性樹脂の量が、当該熱可塑性樹脂含有粒子の質量に対して0.001%~5質量%以下となるように、水溶性樹脂を溶解させることが好ましい。水溶性樹脂の量が0.001%~5質量%以下となると、熱可塑性樹脂含有粒子を用いて立体造形物を作製した際に、立体造形物の強度等が十分に高くなりやすい。熱可塑性樹脂含有粒子中の水溶性樹脂の量は、NMR測定により熱可塑性樹脂由来のピークと水溶性樹脂由来のピークを比較することで特定することができる。 The time for bringing the first solvent into contact with the kneaded product is appropriately selected according to the solubility of the water-soluble resin and the like, but can be usually 1 to 5 hours, and more preferably 3 to 7 hours. preferable. In the dissolving step, the water-soluble resin is dissolved so that the amount of the water-soluble resin in the thermoplastic resin-containing particles is 0.001% to 5% by mass or less with respect to the mass of the thermoplastic resin-containing particles. It is preferable to make it. When the amount of the water-soluble resin is 0.001% to 5% by mass or less, the strength or the like of the three-dimensional model is likely to be sufficiently high when the three-dimensional model is manufactured using the thermoplastic resin-containing particles. The amount of the water-soluble resin in the thermoplastic resin-containing particles can be specified by comparing the peak derived from the thermoplastic resin and the peak derived from the water-soluble resin by NMR measurement.

 1-5.分離工程
 溶解工程後、溶液中に含まれる固形分を分離し、熱可塑性樹脂含有粒子を得る。固形分の分離方法は特に制限されず、例えば遠心分離や、濾過、もしくはこれらの組み合わせ等とすることができる。熱可塑性樹脂含有粒子を必要に応じて、公知の乾燥方法で乾燥させてもよい。
1-5. Separation step After the dissolution step, the solid content contained in the solution is separated to obtain thermoplastic resin-containing particles. The solid content separation method is not particularly limited, and can be, for example, centrifugal separation, filtration, or a combination thereof. If necessary, the thermoplastic resin-containing particles may be dried by a known drying method.

 1-6.洗浄工程
 上述の分離工程後、必要に応じて、得られた熱可塑性樹脂含有粒子を洗浄する洗浄工程を行ってもよい。洗浄工程は、例えば水または有機溶媒を含む第2の溶媒で、熱可塑性樹脂含有粒子を洗浄する工程とすることができる。
1-6. Washing step After the separation step described above, a washing step for washing the obtained thermoplastic resin-containing particles may be performed as necessary. The washing step can be a step of washing the thermoplastic resin-containing particles with a second solvent containing, for example, water or an organic solvent.

 洗浄工程を行うことにより、熱可塑性樹脂含有粒子中の水溶性樹脂をさらに除去し、熱可塑性樹脂含有粒子中の熱可塑性樹脂量を高めることができる。その結果、当該熱可塑性樹脂含有粒子を用いて作製される立体造形物の強度を高めること等が可能となる。 By performing the washing step, the water-soluble resin in the thermoplastic resin-containing particles can be further removed, and the amount of the thermoplastic resin in the thermoplastic resin-containing particles can be increased. As a result, it is possible to increase the strength of the three-dimensional structure produced using the thermoplastic resin-containing particles.

 洗浄工程は、分離工程で分離された熱可塑性樹脂含有粒子を、第2の溶媒に浸漬する工程等とすることができる。第2の溶媒としては、上述の第1の溶媒と同様のものを用いることができる。なお、第1の溶媒および第2の溶媒は、同一であってもよく、異なってもよい。 The washing step can be a step of immersing the thermoplastic resin-containing particles separated in the separation step in a second solvent. As the second solvent, the same solvents as those described above can be used. Note that the first solvent and the second solvent may be the same or different.

 また、洗浄工程を行う際の第2の溶媒の温度は、第2の溶媒の沸点以下の温度であればよく、必要に応じて適宜加熱してもよい。例えば、第2の溶媒として、酢酸エチルまたはエタノールを用いる場合には、第2の溶媒に対する水溶性樹脂の溶解性を高める観点から、第2の溶媒を50℃以上に加熱することが好ましい。一方、その他の溶媒を用いる場合には、室温で第2の溶媒と熱可塑性樹脂含有粒子とを混合してもよい。 Further, the temperature of the second solvent at the time of performing the washing step may be a temperature not higher than the boiling point of the second solvent, and may be appropriately heated as necessary. For example, when ethyl acetate or ethanol is used as the second solvent, it is preferable to heat the second solvent to 50 ° C. or higher from the viewpoint of enhancing the solubility of the water-soluble resin in the second solvent. On the other hand, when other solvents are used, the second solvent and the thermoplastic resin-containing particles may be mixed at room temperature.

 溶解工程では、熱可塑性樹脂含有粒子中の水溶性樹脂の量が、当該熱可塑性樹脂含有粒子の質量に対して5質量%以下となるように、熱可塑性樹脂含有粒子を洗浄することが好ましい。水溶性樹脂の量が5質量%以下となると、熱可塑性樹脂含有粒子を用いて立体造形物を作製した際に、立体造形物の強度等が十分に特に高くなりやすい。熱可塑性樹脂含有粒子中の水溶性樹脂の量は、上述と同様の方法で特定することができる。 In the dissolving step, the thermoplastic resin-containing particles are preferably washed so that the amount of the water-soluble resin in the thermoplastic resin-containing particles is 5% by mass or less with respect to the mass of the thermoplastic resin-containing particles. When the amount of the water-soluble resin is 5% by mass or less, the strength and the like of the three-dimensional model are likely to be sufficiently high when the three-dimensional model is manufactured using the thermoplastic resin-containing particles. The amount of the water-soluble resin in the thermoplastic resin-containing particles can be specified by the same method as described above.

 1-7.溶媒回収工程(第1溶媒回収工程および第2溶媒回収工程)
 また、上述の溶解工程および洗浄工程後、必要に応じて、第1の溶媒および/または第2の溶媒(これらをまとめて単に「溶媒」とも称する)を回収する溶媒回収工程を行ってもよい。本工程では、水溶性樹脂が溶解した第1の溶媒や第2の溶媒から水溶性樹脂を除去し、各溶媒を再利用する。
1-7. Solvent recovery step (first solvent recovery step and second solvent recovery step)
In addition, after the above-described dissolution step and washing step, a solvent recovery step for recovering the first solvent and / or the second solvent (collectively referred to simply as “solvent”) may be performed as necessary. . In this step, the water-soluble resin is removed from the first solvent and the second solvent in which the water-soluble resin is dissolved, and each solvent is reused.

 溶媒の回収方法は特に制限されず、例えば蒸留法等により、溶媒と水溶性樹脂とを分離し、溶媒を分取する方法等とすることができる。なお、第1の溶媒および第2の溶媒が同じである場合には、これらをまとめて回収してもよい。 The method for recovering the solvent is not particularly limited. For example, the solvent and the water-soluble resin can be separated by distillation or the like, and the solvent can be collected. In addition, when the 1st solvent and the 2nd solvent are the same, you may collect | recover these collectively.

 2.立体造形用樹脂組成物
 上述の方法で製造される熱可塑性樹脂含有粒子は、立体造形用樹脂組成物に適用することが可能である。以下、熱可塑性樹脂含有粒子を含む立体造形用樹脂組成物について説明する。本発明の立体造形用樹脂組成物は、粉末床溶融結合法やMJF法等、熱可塑性樹脂含有粒子を溶融結合させて立体造形物を製造する方法に用いられる。当該立体造形用樹脂組成物は、熱可塑性樹脂含有粒子と、必要に応じて各種添加剤やフローエージェント等を含む組成物とすることができる。
2. Three-dimensional modeling resin composition The thermoplastic resin-containing particles produced by the above-described method can be applied to a three-dimensional modeling resin composition. Hereinafter, the resin composition for three-dimensional model | molding containing a thermoplastic resin containing particle is demonstrated. The resin composition for three-dimensional model | molding of this invention is used for the method of melt-bonding thermoplastic resin containing particle | grains, such as a powder bed fusion | bonding method and a MJF method, and manufacturing a three-dimensional molded item. The three-dimensional modeling resin composition can be a composition containing thermoplastic resin-containing particles and various additives, a flow agent, and the like as necessary.

 上記熱可塑性樹脂含有粒子には、熱可塑性樹脂と、耐熱温度130℃以上200℃以下の水溶性樹脂とが含まれ、熱可塑性樹脂含有粒子全量に対する水溶性樹脂の量は0.001質量%以上5質量%以下である。熱可塑性樹脂含有粒子に、水溶性樹脂が0.001質量%以上含まれると、造形時に熱可塑性樹脂含有粒子中の水溶性樹脂が軟化することで、界面の融着性が向上し、破断伸びが向上するという効果がある。さらに、水溶性樹脂によって造形物表面の結晶化が抑制されるという効果もある。一方で、水溶性樹脂の量が5質量%以下であるため、作製される立体造形物の耐熱性や機械的強度が良好になる。上記水溶性樹脂の量は、0.001~3質量%であることがより好ましく、0.001~1質量%であることがさらに好ましい。当該熱可塑性樹脂含有粒子は、上述の熱可塑性樹脂含有粒子の製造方法で製造されるため、ここでの詳細な説明は省略する。 The thermoplastic resin-containing particles include a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or more and 200 ° C. or less, and the amount of the water-soluble resin with respect to the total amount of the thermoplastic resin-containing particles is 0.001% by mass or more. 5% by mass or less. If the thermoplastic resin-containing particles contain 0.001% by mass or more of a water-soluble resin, the water-soluble resin in the thermoplastic resin-containing particles is softened during molding, thereby improving the interfacial fusion property and breaking elongation. Has the effect of improving. Furthermore, there is an effect that crystallization of the surface of the molded article is suppressed by the water-soluble resin. On the other hand, since the amount of the water-soluble resin is 5% by mass or less, the heat resistance and mechanical strength of the three-dimensional model to be manufactured are improved. The amount of the water-soluble resin is more preferably 0.001 to 3% by mass, and further preferably 0.001 to 1% by mass. Since the thermoplastic resin-containing particles are produced by the above-described method for producing thermoplastic resin-containing particles, detailed description thereof is omitted here.

 立体造形用樹脂組成物に必要に応じて含まれるフィラーは、本発明の目的および効果を損なわない限り特に制限されない。立体造形用樹脂組成物にフィラーが含まれると、立体造形物作製時に照射するエネルギーが伝わりやすくなったり、得られる立体造形物の強度が高まったりする。 The filler included in the three-dimensional modeling resin composition as needed is not particularly limited as long as the object and effect of the present invention are not impaired. When the filler is contained in the three-dimensional modeling resin composition, the energy irradiated at the time of three-dimensional modeling is easily transmitted, or the strength of the three-dimensional modeling obtained is increased.

 フィラーの例には、タルク、炭酸カルシウム、炭酸亜鉛、ワラストナイト、シリカ、アルミナ、酸化マグネシウム、ケイ酸カルシウム、アルミン酸ナトリウム、アルミン酸カルシウム、アルミノ珪酸ナトリウム、珪酸マグネシウム、ガラスバルーン、ガラスカットファイバー、ガラスミルドファイバー、ガラスフレーク、ガラス粉末、炭化ケイ素、窒化ケイ素、石膏、石膏ウィスカー、焼成カオリン、カーボンブラック、酸化亜鉛、三酸化アンチモン、ゼオライト、ハイドロタルサイト、金属繊維、金属ウィスカー、金属粉、セラミックウィスカー、チタン酸カリウム、窒化ホウ素、グラファイト、層状粘土鉱物、炭素繊維等の無機フィラー;多糖類のナノファイバー等の有機フィラー;各種ポリマー等が含まれる。立体造形用樹脂組成物には、フィラーが一種のみ含まれていてもよく、二種以上含まれていてもよい。 Examples of fillers include talc, calcium carbonate, zinc carbonate, wollastonite, silica, alumina, magnesium oxide, calcium silicate, sodium aluminate, calcium aluminate, sodium aluminosilicate, magnesium silicate, glass balloon, glass cut fiber , Glass milled fiber, glass flake, glass powder, silicon carbide, silicon nitride, gypsum, gypsum whisker, calcined kaolin, carbon black, zinc oxide, antimony trioxide, zeolite, hydrotalcite, metal fiber, metal whisker, metal powder, Inorganic fillers such as ceramic whiskers, potassium titanate, boron nitride, graphite, layered clay minerals, carbon fibers; organic fillers such as polysaccharide nanofibers; various polymers, and the like. In the three-dimensional modeling resin composition, only one kind of filler may be contained, or two or more kinds may be contained.

 フィラーの平均粒子径は、立体造形物作製時に、熱可塑性樹脂含有粒子どうしの結合を阻害しないとの観点から0.01~50μm程度であることが好ましい。フィラーの平均粒子径は、体積平均粒子径であり、立体造形用樹脂組成物から、熱可塑性樹脂含有粒子を溶媒等によって除去した後、レーザ回折式粒度分布測定装置等にて測定することで特定できる。 The average particle diameter of the filler is preferably about 0.01 to 50 μm from the viewpoint of not inhibiting the bonding between the thermoplastic resin-containing particles during the production of the three-dimensional structure. The average particle diameter of the filler is the volume average particle diameter, and is determined by measuring with a laser diffraction particle size distribution measuring device after removing the thermoplastic resin-containing particles from the three-dimensional resin composition with a solvent or the like. it can.

 フィラーは、上記の中でも、立体造形物作製時に照射するエネルギーの伝導性が良好であり、かつ立体造形物の機械的強度および延性を高めやすいとの観点から、直径が1~1000nmである球状粒子、厚みが1~1000nmである平板状粒子、もしくは繊維径が1~1000nmである繊維状粒子であることが好ましい。 Among the above, the filler is a spherical particle having a diameter of 1 to 1000 nm from the viewpoint of good conductivity of the energy irradiated during preparation of the three-dimensional structure, and easy improvement of the mechanical strength and ductility of the three-dimensional structure. Further, it is preferably a tabular particle having a thickness of 1 to 1000 nm or a fiber particle having a fiber diameter of 1 to 1000 nm.

 球状粒子は、無機材料からなる粒子、有機材料からなる粒子のいずれであってもよく、その例には、シリカ微粒子、アルミナ微粒子、酸化チタン微粒子、ジルコニア微粒子等が含まれる。 The spherical particles may be either particles made of an inorganic material or particles made of an organic material, and examples thereof include silica fine particles, alumina fine particles, titanium oxide fine particles, zirconia fine particles and the like.

 フィラーが平板状粒子である場合、平板状粒子の厚みは、50~500nmであることがより好ましく、100~400nmであることがさらに好ましく、150~300nmであることが特に好ましい。本明細書において、平板状粒子とは、対向する2つの主平面を有し、これら2つの主平面の間の距離(厚み)が、主平面の最大径および最小径に対して十分に小さい粒子をいう。 When the filler is a tabular grain, the thickness of the tabular grain is more preferably 50 to 500 nm, further preferably 100 to 400 nm, and particularly preferably 150 to 300 nm. In this specification, tabular grains have two main planes facing each other, and the distance (thickness) between these two main planes is sufficiently small with respect to the maximum diameter and minimum diameter of the main plane. Say.

 また、当該平板状粒子の主平面の形状は、円形状であってもよく、楕円状であってもよく、多角形状であってもよい。平板状粒子の主平面の幅は、1~10μmであることが好ましく、2~8μmであることがより好ましい。また、主平面の最大径と平板状粒子の厚みとの比(主平面の最大径/厚み)は、5~15であることが好ましく、10~12であることがより好ましい。主平面の最大径と、平板状粒子の厚みとの比が上記範囲であると、熱可塑性樹脂含有粒子に対するエネルギー伝導性が良好になりやすく、熱可塑性樹脂含有粒子どうしを溶融結合させやすくなる。 In addition, the shape of the main plane of the tabular grains may be circular, elliptical, or polygonal. The width of the main plane of the tabular grains is preferably 1 to 10 μm, and more preferably 2 to 8 μm. The ratio of the maximum diameter of the main plane to the thickness of the tabular grains (maximum diameter / thickness of the main plane) is preferably 5 to 15, and more preferably 10 to 12. When the ratio between the maximum diameter of the main plane and the thickness of the tabular grains is in the above range, the energy conductivity with respect to the thermoplastic resin-containing particles tends to be good, and the thermoplastic resin-containing particles are easily melt-bonded.

 平板状粒子の例には、上述の層状粘土鉱物(例えば、カオリン;タルク;マイカ;モンモリロナイト、バイデライト、ヘクトライト、サポナイト、ノントロナイト、スチーブンサイト等のスメクタイト系鉱物;バーミキュライト;ベントナイト;カネマイト、ケニアナイト、マカナイト等の層状ケイ酸ナトリウム;Na型テトラシリシックフッ素雲母、Li型テトラシリシックフッ素雲母、Na型フッ素テニオライト、Li型フッ素テニオライト等の雲母族粘土鉱物等)が含まれる。このような平板状粒子は、天然の鉱物から得られたものであってもよく、化学的に合成されたものであってもよい。さらに、平板状粒子は、表面がアンモニウム塩等で修飾(表面処理)されたものであってもよい。 Examples of tabular grains include the above-mentioned layered clay minerals (for example, kaolin; talc; mica; smectite minerals such as montmorillonite, beidellite, hectorite, saponite, nontronite, stevensite; vermiculite; bentonite; kanemite, Kenya. Layered sodium silicate such as knight and macanite; mica group clay minerals such as Na type tetrasilicic fluorine mica, Li type tetrasilicic fluorine mica, Na type fluorine teniolite, Li type fluorine teniolite). Such tabular grains may be obtained from natural minerals or may be chemically synthesized. Further, the tabular grains may be those whose surfaces are modified (surface treatment) with an ammonium salt or the like.

 一方、フィラーが繊維状である場合、その繊維径は、分散性等の観点から3~30nmであることが好ましく、5~20nmであることがより好ましい。また、繊維状フィラーの繊維長は、200~10000nmであることが好ましく、250~10000nmであることがより好ましい。繊維長10000nm以下であると、立体造形物の外観性が良好になりやすい。また、繊維長が200nm以上であると、得られる立体造形物の強度が高まりやすくなる。ここで、繊維状フィラーの例には、炭素繊維、多糖類のナノファイバー等が含まれる。 On the other hand, when the filler is fibrous, the fiber diameter is preferably 3 to 30 nm, more preferably 5 to 20 nm from the viewpoint of dispersibility and the like. Further, the fiber length of the fibrous filler is preferably 200 to 10,000 nm, and more preferably 250 to 10,000 nm. When the fiber length is 10000 nm or less, the appearance of the three-dimensional structure tends to be good. Moreover, the intensity | strength of the three-dimensional molded item obtained as the fiber length is 200 nm or more becomes easy to increase. Here, examples of the fibrous filler include carbon fiber, polysaccharide nanofiber, and the like.

 立体造形用樹脂組成物中のフィラーの量は、熱可塑性樹脂含有粒子の含有量を100質量部としたとき、5~30質量部であることが好ましく、10~25質量部であることがより好ましく、15~20質量部であることがさらに好ましい。フィラーの量が5質量部以上であると、立体造形用樹脂組成物から得られる立体造形物の機械的強度が高まりやすい。一方、フィラーの量が30質量部以上であると、得られる立体造形物の延性が低下しやすい。 The amount of the filler in the resin composition for three-dimensional modeling is preferably 5 to 30 parts by mass, more preferably 10 to 25 parts by mass, when the content of the thermoplastic resin-containing particles is 100 parts by mass. The amount is preferably 15 to 20 parts by mass. When the amount of the filler is 5 parts by mass or more, the mechanical strength of the three-dimensional structure obtained from the three-dimensional resin composition is likely to increase. On the other hand, when the amount of the filler is 30 parts by mass or more, the ductility of the three-dimensional structure to be obtained tends to decrease.

 一方、立体造形用樹脂組成物に必要に応じて含まれる各種添加剤の例には、酸化防止剤、酸性化合物及びその誘導体、滑剤、紫外線吸収剤、光安定剤、核剤、難燃剤、衝撃改良剤、発泡剤、着色剤、有機過酸化物、展着剤、粘着剤等が含まれる。立体造形用樹脂組成物には、これらが一種のみ含まれていてもよく、二種以上含まれていてもよい。また、これらは、本発明の目的を損なわない範囲で、熱可塑性樹脂含有粒子の表面に塗布されていてもよい。 On the other hand, examples of various additives included in the three-dimensional modeling resin composition as necessary include antioxidants, acidic compounds and derivatives thereof, lubricants, ultraviolet absorbers, light stabilizers, nucleating agents, flame retardants, and impacts. An improving agent, a foaming agent, a coloring agent, an organic peroxide, a spreading agent, an adhesive, and the like are included. Only one of these may be contained in the three-dimensional modeling resin composition, or two or more of them may be contained. Moreover, these may be apply | coated to the surface of the thermoplastic resin containing particle | grains in the range which does not impair the objective of this invention.

 また、フローエージェントは、摩擦係数が小さく、自己潤滑性を有する材料であればよい。このようなフローエージェントの例には、二酸化ケイ素および窒化ホウ素が含まれる。立体造形用樹脂組成物には、フローエージェントを一種のみ含まれていてもよく、二種とも含まれていてもよい。フローエージェントの量は、熱可塑性樹脂含有粒子等の流動性を向上させ、かつ熱可塑性樹脂含有粒子の溶融結合が十分に生じる範囲で適宜設定することができる。たとえば、熱可塑性樹脂含有粒子の質量に対して、0質量%より多く2質量%未満とすることができる。 Further, the flow agent may be a material having a small friction coefficient and self-lubricating property. Examples of such flow agents include silicon dioxide and boron nitride. The resin composition for three-dimensional modeling may contain only one type of flow agent or two types of flow agents. The amount of the flow agent can be appropriately set within a range in which the fluidity of the thermoplastic resin-containing particles and the like is improved and the melt bonding of the thermoplastic resin-containing particles is sufficiently generated. For example, it can be more than 0% by mass and less than 2% by mass with respect to the mass of the thermoplastic resin-containing particles.

 また、後述の粉末床溶融結合法に用いる立体造形用樹脂組成物には、レーザ吸収剤等が含まれていてもよい。レーザ吸収剤の例には、カーボン粉末、ナイロン樹脂粉末、顔料、および染料等が含まれる。立体造形用樹脂組成物には、レーザ吸収剤が一種類のみ含まれていてもよく、二種類以上含まれていてもよい。 Further, the three-dimensional modeling resin composition used in the powder bed melt bonding method described later may contain a laser absorber or the like. Examples of the laser absorber include carbon powder, nylon resin powder, pigment, dye, and the like. The three-dimensional modeling resin composition may contain only one type of laser absorber, or may contain two or more types.

 3.立体造形物の製造方法
 上述の立体造形用樹脂組成物は、前述のように、粉末床結合溶融方式、またはMJF方式による立体造形物の製造方法に用いることができる。以下、上記樹脂組成物を用いた立体造形方法について、それぞれ説明するが、本発明は、これらの方法に制限されない。
3. Manufacturing method of three-dimensional modeled object As described above, the resin composition for three-dimensional modeled object can be used in a method for manufacturing a three-dimensional modeled object by the powder bed bonding melting method or the MJF method. Hereinafter, although the three-dimensional modeling method using the said resin composition is each demonstrated, this invention is not restrict | limited to these methods.

 3-1.粉末床結合溶融方式による立体造形物の製造方法
 粉末床結合溶融方式による立体造形物の製造方法では、前記立体造形用樹脂組成物を用いる以外は、通常の粉末床結合溶融方式と同様に行うことができる。具体的には、(1)前述の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、(2)当該薄層にレーザ光を選択的に照射して、熱可塑性樹脂含有粒子どうしが溶融結合した造形物層を形成するレーザ光照射工程と、を含む方法とすることができる。そして工程(1)および工程(2)を複数回繰り返し、造形物層を積層することで、立体造形物を製造することができる。なお、当該立体造形物の製造方法は、必要に応じて、他の工程を含んでいてもよく、例えば立体造形用樹脂組成物を予備加熱する工程等を含んでいてもよい。
3-1. Method for manufacturing a three-dimensional structure by a powder bed bonding melting method In a method for manufacturing a three-dimensional structure by a powder bed bonding melting method, the method is the same as a normal powder bed bonding melting method except that the resin composition for three-dimensional modeling is used. Can do. Specifically, (1) a thin layer forming step of forming a thin layer containing the resin composition for three-dimensional modeling described above, and (2) a thermoplastic resin containing by selectively irradiating the thin layer with laser light And a laser beam irradiation step of forming a shaped article layer in which particles are melt-bonded. And a three-dimensional molded item can be manufactured by repeating a process (1) and a process (2) in multiple times, and laminating | stacking a molded article layer. In addition, the manufacturing method of the said three-dimensional molded item may include the other process as needed, for example, may include the process etc. which preheat the resin composition for three-dimensional modeling.

 ・薄層形成工程(工程(1))
 本工程では、立体造形用樹脂組成物を含む薄層を形成する。たとえば、立体造形装置の粉末供給部から供給された立体造形用樹脂組成物を、リコータによって造形ステージ上に平らに敷き詰める。薄層は、造形ステージ上に直接形成してもよいし、すでに敷き詰められている立体造形用樹脂組成物、またはすでに形成されている造形物層の上に形成してもよい。なお、上記立体造形用樹脂組成物に、必要に応じて別途、フローエージェントやレーザ吸収剤を混合して薄層を形成してもよい。
・ Thin layer formation process (process (1))
In this step, a thin layer containing the three-dimensional modeling resin composition is formed. For example, the resin composition for three-dimensional modeling supplied from the powder supply unit of the three-dimensional modeling apparatus is laid flat on the modeling stage by a recoater. The thin layer may be formed directly on the modeling stage, or may be formed on the resin composition for three-dimensional modeling that has already been spread, or on the modeling object layer that has already been formed. In addition, you may mix a flow agent and a laser absorber with the said resin composition for three-dimensional modeling separately as needed, and may form a thin layer.

 薄層の厚さは、所望の造形物層の厚さと同じとする。薄層の厚さは、製造しようとする立体造形物の精度に応じて任意に設定することができるが、通常、0.01mm以上0.30mm以下である。薄層の厚さを0.01mm以上とすることで、次の造形物層を形成するためのレーザ光照射によって下の層の立体造形用樹脂組成物が溶融結合することを防ぐことができ、さらには均一な敷き詰めが可能となる。また、薄層の厚さを0.30mm以下とすることで、レーザ光のエネルギーを薄層の下部まで伝導させて、薄層を構成する立体造形用樹脂組成物を、厚み方向の全体にわたって十分に溶融結合させることができる。前記観点からは、薄層の厚さは0.01mm以上0.10mm以下であることがより好ましい。また、十分に立体造形用樹脂組成物を溶融結合させ、造形物層の割れをより生じ難くする観点からは、薄層の厚さと、後述するレーザ光のビームスポット径との差が0.10mm以内になるよう、薄層の厚さを設定することが好ましい。 The thickness of the thin layer is the same as the thickness of the desired object layer. Although the thickness of a thin layer can be arbitrarily set according to the precision of the three-dimensional molded item to manufacture, it is 0.01 mm or more and 0.30 mm or less normally. By making the thickness of the thin layer 0.01 mm or more, it is possible to prevent the resin composition for three-dimensional modeling of the lower layer from being melt-bonded by laser light irradiation for forming the next modeled product layer, Furthermore, uniform spread is possible. In addition, by setting the thickness of the thin layer to 0.30 mm or less, the energy of the laser beam is conducted to the lower portion of the thin layer, and the three-dimensional modeling resin composition constituting the thin layer is sufficient over the entire thickness direction. Can be melt bonded. From the above viewpoint, the thickness of the thin layer is more preferably 0.01 mm or more and 0.10 mm or less. Further, from the viewpoint of sufficiently melt-bonding the resin composition for three-dimensional modeling and making it difficult to cause cracks in the modeled object layer, the difference between the thickness of the thin layer and the beam spot diameter of the laser beam described later is 0.10 mm. It is preferable to set the thickness of the thin layer so as to be within the range.

 ・レーザ光照射工程(工程(2))
 本工程では、立体造形用樹脂組成物を含む薄層のうち、造形物層を形成すべき位置にレーザ光を選択的に照射し、照射された位置の熱可塑性樹脂含有粒子を溶融結合させて造形物層を形成する。このとき、レーザ光のエネルギーを受け取った立体造形用樹脂組成物(熱可塑性樹脂含有粒子)は、すでに形成された造形物層とも溶融結合するため、隣り合う層間の接着も生じる。
・ Laser beam irradiation process (process (2))
In this process, among the thin layers containing the resin composition for three-dimensional modeling, the laser beam is selectively irradiated to the position where the molded article layer is to be formed, and the thermoplastic resin-containing particles at the irradiated position are melt-bonded. A model layer is formed. At this time, since the resin composition for three-dimensional modeling (thermoplastic resin-containing particles) that has received the energy of the laser beam is also melt-bonded to the already formed model layer, adhesion between adjacent layers also occurs.

 レーザ光の波長は、立体造形用樹脂組成物(熱可塑性樹脂含有粒子)が吸収する波長の範囲内で設定すればよい。このとき、レーザ光の波長と、立体造形用樹脂組成物の吸収率が最も高くなる波長との差が小さくなるように設定することが好ましいが、一般的に熱可塑性樹脂は様々な波長域の光を吸収するため、COレーザ等の波長帯域の広いレーザ光を用いることが好ましい。たとえば、レーザ光の波長は、例えば0.8μm以上12μm以下とすることができる。 What is necessary is just to set the wavelength of a laser beam within the range of the wavelength which the resin composition for three-dimensional modeling (thermoplastic resin containing particle | grains) absorbs. At this time, it is preferable to set so that the difference between the wavelength of the laser beam and the wavelength at which the absorption rate of the three-dimensional modeling resin composition is the highest, but in general, the thermoplastic resin has various wavelength ranges. In order to absorb light, it is preferable to use laser light having a wide wavelength band such as a CO 2 laser. For example, the wavelength of the laser beam can be, for example, not less than 0.8 μm and not more than 12 μm.

 レーザ光の出力時のパワーは、後述するレーザ光の走査速度において、前記立体造形用樹脂組成物(熱可塑性樹脂含有粒子)が十分に溶融結合する範囲内で設定すればよい。具体的には、5.0W以上60W以下とすることができる。レーザ光のエネルギーを低くして、製造コストを低くし、かつ、製造装置の構成を簡易なものにする観点からは、レーザ光の出力時のパワーは30W以下であることが好ましく、20W以下であることがより好ましい。 The power at the time of laser beam output may be set within a range in which the three-dimensional modeling resin composition (thermoplastic resin-containing particles) is sufficiently melt-bonded at the laser beam scanning speed described later. Specifically, it can be set to 5.0 W or more and 60 W or less. From the viewpoint of reducing the energy of the laser beam, reducing the manufacturing cost, and simplifying the configuration of the manufacturing apparatus, the power at the output of the laser beam is preferably 30 W or less, preferably 20 W or less. More preferably.

 レーザ光の走査速度は、製造コストを高めず、かつ、装置構成を過剰に複雑にしない範囲内で設定すればよい。具体的には、1m/秒以上10m/秒以下とすることが好ましく、2m/秒以上8m/秒以下とすることがより好ましく、3m/秒以上7m/秒以下とすることがさらに好ましい。
 レーザ光のビーム径は、製造しようとする立体造形物の精度に応じて適宜設定することができる。
The scanning speed of the laser light may be set within a range that does not increase the manufacturing cost and does not excessively complicate the apparatus configuration. Specifically, it is preferably 1 m / second or more and 10 m / second or less, more preferably 2 m / second or more and 8 m / second or less, and further preferably 3 m / second or more and 7 m / second or less.
The beam diameter of the laser light can be appropriately set according to the accuracy of the three-dimensional structure to be manufactured.

 ・工程(1)および工程(2)の繰返しについて
 立体造形物の製造の際には、上述の工程(1)および工程(2)を、任意の回数繰り返す。これにより、造形物層が積層されて、所望の立体造形物が得られることとなる。
-About repetition of a process (1) and a process (2) In the case of manufacture of a three-dimensional molded item, the above-mentioned process (1) and a process (2) are repeated arbitrary times. Thereby, a modeling object layer is laminated | stacked and a desired three-dimensional modeling object will be obtained.

 ・予備加熱工程
 前述のように、粉末床結合溶融方式による立体造形物の製造方法では、立体造形用樹脂組成物を予備加熱する工程を行ってもよい。立体造形用樹脂組成物の予備加熱は、上記薄層形成(工程(1))後に行ってもよく、薄層形成(工程(1))前に行ってもよい。また、これらの両方で行ってもよい。
-Preheating process As mentioned above, in the manufacturing method of the three-dimensional molded item by a powder bed coupling | bonding fusion method, you may perform the process of preheating the three-dimensional modeling resin composition. The preheating of the three-dimensional modeling resin composition may be performed after the thin layer formation (step (1)) or before the thin layer formation (step (1)). Moreover, you may carry out by both of these.

 予備加熱温度は、立体造形用樹脂組成物(熱可塑性樹脂含有粒子)どうしが溶融結合しないように、熱可塑性樹脂含有粒子に含まれる熱可塑性樹脂の溶融温度より低い温度とする。予備加熱温度は、熱可塑性樹脂の溶融温度に応じて適宜選択され、例えば、50℃以上300℃以下とすることができ、100℃以上230℃以下であることがより好ましく、150℃以上190℃以下であることがさらに好ましい。 The preheating temperature is set to a temperature lower than the melting temperature of the thermoplastic resin contained in the thermoplastic resin-containing particles so that the resin composition for three-dimensional modeling (thermoplastic resin-containing particles) is not melt-bonded. The preheating temperature is appropriately selected according to the melting temperature of the thermoplastic resin, and can be, for example, 50 ° C. or higher and 300 ° C. or lower, more preferably 100 ° C. or higher and 230 ° C. or lower, and 150 ° C. or higher and 190 ° C. or lower. More preferably, it is as follows.

 またこのとき、加熱時間は1~30秒とすることが好ましく、5~20秒とすることがより好ましい。上記温度で上記時間、予備加熱を行うことで、レーザエネルギー照射時に立体造形用樹脂組成物(熱可塑性樹脂含有粒子)が溶融するまでの時間を短くすることができ、少ないレーザエネルギー量で立体造形物を製造することが可能となる。 At this time, the heating time is preferably 1 to 30 seconds, more preferably 5 to 20 seconds. By performing preheating at the above temperature for the above time, it is possible to shorten the time until the resin composition for three-dimensional modeling (thermoplastic resin-containing particles) melts at the time of laser energy irradiation, and three-dimensional modeling with a small amount of laser energy. It becomes possible to manufacture a thing.

 ・その他
 なお、溶融結合中の立体造形用樹脂組成物の酸化等によって、立体造形物の強度が低下することを防ぐ観点からは、少なくとも工程(2)は減圧下または不活性ガス雰囲気中で行うことが好ましい。減圧するときの圧力は10-2Pa以下であることが好ましく、10-3Pa以下であることがより好ましい。このとき、使用することができる不活性ガスの例には、窒素ガスおよび希ガスが含まれる。これらの不活性ガスのうち、入手の容易さの観点からは、窒素(N)ガス、ヘリウム(He)ガスまたはアルゴン(Ar)ガスが好ましい。製造工程を簡略化する観点からは、工程(1)および工程(2)の両方を減圧下または不活性ガス雰囲気中で行うことが好ましい。
-Others From the viewpoint of preventing the strength of the three-dimensional structure from decreasing due to oxidation of the resin composition for three-dimensional modeling during melt bonding, at least step (2) is performed under reduced pressure or in an inert gas atmosphere. It is preferable. The pressure at which the pressure is reduced is preferably 10 −2 Pa or less, and more preferably 10 −3 Pa or less. At this time, examples of the inert gas that can be used include nitrogen gas and rare gas. Among these inert gases, nitrogen (N 2 ) gas, helium (He) gas, or argon (Ar) gas is preferable from the viewpoint of availability. From the viewpoint of simplifying the production process, it is preferable to perform both step (1) and step (2) under reduced pressure or in an inert gas atmosphere.

 3-2.MJF方式による立体造形物の製造方法
 本実施形態の立体造形物の製造方法は、(1)上述の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、(2)エネルギー吸収剤を含む結合用流体を、薄層の特定の領域に塗布する流体塗布工程と、(3)流体塗布工程後の薄層にエネルギーを照射し、結合用流体を塗布した領域の熱可塑性樹脂含有粒子を溶融結合させて造形物層を形成するエネルギー照射工程と、を含む。なお、当該立体造形物の製造方法は、必要に応じて、他の工程を含んでいてもよく、例えば立体造形用樹脂組成物を予備加熱する工程等を含んでいてもよい。
3-2. Manufacturing method of three-dimensional modeled object by MJF method The manufacturing method of the three-dimensional modeled object of this embodiment is (1) the thin layer formation process which forms the thin layer containing the resin composition for three-dimensional modeling mentioned above, and (2) energy absorption. A fluid application step in which a bonding fluid containing an agent is applied to a specific region of the thin layer; and (3) a thermoplastic resin in the region where the bonding fluid is applied by irradiating energy to the thin layer after the fluid application step. An energy irradiation step of forming particles by melting and bonding the particles. In addition, the manufacturing method of the said three-dimensional molded item may include the other process as needed, for example, may include the process etc. which preheat the resin composition for three-dimensional modeling.

 (1)薄層形成工程
 本工程では、上述の立体造形用樹脂組成物を主に含む薄層を形成する。薄層の形成方法は、所望の厚みの層を形成可能であれば特に制限されない。例えば、本工程は、立体造形装置の樹脂組成物供給部から供給された立体造形用樹脂組成物を、リコータによって造形ステージ上に平らに敷き詰める工程とすることができる。薄層は、造形ステージ上に直接形成してもよいし、すでに敷き詰められている立体造形用樹脂組成物またはすでに形成されている造形物層の上に接するように形成してもよい。
(1) Thin layer formation process In this process, the thin layer which mainly contains the above-mentioned three-dimensional modeling resin composition is formed. The method for forming the thin layer is not particularly limited as long as a layer having a desired thickness can be formed. For example, this step can be a step in which the resin composition for three-dimensional modeling supplied from the resin composition supply unit of the three-dimensional modeling apparatus is laid flat on the modeling stage by the recoater. The thin layer may be formed directly on the modeling stage, or may be formed so as to be in contact with the resin composition for three-dimensional modeling that has already been laid or the modeling object layer that has already been formed.

 薄層の厚さは、所望の造形物層の厚さと同じとする。薄層の厚さは、製造しようとする立体造形物の精度に応じて任意に設定することができるが、通常、0.01mm以上0.30mm以下である。薄層の厚さを0.01mm以上とすることで、新たな造形物層を形成するためのエネルギー照射(後述のエネルギー照射工程におけるエネルギー照射)によって、既に作製した造形物層が溶融することを防ぐことができる。また、薄層の厚さが0.01mm以上であると、立体造形用樹脂組成物を均一に敷き詰めやすくなる。また、薄層の厚さを0.30mm以下とすることで、後述のエネルギー照射工程において、エネルギー(例えば赤外光)を薄層の下部まで伝導させることが可能となる。これにより、所望の領域(結合用流体を塗布する領域)の熱可塑性樹脂含有粒子を、厚み方向の全体にわたって溶融させることが可能となる。前記観点からは、薄層の厚さは0.01mm以上0.20mm以下であることがより好ましい。 The thickness of the thin layer is the same as the thickness of the desired object layer. Although the thickness of a thin layer can be arbitrarily set according to the precision of the three-dimensional molded item to manufacture, it is 0.01 mm or more and 0.30 mm or less normally. By setting the thickness of the thin layer to 0.01 mm or more, the already formed object layer is melted by energy irradiation for forming a new object layer (energy irradiation in the energy irradiation process described later). Can be prevented. Moreover, it becomes easy to spread the resin composition for three-dimensional modeling uniformly as the thickness of a thin layer is 0.01 mm or more. In addition, by setting the thickness of the thin layer to 0.30 mm or less, energy (for example, infrared light) can be conducted to the lower portion of the thin layer in the energy irradiation process described later. Thereby, it becomes possible to melt the thermoplastic resin-containing particles in a desired region (region where the bonding fluid is applied) over the entire thickness direction. From the above viewpoint, the thickness of the thin layer is more preferably 0.01 mm or more and 0.20 mm or less.

 (2)流体塗布工程
 本工程では、上記薄層形成工程で形成した薄層の特定の領域に、エネルギー吸収剤を含む結合用流体を塗布する。このとき、必要に応じて、結合用流体よりエネルギー吸収の少ない剥離用流体を、結合用流体を塗布しない領域に塗布してもよい。具体的には、造形物層を形成すべき位置に選択的に結合用流体を塗布し、造形物層を形成しない領域に、剥離用流体を塗布してもよい。結合用流体を塗布する領域の周囲に隣接して剥離用流体を塗布することで、剥離用流体を塗布した領域では、熱可塑性樹脂含有粒子が溶融結合し難くなる。結合用流体および剥離用流体のうち、どちらを先に塗布してもよいが、得られる立体造形物の寸法精度の観点から、結合用流体を先に塗布することが好ましい。
(2) Fluid application step In this step, a binding fluid containing an energy absorbent is applied to a specific region of the thin layer formed in the thin layer formation step. At this time, if necessary, a peeling fluid that absorbs less energy than the bonding fluid may be applied to a region where the bonding fluid is not applied. Specifically, the bonding fluid may be selectively applied to a position where the shaped article layer is to be formed, and the peeling fluid may be applied to a region where the shaped article layer is not formed. By applying the peeling fluid adjacent to the periphery of the region where the bonding fluid is applied, the thermoplastic resin-containing particles are hardly melt-bonded in the region where the peeling fluid is applied. Either the binding fluid or the peeling fluid may be applied first, but from the viewpoint of dimensional accuracy of the three-dimensional structure to be obtained, it is preferable to apply the binding fluid first.

 結合用流体および剥離用流体の塗布方法は特に制限されず、例えばディスペンサーによる塗布や、インクジェット法による塗布、スプレー塗布等とすることができるが、高速で所望の領域に結合用流体および剥離用流体を塗布可能であるとの観点から少なくとも一方を、インクジェット法で塗布することが好ましく、両方をインクジェット法で塗布することがより好ましい。 The method for applying the bonding fluid and the peeling fluid is not particularly limited. For example, the bonding fluid and the peeling fluid can be applied by a dispenser, the ink jet method, the spray coating, and the like. It is preferable to apply at least one by the ink jet method from the viewpoint that it can be applied, and it is more preferable to apply both by the ink jet method.

 結合用流体および剥離用流体の塗布量は、それぞれ薄層1mm当たり、0.1~50μLであることが好ましく、0.2~40μLであることがより好ましい。結合用流体および剥離用流体の塗布量が当該範囲であると、造形物層を形成する領域、および造形物層を形成しない領域の立体造形用樹脂組成物に、それぞれ結合用流体および剥離用流体を十分に含浸させることができ、寸法精度の良好な立体造形物を形成することができる。 The application amount of the bonding fluid and the peeling fluid is preferably 0.1 to 50 μL, more preferably 0.2 to 40 μL per 1 mm 3 of the thin layer. When the application amounts of the bonding fluid and the peeling fluid are within the ranges, the bonding fluid and the peeling fluid are respectively added to the three-dimensional modeling resin composition in the region where the modeling object layer is formed and in the region where the modeling layer is not formed. Can be sufficiently impregnated, and a three-dimensional modeled object with good dimensional accuracy can be formed.

 本工程で塗布する結合用流体は、従来のMJF方式に用いられる結合用流体と同様とすることができ、例えばエネルギー吸収剤と、溶媒と、を少なくとも含む組成物とすることができる。結合用流体は、必要に応じて公知の分散剤等を含んでいてもよい。 The binding fluid applied in this step can be the same as the binding fluid used in the conventional MJF method, and can be, for example, a composition containing at least an energy absorbent and a solvent. The binding fluid may contain a known dispersant or the like as necessary.

 エネルギー吸収剤は、後述するエネルギー照射工程において照射されるエネルギーを吸収し、結合用流体が塗布された領域の温度を効率的に高めることが可能なものであれば特に制限されない。エネルギー吸収剤の具体例には、カーボンブラック、ITO(スズ酸化インジウム)、ATO(アンチモン酸化スズ)等の赤外線吸収剤、シアニン色素,アルミニウムや亜鉛を中心に持つフタロシアニン色素,各種ナフタロシアニン化合物,平面四配位構造を有するニッケルジチオレン錯体,スクアリウム色素,キノン系化合物,ジインモニウム化合物,アゾ化合物等の赤外線吸収色素が含まれる。これらの中でも、汎用性や結合用流体が塗布された領域の温度を効率的に高めることができるとの観点から、赤外線吸収剤が好ましく、カーボンブラックであることがさらに好ましい。 The energy absorbent is not particularly limited as long as it can absorb the energy irradiated in the energy irradiation step described later and can efficiently increase the temperature of the region where the binding fluid is applied. Specific examples of energy absorbers include infrared absorbers such as carbon black, ITO (indium tin oxide), ATO (antimony tin oxide), cyanine dyes, phthalocyanine dyes centered on aluminum and zinc, various naphthalocyanine compounds, flat surfaces Infrared absorbing dyes such as nickel dithiolene complexes, squalium dyes, quinone compounds, diimmonium compounds and azo compounds having a tetracoordinate structure are included. Among these, from the viewpoint of versatility and the ability to efficiently increase the temperature of the region where the binding fluid is applied, an infrared absorber is preferable, and carbon black is more preferable.

 エネルギー吸収剤の形状は特に制限されないが、粒子状であることが好ましい。また、その平均粒子径は0.1~1.0μmであることが好ましく、0.1~0.5μmであることがより好ましい。エネルギー吸収剤の平均粒子径が過度に大きいと、結合用流体を薄層上に塗布した際、エネルギー吸収剤が熱可塑性樹脂含有粒子の隙間に入り込み難くなる。一方、エネギー吸収剤の平均粒子径が0.1μm以上であると、後述するエネルギー照射工程で、効率良く熱可塑性樹脂含有粒子に熱を伝えることができ、周囲の熱可塑性樹脂含有粒子を溶融させることが可能となる。 The shape of the energy absorber is not particularly limited, but is preferably particulate. The average particle diameter is preferably 0.1 to 1.0 μm, more preferably 0.1 to 0.5 μm. If the average particle size of the energy absorber is excessively large, the energy absorber will not easily enter the gap between the thermoplastic resin-containing particles when the binding fluid is applied onto the thin layer. On the other hand, if the average particle size of the energy absorbent is 0.1 μm or more, heat can be efficiently transferred to the thermoplastic resin-containing particles in the energy irradiation step described later, and the surrounding thermoplastic resin-containing particles are melted. It becomes possible.

 結合用流体は、エネルギー吸収剤を0.1~10.0質量%含むことが好ましく、1.0~5.0質量%含むことがより好ましい。エネルギー吸収剤の量が0.1質量%以上であると、後述のエネルギー照射工程で、結合用流体が塗布された領域の温度を十分に高めることが可能となる。一方、エネルギー吸収剤の量が10.0質量%以下であると、結合用流体内でエネルギー吸収剤が凝集すること等が少なく、結合用流体の塗布安定性が高まりやすくなる。 The binding fluid preferably contains 0.1 to 10.0% by mass of energy absorber, and more preferably 1.0 to 5.0% by mass. When the amount of the energy absorbent is 0.1% by mass or more, it is possible to sufficiently increase the temperature of the region where the binding fluid is applied in the energy irradiation process described later. On the other hand, when the amount of the energy absorbent is 10.0% by mass or less, the energy absorbent is less likely to aggregate in the coupling fluid, and the application stability of the coupling fluid is likely to increase.

 一方、溶媒は、エネルギー吸収剤を分散可能であり、さらに立体造形用樹脂組成物中の熱可塑性樹脂含有粒子(特に熱可塑性樹脂)等を溶解し難い溶媒であれば特に制限されず、例えば水とすることができる。 On the other hand, the solvent is not particularly limited as long as it can disperse the energy absorber and does not dissolve the thermoplastic resin-containing particles (particularly thermoplastic resin) in the resin composition for three-dimensional modeling. It can be.

 結合用流体は、上記溶媒を90.0~99.9質量%含むことが好ましく、95.0~99.0質量%含むことがより好ましい。結合用流体中の溶媒量が90.0質量%以上であると、結合用流体の流動性が高くなり、例えばインクジェット法等で塗布しやすくなる。 The binding fluid preferably contains 90.0 to 99.9% by mass of the solvent, and more preferably 95.0 to 99.0% by mass. When the amount of the solvent in the bonding fluid is 90.0% by mass or more, the fluidity of the bonding fluid increases, and it becomes easy to apply, for example, by an ink jet method.

 結合用流体の粘度は、0.5~50.0mPa・sであることが好ましく、1.0~20.0mPa・sであることがより好ましい。結合用流体の粘度が0.5mPa・s以上であると、結合用流体を薄層に塗布した際の拡散が抑制されやすくなる。一方で、結合用流体の粘度が50.0mPa・s以下であると、結合用流体の塗布安定性が高まりやすくなる。 The viscosity of the binding fluid is preferably 0.5 to 50.0 mPa · s, and more preferably 1.0 to 20.0 mPa · s. When the viscosity of the bonding fluid is 0.5 mPa · s or more, diffusion when the bonding fluid is applied to the thin layer is easily suppressed. On the other hand, when the viscosity of the bonding fluid is 50.0 mPa · s or less, the coating stability of the bonding fluid is likely to increase.

 一方、本工程で塗布する剥離用流体は、相対的に、結合用流体よりエネルギー吸収の少ない流体であればよく、例えば水を主成分とする流体等とすることができる。 On the other hand, the peeling fluid applied in this step may be a fluid that absorbs relatively less energy than the bonding fluid, and may be, for example, a fluid containing water as a main component.

 剥離用流体は、水を90質量%以上含むことが好ましく、95質量%以上含むことがより好ましい。剥離用流体中の水の量が90質量%以上であると、例えばインクジェット法等で塗布しやすくなる。 The peeling fluid preferably contains 90% by mass or more, more preferably 95% by mass or more of water. When the amount of water in the peeling fluid is 90% by mass or more, it becomes easy to apply, for example, by an ink jet method.

 (3)エネルギー照射工程
 本工程では、上記流体塗布工程後の薄層、すなわち結合用流体および剥離用流体が塗布された薄層に、エネルギーを一括照射する。このとき、結合用流体が塗布された領域では、エネルギー吸収剤がエネルギーを吸収し、当該領域の温度が部分的に上昇する。そして、当該領域の熱可塑性樹脂含有粒子のみが溶融し、造形物層が形成される。
(3) Energy irradiation process In this process, energy is collectively irradiated to the thin layer after the fluid application process, that is, the thin layer coated with the bonding fluid and the peeling fluid. At this time, in the region where the binding fluid is applied, the energy absorber absorbs energy, and the temperature of the region partially rises. And only the thermoplastic resin containing particle | grains of the said area | region fuse | melt, and a molded article layer is formed.

 本工程で照射するエネルギーの種類は、結合用流体が含むエネルギー吸収剤の種類に応じて適宜選択される。当該エネルギーの具体例には、赤外光、白色光等が含まれる。これらの中でも、結合用流体を塗布した領域では、効率よく熱可塑性樹脂含有粒子を溶融させることが可能である。一方で、剥離用流体を塗布した領域では、薄層の温度が上昇し難いとの観点から赤外光であることが好ましく、波長780~3000nmの光であることがより好ましく、波長800~2500nmの光であることがより好ましい。 The type of energy irradiated in this step is appropriately selected according to the type of energy absorbent included in the binding fluid. Specific examples of the energy include infrared light and white light. Among these, in the region where the bonding fluid is applied, the thermoplastic resin-containing particles can be efficiently melted. On the other hand, in the region where the peeling fluid is applied, infrared light is preferable from the viewpoint that the temperature of the thin layer does not rise easily, light having a wavelength of 780 to 3000 nm is more preferable, and a wavelength of 800 to 2500 nm is preferable. More preferably, it is light.

 また、本工程でエネルギーを照射する時間は、立体造形用樹脂組成物が含む熱可塑性樹脂含有粒子(特に熱可塑性樹脂)の種類に応じて適宜選択されるが、通常、5~60秒であることが好ましく、10~30秒であることがより好ましい。エネルギー照射時間を5秒以上とすることで、十分に熱可塑性樹脂含有粒子を溶融させて、これらを結合させることが可能となる。一方で、60秒以下とすることで、効率よく立体造形物を製造することが可能となる。 The time for irradiating energy in this step is appropriately selected according to the type of thermoplastic resin-containing particles (particularly thermoplastic resin) contained in the three-dimensional modeling resin composition, but is usually 5 to 60 seconds. It is preferably 10 to 30 seconds. By setting the energy irradiation time to 5 seconds or more, it becomes possible to sufficiently melt the thermoplastic resin-containing particles and bond them. On the other hand, it becomes possible to manufacture a three-dimensional molded item efficiently by setting it as 60 seconds or less.

 ・予備加熱工程
 MJF方式においても、立体造形用樹脂組成物を予備加熱する工程を行ってもよい。立体造形用樹脂組成物の予備加熱は、上記薄層形成(工程(1))後に行ってもよく、薄層形成(工程(1))前に行ってもよい。また、これらの両方で行ってもよい。予備加熱を行うことで、(3)エネルギー照射工程で照射するエネルギー量を少なくすることが可能となる。またさらに、短時間で効率良く造形物層を形成することが可能となる。予備加熱温度は、熱可塑性樹脂の溶融温度より低い温度であり、かつ(2)流体塗布工程で塗布する結合用流体や剥離用流体が含む溶媒の沸点より低い温度であることが好ましい。具体的には、熱可塑性樹脂含有粒子中の熱可塑性樹脂の融点や、結合用流体や剥離用流体が含む溶媒の沸点より、50℃~5℃低い温度であることが好ましく、30℃~5℃低い温度であることがより好ましい。またこのとき、加熱時間は1~60秒とすることが好ましく、3~20秒とすることがより好ましい。加熱温度および加熱時間を上記範囲とすることで、(3)エネルギー照射工程におけるエネルギー照射量を低減することができる。
-Preheating process You may perform the process of preheating the three-dimensional modeling resin composition also in a MJF system. The preheating of the three-dimensional modeling resin composition may be performed after the thin layer formation (step (1)) or before the thin layer formation (step (1)). Moreover, you may carry out by both of these. By performing preheating, it is possible to reduce the amount of energy irradiated in the (3) energy irradiation step. Furthermore, it becomes possible to form a molded article layer efficiently in a short time. The preheating temperature is preferably a temperature lower than the melting temperature of the thermoplastic resin and (2) a temperature lower than the boiling point of the solvent contained in the bonding fluid or the peeling fluid applied in the fluid application step. Specifically, the temperature is preferably 50 ° C. to 5 ° C. lower than the melting point of the thermoplastic resin in the thermoplastic resin-containing particles and the boiling point of the solvent contained in the bonding fluid or the peeling fluid, and 30 ° C. to 5 ° C. It is more preferable that the temperature is lower. At this time, the heating time is preferably 1 to 60 seconds, more preferably 3 to 20 seconds. By making heating temperature and heating time into the said range, the energy irradiation amount in (3) energy irradiation process can be reduced.

 以下において、本発明の具体的な実施例を説明する。なお、これらの実施例によって、本発明の範囲は限定して解釈されない。 Hereinafter, specific examples of the present invention will be described. These examples do not limit the scope of the present invention.

 1.熱可塑性樹脂含有粒子(立体造形用樹脂組成物)の作製
 熱可塑性樹脂の弾性率は、ISO527-1:2017に準拠して、引張試験器により27℃で測定した。
 また、水溶性樹脂の重量平均分子量は、ゲルパーミエーション(GPC、スチレン換算)で特定した。
 水溶性樹脂の耐熱温度は、レオメーターにより、貯蔵弾性率の変化が起きるまで昇温させることにより特定した。
 混合物の軟化点は、示差走査熱量計(DSC)により、10℃/minの条件で0℃から200℃まで昇温させ、10分間アニーリングをし、200℃から0℃まで降温させ、更に0℃から200℃まで昇温させることにより特定した。
1. Production of Thermoplastic Resin-Containing Particles (Resin Composition for Three-Dimensional Modeling) The elastic modulus of the thermoplastic resin was measured at 27 ° C. with a tensile tester according to ISO 527-1: 2017.
Moreover, the weight average molecular weight of water-soluble resin was specified by gel permeation (GPC, styrene conversion).
The heat-resistant temperature of the water-soluble resin was specified by raising the temperature until a change in storage elastic modulus occurred with a rheometer.
The softening point of the mixture was raised from 0 ° C. to 200 ° C. under a differential scanning calorimeter (DSC) at 10 ° C./min, annealed for 10 minutes, lowered from 200 ° C. to 0 ° C., and further 0 ° C. To 200 ° C.

 [実施例1]
 メタロセン系ポリプロピレン樹脂(日本ポリプロ社製、WMH02、弾性率2300MPa)45質量部と、エチレンオキサイド/プロピレンオキサイド(EO・PO)共重合体(明成化学工業社製、EP1010N、耐熱温度200℃、分子量約10万)55質量部と、を混合した。当該混合物の軟化点は、160℃であった。当該混合物を180℃に加熱し、小型混練機(Xplore社製、MC15)にて20分間混練した。
 そして、混練物を30℃まで冷却した後、70℃に加熱した酢酸エチル(第1の溶媒)10Lと混合した。これにより、エチレンオキサイド/プロピレンオキサイド共重合体が酢酸エチルに溶解した。その後、当該溶液を遠心分離にかけ、ポリプロピレン樹脂を含む熱可塑性樹脂含有粒子を分取した。
 さらに、当該熱可塑性樹脂含有粒子を酢酸エチル(第2の溶媒)で洗浄し、ポリプロピレン樹脂を含む熱可塑性樹脂含有粒子1を得た。当該熱可塑性樹脂含有粒子1の平均粒子径は、40μmであった。また、当該熱可塑性樹脂含有粒子1中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、0.01質量%であった。
[Example 1]
45 parts by mass of a metallocene polypropylene resin (manufactured by Nippon Polypro, WMH02, elastic modulus 2300 MPa), an ethylene oxide / propylene oxide (EO / PO) copolymer (manufactured by Meisei Chemical Industry Co., Ltd., EP1010N, heat resistant temperature 200 ° C., molecular weight of about 100,000) and 55 parts by mass. The softening point of the mixture was 160 ° C. The mixture was heated to 180 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15).
The kneaded product was cooled to 30 ° C. and then mixed with 10 L of ethyl acetate (first solvent) heated to 70 ° C. Thereby, the ethylene oxide / propylene oxide copolymer was dissolved in ethyl acetate. Thereafter, the solution was centrifuged, and thermoplastic resin-containing particles containing polypropylene resin were collected.
Further, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 1 containing a polypropylene resin. The average particle diameter of the thermoplastic resin-containing particles 1 was 40 μm. The amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 1 was 0.01% by mass.

 [実施例2]
 混練物と混合する際の第1の溶媒の温度を、27℃とした以外は、実施例1と同様に、熱可塑性樹脂含有粒子2を得た。当該熱可塑性樹脂含有粒子2の平均粒子径は、40μmであった。また、当該熱可塑性樹脂含有粒子2中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、7質量%であった。
[Example 2]
The thermoplastic resin-containing particles 2 were obtained in the same manner as in Example 1 except that the temperature of the first solvent when mixing with the kneaded product was 27 ° C. The average particle diameter of the thermoplastic resin-containing particles 2 was 40 μm. The amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 2 was 7% by mass.

 [実施例3]
 第1の溶媒および第2の溶媒を水とし、混練物と混合する際の第1の溶媒の温度を、27℃とした以外は、実施例1と同様に、熱可塑性樹脂含有粒子3を得た。当該熱可塑性樹脂含有粒子3の平均粒子径は、50μmであった。また、当該熱可塑性樹脂含有粒子3中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、0.1質量%であった。
[Example 3]
The thermoplastic resin-containing particles 3 are obtained in the same manner as in Example 1 except that the first solvent and the second solvent are water and the temperature of the first solvent when mixing with the kneaded product is 27 ° C. It was. The average particle diameter of the thermoplastic resin-containing particles 3 was 50 μm. Further, the amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 3 was 0.1% by mass.

 [実施例4]
 ポリアミド樹脂(ダイセル・エボニック社製、ダイアミドL1600、弾性率1430MPa)45質量部と、エチレンオキサイド/プロピレンオキサイド共重合体(明成化学工業社製、EP1010N、耐熱温度200℃、分子量約10万)55質量部と、を混合した。当該混合物の軟化点は、160℃であった。当該混合物を200℃に加熱し、小型混練機(Xplore社製、MC15)にて20分間混練した。
 そして、混練物を30℃まで冷却した後、70℃に加熱した酢酸エチル(第1の溶媒)に浸漬した。これにより、エチレンオキサイド/プロピレンオキサイド共重合体が酢酸エチルに溶解した。その後、当該溶液を遠心分離にかけ、ポリアミド樹脂を含む熱可塑性樹脂含有粒子を分取した。
 さらに、当該熱可塑性樹脂含有粒子を酢酸エチル(第2の溶媒)で洗浄し、ポリアミド樹脂を含む熱可塑性樹脂含有粒子4を得た。当該熱可塑性樹脂含有粒子4の平均粒子径は、40μmであった。また、当該熱可塑性樹脂含有粒子4中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、0.01質量%であった。
[Example 4]
45 parts by mass of polyamide resin (manufactured by Daicel-Evonik Co., Ltd., Daiamide L1600, elastic modulus 1430 MPa), 55 parts by mass of ethylene oxide / propylene oxide copolymer (manufactured by Meisei Chemical Industry Co., Ltd., EP1010N, heat resistant temperature 200 ° C., molecular weight about 100,000) Part. The softening point of the mixture was 160 ° C. The mixture was heated to 200 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15).
The kneaded product was cooled to 30 ° C. and then immersed in ethyl acetate (first solvent) heated to 70 ° C. Thereby, the ethylene oxide / propylene oxide copolymer was dissolved in ethyl acetate. Thereafter, the solution was centrifuged, and thermoplastic resin-containing particles containing a polyamide resin were collected.
Furthermore, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 4 containing a polyamide resin. The average particle diameter of the thermoplastic resin-containing particles 4 was 40 μm. The amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 4 was 0.01% by mass.

 [実施例5]
 混練物と混合する際の第1の溶媒の温度を、27℃とした以外は、実施例4と同様に、熱可塑性樹脂含有粒子5を得た。当該熱可塑性樹脂含有粒子5の平均粒子径は、40μmであった。また、当該熱可塑性樹脂含有粒子5中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、7質量%であった。
[Example 5]
The thermoplastic resin-containing particles 5 were obtained in the same manner as in Example 4 except that the temperature of the first solvent when mixing with the kneaded product was 27 ° C. The average particle diameter of the thermoplastic resin-containing particles 5 was 40 μm. The amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 5 was 7% by mass.

 [実施例6]
 第1の溶媒および第2の溶媒を水とし、混練物と混合する際の第1の溶媒の温度を、27℃とした以外は、実施例4と同様に、熱可塑性樹脂含有粒子6を得た。当該熱可塑性樹脂含有粒子6の平均粒子径は、50μmであった。また、当該熱可塑性樹脂含有粒子6中のエチレンオキサイド/プロピレンオキサイド共重合体の量は、0.1質量%であった。
[Example 6]
The thermoplastic resin-containing particles 6 are obtained in the same manner as in Example 4 except that the first solvent and the second solvent are water and the temperature of the first solvent when mixing with the kneaded product is 27 ° C. It was. The average particle diameter of the thermoplastic resin-containing particles 6 was 50 μm. The amount of the ethylene oxide / propylene oxide copolymer in the thermoplastic resin-containing particles 6 was 0.1% by mass.

 [比較例1]
 ポリアミド樹脂(ダイセル・エボニック社製、ダイアミドL1600、弾性率1430MPa)45質量部と、エチレンオキサイド(明成化学工業社製、R1000、耐熱温度120℃、分子量25~40万)55質量部と、を混合した。当該混合物の軟化点は、160℃であった。当該混合物を180℃に加熱し、小型混練機(Xplore社製、MC15)にて20分間混練した。
 そして、混練物を30℃まで冷却した後、70℃の酢酸エチル(第1の溶媒)10Lと混合した。これにより、エチレンオキサイドが酢酸エチルに溶解した。その後、当該溶液を遠心分離にかけ、ポリアミド樹脂を含む熱可塑性樹脂含有粒子を分取した。
 さらに、当該熱可塑性樹脂含有粒子を酢酸エチル(第2の溶媒)で洗浄し、ポリアミド樹脂を含む熱可塑性樹脂含有粒子7を得た。当該熱可塑性樹脂含有粒子7の平均粒子径は、30μmであった。また、当該熱可塑性樹脂含有粒子7中のエチレンオキサイドの量は、10質量%であった。
[Comparative Example 1]
45 parts by mass of polyamide resin (manufactured by Daicel-Evonik Co., Ltd., Daiamide L1600, elastic modulus 1430 MPa) and 55 parts by mass of ethylene oxide (manufactured by Meisei Chemical Industry Co., Ltd., R1000, heat resistant temperature 120 ° C., molecular weight 25 to 400,000) did. The softening point of the mixture was 160 ° C. The mixture was heated to 180 ° C. and kneaded for 20 minutes with a small kneader (Xplore, MC15).
The kneaded product was cooled to 30 ° C. and then mixed with 10 L of ethyl acetate (first solvent) at 70 ° C. Thereby, ethylene oxide was dissolved in ethyl acetate. Thereafter, the solution was centrifuged, and thermoplastic resin-containing particles containing a polyamide resin were collected.
Further, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 7 containing a polyamide resin. The average particle diameter of the thermoplastic resin-containing particles 7 was 30 μm. The amount of ethylene oxide in the thermoplastic resin-containing particles 7 was 10% by mass.

 [比較例2]
 ポリプロピレン樹脂(サンアロマー社製、PM600A、弾性率1320MPa)45質量部と、ポリエチレングリコール(明成化学工業社製、R150、耐熱温度120℃、分子量20000)55質量部と、を混合した。当該混合物の軟化点は、145℃であった。当該混合物を160℃に加熱し、小型混練機(Xplore社製、MC15)にて混練した。
 そして、混練物を30℃まで冷却した後、70℃の酢酸エチル(第1の溶媒)10Lと混合した。これにより、ポリエチレングリコールが酢酸エチルに溶解した。その後、当該溶液を遠心分離にかけ、ポリプロピレン樹脂を含む熱可塑性樹脂含有粒子を分取した。
 さらに、当該熱可塑性樹脂含有粒子を酢酸エチル(第2の溶媒)で洗浄し、ポリプロピレン樹脂を含む熱可塑性樹脂含有粒子8を得た。当該熱可塑性樹脂含有粒子8の平均粒子径は、20μmであった。また、当該熱可塑性樹脂含有粒子8中のポリエチレングリコールの量は、10質量%であった。
[Comparative Example 2]
45 parts by mass of polypropylene resin (manufactured by Sun Aroma Co., Ltd., PM600A, elastic modulus 1320 MPa) and 55 parts by mass of polyethylene glycol (manufactured by Meisei Chemical Industry Co., Ltd., R150, heat resistant temperature 120 ° C., molecular weight 20000) were mixed. The softening point of the mixture was 145 ° C. The mixture was heated to 160 ° C. and kneaded with a small kneader (Xplore, MC15).
The kneaded product was cooled to 30 ° C. and then mixed with 10 L of ethyl acetate (first solvent) at 70 ° C. As a result, polyethylene glycol was dissolved in ethyl acetate. Thereafter, the solution was centrifuged, and thermoplastic resin-containing particles containing polypropylene resin were collected.
Furthermore, the thermoplastic resin-containing particles were washed with ethyl acetate (second solvent) to obtain thermoplastic resin-containing particles 8 containing a polypropylene resin. The average particle diameter of the thermoplastic resin-containing particles 8 was 20 μm. The amount of polyethylene glycol in the thermoplastic resin-containing particles 8 was 10% by mass.

 [比較例3]
 ポリプロピレン樹脂(サンアロマー社製、PM600A、弾性率1320MPa)の代わりに、ポリアミド樹脂(ダイセル・エボニック社製、ダイアミドL1600、弾性率1430MPa)を用いた以外は、比較例2と同様に、ポリアミド樹脂を含む熱可塑性樹脂含有粒子9を得た。当該熱可塑性樹脂含有粒子9の平均粒子径は、20μmであった。また、当該熱可塑性樹脂含有粒子9中のポリエチレングリコールの量は、10質量%であった。
[Comparative Example 3]
A polyamide resin is included as in Comparative Example 2 except that a polyamide resin (manufactured by Daicel-Evonik, Daiamide L1600, elastic modulus 1430 MPa) is used instead of the polypropylene resin (manufactured by Sun Allomer, PM600A, elastic modulus 1320 MPa). Thermoplastic resin-containing particles 9 were obtained. The average particle diameter of the thermoplastic resin-containing particles 9 was 20 μm. The amount of polyethylene glycol in the thermoplastic resin-containing particles 9 was 10% by mass.

 [比較例4]
 メタロセン系ポリプロピレン樹脂(日本ポリプロ社製、WMH02、弾性率2300MPa)45質量部と、ポリエチレングリコール(明成化学工業社製、R150、耐熱温度120℃、分子量20000)55質量部と、を混合した。当該混合物の軟化点は、160℃であった。
 当該混合物を200℃に加熱し、小型混練機(Xplore社製、MC15)にて混練したところ、ポリプロピレン樹脂が粒子状とならなかった。
[Comparative Example 4]
45 parts by mass of a metallocene polypropylene resin (manufactured by Nippon Polypro Co., Ltd., WMH02, elastic modulus 2300 MPa) and 55 parts by mass of polyethylene glycol (manufactured by Meisei Chemical Industry Co., Ltd., R150, heat resistant temperature 120 ° C., molecular weight 20000) were mixed. The softening point of the mixture was 160 ° C.
The mixture was heated to 200 ° C. and kneaded with a small kneader (manufactured by Xplore, MC15). As a result, the polypropylene resin did not become particles.

 2.評価
 各実施例および比較例で作製した熱可塑性樹脂含有粒子(立体造形用樹脂組成物)について、もしくはその製造段階での状態について、以下のように評価した。結果を表1に示す。
2. Evaluation About the thermoplastic resin containing particle (resin composition for three-dimensional modeling) produced by each Example and the comparative example, or the state in the manufacturing stage, it evaluated as follows. The results are shown in Table 1.

 [水溶性樹脂の溶解性評価]
 熱可塑性樹脂含有粒子を作製する際の、第1の溶媒に対する、水溶性樹脂の溶解性を目視で評価した。そして、以下のように評価した。
 ◎:数分以内に、混練物(塊)が水中に残っていない状態になった。
 ○:数時間かけて、混練物(塊)が水中に残っていない状態になった。
 △:数日かけて、混練物(塊)が水中に残っていない状態になった。
[Evaluation of solubility of water-soluble resin]
The solubility of the water-soluble resin in the first solvent when producing the thermoplastic resin-containing particles was visually evaluated. And it evaluated as follows.
A: Within a few minutes, the kneaded product (lumps) did not remain in water.
○: The kneaded product (lumps) was not left in the water over several hours.
(Triangle | delta): It became the state which the kneaded material (lump) did not remain in water over several days.

 [溶媒のリサイクル性]
 第1の溶媒および第2の溶媒のリサイクル性を、溶媒の分取率で評価した。評価は以下のように行った。
 ◎:蒸留法により溶媒と水溶性樹脂とを分離し、溶媒を分取することが可能であり、その分取率が70%以上であった。
 ○:蒸留法により溶媒と水溶性樹脂とを分離し、溶媒を分取することが可能であり、その分取率が10%以上70%未満であった。
 ×:溶媒の分取が不可能、もしくは分取率が10%未満であった。
[Solvent recyclability]
The recyclability of the first solvent and the second solvent was evaluated based on the fraction of the solvent. Evaluation was performed as follows.
(Double-circle): A solvent and water-soluble resin were isolate | separated by the distillation method, it was possible to fractionate a solvent, and the fractionation rate was 70% or more.
A: The solvent and the water-soluble resin were separated by a distillation method, and the solvent could be fractionated, and the fractionation rate was 10% or more and less than 70%.
X: Solvent separation was impossible or the fractionation rate was less than 10%.

 [水溶性樹脂量]
 得られた熱可塑性樹脂含有粒子中の水溶性樹脂を、NMR測定により熱可塑性樹脂由来のピークと水溶性樹脂由来のピークを比較することで定量した。
[Water-soluble resin amount]
The water-soluble resin in the obtained thermoplastic resin-containing particles was quantified by comparing the peak derived from the thermoplastic resin and the peak derived from the water-soluble resin by NMR measurement.

 [引張強度(破断伸び)の評価]
 (立体造形物の作製)
 上述の実施例および比較例で作製した熱可塑性樹脂含有粒子(立体造形用樹脂組成物)を、ホットプレート上に設置した造形ステージ上に敷き詰め、厚さ0.1mmの薄層を形成した。ホットプレートの温度を調整することで、予備加熱温度160℃にそれぞれ加熱した。この薄層に、以下の条件で、YAG波長用ガルバノメータスキャナを搭載したCOレーザから縦15mm×横20mmの範囲にレーザ光を照射して、造形物層を作製した。上記工程を高さ55mmになるまで繰り返し、積層された立体造形物をそれぞれ製造した。
 <レーザ光の出射条件>
 レーザ出力   :12W
 レーザ光の波長  :10.6μm
 ビーム径    :薄層表面で170μm
 <レーザ光の走査条件>
 走査速度    :2000mm/sec
 ライン数    :1ライン
[Evaluation of tensile strength (breaking elongation)]
(Production of 3D objects)
The thermoplastic resin-containing particles (resin composition for three-dimensional modeling) produced in the above-described examples and comparative examples were spread on a modeling stage placed on a hot plate to form a thin layer having a thickness of 0.1 mm. By adjusting the temperature of the hot plate, each was heated to a preheating temperature of 160 ° C. This thin layer was irradiated with laser light in a range of 15 mm long × 20 mm wide from a CO 2 laser equipped with a galvanometer scanner for YAG wavelength under the following conditions to produce a shaped article layer. The above steps were repeated until the height reached 55 mm, and each of the stacked three-dimensional objects was manufactured.
<Laser beam emission conditions>
Laser output: 12W
Laser light wavelength: 10.6 μm
Beam diameter: 170 μm on the surface of the thin layer
<Laser beam scanning conditions>
Scanning speed: 2000mm / sec
Number of lines: 1 line

 (引張強度(破断伸び)の測定)
 上記のようにして作製した立体造形物について、インスロン社製万能試験機model-5582を用い、引張速度1mm/min、掴み具距離60mm、試験温度23℃の条件にて引張強度を測定した。そして、当該引張強度を以下のように評価した。
 ◎:破断伸びが、10%以上である(装具に好適)
 ○:破断伸びが5%以上10%未満である(装具へ使用可能)
 ×:破断伸びが5%未満である(装具に使用不可)
(Measurement of tensile strength (elongation at break))
With respect to the three-dimensional model manufactured as described above, the tensile strength was measured using a universal testing machine model-5582 manufactured by Inslon Corporation under the conditions of a tensile speed of 1 mm / min, a gripping tool distance of 60 mm, and a test temperature of 23 ° C. And the said tensile strength was evaluated as follows.
A: Elongation at break is 10% or more (suitable for orthosis)
○: Elongation at break is 5% or more and less than 10% (can be used for orthoses)
X: Elongation at break is less than 5% (cannot be used for braces)

Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001

 上記表1に示されるように、比較的高弾性率の熱可塑性樹脂と、耐熱温度が130℃以上200℃以下である水溶性樹脂とを混合して、熱可塑性樹脂含有粒子を作製した場合、いずれも所望の平均粒子径の熱可塑性樹脂含有粒子を得ることができた(実施例1~6)。また、当該熱可塑性樹脂含有粒子を含む立体造形用樹脂組成物から立体造形物を作製した場合、破断伸びが優れていた。水溶性樹脂を微量に含むことでも、立体造形時の界面の融着性が向上し、破断伸びが向上したと考えられる。また、立体造形物の表面を偏光顕微鏡で観察したところ、水溶性樹脂によって表面の結晶化も抑制されていた。なお、有機溶媒を第1の溶媒や第2の溶媒として用いた場合、回収後、リサイクルすることが可能であった(実施例1、2、4、および5)。 As shown in Table 1, when a thermoplastic resin-containing particle is produced by mixing a thermoplastic resin having a relatively high elastic modulus and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower, In any case, thermoplastic resin-containing particles having a desired average particle diameter could be obtained (Examples 1 to 6). Moreover, when the three-dimensional molded item was produced from the three-dimensional molded resin composition containing the thermoplastic resin-containing particles, the elongation at break was excellent. It is considered that even when a small amount of the water-soluble resin is contained, the fusion property of the interface at the time of three-dimensional modeling is improved and the elongation at break is improved. Moreover, when the surface of the three-dimensional molded item was observed with a polarizing microscope, crystallization of the surface was also suppressed by the water-soluble resin. In addition, when the organic solvent was used as the first solvent or the second solvent, it was possible to recycle after recovery (Examples 1, 2, 4, and 5).

 これに対し、比較的高弾性率の熱可塑性樹脂と、耐熱温度が130℃未満の水溶性樹脂とを混合して、熱可塑性樹脂含有粒子を作製しようとした場合、熱可塑性樹脂が十分に分散せず、さらには水溶性樹脂が分解してしまった。つまり、これらを組み合わせた場合には、所望の熱可塑性樹脂含有粒子を得ることができなかった(比較例4)。 In contrast, when a thermoplastic resin-containing particle is prepared by mixing a thermoplastic resin having a relatively high elastic modulus and a water-soluble resin having a heat resistant temperature of less than 130 ° C., the thermoplastic resin is sufficiently dispersed. In addition, the water-soluble resin was decomposed. That is, when these were combined, desired thermoplastic resin-containing particles could not be obtained (Comparative Example 4).

 また、比較的弾性率の低い熱可塑性樹脂と、耐熱温度が130℃未満の水溶性樹脂とを混合して、熱可塑性樹脂含有粒子を作製すると、所望の熱可塑性樹脂含有粒子は得られたものの、破断伸びの評価が低く、例えば装具等、耐久性が要求される用途への適用は難しかった(比較例1~3)。 Further, when thermoplastic resin-containing particles are produced by mixing a thermoplastic resin having a relatively low elastic modulus and a water-soluble resin having a heat-resistant temperature of less than 130 ° C., the desired thermoplastic resin-containing particles are obtained. The evaluation of elongation at break was low, and it was difficult to apply it to uses requiring durability such as an orthosis (Comparative Examples 1 to 3).

 本出願は、2018年3月9日出願の特願2018-043183号に基づく優先権を主張する。当該出願明細書に記載された内容は、すべて本願明細書に援用される。 This application claims priority based on Japanese Patent Application No. 2018-043183 filed on Mar. 9, 2018. All the contents described in the application specification are incorporated herein by reference.

 本発明に係る方法で製造される熱可塑性樹脂含有粒子を含む立体造形用樹脂組成物によれば、粉末床溶融結合法やMJF法等のいずれの方法によっても、精度よく立体造形物を形成することが可能である。また、得られる立体造形物は、高い機械的強度および高い弾性率を兼ね備える。したがって、本発明は、立体造形法のさらなる普及に寄与するものと思われる。 According to the three-dimensional modeling resin composition including the thermoplastic resin-containing particles produced by the method according to the present invention, the three-dimensional modeling object is accurately formed by any method such as the powder bed fusion bonding method or the MJF method. It is possible. Moreover, the three-dimensional molded item obtained has both high mechanical strength and high elastic modulus. Therefore, it is considered that the present invention contributes to further spread of the three-dimensional modeling method.

Claims (18)

 熱可塑性樹脂および耐熱温度130℃以上200℃以下の水溶性樹脂を混合し、混合物を得る混合工程と、
 前記混合物を、前記混合物の軟化点以上に加熱して混練し、混練物を得る混練工程と、
 前記混練物を前記軟化点未満に冷却する冷却工程と、
 前記冷却工程後、前記混練物を水または有機溶媒を含む第1の溶媒と混合し、前記水溶性樹脂を前記第1の溶媒に溶解させる溶解工程と、
 前記溶解工程後、固形分を分離し、熱可塑性樹脂含有粒子を得る分離工程と、を含む、熱可塑性樹脂含有粒子の製造方法。
A mixing step of mixing a thermoplastic resin and a water-soluble resin having a heat resistant temperature of 130 ° C. or higher and 200 ° C. or lower to obtain a mixture;
A kneading step of heating the mixture above the softening point of the mixture and kneading to obtain a kneaded product;
A cooling step for cooling the kneaded material below the softening point;
After the cooling step, the kneaded product is mixed with a first solvent containing water or an organic solvent, and a dissolving step of dissolving the water-soluble resin in the first solvent;
A separation step of separating the solid content and obtaining thermoplastic resin-containing particles after the dissolution step.
 前記水溶性樹脂が、エチレンオキサイド/プロピレンオキサイド共重合体を含む、
 請求項1に記載の熱可塑性樹脂含有粒子の製造方法。
The water-soluble resin contains an ethylene oxide / propylene oxide copolymer,
The manufacturing method of the thermoplastic resin containing particle | grains of Claim 1.
 前記エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が50000以上150000以下である、
 請求項2に記載の熱可塑性樹脂含有粒子の製造方法。
The ethylene oxide / propylene oxide copolymer has a weight average molecular weight of 50,000 to 150,000,
The manufacturing method of the thermoplastic resin containing particle | grains of Claim 2.
 前記熱可塑性樹脂が、ポリプロピレンを含む、
 請求項1~3のいずれか一項に記載の熱可塑性樹脂含有粒子の製造方法。
The thermoplastic resin comprises polypropylene;
The method for producing thermoplastic resin-containing particles according to any one of claims 1 to 3.
 前記ポリプロピレンの27℃における弾性率が、1500MPa以上2500MPa以下である、
 請求項4に記載の熱可塑性樹脂含有粒子の製造方法。
The elastic modulus at 27 ° C. of the polypropylene is 1500 MPa or more and 2500 MPa or less.
The manufacturing method of the thermoplastic resin containing particle | grains of Claim 4.
 前記混合工程が、前記熱可塑性樹脂および前記水溶性樹脂を、質量比1:9~5:5で混合し、前記混合物を得る工程である、
 請求項1~5のいずれか一項に記載の熱可塑性樹脂含有粒子の製造方法。
The mixing step is a step of mixing the thermoplastic resin and the water-soluble resin at a mass ratio of 1: 9 to 5: 5 to obtain the mixture.
The method for producing thermoplastic resin-containing particles according to any one of claims 1 to 5.
 前記分離工程後に、前記熱可塑性樹脂含有粒子を水または有機溶媒を含む第2の溶媒で洗浄する洗浄工程をさらに含む、
 請求項1~6のいずれか一項に記載の熱可塑性樹脂含有粒子の製造方法。
After the separation step, further includes a washing step of washing the thermoplastic resin-containing particles with a second solvent containing water or an organic solvent.
The method for producing thermoplastic resin-containing particles according to any one of claims 1 to 6.
 前記洗浄工程は、前記熱可塑性樹脂含有粒子の質量に対する前記水溶性樹脂の含有量が5質量%以下になるまで、前記熱可塑性樹脂含有粒子を洗浄する工程である、請求項7に記載の熱可塑性樹脂含有粒子の製造方法。 The heat according to claim 7, wherein the washing step is a step of washing the thermoplastic resin-containing particles until the content of the water-soluble resin with respect to the mass of the thermoplastic resin-containing particles is 5% by mass or less. A method for producing plastic resin-containing particles.  前記洗浄工程が、有機溶媒で前記熱可塑性樹脂含有粒子を洗浄する工程であり、
 前記洗浄工程後に、前記有機溶媒と前記水溶性樹脂とを分離し、前記有機溶媒を回収する第2溶媒回収工程をさらに含む、
 請求項7または8に記載の熱可塑性樹脂含有粒子の製造方法。
The washing step is a step of washing the thermoplastic resin-containing particles with an organic solvent;
After the washing step, further comprising a second solvent recovery step of separating the organic solvent and the water-soluble resin and recovering the organic solvent;
The manufacturing method of the thermoplastic resin containing particle | grains of Claim 7 or 8.
 前記溶解工程が、前記水溶性樹脂を有機溶媒に溶解させる工程であり、
 前記溶解工程後に、前記有機溶媒と前記水溶性樹脂とを分離し、前記有機溶媒を回収する第1溶媒回収工程をさらに含む、
 請求項1~9のいずれか一項に記載の熱可塑性樹脂含有粒子の製造方法。
The dissolving step is a step of dissolving the water-soluble resin in an organic solvent;
After the dissolving step, further comprising a first solvent recovery step of separating the organic solvent and the water-soluble resin and recovering the organic solvent;
The method for producing thermoplastic resin-containing particles according to any one of claims 1 to 9.
 前記第1の溶媒が含む有機溶媒および/または前記第2の溶媒が含む有機溶媒は、アセトニトリル、ジクロロメタン、メタノール、エタノール、トルエン、テトラヒドロフラン、アセトン、および酢酸エチルからなる群から選ばれる、
 請求項9または10に記載の熱可塑性樹脂含有粒子の製造方法。
The organic solvent included in the first solvent and / or the organic solvent included in the second solvent is selected from the group consisting of acetonitrile, dichloromethane, methanol, ethanol, toluene, tetrahydrofuran, acetone, and ethyl acetate.
The manufacturing method of the thermoplastic resin containing particle | grains of Claim 9 or 10.
 熱可塑性樹脂と、
 耐熱温度130℃以上200℃以下の水溶性樹脂と、
 を含み、前記水溶性樹脂の量が0.001質量%以上5質量%以下である、熱可塑性樹脂含有粒子を含む、
 立体造形用樹脂組成物。
A thermoplastic resin;
A water-soluble resin having a heat-resistant temperature of 130 ° C. or higher and 200 ° C. or lower;
Including thermoplastic resin-containing particles, wherein the amount of the water-soluble resin is 0.001% by mass or more and 5% by mass or less.
Three-dimensional modeling resin composition.
 前記水溶性樹脂が、エチレンオキサイド/プロピレンオキサイド共重合体を含む、
 請求項12に記載の立体造形用樹脂組成物。
The water-soluble resin contains an ethylene oxide / propylene oxide copolymer,
The resin composition for three-dimensional modeling according to claim 12.
 前記エチレンオキサイド/プロピレンオキサイド共重合体の重量平均分子量が50000以上150000以下である、
 請求項13に記載の立体造形用樹脂組成物。
The ethylene oxide / propylene oxide copolymer has a weight average molecular weight of 50,000 to 150,000,
The resin composition for three-dimensional modeling according to claim 13.
 前記熱可塑性樹脂が、ポリプロピレンを含む、
 請求項12~14のいずれか一項に記載の立体造形用樹脂組成物。
The thermoplastic resin comprises polypropylene;
The resin composition for three-dimensional modeling according to any one of claims 12 to 14.
 前記ポリプロピレンの27℃における弾性率が、1500MPa以上2500MPa以下である、
 請求項15に記載の立体造形用樹脂組成物。
The elastic modulus at 27 ° C. of the polypropylene is 1500 MPa or more and 2500 MPa or less.
The resin composition for three-dimensional model | molding of Claim 15.
 請求項12~16のいずれか一項に記載の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、
 前記薄層にレーザ光を選択的に照射して、複数の前記熱可塑性樹脂含有粒子が溶融結合した造形物層を形成するレーザ光照射工程と、
 を含み、
 前記薄層形成工程、および前記レーザ光照射工程を複数回繰り返し、前記造形物層を積層することで立体造形物を形成する、
 立体造形物の製造方法。
A thin layer forming step of forming a thin layer comprising the resin composition for three-dimensional modeling according to any one of claims 12 to 16;
A laser beam irradiation step of selectively irradiating the thin layer with a laser beam to form a shaped article layer in which a plurality of the thermoplastic resin-containing particles are melt-bonded;
Including
The thin layer forming step and the laser light irradiation step are repeated a plurality of times to form a three-dimensional modeled object by laminating the modeled object layer,
Manufacturing method of a three-dimensional molded item.
 請求項12~16のいずれか一項に記載の立体造形用樹脂組成物を含む薄層を形成する薄層形成工程と、
 エネルギー吸収剤を含む結合用流体を、前記薄層の特定の領域に塗布する流体塗布工程と、
 前記流体塗布工程後の前記薄層にエネルギーを照射し、前記結合用流体を塗布した領域の前記熱可塑性樹脂含有粒子が溶融した造形物層を形成するエネルギー照射工程と、
 を含み、
 前記薄層形成工程、前記流体塗布工程、および前記エネルギー照射工程を複数回繰り返し、前記造形物層を積層することで立体造形物を形成する、
 立体造形物の製造方法。
A thin layer forming step of forming a thin layer comprising the resin composition for three-dimensional modeling according to any one of claims 12 to 16;
A fluid application step of applying a binding fluid containing an energy absorber to a specific region of the thin layer;
An energy irradiation step of irradiating the thin layer after the fluid application step with energy and forming a shaped article layer in which the thermoplastic resin-containing particles in the region where the binding fluid is applied are melted;
Including
The thin layer forming step, the fluid application step, and the energy irradiation step are repeated a plurality of times to form a three-dimensional modeled object by laminating the modeled object layer,
Manufacturing method of a three-dimensional molded item.
PCT/JP2019/007110 2018-03-09 2019-02-25 Method for producing thermoplastic-resin-containing particles, resin composition for three-dimensional forming, and method for producing three-dimensional shape from said resin composition Ceased WO2019172003A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020504933A JP7136186B2 (en) 2018-03-09 2019-02-25 Method for producing thermoplastic resin-containing particles, resin composition for three-dimensional modeling, and method for producing three-dimensional object using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018043183 2018-03-09
JP2018-043183 2018-03-09

Publications (1)

Publication Number Publication Date
WO2019172003A1 true WO2019172003A1 (en) 2019-09-12

Family

ID=67845629

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/007110 Ceased WO2019172003A1 (en) 2018-03-09 2019-02-25 Method for producing thermoplastic-resin-containing particles, resin composition for three-dimensional forming, and method for producing three-dimensional shape from said resin composition

Country Status (2)

Country Link
JP (1) JP7136186B2 (en)
WO (1) WO2019172003A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060464A (en) * 2003-08-08 2005-03-10 Sumitomo Seika Chem Co Ltd Method for producing thermoplastic elastomer particle
JP2006016414A (en) * 2004-06-30 2006-01-19 Sumitomo Seika Chem Co Ltd Method for producing ethylene/(meth)acrylic ester copolymer particle
JP2006045295A (en) * 2004-08-03 2006-02-16 Sumitomo Seika Chem Co Ltd Manufacturing method of polyolefin resin particle
JP2007246567A (en) * 2006-03-13 2007-09-27 Daicel Degussa Ltd Method for producing resin particles and resin particles
JP2012197461A (en) * 2008-05-21 2012-10-18 Toray Ind Inc Method for producing fine polymer particle
WO2017180166A1 (en) * 2016-04-15 2017-10-19 Hewlett-Packard Development Company, L.P. Composite particulate build materials
JP2017193090A (en) * 2016-04-19 2017-10-26 コニカミノルタ株式会社 Powder material, manufacturing method of powder material, manufacturing method of solid molded article and solid molding device
JP2018001606A (en) * 2016-07-01 2018-01-11 コニカミノルタ株式会社 Powder material, production method of powder material, production method of solid molded article and solid molding apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060464A (en) * 2003-08-08 2005-03-10 Sumitomo Seika Chem Co Ltd Method for producing thermoplastic elastomer particle
JP2006016414A (en) * 2004-06-30 2006-01-19 Sumitomo Seika Chem Co Ltd Method for producing ethylene/(meth)acrylic ester copolymer particle
JP2006045295A (en) * 2004-08-03 2006-02-16 Sumitomo Seika Chem Co Ltd Manufacturing method of polyolefin resin particle
JP2007246567A (en) * 2006-03-13 2007-09-27 Daicel Degussa Ltd Method for producing resin particles and resin particles
JP2012197461A (en) * 2008-05-21 2012-10-18 Toray Ind Inc Method for producing fine polymer particle
WO2017180166A1 (en) * 2016-04-15 2017-10-19 Hewlett-Packard Development Company, L.P. Composite particulate build materials
JP2017193090A (en) * 2016-04-19 2017-10-26 コニカミノルタ株式会社 Powder material, manufacturing method of powder material, manufacturing method of solid molded article and solid molding device
JP2018001606A (en) * 2016-07-01 2018-01-11 コニカミノルタ株式会社 Powder material, production method of powder material, production method of solid molded article and solid molding apparatus

Also Published As

Publication number Publication date
JP7136186B2 (en) 2022-09-13
JPWO2019172003A1 (en) 2021-02-25

Similar Documents

Publication Publication Date Title
JP5754876B2 (en) Copolyamide powder and production thereof, use of copolyamide powder in molding method, and molded product produced from said copolyamide powder
EP3341184B1 (en) Method of producing crystalline polycarbonate powders
JP6016913B2 (en) Polymer powder for manufacturing three-dimensional objects
EP1742986B1 (en) Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder
CN103980682B (en) A kind of 3D printing polycaprolactone material and preparation method thereof
US20070232753A1 (en) Polymer powder, process for production of and use of this powder, and resultant shaped articles
JP7523433B2 (en) A sintered powder (SP) comprising a first polyamide component (PA1) and a second polyamide component (PA2), the melting point of the second polyamide component (PA2) being higher than the melting point of the first polyamide component (PA1).
JP7010243B2 (en) A resin composition and a method for manufacturing a three-dimensional model using the resin composition.
CN112601787B (en) Sintered Powder (SP) comprising a partially crystalline terephthalate polyester, an amorphous terephthalate polyester and a phosphinate salt
DE102010062347A1 (en) Polymer powder based on polyamides, use in a molding process and molding, made from this polymer powder
JP7107325B2 (en) Resin composition for three-dimensional modeling, three-dimensional modeled article, and method for producing three-dimensional modeled article
JP2010189610A (en) Composition for laser-sintering laminate, method for producing the same, and molded product
JP2023501423A (en) Improved powders for additive manufacturing
JP7136186B2 (en) Method for producing thermoplastic resin-containing particles, resin composition for three-dimensional modeling, and method for producing three-dimensional object using the same
DE102019122662A1 (en) 3D PRINT SUPPORT STRUCTURES WITH INTRODUCED VICTIM MATERIALS
US20230056630A1 (en) Method of producing polycaprolactone powder by reprecipitation and subsequent use of same in additive manufacturing
JP2021524400A (en) Methods for Producing 3D Objects from Poly (Allylene Sulfide) Polymers
EP2062666A1 (en) Wax and polymer formulations containing metallocene-catalysed polyolefins with or without filler, that are particularly well suited to chip removing model creation procedures and their use in precision casting processes, hollow core creation especially for dental, jewellery and precision engineering applications
JP7099473B2 (en) A resin composition and a method for producing a three-dimensional model using the resin composition.
WO2025142480A1 (en) Resin particle for three-dimensional printer
JP7172134B2 (en) POWDER MATERIAL AND METHOD FOR MANUFACTURING 3D PRODUCT USING THE SAME
WO2024204368A1 (en) Material for three-dimensional modeling, molded body and method for producing same
WO2022230807A1 (en) Powder for powder lamination molding
TWI445605B (en) Preparation of nano-polylactic acid-based composite material and polylactic acid-based molded article
KR20230044485A (en) Powder compositions for lamination processes and prints thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19763705

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020504933

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19763705

Country of ref document: EP

Kind code of ref document: A1