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WO2019087261A1 - Composition de résine, moulage et procédé destiné à la fabrication de moulage - Google Patents

Composition de résine, moulage et procédé destiné à la fabrication de moulage Download PDF

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Publication number
WO2019087261A1
WO2019087261A1 PCT/JP2017/039167 JP2017039167W WO2019087261A1 WO 2019087261 A1 WO2019087261 A1 WO 2019087261A1 JP 2017039167 W JP2017039167 W JP 2017039167W WO 2019087261 A1 WO2019087261 A1 WO 2019087261A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
coil
group
resin
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/039167
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English (en)
Japanese (ja)
Inventor
泰典 川端
達仁 福原
香澄 中村
尚英 岩谷
邦幸 小林
尚弘 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to PCT/JP2017/039167 priority Critical patent/WO2019087261A1/fr
Publication of WO2019087261A1 publication Critical patent/WO2019087261A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof

Definitions

  • the present invention relates to a resin composition, a molded body, and a method of producing a molded body.
  • Transformers such as ignition coils, motors, reactors, electric and electronic parts such as in-vehicle computers (engine control unit: ECU) include resin materials for internal electric and electronic members in order to improve the reliability of parts It seals with the curable resin composition (for example, refer the following patent documents 1).
  • a resin material for example, a thermosetting resin such as an epoxy resin is used, and by molding a curable resin composition, a molded body in which an electric / electronic member is sealed can be obtained.
  • the resin composition for casting used for sealing the electric and electronic members as described above is, for example, in a transformer such as an ignition coil, the resin material is sufficiently impregnated even when the coil gap is a micro level coil. In order to be able to do so, and in an ECU or the like, it is desirable that the impregnation property is excellent so that the circuits of high density integrated circuits and circuits of fine circuits can be sufficiently sealed.
  • the cured product to be formed may generate heat from the electric / electronic member (for example, heat generation due to the electrical resistance of the metal wire coil or Joule heat generated at the time of semiconductor operation) Even if it receives the thermal shock due to the change of the crack, it is necessary that the crack does not easily occur.
  • the present invention has been made in view of the above-mentioned circumstances, and a resin composition capable of achieving both the impregnation property to electric / electronic members at the time of casting and the crack resistance of a cured product, and this resin
  • An object of the present invention is to provide a molded body using the composition and a method for manufacturing the molded body.
  • the present invention provides a casting resin composition containing a curable component and a filler having an average particle diameter of 30 ⁇ m or less.
  • the resin composition for casting of the present invention by containing the filler having the above-mentioned specific average particle diameter, it is possible to sufficiently obtain the effect of improving the crack resistance of the cured product by the blending of the filler, At the time of molding, it is possible to lower the viscosity, and it is possible to achieve both the impregnation of the electric / electronic member to be sealed and the crack resistance of the cured product.
  • the filler is preferably at least one inorganic particle selected from the group consisting of silica, alumina and calcium carbonate.
  • the content of the filler is preferably 30 to 80% by mass based on the total mass (excluding the solvent) of the resin composition.
  • the resin composition preferably has a viscosity of 5.0 Pa ⁇ s or less when measured under conditions of 40 ° C. and 60 rpm using a B-type viscometer.
  • the resin composition may be for a coil mold. In this case, it is possible to sufficiently impregnate between the coils, and it is possible to further improve the vibration proofing property, the insulation property, and the rustproofness.
  • the present invention also provides a molded article comprising a coil and a sealing portion for sealing the coil, wherein the sealing portion includes the resin composition according to the present invention or a cured product thereof.
  • the molded body can be obtained as a mold coil, and this mold coil can be excellent in coil insulation and crack resistance.
  • the present invention also provides a method for producing a molded article, wherein the resin composition according to the present invention is cast to obtain a molded article provided with a sealing portion for sealing a coil.
  • the molded body can be obtained as a mold coil, and this mold coil can be excellent in coil insulation and crack resistance.
  • the resin composition according to the present invention can sufficiently reduce the viscosity at the time of casting while sufficiently securing the crack resistance of the molded article. Since it is also excellent in the properties, it is possible to efficiently manufacture the above-mentioned molded body excellent in reliability.
  • a resin composition capable of achieving both the impregnation of electric and electronic members at the time of casting and the crack resistance of a cured product, and a molded article and a molding using this resin composition It is possible to provide a method of manufacturing the body.
  • a numerical range indicated by using “to” indicates a range including numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit or the lower limit of the numerical range of one step can be arbitrarily combined with the upper limit or the lower limit of the numerical range of another step in the numerical range described stepwise in the present specification.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • “A or B” may contain either A or B, and may contain both.
  • the materials exemplified herein can be used alone or in combination of two or more unless otherwise specified.
  • the content of each component in the composition is the total amount of the plurality of substances present in the composition unless a plurality of substances corresponding to each component are present in the composition.
  • the resin composition according to the present embodiment is a resin composition for casting.
  • a cast can be obtained by casting the resin composition according to the present embodiment.
  • the cured product according to the present embodiment is a cured product of the resin composition according to the present embodiment, and can be obtained by curing a curable resin composition.
  • the resin composition according to the present embodiment contains a curable component and a filler component.
  • the filler component preferably contains a filler having an average particle diameter of 30 ⁇ m or less (hereinafter sometimes referred to as “(F1) component”).
  • F1 component a filler having an average particle diameter of 30 ⁇ m or less
  • the curable component can include, for example, a curable resin and a curing agent. If the curable resin can be cured without using a curing agent, the curing agent may not be used.
  • thermosetting component or a photocurable component can be used as the curable component, and a thermosetting resin or a photocurable resin can be used as the curable resin.
  • a thermosetting component is preferable as the curable component.
  • the thermosetting resin include epoxy resin, urea resin, melamine resin, polyester, silicone resin, polyurethane and the like.
  • a photocurable resin an acrylic resin, a methacryl resin, etc. are mentioned.
  • the curable component preferably contains an epoxy resin from the viewpoint of low moisture permeability of the cured product and easily preventing deterioration of the device when the device is sealed with the cured product.
  • epoxy resin resin which has a 2 or more glycidyl group in 1 molecule can be used.
  • epoxy resin bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type Epoxy resin, bisphenol G epoxy resin, bisphenol M epoxy resin, bisphenol S epoxy resin, bisphenol P epoxy resin, bisphenol PH epoxy resin, bisphenol TMC epoxy resin, bisphenol Z epoxy resin, bisphenol S epoxy resin (Hexanediol bisphenol S diglycidyl ether etc.), novolac phenol type epoxy resin, biphenyl type epoxy resin, Phthalene type epoxy resin, dicyclopentadiene type epoxy resin, bixylenol type epoxy resin (bixylenol diglycidyl ether etc), hydrogenated bisphenol A type epoxy resin (hydrogenated bisphenol A glycidyl ether etc), dibasic acid
  • the content of the epoxy resin is preferably 50% by mass or more, more preferably 80% by mass or more, further preferably 90% by mass or more, based on the total mass of the curable resin, from the viewpoint of easily obtaining a cured product with low water absorption.
  • the content of the epoxy resin may be 100% by mass based on the total mass of the curable resin.
  • the content of the curable resin is preferably 10% by mass or more, and 15% by mass or more, based on the total mass (excluding the mass of the solvent) of the resin composition, from the viewpoint of easily impregnating the resin composition into fine gaps. Is more preferable, and 20% by mass or more is more preferable.
  • the content of the curable resin is preferably 60% by mass or less, more preferably 50% by mass or less, based on the total mass (excluding the mass of the solvent) of the resin composition, from the viewpoint of easily obtaining a cured product with low water absorption.
  • 40% by mass or less is more preferable, and 30% by mass or less is particularly preferable. From these viewpoints, the content of the curable resin is preferably 10 to 60% by mass.
  • a compound having two or more functional groups capable of reacting with glycidyl groups in one molecule can be used.
  • a curing agent a phenol resin, an acid anhydride, etc. are mentioned.
  • a phenol resin resin which has a 2 or more phenolic hydroxyl group in 1 molecule can be used.
  • a phenol resin a resin obtained by condensation or co-condensation of phenols and / or naphthols with aldehydes under an acid catalyst, biphenyl skeleton type phenol resin, paraxylylene modified phenolic resin, metaxylylene / paraxylylene modified phenolic resin, melamine Modified phenolic resin, terpene modified phenolic resin, dicyclopentadiene modified phenolic resin, cyclopentadiene modified phenolic resin, polycyclic aromatic ring modified phenolic resin, xylylene modified naphthol resin, etc. may be mentioned.
  • phenols include phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F and the like.
  • naphthols ⁇ -naphthol, ⁇ -naphthol, dihydroxy naphthalene and the like can be mentioned.
  • aldehydes include formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde and the like.
  • Examples of the acid anhydride include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, endomethylene tetrahydrophthalic anhydride, dodecenyl succinic anhydride, octenyl succinic anhydride and the like.
  • the content of the curing agent is preferably 10 to 55% by mass, and 12 to 40% by mass based on the total mass of the resin composition (excluding solvents such as organic solvents) from the viewpoint of excellent curability of the curable resin. Is more preferable, and 15 to 30% by mass is more preferable.
  • the curable component may contain a curing accelerator.
  • the curing accelerator include quaternary ammonium salts, amine curing accelerators, and phosphorus curing accelerators.
  • amine-based curing accelerators include imidazole compounds, aliphatic amines, aromatic amines, modified amines, polyamide resins and the like.
  • phosphine oxide, phosphonium salt, diphosphine and the like can be mentioned.
  • filler ingredient As a constituent material of the filler component, silica, aluminum hydroxide, magnesium hydroxide, wollastonite (wollastonite), aerosil, alumina, calcium carbonate, calcium silicate, mica, talc, clay, titanium white, silicon nitride, carbonized Silicon etc. are mentioned.
  • silica include crystalline silica, fused silica, graphite, melamine cyanurate and the like.
  • metal hydroxides such as aluminum hydroxide and magnesium hydroxide, and melamine cyanurate may have a function as a flame retardant
  • the filler having a function as a flame retardant is preferable from the viewpoint of improving the flame retardancy.
  • the component (F1) preferably contains at least one inorganic particle selected from the group consisting of silica, alumina and calcium carbonate from the viewpoint of easily obtaining a cured product excellent in crack resistance, and contains crystalline silica. Is more preferred.
  • the particle diameter of the component (F1) is preferably 2 ⁇ m or more, and 3 ⁇ m or more from the viewpoint that the resin composition is easy to handle because the excessive increase in viscosity of the resin composition is suppressed and the handling of the resin composition is easy. More preferably, 5 ⁇ m or more is more preferable, and 10 ⁇ m or more is even more preferable.
  • the particle diameter of the component (F1) is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and still more preferably 15 ⁇ m or less, from the viewpoint of easily obtaining a resin composition having excellent infiltration into minute gaps. From these viewpoints, the particle diameter of the component (F1) is preferably 2 to 30 ⁇ m.
  • the particle size of the filler can be measured by a laser diffraction particle size distribution analyzer (for example, manufactured by Horiba, Ltd., trade name: LA920). The average particle diameter of the filler component is also preferably in each of these ranges.
  • the content of the filler component is preferably in the following range based on the total mass of the resin composition (excluding the solvent such as the organic solvent).
  • the content of the filler component is 30 mass from the viewpoint that the excellent strength of the cured product is easily obtained, and the moisture permeability of the cured product is low and the element is easily prevented from being deteriorated when the device is sealed with the cured product. % Or more is preferable, 40 mass% or more is more preferable, and 50 mass% or more is still more preferable.
  • the content of the filler component is preferably 80% by mass or less, and 70% by mass from the viewpoint that the resin composition is easy to handle because the excessive increase in viscosity of the resin composition is suppressed and the handling of the resin composition is easy. The following are more preferable, and 60 mass% or less is still more preferable. From these viewpoints, the content of the filler component is preferably 30 to 80% by mass.
  • the content of the component (F1) is preferably in the following range based on the total mass of the resin composition (excluding the solvent such as the organic solvent).
  • the content of the component (F1) is from the viewpoint that the excellent strength of the cured product can be easily obtained, and from the viewpoint that the moisture permeability of the cured product is low and the degradation of the device can be easily prevented when the device is sealed with the cured product. 30 mass% or more is preferable, 40 mass% or more is more preferable, 50 mass% or more is still more preferable.
  • the content of the component (F1) is preferably 80% by mass or less, from the viewpoint that the resin composition is easy to handle because the excessive increase in the viscosity of the resin composition is suppressed and the handling of the resin composition is easy.
  • the mass% or less is more preferable, and the 60 mass% or less is more preferable. From these viewpoints, the content of the filler is preferably 30 to 80% by mass.
  • the proportion of the filler having a particle diameter of 30 ⁇ m or less in the filler component is more preferably 50% by mass or more, still more preferably 60% by mass or more, and 100% by mass. Being particularly preferred.
  • the proportion of the filler having a particle diameter of 80 ⁇ m or more in the filler component is more preferably 20% by mass or less, still more preferably 10% by mass or less, and 0% % Is particularly preferred.
  • the average particle diameter of all the filler components is preferably 70 ⁇ m or less, more preferably 60 ⁇ m or less, still more preferably 50 ⁇ m or less, and 30 ⁇ m or less It is further more preferable, and particularly preferably 20 ⁇ m or less.
  • the resin composition according to this embodiment can contain additives other than the above-described curable component and filler component.
  • the additive include an antifoaming agent, a flame retardant, a coupling agent, a reaction diluent, a flexibility imparting agent, a pigment, a coloring agent, a solvent and the like.
  • the resin composition according to the present embodiment contains the phosphazene compound as a flame retardant from the viewpoint of obtaining a cured product having further improved heat and moisture resistance in addition to crack resistance while sufficiently maintaining the impregnation property of the resin composition. Is preferred.
  • the phosphazene compound is a compound having a structure in which a phosphorus atom and a nitrogen atom are bonded by a double bond, and has a function as a flame retardant.
  • a cyclic or linear phosphazene compound represented by the following general formula (1) a phosphazene polymer obtained by polymerizing the cyclic or linear phosphazene compound, and the cyclic and / or linear phosphazene compound and epoxy
  • a reaction product with at least one compound selected from a compound, a phenol compound, an amine compound and an acid anhydride, and the like can be mentioned.
  • the phosphazene compounds can be used alone or in combination of two or more.
  • R 1 and R 2 each independently represent an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, an aryl group having 6 to 14 carbon atoms, or 7 to 18 carbon atoms Alkyl aryl group, alkenyl group having 2 to 18 carbon atoms, alkenyl aryl group having 8 to 18 carbon atoms, amino group substituted phenyl group, amino alkyl group substituted phenyl group (the number of carbon atoms of substituted amino alkyl group is 1 to 6) Hydroxyl group substituted phenyl group, Hydroxyalkyl group substituted phenyl group (The carbon number of the hydroxyalkyl group to be substituted is 1 to 6), Glycidyl oxy group substituted phenyl group, Glycidyl oxyalkyl group substituted phenyl group (substituted (A carbon number of the glycidyloxyalkyl group is 4 to 9
  • R 1 and R 2 are preferably a group containing a phenyl group, and more preferably both of which are a group containing a phenyl group.
  • the phosphazene compound has a molecular structure in which the phenoxy group protects the periphery of the phosphorus atom, and superior moisture resistance can be obtained as compared with other phosphorus-based flame retardants.
  • an amino group-substituted phenyl group which can be selected as a substituent represented by R 1 and R 2 is such that 1 to 5 amino groups are substituted on any carbon atom on the benzene ring I say something.
  • a phosphazene compound having a structure in which these reactive functional groups are substituted on arbitrary carbon atoms of a benzene ring since physical properties such as crack resistance and heat resistance of the sealing portion can be easily improved.
  • a phosphazene compound having a structure (alkylaryl group) in which a methyl group is substituted at an arbitrary carbon atom of a benzene ring is preferable because it is liquid at normal temperature and the impregnation property of the resin composition is easily improved.
  • phosphazene compounds include: hexaphenoxycyclotriphosphazene; hexa (methylphenoxy) cyclotriphosphazene; cyclotriphosphazene in which a methylphenoxy group and a phenoxy group are mixed and substituted; a mixture of a methylphenoxy group and a phenoxy group Substituted cyclophosphazene mixture (mixture of n of 3 to 15 in general formula (1)), linear phosphazene mixture in which methyl phenoxy group and phenoxy group are mixed and substituted (mixture of n of average of 3000 in general formula (1)) Phosphazene compounds having a methyl group such as: hexa (aminophenoxy) cyclotriphosphazene, hexa (aminoalkylphenoxy) cyclotriphosphazene (eg, hexa (aminoethylphenoxy) cyclotriphosphazene etc.), aminophenoxy group
  • Phosphazene compounds hexa (cyanophenoxy) cyclotriphosphazene, hexa (cyanoalkylphenoxy) cyclotriphosphazene (eg, hexa (cyanoethylphenoxy) cyclotriphosphazene etc.), cyanophenoxy group and / or Is a cyclotriphosphazene in which a cyanoalkylphenoxy group and a phenoxy group are mixed and substituted, a cyclophosphazene mixture in which a cyanophenoxy group and / or a cyanoalkylphenoxy group and a phenoxy group are mixed and substituted (n in the general formula (1) is 3 to 15)
  • a phosphazene compound having a cyano group such as a mixture of cyanophenoxy group and / or a linear phosphazene mixture in which a cyanoalkyl phenoxy group and a phenoxy group are mixed and substituted (a
  • the phosphazene compound used in the resin composition of the present embodiment is capable of achieving both impregnation and flame retardancy at a higher level, and from the viewpoint of easily obtaining a cured product having a low water absorption, a phosphorus atom and a nitrogen atom. It is preferable to include a cyclophosphazene compound having a cyclic structure in which and are alternately bonded by a double bond.
  • the cyclophosphazene compound is preferably one in which n in the general formula (1) is an integer of 3 to 6.
  • Cyclophosphazene compounds are commercially available, and include, for example, FP-100, FP-110, FP-390, FP-300B (trade names, manufactured by Fushimi Pharmaceutical Co., Ltd.), SPS-100, SPB-100. SPE-100, SPH-100, and SPB-100L (all manufactured by Otsuka Chemical Co., Ltd., trade names), and the like.
  • the content of the phosphazene compound is preferably 1.0 to 20.0 mass% based on the total mass of the resin composition (excluding the solvent such as the organic solvent), and 2
  • the content is more preferably 0.1 to 15.0% by mass, still more preferably 3.0 to 10.0% by mass, and still more preferably 4.0 to 8.0% by mass.
  • the content is 1.0% by mass or more, the flame retardancy and the impregnation property can be easily achieved at a higher level, and when the content is 20.0% by mass or less, the rigidity of the sealed portion, the crack resistance, It is easy to make physical properties such as heat resistance good.
  • the viscosity of the resin composition when measured under conditions of 40 ° C. and 60 rpm using a B-type viscometer is 5.0 Pa from the viewpoint of obtaining excellent impregnation when the resin composition is impregnated in a fine gap. S or less, preferably 3.0 Pa ⁇ s or less, and more preferably 2.0 Pa ⁇ s or less.
  • the viscosity may be, for example, 1.0 Pa ⁇ s or more.
  • the molded object which concerns on this embodiment is provided with an electric / electronic member and the sealing part which seals an electric / electronic member, and the sealing part contains the resin composition which concerns on this embodiment, or its hardened
  • the molded body for example, a capacitor (film capacitor etc.), chip inductor, reactor, transformer, molded coil (ignition coil etc.), LSI chip, IC chip, sensor (tire air pressure sensor etc.), engine control unit (ECU) etc. Electrical and electronic components.
  • a molded body in which the electric / electronic member to be sealed is a coil, that is, a mold coil will be described.
  • the mold coil according to the present embodiment includes a coil and a sealing portion that seals the coil, and the sealing portion includes the resin composition according to the present embodiment or a cured product thereof.
  • FIG. 1 is a schematic cross-sectional view showing an ignition coil as an example of a mold coil according to the present embodiment.
  • the ignition coil 50 shown in FIG. 1 includes a magnetic core 1, an outer core 2, a primary bobbin 3, a primary coil 4, a secondary coil 5, a secondary coil 6, a terminal 7, a terminal 8, a housing (case) 9, And the sealing unit 30.
  • the ignition coil 50 may include ignition timing control circuitry (not shown).
  • the primary coil 4 is, for example, an enameled wire with a diameter of about 0.5 mm about 200 times
  • the secondary coil 6 is, for example, an enameled fine wire with a diameter of about 0.05 mm about 20000 times. is there.
  • the primary coil 4 is connected to the battery and direct current flows, but the current flowing by the ignition timing adjustment electronic circuit part and the power switch is interrupted to change the magnetic flux, and the primary voltage is obtained by self-induction action.
  • the ignition coil 50 generates a high voltage of 20 to 40 kV by the mutual induction between the primary coil 4 and the secondary coil 6 to cause a spark discharge in the spark plug connected to the terminal.
  • the case 9 is formed of, for example, polyphenylene sulfide (PPS) or the like.
  • the bobbins 3 and 5 are made of, for example, modified polyphenylene oxide (PPO) or the like.
  • the sealing portion 30 includes the cured product of the resin composition according to the present embodiment, and seals the core 1, the primary bobbin 3, the primary coil 4, the secondary bobbin 5, and the secondary coil 6 inside the case 9. .
  • the sealing portion 30 is also filled between the fine coil windings of the primary coil 4 and the secondary coil 6.
  • the resin composition according to the present embodiment is excellent in the impregnating ability at the time of impregnating in the fine gaps. Therefore, the resin composition can be sufficiently impregnated between the fine coil windings.
  • fine coil windings for example, an inter-coil gap is about 4 ⁇ m
  • the filler may not be impregnated between the coil windings.
  • At least a liquid resin component of the resin composition may be impregnated between the coil windings.
  • the filler is clogged with the surface layer before the liquid resin component fully impregnates between the coil windings, which tends to cause a problem that the impregnation becomes insufficient.
  • the resin composition according to the present embodiment can be sufficiently impregnated between fine coil windings without clogging.
  • the sealing part 30 can have sufficient crack resistance by containing the hardened
  • the resin composition according to the present embodiment is excellent in the impregnating ability at the time of impregnating into fine gaps, and can form a cured product having sufficient crack resistance, so that the resin composition is impregnated between the fine coil windings. It is particularly suitable for casting applications (for coil molds) in molded coils such as ignition coils that are susceptible to thermal shock during use.
  • the resin composition according to the present embodiment is cast to obtain a molded coil provided with a sealing portion for sealing the coil.
  • the method for producing a mold coil according to the present embodiment includes, for example, a resin supply step of supplying a resin composition according to the present embodiment to a mold member (mold, frame) as a curable sealing material, and a resin composition Curing the resin to form a sealed portion in this order.
  • a molding method a vacuum injection molding method, a pressure injection molding method, an impregnation molding method, an RTM molding method, dipping, a press molding method, an injection molding method, a transfer molding method and the like can be mentioned.
  • a resin composition according to the present embodiment is cast to seal the coils 4 and 6
  • the ignition coil 50 provided with the stop 30 is obtained.
  • the method of manufacturing an ignition coil according to the present embodiment includes, for example, a resin supplying step of supplying the resin composition according to the present embodiment to the inside of the case 9 as a curable sealing material, and curing the resin composition. The steps are provided in this order.
  • the resin composition according to the present embodiment (hardenable) in the inside of the case 9 in the assembly in which the cores 1 and 2, the bobbins 3 and 5, the coils 4 and 6, the terminals 7 and 8 are incorporated Supply sealing material).
  • the resin supply process can be performed, for example, under conditions of a temperature of 20 to 90 ° C. under vacuum.
  • the resin composition supplied into the element housing space is cured to obtain a cured product.
  • the thermosetting resin composition is heated to obtain a cured product.
  • the curing temperature of the resin composition is preferably 150 ° C. or less.
  • the curing step can be performed, for example, under conditions of 80 to 145 ° C. for 3 to 8 hours. A plurality of conditions may be combined, and heating at one temperature may be followed by heating at another temperature (e.g., higher than the above one temperature).
  • R-139S Bisphenol A epoxy resin, manufactured by Mitsui Chemicals, Inc., trade name: Epomic R-139S JER 834: Bisphenol A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: JER 834
  • Crystalline silica manufactured by Humitech Co., Ltd., trade name: HC-15, average particle diameter: 12.8 ⁇ m Crystalline silica: manufactured by Sibelco Japan Ltd., trade name: CA0040, average particle size: 3.65 ⁇ m Wollastonite: Hayashi Kasei Co., Ltd., trade name: VM-8N, average particle diameter: 11 ⁇ m Aluminum hydroxide: Nippon Light Metal Co., Ltd., trade name: AL-B143, average particle diameter: 5 ⁇ m
  • Hexaphenoxycyclotriphosphazene made by Otsuka Chemical Co., Ltd., trade name: SPB-100, phosphorus content: 13.4% by mass Cyclotriphosphazene in which a hydroxyphenoxy group and a phenoxy group are mixed and substituted: manufactured by Otsuka Chemical Co., Ltd., trade name: SPH-100, phosphorus content: 12.5% by mass Cyclotriphosphazene (liquid) in which a methylphenoxy group and a phenoxy group are mixed and substituted: made by Otsuka Chemical Co., Ltd., trade name: SPB-100L, phosphorus content: 12.8 mass%
  • Antifoaming agent silicone antifoaming agent, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KS-603 Coupling agent: Epoxy group-containing silane coupling agent, manufactured by Dow Corning, trade name: OFS-6040 Colorant: carbon black, manufactured by Mitsubishi Chemical Corporation, trade name: MA100
  • viscosity The viscosity of the resin composition was measured at a temperature of 40 ° C. and a rotational speed of 60 rpm (60 revolutions) using a B-type rotational viscometer (trade name: BL, manufactured by TOKIMEC). The temperature was adjusted using a thermostat (manufactured by Yamato Scientific Co., Ltd., trade name: BF600).
  • the above resin composition was thermally cured at 105 ° C. for 8 hours to obtain a cured product, and then the cured product was processed into a rectangular parallelepiped shape of 125 mm ⁇ 13.0 mm and 5 mm in thickness to obtain a test piece.
  • the flame retardancy was evaluated according to the test method of UL94V. In accordance with the UL 94 V determination criteria, the lower contact flame was determined in four stages of “V-0”, “V-1”, “V-2”, and “V-NOT”. “V-0” is the highest in flame retardancy, and the flame retardancy decreases in the order of “V-1”, “V-2” and “V-NOT”.
  • the following test method evaluated the impregnatability to the fine crevice of the above-mentioned resin composition.
  • glass beads (average particle size: 50 to 80 ⁇ m) were filled in a polyethylene test tube having a diameter of 15 mm, and the resin composition defoamed sufficiently was injected thereon. Glass beads were packed from the bottom of the test tube to a height of 20 mm, and the resin composition was injected thereon at a height of 20 mm. Then, after reducing the pressure for 10 minutes at 10 mmHg (1.3 kPa), the resin composition under normal pressure, 70 ° C. for 2 hours, 90 ° C. for 1 hour, 110 ° C. for 0.5 hours, and 145 ° C.
  • Impregnation rate ⁇ 1- (W B / W A ) ⁇ ⁇ 100 (I) Based on the calculated impregnation rate, the impregnation was evaluated based on the following criteria. The results are shown in Table 1.
  • the crack resistance of the above resin composition was evaluated by the following test method. 9 g of the resin composition was injected into an aluminum petri dish having a diameter of 60 mm. Next, the resin composition is thermally cured at 120 ° C. for 45 minutes under normal pressure to obtain a cured product, and the outer diameter is 23 mm at the center of the cured resin product without removing the cured product from the aluminum petri dish. A 13 mm thick, 3 mm thick spring washer was placed. Subsequently, 35 g of the resin composition is newly injected so that the spring washer on the cured resin is buried, and the resin is thermally cured at 105 ° C. for 8 hours under the condition that the spring washer is completely buried in the resin composition.
  • a hardened material in which a spring washer was buried was obtained.
  • the cured product was taken out of the aluminum petri dish and subjected to a thermal shock test in which it was alternately put into a test tank at -40 ° C for 30 minutes and at 150 ° C for 30 minutes (this is one cycle). This test was conducted until a crack occurred on the surface of the cured product, and the number of cycles at which the crack occurred was counted.
  • the evaluation result of the crack resistance is 200 cycles or more, it can be judged that the resistance to a thermal shock of the cured product can be sufficiently secured when sealing electric / electronic parts such as an ignition coil.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention concerne cette composition de résine destinée au moulage par injection qui contient un constituant durcissable et une charge présentant un diamètre moyen des particules ne dépassant pas 30 µm. La composition de résine destinée au moulage par injection peut également être utilisée pour le moulage de bobine. Le moulage est équipé d'une bobine et d'une partie d'étanchéité qui assure l'étanchéité de la bobine et la partie d'étanchéité contient la composition de résine ou un produit durci de celle-ci.
PCT/JP2017/039167 2017-10-30 2017-10-30 Composition de résine, moulage et procédé destiné à la fabrication de moulage Ceased WO2019087261A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261940A (ja) * 2000-03-22 2001-09-26 Sumitomo Bakelite Co Ltd 電気コイル注型用エポキシ樹脂組成物
JP2004051824A (ja) * 2002-07-22 2004-02-19 Kyocera Chemical Corp 注形用エポキシ樹脂組成物
JP2008195782A (ja) * 2007-02-09 2008-08-28 Kyocera Chemical Corp モールドコイル含浸用エポキシ樹脂組成物及びモールドコイル装置
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP2015044906A (ja) * 2013-08-27 2015-03-12 京セラケミカル株式会社 点火コイル注形用エポキシ樹脂組成物、点火コイルおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261940A (ja) * 2000-03-22 2001-09-26 Sumitomo Bakelite Co Ltd 電気コイル注型用エポキシ樹脂組成物
JP2004051824A (ja) * 2002-07-22 2004-02-19 Kyocera Chemical Corp 注形用エポキシ樹脂組成物
JP2008195782A (ja) * 2007-02-09 2008-08-28 Kyocera Chemical Corp モールドコイル含浸用エポキシ樹脂組成物及びモールドコイル装置
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP2015044906A (ja) * 2013-08-27 2015-03-12 京セラケミカル株式会社 点火コイル注形用エポキシ樹脂組成物、点火コイルおよびその製造方法

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