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WO2018111005A1 - Capteur de reconnaissance d'empreintes digitales ayant un stratifié de surface et procédé de formation d'un capteur de reconnaissance d'empreintes digitales - Google Patents

Capteur de reconnaissance d'empreintes digitales ayant un stratifié de surface et procédé de formation d'un capteur de reconnaissance d'empreintes digitales Download PDF

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Publication number
WO2018111005A1
WO2018111005A1 PCT/KR2017/014735 KR2017014735W WO2018111005A1 WO 2018111005 A1 WO2018111005 A1 WO 2018111005A1 KR 2017014735 W KR2017014735 W KR 2017014735W WO 2018111005 A1 WO2018111005 A1 WO 2018111005A1
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WO
WIPO (PCT)
Prior art keywords
functional layer
layer
upper functional
curable resin
fingerprint recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/014735
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English (en)
Korean (ko)
Inventor
전선아
오현택
김기대
박상영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IROOMO Co Ltd
Original Assignee
IROOMO Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IROOMO Co Ltd filed Critical IROOMO Co Ltd
Publication of WO2018111005A1 publication Critical patent/WO2018111005A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • the present invention relates to a surface laminate, a fingerprint recognition sensor having the surface laminate, products having a security device having the fingerprint recognition sensor, and a method of forming the fingerprint recognition sensor.
  • fingerprint recognition technology is mainly used to prevent security incidents through user registration and authentication process, and it is used to protect individual and organization's networking, protect contents and data, and secure access to computers or mobile devices. Access) It is applied to control.
  • a fingerprint recognition technology is applied to a device such as a pointing device biotrack pad (BTP) that detects image data of a finger fingerprint and performs a pointer operation.
  • BTP pointing device biotrack pad
  • a fingerprint recognition sensor is applied as a sensor of a pointing device.
  • the fingerprint recognition sensor is a device for recognizing a fingerprint pattern of a human finger, and the fingerprint recognition sensor is an optical sensor, an electrical (electrostatic Capacitive and conductive), ultrasonic sensors, and thermal sensors, and each type of fingerprint recognition sensor obtains fingerprint image data from a finger by a respective driving principle.
  • a print layer or a pattern layer having a specific color and / or pattern is coated or laminated on the surface of the fingerprint sensor.
  • Republic of Korea Patent Application Publication No. 10-2011-0058377 and Patent No. 10-1184295 and the like is formed by laminating a plurality of layers such as a printing layer and a pattern layer on a release film, and the printed layer and pattern layer formed on the release film After contacting the surface of the fingerprint sensor (EMC Strip) or the injection molding, the heating roller with a heater moves along the release film while pressing the surface laminate against the fingerprint sensor or injection and simultaneously heating the print layer.
  • a method of forming a surface laminate on the surface of a fingerprint recognition sensor or an injection molded product is disclosed in such a way that the patterned layer is cured by a thermal curing method, transferred to the surface of the fingerprint recognition sensor or an injection molded product, and the release film is separated and recovered.
  • the technical problem to be solved by the present invention is to provide a method of forming a surface laminate of a fingerprint recognition sensor comprising a UV adhesive.
  • the technical problem to be solved by the present invention is to provide a method for forming a fingerprint sensor using a surface laminate including a UV adhesive.
  • the technical problem to be solved by the present invention is to provide a fingerprint recognition sensor having a surface laminate including a UV adhesive, and an electronic product such as a portable mobile communication terminal having the fingerprint recognition sensor.
  • a transfer type surface laminate comprising: a lower functional layer coated on a surface of a fingerprint sensor or an electronic product injection product; A UV adhesive layer made of a UV curable resin applied on the lower functional layer and cured by UV light to be bonded to the lower functional layer; And an upper functional layer laminated on the UV adhesive layer before the UV adhesive layer is cured and then bonded to the UV adhesive layer while the UV adhesive layer is cured.
  • the method of forming a transfer sensor surface laminate of a fingerprint recognition sensor surface and an electronic product injection molding comprises: (a) coating a lower functional layer on the surface of the fingerprint recognition sensor or an electronic product injection molding, Forming a functional layer; (b) applying a UV curable resin on the lower functional layer; (c) laminating an upper functional layer formed on the release film onto a UV curable resin on the lower functional layer; (d) irradiating UV in a state where the fingerprint recognition sensor or the electronic product injection molding product and the release film are laminated through the step (c) to cure the UV curable resin to form a UV adhesive layer; (e) separating the release film from the upper functional layer.
  • a fingerprint sensor comprising: a substrate including at least one of a fingerprint recognition unit and an electronic product injection product of a portable mobile communication terminal; UV adhesive layer on the base portion; And an upper functional layer on the UV adhesive layer.
  • the upper functional layer may comprise a first upper functional layer and a second upper functional layer between the UV adhesive layer and the first upper functional layer.
  • Portable fingerprint recognition sensor comprises a UV adhesive layer comprising a UV curable resin; An adhesion reinforcing layer on the UV adhesive layer, the adhesion reinforcing layer comprising a UV curable resin; It may include an upper functional layer on the adhesion enhancement layer.
  • the upper functional layer may include a substrate portion having a surface laminate including a first upper functional layer and a second upper functional layer comprising a transparent non-conductive material layer.
  • Method for forming a fingerprint sensor is to form a UV curable resin layer on the substrate portion, to laminate a release film laminate on the UV curable resin layer, UV to the UV curable resin layer Irradiation may include curing the UV curable resin layer with a UV adhesive layer, and removing the release film of the release film laminate.
  • a UV adhesive layer that functions as an adhesive while curing by UV light is formed between a lower functional layer and an upper functional layer of a surface laminate laminated to a surface of a fingerprint sensor or an electronic product injection molding, thereby providing no heat.
  • the lower functional layer and the upper functional layer can be laminated without addition.
  • the surface laminate includes a UV adhesive layer having an adhesive function that is cured by UV light, and thus can be formed on the surface of a fingerprint sensor or an electronic product injection product without applying any heat.
  • FIG. 1 is a view conceptually illustrating a portable mobile communication terminal having a surface stack according to an embodiment of the present invention.
  • FIG. 2 is a flowchart illustrating a method of forming a surface laminate according to an embodiment of the present invention.
  • 3 to 7 are views for explaining a method for forming a surface laminate according to an embodiment of the present invention.
  • FIG 8 to 10 are views illustrating a method of forming a surface laminate according to another embodiment of the present invention.
  • 11 and 12 are conceptual views illustrating surface laminates according to embodiments of the present invention.
  • FIG. 13 is a micrograph of a cross section of a surface laminate according to the present invention.
  • the spatially relative terms 'below', 'beneath', 'lower', 'above', 'upper' and the like are shown in FIG. It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as terms that include different directions of the device in use or operation in addition to the directions shown in the figures. For example, when the device shown in the figure is reversed, a device described as "below” or "beneath" of another device may be placed “above” of another device.
  • the surface stack 100 may be included in the portable mobile communication terminal 1.
  • the surface stack 100 may include a surface stack 100 formed on the substrate 10 of the portable mobile communication terminal 1.
  • the portable mobile communication terminal 1 may be one of a smart phone, a tablet PC, a personal digital assistant (PDA), or other communication devices.
  • the surface stack 100 may be applied in various home appliances, automobiles, security devices, recognition devices, or various security devices.
  • the surface laminate 100 may include a base portion 10, a lower functional layer 30, a UV adhesive layer 60, and an upper functional layer 45.
  • the upper functional layer 45 may include a first upper functional layer 40 and a second upper functional layer 50.
  • the substrate unit 10 may include a fingerprint sensor, an electronic product injection molding, or a multipurpose substrate.
  • the fingerprint recognition sensor may be a fingerprint recognition unit applied to a smartphone, a tablet PC, or a PDA.
  • the electronic product injection product may be a plastic injection product such as a case or a housing such as the smartphone, the tablet PC, or the PDA.
  • the surface stack 100 may be formed on a specific area of the fingerprint sensor or the electronic product injection product.
  • the substrate portion 10 may be one of an epoxy molding compound (EMC), a plastic such as PET (polyethylene terephthalate), a non-conductive film (or tape) such as ceramics, glass, polyimide, or a printed circuit board (PCB). Can be.
  • EMC epoxy molding compound
  • PET polyethylene terephthalate
  • PCB printed circuit board
  • the substrate portion 10 may be, for example, an epoxy molding compound (EMC) laminated on the PCB.
  • EMC epoxy molding compound
  • the base unit 10 is shown below the front of the portable mobile communication terminal 10, the base unit 10 is the back, sides, corners, It may be located on corners, or various other locations.
  • the lower functional layer 30 may include an epoxy molding compound (EMC), a plastic such as PET, ceramics, glass, a polyimide layer (including a film or tape), or a polymer resin including a pigment.
  • EMC epoxy molding compound
  • the lower functional layer 30 includes a base resin and a pigment.
  • the lower functional layer 30 may have a specific color or pattern.
  • the lower functional layer 30 uses various methods of forming a layer having a spray method, a silk screen printing method, a transfer printing method, a pad printing method, an adhesive method, or any other color on the upper surface of the substrate part 10. Can be formed.
  • the substrate portion 10 and the lower functional layer 30 may have different colors.
  • the substrate portion 10 when the substrate portion 10 includes an epoxy molding compound, the substrate portion 10 may be black, and the lower functional layer 30 may be non-black colored, for example , Blue, red, yellow, gold, or a mixture of other rapeseed colors-or achromatic but not black-for example, white or gray.
  • the lower functional layer 30 may be black or transparent.
  • the lower functional layer 30 may be omitted.
  • the UV adhesive layer 60 may include a UV curable resin.
  • the UV adhesive layer 60 is hardened by UV light and firmly with the lower functional layer 30 and the upper functional layer 45-for example, the second upper functional layer 50. Can be glued.
  • the UV adhesive layer 60 is cured by the UV light while the base portion 10 and the upper functional layer 45-yes For example, it may be firmly adhered to the second upper functional layer 50.
  • the second upper functional layer 50 of the upper functional layer 45 may include a transparent or translucent nonconductive material layer stacked in a single layer or multiple layers.
  • the second upper functional layer 50 may include SiO 2 , TiO 2 , Al 2 O 3 , or various other transparent or translucent non-conductive oxide layers stacked in a single layer or multiple layers.
  • the second upper functional layer 50 may be colored. For example, yellow, blue, red, green, or various other colors may be used depending on the material of the second upper functional layer 50.
  • the second upper functional layer 50 may have a relatively high light transmittance, thereby being transparent or translucent to light, in particular UV light.
  • the second upper functional layer 50 may be formed using an adhesion method, a deposition method, or a coating method.
  • the second upper functional layer 50 may be formed using, for example, an E-Beam deposition method for excellent quality.
  • the second upper functional layer 50 may cause diffuse reflection to improve the stereoscopic feeling and visibility of the first upper functional layer 40.
  • the lower surface of the second upper functional layer 50 that is, the surface in contact with the UV adhesive layer 60, may be formed of a thermosetting resin or a UV curable resin for enhancing adhesion with the UV adhesive layer 60. It may further include.
  • the first upper functional layer 40 may protect the second upper functional layer 50 and the UV adhesive layer 60 from physical and chemical attack from the outside.
  • the first upper functional layer 40 may include an acrylic-based or urethane-based UV curable resin that can be cured by UV light.
  • the first upper functional layer 40 may include transparent or translucent glass, ceramics, plastic, PET, polyimide, or various other materials.
  • the first upper functional layer 40 may include a three-dimensional pattern 41 formed on the surface in contact with the second upper functional layer 50.
  • the pattern 41 may have a plurality of thin straight lines design such as a hair line.
  • the pattern 41 may be a three-dimensional design of a protruding hubble shape or a concave groove shape.
  • the pattern 41 may have a polygonal shape design such as a plurality of parallel straight line shapes (horizontal lines, vertical lines, or diagonal lines), a lattice shape, or a honeycomb shape.
  • the first upper functional layer 40 may not include the pattern 41. That is, the first upper functional layer 40 may have a smooth (flat) surface without the pattern 41.
  • the surface laminate 100 functions as an adhesive while being cured by UV light between the lower functional layer 30 and the upper functional layer 45 at the bottom. Since the UV adhesive layer 60 is included, it is possible to have a solid adhesive with only UV light without applying any heat.
  • FIGS. 3 to 7 illustrate the surface laminate 100 according to an embodiment of the present invention. It is a figure explaining the formation method.
  • the method of forming the surface laminate 100 may include an epoxy molding compound (EMC), plastics such as PET, ceramics, glass, and polyimide. It may include forming the lower functional layer 30 on the surface of the substrate portion 10 including the film, the fingerprint sensor comprising the polymer resin or the injection of the electronic product (step S1).
  • the lower functional layer 30 may include a pigment having a color with the base resin.
  • the lower functional layer 30 may be coated by spraying, silk screen printing, transfer printing, or pad printing.
  • the lower functional layer 30 may comprise an epoxy molding compound, a plastic such as PET, a ceramic, glass, or a non-conductive film (or tape) such as polyimide.
  • the method forms a first upper functional layer 40 on the surface of the release film 20, and molds M on the first upper functional layer 40. And pressing the first upper functional layer 40 using the pressure roller 70 to evenly distribute the first upper functional layer 40 on the release film 20.
  • the mold M may have an inverse pattern. For example, when the pattern 41 is mounded, the mold M may have a groove-shaped inverse pattern, or when the pattern 41 is grooved, the mold M may be It may have a mound inverted pattern. By pressing the pressure roller 70, a pattern 41 may be formed on the first upper functional layer 40.
  • the first upper functional layer 40 may include a UV curable resin.
  • the pattern 41 applies the UV curable resin onto / in the mold M having the mirrored inverse pattern shape of the pattern 41, and pressurizes using the pressure roller 70. And by irradiating UV, and curing the first upper functional layer 40.
  • the mold M may not have the inverse pattern.
  • the pattern 41 may not be formed on the first upper functional layer 40. That is, the first upper functional layer 40 may have a smooth and flat surface without the pattern 41. Thereafter, the mold M may be removed.
  • the method forms a second upper functional layer 50 on the surface of the first upper functional layer 40 from which the mold M is removed, thereby forming a release film laminate ( 25) (step S3).
  • the second upper functional layer 50 may be formed using an adhesion method, a deposition method, or a coating method.
  • the second top functional layer 50 comprises SiO 2 , TiO 2 , Al 2 O 3 , or various other transparent or translucent non-conductive oxide layers (eg, inorganic) Or using a deposition method.
  • the second upper functional layer 50 may be deposited using an E-Beam method.
  • the second upper functional layer 50 further comprises a thermosetting resin or a UV curable resin
  • the second upper functional layer 50 further forms the thermosetting resin or the UV curable resin.
  • the step S1 and the S2 to S3 may be performed independently of each other. That is, the step S1 and the steps S2 to S3 do not need to be performed sequentially, and may be simultaneously or reversed at different process positions, respectively.
  • step S4 it may include forming a UV curable resin layer 60a on the lower functional layer 30 on the substrate portion 10 (step S4).
  • the UV curable resin layer 60a may be formed using a discharge method or a squeegeeing method.
  • the lower functional layer 30 may be omitted.
  • the UV curable resin layer 60a may be directly formed on the substrate portion 10.
  • the method further comprises the release film laminate on the UV curable resin layer 60a such that the second upper functional layer 50 of the release film laminate 25 is in contact with the UV curable resin layer 60a. It may include stacking 25 (step S5).
  • the method comprises pressing the pressure roller 70 in a state in which the base portion 10, the lower functional layer 30, the UV curable resin layer 60a, and the release film laminate 25 are laminated.
  • the UV curable resin layer 60a is applied to the lower functional layer 30 (or the substrate portion 10 by applying pressure to the release film laminate 25 while moving at least once along the upper surface of the release film 20). )
  • the second upper functional layer 50 may be uniformly distributed (step S6).
  • the base unit 10, the lower functional layer 30, the UV curable resin layer 60a, and the release film laminate 25 are irradiated with UV to be UV curable. It may include curing the resin layer 60a to form the UV adhesive layer 60 (step S7).
  • the UV curable resin layer 60a that is, can be firmly bonded to the UV adhesive layer 60.
  • the method may include separating the release film 20 from the release film laminate 25 to form a surface laminate 100 formed on the substrate portion 10 shown in FIG. 1. (Step S8).
  • the first upper functional layer 40 and the second upper functional layer 50 formed on the release film 20 may be formed on the substrate part 10. Since it is attached to the lower functional layer 30 of the UV curing method, it is possible to obtain a remarkably beautiful appearance and clarity as compared to the case of the conventional heat curing method.
  • the UV-curable resin layer 60a when the UV-curable resin layer 60a is applied between the base portion 10 and the release film 20, the surface of the base portion 10 is not solid or rough. It is trapped in the UV curable resin layer 60a so that it does not appear in appearance, and when the UV curable resin layer 60a solidifies in this state, the transfer occurs while maintaining a beautiful portion without the impact of heat. Therefore, it is possible to improve the quality of the fingerprint sensor or the electronic product injection molded product finally produced, it is possible to obtain the advantage of improving the production yield.
  • FIGS. 8 to 10 are views illustrating a method of forming the surface laminate 100 according to another embodiment of the present invention.
  • the method of forming the surface laminate 100 may be performed after performing the processes described with reference to FIGS. 3 to 5, wherein the second upper functional layer of the release film laminate 25 is formed.
  • the method may further include forming the adhesion reinforcing layer 65 on the 50.
  • the adhesion reinforcing layer 65 may be coated and / or formed by a spray method, silk screen printing method, transfer printing method, pad printing method, or other various methods.
  • the method may include drying and curing the adhesion reinforcing layer 65 by performing a heat curing process or the like.
  • the adhesion reinforcing layer 65 may include a UV curable resin.
  • the method may include curing the adhesion reinforcing layer 65 by irradiating UV light to the adhesion reinforcing layer 65. Therefore, the adhesion reinforcing layer 65 may include at least one of a thermosetting resin or a UV curable resin.
  • the UV curable resin layer 60a is formed on the lower functional layer 30 on the substrate portion 10, and the UV curable resin layer ( Mounting the release film laminate 25 on 60a, and using the pressure roller 70 to pass the UV curable resin layer 60a to the lower functional layer 30 (or the substrate portion 10). And evenly distribute between the second upper functional layer 50.
  • the method may include irradiating UV to the UV curable resin layer 60a to cure the UV curable resin layer 60a to form a UV adhesive layer 60. Thereafter, the method may further include separating the release film 20 from the release film stack 25 to form the surface laminate 100.
  • the surface laminate 100 according to the exemplary embodiment of the present invention may include a UV adhesive layer 60 on the substrate portion 10 and an upper functional layer 45 on the UV adhesive layer 60. have.
  • the upper functional layer 45 may include a first upper functional layer 40 and a second upper functional layer 50.
  • the lower functional layer 30 may be omitted.
  • the surface laminate 100 according to the exemplary embodiment of the present invention may include a lower functional layer 30 on the base portion 10, a UV adhesive layer 60, and an upper functional layer on the UV adhesive layer 60. 45 may be included.
  • the upper functional layer 45 may include a first upper functional layer 40 and a second upper functional layer 50.
  • the pattern 41 may not be formed on one surface of the second upper functional layer 50 and may be omitted.
  • FIGS. 1-12 may be compatible and combined with each other.
  • the technical idea of the surface laminate 100 shown in FIG. 11 and the technical idea of the surface laminate 100 shown in FIG. 12 are combined to omit the lower functional layer 30, and the pattern 41.
  • a surface laminate having the first upper functional layer 40 without) may be implemented.
  • FIG. 13 is a longitudinal cross-sectional photograph of a surface laminate 100 according to an embodiment of the present invention. Referring to FIG. 13, it is seen that a lower functional layer 30, a UV adhesive layer 60, a second upper functional layer 50, and a first upper functional layer 40 are formed on the substrate portion 10.
  • FIG. 14 is a photomicrograph of the surface of the surface laminate 100 according to the present invention and the surface of the conventional surface laminate applied to the fingerprint sensor surface of the portable mobile communication terminal. Referring to Figure 14, it can be seen that the surface laminate 100 according to the present invention has a remarkably clear and beautiful appearance compared to the surface laminate of the prior art.
  • Various embodiments of the present invention may be used in the technical field for preventing a security incident through a user registration and authentication procedure using a fingerprint recognition technology.
  • a portable mobile communication terminal such as a smartphone, tablet PC, or PDA, computer, various consumer electronics, security devices, recognition devices, or various security devices.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un capteur de reconnaissance d'empreintes digitales. Le capteur de reconnaissance d'empreintes digitales peut comprendre : une partie substrat comprenant au moins un élément sélectionné parmi une partie de reconnaissance d'empreinte digitale d'un terminal de communication mobile portable et un matériau moulé par injection de produit électronique ; une couche adhésive UV sur la partie substrat ; et une couche fonctionnelle supérieure sur la couche adhésive UV. La couche fonctionnelle supérieure peut comprendre une première couche fonctionnelle supérieure et une seconde couche fonctionnelle supérieure entre la couche adhésive UV et la première couche fonctionnelle supérieure.
PCT/KR2017/014735 2016-12-14 2017-12-14 Capteur de reconnaissance d'empreintes digitales ayant un stratifié de surface et procédé de formation d'un capteur de reconnaissance d'empreintes digitales Ceased WO2018111005A1 (fr)

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KR1020160170581A KR101758249B1 (ko) 2016-12-14 2016-12-14 지문인식 센서의 전사방식 표면적층체 형성방법
KR10-2016-0170581 2016-12-14

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KR20190101717A (ko) 2018-02-23 2019-09-02 삼성전자주식회사 센서를 포함하는 전자 장치
KR102066657B1 (ko) * 2018-05-16 2020-01-15 (주)파트론 지문 센서 패키지 및 그 제조 방법
KR102812326B1 (ko) * 2020-05-20 2025-05-26 삼성디스플레이 주식회사 표시 장치 제조 설비 및 이를 이용한 표시 장치 제조 방법

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KR20160084302A (ko) * 2015-01-02 2016-07-13 주식회사 바이오메트릭스 필름 커버를 포함하는 생체인식센서 모듈 및 생체인식센서 모듈의 패키징 방법

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