WO2019024058A1 - Land grid array package module and terminal - Google Patents

Abstract

The present application provides a land grid array package module and a terminal. The package module comprises: a chip, a grounding bonding pad group and a functional bonding pad group provided on the surface of the chip, wherein the grounding bonding pad group is provided at the central position of the chip, and the functional bonding pad group is provided in a peripheral region of the chip and surrounds the grounding bonding pad group; the functional bonding pad group comprises a plurality of functional bonding pads, the shape of each functional bonding pad is circular, the diameter of each functional bonding pad is within a first set threshold, and the center distance of adjacent functional bonding pads is within a second set threshold. In the embodiment, a circular bonding pad is used as the functional bonding pad; with respect to a square bonding pad in the prior art, the circular bonding pad can be made smaller; according to a corresponding relationship between the bonding pad and signal radiation, i.e., the smaller the bonding pad, the smaller the radiation, it can be seen that the use of a circular bonding pad as the functional bonding pad can effectively improve the radiation of the bonding pad, and the circular bonding pad has less radiation than the square bonding pad.

Description

Grid array package module and terminal Technical field

The present application relates to the technical field of communications, and in particular, to a grid array package module and a terminal.

Background technique

With the rapid development of 4G communication technology, Land Grid Array (LGA) modules are used in the automotive industry, the consumer electronics industry and other special industries. The LGA module can meet the advantages of stable and light weight of the vehicle module and the handheld terminal.

Most of the LGA modules include wireless reception, signal processing, and wireless transmission. As shown in Figure 1, most LGA modules use a square pad connection. The four peripheral pads of module 1 are function pads 2. They provide a rich communication interface, which can also be called a signal pin pad. The middle is Ground pad 3 for easy heat dissipation. Among them, the size of the signal pin pad is 1x1.5mm, and the pin pitch is 1.5mm. This causes the signal radiation of the pad of the current LGA module to be large, which affects the use effect of the entire LGA module.

Summary of the invention

The present application provides a grid array package module and a terminal for improving the pad radiation of the grid array package module, thereby improving the use effect of the LGA module.

The present application provides a grid array package module including: a chip, a ground pad group and a function pad group disposed on the surface of the chip, wherein the ground pad group is disposed on the chip a central location, the set of functional pads being disposed in a peripheral region of the chip and surrounding the set of ground pads;

The set of ground pads includes a plurality of ground pads arranged in an array, the set of functional pads comprising a plurality of functional pads, each of the functional pads being circular in shape, and each of the functions The diameter of the pad is within a first set threshold, and the center distance of the adjacent function pads is within a second set threshold.

In the above embodiment, the function pad adopts a circular pad. Compared with the square pad in the prior art, the pad of the circular pad can be made smaller, and the corresponding relationship between the pad and the signal radiation: soldering The smaller the disk, the smaller the radiation, it can be seen that the function pad uses a circular pad to effectively improve the radiation of the pad, and the circular pad has a smaller radiation effect than the square pad. Improve the use of LGA modules.

In a specific embodiment, each of the ground pads has a square or circular shape. Convenient for the production of the entire LGA module.

In a specific embodiment, when the shape of the ground pad is circular, the diameter of each of the ground pads is within a first set threshold, and the center distance of adjacent ground pads is between Within the second set threshold. Convenient for the production of the entire LGA module.

In a specific embodiment, each of the ground pads has a square or circular shape. It facilitates the connection of pads to other devices.

In a specific embodiment, the functional pad set on the side of the ground pad group is 3-5 rows or 3-5 columns. Reasonable layout of the LGA module's pad layout, making full use of the space on the chip.

In a specific embodiment, the first set threshold is from 0.8 mm to 1.0 mm. That is, the diameter of the functional pad is between 0.8 mm and 1.0 mm, such as 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1.0 mm, and the like.

In a specific embodiment, the second set threshold is between 1.6 mm and 2.0 mm. That is, between the functional pads The interval is between 1.6mm and 2.0mm, such as 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm and the like.

In a specific embodiment, the functional pad group includes at least three antenna pads and non-functional pads for connecting antennas, and at least two of the adjacent antenna pads are spaced apart Non-functional pad. The isolation between the antenna pads is guaranteed.

In a specific embodiment, the functional pad set further includes a plurality of high speed signal pads, and an isolation between each of the high speed signal pads and each of the antenna pads is not less than 85 db. Avoid interference between the pads.

In a specific embodiment, adjacent high speed signal pads are separated by the non-functional pads. Isolation through non-functional pads.

In a specific embodiment, the high speed signal pad comprises a high speed serial bus pad, a receiving line pad and a transmitting line pad, wherein the high speed serial bus pad and the receiving line pad The high speed serial bus pad is isolated from the transmit line pad by a non-functional pad by non-functional pad isolation. Improve the isolation between functional pads.

In a second aspect, a terminal is provided, the terminal comprising the grid array package module of any of the above.

In the above embodiment, the function pad adopts a circular pad. Compared with the square pad in the prior art, the pad of the circular pad can be made smaller, and the corresponding relationship between the pad and the signal radiation: soldering The smaller the disk, the smaller the radiation, it can be seen that the function pad uses a circular pad to effectively improve the radiation of the pad, and the circular pad has a smaller radiation effect than the square pad. Improve the use of LGA modules.

DRAWINGS

1 is a schematic structural view of a grid array package module in the prior art;

2 is a schematic structural diagram of a grid array package module according to an embodiment of the present application;

3 is a schematic structural diagram of a grid array package module according to another embodiment of the present application;

FIG. 4 is a schematic diagram of a function module of a grid array package module according to an embodiment of the present disclosure.

Detailed ways

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings.

First, referring to FIG. 1, FIG. 1 is a schematic structural diagram of an LGA module in the prior art. The LGA module in the prior art includes a chip 1, and a function pad 2 and a ground pad 3 disposed on the chip 1. The ground pad 3 is disposed at an intermediate position of the chip 1 and arranged in an array manner. The ground pad 3 can also improve the heat dissipation effect of the chip 1. The functional pad 2 is disposed around the edge of the chip 1 around the ground pad 3. As shown in FIG. 1, a plurality of rows of functional pads 2 are disposed on each side of the chip 1. In the specific setting, the ground pad 3 and the function pad 2 each adopt a rectangular pad. When a rectangular pad is used, the size of the function pad is large, and the interval between the function pads is small. In the structure shown in FIG. 1, the function pad 2 is 1x1.5 mm in size and 1.5 mm in pitch. . As a result, the radiation of the pad is large, which affects the use effect of the LGA module.

To solve this problem, an embodiment of the present application provides an LGA module.

Example 1

As shown in FIG. 2, the LGA module provided in this embodiment includes a chip 10 and a ground pad group and a function pad group disposed on the chip 10. In a specific setting, the ground pad group is disposed at the center of the chip 10. The position, functional pad set is disposed in a peripheral region of the chip 10 and surrounds the ground pad group. Set in ground pad group and function pad group As shown in FIG. 2 and FIG. 3, the ground pad group includes a plurality of ground pads 30, and the plurality of ground pads 30 are arranged in an array at an intermediate position of the chip 10; the function pad group includes a plurality of functional pads. The disk 20 has a plurality of functional pads 20 arranged on the edge of the chip 10, and the functional pads 20 on each side of the chip 10 are arranged in an array, and the function pads 20 and the ground pad groups adjacent to the ground pad group are arranged. There is a certain spacing between the outermost ground pads 30.

In a specific arrangement, a plurality of ground pads 30 are arranged in an array at an intermediate position of the chip 10, the intermediate position being a range of regions including the center of the chip 10; the plurality of functional pads 20 are arranged in the chip at a specific arrangement The edges of 10, and a plurality of functional pads 20 are disposed around the set of ground pads. The functional pads 20 on each side of the chip 10 are arranged in an array. And the function pads 20 provided on one side of the ground pad group may be 3 to 5 rows or 3-5 columns, and as shown in FIG. 2, the function pads 20 are arranged in 4 rows or 4 columns. In the above LGA module, the pad layout is made rational and the space of the chip 10 is fully utilized.

For each pad size, as shown in FIG. 2, each functional pad 20 has a diameter d, and the size of d is within a first set threshold, the first set threshold being 0.8 mm to 1.0 mm. That is, the diameter d of the functional pad 20 is a size between 0.8 mm and 1.0 mm, such as 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1.0 mm, or the like. The first set threshold is between 0.8mm and 1.0mm, which ensures the minimum area required for the solder to be soldered, to ensure the solder joint strength, and at the same time minimize the satisfaction of the pad. size.

Compared with the pad size of 1x1.5mm in the prior art, the circular pad provided by this embodiment is much smaller than the rectangular pad in the prior art. It can be known from the principle that the smaller the pad and the smaller the radiation, the embodiment can effectively reduce the pad radiation problem by using the circular pad.

In addition, in order to avoid the crosstalk between the devices connected to the function pads 20 provided by the embodiment, when the function pads 20 provided in this embodiment are disposed, the center distance of the adjacent function pads 20 is between the second devices. Within the predetermined threshold, the second set threshold is 1.6 mm to 2.0 mm when specifically set. That is, the center distance of the adjacent functional pads 20 is between 1.6 mm and 2.0 mm. As shown in FIG. 2, the center distance of the adjacent two functional pads 20 is D, and the D can be used when the value is It is a size between any of 1.6 mm and 2.0 mm, such as 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, and the like. Specifically, it can be set according to the size of the chip 10 and the number of the function pads 20. Compared with the center distance (the center distance is 1.5 mm) of the adjacent functional pads 20 in the prior art, the center distance of the adjacent functional pads 20 provided by this embodiment can be seen. D is larger than the center distance between adjacent functional pads 20 in the prior art, so that the interference problem between the functional pads 20 can be effectively improved.

In addition, the ground pads 30 may employ pads of different shapes in a specific arrangement, as shown in FIG. 2, which uses rectangular pads in the prior art. The rectangular pads are arranged in an array in the middle of the chip 10. In the present embodiment, the ground pads 30 are arranged in an array of 5*5.

In the LGA module provided in this embodiment, in order to facilitate connection with other devices, solder or solder balls are disposed on each of the ground pads 30, and/or each functional pad 20 is provided with solder or solder balls. That is, in a specific setting, solder or solder balls may be provided only on the functional pad 20, or solder or solder balls may be provided only on the ground pad 30. Alternatively, solder or solder balls may be disposed on the function pad 20 and the ground pad 30, and the height of the solder or the solder ball may be determined according to actual conditions when the solder or the solder ball is specifically disposed.

Further, the functional pad group further includes a plurality of non-functional pads, which may be the ground pad 23 or the reserved pad 22, and in a specific arrangement, the multi-non-functional pad and the function pad together The arrangement, that is, the function pads 20 and the non-functional pads on one side of the ground pad group are arranged in an array. Additionally, the plurality of functional pads 20 can include pads that connect different devices. In a specific embodiment, at least three antenna pads 21 for connecting antennas are included in the functional pad group, and at least two non-functional pads are spaced between adjacent antenna pads 21, thereby ensuring the antenna. Pad 21 Inter-isolation to avoid interference between connected antennas.

As shown in FIG. 4, FIG. 4 shows three antenna pads 21, and three antenna pads 21 are disposed at the uppermost row of the chip 10 when the LGA module placement direction shown in FIG. 4 is referred to as the reference direction. In the functional pad 20, two of the three antenna pads 21 are separated by two pads, and the other two antenna pads 21 are separated by 8 pads, thereby ensuring any two The isolation between adjacent antenna pads 21. More specifically, the two pads separated between the two antenna pads 21 are two ground pads 23. The other two antenna pads 21 are separated by eight pads, which are two reserved pads 22, and are disposed between the antenna pad 21 and the reserved pad 22, and the reserved pad 22 and the reserved pad. Two ground pads 23 between 22.

Further, the plurality of function pads 20 further include a plurality of high speed signal pads 24, and the isolation between each of the high speed signal pads 24 and each of the antenna pads 21 is not less than 85 db. Avoid interference between the pads. As shown in FIG. 4, a high speed signal pad 24 is disposed at the bottom of the chip 10. In a particular embodiment, adjacent high speed signal pads 24 are isolated by ground pads 23. Specifically, the high-speed signal pad 24 includes a high-speed serial bus pad, a receiving line pad, and a transmitting line pad, wherein the high-speed serial bus pad and the receiving line pad are separated by the ground pad 23, and the high-speed string is separated. The row bus pad and the transmission line pad are isolated by the ground pad 23 to improve the isolation between the functional pads 20. Avoid interference between signals.

Example 2

The difference between this embodiment and the embodiment 1 is that the shape of the ground pad 30 is different. In the embodiment, the ground pad 30 adopts the same circular pad as the function pad 20, as shown in FIG. An array of shaped ground pads 30 is arranged in the middle of the chip 10. In a specific setting, the diameter of the ground pad 30 is within a first set threshold, and the center distance of the adjacent ground pads 30 is within a second set threshold. That is, the diameter of the ground pad 30 is between 0.8 mm and 1.0 mm, such as 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1.0 mm, and the like. The first set threshold is between 0.8mm and 1.0mm, which ensures the minimum area required for the solder to be soldered, to ensure the solder joint strength, and at the same time minimize the satisfaction of the pad. size. The center-to-center distance between adjacent ground pads 30 is between 1.6 mm and 2.0 mm, such as 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, and the like. When the ground pad 30 is sized and equal to the center pad of the function pad 20, the pad arrangement is facilitated, and a uniform pad is used to facilitate the production of the LGA module.

In the LGA module provided in this embodiment, in order to facilitate connection with other devices, solder or solder balls are disposed on each of the ground pads 30, and/or each functional pad 20 is provided with solder or solder balls. That is, in a specific setting, solder or solder balls may be provided only on the functional pad 20, or solder or solder balls may be provided only on the ground pad 30. Alternatively, solder or solder balls may be disposed on both the functional pad 20 and the ground pad 30. And when solder or solder balls are specifically set, the height of the solder or solder balls can be determined according to actual conditions.

As can be seen from the description of Embodiment 1 and Embodiment 2 above, the circular pad is used by the functional pad 20, and the pad of the circular pad can be made smaller than that of the prior art square pad. Corresponding relationship between the pad and the signal radiation: the smaller the pad, the smaller the radiation, it can be seen that the function pad 20 adopts a circular pad to effectively improve the radiation of the pad, and the circular pad is compared with For square pads, the radiation effect is smaller, which improves the use of the LGA module.

In addition, the present application further provides a terminal, which is a common terminal such as a notebook computer, a tablet computer, a mobile phone, and the like, and the terminal includes the grid array package module according to any one of the above.

In the above embodiment, the function pad adopts a circular pad. Compared with the square pad in the prior art, the pad of the circular pad can be made smaller, and the corresponding relationship between the pad and the signal radiation: soldering The smaller the disk, the smaller the radiation, it can be seen that The use of a circular pad on the functional pad can effectively improve the radiation of the pad, and the circular pad has a smaller radiation effect than the square pad, thereby improving the use of the LGA module.

The above is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It is within the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims (12)

A grid array package module, comprising: a chip, a ground pad group and a function pad group disposed on a surface of the chip, wherein the ground pad group is disposed at a center position of the chip, The functional pad group is disposed in a peripheral region of the chip and surrounds the ground pad group; The set of ground pads includes a plurality of ground pads arranged in an array, the set of functional pads comprising a plurality of functional pads, each of the functional pads being circular in shape, and each of the functions The diameter of the pad is within a first set threshold, and the center distance of the adjacent function pads is within a second set threshold. The grid array package module of claim 1 wherein each of said ground pads has a square or circular shape. The grid array package module according to claim 2, wherein when the shape of the ground pad is circular, the diameter of each of the ground pads is within a first set threshold, adjacent The center distance of the ground pad is within a second set threshold. The grid array package module according to any one of claims 1 to 3, wherein each of the ground pads is provided with solder or solder balls, and/or each of the function pads is disposed. There are solder or solder balls. The grid array package module according to any one of claims 1 to 4, wherein the function pad set on the side of the ground pad group is 3-5 rows or 3-5 columns. The grid array package module according to any one of claims 1 to 5, wherein the first set threshold is 0.8 mm to 1.0 mm. The grid array package module according to any one of claims 1 to 6, wherein the second set threshold is 1.6 mm to 2.0 mm. The grid array package module according to any one of claims 1 to 7, wherein the functional pad group includes at least three antenna pads and non-functional pads for connecting antennas, and adjacent At least two of the non-functional pads are spaced between the antenna pads. The grid array package module of claim 8, wherein the functional pad group further comprises a plurality of high speed signal pads, and each of the high speed signal pads and each of the antenna pads The isolation between the two is not less than 85db. The grid array package module of claim 9 wherein adjacent high speed signal pads are separated by said non-functional pads. The grid array package module of claim 10, wherein the high speed signal pad comprises a high speed serial bus pad, a receiving line pad and a transmitting line pad, wherein the high speed serial bus bonding The disk is isolated from the receiving line pad by a non-functional pad, and the high speed serial bus pad is isolated from the transmitting line pad by a non-functional pad. A terminal characterized by comprising the grid array package module of claims 1-11.

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