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WO2018108142A1 - Modular power system - Google Patents

Modular power system Download PDF

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Publication number
WO2018108142A1
WO2018108142A1 PCT/CN2017/116353 CN2017116353W WO2018108142A1 WO 2018108142 A1 WO2018108142 A1 WO 2018108142A1 CN 2017116353 W CN2017116353 W CN 2017116353W WO 2018108142 A1 WO2018108142 A1 WO 2018108142A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
converter
control signal
local control
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/116353
Other languages
French (fr)
Chinese (zh)
Inventor
应建平
王明
黄宵驳
刘军
胡志明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Shanghai Co Ltd
Original Assignee
Delta Electronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201611191912.7A external-priority patent/CN108206643A/en
Priority claimed from CN201711322794.3A external-priority patent/CN108566101B/en
Application filed by Delta Electronics Shanghai Co Ltd filed Critical Delta Electronics Shanghai Co Ltd
Priority to EP17881738.3A priority Critical patent/EP3557753A4/en
Priority to AU2017376699A priority patent/AU2017376699B2/en
Priority to US16/465,004 priority patent/US11463016B2/en
Priority to BR112019011177-8A priority patent/BR112019011177B1/en
Publication of WO2018108142A1 publication Critical patent/WO2018108142A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J3/00Circuit arrangements for AC mains or AC distribution networks
    • H02J3/18Arrangements for adjusting, eliminating or compensating reactive power in networks
    • H02J3/1821Arrangements for adjusting, eliminating or compensating reactive power in networks using shunt compensators
    • H02J3/1835Arrangements for adjusting, eliminating or compensating reactive power in networks using shunt compensators with stepless control
    • H02J3/1842Arrangements for adjusting, eliminating or compensating reactive power in networks using shunt compensators with stepless control wherein at least one reactive element is actively controlled by a bridge converter, e.g. active filters
    • H02J3/1857Arrangements for adjusting, eliminating or compensating reactive power in networks using shunt compensators with stepless control wherein at least one reactive element is actively controlled by a bridge converter, e.g. active filters wherein such bridge converter is a multilevel converter
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J3/00Circuit arrangements for AC mains or AC distribution networks
    • H02J3/36Arrangements for transfer of electric power between AC networks via a high-tension DC link
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/483Converters with outputs that each can have more than two voltages levels
    • H02M7/49Combination of the output voltage waveforms of a plurality of converters
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/20Active power filtering [APF]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/60Arrangements for transfer of electric power between AC networks or generators via a high voltage DC link [HVCD]

Definitions

  • the present invention relates to the field of power electronics, and in particular to a modular power system.
  • the traditional power unit cascaded topology requires a set of optical fibers, auxiliary power supplies, and local controllers for each power unit, ie, the power converter.
  • This power unit cascaded topology increases with the increase of the voltage level, and the number of power units that need to be cascaded increases, resulting in an increase in the number of optical fibers, auxiliary power supplies, and local controllers.
  • the design is complex, costly, and reduces its reliability.
  • FIG. 1 is a schematic structural view of a three-phase SVG system in the prior art.
  • 2 is a schematic diagram of a more specific three-phase SVG system in the prior art.
  • the SVG system of Figures 1 and 2 includes three phase circuits in which the power cells in each phase are connected in cascade.
  • each phase circuit of the SVG system is formed by cascading a plurality of power units 1.
  • cascade is a common knowledge in the art, i.e., each power cell comprises a first end and a second end T 1 T 2, wherein two adjacent power cell a second terminal T 2 and the other The first end T 1 of one is connected.
  • Each phase circuit of the first power units through a first end of the filter L T 1 are respectively connected to three-phase network U A, U B and U C on the three-phase line, the last one power unit for each phase circuit The second ends are connected to each other.
  • each phase circuit of the SVG system is formed by cascading eight power units P 1 to P 8 .
  • Each power unit includes a first end and a second end as shown in Figure 1, wherein a second end of one of the adjacent two power units is coupled to the first end of the other.
  • the second end of the power unit P 1 and P power unit 2 is connected to a first end
  • a second end of the power unit P and the power unit P is connected to a first end of the 2 3, and so on, a second power unit P 7
  • the terminal is connected to the first end of the power unit P 8 .
  • the first end of the three power units P 1 in the three-phase circuit is connected to the U A , U B and U C phases of the three-phase power grid G through a filter circuit (composed of the inductor L, the resistor R and the capacitor C), wherein the three phases
  • the U A , U B and U C of the grid G are connected to the load R load .
  • the second ends of the three power units P 8 in the three-phase circuit are connected to each other.
  • Four power switching devices 2 are included in each power unit.
  • Each power switching device 2 consists of a power semiconductor switch S and an anti-parallel body diode or external diode D.
  • the collector of the power semiconductor switch S is connected to the cathode of the diode D, and the emitter of the power semiconductor switch S is connected to the anode of the diode D. Since the power semiconductor switch S and an anti-parallel body diode or external diode D are generally used as a whole, for the sake of brevity, the anti-parallel body diode or external diode D will not be separately mentioned in the following description. .
  • the power unit 1 shown in FIG. 1 may be a full bridge (H bridge) circuit, or may be other circuit topologies such as a half bridge circuit, a rectification-inverter circuit, and the like.
  • 3 is a schematic diagram of an H-bridge circuit (topology) in the prior art.
  • a power unit circuit for example an H-bridge, H-bridge circuit shown in Figure 3, comprises a power semiconductor switch S 1 is to S 4 and the DC bus capacitor C B.
  • the first end of the power semiconductor switch S 1 is connected to the positive terminal of the DC bus capacitor C B and the first terminal of the power semiconductor switch S 3 .
  • a second end of the power semiconductor switch S 1 is coupled to the first end of the power semiconductor switch S 4 .
  • the second end of the power semiconductor switch S 4 is connected to the negative terminal of the DC bus capacitor C B and the second terminal of the power semiconductor switch S 2 .
  • a second terminal of the power semiconductor switch S. 3 is connected to a first terminal of the power semiconductor switch S 2.
  • the second end of the power semiconductor switch S 1 serves as a first output of the H-bridge circuit, that is, the first end T 1 of the power unit 1
  • the second end of the power semiconductor switch S 3 serves as a second output of the H-bridge circuit. That is, the second end T 2 of the power unit 1.
  • FIG. 4 is a schematic diagram of a single phase SVG in the prior art.
  • the single-phase SVG includes a charging portion 3, a power portion 4, and a control portion 5.
  • the single phase SVG also includes a plurality of power units 40, each of which includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and another The second end is connected.
  • Figure 4 is a conventional cascaded solution for a 25kV single phase SVG.
  • the SVG is cascaded by a plurality of power units to form a phase that is connected to the grid via filters and contactors.
  • Each power unit 40 of the SVG typically employs an H-bridge circuit.
  • Each power unit 40 of the SVG system further includes a DC bus capacitor C B whose connection relationship is as shown in FIG. 4 , wherein the charging portion 3 is used to precharge the DC bus capacitor C B , and the control portion 5 is used to control the power. Part 4 runs.
  • each power unit 40 as a power converter, such as an H-bridge circuit, needs to be separately provided with a set of locals in addition to a main controller 50.
  • the controller 51, the driving circuit 52, the auxiliary power source 53 and the optical fiber 54 are connected in a relationship as shown in FIG. 4.
  • the main controller 50 outputs a main control signal to the local main controller 51, and the local main controller 51 generates a main control signal according to the main control signal.
  • the local control signal of the corresponding power unit is sent to the driving circuit 52.
  • the driving circuit 52 outputs a driving signal according to the local control signal to drive the corresponding power unit to operate.
  • a 25kV single-phase SVG can usually be implemented in the following two schemes.
  • IGBT Insulated Gate Bipolar Transistor
  • the second scheme the power switching device in the H-bridge circuit uses a high-voltage IGBT, such as a 3300V IGBT or even a 6500V IGBT, to increase the voltage level of a single power unit 40.
  • a high-voltage IGBT such as a 3300V IGBT or even a 6500V IGBT
  • a second scheme can generally be employed.
  • the 3300V IGBT if the 3300V IGBT is selected, the voltage level of each power unit 40 is doubled compared to the 1700V IGBT scheme, and the number of cascades can be reduced from 55 to 28, local controller 51, fiber 54 and auxiliary power supply.
  • the number and cost of 53 can also be reduced by half.
  • the cost of 3300V IGBT is still high. Under the same current specification, the cost is far more than twice the cost of 1700V IGBT. Therefore, the cost of the second option will far exceed the first option. If a 6500V IGBT is chosen, the cost pressure is even higher.
  • the current cascading scheme using low voltage IGBT power units or the cascading scheme using high voltage IGBT power units has its significant disadvantages.
  • FIG. 5 is a schematic illustration of an HVDC-Light system in the prior art.
  • the HVDC-Light includes a three-phase circuit, and each phase circuit includes an upper half arm and a lower half arm, and the upper half arm and the lower half arm of each phase circuit include a plurality of stages.
  • each power unit 40 also includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and a second of the other The terminals are connected, the inductance L of each upper arm is connected to the inductance L of the corresponding lower arm, and the connection points between the two inductors L are respectively connected to the power grid, and the connection relationship is as shown in FIG.
  • Each of the HVDC-Light power units 40 employs a half bridge converter. Each power unit 40 of the HVDC-Light further includes a DC bus capacitor. Each power unit 40 of the HVDC-Light also needs to be connected to a driving circuit 52. The power unit 40 operates according to a driving signal output by the driving circuit 52. In addition to the main controller 50, each power unit 40 also needs to be provided with a local controller 51, an optical fiber 54 and an auxiliary power supply 53, the connection relationship of which is shown in FIG.
  • the power supply mode of the local controller and auxiliary power supply needs further consideration and improvement.
  • the driving method of the power semiconductor switch needs further consideration and improvement.
  • a modular power supply system comprising: a main controller configured to output a main control signal; N local controllers, wherein each of the local controllers is configured to Receiving the main control signal to output at least one local control signal; and N power units in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end, each The second end of one of the power units is coupled to the first end of an adjacent one of the power units, each of the power units being configured to include M power converters, wherein each of the powers The converter includes a third end and a fourth end, the fourth end of each of the power converters being coupled to the third end of an adjacent one of the power converters, and the first one of the power conversions The third end of the power unit is the first end of the power unit, and the fourth end of the Mth power converter is the second end of the power unit, each of the power The converter is configured to And operating according to the local control signal outputted by the corresponding local controller,
  • the modular power supply system is configured to further include: N auxiliary power sources in one-to-one correspondence with the N local controllers, wherein each of the auxiliary power sources is configured To provide power to the corresponding local controller.
  • the N auxiliary power sources are configured to draw power from an external power source or to draw power from a corresponding one of the power units.
  • the power converter is any one of an AC/DC converter, a DC/AC converter, and a DC/DC converter.
  • the topologies of the M power converters are all identical, or partially identical.
  • the topology of the M power converters in each of the power units is all a full bridge converter, a half bridge converter, and a neutral point controllable three level One of a converter, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.
  • the topology of the M power converters in each of the power units is a full bridge converter, a half bridge converter, and a neutral point controllable three-level conversion Two or more combinations of a diode, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.
  • each of the power units further includes: M driving circuits in one-to-one correspondence with the M power converters, wherein each of the driving circuits is configured to be connected to Corresponding power semiconductor switch of the power converter receives the local control signal output by the corresponding local controller to output at least one driving signal to drive the power in the corresponding M power converters
  • the semiconductor switch is turned on and off.
  • each of the power units further includes: a plurality of driving circuits, wherein the number of the plurality of driving circuits is equal to the number of power semiconductor switches in the power unit, each of The driving circuit is configured to be connected to the power semiconductor switch of the corresponding power converter, receive a corresponding local control signal output by the local controller, to output a driving signal to drive the corresponding power semiconductor switch Turn on and off.
  • each of the drive circuits is identical to each other or different from each other.
  • each of the driving circuits includes a first magnetic isolation device that transmits a driving logic pulse and a power pulse included in the local control signal; or each One of the drive circuits includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal.
  • a portion of the driving circuit includes a first magnetic isolation device that transmits a driving logic pulse and a power pulse included in the local control signal;
  • the drive circuit includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal.
  • At least one of the M power converters is a main power converter
  • at least one is a slave power converter
  • at least one of the M driving circuits is a main driving circuit.
  • At least one is a slave drive circuit configured to drive a corresponding power semiconductor switch in the main power converter to be turned on and off, the slave drive circuit configured to drive the corresponding slave power
  • the power semiconductor switches in the converter are turned on and off.
  • the main power converter and the slave power converter are controlled when a topology of the master power converter is the same as a topology of the slave power converter
  • the local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.
  • the number of the at least one main power converter is 1, and the number of the at least one slave power converter is M-1, controlling the same in the slave power converter
  • the local control signals of the position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.
  • the slave power converter is controlled
  • the local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.
  • the power semiconductor switch of the same position in the main power converter is controlled when the topology of the main power converter is different from the topology of the slave power converter
  • the local control signals that are turned on and off at the same time are the same.
  • the same position of the power semiconductor switch in the main power converter is controlled simultaneously
  • the local control signals that are turned on and off at the same time are the same.
  • the main driving circuit and the slave driving circuit each include a magnetic isolation device that transmits driving logic pulses and power pulses included in the local control signal; Or the magnetic isolation device transmits a drive logic pulse included in the local control signal.
  • the slave drive circuit includes a slave magnetic isolation device, wherein the main magnetic isolation device transmits a signal included in the local control signal Driving a logic pulse, the driving logic pulse and power pulse included in the local control signal being transmitted from a magnetic isolation device; or the main magnetic isolation device transmitting a driving logic pulse and a power pulse included in the local control signal,
  • the drive logic pulses included in the local control signal are transmitted from the magnetic isolation device.
  • each of the main driving circuit and each of the slave driving circuits includes a magnetic isolation device that transmits a driving logic pulse included in the local control signal And a power pulse, or the magnetic isolation device transmits a drive logic pulse included in the local control signal.
  • the slave drive circuit includes a slave magnetic isolation device, wherein the main magnetic isolation device transmits a signal included in the local control signal Driving a logic pulse, the driving logic pulse and the power pulse contained in the local control signal are transmitted from the magnetic isolation device, or the main magnetic isolation device transmits a driving logic pulse and a power pulse included in the local control signal, The drive logic pulses included in the local control signal are transmitted from the magnetic isolation device.
  • each of the power units further includes: a plurality of first DC bus voltage clamping circuits, one-to-one corresponding to the slave power converters, wherein each of the A DC bus voltage clamping circuit is configured to be coupled in parallel with the corresponding DC bus capacitance of the slave power converter such that the DC bus voltage of the corresponding slave power converter does not exceed a first predetermined value.
  • each of the first DC bus voltage clamping circuits includes: a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, a series branch circuit is connected in parallel with the DC bus capacitor, the switch control circuit is connected to the control end of the switch, and when the DC bus voltage exceeds the first preset value, the switch control circuit outputs a switch control signal to The switch is turned on such that the DC bus capacitor is discharged through the series branch.
  • each of the power units further includes:
  • each of the first DC bus voltage clamping circuits is configured to be coupled to a DC bus of a corresponding slave power converter
  • the capacitors are connected in parallel such that the DC bus voltage of the corresponding slave power converter does not exceed a first preset value
  • each of the second DC bus voltage clamping circuits is configured to be in parallel with a DC bus capacitance of a corresponding main power converter So that the corresponding DC bus voltage of the main power converter does not exceed a second preset value.
  • each of the first DC bus voltage clamping circuits includes: a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, a series branch circuit is connected in parallel with the DC bus capacitor, the switch control circuit is connected to the control end of the switch, and when the DC bus voltage exceeds the first preset value, the switch control circuit outputs a switch control signal to Turning on the switch such that the DC bus capacitor is discharged through the series branch;
  • Each of the second DC bus voltage clamping circuits includes:
  • the switch forms a series branch with the resistor, the series branch is coupled in parallel with the DC bus capacitor, and the switch control circuit is coupled to the control end of the switch when When the DC bus voltage exceeds the second predetermined value, the switch control circuit outputs a switch control signal to turn on the switch such that the DC bus capacitor is discharged through the series branch.
  • the invention can reduce the number of local controllers, optical fibers and auxiliary power sources by simplifying the structure by forming a plurality of power converters into one power unit and using a local controller, an optical fiber, and an auxiliary power source to control multiple power converters. Design, reduce costs and improve reliability.
  • the invention simplifies the control circuit by sharing a drive signal at the same position of the power semiconductor switches at the same position of the power converters in the power unit.
  • the invention is applicable to the topology of all AC/DC, DC/AC, DC/DC power converter connections and is widely used.
  • FIG. 1 is a schematic structural view of a three-phase SVG system in the prior art
  • FIG. 2 is a schematic diagram of a more specific three-phase SVG system in the prior art
  • FIG. 3 is a schematic diagram of an H-bridge circuit (topology) in the prior art
  • FIG. 4 is a schematic diagram of a single phase SVG in the prior art
  • FIG. 5 is a schematic diagram of an HVDC-Light system in the prior art
  • FIG. 6 is a block diagram of a modular power supply system in accordance with one embodiment of the present invention.
  • FIG. 7 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 8 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 9 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 10 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 11 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 16 is a schematic view showing the manner of connection between the local controller and the driving circuit of the present invention.
  • FIG. 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 18 is a schematic view showing the driving mode of the driving circuit of the present invention.
  • Figure 19 is a schematic view showing another driving mode of the driving circuit of the present invention.
  • Figure 20 is a circuit diagram of a driving circuit of one embodiment of the present invention.
  • Figure 21 is a timing chart of a driving circuit of one embodiment of the present invention.
  • Figure 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 27 is a circuit diagram of a clamp circuit according to an embodiment of the present invention.
  • FIG. 28 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 6 is a block diagram of a modular power system in accordance with one embodiment of the present invention.
  • the modular power supply system of the present invention is configured to include: a main controller 90, N local controllers 91, and N power units 70, where N is a natural number greater than one.
  • the main controller 90 is configured to output a main control signal.
  • the primary control signal is, for example, one or more parameters that are set to control the overall operational state of the modular power system.
  • Each local controller 91 is configured to receive the aforementioned primary control signal to output at least one local control signal.
  • the local control signal is, for example, one or more parameters that are set to control the overall operational state of the corresponding power unit 70, or the local control signal is used to control the operational state of a portion of the power converters in the corresponding power unit 70.
  • the modular power system of the present invention can be configured to further include N auxiliary power sources 93, one for each of the N local controllers 91, wherein each of the auxiliary power sources 93 is configured to correspond to a corresponding local controller 91 provides power.
  • each of the power unit 70 includes a first end and a second end X 1 X 2, each of the second end of the power unit 70 is connected to the adjacent X 2
  • the first end X 1 of one power unit 70, that is, the second end X 2 of one of the adjacent two power units 70 is coupled to the first end X 1 of the other.
  • Each power unit 70 is configured to include M power converters 701, each of which includes a third end X 3 and a fourth end X 4 , each of which is coupled to a fourth end X 4 o a third terminal 701 of power converter X 3. That is, the fourth end X 4 of one of the adjacent two power converters 701 is connected to the third end X 3 of the other. M is a natural number greater than one. Thus, the third end X 3 of the first power converter 701 is the first end X 1 of the power unit 70, and the fourth end X 4 of the Mth power converter 701 is the second end of the power unit 70. X 2.
  • Each power converter 701 is configured to operate according to a local control signal output by a corresponding local controller 91, wherein a power semiconductor switch of the same position in at least two of the M power converters is controlled to be simultaneously turned on
  • the local control signals that are disconnected at the same time are the same.
  • the local control signals corresponding to the partial power converters are shared, and the local control signals corresponding to the other power converters are independent, that is, in the power converter sharing the local control signals, the same
  • the local control signal controls the power semiconductor switches in the same position to be turned on and off at the same time.
  • the local control signals corresponding to the M power converters are all shared, and the same local control signal controls the power semiconductor switches of the same position in the M power converters to be simultaneously turned on and off at the same time.
  • the aforementioned main control signal can be transmitted between the main controller 90 and each of the local controllers 91 via an optical isolation device, such as an optical fiber 94.
  • an optical isolation device such as an optical fiber 94.
  • the main controller 90 and each local controller 91 can be connected by a magnetic isolation device, such as an isolation transformer, and the connection between the main controller 90 and each local controller 91 is not only Limited to the above connection method.
  • the modular power supply system of the present invention can be applied to fields such as SVG, MVD, HVDC-Light, and wind power generation systems.
  • the present invention proposes to synthesize M power converters 701 into one power unit 70.
  • One power unit 70 is provided with a local controller 91, an optical fiber 94 and an auxiliary power source 93, that is, a set of local controllers 91.
  • the fiber 94 and the auxiliary power source 93 control the M power converters 701.
  • each power unit 40 that is, the power converter, needs to be configured with a local controller 51, an optical fiber 54, and an auxiliary power supply 53.
  • the number of local controller 91, optical fiber 94 and auxiliary power supply 93 required for the modular power supply system proposed by the present invention will be reduced to 1/M of the conventional solution.
  • the invention greatly simplifies the structural design of the modular power supply system, and the cost is also significantly reduced, and the reliability is greatly improved.
  • the present invention does not limit the topology used in each power converter 701.
  • the M power converters 701 in the modular power system of the present invention may be in an AC/DC converter, a DC/AC converter, and a DC/DC converter. Any of these, so power converter 701 in Figure 6 represents any of the applicable AC/DC, DC/AC, and DC/DC topologies.
  • the present invention does not limit the topology used in the M power converters 701.
  • the topology of the M power converters may be all the same or partially identical.
  • the topology of the M power converters 701 in each power unit 70 of the modular power supply system of the present invention may all be a full bridge converter, a half bridge converter, and a neutral point controllable three level converter.
  • the topology of the M power converters 701 in each power unit 70 in the modular power system of the present invention may be a full bridge converter, a half bridge converter, a neutral point controllable three level converter A combination of two or more of a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.
  • each power unit 70 in the modular power supply system of the present embodiment may include: M drive circuits 702, one-to-one corresponding to M power converters 701, wherein each of the drive circuits 702 is configured For connecting to the power semiconductor switch in the corresponding power converter 701, receiving and according to at least one local control signal output by the corresponding local controller 91, outputting at least one driving signal to drive the corresponding M power converters 701 Turning on and off the power semiconductor switch.
  • each power unit in the modular power system can include: a plurality of drive circuits, the number of the plurality of drive circuits being equal to the number of power semiconductor switches in the power unit, each drive circuit being configured to be coupled to A corresponding power semiconductor switch receives and outputs a driving signal to drive the corresponding power semiconductor switch on and off according to the corresponding local control signal.
  • each power unit 70 in the modular power supply system of the present embodiment may include: M drive circuits 702, one-to-one corresponding to M power converters 701, wherein each of the drive circuits 702 is configured
  • the local control signal outputted by the corresponding local controller 91 is received to output at least one driving signal to drive the power semiconductor switch in the corresponding M power converters 701. Turn on and off.
  • the local control signals corresponding to the first power converter 701 and the second power converter 701 in the power unit 70 are common, that is, the same position in the two power converters 701 is controlled.
  • the local control signals that are simultaneously turned on and off simultaneously by the power semiconductor switch are the same; and the local control signals corresponding to the third power converter 701 are independent, that is, they are identical to the first power converter 701.
  • the local control signal of the second power converter 701 is not the same. In other words, the third power converter 701 is independently controlled and the first power converter 701 and the second power converter 701 are jointly controlled.
  • the local control signals corresponding to the first power converter 701, the second power converter 701, and the third power converter 701 are common, that is, the three power converters 701 are Jointly controlled. It should be noted that there are M power converters in the power unit 70, and here are three, but not limited to three.
  • the power converter 701 employing the same topology may employ a "common drive.”
  • shared drive is meant that the power semiconductor switches at the same location of each converter 701 of the same topology can be controlled using the same local control signal.
  • standard position is meant the position of the logically corresponding power semiconductor switch in each power converter 701 of the same topology in the circuit diagram.
  • the power semiconductor switches Q 11 , Q 21 ... Q M1 in the respective power converters 701 of the same topology in FIGS. 7 to 15 have the same position, and Q 12 , Q 22 ... Q M2 have the same
  • the positions Q 18 , Q 28 ... Q M8 have the same position, so the M power converters 701 in each of the power units 70 in the following FIGS. 7 to 15 can adopt the "common drive".
  • the number of local control signals can be greatly reduced, and the circuit design of the local control can be simplified.
  • 7 to FIG. 15 further describe the driving mode of the "common drive” of the present invention, that is, the local control signals corresponding to the power converter 701 are the same, that is, the M power converters 701 are jointly controlled, specifically, The local control signals corresponding to the power semiconductor switches at the same position in the M power converters 701 are the same.
  • FIG. 6 The related contents of the main controller 90, the local controller 91, the optical fiber 94, and the auxiliary power source 93 have been described in FIG. 6, and are not described herein again.
  • Figures 7-15 depict only the local control signals corresponding to the M power converters in a power unit 70 and the corresponding drive circuits.
  • FIG. 7 is a block diagram of a modular power system in accordance with another embodiment of the present invention.
  • the topology of each power converter 701 of the same power unit 70 is a full bridge converter, such as an H bridge circuit.
  • the H-bridge circuit includes two bridge arms.
  • one bridge arm of the M-th H-bridge circuit includes an upper power semiconductor switch Q M1 and a lower power semiconductor switch Q M2 , and the other bridge arm
  • the upper power semiconductor switch Q M3 and the lower power semiconductor switch Q M4 are included .
  • the connection point of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 is the third output terminal X 3 of the Mth power converter 401.
  • the connection point of the upper power semiconductor switch Q M3 and the lower power semiconductor switch Q M4 is the fourth output terminal X 4 of the Mth power converter 401.
  • the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one.
  • the third output terminal X 3 of the first H-bridge circuit is the first terminal X 1 of the power unit 70, and the fourth output terminal X 4 of the first H-bridge circuit and the second H-bridge circuit
  • the three output terminals X 3 are connected in turn, and the fourth output terminal X 4 of the M-1th H-bridge circuit is connected to the third output terminal X 3 of the M-th H-bridge circuit, and the M-th H-bridge circuit is connected.
  • the four output terminal X 4 is the second terminal X 2 of the power unit 70.
  • the local controller 91 outputs four local control signals.
  • Each H-bridge circuit corresponds to a drive circuit 702.
  • Each of the driving circuits 702 is coupled to the local controller 91, and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the above four local control signals output by the local controller 91, and is localized.
  • the control signals are processed to produce respective four drive signals.
  • the generated four drive signals Y M1 , Y M2 , Y M3 , and Y M4 are output to the control terminals of the upper power semiconductor switches Q M1 and Q M3 and the lower power semiconductor switches Q M2 and Q M4 in the Mth H-bridge circuit, It is used to drive the on and off of the upper power semiconductor switches Q M1 and Q M3 and the lower power semiconductor switches Q M2 and Q M4 .
  • the local control signals corresponding to the power semiconductor switches of the same position of each H-bridge circuit are the same, that is, the local control signals are the same, for example, the upper power semiconductor switch Q 11 of the first H-bridge circuit, The upper power semiconductor switch Q 21 of the second H-bridge circuit, and so on, until the local control signal corresponding to the upper power semiconductor switch Q M1 of the M-th H-bridge circuit is the same, that is, the same local control signal, that is, the output of the driving circuit 702
  • the corresponding drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off.
  • each power converter 701 in the power unit 70 in this embodiment uses an H-bridge circuit, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of the respective H-bridge circuits use the same local control signal, so that only one local control signal is required in one power unit 70.
  • FIG. 8 is a block diagram of a modular power system in accordance with another embodiment of the present invention.
  • the topology of each of the power converters 701 in the same power unit 70 is a half bridge converter.
  • the half-bridge converter includes one bridge arm 111.
  • the bridge arm 111 of the M-th half-bridge circuit includes an upper power semiconductor switch Q M1 and a lower power semiconductor switch Q M2 .
  • a connection point of one end of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 is a third output terminal X 3 of the Mth power converter 701.
  • the other end of the lower power semiconductor switch Q M2 is the fourth output terminal X 4 of the Mth power converter 701.
  • the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one.
  • the third output terminal X 3 of the first half bridge converter is the first end X 1 of the power unit 70, and the fourth output terminal X 4 and the second half bridge of the first half bridge converter are transformed.
  • the third output terminal X 3 of the device is connected and connected in turn, and the fourth output terminal X 4 of the M-1 half bridge converter is connected with the third output terminal X 3 of the Mth half bridge converter, the Mth the fourth output X 4 is a half-bridge converter power unit 70 of the second end of X 2.
  • the local controller 91 outputs two local control signals.
  • Each half bridge converter corresponds to a drive circuit 702.
  • Each of the driving circuits 702 is coupled to the local controller 91 and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the two local control signals output by the local controller 91 and local
  • the control signals are processed to produce respective two drive signals.
  • the generated two drive signals Y M1 and Y M2 are output to the control terminals of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 in the Mth half-bridge converter for driving the upper power semiconductor switch Q M1 and the lower
  • the power semiconductor switch Q M2 is turned on and off.
  • the local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, for example, the upper power semiconductor switch Q of the first half-bridge converter. 11.
  • the drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off.
  • each power converter 701 in the power unit 70 in this embodiment uses a half bridge converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.
  • the neutral point controllable three-level converter includes a first bridge arm 111a and a second bridge arm 111b.
  • the first bridge arm 111a and the second bridge arm 111b each include an upper power semiconductor switch (such as Q 11 , Q 15 ) and a lower power semiconductor switch (such as Q 12 , Q 16 ).
  • the neutral point controllable three-level converter further includes a first DC bus capacitor C 1 , a second DC bus capacitor C 2 , a first switch group (such as Q 13 , Q 14 ) and a second switch group (such as Q 17) , Q 18 ).
  • the first DC bus capacitor C 1 and the second DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b.
  • the connection point of the upper power semiconductor switch Q 11 and the lower power semiconductor switch Q 12 of the first bridge arm 111a is the third output terminal X 3 of the first power converter 701.
  • the connection point of the upper power semiconductor switch Q 15 and the lower power semiconductor switch Q 16 of the second bridge arm 111b is the fourth output terminal X 4 of the first power converter 701.
  • the first switch group (such as Q 13 , Q 14 ) is connected to the connection point of the upper power semiconductor switch Q 11 and the lower power semiconductor switch Q 12 of the first bridge arm 111a with the first DC bus capacitor C 1 and the second DC bus Capacitor C 2 is connected between the points.
  • the second switch group (such as Q 17 , Q 18 ) is connected to the connection point of the upper power semiconductor switch Q 15 and the lower power semiconductor switch Q 16 of the second bridge arm 111b with the first DC bus capacitor C 1 and the second DC bus Capacitor C 2 is connected between the points.
  • the first switch group is formed by connecting two power semiconductor switches in series.
  • the two power semiconductor switches may be bidirectional controllable switches.
  • the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one.
  • the third output terminal X 3 of the first neutral point controllable three-level converter is the first end X 1 of the power unit 70, and the first neutral point controllable three-level converter
  • the four output terminals X 4 are connected to the third output terminal X 3 of the second neutral point controllable three-level converter, and are sequentially connected, and the fourth M-1 neutral point controllable three-level converter
  • the output terminal X 4 is connected to the third output terminal X 3 of the Mth neutral point controllable three-level converter, and the fourth output terminal X 4 of the Mth neutral point controllable three-level converter is a power unit
  • the second end of 70 is X 2 .
  • the local controller 91 outputs eight local control signals, each of which is used to control a corresponding upper power semiconductor switch (such as Q 11 , Q 15 ) and a lower power semiconductor switch (such as Q 12 , Q). 16 ), one of the first switch group (such as Q 13 , Q 14 ) and the second switch group (such as Q 17 , Q 18 ).
  • the local control signals corresponding to the power semiconductor switches of the same position of each neutral point controllable three-level converter are the same, that is, the local control signals are the same, and the neutral point controllable three-level converter in the power unit
  • the first power semiconductor switch of the first neutral point controllable three-level converter, the first power semiconductor switch Q 11 of the first neutral point controllable three-level converter, and the first power semiconductor switch of the second neutral point controllable three-level converter Q 21 and so on until the first power semiconductor switch Q M1 of the Mth neutral point controllable three-level converter corresponds to the same local control signal, that is, the local control signal is the same, that is, the corresponding drive of the drive circuit output
  • each power converter 701 in the power unit 70 in this embodiment uses a neutral point controllable three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of each neutral point controllable three-level converter in this embodiment use the same local control signal, so that one power unit 70 requires only a total of eight local control signals.
  • FIG. 10 is a block diagram of a modular power system in accordance with another embodiment of the present invention.
  • the topology of each of the power cells 70 in the same power unit 70 is a diode clamped three-level converter.
  • the diode clamped three-level converter includes a first bridge arm 111a and a second bridge arm 111b.
  • the first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (such as Q 11 , Q 15 ), a second power semiconductor switch (such as Q 12 , Q 16 ), and a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ).
  • the diode clamped three-level converter further includes a first DC bus capacitor C 1 , a second DC bus capacitor C 2 , a first diode D 1 , a second diode D 2 , and a third diode D 3 And a fourth diode D 4 .
  • the first DC bus capacitor C 1 and the second DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b.
  • the first power semiconductor switch Q 11 , the second power semiconductor switch Q 12 , the third power semiconductor switch Q 13 and the fourth power semiconductor switch Q 14 of the first bridge arm 111 a are connected in series.
  • the connection point of the second power semiconductor switch Q 12 and the third power semiconductor switch Q 13 is the third output terminal X 3 of the power converter 401.
  • the first power semiconductor switch Q 15 , the second power semiconductor switch Q 16 , the third power semiconductor switch Q 17 and the fourth power semiconductor switch Q 18 of the second bridge arm 111b are connected in series.
  • the junction point of the second power semiconductor switch Q 16 and the third power semiconductor switch Q 17 is the fourth output terminal X 4 of the power converter 401.
  • the first diode D 1 and the second diode D 2 are connected in series and connected to the connection point of the first power semiconductor switch Q 11 and the second power semiconductor switch Q 12 of the first bridge arm 111a and the third power semiconductor switch Q and the fourth power semiconductor switch 13 between the connection point Q 14.
  • the third diode D 3 and the fourth diode D 4 are connected in series and connected to the connection point of the first power semiconductor switch Q 16 and the second power semiconductor switch Q 17 of the second bridge arm 111b and the third power semiconductor switch Q and the fourth power semiconductor switch 17 between the connection point Q 18.
  • a connection point of the first diode D 1 and the second diode D 2 is connected to a connection point of the first DC bus capacitor C 1 and the second DC bus capacitor C 2 .
  • the junction of the third diode D 3 and the fourth diode D 4 is also connected to the junction of the first DC bus capacitor C 1 and the second DC bus capacitor C 2 .
  • the first diode D 1 and the second diode D 2 function as clamping diodes, a first power semiconductor switch, a second power semiconductor switch, a third power semiconductor switch, and a fourth power semiconductor.
  • the switch is an IGBT or an IGCT.
  • the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one.
  • the third output terminal X 3 of the first diode clamped three-level converter is the first terminal X 1 of the power unit 70
  • the fourth output terminal X of the first diode clamped three-level converter 4 is connected to the third output terminal X 3 of the second diode clamped three-level converter, and sequentially connected, the fourth output terminal X 4 and the Mth of the M-1th diode clamped three-level converter
  • the third output terminal X 3 of the diode clamped three-level converter is connected
  • the fourth output terminal X 4 of the Mth diode clamped three-level converter is the second terminal X 2 of the power unit 70.
  • the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q 11 , Q 15 ) and a second power semiconductor switch (such as Q 12). , Q 16 ), one of a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ).
  • the local control signal corresponding to the power semiconductor switch of the same position of each diode clamped three-level converter is the same, for example, the first power semiconductor switch of the diode clamped three-level converter in the power unit is taken as an example, the first a first power semiconductor switch Q 11 of a diode clamped three-level converter, a first power semiconductor switch Q 21 of a second diode clamped three-level converter, and so on until the Mth diode clamps three levels
  • the local control signals corresponding to the first power semiconductor switch Q M1 of the converter are the same, that is, the local control signals are the same, that is, the driving circuit outputs the corresponding driving signals Y 11 , Y 21 ...
  • each of the power converters 701 in the power unit 70 in this embodiment employs a diode clamped three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of the diode clamped three-level converters use the same local control signal, so that only one local control signal is required for one power unit.
  • the topology of each of the power converters 701 in the same power unit 70 is a flying capacitor three-level converter.
  • the flying capacitor three-level converter includes a first bridge arm 111a and a second bridge arm 111b.
  • the first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (Q 11 , Q 15 ), a second power semiconductor switch (Q 12 , Q 16 ), and a third power semiconductor switch (Q 13 , Q 17 ) And a fourth power semiconductor switch (Q 14 , Q 18 ).
  • Flying capacitor three-level converter further comprises a first DC bus capacitor C 1, a first DC bus capacitor C 2, the first capacitor and the second capacitor C 3 C 4.
  • the first DC bus capacitor C 1 and the first DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b.
  • the first power semiconductor switch Q 11 , the second power semiconductor switch Q 12 , the third power semiconductor switch Q 13 and the fourth power semiconductor switch Q 14 of the first bridge arm 111 a are connected in series.
  • the connection point of the second power semiconductor switch Q 12 and the third power semiconductor switch Q 13 is the third output terminal X 3 of the power converter 401.
  • the first power semiconductor switch Q 15 , the second power semiconductor switch Q 16 , the third power semiconductor switch Q 17 and the fourth power semiconductor switch Q 18 of the second bridge arm 111b are connected in series.
  • the junction point of the second power semiconductor switch Q 16 and the third power semiconductor switch Q 17 is the fourth output terminal X 4 of the power converter 401.
  • the first capacitor C 3 is connected to the connection point of the first power semiconductor switch Q 11 and the second power semiconductor switch Q 12 of the first bridge arm 111a and the third power semiconductor switch Q 13 and the fourth power semiconductor of the first bridge arm 111a Q switch 14 between the connection point.
  • the second capacitor C 4 is connected to the connection point of the first power semiconductor switch Q 15 and the second power semiconductor switch Q 16 of the second bridge arm 111b and the third power semiconductor switch Q 17 and the fourth power semiconductor of the second bridge arm 111b Between the connection points of switch Q 18 .
  • the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one.
  • the third output terminal X 3 of the first flying capacitor three-level converter is the first end X 1 of the power unit 70
  • the fourth output terminal X of the first flying capacitor three-level converter 4 is connected to the third output terminal X 3 of the second flying capacitor three-level converter, and sequentially connected, the fourth output terminal X 4 and the Mth of the M-1 flying capacitor three-level converter
  • the third output terminal X 3 of the flying capacitor three-level converter is connected, and the fourth output terminal X 4 of the Mth flying capacitor three-level converter is the second terminal X 2 of the power unit 70.
  • the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q 11 , Q 15 ) and a second power semiconductor switch (such as Q 12). , Q 16 ), one of a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ).
  • the local control signal corresponding to the power semiconductor switch of the same position of each flying capacitor three-level converter is the same, for example, the first power semiconductor switch of the flying capacitor three-level converter in the power unit is taken as an example, the first a first power semiconductor switch Q 11 of a flying capacitor three-level converter, a first power semiconductor switch Q 21 of a second flying capacitor three-level converter, and so on until a third level of the Mth flying capacitor
  • the local control signal corresponding to the first power semiconductor switch Q M1 of the converter is the same, that is, the driving circuit outputs corresponding driving signals Y 11 , Y 21 ... Y M1 are the same, so that the first power semiconductor switches Q 11 , Q 21 Until Q M1 is turned on and off at the same time.
  • each power converter 701 in the power unit 70 in this embodiment employs a flying capacitor three-level converter, one power unit 70 requires only one local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of each of the flying capacitor three-level converters use the same local control signal, so that only one local control signal is required for one power unit.
  • FIG. 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • the topology of each of the power converters 701 in the same power unit 70 is a full bridge resonant converter.
  • the full bridge resonant converter 701 includes a full bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG.
  • the full-bridge circuit includes four power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q 11 is connected to one end of the DC bus capacitor C B ' and the power semiconductor switch Q.
  • One end 13 of the power semiconductor switch and the other end Q 11 is connected to the power semiconductor switch end Q 12 of the power semiconductor switch and the other end Q 12 is connected to the DC bus capacitor C B 'and the other end of the power semiconductor switch and the other end Q 14 of
  • the connection point of the power semiconductor switch Q 11 and the power semiconductor switch Q 12 is connected to one end of the resonant circuit formed by the capacitor C' and the inductor L', and the other end of the resonant circuit is connected to one end of the primary coil of the transformer T', and the transformer T
  • the other end of the primary coil is connected to the connection point of the power semiconductor switch Q 13 and the power semiconductor switch Q 14
  • one end of the DC bus capacitor C B ' is the third end of the first power converter X 3
  • the other end of C B ' is the fourth end X 4 of the first power converter
  • the rectifier bridge includes four rectifier diodes, and one end of the rectifier diode D 1 ' is connected to the rectifier dio
  • each of the power unit 70 of a third terminal of the full bridge resonant converter power unit X 3 is a first end 70 of the X 1
  • a first full-bridge resonant converter fourth terminal X 4 is connected to the third end X 3 of the second full-bridge resonant converter
  • the fourth end X 4 of the M-1 full-bridge resonant converter is connected to the third end X of the M-th full-bridge resonant converter 3.
  • the fourth end X 4 of the Mth full bridge resonant converter is the second end X 2 of the power unit 70.
  • the fifth end X 5 of each of the full bridge resonant converters in each of the power units 70 is connected together, and the sixth end X 6 is connected together.
  • the local control signals corresponding to the power semiconductor switches of the same position of the full bridge circuit in each full bridge resonant converter are the same, that is, the local control signals are the same, for example, the power of the first full bridge circuit.
  • the circuit outputs corresponding drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off.
  • each power converter 701 in the power unit 70 in this embodiment uses a full bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of the full bridge resonant converters use the same local control signal, so that only one local control signal is required in one power unit 70.
  • FIG. 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • the topology of each of the power converters 701 in the same power unit 70 is a half bridge resonant converter.
  • the half bridge resonant converter 701 includes a half bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first half-bridge resonant converter 701 as an example, the half-bridge circuit includes two power semiconductor switches and one DC bus capacitor.
  • One end of the power semiconductor switch Q 11 is connected to one end of the DC bus capacitor C B ', and the power semiconductor switch Q the other end 11 is connected to the power semiconductor switch end Q 12, the power semiconductor switch other ends Q 12 is connected to the DC bus capacitor C B ', the power semiconductor switch Q 11 of the power semiconductor switch Q is connected to the point 12 is connected to the 'One end of the primary coil of the transformer T''L and the inductance' end of the resonance circuit composed of the other end of the resonance circuit of the capacitor C is connected to the transformer T, the other end of the primary coil is connected to the power semiconductor switch of another Q 12 of At one end, one end of the DC bus capacitor C B ' is the third end X 3 of the first power converter, and the other end of the DC bus capacitor C B ' is the fourth end X 4 of the first power converter, and the rectifier bridge includes four rectifying diodes, the rectifying diode D 1 'is connected to one end of the rectifying diode D 3' end, a rectifying diode D 1
  • the third end X 3 of the first half-bridge resonant converter in each power unit 70 is the first end X 1 of the power unit 70, and the fourth end X of the first half-bridge resonant converter 4 half-bridge resonant converter connected to the second terminal of the third X 3, and so on, the fourth terminal 4 is connected to the M-X half-bridge resonant converter of a third terminal of the first X M-1 half-bridge resonant converter 3.
  • the fourth end X 4 of the Mth half-bridge resonant converter is the second end X 2 of the power unit 70.
  • the fifth ends X 5 of all of the half-bridge resonant converters in each power unit 70 are connected together, and the sixth ends X 6 are connected together.
  • the power semiconductor switches of the same position of the half bridge circuit in each half-bridge resonant converter have the same local control signal, that is, the local control signals are the same, for example, the power of the first half bridge circuit.
  • the signals Y 11 , Y 21 ... Y M1 are identical, such that the power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and off at the same time.
  • each power converter 701 in the power unit 70 in this embodiment uses a half bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93.
  • the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.
  • FIG. 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • the topology of the M power converters 701 in the same power unit 70 employs a combination of a full bridge converter and a half bridge converter.
  • the power converter 7011' of the full bridge converter includes four power semiconductor switches, and the half bridge converter 7012' includes two power semiconductor switches.
  • the specific connection relationship of the full-bridge converter is as shown in FIG. 7
  • the specific connection relationship of the half-bridge converter is shown in FIG. 8 , and details are not described herein again.
  • the two adjacent power converter wherein a fourth end X 3 X 4 of the third terminal 701 is connected with another, wherein M is a natural number greater than 1.
  • the third end X 3 of the first power converter 701 is the first end X 1 of the power unit 70, and the fourth end X 4 of the first power converter 701 is connected to the second power converter 701.
  • the third end X 3 , and so on, the fourth end X 4 of the M-1th power converter 701 is connected to the third end X 3 of the Mth power converter 701, and the fourth end of the Mth power converter 701 X 4 is the second end X 2 of the power unit 70.
  • the local control signals corresponding to the power semiconductor switches of the same position of each full-bridge converter are the same, that is, the same local control signal, and the driving circuit outputs the corresponding driving signals, so that the power semiconductors of the same position are obtained.
  • the switch is turned on and off at the same time.
  • the local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, and the corresponding driving signals are output by the driving circuit, so that the power semiconductor switches of the same position are simultaneously turned on and simultaneously disconnect.
  • one power unit 70 requires only one local controller 91, fiber 94, and auxiliary power source 93.
  • the power semiconductor switches at the same position of the respective full-bridge converters use the same local control signal
  • the power semiconductor switches at the same position of the respective half-bridge converters use the same local control signal, so that only one power unit 70 6 local control signals are required.
  • the topology of the M power converters 701 of each power unit 70 in the modular power system uses both a full bridge converter, a half bridge converter, a neutral point controllable three level converter, and a diode.
  • the local control signals corresponding to the power semiconductor switches of the same position in the same power structure of the M power converters 701 are the same, and the corresponding driving signals are output by the driving circuit, so that the power semiconductor switches of the same position are simultaneously turned on and simultaneously disconnected. .
  • each power unit 70 in the modular power supply system of the present embodiment may include: a plurality of driving circuits 702, the number of driving circuits in the power unit being equal to the power semiconductor switches in the power unit A quantity, wherein each of the driving circuits 702 is configured to be connected to a power semiconductor switch of the corresponding power converter 701, receive a local control signal output by the corresponding local controller 91, to output a driving signal to drive the corresponding power semiconductor switch Pass and disconnect.
  • FIG. 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • the M power converters 701 in the same power unit 70 are all neutral point controllable three-level converters.
  • the power unit 70 may include 8 ⁇ M drive circuits, each of which is configured to be connected to the power semiconductor switches Q 11 , Q 12 ... Q 18 ... Q M1 , Q M2 of the power converter 701..
  • each driving circuit receives a corresponding local control signal output by the local controller 91 to output driving signals Y 11 , Y 12 ... Y 18 ... Y M1 , Y M2 ..
  • a corresponding one of .Y M8 drives the turn-on and turn-off of the corresponding power semiconductor switch.
  • each driving circuit includes a corresponding local control signal output by the local controller 91 to output a driving signal to drive the corresponding power semiconductor switch to be turned on and off.
  • Each of the drive circuits 702 of the modular power supply system of the present invention can be directly electrically connected to the corresponding local controller 91, or connected by magnetic isolation devices, or connected by optical isolation devices.
  • Figure 16 is a diagram showing the manner of connection between the local controller and the drive circuit of the present invention.
  • the drive circuit 72 (702) is coupled to the local controller 91 via a magnetic isolation device T to transmit local control signals.
  • the use of magnetic isolation devices has the advantages of high reliability, high performance, and low power consumption.
  • the driver circuit 72 (702) and the local controller 91 can also be connected by an optical isolation device.
  • the optical isolation device has the advantages of one-way signal transmission, complete electrical isolation between the input end and the output end, no influence of the output signal on the input end, strong anti-interference ability, stable operation, no contact, long service life and high transmission efficiency.
  • drive circuit 72 (702) is directly electrically coupled to local controller 91.
  • Each of the drive circuits 72 (702) in the modular power supply system of the present invention may be identical to each other or different from each other.
  • each of the drive circuits 702 in the modular power supply system of the present embodiment is identical to each other.
  • FIG. 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 17, a power unit 701 of five H-bridge circuits is included in one power unit in the modular power supply system of the present embodiment. The drive circuit 721 of the four power converters 701 is different from the drive circuit 722 of the intermediate power converter 701.
  • Fig. 18 is a schematic view showing the driving mode of the driving circuit of the present invention.
  • the driving circuit 722 includes a primary circuit 7221, circuit 7222, and the secondary magnetic separator means T 1 18, the primary circuit 7221 receives the signal output from the local controller local control 91, wherein the control signal includes only the local drive The component, the local control signal is a weak signal.
  • the primary side circuit 7221 modulates the local control signal into a high-low level narrow pulse signal, wherein the high and low level narrow pulse signals include a driving logic pulse, and the narrow pulse signal is transmitted via a magnetic isolation device (for example, a high frequency isolation transformer) T 1 .
  • a magnetic isolation device for example, a high frequency isolation transformer
  • the secondary circuit 7222 restores the high and low voltage narrow pulse signals to a PWM signal and is amplified to output a driving signal to drive the on and off of the power semiconductor switch Q, wherein the narrow pulse signal only includes the driving logic pulse , for example, a PWM signal.
  • the power unit 70 further includes a power supply circuit 7223 for supplying power to the primary side circuit 7221 and the secondary side circuit 7222.
  • the power received by the power circuit 7223 may be from the auxiliary source 93, or other external power source, and the power circuit 7223 converts the received power into a voltage V 1 that supplies power to the primary circuit 7221 and a voltage V 2 that supplies power to the secondary side 7222, and The voltages V 1 and V 2 are isolated from each other.
  • the power supply circuit 7223 further includes a primary power supply circuit (not shown), an isolation transformer (not shown), and a secondary power supply circuit (not shown) that converts the received power supply into
  • the primary side power supply supplies the primary side circuit 7221 with direct current V 1
  • the primary side power supply circuit converts the received power supply into a power pulse, that is, the power supply pulse is transmitted to the secondary side power supply circuit through the isolation transformer, and then the power pulse is converted by the secondary side power supply circuit.
  • the secondary side circuit 7222 is supplied with a direct current V 2 for the secondary side power supply.
  • the driving mode of each power converter can adopt "simple driving".
  • Fig. 19 is a schematic view showing another driving mode of the driving circuit of the present invention.
  • each of the drive circuits 721 of the modular power supply system of the present embodiment includes a primary side circuit 7211, a secondary side circuit 7212, and a magnetic isolation device (for example, an isolation transformer) T 2 .
  • a magnetic isolation device for example, an isolation transformer
  • the primary side circuit 7211 receives a local control signal, wherein the local control signal includes a driving component and a power component, the local control signal is a strong signal, and the primary side circuit 7211 modulates the local control signal into a positive and negative narrow pulse signal Y MN , via magnetic isolation
  • the device T 2 is transmitted to the secondary circuit 7212, which demodulates the narrow pulse signal Y MN into a drive signal to drive the on and off of the power semiconductor switch Q, wherein the positive and negative narrow pulse signal Y MN includes drive logic Pulses and power pulses, the power semiconductor switch Q comprises, for example, a gate G, a collector C and an emitter E, the drive signal being output to the gate G of the power semiconductor switch.
  • This "simple driving" eliminates a large number of power supply circuits, so that the device of the driving circuit 721 is reduced a lot, the structure of the entire driving circuit 721 is simplified, and power consumption is reduced. Small, reliability has been improved.
  • Figure 20 is a circuit diagram of a driving circuit of one embodiment of the present invention.
  • Figure 20 is based on Figure 19 and is an embodiment of the secondary side circuit of the drive circuit of Figure 19.
  • Figure 21 is a timing chart of a driving circuit of one embodiment of the present invention.
  • the driving circuit of the present invention mainly comprises a magnetic isolation device T 2 and a bidirectional voltage regulator W, and other resistors R 11 , R 12 , R 13 , R, R 21 , R 22 , R 23 , gate
  • the pole capacitance C GE , the diodes D 11 , D 21 , the Zener diodes W 1 , W 2 and the switching tubes M 1 and M 2 are auxiliary elements, the connection relationship of which is as shown in FIG.
  • the local control signal PWM sent by the local controller 91 is modulated by the primary side circuit to form a positive and negative pulse signal Y MN , as shown by Y NM in FIG. 21 .
  • the positive and negative pulse signals Y NM are transmitted to the secondary circuit via a magnetic isolation device (for example, an isolation transformer) T 2 , and the switching transistors M 1 and M 2 are activated to charge and discharge the IGBT gate capacitance C GE to form a driving power semiconductor switch.
  • the waveforms of the required drive signals V GE , V GE are substantially similar to the local control signals PWM, as shown in FIG.
  • the width of the refresh pulse of the positive and negative pulse signals Y NM may be only a few ⁇ s .
  • the positive pulse of several ⁇ s charges the gate capacitor C GE once, so that the driving signal V GE can reach the gate of the power semiconductor switch. Turn on the voltage, for example +15V.
  • the positive pulse required may be several tens of ⁇ s to hundreds of ⁇ s or even longer.
  • the gate capacitance C GE will slowly discharge and the driving signal V GE will gradually decrease.
  • the gate turn-on voltage required for the normal turn-on of the power semiconductor switch is not reached, so the refresh pulse is required to charge the gate capacitance C GE at intervals to maintain the drive signal V GE at the normal gate turn-on voltage.
  • the refresh pulse interval it is mainly determined by the discharge time constant of the gate capacitance C GE .
  • the principle is that the V GE does not drop too much before the next refresh pulse. For example, the drive signal V GE cannot be low before the next refresh pulse arrives. At 14V.
  • the local control signal received by the driving circuit of FIG. 20 includes a driving logic pulse and a power pulse, so that the driving circuit does not need an external power supply, and does not need to amplify the local control signal, which saves a lot of relative to the driving circuit of FIG.
  • the power supply circuit reduces the number of devices of the driving circuit 721, the structure of the entire driving circuit 721 is simplified, the power consumption is reduced, and the reliability is improved.
  • each of the driving circuits 702 may employ the driving circuit described in FIG. 19, and the local control signals transmitted by the magnetic isolation device include driving logic pulses and power pulses.
  • each of the drive circuits 702 can employ the drive circuit depicted in FIG. 18, and the magnetic isolation device transmits drive logic pulses contained in the local control signals.
  • a drive circuit part of the driving circuit 702 described in FIG. 19 may be employed, and the power drive logic pulse magnetically isolated pulse T 2 is transferred to local control device included in the signal ; and another part of the driver circuit of the driving circuit 702 described in FIG. 18, magnetic isolation local transmission device T 1 controls the drive pulse signal included in the logic.
  • the driving circuit 721 can employ the driving circuit described in FIG. 19, the magnetic isolation device transmits the driving logic pulse and the power pulse included in the local control signal; and the driving circuit 722 adopts The drive circuit depicted in Figure 18, the magnetic isolation device transmits drive logic pulses contained in the local control signal.
  • the driving circuit 722 can adopt the driving circuit described in FIG. 19, the magnetic isolation device transmits the driving logic pulse and the power pulse included in the local control signal; and the driving circuit 721 adopts The drive circuit depicted in Figure 18, the magnetic isolation device transmits drive logic pulses contained in the local control signal.
  • FIG. 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • one of the M power converters 701 in each power unit 70 in the modular power supply system of the present embodiment is a main power converter 7012, and the remaining M-1 are slave power converters. 7011, wherein the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-15 may be used, or the main power converter 7012 and the slave power converter 7011.
  • the topology is different.
  • the main power converter can adopt one of the power converters described in FIG. 7 to FIG. 15.
  • the power converter can adopt another of the power converters described in FIG. 7 to FIG. .
  • one of the M driving circuits is the main driving circuit 722, and the remaining M-1 are the slave driving circuit 721, and the main driving circuit 722 is configured to drive the power semiconductor switch in the corresponding main power converter 7012 to be turned on and Disconnected, each slave drive circuit 721 is configured to drive the turn-on and turn-off of the power semiconductor switches in the corresponding slave power converter 7011.
  • the main drive circuit 722 is different from the slave drive circuit 721, and the main drive circuit 722 employs the drive circuit described in FIG. 18, and the magnetic isolation device transmits only local control.
  • the main driving circuit 722 is different from the slave driving circuit 721, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulses included in the local control signal; and the main driving circuit 722 employs the drive circuit depicted in Figure 19, which transmits drive logic pulses and power pulses contained in the local control signals.
  • the main driving circuit 722 is the same as the slave driving circuit 721, and the main driving circuit 722 and the slave driving circuit 721 both adopt the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulse included in the local control signal;
  • the main drive circuit 722 and the slave drive circuit 721 both employ the drive circuit described in FIG. 19, and the magnetic isolation device transmits drive logic pulses and power pulses contained in the local control signal.
  • the slave power converters 7011 are respectively distributed to the main power converter 7012.
  • the local control signal corresponding to the main power converter 7012 is independent of the local control signal corresponding to the slave power converter 7011, that is, the main power converter 7012 is independently controlled, and the slave power converter 7011 is commonly controlled, for example, by using a common driver.
  • the local control signals corresponding to the power semiconductor switches at the same location in the power converter 7011 are the same, and the main power converter 7012 is locally controlled corresponding to the power semiconductor switches at the same location from the power converter 7011. The signals are not the same.
  • the main power converter 7012 and the slave power converter 7011 are jointly controlled, for example, using a common drive mode, the main power converter 7012 and the corresponding local power transformer switch at the same position in the power converter 7011.
  • the control signals are the same.
  • FIG. 23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • at least one of the M power converters 701 in each of the power units 70 in the modular power supply system of the present embodiment is a master power converter 7012, and at least one is a slave power converter 7011.
  • the main power converter 7012 and the slave power converter 7011 have the same topology, one of the power converters described in FIGS. 7-15, or the main power converter 7012 and the slave power converter 7011 The topology is different, and the main power converter can employ one of the power converters described in Figures 7-15, and the slave power converter can employ another of the power converters described in Figures 7-15.
  • At least one of the M driving circuits is the main driving circuit 722, and at least one is the slave driving circuit 721, and each of the main driving circuits 722 is configured to drive the power semiconductor switches in the corresponding main power converter 7012 to be turned on. And disconnected, each slave drive circuit 721 is configured to drive the turn-on and turn-off of the power semiconductor switches in the corresponding slave power converter 7011.
  • the main drive circuit 722 is different from the slave drive circuit 721, and each of the main drive circuits 722 employs the drive circuit described in FIG. The drive logic pulses included in the control signal; and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 19, the magnetic isolation device transmitting drive logic pulses and power pulses contained in the local control signals.
  • the main driving circuit 722 is different from the slave driving circuit 721, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulses included in the local control signal; and each main The drive circuit 722 employs the drive circuit depicted in FIG. 19, which transmits drive logic pulses and power pulses contained in the local control signals.
  • the main driving circuit 722 is the same as the slave driving circuit 721, and each of the main driving circuit 722 and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the local control signal.
  • the logic pulses are driven; or each of the main drive circuit 722 and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 19, the magnetic isolation device transmitting drive logic pulses and power pulses contained in the local control signals.
  • each of the main driving circuits 722 is identical to each of the slave driving circuits 721, and each of the main power converters 7012 and each of the slave powers
  • the converters 7011 are controlled in common, for example, by a common drive mode, and each of the main power converters 7012 and the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same.
  • the main driving circuit 722 and the slave driving circuit 721 may be the same or different, and the local control signal corresponding to the main power converter 7012 is independent of the local control signal corresponding to the slave power converter 7011, that is, the main The power converter 7012 is independently controlled, and is controlled by the power converter 7011 in common, for example, using a common driving mode, so that the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same, the main power conversion The local control signal corresponding to the power semiconductor switch at the same location from the power converter 7011 is not the same.
  • FIG. 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • the number of the main power converter 7012 and the slave power converter 7011 is two or more.
  • Each of the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-14 can be used, and the main drive circuit 722 and the slave drive circuit 721 can be driven in the same manner.
  • the method adopts the aforementioned "simple drive", as described in the foregoing FIG. 19, that is, the magnetic isolation device of each main drive circuit 722 and each of the magnetic isolation devices from the drive circuit 721 transmit the local control signals contained therein.
  • each of the magnetic isolation devices of the main drive circuit 722 and each of the slave drive circuits 721 adopt the drive circuit described in FIG. 18, and the main magnetic isolation device and the slave magnetic isolation device both transmit local control signals.
  • each of the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-14 can be used, the main driving circuit 722 and the slave driving circuit. 721 may be different, each main driving circuit 722 adopts the driving circuit described in FIG. 18, the main magnetic isolating device transmits driving logic pulses included in the local control signal, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. Transmitting a drive logic pulse and a power pulse contained in the local control signal from the magnetic isolation device; or each of the main drive circuit 722 adopts the drive circuit described in FIG.
  • each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 18 to transfer the drive logic pulses contained in the local control signals from the magnetic isolation device.
  • the local control signals corresponding to each of the main power converters 7012 are independent of each other and independent of the corresponding power converter 7011.
  • the local control signals that is, each of the main power converters 7012 are independently controlled, each of the slave power converters 7011 adopts a common driving mode, and thus the local corresponding to the power semiconductor switches at the same position in the power converter 7011
  • the control signals are the same, and each of the main power converters 7012 and the two local control signals corresponding to the power semiconductor switches at the same position in the power converter 7011 are not the same.
  • the local control signals corresponding to each of the main power converters 7012 are the same, each corresponding to the local corresponding to the power converter 7011.
  • the control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same, that is, each main power converter 7012 adopts a common driving mode, and each slave power converter 7011
  • the common driving mode is also adopted, so that the local control signals corresponding to the power semiconductor switches at the same position in each main power converter 7012 are the same, each corresponding to the power semiconductor switch at the same position in the power converter 7011.
  • the local control signals are the same.
  • each of the main power converters 7012 and the local control signals corresponding to each of the slave power converters 7011 are the same, that is, Each of the main power converters 7012 and each of the slave power converters 7011 adopts a common driving mode, and the local power converter 7012 and the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same. .
  • the local control signals corresponding to each of the main power converters 7012 are independent of each other and are independent of the slave power converter 7011.
  • Corresponding local control signals that is, each main power converter 7012 is independently controlled, and each slave power converter 7011 adopts a common driving mode, and thus corresponds to a power semiconductor switch at the same position in the power converter 7011.
  • the local control signals are the same, and each of the main power converters 7012 and the two local control signals corresponding to the power semiconductor switches at the same position in the power converter 7011 are not the same.
  • the local control signals corresponding to each of the main power converters 7012 are the same, each corresponding to the power converter 7011.
  • the local control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same, that is, each main power converter 7012 adopts a common driving mode, and each slave power conversion
  • the controller 7011 also adopts a common driving manner, so that the local control signals corresponding to the power semiconductor switches at the same position in each main power converter 7012 are the same, each power semiconductor switch at the same position from the power converter 7011.
  • the corresponding local control signals are the same.
  • FIG. 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • Figure 25 is a further description of Figure 23, which has been described in Figure 23 and will not be described again.
  • each of the power units 70 in the modular power supply system of this embodiment may further include: a plurality of DC bus voltage clamping circuits 703, and the foregoing power converter 701 adopting a common driving mode.
  • each of the DC bus voltage clamping circuits 703 is configured to be in parallel with the DC bus capacitance of the corresponding power converter 701 such that the DC bus voltage of the corresponding power converter 701 does not exceed a preset value.
  • the present invention incorporates a DC bus voltage control link in the power converter 701 of each of the power units 70 in the modular power system.
  • the bus voltage control mode can be implemented by hardware or by software.
  • each A DC bus voltage clamp circuit 703 is connected in parallel to the DC bus capacitor of the power converter 7011.
  • each of the main power converters 7012 and each of the slave power converters 7011 employs a common drive mode, that is, each of the main power converters 7012 and each of the slave power converters 7011 are at the same position.
  • the local control signals corresponding to the power semiconductor switches are the same, and each of the main power converters 7012 and each of the DC bus capacitors of the power converter 7011 are connected in parallel with a DC bus voltage clamp circuit 703.
  • the local control signals corresponding to the power semiconductor switches at the same location in each of the main power converters 7012 are the same, each corresponding to the local power semiconductor switch at the same location in the power converter 7011.
  • the control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same.
  • Each DC power bus capacitor of the main power converter 7012 is connected in parallel with a DC bus voltage clamp circuit.
  • Each DC bus voltage clamp circuit is connected in parallel with the DC bus capacitor of the power converter 7011, which can be the same as or different from the DC bus voltage clamp circuit connected in parallel with the DC bus capacitor of the main power converter.
  • the DC bus voltage clamping circuit 703 is implemented by hardware to control the voltage across the DC bus capacitor C B not to exceed a preset value.
  • the DC bus voltage clamp circuit 703 When the DC bus voltage clamp circuit 703 is applied to the modular power supply system as shown in FIGS. 7, 8, and 12-14, the DC bus voltage clamp circuit 703 is connected to the DC bus capacitor C B of the corresponding power converter 701. between the one end and the other end, while FIG. 9-11 and FIG. 15, the DC bus voltage clamping circuit 703 is connected to the power converter 701 corresponding to an end of the DC bus capacitor C 1 and another capacitor C DC bus 2 Between one end, so that the DC bus voltage of the corresponding power converter 701 does not exceed a preset value, wherein the DC bus voltage clamping circuit 703 is implemented by hardware.
  • FIG. 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.
  • FIG. 26 is a further description of FIG. 22, which has been described in FIG. 22, and will not be described again.
  • each of the power units in the modular power supply system of this embodiment may further include: M-1 DC bus voltage clamping circuits 703, and the aforementioned M-1 slave power converters 7011.
  • M-1 DC bus voltage clamping circuits 703 is configured to be in parallel with the corresponding DC bus of the power converter 7011 such that the DC bus voltage of the corresponding slave power converter 7011 does not exceed a preset value.
  • the present invention also provides DC bus voltage control in a dynamically regulated manner.
  • the power unit 70 includes five cascaded H-bridge circuit-based power converters. It should be noted that the topology of the power converter in the power unit 70 can also be as shown in FIG. 7-15. The topology described.
  • the intermediate power converter 7012 is independently controlled. Specifically, the DC bus voltage of the power converter 7012 obtained by the detection is compared with a preset value.
  • the local controller 91 If the DC bus voltage is higher than a preset value, the local controller 91 outputs a local control signal to control the power semiconductor switch of the H-bridge circuit of the power converter 7012 to be turned on or off to discharge its DC bus capacitor C B if The DC bus voltage is lower than a preset value, and the local controller 91 outputs a local control signal to control the power semiconductor switch of the H-bridge circuit of the power converter 7012 to be turned on or off to charge its DC bus capacitor C B , thereby making The DC bus voltage is controlled within a reasonable range.
  • each power semiconductor switch controlled by the same local control signal cannot truly achieve simultaneous conduction and simultaneous disconnection, and the DC bus capacitance also has discreteness, resulting in DC bus voltages. There will be differences.
  • the voltage of each DC bus capacitor C B can be limited to a preset value, which can be guaranteed.
  • the system operates reliably and reliably.
  • FIG. 27 is a circuit diagram of a clamp circuit in accordance with one embodiment of the present invention.
  • each of the DC bus voltage clamping circuits 703 in the modular power supply system of the present embodiment includes a switch K, a resistor R, and a switch control circuit W C .
  • the switch K and the resistor R form a series branch, which is connected in parallel with the DC bus of the corresponding power converter 701.
  • the switch control circuit W C is connected to the control terminal of the switch K.
  • the switch control circuit W C When the DC bus voltage of the power converter 701 exceeds a preset value, the switch control circuit W C outputs a switch control signal to turn on the switch K such that the DC bus of the power converter 701 is discharged through the series branch.
  • the switch control circuit W C employs a transient suppression diode (TVS tube).
  • the TVS tube is connected in series with a diode D.
  • One end is connected to one end of the DC bus, and the other end is connected to the control end of the switch, wherein the diode D acts as a reverse protection.
  • the controllable switch K is turned on, so that the DC bus voltage on the DC bus capacitor C B is discharged through the resistor R connected in series with the controllable switch K. .
  • the DC bus voltage clamping circuit 703 can limit the voltage of the DC bus capacitor of the power converter 701 to a preset value, that is, below the TVS breakdown value.
  • each of the auxiliary power sources 93 in the modular power supply system of the present embodiment can be configured to take power from an external power source, and each of the auxiliary power sources 93 is connected to an external power source E C , for example, from a commercial power source or an external power source.
  • the circuit is powered, or the N auxiliary power sources 93 in the modular power system of the embodiment are in one-to-one correspondence with the N power units 70, and each of the auxiliary power sources 93 can be configured to take power from the corresponding power unit 70.
  • each of the auxiliary power sources 93 of the modular power supply system of the present embodiment may be configured to take power from the DC bus capacitor C B1 of any one of the corresponding power units 70 to obtain a DC bus capacitor C B1 .
  • the DC bus voltage on, or a portion of the auxiliary power source 93 in the modular power system of the present embodiment may be configured to draw power from an external power source, and another portion of the auxiliary power source 93 may be configured to be from any of the corresponding power units 70.
  • the DC bus capacitor C B1 of the power converter 701 is energized to obtain the DC bus voltage on the DC bus capacitor C B1 .
  • the invention can reduce the number of local controllers, optical fibers and auxiliary power sources by simplifying the structure by forming a plurality of power converters into one power unit and using a local controller, an optical fiber, and an auxiliary power source to control multiple power converters. Design, reduce costs and improve reliability.
  • the present invention simplifies the control circuit by sharing the power semiconductor switches at the same location of the power converters in the power unit with a local control signal.
  • the invention is applicable to the topology of all AC/DC, DC/AC, DC/DC power converter connections and is widely used.

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Abstract

A modular power system comprises a primary controller (90), N local controllers (91), and N power units (70). The primary controller is configured to output a primary control signal. Each local controller is configured to receive the primary control signal to output at least one local control signal. The N power units (70) correspond to the N local controllers in a one-to-one manner. Each power unit comprises a first end (X1) and a second end (X2). A second end of each power unit is connected to a first end of an adjacent power unit. Each power unit is configured to comprise M power converters (701). Each power converter is configured to operate according to the local control signal outputted by the corresponding local controller, and local control signals for controlling power semiconductor switches at the same position among at least two power converters among the M power converters to be switched on and switched off at the same time are a same local control signal. The modular power system can simplify the structure, can reduce costs and can improve reliability.

Description

模块化电源系统Modular power system 技术领域Technical field

本发明涉及电力电子技术领域,特别涉及一种模块化电源系统。The present invention relates to the field of power electronics, and in particular to a modular power system.

背景技术Background technique

目前,在一些较高电压等级(如10kV以上)应用场合,如静止无功发生器(Static Var Generator,SVG)、中压变频器(Medium Variable-frequency Drive,MVD)以及轻型高压直流输电系统(High Voltage Direct Current Transmission Light,HVDC-Light)等,由于系统电压等级较高,受半导体器件的耐压等级和成本所限,通常都采用功率单元级联的电路拓扑结构。Currently, at some higher voltage levels (such as above 10kV) applications, such as Static Var Generator (SVG), Medium Variable-frequency Drive (MVD), and Light HVDC Transmission System ( High Voltage Direct Current Transmission Light (HVDC-Light), etc., due to the high system voltage level, limited by the withstand voltage level and cost of the semiconductor device, the circuit topology of the power unit cascade is usually adopted.

传统的功率单元级联的拓扑结构需要给每一个功率单元即功率变换器配备一套光纤、辅助电源、本地控制器。这种功率单元级联的拓扑结构随着电压等级的提高,需要级联的功率单元的数量也随之增加,导致光纤、辅助电源及本地控制器的数量也随之增加,使得这种拓扑结构的设计复杂,成本高,同时也会降低其可靠性。The traditional power unit cascaded topology requires a set of optical fibers, auxiliary power supplies, and local controllers for each power unit, ie, the power converter. This power unit cascaded topology increases with the increase of the voltage level, and the number of power units that need to be cascaded increases, resulting in an increase in the number of optical fibers, auxiliary power supplies, and local controllers. The design is complex, costly, and reduces its reliability.

图1是现有技术中一个三相SVG系统的结构示意图。图2是现有技术中一个更具体的三相SVG系统的示意图。图1和图2中的SVG系统包括三相电路,每一相电路中的功率单元级联连接。1 is a schematic structural view of a three-phase SVG system in the prior art. 2 is a schematic diagram of a more specific three-phase SVG system in the prior art. The SVG system of Figures 1 and 2 includes three phase circuits in which the power cells in each phase are connected in cascade.

如图1中所示,该SVG系统的每一相电路都由多个功率单元1级联而成。这里的术语“级联”在本领域中是公知常识,即每一个功率单元包括第一端T 1和第二端T 2,相邻两个功率单元的其中一个的第二端T 2与另一个的第一端T 1连接。每一相电路的第1个功率单元的第一端T 1经滤波器L分别连接到三相电网的U A、U B和U C三相线路上,每一相电路的最后一个功率单元的第二端相互连接。 As shown in FIG. 1, each phase circuit of the SVG system is formed by cascading a plurality of power units 1. The term "cascade" is a common knowledge in the art, i.e., each power cell comprises a first end and a second end T 1 T 2, wherein two adjacent power cell a second terminal T 2 and the other The first end T 1 of one is connected. Each phase circuit of the first power units through a first end of the filter L T 1 are respectively connected to three-phase network U A, U B and U C on the three-phase line, the last one power unit for each phase circuit The second ends are connected to each other.

如图2所述,该SVG系统的每一相电路都由8个功率单元P 1至P 8级联而成。每一个功率单元包括如图1中所示的第一端和第二端,其中 相邻两个功率单元的其中一个的第二端与另一个的第一端连接。例如,功率单元P 1的第二端与功率单元P 2的第一端连接,功率单元P 2的第二端与功率单元P 3的第一端连接,依次类推,功率单元P 7的第二端与功率单元P 8的第一端连接。三相电路中三个功率单元P 1的第一端经过滤波电路(由电感L、电阻R和电容C组成)分别连接于三相电网G的U A、U B和U C相,其中三相电网G的U A、U B和U C相连接负载R load。三相电路中三个功率单元P 8的第二端相互连接。每一个功率单元中包括四个功率开关器件2。每一个功率开关器件2由一个功率半导体开关S与一个反向并联的体二极管或外接二极管D构成。功率半导体开关S的集电极与二极管D的阴极连接,功率半导体开关S的发射极与二极管D的阳极连接。由于功率半导体开关S与一个反向并联的体二极管或外接二极管D二者通常作为一个整体使用,所以为了描述简洁的目的,以下描述中不再单独提及反向并联的体二极管或外接二极管D。 As shown in FIG. 2, each phase circuit of the SVG system is formed by cascading eight power units P 1 to P 8 . Each power unit includes a first end and a second end as shown in Figure 1, wherein a second end of one of the adjacent two power units is coupled to the first end of the other. For example, the second end of the power unit P 1 and P power unit 2 is connected to a first end, a second end of the power unit P and the power unit P is connected to a first end of the 2 3, and so on, a second power unit P 7 The terminal is connected to the first end of the power unit P 8 . The first end of the three power units P 1 in the three-phase circuit is connected to the U A , U B and U C phases of the three-phase power grid G through a filter circuit (composed of the inductor L, the resistor R and the capacitor C), wherein the three phases The U A , U B and U C of the grid G are connected to the load R load . The second ends of the three power units P 8 in the three-phase circuit are connected to each other. Four power switching devices 2 are included in each power unit. Each power switching device 2 consists of a power semiconductor switch S and an anti-parallel body diode or external diode D. The collector of the power semiconductor switch S is connected to the cathode of the diode D, and the emitter of the power semiconductor switch S is connected to the anode of the diode D. Since the power semiconductor switch S and an anti-parallel body diode or external diode D are generally used as a whole, for the sake of brevity, the anti-parallel body diode or external diode D will not be separately mentioned in the following description. .

图1中所示的功率单元1可以是全桥(H桥)电路,也可以是其它的电路拓扑结构,如半桥电路、整流-逆变电路等。图3是现有技术中的一个H桥电路(拓扑)的示意图。例如,以功率单元为H桥电路为例,H桥电路如图3中所示,包括功率半导体开关S 1至S 4和直流母线电容C B。功率半导体开关S 1的第一端连接于直流母线电容C B的正极端和功率半导体开关S 3的第一端。功率半导体开关S 1的第二端连接于功率半导体开关S 4的第一端。功率半导体开关S 4的第二端连接于直流母线电容C B的负极端和功率半导体开关S 2的第二端。功率半导体开关S 3的第二端连接功率半导体开关S 2的第一端。功率半导体开关S 1的第二端作为H桥电路的第一输出端,也即功率单元1的第一端T 1,功率半导体开关S 3的第二端作为H桥电路的第二输出端,也即功率单元1的第二端T 2The power unit 1 shown in FIG. 1 may be a full bridge (H bridge) circuit, or may be other circuit topologies such as a half bridge circuit, a rectification-inverter circuit, and the like. 3 is a schematic diagram of an H-bridge circuit (topology) in the prior art. For example, a power unit circuit, for example an H-bridge, H-bridge circuit shown in Figure 3, comprises a power semiconductor switch S 1 is to S 4 and the DC bus capacitor C B. The first end of the power semiconductor switch S 1 is connected to the positive terminal of the DC bus capacitor C B and the first terminal of the power semiconductor switch S 3 . A second end of the power semiconductor switch S 1 is coupled to the first end of the power semiconductor switch S 4 . The second end of the power semiconductor switch S 4 is connected to the negative terminal of the DC bus capacitor C B and the second terminal of the power semiconductor switch S 2 . A second terminal of the power semiconductor switch S. 3 is connected to a first terminal of the power semiconductor switch S 2. The second end of the power semiconductor switch S 1 serves as a first output of the H-bridge circuit, that is, the first end T 1 of the power unit 1, and the second end of the power semiconductor switch S 3 serves as a second output of the H-bridge circuit. That is, the second end T 2 of the power unit 1.

图4是现有技术中一个单相SVG的示意图。如图4中所示,该单相SVG包括充电部分3、功率部分4和控制部分5。该单相SVG也包括多个功率单元40,每一个功率单元40包括如图1中所示的第一端和第二端,相邻两个功率单元40其中一个的第一端与另一个的第二端连接。图4是应用于25kV单相SVG的传统级联式方案。该SVG由多个功率单元级联 后形成一相,经滤波器和接触器接入电网。该SVG的每一个功率单元40通常采用一个H桥电路。H桥电路的拓扑结构如图3中所示,这里不再赘述。该SVG系统的每一个功率单元40还包括直流母线电容C B,其连接关系如图4中所示,其中充电部分3用以对直流母线电容C B进行预充电,控制部分5用以控制功率部分4的运行。 4 is a schematic diagram of a single phase SVG in the prior art. As shown in FIG. 4, the single-phase SVG includes a charging portion 3, a power portion 4, and a control portion 5. The single phase SVG also includes a plurality of power units 40, each of which includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and another The second end is connected. Figure 4 is a conventional cascaded solution for a 25kV single phase SVG. The SVG is cascaded by a plurality of power units to form a phase that is connected to the grid via filters and contactors. Each power unit 40 of the SVG typically employs an H-bridge circuit. The topology of the H-bridge circuit is shown in Figure 3 and will not be described here. Each power unit 40 of the SVG system further includes a DC bus capacitor C B whose connection relationship is as shown in FIG. 4 , wherein the charging portion 3 is used to precharge the DC bus capacitor C B , and the control portion 5 is used to control the power. Part 4 runs.

从图4可以看出,在传统的级联式拓扑结构中,除了包括一个主控制器50之外,每一个功率单元40即作为功率变换器,例如H桥电路,都需要单独配备一套本地控制器51、驱动电路52、辅助电源53及光纤54,其连接关系如图4中所示,主控制器50输出主控制信号至本地主控制器51,本地主控制器51根据主控制信号产生对应的功率单元的本地控制信号至驱动电路52,驱动电路52根据本地控制信号输出驱动信号来驱动对应的功率单元运行。例如25kV单相SVG,通常可以采用以下两种方案来实现。第一种方案:H桥电路中的功率开关器件均采用常用的1700V绝缘栅双极型晶体管(Insulated Gate Bipolar Translator,IGBT),那么单个功率单元40的直流母线电压为1000V,考虑冗余,共需要55级功率单元级联,因此一共需要55套本地控制板51、55套光纤54及55个辅助电源53。如此多的本地控制器51、光纤54、辅助电源53将导致SVG的结构设计极其复杂,成本也相当高昂,同时降低了其可靠性。As can be seen from FIG. 4, in the conventional cascaded topology, each power unit 40, as a power converter, such as an H-bridge circuit, needs to be separately provided with a set of locals in addition to a main controller 50. The controller 51, the driving circuit 52, the auxiliary power source 53 and the optical fiber 54 are connected in a relationship as shown in FIG. 4. The main controller 50 outputs a main control signal to the local main controller 51, and the local main controller 51 generates a main control signal according to the main control signal. The local control signal of the corresponding power unit is sent to the driving circuit 52. The driving circuit 52 outputs a driving signal according to the local control signal to drive the corresponding power unit to operate. For example, a 25kV single-phase SVG can usually be implemented in the following two schemes. The first solution: the power switching devices in the H-bridge circuit use the commonly used 1700V Insulated Gate Bipolar Transistor (IGBT), then the DC bus voltage of the single power unit 40 is 1000V, considering redundancy, a total of A 55-level power unit cascade is required, so a total of 55 sets of local control boards 51, 55 sets of fibers 54 and 55 auxiliary power sources 53 are required. Such a large number of local controllers 51, optical fibers 54, and auxiliary power sources 53 will result in extremely complicated structural design of the SVG, and the cost is also relatively high, while reducing its reliability.

第二种方案:H桥电路中的功率开关器件选用高压IGBT,例如3300V IGBT甚至6500V IGBT,将单个功率单元40的电压等级提高。为减少功率单元40的级联数量,减少本地控制器51、光纤54、辅助电源53的数量,通常可以采用第二种方案。在第二种方案中,若选用3300V IGBT,每个功率单元40的电压等级相比1700V IGBT方案提高一倍,级联数量可由55级减少为28级,本地控制器51、光纤54及辅助电源53的数量及成本也可减少一半。但受限于当前的半导体工艺发展水平,3300V IGBT的成本依然居高不下,同样的电流规格下,其成本远远超过1700V IGBT成本的2倍。因此第二种方案的成本将远远超过第一种方案。如果选用6500V IGBT,成本的压力则更高。The second scheme: the power switching device in the H-bridge circuit uses a high-voltage IGBT, such as a 3300V IGBT or even a 6500V IGBT, to increase the voltage level of a single power unit 40. In order to reduce the number of cascades of power units 40 and reduce the number of local controllers 51, fibers 54, and auxiliary power sources 53, a second scheme can generally be employed. In the second scheme, if the 3300V IGBT is selected, the voltage level of each power unit 40 is doubled compared to the 1700V IGBT scheme, and the number of cascades can be reduced from 55 to 28, local controller 51, fiber 54 and auxiliary power supply. The number and cost of 53 can also be reduced by half. However, due to the current level of semiconductor technology development, the cost of 3300V IGBT is still high. Under the same current specification, the cost is far more than twice the cost of 1700V IGBT. Therefore, the cost of the second option will far exceed the first option. If a 6500V IGBT is chosen, the cost pressure is even higher.

因此,目前不管是采用低压IGBT功率单元的级联方案,或是采用高 压IGBT功率单元的级联方案,均有其显著的缺点。Therefore, the current cascading scheme using low voltage IGBT power units or the cascading scheme using high voltage IGBT power units has its significant disadvantages.

图5是现有技术中一个HVDC-Light系统的示意图。如图5中所示,该HVDC-Light包括三相电路,每一相电路包括上半桥臂和下半桥臂,每一相电路的上半桥臂和下半桥臂均包括多个级联的功率单元40和电感L,每一个功率单元40也包括如图1中所示的第一端和第二端,相邻两个功率单元40其中一个的第一端与另一个的第二端连接,每个上桥臂的电感L与相应下桥臂的电感L相连,并且两个电感L之间的连接点分别连接到电网,其连接关系如图5中所示。该HVDC-Light的每一个功率单元40采用了一个半桥变换器。该HVDC-Light的每一个功率单元40还包括直流母线电容,该HVDC-Light的每一个功率单元40还需要连接驱动电路52,功率单元40根据驱动电路52输出的驱动信号进行运行。除了主控制器50之外,每一个功率单元40也都需要配备一套本地控制器51、光纤54及辅助电源53,其连接关系如图5中所示。Figure 5 is a schematic illustration of an HVDC-Light system in the prior art. As shown in FIG. 5, the HVDC-Light includes a three-phase circuit, and each phase circuit includes an upper half arm and a lower half arm, and the upper half arm and the lower half arm of each phase circuit include a plurality of stages. Connected power unit 40 and inductor L, each power unit 40 also includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and a second of the other The terminals are connected, the inductance L of each upper arm is connected to the inductance L of the corresponding lower arm, and the connection points between the two inductors L are respectively connected to the power grid, and the connection relationship is as shown in FIG. 5. Each of the HVDC-Light power units 40 employs a half bridge converter. Each power unit 40 of the HVDC-Light further includes a DC bus capacitor. Each power unit 40 of the HVDC-Light also needs to be connected to a driving circuit 52. The power unit 40 operates according to a driving signal output by the driving circuit 52. In addition to the main controller 50, each power unit 40 also needs to be provided with a local controller 51, an optical fiber 54 and an auxiliary power supply 53, the connection relationship of which is shown in FIG.

由于HVDC-Light的直流电压高达上百千伏,需要级联的功率单元40的数量极其庞大,所以上述提到的问题更加显著,即现有技术中HVDC-Light整体结构复杂、成本高且可靠性低。Since the DC voltage of HVDC-Light is as high as hundreds of kilovolts, and the number of power units 40 to be cascaded is extremely large, the above-mentioned problems are more remarkable, that is, the overall structure of HVDC-Light in the prior art is complicated, costly and reliable. Low sex.

另外,本地控制器和辅助电源的供电方式也需要进一步考虑和改进。In addition, the power supply mode of the local controller and auxiliary power supply needs further consideration and improvement.

另外,功率半导体开关的驱动方式也需要进一步考虑和改进。In addition, the driving method of the power semiconductor switch needs further consideration and improvement.

另外,针对直流母线电容上直流母线电压的钳位也需要进一步考虑和改进。In addition, the clamping of the DC bus voltage on the DC bus capacitors needs further consideration and improvement.

发明内容Summary of the invention

本发明的目的在于提供一种模块化电源系统,以简化电力电子系统的结构,降低成本,并提高可靠性。It is an object of the present invention to provide a modular power supply system that simplifies the structure of a power electronic system, reduces cost, and improves reliability.

根据本发明的一个方面,提供一种模块化电源系统,被配置为包括:一个主控制器,被配置为输出主控制信号;N个本地控制器,其中每一个所述本地控制器被配置为接收所述主控制信号,以输出至少一个本地控制信号;以及N个功率单元,与所述N个本地控制器一一对应,其中每一个所述功率单元包括第一端和第二端,每一个所述功率单元的 所述第二端连接到相邻的一个所述功率单元的所述第一端,每一个所述功率单元被配置为包括M个功率变换器,其中每一个所述功率变换器包括第三端和第四端,每一个所述功率变换器的所述第四端连接到相邻的一个所述功率变换器的所述第三端,且第一个所述功率变换器的所述第三端为所述功率单元的所述第一端,第M个所述功率变换器的所述第四端为所述功率单元的所述第二端,每一个所述功率变换器被配置为根据对应的所述本地控制器输出的所述本地控制信号运行,其中N和M均为大于1的自然数,其中控制所述M个功率变换器中至少2个功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。According to an aspect of the present invention, a modular power supply system is provided, comprising: a main controller configured to output a main control signal; N local controllers, wherein each of the local controllers is configured to Receiving the main control signal to output at least one local control signal; and N power units in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end, each The second end of one of the power units is coupled to the first end of an adjacent one of the power units, each of the power units being configured to include M power converters, wherein each of the powers The converter includes a third end and a fourth end, the fourth end of each of the power converters being coupled to the third end of an adjacent one of the power converters, and the first one of the power conversions The third end of the power unit is the first end of the power unit, and the fourth end of the Mth power converter is the second end of the power unit, each of the power The converter is configured to And operating according to the local control signal outputted by the corresponding local controller, wherein N and M are both natural numbers greater than 1, wherein the power semiconductor of the same position in at least two of the M power converters is controlled The local control signals that are simultaneously turned on and off at the same time are the same.

在本发明的一些示例性实施例中,所述的模块化电源系统被配置为还包括:N个辅助电源,与所述N个本地控制器一一对应,其中每一个所述辅助电源被配置为给对应的所述本地控制器提供电源。In some exemplary embodiments of the present invention, the modular power supply system is configured to further include: N auxiliary power sources in one-to-one correspondence with the N local controllers, wherein each of the auxiliary power sources is configured To provide power to the corresponding local controller.

在本发明的一些示例性实施例中,其中所述N个辅助电源被配置为从外部电源取电,或者从对应的所述功率单元取电。In some exemplary embodiments of the invention, wherein the N auxiliary power sources are configured to draw power from an external power source or to draw power from a corresponding one of the power units.

在本发明的一些示例性实施例中,其中所述功率变换器为AC/DC变换器、DC/AC变换器和DC/DC变换器中的任何一种。In some exemplary embodiments of the invention, wherein the power converter is any one of an AC/DC converter, a DC/AC converter, and a DC/DC converter.

在本发明的一些示例性实施例中,其中所述M个功率变换器的拓扑结构为全部相同,或部分相同。In some exemplary embodiments of the invention, the topologies of the M power converters are all identical, or partially identical.

在本发明的一些示例性实施例中,其中每一个所述功率单元中的所述M个功率变换器的拓扑结构全部为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的一种。In some exemplary embodiments of the present invention, the topology of the M power converters in each of the power units is all a full bridge converter, a half bridge converter, and a neutral point controllable three level One of a converter, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

在本发明的一些示例性实施例中,其中每一个所述功率单元中的所述M个功率变换器的拓扑结构为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的两种或两种以上的组合。In some exemplary embodiments of the present invention, the topology of the M power converters in each of the power units is a full bridge converter, a half bridge converter, and a neutral point controllable three-level conversion Two or more combinations of a diode, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

在本发明的一些示例性实施例中,其中每一个所述功率单元还包括:M个驱动电路,与所述M个功率变换器一一对应,其中每一个所述 驱动电路被配置为连接于对应的所述功率变换器的功率半导体开关,接收对应的所述本地控制器输出的所述本地控制信号,以输出至少一个驱动信号来驱动对应的所述M个功率变换器中的所述功率半导体开关的导通和断开。In some exemplary embodiments of the present invention, each of the power units further includes: M driving circuits in one-to-one correspondence with the M power converters, wherein each of the driving circuits is configured to be connected to Corresponding power semiconductor switch of the power converter receives the local control signal output by the corresponding local controller to output at least one driving signal to drive the power in the corresponding M power converters The semiconductor switch is turned on and off.

在本发明的一些示例性实施例中,其中每一个所述功率单元还包括:多个驱动电路,其中所述多个驱动电路的数量等于所述功率单元中功率半导体开关的数量,每一个所述驱动电路被配置为连接于对应的所述功率变换器的所述功率半导体开关,接收对应的所述本地控制器输出的本地控制信号,以输出驱动信号来驱动对应的所述功率半导体开关的导通和断开。In some exemplary embodiments of the present invention, each of the power units further includes: a plurality of driving circuits, wherein the number of the plurality of driving circuits is equal to the number of power semiconductor switches in the power unit, each of The driving circuit is configured to be connected to the power semiconductor switch of the corresponding power converter, receive a corresponding local control signal output by the local controller, to output a driving signal to drive the corresponding power semiconductor switch Turn on and off.

在本发明的一些示例性实施例中,其中各所述驱动电路为彼此相同或彼此不相同。In some exemplary embodiments of the invention, each of the drive circuits is identical to each other or different from each other.

在本发明的一些示例性实施例中,其中每一个所述驱动电路包括第一磁隔离器件,所述第一磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或每一个所述驱动电路包括第二磁隔离器件,所述第二次隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, each of the driving circuits includes a first magnetic isolation device that transmits a driving logic pulse and a power pulse included in the local control signal; or each One of the drive circuits includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal.

在本发明的一些示例性实施例中,其中部分所述驱动电路包括第一磁隔离器件,所述第一磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;另一部分所述驱动电路包括第二磁隔离器件,所述第二磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, a portion of the driving circuit includes a first magnetic isolation device that transmits a driving logic pulse and a power pulse included in the local control signal; The drive circuit includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal.

在本发明的一些示例性实施例中,其中所述M个功率变换器中至少一个为主功率变换器,至少一个为从功率变换器,所述M个驱动电路中至少一个为主驱动电路,至少一个为从驱动电路,所述主驱动电路被配置为驱动对应的所述主功率变换器中的功率半导体开关导通和断开,所述从驱动电路被配置为驱动对应的所述从功率变换器中的功率半导体开关的导通和断开。In some exemplary embodiments of the present invention, wherein at least one of the M power converters is a main power converter, at least one is a slave power converter, and at least one of the M driving circuits is a main driving circuit. At least one is a slave drive circuit configured to drive a corresponding power semiconductor switch in the main power converter to be turned on and off, the slave drive circuit configured to drive the corresponding slave power The power semiconductor switches in the converter are turned on and off.

在本发明的一些示例性实施例中,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构相同时,控制所述主功率变换器和所述从功率变换器中相同位置的功率半导体开关同时导通和同时断开的 所述本地控制信号为同一个。In some exemplary embodiments of the present invention, wherein the main power converter and the slave power converter are controlled when a topology of the master power converter is the same as a topology of the slave power converter The local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.

在本发明的一些示例性实施例中,其中所述至少一个主功率变换器的数量为1,所述至少一个从功率变换器的数量为M-1时,控制所述从功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。In some exemplary embodiments of the present invention, wherein the number of the at least one main power converter is 1, and the number of the at least one slave power converter is M-1, controlling the same in the slave power converter The local control signals of the position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.

在本发明的一些示例性实施例中,其中当所述至少一个主功率变换器的数量大于等于2,所述至少一个从功率变换器的数量大于等于2时,控制所述从功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。In some exemplary embodiments of the present invention, wherein when the number of the at least one main power converter is greater than or equal to 2 and the number of the at least one slave power converter is greater than or equal to 2, the slave power converter is controlled The local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same.

在本发明的一些示例性实施例中,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构不相同时,控制所述主功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。In some exemplary embodiments of the present invention, wherein the power semiconductor switch of the same position in the main power converter is controlled when the topology of the main power converter is different from the topology of the slave power converter The local control signals that are turned on and off at the same time are the same.

在本发明的一些示例性实施例中,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构相同时,控制所述主功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。In some exemplary embodiments of the present invention, wherein when the topology of the main power converter is the same as the topology of the slave power converter, the same position of the power semiconductor switch in the main power converter is controlled simultaneously The local control signals that are turned on and off at the same time are the same.

在本发明的一些示例性实施例中,其中所述主驱动电路和所述从驱动电路均包括磁隔离器件,所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, wherein the main driving circuit and the slave driving circuit each include a magnetic isolation device that transmits driving logic pulses and power pulses included in the local control signal; Or the magnetic isolation device transmits a drive logic pulse included in the local control signal.

在本发明的一些示例性实施例中,其中所述主驱动电路包括主磁隔离器件,所述从驱动电路包括从磁隔离器件,其中所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, wherein the main drive circuit includes a main magnetic isolation device, the slave drive circuit includes a slave magnetic isolation device, wherein the main magnetic isolation device transmits a signal included in the local control signal Driving a logic pulse, the driving logic pulse and power pulse included in the local control signal being transmitted from a magnetic isolation device; or the main magnetic isolation device transmitting a driving logic pulse and a power pulse included in the local control signal, The drive logic pulses included in the local control signal are transmitted from the magnetic isolation device.

在本发明的一些示例性实施例中,其中每一个所述主驱动电路和每一个所述从驱动电路均包括磁隔离器件,所述磁隔离器件传输所述本地 控制信号中包含的驱动逻辑脉冲和功率脉冲,或者所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, each of the main driving circuit and each of the slave driving circuits includes a magnetic isolation device that transmits a driving logic pulse included in the local control signal And a power pulse, or the magnetic isolation device transmits a drive logic pulse included in the local control signal.

在本发明的一些示例性实施例中,其中所述主驱动电路包括主磁隔离器件,所述从驱动电路包括从磁隔离器件,其中所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,或者所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。In some exemplary embodiments of the present invention, wherein the main drive circuit includes a main magnetic isolation device, the slave drive circuit includes a slave magnetic isolation device, wherein the main magnetic isolation device transmits a signal included in the local control signal Driving a logic pulse, the driving logic pulse and the power pulse contained in the local control signal are transmitted from the magnetic isolation device, or the main magnetic isolation device transmits a driving logic pulse and a power pulse included in the local control signal, The drive logic pulses included in the local control signal are transmitted from the magnetic isolation device.

在本发明的一些示例性实施例中,其中每一个所述功率单元还包括:多个第一直流母线电压钳位电路,与所述从功率变换器一一对应,其中每一个所述第一直流母线电压钳位电路被配置为与对应的从功率变换器的直流母线电容并联,以使对应的所述从功率变换器的直流母线电压不超过第一预设值。In some exemplary embodiments of the present invention, each of the power units further includes: a plurality of first DC bus voltage clamping circuits, one-to-one corresponding to the slave power converters, wherein each of the A DC bus voltage clamping circuit is configured to be coupled in parallel with the corresponding DC bus capacitance of the slave power converter such that the DC bus voltage of the corresponding slave power converter does not exceed a first predetermined value.

在本发明的一些示例性实施例中,其中每一个所述第一直流母线电压钳位电路包括:开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第一预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电。In some exemplary embodiments of the present invention, each of the first DC bus voltage clamping circuits includes: a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, a series branch circuit is connected in parallel with the DC bus capacitor, the switch control circuit is connected to the control end of the switch, and when the DC bus voltage exceeds the first preset value, the switch control circuit outputs a switch control signal to The switch is turned on such that the DC bus capacitor is discharged through the series branch.

在本发明的一些示例性实施例中,其中每一个所述功率单元还包括:In some exemplary embodiments of the present invention, each of the power units further includes:

多个第一直流母线电压钳位电路,与所述从功率变换器一一对应,其中每一个所述第一直流母线电压钳位电路被配置为与对应的从功率变换器的直流母线电容并联,以使对应的所述从功率变换器的直流母线电压不超过第一预设值;以及a plurality of first DC bus voltage clamping circuits in one-to-one correspondence with the slave power converters, wherein each of the first DC bus voltage clamping circuits is configured to be coupled to a DC bus of a corresponding slave power converter The capacitors are connected in parallel such that the DC bus voltage of the corresponding slave power converter does not exceed a first preset value;

多个第二直流母线电压钳位电路,与所述主功率变换器一一对应,其中每一个所述第二直流母线电压钳位电路被配置为与对应的主功率变换器的直流母线电容并联,以使对应的所述主功率变换器的直流母线电压不超过第二预设值。a plurality of second DC bus voltage clamping circuits in one-to-one correspondence with the main power converter, wherein each of the second DC bus voltage clamping circuits is configured to be in parallel with a DC bus capacitance of a corresponding main power converter So that the corresponding DC bus voltage of the main power converter does not exceed a second preset value.

在本发明的一些示例性实施例中,其中每一个所述第一直流母线电 压钳位电路包括:开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第一预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电;以及In some exemplary embodiments of the present invention, each of the first DC bus voltage clamping circuits includes: a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, a series branch circuit is connected in parallel with the DC bus capacitor, the switch control circuit is connected to the control end of the switch, and when the DC bus voltage exceeds the first preset value, the switch control circuit outputs a switch control signal to Turning on the switch such that the DC bus capacitor is discharged through the series branch;

每一个所述第二直流母线电压钳位电路包括:Each of the second DC bus voltage clamping circuits includes:

开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第二预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电。a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, the series branch is coupled in parallel with the DC bus capacitor, and the switch control circuit is coupled to the control end of the switch when When the DC bus voltage exceeds the second predetermined value, the switch control circuit outputs a switch control signal to turn on the switch such that the DC bus capacitor is discharged through the series branch.

本发明通过将多个功率变换器组成一个功率单元,利用一套本地控制器、光纤、辅助电源控制多个功率变换器的方法,可大大减少本地控制器、光纤、辅助电源的数量,简化结构设计,降低成本,提高可靠性。The invention can reduce the number of local controllers, optical fibers and auxiliary power sources by simplifying the structure by forming a plurality of power converters into one power unit and using a local controller, an optical fiber, and an auxiliary power source to control multiple power converters. Design, reduce costs and improve reliability.

本发明通过让功率单元中各级联功率变换器相同位置处的功率半导体开关共用一个驱动信号,可简化控制电路。The invention simplifies the control circuit by sharing a drive signal at the same position of the power semiconductor switches at the same position of the power converters in the power unit.

本发明适用于所有AC/DC、DC/AC、DC/DC功率变换器连接的拓扑结构,应用广泛。The invention is applicable to the topology of all AC/DC, DC/AC, DC/DC power converter connections and is widely used.

附图说明DRAWINGS

通过参照附图详细描述其示例实施例,本发明的上述和其它目标、特征及优点将变得更加明显。The above and other objects, features and advantages of the present invention will become more apparent from the embodiments of the invention.

图1是现有技术中一个三相SVG系统的结构示意图;1 is a schematic structural view of a three-phase SVG system in the prior art;

图2是现有技术中一个更具体的三相SVG系统的示意图;2 is a schematic diagram of a more specific three-phase SVG system in the prior art;

图3是现有技术中的一个H桥电路(拓扑)的示意图;3 is a schematic diagram of an H-bridge circuit (topology) in the prior art;

图4是现有技术中一个单相SVG的示意图;4 is a schematic diagram of a single phase SVG in the prior art;

图5是现有技术中一个HVDC-Light系统的示意图;Figure 5 is a schematic diagram of an HVDC-Light system in the prior art;

图6是本发明一个实施例的模块化电源系统的方框图;Figure 6 is a block diagram of a modular power supply system in accordance with one embodiment of the present invention;

图7是本发明另一个实施例的模块化电源系统的方框图;Figure 7 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图8是本发明另一个实施例的模块化电源系统的方框图;Figure 8 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图9是本发明另一个实施例的模块化电源系统的方框图;Figure 9 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图10是本发明另一个实施例的模块化电源系统的方框图;Figure 10 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图11是本发明另一个实施例的模块化电源系统的方框图;Figure 11 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图12是本发明另一个实施例的模块化电源系统的方框图;Figure 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图13是本发明另一个实施例的模块化电源系统的方框图;Figure 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图14是本发明另一个实施例的模块化电源系统的方框图;Figure 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图15是本发明另一个实施例的模块化电源系统的方框图;Figure 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图16是说明本发明本地控制器与驱动电路之间连接方式的示意图;Figure 16 is a schematic view showing the manner of connection between the local controller and the driving circuit of the present invention;

图17是本发明另一个实施例的模块化电源系统的方框图;Figure 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图18是说明本发明驱动电路的驱动方式的示意图;Figure 18 is a schematic view showing the driving mode of the driving circuit of the present invention;

图19是说明本发明驱动电路的另一种驱动方式的示意图;Figure 19 is a schematic view showing another driving mode of the driving circuit of the present invention;

图20是本发明一个实施例的驱动电路的电路图;Figure 20 is a circuit diagram of a driving circuit of one embodiment of the present invention;

图21是本发明一个实施例的驱动电路的时序图;Figure 21 is a timing chart of a driving circuit of one embodiment of the present invention;

图22是本发明另一个实施例的模块化电源系统的方框图;Figure 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图23是本发明另一个实施例的模块化电源系统的方框图;23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图24是本发明另一个实施例的模块化电源系统的方框图;Figure 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图25是本发明另一个实施例的模块化电源系统的方框图;Figure 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图26是本发明另一个实施例的模块化电源系统的方框图;Figure 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

图27是本发明一个实施例的钳位电路的电路图;Figure 27 is a circuit diagram of a clamp circuit according to an embodiment of the present invention;

图28是本发明另一个实施例的模块化电源系统的方框图。28 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention.

具体实施例Specific embodiment

现在将参考附图更全面地描述示例实施例。然而,示例实施例能够以多种形式实施,且不应被理解为限于在此阐述的范例;相反,提供这些实施例使得本发明将更加全面和完整,并将示例实施例的构思全面地传达给本领域的技术人员。附图仅为本发明的示意性图解,并非一定是按比例绘制。图中相同的附图标记表示相同或类似的部分,因而将省略 对它们的重复描述。Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in a variety of forms and should not be construed as being limited to the examples set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and fully convey the concept of the example embodiments. To those skilled in the art. The drawings are only schematic representations of the invention and are not necessarily to scale. The same reference numerals in the drawings denote the same or similar parts, and the repeated description thereof will be omitted.

此外,所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。在下面的描述中,提供许多具体细节从而给出对本发明的实施例的充分理解。然而,本领域技术人员将意识到,可以实践本发明的技术方案而省略所述特定细节中的一个或更多,或者可以采用其它的方法、组元、装置、步骤等。在其它情况下,不详细示出或描述公知结构、方法、装置、实现或者操作以避免喧宾夺主而使得本发明的各方面变得模糊。Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth However, one skilled in the art will appreciate that the technical solution of the present invention may be practiced, and one or more of the specific details may be omitted, or other methods, components, devices, steps, etc. may be employed. In other instances, well-known structures, methods, apparatus, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

图6是本发明一个实施例的模块化电源系统的方框图。如图6中所示,本发明的模块化电源系统被配置为包括:一个主控制器90、N个本地控制器91和N个功率单元70,其中N为大于1的自然数。Figure 6 is a block diagram of a modular power system in accordance with one embodiment of the present invention. As shown in FIG. 6, the modular power supply system of the present invention is configured to include: a main controller 90, N local controllers 91, and N power units 70, where N is a natural number greater than one.

主控制器90被配置为输出主控制信号。主控制信号例如是设置来控制该模块化电源系统的整体运行状态的一个或多个参数。The main controller 90 is configured to output a main control signal. The primary control signal is, for example, one or more parameters that are set to control the overall operational state of the modular power system.

每一个本地控制器91被配置为接收前述的主控制信号,以输出至少一个本地控制信号。本地控制信号例如是设置来控制对应的功率单元70的整体运行状态的一个或多个参数,或者本地控制信号用来控制对应的功率单元70中部分功率变换器的运行状态。Each local controller 91 is configured to receive the aforementioned primary control signal to output at least one local control signal. The local control signal is, for example, one or more parameters that are set to control the overall operational state of the corresponding power unit 70, or the local control signal is used to control the operational state of a portion of the power converters in the corresponding power unit 70.

本发明的模块化电源系统可以被配置为还包括N个辅助电源93,N个辅助电源93与N个本地控制器91一一对应,其中每一个辅助电源93被配置为给对应的本地控制器91提供电源。The modular power system of the present invention can be configured to further include N auxiliary power sources 93, one for each of the N local controllers 91, wherein each of the auxiliary power sources 93 is configured to correspond to a corresponding local controller 91 provides power.

N个功率单元70与N个本地控制器91一一对应,每一个功率单元70包括第一端X 1和第二端X 2,每一个功率单元70的第二端X 2连接到相邻的一个功率单元70的第一端X 1,也就是说,相邻两个功率单元70的其中一个的第二端X 2与另一个的第一端X 1连接。 N power unit 70 and local controllers 91 of the N-one correspondence, each of the power unit 70 includes a first end and a second end X 1 X 2, each of the second end of the power unit 70 is connected to the adjacent X 2 The first end X 1 of one power unit 70, that is, the second end X 2 of one of the adjacent two power units 70 is coupled to the first end X 1 of the other.

每一个功率单元70被配置为包括M个功率变换器701,其中每一个功率变换器701包括第三端X 3和第四端X 4,每一个功率变换器的第四端X 4连接到相邻的一个功率变换器701的第三端X 3。也就是说,相邻两个功率变换器701的其中一个的第四端X 4与另一个的第三端X 3连接。M为大于1的自然数。这样,第1个功率变换器701的第三端X 3即为该功 率单元70的第一端X 1,第M个功率变换器701的第四端X 4为该功率单元70的第二端X 2。每一个功率变换器701被配置为根据对应的本地控制器91输出的本地控制信号运行,其中控制所述M个功率变换器中至少2个功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。 Each power unit 70 is configured to include M power converters 701, each of which includes a third end X 3 and a fourth end X 4 , each of which is coupled to a fourth end X 4 o a third terminal 701 of power converter X 3. That is, the fourth end X 4 of one of the adjacent two power converters 701 is connected to the third end X 3 of the other. M is a natural number greater than one. Thus, the third end X 3 of the first power converter 701 is the first end X 1 of the power unit 70, and the fourth end X 4 of the Mth power converter 701 is the second end of the power unit 70. X 2. Each power converter 701 is configured to operate according to a local control signal output by a corresponding local controller 91, wherein a power semiconductor switch of the same position in at least two of the M power converters is controlled to be simultaneously turned on The local control signals that are disconnected at the same time are the same.

作为一个实施例,部分功率变换器所对应的本地控制信号是共用的,另一部分功率变换器所对应的本地控制信号是独立的,亦即,在共用本地控制信号的功率变换器中,同一个本地控制信号控制相同位置的功率半导体开关同时导通和同时断开。As an embodiment, the local control signals corresponding to the partial power converters are shared, and the local control signals corresponding to the other power converters are independent, that is, in the power converter sharing the local control signals, the same The local control signal controls the power semiconductor switches in the same position to be turned on and off at the same time.

作为另一个实施例,M个功率变换器所对应的本地控制信号都是共用的,同一个本地控制信号控制M个功率变换器中相同位置的功率半导体开关同时导通和同时断开。As another embodiment, the local control signals corresponding to the M power converters are all shared, and the same local control signal controls the power semiconductor switches of the same position in the M power converters to be simultaneously turned on and off at the same time.

作为本发明的一个实施例,主控制器90与每一个本地控制器91之间可以通过光隔离器件,例如光纤94传输前述的主控制信号。在其他实施例中,主控制器90与每一个本地控制器91之间可以通过磁隔离器件,例如,隔离变压器,进行连接,主控制器90与每一个本地控制器91之间的连接方式不仅限于上述连接方式。As an embodiment of the present invention, the aforementioned main control signal can be transmitted between the main controller 90 and each of the local controllers 91 via an optical isolation device, such as an optical fiber 94. In other embodiments, the main controller 90 and each local controller 91 can be connected by a magnetic isolation device, such as an isolation transformer, and the connection between the main controller 90 and each local controller 91 is not only Limited to the above connection method.

本发明的模块化电源系统可以应用于SVG、MVD、HVDC-Light以及风力发电系统等领域。The modular power supply system of the present invention can be applied to fields such as SVG, MVD, HVDC-Light, and wind power generation systems.

如图6中所示,本发明提出将M个功率变换器701合成为一个功率单元70,一个功率单元70配置一套本地控制器91、光纤94及辅助电源93,即一套本地控制器91、光纤94及辅助电源93控制M个功率变换器701。而在传统的方案中,每个功率单元40即功率变换器均需要配置一套本地控制器51、光纤54及辅助电源53。相比于传统方案,本发明提出的模块化电源系统所需要配置的本地控制器91、光纤94及辅助电源93的数量将降为传统方案的1/M。本发明使得模块化电源系统的结构设计大大简化,成本也显著降低,同时可靠性得到极大提高。As shown in FIG. 6, the present invention proposes to synthesize M power converters 701 into one power unit 70. One power unit 70 is provided with a local controller 91, an optical fiber 94 and an auxiliary power source 93, that is, a set of local controllers 91. The fiber 94 and the auxiliary power source 93 control the M power converters 701. In the conventional solution, each power unit 40, that is, the power converter, needs to be configured with a local controller 51, an optical fiber 54, and an auxiliary power supply 53. Compared with the conventional solution, the number of local controller 91, optical fiber 94 and auxiliary power supply 93 required for the modular power supply system proposed by the present invention will be reduced to 1/M of the conventional solution. The invention greatly simplifies the structural design of the modular power supply system, and the cost is also significantly reduced, and the reliability is greatly improved.

本发明不限制各个功率变换器701中所用的拓扑结构。本发明的模块化电源系统中的M个功率变换器701可以为交流/直流(AC/DC)变换 器、直流/交流(DC/AC)变换器和直流/直流(DC/DC)变换器中的任何一种,因此图6中用功率变换器701代表所有适用的AC/DC、DC/AC和DC/DC拓扑结构中的任何一种。本发明不限制M个功率变换器701中所用的拓扑结构还体现在M个功率变换器的拓扑结构可以为全部相同,或部分相同。例如,本发明的模块化电源系统中的每一个功率单元70中的M个功率变换器701的拓扑结构可以全部为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的一种。或者例如,本发明的模块化电源系统中的每一个功率单元70中的M个功率变换器701的拓扑结构可以为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的两种或两种以上的组合。The present invention does not limit the topology used in each power converter 701. The M power converters 701 in the modular power system of the present invention may be in an AC/DC converter, a DC/AC converter, and a DC/DC converter. Any of these, so power converter 701 in Figure 6 represents any of the applicable AC/DC, DC/AC, and DC/DC topologies. The present invention does not limit the topology used in the M power converters 701. The topology of the M power converters may be all the same or partially identical. For example, the topology of the M power converters 701 in each power unit 70 of the modular power supply system of the present invention may all be a full bridge converter, a half bridge converter, and a neutral point controllable three level converter. One of a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. Or for example, the topology of the M power converters 701 in each power unit 70 in the modular power system of the present invention may be a full bridge converter, a half bridge converter, a neutral point controllable three level converter A combination of two or more of a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

如图6中所示,本实施例的模块化电源系统中的每一个功率单元70可以包括:M个驱动电路702,与M个功率变换器701一一对应,其中每一个驱动电路702被配置为连接于对应的功率变换器701中的功率半导体开关,接收并根据对应的本地控制器91输出的至少一个本地控制信号,以输出至少一个驱动信号来驱动对应的M个功率变换器701中的功率半导体开关的导通和断开。As shown in FIG. 6, each power unit 70 in the modular power supply system of the present embodiment may include: M drive circuits 702, one-to-one corresponding to M power converters 701, wherein each of the drive circuits 702 is configured For connecting to the power semiconductor switch in the corresponding power converter 701, receiving and according to at least one local control signal output by the corresponding local controller 91, outputting at least one driving signal to drive the corresponding M power converters 701 Turning on and off the power semiconductor switch.

在其它实施例中,模块化电源系统中的每一个功率单元可以包括:多个驱动电路,多个驱动电路的数量等于这个功率单元中功率半导体开关的数量,每一个驱动电路被配置为连接于对应的功率半导体开关,接收并根据对应的本地控制信号以输出一个驱动信号来驱动对应的功率半导体开关的导通和断开。In other embodiments, each power unit in the modular power system can include: a plurality of drive circuits, the number of the plurality of drive circuits being equal to the number of power semiconductor switches in the power unit, each drive circuit being configured to be coupled to A corresponding power semiconductor switch receives and outputs a driving signal to drive the corresponding power semiconductor switch on and off according to the corresponding local control signal.

如图6中所示,本实施例的模块化电源系统中的每一个功率单元70可以包括:M个驱动电路702,与M个功率变换器701一一对应,其中每一个驱动电路702被配置为连接于对应的功率变换器701中的功率半导体开关,接收对应的本地控制器91输出的本地控制信号,以输出至少一个驱动信号来驱动对应的M个功率变换器701中的功率半导体开关的导通和断开。As shown in FIG. 6, each power unit 70 in the modular power supply system of the present embodiment may include: M drive circuits 702, one-to-one corresponding to M power converters 701, wherein each of the drive circuits 702 is configured In order to connect to the power semiconductor switch in the corresponding power converter 701, the local control signal outputted by the corresponding local controller 91 is received to output at least one driving signal to drive the power semiconductor switch in the corresponding M power converters 701. Turn on and off.

如图6所示,功率单元70中第一个功率变换器701和第二个功率变换器701所对应的本地控制信号是共同的,亦即,控制该两个功率变换器701中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个;而第三个功率变换器701所对应的本地控制信号是独立的,亦即,其与第一个功率变换器701和第二个功率变换器701的本地控制信号不是同一个。换句话说,第三个功率变换器701是被独立控制的而第一个功率变换器701和第二个功率变换器701是被共同控制的。As shown in FIG. 6, the local control signals corresponding to the first power converter 701 and the second power converter 701 in the power unit 70 are common, that is, the same position in the two power converters 701 is controlled. The local control signals that are simultaneously turned on and off simultaneously by the power semiconductor switch are the same; and the local control signals corresponding to the third power converter 701 are independent, that is, they are identical to the first power converter 701. The local control signal of the second power converter 701 is not the same. In other words, the third power converter 701 is independently controlled and the first power converter 701 and the second power converter 701 are jointly controlled.

在其他实施例中,第一个功率变换器701、第二个功率变换器701以及第三个功率变换器701所对应的本地控制信号是共同的,亦即,三个功率变换器701均被共同控制的。需要说明的是,功率单元70中功率变换器有M个,这里以3个举例,但不仅限于3个。In other embodiments, the local control signals corresponding to the first power converter 701, the second power converter 701, and the third power converter 701 are common, that is, the three power converters 701 are Jointly controlled. It should be noted that there are M power converters in the power unit 70, and here are three, but not limited to three.

在本实施例的模块化电源系统每一个功率单元70中,采用相同拓扑结构的功率变换器701可以采用“共用驱动”。所谓“共用驱动”是指采用相同拓扑结构的各变换器701的相同位置处的功率半导体开关可采用同一个本地控制信号来进行控制。所谓“相同位置”是指相同拓扑结构的各功率变换器701中在逻辑上对应的功率半导体开关在电路图中的位置。例如,下面的图7-图15中相同拓扑结构的各功率变换器701中的功率半导体开关Q 11、Q 21...Q M1具有相同位置,Q 12、Q 22...Q M2具有相同位置,Q 18、Q 28...Q M8具有相同位置,所以下面的图7-图15中每一个功率单元70中的M个功率变换器701都可以采用“共用驱动”。 In each of the power units 70 of the modular power supply system of the present embodiment, the power converter 701 employing the same topology may employ a "common drive." By "shared drive" is meant that the power semiconductor switches at the same location of each converter 701 of the same topology can be controlled using the same local control signal. By "same position" is meant the position of the logically corresponding power semiconductor switch in each power converter 701 of the same topology in the circuit diagram. For example, the power semiconductor switches Q 11 , Q 21 ... Q M1 in the respective power converters 701 of the same topology in FIGS. 7 to 15 have the same position, and Q 12 , Q 22 ... Q M2 have the same The positions Q 18 , Q 28 ... Q M8 have the same position, so the M power converters 701 in each of the power units 70 in the following FIGS. 7 to 15 can adopt the "common drive".

采用本发明的“共用驱动”的驱动方式,可以大大减少本地控制信号的数量,简化本地控制的电路设计。图7-图15将进一步描述本发明的本发明的“共用驱动”的驱动方式,即功率变换器701所对应的本地控制信号相同,即M个功率变换器701被共同控制,具体而言,M个功率变换器701中相同位置处的功率半导体开关所对应的本地控制信号为同一个。By adopting the "common drive" driving method of the invention, the number of local control signals can be greatly reduced, and the circuit design of the local control can be simplified. 7 to FIG. 15 further describe the driving mode of the "common drive" of the present invention, that is, the local control signals corresponding to the power converter 701 are the same, that is, the M power converters 701 are jointly controlled, specifically, The local control signals corresponding to the power semiconductor switches at the same position in the M power converters 701 are the same.

其中主控制器90、本地控制器91、光纤94以及辅助电源93的相关内容已经在图6中加以描述,在此不再赘述。图7-图15仅描述一个功率单元70中M个功率变换器所对应的本地控制信号以及相应驱动电路。The related contents of the main controller 90, the local controller 91, the optical fiber 94, and the auxiliary power source 93 have been described in FIG. 6, and are not described herein again. Figures 7-15 depict only the local control signals corresponding to the M power converters in a power unit 70 and the corresponding drive circuits.

图7是本发明另一个实施例的模块化电源系统的方框图。如图7中所示,同一个功率单元70的每一个功率变换器701的拓扑结构均为全桥变换器,例如H桥电路。以第M个H桥电路为例,H桥电路包括2个桥臂,例如,第M个H桥电路的一个桥臂包括上功率半导体开关Q M1和下功率半导体开关Q M2,另一个桥臂包括上功率半导体开关Q M3和下功率半导体开关Q M4。上功率半导体开关Q M1和下功率半导体开关Q M2的连接点为第M个功率变换器401的第三输出端X 3。上功率半导体开关Q M3和下功率半导体开关Q M4的连接点为第M个功率变换器401的第四输出端X 4Figure 7 is a block diagram of a modular power system in accordance with another embodiment of the present invention. As shown in FIG. 7, the topology of each power converter 701 of the same power unit 70 is a full bridge converter, such as an H bridge circuit. Taking the Mth H-bridge circuit as an example, the H-bridge circuit includes two bridge arms. For example, one bridge arm of the M-th H-bridge circuit includes an upper power semiconductor switch Q M1 and a lower power semiconductor switch Q M2 , and the other bridge arm The upper power semiconductor switch Q M3 and the lower power semiconductor switch Q M4 are included . The connection point of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 is the third output terminal X 3 of the Mth power converter 401. The connection point of the upper power semiconductor switch Q M3 and the lower power semiconductor switch Q M4 is the fourth output terminal X 4 of the Mth power converter 401.

在本实施例中,相邻两个功率变换器701的其中一者的第三输出端X 3与其中另一者的第四输出端X 4依次连接。具体而言,第1个H桥电路的第三输出端X 3为功率单元70的第一端X 1,第1个H桥电路的第四输出端X 4与第2个H桥电路的第三输出端X 3连接,依次连接下去,第M-1个H桥电路的第四输出端X 4与第M个H桥电路的第三输出端X 3连接,第M个H桥电路的第四输出端X 4为功率单元70的第二端X 2In the present embodiment, the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one. Specifically, the third output terminal X 3 of the first H-bridge circuit is the first terminal X 1 of the power unit 70, and the fourth output terminal X 4 of the first H-bridge circuit and the second H-bridge circuit The three output terminals X 3 are connected in turn, and the fourth output terminal X 4 of the M-1th H-bridge circuit is connected to the third output terminal X 3 of the M-th H-bridge circuit, and the M-th H-bridge circuit is connected. The four output terminal X 4 is the second terminal X 2 of the power unit 70.

在本实施例中,本地控制器91输出4个本地控制信号。每一个H桥电路对应一个驱动电路702。每一个驱动电路702与本地控制器91耦接,且与对应的上功率半导体开关以及下功率半导体开关的控制端相连,用于接收本地控制器91输出的上述4个本地控制信号,并对本地控制信号进行处理以产生各自的4个驱动信号。例如产生的4个驱动信号Y M1、Y M2、Y M3和Y M4输出至第M个H桥电路中上功率半导体开关Q M1和Q M3以及下功率半导体开关Q M2和Q M4的控制端,用于驱动上功率半导体开关Q M1和Q M3以及下功率半导体开关Q M2和Q M4的导通和断开。 In the present embodiment, the local controller 91 outputs four local control signals. Each H-bridge circuit corresponds to a drive circuit 702. Each of the driving circuits 702 is coupled to the local controller 91, and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the above four local control signals output by the local controller 91, and is localized. The control signals are processed to produce respective four drive signals. For example, the generated four drive signals Y M1 , Y M2 , Y M3 , and Y M4 are output to the control terminals of the upper power semiconductor switches Q M1 and Q M3 and the lower power semiconductor switches Q M2 and Q M4 in the Mth H-bridge circuit, It is used to drive the on and off of the upper power semiconductor switches Q M1 and Q M3 and the lower power semiconductor switches Q M2 and Q M4 .

在本实施例中,每一个H桥电路的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,例如,第1个H桥电路的上功率半导体开关Q 11、第2个H桥电路的上功率半导体开关Q 21、依次类推,直至第M个H桥电路的上功率半导体开关Q M1所对应本地控制信号相同,即同一个本地控制信号,即驱动电路702输出对应的驱动信号Y 11、Y 21...Y M1相同,使得上功率半导体开关Q 11、Q 21...Q M1同时导 通和同时断开。由于该实施例中功率单元70内各功率变换器701的拓扑结构均采用H桥电路,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各H桥电路相同位置处的功率半导体开关采用同一个本地控制信号,因此一个功率单元70中一共仅需要4个本地控制信号。 In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each H-bridge circuit are the same, that is, the local control signals are the same, for example, the upper power semiconductor switch Q 11 of the first H-bridge circuit, The upper power semiconductor switch Q 21 of the second H-bridge circuit, and so on, until the local control signal corresponding to the upper power semiconductor switch Q M1 of the M-th H-bridge circuit is the same, that is, the same local control signal, that is, the output of the driving circuit 702 The corresponding drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses an H-bridge circuit, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the respective H-bridge circuits use the same local control signal, so that only one local control signal is required in one power unit 70.

图8是本发明另一个实施例的模块化电源系统的方框图。如图8中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为半桥变换器。以第M个半桥变换器为例,半桥变换器包括1个桥臂111,例如,第M个半桥电路的桥臂111包括上功率半导体开关Q M1和下功率半导体开关Q M2。上功率半导体开关Q M1和下功率半导体开关Q M2的一端的连接点为第M个功率变换器701的第三输出端X 3。下功率半导体开关Q M2的另一端为第M个功率变换器701的第四输出端X 4Figure 8 is a block diagram of a modular power system in accordance with another embodiment of the present invention. As shown in FIG. 8, the topology of each of the power converters 701 in the same power unit 70 is a half bridge converter. Taking the Mth half-bridge converter as an example, the half-bridge converter includes one bridge arm 111. For example, the bridge arm 111 of the M-th half-bridge circuit includes an upper power semiconductor switch Q M1 and a lower power semiconductor switch Q M2 . A connection point of one end of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 is a third output terminal X 3 of the Mth power converter 701. The other end of the lower power semiconductor switch Q M2 is the fourth output terminal X 4 of the Mth power converter 701.

在本实施例中,相邻两个功率变换器701的其中一者的第三输出端X 3与其中另一者的第四输出端X 4依次连接。具体而言,第1个半桥变换器的第三输出端X 3为功率单元70的第一端X 1,第1个半桥变换器的第四输出端X 4与第2个半桥变换器的第三输出端X 3连接,依次连接下去,第M-1个半桥变换器的第四输出端X 4与第M个半桥变换器的第三输出端X 3连接,第M个半桥变换器的第四输出端X 4为功率单元70的第二端X 2In the present embodiment, the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one. Specifically, the third output terminal X 3 of the first half bridge converter is the first end X 1 of the power unit 70, and the fourth output terminal X 4 and the second half bridge of the first half bridge converter are transformed. The third output terminal X 3 of the device is connected and connected in turn, and the fourth output terminal X 4 of the M-1 half bridge converter is connected with the third output terminal X 3 of the Mth half bridge converter, the Mth the fourth output X 4 is a half-bridge converter power unit 70 of the second end of X 2.

在本实施例中,本地控制器91输出2个本地控制信号。每一个半桥变换器对应一个驱动电路702。每一个驱动电路702与本地控制器91耦接,且与对应的上功率半导体开关以及下功率半导体开关的控制端相连,用于接收本地控制器91输出的上述2个本地控制信号,并对本地控制信号进行处理以产生各自的2个驱动信号。例如产生的2个驱动信号Y M1和Y M2输出至第M个半桥变换器中上功率半导体开关Q M1和下功率半导体开关Q M2的控制端,用于驱动上功率半导体开关Q M1和下功率半导体开关Q M2的导通和断开。 In the present embodiment, the local controller 91 outputs two local control signals. Each half bridge converter corresponds to a drive circuit 702. Each of the driving circuits 702 is coupled to the local controller 91 and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the two local control signals output by the local controller 91 and local The control signals are processed to produce respective two drive signals. For example, the generated two drive signals Y M1 and Y M2 are output to the control terminals of the upper power semiconductor switch Q M1 and the lower power semiconductor switch Q M2 in the Mth half-bridge converter for driving the upper power semiconductor switch Q M1 and the lower The power semiconductor switch Q M2 is turned on and off.

在本实施例中,每一个半桥变换器的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,例如,第1个半 桥变换器的上功率半导体开关Q 11、第2个H桥电路的上功率半导体开关Q 21、依次类推,直至第M个半桥变换器的上功率半导体开关Q M1所对应本地控制信号为同一个,即驱动电路702输出对应的驱动信号Y 11、Y 21...Y M1相同,使得上功率半导体开关Q 11、Q 21...Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701的拓扑结构均采用半桥变换器,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各半桥变换器相同位置处的功率半导体开关采用同一个本地控制信号,因此一个功率单元70中一共仅需要2路本地控制信号。 In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, for example, the upper power semiconductor switch Q of the first half-bridge converter. 11. The upper power semiconductor switch Q 21 of the second H-bridge circuit, and so on, until the local control signal corresponding to the upper power semiconductor switch Q M1 of the M-th half-bridge converter is the same, that is, the output of the drive circuit 702 is corresponding. The drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a half bridge converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.

图9是本发明另一个实施例的模块化电源系统的方框图。如图9中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为中性点可控三电平变换器。以第1个中性点可控三电平变换器为例,中性点可控三电平变换器包括第一桥臂111a和第二桥臂111b。第一桥臂111a和第二桥臂111b均包括上功率半导体开关(如Q 11、Q 15)和下功率半导体开关(如Q 12、Q 16)。中性点可控三电平变换器还包括第一直流母线电容C 1、第二直流母线电容C 2,第一开关组(如Q 13、Q 14)和第二开关组(如Q 17、Q 18)。其中第一直流母线电容C 1和第二直流母线电容C 2串联连接后与第一桥臂111a和第二桥臂111b并联连接。第一桥臂111a的上功率半导体开关Q 11和下功率半导体开关Q 12的连接点为第1个功率变换器701的第三输出端X 3。第二桥臂111b的上功率半导体开关Q 15和下功率半导体开关Q 16的连接点为第1个功率变换器701的第四输出端X 4。第一开关组(如Q 13、Q 14)连接在第一桥臂111a的上功率半导体开关Q 11和下功率半导体开关Q 12的连接点与第一直流母线电容C 1和第二直流母线电容C 2的连接点之间。第二开关组(如Q 17、Q 18)连接在第二桥臂111b的上功率半导体开关Q 15和下功率半导体开关Q 16的连接点与第一直流母线电容C 1和第二直流母线电容C 2的连接点之间。在本实施例中,第一开关组为由两个功率半导体开关串联而成,例如,该两个功率半导体开关可以为双向可控开关。 9 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 9, the topology of each of the power converters 701 in the same power unit 70 is a neutral point controllable three-level converter. Taking the first neutral point controllable three-level converter as an example, the neutral point controllable three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include an upper power semiconductor switch (such as Q 11 , Q 15 ) and a lower power semiconductor switch (such as Q 12 , Q 16 ). The neutral point controllable three-level converter further includes a first DC bus capacitor C 1 , a second DC bus capacitor C 2 , a first switch group (such as Q 13 , Q 14 ) and a second switch group (such as Q 17) , Q 18 ). The first DC bus capacitor C 1 and the second DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The connection point of the upper power semiconductor switch Q 11 and the lower power semiconductor switch Q 12 of the first bridge arm 111a is the third output terminal X 3 of the first power converter 701. The connection point of the upper power semiconductor switch Q 15 and the lower power semiconductor switch Q 16 of the second bridge arm 111b is the fourth output terminal X 4 of the first power converter 701. The first switch group (such as Q 13 , Q 14 ) is connected to the connection point of the upper power semiconductor switch Q 11 and the lower power semiconductor switch Q 12 of the first bridge arm 111a with the first DC bus capacitor C 1 and the second DC bus Capacitor C 2 is connected between the points. The second switch group (such as Q 17 , Q 18 ) is connected to the connection point of the upper power semiconductor switch Q 15 and the lower power semiconductor switch Q 16 of the second bridge arm 111b with the first DC bus capacitor C 1 and the second DC bus Capacitor C 2 is connected between the points. In this embodiment, the first switch group is formed by connecting two power semiconductor switches in series. For example, the two power semiconductor switches may be bidirectional controllable switches.

在本实施例中,相邻两个功率变换器701的其中一者的第三输出端 X 3与其中另一者的第四输出端X 4依次连接。具体而言,第1个中性点可控三电平变换器的第三输出端X 3为功率单元70的第一端X 1,第1个中性点可控三电平变换器的第四输出端X 4与第2个中性点可控三电平变换器的第三输出端X 3连接,依次连接下去,第M-1个中性点可控三电平变换器的第四输出端X 4与第M个中性点可控三电平变换器的第三输出端X 3连接,第M个中性点可控三电平变换器的第四输出端X 4为功率单元70的第二端X 2In the present embodiment, the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one. Specifically, the third output terminal X 3 of the first neutral point controllable three-level converter is the first end X 1 of the power unit 70, and the first neutral point controllable three-level converter The four output terminals X 4 are connected to the third output terminal X 3 of the second neutral point controllable three-level converter, and are sequentially connected, and the fourth M-1 neutral point controllable three-level converter The output terminal X 4 is connected to the third output terminal X 3 of the Mth neutral point controllable three-level converter, and the fourth output terminal X 4 of the Mth neutral point controllable three-level converter is a power unit The second end of 70 is X 2 .

在本实施例中,本地控制器91输出8个本地控制信号,每一个本地控制信号用于控制对应的上功率半导体开关(如Q 11、Q 15)、下功率半导体开关(如Q 12、Q 16)、第一开关组(如Q 13、Q 14)和第二开关组(如Q 17、Q 18)其中一者。每个中性点可控三电平变换器的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,以功率单元中的中性点可控三电平变换器的第一功率半导体开关为例,第1个中性点可控三电平变换器的第一功率半导体开关Q 11、第2个中性点可控三电平变换器的第一功率半导体开关Q 21、依次类推直至第M个中性点可控三电平变换器的第一功率半导体开关Q M1所对应的本地控制信号相同,即本地控制信号为同一个,即驱动电路输出对应的驱动信号Y 11、Y 21...Y M1相同,使得第一功率半导体开关Q 11、Q 21直至Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701的拓扑结构均采用中性点可控三电平变换器,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各中性点可控三电平变换器的相同位置处的功率半导体开关采用相同的本地控制信号,因此一个功率单元70一共仅需要8个本地控制信号。 In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding upper power semiconductor switch (such as Q 11 , Q 15 ) and a lower power semiconductor switch (such as Q 12 , Q). 16 ), one of the first switch group (such as Q 13 , Q 14 ) and the second switch group (such as Q 17 , Q 18 ). The local control signals corresponding to the power semiconductor switches of the same position of each neutral point controllable three-level converter are the same, that is, the local control signals are the same, and the neutral point controllable three-level converter in the power unit For example, the first power semiconductor switch of the first neutral point controllable three-level converter, the first power semiconductor switch Q 11 of the first neutral point controllable three-level converter, and the first power semiconductor switch of the second neutral point controllable three-level converter Q 21 , and so on until the first power semiconductor switch Q M1 of the Mth neutral point controllable three-level converter corresponds to the same local control signal, that is, the local control signal is the same, that is, the corresponding drive of the drive circuit output The signals Y 11 , Y 21 ... Y M1 are identical such that the first power semiconductor switches Q 11 , Q 21 up to Q M1 are simultaneously turned on and off at the same time. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a neutral point controllable three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. The power semiconductor switches at the same position of each neutral point controllable three-level converter in this embodiment use the same local control signal, so that one power unit 70 requires only a total of eight local control signals.

图10是本发明另一个实施例的模块化电源系统的方框图。如图10中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为二极管钳位三电平变换器。以第1个二极管钳位三电平变换器为例,二极管钳位三电平变换器包括第一桥臂111a和第二桥臂111b。第一桥臂111a和第二桥臂111b均包括第一功率半导体开关(如Q 11、Q 15)、第二功率半导体开关(如Q 12、Q 16)、第三功率半导体开关(如Q 13、Q 17) 和第四功率半导体开关(如Q 14、Q 18)。二极管钳位三电平变换器还包括第一直流母线电容C 1、第二直流母线电容C 2、第一二极管D 1、第二二极管D 2、第三二极管D 3和第四二极管D 4。其中第一直流母线电容C 1和第二直流母线电容C 2串联连接后与第一桥臂111a和第二桥臂111b并联连接。第一桥臂111a的第一功率半导体开关Q 11、第二功率半导体开关Q 12、第三功率半导体开关Q 13和第四功率半导体开关Q 14串联连接。第二功率半导体开关Q 12和第三功率半导体开关Q 13的连接点为该功率变换器401的第三输出端X 3。第二桥臂111b的第一功率半导体开关Q 15、第二功率半导体开关Q 16、第三功率半导体开关Q 17和第四功率半导体开关Q 18串联连接。第二功率半导体开关Q 16和第三功率半导体开关Q 17的连接点为该功率变换器401的第四输出端X 4。第一二极管D 1和第二二极管D 2串联后连接在第一桥臂111a的第一功率半导体开关Q 11和第二功率半导体开关Q 12的连接点和第三功率半导体开关Q 13和第四功率半导体开关Q 14的连接点之间。第三二极管D 3和第四二极管D 4串联后连接在第二桥臂111b的第一功率半导体开关Q 16和第二功率半导体开关Q 17的连接点和第三功率半导体开关Q 17和第四功率半导体开关Q 18的连接点之间。第一二极管D 1和第二二极管D 2的连接点与第一直流母线电容C 1和第二直流母线电容C 2的连接点连接。第三二极管D 3和第四二极管D 4的连接点也与第一直流母线电容C 1和第二直流母线电容C 2的连接点连接。在本实施例中,第一二极管D 1和第二二极管D 2的作用为钳位二极管,第一功率半导体开关、第二功率半导体开关、第三功率半导体开关和第四功率半导体开关为IGBT或者IGCT等。 Figure 10 is a block diagram of a modular power system in accordance with another embodiment of the present invention. As shown in FIG. 10, the topology of each of the power cells 70 in the same power unit 70 is a diode clamped three-level converter. Taking the first diode clamped three-level converter as an example, the diode clamped three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (such as Q 11 , Q 15 ), a second power semiconductor switch (such as Q 12 , Q 16 ), and a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ). The diode clamped three-level converter further includes a first DC bus capacitor C 1 , a second DC bus capacitor C 2 , a first diode D 1 , a second diode D 2 , and a third diode D 3 And a fourth diode D 4 . The first DC bus capacitor C 1 and the second DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The first power semiconductor switch Q 11 , the second power semiconductor switch Q 12 , the third power semiconductor switch Q 13 and the fourth power semiconductor switch Q 14 of the first bridge arm 111 a are connected in series. The connection point of the second power semiconductor switch Q 12 and the third power semiconductor switch Q 13 is the third output terminal X 3 of the power converter 401. The first power semiconductor switch Q 15 , the second power semiconductor switch Q 16 , the third power semiconductor switch Q 17 and the fourth power semiconductor switch Q 18 of the second bridge arm 111b are connected in series. The junction point of the second power semiconductor switch Q 16 and the third power semiconductor switch Q 17 is the fourth output terminal X 4 of the power converter 401. The first diode D 1 and the second diode D 2 are connected in series and connected to the connection point of the first power semiconductor switch Q 11 and the second power semiconductor switch Q 12 of the first bridge arm 111a and the third power semiconductor switch Q and the fourth power semiconductor switch 13 between the connection point Q 14. The third diode D 3 and the fourth diode D 4 are connected in series and connected to the connection point of the first power semiconductor switch Q 16 and the second power semiconductor switch Q 17 of the second bridge arm 111b and the third power semiconductor switch Q and the fourth power semiconductor switch 17 between the connection point Q 18. A connection point of the first diode D 1 and the second diode D 2 is connected to a connection point of the first DC bus capacitor C 1 and the second DC bus capacitor C 2 . The junction of the third diode D 3 and the fourth diode D 4 is also connected to the junction of the first DC bus capacitor C 1 and the second DC bus capacitor C 2 . In this embodiment, the first diode D 1 and the second diode D 2 function as clamping diodes, a first power semiconductor switch, a second power semiconductor switch, a third power semiconductor switch, and a fourth power semiconductor. The switch is an IGBT or an IGCT.

在本实施例中,相邻两个功率变换器701的其中一者的第三输出端X 3与其中另一者的第四输出端X 4依次连接。具体而言,第1个二极管钳位三电平变换器的第三输出端X 3为功率单元70的第一端X 1,第1个二极管钳位三电平变换器的第四输出端X 4与第2个二极管钳位三电平变换器的第三输出端X 3连接,依次连接下去,第M-1个二极管钳位三电平变换器的第四输出端X 4与第M个二极管钳位三电平变换器的第三输出端X 3连接,第M个二极管钳位三电平变换器的第四输出端X 4为功率单元 70的第二端X 2In the present embodiment, the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one. Specifically, the third output terminal X 3 of the first diode clamped three-level converter is the first terminal X 1 of the power unit 70, and the fourth output terminal X of the first diode clamped three-level converter 4 is connected to the third output terminal X 3 of the second diode clamped three-level converter, and sequentially connected, the fourth output terminal X 4 and the Mth of the M-1th diode clamped three-level converter The third output terminal X 3 of the diode clamped three-level converter is connected, and the fourth output terminal X 4 of the Mth diode clamped three-level converter is the second terminal X 2 of the power unit 70.

在本实施例中,本地控制器91输出8个本地控制信号,每一个本地控制信号用于控制对应的第一功率半导体开关(如Q 11、Q 15)、第二功率半导体开关(如Q 12、Q 16)、第三功率半导体开关(如Q 13、Q 17)和第四功率半导体开关(如Q 14、Q 18)其中一者。每个二极管钳位三电平变换器的相同位置的功率半导体开关所对应的本地控制信号相同,例如,以功率单元中二极管钳位三电平变换器的第一功率半导体开关为例,第1个二极管钳位三电平变换器的第一功率半导体开关Q 11、第2个二极管钳位三电平变换器的第一功率半导体开关Q 21、依次类推直至第M个二极管钳位三电平变换器的第一功率半导体开关Q M1所对应的本地控制信号相同,即本地控制信号为同一个,即驱动电路输出对应的驱动信号Y 11、Y 21...Y M1相同,以使第一功率半导体开关Q 11、Q 21直至Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701均采用二极管钳位三电平变换器,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各二极管钳位三电平变换器相同位置处的功率半导体开关采用相同的本地控制信号,因此一个功率单元一共仅需要8个本地控制信号。 In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q 11 , Q 15 ) and a second power semiconductor switch (such as Q 12). , Q 16 ), one of a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ). The local control signal corresponding to the power semiconductor switch of the same position of each diode clamped three-level converter is the same, for example, the first power semiconductor switch of the diode clamped three-level converter in the power unit is taken as an example, the first a first power semiconductor switch Q 11 of a diode clamped three-level converter, a first power semiconductor switch Q 21 of a second diode clamped three-level converter, and so on until the Mth diode clamps three levels The local control signals corresponding to the first power semiconductor switch Q M1 of the converter are the same, that is, the local control signals are the same, that is, the driving circuit outputs the corresponding driving signals Y 11 , Y 21 ... Y M1 to be the same, so that the first The power semiconductor switches Q 11 , Q 21 and Q M1 are simultaneously turned on and off at the same time. Since each of the power converters 701 in the power unit 70 in this embodiment employs a diode clamped three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the diode clamped three-level converters use the same local control signal, so that only one local control signal is required for one power unit.

图11是本发明另一个实施例的模块化电源系统的方框图。如图11中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为飞跨电容三电平变换器。以第1个飞跨电容三电平变换器为例,飞跨电容三电平变换器包括第一桥臂111a和第二桥臂111b。第一桥臂111a和第二桥臂111b均包括第一功率半导体开关(Q 11、Q 15)、第二功率半导体开关(Q 12、Q 16)、第三功率半导体开关(Q 13、Q 17)和第四功率半导体开关(Q 14、Q 18)。飞跨电容三电平变换器还包括第一直流母线电容C 1、第一直流母线电容C 2、第一电容C 3和第二电容C 4。其中第一直流母线电容C 1和第一直流母线电容C 2串联连接后与第一桥臂111a和第二桥臂111b并联连接。第一桥臂111a的第一功率半导体开关Q 11、第二功率半导体开关Q 12、第三功率半导体开关Q 13和第四功率半导体开关Q 14串联连接。第二功率半导体开关Q 12和第三功率半导体开关Q 13的连接点 为该功率变换器401的第三输出端X 3。第二桥臂111b的第一功率半导体开关Q 15、第二功率半导体开关Q 16、第三功率半导体开关Q 17和第四功率半导体开关Q 18串联连接。第二功率半导体开关Q 16和第三功率半导体开关Q 17的连接点为该功率变换器401的第四输出端X 4。第一电容C 3连接于第一桥臂111a的第一功率半导体开关Q 11和第二功率半导体开关Q 12的连接点与第一桥臂111a的第三功率半导体开关Q 13和第四功率半导体开关Q 14的连接点之间。第二电容C 4连接于第二桥臂111b的第一功率半导体开关Q 15和第二功率半导体开关Q 16的连接点与第二桥臂111b的第三功率半导体开关Q 17和第四功率半导体开关Q 18的连接点之间。 11 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 11, the topology of each of the power converters 701 in the same power unit 70 is a flying capacitor three-level converter. Taking the first flying capacitor three-level converter as an example, the flying capacitor three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (Q 11 , Q 15 ), a second power semiconductor switch (Q 12 , Q 16 ), and a third power semiconductor switch (Q 13 , Q 17 ) And a fourth power semiconductor switch (Q 14 , Q 18 ). Flying capacitor three-level converter further comprises a first DC bus capacitor C 1, a first DC bus capacitor C 2, the first capacitor and the second capacitor C 3 C 4. The first DC bus capacitor C 1 and the first DC bus capacitor C 2 are connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The first power semiconductor switch Q 11 , the second power semiconductor switch Q 12 , the third power semiconductor switch Q 13 and the fourth power semiconductor switch Q 14 of the first bridge arm 111 a are connected in series. The connection point of the second power semiconductor switch Q 12 and the third power semiconductor switch Q 13 is the third output terminal X 3 of the power converter 401. The first power semiconductor switch Q 15 , the second power semiconductor switch Q 16 , the third power semiconductor switch Q 17 and the fourth power semiconductor switch Q 18 of the second bridge arm 111b are connected in series. The junction point of the second power semiconductor switch Q 16 and the third power semiconductor switch Q 17 is the fourth output terminal X 4 of the power converter 401. The first capacitor C 3 is connected to the connection point of the first power semiconductor switch Q 11 and the second power semiconductor switch Q 12 of the first bridge arm 111a and the third power semiconductor switch Q 13 and the fourth power semiconductor of the first bridge arm 111a Q switch 14 between the connection point. The second capacitor C 4 is connected to the connection point of the first power semiconductor switch Q 15 and the second power semiconductor switch Q 16 of the second bridge arm 111b and the third power semiconductor switch Q 17 and the fourth power semiconductor of the second bridge arm 111b Between the connection points of switch Q 18 .

在本实施例中,相邻两个功率变换器701的其中一者的第三输出端X 3与其中另一者的第四输出端X 4依次连接。具体而言,第1个飞跨电容三电平变换器的第三输出端X 3为功率单元70的第一端X 1,第1个飞跨电容三电平变换器的第四输出端X 4与第2个飞跨电容三电平变换器的第三输出端X 3连接,依次连接下去,第M-1个飞跨电容三电平变换器的第四输出端X 4与第M个飞跨电容三电平变换器的第三输出端X 3连接,第M个飞跨电容三电平变换器的第四输出端X 4为该功率单元70的第二端X 2In the present embodiment, the third output terminal X 3 of one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X 4 of the other one. Specifically, the third output terminal X 3 of the first flying capacitor three-level converter is the first end X 1 of the power unit 70, and the fourth output terminal X of the first flying capacitor three-level converter 4 is connected to the third output terminal X 3 of the second flying capacitor three-level converter, and sequentially connected, the fourth output terminal X 4 and the Mth of the M-1 flying capacitor three-level converter The third output terminal X 3 of the flying capacitor three-level converter is connected, and the fourth output terminal X 4 of the Mth flying capacitor three-level converter is the second terminal X 2 of the power unit 70.

在本实施例中,本地控制器91输出8个本地控制信号,每一个本地控制信号用于控制对应的第一功率半导体开关(如Q 11、Q 15)、第二功率半导体开关(如Q 12、Q 16)、第三功率半导体开关(如Q 13、Q 17)和第四功率半导体开关(如Q 14、Q 18)其中一者。每个飞跨电容三电平变换器的相同位置的功率半导体开关所对应的本地控制信号相同,例如,以功率单元中飞跨电容三电平变换器的第一功率半导体开关为例,第1个飞跨电容三电平变换器的第一功率半导体开关Q 11、第2个飞跨电容三电平变换器的第一功率半导体开关Q 21、依次类推直至第M个飞跨电容三电平变换器的第一功率半导体开关Q M1所对应的本地控制信号相同,即驱动电路输出对应的驱动信号Y 11、Y 21...Y M1相同,以使第一功率半导体开关Q 11、Q 21直至Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701均采用飞跨电容三电平变换器,一个功率单元 70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各飞跨电容三电平变换器相同位置处的功率半导体开关采用相同的本地控制信号,因此一个功率单元一共仅需要8个本地控制信号。 In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q 11 , Q 15 ) and a second power semiconductor switch (such as Q 12). , Q 16 ), one of a third power semiconductor switch (such as Q 13 , Q 17 ) and a fourth power semiconductor switch (such as Q 14 , Q 18 ). The local control signal corresponding to the power semiconductor switch of the same position of each flying capacitor three-level converter is the same, for example, the first power semiconductor switch of the flying capacitor three-level converter in the power unit is taken as an example, the first a first power semiconductor switch Q 11 of a flying capacitor three-level converter, a first power semiconductor switch Q 21 of a second flying capacitor three-level converter, and so on until a third level of the Mth flying capacitor The local control signal corresponding to the first power semiconductor switch Q M1 of the converter is the same, that is, the driving circuit outputs corresponding driving signals Y 11 , Y 21 ... Y M1 are the same, so that the first power semiconductor switches Q 11 , Q 21 Until Q M1 is turned on and off at the same time. Since each power converter 701 in the power unit 70 in this embodiment employs a flying capacitor three-level converter, one power unit 70 requires only one local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each of the flying capacitor three-level converters use the same local control signal, so that only one local control signal is required for one power unit.

图12是本发明另一个实施例的模块化电源系统的方框图。如图12中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为全桥谐振变换器。全桥谐振变换器701包括全桥电路、谐振电路、变压器和整流桥,其连接关系如图12中所示。以第1个全桥谐振变换器701为例,全桥电路包括4个功率半导体开关和一个直流母线电容,功率半导体开关Q 11的一端连接于直流母线电容C B’的一端和功率半导体开关Q 13的一端,功率半导体开关Q 11的另一端连接于功率半导体开关Q 12的一端,功率半导体开关Q 12的另一端连接于直流母线电容C B’的另一端和功率半导体开关Q 14的另一端,功率半导体开关Q 11与功率半导体开关Q 12的连接点连接于电容C’和电感L’构成的谐振电路的一端,谐振电路的另一端连接于变压器T’的原边线圈的一端,变压器T’的原边线圈的另一端连接于功率半导体开关Q 13与功率半导体开关Q 14的连接点,直流母线电容C B’的一端为第1个功率变换器的第三端X 3,直流母线电容C B’的另一端为第1个功率变换器的第四端X 4,整流桥包括4个整流二极管,整流二极管D 1’的一端连接于整流二极管D 3’一端,整流二极管D 1’的另一端连接于整流二极管D 2’一端,整流二极管D 3’的另一端连接于整流二极管D 4’一端,整流二极管D 2’的另一端连接于整流二极管D 4’另一端,整流二极管D 1’的一端为变换器T’的第五端X 5,整流二极管D 2’的另一端为变换器的第六端X 6,变压器的输出端分别连接于整流二极管D 1’与整流二极管D 2’的连接点以及整流二极管D 3’与整流二极管D 4’的连接点,其中变压器T’可以是中间抽头变压器,具有两个副边线圈,两个副边线圈并联连接,变压器T’也可以具有单个副边线圈。 Figure 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 12, the topology of each of the power converters 701 in the same power unit 70 is a full bridge resonant converter. The full bridge resonant converter 701 includes a full bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first full-bridge resonant converter 701 as an example, the full-bridge circuit includes four power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q 11 is connected to one end of the DC bus capacitor C B ' and the power semiconductor switch Q. One end 13 of the power semiconductor switch and the other end Q 11 is connected to the power semiconductor switch end Q 12 of the power semiconductor switch and the other end Q 12 is connected to the DC bus capacitor C B 'and the other end of the power semiconductor switch and the other end Q 14 of The connection point of the power semiconductor switch Q 11 and the power semiconductor switch Q 12 is connected to one end of the resonant circuit formed by the capacitor C' and the inductor L', and the other end of the resonant circuit is connected to one end of the primary coil of the transformer T', and the transformer T The other end of the primary coil is connected to the connection point of the power semiconductor switch Q 13 and the power semiconductor switch Q 14 , and one end of the DC bus capacitor C B ' is the third end of the first power converter X 3 , the DC bus capacitor The other end of C B ' is the fourth end X 4 of the first power converter, the rectifier bridge includes four rectifier diodes, and one end of the rectifier diode D 1 ' is connected to the rectifier diode D 3 ' The other end of the one end of the rectifying diode D 1 'and the other end is connected to a rectifier diode D 2' end, a rectifying diode D 3 'and the other end is connected to a rectifying diode D 4' end, a rectifying diode D 2 'is connected to a rectifying diode D 4 'At the other end, one end of the rectifier diode D 1 ' is the fifth end X 5 of the converter T', the other end of the rectifier diode D 2 ' is the sixth end X 6 of the converter, and the output ends of the transformer are respectively connected to the rectifier diode The connection point of D 1 ' with the rectifier diode D 2 ' and the connection point of the rectifier diode D 3 ' and the rectifier diode D 4 ', wherein the transformer T' may be a center tap transformer having two secondary coils and two secondary coils Connected in parallel, the transformer T' can also have a single secondary winding.

在本实施例中,每一个功率单元70中第1个全桥谐振变换器的第三端X 3为功率单元70的第一端X 1,第1个全桥谐振变换器的第四端X 4连接第二个全桥谐振变换器的第三端X 3,依次类推,第M-1个全桥谐振变换器的第四端X 4连接第M个全桥谐振变换器的第三端X 3,第M个全 桥谐振变换器的第四端X 4为功率单元70的第二端X 2。每一个功率单元70中每一个全桥谐振变换器器的第五端X 5连在一起,而第六端X 6连在一起。 In the present embodiment, each of the power unit 70 of a third terminal of the full bridge resonant converter power unit X 3 is a first end 70 of the X 1, a first full-bridge resonant converter fourth terminal X 4 is connected to the third end X 3 of the second full-bridge resonant converter, and so on, the fourth end X 4 of the M-1 full-bridge resonant converter is connected to the third end X of the M-th full-bridge resonant converter 3. The fourth end X 4 of the Mth full bridge resonant converter is the second end X 2 of the power unit 70. The fifth end X 5 of each of the full bridge resonant converters in each of the power units 70 is connected together, and the sixth end X 6 is connected together.

在本实施例中,每一个全桥谐振变换器中全桥电路的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,例如,第1个全桥电路的功率半导体开关Q 11、第2个全桥电路的功率半导体开关Q 21、依次类推,直至第M个全桥电路的功率半导体开关Q M1所对应本地控制信号相同,即同一个本地控制信号,即驱动电路输出对应的驱动信号Y 11、Y 21...Y M1相同,使得上功率半导体开关Q 11、Q 21...Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701的拓扑结构均采用全桥谐振变换器,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各全桥谐振变换器相同位置处的功率半导体开关采用同一个本地控制信号,因此一个功率单元70中一共仅需要4个本地控制信号。 In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of the full bridge circuit in each full bridge resonant converter are the same, that is, the local control signals are the same, for example, the power of the first full bridge circuit. The semiconductor switch Q 11 , the power semiconductor switch Q 21 of the second full bridge circuit, and so on, until the local control signal corresponding to the power semiconductor switch Q M1 of the Mth full bridge circuit is the same, that is, the same local control signal, that is, driving The circuit outputs corresponding drive signals Y 11 , Y 21 ... Y M1 are identical, such that the upper power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and simultaneously turned off. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a full bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the full bridge resonant converters use the same local control signal, so that only one local control signal is required in one power unit 70.

图13是本发明另一个实施例的模块化电源系统的方框图。如图13中所示,同一个功率单元70中的每一个功率变换器701的拓扑结构均为半桥谐振变换器。半桥谐振变换器701包括半桥电路、谐振电路、变压器和整流桥,其连接关系如图13中所示。以第1个半桥谐振变换器701为例,半桥电路包括2个功率半导体开关和一个直流母线电容,功率半导体开关Q 11的一端连接于直流母线电容C B’的一端,功率半导体开关Q 11的另一端连接于功率半导体开关Q 12的一端,功率半导体开关Q 12的另一端连接于直流母线电容C B’的另一端,功率半导体开关Q 11与功率半导体开关Q 12的连接点连接于电容C’和电感L’构成的谐振电路的一端,谐振电路的另一端连接于变压器T’的原边线圈的一端,变压器T’的原边线圈的另一端连接于功率半导体开关Q 12的另一端,直流母线电容C B’的一端为第1个功率变换器的第三端X 3,直流母线电容C B’的另一端为第1个功率变换器的第四端X 4,整流桥包括4个整流二极管,整流二极管D 1’的一端连接于整流二极管D 3’一端,整流二极管D 1’的另一端连接于整流二极管D 2’一端,整流二极管D 3’的另一端连接于整流二极管D 4’一端, 整流二极管D 2’的另一端连接于整流二极管D 4’另一端,整流二极管D 1’的一端为变换器的第五端X 5,整流二极管D 2’的另一端为变换器的第六端X 6,变压器的输出端分别连接于整流二极管D 1’与整流二极管D 2’的连接点以及整流二极管D 3’与整流二极管D 4’的连接点,其中变压器可以是中间抽头变压器,具有两个副边线圈,两个副边线圈并联连接,变压器也可以具有单个副边线圈。 Figure 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 13, the topology of each of the power converters 701 in the same power unit 70 is a half bridge resonant converter. The half bridge resonant converter 701 includes a half bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first half-bridge resonant converter 701 as an example, the half-bridge circuit includes two power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q 11 is connected to one end of the DC bus capacitor C B ', and the power semiconductor switch Q the other end 11 is connected to the power semiconductor switch end Q 12, the power semiconductor switch other ends Q 12 is connected to the DC bus capacitor C B ', the power semiconductor switch Q 11 of the power semiconductor switch Q is connected to the point 12 is connected to the 'One end of the primary coil of the transformer T''L and the inductance' end of the resonance circuit composed of the other end of the resonance circuit of the capacitor C is connected to the transformer T, the other end of the primary coil is connected to the power semiconductor switch of another Q 12 of At one end, one end of the DC bus capacitor C B ' is the third end X 3 of the first power converter, and the other end of the DC bus capacitor C B ' is the fourth end X 4 of the first power converter, and the rectifier bridge includes four rectifying diodes, the rectifying diode D 1 'is connected to one end of the rectifying diode D 3' end, a rectifying diode D 1 'and the other end is connected to a rectifier diode D 2' end, a rectifying diode D 3 'of the other One end is connected to one end of the rectifier diode D 4 ', the other end of the rectifier diode D 2 ' is connected to the other end of the rectifier diode D 4 ', and one end of the rectifier diode D 1 ' is the fifth end X 5 of the converter, and the rectifier diode D 2 ' The other end of the converter is the sixth end X 6 of the converter, and the output end of the transformer is respectively connected to the connection point of the rectifier diode D 1 ' and the rectifier diode D 2 ' and the connection point of the rectifier diode D 3 ' and the rectifier diode D 4 ', The transformer may be a center tapped transformer having two secondary windings, two secondary windings being connected in parallel, and the transformer may also have a single secondary winding.

在本实施例中,每一个功率单元70中第1个半桥谐振变换器的第三端X 3为功率单元70的第一端X 1,第1个半桥谐振变换器的第四端X 4连接第二个半桥谐振变换器的第三端X 3,依次类推,第M-1个半桥谐振变换器的第四端X 4连接第M个半桥谐振变换器的第三端X 3,第M个半桥谐振变换器的第四端X 4为功率单元70的第二端X 2。每一个功率单元70中所有的半桥谐振变换器器的第五端X 5连在一起,而第六端X 6连在一起。 In this embodiment, the third end X 3 of the first half-bridge resonant converter in each power unit 70 is the first end X 1 of the power unit 70, and the fourth end X of the first half-bridge resonant converter 4 half-bridge resonant converter connected to the second terminal of the third X 3, and so on, the fourth terminal 4 is connected to the M-X half-bridge resonant converter of a third terminal of the first X M-1 half-bridge resonant converter 3. The fourth end X 4 of the Mth half-bridge resonant converter is the second end X 2 of the power unit 70. The fifth ends X 5 of all of the half-bridge resonant converters in each power unit 70 are connected together, and the sixth ends X 6 are connected together.

在本实施例中,每一个半桥谐振变换器中半桥电路的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,例如,第1个半桥电路的功率半导体开关Q 11、第2个半桥电路的功率半导体开关Q 21、依次类推,直至第M个半桥电路的功率半导体开关Q M1所对应本地控制信号为同一个,即驱动电路输出对应的驱动信号Y 11、Y 21...Y M1相同,使得功率半导体开关Q 11、Q 21...Q M1同时导通和同时断开。由于该实施例中功率单元70内各功率变换器701的拓扑结构均采用半桥谐振变换器,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各半桥变换器相同位置处的功率半导体开关采用同一个本地控制信号,因此一个功率单元70中一共仅需要2个本地控制信号。 In this embodiment, the power semiconductor switches of the same position of the half bridge circuit in each half-bridge resonant converter have the same local control signal, that is, the local control signals are the same, for example, the power of the first half bridge circuit. The semiconductor switch Q 11 , the power semiconductor switch Q 21 of the second half bridge circuit, and so on, until the local control signal corresponding to the power semiconductor switch Q M1 of the Mth half bridge circuit is the same, that is, the corresponding drive of the drive circuit output The signals Y 11 , Y 21 ... Y M1 are identical, such that the power semiconductor switches Q 11 , Q 21 ... Q M1 are simultaneously turned on and off at the same time. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a half bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.

图14是本发明另一个实施例的模块化电源系统的方框图。如图14中所示,同一个功率单元70中的M个功率变换器701的拓扑结构同时采用全桥变换器和半桥变换器的组合。全桥变换器的功率变换器7011’包括4个功率半导体开关,半桥变换器7012’包括2个功率半导体开关。在本实施例中,全桥变换器的具体连接关系如图7所述,半桥变换器的 具体连接关系如图8所示,在此不再赘述。类似的,相邻两个功率变换器701的其中一个的第四端X 4与另一个的第三端X 3连接,其中M为大于1的自然数。这样,第1个功率变换器701的第三端X 3即为该功率单元70的第一端X 1,第1个功率变换器701的第四端X 4连接第2个功率变换器701的第三端X 3,依次类推,第M-1个功率变换器701的第四端X 4连接第M个功率变换器701的第三端X 3,第M个功率变换器701的第四端X 4为该功率单元70的第二端X 2Figure 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 14, the topology of the M power converters 701 in the same power unit 70 employs a combination of a full bridge converter and a half bridge converter. The power converter 7011' of the full bridge converter includes four power semiconductor switches, and the half bridge converter 7012' includes two power semiconductor switches. In this embodiment, the specific connection relationship of the full-bridge converter is as shown in FIG. 7 , and the specific connection relationship of the half-bridge converter is shown in FIG. 8 , and details are not described herein again. Similarly, the two adjacent power converter wherein a fourth end X 3 X 4 of the third terminal 701 is connected with another, wherein M is a natural number greater than 1. Thus, the third end X 3 of the first power converter 701 is the first end X 1 of the power unit 70, and the fourth end X 4 of the first power converter 701 is connected to the second power converter 701. The third end X 3 , and so on, the fourth end X 4 of the M-1th power converter 701 is connected to the third end X 3 of the Mth power converter 701, and the fourth end of the Mth power converter 701 X 4 is the second end X 2 of the power unit 70.

在本实施例中,每一个全桥变换器的相同位置的功率半导体开关所对应的本地控制信号相同,即为同一个本地控制信号,驱动电路输出对应的驱动信号相同,使得相同位置的功率半导体开关同时导通和同时断开。每一个半桥变换器的相同位置的功率半导体开关所对应的本地控制信号相同,即本地控制信号为同一个,驱动电路输出对应的驱动信号相同,使得相同位置的功率半导体开关同时导通和同时断开。由于该实施例中功率单元70内M个功率变换器的拓扑结构同时采用全桥变换器和半桥变换器的组合,一个功率单元70只需要一套本地控制器91、光纤94和辅助电源93。该实施例中各个全桥变换器相同位置处的功率半导体开关采用同一个本地控制信号,各个半桥变换器相同位置处的功率半导体开关采用同一个本地控制信号,因此一个功率单元70中一共仅需要6路本地控制信号。In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each full-bridge converter are the same, that is, the same local control signal, and the driving circuit outputs the corresponding driving signals, so that the power semiconductors of the same position are obtained. The switch is turned on and off at the same time. The local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, and the corresponding driving signals are output by the driving circuit, so that the power semiconductor switches of the same position are simultaneously turned on and simultaneously disconnect. Since the topology of the M power converters in the power unit 70 in this embodiment simultaneously uses a combination of a full bridge converter and a half bridge converter, one power unit 70 requires only one local controller 91, fiber 94, and auxiliary power source 93. . In this embodiment, the power semiconductor switches at the same position of the respective full-bridge converters use the same local control signal, and the power semiconductor switches at the same position of the respective half-bridge converters use the same local control signal, so that only one power unit 70 6 local control signals are required.

在其他实施例中,模块化电源系统中每一个功率单元70的M个功率变换器701的拓扑结构同时采用全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的两种或两种以上的组合。M个功率变换器701中相同拓扑结构的相同位置的功率半导体开关所对应的本地控制信号为同一个,驱动电路输出对应的驱动信号相同,使得相同位置的功率半导体开关同时导通和同时断开。In other embodiments, the topology of the M power converters 701 of each power unit 70 in the modular power system uses both a full bridge converter, a half bridge converter, a neutral point controllable three level converter, and a diode. A combination of two or more of a clamp three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. The local control signals corresponding to the power semiconductor switches of the same position in the same power structure of the M power converters 701 are the same, and the corresponding driving signals are output by the driving circuit, so that the power semiconductor switches of the same position are simultaneously turned on and simultaneously disconnected. .

如图6-图14中所示,本实施例的模块化电源系统中的每一个功率单元70可以包括:多个驱动电路702,功率单元中驱动电路的数量等于该功率单元中功率半导体开关的数量,其中每一个驱动电路702被配置为 连接于对应的功率变换器701的功率半导体开关,接收对应的本地控制器91输出的本地控制信号,以输出驱动信号来驱动对应的功率半导体开关的导通和断开。As shown in FIGS. 6-14, each power unit 70 in the modular power supply system of the present embodiment may include: a plurality of driving circuits 702, the number of driving circuits in the power unit being equal to the power semiconductor switches in the power unit A quantity, wherein each of the driving circuits 702 is configured to be connected to a power semiconductor switch of the corresponding power converter 701, receive a local control signal output by the corresponding local controller 91, to output a driving signal to drive the corresponding power semiconductor switch Pass and disconnect.

图15是本发明另一个实施例的模块化电源系统的方框图。如图15中所示,同一个功率单元70中的M个功率变换器701均为中性点可控三电平变换器。该功率单元70可以包括8×M个驱动电路,每一个驱动电路被配置为连接于功率变换器701的功率半导体开关Q 11、Q 12...Q 18...Q M1、Q M2...Q M8中对应的一个,每一个驱动电路均接收本地控制器91输出的对应的本地控制信号,以输出驱动信号Y 11、Y 12...Y 18...Y M1、Y M2...Y M8中对应的一个,来驱动对应的功率半导体开关的导通和断开。 Figure 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 15, the M power converters 701 in the same power unit 70 are all neutral point controllable three-level converters. The power unit 70 may include 8×M drive circuits, each of which is configured to be connected to the power semiconductor switches Q 11 , Q 12 ... Q 18 ... Q M1 , Q M2 of the power converter 701.. Corresponding one of .Q M8 , each driving circuit receives a corresponding local control signal output by the local controller 91 to output driving signals Y 11 , Y 12 ... Y 18 ... Y M1 , Y M2 .. A corresponding one of .Y M8 drives the turn-on and turn-off of the corresponding power semiconductor switch.

需要说明的是,图6-图15中一个功率单元包括的驱动电路的数量等于该功率单元中功率半导体开关的数量,每一个驱动电路被配置为连接于功率变换器的功率半导体开关中对应的一个,每一个驱动电路均接收本地控制器91输出的对应的本地控制信号,以输出一个驱动信号,来驱动对应的功率半导体开关的导通和断开。It should be noted that the number of driving circuits included in one power unit in FIG. 6 to FIG. 15 is equal to the number of power semiconductor switches in the power unit, and each driving circuit is configured to be connected to a corresponding one of the power semiconductor switches of the power converter. One, each driving circuit receives a corresponding local control signal output by the local controller 91 to output a driving signal to drive the corresponding power semiconductor switch to be turned on and off.

本发明的模块化电源系统中的每一个驱动电路702与对应的本地控制器91可以直接电连接,或者通过磁隔离器件连接,或者通过光隔离器件连接。Each of the drive circuits 702 of the modular power supply system of the present invention can be directly electrically connected to the corresponding local controller 91, or connected by magnetic isolation devices, or connected by optical isolation devices.

图16是说明本发明本地控制器与驱动电路之间连接方式的示意图。如图16中所示,作为一个实施例,驱动电路72(702)与本地控制器91通过磁隔离器件T连接,传输本地控制信号。采用磁隔离器件具有高可靠性、高性能、低功耗等优点。Figure 16 is a diagram showing the manner of connection between the local controller and the drive circuit of the present invention. As shown in FIG. 16, as an embodiment, the drive circuit 72 (702) is coupled to the local controller 91 via a magnetic isolation device T to transmit local control signals. The use of magnetic isolation devices has the advantages of high reliability, high performance, and low power consumption.

作为一个实施例,驱动电路72(702)与本地控制器91也可以通过光隔离器件连接。采用光隔离器件具有信号单向传输、输入端与输出端完全实现了电气隔离、输出信号对输入端无影响、抗干扰能力强、工作稳定、无触点、使用寿命长、传输效率高等优点。As an embodiment, the driver circuit 72 (702) and the local controller 91 can also be connected by an optical isolation device. The optical isolation device has the advantages of one-way signal transmission, complete electrical isolation between the input end and the output end, no influence of the output signal on the input end, strong anti-interference ability, stable operation, no contact, long service life and high transmission efficiency.

作为一个实施例,驱动电路72(702)与本地控制器91直接电连接。As an embodiment, drive circuit 72 (702) is directly electrically coupled to local controller 91.

本发明的模块化电源系统中的各驱动电路72(702)可以为彼此相同 或彼此不相同。Each of the drive circuits 72 (702) in the modular power supply system of the present invention may be identical to each other or different from each other.

如图6-图15中所示,本实施例的模块化电源系统中的各驱动电路702为彼此相同。As shown in FIGS. 6 to 15, each of the drive circuits 702 in the modular power supply system of the present embodiment is identical to each other.

图17是本发明另一个实施例的模块化电源系统的方框图。如图17中所示,本实施例的模块化电源系统中的一个功率单元中包括5个H桥电路的功率变换器701。其中4个功率变换器701的驱动电路721不同于中间的功率变换器701的驱动电路722。Figure 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 17, a power unit 701 of five H-bridge circuits is included in one power unit in the modular power supply system of the present embodiment. The drive circuit 721 of the four power converters 701 is different from the drive circuit 722 of the intermediate power converter 701.

图18是说明本发明驱动电路的驱动方式的示意图。如图18中所示,驱动电路722包括原边电路7221、副边电路7222以及磁隔离器件T 1,原边电路7221接收本地控制器91输出的本地控制信号,其中本地控制信号中只包含驱动成分,该本地控制信号是一个弱信号。原边电路7221将本地控制信号调制成为高低电平的窄脉冲信号,其中高低电平的窄脉冲信号包括驱动逻辑脉冲,该窄脉冲信号经由磁隔离器件(例如,高频隔离变压器)T 1传输副边电路7222,副边电路7222将高低压窄脉冲信号还原成PWM信号并经过放大处理以输出驱动信号来驱动功率半导体开关Q的导通和断开,其中该窄脉冲信号仅包含驱动逻辑脉冲,例如PWM信号。功率单元70还包括电源电路7223,用以给原边电路7221和副边电路7222提供电源。电源电路7223接收的电源可以来自于辅助源93,或者其他外部电源,电源电路7223将接收到的电源转换为给原边电路7221供电的电压V 1以及给副边7222供电的电压V 2,且电压V 1和V 2之间是相互隔离的。在其它实施例中,电源电路7223还包括原边电源电路(未示出)、隔离变压器(未示出)以及副边电源电路(未示出),原边电源电路将接收到的电源转换为原边电源给原边电路7221提供直流电V 1,同时原边电源电路将接收到的电源转换为功率脉冲即电源脉冲通过隔离变压器传输给副边电源电路,再由副边电源电路将功率脉冲转换为副边电源给副边电路7222提供直流电V 2Fig. 18 is a schematic view showing the driving mode of the driving circuit of the present invention. As shown, the driving circuit 722 includes a primary circuit 7221, circuit 7222, and the secondary magnetic separator means T 1 18, the primary circuit 7221 receives the signal output from the local controller local control 91, wherein the control signal includes only the local drive The component, the local control signal is a weak signal. The primary side circuit 7221 modulates the local control signal into a high-low level narrow pulse signal, wherein the high and low level narrow pulse signals include a driving logic pulse, and the narrow pulse signal is transmitted via a magnetic isolation device (for example, a high frequency isolation transformer) T 1 . The secondary circuit 7222, the secondary circuit 7222 restores the high and low voltage narrow pulse signals to a PWM signal and is amplified to output a driving signal to drive the on and off of the power semiconductor switch Q, wherein the narrow pulse signal only includes the driving logic pulse , for example, a PWM signal. The power unit 70 further includes a power supply circuit 7223 for supplying power to the primary side circuit 7221 and the secondary side circuit 7222. The power received by the power circuit 7223 may be from the auxiliary source 93, or other external power source, and the power circuit 7223 converts the received power into a voltage V 1 that supplies power to the primary circuit 7221 and a voltage V 2 that supplies power to the secondary side 7222, and The voltages V 1 and V 2 are isolated from each other. In other embodiments, the power supply circuit 7223 further includes a primary power supply circuit (not shown), an isolation transformer (not shown), and a secondary power supply circuit (not shown) that converts the received power supply into The primary side power supply supplies the primary side circuit 7221 with direct current V 1 , and the primary side power supply circuit converts the received power supply into a power pulse, that is, the power supply pulse is transmitted to the secondary side power supply circuit through the isolation transformer, and then the power pulse is converted by the secondary side power supply circuit. The secondary side circuit 7222 is supplied with a direct current V 2 for the secondary side power supply.

为简化驱动电路722,节省成本,提高驱动电路72的可靠性,本发明中各功率变换器的驱动方式可采用“简易驱动”。In order to simplify the driving circuit 722, the cost is saved, and the reliability of the driving circuit 72 is improved. In the present invention, the driving mode of each power converter can adopt "simple driving".

图19是说明本发明驱动电路的另一种驱动方式的示意图。如图19 中所示,本实施例的模块化电源系统中每一个驱动电路721包括原边电路7211、副边电路7212和磁隔离器件(例如,隔离变压器)T 2。原边电路7211接收本地控制信号,其中本地控制信号包括驱动成分和功率成分,该本地控制信号是一个强信号,原边电路7211将本地控制信号调制成为正负窄脉冲信号Y MN,经由磁隔离器件T 2传输给副边电路7212,副边电路7212将窄脉冲信号Y MN解调成驱动信号以驱动功率半导体开关Q的导通和断开,其中该正负窄脉冲信号Y MN包括驱动逻辑脉冲以及功率脉冲,功率半导体开关Q例如包括栅极G、集电极C和发射极E,驱动信号被输出至功率半导体开关的栅极G。图19所述的驱动方式为“简易驱动”,这种“简易驱动”省去了大量的电源电路,使得驱动电路721的器件减少了很多,整个驱动电路721的结构得到简化,功耗得以减小,可靠性得到了提高。 Fig. 19 is a schematic view showing another driving mode of the driving circuit of the present invention. As shown in FIG. 19, each of the drive circuits 721 of the modular power supply system of the present embodiment includes a primary side circuit 7211, a secondary side circuit 7212, and a magnetic isolation device (for example, an isolation transformer) T 2 . The primary side circuit 7211 receives a local control signal, wherein the local control signal includes a driving component and a power component, the local control signal is a strong signal, and the primary side circuit 7211 modulates the local control signal into a positive and negative narrow pulse signal Y MN , via magnetic isolation The device T 2 is transmitted to the secondary circuit 7212, which demodulates the narrow pulse signal Y MN into a drive signal to drive the on and off of the power semiconductor switch Q, wherein the positive and negative narrow pulse signal Y MN includes drive logic Pulses and power pulses, the power semiconductor switch Q comprises, for example, a gate G, a collector C and an emitter E, the drive signal being output to the gate G of the power semiconductor switch. The driving method described in FIG. 19 is "simple driving". This "simple driving" eliminates a large number of power supply circuits, so that the device of the driving circuit 721 is reduced a lot, the structure of the entire driving circuit 721 is simplified, and power consumption is reduced. Small, reliability has been improved.

图20是本发明一个实施例的驱动电路的电路图。图20基于图19并且为图19中驱动电路的副边电路的具体化。图21是本发明一个实施例的驱动电路的时序图。如图20中所示,本发明的驱动电路主要包括磁隔离器件T 2和一个双向稳压管W,其它电阻R 11、R 12、R 13、R、R 21、R 22、R 23、栅极电容C GE、二极管D 11、D 21、稳压管W 1、W 2和开关管M 1和M 2为辅助元件,其连接关系如图20中所示。 Figure 20 is a circuit diagram of a driving circuit of one embodiment of the present invention. Figure 20 is based on Figure 19 and is an embodiment of the secondary side circuit of the drive circuit of Figure 19. Figure 21 is a timing chart of a driving circuit of one embodiment of the present invention. As shown in FIG. 20, the driving circuit of the present invention mainly comprises a magnetic isolation device T 2 and a bidirectional voltage regulator W, and other resistors R 11 , R 12 , R 13 , R, R 21 , R 22 , R 23 , gate The pole capacitance C GE , the diodes D 11 , D 21 , the Zener diodes W 1 , W 2 and the switching tubes M 1 and M 2 are auxiliary elements, the connection relationship of which is as shown in FIG.

结合图20和图21,本地控制器91发出的本地控制信号PWM经原边电路调制后形成正负脉冲信号Y MN,如图21中Y NM所示。该正负脉冲信号Y NM经磁隔离器件(例如,隔离变压器)T 2传输至副边电路,触发开关管M 1和M 2动作后向IGBT栅极电容C GE充放电,形成驱动功率半导体开关所需的驱动信号V GE,V GE的波形图基本与本地控制信号PWM相近,如图21所示。为了减小磁隔离器件即隔离变压器T 2的磁芯,且使磁芯不饱和,正负脉冲信号Y NM的刷新脉冲的宽度可能只有几 μs。以功率半导体开关Q的栅极-发射级电压V GE为正进行说明,几 μs的正脉冲一次给栅极电容C GE充的电,就可以使得驱动信号V GE达到功率半导体开关的栅极开通电压,例如+15V。然而要维持功率半导体开通导通,其需要的正脉冲可能有几十μs到上百μs甚至更长,因此,如果没有刷 新脉冲,栅极电容C GE会缓慢放电导致驱动信号V GE逐渐降低,达不到功率半导体开关正常导通所需的栅极开通电压,因此需要刷新脉冲每隔一段时间对栅极电容C GE充电以维持驱动信号V GE在正常的栅极开通电压。至于刷新脉冲的时间间隔,主要由栅极电容C GE的放电时间常数确定,原则是在下一个刷新脉冲来之前,V GE不至于下降太多,例如下一个刷新脉冲到来之前驱动信号V GE不能低于14V。 Referring to FIG. 20 and FIG. 21, the local control signal PWM sent by the local controller 91 is modulated by the primary side circuit to form a positive and negative pulse signal Y MN , as shown by Y NM in FIG. 21 . The positive and negative pulse signals Y NM are transmitted to the secondary circuit via a magnetic isolation device (for example, an isolation transformer) T 2 , and the switching transistors M 1 and M 2 are activated to charge and discharge the IGBT gate capacitance C GE to form a driving power semiconductor switch. The waveforms of the required drive signals V GE , V GE are substantially similar to the local control signals PWM, as shown in FIG. In order to reduce the magnetic core of the magnetic isolation device, that is, the isolation transformer T 2 , and to make the core unsaturated, the width of the refresh pulse of the positive and negative pulse signals Y NM may be only a few μs . Taking the gate-emitter voltage V GE of the power semiconductor switch Q as positive, the positive pulse of several μs charges the gate capacitor C GE once, so that the driving signal V GE can reach the gate of the power semiconductor switch. Turn on the voltage, for example +15V. However, to maintain the power semiconductor turn-on, the positive pulse required may be several tens of μs to hundreds of μs or even longer. Therefore, if there is no refresh pulse, the gate capacitance C GE will slowly discharge and the driving signal V GE will gradually decrease. The gate turn-on voltage required for the normal turn-on of the power semiconductor switch is not reached, so the refresh pulse is required to charge the gate capacitance C GE at intervals to maintain the drive signal V GE at the normal gate turn-on voltage. As for the refresh pulse interval, it is mainly determined by the discharge time constant of the gate capacitance C GE . The principle is that the V GE does not drop too much before the next refresh pulse. For example, the drive signal V GE cannot be low before the next refresh pulse arrives. At 14V.

图20的驱动电路接收的本地控制信号包括驱动逻辑脉冲以及功率脉冲,因而该驱动电路就不需要外接电源,也不需要对本地控制信号进行放大处理,相对于图18的驱动电路省去了大量的电源电路,使得驱动电路721的器件减少了很多,整个驱动电路721的结构得到简化,功耗得以减小,可靠性得到了提高。The local control signal received by the driving circuit of FIG. 20 includes a driving logic pulse and a power pulse, so that the driving circuit does not need an external power supply, and does not need to amplify the local control signal, which saves a lot of relative to the driving circuit of FIG. The power supply circuit reduces the number of devices of the driving circuit 721, the structure of the entire driving circuit 721 is simplified, the power consumption is reduced, and the reliability is improved.

在本发明的上述实施例中,如图6-图15所示,每一个驱动电路702可以采用图19所描述的驱动电路,磁隔离器件传输的本地控制信号中包含驱动逻辑脉冲和功率脉冲。In the above embodiment of the present invention, as shown in FIGS. 6-15, each of the driving circuits 702 may employ the driving circuit described in FIG. 19, and the local control signals transmitted by the magnetic isolation device include driving logic pulses and power pulses.

在其他实施例中,如图6-图15所示,每一个驱动电路702可以采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲。In other embodiments, as shown in FIGS. 6-15, each of the drive circuits 702 can employ the drive circuit depicted in FIG. 18, and the magnetic isolation device transmits drive logic pulses contained in the local control signals.

在本发明的上述实施例中,如图6-图15所示,一部分驱动电路702可以采用图19所描述的驱动电路,磁隔离器件T 2传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲;以及另一部分驱动电路702采用图18所描述的驱动电路,磁隔离器件T 1传输本地控制信号中包含的驱动逻辑脉冲。 In the above embodiment of the present invention, as shown in FIG. 6 to 15, a drive circuit part of the driving circuit 702 described in FIG. 19 may be employed, and the power drive logic pulse magnetically isolated pulse T 2 is transferred to local control device included in the signal ; and another part of the driver circuit of the driving circuit 702 described in FIG. 18, magnetic isolation local transmission device T 1 controls the drive pulse signal included in the logic.

在本发明的上述实施例中,如图17所示,驱动电路721可以采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲以及功率脉冲;以及驱动电路722采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲。In the above embodiment of the present invention, as shown in FIG. 17, the driving circuit 721 can employ the driving circuit described in FIG. 19, the magnetic isolation device transmits the driving logic pulse and the power pulse included in the local control signal; and the driving circuit 722 adopts The drive circuit depicted in Figure 18, the magnetic isolation device transmits drive logic pulses contained in the local control signal.

在本发明的上述实施例中,如图17所示,驱动电路722可以采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲以及功率脉冲;以及驱动电路721采用图18所描述的驱动电路,磁 隔离器件传输本地控制信号中包含的驱动逻辑脉冲。In the above embodiment of the present invention, as shown in FIG. 17, the driving circuit 722 can adopt the driving circuit described in FIG. 19, the magnetic isolation device transmits the driving logic pulse and the power pulse included in the local control signal; and the driving circuit 721 adopts The drive circuit depicted in Figure 18, the magnetic isolation device transmits drive logic pulses contained in the local control signal.

图22是本发明另一个实施例的模块化电源系统的方框图。如图22中所示,本实施例的模块化电源系统中的每一个功率单元70中的M个功率变换器701中有一个为主功率变换器7012,其余M-1个为从功率变换器7011,其中主功率变换器7012和从功率变换器7011的拓扑结构相同,均可以采用图7-图15所述的功率变换器其中的一种,或者主功率变换器7012和从功率变换器7011的拓扑结构不相同,主功率变换器可以采用图7-图15所述的功率变换器其中的一种,从功率变换器可以采用图7-图15所述的功率变换器其中的另一种。相应地,M个驱动电路中有一个为主驱动电路722,其余M-1个为从驱动电路721,主驱动电路722被配置为驱动对应的主功率变换器7012中的功率半导体开关导通和断开,每一个从驱动电路721被配置为驱动对应的从功率变换器7011中的功率半导体开关的导通和断开。Figure 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 22, one of the M power converters 701 in each power unit 70 in the modular power supply system of the present embodiment is a main power converter 7012, and the remaining M-1 are slave power converters. 7011, wherein the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-15 may be used, or the main power converter 7012 and the slave power converter 7011. The topology is different. The main power converter can adopt one of the power converters described in FIG. 7 to FIG. 15. The power converter can adopt another of the power converters described in FIG. 7 to FIG. . Correspondingly, one of the M driving circuits is the main driving circuit 722, and the remaining M-1 are the slave driving circuit 721, and the main driving circuit 722 is configured to drive the power semiconductor switch in the corresponding main power converter 7012 to be turned on and Disconnected, each slave drive circuit 721 is configured to drive the turn-on and turn-off of the power semiconductor switches in the corresponding slave power converter 7011.

作为一个实施例,在如图22中所示的模块化电源系统中,主驱动电路722不同于从驱动电路721,主驱动电路722采用图18所描述的驱动电路,磁隔离器件仅传输本地控制信号中包含的驱动逻辑脉冲;以及每一个从驱动电路721采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As an embodiment, in the modular power supply system as shown in FIG. 22, the main drive circuit 722 is different from the slave drive circuit 721, and the main drive circuit 722 employs the drive circuit described in FIG. 18, and the magnetic isolation device transmits only local control. The drive logic pulses included in the signal; and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 19, the magnetic isolation device transmitting drive logic pulses and power pulses contained in the local control signals.

作为另一个实施例,主驱动电路722不同于从驱动电路721,每一个从驱动电路721采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲;以及主驱动电路722采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As another embodiment, the main driving circuit 722 is different from the slave driving circuit 721, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulses included in the local control signal; and the main driving circuit 722 employs the drive circuit depicted in Figure 19, which transmits drive logic pulses and power pulses contained in the local control signals.

作为又一个实施例,主驱动电路722与从驱动电路721相同,主驱动电路722和从驱动电路721均采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲;或者主驱动电路722和从驱动电路721均采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As a further embodiment, the main driving circuit 722 is the same as the slave driving circuit 721, and the main driving circuit 722 and the slave driving circuit 721 both adopt the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulse included in the local control signal; Alternatively, the main drive circuit 722 and the slave drive circuit 721 both employ the drive circuit described in FIG. 19, and the magnetic isolation device transmits drive logic pulses and power pulses contained in the local control signal.

在本实施例中,当主功率变换器7012和从功率变换器7011的拓扑 结构相同时,且主功率变换器7012在功率单元70中居中,从功率变换器7011分别分布于主功率变换器7012的两侧。主功率变换器7012所对应的本地控制信号独立于从功率变换器7011所对应的本地控制信号,亦即,主功率变换器7012被独立控制,从功率变换器7011被共同控制,例如采用共用驱动方式,因而从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,主功率变换器7012与从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号不为同一个。In the present embodiment, when the topologies of the main power converter 7012 and the slave power converter 7011 are the same, and the main power converter 7012 is centered in the power unit 70, the slave power converters 7011 are respectively distributed to the main power converter 7012. On both sides. The local control signal corresponding to the main power converter 7012 is independent of the local control signal corresponding to the slave power converter 7011, that is, the main power converter 7012 is independently controlled, and the slave power converter 7011 is commonly controlled, for example, by using a common driver. Thus, the local control signals corresponding to the power semiconductor switches at the same location in the power converter 7011 are the same, and the main power converter 7012 is locally controlled corresponding to the power semiconductor switches at the same location from the power converter 7011. The signals are not the same.

在其它实施例中,主功率变换器7012和从功率变换器7011被共同控制,例如采用共用驱动方式,主功率变换器7012和从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个。In other embodiments, the main power converter 7012 and the slave power converter 7011 are jointly controlled, for example, using a common drive mode, the main power converter 7012 and the corresponding local power transformer switch at the same position in the power converter 7011. The control signals are the same.

图23是本发明另一个实施例的模块化电源系统的方框图。如图23中所示,本实施例的模块化电源系统中的每一个功率单元70中的M个功率变换器701中有至少一个为主功率变换器7012,并且至少一个为从功率变换器7011,其中主功率变换器7012和从功率变换器7011的拓扑结构相同,均可以采用图7-图15所述的功率变换器其中的一种,或者主功率变换器7012和从功率变换器7011的拓扑结构不相同,主功率变换器可以采用图7-图15所述的功率变换器其中的一种,从功率变换器可以采用图7-图15所述的功率变换器其中的另一种。相应地,M个驱动电路中有至少一个为主驱动电路722,并且至少一个为从驱动电路721,每一个主驱动电路722被配置为驱动对应的主功率变换器7012中的功率半导体开关导通和断开,每一个从驱动电路721被配置为驱动对应的从功率变换器7011中的功率半导体开关的导通和断开。23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 23, at least one of the M power converters 701 in each of the power units 70 in the modular power supply system of the present embodiment is a master power converter 7012, and at least one is a slave power converter 7011. Where the main power converter 7012 and the slave power converter 7011 have the same topology, one of the power converters described in FIGS. 7-15, or the main power converter 7012 and the slave power converter 7011 The topology is different, and the main power converter can employ one of the power converters described in Figures 7-15, and the slave power converter can employ another of the power converters described in Figures 7-15. Accordingly, at least one of the M driving circuits is the main driving circuit 722, and at least one is the slave driving circuit 721, and each of the main driving circuits 722 is configured to drive the power semiconductor switches in the corresponding main power converter 7012 to be turned on. And disconnected, each slave drive circuit 721 is configured to drive the turn-on and turn-off of the power semiconductor switches in the corresponding slave power converter 7011.

作为一个实施例,在如图23中所示的模块化电源系统中,主驱动电路722不同于从驱动电路721,每一个主驱动电路722采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲;以及每一个从驱动电路721采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As an embodiment, in the modular power supply system as shown in FIG. 23, the main drive circuit 722 is different from the slave drive circuit 721, and each of the main drive circuits 722 employs the drive circuit described in FIG. The drive logic pulses included in the control signal; and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 19, the magnetic isolation device transmitting drive logic pulses and power pulses contained in the local control signals.

作为另一个实施例,主驱动电路722不同于从驱动电路721,每一个 从驱动电路721采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲;以及每一个主驱动电路722采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As another embodiment, the main driving circuit 722 is different from the slave driving circuit 721, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the driving logic pulses included in the local control signal; and each main The drive circuit 722 employs the drive circuit depicted in FIG. 19, which transmits drive logic pulses and power pulses contained in the local control signals.

作为又一个实施例,主驱动电路722与从驱动电路721相同,每一个主驱动电路722和每一个从驱动电路721均采用图18所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲;或者每一个主驱动电路722和每一个从驱动电路721均采用图19所描述的驱动电路,磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲。As still another embodiment, the main driving circuit 722 is the same as the slave driving circuit 721, and each of the main driving circuit 722 and each of the slave driving circuits 721 adopts the driving circuit described in FIG. 18, and the magnetic isolation device transmits the local control signal. The logic pulses are driven; or each of the main drive circuit 722 and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 19, the magnetic isolation device transmitting drive logic pulses and power pulses contained in the local control signals.

在本实施例中,当主功率变换器7012和从功率变换器7011的拓扑结构相同时,每一个主驱动电路722与每一个从驱动电路721相同,每一个主功率变换器7012和每一个从功率变换器7011被共同控制,例如采用共用驱动方式,每一个主功率变换器7012和每一个从功率变换器7011相同位置处的功率半导体开关所对应的本地控制信号为同一个。在其它实施例中,主驱动电路722与从驱动电路721可以相同或者不相同,主功率变换器7012所对应的本地控制信号独立于从功率变换器7011所对应的本地控制信号,亦即,主功率变换器7012被独立控制,从功率变换器7011被共同控制,例如采用共用驱动方式,因而从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,主功率变换器7012与从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号不为同一个。In the present embodiment, when the topologies of the main power converter 7012 and the slave power converter 7011 are the same, each of the main driving circuits 722 is identical to each of the slave driving circuits 721, and each of the main power converters 7012 and each of the slave powers The converters 7011 are controlled in common, for example, by a common drive mode, and each of the main power converters 7012 and the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same. In other embodiments, the main driving circuit 722 and the slave driving circuit 721 may be the same or different, and the local control signal corresponding to the main power converter 7012 is independent of the local control signal corresponding to the slave power converter 7011, that is, the main The power converter 7012 is independently controlled, and is controlled by the power converter 7011 in common, for example, using a common driving mode, so that the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same, the main power conversion The local control signal corresponding to the power semiconductor switch at the same location from the power converter 7011 is not the same.

图24是本发明另一个实施例的模块化电源系统的方框图。如图24中所示,在本实施例的模块化电源系统中的每一个功率单元70中,主功率变换器7012和从功率变换器7011的数量均为2个以上。每一个主功率变换器7012和从功率变换器7011的拓扑结构相同,均可以采用图7-图14所述的功率变换器其中一种,而且主驱动电路722与从驱动电路721可以相同,驱动方式都采用了前述的“简易驱动”,如前述图19所描述的内容,即每一个主驱动电路722的磁隔离器件以及每一个从驱动电路721的磁隔离器件都传输本地控制信号中包含的驱动逻辑脉冲和功率脉 冲;或者每一个主驱动电路722的磁隔离器件以及每一个从驱动电路721均采用图18所描述的驱动电路,主磁隔离器件和从磁隔离器件均传输本地控制信号中包含的驱动逻辑脉冲。Figure 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 24, in each of the power units 70 in the modular power supply system of the present embodiment, the number of the main power converter 7012 and the slave power converter 7011 is two or more. Each of the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-14 can be used, and the main drive circuit 722 and the slave drive circuit 721 can be driven in the same manner. The method adopts the aforementioned "simple drive", as described in the foregoing FIG. 19, that is, the magnetic isolation device of each main drive circuit 722 and each of the magnetic isolation devices from the drive circuit 721 transmit the local control signals contained therein. Driving the logic pulse and the power pulse; or each of the magnetic isolation devices of the main drive circuit 722 and each of the slave drive circuits 721 adopt the drive circuit described in FIG. 18, and the main magnetic isolation device and the slave magnetic isolation device both transmit local control signals. Contains drive logic pulses.

作为另一个实施例,每一个主功率变换器7012和从功率变换器7011的拓扑结构相同,均可以采用图7-图14所述的功率变换器其中一种,主驱动电路722与从驱动电路721可以不相同,每一个主驱动电路722采用图18所描述的驱动电路,主磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲,而每一个从驱动电路721采用图19所描述的驱动电路,从磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者每一个主驱动电路722采用图19所描述的驱动电路,主磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲和功率脉冲,而每一个从驱动电路721采用图18所描述的驱动电路,从磁隔离器件传输本地控制信号中包含的驱动逻辑脉冲。As another embodiment, each of the main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 7-14 can be used, the main driving circuit 722 and the slave driving circuit. 721 may be different, each main driving circuit 722 adopts the driving circuit described in FIG. 18, the main magnetic isolating device transmits driving logic pulses included in the local control signal, and each of the slave driving circuits 721 adopts the driving circuit described in FIG. Transmitting a drive logic pulse and a power pulse contained in the local control signal from the magnetic isolation device; or each of the main drive circuit 722 adopts the drive circuit described in FIG. 19, and the main magnetic isolation device transmits the drive logic pulse included in the local control signal and The power pulses, and each of the slave drive circuits 721 employs the drive circuit depicted in FIG. 18 to transfer the drive logic pulses contained in the local control signals from the magnetic isolation device.

在本实施例中,当主功率变换器7012和从功率变换器7011的拓扑结构相同时,每一个主功率变换器7012所对应的本地控制信号相互独立且都独立于从功率变换器7011所对应的本地控制信号,亦即,每一个主功率变换器7012均被独立控制,每一个从功率变换器7011均采用共用驱动方式,因而从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个主功率变换器7012与2个以上从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号不为同一个。In the present embodiment, when the topology of the main power converter 7012 and the slave power converter 7011 are the same, the local control signals corresponding to each of the main power converters 7012 are independent of each other and independent of the corresponding power converter 7011. The local control signals, that is, each of the main power converters 7012 are independently controlled, each of the slave power converters 7011 adopts a common driving mode, and thus the local corresponding to the power semiconductor switches at the same position in the power converter 7011 The control signals are the same, and each of the main power converters 7012 and the two local control signals corresponding to the power semiconductor switches at the same position in the power converter 7011 are not the same.

作为一个实施例,当主功率变换器7012和从功率变换器7011的拓扑结构相同时,每一个主功率变换器7012所对应的本地控制信号为同一个,每一个从功率变换器7011所对应的本地控制信号是同一个,且主功率变换器7012与从功率变换器7011所对应的本地控制信号不是同一个,亦即,每一个主功率变换器7012采用共同驱动方式,每一个从功率变换器7011也采用共同驱动方式,因而每一个主功率变换器7012中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同 一个。As an embodiment, when the topologies of the main power converter 7012 and the slave power converter 7011 are the same, the local control signals corresponding to each of the main power converters 7012 are the same, each corresponding to the local corresponding to the power converter 7011. The control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same, that is, each main power converter 7012 adopts a common driving mode, and each slave power converter 7011 The common driving mode is also adopted, so that the local control signals corresponding to the power semiconductor switches at the same position in each main power converter 7012 are the same, each corresponding to the power semiconductor switch at the same position in the power converter 7011. The local control signals are the same.

作为另一个实施例,当主功率变换器7012和从功率变换器7011的拓扑结构相同时,每一个主功率变换器7012和每一个从功率变换器7011所对应的本地控制信号是同一个,亦即,每一个主功率变换器7012和每一个从功率变换器7011均采用共用驱动方式,主功率变换器7012和从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个。As another embodiment, when the topologies of the main power converter 7012 and the slave power converter 7011 are the same, each of the main power converters 7012 and the local control signals corresponding to each of the slave power converters 7011 are the same, that is, Each of the main power converters 7012 and each of the slave power converters 7011 adopts a common driving mode, and the local power converter 7012 and the local control signals corresponding to the power semiconductor switches at the same position from the power converter 7011 are the same. .

在作为另一个实施例,当主功率变换器7012和从功率变换器7011的拓扑结构不相同时,每一个主功率变换器7012所对应的本地控制信号相互独立且都独立于从功率变换器7011所对应的本地控制信号,亦即,每一个主功率变换器7012均被独立控制,每一个从功率变换器7011均采用共用驱动方式,因而从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个主功率变换器7012与2个以上从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号不为同一个。In another embodiment, when the topology of the main power converter 7012 and the slave power converter 7011 are different, the local control signals corresponding to each of the main power converters 7012 are independent of each other and are independent of the slave power converter 7011. Corresponding local control signals, that is, each main power converter 7012 is independently controlled, and each slave power converter 7011 adopts a common driving mode, and thus corresponds to a power semiconductor switch at the same position in the power converter 7011. The local control signals are the same, and each of the main power converters 7012 and the two local control signals corresponding to the power semiconductor switches at the same position in the power converter 7011 are not the same.

作为另一个实施例,当主功率变换器7012和从功率变换器7011的拓扑结构不相同时,每一个主功率变换器7012所对应的本地控制信号为同一个,每一个从功率变换器7011所对应的本地控制信号是同一个,且主功率变换器7012与从功率变换器7011所对应的本地控制信号不是同一个,亦即,每一个主功率变换器7012采用共同驱动方式,每一个从功率变换器7011也采用共同驱动方式,因而每一个主功率变换器7012中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个。As another embodiment, when the topology of the main power converter 7012 and the slave power converter 7011 are different, the local control signals corresponding to each of the main power converters 7012 are the same, each corresponding to the power converter 7011. The local control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same, that is, each main power converter 7012 adopts a common driving mode, and each slave power conversion The controller 7011 also adopts a common driving manner, so that the local control signals corresponding to the power semiconductor switches at the same position in each main power converter 7012 are the same, each power semiconductor switch at the same position from the power converter 7011. The corresponding local control signals are the same.

图25是本发明另一个实施例的模块化电源系统的方框图。图25是对图23的进一步描述,在图23中已经描述的内容,这里不再赘述。如图25所示,本实施例的模块化电源系统中每一个所述功率单元70可以还包括:多个直流母线电压钳位电路703,与前述的采用共同驱动方式的功率变换器701一一对应,其中每一个直流母线电压钳位电路703被 配置为与对应的功率变换器701的直流母线电容并联,以使对应的功率变换器701的直流母线电压不超过预设值。也就是说,本发明在模块化电源系统中每一个所述功率单元70中功率变换器701中加入了直流母线电压控制环节。为了确保功率变换器701可靠运行,需要把功率变换器701中的母线电压控制在合适的范围内。该母线电压控制方式可以通过硬件实现,也可以通过软件实现。Figure 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 25 is a further description of Figure 23, which has been described in Figure 23 and will not be described again. As shown in FIG. 25, each of the power units 70 in the modular power supply system of this embodiment may further include: a plurality of DC bus voltage clamping circuits 703, and the foregoing power converter 701 adopting a common driving mode. Correspondingly, each of the DC bus voltage clamping circuits 703 is configured to be in parallel with the DC bus capacitance of the corresponding power converter 701 such that the DC bus voltage of the corresponding power converter 701 does not exceed a preset value. That is, the present invention incorporates a DC bus voltage control link in the power converter 701 of each of the power units 70 in the modular power system. In order to ensure reliable operation of the power converter 701, it is necessary to control the bus voltage in the power converter 701 within an appropriate range. The bus voltage control mode can be implemented by hardware or by software.

在本实施例中,当每一个从功率变换器7011均采用共用驱动方式时,亦即,每一个从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个从功率变换器7011的直流母线电容上都并联一个直流母线电压钳位电路703。In this embodiment, when each of the slave power converters 7011 adopts a common driving mode, that is, the local control signals corresponding to the power semiconductor switches at the same position in the power converter 7011 are the same, each A DC bus voltage clamp circuit 703 is connected in parallel to the DC bus capacitor of the power converter 7011.

作为一个实施例,当每一个主功率变换器7012和每一个从功率变换器7011均采用共用驱动方式时,亦即,每一个主功率变换器7012和每一个从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个主功率变换器7012和每一个从功率变换器7011的直流母线电容上都并联一个直流母线电压钳位电路703。As an embodiment, when each of the main power converters 7012 and each of the slave power converters 7011 employs a common drive mode, that is, each of the main power converters 7012 and each of the slave power converters 7011 are at the same position. The local control signals corresponding to the power semiconductor switches are the same, and each of the main power converters 7012 and each of the DC bus capacitors of the power converter 7011 are connected in parallel with a DC bus voltage clamp circuit 703.

作为一个实施例,当每一个主功率变换器7012中相同位置处的功率半导体开关所对应的本地控制信号为同一个,每一个从功率变换器7011中相同位置处的功率半导体开关所对应的本地控制信号为同一个,且主功率变换器7012与从功率变换器7011所对应的本地控制信号不是同一个,每一个主功率变换器7012的直流母线电容上都并联一个直流母线电压钳位电路,而每一个从功率变换器7011的直流母线电容上都并联一个直流母线电压钳位电路,可以与主功率变换器的直流母线电容上并联的直流母线电压钳位电路相同或者不同。As an embodiment, the local control signals corresponding to the power semiconductor switches at the same location in each of the main power converters 7012 are the same, each corresponding to the local power semiconductor switch at the same location in the power converter 7011. The control signals are the same, and the main power converter 7012 and the local control signal corresponding to the slave power converter 7011 are not the same. Each DC power bus capacitor of the main power converter 7012 is connected in parallel with a DC bus voltage clamp circuit. Each DC bus voltage clamp circuit is connected in parallel with the DC bus capacitor of the power converter 7011, which can be the same as or different from the DC bus voltage clamp circuit connected in parallel with the DC bus capacitor of the main power converter.

如图25中所示,该直流母线电压钳位电路703由硬件实现,用以控制各直流母线电容C B两端的电压不超过预设值。 As shown in FIG. 25, the DC bus voltage clamping circuit 703 is implemented by hardware to control the voltage across the DC bus capacitor C B not to exceed a preset value.

当直流母线电压钳位电路703应用于如图7、图8和图12-图14的模块化电源系统中,直流母线电压钳位电路703连接于对应的功率变换器701的直流母线电容C B的一端和另一端之间,而如图9-图11和图15,直流母线电压钳位电路703连接在对应的功率变换器701的直流母线电 容C 1的一端和直流母线电容C 2的另一端之间,以使对应的功率变换器701的直流母线电压不超过预设值,其中直流母线电压钳位电路703由硬件实现。 When the DC bus voltage clamp circuit 703 is applied to the modular power supply system as shown in FIGS. 7, 8, and 12-14, the DC bus voltage clamp circuit 703 is connected to the DC bus capacitor C B of the corresponding power converter 701. between the one end and the other end, while FIG. 9-11 and FIG. 15, the DC bus voltage clamping circuit 703 is connected to the power converter 701 corresponding to an end of the DC bus capacitor C 1 and another capacitor C DC bus 2 Between one end, so that the DC bus voltage of the corresponding power converter 701 does not exceed a preset value, wherein the DC bus voltage clamping circuit 703 is implemented by hardware.

图26是本发明另一个实施例的模块化电源系统的方框图。图26是对图22的进一步描述,在图22中已经描述的内容,这里不再赘述。如图26中所示,本实施例的模块化电源系统中每一个所述功率单元可以还包括:M-1个直流母线电压钳位电路703,与前述的M-1个从功率变换器7011一一对应,其中每一个直流母线电压钳位电路703被配置为与对应的从功率变换器7011的直流母线并联,以使得对应的从功率变换器7011的直流母线电压不超过预设值。Figure 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. FIG. 26 is a further description of FIG. 22, which has been described in FIG. 22, and will not be described again. As shown in FIG. 26, each of the power units in the modular power supply system of this embodiment may further include: M-1 DC bus voltage clamping circuits 703, and the aforementioned M-1 slave power converters 7011. One-to-one correspondence, wherein each of the DC bus voltage clamping circuits 703 is configured to be in parallel with the corresponding DC bus of the power converter 7011 such that the DC bus voltage of the corresponding slave power converter 7011 does not exceed a preset value.

除了使用直流母线电压钳位电路703,本发明还提供了动态调节方式的直流母线电压控制。如图26中所示,功率单元70内包含5个级联的基于H桥电路的功率变换器,需要说明的是,功率单元70中功率变换器的拓扑结构也可以是图7-图15所述的拓扑结构。中间的功率变换器7012独立控制。具体地,将通过检测获得的功率变换器7012的直流母线电压与预设值比较。如果该直流母线电压高于预设值,则本地控制器91输出本地控制信号以控制功率变换器7012的H桥电路的功率半导体开关导通或断开,使其直流母线电容C B放电,如果该直流母线电压低于预设值,则本地控制器91输出本地控制信号以控制功率变换器7012的H桥电路的功率半导体开关导通或断开,使其直流母线电容C B充电,从而使得该直流母线电压被控制在合理的范围内。 In addition to using the DC bus voltage clamp circuit 703, the present invention also provides DC bus voltage control in a dynamically regulated manner. As shown in FIG. 26, the power unit 70 includes five cascaded H-bridge circuit-based power converters. It should be noted that the topology of the power converter in the power unit 70 can also be as shown in FIG. 7-15. The topology described. The intermediate power converter 7012 is independently controlled. Specifically, the DC bus voltage of the power converter 7012 obtained by the detection is compared with a preset value. If the DC bus voltage is higher than a preset value, the local controller 91 outputs a local control signal to control the power semiconductor switch of the H-bridge circuit of the power converter 7012 to be turned on or off to discharge its DC bus capacitor C B if The DC bus voltage is lower than a preset value, and the local controller 91 outputs a local control signal to control the power semiconductor switch of the H-bridge circuit of the power converter 7012 to be turned on or off to charge its DC bus capacitor C B , thereby making The DC bus voltage is controlled within a reasonable range.

如图26中所示,共4个从功率变换器7011分别分布于主功率变换器7012的两侧,其中4个从功率变换器则可以采用前述的共用驱动方式。各H桥电路中相同位置处的功率半导体开关由同一本地控制信号对应的驱动信号来控制。在实际应用中,由于器件存在离散性,由同一个本地控制信号控制的各功率半导体开关并不能真正实现同时导通和同时断开,且直流母线电容也会存在离散性,导致各直流母线电压会产生差异。本发明在采用共用驱动的各个从功率变换器的直流母线电容C B两侧并联直流母线电压钳位电路703后,可将各直流母线电容C B两端的电压 限制在预设值内,可保证系统稳定可靠地运行。 As shown in FIG. 26, a total of four slave power converters 7011 are respectively distributed on both sides of the main power converter 7012, and four of the slave power converters can adopt the aforementioned common driving mode. The power semiconductor switches at the same location in each H-bridge circuit are controlled by drive signals corresponding to the same local control signal. In practical applications, due to the discreteness of the device, each power semiconductor switch controlled by the same local control signal cannot truly achieve simultaneous conduction and simultaneous disconnection, and the DC bus capacitance also has discreteness, resulting in DC bus voltages. There will be differences. After the DC bus voltage clamping circuit 703 is connected in parallel with the DC bus capacitor C B of each of the slave power converters of the shared driving, the voltage of each DC bus capacitor C B can be limited to a preset value, which can be guaranteed. The system operates reliably and reliably.

图27是本发明一个实施例的钳位电路的电路图。如图27中所示,本实施例的模块化电源系统中每一个直流母线电压钳位电路703包括:开关K、电阻R和开关控制电路W C。其中开关K与电阻R形成串联支路,该串联支路与对应的功率变换器701的直流母线并联。开关控制电路W C连接开关K的控制端。当功率变换器701的直流母线电压超过预设值时,开关控制电路W C输出开关控制信号以导通开关K,使得功率变换器701的直流母线通过该串联支路放电。 Figure 27 is a circuit diagram of a clamp circuit in accordance with one embodiment of the present invention. As shown in FIG. 27, each of the DC bus voltage clamping circuits 703 in the modular power supply system of the present embodiment includes a switch K, a resistor R, and a switch control circuit W C . The switch K and the resistor R form a series branch, which is connected in parallel with the DC bus of the corresponding power converter 701. The switch control circuit W C is connected to the control terminal of the switch K. When the DC bus voltage of the power converter 701 exceeds a preset value, the switch control circuit W C outputs a switch control signal to turn on the switch K such that the DC bus of the power converter 701 is discharged through the series branch.

在图27中,开关控制电路W C采用了一个瞬态抑制二极管(TVS管)。TVS管与一个二极管D串联连接后一端连接于直流母线的一端,另一端连接于开关的控制端,其中二极管D起反向保护作用。当功率变换器701的直流母线电压超过该TVS管的击穿值以后,控制可控开关K导通,使直流母线电容C B上的直流母线电压经过与可控开关K串联的电阻R进行放电。直至该直流母线电压降至该TVS管的击穿值以下,该TVS管恢复截止状态,可控开关K断开,直流母线电容C B放电结束。因此,该直流母线电压钳位电路703可将功率变换器701的直流母线电容的电压限制在预设值即该TVS击穿值以下。 In Fig. 27, the switch control circuit W C employs a transient suppression diode (TVS tube). The TVS tube is connected in series with a diode D. One end is connected to one end of the DC bus, and the other end is connected to the control end of the switch, wherein the diode D acts as a reverse protection. After the DC bus voltage of the power converter 701 exceeds the breakdown value of the TVS tube, the controllable switch K is turned on, so that the DC bus voltage on the DC bus capacitor C B is discharged through the resistor R connected in series with the controllable switch K. . Until the DC bus voltage drops below the breakdown value of the TVS tube, the TVS tube returns to the off state, the controllable switch K is turned off, and the DC bus capacitor C B is discharged. Therefore, the DC bus voltage clamping circuit 703 can limit the voltage of the DC bus capacitor of the power converter 701 to a preset value, that is, below the TVS breakdown value.

图28是本发明另一个实施例的模块化电源系统的方框图。如图28中所示,本实施例的模块化电源系统中每一个辅助电源93可以被配置为从外部电源取电,每一个辅助电源93连接外部电源E C,例如从市电取电或者外部电路取电,或者本实施例的模块化电源系统中的前述N个辅助电源93与前述N个功率单元70一一对应,每一个辅助电源93可以被配置为从对应的功率单元70取电,或者本实施例的模块化电源系统中的每一个辅助电源93可以被配置为从对应的功率单元70中的任一个功率变换器701的直流母线电容C B1取电,以获取直流母线电容C B1上的直流母线电压,或者本实施例的模块化电源系统中的一部分辅助电源93可以被配置为从外部电源取电,另一部分辅助电源93可以被配置为从对应的功率单元70中的任一个功率变换器701的直流母线电容C B1取电,以获取直流母线电容C B1上的直流母线电压。 28 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 28, each of the auxiliary power sources 93 in the modular power supply system of the present embodiment can be configured to take power from an external power source, and each of the auxiliary power sources 93 is connected to an external power source E C , for example, from a commercial power source or an external power source. The circuit is powered, or the N auxiliary power sources 93 in the modular power system of the embodiment are in one-to-one correspondence with the N power units 70, and each of the auxiliary power sources 93 can be configured to take power from the corresponding power unit 70. Or each of the auxiliary power sources 93 of the modular power supply system of the present embodiment may be configured to take power from the DC bus capacitor C B1 of any one of the corresponding power units 70 to obtain a DC bus capacitor C B1 . The DC bus voltage on, or a portion of the auxiliary power source 93 in the modular power system of the present embodiment, may be configured to draw power from an external power source, and another portion of the auxiliary power source 93 may be configured to be from any of the corresponding power units 70. The DC bus capacitor C B1 of the power converter 701 is energized to obtain the DC bus voltage on the DC bus capacitor C B1 .

本发明通过将多个功率变换器组成一个功率单元,利用一套本地控制器、光纤、辅助电源控制多个功率变换器的方法,可大大减少本地控制器、光纤、辅助电源的数量,简化结构设计,降低成本,提高可靠性。The invention can reduce the number of local controllers, optical fibers and auxiliary power sources by simplifying the structure by forming a plurality of power converters into one power unit and using a local controller, an optical fiber, and an auxiliary power source to control multiple power converters. Design, reduce costs and improve reliability.

本发明通过让功率单元中各功率变换器相同位置处的功率半导体开关共用一个本地控制信号,可简化控制电路。The present invention simplifies the control circuit by sharing the power semiconductor switches at the same location of the power converters in the power unit with a local control signal.

本发明适用于所有AC/DC、DC/AC、DC/DC功率变换器连接的拓扑结构,应用广泛。The invention is applicable to the topology of all AC/DC, DC/AC, DC/DC power converter connections and is widely used.

以上具体地示出和描述了本发明的示例性实施例。应可理解的是,本发明不限于这里描述的详细结构、设置方式或实现方法;相反,本发明意图涵盖包含在所附权利要求的精神和范围内的各种修改和等效设置。最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。The exemplary embodiments of the present invention have been particularly shown and described above. It is to be understood that the invention is not limited to the details of the details of the embodiments of the invention. Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims (26)

一种模块化电源系统,被配置为包括:A modular power system configured to include: 一个主控制器,被配置为输出主控制信号;a main controller configured to output a main control signal; N个本地控制器,其中每一个所述本地控制器被配置为接收所述主控制信号,以输出至少一个本地控制信号;以及N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal; N个功率单元,与所述N个本地控制器一一对应,其中每一个所述功率单元包括第一端和第二端,每一个所述功率单元的所述第二端连接到相邻的一个所述功率单元的所述第一端,每一个所述功率单元被配置为包括M个功率变换器,其中每一个所述功率变换器包括第三端和第四端,每一个所述功率变换器的所述第四端连接到相邻的一个所述功率变换器的所述第三端,且第一个所述功率变换器的所述第三端为所述功率单元的所述第一端,第M个所述功率变换器的所述第四端为所述功率单元的所述第二端,每一个所述功率变换器被配置为根据对应的所述本地控制器输出的所述本地控制信号运行,其中N和M均为大于1的自然数,其中控制所述M个功率变换器中至少2个功率变换器中相同位置的功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。N power units, one-to-one corresponding to the N local controllers, wherein each of the power units includes a first end and a second end, and the second end of each of the power units is connected to an adjacent one The first end of one of the power units, each of the power units being configured to include M power converters, wherein each of the power converters includes a third end and a fourth end, each of the power The fourth end of the converter is coupled to the third end of an adjacent one of the power converters, and the third end of the first one of the power converters is the first of the power units And at one end, the fourth end of the Mth power converter is the second end of the power unit, and each of the power converters is configured to be output according to a corresponding local controller The local control signal operates, wherein N and M are both natural numbers greater than 1, wherein the power semiconductor switches controlling the same position in at least two of the M power converters are simultaneously turned on and simultaneously turned off The local control signals are the same. 根据权利要求1所述的模块化电源系统,被配置为还包括:The modular power supply system of claim 1 configured to further include: N个辅助电源,与所述N个本地控制器一一对应,其中每一个所述辅助电源被配置为给对应的所述本地控制器提供电源。N auxiliary power sources are in one-to-one correspondence with the N local controllers, wherein each of the auxiliary power sources is configured to provide power to a corresponding local controller. 根据权利要求2所述的模块化电源系统,其中所述N个辅助电源被配置为从外部电源取电,或者从对应的所述功率单元取电。The modular power supply system of claim 2 wherein said N auxiliary power sources are configured to draw power from an external power source or to draw power from a corresponding one of said power units. 根据权利要求1所述的模块化电源系统,其中所述功率变换器为AC/DC变换器、DC/AC变换器和DC/DC变换器中的任何一种。The modular power supply system of claim 1 wherein said power converter is any one of an AC/DC converter, a DC/AC converter, and a DC/DC converter. 根据权利要求1所述的模块化电源系统,其中所述M个功率变换器的拓扑结构为全部相同,或部分相同。The modular power system of claim 1 wherein the topologies of said M power converters are all identical or partially identical. 根据权利要求5所述的模块化电源系统,其中每一个所述功率单元中的所述M个功率变换器的拓扑结构全部为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平 变换器、全桥谐振变换器和半桥谐振变换器中的一种。The modular power supply system according to claim 5, wherein the topology of the M power converters in each of the power units is a full bridge converter, a half bridge converter, and a neutral point controllable three One of a flat converter, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. 根据权利要求5所述的模块化电源系统,其中每一个所述功率单元中的所述M个功率变换器的拓扑结构为全桥变换器、半桥变换器、中性点可控三电平变换器、二极管钳位三电平变换器、飞跨电容三电平变换器、全桥谐振变换器和半桥谐振变换器中的两种或两种以上的组合。The modular power supply system according to claim 5, wherein the topology of said M power converters in each of said power units is a full bridge converter, a half bridge converter, and a neutral point controllable three level A combination of two or more of a converter, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. 根据权利要求5所述的模块化电源系统,其中每一个所述功率单元还包括:The modular power supply system of claim 5 wherein each of said power units further comprises: M个驱动电路,与所述M个功率变换器一一对应,其中每一个所述驱动电路被配置为连接于对应的所述功率变换器的功率半导体开关,接收对应的所述本地控制器输出的所述本地控制信号,以输出至少一个驱动信号来驱动对应的所述M个功率变换器中的所述功率半导体开关的导通和断开。M driving circuits, one-to-one corresponding to the M power converters, wherein each of the driving circuits is configured to be connected to a corresponding power semiconductor switch of the power converter, and receive a corresponding output of the local controller The local control signal outputs at least one driving signal to drive the turning on and off of the power semiconductor switch in the corresponding M power converters. 根据权利要求5所述的模块化电源系统,其中每一个所述功率单元还包括:The modular power supply system of claim 5 wherein each of said power units further comprises: 多个驱动电路,其中所述多个驱动电路的数量等于所述功率单元中功率半导体开关的数量,每一个所述驱动电路被配置为连接于对应的所述功率变换器的所述功率半导体开关,接收对应的所述本地控制器输出的本地控制信号,以输出驱动信号来驱动对应的所述功率半导体开关的导通和断开。a plurality of drive circuits, wherein the number of the plurality of drive circuits is equal to the number of power semiconductor switches in the power unit, each of the drive circuits being configured to be coupled to the corresponding power semiconductor switch of the power converter Receiving a corresponding local control signal output by the local controller to output a driving signal to drive the corresponding on and off of the power semiconductor switch. 根据权利要求8或9所述的模块化电源系统,其中各所述驱动电路为彼此相同或彼此不相同。A modular power supply system according to claim 8 or 9, wherein each of said drive circuits is identical to each other or different from each other. 根据权利要求8或9所述的模块化电源系统,其中每一个所述驱动电路包括第一磁隔离器件,所述第一磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者每一个所述驱动电路包括第二磁隔离器件,所述第二磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to claim 8 or claim 9, wherein each of said drive circuits includes a first magnetic isolation device that transmits drive logic pulses and power pulses contained in said local control signal Or each of the drive circuits includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal. 根据权利要求8或9所述的模块化电源系统,其中部分所述驱动电路包括第一磁隔离器件,所述第一磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;另一部分所述驱动电路包括第二磁 隔离器件,所述第二磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to claim 8 or claim 9, wherein a portion of said drive circuit comprises a first magnetic isolation device, said first magnetic isolation device transmitting drive logic pulses and power pulses contained in said local control signal; Another portion of the drive circuit includes a second magnetic isolation device that transmits drive logic pulses included in the local control signal. 根据权利要求5所述的模块化电源系统,其中所述M个功率变换器中至少一个为主功率变换器,至少一个为从功率变换器,所述M个驱动电路中至少一个为主驱动电路,至少一个为从驱动电路,所述主驱动电路被配置为驱动对应的所述主功率变换器中的功率半导体开关导通和断开,所述从驱动电路被配置为驱动对应的所述从功率变换器中的功率半导体开关的导通和断开。A modular power supply system according to claim 5, wherein at least one of said M power converters is a main power converter, at least one is a slave power converter, and at least one of said M drive circuits is a main drive circuit At least one is a slave drive circuit configured to drive a power semiconductor switch in the corresponding main power converter to be turned on and off, the slave drive circuit being configured to drive the corresponding slave The power semiconductor switches in the power converter are turned on and off. 根据权利要求13所述的模块化电源系统,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构相同时,控制所述主功率变换器和所述从功率变换器中相同位置的所述功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。The modular power supply system of claim 13 wherein said primary power converter and said slave power converter are controlled when said topology of said primary power converter is identical to said topology of said slave power converter The local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same. 根据权利要求13所述的模块化电源系统,其中所述至少一个主功率变换器的数量为1,所述至少一个从功率变换器的数量为M-1时,控制所述从功率变换器中相同位置的所述功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。A modular power supply system according to claim 13 wherein said number of said at least one main power converter is one, and said number of said at least one slave power converters is M-1, said slave power converter being controlled The local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same. 根据权利要求13所述的模块化电源系统,其中当所述至少一个主功率变换器的数量大于等于2,所述至少一个从功率变换器的数量大于等于2时,控制所述从功率变换器中相同位置的所述功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。The modular power supply system according to claim 13, wherein said slave power converter is controlled when the number of said at least one main power converter is greater than or equal to 2 and the number of said at least one slave power converter is greater than or equal to two The local control signals of the same position of the power semiconductor switch being simultaneously turned on and simultaneously turned off are the same. 根据权利要求16所述的模块化电源系统,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构不相同时,控制所述主功率变换器中相同位置的所述功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。The modular power supply system of claim 16 wherein said controlling said same position in said main power converter when said topology of said main power converter is different from said topology of said slave power converter The local control signals that are simultaneously turned on and simultaneously turned off by the power semiconductor switches are the same. 根据权利要求16所述的模块化电源系统,其中当所述主功率变换器的拓扑结构与所述从功率变换器的拓扑结构相同时,控制所述主功率变换器中相同位置的所述功率半导体开关同时导通和同时断开的所述本地控制信号为同一个。A modular power supply system according to claim 16 wherein said power of said same position in said main power converter is controlled when said topology of said main power converter is identical to said topology of said slave power converter The local control signals that are simultaneously turned on and simultaneously turned off by the semiconductor switches are the same. 根据权利要求13任何一个所述的模块化电源系统,其中所述主 驱动电路和所述从驱动电路均包括磁隔离器件,所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to any one of claims 13 to 4, wherein said main drive circuit and said slave drive circuit each comprise a magnetic isolation device that transmits drive logic pulses contained in said local control signal and a power pulse; or the magnetic isolation device transmits a drive logic pulse included in the local control signal. 根据权利要求13任何一个所述的模块化电源系统,其中所述主驱动电路包括主磁隔离器件,所述从驱动电路包括从磁隔离器件,其中所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲;或者所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to any of the preceding claims, wherein said main drive circuit comprises a main magnetic isolation device, said slave drive circuit comprising a slave magnetic isolation device, wherein said main magnetic isolation device transmits said local control signal a drive logic pulse included in the drive, the drive logic pulse and power pulse included in the local control signal being transmitted from the magnetic isolation device; or the main magnetic isolation device transmitting drive logic pulse and power included in the local control signal A pulse that transmits a drive logic pulse included in the local control signal from a magnetic isolation device. 根据权利要求14所述的模块化电源系统,其中每一个所述主驱动电路和每一个所述从驱动电路均包括磁隔离器件,所述磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,或者所述磁隔离器件仅传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to claim 14 wherein each of said main drive circuit and each of said slave drive circuits includes a magnetic isolation device that transmits drive logic contained in said local control signal Pulse and power pulses, or the magnetic isolation device transmits only drive logic pulses contained in the local control signal. 根据权利要求15-18任何一个所述的模块化电源系统,其中所述主驱动电路包括主磁隔离器件,所述从驱动电路包括从磁隔离器件,其中所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,或者所述主磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲和功率脉冲,所述从磁隔离器件传输所述本地控制信号中包含的驱动逻辑脉冲。A modular power supply system according to any of claims 15-18, wherein said main drive circuit comprises a main magnetic isolation device, said slave drive circuit comprising a slave magnetic isolation device, wherein said main magnetic isolation device transmits said local a drive logic pulse included in the control signal, the drive logic pulse and power pulse included in the local control signal being transmitted from the magnetic isolation device, or the main magnetic isolation device transmitting a drive logic pulse included in the local control signal And a power pulse that transmits a drive logic pulse included in the local control signal from the magnetic isolation device. 根据权利要求15-18任何一个所述的模块化电源系统,其中每一个所述功率单元还包括:A modular power supply system according to any of claims 15-18, wherein each of said power units further comprises: 多个第一直流母线电压钳位电路,与所述从功率变换器一一对应,其中每一个所述第一直流母线电压钳位电路被配置为与对应的从功率变换器的直流母线电容并联,以使对应的所述从功率变换器的直流母线电压不超过第一预设值。a plurality of first DC bus voltage clamping circuits in one-to-one correspondence with the slave power converters, wherein each of the first DC bus voltage clamping circuits is configured to be coupled to a DC bus of a corresponding slave power converter The capacitors are connected in parallel such that the corresponding DC bus voltage of the slave power converter does not exceed a first predetermined value. 根据权利要求23所述的模块化电源系统,其中每一个所述第一直流母线电压钳位电路包括:The modular power supply system of claim 23 wherein each of said first DC bus voltage clamping circuits comprises: 开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第一预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电。a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, the series branch is coupled in parallel with the DC bus capacitor, and the switch control circuit is coupled to the control end of the switch when When the DC bus voltage exceeds the first predetermined value, the switch control circuit outputs a switch control signal to turn on the switch such that the DC bus capacitor is discharged through the series branch. 根据权利要求16-18任何一个所述的模块化电源系统,其中每一个所述功率单元还包括:A modular power supply system according to any one of claims 16-18, wherein each of said power units further comprises: 多个第一直流母线电压钳位电路,与所述从功率变换器一一对应,其中每一个所述第一直流母线电压钳位电路被配置为与对应的从功率变换器的直流母线电容并联,以使对应的所述从功率变换器的直流母线电压不超过第一预设值;以及a plurality of first DC bus voltage clamping circuits in one-to-one correspondence with the slave power converters, wherein each of the first DC bus voltage clamping circuits is configured to be coupled to a DC bus of a corresponding slave power converter The capacitors are connected in parallel such that the DC bus voltage of the corresponding slave power converter does not exceed a first preset value; 多个第二直流母线电压钳位电路,与所述主功率变换器一一对应,其中每一个所述第二直流母线电压钳位电路被配置为与对应的主功率变换器的直流母线电容并联,以使对应的所述主功率变换器的直流母线电压不超过第二预设值。a plurality of second DC bus voltage clamping circuits in one-to-one correspondence with the main power converter, wherein each of the second DC bus voltage clamping circuits is configured to be in parallel with a DC bus capacitance of a corresponding main power converter So that the corresponding DC bus voltage of the main power converter does not exceed a second preset value. 根据权利要求25所述的模块化电源系统,其中The modular power supply system of claim 25 wherein 每一个所述第一直流母线电压钳位电路包括:Each of the first DC bus voltage clamping circuits includes: 开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第一预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电;以及a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, the series branch is coupled in parallel with the DC bus capacitor, and the switch control circuit is coupled to the control end of the switch when When the DC bus voltage exceeds the first predetermined value, the switch control circuit outputs a switch control signal to turn on the switch, so that the DC bus capacitor is discharged through the series branch; 每一个所述第二直流母线电压钳位电路包括:Each of the second DC bus voltage clamping circuits includes: 开关、电阻和开关控制电路,其中所述开关与所述电阻形成串联支路,所述串联支路与所述直流母线电容并联,所述开关控制电路连接所述开关的控制端,当所述直流母线电压超过所述第二预设值时,所述开关控制电路输出开关控制信号以导通所述开关,使得所述直流母线电容通过所述串联支路放电。a switch, a resistor, and a switch control circuit, wherein the switch forms a series branch with the resistor, the series branch is coupled in parallel with the DC bus capacitor, and the switch control circuit is coupled to the control end of the switch when When the DC bus voltage exceeds the second predetermined value, the switch control circuit outputs a switch control signal to turn on the switch such that the DC bus capacitor is discharged through the series branch.
PCT/CN2017/116353 2016-12-16 2017-12-15 Modular power system Ceased WO2018108142A1 (en)

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