WO2019031712A1 - Wireless communication chip having embedded antenna, embedded antenna for wireless communication chip, and method for manufacturing wireless communication chip having embedded antenna - Google Patents

Abstract

According to one aspect of the present invention, a wireless communication chip having an embedded antenna, capable of compensating for a length value of the antenna and simultaneously improving antenna efficiency, comprises: a substrate including a first mounting area and a second mounting area; a wireless communication integrated circuit mounted on the first mounting area; and an antenna block mounted on the second mounting area so as to be electrically connected to the wireless communication integrated circuit, wherein the antenna block comprises: a first antenna formed on the substrate; a parasitic element formed on the substrate so as to be spaced apart from the first antenna and inducing coupling with the first antenna; a connection element connected to the first antenna; an insulating layer formed on the first antenna, the parasitic element, and the connection element so as to cover the first antenna, the parasitic element and the connection element; and a second antenna formed on the insulating layer, and electrically connected to the first antenna through the connection element.

Description

A wireless communication chip having a built-in antenna, a built-in antenna for a wireless communication chip, and a method of manufacturing a wireless communication chip having a built-in antenna

The present invention relates to a communication module, and more particularly, to an antenna of a communication module.

A variety of electronic devices capable of performing communication functions are connected to a wireless communication chip such as Bluetooth, Wi-Fi, or GPS to perform a communication function and to transmit communication data to the external or external And an antenna for receiving communication data from the antenna.

1, in a general electronic device 100, a wireless communication chip 120 and an antenna 130 for transmitting and receiving communication data are mounted on a mother board 110, The chip 120 and the antenna 130 are electrically connected to each other through the RF cable 140.

1, since the wireless communication chip 120 and the antenna 130 are mounted in a separate structure in the general electronic device 100, the wireless communication chip 120 and the antenna 130 are connected to each other There is a problem that it is difficult to miniaturize the electronic device 100 as well as the manufacturing cost.

In addition, since the antenna 130 is mounted directly on the mother substrate 110, there is a problem that the resonance frequency of the antenna 130 can be changed according to the shape and size of the mother substrate 110.

SUMMARY OF THE INVENTION The present invention provides a method for manufacturing a wireless communication chip having a built-in antenna for a wireless communication chip, a built-in antenna for a wireless communication chip, and a built-in antenna, This is a technical problem.

Another object of the present invention is to provide a wireless communication chip having a built-in antenna capable of varying a resonant frequency, a built-in antenna for a wireless communication chip, and a wireless communication chip having the built-in antenna.

The present invention also provides a method of manufacturing a wireless communication chip having a built-in antenna for a wireless communication chip, a built-in antenna for a wireless communication chip, and a built-in antenna capable of compensating for the length value of the antenna and improving the antenna efficiency Another technical challenge is.

According to an aspect of the present invention, there is provided a wireless communication chip having a built-in antenna, including: a substrate including a first mounting area and a second mounting area; An integrated circuit 220 for wireless communication mounted on the antenna 212; And an antenna block 230 mounted on the second mounting region 214 so as to be electrically connected to the wireless communication integrated circuit 220. The antenna block 230 includes an antenna block 230 formed on the substrate 210, 1 antenna 240; A parasitic element 260 formed on the substrate 210 so as to be spaced apart from the first antenna 240 and inducing a coupling with the first antenna 240; A connection element 250 connected to the first antenna 240; (Not shown) formed on the first antenna 240, the parasitic element 260, and the connecting element 250 to cover the first antenna 240, the parasitic element 260, An insulating layer 270; And a second antenna 280 formed on the insulating layer 270 and electrically connected to the first antenna 240 through the connecting element 250.

In one embodiment, the parasitic element 260 comprises a first parasitic radiator pattern 262 in the form of a loop and an opening 264 is formed in the first parasitic radiator pattern 262 .

The parasitic element 260 extends from one end of the first parasitic radiator pattern 262 toward the first antenna 240 and connects the first parasitic radiator pattern 262 to the first antenna 240 A second stray emitter pattern 266; And a third parasitic radiator pattern (250) extending from the other end of the first parasitic radiator pattern (262) toward the first antenna (240) and connecting the first parasitic radiator pattern (262) 268).

The first antenna 240 includes a main pattern 312 extending in a first direction D1; A first connection pattern 314 extending from one end of the main pattern 312 in a second direction D2 different from the first direction D1; A second connection pattern 316 extending from the other end of the main pattern 312 in the second direction D2; And a feed pin 320 that extends from the first connection pattern 314 in the second direction D2 and that feeds a feed signal supplied from the wireless communication integrated circuit 220 to the first antenna 240, ); And a first ground unit 330 for grounding the first antenna 240. The first ground unit 330 may include a first ground unit 330 branched from the power supply pin 320 in the first direction D1, And may include a branching portion 332 and a grounding pin 334 extending from the one end of the branching portion 332 in the second direction D2.

The width W1 between the branching portion 332 and the first parasitic radiator pattern 262 may be greater than the inner width W2 of the first parasitic radiator pattern 262. In one embodiment,

The width W1 between the branching portion 332 and the first parasitic radiator pattern 262 may be smaller than the inner width W2 of the first parasitic radiator pattern 262. In other embodiments,

The parasitic element 260 described above is disposed on the substrate 210 in a region formed by the main pattern 312, the first connection pattern 314, and the second connection pattern 316.

The connection element 250 is connected to the second connection pattern 316 and the first antenna 240 extends from the connection element 250 in the second direction D2, And a second ground unit 340 for grounding the first and second ground units 250 and 250.

According to another aspect of the present invention, there is provided an internal antenna for a wireless communication chip, including: a first antenna formed on a substrate; A parasitic element 260 disposed on the substrate 210 so as to be spaced apart from the first antenna 240 and inducing a coupling with the first antenna 240; A connection element 250 connected to the first antenna 240; (Not shown) formed on the first antenna 240, the parasitic element 260, and the connecting element 250 to cover the first antenna 240, the parasitic element 260, An insulating layer 270; And a second antenna 280 formed on the insulating layer 270 and electrically connected to the first antenna 240 through the connection element 250.

In one embodiment, the parasitic element 260 includes a first parasitic radiator pattern 262 in the form of a loop, and the first parasitic radiator pattern 262 has an opening 264 formed therein. At this time, the first parasitic radiator pattern 262 is formed of N sides (N is a natural number), and the opening 264 is formed at a side N2 of the N sides facing the first antenna 240 .

According to another aspect of the present invention, there is provided an electronic apparatus comprising: a first substrate; A first antenna 240 formed on the first substrate 710; A parasitic element 260 disposed on the first substrate 710 to be spaced from the first antenna 240 and inducing a coupling with the first antenna 240; And a wireless communication chip 720 mounted on the first substrate 710 and electrically connected to the first antenna 240. The wireless communication chip 720 includes a first mounting area 212, And a second mounting region (214): an integrated circuit (220) for wireless communication molded into the first mounting region (212); And an antenna block 230 mounted in the second mounting area 214 to be electrically connected to the wireless communication integrated circuit 220 and the first antenna 240, A connection element 250 formed on the second mounting region 214 of the second substrate 210 to be electrically connected to the first antenna 240; An insulating layer 270 formed on the connecting element 250 to cover the connecting element 250; And a second antenna 280 formed on the insulating layer 270 and electrically connected to the first antenna 240 through the connecting element 250.

According to another aspect of the present invention, there is provided a method of manufacturing a wireless communication chip having a built-in antenna, the method comprising: forming a wireless communication integrated circuit (220) in a first mounting area (212) Forming a chip and a circuit wiring; Forming a first antenna (240), a parasitic element (260), and a coupling element (250) in a second mounting region (214) of the substrate (210); Forming an insulating layer (270) on the entire surface of the substrate (210); Forming a second antenna (280) on an insulating layer (270) formed in the second mounting region (214); And electrically connecting the second antenna (280) to the first antenna (240), wherein the parasitic element (260) is mounted on the second mounting region (214) of the substrate (210) 1 antenna 240 to guide coupling between the first antenna 240 and the first antenna 240.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic device, including the steps of: mounting a chip and a circuit wiring constituting an integrated circuit (220) for wireless communication in a first mounting area (212) ; Forming a connection element (250) in a second mounting region (214) of the sub-substrate (210); Forming an insulating layer (270) on the entire surface of the sub-substrate (210); Forming a second antenna (280) on an insulating layer (270) formed in the second mounting region (214); Fabricating a wireless communication chip by electrically connecting the second antenna (280) to the connection element (250); The wireless communication chip is electrically connected to the first antenna 240 on the mother board 710 on which the first antenna 240 and the parasitic element 260 are formed. Wherein the parasitic element is disposed on the mosquito plate and spaced apart from the first antenna to direct the coupling between the first antenna and the first antenna, .

According to the present invention, since the antenna is embedded in the wireless communication chip, the RF cable for connecting the antenna and the wireless communication chip on the mother board of the electronic device is not required, so that the manufacturing cost can be reduced and the electronic device can be miniaturized It is effective.

Further, according to the present invention, since the antenna is not designed directly on the mother substrate of the electronic apparatus, the resonance frequency of the antenna can be prevented from being changed according to the shape and size of the mother substrate.

Further, according to the present invention, since the resonance frequency of the antenna can be varied by using the lumped-parameter element included in the antenna, the antenna can be applied to various applications without additional configuration or configuration change.

According to another aspect of the present invention, there is provided a parasitic element that is spaced apart from the first antenna by a predetermined distance, thereby inducing coupling of the parasitic element with the first antenna to substantially extend the length of the first antenna There is an effect that the length of the first antenna can be compensated and at the same time the efficiency of the first antenna can be improved.

1 is a schematic view showing a configuration of a general electronic apparatus in which a wireless communication chip and an antenna are separately mounted.

2A is a partially exploded perspective view of a wireless communication chip according to a first embodiment of the present invention.

2B is a partially exploded perspective view of a wireless communication chip according to the first embodiment of the present invention.

2C to 2E are partial exploded perspective views of a wireless communication chip according to a modification of the first embodiment.

3 is a side view of a wireless communication chip according to the first embodiment of the present invention.

4 is an exemplary view showing the sizes of the first mounting area and the second mounting area on the substrate.

5 is a graph showing an efficiency of an antenna block including a parasitic element and an efficiency of an antenna block not including a parasitic element.

6 is a partially exploded perspective view of a wireless communication chip according to a second embodiment of the present invention.

7A is a partial perspective view of an electronic device including a wireless communication chip according to a third embodiment of the present invention.

7B is a partially exploded perspective view of an electronic device including a wireless communication chip according to a third embodiment of the present invention.

7C to 7E are partially exploded perspective views of an electronic device including a wireless communication chip according to a modified example of the third embodiment.

8 is a side view of an electronic device including a wireless communication chip according to a third embodiment of the present invention.

9A and 9B are views showing an example in which a wireless communication chip according to the present invention is mounted on the center of one side of a mother board and a radiation pattern at that time.

10A and 10B are views showing an example in which a wireless communication chip according to the present invention is mounted on the edge of a mother board and a radiation pattern at that time.

11 is a side view of an electronic device including a wireless communication chip according to a fourth embodiment of the present invention.

12 is a flowchart showing a method of manufacturing a wireless communication chip according to the first and second embodiments of the present invention.

13 is a flowchart showing a method of manufacturing an electronic device including a wireless communication chip according to the third and fourth embodiments of the present invention.

The meaning of the terms described herein should be understood as follows.

The word " first, " " second, " and the like, used to distinguish one element from another, are to be understood to include plural representations unless the context clearly dictates otherwise. The scope of the right should not be limited by these terms.

It should be understood that the terms "comprises" or "having" does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

It should be understood that the term " at least one " includes all possible combinations from one or more related items. For example, the meaning of " at least one of the first item, the second item and the third item " means not only the first item, the second item or the third item, but also the second item and the second item among the first item, Means any combination of items that can be presented from more than one.

First Embodiment

Hereinafter, the first embodiment of the present invention will be described in detail with reference to Figs. 2 to 4. Fig. FIG. 2A is a perspective view of a wireless communication chip according to a first embodiment of the present invention, FIG. 2B is a partially exploded perspective view of a wireless communication chip according to the first embodiment of the present invention, FIGS. 2C- FIG. 3 is a side view of a wireless communication chip according to a first embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating a size of a first mounting area and a second mounting area on a substrate Fig.

The wireless communication chip 200 according to the first embodiment of the present invention is mounted on a mother board (not shown) of an electronic device to implement a communication function of the electronic device. In one embodiment, the wireless communication chip 200 according to the present invention may be a short distance communication chip capable of short range communication such as Bluetooth, WiFi, Beecon, NFC have. However, the present invention is not limited to this, and the wireless communication chip 200 according to the present invention may be a communication chip that enables wireless communication such as 3G, 4G, or 5G.

The wireless communication chip 200 according to the present invention includes a substrate 210, a wireless communication integrated circuit 220, and an antenna block 230 as shown in FIGS. 2A and 2B.

On the substrate 210, the wireless communication integrated circuit 220 and the antenna block 230 are mounted. In one embodiment, the substrate 210 may be a printed circuit board (PCB). 2A and 2B, the substrate 210 according to the present invention includes a first mounting region 212 on which the wireless communication integrated circuit 220 is mounted, and a second mounting region 212 on which the antenna block 230 is mounted. (214). At this time, the length of the substrate 210 in the first direction D1 may be shorter than the length of the substrate 210 in the second direction D2.

In one embodiment, the first mounting area 212 may be formed to have an area larger than the second mounting area 214. [ 4, when the length of the first side a of the substrate 210 is 6.5 mm and the length of the second side b of the substrate 210 is 6.5 mm, The first side ac of the first mounting region 212 on which the antenna block 230 is mounted is 5.0 mm and the side b of the first mounting region 212 is 6.5 mm, The first side c of the first side 214 may be 1.5 mm and the second side b may be 6,5 mm in size.

The integrated circuit 220 for wireless communication is molded and formed on the first mounting region 212 of the substrate 210. [ In one embodiment, the wireless communication integrated circuit 220 may be a short range communication module such as Bluetooth, WiFi, Beecon or NFC, or a communication such as 3G, 4G, or 5G Module.

The integrated circuit 220 for wireless communication includes a circuit wiring (not shown) patterned in the first mounting area 212 of the substrate 210, a first wiring line (not shown) of the substrate 210 to be electrically connected to the circuit wiring A base band chip / RF chip 222 mounted on the mounting region 212, and an insulating layer 224 for covering the base band chip / RF chip 222.

The antenna block 230 is electrically connected to the integrated circuit 220 for wireless communication and externally transmits communication data supplied from the integrated circuit 220 for wireless communication or receives externally received communication data. The antenna block 230 can radiate communication data to the outside or receive communication data received from the outside using an electric signal (for example, current) supplied from the wireless communication integrated circuit 220. [

In one embodiment, the antenna block 230 according to the present invention includes a first antenna 240, a connecting element 250, a parasitic element 260, and a second antenna 240, as shown in FIGS. 2A, 2B, An insulating layer 270, and a second antenna 280.

The first antenna 240 is formed on the substrate 210 so as to be electrically connected to the wireless communication integrated circuit 220. The first antenna 240 may be patterned on the substrate 210. In one embodiment, the first antenna 240 may be patterned and formed with circuit wiring designed in the first mounting area 212.

The first antenna 240 according to the present invention may include a radiator pattern 310, a feed pin 320, and a first ground portion 330, as shown in FIGS. 2A, 2B, have.

The radiator pattern 310 is formed to have a predetermined length on the second mounting region 214 of the substrate 210. [ At this time, the length of the radiator pattern 310 may be determined according to a desired resonance frequency band. In one embodiment, the emitter pattern 310 includes a main pattern 312, a first connecting pattern 314, and a second connecting pattern 316. In one embodiment,

The main pattern 312 is formed to extend in the first direction D1 on the second mounting region 214 of the substrate 210. [ The first connection pattern 314 extends from one end of the main pattern 312 in the second direction D2. The first connection pattern 314 is connected to the feed pin 320. The second connection pattern 316 extends from the other end of the main pattern 314 in the second direction D2. The second connection pattern 316 is connected to the connection element 250. The first connection pattern 314 and the second connection pattern 316 are formed to have the same length and the main pattern 312 is formed to have a length longer than the first and second connection patterns 314 and 316 As shown in FIG.

The feed pin 320 supplies the electric signal supplied from the radio communication integrated circuit 220 to the radiator pattern 310. In one embodiment, the feed pin 320 may be formed to extend from the first connection pattern 314 of the radiator pattern 310 in the second direction D2.

The first grounding part 330 grounds the radiator pattern 310. The first ground 330 may electrically connect the emitter pattern 310 to ground (not shown) in the integrated circuit 220 for wireless communication to ground the emitter pattern 310.

In one embodiment, the first ground 330 may be branched from the feed pin 320. According to this embodiment, the first ground portion 330 includes a branch portion 332 and a ground pin 334, as shown in FIG. 2B.

The branch portion 332 may be formed to extend in the first direction D1 from a point where the feed pin 320 and the first connection pattern 314 are connected. The ground pin 334 is formed to extend from the one end of the branched portion 332 in the second direction D2. The ground pin 334 is electrically connected to the ground in the wireless communication integrated circuit 220. That is, one end of the ground pin 334 is connected to the branch portion 332, and the other end of the ground pin 334 is electrically connected to the ground portion in the radio communication integrated circuit 220.

The length of the branch portion 332 may be set to a value that allows the current distribution to be concentrated at the branch portion 332 and the ground pin 334 portion. For example, the length of the branched portion 332 may be set to 0.02 lambda to 0.03 lambda. Accordingly, the feed pin 320 and the ground pin 334 are spaced apart from each other by an interval of 0.02 lambda to 0.03 lambda.

Referring again to FIGS. 2A, 2B, and 3, the connecting element 250 electrically connects the first antenna 240 and the second antenna 280. The connecting element 250 may be formed on the substrate 210 so as to extend in the second direction D2 from the second connection pattern 316 of the radiator pattern 310. [

In one embodiment, the connecting element 250 may be implemented as a lumped element. The first antenna 240 and the second antenna 280 are connected to the first terminal 252 of the connecting element 250 and the second terminal 254 of the connecting element 250 is connected to the first terminal 252 (Floating). When the connection element 250 is implemented as a lumped element, the connection element 250 is formed to have a predetermined height from the surface of the substrate 210. The radiator pattern 310 of the first antenna 240 is connected to the lower surface of the first terminal 252 of the connecting element 250 and the radiator pattern 310 of the first antenna 240 is connected to the upper surface of the first terminal 252 of the connecting element 250. [ 2 antenna 280 are connected to each other to electrically connect the first antenna 240 and the second antenna 280 to each other.

The parasitic element 260 is formed on the second mounting region 214 of the substrate 210 so as to be spaced apart from the first antenna 240 by a predetermined distance. The parasitic element 260 induces coupling between the first antenna 240 and the first antenna 240 so that the first antenna 240 has substantially the same effect as that of the first antenna 240 while maintaining the performance of the first antenna 240.

The parasitic element 260 may be patterned on the substrate 210. In one embodiment, the parasitic element 260 may be patterned and formed with circuit wiring designed in the first mounting region 212.

The parasitic element 260 includes a main pattern 312, a first connection pattern 314, and a second connection pattern 313 constituting the radiator pattern 310 on the second mounting region 214 of the substrate 210, May be formed in the region formed by the second connection pattern 326. [

In one embodiment, the parasitic element 260 may comprise a first parasitic radiator pattern 262 in the form of a loop. At this time, the opening portion 264 is formed in the loop-shaped first parasitic radiator pattern 262. In the present invention, the parasitic element 260 is formed of the first parasitic radiator pattern 262 in the form of a loop to increase the length of the parasitic element 260, and the first parasitic radiator pattern 262 The reason for forming the opening 264 is to facilitate the current exchange due to the coupling induction between the first parasitic radiator pattern 262 and the first antenna 242 through the opening 264. [

According to the embodiment described above, the loop-shaped first parasitic radiator pattern 262 may be composed of N (N is a natural number) sides. Specifically, the first parasitic radiator pattern 262 includes a first side N1 formed to face the integrated circuit 220 for wireless communication, a first side N1 in the direction of the main pattern 312 with respect to the first side N1, A third side N3 connecting one end of the first side N1 and one end of the second side N2 and a third side N2 connecting the other side of the first side N1, And a fourth side N4 connecting the other end of the second side N2. At this time, the opening 264 is formed at a substantially central portion of the second side N2 formed so as to face the main pattern 312 among the N sides.

2B, the width W1 between the first side N1 of the N sides and the branching portion 332 is greater than the width W1 of the first side N1, which is the inner width of the first parasitic radiator pattern 262, The first parasitic radiator pattern 262 may be formed to be larger than the width W2 between the second side N2 and the second side N2.

2C, the width W1 between the first side N1 and the branching portion 332 of the N sides is the first side (the inner width of the first parasitic radiator pattern 262) The first parasitic radiator pattern 262 may be formed to be smaller than the width W2 between the first side N1 and the second side N2.

The antenna length adjustment and the impedance adjustment for frequency matching can be performed through the adjustment of W1 and W2.

2B and 2C, the parasitic element 260 has been described as including only the first parasitic radiator pattern 262 having the opening 264 formed therein. However, in a modified embodiment, the parasitic element 260 may further include a second parasitic emitter pattern 266 and a third parasitic emitter pattern 268, as shown in Figures 2d and 2e.

The second parasitic radiator pattern 266 extends from the one end of the first parasitic radiator pattern 262 in the second direction D2 and is connected to the main pattern 312. [ In one embodiment, when the first parasitic radiator pattern 262 is composed of N sides, the second parasitic radiator pattern 266 is formed by opening portions 264 of the N sides constituting the first parasitic radiator pattern 262 And extends in the second direction D2 from one side of the opening 264 of the second side N2 on which the main pattern 312 is formed.

The third parasitic radiator pattern 268 extends in the second direction D2 from the other end of the first parasitic radiator pattern 262 and is connected to the main pattern 312. In one embodiment, when the first parasitic radiator pattern 262 is comprised of N sides, the third parasitic radiator pattern 268 may include an opening 264 of the N sides constituting the first parasitic radiator pattern 262 And extends in the second direction D2 from the other side of the opening 264 of the second side N2 on which the main pattern 312 is formed.

FIG. 5 is a graph illustrating a comparison between the efficiency of the antenna block 230 including the parasitic element 260 and the efficiency of the antenna block 230 that does not include the parasitic element 260. 6, when the antenna block 230 includes the parasitic element 260, the efficiency is improved compared to the case 620 in which the antenna block 230 does not include the parasitic element 260 .

2B, the insulating layer 270 is formed on the second mounting region 214 of the substrate 210 to cover the first antenna 240, the connecting element 250, and the parasitic element 260 do. The insulating layer 270 may be formed to a thickness such that the first antenna 240, the connecting element 250, and the parasitic element 260 are not exposed to the outside. Accordingly, the antenna block 230 according to the present invention can protect the first antenna 240, the connecting element 250, and the parasitic element 260 with only the insulating layer 270 without a separate external case.

Meanwhile, the insulating layer 270 may be formed at the same height as the insulating layer 224 constituting the wireless communication integrated circuit 220. In this case, the insulating layer 270 may be formed together with the insulating layer 224 of the wireless communication integrated circuit 220.

In one embodiment, the insulating layer 270 may be formed of epoxy. In another embodiment, the insulating layer 270 may be formed of a high permittivity material having a dielectric constant equal to or higher than a reference value, for example, a ceramic.

The second antenna 280 is formed on the insulating layer 270 to be electrically connected to the first antenna 240 through the connecting element 250. As such, the second antenna 280 is electrically connected to the first antenna 240, so that the first antenna 240 has an effect of extending the length of the second antenna 280 by a length. The second antenna 280 may be formed to extend in the first direction D1 on the insulating layer 270 and the spacing distance between the second antenna 280 and the substrate 210 may be 0.2 to 0.3 lt; / RTI >

At this time, the first surface of the second antenna 280 contacts the insulating layer 270, and the second surface of the second antenna 280, which is the opposite surface of the first surface, is exposed to the outside of the wireless communication chip 200 . That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost portion and is exposed to the outside.

The reason why the first antenna 240, the insulating layer 270 and the second antenna 280 are disposed on the upper surface of the substrate 210 in a laminated structure in the above- When the first antenna 240 and the second antenna 280 are disposed on the upper surface of the substrate 210, a via hole for electrical connection between the first antenna 240 and the second antenna 280 is formed on the substrate 210 Since the thickness of the substrate 210 is thin, it is difficult to directly form a via hole in the substrate 210. [

Therefore, in the first embodiment of the present invention, the first antenna 240, the insulating layer 270, and the second antenna 280 are stacked on the upper surface of the substrate 210, It is possible to electrically connect the first and second antennas 240 and 280 without forming a gap between the second antenna 280 and the first antenna 240, The distance between the first and second antennas 330 and 330 can be ensured, and the antenna performance can be improved.

In one embodiment, the second antenna 280 includes a compression groove 282 for electrically connecting the second antenna 280 to the connecting element 250, as shown in FIGS. 2 and 3 . The reason why the second antenna 280 according to the present invention includes the compression groove 282 is that when the height of the connection element 250 is lower than the height of the insulation layer 270, Since the second antenna 280 formed on the insulating layer 270 can not be connected to the connecting element 250 because the second antenna 280 is formed on the insulating layer 270, So that the antenna 280 passes through the insulating layer 270 and is connected to the connecting element 250.

According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the upper surface of the first terminal 252 of the connecting element 250.

Since the connecting element 250 is formed at a lower height than the insulating layer 270 in order to connect the second antenna 280 to the connecting element 250, 282). However, in another embodiment, the height of the connecting element 250 and the insulating layer 270 are the same or the height of the connecting element 250 is higher than the height of the insulating layer 270, The second antenna 280 may be directly connected to the upper surface of the first terminal 252 of the connection element 250 without a separate compression groove 282 when the upper surface of the connection element 252 is exposed to the outside. Accordingly, the compression grooves 282 may be selectively provided depending on the height of the coupling element 250 and the insulating layer 270.

In one embodiment, the resonant frequency of the second antenna 280 may be the same as the resonant frequency of the first antenna 240. Accordingly, interference that may occur between the second antenna 280 and the first antenna 240 can be prevented in advance.

As described above, according to the present invention, since the antenna block 230 is mounted in the wireless communication chip 200, when the wireless communication chip 200 is mounted on the mother board, the connection between the wireless communication chip 200 and the antenna It is possible to reduce the manufacturing cost and improve the degree of integration on the mother board, thereby making it possible to miniaturize electronic equipment and increase the easiness of circuit wiring on the mother board. The convenience of the operation can be increased.

Particularly, according to the present invention, a parasitic element 260 for inducing coupling between the first antenna 240 and the first antenna 240 is additionally disposed on the substrate 210, The effect of extending the length of the first antenna 240 by the length of the parasitic element 260 while maintaining the performance can be generated.

According to the present invention, since the antenna block 230 is mounted in the wireless communication chip 200 and is not designed directly on the mother board of the electronic device, it is possible to prevent the resonance frequency of the antenna from being changed according to the shape and size of the mother board. You may.

Second Embodiment

In the first and second embodiments shown in FIGS. 2B through 2E, even if the connecting element 250 constituting the antenna block 230 is implemented as a lumped element, 1 terminal 252 is electrically connected to the first antenna 240 and the second antenna 280 and the second terminal 254 of the connection element 250 is floated.

However, in order to change the resonance frequency of the antenna block 230 using the coupling element 250 implemented as a lumped element, the antenna block 230 according to the second embodiment may be modified as shown in FIG. 6 And a second ground portion 340 for grounding the connecting element 250 as shown in FIG.

The wireless communication chip 600 according to the second embodiment shown in FIG. 6 is different from the wireless communication chip 600 according to the first embodiment shown in FIG. 2B to FIG. 2E except that the second grounding part 340 is included. The second ground unit 340 will be described below for convenience of explanation. Although the parasitic element 260 is shown in FIG. 6 as having the same shape as that shown in FIG. 2B for convenience of explanation, the wireless communication chip 600 including the parasitic element 260 of the type shown in FIGS. 2C- May also include a second ground unit 340.

The second grounding unit 340 grounds the connecting element 250 by electrically connecting the connecting element 250 to a grounding unit (not shown) inside the wireless communication integrated circuit 200. To this end, the second grounding portion 340 is formed to extend from the second terminal 254 of the connecting element 250 in the second direction D2.

As described above, according to the second embodiment of the present invention, the connecting element 250 is implemented as a lumped element including at least one of an inductor, a capacitor, and a resistor, and the first terminal 252 of the connecting element 250, The second terminal 254 of the connection element 250 is connected to the first antenna 240 and the second antenna 280 so that the connection terminal 250 is grounded through the second ground portion 340, It is possible to vary the resonance frequency of the antenna block 230 by changing the value of the circuit element to which the antenna block 230 is connected. Therefore, the antenna block 230 can be applied to various applications without any additional configuration or configuration change.

In the second embodiment, the first antenna 240, the insulating layer 270, and the second antenna 280 are disposed in a laminated structure on the upper surface of the substrate 210, as in the first embodiment, The first and second antennas 240 and 280 can be electrically connected without forming a via hole and the distance between the second antenna 280 and the first antenna 240 as well as the distance between the second antenna 280 and the first and second antennas 240 and 280, The spacing distance between the second ground units 330 and 340 can be ensured, and the antenna performance can be improved.

Third Embodiment

In the first and second embodiments, the first antenna 240, the parasitic element 260, and the second antenna 280 are both included in the wireless communication chip 200. However, in the case of the wireless communication chip 720 according to the third embodiment, only the second antenna 280 is included, and the first antenna 240 and the parasitic element 260 are directly connected to the mother board 710 of the electronic device . Hereinafter, an electronic apparatus including a wireless communication chip according to a third embodiment of the present invention will be described with reference to Figs. 7 and 8. Fig.

FIG. 7A is a perspective view showing an electronic device in which a wireless communication chip according to a third embodiment of the present invention is mounted, FIG. 7B is an exploded perspective view showing an electronic device in which a wireless communication chip according to a third embodiment of the present invention is mounted And FIGS. 7C to 7E are exploded perspective views showing an electronic device in which the third embodiment is mounted with the wireless communication chip according to the modified embodiment, and FIG. 8 is a side view of the wireless communication chip according to the third embodiment.

7 and 8, the electronic device 700 includes a mother board 710, a wireless communication chip 720, a first antenna 240, and a parasitic element 260.

The mother board 710 is mounted with various chips (not shown) for implementing the functions of the electronic device 700. [ Particularly, the wireless communication chip 720 according to the third embodiment of the present invention is mounted on the mother board 710 according to the present invention, and the first antenna 240 and the parasitic element 260 according to the present invention are formed . That is, in the first and second embodiments, the first antenna 240 and the parasitic element 260 are included in the wireless communication chip 200, but in the third embodiment, the first antenna 240 and the parasitic element 260 are included, Is formed directly on the mother board 710 without being included in the wireless communication chip 720. [

The wireless communication chip 720 is mounted on a predetermined area of the mother board 710 so that the electronic device 700 can perform a communication function. In one embodiment, the wireless communication chip 720 may be a short range communication chip that enables short range communication such as Bluetooth, WiFi, Beecon, or NFC. However, the present invention is not limited to this, and the wireless communication chip 720 according to the present invention may be a communication module that enables wireless communication such as 3G, 4G, or 5G.

In one embodiment, the wireless communication chip 720 may be mounted in one central region of the mother board 710, as shown in FIG. 9A, or mounted on a corner portion of the mother board 710, as shown in FIG. 10A . The radiation pattern is as shown in Fig. 9B when the wireless communication chip 720 is mounted on the central region of one side of the mother substrate 710 and when the wireless communication chip 720 is mounted on the edge portion of the mother substrate 710 The radiation pattern is as shown in Fig. 10B. As can be seen from FIG. 10, it can be seen that a more uniform radiation pattern can be secured when the wireless communication chip 720 is mounted in the central region on one side of the edge portion of the mother substrate 710.

The wireless communication chip 720 according to the third embodiment of the present invention includes a sub substrate 210, a wireless communication integrated circuit 220 and an antenna block 230. The antenna block 230 includes a connection element 250 ), An insulating layer 270, and a second antenna 280. Here, the sub-substrate 210 is the same as the substrate 210 in the first and second embodiments.

The integrated circuit 220 and the antenna block 230 are mounted on the sub-board 210. In one embodiment, the secondary substrate 210 may be a printed circuit board (PCB). The sub-board 210 according to the present invention includes a first mounting area 212 on which the wireless communication integrated circuit 220 is mounted and a second mounting area 214 on which the antenna block 230 is mounted. At this time, the length of the sub-substrate 210 in the first direction D1 may be shorter than the length of the sub-substrate 210 in the second direction D2.

In one embodiment, a first via hole 810 is formed in the sub-substrate 210 for connection between the first antenna 240 and the integrated circuit 220 for wireless communication, as shown in FIG. 7B.

7B and 8, a first conductor 812 for electrical connection between the wireless communication IC 220 and the first antenna 240 is filled in the first via hole 810. 7B, the first via hole 810 and the wireless communication integrated circuit 220 are electrically connected to the wireless communication integrated circuit 220 at this time to connect the first via hole 810 to the wireless communication integrated circuit 220. [ A sub power feed pin 322 may be formed.

As shown in FIG. 7B, a second via hole 820 for connecting the first antenna 240 to the connection element 250 may be additionally formed on the sub-substrate 210. As shown in FIGS. 7B and 8, the second via hole 820 is filled with a second conductor 822 for electrical connection between the connection element 250 and the first antenna 240.

Thus, the wireless communication chip 720 and the first antenna 240 are formed on the mother substrate 210, as the first antenna 240 is directly formed on the mother substrate 710. In this case, 1 and the second via holes 810 and 820, respectively.

The integrated circuit 220 for wireless communication is molded and formed on the first mounting region 212 of the sub-board 210. In one embodiment, the wireless communication integrated circuit 220 may be a short range communication module such as Bluetooth, WiFi, Beecon or NFC, or a communication such as 3G, 4G, or 5G Module.

The integrated circuit 220 for wireless communication includes a circuit wiring (not shown) patterned in the first mounting region 212 of the sub-board 210, a circuit wiring (not shown) electrically connected to the circuit wiring for implementing a communication function, A base band chip / RF chip 222 mounted on the first mounting area 212, and an insulating layer 224 for covering the base bad chip / RF chip 222.

The antenna block 230 is electrically connected to the integrated circuit 220 for wireless communication and externally transmits communication data supplied from the integrated circuit 220 for wireless communication or receives externally received communication data. The antenna block 230 can radiate communication data to the outside or receive communication data received from the outside using an electric signal (for example, current) supplied from the wireless communication integrated circuit 220. [

The antenna block 230 includes a connecting element 250, an insulating layer 270, and a second antenna 280, as shown in FIGS.

The connecting element 250 is formed in the second mounting region 214 of the sub-board 210 to electrically connect the second antenna 280 to the first antenna 240 formed on the mother board 710. The connection element 250 is electrically connected to the second connection pattern 316 of the first antenna 240 formed on the mother board 710 through the second via hole 820.

In one embodiment, the connecting element 250 may be implemented as a lumped element. The first antenna 240 and the second antenna 280 are connected to the first terminal 252 of the connecting element 250 and the second terminal 254 of the connecting element 250 is connected to the first terminal 252 (Floating).

When the connection element 250 is implemented as a lumped element, the connection element 250 is formed to have a predetermined height from the surface of the substrate 210. The lower surface of the first terminal 252 of the connection element 250 is connected to the second connection pattern 316 of the first antenna 240 through the second via hole 820, The upper surface of the first terminal 252 is connected to the second antenna 280 so that the first antenna 240 and the second antenna 280 are electrically connected.

 An insulating layer 270 is formed on the second mounting region 214 of the secondary substrate 210 to cover the connecting element 250. The insulating layer 270 may be formed to a thickness such that the connecting element 250 is not exposed to the outside. Accordingly, the antenna block 230 according to the present invention can protect the connection element 250 with only the insulation layer 270 without a separate external case.

Meanwhile, the insulating layer 270 may be formed at the same height as the insulating layer 224 constituting the wireless communication integrated circuit 220. In this case, the insulating layer 270 may be formed together with the insulating layer 224 of the wireless communication integrated circuit 220.

In one embodiment, the insulating layer 270 may be formed of epoxy. In another embodiment, the insulating layer 270 may be formed of a high permittivity material having a dielectric constant equal to or higher than a reference value, for example, a ceramic.

The second antenna 280 is formed on the insulating layer 270 to be electrically connected to the first antenna 240 through the connecting element 250. As such, the second antenna 280 is electrically connected to the first antenna 240, so that the first antenna 240 has an effect of extending the length of the second antenna 280 by a length. The second antenna 280 may be formed to extend in the first direction D1 on the insulating layer 270 and the spacing distance between the second antenna 280 and the sub- Lt; / RTI >

The first surface of the second antenna 280 contacts the insulating layer 270 and the second surface of the second antenna 280 opposite to the first surface is exposed to the outside of the wireless communication chip 720. [ . That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost portion and is exposed to the outside.

In one embodiment, the second antenna 280 includes a compression groove 282 for electrically connecting the second antenna 280 to the connection element 250, as shown in FIGS. 7 and 8 . The reason why the second antenna 280 according to the present invention includes the compression groove 282 is that when the height of the connection element 250 is lower than the height of the insulation layer 270, Since the second antenna 280 formed on the insulating layer 270 can not be connected to the connecting element 250 because the second antenna 280 is formed on the insulating layer 270, So that the antenna 280 passes through the insulating layer 270 and is connected to the connecting element 250.

According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the upper surface of the first terminal 252 of the connecting element 250.

Since the connecting element 250 is formed at a lower height than the insulating layer 270 in order to connect the second antenna 280 to the connecting element 250, 282). However, in another embodiment, the height of the connecting element 250 and the insulating layer 270 are the same or the height of the connecting element 250 is higher than the height of the insulating layer 270, The second antenna 280 may be directly connected to the upper surface of the first terminal 252 of the connection element 250 without a separate compression groove 282 when the upper surface of the connection element 252 is exposed to the outside. Accordingly, the compression grooves 282 may be selectively provided depending on the height of the coupling element 250 and the insulating layer 270.

The first antenna 240 is formed directly on the mother board 710. The first antenna 240 is formed on the mother board 710 so as to be electrically connected to the wireless communication integrated circuit 220 and the second antenna 280 of the antenna block 230. The first antenna 240 may be patterned on the mother substrate 710.

In one embodiment, the first antenna 240 may include a radiator pattern 310, a feed pin 320, and a first ground 330.

The radiator pattern 310 is formed directly on the mother substrate 710. At this time, the length of the radiator pattern 310 may be determined according to a desired resonance frequency band. In one embodiment, the emitter pattern 310 includes a main pattern 312, a first connecting pattern 314, and a second connecting pattern 316. In one embodiment,

The main pattern 312 is formed on the mother substrate 710 to have a predetermined length in the first direction D1. The first connection pattern 314 extends from one end of the main pattern 312 in the second direction D2. The first connection pattern 314 is connected to the feed pin 320. The second connection pattern 316 extends from the other end of the main pattern 314 in the second direction D2. The second connection pattern 316 is connected to the connection element 250. The first connection pattern 314 and the second connection pattern 316 are formed to have the same length and the main pattern 312 is formed to have a length longer than the first and second connection patterns 314 and 316 As shown in FIG.

The feed pin 320 is electrically connected to the radio communication integrated circuit 220 via the first via hole 810 and the sub feed pin 322 and transmits an electric signal supplied from the radio communication integrated circuit 220 to the radiator pattern 310). The feed pin 320 may be formed to extend in the second direction D2 from the first connection pattern 314 constituting the radiator pattern 310. In this embodiment,

The first grounding part 330 grounds the radiator pattern 310. The first ground unit 330 may electrically connect the radiator pattern 310 to a ground unit (not shown) formed on the mother substrate 710 to ground the radiator pattern 310.

In one embodiment, the first ground 330 may be branched from the feed pin 320. According to this embodiment, the first ground portion 330 includes a branch portion 332 and a ground pin 334, as shown in FIG. 7B.

The branching portion 332 is formed to extend in a first direction D1 from a point where the feed pin 320 and the first connection pattern 314 are connected. The ground pin 334 is formed to extend from the one end of the branched portion 332 in the second direction D2. The ground pin 334 is electrically connected to the ground formed on the mother board 710. That is, one end of the ground pin 334 is connected to the branch portion 332, and the other end of the ground pin 334 is electrically connected to the ground portion of the mother board 710.

The length of the branch portion 332 may be set to a value that allows the current distribution to be concentrated at the branch portion 332 and the ground pin 334 portion. For example, the length of the branched portion 332 may be set to 0.02 lambda to 0.03 lambda. Accordingly, the feed pin 320 and the ground pin 334 are spaced apart by an interval of 0.02 lambda to 0.03 lambda.

In one embodiment, the resonant frequency of the first antenna 240 may be the same as the resonant frequency of the second antenna 280. [ Accordingly, interference that may occur between the first antenna 240 and the first antenna 280 can be prevented in advance.

As described above, according to the third embodiment of the present invention, the first antenna 240 formed on the mother substrate 710 is electrically connected to the antenna block 230 built in the wireless communication chip 720, .

The parasitic element 260 is formed directly on the mother substrate 710. The parasitic element 260 is spaced apart from the first antenna 240 by a predetermined distance on the mother substrate 710. The parasitic element 260 induces coupling between the first antenna 240 and the first antenna 240 so that the first antenna 240 has substantially the same effect as that of the first antenna 240 while maintaining the performance of the first antenna 240.

The parasitic element 260 is electrically connected to the main pattern 312, the first connection pattern 314 and the second connection pattern 326 constituting the radiator pattern 310 on the mother substrate 710 as shown in FIG. As shown in FIG.

In one embodiment, the parasitic element 260 may comprise a first parasitic radiator pattern 262 in the form of a loop. At this time, the opening portion 264 is formed in the loop-shaped first parasitic radiator pattern 262. In the present invention, the parasitic element 260 is formed of the first parasitic radiator pattern 262 in the form of a loop to increase the length of the parasitic element 260, and the first parasitic radiator pattern 262 The reason for forming the opening portion 264 is to facilitate current exchange by coupling between the first parasitic radiator pattern 262 and the first antenna 242 through the opening portion 264. [

According to the embodiment described above, the loop-shaped first parasitic radiator pattern 262 may be composed of N (N is a natural number) sides. Specifically, the first parasitic radiator pattern 262 includes a first side N1 formed to face the integrated circuit 220 for wireless communication, a first side N1 in the direction of the main pattern 312 with respect to the first side N1, A third side N3 connecting one end of the first side N1 and one end of the second side N2 and a third side N2 connecting the other side of the first side N1, And a fourth side N4 connecting the other end of the second side N2. At this time, the opening 264 is formed at a substantially central portion of the second side N2 formed so as to face the main pattern 312 among the N sides.

7B, the width W1 between the first side N1 of the N sides and the branching portion 332 is greater than the width W1 of the first side N1, which is the inner width of the first parasitic radiator pattern 262, The first parasitic radiator pattern 262 may be formed on the mother substrate 710 such that the first parasitic radiator pattern 262 is larger than the width W2 between the second side N2.

7C, the width W1 between the first side N1 of the N sides and the branching portion 332 is greater than the width W1 of the first parasitic radiator pattern 262, The first parasitic radiator pattern 262 may be formed on the mother substrate 710 so as to be smaller than the width W2 between the first side N1 and the second side N2.

The antenna length adjustment and the impedance adjustment for frequency matching can be performed through the adjustment of W1 and W2.

7B and 7D, the parasitic element 260 is described as including only the first parasitic radiator pattern 262 in which the opening 264 is formed. However, in a modified embodiment, the parasitic element 260 may further include a second parasitic radiator pattern 266 and a third parasitic radiator pattern 268, as shown in Figures 7C and 7E.

The second parasitic radiator pattern 266 extends from the one end of the first parasitic radiator pattern 262 in the second direction D2 and is connected to the main pattern 312 of the first antenna 240. [ In one embodiment, when the first parasitic radiator pattern 262 is composed of N sides, the second parasitic radiator pattern 266 is formed by opening portions 264 of the N sides constituting the first parasitic radiator pattern 262 And extends in the second direction D2 from one side of the opening 264 of the first side N2 on which the main pattern 312 is formed.

The third parasitic radiator pattern 268 extends from the other end of the first parasitic radiator pattern 262 in the second direction D2 and is connected to the main pattern 312 of the first antenna 240. [ In one embodiment, when the first parasitic radiator pattern 262 is comprised of N sides, the third parasitic radiator pattern 268 may include an opening 264 of the N sides constituting the first parasitic radiator pattern 262 And extends in the second direction D2 from the other side of the opening 264 of the first side N2 on which the main pattern 312 is formed.

Fourth Embodiment

7B to 7E, the first terminal 252 of the connecting element 250 is connected to the first antenna 240 and the second antenna 280, And the second terminal 254 of the connection element 250 is described as floating. However, in order to change the resonance frequency of the antenna block 230 using the coupling element 250 implemented as a lumped element, the antenna block 230 according to the fourth embodiment may be modified as shown in FIG. 11 And a second grounding unit 340 for grounding the connecting element 250 as shown in FIG.

Although the parasitic element 260 is shown in FIG. 11 as having the same shape as that shown in FIG. 7B for convenience of explanation, the electronic apparatus 700 including the parasitic element 260 of the form shown in FIGS. 7C to 7E And a second ground unit 340.

Hereinafter, only the second ground unit 340, which is an additional configuration as compared with the third and third embodiments, will be described.

The second grounding unit 340 grounds the connecting element 250 by electrically connecting the connecting element 250 to a grounding unit (not shown) inside the wireless communication integrated circuit 220. The second grounding portion 340 extends from the second terminal 254 of the connecting element 250 in the second direction D2 and is electrically connected to the grounding portion inside the wireless communication integrated circuit 220. [

As described above, according to the fourth embodiment of the present invention, the connecting element 250 is implemented as a lumped element including at least one of an inductor, a capacitor, and a resistor, and the first terminal 252 of the connecting element 250, The second terminal 254 of the connection element 250 is connected to the first antenna 240 and the second antenna 280 so that the connection terminal 250 is grounded through the second ground portion 340, It is possible to change the resonance frequency of the antenna block 230 by changing the value of the circuit element to be applied to various applications without additional configuration or configuration change.

Hereinafter, a method of manufacturing a wireless communication chip according to the present invention will be briefly described with reference to FIG.

12 is a flowchart showing a method of manufacturing a wireless communication chip according to the first and second embodiments.

A base band chip / RF chip (not shown) electrically connected to the circuit wiring and the circuit wiring for constituting the integrated circuit 220 for wireless communication in the first mounting area 212 of the substrate 210 222 are mounted (S1200).

The first antenna 240, the connecting element 250, and the parasitic element 260 are formed in the second mounting region 214 of the substrate 210 (S1210). The first antenna 240 includes a radiator pattern 310, a feed pin 320, and a first ground portion 330, as shown in Figs. 2 and 3 described above. In addition, the first antenna 240 may further include a second ground unit 340 for grounding the connecting element 250 as shown in FIG. The radiator pattern 310 includes a main pattern 312, a first connecting pattern 314, and a second connecting pattern 316. [ A detailed description of the emitter pattern 310, the feed pin 320, the first ground portion 330, and the second ground portion 340 will be described later with reference to FIGS. 2, 3, and 6 It will be omitted.

The connecting element 250 is formed on the substrate 210 so as to extend in the second direction D2 from the second connecting pattern 316 of the first antenna 240. [ In one embodiment, the connecting element 250 may be implemented as a lumped element. According to this embodiment, the first antenna 240 is connected to the first terminal 252 of the connection element 250 and the second terminal 254 of the connection element 250 is floated, And can be grounded through the ground portion 340.

The parasitic element 260 is formed on the second mounting region 214 of the substrate 210 so as to be spaced apart from the first antenna 240 by a predetermined distance. The parasitic element 260 induces coupling between the first antenna 240 and the first antenna 240 so that the length of the first antenna 240 is extended. The parasitic element 260 includes a first parasitic radiator pattern 262 in the form of a loop as shown in Figures 2 and 6 and a second parasitic radiator pattern 266 and a third parasitic radiator pattern 268, . The detailed description of the first parasitic emitter pattern 262, the second parasitic emitter pattern 266, and the third parasitic emitter pattern 268 is omitted because it has already been described in connection with FIGS. 2 and 6 described above .

Then, insulating layers 224 and 270 are formed on the entire surface of the substrate 210 (S1220). That is, the insulating layers 224 and 270 are formed entirely on the first mounting region 212 and the second mounting region 214 of the substrate 210. The base layer chip / RF chip 222 electrically connected to the circuit wiring, the first antenna 240, and the connection element (not shown) electrically connect the circuit wiring for constituting the integrated circuit 220 for wireless communication with the insulating layers 224, (250), and the parasitic element (260) are all covered.

In one embodiment, the insulating layers 224 and 270 may be formed by using a dispenser to discharge an epoxy or a material such as a ceramic with a high dielectric constant onto the substrate 210.

The insulating layers 224 and 270 are simultaneously formed on the first mounting region 212 and the second mounting region 214 of the substrate 210. In the modified embodiment, The insulating layer 270 may be formed by discharging an insulating material to the second mounting region 214 after the insulating layer 224 is formed by discharging the insulating material to the mounting region 212.

In another embodiment, after the insulating layer 270 is formed by discharging the insulating material to the second mounting region 214, the insulating layer 224 is formed by discharging the insulating material to the first mounting region 211 It might be.

The insulating layer 224 is formed by discharging the insulating material to the first mounting region 212 and then the process of S1210 is performed to form the insulating layer 224. In this case, The insulating layer 270 may be formed by discharging an insulating material to the second mounting region 214 after the connecting element 250 and the parasitic element 260 are formed.

In another embodiment, after the first antenna 240, the connecting element 250, and the parasitic element 260 are formed by performing the process of S1210, the insulating material is discharged to the second mounting region 214 The base layer chip / RF chip 222 electrically connected to the circuit wiring and the circuit wiring for constituting the wireless communication integrated circuit 220 is mounted by performing the process of S1200 The insulating layer 224 may be formed by discharging an insulating material to the first mounting region 212. [

Thereafter, the second antenna 280 is formed on the insulating layer 270 (S1230). In one embodiment, the second antenna 280 is formed to extend in the first direction D1 on the insulating layer 270. In one embodiment, At this time, the first surface of the second antenna 280 contacts the insulating layer 270, and the second surface of the second antenna 280, which is the opposite surface of the first surface, is exposed to the outside of the wireless communication chip 200 . That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost portion and is exposed to the outside.

Thereafter, the second antenna 280 and the first antenna 240 are electrically connected (S1240). At this time, the distance between the second antenna 280 and the substrate 210 may be 0.2 to 0.3 [lambda].

  When the height of the connecting element 250 is lower than the height of the insulating layer 270, a part of the second antenna 280 is pressed to form the pressing groove 282, And may be connected to the connecting element 250 through the insulating layer 270. According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the upper surface of the first terminal 252 of the connecting element 250.

As such, the second antenna 280 is electrically connected to the first antenna 240, so that the first antenna 240 has an effect of extending the length of the second antenna 280 by a length. The connecting element 250 is formed at a lower height than the insulating layer 270 so that the second antenna 280 is connected to the connecting element 250 through a compression groove 282 are formed to connect the second antenna 280 to the connection element 250. [ However, in another embodiment, the height of the connecting element 250 and the insulating layer 270 are the same or the height of the connecting element 250 is higher than the height of the insulating layer 270, The second antenna 280 may be directly connected to the upper surface of the first terminal 252 of the connection element 250 without a separate compression groove 282 when the upper surface of the connection element 252 is exposed to the outside.

Hereinafter, a method of manufacturing an electronic device including a wireless communication chip according to the third and fourth embodiments of the present invention will be described with reference to FIG. 13, a method for manufacturing a wireless communication chip and a method for mounting the manufactured wireless communication chip on a mother board will be described in detail.

First, as shown in FIG. 13, a circuit wiring for constituting the integrated circuit 220 for wireless communication and a baseband chip / RF (not shown) electrically connected to the circuit wiring are formed in the first mounting region 212 of the sub- The chip 222 is mounted (S1300).

Then, the connecting element 250 is formed in the second mounting region 214 of the sub-substrate 210 (S1310). The connecting element 250 may be implemented as a lumped element. The second terminal 254 of the connecting element 250 may be electrically connected to the ground within the integrated circuit 220 for wireless communication via the second grounding portion 340. In one embodiment,

Thereafter, insulating layers 224 and 270 are formed on the entire surface of the sub-substrate 210 (S1320). That is, the insulating layers 224 and 270 are formed entirely on the first mounting region 212 and the second mounting region 214 of the sub- The circuit layers for constituting the integrated circuit 220 for wireless communication, the base band chip / RF chip 222 electrically connected to the circuit wiring and the connection element 250 are all covered with the insulating layers 224 and 270, do.

In one embodiment, the insulating layers 224 and 270 may be formed by using a dispenser to discharge a material such as epoxy or ceramics with a high dielectric constant onto the sub-substrate 210.

Although the insulating layers 224 and 270 are simultaneously formed on the first mounting region 212 and the second mounting region 214 of the sub-substrate 210 in the above-described embodiment, The insulating layer 226 may be formed by discharging an insulating material to the second mounting region 214 after the insulating layer 224 is formed by discharging the insulating material to the first mounting region 212. [

In another embodiment, after the insulating layer 270 is formed by discharging the insulating material to the second mounting region 214, the insulating layer 224 is formed by discharging the insulating material to the first mounting region 211 It might be.

In yet another embodiment, after the process of S1300 is completed, an insulating material is injected into the first mounting region 212 to form an insulating layer 224. Then, the connecting device 250 is formed by performing the process of S1310 The insulating layer 270 may be formed by discharging the insulating material to the second mounting region 214. [

In still another embodiment, after forming the connecting element 250 by performing the process of S1310, the insulating layer 270 is formed by discharging the insulating material to the second mounting region 214. Then, the process of S1300 is repeated The base band chip / RF chip 222 electrically connected to the circuit wiring and the circuit wiring for constituting the wireless communication integrated circuit 220 is mounted, and then the insulating material is discharged to the first mounting area 212 The insulating layer 224 may be formed.

Thereafter, the second antenna 280 is formed on the insulating layer 270 (S1330). In one embodiment, the second antenna 280 is formed to extend in the first direction D1 on the insulating layer 270. In one embodiment, The first surface of the second antenna 280 contacts the insulating layer 270 and the second surface of the second antenna 280 opposite to the first surface is exposed to the outside of the wireless communication chip 720. [ . That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost portion and is exposed to the outside.

Thereafter, the second antenna 280 is electrically connected to the connection element 250 (S1340). Thus, the wireless communication chip 720 is completed. At this time, the distance between the second antenna 280 and the sub-substrate 210 may be 0.2 to 0.3 [lambda].

In one embodiment, when the height of the connecting element 250 is lower than the height of the insulating layer 270, a part of the second antenna 280 is pressed to form a compression groove 282, May be connected to the connecting element 250 through the through hole 270. According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the upper surface of the first terminal 252 of the connecting element 250.

The connecting element 250 is formed at a lower height than the insulating layer 270 so that the second antenna 280 is connected to the connecting element 250 through a compression groove 282 are formed to connect the second antenna 280 to the connection element 250. [ However, in another embodiment, the height of the connecting element 250 and the insulating layer 270 are the same or the height of the connecting element 250 is higher than the height of the insulating layer 270, The second antenna 280 may be directly connected to the upper surface of the first terminal 252 of the connection element 250 without a separate compression groove 282 when the upper surface of the connection element 252 is exposed to the outside.

Subsequently, a first via hole 810 and a second via hole 820 are formed in the second mounting region 214 of the sub-substrate 210 (S1350). The first via hole 810 is for electrical connection between the first antenna 240 formed on the mother substrate 710 and the integrated circuit 220 for wireless communication and the second via hole 820 is for the electrical connection between the first antenna 240 and the second antenna 240. [ And for electrical connection between connecting elements 250.

The wireless communication chip 720 is electrically connected to the first antenna 240 on the mother board 710 on which the first antenna 240 and the parasitic element 260 are formed. (S1360). The configuration of the first antenna 240 and the parasitic element 260 formed on the mother substrate 710 has already been described with reference to FIGS. 7 and 11, and thus a detailed description thereof will be omitted.

At this time, when the wireless communication chip 720 is mounted on the mother substrate 710, the first conductor 812 is filled in the first via hole 810 so that the feed pin 320 of the first antenna 240 is wirelessly The first antenna 240 is electrically connected to the communication integrated circuit 220 and the second conductor 822 is filled in the second via hole 820 so that the first antenna 240 is connected to the lower end of the first terminal 252 of the connection element 250 Respectively. Since the first antenna 240 is electrically connected to the connection element 250 through the second via hole 820 and the connection element 240 is electrically connected to the second antenna 280, The first antenna 240 and the second antenna 280 are electrically connected to each other so that the length of the first antenna 240 is extended by the length of the second antenna 280. [

Although not shown in FIG. 13, the first antenna 240 and the parasitic element 260 may be formed on the mother substrate 710 during steps S1300 to S1360.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

Claims (34)

A substrate comprising a first mounting region and a second mounting region: An integrated circuit for wireless communication mounted on the first mounting area; And an antenna block mounted in the second mounting area so as to be electrically connected to the wireless communication integrated circuit, The antenna block includes: A first antenna formed on the substrate; A parasitic element formed on the substrate so as to be spaced apart from the first antenna and inducing a coupling with the first antenna; A connection element connected to the first antenna; An insulating layer formed on the first antenna, the parasitic element, and the connecting element to cover the first antenna, the parasitic element, and the connecting element; And And a second antenna formed on the insulating layer and electrically connected to the first antenna through the connecting element. The method according to claim 1, Wherein the parasitic element includes a first parasitic radiator pattern in a loop shape and an opening is formed in the first parasitic radiator pattern. 3. The method of claim 2, The parasitic element A second parasitic radiator pattern extending from one end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna; And And a third parasitic radiator pattern extending from the other end of the first parasitic radiator pattern toward the first antenna and connecting the first parasitic radiator pattern and the first antenna. chip. The method according to claim 1, The first antenna A main pattern extending in a first direction; A first connection pattern extending from one end of the main pattern in a second direction different from the first direction; A second connection pattern extending from the other end of the main pattern in the second direction; A feed pin extending from the first connection pattern in the second direction and supplying a feed signal supplied from the radio communication integrated circuit to the first antenna; And And a first ground unit for grounding the first antenna. 5. The method of claim 4, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branch portion and the first parasitic radiator pattern is larger than an inner width of the first parasitic radiator pattern. 5. The method of claim 4, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branch portion and the first parasitic radiator pattern is smaller than an inner width of the first parasitic radiator pattern. 5. The method of claim 4, Wherein the parasitic element is disposed in a region formed by the main pattern, the first connection pattern, and the second connection pattern on the substrate. 5. The method of claim 4, The connecting element being connected to the second connection pattern, Wherein the first antenna further comprises a second grounding portion extending from the connection element in the second direction to ground the connection element. A first antenna formed on a substrate; A parasitic element disposed on the substrate and spaced apart from the first antenna, the parasitic element inducing a coupling with the first antenna; A connection element connected to the first antenna; An insulating layer formed on the first antenna, the parasitic element, and the connecting element to cover the first antenna, the parasitic element, and the connecting element; And And a second antenna formed on the insulating layer and electrically connected to the first antenna through the connection element. 10. The method of claim 9, Wherein the parasitic element includes a first parasitic radiator pattern in a loop shape and an opening is formed in the first parasitic radiator pattern. 11. The method of claim 10, Wherein the first parasitic radiator pattern comprises N (N is a natural number) sides, and the opening is formed on a side of the N sides facing the first antenna. 11. The method of claim 10, The parasitic element A second parasitic radiator pattern extending from one end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna; And And a third parasitic radiator pattern extending from the other end of the first parasitic radiator pattern toward the first antenna and connecting the first parasitic radiator pattern and the first antenna. 12. The method of claim 11, The first antenna includes: A main pattern extending in a first direction; A first connection pattern extending from one end of the main pattern in a second direction different from the first direction; A second connection pattern extending from the other end of the main pattern in the second direction; A feed pin extending from the first connection pattern in the second direction and supplying a feed signal supplied from the radio communication integrated circuit to the first antenna; And And a first grounding part for grounding the first antenna. 14. The method of claim 13, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branch portion and the first parasitic radiator pattern is larger than an inner width of the first parasitic radiator pattern. 14. The method of claim 13, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branch portion and the first parasitic radiator pattern is smaller than an inner width of the first parasitic radiator pattern. 14. The method of claim 13, Wherein the parasitic element is disposed in a region formed by the main pattern, the first connection pattern, and the second connection pattern on the substrate. 14. The method of claim 13, The connecting element being connected to the second connection pattern, Wherein the first antenna further comprises a second grounding portion extending from the connecting element in the second direction to ground the connecting element. A first substrate; A first antenna formed on the first substrate; A parasitic element disposed on the first substrate so as to be spaced apart from the first antenna and inducing a coupling with the first antenna; And And a wireless communication chip mounted on the first substrate and electrically connected to the first antenna, The wireless communication chip includes: A second substrate including a first mounting region and a second mounting region; An integrated circuit for wireless communication molded in the first mounting area; And an antenna block mounted in the second mounting area to be electrically connected to the wireless communication integrated circuit and the first antenna, The antenna block includes: A connection element electrically connected to the first antenna on a second mounting region of the second substrate; An insulating layer formed on the connecting element to cover the connecting element; And And a second antenna formed on the insulating layer and electrically connected to the first antenna through the connection element. 19. The method of claim 18, Wherein the parasitic element includes a first parasitic radiator pattern in a loop shape, and an opening is formed in the first parasitic radiator pattern. 20. The method of claim 19, Wherein the first parasitic radiator pattern comprises N (N is a natural number) sides, and the opening is formed on a side of the N sides facing the first antenna. 20. The method of claim 19, The parasitic element A second parasitic radiator pattern extending from one end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna; And And a third parasitic radiator pattern extending from the other end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna. 19. The method of claim 18, The first antenna A main pattern extending in a first direction; A first connection pattern extending from one end of the main pattern in a second direction different from the first direction; A second connection pattern extending from the other end of the main pattern in the second direction; A feed pin extending from the first connection pattern in the second direction and supplying a feed signal supplied from the radio communication integrated circuit to the first antenna; And And a first ground unit for grounding the first antenna. 23. The method of claim 22, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branching portion and the first parasitic radiator pattern is larger than an internal width of the first parasitic radiator pattern. 23. The method of claim 22, Wherein the parasitic element comprises a first parasitic radiator pattern in the form of a loop having an opening, Wherein the first ground portion includes a branch portion branched from the feed pin in the first direction and a ground pin extended in the second direction from one end of the branch portion, Wherein a width between the branching portion and the first parasitic radiator pattern is smaller than an internal width of the first parasitic radiator pattern. 23. The method of claim 22, Wherein the parasitic element is disposed in a region formed by the main pattern, the first connection pattern, and the second connection pattern on the first substrate. 23. The method of claim 22, A first via hole filled with a first conductor for electrically connecting the radio communication integrated circuit and the feed pin is formed in a region corresponding to the feed pin on the second substrate, And a second via hole filled with a second conductor for electrically connecting the second connection pattern and the connection element is formed in a region of the second substrate corresponding to an end of the second connection pattern. Electronics. Forming a chip and a circuit wiring constituting an integrated circuit for wireless communication in a first mounting region of the substrate; Forming a first antenna, a parasitic element, and a connecting element in a second mounting area of the substrate; Forming an insulating layer on the entire surface of the substrate; Forming a second antenna on an insulating layer formed in the second mounting region; And And electrically connecting the second antenna to the first antenna, Wherein the parasitic element is arranged to be spaced apart from the first antenna on a second mounting area of the substrate to induce coupling with the first antenna. 28. The method of claim 27, Wherein the parasitic element includes a first parasitic radiator pattern in a loop shape and an opening is formed in the first parasitic radiator pattern. 29. The method of claim 28, The parasitic element includes: A second parasitic radiator pattern extending from one end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna; And And a third parasitic radiator pattern extending from the other end of the first parasitic radiator pattern toward the first antenna and connecting the first parasitic radiator pattern and the first antenna. / RTI > 28. The method of claim 27, The first antenna includes: A main pattern extending in a first direction; A first connection pattern extending from one end of the main pattern in a second direction different from the first direction; A second connection pattern extending from the other end of the main pattern in the second direction; A feed pin extending from the first connection pattern in the second direction and supplying a feed signal supplied from the radio communication integrated circuit to the first antenna; And And a first grounding part for grounding the first antenna, Wherein the parasitic element is disposed in a region formed by the main pattern, the first connection pattern, and the second connection pattern on the substrate. Forming a chip and a circuit wiring constituting an integrated circuit for wireless communication in a first mounting region of the sub-board; Forming a connection element in a second mounting region of the sub-substrate; Forming an insulating layer on the entire surface of the sub-substrate; Forming a second antenna on an insulating layer formed in the second mounting region; Fabricating a wireless communication chip by electrically connecting the second antenna to the connection element; And Mounting the wireless communication chip on the mother substrate so that the wireless communication chip is electrically connected to the first antenna on a mother substrate having a first antenna and a parasitic element formed thereon, Wherein the parasitic element is disposed on the mother substrate so as to be spaced apart from the first antenna to induce a coupling with the first antenna. 32. The method of claim 31, Wherein the parasitic element includes a first parasitic radiator pattern in a loop shape and an opening is formed in the first parasitic radiator pattern. 33. The method of claim 32, The parasitic element A second parasitic radiator pattern extending from one end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna; And And a third parasitic radiator pattern extending from the other end of the first parasitic radiator pattern toward the first antenna to connect the first parasitic radiator pattern and the first antenna. 32. The method of claim 31, The first antenna includes: A main pattern extending in a first direction; A first connection pattern extending from one end of the main pattern in a second direction different from the first direction; A second connection pattern extending from the other end of the main pattern in the second direction; A feed pin extending from the first connection pattern in the second direction and supplying a feed signal supplied from the radio communication integrated circuit to the first antenna; And And a first grounding part for grounding the first antenna, Wherein the parasitic element is formed in a region formed by the main pattern, the first connection pattern, and the second connection pattern on the mother substrate.

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