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WO2019143598A1 - Dispositif de stockage d'énergie à semi-conducteurs et son procédé de fabrication - Google Patents

Dispositif de stockage d'énergie à semi-conducteurs et son procédé de fabrication Download PDF

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Publication number
WO2019143598A1
WO2019143598A1 PCT/US2019/013615 US2019013615W WO2019143598A1 WO 2019143598 A1 WO2019143598 A1 WO 2019143598A1 US 2019013615 W US2019013615 W US 2019013615W WO 2019143598 A1 WO2019143598 A1 WO 2019143598A1
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layer
ink
layers
ssee
solid state
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David L. Frank
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H01G11/12—Stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/30—Electrodes characterised by their material
    • H01G11/48—Conductive polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/54—Electrolytes
    • H01G11/56—Solid electrolytes, e.g. gels; Additives therein
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/66—Current collectors
    • H01G11/72—Current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H01G11/86—Processes for the manufacture of hybrid or EDL capacitors, or components thereof specially adapted for electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Definitions

  • the patent relates to solid state electrolytes and a method of fabrication that provides a multilayer stack of solid state electrolytes interleaved in between electrodes forming a solid state energy storage device. Inkjet material deposition is applied to simplify production and improve energy density.
  • the present disclosure generally relates to energy storage devices that are based on ultra-thin layers of solid state electrolyte(s) and electrode materials that are fabricated through inkjet material deposition.
  • solid electrolytes do not provide the ion transport efficiency of liquid electrolytes resulting in reduced energy density.
  • Many important applications demand high energy density, high operating voltage per cell and an extended battery life-cycle.
  • a Solid State Energy Element provides solid state electrolyte material interleaved in between electrodes (cathodes and anodes).
  • the electrolyte and electrode layers are formed as ultra-thin layers with complex patterns.
  • the ultra-thin layers and complex patterns are produced using precursor materials that are modified to have ink-like characteristics and are used in an inkjet material deposition system.
  • the material deposition system creates a multilayer thin film (MLTF) that can be heat processed or pressure processed to form a Solid State Energy Element.
  • MLTF multilayer thin film
  • the Solid State Energy Element is fabricated using our inkjet deposition system and proprietary inks enhances ion transport based on a shorter transport distance across the ultra- thin solid state electrolyte between the anode and cathode. This results in an increased number of ions that successfully transport between the anode and cathode.
  • the Solid State Energy Element (SSEE) fabricated using our inkjet deposition system allows for complex layer patterns within the SSEE and an ability to create stack of electrolytic and electrode layers in series, parallel and combined series parallel connections between the electrodes within the SSEE.
  • SSEEs can be combined in series, parallel or combined series parallel connections to form a Solid State Energy Cell (SSEC).
  • SSECs can be combined in series, parallel or combined series parallel connections to form a Solid State Energy Module (SSEM).
  • SSEMs can be combined in series, parallel or combined series parallel connections to form a Solid State Energy Array (SSEA).
  • SSEA Solid State Energy Array
  • the Solid State Energy Element provides rapid charge, over 100,000 recharge cycles, operating voltages of up to 10 volts per cell and can be manufactured at a low cost.
  • the SSEE utilizes Precursor or Nano Ink that is deposited to form each layer.
  • the SSEE design addresses the seven critical issues in battery technology:
  • the SSEE is based on a solid state electrolyte that can
  • the transformational inventions for the SSEE include a proprietary design enabling the capabilities listed above and proprietary fabrication methods that provide for volume production of the SSEE at low cost.
  • SIC Super-Ionic Conductor
  • Liquid electrolytes can be highly efficient ionic conductors with better efficiency for ion transport compared to solid state electrolytes.
  • the ultra-thin solid electrolyte layer within the SSEE addresses the need for an improved ion transport across a solid electrolyte.
  • a solid state electrolyte possesses a structure that enables conducive to ionic mobility. There are few solids that enable ionic mobility at room temperature. It is known that Sodium for example has good ion mobility in b-alumina. Solids having exceptionally high ionic conductivity are called fast ion conductors, superionic conductors or solid electrolytes. The solid electrolytes have special crystal structures where open tunnels enable ions transport.
  • Rechargeable batteries or secondary batteries such as Li-ion batteries, Na-ion batteries, and Mg-ion batteries, reversibly convert between electrical and chemical energy via redox reactions, storing energy as chemical potential in their electrodes.
  • the energy density of a rechargeable battery is determined collectively by the specific capacity of electrodes and the working voltage of the cell.
  • the working voltage of the cell is defined as the differential in potential between the cathode and the anode. A higher-potential cathode and a lower-potential anode can be used to increase battery cell voltage.
  • the electrode materials must offer a large reversible storage capacity.
  • the number of electrons is correlated with the number of ions accommodated in the host lattice.
  • a significantly lower capacity is realized as only a portion of the ions can be reversibly inserted into or extracted from the host.
  • the site energy of ions and the band energy state of electrons are two main factors that determine the voltage profiles of materials.
  • the optimum materials for the design of new electrode materials are described as Li, Na, Mg, Ti, Mn, Fe, Cu, B, C, N, O F, Si, P, S, Sb, Sn, Nb, Mo, Al, LiTiO, Bi, and W with other materials in development.
  • the SSEE and SSEC is designed as a scalable product supporting micro-battery applications, mobile devices, fixed energy backup, grid energy storage, alternative energy storage and large arrays for commercial, utility and government applications.
  • Inkjet printing provides a material deposition process that can provide ultra-thin layers in specific patterns with one or more materials applied in patterns for each layer.
  • the present invention enables the fabrication of a Solid State Energy Storage Element that has one or more solid state electrolytic layers comprised of a plurality of precursor materials and or Nano particles that form layers of less than 10 microns thick.
  • the electrolytic layers are interleaved in between electrode layers to form a multi-layer thin film (MLTF).
  • MLTF multi-layer thin film
  • SSEE Solid State Energy Element
  • the present invention describes a Solid State Energy Storage Element comprised of solid state electrolyte layers interleaved in between electrode layers which are fabricated using inkjet material deposition.
  • the inkjet material deposition allows for complex patterns of one or more materials within the same layer.
  • Inkjet material deposition also enables one or more layer types and patterns such as dielectric layers, electrode layers, cathode layers, anode layers, and insulator layers.
  • the inkjet material deposition processes and specialized inks allow ultra-thin layers of complex patterns from one to thousands of layers.
  • inkjet deposition and complex patterns simplifies manufacturing and enables ultra- thin layers of less than one micron which improves ion transport and overall energy density
  • the cathode layer There are a wide variety of materials that can be applied as the cathode layer.
  • the voltage differential between the cathode and anode are important factors to ensure high operating voltage.
  • the anode material selected requires a high energy content such as is found in alkali metals.
  • One of the conductive Ink types for the anode layer is graphene.
  • Graphene is a two- dimensional sheet of carbon atoms, just one atom thick.
  • One method of preparing graphene ink is to suspend nanoparticles of graphene in a carrier mixture which is modified to ensure proper viscosity, wetting, ink drop formation and surface tension.
  • 3D printing graphene uses a moderate viscosity (25-35 Pa.s) graphene suspension comprised of graphene with a polymer binder in a mixture of solvents that can be 3D printed.
  • 3D graphene conductive networks provide short path length for Li ion and electron transport. Integration of graphene and alloying type active materials improve electrode performance.
  • the electrolyte material can infuse into a portion of the graphene anode prior to and during heat treatment of the MLTF.
  • a variety of materials can be combined with the graphene to create high performance alloys.
  • An insulating material may be applied to the edges of the electrode layer.
  • Electrode Layer Electrode Layer (Anode) There are a wide variety of materials that can be applied as the Anode layer. The voltage differential between the cathode and anode are important factors to ensure high operating voltage. The general requirements for selection for anode materials include:
  • One of the conductive Ink types for the anode layer is graphene.
  • Graphene is a two- dimensional sheet of carbon atoms, just one atom thick.
  • One method of preparing graphene ink is to suspend nanoparticles of graphene in a carrier mixture which is modified to ensure proper viscosity, wetting, ink drop formation and surface tension.
  • 3D printing graphene uses a moderate viscosity (25-35 Pa.s) graphene suspension comprised of graphene with a polymer binder in a mixture of solvents that can be 3D printed.
  • 3D graphene conductive networks provide short path length for Li ion and electron transport. Integration of graphene and alloying type active materials improve electrode performance.
  • the electrolyte material can infuse into a portion of the graphene anode prior to and during heat treatment of the MLTF.
  • a variety of materials can be combined with the graphene to create high performance alloys.
  • An insulating material may be applied to the edges of the electrode layer.
  • Another conductive Ink type for the anode is comprised of a Nickel precursor that is stable at room temperature.
  • the Nickel precursor has a metal ion that can be reduced to a pure metallic state by a reducing agent and heat.
  • the reducing agent and nickel precursor are activated in the temperature in the range of 100-300° C. The reaction of the nickel precursor, reduction agent and heat forms a pure metal deposit.
  • the nickel precursor and reduction agent can be formulated into a Nano-ink where the nickel precursor and reducing agent are loaded into a carrier fluid for use in a variety of print processes including inkjet printing, spray deposition and or screen printing.
  • Superionic conductors are solids with highly mobile ions. As solid electrolytes they allow the movement of ions without the need for a liquid or soft membrane separating the electrodes. The phenomenon relies on the hopping of ions through a rigid crystal structure.
  • Superionic conductors are those solid materials which allow movement of ions through their structure. Typically this occurs at an elevated temperature.
  • Sodium-ion batteries are emerging as candidates for large-scale energy storage due to their low cost and the wide variety of cathode materials available.
  • One such design is based on NaioSnP 2 Si 2 , with room temperature ionic conductivity of 0.4 mS cm _1 .
  • Variants of this compound include a tin is substituted silicon to achieve even higher conductivity.
  • Solid state sodium-ion batteries are promising candidates for large-scale energy storage applications.
  • a solid state sodium electrolyte exhibits high Na-i- conductivity at ambient temperatures, as well as excellent phase and electrochemical stability.
  • Using an inkjet print deposition process enables an ultra-thin electrolyte layer to increase successful ion transport.
  • Na3PS4 Cl-doped Na3PS4 (t-Na3-xPS4-xClx) with a room- temperature Na-i- conductivity exceeding 1 mS cm-l.
  • Na 3 SbS 4 Another variant for sodium electrolyte is Cl-doped Na3PS4 (t-Na3-xPS4-xClx) with a room- temperature Na-i- conductivity exceeding 1 mS cm-l.
  • Na 3 SbS 4 Na 3 SbS 4 .
  • the insulator layer ink may be comprised of a variety of materials with resistivity of 10 8 ohms per square centimeter or greater.
  • the insulator materials can be oxides or other insulator materials with lower temperature curing.
  • the top and bottom cover layers for the SSEE is an insulating material that encases the SSEE with the exception of the left and right electrodes.
  • a multi-layer thin film is created by applying the inks described above.
  • the multi-layer thin film is heat treated to form a SSEE device. .
  • FIG. 1 we illustrate a multilayer capacitor.
  • FIG. 2 we illustrate example complex patterns deposited by inkjet material deposition to form the layers of f SSEE.
  • FIG. 3 we illustrate the conventional SSEE fabrication processes (301) that are replaced with inkjet material deposition (302).
  • FIG. 1 Describes a Multilayer Solid State Electrolyte Stack (SSEES)
  • FIG. 2 An Example of Complex Patterns Applied to SSEES Layers
  • FIG. 3 Illustration of types of electrodes and stack configurations
  • FIG. 4 Illustrates the x, y, z axis
  • FIG. 5 Drop and Spread and Evaporation of Nanoparticle Ink
  • FIG. 6 Illustration of an Inkjet Drop pattern
  • FIG. 7 Illustrated a composite material at the deposition layer in inkjet printing
  • FIG. 8 illustrates a Nanoparticle Deposition Frame Structure
  • FIG. 9 Inkjet Compound Material Deposition Flow Chart
  • FIG. 10 Describes the Material Deposition System
  • FIG. 11 Material Deposition Process for the SSEE Layers
  • FIG. 12 Describes the Process to Print an SSE Multilayer Thin Film
  • FIG. 13 Describes the Heat Process to Fabricate an SSE Element Thin Film
  • the terms “a” or “an”, as used herein, are defined as one or more than one.
  • the term “plurality”, as used herein, is defined as two or more than two.
  • the term “another”, as used herein, is defined as at least a second or more.
  • the terms “including” and “having,” as used herein, are defined as comprising i.e., open language.
  • the term “coupled,” as used herein, is defined as “connected,” although not necessarily directly, and not necessarily mechanically. “Communicatively coupled” refers to coupling of components such that these components are able to communicate with one another through, for example, wired, wireless or other communications media.
  • the term "communicatively coupled” or “communicatively coupling” includes, but is not limited to, communicating electronic control signals by which one element may direct or control another.
  • the term “configured to” describes hardware, software or a combination of hardware and software that is adapted to, set up, arranged, commanded, altered, modified, built, composed, constructed, designed, or that has any combination of these characteristics to carry out a given function.
  • the term “adapted to” describes hardware, software or a combination of hardware and software that is capable of, able to accommodate, to make, or that is suitable to carry out a given function.
  • controller refers to a suitably configured processing system adapted to implement one or more embodiments of the present disclosure. Any suitably configured processing system is similarly able to be used by embodiments of the present disclosure.
  • a processing system may include one or more processing systems or processors.
  • a processing system can be realized in a centralized fashion in one processing system or in a distributed fashion where different elements are spread across several interconnected processing systems.
  • the terms “computing system”, “computer system”, and “personal computing system”, describe a processing system that includes a user interface and which is suitably configured and adapted to implement one or more embodiments of the present disclosure.
  • the terms “network”, “computer network”, “computing network”, and “communication network”, describe examples of a collection of computers and devices interconnected by communications channels that facilitate communications among users and allows users to share resources.
  • the terms “wired network” and “wired communication network” similarly describe a network that communicatively couples computers and devices primarily or entirely by wired communication media.
  • SSEE Multilayer Solid State Electrolyte Stack
  • FIG. 1 illustrates the solid state electrolyte layer (101), inner electrodes (102) and external electrodes (103) design for the SSEE Device.
  • FIG. 2 illustrates example print patterns for an SSEE device Element that applies an encapsulated dielectric energy storage layer.
  • a. Where the inner electrodes (201 and 203) are smaller in width and length than the dielectric layer to avoid contact with other electrodes, except where connected to an electrode array collector that forms an outer electrode, and b.
  • insulator material is applied to the outer edges of each left and right electrodes (201 and 203), except where connected to the collector (210 and 210), to avoid potential interaction between the left and right electrodes and to eliminate an electrical path between dielectric layers (202 and 203) , and c.
  • the inner left (201) and inner right inner (203) electrodes are each combined into a left (210) and right (210) collector that forms the outer left and right electrode.
  • the inner electrodes alternate as right and left inner electrodes.
  • the dielectric energy storage layers (202) are encapsulated by insulator material.
  • the insulator layer may be comprised of a variety of materials with various temperatures for heat processing.
  • FIG. 3 illustrates the difference between anodes (301), cathodes (311) and bidirectional anodes (302) and bidirectional cathodes (312).
  • FIG. 3 also illustrates parallel (310) and series (320) stack configurations.
  • a Multilayer Solid State Electrolyte Stack may be configured as a parallel stack, a series stack or a combination of parallel and series stacks.
  • Inkjet printing is used to deposit the layers of the SSEE Thin Film. Particles and or precursor material are used for the fabrication of the SSEE layers. In some cases, composite materials are applied using two or more print heads to create a composite at the printed layer.
  • FIG. 7 we illustrate the printing of two individual types of materials in inkjet droplets (702, 702) and the combined materials as composite in 703). The different materials are mixed to create a uniform composite of the two or more materials deposited.
  • a computer device compiles the inkjet compound set-up (902) derived from the particle loading data (901) for each deposition material (ink) profile.
  • One or more materials are combined to form an ink and where two or more inks are deposited into the same layer by two or more spray or drop on demand devices into the same deposition layer to form a compound.
  • the inkjet processor (905) identifies the ink ratio, drop pattern, drop size, print pattern, print thickness, number of print cycles and drying cycles for the print operation and send this data to the print controller (906) to drive the printer and produce the desired printed pattern.
  • the proportions of the one or more material inks are deposited as spray droplets configured to achieve a composite material with a desired stoichiometric formula.
  • Consecutive independent layers may be printed on top of existing layers as single material layers and or composite material layers. One or more layers may he deposited to create a single layer and or multilayer device.
  • the print process may incorporate one or more single ink print layers and one or more multi ink composite print layers in any configuration, and
  • a computer device can calculate the amount and dispersion method for each material to he deposited to form the desired composite layers
  • the inkjet deposition method described above can be used to fabricate an electronic circuit comprised of single and multilayer devices, electronic devices, circuit patterns, a battery, capacitor and or an energy storage capacitor.
  • Electrolyte materials include any and all dielectric materials that can be applied to a solid state electrolyte battery.
  • Superionic conductors are types of materials that provide excellent performance as an electrolyte material.
  • Superionic conductors are solids with highly mobile ions. As solid electrolytes they allow the movement of ions without the need for a liquid or soft membrane separating the electrodes. The phenomenon relies on the hopping of ions through a rigid crystal structure.
  • Superionic conductors are those solid materials which allow movement of ions through their structure. Typically this occurs at an elevated temperature.
  • the present invention applied the mixing of materials during the material deposition process to create a compound using a spray and or drop-on-demand ink jet printing apparatus.
  • the inkjet deposition system would position the print heads across a two or three dimensional axis with an optional ability to rotate print head alignment to enable the stacking of two dimensional nanoparticle patterned layers to form a three dimensional electronic device.
  • the use of two or more print heads to mix two materials becomes important when the two materials are in compatible in a single solution.
  • the pH level of a solution enables particle distribution, which is an important characteristic for inkjet ink passing through an inkjet printer (material deposition system).
  • the pH of two solutions may need to be different to suspend the different materials that would comprise the desired compound material to be deposited in a single layer. In this case, and others, the use of multiple different solutions may be desirable. After the ink (particle solution) has passed through the inkjet head, the particle suspension is less critical. Therefore, the mixing of the two solutions by multiple deposition print heads is a solution to this problem.
  • the inkjet deposition process for mixing at the deposition layer is as follows:
  • MDP material Deposition Profile
  • the MDP is a ratio of each ink to be applied at the deposition layer, taking into account:
  • Raster Image Software and or ICC Software are modified to reflect chemical composition instead of colors.
  • a raster image processor is a component used in the printing industry which produces a raster image also known as a bitmap.
  • the RIP image is used to generate the patterns to be printed.
  • ICC International Color Consortium
  • the ICC color profiles are a set of data that describes the properties of a color space, the range of colors (gamut) that a monitor can display or a printer can output.
  • the RIP software would be used to define patterns for the material deposition.
  • MDP material Deposition Profile
  • Multiple print methods may be applied for mixing the multiple materials. These include but are not limited to print matrix interlacing, specific patterns and multilayer deposition.
  • a three dimension coordinate system is defined as a Cartesian coordinate system with an ordered triplet of lines (axes) that are pair-wise perpendicular, have a single unit of length for all three axes and have an orientation for each axis. As in the two-dimensional case, each axis becomes a number line. The coordinates of a point P are obtained by drawing a line through P perpendicular to each coordinate axis, and reading the points where these lines meet the axes as three numbers of these number lines.
  • FIG. 4 will illustrate a three dimensional Cartesian coordinate system, with origin O and axis lines X, Y and Z, oriented as shown by the arrows.
  • the tick marks on the axes are one length unit apart.
  • the deposition head deposits Nano Ink onto a substrate or an existing layer.
  • the drop on demand process positions Nano Ink with suspended Nanoparticles in a pattern.
  • the droplet impacts (502) the substrate or existing layer, spreads (503) out and distributes the nanoparticles.
  • the carrier fluid is evaporated leaving the residual Nanoparticles (504) in an ultrathin deposition.
  • the layer (505) may be cured using a variety of methods including Ultraviolet light to activate a photo-initiator and or an infrared heat.
  • a deposition resolution is selected to ensure that the Nano Ink droplets and distributed Nanoparticles provide efficient distribution of the Nanoparticles across the pattern.
  • One or more deposition cycles may be applied to each pattern to ensure that the pattern is filled to the desired thickness with a cohesive covering.
  • FIG. 6 we illustrate examples drop patterns for inkjet deposition.
  • FIG. 7 we illustrate a composite material deposition.
  • FIG. 8 we illustrate the Nanoparticle and precursor material deposition frame.
  • the deposition head (802) is mounted on a fixture (803) that allows for movement across the deposition bed in an X axis (805) and can allow the deposition head up or down in relation to the deposition bed Z axis (804) and allows the deposition head pitch to be altered in various directions.
  • the gantry (808) allows for precise X (805) and Y (807) axis movement of the deposition head across the deposition bed (806).
  • the movement of the gantry (808) and deposition head is accomplished through the use of stepper motors and control electronics.
  • a power supply and communications interface are provided to interface with a computer. Remote access and control can be provided.
  • Optional keyboard, processor and display may enable the Nanoparticle Deposition system to be autonomous.
  • FIG. 9 we illustrate the inkjet compound material deposition flow chart.
  • two or more materials (901) are created as inks with a material profile that identifies the material, carrier fluid and particle loading within the ink.
  • the inkjet compound setup processor (902) creates a profile for each material (ink) that is available for deposition.
  • the inkjet compound processor (905) selects the materials to be deposited as a compound based on the desired compound (903) and the profiles in the inkjet compound setup (902).
  • the inkjet compound processor sends the following data to the print controller to identify the compound to be printed:
  • a substrate is provided for Nanoparticle ink deposition.
  • the substrate may have a non-stick function to allow the multilayer stack to be released from the substrate when the deposition process is completed.
  • FIG. 10 we illustrate the processes used to perform the print process for material deposition.
  • MDP Image Processor and Materials Deposition Profile
  • RIP raster image processor
  • MDP material deposition profile
  • An example of a computer program for designing the pattern of the Nanoparticle and or precursor materials deposition is Power Point from Microsoft.
  • the print controller (1001) provides a high speed data path and electronics that buffer, store, manipulate and route data to the deposition head drivers (1010) in the deposition head array.
  • Deposition head drivers (1010) configure power and drive a deposition head and can define, create and supply the waveform pulses used by the deposition head to eject the Nanoparticle ink drops.
  • Nanoparticle and or precursor material Ink is emitted from nozzles while they pass over the deposition bed.
  • the operation of Nanoparticle and or precursor materials deposition includes the Nanoparticle ink in various types being squirted onto the print bed or an existing layer to build a multilayer stack.
  • the deposition head scans the deposition bed in horizontal strips, using the deposition head positioning system (1011) and the frame’s stepper motors (1021) to drive the Y axis. A row of Nanoparticle and or precursor material ink drops are deposited then the gantry moves the deposition head (1010) into place to deposit the next strip. The deposition head (1010) may deposit a vertical row of droplets on each pass.
  • the deposition head (1010) takes about one half of a second to print the strip across the deposition bed. Multiple deposition heads may be applied to enable more than one ink type.
  • the deposition head (1010) is a "drop on demand” (DOD) device, squirting small droplets of Nanoparticle and or precursor material ink onto the deposition bed or existing layer through tiny nozzles.
  • the amount of Nanoparticle or precursor material ink propelled through the nozzles can be configured through the Deposition head driver (1010) software.
  • an ultra-violet light or infrared radiation is applied (1013, 1024) is to rapidly cure the layer. This allows the repeated layers to be formed in a continuous process.
  • the deposition system may be connected to a network (1002) to allow remote access (1003) or connection to a computer (1004).
  • a multi-layer Nano particle and precursor material deposition system for the fabrication of devices comprised of multiple independent layers each with similar or independent deposition patterns that may have a mixture of materials deposited with a layer that is comprised of: a) A frame structure that allows a print head to be moved in up to four positions including the x, y and z axis (figure 4) and an angle of the print head, and b) One or more inkjet print head with nozzles configured to allow Nanoparticles and or precursor materials combined with a binder and a carrier fluid to pass through the print head and be deposited as droplets onto a print substrate or an existing printed layer, and c) where the inkjet print head conducts one or more print cycles for each print pattern to form a layer, and d) where the layer may be exposed to a headed print bed to reduce, and or evaporate the carrier fluid, and e) Where consecutive independent layers may be printed on top of existing layers, and f) Where the print head maintains a specified distance from the substrate
  • the print controller (1102) controls the ink ratio, drop pattern, drop size, printed patterns, printed thickness how many print cycles per layer, the drying of the printed layers and how many of the individual layers are printed in a configuration.
  • Layer one (1101) has a pattern with defined inks for each pattern in the layer.
  • Layer two (1102) has a pattern with defined inks for each pattern in the layer and so on.
  • the layers are printed and dried using heat and may be UC cured.
  • FIG. 12 we illustrate the process of creating an Multilayer Thin Film for the Solid State Energy Element.
  • (1200) we create the precursor inks (1201, 1203, 1204, etc.) for each material to be deposited as patterns within the layers.
  • 1210 we setup the Material Deposition System to print the patterns within each of the layers.
  • FIG. 13 we illustrate the heat treatment for the SSEE multilayer thin film
  • SSE multilayer thin films are place in an oven for heat treatment at the desired temperatures for selected duration at each temperature (1301 , 1302).
  • the heat treated multilayer thin films become a Solid State Electrolyte Energy Element upon completion of the heat treatment (1303).
  • Computer program in the present context means any expression, in any language, code or notation, of a set of instructions intended to cause a system having an information processing capability to perform a particular function either directly or after either or both of the following a conversion to another language, code or, notation; and b reproduction in a different material form.
  • Each computer system may include, inter alia, one or more computers and at least a computer readable medium allowing a computer to read data, instructions, messages or message packets, and other computer readable information from the computer readable medium.
  • the computer readable medium may include computer readable storage medium embodying non volatile memory, such as read-only memory ROM, flash memory, disk drive memory, CD- ROM, and other permanent storage. Additionally, a computer medium may include volatile storage such as RAM, buffers, cache memory, and network circuits.
  • the computer readable medium may comprise computer readable information in a transitory state medium such as a network link and/or a network interface, including a wired network or a wireless network, that allow a computer to read such computer readable information.
  • a transitory state medium such as a network link and/or a network interface, including a wired network or a wireless network, that allow a computer to read such computer readable information.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

L'invention concerne un condensateur céramique multicouche avancé (SSEE) et un procédé amélioré de production d'un élément d'énergie à semi-conducteurs au moyen d'un dépôt de matériau par jet d'encre et d'encres spécialisées.
PCT/US2019/013615 2018-01-16 2019-01-15 Dispositif de stockage d'énergie à semi-conducteurs et son procédé de fabrication Ceased WO2019143598A1 (fr)

Applications Claiming Priority (2)

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US201862617671P 2018-01-16 2018-01-16
US62/617,671 2018-01-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060120020A1 (en) * 2004-12-03 2006-06-08 Dowgiallo Edward J Jr High performance capacitor with high dielectric constant material
US20100002362A1 (en) * 2006-07-28 2010-01-07 Illinois Tool Works Inc. Double layer capacitor using polymer electrolyte in multilayer construction
US20140233153A1 (en) * 2009-12-16 2014-08-21 Liang Chai Methods for manufacture a capacitor with three-dimensional high surface area electrodes
US20170250406A1 (en) * 2014-10-14 2017-08-31 Fundacion Centro De Investigacion Cooperativa De Energias Alternativas Cic Energigune Fundazioa Sodium ceramic electrolyte battery
US20170330695A1 (en) * 2009-04-13 2017-11-16 David L. FRANK Advanced dielectric energy storage device and method of fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060120020A1 (en) * 2004-12-03 2006-06-08 Dowgiallo Edward J Jr High performance capacitor with high dielectric constant material
US20100002362A1 (en) * 2006-07-28 2010-01-07 Illinois Tool Works Inc. Double layer capacitor using polymer electrolyte in multilayer construction
US20170330695A1 (en) * 2009-04-13 2017-11-16 David L. FRANK Advanced dielectric energy storage device and method of fabrication
US20140233153A1 (en) * 2009-12-16 2014-08-21 Liang Chai Methods for manufacture a capacitor with three-dimensional high surface area electrodes
US20170250406A1 (en) * 2014-10-14 2017-08-31 Fundacion Centro De Investigacion Cooperativa De Energias Alternativas Cic Energigune Fundazioa Sodium ceramic electrolyte battery

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