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WO2019013230A1 - Composition adhésive conductrice - Google Patents

Composition adhésive conductrice Download PDF

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Publication number
WO2019013230A1
WO2019013230A1 PCT/JP2018/026103 JP2018026103W WO2019013230A1 WO 2019013230 A1 WO2019013230 A1 WO 2019013230A1 JP 2018026103 W JP2018026103 W JP 2018026103W WO 2019013230 A1 WO2019013230 A1 WO 2019013230A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive adhesive
adhesive composition
particles
conductive
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/026103
Other languages
English (en)
Japanese (ja)
Inventor
真太郎 阿部
近藤　剛史
力亜 古正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Publication of WO2019013230A1 publication Critical patent/WO2019013230A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to conductive adhesive compositions.
  • Patent Document 1 a conductive paste for die bonding comprising a metal powder and an organic solvent, wherein the metal powder has a purity of 99.9% by mass or more and an average particle diameter of 0.01 ⁇ m to 1.0 ⁇ m.
  • a conductive paste comprising one or more metal particles selected from palladium powder and copper powder, and a coating layer made of gold covering at least a part of the metal particles.
  • Patent Document 2 gold, silver, copper, platinum, palladium, palladium, rhodium, nickel, iron, cobalt, tin, indium, aluminum, zinc, at least any of these compounds or alloys, having an average particle diameter of 0.1 to 100 ⁇ m.
  • Conductive adhesive comprising: a plurality of solid conductive particles including iron; solid lubricating particles not metal-bonded to the solid conductive particles; and having higher lubricity than the solid conductive particles; and water or an organic solvent Agents have been reported.
  • the semiconductor element In electronic components, the semiconductor element generates heat due to current flow during use, so the die bonding material is subject to repeated temperature changes, which may degrade adhesion by the die bonding material and cause the semiconductor element to separate from the support member is there. Further, in recent years, with the progress of miniaturization and high functionality of electronic parts, the calorific value by energization of the semiconductor element tends to increase, and the risk of the above peeling is further increased.
  • the present invention has been invented in view of the above problems, and an object thereof is to provide a conductive adhesive composition in which peeling of a material to be adhered is unlikely to occur even when subjected to repeated temperature changes. is there.
  • the present inventors repeatedly subjected to temperature changes in the conductive adhesive composition by including particles of thermoplastic resin in solid form at 25 ° C. consisting of a polyamide containing an aliphatic skeleton. It has been found that adhesion which is less likely to be peeled off can be formed, and the present invention has been completed.
  • the conductive adhesive composition of the present invention is a conductive adhesive composition comprising particles (A) of a thermoplastic resin which is solid at 25 ° C. and a conductive filler (B), and the thermal adhesive as described above
  • the plastic resin is a polyamide comprising an aliphatic backbone having a melting point of 250 ° C. or less.
  • the thermoplastic resin contains at least one of nylon 11, nylon 12 and nylon 6.
  • the average particle diameter of the thermoplastic resin particles (A) is 1 to 30 ⁇ m.
  • the conductive adhesive composition according to one aspect of the present invention contains the particles (A) of the thermoplastic resin in a range of 0.5 to 10% by mass with respect to the total amount of the conductive adhesive composition. .
  • the conductive filler (B) contains silver.
  • the conductive adhesive composition according to one aspect of the present invention contains the conductive filler (B) in the range of 80 to 95% by mass with respect to the total amount of the conductive adhesive composition.
  • the conductive adhesive cured product of the present invention is a cured product of any one of the above-mentioned conductive adhesive compositions.
  • the electronic device of the present invention uses any one of the conductive adhesive compositions described above for bonding of parts.
  • the conductive adhesive composition of the present invention is characterized in that it comprises particles (A) of a thermoplastic resin in solid form at 25 ° C. comprising a polyamide containing an aliphatic skeleton, which has been subjected to repeated temperature changes. Also in this case, peeling of the adherend material is less likely to occur.
  • the average particle size is taken as the 50% average particle size (D50) of the particle size distribution measured using a laser diffraction / scattering type particle size analyzer.
  • D50 50% average particle size
  • measurement can be performed using a laser diffraction / scattering particle size analyzer MT-3000 manufactured by Nikkiso Co., Ltd.
  • the conductive adhesive composition according to the present invention contains particles (A) of a thermoplastic resin solid at 25 ° C. (hereinafter, also simply referred to as “particles of thermoplastic resin (A)”).
  • the particles (A) of the thermoplastic resin are particles of a polyamide containing an aliphatic skeleton having a melting point of 250 ° C. or less.
  • thermoplastic resin particles (A) melt at the time of heat curing of the conductive adhesive composition since the melting point thereof is 250 ° C. or less, and as a result, the conductive adhesive It will have high adhesiveness with the conductive filler (B) in the cured product.
  • thermoplastic resin having high adhesiveness with the conductive filler (B) is elastically deformed when stressed as described above, and the stress can be effectively relieved. Therefore, it is considered that the cured conductive adhesive of the present invention is excellent in stress relaxation performance, and peeling of the material to be adhered is difficult to occur even when the stress load as described above is applied.
  • the particles (A) of the thermoplastic resin are melted at the time of heat curing of the conductive adhesive composition to fill the voids existing at the bonding interface between the conductive adhesive cured product and the material to be bonded, The improvement of the adhesive strength is also considered to contribute to the suppression of peeling due to repeated temperature changes.
  • the particles (A) of the thermoplastic resin may be particles of a polyamide containing an aliphatic skeleton having a melting point of 250 ° C. or less, and there is no particular limitation.
  • particles of resin having a melting point in the range of 50 to 250 ° C. are preferable, particles of resin having a melting point in the range of 100 to 225 ° C. are more preferable, and melting point is 150 to 150 More preferred are particles of resin in the range of 200 ° C.
  • the thermoplastic resin contains at least one of nylon 11, nylon 12 and nylon 6.
  • Particles made of either nylon 11, nylon 12, nylon 6 may be used alone, or multiple types of particles may be used. It is also possible to use particles made of at least two copolymers of nylon 11, nylon 12, and nylon 6. In particular, particles of nylon 11, particles of nylon 12, and particles of a copolymer of nylon 12 and nylon 6 are preferred.
  • the average particle diameter of the particles (A) of the thermoplastic resin in the present invention is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and still more preferably 15 ⁇ m or less in order to secure the adhesion strength.
  • the average particle diameter of the particles (A) of the thermoplastic resin in the present invention is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, in order to secure the stress relaxation performance of the cured conductive adhesive. And 5 ⁇ m or more.
  • the shape of the particles (A) of the thermoplastic resin in the present invention is not particularly limited, and examples thereof include substantially spherical, cubic, cylindrical, prismatic, conical, conical, pyramidal, flake, foil and dendritic shapes, etc. However, a substantially spherical or cubic shape is preferable.
  • the content of the particles (A) of the thermoplastic resin is the composition of the conductive adhesive in order to prevent peeling of the material to be bonded at a high level when subjected to repeated temperature changes.
  • the content is preferably 0.5% by mass or more, more preferably 1% by mass or more, and still more preferably 2% by mass or more based on the total amount of the substance.
  • the conductive filler (B) in the present invention is not particularly limited as long as it is a component that contributes to the conductivity in the conductive adhesive composition.
  • metals, carbon nanotubes and the like are preferable.
  • metal all metal powders treated as a general conductor can be used.
  • simple substances such as silver, copper, gold, nickel, aluminum, chromium, platinum, palladium, tungsten, and molybdenum, alloys comprising these two or more metals, coated articles of these metals, oxides of these metals, or oxides of these metals And compounds having good conductivity, and the like.
  • metals having silver or copper as a main component are more preferable because they are resistant to oxidation and high thermal conductivity, and metals having silver as a main component are particularly preferable because they are excellent in conductivity and antioxidative property.
  • the term "main component" refers to the component with the highest content among the components in the conductive filler.
  • the average particle size (D50) of the conductive filler (B) is not particularly limited, but the cost at the time of pulverizing the conductive filler (B), easiness of paste formation, securing of adhesion to a material to be adhered, etc. From the viewpoint, it is preferably 0.5 to 10 ⁇ m, more preferably 0.7 to 8 ⁇ m, and still more preferably 0.8 to 6 ⁇ m.
  • the tap density of the conductive filler (B) is not particularly limited, but is preferably 4 g / cm 3 or more, more preferably 5 g / cm 3 or more, in order to ensure the adhesion strength to the adherend material Preferably, it is more preferably 5.5 g / cm 3 or more. Moreover, in order to prevent the conductive filler (B) from settling and becoming unstable when the conductive adhesive composition is stored for a long period of time, it is preferably 8 g / cm 3 or less, and 7.5 g / cm 3 or less Is more preferably 7 g / cm 3 or less.
  • the tap density is measured and calculated, for example, by the metal powder-tap density measuring method of JIS standard Z 2512: 2012.
  • the specific surface area of the conductive filler (B) is not particularly limited, but is preferably 0.1 to 3 m 2 / g, more preferably 0.2 to 2 m 2 / g, and still more preferably 0.3. It is ⁇ 1 m 2 / g.
  • the specific surface area of the conductive filler (B) is 0.1 m 2 / g or more, the surface area of the conductive filler (B) in contact with the adherend material can be secured.
  • the specific surface area of the conductive filler (B) is 3 m 2 / g or less, the amount of solvent added to the conductive composition can be reduced.
  • the shape of the conductive filler (B) is not particularly limited, and examples thereof include powder, sphere, flake, foil, plate, dendritic and the like. In general, flakes or spheres are selected. In addition to particles of a single metal, metal particles surface-coated with other metals, or mixtures of these can be used.
  • the conductive filler (B) may have its surface coated with a coating agent.
  • a coating agent the coating agent containing carboxylic acid is mentioned, for example.
  • the carboxylic acid contained in the coating agent is not particularly limited, and examples thereof include monocarboxylic acid, polycarboxylic acid and oxycarboxylic acid.
  • the carboxylic acid contained in the coating agent may be a mixture of two or more. Further, higher fatty acids which are saturated fatty acids or unsaturated fatty acids having 12 to 24 carbon atoms are preferable.
  • a method of coating the surface of the conductive filler (B) with a coating agent for example, a method of stirring and kneading both in a mixer, impregnating the conductive filler (B) with a solution of carboxylic acid to volatilize the solvent
  • a coating agent for example, a method of stirring and kneading both in a mixer, impregnating the conductive filler (B) with a solution of carboxylic acid to volatilize the solvent
  • the content of the conductive filler (B) is preferably 80% by mass or more based on the total amount of the conductive adhesive composition to improve the conductivity and the thermal conductivity, and is 82% by mass or more. It is more preferable to make it 84 mass% or more. Further, in order to secure the ease of paste formation, the content is preferably 95% by mass or less, more preferably 92% by mass or less, and still more preferably 90% by mass or less.
  • the particles (A) of the thermoplastic resin and the conductive filler (B) may be dispersed in the binder resin.
  • the binder resin is not particularly limited, for example, an epoxy resin, a phenol resin, a urethane resin, an acrylic resin, a silicone resin, a polyimide resin, etc. can be used, and these may be used alone or in combination.
  • the binder resin in the present invention is preferably a thermosetting resin, and particularly preferably an epoxy resin. When a binder resin is contained, it is preferable to use 0.5 mass% or more.
  • the content of the binder resin is preferably 15% by mass or less, more preferably 10% by mass or less, and still more preferably 8% by mass or less based on the total amount of the conductive adhesive composition. .
  • the content of the binder resin is 15% by mass or less, a network due to necking of the conductive filler is easily formed, and stable conductivity and thermal conductivity can be obtained.
  • the conductive adhesive composition of the present invention may also contain, for example, a curing agent.
  • a curing agent examples include amine-based curing agents such as tertiary amines, alkyl ureas and imidazoles, and phenol-based curing agents.
  • the content of the curing agent is preferably 5% by mass or less based on the total amount of the conductive adhesive composition.
  • a curing accelerator can also be incorporated into the conductive adhesive composition of the present invention.
  • a curing accelerator for example, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-methyl-4-methylimidazole, 1-cyano-2-ethyl Examples thereof include imidazoles such as -4-methylimidazole, tertiary amines, triphenylphosphines, urea compounds, phenols, alcohols, and carboxylic acids.
  • the curing accelerator may be used alone or in combination of two or more.
  • the compounding quantity of a hardening accelerator is not limited and may be determined suitably, when using it, it is generally 1.5 mass% or less with respect to the whole quantity of the conductive adhesive composition of this invention .
  • the conductive adhesive composition of the present invention may further contain a solvent to paste the conductive adhesive composition.
  • a solvent which does not dissolve it is used.
  • Others are not particularly limited, but those having a boiling point of 350 ° C. or less are preferable, and those having a boiling point of 300 ° C. or less are more preferable because the solvent is easily volatilized during curing of the conductive adhesive composition.
  • acetate, ether, hydrocarbon and the like can be mentioned, and more specifically, dibutyl carbitol, butyl carbitol acetate and the like are preferably used.
  • the content of the solvent is usually 15% by mass or less with respect to the conductive adhesive composition, and preferably 10% by mass or less from the viewpoint of workability.
  • the conductive adhesive composition of the present invention in addition to the above components, antioxidants, ultraviolet light absorbers, tackifiers, viscosity modifiers, dispersants, coupling agents, toughness imparting agents, elastomers, etc. It can be suitably blended in the range which does not impair the effect of the present invention.
  • the conductive adhesive composition of the present invention can be obtained by mixing and stirring the above (A) and (B) and other components in any order.
  • a dispersion method for example, a system such as two rolls, three rolls, a sand mill, a roll mill, a ball mill, a colloid mill, a jet mill, a bead mill, a kneader, a homogenizer, and a propellerless mixer can be adopted.
  • the cured conductive adhesive of the present invention is obtained by curing the above-described conductive adhesive composition of the present invention.
  • the method of curing is not particularly limited, for example, a conductive adhesive cured product can be obtained by heat treating the conductive adhesive composition at 100 to 250 ° C. for 0.5 to 3 hours.
  • the thermal conductivity of the conductive adhesive cured product of the present invention is preferably 5 W / m ⁇ K or more, more preferably 10 W / m ⁇ K or more, in order to ensure the heat radiation of the material to be bonded. Preferably, it is 20 W / m ⁇ K or more.
  • the thermal conductivity of the conductive adhesive cured product can be calculated using the method described in the section of the example.
  • the conductive adhesive composition is generally cured by heating to perform bonding.
  • the temperature of heating at that time is not particularly limited, but the conductive fillers (B), and the adhesive material and the conductive filler (B) form close contact with each other, and the adhesion portion is formed.
  • the temperature is preferably 100 ° C. or higher, more preferably 130 ° C. or higher, and still more preferably 150 ° C. or higher, in order to stabilize the shape.
  • the bonding between the conductive fillers (B) proceeds excessively, necking between the conductive fillers (B) occurs, and the conductive fillers (B) are firmly bonded to each other so as to avoid being too hard.
  • the temperature is preferably 230 ° C. or less, more preferably 210 ° C. or less.
  • a method of performing a thermal cycle test by the method described later in the section of the example and measuring the ratio of the peeled area after the test by the method described later in the section of the example can be mentioned. It is preferable that the ratio of the peeling area measured by the said method is 15% or less, It is more preferable that it is 10% or less, It is more preferable that it is 5% or less.
  • the conductive adhesive composition of the present invention can be used for bonding parts in electronic devices.
  • Thermoplastic resin particles (3) “4000 EDX NAT COS” (trade name), Arkema Co., copolymer of nylon 6 and nylon 12, average particle diameter d50: 10 ⁇ m, spherical, melting point: 170 to 210 ° C.
  • thermoplastic resin particles (1) “SX-500H” (trade name), manufactured by Soken Chemical Co., Ltd., made of styrene copolymer, average particle diameter d50: 5 ⁇ m, spherical, decomposition start at 260 to 300 ° C., etc.
  • Silver particles (1) flake-like, average particle diameter d50: 4 ⁇ m, tap density: 6.7 g / cm 3 , manufactured by Tanaka Kikinzoku Kogyo Co., Ltd.
  • Epoxy resin (1) bisphenol F type (“EPICLON 831-S” (trade name), manufactured by Dainippon Ink and Chemicals, Inc., liquid at room temperature, epoxy equivalent: 169 g / eq -Epoxy resin (2): Phenol novolak type ("EPALLOY 8330" (trade name), manufactured by Emerald Performance Materials, liquid at room temperature, epoxy equivalent: 177 g / eq Epoxy resin (3): 1,4 butanediol glycidyl ether ("ERISYS GE-21” (trade name), manufactured by CVC, liquid at room temperature, epoxy equivalent: 125 g / eq Curing agent: Phenolic curing agent (MEH 8000 H, manufactured by Meiwa Kasei Co., Ltd.) Hardener acceleration: 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ) Solvent: butyl carbitol acetate (made by Tokyo Chemical Industry Co
  • the obtained conductive adhesive composition is applied to a 10 mm ⁇ 10 mm silver-plated copper lead frame, and a 5 mm ⁇ 5 mm silver sputtering silicon chip is placed on the coated surface, and then 60 at 250 ° C. in a nitrogen atmosphere.
  • a silver bonded body (hereinafter, also simply referred to as a “silver bonded body”) was prepared by heating a silver lead-plated copper lead frame and a silver-sputtered silicon chip using a conductive adhesive cured product.
  • the thermal conductivity of the obtained silver bonded body is shown in Table 1.
  • the silver bonded body obtained in the example had a smaller peeled area after the thermal cycle test compared to the silver bonded body obtained in the comparative example. From this result, it was confirmed that the conductive adhesive composition of the present invention can achieve adhesion which is hard to cause peeling of the material to be adhered even when the temperature change is repeated.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'objectif de la présente invention est de fournir une composition adhésive conductrice qui, même lorsqu'elle est soumise à plusieurs reprises à des changements de température, est peu susceptible de provoquer l'écaillage d'un matériau adhérent. La présente invention concerne une composition adhésive conductrice comprenant : des particules (A) d'une résine thermoplastique qui se présente sous la forme d'un solide à 25 °C ; et une charge conductrice (B), la résine thermoplastique étant un polyamide qui a un point de fusion d'au maximum 250 °C et comprend un squelette aliphatique.
PCT/JP2018/026103 2017-07-11 2018-07-10 Composition adhésive conductrice Ceased WO2019013230A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-135203 2017-07-11
JP2017135203 2017-07-11

Publications (1)

Publication Number Publication Date
WO2019013230A1 true WO2019013230A1 (fr) 2019-01-17

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Application Number Title Priority Date Filing Date
PCT/JP2018/026103 Ceased WO2019013230A1 (fr) 2017-07-11 2018-07-10 Composition adhésive conductrice

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WO (1) WO2019013230A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019013231A1 (ja) * 2017-07-11 2020-07-16 田中貴金属工業株式会社 導電性接着剤組成物
KR20230009942A (ko) 2020-05-18 2023-01-17 다나카 기킨조쿠 고교 가부시키가이샤 도전성 조성물, 도전성 소결부, 및 도전성 소결부를 구비하고 있는 부재

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051043A1 (fr) * 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. Film adhésif de connexion de circuit et structure de connexion de circuit
JP2015519459A (ja) * 2012-06-14 2015-07-09 ヘクセル コンポジッツ、リミテッド 複合材料の改良
WO2015146781A1 (fr) * 2014-03-24 2015-10-01 東レ株式会社 Préimprégné et matériau composite renforcé de fibres
WO2016063931A1 (fr) * 2014-10-24 2016-04-28 ナミックス株式会社 Composition conductrice et composant électronique utilisant cette dernière

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051043A1 (fr) * 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. Film adhésif de connexion de circuit et structure de connexion de circuit
JP2015519459A (ja) * 2012-06-14 2015-07-09 ヘクセル コンポジッツ、リミテッド 複合材料の改良
WO2015146781A1 (fr) * 2014-03-24 2015-10-01 東レ株式会社 Préimprégné et matériau composite renforcé de fibres
WO2016063931A1 (fr) * 2014-10-24 2016-04-28 ナミックス株式会社 Composition conductrice et composant électronique utilisant cette dernière

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019013231A1 (ja) * 2017-07-11 2020-07-16 田中貴金属工業株式会社 導電性接着剤組成物
JP7069162B2 (ja) 2017-07-11 2022-05-17 田中貴金属工業株式会社 導電性接着剤組成物
KR20230009942A (ko) 2020-05-18 2023-01-17 다나카 기킨조쿠 고교 가부시키가이샤 도전성 조성물, 도전성 소결부, 및 도전성 소결부를 구비하고 있는 부재
DE112021002818T5 (de) 2020-05-18 2023-04-06 Tanaka Kikinzoku Kogyo K.K. Elektrisch leitfähige zusammensetzung, elektrisch leitfähiger sinterteil und bauteil mit elektrisch leitfähigem sinterteil
KR20250044457A (ko) 2020-05-18 2025-03-31 다나카 기킨조쿠 고교 가부시키가이샤 도전성 조성물, 도전성 소결부, 및 도전성 소결부를 구비하고 있는 부재

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