WO2019006740A1 - Assembly method, and terminal - Google Patents

Abstract

Provided are an assembly method and a terminal, wherein same relate to the technical field of terminals, and can completely install a fingerprint module in a cover plate, such that at least a part of a touch display component can extend directly below the fingerprint module, thereby improving the screen-to-body ratio of the terminal. The specific solution is: a terminal 20 comprising a fingerprint module 21, and an upper first cover plate 22 and a lower touch display module 23 arranged in a stacked manner, wherein the first cover plate 22 is provided with an opening hole 221, and the opening hole 221 is close to the bottom of the first cover plate 22; the thickness of the fingerprint module 21 is less than or equal to the thickness of the first cover plate 22, and the fingerprint module 21 is completely arranged in the opening hole 221; and at least a part of the touch display module 23 is located directly below the fingerprint module 21. The embodiments of the present application are used for increasing the screen-to-body ratio.

Description

Assembly method and terminal Technical field

The embodiments of the present invention relate to the field of terminal technologies, and in particular, to an assembly method and a terminal.

Background technique

With the development of smart phones, fingerprint recognition has become a necessary basic function of touch-screen phones. The fingerprint identification scheme mainly includes a fingerprint module front scheme and a fingerprint module rear scheme. The front scheme may include a front cover scheme and a front hidden scheme, and the rear scheme may include a rear ink coating scheme. Among them, the pre-program is more in line with the user's usage habits and is favored by more users. Moreover, as users demand higher and higher appearance of mobile phones, high-screen ratio and ultra-thin mobile phones are more and more popular among users.

In the pre-solution, the fingerprint module is located below the touch display module, which occupies the width of the "chin" of the mobile phone, and thus the design of the high-screen ratio of the mobile phone is a great challenge. For example, in the prior art, a recess 02 is formed on the bottom of the cover glass 01 of the mobile phone screen, and then the fingerprint module 03 is attached to the recess 02 to realize the front hidden type. Fingerprint identification scheme. A cross-sectional view of the handset implemented by the solution can be seen in Figure 1a. The distance between the fingerprint module 03 and the top of the cover glass 01 can be controlled within 0.2-0.3 mm to meet the requirements of productivity, reliability and recognition performance.

In the existing pre-plan shown in FIG. 1a, the touch screen module 04 and the fingerprint module 03 are both located on the lower layer of the cover glass 01, and the touch screen module 04 is to avoid the fingerprint module 03, thereby affecting the screen. The area of the display area makes the length of the "chin" of the mobile phone long, resulting in a relatively low screen of the mobile phone. For example, referring to the existing scheme shown in FIG. 1b, the length of the "chin" of the mobile phone is ≥10 mm.

Summary of the invention

The embodiment of the present invention provides an assembly method and a terminal, which can completely install the fingerprint module in the cover, so that at least a portion of the touch display component can extend directly under the fingerprint module, thereby increasing the proportion of the terminal screen.

To achieve the above objective, the embodiment of the present application adopts the following technical solutions:

In a first aspect, a terminal 20 is provided, including: a fingerprint module 21, a stacked upper first cover 22 and a lower touch display module 23. The first cover 22 is provided with an opening 221, and the opening 221 is disposed near the bottom of the first cover 22. The thickness of the fingerprint module 21 is less than or equal to the thickness of the first cover 22, and the fingerprint module 21 is completely disposed in the opening 221 . At least a portion of the touch display module 23 is located directly below the fingerprint module 21.

In this way, since the fingerprint module 21 is not required to be avoided, at least a part of the touch display module 23 can be extended directly below the fingerprint module 21, so that the occupied area of the touch display module 23 can be increased, and the proportion of the mobile phone screen can be increased.

In combination with the first aspect, in one possible implementation, the opening 221 is a through hole or a blind hole.

In this way, the specific form of the opening 221 can be made more flexible.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the fingerprint module 21 is recessed into the upper surface of the terminal 20, or a portion of the fingerprint module 21 is protruded from the upper surface of the terminal 20.

In this way, the user can be made to perceive the fingerprint recognition position on the upper surface of the terminal 20.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the touch display module 23 is a stacked structure, and the touch display module 23 further includes a first circuit board 231, and the first circuit board 231 is touched. The middle layer of the display module 23 is led out. At least a portion of the touch display module 23 is located directly below the fingerprint module 21, and at least a portion of the first circuit board 231 is located directly below the fingerprint module 21.

In this way, since the fingerprint module 21 is not required to be avoided, as a component of the touch display module 23, at least a portion of the first circuit board 231 can extend directly below the fingerprint module 21, thereby increasing the ratio of the screen of the mobile phone.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the touch display module 23 can include an ative area (AA) region 44, and at least a portion of the peripheral region of the AA region can be extended to Directly below the fingerprint module 21.

In this way, the fingerprint module 21 does not hinder the display of the AA area, and can further increase the area of the display area and increase the proportion of the mobile phone screen.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the boundary of the AA area is located just below the fingerprint module 21.

In this way, the area of the display area can be increased to a greater extent, and the proportion of the screen of the mobile phone can be increased.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the terminal 20 further includes a hollow design fixing ring 24, the thickness of the fixing ring 24 being less than or equal to the thickness of the first cover plate 22, and the fingerprint mode The set 21 is mounted in the opening 221 by a retaining ring 24. The lower end of the fixing ring 24 is designed with a first step 241. The first step 241 protrudes in a direction close to the central axis 2210 of the opening, and the fingerprint module 21 is nested in the fixing ring 24.

In this way, the fixing ring 24 does not hinder the extension of the touch display module 23, and at least a portion of the touch display module 23 can extend directly below the fingerprint module 21, so that the mobile phone screen ratio can be increased; and the first step 241 can The fingerprint module 21 is supported under the fingerprint module 21 to prevent the fingerprint module 21 from collapsing when the user presses the fingerprint module 21, thereby improving the reliability of the drop, the steel ball and the static pressure.

In combination with the first aspect and the above possible implementation, in another possible implementation, the section 223 of the first cover 22 at the opening 221 includes a first slope 224, and the first slope 224 is located at the lower end of the section 223 and Tilting away from the center axis 2210 of the hole, the first bevel 224 is used to dispense the retaining ring 24.

In this way, a larger area between the first cover 22 and the fixing ring 24 can be used to bond the fixing ring 24 and the first cover 22, so that the bonding is stronger and the waterproof and dustproof effect is achieved.

In combination with the first aspect and the above possible implementation, in another possible implementation, the section 223 of the first cover 22 at the opening 221 further includes a second slope 225, and the second slope 225 is located. The upper end of the section 223 is inclined in a direction away from the central axis 2210 of the hole. The upper end of the fixing ring 24 is designed with a second step 242. The second step 242 protrudes away from the central axis 2210 of the hole. The second step 242 includes a third inclined surface 243. The third inclined surface 243 is disposed corresponding to the second inclined surface 225. The two inclined surfaces 225 are used for supporting the fixing ring 24 and the fingerprint module 21 in cooperation with the third inclined surface 243.

In this way, the third inclined surface 243 can be engaged with the second inclined surface 225 of the first cover 22, so that the fixing ring 24 is hung on the first cover 22, preventing the fingerprint module 21 from collapsing when the user presses the fingerprint module 21 hard. Improve the reliability of drops, steel balls and static pressure.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the fingerprint module 21 includes an upper layer fingerprint identification chip 211 and a lower layer second circuit board 212 disposed in a stack, and the lower surface of the fingerprint identification chip 211 is disposed. There is a pin 2111, the pin 2111 is concentratedly distributed in a central area of the lower surface, and the fingerprint identification chip 211 is electrically connected to the second circuit board 212 through the pin 2111. The distribution area of the pin 2111 on the lower surface is the first area 213, and the lower surface further includes a second area 214 located at the periphery of the first area 213, and the second area 214 is overlapped with the upper surface of the first step 241.

In this way, the fingerprint module 21 can be supported by the first step 241 of the fixing ring 24 to prevent the fingerprint module 21 from collapsing when the user presses the fingerprint module 21 hard.

In combination with the first aspect and the above possible implementation, in another possible implementation, the second region 214 and the upper surface of the first step 241 are bonded by the foam rubber 216.

In this way, the fingerprint module 21 can be more firmly fixed in the fixing ring 24, which prevents the fingerprint module 21 from collapsing when the user presses the fingerprint module 21 hardly, and can also play the role of waterproof and dustproof, and can also be convenient. The removal of the fingerprint module 21 facilitates repair and replacement of the fingerprint module 21.

In conjunction with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the second circuit board 212 is a flexible circuit board, and the fingerprint module 21 further includes a reinforcing board 215 located under the second circuit board 212.

Wherein, the flexible circuit board can meet the thickness requirement of the ultra-thin mobile phone, and the reinforcing plate 215 can support the flexible second circuit board 212 to protect the pad on the flexible second circuit board 212 and the tube on the lower surface of the fingerprint identification chip 211. Feet 2111.

With reference to the first aspect and the foregoing possible implementation manner, in another possible implementation manner, the lower surface of the fingerprint chip 211 further includes a third area 217, and the third area 217 is located between the first area 213 and the second area 214. The third area 217 is used for underfill dispensing between the fingerprint identification chip 211 and the second circuit board 212.

In this way, there can be sufficient area for underfill dispensing, so that the colloid can penetrate more fully along the fingerprint identification chip 211 between the first region 213 and the second circuit board 212, thereby better filling the pads. The gap between the two serves to protect the pad of the second circuit board 212 and to prevent water and dust.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the touch display module 23 is an oncell mode undercell mode, an incell mode, or an OGS mode, and the touch display module 23 includes a liquid crystal display. , LCD) panel or organic light-emitting diode (OLED) panel.

In this way, the touch display module 23 can have multiple implementations, thereby enabling the implementation of the terminal 20. The way is more flexible.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the thickness of the fingerprint module 21 is less than or equal to 0.8 mm.

Thus, the thickness of the fingerprint module 21 can generally be made less than or equal to the thickness of the first cover plate 22.

With reference to the first aspect and the foregoing possible implementation manners, in another possible implementation manner, the fingerprint identification chip 211 includes a die 2112, and the die 2112 is packaged in an open mold.

Compared with the over molding or double-sided molding package, the open die package can make the corresponding drop of the packaged die 2112 smaller, more reliable, and less likely to be damaged when the external force is impacted.

In combination with the first aspect and the above possible implementation manners, in another possible implementation manner, the thickness of the die 2112 is 0.15 mm, and the thickness of the fingerprint identification chip 211 is 0.25 mm.

In this case, a fingerprint module 21 having a small thickness and high reliability can be obtained.

In combination with the first aspect and the foregoing possible implementation manners, in another possible implementation manner, when the opening 221 is a through hole, the fingerprint module 21 further includes a second cover 218 disposed on the upper layer of the fingerprint identification chip 211.

In this way, the fingerprint module 21 can be protected by the second cover 218 to prevent scratching or damage to the fingerprint recognition chip 211.

In combination with the first aspect and the above possible implementation, in another possible implementation, the second cover 218 is a ceramic cover or a glass cover.

In this way, the second cover 218 can be embodied in various ways, which can improve the flexibility of the solution.

In combination with the first aspect and the above possible implementation manners, in another possible implementation manner, the second cover plate 218 is ceramic, and the second cover plate 218 has a thickness of 0.12 mm.

In this case, a second cover 218 having a larger hardness and a smaller thickness can be obtained.

In combination with the first aspect and the above possible implementation, in another possible implementation, the fixing ring 24 is made of a metal material.

In this way, the static electricity from the user can be prevented from interfering with or damaging the mobile phone components such as the fingerprint module 21 by the fingers while ensuring the strength of the fixing ring 24.

In combination with the first aspect and the above possible implementation manner, in another possible implementation manner, the first cover plate 22 is a glass cover plate, a transparent plastic cover plate or a composite cover plate.

In this way, the first cover plate 22 can be embodied in various manners, which can improve the flexibility of the solution.

In a second aspect, an embodiment of the present application provides a method for assembling a terminal, where the terminal includes a fingerprint module, a hollow design fixing ring and a cover plate, and the cover plate is designed with an opening. The method includes first: bonding the retaining ring to the opening by an adhesive. Then, the fingerprint module is nested in the fixing ring, and the bottom of the fingerprint module and the inside of the fixing ring are bonded by the foam rubber, and the thickness of the fingerprint module and the fixing ring is less than or equal to the thickness of the cover plate.

In this way, when the fixing ring is first dispensed with the cover plate, since there is no interference of the fingerprint module cable during the dispensing process, the dispensing is easy, and even if the dispensing fails, only one cover plate and the fixing ring are lost. The fingerprint module is not involved, which improves the yield. Moreover, the fingerprint module is bonded to the fingerprint module by the foam glue. It also facilitates repair and replacement of the fingerprint module.

DRAWINGS

1a is a cross-sectional view of a terminal provided in the prior art;

Figure 1b is a cross-sectional view of another terminal provided in the prior art;

1c is a top view of a terminal provided in the prior art;

2 is a schematic structural diagram of a mobile phone according to an embodiment of the present application;

3a is a schematic cross-sectional view of an embodiment of the present application;

FIG. 3b is a cross-sectional view of a terminal according to an embodiment of the present application;

3c is a cross-sectional view of another terminal according to an embodiment of the present application;

3d is a cross-sectional view of another terminal according to an embodiment of the present application;

3e is a cross-sectional view of another terminal according to an embodiment of the present application;

4a is a schematic structural diagram of a touch display module according to an embodiment of the present application;

4b is a schematic structural diagram of another touch display module according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another touch display module according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of another touch display module according to an embodiment of the present disclosure;

Figure 7 is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 8 is a cross-sectional view of another terminal according to an embodiment of the present application;

FIG. 9 is a cross-sectional view of another terminal according to an embodiment of the present application;

FIG. 10a is a schematic diagram of a location of an effective display area according to an embodiment of the present application;

Figure 10b is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 11 is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 12a is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 12b is a schematic cross-sectional view of an embodiment of the present application;

Figure 13 is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 14 is a cross-sectional view of another terminal according to an embodiment of the present application;

15 is a cross-sectional view of another terminal according to an embodiment of the present application;

FIG. 16 is a schematic diagram of a corresponding relationship between a pin distribution and a circuit board according to an embodiment of the present application;

Figure 16b is a cross-sectional view of another terminal according to an embodiment of the present application;

FIG. 17 is a schematic structural diagram of a fingerprint identification chip according to an embodiment of the present application;

FIG. 18 is a cross-sectional view of another terminal according to an embodiment of the present application;

FIG. 19 is a schematic partial view of a cross-sectional view of a terminal according to an embodiment of the present disclosure;

20a is a bottom view of a fingerprint identification chip according to an embodiment of the present application;

Figure 20b is a cross-sectional view of another terminal according to an embodiment of the present application;

20c is a schematic diagram of area division of a lower surface of a fingerprint identification chip according to an embodiment of the present application;

Figure 20d is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 20e is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 20f is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 20g is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 21a is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 21b is a cross-sectional view of another terminal according to an embodiment of the present application;

21c is a cross-sectional view of another terminal according to an embodiment of the present application;

Figure 22 is a drop-spherical strain histogram provided by an embodiment of the present application;

FIG. 23 is a schematic structural diagram of another fingerprint identification chip according to an embodiment of the present disclosure;

FIG. 24 is a top view of a terminal according to an embodiment of the present application;

FIG. 25 is a flowchart of a method for assembling a terminal according to an embodiment of the present application.

Detailed ways

For ease of understanding, the description of some of the concepts related to the embodiments of the present application is given for reference. As follows:

Screen ratio: The relative ratio of the display area to the front panel area of the terminal.

Dispensing: A process, also known as sizing, gluing, potting, dispensing, etc., is to apply, potting, or dripping electronic glue, oil or other liquid onto the product, so that the product can be pasted and potted. , insulation, fixing, smooth surface and so on.

Foam rubber: Ethylene-vinyl acetate EVA foam or polyethylene (PE) foam as the substrate, coated with solvent-based (or hot-melt) pressure-sensitive adhesive on one or both sides, and then Made of release paper, it has sealability, compression set resistance, flame retardancy, wettability, etc.

Underfill: The underfill of the chip scale package, the ball grid array, and the stacked package on the board.

For the fingerprint module front-end scheme, since the fingerprint module on the front panel is located below the touch display module, the buttons, data interfaces, and circuit board cables of the mobile terminal are in this area, so the volume of the fingerprint module It must be small enough to prevent interference with other modules, and the thickness of the fingerprint module should be thin enough to achieve high screen ratio and ultra-thin terminal design.

In the existing front scheme, since the touch display module of the lower layer of the cover layer avoids the fingerprint module, the area of the screen display area is reduced, and the screen ratio of the terminal is reduced. In the fingerprint identification scheme provided by the embodiment of the present application, the fingerprint module can be completely installed in the cover plate, so that the touch display module of the lower layer of the cover can extend directly below the fingerprint module, thereby increasing the area of the display area. Increase the proportion of mobile phone screens.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. In the description of the embodiments of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", The orientation or positional relationship of the indications of "horizontal", "top", "bottom", "inner", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplified description. It is not intended or implied that the device or component that is referred to has a particular orientation, is constructed and operated in a particular orientation, and thus is not to be construed as limiting the invention.

It should be noted that the terminal provided by the embodiment of the present application may be a terminal device with a touch display function, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, and an individual. Digital assistant (PDA) Ready.

Specifically, the embodiment of the present application introduces a terminal provided by an embodiment of the present application by using a mobile phone as an example. As shown in FIG. 2, the mobile phone 10 may include: a screen 11, a processor 12, a memory 13, a power source 14, a radio frequency (RF) circuit 15, a gravity sensor 16, an audio circuit 17, a speaker 18, a microphone 19, and the like. These components can be connected by bus or directly. It will be understood by those skilled in the art that the structure of the handset shown in FIG. 2 does not constitute a limitation to the handset, and may include more components than those illustrated, or some components may be combined, or different components may be arranged.

The screen 11 can be a touch display panel with display and touch functions. Specifically, the screen 11 can be used to display a graphical interface, and can also be used to display information input by the user or information provided to the user (such as an image collected by a camera) and various menus of the mobile phone, and can also be used to implement the mobile phone 10 Input and output functions to collect touch operations on or near the user (such as the user's use of a finger, stylus, etc., on any suitable object or accessory on or near screen 11), and according to preset The program drives the corresponding connection device. The touch display panel can be implemented by using a resistive type, a capacitive type, an infrared light sense, and an ultrasonic wave. The front fingerprint module 110 can also be included on the screen 11 for user fingerprint recognition. The fingerprint module 110 can also integrate navigation functions instead of the traditional three-button (return button, home button, and function button) mode.

The processor 12 is the control center of the handset 10, which connects various portions of the entire handset using various interfaces and lines, by running or executing software programs and/or modules stored in the memory 13, and recalling data stored in the memory 13, The various functions and processing data of the mobile phone 10 are executed to perform overall monitoring of the mobile phone 10. In a particular implementation, as an embodiment, processor 12 may include one or more processing units; processor 12 may integrate an application processor and a modem processor. The application processor mainly processes an operating system, a user interface, an application, and the like, and the modem processor mainly processes wireless communication. It will be appreciated that the above described modem processor may also not be integrated into the processor 12.

The memory 13 can be used to store data, software programs, and modules, and can be a volatile memory, such as a random-access memory (RAM), or a non-volatile memory. For example, a read-only memory (ROM), a flash memory, a hard disk drive (HDD), or a solid-state drive (SSD); or a combination of the above types of memories.

The power source 14, which can be a battery, is logically coupled to the processor 12 through a power management system to manage functions such as charging, discharging, and power management through the power management system.

The RF circuit 15 can be used for transmitting and receiving information or during a call, receiving and transmitting signals, and in particular, processing the received information to the processor 12; in addition, transmitting signals generated by the processor 12. Generally, RF circuits include, but are not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, and the like. In addition, the RF circuit 15 can also communicate with the network and other devices through wireless communication.

A gravity sensor 16 can detect the magnitude of the acceleration of the mobile phone in various directions (usually three axes), and can detect the magnitude and direction of gravity when stationary, and can be used to identify the gesture of the mobile phone (such as horizontal and vertical screen switching, related Game, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping). It should be noted that the mobile phone 10 may also include other sensors, such as a pressure sensor and a light transmission. Other sensors such as sensors, gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., are not described here.

The audio circuit 17, speaker 18, and microphone 19 provide an audio interface between the user and the handset 10. The audio circuit 17 can transmit the converted electrical data of the received audio data to the speaker 18 for conversion to the sound signal output by the speaker 18; on the other hand, the microphone 19 converts the collected sound signal into an electrical signal by the audio circuit 17 After receiving, it is converted into audio data, and then the audio data is output to the RF circuit 15 for transmission to, for example, another mobile phone, or the audio data is output to the processor 12 for further processing.

Although not shown, the mobile phone 10 may further include a wireless fidelity (WiFi) module, a Bluetooth module, a camera, and the like, and will not be further described herein.

Specifically, the terminal 20 and the assembly method provided by the embodiments of the present application are described in detail below with reference to the mobile phone 10 shown in FIG. 2 . It should be noted that the terminal provided by the embodiment of the present application may also be any terminal device other than the mobile phone shown in FIG. 2 .

A cross-sectional view of the mobile phone 200 provided by the embodiment of the present application corresponding to the cross-sectional line shown in FIG. 3a can be seen in FIG. 3b. It should be noted that the cross-sectional views in the following embodiments of the present application correspond to the cross-sectional lines shown in FIG. 3a. Sectional view. As can be seen from FIG. 3b, the mobile phone 200 can include a fingerprint module 21, a stacked upper first cover 22, and a lower touch display module 23. The first cover 22 may be provided with an opening 221, and the opening 221 is disposed near the bottom of the first cover 22. The thickness of the fingerprint module 21 is less than or equal to the thickness of the first cover 22, and the fingerprint module 21 is completely disposed in the opening 221 . At least a portion of the touch display module 23 is located directly below the fingerprint module 21.

Among them, in the mobile phone, the end of the camera is usually called the top, the other end opposite to the top is called the bottom, and the bottom is usually provided with a data interface.

FIG. 3b provides a front view of the fingerprint module 21, in which the first cover 22 is provided with an opening 221, and the thickness of the fingerprint module 21 is less than or equal to the thickness of the first cover 22. Therefore, the fingerprint module 21 can be completely disposed in the opening 221 of the first cover 22, and the bottom of the fingerprint module 21 does not protrude from the lower surface of the first cover 22, so that the touch display of the lower layer of the first cover 22 is provided. At least a portion of the module 23 can extend directly below the fingerprint module 21, and the touch display module 23 does not need to avoid the fingerprint module 21 as in the prior art, so that the touch display module 23 can occupy a larger area. The area of the display area is proportional to the area of the touch display module 23, so that the area of the display area of the mobile phone can be increased, and the proportion of the screen of the mobile phone can be increased.

It should be noted that FIG. 3b is an example in which the opening 221 is a through hole. In the embodiment of the present application, the opening 221 may also be a blind hole. When the opening 221 is a blind hole, refer to FIG. 3c. 3d and 3e, the opening 221 does not penetrate at the upper surface of the first cover 22, but retains a certain thickness. In the structure shown in FIG. 3d and FIG. 3e, the first cover 22 can be recessed or raised at the opening 221 to facilitate the user to perceive the position of the fingerprint recognition and improve the user experience. In the following embodiments of the present application, the structure shown in FIG. 3b will be mainly described as an example.

The first cover 22 can be used to protect components inside the mobile phone 200. The first cover 22 may be a cover glass, a transparent plastic cover or a composite cover or the like. Wherein, the glass cover plate may comprise a cover plate made of an anisotropic material, such as a sapphire glass cover plate, or by chemical vapor deposition (CVD) or physical vapor deposition (physical vapor deposition) on the glass substrate. PVD) technology is a cover plate made of an anisotropic material. The composite cover can be a composite cover of a variety of materials. For example, plastic and glass composite covers. The material and process of the first cover 22 are not specifically limited in the embodiment of the present application.

In a possible implementation manner, the thickness of the fingerprint module 21 is less than or equal to 0.8 mm.

When the thickness of the fingerprint module 21 is less than or equal to 0.8 mm, the thickness of the fingerprint module 21 is usually less than or equal to the thickness of the first cover 22, and the fingerprint module 21 can be completely disposed in the opening 221 of the first cover 22. .

In the embodiment of the present application, the touch display module 23 can be used to provide display and touch functions. Specifically, in an implementation manner, the touch display module 23 can be a resistive, capacitive, piezoelectric, infrared, or surface acoustic wave type; in structure, the touch display module 23 can be an oncell mode, an undercell mode, and an incell. Mode or OGS mode. Moreover, the touch display module 23 can generally include a liquid crystal display LCD panel or an organic motor light display OLED panel. The OLED panel may include a passive matrix organic light emitting diode (PMOLED) panel and an active matrix/organic light emitting diode (AMOLED) panel.

The oncell mode and the undercell mode refer to the touch panel 232 and the display panel 233 including the layered arrangement in the touch display module 23. 4a, in the oncell mode, the touch panel 232 is located on the upper layer of the display panel 233; see FIG. 4b, in the undercell mode, the touch panel 232 is located on the lower layer of the display panel 233. For example, a specific implementation of the oncell mode is to embed the touch panel function between the color filter substrate of the AMOLED and the polarizer. Referring to FIG. 5 , the incell mode refers to that the touch panel and the display panel in the touch display module 23 are integrated into the touch display panel 234 . For example, an incell mode is implemented by embedding the function of the touch panel into the liquid crystal pixels of the thin film transistor type liquid crystal display TFT-LCD panel. Referring to FIG. 6 , the OSG mode refers to that the touch panel 232 is integrated on the first cover 22 , and the display panel 233 and the touch panel 232 are layered.

Specifically, the touch display module 23 can be a stacked structure, and the touch display module 23 can further include a first circuit board 231. Referring to FIG. 7, the first circuit board 231 is taken out from the middle layer of the touch display module 23. At least a portion of the touch display module 23 is located directly below the fingerprint module 21 and includes at least a portion of the first circuit board 231 directly below the fingerprint module 21 .

One end of the first circuit board 231 is electrically connected to other components of the touch display module 23, and the other end is electrically connected to the main board of the mobile phone 200 through a connector. The first circuit board 231 is generally connected from the stacked touch display module 23 . The middle layer is taken out, and the first circuit board 231 is usually a flexible circuit board to meet the requirements of the ultra-thin mobile phone for the thickness of the mobile phone. As can be seen from FIG. 4a to FIG. 6, the touch display module 23 can have a plurality of layers of stacked structures. The layered structure means that the touch display module 23 is formed by stacking a plurality of layers. The first circuit board 231 is taken out from the middle layer of the touch display module 23, and the first circuit board 231 can be included from the touch display module 23. The lower layer of the layer or the upper layer of any layer is taken out. For example, in the case of FIG. 4a, the touch display module 23 can include a display panel 232 and a touch panel 233. The first circuit board 231 can be drawn from between the display panel 232 and the touch panel 233. The first circuit board 231 can be shared by the 232 and the touch panel 233.

When the first circuit board 231 is a flexible circuit board, in the lower layer of the first cover 22, the right side of the display module 23 is touched, and the related components 41, the data interface 42, etc. of the buttons (for example, the return key, the menu key, etc.) are also It takes a certain amount of space, so in order to save space, the first board needs to be folded. Exemplarily, referring to FIG. 8 , in a possible implementation manner, the first circuit board 231 is located from the middle layer of the touch display module 23 to the bottom. The direction is taken out and bent toward the lower side of the first circuit board 231. In this case, at least a portion of the first circuit board 231 in the embodiment of the present application may extend directly below the fingerprint module 21; in the prior art, when the circuit board of the touch display module is also bent When the folding setting is made, referring to FIG. 9 , since the fingerprint module 03 is to be avoided, the circuit board 05 electrically connected to the touch display module 04 cannot extend directly below the fingerprint module 03 . It can be seen that, in the embodiment of the present application, since at least a portion of the first circuit board 231 can extend directly below the fingerprint module 21, the area of the display area of the terminal 20 can be increased, and the proportion of the mobile phone screen can be increased.

Referring to FIG. 8 , the area of the first circuit board 231 located directly below the fingerprint module 21 may be provided with a line of the first circuit board 231 .

In addition, referring to FIG. 10a, the touch display module 23 can include an effective display AA area 44. In one possible implementation, referring to FIG. 10b, at least a portion of the peripheral area of the AA area (the area indicated by the dashed arrow in the touch display module 23) may extend directly below the fingerprint module 21. In particular, the boundary of the AA area is located just below the fingerprint module 21. In this way, the fingerprint module 21 does not hinder the display of the AA area, and can further increase the area of the display area and increase the proportion of the mobile phone screen.

It should be noted that since the buttons and data interfaces of the mobile phone also occupy a certain space in the "chin" area of the mobile phone, the touch display module 23 can extend but does not extend too much toward the bottom direction. However, in general, at least a portion of the first circuit board 231 may extend directly below the fingerprint module 21.

Further, referring to FIG. 11 , the mobile phone 200 may further include a fixing ring 24 of a hollow design. The thickness of the fixing ring 24 is less than or equal to the thickness of the first cover 22 , and the fingerprint module 21 is installed in the opening 221 through the fixing ring 24 . The lower end of the fixing ring 24 is designed with a first step 241. The first step 241 extends in a direction close to the central axis 2210 of the opening, and the fingerprint module 21 is nested in the fixing ring 24.

When the thickness of the fixing ring 24 is less than or equal to the thickness of the first cover 22, the upper end of the fixing ring 24 does not protrude from the upper surface of the first cover 22, and the lower end of the fixing ring 24 does not protrude from the first cover 22 The lower surface of the fixing ring 24 can be completely installed in the first cover 22. As can be seen from FIG. 11, the fingerprint module 21 is nested in the fixing ring 24, so that the fixing ring 24 and the fingerprint module 21 are not Blocking the extension of the touch display module 23, so that at least a portion of the touch display module 23 can extend directly below the fingerprint module 21, so that the mobile phone screen ratio can be increased; and when the lower end of the fixing ring 24 is designed with the first step 241 The fixing ring 24 can support the fingerprint module 21 through the first step 241 to support the fingerprint module 21, so as to prevent the fingerprint module 21 from collapsing when the user presses the fingerprint module 21, and the drop, the steel ball and the static are improved. Pressure reliability.

Further, referring to Fig. 12a, the section 223 of the first cover plate 22 at the opening 221 (shown in broken line in Fig. 12a) includes a first slope 224, the first slope 224 being located at the lower end of the section 223 and away from the center of the hole The direction of the shaft 2210 is inclined, and the first slope 224 is used to dispense the fixing ring 24.

The shape of the section 223 corresponds to the shape of the opening 221 . Illustratively, when the opening 221 is a cylinder, the shape of the section 223 is a cylindrical shape as shown in FIG. 12b.

Thus, by providing the first bevel 224 at the section 223 of the opening 221 of the first cover 22 and dispensing between the first bevel 224 and the retaining ring 24, the first cover 22 and the retaining ring 24 can be made There is a larger area to bond the fixing ring 24 and the first cover 22, so that the fixing ring 24 and the fingerprint module 21 in the fixing ring 24 can be more firmly fixed on the mobile phone 200, thereby improving the drop and the steel ball. And static pressure reliability, and achieve waterproof and dustproof effect.

The type of the first colloid 45 bonding the first inclined surface 224 and the fixing ring 24 in FIG. 13 is not specifically limited, and may be, for example, a thermosetting adhesive.

Further, referring to FIG. 14, the section 223 of the first cover plate 22 at the opening 221 further includes a second slope 225 that is located at the upper end of the section 223 and is inclined away from the hole center axis 2210. The upper end of the fixing ring 24 is designed with a second step 242. The second step 242 protrudes away from the central axis 2210 of the hole. The second step 242 includes a third inclined surface 243. The third inclined surface 243 is disposed corresponding to the second inclined surface 225. The two inclined surfaces 225 are used for supporting the fixing ring 24 and the fingerprint module 21 in cooperation with the third inclined surface 243.

The second step 242 designed with the third slope 243 may be referred to as a slope step, and the slope step may be engaged with the second slope 225 of the first cover 22 to hang on the first cover 22, so that the first The cover 22 can better support the fixing ring 24 and the fingerprint module 21, preventing the fingerprint module 21 from collapsing when the user presses the fingerprint module 21 hard, and improving the reliability of the drop, the steel ball and the static pressure.

The fixing ring 24 may specifically be a metal ring, a plastic ring or made of other materials. In a possible embodiment, the fixing ring 24 is made of a metal material with high strength and being easy to conduct, for example, an alloy material such as copper or stainless steel, so as to prevent the strength of the fixing ring 24 while preventing the user from being Static electricity interferes with or damages the mobile phone components such as the fingerprint module 21 by fingers.

In addition, referring to FIG. 15, in addition to the first inclined surface 224 of the first cover 22 and the fixing ring 24, the other contact surfaces of the first cover 22 and the fixing ring 24 can also be dispensed by dispensing. Bonding, so that the fingerprint module 21 in the fixing ring 24 and the fixing ring 24 can be more firmly fixed in the first cover 22, thereby improving the reliability of the drop, the steel ball and the static pressure, and achieving the waterproof and dustproof effect. . The first colloid 45 (the mesh filling portion in Fig. 15) for bonding herein may be a thermosetting glue.

Further, referring to FIG. 16a and FIG. 16b, the fingerprint module 21 may include an upper layer fingerprint identification chip 211 and a lower layer second circuit board 212 which are arranged in a stack. The lower surface of the fingerprint identification chip 211 is provided with a pin 2111, and the pin 2111 is concentrated. The fingerprint identification chip 211 is electrically connected to the second circuit board 212 through the pin 2111 in a central area of the lower surface. Wherein, the distribution area of the pin 2111 on the lower surface is the first area 213 (the area within the dotted line shown in FIG. 16a), and the lower surface further includes the second area 214 located outside the first area 213 (outside the dotted line shown in FIG. 16a) The second region 214 overlaps the upper surface of the first step 241.

The fingerprint identification chip 211 is a fingerprint sensor, and specifically may be a packaged chip. The package here may include a grid array (LGA) package, a ball grid array (BGA) package, and the like. Way, there is no specific limit here. The fingerprint identification chip 211 can have large mechanical strength and electrostatic-static discharge (ESD) protection capability, and is waterproof, dustproof, and corrosion-resistant, because it needs to meet the needs of frequent users. Illustratively, a schematic diagram of a laminated structure of a fingerprint identification chip 211 in the form of a through-silicon via (TSV) can be seen in FIG. Here, the PI layer represents a polyimide layer, the RDL layer represents a redistribution layer, and the EMC layer represents an epoxy molding compound layer.

One end of the second circuit board 212 is electrically connected to the fingerprint identification chip 211, and the other end is electrically connected to the main board of the mobile phone 200 through a connector. In particular, the second circuit board 212 can be a flexible circuit board to meet the thickness requirements of ultra-thin mobile phones.

Specifically, the upper surface of the second circuit board 212 may include a surface mounting area, and the surface mounting area is provided The surface mount area is disposed for mounting the fingerprint identification chip 211, and the surface mount area corresponds to a distribution area (ie, the first area 213) of the pin PAD 2111 of the lower surface of the fingerprint identification chip 211. The fingerprint identification chip 211 and the second circuit board 212 are electrically connected to the pad through the pin 2111. As can be seen from FIG. 16a, when the pins 2111 on the lower surface of the fingerprint recognition chip 211 are concentrated in the central area distribution, that is, the pins 2111 on the lower surface of the fingerprint identification chip 211 are contracted, the pins 2111 and the pads and the fingerprint identification chip 211 are passed through the pins 2111. The connected second circuit board 212 can also be correspondingly narrower. When the fingerprint module 21 includes the reinforcing plate 215, the reinforcing plate 215 can also be designed to be narrower corresponding to the second circuit board 212. This allows the lower surface of the fingerprint recognition chip 211 to leave a certain vacant area 46 on the periphery of the first area 213. The vacant area 46 may specifically be an area within a solid line outside the dotted line shown in Fig. 16a. The vacant area 46 may include a second area 214 for overlapping with the first step 241 of the fixing ring 24, so that the fingerprint module 21 is supported by the first step 241 of the fixing ring 24, so as to prevent the user from pressing the fingerprint module 21 hard. The fingerprint module 21 is collapsed.

In addition, when the second circuit board 212 is a flexible circuit board, referring to FIG. 18, the fingerprint module 21 may further include a reinforcing board 215 disposed on the lower layer of the second circuit board 212 for supporting the flexible second circuit board 212. The pad on the flexible second circuit board 212 and the pin 2111 on the lower surface of the fingerprint identification chip 211 connected to the pad are protected.

Further, referring to FIG. 19, the second surface 214 and the upper surface of the first step 241 may be bonded by a foam rubber 216 (a mesh filling region as shown in FIG. 19). In this way, the fingerprint module 21 can be more firmly fixed in the fixing ring 24, so as to be more firmly fixed on the mobile phone 200, so as to prevent the fingerprint module 21 from collapsing when the user presses the fingerprint module 21 hard, and the drop and steel are improved. Ball and static pressure reliability can also play the role of waterproof and dustproof. The foam rubber 216 may specifically include PE foam rubber, EVA foam rubber, polyurethane (PU) foam rubber and acrylic foam rubber.

It should be noted that, since the foam rubber 216 has detachability, when the second region of the lower surface of the fingerprint module 21 and the fixing ring 24 are bonded by the foam rubber 216, the fingerprint module 21 can be easily disassembled. It is convenient to repair and replace the fingerprint module 21.

Further, referring to FIG. 20a and FIG. 20b, the lower surface of the fingerprint identification chip 211 may further include a third area 217, the third area 217 is located between the first area 213 and the second area 214, and the third area 217 is used for The underfill glue is dispensed between the fingerprint identification chip 211 and the second circuit board 212.

Specifically, in FIG. 20a, the first region 213 is a region indicated by a solid small quadrangle, and a region between the solid small quadrilateral and the solid large quadrilateral represents the vacant region 46, and the region between the dotted quadrilateral and the solid large quadrilateral A second region 214 is shown, and the third region 217 is located between the first region 213 and the second region 214, that is, a region between the solid small quadrilateral and the dotted quadrilateral. In the embodiment of the present application, underfill dispensing through the third region 217 allows sufficient area for underfill dispensing, so that the colloid can penetrate the first region 213 more fully along the fingerprint identification chip 211. Between the second circuit board 212 and the second circuit board 212, the gap between the pads is better filled, and the pad of the second circuit board 212 is protected from water and dust.

In addition, a schematic diagram of the area division of the lower surface of the fingerprint identification chip 211 can also be seen in FIG. 20c. It is worth noting that the underfill dispensing area shown in Figure 20c has an opening that can be used to elicit the wire of the fingerprinting chip 211.

It should be noted that the above FIG. 4a to FIG. 20c are mainly described by taking the opening 221 as a through hole as an example. When the opening 221 is a blind hole, the mobile phone 200 provided by the embodiment of the present application may also be the structure shown in FIG. 20d, FIG. 20e, FIG. 20f or FIG. 20g. In FIG. 20e to FIG. 20g, the recess or protrusion of the first cover 22 at the opening 221 can facilitate the user to perceive the position of fingerprint recognition and improve the user experience.

Further, when the opening 221 is a through hole, on the basis of the structure shown in FIG. 20a to FIG. 20c, referring to FIG. 21a, the fingerprint module 21 may further include a second cover 218 disposed on the upper layer of the fingerprint identification chip 211. The second cover 218 has a large hardness and can be used to protect the fingerprint module 21 from scratching or damaging the fingerprint recognition chip 211. The second cover 218 may specifically be a ceramic cover or a cover glass, wherein the glass may comprise an anisotropic material such as sapphire glass. The second cover 218 may also be a cover plate formed by plating an anisotropic material on a glass substrate by CVD or PVD techniques. The material of the second cover 218 is not specifically limited herein.

In addition, when the opening 221 is a through hole, as shown in FIG. 21b, the fingerprint module 21 can also be recessed into the upper surface of the mobile phone 200; or, as shown in FIG. 21c, the fingerprint module 21 can also highlight the mobile phone 200. Upper surface setting. In this way, the user can be made aware of the location of the fingerprint recognition.

In addition, in the embodiment of the present application, the fingerprint identification chip 211 may specifically include a die DIE 2112, and the die 2112 may adopt an open mold, an over molding package, or a double-sided molding. Referring to FIG. 22, the double-sided molding package refers to the EMC of the upper layer and the lower layer of the die; the open molding of the open mold refers to the EMC of the lower layer of the die, and the EMC of the upper layer; the over molding package refers to the upper layer of the die. EMC, there is no EMC in the lower layer.

Referring to the simulation data in Table 1 and FIG. 22, in comparison with the third embodiment, the fourth embodiment, and the sixth embodiment, when the die 2112 inside the fingerprint identification chip 211 is packaged by open molding, the falling ball corresponding to the die 2112 should be changed small, so that It is explained that the bare chip 2112 and the fingerprint recognition chip 211 have higher reliability and are less likely to be damaged when an external force is struck. Wherein, the die DIE here may specifically be in the form of TSV.

Table 1

In addition, comparing the scheme 2 and the scheme 3 in Table 1, it is understood that when the thickness of the bare sheet 2112 is less than 0.15 mm, the risk of processing is high. Comparing Scheme 1 and Scheme 3 in Table 1, it can be seen that when the second cover plate 218 is a 0.12 mm ceramic cover plate, the corresponding ball drop strain of the die 2112 is small, so that the steel of the die 2112 and the fingerprint identification chip 211 can be reliably determined. It is more sexual and less susceptible to damage when impacted by external forces.

In one possible implementation, the die 2112 may have a thickness of 0.15 mm, and the die 2112 is open. In the open molding package, the thickness of the fingerprint recognition chip 211 is 0.25 mm, the fingerprint recognition chip 211 is packaged in an LGA, and the second cover 218 is a ceramic cover plate of 0.12 mm. For a schematic diagram of the stacking structure of the fingerprint module 21 corresponding to the implementation, refer to FIG. 23 . In the fingerprint module 21 shown in FIG. 23, the top and bottom layers are sequentially shown: a ceramic second cover plate 218 of 0.12 mm, an ink of 0.02 mm, a die attach film of 0.02 mm, A total thickness of the fingerprint module 21 of 0.75 mm is 0.25 mm fingerprint identification chip 211, 0.03 mm solder, 0.12 mm flexible second circuit board 212, and 0.15 mm reinforcing plate 216.

When the fingerprint module 21 shown in FIG. 23 is used, referring to FIG. 24, the length of the "chin" of the mobile phone can be less than or equal to 7 mm, which is smaller than the length of the "chin" shown in FIG. 1b in the prior art. Correspondingly, the screen ratio of the mobile phone shown in FIG. 24 is higher than that of the mobile phone shown in FIG. 1b.

The embodiment of the present application further provides a method for assembling a terminal, the terminal includes a fingerprint module, a hollow design fixing ring and a cover plate, and the cover plate is designed with an opening. Referring to FIG. 25, the method may include:

301. Bonding the fixing ring to the opening through an adhesive.

302. Nesting the fingerprint module in the fixing ring, the bottom of the fingerprint module and the inside of the fixing ring are bonded by the foam rubber, and the thickness of the fingerprint module and the fixing ring is less than or equal to the thickness of the cover plate.

The cover plate may be specifically the first cover plate 22 shown in FIG. 3b to FIG. 24 , wherein the fixing ring, the fingerprint module and the terminal may specifically be the fixing ring 24 shown in FIG. 3 b to FIG. Fingerprint module 21 and terminal 20. Wherein, since the thickness of the fingerprint module is less than or equal to the thickness of the cover plate, the fingerprint module can be completely disposed in the opening of the cover plate, and the bottom of the fingerprint module does not protrude from the lower surface of the cover plate, thereby making the lower layer of the cover plate At least a part of the touch display module can be extended directly below the fingerprint module 21, and the touch display module does not need to avoid the fingerprint module as in the prior art, so that the touch display module can occupy a larger area. Therefore, the area of the screen display area can be increased, and the proportion of the terminal screen can be increased.

The terminal that is commonly used in the prior art is assembled by bonding the fingerprint module and the fixing ring to the whole through the non-removable colloid, and then fixing the fixing ring and the cover plate by dispensing. In this way, since the fingerprint module has a long cable, it will interfere with the dispensing process of the fixing ring and the cover plate, which may easily lead to the failure of dispensing. When the dispensing fails, the fingerprint module and the fixing ring cannot be disassembled, so the fingerprint module, the fixing ring and the cover are scrapped, so that the yield is low.

In the assembly method provided by the embodiment of the present application, the fixing ring is first dispensed with the cover plate. At this time, since there is no interference of the fingerprint module cable during the dispensing process, the dispensing is easy, and even if the dispensing fails, Only one cover and a retaining ring are lost, and the fingerprint module is not involved, thereby improving the yield. In addition, since the fingerprint module is bonded to the fingerprint module by the foam rubber, it is also convenient to repair and replace the fingerprint module.

Although the present application has been described herein in connection with the embodiments of the present invention, those skilled in the art can understand and implement the disclosure by the drawings, the disclosure, and the appended claims. Other variations of the embodiments. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill several of the functions recited in the claims. Certain measures are recited in mutually different dependent claims, but this does not mean that the measures are not combined to produce a good effect.

While the present invention has been described in connection with the specific embodiments and embodiments thereof, various modifications and combinations can be made without departing from the spirit and scope of the application. Accordingly, this specification and accompanying The drawings are merely illustrative of the present invention as defined by the appended claims, and are intended to cover any and all modifications, variations, combinations or equivalents. It will be apparent to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit and scope of the application. Thus, it is intended that the present invention cover the modifications and variations of the present invention.

Claims (20)

A terminal (20), comprising: a fingerprint module (21), a stacked upper first cover (22) and a lower touch display module (23); The first cover plate (22) is provided with an opening (221), and the opening (221) is disposed near the bottom of the first cover plate (22); The thickness of the fingerprint module (21) is less than or equal to the thickness of the first cover (22), and the fingerprint module (21) is completely disposed in the opening (221); At least a portion of the touch display module (23) is located directly below the fingerprint module (21). The terminal (20) according to claim 1, wherein the opening 221 is a through hole or a blind hole. The terminal (20) according to claim 1 or 2, wherein the touch display module (23) is a stacked structure, and the touch display module (23) further includes a first circuit board (231). The first circuit board (231) is drawn from the middle layer of the touch display module (23), and at least a portion of the touch display module (23) is located directly below the fingerprint module (21), including: At least a portion of the first circuit board (231) is located directly below the fingerprint module (21). The terminal (20) according to any one of claims 1 to 3, wherein the terminal (20) further comprises a hollow design fixing ring (24), the fixing ring (24) having a thickness less than or equal to The thickness of the first cover plate (22), the fingerprint module (21) is installed in the opening (221) through the fixing ring (24); The lower end of the fixing ring (24) is designed with a first step (241), and the first step (241) protrudes in a direction close to the central axis (2210) of the opening, the fingerprint module (21) ) nested within the stationary ring (24). The terminal (20) according to claim 4, wherein a section (223) of the first cover (22) at the opening (221) comprises a first slope (224), the A bevel (224) is located at a lower end of the section (223) and is inclined away from a central axis (2210) of the opening, the first bevel (224) for dispensing the fixing ring (24) . The terminal (20) according to claim 4 or 5, wherein the section (223) of the first cover (22) at the opening (221) further comprises a second slope (225), The second slope (225) is located at an upper end of the section (223) and is inclined away from a central axis (2210) of the opening; The upper end of the fixing ring (24) is designed with a second step (242) protruding in a direction away from the central axis (2210) of the opening, the second step (242) comprising a third inclined surface (243), the third inclined surface (243) is disposed corresponding to the second inclined surface (225), and the second inclined surface (225) is configured to support the fixing by the third inclined surface (243) Ring (24) and the fingerprint module (21). The terminal (20) according to any one of claims 4-6, wherein the fingerprint module (21) comprises an upper layer fingerprint identification chip (211) and a lower layer second circuit board (212) arranged in a stack. The lower surface of the fingerprint identification chip (211) is provided with a pin (2111), the pin (2111) is concentratedly distributed in a central area of the lower surface, and the fingerprint identification chip (211) passes through the pin (2111) Electrically connecting to the second circuit board (212); Wherein, the distribution area of the pin (2111) on the lower surface is a first area (213), and the lower surface further includes a second area (214) located at a periphery of the first area (213), The second region (214) overlaps the upper surface of the first step (241). The terminal (20) according to claim 7, wherein the second region (214) is bonded to the upper surface of the first step (241) by a foam (216). The terminal (20) according to claim 7 or 8, wherein the second circuit board (212) is a flexible circuit board, and the fingerprint module (21) further comprises a second circuit board ( 212) The lower reinforcing plate (215). The terminal (20) according to any one of claims 7-9, wherein the lower surface further comprises a third area (217), and the third area (217) is located in the first area (213) Between the second region (214), the third region (217) is used for underfilling the fingerprint identification chip (211) and the second circuit board (212) . The terminal (20) according to any one of claims 1 to 10, wherein the touch display module (23) is an oncell mode, an undercell mode, an incell mode or an OGS mode, and the touch display module ( 23) A liquid crystal display LCD panel or an organic motor light display OLED panel. The terminal (20) according to any one of claims 1 to 11, characterized in that the thickness of the fingerprint module (21) is less than or equal to 0.8 mm. The terminal (20) according to any one of claims 7 to 12, wherein the fingerprint identification chip (211) comprises a die (2112), and the die (2112) is packaged in an open mold. The terminal (20) according to claim 13, wherein the die (2112) has a thickness of 0.15 mm and the fingerprint recognition chip (211) has a thickness of 0.25 mm. The terminal (20) according to any one of claims 7-14, wherein when the opening 221 is a through hole, the fingerprint module (21) further comprises a fingerprint identification chip ( 211) The second cover (218) of the upper layer. The terminal (20) according to claim 15, wherein the second cover (218) is a ceramic cover or a cover glass. The terminal (20) according to claim 15, wherein the second cover (218) is ceramic and the second cover (218) has a thickness of 0.12 mm. The terminal (20) according to any one of claims 4-17, characterized in that the fixing ring (24) is a metal ring. The terminal (20) according to any one of claims 1 to 18, wherein the first cover (22) is a glass cover, a transparent plastic cover or a composite cover. A method for assembling a terminal, wherein the terminal comprises a fingerprint module, a hollow design fixing ring and a cover plate, and the cover plate is designed with an opening, the method comprising: Bonding the fixing ring to the opening through an adhesive; Nesting the fingerprint module in the fixing ring, the bottom of the fingerprint module and the inside of the fixing ring are bonded by foam rubber, and the thickness of the fingerprint module and the fixing ring is less than or equal to Cover thickness of.

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