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WO2018123432A1 - Antenne amplificatrice, unité de ci de communication équipée de l'antenne amplificatrice, et unité de ci de communication équipée de l'antenne amplificatrice à laquelle est relié un conducteur - Google Patents

Antenne amplificatrice, unité de ci de communication équipée de l'antenne amplificatrice, et unité de ci de communication équipée de l'antenne amplificatrice à laquelle est relié un conducteur Download PDF

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Publication number
WO2018123432A1
WO2018123432A1 PCT/JP2017/043161 JP2017043161W WO2018123432A1 WO 2018123432 A1 WO2018123432 A1 WO 2018123432A1 JP 2017043161 W JP2017043161 W JP 2017043161W WO 2018123432 A1 WO2018123432 A1 WO 2018123432A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
surface side
antenna
unit
booster antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/043161
Other languages
English (en)
Japanese (ja)
Inventor
久夫 金岡
詩朗 杉村
達次 庭田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Solution Co Ltd
Original Assignee
Phoenix Solution Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Solution Co Ltd filed Critical Phoenix Solution Co Ltd
Priority to JP2018558938A priority Critical patent/JP6879576B2/ja
Publication of WO2018123432A1 publication Critical patent/WO2018123432A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/40—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by components specially adapted for near-field transmission
    • H04B5/48—Transceivers

Definitions

  • An object of the present invention is to provide a booster antenna that exhibits high communication performance when attached to a conductor, a booster antenna-mounted communication IC unit, and a conductor-mounted booster antenna-mounted communication IC unit.
  • RFID Radio Frequency Identification
  • the RF tag used in the RFID system contains an antenna and an IC chip.
  • the carrier wave transmitted from the reader / writer antenna is received by the RF tag antenna and the identification data recorded on the IC chip is reflected. It communicates in a non-contact manner by returning it to the reader / writer on the wave.
  • the prior art has the following problems. That is, since the communication distance is short, it is necessary to bring the reader / writer close to the vicinity of the IC unit. In addition, if the IC unit is brought closer to a conductor (metal object, etc.), the resonance frequency will shift and this will interfere with communication, or communication will not be possible if radio waves are irradiated on the back side of the surface where the IC unit is attached. There's a problem.
  • the present invention provides a booster antenna that exhibits high communication performance when mounted on a conductor, a booster antenna-mounted communication IC unit, and a conductor-mounted booster antenna-mounted communication IC unit.
  • the purpose is to provide.
  • the booster antenna of the present invention includes an upper surface side conductor attached to the upper surface side of the base material, a lower surface side conductor attached to the lower surface side of the base material, and an end portion and a lower surface side of the upper surface side conductor attached to the inside or the side surface of the base material.
  • the antenna-mounted communication IC unit includes at least a main antenna unit in which a plurality of coils are connected in series so that the magnetic flux generation directions coincide with each other, and an IC chip connected to the main antenna unit.
  • the coil of less than one turn constitutes the sub antenna part, and the main antenna part and the sub antenna part are electromagnetically coupled so that the magnetic flux generation direction of the main antenna part coincides with the magnetic flux generation direction of the sub antenna part. It is characterized by that. Further, a frequency adjusting capacitor is connected to both ends of the coil of less than one turn. Further, when viewed in a plan view, the upper surface side conductor and the lower surface side conductor are attached so as not to overlap each other. Further, the base material is a multilayer printed board, and the connecting conductor electrically connects the upper surface side conductor and the lower surface side conductor through the through-hole penetrating each layer of the multilayer printed board.
  • the method of using the booster antenna according to the present invention is characterized in that, in the method of using the booster antenna, the lower surface side conductor and the conductor are electrically contact-connected.
  • the booster antenna-mounted communication IC unit of the present invention includes the booster antenna and the antenna-mounted communication IC unit, and the antenna-mounted communication IC unit has the same magnetic flux generation direction.
  • a plurality of coils connected in series, and an IC chip connected to the main antenna unit, and a coil of less than one turn constitutes a sub-antenna unit.
  • the portion and the sub-antenna portion are electromagnetically coupled.
  • the main antenna portion and the sub antenna portion are both constituted by coils, and the coil shape of the sub element installed on the conductor is less than one turn. Then, the entire conductor functions as an antenna by connecting the main antenna unit and the sub-antenna unit so that the magnetic flux generation directions of the two match.
  • the carrier wave of the reader / writer is transmitted from a position away from the IC unit, the carrier wave may not reach the IC unit.
  • the conductor functions as an antenna, if the carrier wave reaches a part of the conductor, the carrier wave propagates through the conductor to the sub-antenna part and the main antenna part, and a power supply voltage is generated in the IC chip. A circuit or the like can be operated.
  • the booster antenna, the booster antenna mounted communication IC unit, and the booster antenna mounted communication IC unit of the present invention can exhibit high communication performance when attached to a conductor.
  • the term “conductor” is “generic name for substances having a relatively large electrical conductivity” (Kojien), as well as the general meaning. For example, metal, carbon fiber, human body, animal body, vegetation, Although water, the ground, etc. are mentioned, it is not necessarily limited to these.
  • the main antenna portion is configured by connecting a plurality of coils in series, so that the size can be reduced.
  • the size can also be reduced by connecting frequency adjusting capacitors to both ends of the coil of less than one turn.
  • both are attached to a base material so that an upper surface side conductor and a lower surface side conductor may not overlap when seen in a plan view, a coil of less than one turn becomes C-shaped when seen in a plan view.
  • the booster antenna-mounted communication IC unit alone transmits and receives the carrier wave from the direction orthogonal to the upper surface of the base material. Is possible. If the base material is a multilayer printed circuit board and the connection conductor is passed through the through-holes that pass through each layer, the connection conductor will not be exposed on the surface of the base material, reducing the possibility of damage and improving durability. Can be made.
  • FIG. 1 A perspective view (a) showing the booster antenna, a perspective view (b) when the booster antenna is viewed in plan, a perspective view (c) of the booster antenna showing a state where the extension is attached, and a communication IC unit mounted with the booster antenna
  • FIG. A perspective view showing a structure of an antenna-mounted communication IC unit The perspective view which shows the state which installed the communication IC unit of a booster antenna mounting type on the conductor Perspective view (a) and right side view (b) showing another configuration example of the booster antenna Equivalent circuit diagram of communication IC unit with booster antenna
  • the booster antenna 1 is roughly composed of a base material 10, a coil 20 of less than one turn, an installation part 30, and a frequency adjusting capacitor 40.
  • an insulating plate such as ceramics, mica, and glass, an insulating film, an insulating sheet, an insulating film, etc. are used in addition to any insulating plastic resin that is generally used, such as epoxy resin and polyimide resin. can do. Ceramics are suitable from the viewpoints of insulation, miniaturization, and high temperature resistance.
  • a multilayer printed board may be used as the substrate 10.
  • the dimension and shape of the base material 10 are not specifically limited, in this Embodiment, it is set as the rectangular parallelepiped shape whose external dimension is about 2 mm long x 5 mm wide x 2 mm in height. That is, a rectangular parallelepiped shape of 5 mm or less ⁇ 5 mm or less ⁇ 2 mm or less in height is preferable.
  • the coil 20 having less than one turn is formed by the upper surface side conductor 21, the lower surface side conductor 22 and the connection conductor 23.
  • the coil 20 having less than one turn is made of any conductive material including a metal, and can be formed on the base material 10 by a technique such as plating, printing, etching, or vapor deposition. Alternatively, a coil 20 having less than one turn may be formed by cutting out a metal thin plate. As will be described in detail later, the coil 20 having less than one turn constitutes the sub-antenna portion 63.
  • the upper surface side conductor 21 is a member attached to the upper surface side of the base material 10.
  • the upper surface side conductor 21 of the present embodiment is substantially L-shaped that bends rightward from the entire rear surface of the upper surface of the base material 10 to the front.
  • the lower surface side conductor 22 is a member attached to the lower surface side of the base material 10.
  • the lower surface side conductor 22 of the present embodiment is attached to the entire front surface of the lower surface of the base material 10, so that the upper surface side conductor 21 and the lower surface side conductor 22 are viewed in plan view from above as shown in FIG. It is preferable to form so as not to overlap.
  • the upper surface side conductor 21 and the lower surface side conductor 22 may partially overlap each other.
  • the connecting conductor 23 is a member for electrically connecting the end of the upper surface side conductor 21 and the lower surface side conductor 22.
  • the installation portion 30 is a location for installing the antenna-mounted communication IC unit 50 and is provided on the upper surface side of the base material 10. In the present embodiment, the installation portion 30 is provided above the bent portion of the upper surface side conductor 21.
  • the frequency adjusting capacitor 40 is connected to both ends of the coil 20 having less than one turn.
  • an extension 25 (FIG. 1C) is formed from the end of the lower conductor 22 to the upper surface through the side surface of the substrate 10.
  • one of the frequency adjustment capacitors 40 is connected to the upper surface side conductor 21 and the other is connected to the extension portion 25, whereby the frequency adjustment capacitor 40 is connected to both ends of the coil 20 having less than one turn.
  • the function of the frequency adjusting capacitor 40 will be described later.
  • the antenna-mounted communication IC unit 50 includes at least a main antenna unit 60 and an IC chip 70.
  • the booster antenna 1 and the antenna-mounted communication IC unit 50 constitute a booster antenna-mounted communication IC unit 2.
  • the main antenna unit 60 a plurality of coils 61 are connected in series so that the generation directions of magnetic flux coincide.
  • the main antenna unit 60 includes a coil 61 on the back surface (lower surface) of the laminated substrate 62.
  • the number of substrates 62 can be adjusted as appropriate, three substrates are used in the present embodiment.
  • the substrate 62 in the present embodiment is configured by stacking an intermediate layer substrate 62 and a lowermost layer substrate 62 on the uppermost layer substrate 62 described above.
  • the substrate 62 can be laminated by a known method such as a method using an adhesive or a fusion of a resin contained in the substrate 62.
  • An uppermost layer coil 61 is formed between the intermediate layer substrate 62 and the uppermost layer substrate 62, and an intermediate layer coil 61 is formed between the intermediate layer substrate 62 and the lowermost layer substrate 62. Is done.
  • an insulating plate such as ceramics, mica, and glass, an insulating film, an insulating sheet, an insulating film, etc. are used in addition to any generally used insulating plastic resin including epoxy resin and polyimide resin. be able to. Ceramics are suitable from the viewpoints of insulation, miniaturization, and high temperature resistance.
  • substrate 31 are not specifically limited.
  • the shape of the substrate 31 can be a rectangular shape such as a square or a rectangle, a circle, an ellipse, or the like.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 0.5 mm or more, and preferably 1 mm or more.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 8 mm or less, preferably 6 mm or less, more preferably 5 mm or less, and most preferably 3 mm or less.
  • the planar outer dimensions are 5 mm ⁇ 5 mm or less.
  • an insulating film may be disposed between the substrates 31 as necessary.
  • substrate 62 are not specifically limited. Further, an insulating film may be disposed between the substrates 62 as necessary.
  • the coil 61 is a so-called planar coil that is spiral in a plane.
  • the outermost end of the uppermost coil 61 is connected to one line 71 of the IC chip 70 via a connection point 62 a (through hole) of the uppermost substrate 62. From the outer peripheral end, it turns counterclockwise in a spiral shape, and the inner peripheral end is connected to the inner peripheral end of the intermediate layer coil 61 via a connection point 62 a of the intermediate layer substrate 62.
  • the coil 61 of the intermediate layer is spirally counterclockwise from the inner peripheral end thereof, and the outer peripheral end is connected to the other line 71 via a connection point 62 a between the intermediate layer and the uppermost substrate 62.
  • the coils 61 are connected in series so that the magnetic flux generated by the common current is generated in the same direction.
  • the number of coils 61, the formation area, and the number of turns can be arbitrarily set according to the required inductance of the antenna-mounted communication IC unit 50.
  • the number of turns of the coil 61 of the uppermost layer and the intermediate layer is preferably 2 or more, and can be 3 or 4 or more.
  • the winding direction and connection form of each coil 61 may be any form other than that shown in the drawing as long as the magnetic field generation direction from each coil 61 is the same direction.
  • the coil 61 is formed on the back surface (lower surface) of the substrate 62, but may be formed on the front surface (upper surface) of the substrate 62.
  • the coil 61 is made of any conductive material including metal, and can be formed on the substrate 62 by a technique such as plating, printing, etching, or vapor deposition.
  • the IC chip 70 is connected to the main antenna unit 60 and is arranged on the upper surface of the uppermost substrate 62 in the present embodiment.
  • the IC chip 70 rectifies a part of the carrier wave transmitted from the reader / writer and generates a power supply voltage necessary for operation.
  • the generated power supply voltage operates a memory in which a control logic circuit or the like in the IC chip 70 is stored, a communication circuit for transmitting / receiving data to / from the reader / writer, and the like.
  • Two lines 71 are drawn from the side surface of the IC chip 70. 1D and 3 show a state in which the surface of the uppermost substrate 62 and the IC chip 70 are covered with a protective layer.
  • the main antenna unit 60 is installed in the installation unit 30 as a component of the antenna-mounted communication IC unit 50.
  • the main antenna unit 60 and the sub antenna unit 63 are electromagnetically coupled so that the magnetic flux generation direction of the main antenna unit 60 matches the magnetic flux generation direction of the sub antenna unit 63 (the coil 20 of less than one turn).
  • the lower surface side conductor 22 constituting the sub antenna part 63 is electrically connected to the conductor 100. That is, the lower surface side conductor 22 is electrically connected to the conductor 100 by bringing the lower surface side of the booster antenna 1 into contact with the conductor 100, whereby the sub-antenna portion 63 (the coil 20 of less than one turn) is electrically connected to the conductor 100. Will be connected to.
  • the main antenna unit 60 and the sub antenna unit 63 are connected so that the magnetic flux generation directions of the two coincide with each other, and the sub antenna unit 63 is further connected to the conductor 100 so that the entire conductor 100 is used as an antenna. Can do.
  • the conductor 23 for a connection shall be attached to the side surface of the base material 10, you may decide to attach to the inside of the base material 10.
  • FIG. 4A if the base material 10 is a multilayer printed circuit board 64 and the connection conductor 23 is passed through the through holes 80 penetrating each layer, the connection conductor 23 becomes the surface of the base material 10. Since it is not exposed to light, the possibility of breakage is reduced and durability can be improved.
  • FIG. 4 (b) the connection conductor 23 is extended in an oblique direction from the rear of the upper surface of the base material 10 to the front of the lower surface of the base material 10, thereby connecting the connection conductor 23 to the base material. Compared with the case where it is attached to the side surface of the coil 10, the total length of the coil 20 of less than one turn becomes longer. Thereby, communication performance can be improved more.
  • FIG. 5 is an equivalent circuit diagram of the booster antenna-mounted communication IC unit 2 of the present embodiment.
  • the main antenna unit 60 and the sub antenna unit 63 constitute a resonance circuit by the equivalent capacitance in the IC chip 70 and the equivalent capacitance including the gap of the open portion 24 of the coil 20 of less than one turn and the frequency adjusting capacitor 40.
  • the frequency adjusting capacitor 40 By using the frequency adjusting capacitor 40, the dimensions (mainly the length in the left-right direction) of the booster antenna 1 can be shortened.
  • the booster antenna 1 may not include the frequency adjustment capacitor 40.
  • the resonance frequency f [Hz] of this resonance circuit is given by equation (1).
  • the value of the resonance frequency f is set so as to be included in the frequency band of the radio wave transmitted from the reading device.
  • L Inductance of the coil 20 of less than one turn
  • C Capacitance of the frequency adjusting capacitor 40
  • ⁇ C Electric capacity between conductors in the base material 10 (dielectric) of the booster antenna 1.
  • the inductance is proportional to the number of turns of the coil 61. Under the condition that the total number of turns of the coil 61 constituting the main antenna unit 60 is n (where n >> 1), the inductance is increased before and after the main antenna unit 60 and the sub antenna unit 63 are electromagnetically joined. The change is negligible.
  • less than one turn of the sub antenna part 63 viewed from the n turns of the main antenna part 60 is less than 1 turn / n turn, so that a change in impedance when attached to the conductor 100 can be reduced. If the n-turn side is viewed from less than one turn, the converted electromagnetic field is multiplied by n from the conductor 100, so that electromagnetic waves can be taken in efficiently. Therefore, if conjugate matching is maintained between the IC chip 70 and the main antenna unit 60, sufficient communication performance can be maintained even after the main antenna unit 60 and the sub antenna unit 63 are electromagnetically joined.
  • the base material 10 corresponds to a “base material”
  • the upper surface side conductor 21 corresponds to a “first surface side conductor”
  • the lower surface side conductor 22 corresponds to a “second surface side conductor”.
  • the conductor 23 corresponds to the “connecting conductor”
  • the coil portion 20 of less than one turn corresponds to the “coil portion of less than one turn”
  • the installation portion 30 corresponds to the “installation portion”
  • the booster antenna 1 corresponds to the “booster booster”.
  • the extension 25 corresponds to "extension”
  • the frequency adjusting capacitor 40 corresponds to “frequency adjusting capacitor”
  • the multilayer printed circuit board 64 corresponds to "multilayer printed circuit board”
  • the through hole 80 corresponds to a “through hole”
  • the booster antenna-mounted communication IC unit 2 corresponds to a “booster antenna-mounted communication IC unit”
  • the main antenna portion 60 corresponds to a “main antenna portion”.
  • the IC chip 70 corresponds to an “IC chip”
  • the conductor 100 corresponds to a “conductor”.
  • the present invention is a booster antenna that exhibits high communication performance when mounted on a conductor, a communication IC unit equipped with a booster antenna, and a communication IC unit equipped with a booster antenna with a conductor.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Near-Field Transmission Systems (AREA)
  • Aerials With Secondary Devices (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention aborde le problème de réalisation d'une antenne amplificatrice qui présente une haute performance de communication lorsqu'elle est reliée à un conducteur, une unité de CI de communication équipée d'une antenne amplificatrice, et une unité de CI de communication équipée d'une antenne amplificatrice à laquelle est relié un conducteur. La solution selon la présente invention consiste en une antenne amplificatrice (1) qui comporte : une bobine (20) qui est enroulée sur moins d'un tour et qui est formée d'un conducteur du côté de surface supérieure (21) relié à un côté de la surface supérieure d'un substrat (10), un conducteur du côté de surface inférieure (22) relié à un côté de la surface inférieure du substrat, et un conducteur de connexion (23) relié à une surface intérieure ou à une surface latérale du substrat pour connecter électriquement une section d'extrémité du conducteur du côté de surface supérieure et une section d'extrémité du conducteur du côté de surface inférieure; et une section d'installation (30) pour l'installation d'une unité de CI de communication (50) équipée d'une antenne sur le côté de la surface supérieure du substrat. Lorsque le conducteur du côté de surface inférieure et un conducteur sont mis en contact électrique et connectés électriquement, un conducteur (100) fonctionne comme une antenne.
PCT/JP2017/043161 2016-12-30 2017-11-30 Antenne amplificatrice, unité de ci de communication équipée de l'antenne amplificatrice, et unité de ci de communication équipée de l'antenne amplificatrice à laquelle est relié un conducteur Ceased WO2018123432A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018558938A JP6879576B2 (ja) 2016-12-30 2017-11-30 ブースターアンテナ、ブースターアンテナ搭載形の通信用ｉｃユニット、及び導体付きブースターアンテナ搭載形の通信用ｉｃユニット

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016257468 2016-12-30
JP2016-257468 2016-12-30

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WO2018123432A1 true WO2018123432A1 (fr) 2018-07-05

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WO (1) WO2018123432A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6476356B1 (ja) * 2018-09-21 2019-02-27 ヨメテル株式会社 無線通信基板、および無線通信タグ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (fr) * 2008-05-21 2009-11-26 株式会社村田製作所 Dispositif ci sans fil
JP2011250406A (ja) * 2010-05-28 2011-12-08 China Steel Corp 容量性負荷を有するｒｆｉｄタグ
JP2012253699A (ja) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd 無線通信デバイス、その製造方法及び無線通信デバイス付き金属物品
CN102880898A (zh) * 2011-07-13 2013-01-16 上海铁勋智能识别系统有限公司 一种覆盖uhf全频段、自由空间和金属表面共用的超高频电子标签
WO2014050553A1 (fr) * 2012-09-26 2014-04-03 株式会社村田製作所 Dispositif d'antenne et dispositif électronique le comprenant
JP2016178449A (ja) * 2015-03-19 2016-10-06 Tdk株式会社 アンテナ装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100181A (ja) * 2009-11-04 2011-05-19 Toppan Printing Co Ltd 非接触ｉｃラベルとアンテナ内蔵被接着体
JP2011193245A (ja) * 2010-03-15 2011-09-29 Murata Mfg Co Ltd アンテナ装置、無線通信デバイス及び無線通信端末
JP5660217B2 (ja) * 2011-07-19 2015-01-28 株式会社村田製作所 アンテナ装置、ｒｆｉｄタグおよび通信端末装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (fr) * 2008-05-21 2009-11-26 株式会社村田製作所 Dispositif ci sans fil
JP2011250406A (ja) * 2010-05-28 2011-12-08 China Steel Corp 容量性負荷を有するｒｆｉｄタグ
JP2012253699A (ja) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd 無線通信デバイス、その製造方法及び無線通信デバイス付き金属物品
CN102880898A (zh) * 2011-07-13 2013-01-16 上海铁勋智能识别系统有限公司 一种覆盖uhf全频段、自由空间和金属表面共用的超高频电子标签
WO2014050553A1 (fr) * 2012-09-26 2014-04-03 株式会社村田製作所 Dispositif d'antenne et dispositif électronique le comprenant
JP2016178449A (ja) * 2015-03-19 2016-10-06 Tdk株式会社 アンテナ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6476356B1 (ja) * 2018-09-21 2019-02-27 ヨメテル株式会社 無線通信基板、および無線通信タグ
WO2020059154A1 (fr) * 2018-09-21 2020-03-26 ヨメテル株式会社 Substrat de communication sans fil et étiquette de communication sans fil

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JPWO2018123432A1 (ja) 2019-10-31
JP6879576B2 (ja) 2021-06-02

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