WO2019163363A1 - Temperature measuring device, ambient temperature measuring method, and ambient temperature measuring program - Google Patents

Abstract

A terminal temperature measuring element (30) is disposed close to, in a housing (90), a terminal to which a thermocouple (600) is connected, and a first internal temperature measuring element (31) and a second internal temperature measuring element (32) are disposed, in a housing (900), at positions closer to a heat generating source than the terminal temperature measuring element (30). The difference between influence of heat generated from the heat generating source to the first internal temperature measuring element (31), and influence of the heat generated from the heat generating source to the second internal temperature measuring element (32) changes in accordance with the attitude of the housing (90). A main control unit (20) calculates, using the temperature measured by the three temperature measuring elements, the ambient temperature of the housing (90).

Description

Temperature measuring device, ambient temperature measuring method, and ambient temperature measuring program

The present invention relates to an ambient temperature measurement technique in a temperature measurement device using a thermocouple.

A mode in which a thermocouple is used when measuring and adjusting the temperature of an object or target device is disclosed in, for example, Patent Document 1.

The configuration of Patent Document 1 includes a thermocouple and a temperature adjustment device. The thermocouple is connected to a connection terminal provided on the casing of the temperature adjustment device.

The thermocouple is placed on the target object or target device. The temperature adjustment device is disposed at a position different from the target device. The temperature adjusting device calculates the temperature from the voltage generated by the thermocouple and acquired through the connection terminal, and executes the temperature adjustment.

In this case, the calculated temperature is affected by the temperature of the connection terminal (cold junction). For this reason, in the structure of patent document 1, the temperature sensor which measures the temperature of a connection terminal is provided in the housing | casing of a temperature control apparatus. And the temperature control apparatus is calculating the temperature of a target object by adding the cold junction temperature measured with this temperature sensor to the temperature measured with the thermocouple.

JP 2001-124636 A

As a temperature adjustment device, it may be required to measure not only the temperature of the object but also the ambient temperature of the housing. Since the ambient temperature of the casing is close to the cold junction temperature, conventionally, it has been considered to use the cold junction temperature as the ambient temperature.

However, the cold junction temperature changes due to the influence of the heat source arranged inside the casing of the temperature control device. Therefore, the cold junction temperature and the ambient temperature do not necessarily match. Furthermore, the influence varies depending on the orientation (arrangement mode) of the casing of the temperature adjusting device.

For this reason, in the conventional temperature measurement method in which the cold junction temperature is set to the ambient temperature, this effect cannot be sufficiently offset, and the ambient temperature may have an error.

Therefore, an object of the present invention is to provide a temperature measurement technique capable of measuring the ambient temperature more accurately while suppressing the influence of the internal heat source and the influence of the arrangement mode.

According to an example of the present disclosure, the temperature measurement device includes a terminal temperature measurement element, a first internal temperature measurement element, a second internal temperature measurement element, and a control unit. The terminal temperature measuring element is disposed in the vicinity of the terminal to which the thermocouple is connected in the housing. The first internal temperature measuring element is disposed in the housing at a position closer to the heat source than the terminal temperature measuring element. The second internal temperature measuring element is disposed in the housing at a position closer to the heat source than the terminal temperature measuring element and at a position different from the first internal temperature measuring element. In addition, the first internal temperature measuring element and the second internal temperature measuring element include an influence of heat from the heat source in the first internal temperature measuring element and an influence of heat from the heat source in the second internal temperature measuring element. The difference is arranged at a position that changes according to the posture of the housing. The control unit uses the terminal temperature measured by the terminal temperature measuring element, the first internal temperature measured by the first internal temperature measuring element, and the second internal temperature measured by the second internal temperature measuring element to Calculate the body ambient temperature.

In this configuration, the influence of the heat of the heat source on the terminal temperature is suppressed by using the internal temperature. Furthermore, since the measurement points of the internal temperature are different from each other in the casing, the influence of the attitude of the casing on the calculation result of the ambient temperature is suppressed.

According to an example of the present disclosure, the second internal temperature measurement element has the same heat effect as the first internal temperature measurement element in the first posture of the housing, and the first internal temperature measurement device in the second posture of the housing. The temperature measurement element and the thermal effect are arranged at different positions.

This configuration makes it easy to set a correction term using the first internal temperature and the second internal temperature for calculating the ambient temperature.

According to an example of the present disclosure, the calculation formula for calculating the ambient temperature by the control unit includes a difference term between the terminal temperature and the first internal temperature, and the correction coefficient for the difference term is the first internal temperature and the above-described correction factor. It is a value calculated from the second internal temperature.

In this configuration, the ambient temperature is calculated without using a complicated calculation formula.

According to an example of the present disclosure, the correction coefficient is a value corresponding to a ratio between the first internal temperature and the second internal temperature.

In this configuration, the ambient temperature is calculated using a simple calculation formula.

According to the present invention, the influence of the internal heat source and the influence of the arrangement mode can be suppressed, and the ambient temperature can be measured with higher accuracy.

It is a functional block diagram of the temperature control apparatus which concerns on embodiment of this invention. (A) is a front view of a temperature regulator, (B) is a side sectional view showing a schematic internal structure of a temperature regulator. (A), (B) is a figure which shows an example of the some attitude | position of a temperature control apparatus. (A), (B), (C) is a graph which shows the influence of the temperature by an attitude | position. It is a figure which shows the relationship between each attitude | position, and the difference of 1st internal temperature Tin1 and 2nd internal temperature Tin2. It is a flowchart which shows the temperature measurement method which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

-Application example First, the application example of the temperature control apparatus which concerns on embodiment of this invention is demonstrated. FIG. 1 is a functional block diagram of a temperature adjustment device according to an embodiment of the present invention.

As shown in FIG. 1, the temperature adjusting device 10 includes a main control unit 20, a terminal temperature measuring element 30, a first internal temperature measuring element 31, and a second internal temperature measuring element 32. Further, the temperature adjusting device 10 includes a heat source 110 that generates heat by driving. The heat source 110 includes, for example, a main control unit 20, a communication unit 51, a control output unit 52, and a power supply unit 70. Note that the configuration of the heat source 110 is not limited to these, and is not limited to these sets.

The terminal temperature measuring element 30 is disposed in the vicinity of the thermocouple connection terminal 60. The terminal temperature measuring element 30 measures the terminal temperature Tb and outputs it to the main control unit 20.

The first internal temperature measuring element 31 is disposed at a position that is more susceptible to heat from the heat source 110 than the terminal temperature measuring element 30. The first internal temperature measuring element 31 measures the first internal temperature Tin1 and outputs it to the main control unit 20.

The second internal temperature measurement element 32 is arranged at a position where the influence of heat from the heat generation source 110 is different from that of the first internal temperature measurement element 31 according to the attitude of the casing of the temperature adjustment device 10. The second internal temperature measuring element 32 measures the second internal temperature Tin <b> 2 and outputs it to the main control unit 20.

The main control unit 20 calculates the ambient temperature Ta from the following equation using the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2.

Ta = Tb-Tg-(Formula 1)
Tg = (Tin1-Tb) × a + b − (Formula 2)
Note that a and b are correction values set from the first internal temperature Tin1 and the second internal temperature Tin2.

Further, (Tin1-Tb) corresponds to the difference term referred to in the present invention, and a corresponds to the correction coefficient referred to in the present invention. Further, a is a value corresponding to the ratio between the first internal temperature Tin1 and the second internal temperature Tin2, as will be described later.

By using such a configuration and processing, the influence of heat from the heat source 110 in the temperature adjustment device 10 is suppressed in the calculation formula, and the change in the influence of heat from the heat source 110 due to the attitude of the housing is changed. However, the influence on the calculation of the ambient temperature Ta can be suppressed. Thereby, the temperature adjustment apparatus 10 can calculate the ambient temperature Ta more accurately.

Configuration Example A temperature adjustment device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a functional block diagram of a temperature adjustment device according to an embodiment of the present invention.

(Function block)
As shown in FIG. 1, the temperature adjustment apparatus 10 includes a main control unit 20, a terminal temperature measurement element 30, a first internal temperature measurement element 31, a second internal temperature measurement element 32, a temperature detection signal generation unit 41, and a temperature detection signal. A generation unit 42, a temperature detection signal generation unit 43, a temperature detection signal generation unit 44, a communication unit 51, a control output unit 52, a notification unit 53, a storage unit 54, a thermocouple connection terminal 60, and a power supply unit 70 are provided.

The main control unit 20 is composed of arithmetic processing elements such as a CPU, and executes a program for performing temperature measurement or temperature adjustment processing described later. The storage unit 54 includes volatile and nonvolatile storage devices. The storage unit 54 is connected to the main control unit 20. The non-volatile storage device stores the program and a correction value described later. The volatile storage device is used as a work area when the main control unit 20 executes the program.

The terminal temperature measuring element 30, the first internal temperature measuring element 31, and the second internal temperature measuring element 32 are realized by, for example, a temperature sensor using a resistance thermometer, a thermistor, or a semiconductor.

The terminal temperature measuring element 30 is connected to the temperature detection signal generating unit 42. The temperature detection signal generation unit 42 is connected to the main control unit 20.

The terminal temperature measuring element 30 generates a terminal temperature measurement voltage corresponding to the sensed temperature. The measured voltage of this terminal temperature corresponds to the terminal temperature Tb. For example, the temperature detection signal generation unit 42 amplifies and A / D (analog / digital) converts the measured voltage of the terminal temperature, and outputs it to the main control unit 20.

The first internal temperature measurement element 31 is connected to the temperature detection signal generation unit 43. The temperature detection signal generation unit 43 is connected to the main control unit 20.

The first internal temperature measurement element 31 generates a measurement voltage of the first internal temperature according to the sensed temperature. The measurement voltage of the first internal temperature corresponds to the first internal temperature Tin1. For example, the temperature detection signal generation unit 43 amplifies and A / D (analog / digital) converts the measurement voltage of the first internal temperature and outputs the amplified voltage to the main control unit 20.

The second internal temperature measurement element 32 is connected to the temperature detection signal generation unit 44. The temperature detection signal generation unit 44 is connected to the main control unit 20.

The second internal temperature measurement element 32 generates a measurement voltage of the second internal temperature according to the sensed temperature. The measurement voltage of the second internal temperature corresponds to the second internal temperature Tin2. The temperature detection signal generation unit 44 amplifies and A / D (analog / digital) converts the measurement voltage of the second internal temperature, for example, and outputs it to the main control unit 20.

The thermocouple connection terminal 60 is connected to the external thermocouple 600 and is also connected to the temperature detection signal generator 41. The temperature detection signal generation unit 41 is connected to the main control unit 20.

The thermocouple connection terminal 60 generates a measurement voltage corresponding to the temperature sensed by the thermocouple 600. This measured voltage corresponds to the temperature of the detection object before correction. For example, the temperature detection signal generation unit 41 amplifies and A / D (analog / digital) converts the measurement voltage of the detection target before correction and outputs the amplified voltage to the main control unit 20.

The main control unit 20 calculates the ambient temperature Ta using the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2. The ambient temperature Ta corresponds to the temperature in the vicinity of the thermocouple connection terminal 60 in the temperature adjusting device 10. A specific method for calculating the ambient temperature Ta will be described later.

Further, the main control unit 20 uses the calculated terminal temperature Tb to correct the temperature of the detection target before correction using a known method, and calculates the temperature of the detection target. Further, the main control unit 20 generates a temperature control signal using the difference between the calculated temperature of the detected object and the target temperature, and outputs the temperature control signal to the control output unit 52. The temperature control signal is a signal for controlling the control output unit 52 so that the difference between the calculated temperature of the detected object and the target temperature approaches zero.

The communication unit 51 includes, for example, a communication interface IC. The communication unit 51 is connected to the main control unit 20 and is connected to an external control network or the like. The communication unit 51 transmits, for example, at least one of the ambient temperature Ta calculated by the main control unit 20 and the corrected temperature of the detected object to another control device, a database, or the like via the control network.

The control output unit 52 is constituted by, for example, a power control transistor. The control output unit 52 is connected to the main control unit 20 and is connected to an external known power control device that controls energization to a heater or the like that heats the detection target. Control of the power control apparatus via the control output unit 52 realizes temperature adjustment for the detected object.

The notification unit 53 includes, for example, an LED, a liquid crystal display panel, and the like. The notification unit 53 is connected to the main control unit 20. The notification unit 53 displays any one of the ambient temperature Ta calculated by the main control unit 20, the corrected temperature of the detected object, the temperature adjustment state, and the like.

The power supply unit 70 is connected to an external power supply 700 via a power supply bus line or the like. The power supply unit 70 receives power from the external power source 700, converts the voltage into a voltage corresponding to each function unit, and each function unit that requires power (the portion surrounded by a thick dotted line in FIG. 1). ).

In such a configuration, a portion that generates heat by driving becomes a heat source 110 of the temperature adjusting device 10. For example, in the example of FIG. 1, the heat source 110 corresponds to the hatched portion surrounded by the thin dotted line shown in FIG. 1, and the main control unit 20, the communication unit 51, the control output unit 52, and the power supply unit 70. including.

(Construction)
FIG. 2A is a front view of the temperature adjustment device, and FIG. 2B is a side sectional view showing a schematic internal structure of the temperature adjustment device.

2A and 2B, the temperature adjustment device 10 includes a housing 90 and a substrate 900. The housing 90 includes a front wall 901, a back wall 902, a top wall 903, a bottom wall 904, a side wall 905, and a side wall 906. The housing 90 has an internal space surrounded by these walls. A thermocouple connection terminal 60 is disposed on the front wall 901.

The substrate 900 includes the main control unit 20, the terminal temperature measurement element 30, the first internal temperature measurement element 31, the second internal temperature measurement element 32, the temperature detection signal generation unit 41, the temperature detection signal generation unit 42, and the temperature detection. Devices that implement the signal generation unit 43, the temperature detection signal generation unit 44, the communication unit 51, the control output unit 52, the notification unit 53, the storage unit 54, and the power supply unit 70 are mounted. Note that the notification unit 53 may not be directly mounted on the substrate 900.

At this time, as shown in FIG. 2B, the terminal temperature measuring element 30 is disposed in the vicinity of the front wall 901 of the substrate 900, that is, in the vicinity of the thermocouple connection terminal 60.

The first internal temperature measuring element 31 and the second internal temperature measuring element 32 are arranged at positions that are more easily affected by heat from the heat source 110 than the terminal temperature measuring element 30. The position that is easily affected by heat from the heat source 110 is, for example, a position where a physical distance to the heat source 110 is close, or a position where heat conduction to the heat source 110 is high.

Furthermore, the first internal temperature measurement element 31 and the second internal temperature measurement element 32 have substantially the same influence of heat from the heat source 110 in the first posture of the housing 90 and the first posture of the housing 90. In other postures (second posture, third posture), the heat from the heat source 110 is arranged at different positions. Here, the first posture is a posture in which the top wall 903 shown in FIG. 2B is on the upper side of the housing 90, and the second posture is the front wall shown in FIG. 3A. The posture 901 is an upper side of the housing 90, and the third posture is a posture in which the back wall 902 shown in FIG.

As a specific example, as shown in FIGS. 2B, 3A, and 3B, the first internal temperature measuring element 31 and the second internal temperature measuring element 32 are formed of a housing 90. In the direction connecting the top wall 903 and the bottom wall 904, the heat source 110 is disposed on the same side, and the distance from the heat source 110 in this direction is also substantially the same. Further, the second internal temperature measuring element 32 is disposed at a position spaced apart from the first internal temperature measuring element 31 by a predetermined distance on the front wall 901 side. In other words, the second internal temperature measurement element 32 is disposed between the terminal temperature measurement element 30 and the first internal temperature measurement element 31.

By adopting such a structure, in the first posture shown in FIG. 2B, the first internal temperature measuring element 31 and the second internal temperature measuring element 32 are substantially the same affected by the heat of the heat source 110. Become. In the second posture shown in FIG. 3A, the second internal temperature measurement element 32 is more susceptible to the heat of the heat source 110 than the first internal temperature measurement element 31, similarly to the terminal temperature measurement element 30. . In the third posture shown in FIG. 3B, the second internal temperature measurement element 32 is less susceptible to the heat of the heat source 110 than the first internal temperature measurement element 31, like the terminal temperature measurement element 30. .

FIG. 4A is a diagram showing the magnitude of the influence of internal heat generation on the ambient temperature, terminal temperature, and internal temperature (first internal temperature) in the front-facing arrangement (first posture). FIG. 4B is a diagram illustrating the magnitude of the influence of internal heat generation on the ambient temperature, the terminal temperature, and the internal temperature (first internal temperature) in the upward arrangement (second posture). FIG. 4C is a diagram illustrating the magnitude of the influence of internal heat generation of the ambient temperature, the terminal temperature, and the internal temperature (first internal temperature) in the downward arrangement (third posture).

As shown in FIG. 4 (A), FIG. 4 (B), and FIG. 4 (C), the ambient temperature Ta hardly changes regardless of the arrangement (posture). On the other hand, the terminal temperature Tb and the first internal temperature Tin1 change according to the posture. For example, as shown in FIG. 4A, in the front-facing arrangement (first posture), the terminal temperature Tb and the first internal temperature Tin1 are affected in a similar manner depending on the magnitude of the load. As shown in FIG. 4B, in the upward arrangement (second attitude), the terminal temperature Tb is more greatly affected by heat than the first internal temperature Tin1. On the other hand, as shown in FIG. 4C, in the downward arrangement (third posture), the first internal temperature Tin1 is more greatly affected by heat than the terminal temperature Tb.

When such a heat source 110 is in the temperature adjusting device 10, the terminal temperature Tb is affected by the heat generated by the heat source 110, and an error occurs.

In order to correct the error due to the influence of the heat of the heat source 110, the temperature adjustment device 10 executes the following configuration and processing.

FIG. 5 is a diagram showing the relationship between the difference between the first internal temperature Tin1 and the second internal temperature Tin2 and each posture.

As shown in FIG. 2B, FIG. 3A, and FIG. 3B, the second internal temperature measurement element 32 is provided between the terminal temperature measurement element 30 and the first internal temperature measurement element 31. Is arranged. Therefore, the influence of the second internal temperature measurement element 32 due to heat generation is closer to the influence of the terminal temperature measurement element 30 due to heat generation than the influence of the first internal temperature measurement element 31 due to heat generation.

As a result, as shown in FIG. 5, the value obtained by subtracting the second internal temperature Tin2 from the first internal temperature Tin1 is substantially 0 in the front-facing arrangement (first attitude), and is a negative value in the upward arrangement (second attitude). In the downward arrangement (third posture), it becomes a positive value.

That is, by using this subtracted value for correcting the calculation formula for the ambient temperature Ta, errors due to posture can be suppressed.

The main control unit 20 calculates the ambient temperature Ta using the following equations.

Ta = Tb-Tg-(Formula 1)
Tg = (Tin1-Tb) × a + b − (Formula 2)
a = (Tin2 / Tin1) × c − (Formula 3)
b = (Tin2 / Tin1) × d − (Formula 4)
As described above, Tb is the terminal temperature, Tg is the thermal error, Tin1 is the first internal temperature, and Tin2 is the second internal temperature. Further, c and d are correction values determined in advance through experiments or the like.

As is clear from Equation 3, a is a value corresponding to the ratio between the first internal temperature Tin1 and the second internal temperature Tin2.

By using these equations, the thermal error Tg due to the heat source 110 included in the terminal temperature Tb is corrected. Further, the influence of the heat error Tg on the heat source 110 is suppressed.

Thereby, the main controller 20 can accurately calculate the ambient temperature Ta without being affected by the heat generation state of the heat source 110 and the attitude of the housing 90.

The correction values c and d may be set as follows, for example. Note that the following method is performed under the condition that there is no adjacent device or that the device is not affected by heat from the adjacent device.

(A) First method (method of setting from two different temperature conditions)
(A-1) A state in which the heat generation from the heat source 110 is the smallest is realized by fixing to one kind of posture (the above-described front arrangement (first posture)). The temperature at this time is arbitrary but constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. Also, the ambient temperature Ta is measured and recorded using another temperature measuring instrument or the like. Here, the state in which the heat generation from the heat source 110 is the smallest is, for example, a state in which the control output unit 52 is in an operation off state and the communication load of the communication unit 51 is the smallest.

(A-2) The same operating state as (A-1) above, but with a different constant temperature. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. Also, the ambient temperature Ta is measured and recorded using another temperature measuring instrument or the like.

(A-3) The measurement results of (A-1) and (A-2) described above are substituted into the above (Expression 1) and (Expression 2), and a and b are calculated from the simultaneous equations. Then, the calculated a is set as the correction value c, and the calculated b is set as the correction value d.

(B) Second method (a method of setting from the condition that the difference in heat generation is maximized)
(B-1) Similar to the above (A-1), it is fixed in one kind of posture (the above-described front arrangement (first posture)) to realize a state where the heat generation of the heat source 110 is the smallest. The temperature at this time is arbitrary but constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. Also, the ambient temperature Ta is measured and recorded using another temperature measuring instrument or the like.

(B-2) A state in which the heat generation from the heat source 110 is the largest is realized by fixing to one kind of posture (the above-described front arrangement (first posture)). The temperature at this time is arbitrary but constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. Also, the ambient temperature Ta is measured and recorded using another temperature measuring instrument or the like. Here, the state in which the heat generation from the heat source 110 is the largest is, for example, a state in which the control output unit 52 is in an operation-on state and the communication load of the communication unit 51 is the largest.

(B-3) Substituting the above measurement results (B-1) and (B-2) into the above (Expression 1) and (Expression 2), and calculating a and b from the simultaneous equations. Then, the calculated a is set as the correction value c, and the calculated b is set as the correction value d.

By using such a process, the ambient temperature Ta can be accurately calculated without using a complicated calculation formula.

In the above description, the aspect in which the calculation of the ambient temperature Ta is divided into a plurality of functional blocks is shown. However, the calculation of the ambient temperature Ta has at least the processing shown in the flow shown in FIG. Good. FIG. 6 is a flowchart showing the temperature measurement method according to the embodiment of the present invention.

The temperature adjusting device 10 acquires the terminal temperature Tb (S11). The temperature adjusting device 10 acquires the first internal temperature Tin1 and the second internal temperature Tin2 (S12). The temperature adjustment device 10 calculates the ambient temperature Ta by substituting the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2 into the above-described (Expression 1) and (Expression 2).

Further, in the above description, the configuration of the temperature adjustment device 10 is shown. However, when the above-described temperature adjustment processing is not performed, for example, when the configuration does not include the control output unit 52, the temperature adjustment device 10 is also used. it can.

In the above description, the ratio between the first internal temperature Tin1 and the second internal temperature Tin2 is used as the correction coefficient for calculating the ambient temperature Ta. However, any value corresponding to the ratio using the first internal temperature Tin1 and the second internal temperature Tin2 can be used for the correction coefficient.

10: Temperature control device 20: Main control unit 30: Terminal temperature measurement element 31: First internal temperature measurement element 32: Second internal temperature measurement elements 41, 42, 43, 44: Temperature detection signal generation unit 51: Communication unit 52 : Control output unit 53: Notification unit 54: Storage unit 60: Thermocouple connection terminal 70: Power supply unit 90: Case 110: Heat source 600: Thermocouple 700: External power supply 900: Substrate 901: Front wall 902: Back wall 903: Top wall 904: Bottom wall 905, 906: Side wall

Claims (6)

A terminal temperature measuring element arranged in the vicinity of the terminal to which the thermocouple in the housing is connected;
A first internal temperature measurement element disposed in a position closer to the heat source than the terminal temperature measurement element in the housing;
A second internal temperature measurement element disposed in a position different from the first internal temperature measurement element at a position closer to the heat source than the terminal temperature measurement element in the housing;
Using the terminal temperature measured by the terminal temperature measuring element, the first internal temperature measured by the first internal temperature measuring element, and the second internal temperature measured by the second internal temperature measuring element, the housing is used. A control unit for calculating the ambient temperature of the body;
With
The first internal temperature measurement element and the second internal temperature measurement element are configured such that an influence of heat from the heat generation source in the first internal temperature measurement element and heat from the heat generation source in the second internal temperature measurement element are provided. Is arranged at a position where the difference from the influence of the change according to the attitude of the housing,
Temperature measuring device. The second internal temperature measuring element is
In the first posture of the casing, the influence of heat is the same as that of the first internal temperature measurement element, and in the second posture of the casing, the influence of heat is different from that of the first internal temperature measurement element. Arranged,
The temperature measuring device according to claim 1. In the calculation formula for calculating the ambient temperature by the control unit,
A difference term between the terminal temperature and the first internal temperature is included;
The correction coefficient of the difference term is a value calculated from the first internal temperature and the second internal temperature.
The temperature measuring device according to claim 1 or 2. The correction coefficient is a value corresponding to a ratio between the first internal temperature and the second internal temperature.
The temperature measuring device according to claim 3. A process of measuring a terminal temperature at a terminal to which a thermocouple in the housing is connected;
A process of measuring the first internal temperature at a position closer to the heat source than the measurement position of the terminal temperature in the housing;
A process of measuring the second internal temperature at a position different from the measurement position of the first internal temperature at a position closer to the heat source than the measurement position of the terminal temperature in the housing;
A process of calculating an ambient temperature of the housing using the terminal temperature, the first internal temperature, and the second internal temperature;
Have
The measurement position of the first internal temperature and the measurement position of the second internal temperature are the influence of heat from the heat source at the measurement position of the first internal temperature and the heat generation at the measurement position of the second internal temperature. The difference with the influence of heat from the source is a position that changes according to the attitude of the housing,
Ambient temperature measurement method. A process of measuring a terminal temperature at a terminal to which a thermocouple in the housing is connected;
A process of measuring the first internal temperature at a position closer to the heat source than the measurement position of the terminal temperature in the housing;
A process of measuring the second internal temperature at a position different from the measurement position of the first internal temperature at a position closer to the heat source than the measurement position of the terminal temperature in the housing;
A process of calculating an ambient temperature of the housing using the terminal temperature, the first internal temperature, and the second internal temperature;
Is executed by the arithmetic processing unit,
The measurement position of the first internal temperature and the measurement position of the second internal temperature are the influence of heat from the heat source at the measurement position of the first internal temperature and the heat generation at the measurement position of the second internal temperature. The difference with the influence of heat from the source is a position that changes according to the attitude of the housing,
Ambient temperature measurement program.

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