WO2019078206A8 - 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 - Google Patents
多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 Download PDFInfo
- Publication number
- WO2019078206A8 WO2019078206A8 PCT/JP2018/038501 JP2018038501W WO2019078206A8 WO 2019078206 A8 WO2019078206 A8 WO 2019078206A8 JP 2018038501 W JP2018038501 W JP 2018038501W WO 2019078206 A8 WO2019078206 A8 WO 2019078206A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- reflective film
- reflective mask
- multilayer reflective
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Vapour Deposition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
Abstract
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020207007408A KR102785832B1 (ko) | 2017-10-17 | 2018-10-16 | 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법 |
| SG11202002853TA SG11202002853TA (en) | 2017-10-17 | 2018-10-16 | Substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device |
| JP2019549295A JP7286544B2 (ja) | 2017-10-17 | 2018-10-16 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| KR1020257009101A KR20250046343A (ko) | 2017-10-17 | 2018-10-16 | 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법 |
| US16/756,727 US11262647B2 (en) | 2017-10-17 | 2018-10-16 | Substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| US17/581,590 US11681214B2 (en) | 2017-10-17 | 2022-01-21 | Substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device |
| US18/142,223 US12025911B2 (en) | 2017-10-17 | 2023-05-02 | Reflective structure, reflective mask blank, reflective mask and method of manufacturing semiconductor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017201189 | 2017-10-17 | ||
| JP2017-201189 | 2017-10-17 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/756,727 A-371-Of-International US11262647B2 (en) | 2017-10-17 | 2018-10-16 | Substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| US17/581,590 Continuation US11681214B2 (en) | 2017-10-17 | 2022-01-21 | Substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2019078206A1 WO2019078206A1 (ja) | 2019-04-25 |
| WO2019078206A8 true WO2019078206A8 (ja) | 2020-02-20 |
Family
ID=66174168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/038501 Ceased WO2019078206A1 (ja) | 2017-10-17 | 2018-10-16 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11262647B2 (ja) |
| JP (3) | JP7286544B2 (ja) |
| KR (2) | KR20250046343A (ja) |
| SG (1) | SG11202002853TA (ja) |
| TW (3) | TW202536526A (ja) |
| WO (1) | WO2019078206A1 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7286544B2 (ja) | 2017-10-17 | 2023-06-05 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| TW202511858A (zh) | 2018-05-25 | 2025-03-16 | 日商Hoya股份有限公司 | 反射型光罩基底及反射型光罩 |
| SG11202112745RA (en) * | 2019-05-21 | 2021-12-30 | Agc Inc | Reflective mask blank for euv lithography |
| JP7610346B2 (ja) * | 2019-11-01 | 2025-01-08 | テクセンドフォトマスク株式会社 | 反射型マスク及び反射型マスクの製造方法 |
| CN111290224B (zh) * | 2020-02-20 | 2023-04-07 | 上海华力微电子有限公司 | 一种单元标记及其设计方法 |
| JP7318607B2 (ja) * | 2020-07-28 | 2023-08-01 | Agc株式会社 | Euvリソグラフィ用反射型マスクブランク、euvリソグラフィ用反射型マスク、およびそれらの製造方法 |
| TW202246879A (zh) * | 2021-02-09 | 2022-12-01 | 美商應用材料股份有限公司 | 極紫外光遮罩毛胚結構 |
| US11782337B2 (en) * | 2021-09-09 | 2023-10-10 | Applied Materials, Inc. | Multilayer extreme ultraviolet reflectors |
| JP2025036222A (ja) | 2023-08-31 | 2025-03-14 | Hoya株式会社 | 多層反射膜付き基板、マスクブランク、転写用マスク及び転写用マスクの製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021901A (ja) * | 1988-06-09 | 1990-01-08 | Fujitsu Ltd | 位置合わせマークの形成方法 |
| JP3219502B2 (ja) * | 1992-12-01 | 2001-10-15 | キヤノン株式会社 | 反射型マスクとその製造方法、並びに露光装置と半導体デバイス製造方法 |
| US6756158B2 (en) * | 2001-06-30 | 2004-06-29 | Intel Corporation | Thermal generation of mask pattern |
| US6830851B2 (en) * | 2001-06-30 | 2004-12-14 | Intel Corporation | Photolithographic mask fabrication |
| JP2005317617A (ja) * | 2004-04-27 | 2005-11-10 | Nikon Corp | 位置検出用マーク及びそれを備えたレチクル又は感光性基板、位置検出方法、マーク評価方法、及びマーク検出方法とマーク検出装置、並びに露光方法と露光装置 |
| JP5279840B2 (ja) * | 2008-11-27 | 2013-09-04 | Hoya株式会社 | 多層反射膜付基板及び反射型マスクブランク並びに反射型マスクの製造方法 |
| JP2010219445A (ja) | 2009-03-18 | 2010-09-30 | Nuflare Technology Inc | 荷電粒子ビーム描画方法、荷電粒子ビーム描画用の基準マークの位置検出方法及び荷電粒子ビーム描画装置 |
| KR101904560B1 (ko) | 2011-03-07 | 2018-10-04 | 에이지씨 가부시키가이샤 | 다층 기판, 다층 기판의 제조 방법, 다층 기판의 품질 관리 방법 |
| KR101908168B1 (ko) | 2011-09-01 | 2018-10-15 | 에이지씨 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 블랭크의 제조 방법, 및 반사형 마스크 블랭크의 품질 관리 방법 |
| JP6460619B2 (ja) | 2012-03-12 | 2019-01-30 | Hoya株式会社 | 反射型マスクブランク及び反射型マスクの製造方法 |
| JP2013222811A (ja) | 2012-04-16 | 2013-10-28 | Lasertec Corp | Euvマスクブランクス、マスクの製造方法、及びアライメント方法 |
| WO2014050891A1 (ja) * | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにeuvリソグラフィ用反射型マスクおよびその製造方法 |
| WO2015146140A1 (ja) * | 2014-03-24 | 2015-10-01 | 凸版印刷株式会社 | Euvマスクの位相欠陥評価方法、euvマスクの製造方法、euvマスクブランク及びeuvマスク |
| JP6713251B2 (ja) * | 2015-03-30 | 2020-06-24 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びにそれらの製造方法 |
| JP6586934B2 (ja) | 2015-09-17 | 2019-10-09 | Agc株式会社 | 反射型マスクブランク、及び反射型マスクブランクの製造方法 |
| JP2017075997A (ja) * | 2015-10-13 | 2017-04-20 | 旭硝子株式会社 | 反射型マスクブランク、及び反射型マスクブランクの製造方法 |
| JP7286544B2 (ja) | 2017-10-17 | 2023-06-05 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| WO2022004201A1 (en) | 2020-06-30 | 2022-01-06 | Aoyama Seisakusho Co., Ltd. | Piercing nut and method for fixing the same to inner surface of mating member having closed sectional shape |
-
2018
- 2018-10-16 JP JP2019549295A patent/JP7286544B2/ja active Active
- 2018-10-16 US US16/756,727 patent/US11262647B2/en active Active
- 2018-10-16 KR KR1020257009101A patent/KR20250046343A/ko active Pending
- 2018-10-16 KR KR1020207007408A patent/KR102785832B1/ko active Active
- 2018-10-16 WO PCT/JP2018/038501 patent/WO2019078206A1/ja not_active Ceased
- 2018-10-16 SG SG11202002853TA patent/SG11202002853TA/en unknown
- 2018-10-17 TW TW114120942A patent/TW202536526A/zh unknown
- 2018-10-17 TW TW113126233A patent/TWI889453B/zh active
- 2018-10-17 TW TW107136501A patent/TWI851543B/zh active
-
2022
- 2022-01-21 US US17/581,590 patent/US11681214B2/en active Active
-
2023
- 2023-05-02 US US18/142,223 patent/US12025911B2/en active Active
- 2023-05-24 JP JP2023085233A patent/JP7500828B2/ja active Active
-
2024
- 2024-06-05 JP JP2024091133A patent/JP7688763B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023104997A (ja) | 2023-07-28 |
| KR20200064065A (ko) | 2020-06-05 |
| US20230266658A1 (en) | 2023-08-24 |
| TW202447325A (zh) | 2024-12-01 |
| WO2019078206A1 (ja) | 2019-04-25 |
| TWI889453B (zh) | 2025-07-01 |
| JP7688763B2 (ja) | 2025-06-04 |
| SG11202002853TA (en) | 2020-05-28 |
| JPWO2019078206A1 (ja) | 2020-11-05 |
| KR102785832B1 (ko) | 2025-03-26 |
| KR20250046343A (ko) | 2025-04-02 |
| US11262647B2 (en) | 2022-03-01 |
| JP7500828B2 (ja) | 2024-06-17 |
| US12025911B2 (en) | 2024-07-02 |
| US11681214B2 (en) | 2023-06-20 |
| TW202536526A (zh) | 2025-09-16 |
| JP7286544B2 (ja) | 2023-06-05 |
| JP2024114710A (ja) | 2024-08-23 |
| US20220146925A1 (en) | 2022-05-12 |
| TW201928503A (zh) | 2019-07-16 |
| US20200249558A1 (en) | 2020-08-06 |
| TWI851543B (zh) | 2024-08-11 |
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