WO2019161282A1 - Thermal interface materials having high dielectric losses and low dielectric constants - Google Patents

Abstract

Disclosed are exemplary embodiments of thermal interface materials (TIMs) having high dielectric losses and low dielectric constants, whereby the thermal interface material may be configured to have a dielectric constant within a range from about 3 to about 20 and a loss tangent within a range from about 0.10 to 1.0. The thermal interface material with high dielectric losses may reduce EMI from resonances created by a capacitance of a heat sink and a heat source.

Description

THERMAL INTERFACE MATERIALS HAVING

HIGH DIELECTRIC LOSSES AND LOW DIELECTRIC CONSTANTS

FIELD

[0001] The present disclosure relates to thermal interface materials having high dielectric losses and low dielectric constants.

BACKGROUND

[0002] This section provides background information related to the present disclosure which is not necessarily prior art.

[0003] Electrical components, such as semiconductors, integrated circuit packages, transistors, etc ., typically have pre-designed temperatures at which the electrical components optimally operate. Ideally, the pre-designed temperatures approximate the temperature of the surrounding air. But the operation of electrical components generates heat. If the heat is not removed, the electrical components may then operate at temperatures significantly higher than their normal or desirable operating temperature. Such excessive temperatures may adversely affect the operating characteristics of the electrical components and the operation of the associated device.

[0004] To avoid or at least reduce the adverse operating characteristics from the heat generation, the heat should be removed, for example, by conducting the heat from the operating electrical component to a heat sink. The heat sink may then be cooled by conventional convection and/or radiation techniques. During conduction, the heat may pass from the operating electrical component to the heat sink either by direct surface contact between the electrical component and heat sink and/or by contact of the electrical component and heat sink surfaces through an intermediate medium or thermal interface material (TIM). The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor.

[0005] In addition, a common problem in the operation of electronic devices is the generation of electromagnetic radiation within the electronic circuitry of the equipment. Such radiation may result in electromagnetic interference (EMI) or radio frequency interference (RFI), which can interfere with the operation of other electronic devices within a certain proximity. Without adequate shielding, EMI/RFI interference may cause degradation or complete loss of important signals, thereby rendering the electronic equipment inefficient or inoperable. [0006] A common solution to ameliorate the effects of EMI/RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy. These shields are typically employed to localize EMI/RFI within its source, and to insulate other devices proximal to the EMI/RFI source. The term“EMI” as used herein should be considered to generally include and refer to EMI emissions and RFI emissions, and the term“electromagnetic” should be considered to generally include and refer to electromagnetic and radio frequency from external sources and internal sources. Accordingly, the term shielding (as used herein) broadly includes and refers to mitigating (or limiting) EMI and/or RFI, such as by absorbing, reflecting, blocking, and/or redirecting the energy or some combination thereof so that it no longer interferes, for example, for government compliance and/or for internal functionality of the electronic component system.

DRAWINGS

[0007] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and is not intended to limit the scope of the present disclosure.

[0008] FIG. 1 shows a modeled system in which the excitation source is a loop antenna realized on a PCB substrate.

[0009] FIG. 2 is a line graph of Total Radiated Power in decibels-milliwatt (dBm) versus frequency from 1 GHz to 6 GHz, which includes values calculated using the modeled system shown in FIG. 1 without a thermal interface material (TIM) between the source and heat sink, and also with a TIM having a dielectric constant (K) equal to 7 positioned between the source and heat sink. FIG. 2 also indicates the frequency of 2.5 GHz which is in the WiFi band.

[0010] FIG. 3 is a line graph of Total Radiated Power (in dBm) versus frequency from 1 GHz to 6 GHz, which includes the calculated values shown in FIG. 2. FIG. 3 also includes calculated values using the modeled system shown in FIG. 1 with a TIM having a dielectric constant (K) equal to 3 positioned between the source and heat sink.

[0011] FIG. 4 is a line graph of Total Radiated Power (in dBm) versus frequency from 1 GHz to 6 GHz, which includes the calculated values (TIM with K=3 and K=7) shown in FIG. 3. FIG. 4 also includes calculated values using the modeled system shown in FIG. 1 with a TIM having a dielectric constant equal to 3 and a loss tangent equal to 0.5 (a complex permittivity of 3-j 1.5) positioned between the source and heat sink. [0012] FIG. 5 is a line graph of Total Radiated Power (in dBm) versus frequency from 0 GHz to 18 GHz, which includes values calculated when a TIM with K=3, a TIM with K=7, and a TIM with K=3 and a loss tangent equal to 3 (a complex permittivity of 3-j 1.5) were respectively positioned between the source and heat sink of the modeled system shown in FIG. 1.

DETAILED DESCRIPTION

[0013] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0014] Electromagnetic energy radiated by a source can couple to a heat sink. If the electromagnetic energy is at a resonant frequency of the system, the heat sink will act as an efficient antenna and radiate. The resonant frequencies are dependent on the dimensions of the heat sink and the dielectric constant of the thermal interface material. Conventionally, thermal interface materials generally have low dielectric losses in the radio frequency (RF)/microwave range. It is commonly believed that a thermal interface material (TIM) with a lower dielectric constant will reduce EMI from a heat sink/TIM combination. Contrary to this, the inventor hereof has recognized that TIMs with high dielectric losses may reduce EMI from resonances created by the capacitance of a heat sink and a heat source ( e.g ., a printed circuit board/integrated circuit PCB/IC, etc.). Accordingly, disclosed herein are exemplary embodiments of thermal interface materials having high dielectric losses and low dielectric constants.

[0015] With reference to the figures, FIG. 1 shows a modeled system in which the excitation source is a loop antenna realized on a PCB substrate. FIG. 2 is a line graph of Total Radiated Power in decibels-milliwatt (dBm) versus frequency from 1 GHz to 6 GHz, which values were calculated using the modeled system shown in FIG. 1 without a thermal interface material (TIM) between the source and heat sink and also with a TIM having a dielectric constant equal to 7 positioned between the source and heat sink. FIG. 2 also indicates the frequency of 2.5 GHz, which is in the WiFi band. Generally, FIG. 2 shows that the effect of the TIM with a dielectric constant of 7 is to pull the first resonance down into the WiFi band (as shown by the arrow). This will cause the system to resonate at 2.5 GHz hence energy in the system will couple to the heat sink and re-radiate, which will adversely affect WiFi performance. In this case, the inventor hereof has recognized that this problem may be eliminated by using a thermal interface material with a lower dielectric constant material as shown in FIG. 3.

[0016] FIG. 3 is a line graph of Total Radiated Power (in dBm) versus frequency from 1 GHz to 6 GHz. FIG. 3 includes the calculated values shown in FIG. 2 and calculated values using the modeled system shown in FIG. 1 with a TIM having a dielectric constant equal to 3 positioned between the source and heat sink. Generally, FIG. 3 shows the reduction in total radiated power caused by the shift in resonant frequency to a higher frequency (as shown by the arrow) using the lower dielectric constant TIM.

[0017] Energy coupling between the source and heat sink is primarily via the displacement current. The inventor has recognized that an efficient way to attenuate the displacement current is to increase the dielectric loss of the material. Accordingly, a model was run using a material with dielectric constant equal to 3 and a loss tangent of 0.5. This would result in a complex permittivity of 3 -j 1.5. The results are shown in FIG. 4, which is a line graph of Total Radiated Power (in dBm) versus frequency from 1 GHz to 6 GHz. FIG. 4 includes the calculated values (TIM with K=3 and K=7) shown in FIG. 3. FIG. 4 also includes calculated values using the modeled system shown in FIG. 1 with a TIM having a dielectric constant equal to 3 and a loss tangent equal to 0.5 (a complex permittivity of 3-j 1.5) positioned between the source and heat sink.

[0018] Generally, FIG. 4 shows that the TIM with high dielectric loss effectively reduced all resonances (as shown by the arrow) from 1 to 6 GHz. The effect is more dramatic when we expand the frequency range to 18 GHz as shown in FIG. 5, which is a line graph of Total Radiated Power (in dBm) versus frequency from 0 GHz to 18 GHz. FIG. 5 includes values calculated when a TIM with K=3, a TIM with K=7, and a TIM with K=3 and a loss tangent equal to 3 (a complex permittivity of 3-j 1.5) were respectively positioned between the source and heat sink of the modeled system shown in FIG. 1.

[0019] Disclosed herein are exemplary embodiments of thermal interface materials having high dielectric losses and low dielectric constants. In exemplary embodiments, a thermal interface material may have a dielectric constant within a range from about 3 to about 20 ( e.g ., 3, 4.5, 20, 10, greater than 3 but less than 20, etc.) and a loss tangent within a range from about 0.10 to about 1.0 (e.g., 0.10, 0.50, 1.0, greater than 0.1 but less than 1.0, etc.). The values for dielectric constant and loss tangent may be measured at room temperature of 21 degrees Celsius (°C) at frequencies from about 1 GHz to about 18 GHz. The thermal interface material may be relatively soft and/or have a relatively high thermal conductivity (e.g, 1 watts per meter per Kelvin (W/mK) or more, etc.).

[0020] In exemplary embodiments, the thermal interface material (e.g, a dielectrically lossy thermal interface material, a thermally-conductive EMI absorber, etc.) includes a matrix loaded with dielectrically lossy filler. The matrix comprises silicone elastomer, hydrocarbon resin, epoxy, and/or other matrix material(s) loaded with the dielectrically lossy filler. The dielectrically lossy filler comprises alumina, silicon carbide, carbon black, and/or other filler(s). In exemplary embodiments, the thermal interface material ( e.g ., a dielectrically lossy thermal interface material, a thermally-conductive EMI absorber, etc.) includes a blend of silicon carbide, carbon black, alumina, and/or other filler. In an exemplary embodiment, the thermal interface material includes about 3 to 10 volume percent of silicone carbide (e.g., 3 volume percent of silicone carbide, 10 volume percent of silicone carbide, greater than 3 but less than 10 volume percent of silicone carbide, etc.), about 3 to 10 volume percent of carbon black (e.g, 3 volume percent of carbon black, 10 volume percent of carbon black, greater than 3 but less than 10 volume percent of carbon black, etc.), and about 18 to 23 volume percent of alumina (e.g, 18 volume percent of alumina, 23 volume percent of alumina, greater than 18 but less than 23 volume percent of alumina, etc.).

[0021] Also disclosed herein are methods of mitigating or reducing EMI. In an exemplary embodiment, a method generally includes positioning and/or using a thermal interface material having a high dielectric loss and a low dielectric constant generally between one or more heat sources and one or more heat removal/dissipation structures or components (e.g, a heat spreader, a heat sink, a heat pipe, a device exterior case or housing, etc.). The thermal interface material may establish a thermal joint, interface, pathway, or thermally-conductive heat path along which heat may be transferred (e.g, conducted) from the heat source to the heat removal/dissipation structure or component.

[0022] In an exemplary embodiment, a method generally includes positioning and/or using a thermal interface material having a relatively low dielectric constant (e.g, within a range from about 3 to about 20, etc.) and a relatively low loss tangent (e.g, within a range from about 0.10 to about 1.0, etc.) generally between a heat sink and a heat source. The thermal interface material may reduce EMI from the heat sink/TIM combination and/or reduce EMI from resonances created by the capacitance of the heat sink and the heat source (e.g, a printed circuit board/integrated circuit PCB/IC, etc.). Accordingly, also disclosed herein are exemplary embodiments of methods of reducing EMI from a heat sink/TIM combination and methods of reducing EMI from resonances created by the capacitance of a heat sink and a heat source.

[0023] In exemplary embodiments of a thermal interface material having a high dielectric loss and low dielectric constant, the thermal interface material may include a matrix loaded with filler materials with volume filler loadings ranging from about 5% to about 98% (e.g., 5%, 98%, percentage greater than 5% but less than 98%, etc.). The matrix may comprise a silicone matrix in which are dispersed thermally-conductive filler and/or EMI absorbing filler. Exemplary fillers include alumina, zinc oxide, boron nitride, silicon nitride, aluminum, aluminum nitride, iron, metallic oxides, graphite, ceramic, silicon carbide, manganese zinc ferrite, magnetic flakes, carbonyl iron powder, carbon graphite fiber, carbon black, combinations thereof, etc.

[0024] In exemplary embodiments of a thermal interface material having a high dielectric loss and low dielectric constant, the thermal interface material may have a relatively high thermal conductivity ( e.g ., 1 W/mK, 2 W/mK, 3 W/mK, 4 W/mK, 5 W/mK, 6 W/mK, etc.) depending on the particular materials used to make the material and filler loading percentage. These thermal conductivities are only examples as other embodiments may include a thermal management and/or EMI mitigation material with a thermal conductivity higher than 6 W/mK, less than 1 W/mK, or other values between 1 and 6 W/mk.

[0025] In exemplary embodiments of a thermal interface material having a high dielectric loss and low dielectric constant, the thermal interface material may be a thermal gap filler, thermal phase change material, thermally-conductive EMI absorber or hybrid thermal/EMI absorber, thermal grease, thermal paste, thermal putty, a dispensable thermal interface material, a thermal pad, etc. The thermal interface material may be relatively soft, e.g., with a hardness of less than 25 Shore 00, greater than 75 Shore 00, between 25 and 75 Shore 00, etc.

[0026] In exemplary embodiments of a thermal interface material having a high dielectric loss and low dielectric constant, the thermal interface material may be used to define or provide part of a thermally-conductive heat path from a heat source to a heat removal/dissipation structure or component. A thermal interface material disclosed herein may be used, for example, to help conduct thermal energy (e.g, heat, etc.) away from a heat source of an electronic device (e.g, one or more heat generating components, central processing unit (CPU), die, semiconductor device, etc.). A thermal interface material may be positioned generally between a heat source and a heat removal/dissipation structure or component (e.g, a heat spreader, a heat sink, a heat pipe, a device exterior case or housing, etc.) to establish a thermal joint, interface, pathway, or thermally-conductive heat path along which heat may be transferred (e.g, conducted) from the heat source to the heat removal/dissipation structure or component. During operation, the thermal interface material may then function to allow transfer (e.g, to conduct heat, etc.) of heat from the heat source along the thermally-conductive path to the heat removal/dissipation structure or component.

[0027] In exemplary embodiments of a thermal interface material having a high dielectric loss and low dielectric constant, the thermal interface material may be used with a wide range of heat sources, electronic devices, and/or heat removal/dissipation structures or components ( e.g ., a heat spreader, a heat sink, a heat pipe, a device exterior case or housing, etc.). For example, a heat source may comprise one or more heat generating components or devices (e.g., a CPU, die within underfill, semiconductor device, flip chip device, graphics processing unit (GPU), digital signal processor (DSP), multiprocessor system, integrated circuit, multi-core processor, etc.). Generally, a heat source may comprise any component or device that has a higher temperature than the thermal interface material or otherwise provides or transfers heat to the thermal interface material regardless of whether the heat is generated by the heat source or merely transferred through or via the heat source. Accordingly, aspects of the present disclosure should not be limited to use with any single type of heat source, electronic device, heat removal/dissipation structure, etc.

[0028] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well- known processes, well-known device structures, and well-known technologies are not described in detail. In addition, advantages and improvements that may be achieved with one or more exemplary embodiments of the present disclosure are provided for purpose of illustration only and do not limit the scope of the present disclosure, as exemplary embodiments disclosed herein may provide all or none of the above mentioned advantages and improvements and still fall within the scope of the present disclosure.

[0029] Specific dimensions, specific materials, and/or specific shapes disclosed herein are example in nature and do not limit the scope of the present disclosure. The disclosure herein of particular values and particular ranges of values for given parameters are not exclusive of other values and ranges of values that may be useful in one or more of the examples disclosed herein. Moreover, it is envisioned that any two particular values for a specific parameter stated herein may define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that any value between the first and second values could also be employed for the given parameter). For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if parameter X is exemplified herein to have values in the range of 1 - 10, or 2 - 9, or 3 - 8, it is also envisioned that Parameter X may have other ranges of values including 1 - 9, 1 - 8, 1 - 3, 1 - 2, 2 - 10, 2 - 8, 2 - 3, 3 - 10, and 3 - 9.

[0030] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms“a”,“an” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms“comprises,”“comprising,”“including,” and“having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[0031] When an element or layer is referred to as being“on”,“engaged to”,“connected to” or“coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being“directly on,”“directly engaged to”,“directly connected to” or“directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion ( e.g .,“between” versus“directly between,”“adjacent” versus“directly adjacent,” etc.). As used herein, the term“and/or” includes any and all combinations of one or more of the associated listed items.

[0032] The term “about” when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by “about” is not otherwise understood in the art with this ordinary meaning, then“about” as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms“generally”,“about”, and“substantially” may be used herein to mean within manufacturing tolerances. Or for example, the term“about” as used herein when modifying a quantity of an ingredient or reactant of the invention or employed refers to variation in the numerical quantity that can happen through typical measuring and handling procedures used, for example, when making concentrates or solutions in the real world through inadvertent error in these procedures; through differences in the manufacture, source, or purity of the ingredients employed to make the compositions or carry out the methods; and the like. The term“about” also encompasses amounts that differ due to different equilibrium conditions for a composition resulting from a particular initial mixture. Whether or not modified by the term“about”, the claims include equivalents to the quantities.

[0033] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as“first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0034] Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as“below” or“beneath” other elements or features would then be oriented“above” the other elements or features. Thus, the example term“below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0035] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

CLAIMS What is claimed is:

1. A thermal interface material configured to have a high dielectric loss and a low dielectric constant, whereby the thermal interface material may be configured to have a dielectric constant within a range from about 3 to about 20 and a loss tangent within a range from about 0.10 to about 1.0.

2. The thermal interface material of claim 1, wherein the thermal interface material has a dielectric constant within a range from about 3 to about 20 and a loss tangent within a range from about 0.10 to about 1.0 that are measured at room temperature of 21 degrees Celsius (°C) at frequencies from about 1 GHz to about 18 GHz.

3. The thermal interface material of any one of the preceding claims, wherein the thermal interface material has a thermal conductivity of at least 1 watt per meter per Kelvin (W/mK).

4. The thermal interface material of any one of the preceding claims, wherein the thermal interface material has a dielectric constant of 3 and a loss tangent of 0.50.

5. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises a matrix loaded with one or more fillers, and wherein a volume filler loading is within a range from about 5% to about 98%; and/or wherein the matrix comprises a silicone matrix; and/or wherein the one or more fillers comprise one or more of alumina, zinc oxide, boron nitride, silicon nitride, aluminum, aluminum nitride, iron, metallic oxides, graphite, ceramic, silicon carbide, manganese zinc ferrite, magnetic flakes, carbonyl iron powder, carbon graphite fiber, carbon black, or a combination thereof.

6. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises a dielectrically lossy thermal interface material.

7. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises a thermally-conductive EMI absorber.

8. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises a matrix loaded with one or more dielectrically lossy fillers.

9. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises a matrix loaded with one or more fillers, and wherein the matrix comprises silicone elastomer, hydrocarbon resin, and/or epoxy; and/or wherein the one or more fillers comprise alumina, silicon carbide, and/or carbon black.

10. The thermal interface material of any one of the preceding claims, wherein the thermal interface comprises about 3 to 10 volume percent of silicon carbide, about 3 to 10 volume percent of carbon black, and about 18 to 23 volume percent of the alumina.

11. A thermal interface material configured to have a high dielectric loss and a low dielectric constant, wherein the thermal interface comprises a matrix loaded with one or more dielectrically lossy fillers; the matrix comprises silicone elastomer, hydrocarbon resin, and/or epoxy; the one or more dielectrically lossy fillers comprise alumina, silicon carbide, and/or carbon black; the thermal interface material has a dielectric constant within a range from about 3 to about 20 and a loss tangent within a range from about 0.10 to about 1.0 that are measured at room temperature of 21 degrees Celsius (°C) at frequencies from about 1 GHz to about 18 GHz; and the thermal interface material has a thermal conductivity of at least lwatt per meter per Kelvin (W/mK).

12. The thermal interface material of claim 11, wherein the thermal interface comprises a dielectrically lossy thermal interface material including about 3 to 10 volume percent of silicon carbide, about 3 to 10 volume percent of carbon black, and about 18 to 23 volume percent of the alumina.

13. The thermal interface material of claim 11 or 12, wherein the thermal interface material has a dielectric constant of 3 and a loss tangent of 0.50.

14. A device comprising one or more heat sources, one or more heat removal/dissipation structures, and the thermal interface material of any one of the preceding claims positioned generally between the one or more heat sources and the one or more heat removal/dissipation structures such that the thermal interface material establish at least a portion of a thermally-conductive heat path along which heat is transferrable from the one or more heat sources to the one or more heat removal/dissipation structures.

15. A method comprising positioning and/or using the thermal interface material of any one of claims 1 to 14 generally between one or more heat sources and one or more heat removal/dissipation structures, whereby the thermal interface material establishes at least a portion of a thermally-conductive heat path along which heat is transferrable from the one or more heat sources to the one or more heat removal/dissipation structures; and/or whereby the thermal interface material is operable for reducing electromagnetic interference from a combination of the one or more heat sources and the thermal interface material; and/or whereby the thermal interface material is operable for reducing electromagnetic interference from resonances created by a capacitance of the one or more heat sources and the one or more heat removal/dissipation structures.