WO2019150683A1 - Substrate cleaning device, substrate processing device, ultrasonic cleaning fluid supply device, and recording medium - Google Patents

Abstract

The present invention provides a substrate cleaning device having high cleaning power. In an embodiment, there is provided a substrate cleaning device comprising a substrate rotation mechanism that holds and rotates a substrate, and a nozzle that sprays an ultrasonic cleaning fluid toward the rotated substrate, the nozzle being capable of pivoting within a plane perpendicular to the substrate, and also capable of pivoting within a plane parallel to the substrate.

Description

Substrate cleaning apparatus, substrate processing apparatus, ultrasonic cleaning liquid supply apparatus, and recording medium

The present invention relates to a substrate cleaning apparatus, a substrate processing apparatus, an ultrasonic cleaning liquid supply apparatus, and a recording medium.

Conventionally, an apparatus for cleaning a semiconductor substrate using ultrasonic waves is known (for example, Patent Documents 1 and 2).

JP 2001-53047 A JP 2017-162889 A

に す る Make the substrate more suitable for cleaning.

According to one aspect of the present invention, a substrate rotating mechanism that holds and rotates a substrate, and a nozzle that ejects an ultrasonic cleaning liquid toward the rotated substrate, the nozzle being perpendicular to the substrate. There is provided a substrate cleaning apparatus that can be swiveled in a plane and that can be swiveled in a plane parallel to the substrate.

It is desirable that the nozzle sprays an ultrasonic cleaning liquid onto the edge and / or bevel of the substrate.

It is desirable that the nozzle can move up and down.

It is desirable that the nozzle can be raised to a position where the ultrasonic cleaning liquid is sprayed on the upper surface of the substrate and can be lowered to a position where the ultrasonic cleaning liquid is sprayed on the lower surface of the substrate.

It is desirable that the nozzle can be swung in a plane perpendicular to the substrate, so that an ultrasonic cleaning liquid can be sprayed from the inside of the substrate toward the outer periphery.

It is desirable that the nozzle sprays an ultrasonic cleaning liquid onto the substrate rotation mechanism.

It is desirable that a cleaning tool for cleaning the surface of the substrate while contacting the substrate while rotating is provided, and the nozzle sprays an ultrasonic cleaning liquid onto the cleaning tool.

It is desirable that the angle formed between the jet direction of the ultrasonic cleaning liquid from the nozzle and the longitudinal direction of the cleaning tool is greater than 0 degree and less than 90 degrees.

It is desirable that the nozzle sprays a mist-like ultrasonic cleaning liquid.

It is desirable that the substrate rotating mechanism holds the substrate in a non-horizontal direction.

The substrate rotating mechanism rotates the substrate while holding the substrate in a horizontal direction, and the nozzle is fixed to a first shaft extending in a vertical direction, and the first shaft rotates about its axis, thereby The nozzle preferably swivels in a plane horizontal to the substrate.

The substrate rotation mechanism holds and rotates the substrate in the horizontal direction, the nozzle is fixed to a second shaft extending in the horizontal direction, and the second shaft rotates about its axis, thereby The nozzle preferably swivels in a plane perpendicular to the substrate.

According to another aspect of the present invention, the substrate is held and rotated by the substrate rotation mechanism, the nozzle communicating with the ultrasonic cleaning liquid source is raised to a position higher than the upper surface of the substrate, and the substrate Moving the nozzle inwardly in the horizontal direction, and further rotating the nozzle so that the nozzle outlet faces in an orientation having an acute incident angle with respect to an edge of the upper surface of the substrate; Spraying an ultrasonic cleaning liquid toward the upper surface of the substrate; moving the nozzle outward in the horizontal direction of the substrate; lowering the nozzle to a position lower than the lower surface of the substrate; The nozzle is moved inward in the direction, and the nozzle outlet is oriented in a direction having an acute incident angle with respect to the edge of the lower surface of the substrate. Rotating the nozzle, spraying ultrasonic cleaning liquid from the nozzle toward the lower surface of the substrate, moving the nozzle outward in the horizontal direction of the substrate, and beveling the nozzle on the substrate. And rotating the nozzle so that the nozzle outlet faces the bevel of the substrate, and jetting ultrasonic cleaning liquid from the nozzle toward the bevel of the substrate; In order to execute the substrate cleaning method including the above, a non-temporary recording of a program for giving a command to the substrate cleaning apparatus and causing the computer to execute the operation of the mechanism for moving the substrate rotating mechanism and the nozzle A computer readable recording medium is provided.

According to another aspect of the present invention, the housing includes: a vibrating unit that generates an ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid; and a casing that stores the generated ultrasonic cleaning liquid. An ultrasonic cleaning liquid supply apparatus is provided in which at least a part of the surface in contact with the ultrasonic cleaning liquid is made of a conductive fluororesin.
With such a configuration, charging of the ultrasonic cleaning liquid can be suppressed.

The conductive fluororesin may be a fluororesin containing carbon nanotubes.
The fluororesin may be PTFE, PCTFE, or PFA.

Desirably, at least a part of the portion where the ultrasonic cleaning liquid is sprayed has higher heat dissipation than the conductive fluororesin.
Desirably, at least a part of the portion to which the ultrasonic cleaning liquid is sprayed is made of sapphire, quartz, or PTFE containing carbon nanotubes.
With such a configuration, the temperature of the ultrasonic cleaning liquid to be ejected can be lowered, and the cleaning power is improved.

A bias may be applied to the portion of the casing made of the conductive fluororesin.

According to another aspect of the present invention, there is provided a substrate cleaning apparatus comprising: a substrate rotating mechanism that rotates a substrate; and the ultrasonic cleaning liquid supply device that supplies the ultrasonic cleaning liquid to the rotated substrate. Provided.

According to another aspect of the present invention, a vibration unit that generates ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid, a casing that stores the generated ultrasonic cleaning liquid, and at least a part of the casing. A substrate rotating mechanism for rotating the substrate immersed in the ultrasonic cleaning liquid housed in the body, and at least a part of the surface of the housing that contacts the ultrasonic cleaning liquid is made of a conductive fluororesin. A substrate cleaning apparatus is provided.

According to another aspect of the present invention, the step of generating the ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid, and the inside of the housing in which at least a part of the surface in contact with the ultrasonic cleaning liquid is made of a conductive fluororesin A step of immersing the substrate in the ultrasonic cleaning liquid contained in the substrate, and a step of cleaning the substrate by rotating the substrate immersed in the ultrasonic cleaning liquid to flow the cleaning liquid. A substrate cleaning method is provided.

According to another aspect of the present invention, there is provided an ultrasonic cleaning liquid supply device for supplying an ultrasonic cleaning liquid to which ultrasonic waves are applied to the substrate surface, wherein the flow path for receiving the ultrasonic cleaning liquid from the outside. And a housing provided with an opening at a lower position, and at least a part of the upper surface of the bottom surface in contact with the ultrasonic cleaning liquid and the side surface of the opening in the housing includes a conductive fluororesin containing carbon nanotubes An ultrasonic cleaning liquid supply device is provided in which the other surface is a conductive material.

Further, according to another aspect of the present invention, there is provided a substrate processing apparatus including a substrate polishing apparatus for polishing a substrate and the above-described substrate cleaning apparatus for cleaning a polished substrate.

Can be cleaned properly.

The schematic top view of a substrate processing apparatus. The side surface enlarged view of the board | substrate W. FIG. 1 is a perspective view showing a schematic configuration of a substrate cleaning apparatus 4 according to a first embodiment. 1 is a top view showing a schematic configuration of a substrate cleaning apparatus 4 according to a first embodiment. The side view which shows schematic structure of the board | substrate cleaning apparatus 4 which concerns on 1st Embodiment. The side view which shows schematic structure of the board | substrate cleaning apparatus 4 which concerns on 1st Embodiment. The figure which shows a mode that an ultrasonic cleaning liquid is injected to the lower surface of the board | substrate W from the nozzle 435. FIG. The figure which shows a mode that an ultrasonic cleaning liquid is injected to the upper surface edge of the board | substrate W from the nozzle 435. FIG. The figure which shows a mode that an ultrasonic cleaning liquid is injected to the lower surface edge of the board | substrate W from the nozzle 435. FIG. The figure which shows a mode that an ultrasonic cleaning liquid is injected to the bevel of the board | substrate W from the nozzle 435. FIG. The figure which shows the specific structural example of the ultrasonic cleaning fluid supply apparatus. The figure which shows a mode that an ultrasonic cleaning liquid is injected toward the outer periphery from the inner side of the board | substrate W. FIG. 5 is a flowchart showing an example of processing operation of the substrate cleaning apparatus 4. The perspective view which shows schematic structure of the board | substrate cleaning apparatus 4 'which concerns on 2nd Embodiment. The top view showing the schematic structure of substrate cleaning device 4 'concerning a 2nd embodiment. The side view showing the schematic structure of substrate cleaning device 4 'concerning a 2nd embodiment. The figure which shows a mode that an ultrasonic cleaning liquid is injected to the lower surface of the board | substrate W from the nozzle 435. FIG. The front view which shows schematic structure of the board | substrate cleaning apparatus 4 '' which concerns on 3rd Embodiment. The side view which shows schematic structure of the board | substrate cleaning apparatus 4 '' which concerns on 3rd Embodiment. The front view which shows schematic structure of the modification of board | substrate cleaning apparatus 4 ''. The side view which shows schematic structure of the modification of board | substrate washing | cleaning apparatus 4 ''. The side view which shows schematic structure of the modification of board | substrate washing | cleaning apparatus 4 ''. The figure which shows a mode that an ultrasonic cleaning liquid is sprayed from the nozzle 435. FIG. The perspective view which shows schematic structure of the board | substrate washing | cleaning apparatus 4 '' ''. 1 is a schematic top view of a substrate processing apparatus according to an embodiment. The top view of the board | substrate cleaning apparatus 4 which concerns on 1st Embodiment. The side view of the board | substrate cleaning apparatus 4 which concerns on 1st Embodiment. The figure which shows typically schematic structure of the ultrasonic cleaning fluid supply apparatus 43. FIG. The figure which shows typically schematic structure of the ultrasonic cleaning fluid supply apparatus 43 'which is a modification of FIG. The figure which shows typically schematic structure of the ultrasonic cleaning fluid supply apparatus 43 '' which is a modification of FIG. The figure which shows typically schematic structure of the board | substrate cleaning apparatus 4 'which concerns on 2nd Embodiment. The figure which looked at FIG. 18A from the side (arrow direction).

Hereinafter, embodiments according to the present invention will be specifically described with reference to the drawings.

In the cleaning apparatus of Patent Document 1, there is a problem that the cleaning liquid in the semiconductor substrate reaches a limited area, and the cleaning power is not sufficient.

The problems of the first to third embodiments are a substrate cleaning apparatus having a high cleaning power, a substrate processing apparatus provided with such a substrate cleaning apparatus, and a program for performing such substrate cleaning. It is to provide a recording medium.
As will be described in detail below, according to the first to third embodiments, since the nozzle for injecting the ultrasonic cleaning liquid can be swung, a wide area of the substrate can be cleaned and the cleaning power is improved.

(First embodiment)
FIG. 1 is a schematic top view of a substrate processing apparatus according to an embodiment. This substrate processing apparatus is used in the manufacturing process of a magnetic film in a semiconductor wafer having a diameter of 300 mm or 450 mm, a flat panel, an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device), or an MRAM (Magnetoresistive Random Access Memory). Process various substrates. Further, the shape of the substrate is not limited to a circle, but may be a rectangular shape (square shape) or a polygonal shape.

Here, “edge” and “bevel” of the substrate W will be described. FIG. 1A is an enlarged side view of the substrate W. FIG. As illustrated, in this specification, the “edge” of the substrate W refers to the flat portion Wa near the outer periphery of the substrate surface, and more specifically, the flat portion Wa within a predetermined distance from the edge of the substrate W. Can do. Further, in this specification, the “bevel” of the substrate W is a curved surface portion Wb (FIG. 2B) having an angle from the substrate surface outside the edge, or a chamfered portion Wc and a side surface portion Wd (FIG. 2A). Refers to that. In addition, a region including both “edge” and “bevel” is referred to as “peripheral region”.

The substrate processing apparatus of the present embodiment includes a substantially rectangular housing 1, a load port 2 on which a substrate cassette for stocking a large number of substrates is placed, and one or a plurality of (four in the embodiment shown in FIG. 1) substrates. A polishing apparatus 3, one or a plurality of (two in the embodiment shown in FIG. 1) substrate cleaning apparatus 4, a substrate drying apparatus 5, transport mechanisms 6 a to 6 d, and a control unit 7 are provided.

The load port 2 is disposed adjacent to the housing 1. The load port 2 can be equipped with an open cassette, a SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod). SMIF pods and FOUPs are sealed containers that can maintain an environment independent of the external space by accommodating a substrate cassette inside and covering with a partition wall. Examples of the substrate include a semiconductor wafer.

A substrate polishing apparatus 3 for polishing the substrate, a substrate cleaning apparatus 4 for cleaning the polished substrate, and a substrate drying apparatus 5 for drying the cleaned substrate are accommodated in the housing 1. The substrate polishing apparatus 3 is arranged along the longitudinal direction of the substrate processing apparatus, and the substrate cleaning apparatus 4 and the substrate drying apparatus 5 are also arranged along the longitudinal direction of the substrate processing apparatus.

Each of the substrate cleaning device 4 and the substrate drying device 5 is a substantially rectangular housing (not shown), and can be opened and closed by a shutter mechanism, and the substrate to be processed is opened from an opening / closing portion provided in the housing portion. It may be configured to take in and out. Alternatively, as a modified embodiment, the substrate cleaning device 4 and the substrate drying device 5 may be integrated, and the substrate cleaning process and the substrate drying process may be performed continuously in one unit.

In the present embodiment, the substrate cleaning device 4 performs contact cleaning using a pen-type cleaning tool and non-contact cleaning using ultrasonic cleaning water. Although details will be described later, contact cleaning using a pen-type cleaning tool refers to contacting the lower end contact surface of a cylindrical pen-type cleaning tool extending in the vertical direction with a substrate in the presence of cleaning liquid, and rotating the cleaning tool. However, it is moved in one direction to scrub the surface of the substrate.

The substrate drying apparatus 5 includes a spin drying unit that blows IPA vapor from a moving spray nozzle toward a horizontally rotating substrate to dry the substrate, and further rotates the substrate at high speed to dry the substrate by centrifugal force. Can be used.

In a region surrounded by the load port 2 and the substrate polishing apparatus 3 and the substrate drying apparatus 5 located on the load port 2 side, a transport mechanism 6a is arranged. Further, a transport mechanism 6 b is arranged in parallel with the substrate polishing apparatus 3, the substrate cleaning apparatus 4 and the substrate drying apparatus 5. The transport mechanism 6a receives the substrate before polishing from the load port 2 and delivers it to the transport mechanism 6b, or receives the dried substrate taken out from the substrate drying apparatus 5 from the transport mechanism 6b.

Between the two substrate cleaning apparatuses 4, a transfer mechanism 6 c for transferring the substrate between the substrate cleaning apparatuses 4 is disposed, and between the substrate cleaning apparatus 4 and the substrate drying apparatus 5, the substrate cleaning apparatus 4 and the substrate drying are disposed. A transport mechanism 6c that transfers substrates between the apparatuses 5 is disposed.

Furthermore, a control unit 7 that controls the movement of each device of the substrate processing apparatus is disposed inside the housing 1. Although this embodiment demonstrates using the aspect by which the control part 7 is arrange | positioned inside the housing 1, it is not restricted to this, The control part 7 may be arrange | positioned outside the housing 1. FIG. For example, by the control unit 7, as in an embodiment described later, the operation of the spindle 41 that holds and rotates the substrate, the discharge start and end timing of the nozzle that ejects the ultrasonic cleaning liquid toward the substrate, or the nozzle It is also possible to control the vertical movement and the swiveling movement in the vertical plane. The control unit may include a memory that stores a predetermined program, a CPU (Central Processing Unit) that executes the program in the memory, and a control module that is realized by the CPU executing the program. The control module is configured so that the control unit can communicate with a host controller (not shown) that performs overall control of the substrate processing apparatus and other related apparatuses, and can exchange data with a database included in the host controller. . Here, the storage medium constituting the memory stores various programs such as various setting data and processing programs. As the storage medium, a known medium such as a computer-readable memory such as ROM or RAM, or a disk-shaped storage medium such as a hard disk, CD-ROM, DVD-ROM, or flexible disk can be used.

2A to 2D are a perspective view, a top view, and a side view, respectively, showing a schematic configuration of the substrate cleaning apparatus 4 according to the first embodiment. The substrate cleaning device 4 includes a spindle 41 and an ultrasonic cleaning liquid supply device 42, which are housed in a casing (not shown) having a shutter. Each part in the substrate cleaning apparatus 4 is controlled by the control unit 7 in FIG.

The spindle 41 supports the peripheral edge of the substrate W with the surface facing up, and rotates in a horizontal plane. More specifically, the peripheral portion of the substrate W is positioned in a gripping groove formed on the outer peripheral side surface of the top 41a provided on the upper portion of the spindle 41 and pressed inward to rotate (spin) the top 41a. W rotates. Here, “frame” is rephrased as a “gripping part” for gripping the substrate. The “spindle” can also be called a “roller”. The control unit 7 in FIG. 1 controls the rotation direction and the number of rotations of the spindle 41. The rotation speed may be constant or variable.

Note that a cup (not shown) that is outside the spindle 41 and covers the periphery of the substrate W may be provided in order to prevent the ultrasonic cleaning liquid described later from scattering. The cup may be configured such that a downflow airflow supplied into the unit from an FFU above the cleaning unit (not shown) passes through a hole provided in the cup and escapes downward. By comprising in this way, it can prevent more reliably that a washing | cleaning liquid and an ultrasonic cleaning liquid scatter.

Hereinafter, the ultrasonic cleaning liquid supply apparatus 42 will be described in detail with reference to FIGS. 2C and 2D. The ultrasonic cleaning liquid supply device 42 includes a support shaft 431, a movable shaft 432, a head 433, a turning shaft 434, and a nozzle 435.

The support shaft 431 extends in the vertical direction and is fixed.

The movable shaft 432 extends upward from the upper portion of the support shaft 431, and can move up and down, and can rotate (rotate about an axis, the same applies hereinafter). When the vertical movement of the nozzle 435 is unnecessary, the support shaft 431 and the movable shaft 432 may be integrated.

The head 433 is fixed to the upper end of the movable shaft 432. Further, a pivot shaft 434 extending in the horizontal direction passes through the head 433.

The nozzle 435 is attached to the tip of the head 433. It can be said that the nozzle 435 is attached to the movable shaft 432 via the head 433, and can be said to be attached to the turning shaft 434 via the head 433.

The nozzle 435 sprays the cleaning liquid toward the rotated substrate W. There is no limitation on the type of cleaning liquid, and it may be, for example, DIW or pure water, or may be a chemical liquid, and degassed water and gas components that have been degassed with respect to DIW or pure water are dissolved. Gas-dissolved water may be used. Examples of the chemical liquid include cleaning liquids such as weak ozone water, SC1, SC2, etching liquid, and low-concentration carbonated water. The temperature of the cleaning liquid is not limited, and the temperature may be adjustable (for example, from about 0 degrees Celsius to about 80 degrees Celsius).

In the following, a vibrator (not shown) is provided inside the nozzle 435 or the head 433, and a cleaning liquid to which ultrasonic waves are applied (hereinafter also referred to as ultrasonic cleaning liquid) is ejected. In the nozzle 435 or the head 433, when an oscillation signal is output from an oscillator (not shown) to a vibrator in the nozzle based on a control signal from the control unit 7, the vibrator vibrates and an ultrasonic wave is generated. The frequency of the ultrasonic wave is not limited, and may be, for example, a high frequency (about 800 kHz) to a very high frequency (about 5 MHz). In general, the higher the frequency, the smaller foreign particles (particles) can be removed.

In the present embodiment, the turning shaft 434 rotates, so that the nozzle 435 held by the head 433 can turn in a vertical plane (in other words, in a plane perpendicular to the substrate W) (broken line in FIG. 2C). (Refer to the arrow, hereinafter, this turning is also referred to as longitudinal turning). As shown in FIG. 2B, the ultrasonic cleaning liquid can be ejected from the side closer to the nozzle 435 to the side farther from the substrate W by such vertical turning about the turning axis 434. Specifically, even when the movable shaft 432 is at a fixed position (the height of the nozzle 435 is constant), it is desirable that the ultrasonic cleaning liquid can be ejected from end to end of the substrate W by turning in the vertical direction.

Further, as the movable shaft 432 rotates, the nozzle 435 held by the head 433 can turn in a horizontal plane (in other words, in a plane parallel to the substrate W) (see the broken line in FIG. 2B, hereinafter). This turning is also called a lateral turning). As shown in FIG. 2B, the ultrasonic cleaning liquid can be ejected in an arc shape from the left side to the right side of the turning shaft 434 in the substrate W by such a lateral turning with the movable shaft 432 as an axis.

Since the movable shaft 432 can be raised and lowered with respect to the support shaft 431, as shown in FIG. 2C, the angle in the vertical plane of the nozzle 435 (the angle formed by the ejection direction and the movable shaft 432) is constant. The position where the ultrasonic cleaning liquid is deposited on the surface of the substrate W can also be changed by changing the height of the nozzle 435.

In addition, by arbitrarily adjusting the height of the nozzle 435 and the angle of vertical rotation, the ultrasonic cleaning liquid can be supplied to a desired position according to the spray pressure of various ultrasonic cleaning liquids. Further, the position where the ultrasonic cleaning liquid is deposited on the substrate may be scanned by changing the height of the nozzle 435 and / or the angle of vertical rotation during cleaning.

Furthermore, the nozzle 435 held by the head 433 is movable from a position higher than the upper surface of the substrate W to a position lower than the upper surface of the substrate W as the movable shaft 432 moves up and down. As the nozzle 435 moves up to a position higher than the upper surface of the substrate W, the ultrasonic cleaning liquid is jetted onto the upper surface of the substrate W (FIG. 2D). That is, as shown in FIG. 2D, the movable shaft 432 moves up and down and can be turned in the vertical direction. On the other hand, when the nozzle 435 is lowered to a position lower than the lower surface of the substrate W, the ultrasonic cleaning liquid is jetted onto the lower surface of the substrate W (FIG. 3). Similarly to the case where the ultrasonic cleaning liquid is sprayed onto the upper surface of the substrate W, the spraying of the ultrasonic cleaning liquid from the end to the end of the lower surface of the substrate W may be realized only by the vertical rotation of the nozzle 435. You may implement | achieve only by a vertical motion, or you may implement | achieve combining a vertical direction turning and a vertical motion.

Each member of the ultrasonic cleaning liquid supply device 42 is controlled by a nozzle moving mechanism (not shown), and the nozzle 435 moves. In one embodiment, the nozzle moving mechanism includes, for example, a driving mechanism that generates a driving force such as a cylinder or a motor, and the driving force from the driving mechanism is used to raise, lower, rotate, and rotate the movable shaft 432. It can be set as the mechanism containing the conversion mechanism (For example, a link mechanism, a planetary gear mechanism, etc.) which converts into rotation of this.

With the above mechanism, the ultrasonic cleaning liquid can be sprayed over a wide area of the substrate W. For example, as shown in FIGS. 4A to 4C, the edge and bevel of the substrate W can be cleaned by moving the movable shaft 432 up and down and turning in the vertical direction. Specifically, the ultrasonic cleaning liquid can be sprayed onto the edge of the upper surface of the substrate W by raising the nozzle 435 to a position higher than the upper surface of the substrate W and turning the nozzle 435 in a vertical direction so that the nozzle 435 is slightly downward (FIG. 4A). ). Conversely, the ultrasonic cleaning liquid can be sprayed onto the edge of the lower surface of the substrate W by lowering the nozzle 435 to a position lower than the upper surface of the substrate W and turning it vertically so that the nozzle 435 is slightly upward (FIG. 4B). Further, the ultrasonic cleaning liquid can be sprayed onto the bevel of the substrate W by setting the nozzle 435 to the same height as the substrate W and turning the nozzle 435 in the vertical direction so that the nozzle 435 is horizontally oriented (FIG. 4C).

In addition, the mechanism for moving the nozzle 435 in the vertical direction, the horizontal direction, and the vertical movement is not limited to that described above.

When cleaning the substrate W, the ultrasonic cleaning liquid is sprayed onto the substrate W while rotating the substrate W and rotating the nozzle 435 in the vertical direction and / or in the horizontal direction. At this time, various controls such as changing the output, the scanning speed, the flow rate, and the amount of dissolved gas may be performed according to the ejection position (position where the ultrasonic cleaning liquid is deposited on the substrate W).

5A, the support shaft 431 and the movable shaft 432 may be connected by a pivot shaft 436 extending in the horizontal direction. As a result, the movable shaft 432 can turn in the vertical plane with respect to the support shaft 431 with the turning shaft 436 as an axis. By combining with the vertical rotation of the nozzle 435, the ultrasonic cleaning liquid can be sprayed from the inner side (side closer to the center) to the outer periphery (side closer to the edge) of the substrate W (FIG. 5B).

In recent years, since the pattern formed on the substrate surface has become finer, it has become necessary to remove finer particles from the substrate. According to the invention of this embodiment, the substrate is cleaned using an ultrasonic cleaning liquid. Therefore, fine particles can be removed appropriately. In addition, by jetting the ultrasonic cleaning liquid toward the outer periphery in this way, the ultrasonic cleaning liquid contaminated by the cleaning of the substrate W can be quickly discharged without going to the inside of the substrate W, and the cleaning power is further improved.

The substrate cleaning apparatus 4 described above operates, for example, as follows.

FIG. 5C is a flowchart illustrating an example of the processing operation of the substrate cleaning apparatus 4. A command may be given to the substrate cleaning apparatus 3 (particularly a mechanism for moving the spindle 41 and the nozzle 435) from the control unit 7 or another computer so as to perform part or all of this flowchart. The command may be issued by executing a predetermined program.

First, the spindle 41 as the substrate rotating mechanism holds and rotates the substrate W (step S1).

As the support shaft 431 is raised, the nozzle 435 communicating with the ultrasonic cleaning liquid source is raised to a position higher than the upper surface of the substrate W. Next, the movable shaft 432 rotates in the vertical plane with the rotation axis 436 as an axis, so that the nozzle 435 moves to the inner side in the horizontal direction of the substrate W. Further, the head 433 turns in the vertical plane around the turning shaft 434, so that the nozzle 435 faces outward. As a result, as shown in FIG. 5A, the injection port of the nozzle 435 is oriented in a direction having an acute incident angle with respect to the edge of the upper surface of the substrate W (step S2).

In this state, an ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the edge of the upper surface of the substrate W (step S3). At this time, the incident angle of the ultrasonic cleaning liquid with respect to the surface of the substrate W is an acute angle.

When the ejection of the ultrasonic dedicated liquid, that is, the cleaning of the edge of the upper surface of the substrate W is completed, the movable shaft 432 pivots in the vertical plane around the pivot shaft 436, whereby the nozzle 435 moves to the outside in the horizontal direction of the substrate W ( Step S4).

Then, when the support shaft 431 is lowered, the nozzle 435 is lowered to a position lower than the lower surface of the substrate W. Next, the movable shaft 432 rotates in the vertical plane with the rotation axis 436 as an axis, so that the nozzle 435 moves to the inner side in the horizontal direction of the substrate W. Further, the head 433 turns in the vertical plane around the turning axis 434, so that the nozzle 435 is directed outward (step S5). As described above, the injection port of the nozzle 435 is in a state in which it has an acute incident angle with respect to the edge of the lower surface of the substrate W.

In this state, the ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the edge of the lower surface of the substrate W (step S6). At this time, the incident angle of the ultrasonic cleaning liquid with respect to the back surface of the substrate W is an acute angle.

When the ejection of the ultrasonic dedicated liquid, that is, the cleaning of the edge of the back surface of the substrate W is completed, the movable shaft 432 pivots in the vertical plane with the pivot shaft 436 as an axis, whereby the nozzle 435 moves to the outside in the horizontal direction of the substrate W ( Step S7).

As the support shaft 431 is raised, the nozzle 435 is raised to the same position as the substrate W. Next, the head 433 rotates in the vertical plane with the rotation axis 434 as an axis, so that the nozzle 435 is oriented horizontally and is in the state shown in FIG. 4C (step S8).

In this state, the ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the bevel of the substrate W (step S9). When spraying of the ultrasonic cleaning liquid, that is, cleaning of the bevel is completed, the substrate W is removed from the spindle 41 (step S10).

As described above, in the first embodiment, the nozzle 435 is capable of vertical turning and horizontal turning. Therefore, a wide region of the substrate W can be cleaned, and the cleaning power is improved.

In addition, the injection target of the ultrasonic cleaning liquid is not limited to the substrate W. Since the nozzle 435 can be turned in the vertical direction and the horizontal direction, the ultrasonic cleaning liquid can be sprayed onto a part of the substrate cleaning apparatus 4 (for example, the spindle 41 and the cup), and these cleanings are also possible.

(Second Embodiment)

A second embodiment to be described next relates to a substrate cleaning apparatus 4 including a roll-type cleaning member.

6A to 6C are a perspective view, a top view, and a side view, respectively, showing a schematic configuration of a substrate cleaning apparatus 4 ′ according to the second embodiment. Hereinafter, a description will be given focusing on differences from the first embodiment.

The substrate cleaning apparatus 4 ′ includes a roll-type cleaning tool 451 and a roll-type cleaning tool 452 arranged immediately below the roll-type cleaning tool 451. The roll-type cleaning tools 451 and 452 are elongated, and in one embodiment, desirably extend from the edge of the substrate W to the opposite edge and pass through the center of the substrate W. While the nozzle 435 rotates in the vertical direction and / or in the horizontal direction, the ultrasonic cleaning liquid is sprayed onto the substrate W (more specifically, the side closer to the nozzle 435 than the roll type cleaning tools 451 and 452), while the roll type cleaning tool 451. 452 cleans each surface while contacting the upper and lower surfaces of the substrate W, respectively.

In this case, the injection direction from the nozzle 435 may be parallel to the longitudinal direction of the roll-type cleaning tools 451 and 452, or may be vertical, but as shown in FIG. It is desirable that the angle formed by the longitudinal direction and the injection direction is greater than 0 degree and less than 90 degrees.

In addition, as shown in FIG. 6C, in the vicinity where the roll-type cleaning tool 451 contacts the substrate W, the rotation direction of the roll-type cleaning tool 451 may coincide with the injection direction from the nozzle 435. It does not have to be.

However, considering the rapid supply of the ultrasonic cleaning liquid to the contact portion between the roll-type cleaning tool 451 and the substrate W and the quick discharge of the ultrasonic cleaning liquid that has passed through the contact portion, the rotation direction of the roll-type cleaning tool 451 and the nozzle It is desirable that the injection direction from 435 matches.

Further, as shown in FIG. 7, the ultrasonic cleaning liquid is sprayed onto the lower surface of the substrate W when the nozzle 435 is lowered to a position lower than the lower surface of the substrate W. Even when the ultrasonic cleaning liquid is sprayed onto the lower surface of the substrate W, even when the roll cleaning tool 452 is in contact with the substrate W, the rotation direction of the roll cleaning tool 452 and the spraying direction from the nozzle 435 coincide with each other. It does not have to match. However, it is desirable that they coincide with the upper surface of the substrate W.

As described above, in this embodiment, cleaning is performed not only with the ultrasonic cleaning liquid but also with the roll-type cleaning tools 451 and 452. Therefore, the cleaning power is improved. In addition, since the nozzle 435 can be turned in the vertical direction or the horizontal direction, the ultrasonic cleaning liquid can be sprayed onto the roll-type cleaning tools 451 and 452. As a modified example of the present embodiment, as the roll-type cleaning tool 452 disposed immediately below the roll-type cleaning tool 451, a roll-type cleaning tool having a length that is greater than the radius of the substrate and less than the diameter of the substrate is used. You may make it contact a board | substrate, rotating a roll cleaning tool around the rotating shaft which is a length direction at the time of board | substrate cleaning. Moreover, you may make it supply a washing | cleaning liquid to the back surface (lower side) of a board | substrate, making the roll cleaning tool 452 contact the back surface (lower side) of a board | substrate. In this case, an inclination adjustment mechanism that freely adjusts the inclination of the roll cleaning tool 452 and an elevating unit that elevates and lowers the inclination adjustment mechanism with respect to the substrate are further provided. By adopting such a configuration, not only the ultrasonic cleaning liquid is sprayed onto the roll-type cleaning tools 451 and 452 by the nozzle 435 capable of vertical and horizontal rotation, but also the inclination of the roll-type cleaning tool 452 with respect to the substrate W, Since the raising / lowering operation can be freely adjusted, not only the bevel on the front side of the substrate W but also the peripheral area (bevel and edge) on the back side can be more reliably cleaned. As a further modified embodiment, a roll-type cleaning tool 451 having a length that is greater than the radius of the substrate and less than the diameter of the substrate is used, and a mechanism that can freely adjust the tilt and the lifting operation with respect to the substrate W is provided. It can also be provided.

(Third embodiment)

In both the first and second embodiments described above, the substrate W is held in the horizontal direction in mind. On the other hand, a third embodiment described below holds the substrate W in a non-horizontal direction. The non-horizontal direction includes a vertical direction (vertical direction) and a direction inclined at a predetermined angle with respect to a horizontal plane.

In the embodiment shown in FIGS. 8A and 8B, respectively, a front view and a side view showing a schematic configuration of a substrate cleaning apparatus 4 ″ according to the third embodiment. The substrate cleaning apparatus 4 ″ includes two spindles 41 that rotate while holding the lower side of the substrate W, and two spindles 41 that rotate while holding the upper side. By arranging these spindles 41 in the same vertical plane, the substrate W is held in the vertical direction.

Further, the substrate cleaning device 4 ″ may include four ultrasonic cleaning liquid supply devices 42A to 42D. The ultrasonic cleaning liquid supply device 42A is disposed vertically above the center of the substrate W and ejects the ultrasonic cleaning liquid downward from the nozzle 435A. The ultrasonic cleaning liquid supply device 42B is disposed below the center of the substrate W in the vertical direction, and jets the ultrasonic cleaning liquid upward from the nozzle 435B. The ultrasonic cleaning liquid supply device 42 </ b> C is disposed obliquely above the center of the substrate W, and ejects the ultrasonic cleaning liquid obliquely downward from the nozzle 435 </ b> C toward the center of the substrate W. The ultrasonic cleaning liquid supply device 42D is disposed obliquely below the center of the substrate W, and jets the ultrasonic cleaning liquid obliquely upward from the nozzle 435D toward the center of the substrate W.

Although not shown, at least a part of the ultrasonic cleaning liquid supply devices 42A to 42D has the structure described in the first embodiment, and is in a plane perpendicular to the substrate W with the pivot axis 434 as an axis. It is desirable to be able to turn and / or move up and down in a plane parallel to the substrate W with the movable shaft 432 as an axis.

The substrate cleaning device 4 ″ only needs to include at least one ultrasonic cleaning liquid supply device 42, and the number and arrangement thereof are not particularly limited.

As a modification, roll-type cleaning tools 451 and 452 may be provided as in the second embodiment (FIGS. 9A and 9B). Further, by not arranging the upper spindle 41 and the lower spindle 41 in the same vertical plane, the substrate W may be held in an oblique direction (FIG. 10), and in addition, a roll-type cleaning tool is provided. (Not shown).

As described above, the substrate W may be held and rotated in a non-horizontal direction.

(Other embodiments)

As shown in FIG. 11, the ultrasonic cleaning liquid may be sprayed (sprayed) from the nozzle 435 in a mist form. By spraying and supplying the ultrasonic cleaning liquid having vibration energy, particles on the surface of the substrate W can be removed while suppressing damage to the substrate W. In particular, it is necessary to lower the frequency of ultrasonic waves (for example, several tens of kHz to 500 kHz) to remove large particles. In this case, the substrate W may be damaged. Can be suppressed.

FIG. 12 is a perspective view showing a schematic configuration of a substrate cleaning apparatus 4 ′ ″ that holds and rotates the substrate W with chuck claws. The substrate cleaning apparatus 4 ′ ″ includes a chuck claw 511 and a rotation drive shaft 512 instead of the spindle 41 in FIG. 2A and the like.

The chuck claw 511 is a holding member provided to hold the substrate W by holding the outer peripheral end (edge portion) of the substrate W. An interval is provided between adjacent chuck claws 511 that does not hinder the movement of a robot hand (not shown) that transports the substrate W. The chuck claws 511 are each connected to the rotation drive shaft 512 so that the surface of the substrate W can be held horizontally.

The rotation drive shaft 512 can be rotated around an axis extending perpendicularly to the surface of the substrate W, and the substrate W can be rotated in a horizontal plane by rotation around the axis of the rotation drive shaft 512. ing. The control unit 7 in FIG. 1 controls the rotation direction and the number of rotations of the rotation drive shaft 512. The rotation speed may be constant or variable. Further, a rotary cup that covers the periphery of the substrate W outside the chuck claws 511 and rotates in synchronization with the rotation drive shaft 512 may be provided.

In such a configuration, the ultrasonic cleaning liquid may be sprayed onto the chuck claws 511 and the rotating cup. Here, the flow of gas flowing into the housing from the FFU unit (not shown) provided in the upper part of the housing of the substrate cleaning apparatus 4 or the shutter mechanism for taking in and out the substrate provided in the housing is as follows. The substrate cleaning device 4 can be discharged from the lower discharge portion of the housing, and a downflow can be formed in the housing. Furthermore, the above-mentioned rotating cup may be provided with a discharge hole for discharging the drainage liquid, and the downflow is discharged from the discharge portion at the bottom of the housing through this discharge hole and the ultrasonic cleaning liquid is sprayed onto the rotating cup. Then, the washed drained liquid from the rotating cup is received from the discharge hole below the rotating cup into the liquid receiving container located below the rotating cup along the flow of the downflow airflow, and discharged. It is also possible to ensure that the tube is discharged. By adopting such a configuration, particles that tend to adhere to the rotating cup and the substrate chuck claw 511 can be reliably removed to prevent re-contamination of the substrate, and the outer peripheral edge (edge portion) of the substrate can also be reliably secured. Expect to be washed.

As another configuration example of the substrate cleaning apparatus, instead of rotating the substrate W by the spindle 41 or the chuck claw 511, the substrate W may be supported on the stage from below and the stage may be rotated. Further, as a cleaning tool, a so-called pencil sponge type cleaning tool may be used instead of the roll type illustrated in FIG. Alternatively, one surface (for example, the upper surface) of the substrate W may be cleaned with a pencil sponge type cleaning tool, and the other surface (for example, the lower surface) may be cleaned with a roll type cleaning tool. Moreover, you may combine suitably each aspect demonstrated in this specification.

[Explanation of symbols]
3 Substrate polishing device 4, 4 ′, 4 ″, 4 ′ ″ Substrate cleaning device 41 Spindle 42, 42A to 42D Ultrasonic cleaning liquid supply device 431 Support shaft 432 Moving shaft 433 Head 434 Rotating shaft 435, 435A to 435D Nozzle 436 Rotating shaft 451, 452 Roll type cleaning tool 511 Chuck claw 512 Rotation drive shaft

If the ultrasonic cleaning liquid is charged, the substrate may be damaged during cleaning. The problem of the fourth and fifth embodiments is to provide an ultrasonic cleaning liquid supply device and a substrate cleaning device that can clean the substrate appropriately and reduce the risk of damaging the substrate.
As will be described in detail below, according to the fourth and fifth embodiments, the substrate can be properly cleaned, and the risk of damaging the substrate during cleaning is suppressed when charging the ultrasonic cleaning liquid when cleaning the substrate. Can be reduced. In the fourth and fifth embodiments, reference numerals are assigned separately from the first to third embodiments.

(Fourth embodiment)
FIG. 13 is a schematic top view of a substrate processing apparatus according to an embodiment. This substrate processing apparatus is used in the manufacturing process of a magnetic film in a semiconductor wafer having a diameter of 300 mm or 450 mm, a flat panel, an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device), or an MRAM (Magnetoresistive Random Access Memory). Process various substrates. Further, the shape of the substrate is not limited to a circle, but may be a rectangular shape (square shape) or a polygonal shape.

The substrate processing apparatus includes a substantially rectangular housing 1, a load port 2 on which a substrate cassette for stocking a large number of substrates is placed, and one or a plurality (four in the embodiment shown in FIG. 13) of substrate polishing apparatuses 3. One or a plurality of (two in the embodiment shown in FIG. 13) substrate cleaning device 4, a substrate drying device 5, transport mechanisms 6a to 6d, and a control unit 7 are provided.

The load port 2 is disposed adjacent to the housing 1. The load port 2 can be equipped with an open cassette, SMIF (Standard Mechanical Interface) pod, or FOUP (Front Opening Unified Pod). SMIF pods and FOUPs are sealed containers that can maintain an environment independent of the external space by accommodating a substrate cassette inside and covering with a partition wall. Examples of the substrate include a semiconductor wafer.

A substrate polishing apparatus 3 for polishing the substrate, a substrate cleaning apparatus 4 for cleaning the polished substrate, and a substrate drying apparatus 5 for drying the cleaned substrate are accommodated in the housing 1. The substrate polishing apparatus 3 is arranged along the longitudinal direction of the substrate processing apparatus, and the substrate cleaning apparatus 4 and the substrate drying apparatus 5 are also arranged along the longitudinal direction of the substrate processing apparatus. Each of the substrate cleaning device 4 and the substrate drying device 5 is a substantially rectangular housing (not shown), and can be opened and closed by a shutter mechanism, and the substrate to be processed is opened from an opening / closing portion provided in the housing portion. It may be configured to take in and out. Alternatively, as a modified embodiment, the substrate cleaning device 4 and the substrate drying device 5 may be integrated, and the substrate cleaning process and the substrate drying process may be performed continuously in one unit.
As still another modified embodiment, instead of the substrate polishing apparatus 3, for example, a plating apparatus for plating a substrate or a bevel polishing apparatus for polishing a bevel portion may be employed.

In the present embodiment, the substrate cleaning device 4 performs contact cleaning using a pen-type cleaning tool and non-contact cleaning using ultrasonic cleaning water. Although details will be described later, contact cleaning using a pen-type cleaning tool refers to contacting the lower end contact surface of a cylindrical pencil-type cleaning tool extending in the vertical direction with a substrate in the presence of a cleaning liquid, and rotating the cleaning tool. However, it is moved in one direction to scrub the surface of the substrate.

The substrate drying apparatus 5 includes a spin drying unit that blows IPA vapor from a moving spray nozzle toward a horizontally rotating substrate to dry the substrate, and further rotates the substrate at high speed to dry the substrate by centrifugal force. Can be used.

In a region surrounded by the load port 2 and the substrate polishing apparatus 3 and the substrate drying apparatus 5 located on the load port 2 side, a transport mechanism 6a is arranged. Further, a transport mechanism 6 b is arranged in parallel with the substrate polishing apparatus 3, the substrate cleaning apparatus 4 and the substrate drying apparatus 5. The transport mechanism 6a receives the substrate before polishing from the load port 2 and delivers it to the transport mechanism 6b, or receives the dried substrate taken out from the substrate drying apparatus 5 from the transport mechanism 6b.

Between the two substrate cleaning apparatuses 4, a transfer mechanism 6 c for transferring the substrate between the substrate cleaning apparatuses 4 is disposed, and between the substrate cleaning apparatus 4 and the substrate drying apparatus 5, the substrate cleaning apparatus 4 and the substrate drying are disposed. A transport mechanism 6c that transfers substrates between the apparatuses 5 is disposed.

Further, a control unit 7 for controlling the movement of each device of the substrate processing apparatus is disposed inside the housing 1. Although this embodiment demonstrates using the aspect by which the control part 7 is arrange | positioned inside the housing 1, it is not restricted to this, The control part 7 may be arrange | positioned outside the housing 1. FIG.

14 and 15 are a plan view and a side view, respectively, of the substrate cleaning apparatus 4 according to the first embodiment. The substrate cleaning device 4 includes a substrate rotation mechanism 41, a pen cleaning mechanism 42, and an ultrasonic cleaning liquid supply device 43, which are housed in a housing 44 having a shutter 44a. Each part in the substrate cleaning apparatus 4 is controlled by the control unit 7 in FIG.

The substrate rotation mechanism 41 includes a chuck claw 411 and a rotation drive shaft 412.
The chuck claw 411 is a holding member provided to hold the substrate W by holding the outer peripheral end (edge portion) of the substrate W to be cleaned. In this embodiment, four chuck claws 411 are provided, and an interval is provided between adjacent chuck claws 411 that does not hinder the movement of a robot hand (not shown) that transports the substrate W. The chuck claws 411 are each connected to the rotation drive shaft 412 so that the surface of the substrate W can be held horizontally. In the present embodiment, the substrate W is held by the chuck claws 411 so that the surface WA of the substrate W faces upward.

The rotation drive shaft 412 can be rotated around an axis extending perpendicularly to the surface of the substrate W, and the substrate W can be rotated in a horizontal plane by rotation around the axis of the rotation drive shaft 412. ing. The controller 7 controls the rotation direction and the number of rotations of the rotation drive shaft 412. The rotation speed may be constant or variable.

Further, in order to prevent a cleaning liquid and an ultrasonic cleaning liquid to be described later from splashing, the rotation outside of the substrate rotation mechanism 41 (more specifically, the chuck claw 411) covers the periphery of the substrate W, and rotates. A rotating cup that rotates in synchronization with 412 may be provided. Further, the rotary cup may be configured such that a downflow airflow supplied into the unit from an FFU above the cleaning unit (not shown) passes through a hole provided in the rotary cup and escapes downward. By comprising in this way, it can prevent more reliably that a washing | cleaning liquid and an ultrasonic cleaning liquid scatter.

The pen cleaning mechanism 42 includes a pen-type cleaning tool 421, an arm 422 that supports the pen-type cleaning tool 421, a moving mechanism 423 that moves the arm 422, a cleaning liquid nozzle 424, a rinse liquid nozzle 425, and a cleaning device 426. Have

The pen-type cleaning tool 421 is, for example, a cylindrical PVA (for example, sponge) cleaning tool, and is disposed above the substrate W held by the chuck claws 411 so that the axis is perpendicular to the substrate W. . The pen-type cleaning tool 421 has a lower surface that cleans the substrate W, and an upper surface that is supported by the arm 422.

The arm 422 is a flat bar-like member, and is typically arranged so that its longitudinal direction is parallel to the substrate W. The arm 422 supports the pen-shaped cleaning tool 421 at one end so as to be rotatable around its axis, and a moving mechanism 423 is connected to the other end.

The moving mechanism 423 moves the arm 422 vertically up and down and swings the arm 422 in a horizontal plane. The movement of the arm 422 in the horizontal direction by the moving mechanism 423 is such that the locus of the pen-type cleaning tool 421 draws an arc around the other end of the arm 422. The moving mechanism 423 can swing the pen-type cleaning tool 421 between the center of the substrate W and the retracted position outside the substrate W as indicated by an arrow A. The moving mechanism 423 is controlled by the control unit 7.

The cleaning liquid nozzle 424 supplies a cleaning liquid such as a chemical liquid or pure water when cleaning the substrate W with the pen-type cleaning tool 421. The rinse liquid nozzle 425 supplies a rinse liquid such as pure water to the substrate W. The cleaning liquid nozzle 424 and the rinsing liquid nozzle 425 are desirably provided not only for the front surface WA of the substrate W but also for the back surface WB. The supply timing and supply amount of the cleaning liquid and the rinse liquid are controlled by the control unit 7.

The cleaning device 426 is disposed outside the position where the substrate W is disposed, and the moving mechanism 423 can move the pen-type cleaning tool 421 onto the cleaning device 426. The cleaning device 426 cleans the pen type cleaning tool 421.

In the pen cleaning mechanism 42 described above, while the substrate W is rotating, the cleaning liquid is supplied from the cleaning liquid nozzle 424 onto the substrate W, and the lower surface of the pen-type cleaning tool 421 contacts the surface WA of the substrate W so that the arm 422 is provided. By swinging, the substrate W is physically contact-cleaned.

The ultrasonic cleaning liquid supply device 43 is disposed on the opposite side of the pen cleaning mechanism 42 with the substrate W interposed therebetween. The ultrasonic cleaning liquid supply device 43 cleans the substrate W in a non-contact manner using a cleaning liquid to which ultrasonic waves are applied (hereinafter also referred to as an ultrasonic cleaning liquid). This embodiment is characterized by the structure of the ultrasonic cleaning liquid supply device 43 and will be described in detail below.

FIG. 16 is a diagram schematically showing a schematic configuration of the ultrasonic cleaning liquid supply device 43. The ultrasonic cleaning liquid supply device 43 includes an ultrasonic cleaning liquid generation device 70 and a nozzle unit 71.

The ultrasonic cleaning liquid generating apparatus 70 has a casing 81 and a vibrating part 82. The casing 81 has a cavity opened at the bottom, and the cavity is tapered downward. A channel 81 a is formed in a part of the housing 81. Then, the vibration unit 82 is disposed in a cavity inside the housing 81.

The cleaning liquid (before the ultrasonic wave is applied) is supplied into the casing 81 from the flow path 81 a of the casing 81. The cleaning liquid may be, for example, pure water or a chemical liquid. The vibration unit 82 generates ultrasonic cleaning liquid by applying ultrasonic vibration to the cleaning liquid. The frequency of the ultrasonic wave may be a predetermined fixed frequency, or may be selected from a plurality of frequencies (for example, a high frequency of about 900 kHz and a low frequency of about 430 kHz). The generated ultrasonic cleaning water is accommodated in the casing 81.

The nozzle unit 71 is connected to an opening in the housing 81 and sprays ultrasonic cleaning liquid toward the substrate W.

Here, if the ultrasonic cleaning liquid is charged, the substrate W may be damaged during cleaning. Therefore, in the present embodiment, at least a part (preferably the entire part) of the surface (wetted part) in contact with the ultrasonic cleaning liquid in the casing 81 is made of a conductive material so as to have conductivity. As the conductive material, carbon nanotubes are kneaded into a fluororesin such as PTFE (Poly Tetra Fluoro Ethylene), PCTFE (Poly Chloro Tri Furuoro Ethylene), PFA (Per Fluoroalkoxy Alkane), etc. That is suitable. A portion made of a conductive material on the surface of the casing 81 that contacts the ultrasonic cleaning liquid is grounded.
16 and 17 schematically show that the case 81 is grounded via a cable when the entire casing 81 is made of a conductive material as an example.

In addition, in order to give sufficient conductivity while suppressing the content of the carbon nanotube of the conductive material, it is desirable that the length of the carbon nanotube fiber is 30 μm or more.

This can suppress charging of the ultrasonic cleaning liquid and reduce the risk of damaging the substrate W during cleaning. Moreover, the intensity | strength improves by forming the housing | casing 81 with the fluororesin containing a carbon nanotube. Furthermore, at the time of cleaning, the grounding can be canceled and a bias can be applied to the conductive portion. Thus, the charged ultrasonic cleaning liquid can be intentionally supplied to the surface of the substrate W that has already been charged, and the charging of the surface of the substrate W is cancelled. For example, when the substrate W tends to be negatively charged, the conductive portion may be grounded or a positive charge may be applied.

In this embodiment, in particular, at least a part (preferably the entire surface) of the nozzle portion 71 to which the ultrasonic cleaning liquid is sprayed is in contact with the ultrasonic cleaning liquid (preferably the whole) is made of a material having high thermal conductivity. It is preferable to use a material having a thermal conductivity equal to or higher than that of the conductive portion. More specifically, sapphire or quartz can be applied. In addition, since PTFE including carbon nanotubes has high thermal conductivity, PTFE including carbon nanotubes may be applied to both the casing 81 and the nozzle portion 71. Sapphire and PTFE are excellent in terms of chemical resistance, and quartz is excellent in that it is difficult to attenuate ultrasonic vibration.

When the nozzle part 71 is formed of a material having low thermal conductivity such as PTFE that does not contain carbon nanotubes, the energy of ultrasonic waves may be absorbed by the nozzle part 71 and converted into heat, and the nozzle part 71 may store heat. When heat accumulation occurs in the nozzle portion 71, the temperature of the ultrasonic cleaning liquid may change between the substrate cleaned in the initial stage and the substrate cleaned after cleaning a large number of substrates, and the processing may become unstable. Further, even when a high-temperature ultrasonic cleaning liquid is used, if the heat of the ultrasonic cleaning liquid moves to the nozzle unit 71 and accumulates in the nozzle unit 71, the temperature of the ultrasonic cleaning liquid similarly changes and the processing becomes unstable. . On the other hand, such a problem can be reduced by improving the heat dissipation of the nozzle part 71. Further, by forming the nozzle part 71 from PTFE containing carbon nanotubes, it is possible to increase the strength of the nozzle part and prevent deformation due to heat.

Thereby, the temperature of the ultrasonic cleaning liquid sprayed onto the substrate W can be lowered, and a reduction in cleaning power can be suppressed.

FIG. 17 is a diagram schematically showing a schematic configuration of an ultrasonic cleaning liquid supply device 43 ′ which is a modification of FIG. 16. The casing 81 of the ultrasonic cleaning liquid supply device 43 ′ has a cavity opened at the bottom, and an opening 81 c is provided on the bottom surface 81 b of the casing 81. Then, an ultrasonic cleaning liquid is ejected from the opening 81c toward the substrate W. Of the casing 81 of the ultrasonic cleaning liquid supply device 43 ′, a portion close to the opening 81c from which the ultrasonic cleaning liquid is ejected, more specifically, at least a part of the upper surface of the bottom surface 81b and the side surface of the opening 81c (preferably the whole ) Is made of a material with high heat dissipation, and the other surface is preferably made of a conductive material. Others are the same as FIG.

Thus, in the fourth embodiment, the inner surface of the casing 81 of the ultrasonic cleaning liquid supply device 43 (43 ') is made conductive. Therefore, charging of the ultrasonic cleaning liquid can be suppressed, and the risk of damaging the substrate W during cleaning can be reduced. Moreover, the heat dissipation of the inner surface of the portion where the ultrasonic cleaning liquid is ejected is increased. Therefore, the temperature of the ultrasonic cleaning liquid supplied to the substrate W can be lowered, and a reduction in cleaning power can be suppressed.

In addition, the aspect of the substrate cleaning apparatus 4 is not limited to that shown in FIGS. For example, the cleaning may be performed with a roll-type cleaning tool instead of the pen-type cleaning tool 421. Moreover, you may only wash | clean with an ultrasonic cleaning liquid, without using a cleaning tool. Further, instead of holding and rotating the substrate W with the chuck claws 411, the substrate W may be supported on the stage from below and the stage may be rotated, or the outer peripheral edge of the substrate W may be held with a roller. It may be rotated.

Further, the ultrasonic cleaning liquid supply device 43 may be configured such that the ultrasonic cleaning liquid generated by the vibration unit 82 disposed outside the casing 81 is guided into the casing 81.

FIG. 17A is a diagram schematically showing a schematic configuration of an ultrasonic cleaning liquid supply device 43 ″ which is a modified example of FIG. 17. The ultrasonic cleaning liquid supply device 43 ″ does not have a vibration part, and cleaning liquid (liquid) to which ultrasonic waves are added by an external vibration part (not shown) is supplied from the flow path 81 a. Then, the cleaning liquid is supplied to the substrate surface from the opening 81 c provided below the housing 81.

In such an ultrasonic cleaning liquid supply apparatus 43 ″, it is desirable that at least a part of the upper surface 81b1 of the bottom surface 81b and the side surface 81c1 of the opening 81c that are in contact with the cleaning liquid is a conductive fluororesin including carbon nanotubes. The other surface is desirably a conductive material (which may contain carbon nanotubes or may be a conductive fluororesin).

(Fifth embodiment)
The substrate cleaning apparatus 4 in the fourth embodiment described above supplies an ultrasonic cleaning liquid to the rotating substrate W. On the other hand, in the second embodiment described below, cleaning is performed by immersing the substrate W in an ultrasonic cleaning liquid.

FIG. 18A is a diagram schematically showing a schematic configuration of a substrate cleaning apparatus 4 ′ according to the fifth embodiment. Moreover, FIG. 18B is the figure which looked at FIG. 18A from the side surface (arrow direction). Hereinafter, a description will be given focusing on differences from the first embodiment.

The substrate cleaning device 4 ′ includes an ultrasonic cleaning liquid generating device 70 and a substrate rotating mechanism 49.
The ultrasonic cleaning liquid generating apparatus 70 includes a casing 81 and a vibration unit 82 (omitted in FIG. 18B). The casing 81 has a bottom surface and side surfaces, but the upper portion is open, and the vibration unit 82 is disposed on the bottom surface. The vibration unit 82 generates ultrasonic cleaning liquid by applying vibration to the cleaning liquid supplied into the housing 81. At least a part of the liquid contact portion of the casing 81 is conductive as in the first embodiment. Alternatively, the conductive portion of the casing 81 may be grounded to release the charge.

The substrate rotation mechanism 49 is supported by a support member, and holds and rotates the substrate W to be cleaned in a state where at least a part is immersed in the ultrasonic cleaning liquid accommodated in the housing 81. More specifically, the substrate rotation mechanism 41 is provided inside the housing 81 and supports the edge of the substrate W to drive the substrate W in the circumferential direction. As a result, the substrate W is held in the vertical direction and rotates in the vertical plane. In this embodiment, the example in which the substrate W is held in the vertical direction has been described. In the present embodiment, an example in which one substrate is held is shown, but a plurality of substrates may be accommodated in the housing 81.

The cleaning liquid flows in the casing 81 by supplying the cleaning liquid into the casing 81 and rotating the substrate W. Then, the inner wall surface of the housing 81 may be charged due to friction between the cleaning liquid and the inner wall of the housing 81. However, in the present embodiment, since the casing 81 is conductive, it is possible to release electric charges. As a result, charging inside the casing 81 containing the cleaning liquid can be prevented, and charging of the substrate W can be prevented. And the risk of damage to the substrate W can be reduced. Further, at the time of cleaning, grounding can be canceled and a bias can be applied to the conductive portion. Accordingly, the charged ultrasonic cleaning liquid is intentionally brought into contact with the surface of the substrate W that has already been charged, so that charging of the surface of the substrate W can be effectively suppressed. For example, when the surface of the substrate W tends to be negatively charged, the conductive portion of the housing may be grounded or a positive charge may be applied to the cleaning liquid.

[Explanation of symbols]
4 Substrate cleaning devices 41, 49 Substrate rotation mechanism (substrate holding mechanism)
42 Pen cleaning mechanism 43, 43 'Ultrasonic cleaning liquid supply apparatus 70 Ultrasonic cleaning liquid generation apparatus 71 Nozzle part 81 Housing 81a Channel 81b Bottom face 81c Opening 82 Vibration part

The above-described embodiments are described for the purpose of enabling the person having ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. For example, in the substrate cleaning apparatus, with the substrate held by the holding mechanism, the substrate is cleaned with the ultrasonic cleaning liquid in the same manner as the nozzle described in the above embodiment, and then the substrate is continuously rotated as it is. The substrate may be configured to be sprayed by spraying the IPA liquid from the IPA nozzle onto the substrate. Alternatively, the substrate chemical mechanical polishing apparatus (CMP apparatus) is shown as the substrate processing apparatus of the above embodiment, but is not limited thereto, for example, a bevel polishing apparatus for polishing a bevel portion of the substrate, The above-described substrate cleaning apparatus can also be employed in the plating apparatus. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention should not be limited to the described embodiments, but should be the widest scope according to the technical idea defined by the claims.

Claims (24)

A substrate rotating mechanism for holding and rotating the substrate;
A nozzle for injecting an ultrasonic cleaning liquid toward the rotated substrate,
The substrate cleaning apparatus, wherein the nozzle can swivel in a plane perpendicular to the substrate and can swivel in a plane parallel to the substrate. 2. The substrate cleaning apparatus according to claim 1, wherein the nozzle sprays an ultrasonic cleaning liquid onto an edge and / or bevel of the substrate. The substrate cleaning apparatus according to claim 1, wherein the nozzle is movable up and down. 4. The nozzle according to claim 3, wherein the nozzle can be raised to a position where the ultrasonic cleaning liquid is sprayed on the upper surface of the substrate, and can be lowered to a position where the ultrasonic cleaning liquid is sprayed on the lower surface of the substrate. Substrate cleaning device. The substrate cleaning apparatus according to any one of claims 1 to 4, wherein the nozzle can be swung in a plane perpendicular to the substrate, whereby an ultrasonic cleaning liquid can be sprayed from the inner side toward the outer periphery of the substrate. 6. The substrate cleaning apparatus according to claim 1, wherein the nozzle sprays an ultrasonic cleaning liquid onto the substrate rotating mechanism. A cleaning tool for cleaning the surface of the substrate while contacting the substrate while rotating,
The substrate cleaning apparatus according to claim 6, wherein the nozzle sprays an ultrasonic cleaning liquid onto the cleaning tool. The substrate cleaning apparatus according to claim 6 or 7, wherein an angle formed between the jet direction of the ultrasonic cleaning liquid from the nozzle and the longitudinal direction of the cleaning tool is greater than 0 degree and less than 90 degrees. The substrate cleaning apparatus according to any one of claims 1 to 8, wherein the nozzle sprays an atomized ultrasonic cleaning liquid. 10. The substrate cleaning apparatus according to claim 1, wherein the substrate rotation mechanism holds the substrate in a non-horizontal direction. The substrate rotating mechanism holds and rotates the substrate in a horizontal direction,
The nozzle is fixed to a first axis extending in a vertical direction, and the nozzle rotates in a plane parallel to the substrate by rotating the first axis about its axis. The substrate cleaning apparatus according to any one of the above. The substrate rotating mechanism holds and rotates the substrate in a horizontal direction,
The nozzle is fixed to a second shaft extending in a horizontal direction, and the second shaft rotates about its axis, whereby the nozzle swivels in a plane perpendicular to the substrate. The substrate cleaning apparatus according to any one of the above. Holding the substrate on the substrate rotation mechanism and rotating the substrate;
The nozzle communicating with the ultrasonic cleaning liquid source is raised to a position higher than the upper surface of the substrate, the nozzle is moved inward in the horizontal direction of the substrate, and an acute incident angle with respect to the edge of the upper surface of the substrate. Swiveling the nozzle so that the nozzle outlet faces in the direction it has;
Spraying an ultrasonic cleaning liquid from the nozzle toward the upper surface of the substrate;
Moving the nozzle outward in the horizontal direction of the substrate;
The nozzle is lowered to a position lower than the lower surface of the substrate, the nozzle is moved inward in the horizontal direction of the substrate, and the nozzle is ejected in a direction having an acute incident angle with respect to an edge of the lower surface of the substrate. Turning the nozzle so that the mouth is facing;
Spraying an ultrasonic cleaning liquid from the nozzle toward the lower surface of the substrate;
Moving the nozzle outward in the horizontal direction of the substrate;
Swiveling the nozzle so that the nozzle is directed to the bevel of the substrate and the nozzle is directed toward the bevel of the substrate,
Injecting an ultrasonic cleaning liquid from the nozzle toward the bevel of the substrate, in order to move the substrate rotating mechanism and the nozzle by giving a command to the substrate cleaning apparatus. A non-transitory computer-readable recording medium recording a program for causing a computer to execute the operation of the mechanism. A vibration unit that generates ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid;
A housing for containing the generated ultrasonic cleaning liquid,
The ultrasonic cleaning liquid supply apparatus, wherein at least a part of a surface of the housing that contacts the ultrasonic cleaning liquid is made of a conductive fluororesin. 15. The ultrasonic cleaning liquid supply device according to claim 14, wherein the conductive fluororesin is a fluororesin containing carbon nanotubes. The ultrasonic cleaning liquid supply apparatus according to claim 15, wherein the fluororesin is PTFE, PCTFE, or PFA. The ultrasonic cleaning liquid supply apparatus according to any one of claims 14 to 16, wherein at least a part of the portion to which the ultrasonic cleaning liquid is sprayed has higher heat dissipation than the conductive fluororesin. The ultrasonic cleaning liquid supply device according to any one of claims 14 to 17, wherein at least a part of the portion to which the ultrasonic cleaning liquid is sprayed is made of sapphire, quartz, or PTFE including carbon nanotubes. The ultrasonic cleaning liquid supply device according to any one of claims 14 to 18, wherein a bias is applied to a portion of the casing made of the conductive fluororesin. A substrate rotation mechanism for rotating the substrate;
An ultrasonic cleaning liquid supply apparatus according to any one of claims 14 to 19, wherein the ultrasonic cleaning liquid is supplied to the rotated substrate. A vibration unit that generates ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid;
A housing for containing the generated ultrasonic cleaning liquid;
A substrate rotating mechanism for rotating the substrate in a state where at least a part is immersed in the ultrasonic cleaning liquid housed in the housing, and
The substrate cleaning apparatus, wherein at least a part of a surface of the casing that contacts the ultrasonic cleaning liquid is made of a conductive fluororesin. Producing an ultrasonic cleaning liquid by applying ultrasonic waves to the cleaning liquid;
Immersing the substrate in the ultrasonic cleaning liquid housed in a housing in which at least a part of the surface in contact with the ultrasonic cleaning liquid is made of a conductive fluororesin; and
And a step of cleaning the substrate by rotating the substrate immersed in the ultrasonic cleaning liquid to flow the cleaning liquid. An ultrasonic cleaning liquid supply device for supplying an ultrasonic cleaning liquid to which ultrasonic waves are applied to a substrate surface,
A flow path for receiving the ultrasonic cleaning liquid from the outside;
A housing provided with an opening at a lower position,
At least a part of the upper surface of the bottom surface in contact with the ultrasonic cleaning liquid and the side surface of the opening in the housing is a conductive fluororesin containing carbon nanotubes,
The ultrasonic cleaning liquid supply device whose other surface is a conductive material. A substrate polishing apparatus for polishing a substrate;
The substrate processing apparatus provided with the substrate cleaning apparatus in any one of Claims 1 thru | or 12 and 20 thru | or 21 which cleans the board | substrate after grinding | polishing.

Images