WO2019038879A1 - Wire forming method and wire forming device - Google Patents

Abstract

This wire forming method comprises: an application step for applying a metal-containing solution, which contains metal particulates, onto an insulating support body or substrate; a baking step for baking the metal-containing solution with a laser beam to form a wire; and a laminating step for laminating the wires by repeating the application step and the baking step, wherein the amount of laser irradiation of the laser beam per unit area in the baking step is varied on the basis of the lamination number of the wires.

Description

Wiring formation method and wiring formation apparatus

In the present disclosure, a metal-containing liquid containing metal fine particles is coated on an insulating support or substrate, and the metal-containing liquid is fired with a laser beam to form a wiring, and a wiring It relates to a forming apparatus.

In recent years, as described in the following patent documents, after a metal-containing liquid containing metal fine particles is coated on an insulating support or substrate, the metal-containing liquid is irradiated with laser light, and the metal-containing liquid A technique for forming a wiring by firing is developed.

JP 2006-59942 A International Publication No. 2014/041670

The metal-containing solution is irradiated with laser light, and the wiring is formed by firing the metal-containing solution, but the metal-containing solution is discharged in a relatively thin state to appropriately fire the metal-containing solution, and the metal in the thin state Wiring is formed by baking the contained liquid. For this reason, the thickness of the wiring is relatively thin. Then, the discharge process of the metal-containing liquid and the irradiation process of the laser light to the metal-containing liquid are repeated, and the wiring is laminated, whereby a laminated body of the wiring having a certain thickness is formed. At this time, if the number of stacked layers of wiring is increased, it is necessary to repeat the discharge processing of the metal-containing liquid and the irradiation processing of the laser light a lot, which may increase the time required for forming the wiring. In addition, there is a possibility that the amount of power consumption by the device which emits the laser beam may be increased. As described above, in the technique of forming a wiring by laser light irradiation, a room for improvement is largely left, and improvement is made to improve practicability. Then, this indication makes it a subject the improvement of the practicability of the wiring formation technique by irradiation of a laser beam.

In order to solve the above problems, in the present specification, a step of applying a metal-containing liquid containing metal fine particles on an insulating support or substrate, and baking the metal-containing liquid with a laser beam And a laminating step of laminating the wiring by repeating the baking step of forming the wiring and the coating step and the baking step, and the laser in the baking step based on the number of laminated layers of the wiring. Disclosed is a wiring formation method for changing the laser irradiation amount per unit area of light.

Further, in the present specification, a coating device for applying a metal-containing liquid containing metal fine particles onto an insulating support or a substrate, and the metal-containing liquid applied by the coating device are irradiated with a laser beam. By firing the metal-containing liquid, the operation of the irradiation device for forming the wiring, the application device and the irradiation device is controlled, and the application of the metal-containing liquid and the firing of the metal-containing liquid are repeated. A control apparatus for laminating the wiring is disclosed, and a wiring forming apparatus for changing the laser irradiation amount per unit area of the laser beam by the irradiation apparatus based on the number of laminated wirings is disclosed.

According to the present disclosure, the laser irradiation amount per unit area of the laser light irradiated to the metal-containing liquid is changed based on the number of laminated layers. Since the laser irradiation amount is obtained by multiplying the laser irradiation time and the laser irradiation intensity, for example, shortening of the laser irradiation time, reduction of the laser intensity, etc. can be achieved by changing the laser irradiation amount. This improves the practicability of the wiring formation technique by laser light irradiation.

It is a figure which shows a wiring formation apparatus. It is a block diagram showing a control device of a wiring formation device. It is sectional drawing which shows the circuit of the state in which the resin laminated body was formed. It is sectional drawing which shows the circuit of the state in which the wiring laminated body was formed on the resin laminated body. It is a table | surface which shows the irradiation time of the laser beam in the conventional wiring formation method, and the irradiation time of the laser beam in the wiring formation method of this indication. It is a conceptual diagram which shows the state to which a laser beam is irradiated to metal ink at the time of wiring formation of 1st layer. It is a conceptual diagram which shows the state to which a laser beam is irradiated to metal ink at the time of wiring formation of several layers. It is a graph which shows the relationship between the lamination | stacking number of wiring, and the magnification of the movement speed of a stage. It is a figure which shows the flowchart at the time of wiring being laminated | stacked. It is a graph which shows the relationship between the lamination | stacking number of wiring, and the magnification of the laser intensity of a laser beam. It is a graph which shows the relationship between the lamination | stacking number of wiring, and the magnification of the movement speed of a stage.

A circuit forming device 10 is shown in FIG. The circuit forming device 10 includes a transport device 20, a first shaping unit 22, a second shaping unit 24, and a control device 26 (see FIG. 2). The transfer device 20, the first shaping unit 22, and the second shaping unit 24 are disposed on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction and the Y-axis direction. The direction is referred to as the Z-axis direction.

The transfer device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Furthermore, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38. By driving the electromagnetic motor 38, the X-axis slider 36 is moved to an arbitrary position in the X-axis direction. The Y-axis slide mechanism 32 also has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. Then, one end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is slidably held by the Y-axis slide rail 50 in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56. By driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. Thereby, the stage 52 is moved to an arbitrary position on the base 28 by the drive of the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device (see FIG. 2) 64. The base 60 is formed in a flat plate shape, and the substrate is mounted on the upper surface. The holding devices 62 are provided on both sides in the X-axis direction of the base 60. Then, both edges in the X-axis direction of the substrate placed on the base 60 are held by the holding device 62, whereby the substrate is fixedly held. In addition, the lifting device 64 is disposed below the base 60, and lifts the base 60.

The first shaping unit 22 is a unit for shaping the wiring on the substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and has a first printing unit 72 and a baking unit 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and discharges metal ink linearly on the substrate 70 placed on the base 60. The metal ink is one in which fine particles of metal are dispersed in a solvent. The inkjet head 76 discharges the conductive material from the plurality of nozzles by, for example, a piezo method using a piezoelectric element.

The baking unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device for irradiating the metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is fired to form a wiring. The baking of the metal ink is a phenomenon in which the evaporation of the solvent, the decomposition of the metal fine particle protective film, and the like are carried out by applying energy, and the metal fine particles contact or fuse to increase the conductivity. is there. Then, the metal ink is fired to form a metal wiring.

The second modeling unit 24 is a unit for modeling a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit 86. . The second printing unit 84 has an ink jet head (see FIG. 2) 88 and discharges the ultraviolet curing resin onto the substrate 70 placed on the base 60. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or may be a thermal method in which a resin is heated to generate air bubbles and discharged from a nozzle.

The curing unit 86 includes a planarization device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The planarization apparatus 90 planarizes the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the ink jet head 88. For example, the excess resin may be a roller or an adhesive while the surface of the ultraviolet curable resin is smoothed. The thickness of the ultraviolet curable resin is made uniform by scraping with a blade. In addition, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 with ultraviolet light. Thereby, the ultraviolet curing resin discharged onto the substrate 70 is cured, and the resin layer is shaped.

Further, as shown in FIG. 2, the control device 26 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. The controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 122. Thus, the controller 120 controls the operation of the transfer device 20, the first shaping unit 22, and the second shaping unit 24.

In the circuit forming device 10, the circuit pattern is formed on the substrate 70 by the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. Then, as shown in FIG. 3, in the second modeling unit 24, the resin laminate 130 is formed on the substrate 70. The resin laminate 130 is formed by repeating the discharge of the ultraviolet curable resin from the ink jet head 88 and the irradiation of the ultraviolet light by the irradiation device 92 to the discharged ultraviolet curable resin.

Specifically, in the second printing unit 84 of the second shaping unit 24, the inkjet head 88 discharges the ultraviolet curable resin in a thin film form on the upper surface of the substrate 70. Subsequently, when the ultraviolet curable resin is discharged in a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing portion 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curing resin with ultraviolet light. Thereby, the thin film resin layer 132 is formed on the substrate 70.

Subsequently, the ink jet head 88 discharges the ultraviolet curable resin in a thin film form on the thin film resin layer 132. Then, the thin film ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin discharged in the thin film onto the thin film resin layer 132. A thin film resin layer 132 is stacked. As described above, the discharge of the ultraviolet curable resin onto the thin film resin layer 132 and the irradiation of the ultraviolet light are repeated, and the plurality of resin layers 132 are laminated, whereby the resin laminate 130 is formed.

When the resin laminate 130 is formed by the above-described procedure, the stage 52 is moved to the lower side of the first modeling unit 22 to form the wiring laminate 136, as shown in FIG. The wiring laminate 136 is formed by repeating discharge of the metal ink from the ink jet head 76 and irradiation of laser light by the laser irradiation device 78 to the discharged metal ink.

Specifically, in the first printing unit 72 of the first shaping unit 22, the inkjet head 76 discharges metal ink linearly on the upper surface of the resin laminate 130 according to the circuit pattern. Subsequently, when the metal ink is discharged according to the circuit pattern, in the baking unit 74, the laser irradiation device 78 irradiates the metal ink with the laser light. At this time, the energy of the laser light is absorbed by the metal ink, whereby the metal ink generates heat and is baked. Thus, the wiring 138 is formed on the resin laminate 130. The thickness of the metal ink discharged by the ink jet head 76 is about several μm to several tens of μm, and the thickness of the wiring 138 formed by firing is several hundred nm to several μm.

Subsequently, the ink jet head 76 discharges the metal ink onto the wiring 138. Then, the laser irradiation device 78 irradiates the metal ink with laser light, whereby the wiring 138 is stacked on the wiring 138. As described above, the discharge of the metal ink and the irradiation of the discharged metal ink with the laser beam are repeated to stack the plurality of wires 138, whereby the wiring stack 136 is formed. The thickness of the wiring stack 136 is several tens μm to several hundreds μm. That is, the discharge of the metal ink and the irradiation of the discharged metal ink with the laser beam are repeated about 50 to 100 times, and the wiring stack 136 is formed by stacking the wirings 138 of 50 to 100. Ru. As described above, in the circuit forming device 10, the resin laminate 130 is formed of the ultraviolet curing resin, and the wiring laminate 136 is formed of the metal ink, whereby a circuit pattern is formed on the substrate 70.

As described above, at the time of circuit pattern formation, the wiring stack 136 is formed by stacking a plurality of wirings 138. At this time, in the conventional formation method, the irradiation time per unit area of the laser beam to the discharged metal ink is constant regardless of the number of stacked layers of the wiring 138.

Specifically, for example, in the case where the irradiation time of the laser light to the ejected metal ink is T seconds when forming the first layer wiring 138, even when forming the second layer wiring 138 and after. The irradiation time of the laser beam to the ejected metal ink is set to T seconds. Therefore, for example, in the case where the wiring stack 136 is formed by stacking 10 layers of the wirings 138, the total irradiation time of the laser light is (10 × T) seconds as shown in FIG. Further, for example, in the case where the wiring stack 136 is formed by stacking the wirings 138 of 100 layers, the total irradiation time of the laser light is (100 × T) seconds.

The laser intensity per unit area at the time of forming the wiring 138 of each layer is the same. The laser intensity indicates the intensity of the laser beam irradiated to the metal ink, and is also called laser illuminance. Therefore, in the conventional method for forming the wiring stack 136, the value obtained by multiplying the irradiation time of the laser light per unit area and the laser irradiation intensity per unit area, that is, the laser irradiation amount per unit area is constant. It had been. Incidentally, since the laser irradiation amount per unit area is the total amount of energy of the laser irradiated to the metal ink, it is also called an integrated light amount of the laser light per unit area.

However, at the time of forming the wiring laminate 136, when the first-layer wiring 138 is formed, the metal ink is discharged onto the resin-made resin laminate 130, and a plurality of wiring 138 is formed. At the time, the metal ink is discharged onto the metal wiring 138. Then, the discharged metal ink is irradiated with laser light, and energy of the laser light is absorbed by the metal ink, whereby the metal ink generates heat and is baked. Under the present circumstances, the energy of the laser beam required for baking, ie, laser irradiation amount, changes with differences in the heat conductivity of resin-made resin laminated body 130 and metal wiring 138.

Specifically, when the first layer wiring 138 is formed, as shown in FIG. 6, the laser beam 152 is applied by the laser irradiation device 78 to the metal ink 150 discharged on the resin laminate 130 made of resin. It is irradiated. At this time, the metal ink 150 generates heat by the irradiated laser light 152 and is baked. However, it is difficult to transfer the heat of the metal ink 150 generated by the irradiation of the laser beam 152 to the resin laminate 130 made of resin, that is, the resin laminate 130 having a low thermal conductivity. For this reason, the resin laminate 130 made of resin does not generate heat as much, and the metal ink 150 is hardly heated by the heat generation of the resin laminate 130. That is, when the metal ink 150 is irradiated with the laser light at the time of forming the first layer wiring 138, the baking of the metal ink 150 is performed by the heat generation of the metal ink 150 by the irradiation of the laser light. The heating of the metal ink 150 by the laminate 130 hardly contributes to the firing of the metal ink 150. As a result, when the metal ink 150 is irradiated with the laser light at the time of forming the first layer wiring 138, the metal ink 150 hardly generates heat from the lower surface, but generates heat from the upper surface, thereby baking it.

On the other hand, when forming the wiring 138 of a plurality of layers, as shown in FIG. 7, the laser irradiation device 78 is applied to the already fired metal ink, that is, the metal ink 150 discharged on the metal wiring 138. The laser beam 152 is irradiated by this. At this time, the metal ink 150 generates heat by the irradiated laser light 152 and is baked. Further, the heat of the metal ink 150 generated by the irradiation of the laser beam 152 is easily transmitted to the metal wiring 138, that is, the wiring 138 having high thermal conductivity. Therefore, the metal wire 138 generates heat, and the heat of the wire 138 heats the metal ink 150. That is, when the metal ink 150 is irradiated with the laser light at the time of formation of the wiring 138 of a plurality of layers, the metal ink 150 not only generates heat by the irradiation of the laser light but also generates heat by heating from the wiring 138 Do. Thus, when the metal ink 150 is irradiated with the laser light when forming the plurality of wiring lines 138, the metal ink 150 generates heat not only from the upper surface but also from the lower surface, thereby efficiently firing the metal ink 150. . The portions blackened in FIG. 6 and FIG. 7 are the baking portions of the metal ink 150.

In consideration of such a thing, the laser beam irradiated to the metal ink 150 at the time of formation of the wiring 138 of a plurality of layers, the laser irradiated to the metal ink 150 at the time of formation of the wiring 138 of the first layer Even if the amount of light irradiation is reduced, the metal ink 150 is appropriately baked at the time of formation of the plurality of wiring lines 138. That is, as the number of stacked layers of the wiring 138 increases, the metal ink 150 is appropriately baked even if the irradiation amount of the laser light to the metal ink 150 is reduced. Therefore, as the number of stacked layers of the wires 138 increases, the irradiation time of the laser light is shortened. The laser intensity is constant regardless of the number of stacked layers of the wires 138. That is, as the number of stacked layers of the wiring 138 increases, the irradiation time of the laser light is shortened without changing the laser intensity in order to reduce the irradiation amount of the laser light to the metal ink 150.

Specifically, as shown in FIG. 8, the magnification of the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light is 1 when forming the first to third wiring 138. Ru. Here, the magnification of the movement speed is a magnification with respect to the movement speed of the stage 52 when the metal ink 150 is irradiated with the laser light by the conventional method. Therefore, at the time of forming the first to third wiring 138, the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light is such that the metal ink 150 is irradiated with the laser light by a conventional method. And the moving speed of the stage 52 at the time of movement. That is, during the formation of the first to third wiring 138, the irradiation time of the laser light to the metal ink 150 is the irradiation time of the laser light when the metal ink 150 is irradiated with the laser light by the conventional method. Same as T. As a result, at the time of forming the first to third layer wirings 138, the metal ink 150 hardly generates heat from the lower surface but bakes by generating heat from the upper surface.

At the time of forming the second and third layers of wiring 138, the metal ink 150 is discharged onto the wiring 138 of one layer or the wiring 138 of two layers, and the metal ink 150 is irradiated with a laser beam. . At this time, the thickness of the wiring 138 located on the lower surface side of the metal ink 150 is very thin, and the amount of heat transferred to the wiring 138 by the heat generation of the metal ink 150 is very small. Therefore, at the time of forming the second and third layer wirings 138, the metal ink 150 hardly generates heat from the lower surface. Therefore, the magnification of the moving speed is 1 not only at the time of formation of the first layer wiring 138 but also at the time of formation of the second and third layer wirings 138. That is, not only at the time of formation of the first layer wiring 138 but also at the time of formation of the second and third layer wirings 138, the irradiation time of the laser light to the metal ink 150 is the metal ink 150 by the conventional method. It is assumed that the irradiation time T of the laser light when the laser light is irradiated.

Further, at the time of forming the fourth layer wiring 138, the magnification of the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light is five. Therefore, the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light when forming the wiring 138 of the fourth layer is the same as the stage 52 when irradiating the laser light when forming the wiring 138 of the first layer. It is five times the moving speed of. That is, at the time of forming the fourth layer wiring 138, the irradiation time of the laser light to the metal ink 150 is 1⁄5 of the irradiation time T of the laser beam at the time of formation of the first wiring 138.

This is because the metal ink 150 discharged onto the third layer wiring 138 is irradiated with laser light when the fourth layer wiring 138 is formed, and the thickness of the wiring 138 located on the lower surface side of the metal ink 150 is This is because the heat of the metal ink 150 is transmitted to the wiring 138 to a certain extent. That is, when the metal ink 150 is irradiated with the laser light when the fourth layer wiring 138 is formed, the metal ink 150 generates heat from the upper surface and also generates heat from the lower surface to some extent. Thereby, even when the fourth layer wiring 138 is formed, the irradiation time of the laser light to the metal ink 150 is set to 1⁄5 of the laser light irradiation time T when the first layer wiring 138 is formed. Properly, the metal ink 150 is fired.

Further, at the time of forming the wiring 138 for the fifth and subsequent layers, the magnification of the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light is set to 10. Therefore, the moving speed of the stage 52 when the metal ink 150 is irradiated with the laser light during the formation of the wiring 138 for the fifth and subsequent layers is the movement during the laser light irradiation when the wiring 138 for the first layer is formed. It is 10 times the speed. That is, at the time of formation of the wiring 138 of the fifth and subsequent layers, the irradiation time of the laser light to the metal ink 150 is 1/10 of the irradiation time T of the laser light at the time of formation of the wiring 138 of the first layer.

This is because the metal ink 150 discharged onto the wiring 138 of four or more layers is irradiated with laser light when the wiring 138 of the fifth and subsequent layers is formed, and the thickness of the wiring 138 positioned on the lower surface side of the metal ink 150 is The thickness is relatively thick, because the heat of the metal ink 150 is transferred to the wiring 138. That is, when the metal ink 150 is irradiated with the laser light at the time of forming the wiring 138 of the fifth and subsequent layers, the metal ink 150 generates heat from the upper surface and also generates heat from the lower surface. Thereby, when forming the wiring 138 for the fifth and subsequent layers, the irradiation time of the laser light to the metal ink 150 is set to 1/10 of the irradiation time T of the laser light when forming the wiring 138 for the first layer. Also, the metal ink 150 is appropriately fired.

In the formation of the wiring 138 of the fifth and subsequent layers, even if the number of stacked layers of the wiring 138 is increased, the magnification of the moving speed is not 10 times or more. That is, at the time of forming the wirings 138 of the fifth and subsequent layers, the irradiation time of the laser light is not shortened even if the number of stacked layers of the wirings 138 is increased. This is because the irradiation amount of the laser light per unit area of the laser light at the time of formation of the wiring 138 of the fifth and subsequent layers is the minimum value necessary for firing the metal ink, and the irradiation amount smaller than the irradiation amount is This is because the metal ink does not burn.

As described above, in the method of forming the wiring stacked body 136 according to the present disclosure, as shown in FIG. 5, the irradiation time of the laser light at the time of forming the first to third wiring 138 is the same as that of the conventional method. The same as time T. The irradiation time of the laser light at the time of forming the fourth layer wiring 138 is 1⁄5 of the irradiation time T of the laser light in the conventional method, and the laser light irradiation time at the time of forming the fifth layer wiring 138 is The irradiation time is set to 1/10 of the laser light irradiation time T in the conventional method.

For this reason, for example, in the case where the wiring stack 136 is formed by stacking the wiring 138 of ten layers, the total irradiation time of the laser light is (3.8 × T) seconds. Here, when compared with the total of the irradiation time of the laser beam when the wiring laminate 136 is formed by the conventional method, the irradiation time of the laser light is the same as the wiring laminate 136 formed by the present method. , 38% of the conventional irradiation time. In addition, for example, in the case where the wiring stack 136 is formed by stacking the wirings 138 of 100 layers, the total irradiation time of the laser light is (12.8 × T) seconds. Here, when compared with the total of the irradiation time of the laser beam when the wiring laminate 136 is formed by the conventional method, the irradiation time of the laser light is the same as the wiring laminate 136 formed by the present method. , 12.8% of the conventional irradiation time. As described above, by adopting the present method in the formation of the wiring laminate 136, the irradiation time of the laser light can be significantly shortened, and the formation time of the circuit pattern can be shortened.

In addition, formation of the wiring laminated body 136 mentioned above is performed according to the program (refer FIG. 2) 190 provided in the controller 120. FIG. Specifically, the flow shown in FIG. 9 is executed according to the program 190, and first, the metal ink is ejected according to the circuit pattern (S100). Next, the moving speed of the stage 52 according to the number of stacked layers of the wiring 138 is determined (S102). Specifically, map data corresponding to FIG. 8 is stored in the controller 120. Then, by referring to the map data, the speed magnification according to the number of stacked layers of the wiring 138 is specified, and the moving speed of the stage 52 is calculated based on the speed magnification. Thereby, the moving speed of the stage 52 according to the number of stacked layers of the wiring 138 is determined.

Subsequently, when the moving speed of the stage 52 is determined, the metal ink is irradiated with the laser beam in a state in which the stage 52 is moved at the determined moving speed (S104). Thus, the wiring 138 is formed. Then, it is determined whether or not the number of layers stacked due to the formation of the wires 138, that is, the number of stacked layers of the wires 138 has reached a preset set number of layers (S106). At this time, when the number of stacked layers of the wiring 138 does not reach the set number of stacked layers (S106: NO), the processing after S100 is repeated. On the other hand, when the number of stacked layers of the wiring 138 has reached the set number of stacked layers (S106: YES), this flow ends.

As shown in FIG. 2, the program 190 includes an application unit 200, a baking unit 202, and a stacking unit 204. The application unit 200 is a functional unit for executing the process of S100, that is, a functional unit for applying a metal ink. The firing unit 202 is a functional unit for executing the process of S104, that is, a functional unit for firing the metal ink by irradiation of a laser beam. The stacking unit 204 is a functional unit for repeatedly performing S100 and S104, that is, a functional unit for stacking wiring.

Further, the irradiation amount of laser light per unit area is obtained by multiplying the irradiation time of the laser light per unit area by the laser irradiation intensity per unit area. For this reason, the irradiation amount of the laser beam to the metal ink 150 can be reduced also by weakening the laser intensity. Therefore, unlike the above-described method, as the number of stacked layers of the wiring 138 increases, the irradiation amount of the laser light to the metal ink 150 can be reduced by weakening the laser intensity without changing the irradiation time of the laser light. Good.

Specifically, as shown in FIG. 10, the intensity magnification of the laser beam irradiated to the metal ink 150 is 1 at the time of formation of the first to third wiring 138. Here, the intensity magnification of the laser light is a magnification with respect to the laser intensity when the metal ink 150 is irradiated with the laser light by a conventional method. Therefore, at the time of forming the first to third wiring 138, the laser intensity of the laser beam irradiated to the metal ink 150 is the same as the laser intensity of the laser beam irradiated to the metal ink 150 by the conventional method. It is assumed. As a result, at the time of forming the first to third layer wirings 138, the metal ink 150 hardly generates heat from the lower surface but bakes by generating heat from the upper surface.

The laser intensity at the time of formation of the second and third layer wirings 138 is the same as the reason described in the laser light irradiation time at the time of formation of the first to third layers of wiring 138, the first layer The laser intensity is the same as when the wiring 138 is formed.

Further, at the time of forming the fourth layer wiring 138, the magnification of the laser intensity of the laser light irradiated to the metal ink 150 is 0.5. Therefore, at the time of forming the fourth layer wiring 138, the laser intensity of the laser beam irradiated to the metal ink 150 is 1⁄2 of the laser intensity of the laser light at the time of forming the first layer wiring 138. . As described above, even if the laser intensity at the time of formation of the fourth layer wiring 138 is halved of the laser intensity at the time of formation of the first layer wiring 138, the three layers of the lower surface of the metal ink The metal ink 150 generates heat from the upper surface and the lower surface by the heating by the wiring 138 and the irradiation of the laser light. Thus, the metal ink 150 is appropriately fired even when the fourth layer wiring 138 is formed.

Further, at the time of formation of the fifth and subsequent wiring 138, the magnification of the laser intensity of the laser beam irradiated to the metal ink 150 is 0.1. Therefore, at the time of formation of the wiring 138 for the fifth and subsequent layers, the laser intensity of the laser light irradiated to the metal ink 150 is 1/10 of the laser intensity of the laser light at the time of formation of the wiring 138 for the first layer. Ru. As described above, even if the laser intensity at the time of formation of the fifth and subsequent wiring 138 is 1/10 of the laser intensity at the time of formation of the first wiring 138, four or more layers existing on the lower surface of the metal ink The metal ink 150 generates heat from the upper surface and the lower surface by the heating by the wiring 138 and the irradiation of the laser light. As a result, the metal ink 150 is appropriately fired even when the fifth and subsequent wirings 138 are formed.

Note that at the time of forming the wirings 138 in the fifth and subsequent layers, the strength magnification is not made 0.1 or less even if the number of stacked layers of the wirings 138 is increased. That is, at the time of formation of the wiring 138 of the fifth and subsequent layers, the laser intensity of the laser light is not weakened even if the number of stacked layers of the wiring 138 increases. This is because the irradiation amount of the laser light per unit area of the laser light at the time of formation of the wiring 138 of the fifth and subsequent layers is the minimum value necessary for firing the metal ink, and the irradiation amount smaller than the irradiation amount is This is because the metal ink does not burn.

As described above, in the method of forming the wiring stacked body 136 according to the present disclosure, the laser intensity at the time of forming the fourth layer wiring 138 is 1⁄2 of the laser intensity in the conventional method. The laser intensity at the time of formation of is made 1/10 of the laser intensity in the conventional method. As a result, the power consumption by the laser irradiation device 78 can be suppressed by weakening the laser intensity at the time of laser irradiation to the metal ink.

Incidentally, in the above embodiment, the circuit forming apparatus 10 is an example of a wiring forming apparatus. The control device 26 is an example of a control device. The substrate 70 is an example of a substrate. The inkjet head 76 is an example of a coating apparatus. The laser irradiation device 78 is an example of the irradiation device. The resin laminate 130 is an example of a support. The wiring 138 is an example of the wiring. The metal ink 150 is an example of a metal-containing liquid. The application unit 200 is an example of an application unit. The firing unit 202 is an example of a firing unit. The stacked unit 204 is an example of a stacked unit. Moreover, the step performed by the application part 200 is an example of an application step. The steps performed by the firing unit 202 are an example of a firing process step. The steps performed by the stacking unit 204 are an example of the stacking step.

Note that the present disclosure is not limited to the above-described embodiment, and can be implemented in various modes in which various modifications and improvements are made based on the knowledge of those skilled in the art. For example, although the metal ink is applied on the resin laminate 130 and the wiring is formed in the above embodiment, the metal ink may be applied on the substrate 70 to form the wiring.

Moreover, in the said Example, although the inkjet head 76 and the laser irradiation apparatus 78 are controlled by the control apparatus 26, you may be controlled by a different control apparatus. That is, the inkjet head 76 may be controlled by the first controller, and the laser irradiation device 78 may be controlled by the second controller.

Further, in the above embodiment, as the number of stacked layers of the wiring 138 increases, the laser irradiation time is shortened while the laser intensity is constant, but the laser strength is increased and the laser irradiation time is shortened. It may be done. Specifically, as shown in FIG. 11, the speed magnification is 1 when forming the first to third layer wiring, and the speed magnification is 5 when forming the fourth layer wiring. At the time of wiring formation, the speed magnification is gradually increased from 10 as the number of stacked layers of wiring increases. At this time, the laser intensity is constant when forming the first to fifth layers of wiring, and the laser intensity is increased when forming the sixth and subsequent layers. As a result, the metal ink can be appropriately fired even if the speed magnification factor in forming the sixth and subsequent layers is increased, and the laser irradiation time can be further shortened.

10: Circuit formation device (wiring formation device) 26: Control device 70: Substrate 76: Ink jet head (coating device) 78: Laser irradiation device (irradiation device) 130: Resin laminate (support) 138: Wiring 150: Metal ink (Metal-containing liquid) 200: application section 202: baking section 204: lamination section

Claims (6)

Applying a metal-containing liquid containing metal fine particles on an insulating support or substrate;
A baking treatment step of forming a wiring by baking the metal-containing liquid with laser light;
Laminating the wiring by repeating the applying step and the firing step;
The wiring formation method which changes the laser irradiation amount per unit area of the laser beam in the said baking process step based on the number of lamination | stacking of the said wiring. The wiring formation method according to claim 1 which reduces the laser irradiation amount per unit area of a laser beam as the number of laminations of said wiring increases, when the number of laminations of said wiring is more than a setup number. When the number of laminations of the wiring is equal to or more than a set number, the irradiation device for irradiating a laser beam at the time of laser light irradiation as the number of laminations of the wiring increases, and the support on which the metal-containing liquid is applied The wiring forming method according to claim 1 or 2, wherein the relative speed with the substrate is increased. The wiring formation method as described in any one of the Claims 1 thru | or 3 which shortens the laser irradiation time per unit area of a laser beam as the number of lamination | stackings of the said wiring increases. The wiring formation method according to any one of claims 1 to 4, wherein the laser intensity per unit area of the laser light is weakened as the number of stacked layers of the wiring increases. A coating device for coating a metal-containing liquid containing metal fine particles on an insulating support or substrate;
An irradiation device that forms a wiring by irradiating the metal-containing liquid applied by the application device with a laser beam and baking the metal-containing liquid;
A control device that controls the operation of the coating device and the irradiation device, and repeats the application of the metal-containing liquid and the firing of the metal-containing liquid to stack the wires;
The wiring formation apparatus which changes the laser irradiation amount per unit area of the laser beam by the said irradiation apparatus based on the number of lamination | stacking of the said wiring.

Images