WO2019093642A1 - Material rotation-type silicone filament automatic grinding machine and grinding system using same - Google Patents

Abstract

The present invention relates to a material rotation-type silicone filament automatic grinding machine and a grinding system using the same, and the grinding machine comprises a rotating unit which holds and fixes the silicone filament and then rotates the silicone filament; a machining unit which is formed on a front surface of the rotating unit and machines an end of the silicone filament fixed to the rotating unit into a tapered shape by contacting a rotating machining tool with the end of the silicone filament fixed to the rotating unit; a transfer unit which is formed at a lower portion of the machining unit to transfer the machining unit in a direction of the rotation unit formed on the front surface or to transfer toward the side surface of the rotation unit; and a support portion which connects and supports the rotating unit and the lower portion of the transfer unit to each other.

Description

Silicone filament automatic grinding machine with rotating material and polishing system using the same

The present invention relates to a silicon filament automatic polishing machine for a material rotation type and a polishing system using the same, and more particularly, to a silicon filament automatic polishing machine for rotating the end of a high purity silicon filament for a CVD process, And more particularly to a polishing system using the same.

The most commonly used process for producing polysilicon for solar PV is called CVD (Chemical Vapor Deposition) process, which is a high-purity silicon filament.

As shown in FIGS. 1 and 2, the filament is connected to a graphite chuck 20 corresponding to an electrode, thereby allowing electricity to pass therethrough.

At this time, in order to efficiently bind the filament to the graphite chuck 20, both ends of the filament must be processed into a taper shape like the processing shape inside the graphite chuck 20.

Particularly, the portion where the filament 10 and the graphite chuck 20 are connected is a part for connecting the electric wires, and the accuracy of the tapering process is a factor that significantly affects the CVD process.

In the case of a conventional taper grinding machine or a machining method of a machining tool, as shown in Fig. 3, in a state that the product is fixed to a jig or the like, a motor equipped with the taper abrasive tool 30 is eccentrically And the taper abrasive tool 30 rotates together with the dummy tool 31 in a spiral shape while revolving and entering the product direction to be processed.

At this time, since the tip of the taper abrasive tool 30 always touches the end portion of the filament 10 at all times, the wear progresses at the earliest and every time the work is repeatedly performed, the tip portion always wears first, A problem that the taper of the set angle can not be machined occurs.

In addition, when the motor or bearing needs to be replaced due to a failure of the device, the rearrangement of the angle between the center axis of the product and the center axis of the rotating body (32) is very complicated for general users.

In the structure of the apparatus, the taper abrasive tool 30 and the motor itself equipped with the tool are located inside the double rotating bearing structure, and the entire rotation is performed, thereby adjusting the rotational axis center position of the rotating body 32 and adjusting the angle of the rotating shaft. If the technician does not work, the reliability is low.

Therefore, the above-described prior art tapering machine and processing method adversely affect the quality and productivity of the product.

The present invention has been made to solve the above problems and it is an object of the present invention to provide a silicon filament automatic polishing machine capable of being applied to various models by automatically adjusting a taper angle and a dimension according to a model produced when a silicon filament is tapered, And a polishing system using the same.

Another object of the present invention is to provide a material rotation type silicon filament automatic polishing machine for preventing the partial abrasion of a part of the processing tool during tapering of the silicon filament to prolong the life of the processing tool and a polishing system using the same .

According to an aspect of the present invention, there is provided a silicon filament automatic polishing system for a material rotary system, comprising: a frame formed to mount various devices; an input conveyor formed on a front surface of the frame to supply silicon filaments; A plurality of silicon filaments formed on one side and the other of the silicon filaments formed on the center of the frame, the silicon filaments being formed on one side and the other side of the frame, respectively, And a discharge conveyor formed on a rear surface of the frame for discharging the silicon filament, which is formed on the back surface of the supply unit and has been processed by the polishing machine.

In order to accomplish the above object, there is provided a silicon filament automatic polishing machine of a material rotation type of the present invention, comprising: a rotating part for gripping and fixing a silicon filament and rotating the silicon filament; and a processing tool formed on a front surface of the rotating part, A transferring portion formed at a lower portion of the processing portion to transfer the processing portion toward the rotation portion formed on the front surface or to transfer the processing portion toward the side surface of the rotation portion; And a support for connecting and supporting the lower parts of the conveying part.

The central axis of the processed portion of the silicon filament automatic polishing machine according to the present invention may be formed parallel to the center axis of the rotating portion or rotated at a predetermined angle so that the end of the silicon filament is processed .

The rotating part of the silicon filament automatic polishing machine according to the present invention includes a chucking block which is moved toward the center so as to press and grip the outer surface of the silicon filament, And a rotating unit that receives the rotation force transmitted through the timing belt or the gear and rotates the chucking block.

Further, the processing tool of the spinning type automatic filament polishing machine of the present invention is formed in a cylindrical shape or a tapered shape so that the end of the silicon filament can be cut in a taper shape, and a cutting material is coated on the outer side.

As described above, according to the material rotation type silicon filament automatic polishing machine and the polishing system using the same, the taper angle and the dimension are automatically adjusted according to the model produced when the silicon filament is tapered, There is an effect that can be done.

Further, according to the material rotation type automatic filament polishing machine of the present invention and the polishing system using the same, the part of the processing tool is prevented from being intensively worn when the silicon filament is tapered, thereby prolonging the life of the processing tool.

1 is a perspective view showing a state in which an end of a silicon filament is processed into a tapered shape;

FIG. 2 is a perspective view showing a state in which a silicon filament is inserted into a graphite chuck used in a CVD process. FIG.

3 is a side view showing a conventional taper processing machine for processing a silicon filament.

4 is a plan view showing the overall configuration of a silicon filament automatic polishing system according to the present invention.

5 is a front view showing the overall structure of a silicon filament automatic polishing system according to the present invention.

6 is a perspective view of a silicon filament automatic polishing machine according to the present invention.

7 is a front view showing a processing tool and a processing position of a silicon filament in an automatic grinding machine of a silicon filament automatic grinding machine according to the present invention.

8 is a plan view showing a state in which a processing tool angle of a silicon filament automatic polishing machine according to the present invention is adjusted.

FIG. 9 is a plan view showing a machining tool of a silicon filament automatic polishing machine of a material rotation type according to the present invention formed in a tapered shape. FIG.

10: Silicone filament

20: Graphite Chuck

30: Taper polishing

31: Dummy tool

32: Rotating body

100: Grinding machine

110:

111: Chucking block

112:

113: timing belt

114: Pneumatic valve

115: Rotary motor

120:

121: Processing tool

122: Spindle motor

130:

131: conveying bed

132: Transfer block

133: Feed rail

140: Support

200: frame

300: Feeding conveyor

310: Feeding belt

320: input motor

400:

410: supply chuck

500: Discharge conveyor

510: discharge belt

520: Discharge motor

Specific features and advantages of the present invention will be described in detail below with reference to the accompanying drawings. The detailed description of the functions and configurations of the present invention will be omitted if it is determined that the gist of the present invention may be unnecessarily blurred.

The present invention relates to a silicon filament automatic polishing machine for a material rotation type and a polishing system using the same, and more particularly, to a silicon filament automatic polishing machine for rotating the end of a high purity silicon filament for a CVD process, And more particularly to a polishing system using the same.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 4 is a plan view showing a state where a silicon filament automatic polishing system according to the present invention is installed. FIG. 5 is a front view showing an overall configuration of a silicon filament automatic polishing system according to the present invention.

4 to 5, the automatic polishing system of the spinning type silicon filament 10 according to the present invention includes a frame 200 formed to mount various devices, And a grinding machine 300 which is formed on one side and the other side of the center of the frame 200 and processes the ends of the silicon filaments 10 in a tapered shape And a supply unit 400 for sequentially positioning the silicon filaments 10 formed at the center of the frame 200 and supplied through the charging conveyor 300 to the polishers 100 and 100 ' And a discharge conveyor 500 formed on the rear surface of the frame 200 and formed on the rear surface of the supply part 400 for discharging the processed silicon filaments 10 by the polishing machines 100 and 100 ' .

The frame 200 allows the feed conveyor 300, the grinders 100 and 100 ', the feeder 400 and the discharge conveyor 500 to be mounted thereon and includes a feeder 400 formed at the center of the frame 200 A polishing conveyor 100 and 100 'are formed on one side and a feeding conveyor 500 for conveying the silicon filaments 10 on the front side of the feeding part 400, respectively.

The input conveyor 300 transfers the unprocessed silicon filaments 10 toward the supply unit 400 positioned at the center of the frame 200 and transfers the silicon filaments 10 one by one to the supply unit 400.

The input conveyor 300 includes a plurality of input belts 310 rotated by the input motor 320 toward the supply unit 400 and the silicon filaments 10 positioned at the upper portion of the input belt 310 And is fed to the feeding unit 400 by the feeding belt 310.

The feeder 400 is formed at the center of the frame 200 and is configured to be transported in the front or back direction of the frame 200. The feeder 400 receives the silicon filament 10 from the input conveyor 300 .

At this time, the supply unit 400 is provided with supply chucks 410 at both ends of the supply unit 400 for supporting the silicon filament 10 transferred by the input conveyor 300, The outer surface of the filament 10 is pressed and fixed.

The silicon filament 10 fixed by the supply chuck 410 is positioned at a position coincident with the center axis of the one side grinding machine 100 and the center axis of the other side grinding machine 100 by the supply part 400 transferred to the front surface or the rear surface of the frame 200. [ And is transported in the rear direction of the frame 200 on which the discharge conveyor 500 is formed when the processing is completed.

The grinding machines 100 and 100 'are formed on one side and the other side of the frame 200. When the feeder 400 is positioned in the center of the frame 200, the one grinding machine 100 is rotated about the center line of the feeder 400, And the other grinding machine 100 is directed to the rear side of the frame 200. [0031] As shown in FIG.

That is, when the supply part 400 is positioned in the center of the frame 200, the one-side polishing machine 100 and the other-side polishing machine 100 are separated from the center line of the supply part 400 And each center line is formed at a different position.

At this time, the center line positions of the supply part 400, the one side polishing machine 100 and the other side polishing machine 100 are preferably parallel to each other.

Accordingly, the supply part 400 fixes the silicon filament 10 to the supply chuck 410 and then transfers the silicon filament 10 to a position where the one side polishing machine 100 is formed, thereby tapering one side of the silicon filament 10, The supply part 400 is transferred to a position where the other polishing machine 100 is formed, and the other side of the silicon filament 10 is tapered.

That is, the supply part 400 is formed so that one side and the other side of the silicon filament 10 are sequentially processed.

Further, the polishing machines 100 and 100 'are transferred toward the supply part 400 so as to fix the silicon filament 10 transferred to the machining position by the supply part 400, The silicon filament 10 is inserted into the rotation unit 112 and is fixed to the chucking block 111 of FIG. 6 and rotated to process the same through the processing tool 121 of FIG.

When the silicon filaments 10 are fixed to the polishing machines 100 and 100 ', the supply chuck 410 of the supply part 400 is separated from the silicon filaments 10 so that the silicon filaments 10 are transferred to the polishing machines 100 and 100' To rotate freely.

When the processing is completed by the polishing machines 100 and 100 ', the supply chuck 410 presses and fixes the silicon filament 10 and the polishing machine 100 or 100' is returned to the original position, do.

The detailed structure of the grinders 100 and 100 'will be described later with reference to FIG.

The discharge conveyor 500 is for discharging the silicon filament 10 transferred by the supply part 400 after one side and the other side of the silicon filament 10 are processed by the polishing machines 100 and 100 ' 10) is transferred to the next process or discharged to a loading device (not shown) and stored.

At this time, the discharge conveyor 500 is formed with a plurality of discharge belts 510 which are rotated by a discharge motor 520 toward a next process or a loading device (not shown) The silicon filament 10 is conveyed to the supply part 400 by the discharge belt 510. [

The LM guide, the ball screw, and the driving motor may be formed so that the feeding part 400 and the polishing machines 100 and 100 'can be transported. The driving motor can be numerically controlled, and the feeding part 400 and the polishing machines 100, 100 'may be automatically controlled.

FIG. 6 is a perspective view of a silicon filament automatic polishing machine according to the present invention, FIG. 7 is a perspective view of a processing tool 121 of a silicon filament automatic polishing machine according to the present invention and a processing position of a silicon filament 10 Fig.

6 to 7, the automatic rotation device for a silicon filament according to the present invention includes a rotation unit 110 for holding and fixing the silicon filament 10 and then rotating the rotation unit 110, A processing section 120 formed in a lower portion of the processing section 120 to process the rotating and forming tool 121 into a taper shape by contacting the end of the silicon filament 10 fixed to the rotating section 110, A transfer unit 130 for transferring the unit 120 toward the rotation unit 110 formed on the front side or for transferring the rotation unit 110 toward the side of the rotation unit 110 and a support unit 130 for connecting and supporting the rotation unit 110 and the transfer unit 130, (140).

The rotation unit 110 includes a chucking block 111 that moves toward the center so as to press and grip the outer surface of the silicon filament 10 and a rotation motor 115 coupled to an outer surface of the chucking block 111, And a rotating unit 112 for rotating the chucking block 111 by receiving the rotational force from the timing belt 113 or the gear.

The rotating part 110 is for pressing the silicon filament 10 to fix the silicon filament 10 and rotating the silicon filament 10 to taper the end part.

The rotating unit 112 is formed in a cylindrical shape, and a hole is formed at the center thereof, so that the silicon filament 10 can be inserted.

A plurality of chucking blocks 111 are formed on the front surface of the rotary unit 112 to be transferred toward the center of the rotary unit 112 by air pressure so that the outer surface of the silicon filament 10 inserted into the rotary unit 112 It becomes possible to pressurize.

At this time, it is preferable that the chucking block 111 is formed so as to be able to press and fix the outer surface of the silicon filament 10, and the surface contacting the outer surface of the silicon filament 10 is a V- or U- So that the contact area is widened so as to be efficiently pressurized.

A pneumatic valve 114 is formed on the rear surface of the rotary unit 112. The pneumatic valve 114 is supplied to the chucking block 111 to supply the pneumatic pressure to the chucking block 111, It is possible to remove the pneumatic pressure and to control the chucking block 111 to be separated.

A rotary motor 115 capable of numerical control is formed at an upper portion of the rotary unit 112 for rotating the rotary unit 112. The rotary unit 112 and the rotary motor 115 are connected to each other through a timing belt 113 So that the rotary unit 112 can be rotated by the rotary motor 115.

At this time, the rotary unit 112 and the rotary motor 115 may be connected via a gear rather than the timing belt 113, and it is preferable that the rotary unit 112 and the rotary motor 115 can be selectively changed as needed.

The processing unit 120 is formed on the opposite side of the rotation unit 110 and is preferably positioned at a height corresponding to the central axis of the rotation unit 112 into which the silicon filament 10 is inserted.

The machining unit 120 includes a machining tool 121 that cuts the end of the silicon filament 10 to form a tapered shape and a spindle motor 121 that is formed on the rear surface of the machining tool 121 to rotate the machining tool 121 122).

At this time, a cutting tool is formed on the outer surface of the processing tool 121 through a diamond electrodeposition method or a metal and resin bonding method to cut the silicon filament 10. The cutting tool is rotated at a high speed by the spindle motor 122 to rotate the silicon filament 10, The silicon filament 10 is cut and processed.

The transfer unit 130 is for transferring the machining tool 121 of the machining unit 120 to the x-axis direction, that is, toward one side or the other side of the rotation unit 112. The transfer unit 130 is a conventional helical- The wear of the machining tool 121 is uniformly generated throughout the horizontal feed rather than the feed, thereby extending the service life.

The transfer unit 130 is formed at a lower portion of the processing unit 120 to transfer the processing unit 120 in the x-axis direction. The transfer unit 130 includes a plurality of feeds A rail 133 and a ball screw (not shown) and a feed motor (not shown) formed on the upper side of the support table 140 and formed in the x-axis direction, A conveying block 132 which is coupled to the upper portion of the conveying block 132 and is formed to support the processing part 120 and is conveyed in the x axis by the operation of the conveying motor, ).

At this time, the feed motor (not shown) can control the position to which the machining portion 120 is fed by the numerical control, and the depth by which the machining tool 121 cuts the silicon filament 10 It becomes possible to control.

8 is a plan view showing a state in which the angle of the processing tool 121 of the silicon filament automatic polishing machine according to the present invention is controlled.

8, the central axis of the machining portion 120 of the material-type silicon filament automatic polishing machine according to the present invention may be formed parallel to the center axis of the rotary portion 110, And the end of the silicon filament 10 can be processed at a predetermined angle.

The processing unit 120 can be rotated in the Y axis direction on the X axis with reference to the upper center of the transfer bed 131. The processing tool 121 processes the end of the silicon filament 10 into a tapered shape It is possible to adjust the angle to the angle?

A rotating motor (not shown) for rotating the machining unit 120 is formed at the center of the transporting bed 131 so that the machining unit 120 can be rotated. It is preferable to control the angle [theta] at which the machining unit 120 is rotated through the numerical control.

Further, the processing tool 121 is formed in a cylindrical shape so that the end of the silicon filament 10 can be cut in a taper shape, and a cutting material is coated on the outer surface.

The end of the silicon filament 10 can be tapered by using the processing tool 121 formed into a cylindrical shape having a relatively low manufacturing cost and a low unit cost since the machining portion 120 is rotated to process the end of the silicon filament 10 at a desired angle, So that it can be processed into a shape.

The transfer unit 130 may be formed to be capable of being transferred to the Y-axis direction, that is, toward the rotation unit 110. The transfer unit 130 may include a processing unit (not shown) 120 can adjust the taper length of the silicon filament 10 by a desired length.

FIG. 9 is a plan view showing a process tool 121 of a silicon filament automatic polishing machine according to the present invention in a polygonal shape.

As shown in FIG. 9, the processing tool 121 of the silicon filament automatic polishing machine according to the present invention is formed in a tapered shape so that the end of the silicon filament 10 can be cut in a tapered shape, Is coated with ashes.

When the processing tool 121 is formed in a tapered shape, the end of the silicon filament 10 can be processed into a tapered shape even when the central axis of the processing portion 120 is positioned parallel to the central axis of the rotary portion 110 do.

The rotation part 110 is formed with a sensing sensor (not shown) for sensing the silicon filament 10 inserted into the rotation unit 112 so that the silicon filament 10 rotates from the rotation unit 112 to the processing part 120, As shown in FIG.

4, when the silicon filament 10 is inserted into the rotation unit 110, the detection sensor senses the silicon filament 10 inserted into the rotation unit 112. In this case, And the length at which the silicon filament 10 protrudes can be adjusted by measuring the distance that the polishing machine 100 is transferred by numerical control from the sensed moment.

As described above, according to the material rotation type silicon filament automatic polishing machine and the polishing system using the same, the taper angle and the dimension are automatically adjusted according to the model produced when the silicon filament is tapered, Therefore, it is possible to prevent a part of the processing tool from being intensively worn when the silicon filament is tapered, thereby prolonging the life of the processing tool.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken as a limitation of the scope of the present invention. Or modify it. The scope of the invention should, therefore, be construed in light of the claims set forth to cover many of such variations.

Claims (5)

A frame formed to mount various devices; An input conveyor formed on a front surface of the frame and configured to supply a silicon filament; A polisher which is formed on one side and the other side with respect to the center of the frame and processes the ends of the silicon filaments into a tapered shape; A supply part configured to sequentially position the silicon filament formed at the center of the frame and supplied through the charging conveyor to the polishing machine formed at one side and the other side; And a discharge conveyor formed on a rear surface of the frame to discharge the silicon filament, which is formed on the rear surface of the supply unit and has been processed by the polishing machine, The abrasive machine A rotation unit for holding and fixing the silicon filament and then rotating the silicon filament; A processing unit formed on a front surface of the rotary unit and adapted to process a rotating machining tool into a tapered shape by contacting the end of the silicon filament fixed to the rotary unit; A transfer unit formed at a lower portion of the processing unit to transfer the processing unit toward the rotation unit formed on the front surface or to the side surface of the rotation unit; And a support base for connecting and supporting the rotating portion and the lower portion of the conveyance portion with each other Wherein the transferring unit horizontally feeds the machining unit from one side or the other side of the rotation unit so that wear of the machining tool is uniformly generated Silicone filament automatic polishing system of material rotation method. A rotation unit for holding and fixing the silicon filament and then rotating the silicon filament; A processing unit formed on a front surface of the rotary unit and adapted to process a rotating machining tool into a tapered shape by contacting the end of the silicon filament fixed to the rotary unit; A transfer unit formed at a lower portion of the processing unit to transfer the processing unit toward the rotation unit formed on the front surface or to the side surface of the rotation unit; And a supporter for connecting and supporting the rotary part and the lower part of the conveyance part, Wherein the transferring unit horizontally feeds the machining unit from one side or the other side of the rotation unit so that wear of the machining tool is uniformly generated Silicone filament automatic grinding machine of material rotation method. 3. The method of claim 2, Wherein the center axis of the machining portion is formed parallel to the center axis of the rotary portion or can be rotated at a predetermined angle so that the end of the silicon filament can be machined at a predetermined angle Silicone filament automatic grinding machine of material rotation method. 3. The method of claim 2, The rotating part A chucking block which moves toward the center so as to press and grip an outer surface of the silicon filament; And a rotation unit coupled to an outer surface of the chucking block and transmitting rotation force generated by the rotation motor through a timing belt or gear to rotate the chucking block Silicone filament automatic grinding machine of material rotation method. 3. The method of claim 2, The processing tool Wherein the silicon filament is formed in a cylindrical shape or a tapered shape so as to cut the end of the silicon filament in a tapered shape, and a cutting material is coated on an outer surface thereof Silicone filament automatic grinding machine of material rotation method.

Images