[go: up one dir, main page]

WO2019075096A1 - Systèmes et procédés pour chicanes d'entrée de condensateur à base pression - Google Patents

Systèmes et procédés pour chicanes d'entrée de condensateur à base pression Download PDF

Info

Publication number
WO2019075096A1
WO2019075096A1 PCT/US2018/055260 US2018055260W WO2019075096A1 WO 2019075096 A1 WO2019075096 A1 WO 2019075096A1 US 2018055260 W US2018055260 W US 2018055260W WO 2019075096 A1 WO2019075096 A1 WO 2019075096A1
Authority
WO
WIPO (PCT)
Prior art keywords
condenser
inlet pipe
shell
inlet
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2018/055260
Other languages
English (en)
Inventor
Fang XUE
Xiuping Su
Bryson Lee Sheaffer
Jeb William SCHREIBER
Lu MEI
Shenglong Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Controls Technology Co
Original Assignee
Johnson Controls Technology Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Controls Technology Co filed Critical Johnson Controls Technology Co
Priority to CN201880065878.XA priority Critical patent/CN111630329B/zh
Publication of WO2019075096A1 publication Critical patent/WO2019075096A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/16—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/04—Details of condensers
    • F25B2339/046—Condensers with refrigerant heat exchange tubes positioned inside or around a vessel containing water or pcm to cool the refrigerant gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
    • F28D2021/007—Condensers

Definitions

  • HVAC&R heating, ventilating, air conditioning, and refrigeration
  • Vapor compression systems utilize a working fluid, typically referred to as a refrigerant, which changes phases between vapor, liquid, and combinations thereof in response to being subjected to different temperatures and pressures associated with operation of the vapor compression system.
  • a refrigerant typically referred to as a refrigerant
  • Certain vapor compression systems include a condenser having an inlet baffle for distributing a refrigerant gas on top of a tube bundle disposed in a lower portion of a shell of the condenser.
  • the condenser enables fluid flowing through tubes of the tube bundle to exchange thermal energy with and condense the falling refrigerant gas into a refrigerant liquid.
  • the condenser of certain vapor compression systems may restrict flow of the refrigerant gas during distribution, thus causing pressure drop which lowers an operational efficiency of the condenser.
  • a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a condenser configured to condense a low pressure refrigerant gas into a low pressure refrigerant liquid.
  • the condenser includes a shell defining an interior space that includes an interior height and an interior length, and a refrigerant inlet configured to enable the low pressure refrigerant gas to enter the shell.
  • the refrigerant inlet includes an inlet pipe traversing from an outside of the shell to the interior space.
  • the inlet pipe includes an inlet pipe inner diameter.
  • the refrigerant inlet includes a bell mouth tapered outward from the inlet pipe and into the interior space of the shell.
  • the condenser also includes a refrigerant inlet baffle configured to distribute the low pressure refrigerant gas along a portion of the interior length of the shell.
  • An upper surface of the refrigerant inlet baffle is vertically spaced from a bottom edge of the bell mouth by an upper layout height.
  • a bottom surface of the refrigerant inlet baffle is vertically spaced from a bottom inner surface of the shell by a lower layout height.
  • the upper layout height is greater than 0.25 of the inlet pipe inner diameter.
  • a method of designing a condenser for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes determining, via a processor of a computing device, an inner diameter of an inlet pipe of a refrigerant inlet of the condenser, such that a target flowrate of low pressure refrigerant gas is configured to travel though the refrigerant inlet and into the condenser. Additionally, the method includes multiplying, via the processor, the inner diameter of the inlet pipe by a design parameter. The design parameter is a value between 0.25 and 0.50. Further, the method includes determining, via the processor, an upper layout height defined between a bottom edge of the refrigerant inlet and an upper edge of an inlet baffle for the condenser based on the multiplication.
  • a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a condenser configured to condense a low pressure refrigerant gas into a low pressure refrigerant liquid, wherein the condenser includes a shell defining an interior space that comprises an interior height and an interior length and a refrigerant inlet configured to direct the low pressure refrigerant gas into the shell.
  • the refrigerant inlet includes an inlet pipe extending from an outside of the shell to the interior space, wherein the inlet pipe comprises an inlet pipe inner diameter and a diffuser coupled to the inlet pipe and tapered outward from the inlet pipe and into the interior space of the shell.
  • the condenser further includes a refrigerant inlet baffle configured to distribute the low pressure refrigerant gas along a portion of the interior length of the shell, wherein an upper surface of the refrigerant inlet baffle is vertically spaced from a bottom edge of the diffuser by an upper layout height, and wherein the upper layout height is greater than 0.25 of the inlet pipe inner diameter.
  • FIG. 1 is a perspective view of an embodiment of a building that may utilize a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system in a commercial setting, in accordance with the present techniques;
  • HVAC&R heating, ventilation, air conditioning, and refrigeration
  • FIG. 2 is a perspective view of an embodiment of a vapor compression system, in accordance with the present techniques
  • FIG. 3 is a schematic diagram of an embodiment of the vapor compression system, in accordance with the present techniques.
  • FIG. 4 is a schematic diagram of an embodiment of the vapor compression system, in accordance with the present techniques.
  • FIG. 5 is a side cross-sectional view of an embodiment of a condenser of the vapor compression system having an inlet baffle placement arrangement for reducing or minimizing a pressure drop within the condenser, in accordance with the present techniques
  • FIG. 6 is a partial axial cross-sectional view of an embodiment of the condenser having the baffle placement, in accordance with the present techniques; and [0013]
  • FIG. 7 is a schematic diagram of an embodiment of a computational fluid dynamics (CFD) screen overlay for a modeled condenser portion of the vapor compression system, in accordance with the present techniques.
  • CFD computational fluid dynamics
  • HVAC&R systems include a closed refrigeration circuit having a condenser configured to condense, or cool, a refrigerant therein to enable the HVAC&R system to condition an interior space.
  • a condenser configured to condense, or cool, a refrigerant therein to enable the HVAC&R system to condition an interior space.
  • the HVAC&R system may employ a low pressure refrigerant without an accompanying pressure drop to enhance condenser performance as compared to traditional condensers.
  • an embodiment of a condenser of the present disclosure includes a refrigerant inlet having an inlet pipe and a bell mouth tapered outward from the inlet pipe and into an interior space of a shell of the condenser.
  • a low pressure refrigerant gas enters the refrigerant inlet of the condenser and contacts a refrigerant inlet baffle that distributes the low pressure refrigerant gas on to a tube bundle disposed underneath the refrigerant inlet baffle.
  • the present disclosure recognizes an important balance between pressure drop of the low pressure refrigerant and tube layout room for the tube bundle beneath the refrigerant inlet baffle. For example, when a greater vertical space (e.g., upper layout height) is provided between the refrigerant inlet (e.g., and more particularly, the bell mouth of the refrigerant inlet) and the refrigerant inlet baffle, a reduction or minimization in pressure drop within the condenser is obtained.
  • a greater vertical space e.g., upper layout height
  • FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 in a building 12 for a typical commercial setting.
  • the HVAC&R system 10 may include a vapor compression system 14 that supplies a chilled liquid, which may be used to cool the building 12.
  • the HVAC&R system 10 may also include a boiler 16 to supply warm liquid to heat the building 12 and an air distribution system which circulates air through the building 12.
  • the air distribution system can also include an air return duct 18, an air supply duct 20, and/or an air handler 22.
  • the air handler 22 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by conduits 24.
  • the heat exchanger in the air handler 22 may receive either heated liquid from the boiler 16 or chilled liquid from the vapor compression system 14, depending on the mode of operation of the HVAC&R system 10.
  • the HVAC&R system 10 is shown with a separate air handler on each floor of building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 22 and/or other components that may be shared between or among floors.
  • FIGS. 2 and 3 are embodiments of the vapor compression system 14 that can be used in the HVAC&R system 10.
  • the vapor compression system 14 may circulate a refrigerant through a circuit starting with a compressor 32.
  • the circuit may also include a condenser 34, an expansion valve(s) or device(s) 36, and a liquid chiller or an evaporator 38.
  • the vapor compression system 14 may further include a control panel 40 that has an analog to digital (AID) converter 42, a microprocessor 44, a non-volatile memory 46, and/or an interface board 48.
  • AID analog to digital
  • HFC hydrofluorocarbon
  • R- 41 OA R-407, R-134a
  • HFO hydrofluoro olefin
  • NH3 ammonia
  • R-717 R-717
  • C02 carbon dioxide
  • R-744 hydrocarbon based refrigerants
  • the vapor compression system 14 may be configured to efficiently utilize refrigerants having a normal boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere of pressure, also referred to as low pressure refrigerants, versus a medium pressure refrigerant, such as R-134a.
  • refrigerants having a normal boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere of pressure also referred to as low pressure refrigerants
  • medium pressure refrigerant such as R-134a.
  • "normal boiling point” may refer to a boiling point temperature measured at one atmosphere of pressure.
  • the vapor compression system 14 may use one or more of a variable speed drive (VSDs) 52, a motor 50, the compressor 32, the condenser 34, the expansion valve or device 36, and/or the evaporator 38.
  • the motor 50 may drive the compressor 32 and may be powered by a variable speed drive (VSD) 52.
  • the VSD 52 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source, and provides power having a variable voltage and frequency to the motor 50.
  • the motor 50 may be powered directly from an AC or direct current (DC) power source.
  • the motor 50 may include any type of electric motor that can be powered by a VSD or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.
  • the compressor 32 compresses a refrigerant vapor and delivers the vapor to the condenser 34 through a discharge passage.
  • the compressor 32 may be a centrifugal compressor.
  • the refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34.
  • the refrigerant vapor may condense to a refrigerant liquid in the condenser 34 as a result of thermal heat transfer with the cooling fluid.
  • the liquid refrigerant from the condenser 34 may flow through the expansion device 36 to the evaporator 38.
  • the condenser 34 is water cooled and includes a tube bundle 54 connected to a cooling tower 56, which supplies the cooling fluid to the condenser 34.
  • the liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34.
  • the liquid refrigerant in the evaporator 38 may undergo a phase change from the liquid refrigerant to a refrigerant vapor.
  • the evaporator 38 may include a tube bundle 58 having a supply line 60S and a return line 60R connected to a cooling load 62.
  • the cooling fluid of the evaporator 38 enters the evaporator 38 via return line 60R and exits the evaporator 38 via supply line 60S.
  • the evaporator 38 may reduce the temperature of the cooling fluid in the tube bundle 58 via thermal heat transfer with the refrigerant.
  • the tube bundle 58 in the evaporator 38 can include a plurality of tubes and/or a plurality of tube bundles. In any case, the vapor refrigerant exits the evaporator 38 and returns to the compressor 32 by a suction line to complete the cycle.
  • FIG. 4 is a schematic diagram of the vapor compression system 14 with an intermediate circuit 64 incorporated between condenser 34 and the expansion device 36.
  • the intermediate circuit 64 may have an inlet line 68 that is directly fluidly connected to the condenser 34.
  • the inlet line 68 may be indirectly fluidly coupled to the condenser 34.
  • the inlet line 68 includes a first expansion device 66 positioned upstream of an intermediate vessel 70.
  • the intermediate vessel 70 may be a flash tank (e.g., a flash intercooler).
  • the intermediate vessel 70 may be configured as a heat exchanger or a "surface economizer.” In the illustrated embodiment of FIG.
  • the intermediate vessel 70 is used as a flash tank, and the first expansion device 66 is configured to lower the pressure of (e.g., expand) the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus, the intermediate vessel 70 may be used to separate the vapor from the liquid received from the first expansion device 66. Additionally, the intermediate vessel 70 may provide for further expansion of the liquid refrigerant because of a pressure drop experienced by the liquid refrigerant when entering the intermediate vessel 70 (e.g., due to a rapid increase in volume experienced when entering the intermediate vessel 70). The vapor in the intermediate vessel 70 may be drawn by the compressor 32 through a suction line 74 of the compressor 32.
  • the vapor in the intermediate vessel may be drawn to an intermediate stage of the compressor 32 (e.g., not the suction stage).
  • the liquid that collects in the intermediate vessel 70 may be at a lower enthalpy than the liquid refrigerant exiting the condenser 34 because of the expansion in the expansion device 66 and/or the intermediate vessel 70.
  • the liquid from intermediate vessel 70 may then flow in line 72 through a second expansion device 36 to the evaporator 38.
  • FIG. 5 is a side cross-sectional view of the condenser 34 having a baffle placement 100 (e.g., optimized refrigerant inlet baffle placement) for an inlet baffle 102 to optimize operation of the condenser 34.
  • the inlet baffle 102 may be a diffuser.
  • the inlet baffle 102 may be formed of cast iron.
  • the inlet baffle 102 may be formed utilizing a pattern, such as a cast.
  • the condenser 34 includes a shell 104 (e.g., cylindrical shell) having a tube bundle 106 disposed therein.
  • the tube bundle 106 includes a plurality of tubes 108 (e.g., heat exchange tubes) that enable a cooling fluid to flow therethrough.
  • tubes 108 e.g., heat exchange tubes
  • a first water box 110 is secured to a first tubesheet 112 at a first end 114 of the shell 104
  • a second water box 116 is secured to a second tubesheet 118 at second end 120 of the shell 104.
  • the condenser 34 supplies a cooling fluid 130 (e.g., cool water) through an inlet 132 of a lower chamber 134 of the first water box 110.
  • the cooling fluid 130 is directed through a lower portion of the tubes 108 for a first pass through the shell 104.
  • the cooling fluid 130 is directed by the second water box 116 into an upper portion of the tubes 108 for a second pass through the shell 104, and is directed out of the shell 104 through an outlet 138 of a second chamber 140 of the first water box 110 (e.g., as warmed water). While the illustrated embodiment of FIG. 5 shows the condenser 34 as having two passes for the cooling fluid 130, it should be recognized that, in other embodiments, the condenser 34 may be configured to direct the cooling fluid 130 using any suitable number of passes (e.g., one, two, four, five, six, seven, eight, nine, ten, or more passes).
  • the shell 104 includes a refrigerant inlet 152.
  • the refrigerant inlet 152 is centrally positioned relative to the opposed ends 114 and 120 of the shell 104.
  • the refrigerant inlet 152 may be non- centrally positioned relative to the opposed ends 114 and 120 of the shell 104, similar to an illustrated refrigerant outlet 154.
  • the refrigerant inlet 152 includes an inlet pipe 160 fluidly coupled to or integrally formed with a bell mouth 162.
  • the bell mouth 162 may be a diffuser.
  • the bell mouth 162 may be a component that is positioned within the shell 104 separate from the inlet pipe 160, and the inlet pipe 160 and bell mouth 162 may be subsequently coupled to one another.
  • the inlet baffle 102 is disposed beneath the bell mouth 162 of the refrigerant inlet 152, and above the tube bundle 106.
  • the low pressure refrigerant gas 150 travels into the shell 104 via the inlet pipe 160, is directed by the bell mouth 162 along the inlet baffle 102, and travels across the inlet baffle 102 for distribution across the tube bundle 106.
  • the tubes 108 of the tube bundle 106 thus enable a transfer of thermal energy to the low pressure refrigerant gas 150 to condense the low pressure refrigerant gas 150 into a low pressure refrigerant liquid 164, which trickles down through the tube bundle 106 and out of the refrigerant outlet 154 on its way to the expansion device 36.
  • the baffle placement 100 discussed herein is employed to vertically position the inlet baffle 102 within the shell 104 of the condenser to reduce pressure drop within the condenser 34, while providing sufficient or desired space for the tube bundle 106.
  • an upper layout height 166 is defined between an upper surface 168 of the inlet baffle 102 and a bottom edge 170 of the bell mouth 162.
  • a lower layout height 172 is defined between a bottom surface 174 of the inlet baffle 102 and a bottom inner surface 176 of the shell 104.
  • an interior space 180 within the shell 104 e.g., including an interior height 182 and an interior length 184) is at least partially vertically bisected by the inlet baffle 102.
  • the upper layout height 166 is utilized by the condenser 34 to distribute the low pressure refrigerant gas 150 along at least a portion of the interior length 184 of the shell. As such, increasing the upper layout height 166 (e.g., by placing the inlet baffle 102 lower within the shell 104) decreases a pressure drop for the condenser 34 (e.g., by increasing a pressure recovery). Alternatively, decreasing the upper layout height 166 increases the pressure drop within the condenser 34 (e.g., by decreasing the pressure recovery). Moreover, the lower layout height 172 is utilized by the condenser 34 as space for the tube bundle 106 to be arranged (e.g., tube layout room).
  • a greater number and/or size of tubes 108 may be included in the tube bundle 106, thus increasing an amount of thermal energy that can be transferred via the condenser 34. Additionally, in embodiments having a smaller lower layout height 172, a fewer number and/or size of tubes 108 may be included in the tube bundle 106, thus decreasing a heat exchange efficiency of the condenser.
  • a pitch between the tubes 108 may be adjusted when constructing the condenser 34, such that a smaller pitch between adjacent tubes 108 is used when constructing condensers 34 having reduced lower layout heights 172, thus restricting flow of the low pressure refrigerant gas 150 and/or the low pressure refrigerant liquid 164 between the tubes 108 in the shell 104.
  • the baffle placement 100 is optimally determined (e.g., via computational fluid dynamics (CFD)) to balance pressure drop and tube layout room within the condenser 34. Further understanding of the refrigerant inlet 152 and the inlet baffle 102 is provided with reference to FIG. 6 below.
  • FIG. 6 is a detail axial cross-sectional view of the condenser 34.
  • the inlet pipe 160 of the refrigerant inlet 152 traverses the shell 104 of the condenser 34 (e.g., via an opening 190).
  • the inlet pipe 160 may be coupled to the opening 190 via welding, and more specifically, without the use of flanges.
  • the inlet pipe includes an inner diameter 188 to enable the low pressure refrigerant gas 150 to flow therein.
  • the bell mouth 162 includes a diverging radius 192 that flares radially outward from the inlet pipe 160, thus providing a smooth transition for the low pressure refrigerant gas 150 into the condenser 34 that enables pressure recovery (e.g. via reduced turbulence).
  • the bottom edge 170 of the bell mouth 162 is vertically spaced from the upper surface 168 of the inlet baffle 102 by the upper layout height 166.
  • the inlet baffle 102 includes upturned portions 196 that extend upward from a flat portion 198 of the inlet baffle 102 and contact an inner surface 202 of the shell 104.
  • the inlet baffle 102 defines a baffle space 204 which is at least partially fluidly isolated from the tube bundle 106 (e.g., along at least a portion of the length of the shell 104).
  • the inlet pipe 160 may be directly coupled to the inlet baffle 102 or a diffuser, such as via welding.
  • the upturned portions 196 may extend only partially towards the inner surface 202 of the shell 104 and may further include vertical portions 197 that couple the inlet baffle 102 directly to the inlet pipe 160 at the bell mouth 162.
  • the inlet pipe 160 may be coupled to the inlet baffle 102 inside the shell 104 and within a pressure boundary of the shell 104.
  • the vertical portions 197 may be angled some amount from a vertical position.
  • the inlet pipe 160 may be coupled directly to a diffuser different from the inlet baffle 102 via welding.
  • the baffle placement 100 of the inlet baffle 102 is included within the condenser 34 to optimize the balance between pressure drop and tube layout room.
  • the optimized upper layout height 166 is defined relative to the inner diameter 188 of the inlet pipe 160 of the refrigerant inlet 152.
  • the upper layout height 166 may be selected to be equal to a design parameter (e.g., a ratio, a value) multiplied times the inner diameter 188 of the inlet pipe 160.
  • the upper layout height 166 may be 0.200, 0.225, 0.250, 0.275, 0.300, 0.325, 0.350, 0.375, 0.400, 0.425, 0.450, 0.475, 0.500 or more of the inner diameter 188 of the inlet pipe 160. Additionally, the upper layout height 166 may be selected between any suitable range of ratios relative to the inner diameter 188 of the inlet pipe 160, such as between 0.250 and 0.500, 0.200 and 0.400, 0.300 and 0.500, 0.200 and 0.300, 0.200 and 0.250, 0.250 and 0.300, etc. of the inner diameter 188 of the inlet pipe 160.
  • an adjustment to an inlet pipe length 189 is considered by the present disclosure in order to enhance pressure recovery and/or refrigerant flow within the condenser 34.
  • the inlet pipe length 189 may be decreased to enhance the pressure recovery and/or the refrigerant flow within the condenser.
  • FIG. 7 is a perspective diagram of an embodiment of a CFD screen overlay 300 for a modeled condenser portion 302.
  • the modeled condenser portion 302 includes a quadrant of a condenser, such as the condenser 34 discussed above.
  • the modeled condenser portion 302 thus includes two symmetry faces 304, across which the modeled condenser portion 302 may be reflected to visually represent all four quadrants of a modeled condenser.
  • the CFD screen overlay 300 may be included on an electronic display of any suitable computing device (e.g., laptop computer, desktop computer, tablet, etc.) having a processor and memory therein, such as the illustrated computing device 310.
  • the modeled condenser portion 302 also includes a modeled refrigerant inlet 320 having a modeled inlet pipe 322 and modeled bell mouth 324.
  • a variable upper layout height 328 is defined between the modeled bell mouth 324 and a modeled inlet baffle 330.
  • a variable lower layout height 332 is defined between the modeled inlet baffle 330 and a modeled bottom inner surface 334 of a shell 336 of the modeled condenser portion 302.
  • greater variable upper layout heights correspond to greater pressure recovery
  • greater variable lower layout heights correspond to greater room for disposing a greater number or quantity of heat exchange tubes therein.
  • the user may model the pressure drop through the modeled condenser having the modeled condenser portion 302 for various embodiments of the variable upper layout height 328 and the variable lower layout height 332.
  • variable upper layout height 328 is at least 0.25 of the inner diameter of the modeled inlet pipe 322. Additional exemplary embodiments of the variable upper layout height 328 having minimized pressure drop via the optimized baffle placement 100 are shown below in Table 1, in which the variable upper layout height 328 approximates 0.3 (e.g., within 0.05%, 1%, 5%) of the modeled inlet pipe 322 inner diameter.
  • a service technician or system designer may utilize a fixture 340 to place the inlet pipe 160 within condenser 34 when simulating and determining the variable upper layout height 328 and the variable lower layout height 332.
  • the fixture 340 may be a ring, brace, clamp, guide, block, bracket, or other structure that may couple to and/or be positioned adjacent or about the inlet pipe 160.
  • the fixture 340 may be configured to support the inlet pipe 160 in a fixed position while simulating and determining the variable upper layout height 328 and the variable lower layout height 332.
  • the fixture 340 may also be used to hold the inlet pipe 160 in a desired location during assembly of the condenser 34, such as during securement of the inlet pipe 160 to the shell 104, to the bell mouth 162, and/or to another component of the HVAC&R system 10.
  • the fixture 340 may enable coupling (e.g., welding) of the inlet pipe 160 to an inlet boss of the HVAC&R system 10 without an additional flanged connection.
  • the fixture 340 or another fixture 340 may be used to position the bell mouth 162, which may be a diffuser, within the shell 104 during assembly of the condenser 34.
  • the fixture 340 may hold the bell mouth 162 in place while the bell mouth 162 or diffuser is secured to the shell 104, the inlet pipe 160, or both.
  • the present techniques are directed to a baffle placement design for a condenser to optimally balance pressure drop and tube layout room.
  • the baffle placement design includes disposing an inlet baffle between a refrigerant inlet and a tube bundle.
  • the refrigerant inlet includes an inlet pipe that flares into a bell mouth, which deposits low pressure refrigerant gas onto the inlet baffle.
  • the inlet baffle distributes the low pressure refrigerant gas along a length of a shell of the condenser, thus enabling the low pressure refrigerant gas to transfer heat to a cooling fluid flowing within the tubes of the tube bundle and condense thereon.
  • the present disclosure provides sufficient room for heat exchange tubes while reducing or minimizing pressure drop within the condenser.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un condenseur qui comprend une entrée de fluide frigorigène ayant un tuyau d'entrée traversant de l'extérieur vers l'espace intérieur de la coque. Le tuyau d'entrée comprend un diamètre interne de tuyau d'entrée. De plus, l'entrée de fluide frigorigène comprend un évasement doucine effilé vers l'extérieur à partir du tuyau d'entrée et dans l'espace intérieur de la coque. Le condenseur comprend également un déflecteur d'entrée de fluide frigorigène configuré pour distribuer un gaz réfrigérant à basse pression le long d'une partie d'une longueur intérieure de la coque du condenseur. Une surface supérieure de la chicane d'entrée de fluide frigorigène est verticalement espacée d'un bord inférieur de la bouche en cloche par une hauteur de disposition supérieure. De plus, une surface basse de la chicane d'entrée de fluide frigorigène est espacée verticalement d'une surface interne basse de la coque d'une hauteur de disposition inférieure. La hauteur de disposition supérieure est supérieure à 0,25 du diamètre interne de tuyau d'entrée.
PCT/US2018/055260 2017-10-10 2018-10-10 Systèmes et procédés pour chicanes d'entrée de condensateur à base pression Ceased WO2019075096A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880065878.XA CN111630329B (zh) 2017-10-10 2018-10-10 加热、通风、空调和制冷系统、冷凝器及其设计方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762570512P 2017-10-10 2017-10-10
US62/570,512 2017-10-10
US201762611417P 2017-12-28 2017-12-28
US62/611,417 2017-12-28

Publications (1)

Publication Number Publication Date
WO2019075096A1 true WO2019075096A1 (fr) 2019-04-18

Family

ID=64051742

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/055260 Ceased WO2019075096A1 (fr) 2017-10-10 2018-10-10 Systèmes et procédés pour chicanes d'entrée de condensateur à base pression

Country Status (2)

Country Link
CN (1) CN111630329B (fr)
WO (1) WO2019075096A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111928543A (zh) * 2020-09-09 2020-11-13 珠海格力电器股份有限公司 冷凝器和空调
EP3832242A4 (fr) * 2018-07-27 2022-04-06 York (Wuxi) Air Conditioning And Refrigeration Co., Ltd. Condenseur
CN119903785A (zh) * 2025-02-11 2025-04-29 北京广厦环能科技股份有限公司 一种真空冷凝器的设计方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202238050A (zh) * 2021-01-11 2022-10-01 美商江森自控泰科知識產權控股有限責任合夥公司 用於冷凍器之冷凝器過冷卻器
CN115371297A (zh) 2021-05-21 2022-11-22 开利公司 用于冷凝器的导流装置、具有其的冷凝器及制冷系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07318292A (ja) * 1994-05-25 1995-12-08 Hitachi Ltd 緩衝板
US20070028647A1 (en) * 2005-08-04 2007-02-08 York International Condenser inlet diffuser
WO2009120385A1 (fr) * 2008-03-28 2009-10-01 Saudi Arabian Oil Company Plateau de contact de chevauchement surélevé
WO2015175610A1 (fr) * 2014-05-13 2015-11-19 Holtec International Système de conditionnement de vapeur

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252186A (en) * 1979-09-19 1981-02-24 Borg-Warner Corporation Condenser with improved heat transfer
CA2191379A1 (fr) * 1995-11-28 1997-05-29 Cuddalore Padmanaban Natarajan Echangeur de chaleur pour applications haute temperature
NL2006776C2 (en) * 2011-05-13 2012-11-14 Friesland Brands Bv Evaporator system.
JP6378306B2 (ja) * 2013-03-12 2018-08-22 ロッキード マーティン コーポレーション 管端部の接合部に対する摩擦撹拌溶接処理及びそれにより製造された製品
CN105318616B (zh) * 2015-01-30 2017-02-15 浙江三花汽车零部件有限公司 干燥过滤器及其制造方法与冷凝器组件的制造方法
BE1023986B1 (nl) * 2016-03-31 2017-10-25 Atlas Copco Airpower,Naamloze Vennootschap Buizenwarmtewisselaar en werkwijze om deze te vervaardigen
CN206449943U (zh) * 2017-02-15 2017-08-29 特灵空调系统(中国)有限公司 一种具有导流挡板的壳管冷凝器
WO2019056378A1 (fr) * 2017-09-25 2019-03-28 Johnson Controls Technology Company Caractéristiques de récupération de pression d'entrée de condenseur pour ensemble refroidisseur
CN111442681B (zh) * 2020-04-30 2025-04-11 大唐环境产业集团股份有限公司 一种翅片管及换热器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07318292A (ja) * 1994-05-25 1995-12-08 Hitachi Ltd 緩衝板
US20070028647A1 (en) * 2005-08-04 2007-02-08 York International Condenser inlet diffuser
WO2009120385A1 (fr) * 2008-03-28 2009-10-01 Saudi Arabian Oil Company Plateau de contact de chevauchement surélevé
WO2015175610A1 (fr) * 2014-05-13 2015-11-19 Holtec International Système de conditionnement de vapeur

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3832242A4 (fr) * 2018-07-27 2022-04-06 York (Wuxi) Air Conditioning And Refrigeration Co., Ltd. Condenseur
US12055326B2 (en) 2018-07-27 2024-08-06 Tyco Fire & Security Gmbh Condenser
CN111928543A (zh) * 2020-09-09 2020-11-13 珠海格力电器股份有限公司 冷凝器和空调
CN119903785A (zh) * 2025-02-11 2025-04-29 北京广厦环能科技股份有限公司 一种真空冷凝器的设计方法

Also Published As

Publication number Publication date
CN111630329A (zh) 2020-09-04
CN111630329B (zh) 2022-12-02

Similar Documents

Publication Publication Date Title
WO2019075096A1 (fr) Systèmes et procédés pour chicanes d'entrée de condensateur à base pression
US10677503B2 (en) Heat exchanger
US11365912B2 (en) Suction duct and multiple suction ducts inside a shell of a flooded evaporator
TWI740871B (zh) 具有水箱之熱交換器
CN103946658A (zh) 管壳式热交换器
JP5975971B2 (ja) 熱交換器及び冷凍サイクル装置
JP2018112379A (ja) 空気調和機
CN104854410B (zh) 低压冷却器
CN113646598A (zh) 用于冷却器的冷凝器布置
CN111316053B (zh) 用于降膜蒸发器管板的系统和方法
WO2024064382A1 (fr) Échangeur de chaleur pour système cvcr
JP6885857B2 (ja) 空気調和機
WO2025112029A1 (fr) Économiseur pour système de cvc&r
WO2024259247A1 (fr) Évaporateur et accumulateur intégré et sous-refroidisseur pour système cvcr
WO2025030113A1 (fr) Agencement d'admission pour compresseur
WO2021016467A1 (fr) Évaporateur noyé et climatiseur ayant un évaporateur noyé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18796239

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18796239

Country of ref document: EP

Kind code of ref document: A1