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WO2019020065A1 - Bonded body of thermoplastic resin composition and metal, and manufacturing method therefor - Google Patents

Bonded body of thermoplastic resin composition and metal, and manufacturing method therefor Download PDF

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Publication number
WO2019020065A1
WO2019020065A1 PCT/CN2018/097143 CN2018097143W WO2019020065A1 WO 2019020065 A1 WO2019020065 A1 WO 2019020065A1 CN 2018097143 W CN2018097143 W CN 2018097143W WO 2019020065 A1 WO2019020065 A1 WO 2019020065A1
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Prior art keywords
terminal
polyamide resin
joined body
thermoplastic resin
resin composition
Prior art date
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PCT/CN2018/097143
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French (fr)
Chinese (zh)
Inventor
左璞晶
宋婷婷
陈斌
加藤公哉
大久保拓郎
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Toray Advanced Materials Research Laboratories China Co Ltd
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Toray Advanced Materials Research Laboratories China Co Ltd
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Priority to CN201880003557.7A priority Critical patent/CN109715393B/en
Publication of WO2019020065A1 publication Critical patent/WO2019020065A1/en
Anticipated expiration legal-status Critical
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40Polyamides containing oxygen in the form of ether groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor

Definitions

  • the present invention belongs to the field of composites of polymers and metals, and specifically discloses a bonded body of a thermoplastic resin composition and a metal and a method for producing the same.
  • the metal/plastic hybrid composite combines the high strength of metal with the light weight of plastic, while meeting the mechanical strength requirements and lightweight requirements of automotive structural components.
  • the joint between the metal member and the plastic is mainly joined by mechanical riveting and adhesive bonding to form a hybrid composite material, but in these joining methods, the plastic component and the metal component need to be processed separately, and then riveted and glued. They are joined together to form a complete part.
  • the above bonding method has problems such as complicated process and easy deterioration of the adhesive.
  • polyamide elastomers have mechanical properties significantly reduced compared to polyamide homopolymers.
  • the polyamide elastomer has a lower glass transition temperature than the polyamide homopolymer, and the curing speed is slower at the time of injection molding, and the molding cycle is lengthened. At the same time, the polyamide elastomer has poor adhesion to metals.
  • Chinese Patent Application Publication No. CN105479659A discloses a composite of a plastic material and a metal material comprising a polyether block amide. Although the plastic material and the metal have excellent bonding strength and provide a certain degree of sealing property, due to the polyether block amide The content of the polyether structure is high, and the mechanical properties of the polyether block amide are degraded compared with the polyamide homopolymer, and the bonding property of the polyether block amide with the metal is insufficient.
  • Patent Document 1 International Patent Application Publication No. WO2012/132639
  • Patent Document 2 International Patent Application Publication No. WO2015/022955
  • Patent Document 3 Chinese Patent Application Publication No. CN105479659A
  • An object of the present invention is to solve the above problems and to provide a bonded body of a thermoplastic resin composition containing a polyamide resin having a polyether chain introduced at its end, thereby enhancing the thermoplastic resin composition and the metal.
  • the bonding strength while the thermoplastic resin composition itself still maintains high mechanical properties.
  • the present invention also provides a method for producing a bonded body of the thermoplastic resin composition and a metal, which is capable of efficiently preparing a joint of a metal and a resin, and laying a foundation for continuous production.
  • the invention consists of the following:
  • a joint of a thermoplastic resin composition comprising a terminal-modified polyamide resin, the terminal-modified polyamide resin being contained in an amount of from 5 to 100% by weight based on the total weight of the thermoplastic resin composition.
  • the terminal modified polyamide resin has an end structure represented by Formula I,
  • n is an integer of 2 to 100
  • R 1 is the same or different, and is an alkylene group having 2 to 10 carbon atoms
  • R 2 is an alkyl group having 1 to 30 carbon atoms
  • Any one of the structures of Formula I in the terminally modified polyamide resin is 0.05 to 20% by weight based on the total weight of the terminally modified polyamide resin.
  • n is an integer of from 16 to 50.
  • n is an integer of from 16 to 25.
  • R 1 is the same or different and is an alkylene group having 2 to 4 carbon atoms.
  • R 2 is an alkyl group having 1 to 20 carbon atoms.
  • thermoplastic resin composition has a tensile shear strength of ⁇ 10 MPa measured at a tensile speed of 5 mm/min according to the joint test strip specified in ISO19095.
  • the joined body according to the above 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I has a weight average molecular weight Mw measured by gel permeation chromatography in the range of 10,000 to 400,000.
  • thermoplastic resin composition further comprises an inorganic filler in an amount of from 5 to 80% by weight based on the total mass of the thermoplastic resin composition.
  • thermoplastic resin composition of the present invention can be used for automobile parts, electronic parts, electrical product parts, structural materials, and the like.
  • thermoplastic resin composition used in the joined body of the present invention comprises a terminal-modified polyamide resin having an end structure represented by Formula I, and the content of the terminal-modified polyamide resin is 5 to 100% by weight based on the total weight of the thermoplastic resin composition.
  • n is an integer of 2 to 100
  • R 1 is the same or different, and is an alkylene group having 2 to 10 carbon atoms
  • R 2 is an alkyl group having 1 to 30 carbon atoms
  • Any of the structures of Formula I in the terminally modified polyamide resin is 0.05 to 20% by weight based on the total weight of the terminally modified polyamide resin.
  • thermoplastic resin composition when the thermoplastic resin composition contains only a single component of the terminal-modified polyamide resin, it is also defined as a thermoplastic resin composition.
  • the present invention is not particularly limited to the kind of the terminal-modified polyamide resin main chain structure to be used.
  • the monomer raw material constituting the main chain structure of the terminal-modified polyamide resin may be a diacid, a diamine, an amino acid or a lactam, etc., and specific examples thereof are exemplified but are not limited to the following examples: 6-aminocaproic acid, 11-amino-10- An acid, an amino acid such as 12-aminododecanoic acid or 4-aminomethylbenzoic acid; a lactam such as ⁇ -caprolactam, ⁇ -undecanolactam or ⁇ -laurolactam; ethylenediamine, propylenediamine, and butyl Diamine, pentanediamine, hexamethylenediamine, heptanediamine, octanediamine, decanediamine, decanediamine, undecanediamine, dodecanediamine, tridecanediamine, tetrade
  • the alkyl diester and diacid chloride derived from a dicarboxylic acid are also exemplified as a monomer raw material constituting the main chain structure of the polyamide resin.
  • the main chain of the terminal-modified polyamide resin used in the present invention may specifically be a homopolymer structure prepared from the above monomers, or a copolymerization structure prepared from the above monomers.
  • the polyamide backbone structure for the terminal-modified polyamide resin may be exemplified by, but not limited to, the following examples: polycaprolactam (nylon 6), polyundecanolactam (nylon 11), polydodelactam (nylon 12), poly Adipyl hexamethylenediamine (nylon 66), polyadipyl butanediamine (nylon 46), polyhexamethylene diamylamine (nylon 56), polysebacyl diamine (nylon 410), polyfluorene Acylpentanediamine (nylon 510), polyphthalamide (nylon 610), polydodecanoyldiamine (nylon 612), polysebacyldiamine (nylon 1010), polydodecanoylhydrazide Diamine (nylon 1012), polycaprolactam/polyhexamethylene adipamide (nylon 6/66), poly(m-xylylenediamine) (MXD6), poly(m
  • the polyamide main chain structure of the above terminal modified polyamide resin is preferably polycaprolactam (nylon 6), polyhexamethylene adipamide (nylon 66), polyhexamethylene.
  • the main chain structure of the terminal-modified polyamide resin may be composed of one of the above-described main chain structures, or may be composed of two or more of the above-described main chain structures.
  • the main chain repeating unit of the terminal-modified polyamide resin used in the present invention is preferably composed of 80 mol% or more of the structural unit derived from the above-mentioned monomer raw material (the number of repeating units of the polyamide main chain structure is 100 mol%). In view of heat resistance and crystallinity, it is preferably 90 mol% or more, and most preferably 100 mol%.
  • the terminally modified polyamide resin used in the present invention increases the mobility of the entire molecular chain by introducing a flexible polyether structure represented by Formula I at the terminal of the polyamide, thereby lowering the melt viscosity. Therefore, when the thermoplastic resin containing the terminal-modified polyamide resin is brought into contact with the metal in a molten state, the resin melt is more effectively infiltrated into minute pores of the metal surface, so that it can be better bonded to the metal surface.
  • n is an integer of from 2 to 100.
  • n is less than 2, the effect of lowering the melt viscosity of the thermoplastic resin composition is deteriorated.
  • n is 4 or more, and further preferably n is 8 or more, and most preferably n is 16 or more.
  • n is more than 100, the heat resistance of the terminal structure represented by Formula I is deteriorated.
  • n is 70 or less, more preferably n is 50 or less, and most preferably n is 25 or less.
  • R 1 is the same or different and is an alkylene group having 2 to 10 carbon atoms.
  • R 1 include -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -, -CH(CH 3 )-CH 2 -, -CH 2 -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -CH 2 - or -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -.
  • R 1 is preferably an alkylene group having 2 to 6 carbon atoms, and more preferably an alkylene group having 2 to 4 carbon atoms.
  • R 1 may be a combination of different alkylene groups, preferably at least one of -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -, -CH(CH 3 )-CH 2 -.
  • R 2 is an alkyl group having 1 to 30 carbon atoms.
  • the smaller the number of carbon atoms in R 2 the higher the affinity with the polyamide main chain structure. Therefore, R 2 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably 1 to 10 carbon atoms.
  • the alkyl group is more preferably an alkyl group having 1 to 5 carbon atoms, and most preferably a methyl group.
  • the terminal modified polyamide resin used in the present invention has a terminal structure represented by the formula I in an amount of 0.05 to 20% by weight based on the total weight of the terminal-modified polyamide resin, and the terminal structure is considered for the purpose of lowering the melt viscosity and improving moldability.
  • the content in the terminally modified polyamide resin is preferably 0.1% by weight or more, further preferably 0.5% by weight or more, still more preferably 1.5% by weight or more, and most preferably 2% by weight or more; on the other hand, by making the terminal of Formula I
  • the content of the structure is 20% by weight or less, and the crystallinity and mechanical properties of the terminal-modified polyamide resin can be more preferably maintained, and are preferably 15% by weight or less, further preferably 10% by weight or less, and still more preferably 5% by weight or less.
  • the content (wt%) of the polyether segment represented by the above formula I with respect to the terminal-modified polyamide resin was obtained by 1 H-NMR (nuclear magnetic resonance) test.
  • the terminal modified polyamide resin having the terminal structure represented by Formula I in the present invention is preferably prepared at a concentration of 0.01 g/ml in a solution of 96 wt% concentrated sulfuric acid as a solvent at a relative viscosity ⁇ r measured at 25 ° C. It is 1.1 to 5.0. When ⁇ r is less than 1.1, the mechanical properties and metal bonding properties of the thermoplastic resin composition tend to decrease. Preferably, ⁇ r is 1.2 or more, and more preferably 1.4 or more. On the other hand, when ⁇ r is more than 5.0, the molecular weight is too high, and thus the melt viscosity is too high, which tends to lower the metal bonding performance. ⁇ r is preferably 4 or less, and more preferably ⁇ r is 3 or less.
  • the weight-average molecular weight (Mw) of the terminal-modified polyamide resin having the terminal structure represented by Formula I in the present invention is preferably 10,000 or more. When the Mw reaches 10,000 or more, the mechanical properties and metal bonding properties are improved. Mw is further preferably 20,000 or more, and still more preferably 30,000 or more. Further, Mw is preferably 400,000 or less. When the Mw is 400,000 or less, the melt viscosity is low, and during the process of manufacturing the joined body, the resin melt can sufficiently wet the minute holes of the metal surface, thereby bringing the thermoplastic resin composition into close contact with the metal surface, and improving the metal bonding property. Mw is more preferably 300,000 or less, still more preferably 250,000 or less. The weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC).
  • the present invention is intended to obtain a joined body having good heat resistance, and therefore the melting point (Tm) of the terminal-modified polyamide resin having the terminal structure represented by Formula I is preferably 215 ° C or higher, and further preferably the melting point of the terminal-modified polyamide resin. (Tm) is above 218 °C.
  • the introduction of a flexible structure into a polyamide resin by copolymerization causes a decrease in the melting point of the polyamide resin, but the present invention selectively introduces a polyether having a specific structure at the end of the resin to a polyamide phase which does not contain a polyether end structure.
  • the decrease in the melting point of the polyamide resin into which the polyether end is introduced is controlled to the minimum.
  • the melting point is preferably not more than 5 ° C, and further preferably the melting point is not more than 3 ° C.
  • the melting point of the polyamide resin described herein is determined by differential scanning calorimetry (DSC): the polyamide resin is accurately weighed 5 to 7 mg, and the temperature is raised from 20 ° C at a heating rate of 20 ° C / min under a nitrogen atmosphere.
  • Tm melting point
  • thermoplastic resin composition used in the present invention other kinds of polymers, fillers, and various additives may be added in addition to the terminal-modified polyamide resin.
  • the other types of polymers in the thermoplastic resin composition may be, but not limited to, the following examples: polyolefins such as polyethylene and polypropylene; modified polyolefins such as copolymers obtained by polymerizing olefins and/or conjugated diene compounds; Ester, polycarbonate, polyphenylene ether, polyphenylene sulfide, liquid crystal polymer, polysulfone, polyethersulfone, ABS resin, SAN resin, polystyrene, polyunsity other than the terminal unmodified polyamide resin of the present invention Amide resin and the like.
  • polyolefins such as polyethylene and polypropylene
  • modified polyolefins such as copolymers obtained by polymerizing olefins and/or conjugated diene compounds
  • Ester polycarbonate, polyphenylene ether, polyphenylene sulfide, liquid crystal polymer, polysulfone, polyethersulfone, ABS resin,
  • thermoplastic resin composition used in the present invention in order to improve the impact resistance of the molded article obtained by the thermoplastic resin composition used in the present invention and to reduce the shrinkage ratio, it is preferred to use a polymer obtained by polymerizing an olefin and/or a conjugated diene compound (or copolymerization).
  • An impact agent such as a modified polyolefin.
  • the polymer may, but not limited to, the following examples: an ethylene-based copolymer, a conjugated diene-based polymer, or a conjugated diene-aromatic ethylene copolymer.
  • the ethylene-based copolymer means a copolymer of ethylene and another monomer.
  • Other monomers copolymerized with ethylene may be exemplified by, but not limited to, the following examples: an ⁇ -olefin having 3 or more carbon atoms, a non-conjugated diene, a vinyl acetate, a vinyl alcohol, an ⁇ , ⁇ -unsaturated carboxylic acid or a derivative thereof. Things. Two or more kinds of the above monomers may be copolymerized with ethylene.
  • the ⁇ -olefin having 3 or more carbon atoms may, but not limited to, the following examples: propylene, 1-butene, 1-pentene or 3-methyl-1-pentene, preferably propylene or 1-butene.
  • the non-conjugated diene may be exemplified by, but not limited to, the following examples: 5-methylene-2-norbornene, 5-ethylidene-2-norbornene, 5-vinyl-2-norbornene, 5 -propenyl-2-norbornene, 5-isopropenyl-2-norbornene, 5-butenyl-2-norbornene, 5-(2-methyl-2-butenyl)-2 -norbornene compound such as norbornene, 5-(2-ethyl-2-butenyl)-2-norbornene or 5-methyl-5-vinylnorbornene; dicyclopentadiene, A Tetrahydroindole, te
  • the ⁇ , ⁇ -unsaturated carboxylic acid may be exemplified by, but not limited to, the following examples: acrylic acid, methacrylic acid, ethacrylic acid, 2-butenoic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid or butyl Oleic acid and the like.
  • the derivative of the ⁇ , ⁇ -unsaturated carboxylic acid may, but not limited to, the following examples: an alkyl ester, an aryl ester, a glyceride, an acid anhydride or an imide of the above ⁇ , ⁇ -unsaturated carboxylic acid.
  • the conjugated diene polymer refers to a polymer obtained by polymerizing at least one conjugated diene.
  • the conjugated diene described herein may be exemplified by, but not limited to, the following examples: 1,3-butadiene, isoprene (2-methyl-1,3-butadiene), 2,3-dimethyl Base-1,3-butadiene or 1,3-pentadiene.
  • the conjugated diene may be copolymerized in two or more types. Additionally, the unsaturated bonds of the polymer can be partially or completely reduced by hydrogenation.
  • the conjugated diene-aromatic ethylene copolymer refers to a copolymer of a conjugated diene and an aromatic ethylene, and may be a block copolymer or a random copolymer.
  • Examples of the conjugated diene may be the same as those of the above-mentioned conjugated diene-based polymer, and 1,3-butadiene and isoprene are preferable.
  • the aromatic vinyl may, for example, be styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 1,3-dimethylstyrene or vinylnaphthalene or the like, preferably styrene.
  • the unsaturated bond other than the double bond of the aromatic ring of the conjugated diene-aromatic ethylene copolymer may be partially or completely reduced by hydrogenation.
  • the impact agent include an ethylene/propylene copolymer, an ethylene/1-butene copolymer, an ethylene/1-hexene copolymer, an ethylene/propylene/dicyclopentadiene copolymer, and an ethylene/propylene/5-Asian Base-2-norbornene copolymer, unhydrogenated or hydrogenated styrene/isoprene/styrene triblock copolymer, unhydrogenated or hydrogenated styrene/butadiene/styrene triblock a salt of a part or all of a carboxylic acid group of a copolymer, an ethylene/methacrylic acid copolymer or a copolymer with sodium, lithium, potassium, zinc or calcium, an ethylene/methyl acrylate copolymer, an ethylene/ethyl acrylate copolymer , ethylene / methyl methacrylate copolymer, ethylene /
  • the above copolymer is preferably an ethylene/methacrylic acid copolymer and a salt of a part or all of a carboxylic acid group of the copolymer with sodium, lithium, potassium, zinc or calcium, an ethylene/propylene-g-maleic anhydride copolymer, ethylene/ Butene-1-g-maleic anhydride copolymer.
  • the polymer other than the terminal-modified polyester resin in the above thermoplastic resin composition may be added singly or in combination of two or more kinds.
  • the addition amount is preferably 0% by weight or more and 80% by weight or less (100% by weight of the thermoplastic resin composition), and by controlling the amount of addition to the above range, the fluidity at the time of melting the thermoplastic resin composition can be further improved. It is further preferably 60% by weight or less, and still more preferably 50% by weight or less.
  • the thermoplastic resin composition of the present invention may further contain a filler, and the filler may be exemplified by, but not limited to, the following examples: glass fiber, carbon fiber, titanic acid whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, Fibrous inorganic or organic fillers such as alumina fibers, silicon carbide fibers, ceramic fibers, asbestos fibers, gypsum fibers or metal fibers; wollastonite, zeolite, sericite, kaolin, mica, talc, clay, pyrophyllite, bentonite, Montmorillonite, asbestos, silicate, alumina, silica, magnesia, zirconia, titania, iron oxide, calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, magnesium hydroxide, calcium hydroxide
  • Non-fibrous inorganic fillers such as aluminum hydroxide, glass microspheres, ceramic microbeads,
  • the filler may be hollow, and the filler may be treated with a coupling agent such as an isocyanate compound, an organosilane compound, an organic titanate compound, an organoborane compound or an epoxy compound.
  • a coupling agent such as an isocyanate compound, an organosilane compound, an organic titanate compound, an organoborane compound or an epoxy compound.
  • the above montmorillonite may also be an organic montmorillonite obtained by cation exchange of interlamellar ions through an organic ammonium salt.
  • the above filler is preferably a fibrous inorganic filler, and more preferably glass fiber or carbon fiber. Further, the above fillers may be added singly or in combination of two or more.
  • the content of the above filler in the thermoplastic resin composition is preferably from 5 to 80% by weight based on the total weight of the thermoplastic resin composition, and when the filler is added in an amount of 5% by weight or more, the shrinkage ratio of the thermoplastic resin composition is reduced, and the joint body is produced.
  • the filler is added in a total amount of the thermoplastic resin composition.
  • the weight is 10% by weight or more, more preferably 20% by weight or more, and most preferably 30% by weight or more.
  • the amount of the filler added is 80% by weight or less, the melt of the thermoplastic resin composition has good fluidity, more preferably 60% by weight or less, still more preferably 50% by weight or less.
  • thermoplastic resin composition used in the present invention may further contain various additives.
  • antioxidants and heat stabilizers hindered phenols, hydroquinones, phosphites, phosphates and substituted products, copper halides, iodine compounds, etc.
  • weathering agents resorcinol, water
  • Salicylic acid resorcinol, water
  • benzotriazole diphenyl ketone or sterically hindered amines
  • mold release agents and lubricants fatty alcohols, aliphatic amides, aliphatic diamides or diureas or polyethylene waxes, etc.
  • pigment calcium sulfide, phthalocyanine or carbon black, etc.
  • dye aniline black, etc.
  • plasticizer n-octyl p-hydroxybenzoate or N-butylbenzenesulfonamide
  • antistatic agent alkyl sulfate
  • a salt type anionic antistatic agent a 4-stage ammoni
  • the present invention is intended to obtain a joined body having excellent bonding properties between a thermoplastic resin composition and a metal, and therefore it is preferred to use a stretched shear bonded to aluminum using a thermoplastic resin composition comprising a terminally modified polyamide resin having an end structure of the formula I.
  • the tensile shear strength is defined as a value measured at a tensile speed of 5 mm/min according to the joint test strip (Fig. 1) specified in IS019095.
  • the surface of the aluminum used herein has a microporous structure having an average pore diameter of 10 to 100 nm, and the uneven structure of the aluminum surface can be observed by an electron scanning microscope.
  • the tensile shear strength is 15 MPa or more, and most preferably the thermoplastic resin composition having a tensile shear strength of 20 MPa or more, and the tensile shear strength of the thermoplastic resin composition bonded to the metal herein is prepared according to ISO 19095. It was tested at a tensile speed of 5 mm/min.
  • the joined body in the present invention can be obtained by directly bonding a thermoplastic resin composition to a metal, that is, the thermoplastic resin composition and the metal can be directly joined without passing through an intermediate layer such as another bonding material.
  • the metal may be surface-treated or not surface-treated, and the type of the metal is not particularly limited, and examples thereof include iron, copper, silver, gold, aluminum, zinc, lead, tin, magnesium, and the like.
  • the metal surface may have an oxide layer, or may have a surface structure to form an uneven structure, or an organic functional group or a low molecular weight organic compound may be introduced into the metal surface to form a chemical structure layer.
  • the surface treatment method of the above metal may be exemplified by immersing the metal surface in a corrosive liquid, immersing the fine concavo-convex structure on the surface, immersing it in an aqueous solution of the nitrogen-containing compound, or fumigation using a nitrogen-containing compound gas to make the metal surface a method of attaching a chemical substance; immersing a metal surface in a corrosive liquid, and forming a fine uneven structure on the surface of the metal by anodization on the surface of the metal, and attaching a chemical substance to the surface of the metal; etching the groove by laser processing The method of the slot, etc.
  • the NMT surface treatment method of Dacheng PLAS Corporation and the TRI surface treatment method of the East Asia Electrochemical Company can be exemplified.
  • the corrosive liquid used for the surface treatment may, for example, be an alkaline aqueous solution (pH>7), an acidic aqueous solution (pH ⁇ 7), an aqueous solution containing a nitrogen compound, or the like, wherein the alkaline aqueous solution may, for example, be sodium hydroxide or hydroxide.
  • an acidic aqueous solution may, for example, be an aqueous solution of hydrochloric acid, sulfuric acid, nitric acid or hydrofluoric acid;
  • the nitrogen-containing compound may be ammonia, hydrazine or a water-soluble amine, and the water-soluble amine may specifically be methylamine.
  • the metal surface anodizing treatment method may be exemplified by using a metal as an anode and passing an electric current in the electrolytic solution to form an oxide film on the metal surface.
  • the water-soluble amine composition may be used as an electrolytic solution for anodizing the metal surface.
  • Examples of the chemical substance to be attached to the metal surface include ammonia, hydrazine, a water-soluble amine, and a triazine dithiol compound.
  • the above method of etching the groove by laser processing can specifically exemplify the technique of manufacturing micropores by metal surface etching by the DLAMP technology developed by Daicel Corporation of Japan and Daicel Plastics Co., Ltd.
  • the nano-scale uneven structure of the above metal surface is a nano-scale microporous structure under an electron scanning microscope, and preferably has an average pore diameter of 10 to 100 nm, and more preferably has a pore diameter of 10 to 80 nm.
  • the present invention also provides a process for producing a bonded body of a thermoplastic resin composition of the present invention and a metal.
  • the method for producing the joined body of the present invention is not particularly limited, and the method for producing the joined body will be exemplified below.
  • thermoplastic resin composition It is considered to improve the bonding property of the thermoplastic resin composition and the metal and the efficiency in the actual manufacturing process, and it is preferable to perform injection molding or welding by laser irradiation.
  • the method of injection molding can specifically exemplify a method in which a thermoplastic resin composition is heated and melted and then injection-molded into a mold placed in advance in a metal to obtain a joined body.
  • the mold temperature is not particularly limited, but is preferably 60° C. or higher and 180° C. or lower.
  • the moldability of the thermoplastic resin composition to the metal can be further improved by controlling the mold temperature to 60° C. or higher, more preferably 80° C. or higher, and still more preferably 100° C. or higher.
  • the thermoplastic resin combination when the mold temperature is 180° C. or lower.
  • the material can be more effectively cured and formed, and is more preferably 160 ° C or lower, still more preferably 150 ° C or lower.
  • the method of welding by laser irradiation may be carried out by laminating and fixing a molded article obtained by using a thermoplastic resin composition, and then irradiating with a laser from the resin side or the metal side to melt the resin in the vicinity of the interface between the resin and the metal material.
  • a method of joining a resin molded article and a metal material may be carried out by laminating and fixing a molded article obtained by using a thermoplastic resin composition, and then irradiating with a laser from the resin side or the metal side to melt the resin in the vicinity of the interface between the resin and the metal material.
  • thermoplastic resin composition of the present invention has high bonding property with a metal joined body, and is suitable for fields such as automobile parts requiring metal joining, electronic parts, electrical product parts, structural materials, and the like.
  • Fig. 1 is a resin-metal bonded spline used for testing the adhesion of a resin to a metal in an embodiment of the present invention.
  • Relative viscosity ⁇ r The polyamide resin sample used in each of the examples and the comparative examples was dissolved in 96 wt% of concentrated sulfuric acid to prepare a solution having a polyamide resin concentration of 0.01 g/ml, and was used at 25 ° C. The viscometer measures the relative viscosity.
  • the terminal structure content of the formula (I) in the polyamide resin was calculated by calculating the peak area obtained by integrating the peaks and the number of hydrogen atoms contained in each structure.
  • thermoplastic resin composition used in each of the examples and the comparative examples was accurately weighed 5 to 7 mg by a differential scanning calorimeter (DSC Q2000) of TA Corporation, and the temperature was raised from 20 ° C at a heating rate of 20 ° C / min under a nitrogen atmosphere. Start heating up to a temperature 30 ° C higher than the temperature T0 of the endothermic peak that appears, and then thermostat at this temperature for 2 min, then cool down to 20 ° C at a temperature drop rate of 20 ° C / min, and then thermostatically at 20 ° C for 2 min. The temperature increase rate of 20 ° C / min was raised to a temperature 30 ° C higher than T0 to obtain a melting point T m .
  • T m is the temperature corresponding to the peak tip of the endothermic peak during the secondary temperature rise.
  • the polyamide resin particles obtained in each of the preparation examples or the resin portion of the joined body obtained after the injection molding in each of the examples and the comparative examples were dissolved in 4 ml of hexafluoroisopropanol containing 0.0075 N of sodium trifluoroacetate. After the filtration, the number average molecular weight Mn and the weight average molecular weight Mw were measured by filtration through a 0.45 ⁇ m filter, and the measurement conditions were as follows:
  • the polyamide resin obtained in Preparation Examples 1 to 12 was dried in a vacuum drying oven at 80 ° C for 12 hours or more, and then formed into a film (film thickness: 0.7 mm) by a laminator and then cut into a circle having a diameter of 25 mm.
  • the sheet was measured for melt viscosity by a rotary rheometer (manufactured by Antonpas, MCR302, ⁇ 25 parallel plate) by the following method: at 260 ° C (preparation examples 1 to 7, 10 to 12) or 280 ° C under a nitrogen atmosphere.
  • the spline size is Type IV in ASTM D638, the terminal modified polyamide obtained in Preparation Example 3 using Shimadzu AG-IS 1 KN, and the commercial polyamide elastomer used in Comparative Examples 4 and 5.
  • the tensile modulus results are taken as the average of the five spline test results.
  • the injection molding conditions for the spline are as follows:
  • the metal piece was placed in a cavity of the mold, and after the mold was held for 1 minute, the melt of the thermoplastic resin composition was metered and injected into the mold. After the melt is cooled and solidified, the mold is opened to obtain a joined body.
  • Screw temperature 260 ° C (Examples 1 to 11, Comparative Examples 1 to 6)
  • the bondability between resin and metal is characterized by tensile shear strength, tested according to ISO 19095, the spline size is the specified size in ISO 19095 shown in Figure 1, and the joint area is 0.5 cm 2 using Shimadzu AG-IS 1 KN test tensile modulus, test temperature 23 ° C, humidity 50% RH, tensile speed 5 mm / min, clamp spacing 3 mm.
  • the tensile shear strength results are taken as the average of the five spline test results.
  • the heater set temperature was lowered to 260 ° C, and the pressure in the autoclave was gradually lowered from 1 MPa to normal pressure within 1 hour (the temperature in the autoclave was 260 ° C when the pressure was reached).
  • a nitrogen gas flow was introduced into the autoclave, and after 30 minutes of melt polymerization under a nitrogen stream (up to a temperature of 263 ° C), the polymer melt was discharged through a discharge valve and cooled by cooling water. The pellets are obtained to obtain product particles.
  • the obtained particles were subjected to removal of small molecules in the polymer using methanol as a solvent in a Soxhlet extractor, and dried in a vacuum oven at 80 ° C for 24 hours to obtain a terminal modified N6 containing the structure represented by Formula I.
  • the pressure in the autoclave was gradually decreased from 1.75 MPa to normal pressure within 1 hour (the temperature in the autoclave at normal pressure was 270 ° C).
  • a nitrogen gas flow was introduced into the autoclave, and after 20 minutes of melt polymerization under a nitrogen stream (up to a temperature of 283 ° C), the polymer melt was discharged through a discharge valve and cooled by cooling water.
  • the pellets are obtained to obtain product particles.
  • the resulting particles were dried in a vacuum oven at 80 ° C for 24 h to give a terminal modified N66 of the formula I.
  • the extruded tow was subjected to pelletization, and vacuum dried at 80 ° C for 24 hours to obtain a polyamide resin composition.
  • the surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the end-modification of the structure containing the I obtained by the measurement preparation example 1.
  • the polyamide resin was poured into the mold, and the cooling time was 15 s.
  • the mold was opened to obtain a joined body.
  • the screw temperature was 260 ° C and the mold temperature was 120 ° C.
  • the joined body obtained by the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 3.
  • the surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the unmodified polyamide obtained in Preparation Example 7.
  • the resin melt was injected into the mold, the cooling time was 15 s, and the mold was opened to obtain a joined body.
  • the screw temperature was 260 ° C and the mold temperature was 120 ° C.
  • the obtained joined body of the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 3.
  • thermoplastic resin composition containing the structurally modified polyamide of the structure represented by Formula I has a tensile shear strength superior to that of the metal without the structural polyamide represented by Formula I.
  • the resin, Examples 2 to 6 metal joint tensile shear strength was significantly higher than Examples 1 and 7 having a lower structural content as shown in Formula I.
  • a higher content of the structure of Formula I has an effect on the mechanical strength of the end-modified polyamide resin body such that the metal bond tensile shear strength ratio is 2 wt% and 4 wt% of the end of the structure shown in Formula I.
  • the examples are low.
  • thermoplastic resin composition has a lower content by blending a structurally modified polyamide resin having a higher content of the formula I and a structural polyamide resin not containing the formula I.
  • the melt viscosity (Table 2) was such that the resulting joined body had a higher metal bond tensile shear strength.
  • Example 8 Comparing Example 8 with Comparative Example 2, Example 9 and Comparative Example 3, it is understood that 4% by weight of the structure-modified polyamide resin of the formula I has a higher tensile shear strength and higher mold temperature.
  • the metal bonded tensile shear strength of Examples 3 and 8 molded under the conditions was higher than that of Example 9 and Example 10 which were molded under the mold temperature conditions.
  • the surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the commercial polyamide elastomer (PEBAX 5533SP01, manufactured by Arkema).
  • the resin melt was poured into a mold, the cooling time was 15 s, and the mold was opened to obtain a joined body.
  • the screw temperature was 260 ° C and the mold temperature was 60 ° C.
  • the obtained joined body of the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 5.
  • Example 3 was excellent in high-temperature molding properties and had higher metal bond tensile shear strength. Meanwhile, in Example 10, the tensile strength of the metal joint tensile shear of Example 10 was higher than that of Comparative Example 4. Further, the tensile strength and tensile modulus of the thermoplastic resin composition body in Example 3 and Example 10 were significantly superior to those of Comparative Example 4 and Comparative Example 5.
  • Example 3 and Example 11 It can be seen from Example 3 and Example 11 that the tensile shear strength of the joint containing 4 wt% of the terminal modified polyamide resin of the formula I and the NMT and TRI treatments was 20 MPa or more. In Comparative Example 1 and Comparative Example 6 in which a polyamide resin which was not subjected to terminal modification was used, the tensile shear strength of the joint of the resin and the NMT and TRI treatments was less than 10 MPa.
  • the surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the terminal modification of the structure I obtained by the preparation of Example 8.
  • the polyamide resin was poured into the mold, and the cooling time was 15 s.
  • the mold was opened to obtain a joined body.
  • the screw temperature was 280 ° C and the mold temperature was 120 ° C.
  • the joined body obtained by the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 7.
  • thermoplastic resin composition containing the terminal-modified polyamide of the formula I represented by the structure has a tensile shear strength superior to that of the metal bonded structure of the formula I.

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Abstract

Provided are a bonded body of a thermoplastic resin composition and a metal, which bonded body has excellent bonding properties, and a manufacturing method therefor. The thermoplastic resin composition contains a terminally modified polyamide resin. The content of the terminally modified polyamide resin in the thermoplastic resin composition is 5-100 wt% of the total weight of the thermoplastic resin composition, and the terminally modified polyamide resin has a terminal structure shown in formula I, -X-(R1-O)n-R2, formula I. In formula I above, n is an integer from 2 to 100; R1 is identical or different, and is an alkylene group having 2-10 carbon atoms; R2 is an alkyl group having 1-30 carbon atoms; and -X- is any one of -NH-, -O-, -C(=O)-, -NH-C(=O)-O-, -NH-C(=O)-NH- or-CH(OH)-CH2-. The content of the structure shown in formula I in the terminally modified polyamide resin is 0.05-20 wt% of the total weight of the terminally modified polyamide resin.

Description

一种热塑性树脂组合物与金属的接合体及其制造方法Bonded body of thermoplastic resin composition and metal and method of producing the same 技术领域Technical field

本发明属于聚合物与金属的复合体领域,具体公开了一种热塑性树脂组合物与金属的接合体及其制造方法。The present invention belongs to the field of composites of polymers and metals, and specifically discloses a bonded body of a thermoplastic resin composition and a metal and a method for producing the same.

背景技术Background technique

随着能源、安全、环保三大问题日益突出,汽车轻量化越来越受到重视。由于比重远小于金属,工程塑料在汽车上的应用逐渐增加,但在某些结构部件中,工程塑料其本身的机械强度仍难以满足需求。金属/塑料杂化复合材料兼具金属高强度与塑料轻质的特点,同时满足了汽车结构部件的机械强度需求和轻量化需求。With the three major problems of energy, safety and environmental protection becoming more and more prominent, the lightweight of automobiles has received more and more attention. Because the proportion is much smaller than that of metal, the application of engineering plastics in automobiles is gradually increasing. However, in some structural components, the mechanical strength of engineering plastics is still difficult to meet the demand. The metal/plastic hybrid composite combines the high strength of metal with the light weight of plastic, while meeting the mechanical strength requirements and lightweight requirements of automotive structural components.

目前,金属构件与塑料之间的接合主要通过机械铆接、胶黏剂粘结接合到一起构成杂化复合材料,但这些接合方式中塑料部件与金属部件需要分别加工后,再通过铆接、胶接等接合到一起构成完整部件。上述接合方式有着工艺复杂、胶黏剂易劣化等问题。At present, the joint between the metal member and the plastic is mainly joined by mechanical riveting and adhesive bonding to form a hybrid composite material, but in these joining methods, the plastic component and the metal component need to be processed separately, and then riveted and glued. They are joined together to form a complete part. The above bonding method has problems such as complicated process and easy deterioration of the adhesive.

近年来,将树脂直接通过注塑成型与金属进行接合的方法也得到了越来越多的研究。国际专利申请公开公报WO2012/132639公开了一种热塑性树脂和金属的复合体,该热塑性树脂中含有能够使树脂结晶温度上升的无机填料,但该方法得到的复合体其树脂和金属之间的接合性仍不足。国际专利申请公开公报WO2015/022955公开了一种热塑性树脂和金属的复合体,该热塑性树脂可以是聚醚共聚改性的聚 酰胺弹性体或由吸水性热塑性树脂与金属氢氧化物构成的热塑性树脂组合物。但与聚酰胺均聚物相比,聚酰胺弹性体的机械性能显著下降。另一方面,相比于聚酰胺均聚物,聚酰胺弹性体玻璃化转变温度较低,注射成型时固化速度较慢,成型周期加长。同时,聚酰胺弹性体与金属的接合性不好。In recent years, more and more research has been conducted on a method in which a resin is directly joined to a metal by injection molding. International Patent Application Publication No. WO 2012/132639 discloses a composite of a thermoplastic resin and a metal, which contains an inorganic filler capable of increasing the crystallization temperature of the resin, but the composite obtained by the method has a bond between the resin and the metal. Sex is still insufficient. International Patent Application Publication No. WO 2015/022955 discloses a composite of a thermoplastic resin and a metal, which may be a polyether copolymer modified polyamide elastomer or a thermoplastic resin composed of a water-absorbing thermoplastic resin and a metal hydroxide. combination. However, the mechanical properties of polyamide elastomers are significantly reduced compared to polyamide homopolymers. On the other hand, the polyamide elastomer has a lower glass transition temperature than the polyamide homopolymer, and the curing speed is slower at the time of injection molding, and the molding cycle is lengthened. At the same time, the polyamide elastomer has poor adhesion to metals.

中国专利申请公开公报CN105479659A公开了一种包含聚醚嵌段酰胺的塑胶材料和金属材料的复合体,虽然塑胶材料和金属结合力优良且提供一定程度的密封特性,但由于聚醚嵌段酰胺中聚醚结构含量较高,与聚酰胺均聚物相比,聚醚嵌段酰胺机械性能下降,且聚醚嵌段酰胺与金属的接合性能不足。Chinese Patent Application Publication No. CN105479659A discloses a composite of a plastic material and a metal material comprising a polyether block amide. Although the plastic material and the metal have excellent bonding strength and provide a certain degree of sealing property, due to the polyether block amide The content of the polyether structure is high, and the mechanical properties of the polyether block amide are degraded compared with the polyamide homopolymer, and the bonding property of the polyether block amide with the metal is insufficient.

现有技术文献Prior art literature

专利文献1:国际专利申请公开公报WO2012/132639Patent Document 1: International Patent Application Publication No. WO2012/132639

专利文献2:国际专利申请公开公报WO2015/022955Patent Document 2: International Patent Application Publication No. WO2015/022955

专利文献3:中国专利申请公开公报CN105479659APatent Document 3: Chinese Patent Application Publication No. CN105479659A

发明内容Summary of the invention

本发明的目的是解决上述课题,提供一种热塑性树脂组合物和金属的接合体,所述热塑性树脂组合物含有末端导入了聚醚链的聚酰胺树脂,从而提升了热塑性树脂组合物与金属的接合强度,同时热塑性树脂组合物本身仍保持较高的机械性能。An object of the present invention is to solve the above problems and to provide a bonded body of a thermoplastic resin composition containing a polyamide resin having a polyether chain introduced at its end, thereby enhancing the thermoplastic resin composition and the metal. The bonding strength while the thermoplastic resin composition itself still maintains high mechanical properties.

本发明还提供了所述热塑性树脂组合物和金属的接合体的制造 方法,该方法能高效制备金属与树脂的接合体,为连续化生产奠定基础。The present invention also provides a method for producing a bonded body of the thermoplastic resin composition and a metal, which is capable of efficiently preparing a joint of a metal and a resin, and laying a foundation for continuous production.

本发明由以下内容构成:The invention consists of the following:

1、一种热塑性树脂组合物和金属的接合体,所述热塑性树脂组合物含有末端改性聚酰胺树脂,所述末端改性聚酰胺树脂的含量为热塑性树脂组合物总重量的5~100wt%,所述末端改性聚酰胺树脂具有式I所示末端结构,A joint of a thermoplastic resin composition comprising a terminal-modified polyamide resin, the terminal-modified polyamide resin being contained in an amount of from 5 to 100% by weight based on the total weight of the thermoplastic resin composition. The terminal modified polyamide resin has an end structure represented by Formula I,

-X-(R 1-O)n-R 2   式I -X-(R 1 -O)nR 2 Formula I

上述式I中,n为2~100的整数,R 1相同或不同,为碳原子数为2~10的亚烷基,R2为碳原子数为1~30的烷基,-X-为-NH-、-O-、-C(=O)-、-NH-C(=O)-O-、-NH-C(=O)-NH-或-CH(OH)-CH 2-中的任一种;式I所示结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.05~20wt%。 In the above formula I, n is an integer of 2 to 100, R 1 is the same or different, and is an alkylene group having 2 to 10 carbon atoms, R 2 is an alkyl group having 1 to 30 carbon atoms, and -X- is - Among NH-, -O-, -C(=O)-, -NH-C(=O)-O-, -NH-C(=O)-NH- or -CH(OH)-CH 2 - Any one of the structures of Formula I in the terminally modified polyamide resin is 0.05 to 20% by weight based on the total weight of the terminally modified polyamide resin.

2、根据上述1所述的接合体,上述式I所示末端结构中,n为16~50的整数。2. The bonded body according to the above 1, wherein in the terminal structure represented by the above formula I, n is an integer of from 16 to 50.

3、根据上述1所述的接合体,上述式I所示末端结构中,n为16~25的整数。3. The bonded body according to the above 1, wherein in the terminal structure represented by the above formula I, n is an integer of from 16 to 25.

4、根据上述1所述的接合体,上述式I所示末端结构中,R 1相同或不同,为碳原子数为2~4的亚烷基。 4. The joined body according to the above 1, wherein, in the terminal structure represented by the above formula I, R 1 is the same or different and is an alkylene group having 2 to 4 carbon atoms.

5、根据上述1所述的接合体,上述式I所示末端结构中,R 2为碳原子数为1~20的烷基。 5. The joined body according to the above 1, wherein in the terminal structure represented by the formula I, R 2 is an alkyl group having 1 to 20 carbon atoms.

6、根据上述1所述的接合体,上述式I所示末端结构中,R 2为 甲基。 6. The joined body according to the above 1, wherein in the terminal structure represented by the formula I, R 2 is a methyl group.

7、根据上述1所述的接合体,上述式I所示末端结构中,-X-为-NH-。7. The joined body according to the above 1, wherein -X- is -NH- in the terminal structure represented by the above formula I.

8、根据上述1所述的接合体,上述式I所示末端结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.1~15wt%。9、根据上述1所述的接合体,上述式I所示末端结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.1~10wt%。10、根据上述1所述的接合体,所述热塑性树脂组合物根据ISO19095规定的接合体试验样条在5mm/min的拉伸速度下测得的拉伸剪切强度≥10MPa。8. The joined body according to the above 1, wherein the terminal structure represented by the above formula I is contained in the terminal-modified polyamide resin in an amount of from 0.1 to 15% by weight based on the total weight of the terminal-modified polyamide resin. 9. The joined body according to the above 1, wherein the terminal structure represented by the above formula I is contained in the terminal-modified polyamide resin in an amount of from 0.1 to 10% by weight based on the total weight of the terminal-modified polyamide resin. 10. The joined body according to the above 1, wherein the thermoplastic resin composition has a tensile shear strength of ≥ 10 MPa measured at a tensile speed of 5 mm/min according to the joint test strip specified in ISO19095.

11、根据上述1所述的接合体,所述接合体由热塑性树脂组合物与金属直接接合得到。11. The joined body according to the above 1, wherein the joined body is obtained by directly bonding a thermoplastic resin composition to a metal.

12、根据上述1所述的接合体,所述具有式I所示末端结构的末端改性聚酰胺树脂以96wt%硫酸为溶剂配制成0.01g/ml的聚酰胺树脂溶液,在25℃下测定的相对粘度ηr为1.1~5.0。12. The joined body according to the above 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I is formulated into a 0.01 g/ml polyamide resin solution using 96 wt% sulfuric acid as a solvent, and is measured at 25 ° C. The relative viscosity ηr is from 1.1 to 5.0.

13、根据上述1所述的接合体,所述具有式I所示末端结构的末端改性聚酰胺树脂用凝胶渗透色谱测得的重均分子量Mw的范围为10,000~400,000。13. The joined body according to the above 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I has a weight average molecular weight Mw measured by gel permeation chromatography in the range of 10,000 to 400,000.

14、根据上述1所述的接合体,所述具有式I所示末端结构的末端改性聚酰胺树脂的熔点为215℃以上。14. The joined body according to the above 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I has a melting point of 215 ° C or higher.

15、根据上述1所述的接合体,所述热塑性树脂组合物还包括无机填料,所述无机填料的含量为热塑性树脂组合物总重量的5~80wt%。15. The joined body according to the above 1, wherein the thermoplastic resin composition further comprises an inorganic filler in an amount of from 5 to 80% by weight based on the total mass of the thermoplastic resin composition.

16、一种上述1~15中任意一项所述接合体的制造方法,所述接合体由热塑性树脂组合物加热熔融后与预先放入模具的金属注塑成型。The method for producing a joined body according to any one of the above 1 to 15, wherein the joined body is heated and melted by a thermoplastic resin composition, and then injection-molded with a metal previously placed in a mold.

17、根据上述16所述的制造方法,所述接合体在注塑成型过程中,模具温度在60~180℃之间。17. The manufacturing method according to the above 16, wherein the joint body has a mold temperature of between 60 and 180 ° C during the injection molding process.

18、一种上述1~15中任意一项所述接合体的制造方法,其特征在于:所述接合体由热塑性树脂组合物的成型品和金属通过激光照射焊接得到。The method of producing a joined body according to any one of the above 1 to 15, wherein the joined body is obtained by welding a molded article of a thermoplastic resin composition and a metal by laser irradiation.

本发明的热塑性树脂组合物与金属的接合体,可以用于汽车部件,电子、电器产品部件,结构材料等。The bonded body of the thermoplastic resin composition of the present invention and metal can be used for automobile parts, electronic parts, electrical product parts, structural materials, and the like.

下面对上述发明内容进行详细说明:The above summary of the invention is described in detail below:

本发明接合体中所使用的热塑性树脂组合物包含具有式I所示末端结构的末端改性聚酰胺树脂,所述末端改性聚酰胺树脂的含量为热塑性树脂组合物总重量的5~100wt%,The thermoplastic resin composition used in the joined body of the present invention comprises a terminal-modified polyamide resin having an end structure represented by Formula I, and the content of the terminal-modified polyamide resin is 5 to 100% by weight based on the total weight of the thermoplastic resin composition. ,

-X-(R 1-O)n-R 2   式I -X-(R 1 -O)nR 2 Formula I

上述式I中,n为2~100的整数,R 1相同或不同,为碳原子数为2~10的亚烷基,R 2为碳原子数为1~30的烷基,-X-为-NH-、-O-、-C(=O)-、-NH-C(=O)-O-、-NH-C(=O)-NH-或-CH(OH)-CH 2-中的任一种;式I所示结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.05~20wt%。 In the above formula I, n is an integer of 2 to 100, R 1 is the same or different, and is an alkylene group having 2 to 10 carbon atoms, and R 2 is an alkyl group having 1 to 30 carbon atoms, and -X- is -NH-, -O-, -C(=O)-, -NH-C(=O)-O-, -NH-C(=O)-NH- or -CH(OH)-CH 2 - Any of the structures of Formula I in the terminally modified polyamide resin is 0.05 to 20% by weight based on the total weight of the terminally modified polyamide resin.

本发明中,当热塑性树脂组合物只含有末端改性聚酰胺树脂这一单一组份时,也将其定义为热塑性树脂组合物。In the present invention, when the thermoplastic resin composition contains only a single component of the terminal-modified polyamide resin, it is also defined as a thermoplastic resin composition.

本发明对所使用的末端改性聚酰胺树脂主链结构的种类没有特殊的限制。构成末端改性聚酰胺树脂主链结构的单体原料可以是二酸、二胺、氨基酸或内酰胺等,具体可以举出以下实例但不仅限于以下实例:6-氨基己酸、11-氨基十一酸、12-氨基十二酸或4-氨甲基苯甲酸等氨基酸;ε-己内酰胺、ω-十一内酰胺或ω-十二内酰胺等内酰胺;乙二胺、丙二胺、丁二胺、戊二胺、己二胺、庚二胺、辛二胺、壬二胺、癸二胺、十一烷二胺、十二烷二胺、十三烷二胺、十四烷二胺、十五烷二胺、十六烷二胺、十七烷二胺、十八烷二胺、十九烷二胺、二十烷二胺、2-甲基-1,5-戊二胺或2-甲基-1,8-辛二胺等脂肪族二胺;环己二胺或4,4′-二氨基二环己基甲烷、4,4’-亚甲基双(2-甲基环己胺)等脂环族二胺;苯二甲胺等芳香族二胺;草酸、琥珀酸、己二酸、辛二酸、壬二酸、癸二酸或十二烷二酸等脂肪族二羧酸;对苯二甲酸、间苯二甲酸、2-氯-1,4-苯二甲酸、2-甲基-1,4-苯二甲酸或5-甲基间苯二甲酸、5-磺酸钠间苯二甲酸等芳香族二羧酸;环己烷二甲酸等脂环族二羧酸。由二羧酸衍生的烷基二酯和二酰氯也同样可以作为构成聚酰胺树脂主链结构的单体原料被例举。本发明所使用的末端改性聚酰胺树脂的主链具体来说可以例举出由上述单体制备的均聚结构,也可以是由上述单体制备的共聚结构。The present invention is not particularly limited to the kind of the terminal-modified polyamide resin main chain structure to be used. The monomer raw material constituting the main chain structure of the terminal-modified polyamide resin may be a diacid, a diamine, an amino acid or a lactam, etc., and specific examples thereof are exemplified but are not limited to the following examples: 6-aminocaproic acid, 11-amino-10- An acid, an amino acid such as 12-aminododecanoic acid or 4-aminomethylbenzoic acid; a lactam such as ε-caprolactam, ω-undecanolactam or ω-laurolactam; ethylenediamine, propylenediamine, and butyl Diamine, pentanediamine, hexamethylenediamine, heptanediamine, octanediamine, decanediamine, decanediamine, undecanediamine, dodecanediamine, tridecanediamine, tetradecanediamine , pentadecanediamine, hexadecanediamine, heptadecanediamine, stearyldiamine, nonadecanediamine, eicosanediamine, 2-methyl-1,5-pentanediamine or An aliphatic diamine such as 2-methyl-1,8-octanediamine; cyclohexanediamine or 4,4'-diaminodicyclohexylmethane, 4,4'-methylenebis(2-methylcyclo) An alicyclic diamine such as hexylamine; an aromatic diamine such as xylylenediamine; an aliphatic oxalic acid, succinic acid, adipic acid, suberic acid, azelaic acid, sebacic acid or dodecanedioic acid Carboxylic acid; terephthalic acid, isophthalic acid, 2-chloro-1 An aromatic dicarboxylic acid such as 4-phthalic acid, 2-methyl-1,4-phthalic acid or 5-methylisophthalic acid or sodium 5-sulfonate isophthalic acid; cyclohexanedicarboxylic acid Alicyclic dicarboxylic acid. The alkyl diester and diacid chloride derived from a dicarboxylic acid are also exemplified as a monomer raw material constituting the main chain structure of the polyamide resin. The main chain of the terminal-modified polyamide resin used in the present invention may specifically be a homopolymer structure prepared from the above monomers, or a copolymerization structure prepared from the above monomers.

对于末端改性聚酰胺树脂的聚酰胺主链结构可以举出但不仅限于以下实例:聚己内酰胺(尼龙6)、聚十一内酰胺(尼龙11)、聚十二内酰胺(尼龙12)、聚己二酰己二胺(尼龙66)、聚己二酰丁二胺(尼龙46)、聚己二酰戊二胺(尼龙56)、聚癸二酰丁二胺(尼龙410)、 聚癸二酰戊二胺(尼龙510)、聚癸二酰己二胺(尼龙610)、聚十二酰己二胺(尼龙612)、聚癸二酰癸二胺(尼龙1010)、聚十二酰癸二胺(尼龙1012)、聚己内酰胺/聚己二酰己二胺共聚物(尼龙6/66)、聚己二酰间苯二甲胺(MXD6)、聚癸二酰间苯二甲胺(MXD10)、聚癸二酰对苯二甲胺(PXD10)、聚对苯二甲酰壬二胺(尼龙9T)、聚对苯二甲酰癸二胺(尼龙10T)、聚对苯二甲酰十一胺(尼龙11T)、聚对苯二甲酰十二胺(尼龙12T)、聚对苯二甲酰戊二胺/聚对苯二甲酰己二胺共聚物(尼龙5T/6T)、聚对苯二甲酰-2-甲基戊二胺/聚对苯二甲酰己二胺共聚物(尼龙M5T/6T)、聚己二酰己二胺/聚对苯二甲酰己二胺共聚物(尼龙66/6T)、聚己二酰己二胺/聚间苯二甲酰`二胺共聚物(尼龙66/6I)、聚己二酰己二胺/聚对苯二甲酰己二胺/聚间苯二甲酰己二胺共聚物(尼龙66/6T/6I)、聚对苯二甲酰4,4’-亚甲基双(2-甲基环己胺)(尼龙MACMT)、聚间苯二甲酰4,4’-亚甲基双(2-甲基环己胺)(尼龙MACMI)、聚十二酰4,4’-亚甲基双(2-甲基环己胺)(尼龙MACM12)、聚对苯二甲酰4,4’-亚甲基双环己胺(尼龙PACMT)、聚间苯二甲酰4,4’-亚甲基双环己胺(尼龙PACMI)、聚十二酰4,4’-亚甲基双环己胺(尼龙PACM12)或上述聚合物的共聚物。The polyamide backbone structure for the terminal-modified polyamide resin may be exemplified by, but not limited to, the following examples: polycaprolactam (nylon 6), polyundecanolactam (nylon 11), polydodelactam (nylon 12), poly Adipyl hexamethylenediamine (nylon 66), polyadipyl butanediamine (nylon 46), polyhexamethylene diamylamine (nylon 56), polysebacyl diamine (nylon 410), polyfluorene Acylpentanediamine (nylon 510), polyphthalamide (nylon 610), polydodecanoyldiamine (nylon 612), polysebacyldiamine (nylon 1010), polydodecanoylhydrazide Diamine (nylon 1012), polycaprolactam/polyhexamethylene adipamide (nylon 6/66), poly(m-xylylenediamine) (MXD6), poly(m-xylylenediamine) (MXD10) ), poly(p-xylylenediamine) (PXD10), poly(p-phenylene terephthalamide) (nylon 9T), poly(p-phenylene terephthalamide) (nylon 10T), poly(p-phenylene terephthalate) Monoamine (nylon 11T), poly(p-phenylene terephthalamide) (nylon 12T), poly(p-phenylene glutamine)/poly(p-phenylene terephthalamide) (nylon 5T/6T), poly Terephthaloyl-2-methylpentanediamine/poly(p-phenylene hexamethylenediamine copolymer (nylon M5T) /6T), polyhexamethylene adipamide/poly(p-phenylene hexamethylene diamine copolymer (nylon 66/6T), polyhexamethylene adipamide/poly(m-phenylene diamine) copolymer Nylon 66/6I), polyhexamethylene adipamide/poly(p-phenylene hexamethylenediamine/poly-m-phenylene hexamethylenediamine copolymer (nylon 66/6T/6I), polyparaphenylene 4,4'-methylenebis(2-methylcyclohexylamine) (nylon MACMT), polyisophthaloyl 4,4'-methylenebis(2-methylcyclohexylamine) (nylon MACMI ), polydodecanoyl 4,4'-methylenebis(2-methylcyclohexylamine) (nylon MACM12), polyparaphenyl 4,4'-methylenebiscyclohexylamine (nylon PACMT) , polyisophthaloyl 4,4'-methylenebiscyclohexylamine (nylon PACMI), polydodecanoyl 4,4'-methylenebiscyclohexylamine (nylon PACM12) or a copolymer of the above polymers.

为了得到结晶性较好的末端改性聚酰胺树脂,上述末端改性聚酰胺树脂的聚酰胺主链结构优选聚己内酰胺(尼龙6)、聚己二酰己二胺(尼龙66)、聚己二酰戊二胺(尼龙56)、聚癸二酰丁二胺(尼龙410)、聚癸二酰戊二胺(尼龙510)、聚癸二酰己二胺(尼龙610)、 聚对苯二甲酰壬二胺(尼龙9T)或聚对苯二甲酰癸二胺(尼龙10T)。In order to obtain a terminally modified polyamide resin having good crystallinity, the polyamide main chain structure of the above terminal modified polyamide resin is preferably polycaprolactam (nylon 6), polyhexamethylene adipamide (nylon 66), polyhexamethylene. Acetyl pentane diamine (nylon 56), polysebacyl diamine (nylon 410), polysebacyl pentane diamine (nylon 510), polyphthalamide (nylon 610), polyparaphenylene A hydrazide diamine (nylon 9T) or a poly(p-phenylene terephthalamide) (nylon 10T).

所述末端改性聚酰胺树脂的主链结构可以由上述主链结构中的一种单独构成,也可以由上述主链结构中的两种以上组合构成。本发明所使用的末端改性聚酰胺树脂的主链重复单元优选80mol%以上由上述例举的单体原料由来的结构单元构成(以聚酰胺主链结构的重复单元数为100mol%)。考虑到耐热性和结晶性,优选为90mol%以上,最优选为100mol%。The main chain structure of the terminal-modified polyamide resin may be composed of one of the above-described main chain structures, or may be composed of two or more of the above-described main chain structures. The main chain repeating unit of the terminal-modified polyamide resin used in the present invention is preferably composed of 80 mol% or more of the structural unit derived from the above-mentioned monomer raw material (the number of repeating units of the polyamide main chain structure is 100 mol%). In view of heat resistance and crystallinity, it is preferably 90 mol% or more, and most preferably 100 mol%.

本发明所使用的末端改性聚酰胺树脂通过在聚酰胺末端引入式I所示柔性聚醚结构,提高了分子链整体的运动性,从而降低了熔融粘度。因此,当含有末端改性聚酰胺树脂的热塑性树脂在熔融状态下与金属接触时,树脂熔体更有效的浸润入金属表面微小的孔洞内,从而能够更好的与金属表面紧密接合。The terminally modified polyamide resin used in the present invention increases the mobility of the entire molecular chain by introducing a flexible polyether structure represented by Formula I at the terminal of the polyamide, thereby lowering the melt viscosity. Therefore, when the thermoplastic resin containing the terminal-modified polyamide resin is brought into contact with the metal in a molten state, the resin melt is more effectively infiltrated into minute pores of the metal surface, so that it can be better bonded to the metal surface.

上述式I中,n为2~100的整数。n小于2时,热塑性树脂组合物熔融粘度降低效果变差。优选n为4以上,进一步优选n为8以上,最优选n为16以上。另一方面,n大于100时,式I所示末端结构的耐热性变差。优选n为70以下,进一步优选n为50以下,最优选n为25以下。In the above formula I, n is an integer of from 2 to 100. When n is less than 2, the effect of lowering the melt viscosity of the thermoplastic resin composition is deteriorated. Preferably, n is 4 or more, and further preferably n is 8 or more, and most preferably n is 16 or more. On the other hand, when n is more than 100, the heat resistance of the terminal structure represented by Formula I is deteriorated. Preferably, n is 70 or less, more preferably n is 50 or less, and most preferably n is 25 or less.

上述式I中,R 1相同或不同,为碳原子数2~10的亚烷基。R 1具体可以举出-CH 2-CH 2-、-CH 2-CH 2-CH 2-、-CH(CH 3)-CH 2-、-CH 2-CH 2-CH 2-CH 2-、-CH 2-CH 2-CH 2-CH 2-CH 2-或-CH 2-CH 2-CH 2-CH 2-CH 2-CH 2-等。考虑到与聚酯主链结构的亲和性,优选R 1为碳原子数2~6的亚烷基,进一步优选碳原子数2~4的亚烷 基。R 1可以由不同的亚烷基组合而成,优选为-CH 2-CH 2-、-CH 2-CH 2-CH 2-、-CH(CH 3)-CH 2-中的至少一种。 In the above formula I, R 1 is the same or different and is an alkylene group having 2 to 10 carbon atoms. Specific examples of R 1 include -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -, -CH(CH 3 )-CH 2 -, -CH 2 -CH 2 -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 - or -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -. In view of affinity with the polyester main chain structure, R 1 is preferably an alkylene group having 2 to 6 carbon atoms, and more preferably an alkylene group having 2 to 4 carbon atoms. R 1 may be a combination of different alkylene groups, preferably at least one of -CH 2 -CH 2 -, -CH 2 -CH 2 -CH 2 -, -CH(CH 3 )-CH 2 -.

上述式I中,R 2为碳原子数1~30的烷基。R 2中碳原子数越少,其与聚酰胺主链结构的亲和性也就越高,因此R 2优选碳原子数为1~20的烷基,进一步优选碳原子数为1~10的烷基,更进一步优选碳原子数为1~5的烷基,最优选甲基。 In the above formula I, R 2 is an alkyl group having 1 to 30 carbon atoms. The smaller the number of carbon atoms in R 2 , the higher the affinity with the polyamide main chain structure. Therefore, R 2 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group is more preferably an alkyl group having 1 to 5 carbon atoms, and most preferably a methyl group.

上述式I中,-X-为-NH-、-O-、-C(=O)-、-NH-C(=O)-O-、-NH-C(=O)-NH-或-CH(OH)-CH 2-中的任一种,为了使本发明所使用的热塑性树脂组合物具有较低的熔融粘度,聚醚末端与聚酰胺主链的亲和力较高为好,-X-优选-NH-。 In the above formula I, -X- is -NH-, -O-, -C(=O)-, -NH-C(=O)-O-, -NH-C(=O)-NH- or - Any one of CH(OH)-CH 2 -, in order to make the thermoplastic resin composition used in the present invention have a lower melt viscosity, the affinity of the polyether end to the polyamide main chain is preferably higher, -X- Preferred is -NH-.

本发明所使用的末端改性聚酰胺树脂中式I所示末端结构的含量为末端改性聚酰胺树脂总重量的0.05~20wt%,考虑到降低熔融粘度、提高成型加工性的目的,该末端结构在所述末端改性聚酰胺树脂中的含量优选0.1wt%以上,进一步优选0.5wt%以上,更进一步优选1.5wt%以上,最优选2wt%以上;另一方面,通过使式I所示末端结构的含量为20wt%以下,可以使末端改性聚酰胺树脂的结晶性和机械性能得到更好的保持,优选为15wt%以下,进一步优选为10wt%以下,更进一步优选为5wt%以下。在这里,上述式I所示的聚醚链段相对于所述末端改性聚酰胺树脂的含量(wt%)通过 1H-NMR(核磁氢谱)测试得到。 The terminal modified polyamide resin used in the present invention has a terminal structure represented by the formula I in an amount of 0.05 to 20% by weight based on the total weight of the terminal-modified polyamide resin, and the terminal structure is considered for the purpose of lowering the melt viscosity and improving moldability. The content in the terminally modified polyamide resin is preferably 0.1% by weight or more, further preferably 0.5% by weight or more, still more preferably 1.5% by weight or more, and most preferably 2% by weight or more; on the other hand, by making the terminal of Formula I The content of the structure is 20% by weight or less, and the crystallinity and mechanical properties of the terminal-modified polyamide resin can be more preferably maintained, and are preferably 15% by weight or less, further preferably 10% by weight or less, and still more preferably 5% by weight or less. Here, the content (wt%) of the polyether segment represented by the above formula I with respect to the terminal-modified polyamide resin was obtained by 1 H-NMR (nuclear magnetic resonance) test.

本发明中具有式I所示末端结构的末端改性聚酰胺树脂在以96wt%浓硫酸为溶剂,配制成浓度为0.01g/ml的溶液时,在25℃下 测得的相对粘度ηr下优选为1.1~5.0。ηr小于1.1时,热塑性树脂组合物力学性能和金属接合性能有下降的趋势。优选ηr在1.2以上,进一步优选在1.4以上。另一方面,ηr高于5.0时,分子量过高,因而熔融粘度过高导致金属接合性能有下降的趋势,优选ηr在4以下,进一步优选ηr在3以下。The terminal modified polyamide resin having the terminal structure represented by Formula I in the present invention is preferably prepared at a concentration of 0.01 g/ml in a solution of 96 wt% concentrated sulfuric acid as a solvent at a relative viscosity ηr measured at 25 ° C. It is 1.1 to 5.0. When ηr is less than 1.1, the mechanical properties and metal bonding properties of the thermoplastic resin composition tend to decrease. Preferably, ηr is 1.2 or more, and more preferably 1.4 or more. On the other hand, when ηr is more than 5.0, the molecular weight is too high, and thus the melt viscosity is too high, which tends to lower the metal bonding performance. ηr is preferably 4 or less, and more preferably ηr is 3 or less.

本发明中具有式I所示末端结构的末端改性聚酰胺树脂的重均分子量(Mw)优选在10,000以上。当Mw达到10,000以上时,机械性能及金属接合性能提高。Mw进一步优选20,000以上,更进一步优选30,000以上。另外,Mw优选40万以下。当Mw为40万以下时,熔融粘度较低,在制造接合体的过程中,树脂熔体能充分浸润金属表面微小的孔洞,从而使得热塑性树脂组合物与金属表面紧密接合,提高金属接合性能。Mw进一步优选30万以下,更进一步优选25万以下。重均分子量(Mw)可以通过凝胶渗透色谱(GPC)测定。The weight-average molecular weight (Mw) of the terminal-modified polyamide resin having the terminal structure represented by Formula I in the present invention is preferably 10,000 or more. When the Mw reaches 10,000 or more, the mechanical properties and metal bonding properties are improved. Mw is further preferably 20,000 or more, and still more preferably 30,000 or more. Further, Mw is preferably 400,000 or less. When the Mw is 400,000 or less, the melt viscosity is low, and during the process of manufacturing the joined body, the resin melt can sufficiently wet the minute holes of the metal surface, thereby bringing the thermoplastic resin composition into close contact with the metal surface, and improving the metal bonding property. Mw is more preferably 300,000 or less, still more preferably 250,000 or less. The weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC).

本发明旨在得到耐热性好的接合体,因此具有式I所示末端结构的末端改性聚酰胺树脂的熔点(Tm)以215℃以上为好,进一步优选末端改性聚酰胺树脂的熔点(Tm)在218℃以上。一般来说通过共聚向聚酰胺树脂引入柔性结构会使聚酰胺树脂的熔点下降,但本发明通过选择性的在树脂末端导入特定结构的聚醚,使得与不含有聚醚末端结构的聚酰胺相比,导入了聚醚末端的聚酰胺树脂熔点的下降控制在最小的范围。熔点下降优选不超过5℃,进一步优选熔点下降不超过3℃。这里所述的聚酰胺树脂的熔点是由示差扫描量热仪(DSC)测定得到:将聚酰胺树脂精确称量5~7mg,在氮气气氛下以20℃/min 的升温速率从20℃开始升温至比所出现的吸热峰的温度T0高出30℃的温度,在此温度下恒温2min,随后以20℃/min的降温速率降温至20℃后再次以20℃/min的升温速率升温至比T0高出30℃的温度,将第二次升温过程中出现的吸热峰的温度定义为熔点(Tm)。The present invention is intended to obtain a joined body having good heat resistance, and therefore the melting point (Tm) of the terminal-modified polyamide resin having the terminal structure represented by Formula I is preferably 215 ° C or higher, and further preferably the melting point of the terminal-modified polyamide resin. (Tm) is above 218 °C. In general, the introduction of a flexible structure into a polyamide resin by copolymerization causes a decrease in the melting point of the polyamide resin, but the present invention selectively introduces a polyether having a specific structure at the end of the resin to a polyamide phase which does not contain a polyether end structure. The decrease in the melting point of the polyamide resin into which the polyether end is introduced is controlled to the minimum. The melting point is preferably not more than 5 ° C, and further preferably the melting point is not more than 3 ° C. The melting point of the polyamide resin described herein is determined by differential scanning calorimetry (DSC): the polyamide resin is accurately weighed 5 to 7 mg, and the temperature is raised from 20 ° C at a heating rate of 20 ° C / min under a nitrogen atmosphere. Up to a temperature of 30 ° C higher than the temperature T0 of the endothermic peak, at this temperature for 2 min, then cooling to 20 ° C at a temperature drop rate of 20 ° C / min, and then heating up to a temperature increase rate of 20 ° C / min to The temperature of the endothermic peak appearing during the second temperature rise is defined as the melting point (Tm) at a temperature 30 ° C higher than T0.

本发明使用的热塑性树脂组合物中,除末端改性聚酰胺树脂以外还可以添加其他种类的聚合物、填料以及各种添加剂进行复配。In the thermoplastic resin composition used in the present invention, other kinds of polymers, fillers, and various additives may be added in addition to the terminal-modified polyamide resin.

上述热塑性树脂组合物中其他种类的聚合物可以举出但不仅限于以下例子:聚乙烯、聚丙烯等聚烯烃;烯烃和/或共轭二烯烃化合物聚合得到的共聚体等改性聚烯烃;聚酯、聚碳酸酯、聚苯醚、聚苯硫醚、液晶聚合物、聚砜、聚醚砜、ABS树脂、SAN树脂、聚苯乙烯、本发明的末端未改性的聚酰胺树脂以外的聚酰胺树脂等。The other types of polymers in the thermoplastic resin composition may be, but not limited to, the following examples: polyolefins such as polyethylene and polypropylene; modified polyolefins such as copolymers obtained by polymerizing olefins and/or conjugated diene compounds; Ester, polycarbonate, polyphenylene ether, polyphenylene sulfide, liquid crystal polymer, polysulfone, polyethersulfone, ABS resin, SAN resin, polystyrene, polyunsity other than the terminal unmodified polyamide resin of the present invention Amide resin and the like.

作为上述其他种类的聚合物,为了提高本发明使用的热塑性树脂组合物所得到的成型品抗冲击性并降低收缩率,优选使用烯烃和/或共轭二烯烃化合物聚合得到的聚合物(或共聚物)等改性聚烯烃等抗冲剂。As the above-mentioned other kinds of polymers, in order to improve the impact resistance of the molded article obtained by the thermoplastic resin composition used in the present invention and to reduce the shrinkage ratio, it is preferred to use a polymer obtained by polymerizing an olefin and/or a conjugated diene compound (or copolymerization). An impact agent such as a modified polyolefin.

上述聚合物(或共聚物)可以举出但不仅限于以下实例:乙烯系共聚物、共轭二烯烃系聚合物或共轭二烯烃-芳香族乙烯共聚物等。The polymer (or copolymer) may, but not limited to, the following examples: an ethylene-based copolymer, a conjugated diene-based polymer, or a conjugated diene-aromatic ethylene copolymer.

乙烯系共聚物是指乙烯和其他单体的共聚物。和乙烯共聚的其他单体可以举出但不仅限于以下实例:碳原子数3以上的α-烯烃、非共轭二烯烃、乙酸乙烯酯、乙烯醇、α,β-不饱和羧酸或其衍生物。上述单体也可以选择2种以上与乙烯进行共聚。The ethylene-based copolymer means a copolymer of ethylene and another monomer. Other monomers copolymerized with ethylene may be exemplified by, but not limited to, the following examples: an α-olefin having 3 or more carbon atoms, a non-conjugated diene, a vinyl acetate, a vinyl alcohol, an α,β-unsaturated carboxylic acid or a derivative thereof. Things. Two or more kinds of the above monomers may be copolymerized with ethylene.

碳原子数3以上的α-烯烃可以举出但不仅限于以下实例:丙烯、 1-丁烯、1-戊烯或3-甲基-1-戊烯,优选丙烯或1-丁烯。非共轭二烯烃可以举出但不仅限于以下实例:5-亚甲基-2-降冰片烯、5-亚乙基-2-降冰片烯、5-乙烯基-2-降冰片烯、5-丙烯基-2-降冰片烯、5-异丙烯基-2-降冰片烯、5-丁烯基-2-降冰片烯、5-(2-甲基-2-丁烯基)-2-降冰片烯、5-(2-乙基-2-丁烯基)-2-降冰片烯或5-甲基-5-乙烯基降冰片烯等降冰片烯化合物;双环戊二烯、甲基四氢茚、四氢茚、1,5-环辛二烯、1,4-己二烯、6-甲基-1,5-庚二烯或11-十三碳二烯等,优选5-亚甲基-2-降冰片烯、5-亚乙基-2-降冰片烯、双环戊二烯或1,4-己二烯。α,β-不饱和羧酸可以举出但不仅限于以下实例:丙烯酸、甲基丙烯酸、乙基丙烯酸、2-丁烯酸、马来酸、富马酸、衣康酸、柠康酸或丁烯二酸等。α,β-不饱和羧酸的衍生物可以举出但不限于以下实例:上述α,β-不饱和羧酸的烷基酯、芳基酯、甘油酯、酸酐或酰亚胺等。The α-olefin having 3 or more carbon atoms may, but not limited to, the following examples: propylene, 1-butene, 1-pentene or 3-methyl-1-pentene, preferably propylene or 1-butene. The non-conjugated diene may be exemplified by, but not limited to, the following examples: 5-methylene-2-norbornene, 5-ethylidene-2-norbornene, 5-vinyl-2-norbornene, 5 -propenyl-2-norbornene, 5-isopropenyl-2-norbornene, 5-butenyl-2-norbornene, 5-(2-methyl-2-butenyl)-2 -norbornene compound such as norbornene, 5-(2-ethyl-2-butenyl)-2-norbornene or 5-methyl-5-vinylnorbornene; dicyclopentadiene, A Tetrahydroindole, tetrahydroanthracene, 1,5-cyclooctadiene, 1,4-hexadiene, 6-methyl-1,5-heptadiene or 11-tridecadiene, etc., preferably 5 -methylene-2-norbornene, 5-ethylidene-2-norbornene, dicyclopentadiene or 1,4-hexadiene. The α,β-unsaturated carboxylic acid may be exemplified by, but not limited to, the following examples: acrylic acid, methacrylic acid, ethacrylic acid, 2-butenoic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid or butyl Oleic acid and the like. The derivative of the α,β-unsaturated carboxylic acid may, but not limited to, the following examples: an alkyl ester, an aryl ester, a glyceride, an acid anhydride or an imide of the above α,β-unsaturated carboxylic acid.

共轭二烯烃系聚合物指的是由至少一种共轭二烯烃聚合得到的聚合物。这里所述的共轭二烯烃可以举出但不仅限于以下实例:1,3-丁二烯、异戊二烯(2-甲基-1,3-丁二烯)、2,3-二甲基-1,3-丁二烯或1,3-戊二烯等。上述共轭二烯烃也可以选择2种以上进行共聚。另外,所述聚合物的不饱和键可以通过氢化进行部分或完全的还原。The conjugated diene polymer refers to a polymer obtained by polymerizing at least one conjugated diene. The conjugated diene described herein may be exemplified by, but not limited to, the following examples: 1,3-butadiene, isoprene (2-methyl-1,3-butadiene), 2,3-dimethyl Base-1,3-butadiene or 1,3-pentadiene. The conjugated diene may be copolymerized in two or more types. Additionally, the unsaturated bonds of the polymer can be partially or completely reduced by hydrogenation.

共轭二烯烃-芳香族乙烯共聚物指的是共轭二烯烃和芳香族乙烯的共聚物,可以是嵌段共聚物,也可以是无规共聚物。共轭二烯烃可以举出的实例与上述制备共轭二烯烃系聚合物的原料相同,优选1,3-丁二烯和异戊二烯。芳香族乙烯可以举出以下实例:苯乙烯、邻甲基苯乙烯、间甲基苯乙烯、对甲基苯乙烯、1,3-二甲基苯乙烯或乙 烯基萘等,优选苯乙烯。另外,共轭二烯烃-芳香族乙烯共聚物的除芳香环的双键以外的不饱和键也可以通过氢化部分或者完全的还原。The conjugated diene-aromatic ethylene copolymer refers to a copolymer of a conjugated diene and an aromatic ethylene, and may be a block copolymer or a random copolymer. Examples of the conjugated diene may be the same as those of the above-mentioned conjugated diene-based polymer, and 1,3-butadiene and isoprene are preferable. The aromatic vinyl may, for example, be styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 1,3-dimethylstyrene or vinylnaphthalene or the like, preferably styrene. Further, the unsaturated bond other than the double bond of the aromatic ring of the conjugated diene-aromatic ethylene copolymer may be partially or completely reduced by hydrogenation.

抗冲剂具体可以举出:乙烯/丙烯共聚物、乙烯/1-丁烯共聚物、乙烯/1-己烯共聚物、乙烯/丙烯/双环戊二烯共聚物、乙烯/丙烯/5-亚乙基-2-降冰片烯共聚物、未加氢或加氢苯乙烯/异戊二烯/苯乙烯三嵌段共聚物、未加氢或加氢苯乙烯/丁二烯/苯乙烯三嵌段共聚物、乙烯/甲基丙烯酸共聚物或者共聚物中部分或者全部羧酸基团与钠、锂、钾、锌或钙形成的盐、乙烯/丙烯酸甲酯共聚物、乙烯/丙烯酸乙酯共聚物、乙烯/甲基丙烯酸甲酯共聚物、乙烯/丙烯酸乙酯-g-马来酸酐共聚物(此处“g”表示接枝,下同)、乙烯/丙烯酸甲酯-g-马来酸酐共聚物、乙烯/丙烯酸乙酯-g-马来酰亚胺共聚物、乙烯/丙烯酸乙酯-g-N-苯基马来酰亚胺共聚物或者所述共聚物的部分皂化物、乙烯/甲基丙烯酸缩水甘油酯共聚物、乙烯/乙酸乙烯酯/甲基丙烯酸缩水甘油酯共聚物、乙烯/甲基丙烯酸甲酯/甲基丙烯酸缩水甘油酯共聚物、乙烯/丙烯酸缩水甘油酯共聚物、乙烯/乙酸乙烯酯/丙烯酸缩水甘油酯共聚物、乙烯/缩水甘油醚共聚物、乙烯/丙烯-g-马来酸酐共聚物、乙烯/丙烯-g-马来酸酐共聚物、乙烯/丁烯-1-g-马来酸酐共聚物、乙烯/丙烯/1,4-己二烯-g-马来酸酐共聚物、乙烯/丙烯/双环戊二烯-g-马来酸酐共聚物、乙烯/丙烯/2,5-降冰片二烯-g-马来酸酐共聚物、乙烯/丙烯-g-N-苯基马来酰亚胺共聚物、乙烯/丁烯-1-g-N-苯基马来酰亚胺共聚物、氢化(苯乙烯/丁二烯/苯乙烯-g-马来酸酐)共聚物、氢化(苯乙烯/异戊二烯/苯乙烯-g-马来酸酐)共聚物、乙烯/丙烯-g-甲基丙烯酸缩水甘油酯共 聚物、乙烯/丁烯-1-g-甲基丙烯酸缩水甘油酯共聚物、乙烯/丙烯/1,4-己二烯-g-甲基丙烯酸缩水甘油酯共聚物、乙烯/丙烯/双环戊二烯-g-甲基丙烯酸缩水甘油酯共聚物、氢化(苯乙烯/丁二烯/苯乙烯-g-甲基丙烯酸缩水甘油酯)共聚物、尼龙12/聚四氢呋喃共聚物、尼龙12/聚丙二醇共聚物、聚对苯二甲酸丁二酯/聚四氢呋喃共聚物或聚对苯二甲酸丁二酯/聚丙二醇共聚物等。上述共聚物优选乙烯/甲基丙烯酸共聚物以及共聚物中部分或全部羧酸基团与钠、锂、钾、锌或钙形成的盐、乙烯/丙烯-g-马来酸酐共聚物、乙烯/丁烯-1-g-马来酸酐共聚物。Specific examples of the impact agent include an ethylene/propylene copolymer, an ethylene/1-butene copolymer, an ethylene/1-hexene copolymer, an ethylene/propylene/dicyclopentadiene copolymer, and an ethylene/propylene/5-Asian Base-2-norbornene copolymer, unhydrogenated or hydrogenated styrene/isoprene/styrene triblock copolymer, unhydrogenated or hydrogenated styrene/butadiene/styrene triblock a salt of a part or all of a carboxylic acid group of a copolymer, an ethylene/methacrylic acid copolymer or a copolymer with sodium, lithium, potassium, zinc or calcium, an ethylene/methyl acrylate copolymer, an ethylene/ethyl acrylate copolymer , ethylene / methyl methacrylate copolymer, ethylene / ethyl acrylate - g - maleic anhydride copolymer (here "g" means grafting, the same below), ethylene / methyl acrylate - g - maleic anhydride copolymerization , ethylene/ethyl acrylate-g-maleimide copolymer, ethylene/ethyl acrylate-gN-phenylmaleimide copolymer or partial saponification of the copolymer, ethylene/methacrylic acid Glycidyl ester copolymer, ethylene/vinyl acetate/glycidyl methacrylate copolymer, ethylene/methyl methacrylate /glycidyl methacrylate copolymer, ethylene/glycidyl acrylate copolymer, ethylene/vinyl acetate/glycidyl acrylate copolymer, ethylene/glycidyl ether copolymer, ethylene/propylene-g-maleic anhydride copolymerization , ethylene/propylene-g-maleic anhydride copolymer, ethylene/butene-1-g-maleic anhydride copolymer, ethylene/propylene/1,4-hexadiene-g-maleic anhydride copolymer, ethylene /propylene/dicyclopentadiene-g-maleic anhydride copolymer, ethylene/propylene/2,5-norbornadiene-g-maleic anhydride copolymer, ethylene/propylene-gN-phenylmaleimide Copolymer, ethylene/butene-1-gN-phenylmaleimide copolymer, hydrogenated (styrene/butadiene/styrene-g-maleic anhydride) copolymer, hydrogenated (styrene/isoprene) Diene/styrene-g-maleic anhydride) copolymer, ethylene/propylene-g-glycidyl methacrylate copolymer, ethylene/butene-1-g-glycidyl methacrylate copolymer, ethylene/ Propylene/1,4-hexadiene-g-glycidyl methacrylate copolymer, ethylene/propylene/dicyclopentadiene-g-glycidyl methacrylate copolymer, hydrogenation (styrene/butadiene) Ethylene/styrene-g-glycidyl methacrylate copolymer, nylon 12/polytetrahydrofuran copolymer, nylon 12/polypropylene glycol copolymer, polybutylene terephthalate/polytetrahydrofuran copolymer or polyparaphenylene Butylene dicarboxylate/polypropylene glycol copolymer and the like. The above copolymer is preferably an ethylene/methacrylic acid copolymer and a salt of a part or all of a carboxylic acid group of the copolymer with sodium, lithium, potassium, zinc or calcium, an ethylene/propylene-g-maleic anhydride copolymer, ethylene/ Butene-1-g-maleic anhydride copolymer.

上述热塑性树脂组合物中除末端改性聚酯树脂以外的聚合物可以单独添加,也可以选取两种以上配合添加。其添加量优选为0wt%以上,80wt%以下(以热塑性树脂组合物为100wt%),通过将添加量控制在上述范围,能够使热塑性树脂组合物熔融时的流动性更好。进一步优选60wt%以下,更进一步优选50wt%以下。The polymer other than the terminal-modified polyester resin in the above thermoplastic resin composition may be added singly or in combination of two or more kinds. The addition amount is preferably 0% by weight or more and 80% by weight or less (100% by weight of the thermoplastic resin composition), and by controlling the amount of addition to the above range, the fluidity at the time of melting the thermoplastic resin composition can be further improved. It is further preferably 60% by weight or less, and still more preferably 50% by weight or less.

本发明的热塑性树脂组合物中还可以含有填料,填料可以举出但不仅限于以下实例:玻璃纤维、碳纤维、钛钾酸晶须、氧化锌晶须、硼酸铝晶须、芳香族聚酰胺纤维、氧化铝纤维、碳化硅纤维、陶瓷纤维、石棉纤维、石膏纤维或金属纤维等纤维状无机或有机填料;硅灰石、沸石、绢云母、高岭土、云母、滑石、粘土、叶蜡石、膨润土、蒙脱土、石棉、硅酸盐、氧化铝、氧化硅、氧化镁、氧化锆、氧化钛、氧化铁、碳酸钙、碳酸镁、白云石、硫酸钙、硫酸钡、氢氧化镁、氢氧化钙、氢氧化铝、玻璃微珠、陶瓷微珠、氮化硼、碳化硅或二氧化硅等非纤维状无机填料。上述填料可以为中空的,另外,上述填料也 可经异氰酸系化合物、有机硅烷化合物、有机钛酸盐系化合物、有机硼烷化合物或环氧化合物等偶联剂处理。上述蒙脱土也可以是片层间离子通过有机铵盐进行阳离子交换后的有机化蒙脱土。考虑到热塑性树脂组合物的机械性能提高、成形收缩率降低,上述填料优选纤维状的无机填料,进一步优选玻璃纤维或碳纤维。另外,上述填料可以单独添加,也可以选取两种以上配合添加。The thermoplastic resin composition of the present invention may further contain a filler, and the filler may be exemplified by, but not limited to, the following examples: glass fiber, carbon fiber, titanic acid whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, Fibrous inorganic or organic fillers such as alumina fibers, silicon carbide fibers, ceramic fibers, asbestos fibers, gypsum fibers or metal fibers; wollastonite, zeolite, sericite, kaolin, mica, talc, clay, pyrophyllite, bentonite, Montmorillonite, asbestos, silicate, alumina, silica, magnesia, zirconia, titania, iron oxide, calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, magnesium hydroxide, calcium hydroxide Non-fibrous inorganic fillers such as aluminum hydroxide, glass microspheres, ceramic microbeads, boron nitride, silicon carbide or silicon dioxide. The filler may be hollow, and the filler may be treated with a coupling agent such as an isocyanate compound, an organosilane compound, an organic titanate compound, an organoborane compound or an epoxy compound. The above montmorillonite may also be an organic montmorillonite obtained by cation exchange of interlamellar ions through an organic ammonium salt. In view of improvement in mechanical properties of the thermoplastic resin composition and reduction in mold shrinkage, the above filler is preferably a fibrous inorganic filler, and more preferably glass fiber or carbon fiber. Further, the above fillers may be added singly or in combination of two or more.

上述填料在热塑性树脂组合物中的含量优选为热塑性树脂组合物总重量的5~80wt%,当填料的添加量在5wt%以上时,由于热塑性树脂组合物收缩率减少,在制造接合体过程中,热塑性树脂组合物熔体与金属接触并冷却后,热塑性树脂组合物与金属的界面剥离被抑制,从而使得热塑性树脂组合物与金属的接合性增强,进一步优选填料添加量为热塑性树脂组合物总重量的10wt%以上,更进一步优选20wt%以上,最优选30wt%以上。另一方面,填料的添加量在80wt%以下时,热塑性树脂组合物熔体具有良好的流动性,进一步优选60wt%以下,更进一步优选50wt%以下。The content of the above filler in the thermoplastic resin composition is preferably from 5 to 80% by weight based on the total weight of the thermoplastic resin composition, and when the filler is added in an amount of 5% by weight or more, the shrinkage ratio of the thermoplastic resin composition is reduced, and the joint body is produced. After the melt of the thermoplastic resin composition is brought into contact with the metal and cooled, the interface peeling of the thermoplastic resin composition with the metal is suppressed, so that the bondability of the thermoplastic resin composition to the metal is enhanced, and it is further preferred that the filler is added in a total amount of the thermoplastic resin composition. The weight is 10% by weight or more, more preferably 20% by weight or more, and most preferably 30% by weight or more. On the other hand, when the amount of the filler added is 80% by weight or less, the melt of the thermoplastic resin composition has good fluidity, more preferably 60% by weight or less, still more preferably 50% by weight or less.

本发明使用的热塑性树脂组合物中,还可以含有各种添加剂。例如,抗氧化剂和热稳定剂(受阻酚系、对苯二酚系、亚磷酸酯系、磷酸酯系及其取代产物、卤化铜、碘化合物等)、耐候剂(间苯二酚系、水杨酸系、苯并三唑系、二苯基甲酮系或位阻胺系等)、脱模剂和润滑剂(脂肪醇、脂肪族酰胺、脂肪族二酰胺或二脲或聚乙烯蜡等)、颜料(硫化钙、酞菁或炭黑等)、染料(苯胺黑等)、塑化剂(对羟基苯甲酸正辛酯或N-丁基苯磺酰胺)、抗静电剂(烷基硫酸盐型阴离子 系抗静电剂、4级铵盐型阳离子系抗静电剂、聚氧乙烯脱水山梨糖醇单硬脂酸酯等非离子系抗静电剂或三甲基甘氨酸系两性抗静电剂)、阻燃剂(三聚氰胺氰脲酸盐,氢氧化镁、氢氧化铝等氢氧化物,聚乙烯磷酸铵,溴化聚苯乙烯、溴化聚苯醚、溴化聚碳酸酯、溴化环氧树脂等溴系阻燃剂或上述溴系阻燃剂与三氧化二锑的组合物)。上述添加剂可以单独使用,也可以选择2种以上复配。The thermoplastic resin composition used in the present invention may further contain various additives. For example, antioxidants and heat stabilizers (hindered phenols, hydroquinones, phosphites, phosphates and substituted products, copper halides, iodine compounds, etc.), weathering agents (resorcinol, water) Salicylic acid, benzotriazole, diphenyl ketone or sterically hindered amines, mold release agents and lubricants (fatty alcohols, aliphatic amides, aliphatic diamides or diureas or polyethylene waxes, etc.) ), pigment (calcium sulfide, phthalocyanine or carbon black, etc.), dye (aniline black, etc.), plasticizer (n-octyl p-hydroxybenzoate or N-butylbenzenesulfonamide), antistatic agent (alkyl sulfate) a salt type anionic antistatic agent, a 4-stage ammonium salt type cationic antistatic agent, a nonionic antistatic agent such as polyoxyethylene sorbitan monostearate or a trimethylglycine amphoteric antistatic agent) Flame retardant (melamine cyanurate, hydroxide such as magnesium hydroxide or aluminum hydroxide, ammonium polyphosphate, brominated polystyrene, brominated polyphenylene ether, brominated polycarbonate, brominated epoxy resin A bromine-based flame retardant or a combination of the above bromine-based flame retardant and antimony trioxide). These additives may be used singly or in combination of two or more.

本发明旨在获得热塑性树脂组合物与金属间具有优良接合性能的接合体,因此优选使用包含具有式I所示末端结构的末端改性聚酰胺树脂的热塑性树脂组合物与铝接合的拉伸剪切强度为10MPa以上的热塑性树脂组合物。所述拉伸剪切强度定义为根据IS019095规定的接合体试验样条(图1)在5mm/min的拉伸速度下测得的值。这里使用的铝的表面具有平均孔径为10~100nm的微孔结构,铝表面的凹凸结构可以通过电子扫描显微镜观察。进一步优选拉伸剪切强度15MPa以上,最优选拉伸剪切强度为20MPa以上的热塑性树脂组合物,这里所述的热塑性树脂组合物与金属接合的拉伸剪切强度根据ISO19095制得试验样条,在5mm/min的拉伸速度下测试得到。The present invention is intended to obtain a joined body having excellent bonding properties between a thermoplastic resin composition and a metal, and therefore it is preferred to use a stretched shear bonded to aluminum using a thermoplastic resin composition comprising a terminally modified polyamide resin having an end structure of the formula I. A thermoplastic resin composition having a shear strength of 10 MPa or more. The tensile shear strength is defined as a value measured at a tensile speed of 5 mm/min according to the joint test strip (Fig. 1) specified in IS019095. The surface of the aluminum used herein has a microporous structure having an average pore diameter of 10 to 100 nm, and the uneven structure of the aluminum surface can be observed by an electron scanning microscope. Further preferably, the tensile shear strength is 15 MPa or more, and most preferably the thermoplastic resin composition having a tensile shear strength of 20 MPa or more, and the tensile shear strength of the thermoplastic resin composition bonded to the metal herein is prepared according to ISO 19095. It was tested at a tensile speed of 5 mm/min.

本发明中的接合体可以由热塑性树脂组合物与金属直接接合得到,也就是热塑性树脂组合物与金属之间不通过其他粘接材料等中间层也可以直接进行接合。所述金属可以是经过表面处理,也可以是没有经过表面处理的,同时对于金属的种类没有特殊限制,可以例举出铁、铜、银、金、铝、锌、铅、锡、镁以及上述金属的合金,例如不锈钢。所述金属表面可以存在氧化层,也可以通过表面处理使其表面 形成凹凸结构,还可以在金属表面导入有机官能团或低分子量有机化合物形成化学结构层。The joined body in the present invention can be obtained by directly bonding a thermoplastic resin composition to a metal, that is, the thermoplastic resin composition and the metal can be directly joined without passing through an intermediate layer such as another bonding material. The metal may be surface-treated or not surface-treated, and the type of the metal is not particularly limited, and examples thereof include iron, copper, silver, gold, aluminum, zinc, lead, tin, magnesium, and the like. An alloy of metals, such as stainless steel. The metal surface may have an oxide layer, or may have a surface structure to form an uneven structure, or an organic functional group or a low molecular weight organic compound may be introduced into the metal surface to form a chemical structure layer.

上述金属的表面处理方法可以例举出将金属表面在腐蚀性液体中进行浸渍处理,在表面刻蚀出微细的凹凸结构后浸入含氮化合物水溶液中或采用含氮化合物气体进行熏蒸,使金属表面附着化学物质的方法;将金属表面在腐蚀性液体中进行浸渍处理,并在金属表面通过阳极氧化使金属表面形成微细的凹凸结构,在金属表面附着化学物质的方法;通过激光加工刻蚀出沟槽的方法等。具体来说可以例举出大成PLAS公司的NMT表面处理方法和东亚电化公司的TRI表面处理方法等。The surface treatment method of the above metal may be exemplified by immersing the metal surface in a corrosive liquid, immersing the fine concavo-convex structure on the surface, immersing it in an aqueous solution of the nitrogen-containing compound, or fumigation using a nitrogen-containing compound gas to make the metal surface a method of attaching a chemical substance; immersing a metal surface in a corrosive liquid, and forming a fine uneven structure on the surface of the metal by anodization on the surface of the metal, and attaching a chemical substance to the surface of the metal; etching the groove by laser processing The method of the slot, etc. Specifically, the NMT surface treatment method of Dacheng PLAS Corporation and the TRI surface treatment method of the East Asia Electrochemical Company can be exemplified.

上述用于表面处理的腐蚀性液体可以例举出碱性水溶液(pH>7)、酸性水溶液(pH<7),含氮化合物水溶液等,其中碱性水溶液可以例举出氢氧化钠、氢氧化钾、碳酸钠等的水溶液;酸性水溶液可以例举出盐酸、硫酸、硝酸、氢氟酸等的水溶液;含氮化合物可以是氨、肼或水溶性胺,水溶性胺具体可以举出甲胺、二甲胺、三甲胺、乙胺、二乙胺、三乙胺、乙二胺、烯丙胺、乙醇胺、二乙醇胺、三乙醇胺、苯胺以及其他胺类。The corrosive liquid used for the surface treatment may, for example, be an alkaline aqueous solution (pH>7), an acidic aqueous solution (pH<7), an aqueous solution containing a nitrogen compound, or the like, wherein the alkaline aqueous solution may, for example, be sodium hydroxide or hydroxide. An aqueous solution of potassium or sodium carbonate; an acidic aqueous solution may, for example, be an aqueous solution of hydrochloric acid, sulfuric acid, nitric acid or hydrofluoric acid; the nitrogen-containing compound may be ammonia, hydrazine or a water-soluble amine, and the water-soluble amine may specifically be methylamine. Dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, ethylenediamine, allylamine, ethanolamine, diethanolamine, triethanolamine, aniline, and other amines.

上述金属表面阳极氧化处理方法可以例举出以金属为阳极,在电解液中通过电流,在金属表面形成氧化膜,例如水溶性胺组合物可以作为电解液用于金属表面的阳极氧化处理。The metal surface anodizing treatment method may be exemplified by using a metal as an anode and passing an electric current in the electrolytic solution to form an oxide film on the metal surface. For example, the water-soluble amine composition may be used as an electrolytic solution for anodizing the metal surface.

金属表面附着的化学物质可以举出氨、肼、水溶性胺、三嗪二硫醇化合物等。Examples of the chemical substance to be attached to the metal surface include ammonia, hydrazine, a water-soluble amine, and a triazine dithiol compound.

上述通过激光加工刻蚀沟槽的方法具体可以例举出日本的大赛璐公司和大赛璐塑料公司开发的DLAMP技术,通过金属表面蚀刻来制造微孔的技术。The above method of etching the groove by laser processing can specifically exemplify the technique of manufacturing micropores by metal surface etching by the DLAMP technology developed by Daicel Corporation of Japan and Daicel Plastics Co., Ltd.

上述金属表面的纳米级凹凸结构在电子扫描显微镜下为纳米级微孔结构,优选平均孔径在10~100nm,进一步优选孔径在10~80nm。The nano-scale uneven structure of the above metal surface is a nano-scale microporous structure under an electron scanning microscope, and preferably has an average pore diameter of 10 to 100 nm, and more preferably has a pore diameter of 10 to 80 nm.

本发明还提供一种本发明的热塑性树脂组合物与金属的接合体的制备方法。本发明对接合体的制造方法没有特殊限定,下面,对该接合体的制备方法进行举例说明。The present invention also provides a process for producing a bonded body of a thermoplastic resin composition of the present invention and a metal. The method for producing the joined body of the present invention is not particularly limited, and the method for producing the joined body will be exemplified below.

考虑提高热塑性树脂组合物和金属的接合性以及实际制造过程中的高效,优选注塑成型或通过激光照射进行焊接。It is considered to improve the bonding property of the thermoplastic resin composition and the metal and the efficiency in the actual manufacturing process, and it is preferable to perform injection molding or welding by laser irradiation.

注塑成型的方法具体可以例举出将热塑性树脂组合物加热熔融后注塑成型到预先放入金属的模具内,从而得到接合体的方法。上述注塑成型过程中,模具温度没有特别限定,但优选为60℃以上、180℃以下。通过将模具温度控制在60℃以上能够使热塑性树脂组合物与金属的接合性更好,进一步优选80℃以上,更进一步优选100℃以上;另一方面,模具温度在180℃以下时热塑性树脂组合物能够更有效地固化成型,进一步优选160℃以下,更进一步优选150℃以下。The method of injection molding can specifically exemplify a method in which a thermoplastic resin composition is heated and melted and then injection-molded into a mold placed in advance in a metal to obtain a joined body. In the above injection molding process, the mold temperature is not particularly limited, but is preferably 60° C. or higher and 180° C. or lower. The moldability of the thermoplastic resin composition to the metal can be further improved by controlling the mold temperature to 60° C. or higher, more preferably 80° C. or higher, and still more preferably 100° C. or higher. On the other hand, the thermoplastic resin combination when the mold temperature is 180° C. or lower. The material can be more effectively cured and formed, and is more preferably 160 ° C or lower, still more preferably 150 ° C or lower.

通过激光照射进行焊接的方法具体可以例举出将热塑性树脂组合物制得的成型品和金属重叠并固定后,从树脂侧或金属侧用激光照射,使得树脂与金属材料接触界面附近的树脂熔融从而将树脂成型品和金属材料接合的方法。Specifically, the method of welding by laser irradiation may be carried out by laminating and fixing a molded article obtained by using a thermoplastic resin composition, and then irradiating with a laser from the resin side or the metal side to melt the resin in the vicinity of the interface between the resin and the metal material. Thus, a method of joining a resin molded article and a metal material.

本发明的热塑性树脂组合物与金属的接合体有较高的接合性,适 合需要金属接合的汽车部件,电子、电器产品部件,结构材料等领域。The thermoplastic resin composition of the present invention has high bonding property with a metal joined body, and is suitable for fields such as automobile parts requiring metal joining, electronic parts, electrical product parts, structural materials, and the like.

附图说明DRAWINGS

图1:本发明实施例中测试树脂与金属的接合性所使用的树脂与金属的接合样条。Fig. 1 is a resin-metal bonded spline used for testing the adhesion of a resin to a metal in an embodiment of the present invention.

具体实施方式Detailed ways

下面结合实施例对本发明作进一步说明,但这并不说明本发明仅限于这些实施例。The invention is further illustrated by the following examples, which are not intended to limit the invention.

实施例和比较例中涉及的测试的说明如下:The description of the tests involved in the examples and comparative examples is as follows:

(1)相对粘度ηr:各实施例及比较例中所使用的聚酰胺树脂样品溶于96wt%的浓硫酸中,配制成聚酰胺树脂浓度为0.01g/ml的溶液,在25℃下用乌氏粘度计测量相对粘度。(1) Relative viscosity ηr: The polyamide resin sample used in each of the examples and the comparative examples was dissolved in 96 wt% of concentrated sulfuric acid to prepare a solution having a polyamide resin concentration of 0.01 g/ml, and was used at 25 ° C. The viscometer measures the relative viscosity.

(2)式I所示末端结构含量:各实施例和比较例中所使用的具有上述式I所示末端结构的聚酰胺树脂,以50mg/ml的浓度溶于氘代浓硫酸中,在扫描次数为256次的条件下采用日本电子JEOL ECX400P进行 1H-NMR核磁测试。对 1H-NMR谱图中上述式I中的末端结构上与醚键的氧相邻的-CH 2-上的氢对应的峰、以及作为主成份的聚酰胺主链重复单元上的氢对应的峰进行归属后,通过对各峰进行积分所得的峰面积以及各结构所含有的氢原子数计算得到聚酰胺树脂中式(I)所示末端结构含量。 (2) The terminal structure content represented by Formula I: the polyamide resin having the terminal structure represented by the above formula I used in each of the Examples and Comparative Examples, dissolved in deuterated concentrated sulfuric acid at a concentration of 50 mg/ml, in scanning The 1 H-NMR nuclear magnetic test was carried out using Japanese electronic JEOL ECX400P under the conditions of 256 times. a peak corresponding to hydrogen on -CH 2 - adjacent to the oxygen of the ether bond in the terminal structure of the above formula I in the 1 H-NMR spectrum, and hydrogen corresponding to the repeating unit of the polyamide main chain as a main component After the peaks were assigned, the terminal structure content of the formula (I) in the polyamide resin was calculated by calculating the peak area obtained by integrating the peaks and the number of hydrogen atoms contained in each structure.

(3)热性能(3) Thermal properties

采用TA公司的示差扫描量热仪(DSC Q2000),各实施例及比较例中所使用的热塑性树脂组合物精确称量5~7mg,在氮气气氛下以 20℃/min的升温速率从20℃开始升温至比所出现的吸热峰的温度T0高出30℃的温度,并在此温度下恒温2min,随后以20℃/min的降温速率降温至20℃,20℃下恒温2min后再次以20℃/min的升温速率升温至比T0高出30℃的温度,得到熔点T m。T m为二次升温过程中吸热峰的峰尖对应的温度。 The thermoplastic resin composition used in each of the examples and the comparative examples was accurately weighed 5 to 7 mg by a differential scanning calorimeter (DSC Q2000) of TA Corporation, and the temperature was raised from 20 ° C at a heating rate of 20 ° C / min under a nitrogen atmosphere. Start heating up to a temperature 30 ° C higher than the temperature T0 of the endothermic peak that appears, and then thermostat at this temperature for 2 min, then cool down to 20 ° C at a temperature drop rate of 20 ° C / min, and then thermostatically at 20 ° C for 2 min. The temperature increase rate of 20 ° C / min was raised to a temperature 30 ° C higher than T0 to obtain a melting point T m . T m is the temperature corresponding to the peak tip of the endothermic peak during the secondary temperature rise.

(4)分子量(4) Molecular weight

取各制备例中所得到的聚酰胺树脂粒子或各实施例和比较例中注塑成形后所得到的接合体的树脂部分2.5mg溶于4ml含0.0075N的三氟乙酸钠的六氟异丙醇中后,用0.45μm的过滤器过滤后测定数均分子量Mn和重均分子量Mw,测定条件如下:The polyamide resin particles obtained in each of the preparation examples or the resin portion of the joined body obtained after the injection molding in each of the examples and the comparative examples were dissolved in 4 ml of hexafluoroisopropanol containing 0.0075 N of sodium trifluoroacetate. After the filtration, the number average molecular weight Mn and the weight average molecular weight Mw were measured by filtration through a 0.45 μm filter, and the measurement conditions were as follows:

泵:e-Alliance GPC system(Waters制)Pump: e-Alliance GPC system (made by Waters)

检测器:示差检测器Waters 2414(Waters制)Detector: Differential detector Waters 2414 (manufactured by Waters)

色谱柱:Shodex HFIP-806M(2根)+HFIP-LGColumn: Shodex HFIP-806M (2) + HFIP-LG

溶剂:六氟异丙醇(添加0.0075N的三氟乙酸钠)Solvent: hexafluoroisopropanol (adding 0.0075N sodium trifluoroacetate)

流速:0.5ml/minFlow rate: 0.5ml/min

样品注入量:0.1mlSample injection amount: 0.1ml

温度:40℃Temperature: 40 ° C

分子量校正:聚甲基丙烯酸甲酯。Molecular weight correction: polymethyl methacrylate.

(5)熔融粘度(5) Melt viscosity

将制备例1~12中所得到的聚酰胺树脂置于真空干燥箱中在80℃下干燥12小时以上后,用压膜机热压成膜(膜厚0.7mm)后裁剪成直径25mm的圆片,用旋转流变仪(Antonpaar制、MCR302、φ25平行板)采用以下的方法测定熔融粘度:在氮气氛下,将上述样品在260℃(制备例1~7、10~12)或280℃(制备例8、9)熔融5分钟、平行板间距0.5mm、振动模式测定、频率0.5~6.88Hz、测定50个点 (0.5分钟)、振幅1%。采用频率为1Hz时的复数粘度测定值作为熔融粘度。The polyamide resin obtained in Preparation Examples 1 to 12 was dried in a vacuum drying oven at 80 ° C for 12 hours or more, and then formed into a film (film thickness: 0.7 mm) by a laminator and then cut into a circle having a diameter of 25 mm. The sheet was measured for melt viscosity by a rotary rheometer (manufactured by Antonpaar, MCR302, φ25 parallel plate) by the following method: at 260 ° C (preparation examples 1 to 7, 10 to 12) or 280 ° C under a nitrogen atmosphere. (Preparation Examples 8 and 9) Molten for 5 minutes, parallel plate pitch of 0.5 mm, vibration mode measurement, frequency of 0.5 to 6.88 Hz, measurement of 50 points (0.5 minutes), and amplitude of 1%. The complex viscosity measurement at a frequency of 1 Hz was used as the melt viscosity.

(6)拉伸强度/拉伸模量(6) Tensile strength / tensile modulus

根据ASTM D638标准测试,样条尺寸为ASTM D638中的TypeIV,采用岛津AG-IS 1 KN测试制备例3获得的末端改性聚酰胺及比较例4、5所使用的商品化聚酰胺弹性体的拉伸模量,测试温度23℃,湿度50%RH,拉伸速度10 mm/min,夹具间距60mm。拉伸模量的结果取5根样条测试结果的平均值。样条的注塑条件如下:Tested according to ASTM D638, the spline size is Type IV in ASTM D638, the terminal modified polyamide obtained in Preparation Example 3 using Shimadzu AG-IS 1 KN, and the commercial polyamide elastomer used in Comparative Examples 4 and 5. The tensile modulus, test temperature 23 ° C, humidity 50% RH, tensile speed 10 mm / min, clamp spacing 60 mm. The tensile modulus results are taken as the average of the five spline test results. The injection molding conditions for the spline are as follows:

注塑成型机:ST10S2V(NISSEI制)Injection molding machine: ST10S2V (manufactured by NISSEI)

螺杆温度:250℃Screw temperature: 250 ° C

模具温度:80℃Mold temperature: 80 ° C

(7)金属片(7) Metal sheet

铝片A6061(45mm*10mm*1.5mm)昆山鑫达模具有限公司。Aluminum sheet A6061 (45mm*10mm*1.5mm) Kunshan Xinda Mould Co., Ltd.

委托铝片处理公司:深圳宝元金股份有限公司(NMT`理);Entrusted aluminum sheet processing company: Shenzhen Baoyuanjin Co., Ltd. (NMT);

                 深圳金宏欣科技有限公司(TRI处理)。Shenzhen Jinhongxin Technology Co., Ltd. (TRI processing).

(8)接合体注射成型(8) Joint injection molding

将金属片置于模具的模腔内,合模保持1分钟后,对热塑性树脂组合物的熔体进行计量并注入模具中。待熔体冷却固化后,打开模具,获得接合体。The metal piece was placed in a cavity of the mold, and after the mold was held for 1 minute, the melt of the thermoplastic resin composition was metered and injected into the mold. After the melt is cooled and solidified, the mold is opened to obtain a joined body.

注塑成型机:ST10S2V(NISSEI制)Injection molding machine: ST10S2V (manufactured by NISSEI)

螺杆温度:260℃(实施例1~11、比较例1~6)Screw temperature: 260 ° C (Examples 1 to 11, Comparative Examples 1 to 6)

         280℃(实施例12、比较例7)280 ° C (Example 12, Comparative Example 7)

模具温度:60~120℃Mold temperature: 60 ~ 120 ° C

(9)接合性(9) splicability

树脂和金属的接合性采用拉伸剪切强度表征,根据ISO 19095标准测试,样条尺寸为附图1所示ISO 19095中的规定尺寸,接合面积为0.5cm 2,采用岛津AG-IS 1 KN测试拉伸模量,测试温度23℃,湿度50%RH,拉伸速度5mm/min,夹具间距3mm。拉伸剪切强度的结果取5根样条测试结果的平均值。 The bondability between resin and metal is characterized by tensile shear strength, tested according to ISO 19095, the spline size is the specified size in ISO 19095 shown in Figure 1, and the joint area is 0.5 cm 2 using Shimadzu AG-IS 1 KN test tensile modulus, test temperature 23 ° C, humidity 50% RH, tensile speed 5 mm / min, clamp spacing 3 mm. The tensile shear strength results are taken as the average of the five spline test results.

对于未经末端改性聚酰胺树脂及含有式I所示结构的末端改性聚酰胺树脂的制备方法,说明如下:For the preparation method of the terminal-modified polyamide resin without the terminal-modified polyamide resin and the structure containing the formula I, the description is as follows:

制备例中使用的原料:Raw materials used in the preparation examples:

己内酰胺:BASFCaprolactam: BASF

聚醚胺:Huntsman的JEFFAMINE M1000(Mn=1000),结构如式II所示Polyetheramine: Huntsman's JEFFAMINE M1000 (Mn = 1000), the structure is shown in Formula II

Figure PCTCN2018097143-appb-000001
Figure PCTCN2018097143-appb-000001

己二酸:AlfaAdipic acid: Alfa

1,6-己二胺:TCI1,6-hexanediamine: TCI

制备例1Preparation Example 1

将500g己内酰胺、0.19g己二酸、2.6g JEFFAMINE M1000(Mn=1000)、150g去离子水加入反应釜中,将反应釜密闭后用氮气置换三次。将反应釜的加热器温度设定为290℃后开始加热。当反应釜内压力达到1MPa后,通过放气阀门将反应釜内水蒸气放出的同时将釜内压力维持在1MPa直至釜内温度升高到250℃。当釜内温度达到250℃后,将加热器设定温度降低至260℃,并在1小时内将 釜内压力从1MPa逐渐降至常压(达到常压时釜内温度为260℃)。降至常压后向釜内通入氮气流,并在氮气流下进行30分钟的熔融聚合(最高到达温度263℃)后,聚合物熔体经吐出阀吐出成长条状并通过冷却水冷却后进行切粒得到产物粒子。所得粒子在索氏提取器中以甲醇为溶剂除去聚合物中的小分子,80℃真空烘箱中干燥24h后,得到含有式I所示结构末端改性N6。500 g of caprolactam, 0.19 g of adipic acid, 2.6 g of JEFFAMINE M1000 (Mn = 1000), and 150 g of deionized water were placed in the reaction vessel, and the reaction vessel was sealed and replaced with nitrogen three times. Heating was started after the heater temperature of the reaction vessel was set to 290 °C. After the pressure in the reactor reached 1 MPa, the water vapor in the reactor was discharged through a bleed valve while maintaining the pressure in the vessel at 1 MPa until the temperature in the vessel was raised to 250 °C. When the temperature in the autoclave reached 250 ° C, the heater set temperature was lowered to 260 ° C, and the pressure in the autoclave was gradually lowered from 1 MPa to normal pressure within 1 hour (the temperature in the autoclave was 260 ° C when the pressure was reached). After the pressure was reduced to normal pressure, a nitrogen gas flow was introduced into the autoclave, and after 30 minutes of melt polymerization under a nitrogen stream (up to a temperature of 263 ° C), the polymer melt was discharged through a discharge valve and cooled by cooling water. The pellets are obtained to obtain product particles. The obtained particles were subjected to removal of small molecules in the polymer using methanol as a solvent in a Soxhlet extractor, and dried in a vacuum oven at 80 ° C for 24 hours to obtain a terminal modified N6 containing the structure represented by Formula I.

制备例2~7Preparation Examples 2 to 7

除原料按照表1所示的更改以及釜内压力到达常压后通氮气时间如表1所示的更改外,其他操作均和制备例1一样。The other operations were the same as in Preparation Example 1, except that the raw materials were changed as shown in Table 1 and the pressure in the autoclave reached the normal pressure and the nitrogen-passing time was as shown in Table 1.

制备例8Preparation Example 8

将381.64g己二酸、302.11g 1,6-己二胺、23.6g JEFFAMINE M1000(Mn=1000)、180g去离子水加入反应釜中,将反应釜密闭后用氮气置换三次。将反应釜的加热器温度设定为210℃后开始加热。反应1.5小时后将反应釜的加热器温度设定为300℃,当反应釜内压力达到1.75MPa后,通过放气阀门将反应釜内水蒸气放出的同时将釜内压力维持在1.75MPa直至釜内温度升高到250℃。当釜内温度达到250℃后,在1小时内将釜内压力从1.75MPa逐渐降至常压(达到常压时釜内温度为270℃)。降至常压后向釜内通入氮气流,并在氮气流下进行20分钟的熔融聚合(最高到达温度283℃)后,聚合物熔体经吐出阀吐出成长条状并通过冷却水冷却后进行切粒得到产物粒子。所得粒子在80℃真空烘箱中干燥24h后,得到含有式I所示结构末端改 性N66。381.64 g of adipic acid, 302.11 g of 1,6-hexanediamine, 23.6 g of JEFFAMINE M1000 (Mn = 1000), and 180 g of deionized water were placed in the reaction vessel, and the reaction vessel was sealed and replaced with nitrogen three times. Heating was started after the heater temperature of the reaction vessel was set to 210 °C. After 1.5 hours of reaction, the heater temperature of the reaction vessel was set to 300 ° C. After the pressure in the reactor reached 1.75 MPa, the water vapor in the reactor was discharged through a gas release valve while maintaining the pressure in the reactor at 1.75 MPa until the kettle was maintained. The internal temperature rose to 250 °C. When the temperature in the autoclave reached 250 ° C, the pressure in the autoclave was gradually decreased from 1.75 MPa to normal pressure within 1 hour (the temperature in the autoclave at normal pressure was 270 ° C). After the pressure was reduced to normal pressure, a nitrogen gas flow was introduced into the autoclave, and after 20 minutes of melt polymerization under a nitrogen stream (up to a temperature of 283 ° C), the polymer melt was discharged through a discharge valve and cooled by cooling water. The pellets are obtained to obtain product particles. The resulting particles were dried in a vacuum oven at 80 ° C for 24 h to give a terminal modified N66 of the formula I.

制备例9Preparation Example 9

除原料按照表1所示的更改以及釜内压力到达常压后通氮气时间如表1所示的更改外,其他操作均和制备例8一样。The other operations were the same as in Preparation 8 except that the raw materials were changed as shown in Table 1 and the pressure in the autoclave reached the normal pressure and the nitrogen-passing time was as shown in Table 1.

表1Table 1

Figure PCTCN2018097143-appb-000002
Figure PCTCN2018097143-appb-000002

对于制备例6,末端改性聚酰胺树脂从反应釜吐出时,无法拉伸成长条状从而无法得到产物粒子,推测由于聚醚胺添加量过高,导致聚合物分子量无法上升。In Preparation Example 6, when the terminal-modified polyamide resin was discharged from the reactor, the product was not stretched and the product particles could not be obtained. It is presumed that the molecular weight of the polymer could not be increased because the amount of the polyetheramine added was too high.

制备例10~12Preparation Examples 10 to 12

原料如表2中所示称取。原料在高速混合机中混合后,从日本制钢所公司制TEX30α型双轴挤出机(L/D=45.5)主喂料口加入,在螺杆温度250℃和螺杆转速200rpm下进行熔融混炼。挤出的丝束经切粒后,在80℃下真空干燥24小时得到聚酰胺树脂组合物。The raw materials were weighed as shown in Table 2. After the raw materials were mixed in a high-speed mixer, they were fed from a main feed port of a TEX30α-type twin-screw extruder (L/D=45.5) manufactured by Nippon Steel Works Co., Ltd., and melt-kneaded at a screw temperature of 250 ° C and a screw rotation speed of 200 rpm. . The extruded tow was subjected to pelletization, and vacuum dried at 80 ° C for 24 hours to obtain a polyamide resin composition.

表2Table 2

Figure PCTCN2018097143-appb-000003
Figure PCTCN2018097143-appb-000003

实施例1Example 1

将经过表面处理的金属片(NMT处理,深圳宝元金股份有限公司)置于ST10S2V(NISSEI制)注射成型机模具中,注塑机完成计量制备例1所获得的含有I所示结构末端改性聚酰胺树脂并将树脂熔体注入模具中,冷却时间为15s,开模,得到接合体,成型过程中,螺杆温度为260℃,模具温度为120℃。将上述方法得到的接合体,按照ISO19095,在5mm/min拉伸速度下进行金属接合性能测试,结果如表3所示。The surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the end-modification of the structure containing the I obtained by the measurement preparation example 1. The polyamide resin was poured into the mold, and the cooling time was 15 s. The mold was opened to obtain a joined body. During the molding, the screw temperature was 260 ° C and the mold temperature was 120 ° C. The joined body obtained by the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 3.

实施例2~7Examples 2-7

除了按照表3所示的更改末端改性聚酰胺的种类,其他操作均和实施例1一样,所得接合体性能如表3所示。Except for the modification of the type of the terminally modified polyamide shown in Table 3, the other operations were the same as in Example 1, and the properties of the obtained joined body were as shown in Table 3.

比较例1Comparative example 1

将经过表面处理的金属片(NMT处理,深圳宝元金股份有限公司)置于ST10S2V(NISSEI制)注射成型机模具中,注塑机完成计量制备例7得到的未经末端改性聚酰胺后将树脂熔体注入模具中,冷却时间为15s,开模,得到接合体,成型过程中,螺杆温度为260℃,模具温度为120℃。将上述方法的得到的接合体,按照ISO19095,在 5mm/min拉伸速度下进行金属接合性能测试,结果如表3所示。The surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the unmodified polyamide obtained in Preparation Example 7. The resin melt was injected into the mold, the cooling time was 15 s, and the mold was opened to obtain a joined body. During the molding process, the screw temperature was 260 ° C and the mold temperature was 120 ° C. The obtained joined body of the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 3.

表3table 3

Figure PCTCN2018097143-appb-000004
Figure PCTCN2018097143-appb-000004

实施例1~7与比较例1相比,可以看到含有式I所示结构末端改性聚酰胺的热塑性树脂组合物与金属接合拉伸剪切强度优于不含式I所示结构聚酰胺树脂,实施例2~6金属接合拉伸剪切强度明显高于具有较低式I所示结构含量的实施例1、7。对于实施例4,较高含量的式I所示结构对末端改性聚酰胺树脂本体的机械强度产生影响,使得金属接合拉伸剪切强度比含有2wt%和4wt%式I所示结构末端的实施例低。对于实施例5、6,通过将含有较高含量式I所示结构末端改性聚酰胺树脂与不含式I所示结构聚酰胺树脂共混,使所得到的热塑性树脂组合物具有较低的熔融粘度(表2),从而使得所得到的接合体有较高金属接合拉伸剪切强度。Comparing Examples 1 to 7 with Comparative Example 1, it can be seen that the thermoplastic resin composition containing the structurally modified polyamide of the structure represented by Formula I has a tensile shear strength superior to that of the metal without the structural polyamide represented by Formula I. The resin, Examples 2 to 6 metal joint tensile shear strength was significantly higher than Examples 1 and 7 having a lower structural content as shown in Formula I. For Example 4, a higher content of the structure of Formula I has an effect on the mechanical strength of the end-modified polyamide resin body such that the metal bond tensile shear strength ratio is 2 wt% and 4 wt% of the end of the structure shown in Formula I. The examples are low. For Examples 5 and 6, the obtained thermoplastic resin composition has a lower content by blending a structurally modified polyamide resin having a higher content of the formula I and a structural polyamide resin not containing the formula I. The melt viscosity (Table 2) was such that the resulting joined body had a higher metal bond tensile shear strength.

实施例8~10Examples 8 to 10

除了按照表4所示的更改注射成型过程中模具温度,其他操作均和实施例3一样,所得接合体性能如表4所示。Except that the mold temperature during the injection molding process was changed as shown in Table 4, the other operations were the same as in Example 3, and the properties of the resulting joined body were as shown in Table 4.

比较例2和3Comparative Examples 2 and 3

除了按照表4所示的更改注射成型过程中模具温度,其他操作均和比较例1一样,所得接合体性能如表4所示。Except that the mold temperature during the injection molding process was changed as shown in Table 4, the other operations were the same as in Comparative Example 1, and the properties of the obtained joined body were as shown in Table 4.

表4Table 4

Figure PCTCN2018097143-appb-000005
Figure PCTCN2018097143-appb-000005

将实施例8与比较例2、实施例9与比较例3对比可知,含有4wt%式I所示结构末端改性聚酰胺树脂与金属接合拉伸剪切强度更高,并且,较高模具温度条件下成型的实施例3、8的金属接合拉伸剪切强度比较低模具温度条件下成型的实施例9和实施例10更高。Comparing Example 8 with Comparative Example 2, Example 9 and Comparative Example 3, it is understood that 4% by weight of the structure-modified polyamide resin of the formula I has a higher tensile shear strength and higher mold temperature. The metal bonded tensile shear strength of Examples 3 and 8 molded under the conditions was higher than that of Example 9 and Example 10 which were molded under the mold temperature conditions.

比较例4Comparative example 4

将经过表面处理的金属片(NMT处理,深圳宝元金股份有限公司)置于ST10S2V(NISSEI制)注射成型机模具中,注塑机完成计量商品化聚酰胺弹性体(PEBAX 5533SP01,Arkema制)后将树脂熔体注入模具中,冷却时间为15s,开模,得到接合体,成型过程中,螺杆温度为260℃,模具温度为60℃。将上述方法的得到的接合体,按照ISO19095,在5mm/min拉伸速度下进行金属接合性能测试,结果如表5所示。The surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the commercial polyamide elastomer (PEBAX 5533SP01, manufactured by Arkema). The resin melt was poured into a mold, the cooling time was 15 s, and the mold was opened to obtain a joined body. During the molding, the screw temperature was 260 ° C and the mold temperature was 60 ° C. The obtained joined body of the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 5.

比较例5Comparative Example 5

除了按照表5所示更改注射成型过程中模具温度至120℃外,其他操作均和比较例4一致。但是树脂在模具内无法充分固化,脱模时发生变形,从而无法得到试验样条。Other operations were in accordance with Comparative Example 4 except that the mold temperature during the injection molding process was changed to 120 ° C as shown in Table 5. However, the resin could not be sufficiently cured in the mold, and deformation occurred during demolding, so that test strips could not be obtained.

表5table 5

Figure PCTCN2018097143-appb-000006
Figure PCTCN2018097143-appb-000006

*数据源于Shannon Armstrong,Benny Freeman,Anne Hiltner,Eric Baer.Polymer;2012:1383-1392.*Data from Shannon Armstrong, Benny Freeman, Anne Hiltner, Eric Baer. Polymer; 2012: 1383-1392.

与比较例5相比,实施例3高温成型性能优良,而且具有更高的金属接合拉伸剪切强度。同时实施例10与比较例4相比,实施例10金属接合拉伸剪切强度更高。另外,实施例3和实施例10中热塑性树脂组合物本体的拉伸强度和拉伸模量明显优于比较例4和比较例5中的聚酰胺弹性体。Compared with Comparative Example 5, Example 3 was excellent in high-temperature molding properties and had higher metal bond tensile shear strength. Meanwhile, in Example 10, the tensile strength of the metal joint tensile shear of Example 10 was higher than that of Comparative Example 4. Further, the tensile strength and tensile modulus of the thermoplastic resin composition body in Example 3 and Example 10 were significantly superior to those of Comparative Example 4 and Comparative Example 5.

实施例11Example 11

除了按照表6所示,采用经过不同表面处理方法(TRI处理,深圳金宏欣科技有限公司)处理的金属片,其他操作均和实施例3一样,所得接合体性能如表6所示。Except as shown in Table 6, the metal sheets treated by different surface treatment methods (TRI treatment, Shenzhen Jinhongxin Technology Co., Ltd.) were subjected to the same operations as in Example 3, and the properties of the obtained joined bodies were as shown in Table 6.

比较例6Comparative Example 6

除了按照表6所示,采用经过不同表面处理方法(TRI处理,深圳金宏欣科技有限公司)处理的金属片,其他操作均和比较例1一样,所得接合体性能如表6所示。Except as shown in Table 6, the metal sheets treated by different surface treatment methods (TRI treatment, Shenzhen Jinhongxin Technology Co., Ltd.) were used, and the other operations were the same as in Comparative Example 1, and the properties of the obtained joined bodies were as shown in Table 6.

表6Table 6

Figure PCTCN2018097143-appb-000007
Figure PCTCN2018097143-appb-000007

从实施例3和实施例11可见,含有4wt%式I所示结构末端改性聚酰胺树脂与NMT和TRI两种处理方式的金属的接合拉伸剪切强度均达到了20MPa以上。而使用了未经末端改性的聚酰胺树脂的比较例1和比较例6,树脂与NMT和TRI两种处理方式的金属的接合拉伸剪切强度均低于10MPa。It can be seen from Example 3 and Example 11 that the tensile shear strength of the joint containing 4 wt% of the terminal modified polyamide resin of the formula I and the NMT and TRI treatments was 20 MPa or more. In Comparative Example 1 and Comparative Example 6 in which a polyamide resin which was not subjected to terminal modification was used, the tensile shear strength of the joint of the resin and the NMT and TRI treatments was less than 10 MPa.

实施例12Example 12

将经过表面处理的金属片(NMT处理,深圳宝元金股份有限公司)置于ST10S2V(NISSEI制)注射成型机模具中,注塑机完成计量制备例8所获得的含有I所示结构末端改性聚酰胺树脂并将树脂熔体注入模具中,冷却时间为15s,开模,得到接合体,成型过程中,螺杆温度为280℃,模具温度为120℃。将上述方法得到的接合体,按照ISO19095,在5mm/min拉伸速度下进行金属接合性能测试,结果如表7所示。The surface-treated metal sheet (NMT treatment, Shenzhen Baoyuanjin Co., Ltd.) was placed in a ST10S2V (NISSEI) injection molding machine mold, and the injection molding machine completed the measurement of the terminal modification of the structure I obtained by the preparation of Example 8. The polyamide resin was poured into the mold, and the cooling time was 15 s. The mold was opened to obtain a joined body. During the molding, the screw temperature was 280 ° C and the mold temperature was 120 ° C. The joined body obtained by the above method was subjected to metal bonding performance test at a tensile speed of 5 mm/min in accordance with ISO 19095, and the results are shown in Table 7.

比较例7Comparative Example 7

除了按照表7所示的更改末端改性聚酰胺的种类,其他操作均和实施例12一样,所得接合体性能如表7所示。Except for the modification of the type of the terminally modified polyamide shown in Table 7, the other operations were the same as in Example 12, and the properties of the obtained joined body were as shown in Table 7.

表7Table 7

Figure PCTCN2018097143-appb-000008
Figure PCTCN2018097143-appb-000008

实施例12与比较例7相比,可以看到含有式I所示结构末端改性聚酰胺的热塑性树脂组合物与金属接合拉伸剪切强度优于不含式I所示结构聚酰胺树脂。In Example 12, as compared with Comparative Example 7, it can be seen that the thermoplastic resin composition containing the terminal-modified polyamide of the formula I represented by the structure has a tensile shear strength superior to that of the metal bonded structure of the formula I.

Claims (18)

一种热塑性树脂组合物和金属的接合体,其特征在于:所述热塑性树脂组合物含有末端改性聚酰胺树脂,所述末端改性聚酰胺树脂的含量为热塑性树脂组合物总重量的5~100wt%,所述末端改性聚酰胺树脂具有式I所示末端结构,A bonded body of a thermoplastic resin composition and a metal, characterized in that the thermoplastic resin composition contains a terminal-modified polyamide resin, and the content of the terminal-modified polyamide resin is 5 to the total weight of the thermoplastic resin composition. 100% by weight, the terminal modified polyamide resin has an end structure represented by Formula I, -X-(R 1-O)n-R 2  式I -X-(R 1 -O)nR 2 Formula I 上述式I中,n为2~100的整数,R 1相同或不同,为碳原子数为2~10的亚烷基,R 2为碳原子数为1~30的烷基,-X-为-NH-、-O-、-C(=O)-、-NH-C(=O)-O-、-NH-C(=O)-NH-或-CH(OH)-CH 2-中的任一种;式I所示结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.05~20wt%。 In the above formula I, n is an integer of 2 to 100, R 1 is the same or different, and is an alkylene group having 2 to 10 carbon atoms, and R 2 is an alkyl group having 1 to 30 carbon atoms, and -X- is -NH-, -O-, -C(=O)-, -NH-C(=O)-O-, -NH-C(=O)-NH- or -CH(OH)-CH 2 - Any of the structures of Formula I in the terminally modified polyamide resin is 0.05 to 20% by weight based on the total weight of the terminally modified polyamide resin. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构中,n为16~50的整数。The bonded body according to claim 1, wherein in the terminal structure represented by the above formula I, n is an integer of from 16 to 50. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构中,n为16~25的整数。The bonded body according to claim 1, wherein in the terminal structure represented by the above formula I, n is an integer of from 16 to 25. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构中,R 1相同或不同,为碳原子数为2~4的亚烷基。 The joined body according to claim 1, wherein in the terminal structure represented by the above formula I, R 1 is the same or different and is an alkylene group having 2 to 4 carbon atoms. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构中,R 2为碳原子数为1~20的烷基。 The bonded body according to claim 1, wherein in the terminal structure represented by the formula I, R 2 is an alkyl group having 1 to 20 carbon atoms. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构中,R 2为甲基。 The joined body according to claim 1, wherein in the terminal structure represented by the above formula I, R 2 is a methyl group. 根据权利要求1所述的接合体,其特征在于:上述式I所示 末端结构中,-X-为-NH-。The joined body according to claim 1, wherein -X- is -NH- in the terminal structure represented by the above formula I. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.1~15wt%。The joined body according to claim 1, wherein the terminal structure represented by the above formula I is contained in the terminal-modified polyamide resin in an amount of from 0.1 to 15% by weight based on the total weight of the terminal-modified polyamide resin. 根据权利要求1所述的接合体,其特征在于:上述式I所示末端结构在末端改性聚酰胺树脂中的含量为末端改性聚酰胺树脂总重量的0.1~10wt%。The joined body according to claim 1, wherein the terminal structure represented by the above formula I is contained in the terminal-modified polyamide resin in an amount of from 0.1 to 10% by weight based on the total weight of the terminal-modified polyamide resin. 根据权利要求1所述的接合体,其特征在于:所述热塑性树脂组合物根据ISO19095规定的接合体试验样条在5mm/min的拉伸速度下测得的拉伸剪切强度≥10MPa。The joined body according to claim 1, wherein the thermoplastic resin composition has a tensile shear strength of ≥ 10 MPa measured at a tensile speed of 5 mm/min according to the joint test strip specified in ISO19095. 根据权利要求1所述的接合体,其特征在于:所述接合体由热塑性树脂组合物与金属直接接合得到。The joined body according to claim 1, wherein the joined body is obtained by directly bonding a thermoplastic resin composition to a metal. 根据权利要求1所述的接合体,其特征在于:所述具有式I所示末端结构的末端改性聚酰胺树脂以96wt%硫酸为溶剂配制成0.01g/ml的聚酰胺树脂溶液,在25℃下测定的相对粘度ηr为1.1~5.0。The joined body according to claim 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I is formulated into a polyamide resin solution of 0.01 g/ml with 96 wt% sulfuric acid as a solvent, at 25 The relative viscosity ηr measured at ° C was 1.1 to 5.0. 根据权利要求1所述的接合体,其特征在于:所述具有式I所示末端结构的末端改性聚酰胺树脂用凝胶渗透色谱测得的重均分子量Mw的范围为10,000~400,000。The joined body according to claim 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I has a weight average molecular weight Mw measured by gel permeation chromatography in the range of 10,000 to 400,000. 根据权利要求1所述的接合体,其特征在于:所述具有式I所示末端结构的末端改性聚酰胺树脂的熔点为215℃以上。The joined body according to claim 1, wherein the terminal modified polyamide resin having the terminal structure represented by Formula I has a melting point of 215 ° C or higher. 根据权利要求1所述的接合体,其特征在于:所述热塑性树脂组合物还包括填料,所述填料的含量为热塑性树脂组合物总重量的 5~80wt%。The joined body according to claim 1, wherein the thermoplastic resin composition further comprises a filler in an amount of from 5 to 80% by weight based on the total mass of the thermoplastic resin composition. 一种权利要求1~15中任意一项所述接合体的制造方法,其特征在于:所述接合体由热塑性树脂组合物加热熔融后与预先放入模具的金属注塑成型。The method for producing a joined body according to any one of claims 1 to 15, wherein the joined body is heated and melted by a thermoplastic resin composition, and then injection-molded with a metal previously placed in a mold. 根据权利要求16所述的制造方法,其特征在于:所述接合体在注塑成型过程中,模具温度在60~180℃之间。The manufacturing method according to claim 16, wherein in the injection molding, the mold temperature is between 60 and 180 °C. 一种权利要求1~15中任意一项所述接合体的制造方法,其特征在于:所述接合体由热塑性树脂组合物的成型品和金属通过激光照射焊接得到。The method for producing a joined body according to any one of claims 1 to 15, wherein the joined body is obtained by welding a molded article of a thermoplastic resin composition and a metal by laser irradiation.
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