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WO2018102843A1 - Procédé de revêtement d'un composant - Google Patents

Procédé de revêtement d'un composant Download PDF

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Publication number
WO2018102843A1
WO2018102843A1 PCT/AT2017/060323 AT2017060323W WO2018102843A1 WO 2018102843 A1 WO2018102843 A1 WO 2018102843A1 AT 2017060323 W AT2017060323 W AT 2017060323W WO 2018102843 A1 WO2018102843 A1 WO 2018102843A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate holder
chambers
component
coating
phase change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2017/060323
Other languages
German (de)
English (en)
Inventor
Walter GÄRTNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miba Gleitlager Austria GmbH
Original Assignee
Miba Gleitlager Austria GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miba Gleitlager Austria GmbH filed Critical Miba Gleitlager Austria GmbH
Publication of WO2018102843A1 publication Critical patent/WO2018102843A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates

Definitions

  • the invention relates to a method for coating a component, wherein the component is arranged on a substrate holder and is coated on the substrate holder in a predetermined temperature range.
  • the invention relates to a substrate holder with a holding area for holding a component during its coating and with at least one receiving area for a cooling and / or heating medium.
  • coatings of components are often carried out at a defined temperature or in a defined temperature range in order to obtain the desired coating result.
  • media such as water or various oils are often used, which must be brought via appropriate lines in the vicinity of the component to be coated.
  • this normally does not represent a major problem.
  • the outlay on equipment is relatively high, in particular when it comes to continuous or multi-chamber systems.
  • Such systems can have travel paths for the lines for the liquid heating or cooling medium, which are several meters long.
  • these lines must be protected at least in the immediate area of the coating itself from deposition of the coating material or from radiation.
  • cooling with cooling jaws that can be pressed against the substrate is also known.
  • these have a relatively low cooling capacity.
  • Known substrate cooling systems are also described in EP 1 650 792 A1 and DE 10 2012 013 726 A1.
  • the object of the present invention is to provide a simpler way by which a temperature range can be maintained during the coating of a component.
  • a substrate holder is used for maintaining the temperature in the temperature range, which is provided with a phase change material and / or a thermochemi see storage material.
  • the object is also achieved with the substrate holder mentioned in the introduction, in which the cooling and / or heating medium is a phase change material and / or a thermochemical see s memory material.
  • the advantage here is that with the use of the phase change material or the thermochemical storage material no more lines are required for a cooling and / or heating medium.
  • the substrate holder is thus structurally easier.
  • these advantages are apparent. Since the phase change material or the thermochemical storage material is arranged in the receiving area and remains in this, no leaks in connections, etc. may occur.
  • the substrate holder and an increase in the efficiency of the coating system is possible, especially when multiple substrate holders are used in large-scale coating process.
  • the receiving region of the substrate holder for the phase change material or the thermochemical storage material can be subdivided into a plurality of separate chambers. It is thus possible to improve the heat input into the phase change material or the thermochemical storage material, by avoiding that only the bottom region of the phase change material melts. Since the phase change material generally has a relatively low thermal conductivity, it can lead to plug formation by the solid phase change material located above the melt. come. By the additional possibility of lateral energy input into the phase change material or the thermochemical storage material, this can be avoided by the phase change material melts in this area and thus a liquid film is formed.
  • the arrangement of several chambers is also advantageous for the heat input into the thermochemical storage material, even if the problem of plug formation does not occur here.
  • the chambers have a height and a width when viewed in cross-section, the height being greater than the width, and that the heights of the chambers are oriented in the direction of the holding region for the component. This orientation of the chambers makes it possible to achieve a further improvement in the additional lateral heat input into the phase change material or the thermochemical storage material.
  • a material with a thermal conductivity of at least 100 W / (m K) is arranged between the chambers.
  • the heat input into the phase change material can be improved by virtue of the fact that the incident heat can be distributed relatively quickly over the entire height of the chambers due to the high heat conductivity of the webs between the chambers.
  • a substrate holder for a Elektronenstrahlbedampfungsstrom according to the prior art in cross-section from the front (perpendicular to the direction of movement of the substrate holder by the coating system); 2 shows a first embodiment of a substrate holder according to the invention in cross-section from the front (perpendicular to the direction of movement of the substrate holder by the coating system).
  • Fig. 3 shows a second embodiment of a substrate holder according to the invention in
  • a substrate holder 1 for the coating of a component 2, that is, the substrate to be coated, shown in a coating system.
  • the substrate holder 1 comprises a holding device 3 for receiving and holding the component during the coating of a surface 4 of the component 2.
  • the component 2 is located on a cooling device 5 at least partially, in particular over the entire surface, on or is disposed immediately adjacent thereto. But it is also possible that between the component 2 and the cooling device 5, a heat exchanger is arranged, for example, a corresponding foil, with which an adaptation of geometry differences / surface roughness can be done. This allows a better system of the component 2 and thus a more efficient heat transfer. It should be noted in this connection also to the cited prior art with an air or gas gap.
  • the cooling device 5 can also be used as a heating device.
  • the component 2 can be kept during the coating at a favorable temperature level for the coating, ie that the temperature of the component 2 varies only within a defined temperature range.
  • the entire component 2 has this temperature during the coating. But it can also be enough if that Part 2 at least in near-surface areas to be coated surface 4 has this temperature.
  • the cooling device 5 and / or heating device is designed as a liquid cooling block.
  • 6 receiving areas 7 are provided for a fluid that flows through the heat sink 6 in a tempering.
  • the fluid for example, water or an oil can be used.
  • this cooling works very well, but it prepares the previously described problems in the fluid guide.
  • these problems occur in vacuum coating systems in a continuous process or multi-chamber process.
  • the coating of the component 2 takes place in a single pass.
  • Such a method is known for example from the applicant's AT 514 955 Bl. Thick layers are produced by electron beam evaporation. To achieve this, the substrate to be coated moves relatively slowly through the coating chamber, whereby the temperature load of the component is even greater.
  • FIG. 2 shows a substrate holder 1 according to the invention.
  • the reference numerals are used as in FIG. In order to avoid unnecessary repetition, reference is therefore made to the description of FIG.
  • the substrate holder 1 can not only be used in electron beam vapor deposition systems, but can generally be used in PVD systems, in particular with evacuated coating chambers.
  • a significant difference from the substrate holder 1 according to FIG. 1 is that a phase change material 8 (PCM) and / or a thermochemical storage material (TCM) is contained in the at least one receiving region 7.
  • PCM phase change material 8
  • TCM thermochemical storage material
  • phase change material 8 is understood as meaning a material that changes its state, for example its state of aggregation, as a result of energy input. Such materials have been known for a long time.
  • phase change materials 8 are preferably used, which due to an energy input the state of matter from solid to liquid (Melt) or vice versa. In this phase change either energy is consumed (change from solid to liquid) or energy released (change from liquid to solid). It is the enthalpy of fusion. In principle, however, it is also possible to use other phase change materials 8, for example those which undergo a fixed-solid change as a result of energy input.
  • thermochemical storage material stores energy by a reversible chemical reaction, such as the release of crystal water or adsorbed water.
  • the heat release or energy release takes place by taking up water of crystallization or the adsorption of water.
  • the phase change material 8 or the thermochemical storage material is thus able to compensate for temperature changes by heat storage (energy storage) or heat dissipation (energy release) within a temperature range, so that the process can be carried out for coating the component 2 within a defined temperature range.
  • the receiving region 7 consists of a single chamber 9.
  • the chamber 9 is formed, in particular, by a cavity 10 of the tempering body 6, that is to say of the heat sink and / or radiator.
  • the chamber 9 therefore does not have to have its own chamber walls, which are different from the tempering body 6, although this is possible.
  • the receiving area 7 or the chamber 9 has a width 11, which is preferably at least 80%, in particular at least 90%, of an overall width 12 of the tempering body 6 (viewed in the same direction). For reasons that are easy to understand, the receiving area 7 does not extend over 100% of the total width of the tempering body 6.
  • the receiving region 7 or the chamber 9 has a length (orthogonal to the width 11) which is preferably at least 80%, in particular at least 90%, of an overall length of the tempering body 6 (viewed in the same direction). Again, the length of the receiving area 6 is smaller than the total length of the tempering. 6
  • the receiving area 7 or the chamber 9 furthermore has a height 13 which is preferably at least 50%, preferably at least 80%, of an overall height 14 of the tempering body 6 (viewed in the same direction). Again, the height 12 of the receiving area 6 is smaller than the total height 14 of the tempering. 6
  • a maximum distance 15 between the rear side of the component 2, that is, the surface 4 to be coated in the direction of the temperature control body 6 opposite side, and the phase change material 8 in the cavity 10 should be as small as possible.
  • This maximum distance can be between 1% and 20%, for example between 5% and 10%, of the total height 14 of the tempering body 6.
  • phase change material 8 a material is preferably used, which has its phase change (from solid to liquid and vice versa) in a temperature range between 100 ° C and 450 ° C, in particular between 150 ° C and 300 ° C.
  • the phase change material 8 can be both organic and inorganic in nature. As phase change material 8, preference is given to using inorganic salts, such as nitrates, chlorides, hydroxides, carbonates, salt hydrates, metal alloys or mixtures thereof. For easier prevention of corrosion problems, the phase change material 8 may be organic, for example a sugar alcohol, e.g. D-mannitol.
  • phase change material 8 which has a specific phase change enthalpy of at least 150 kJ / kg, in particular at least 250 kJ / kg.
  • thermochemical storage material may be, for example, silica gel or a zeolite.
  • the zeolite may be treated with at least one salt, e.g. an alkali or alkaline earth chloride or sulphate or mixtures thereof, in order to increase the storage capacity.
  • FIG. 3 shows a further embodiment variant of the substrate holder 1, which may be independent of itself, and in which again the same reference numerals and the same parts are used for identical parts. Component names as used in Figs. 1 and 2. To avoid unnecessary repetition, reference is made to the detailed description of these FIGS. 1 and 2 and referred to.
  • Significant difference to the embodiment of the substrate holder 1 of FIG. 2 is that the phase change material 8 and / or thermochemical storage material is no longer contained in only one chamber 9.
  • the receiving area 7 is subdivided into a plurality of separate chambers 9, so that the total amount of phase change material 8 and / or the thermochemical storage material is divided into a plurality of chambers 9.
  • the chambers 9 can in principle have any suitable geometry, for example be cylindrical. Preferably, however, they are cuboid. It is also possible that the chambers 9 are formed with a cross section that changes in the direction of its height, in particular a cross section that tapers in the direction of the component 2. For example, the chambers 9 may have a trapezoidal cross section in the direction of the conveying direction of the substrate through the coating installation, that is to say perpendicular to the plane of the drawing in FIG. 3, the short side of the trapezoid facing the substrate 2. It is thus better avoidable the above-mentioned plug formation.
  • the substrate holder 1 may have a plurality of cube-shaped and / or a plurality of cuboidal and / or a plurality of cylindrical and / or a plurality of conical chambers 9.
  • the number of chambers 9 may depend on the intended, dissipated energy and the total width of the 12 and / or length of the tempering 6.
  • the substrate holder 1 may have between 2 and 10 chambers 9 per 10 cm width and / or between 2 and 10 chambers 9 per 10 cm length.
  • the figures given for the number of chambers 9 are not to be understood as limiting.
  • the tempering body 6 expediently has a total width 12 which corresponds at least approximately to the total width of the component 2 to be coated viewed in the same direction.
  • the total width 12 of the tempering body 6 can amount to between 85% and 98% of the total width of the component 2.
  • the height of the chambers 9 is greater than their width 11, wherein the chambers 9 are oriented so that the heights 13 of the chambers 9 are aligned at least approximately orthogonal to the surface 4 to be coated of the component 2.
  • the orientation of the chambers 9 may deviate from the exact perpendicularity. Namely, it is possible that the component 2 is held curved on the substrate holder 1, as shown in FIGS. 2 and 3.
  • the height of the chambers 9 may include an angle with the surface 4 of the component 2, which is selected from a range of 0, 1 ° to 10 °. The same applies to components 2, which in themselves already have a curved surface 4 to be coated. In completely unbraked held components 2, the said orthogonality of heights may be present.
  • These webs 16 may have a width 17 in the direction of the overall width 12 and / or a width in the direction of the length of the substrate holder 1, which is selected from a range of 50% to 200% of the width 11 of the chambers 9 in the same direction. Via these webs 16 a more uniform energy input into or discharge from the PCM and / or TCM over the entire volume of the chambers 9 can be achieved.
  • the region between the chambers 9, that is, for example in the embodiment of the substrate holder 1 of FIG. 3, the webs 16, consists of a material having a thermal conductivity of at least 100 W / ( m K).
  • this area may consist of a metal or a metallic alloy, such as silver, aluminum, etc.
  • this area consists of copper or a copper alloy.
  • the chambers 9 with a larger width 11 in comparison to train to height 13.
  • the chambers 9 have a different geometry, for example, are cylindrical.
  • the phase change material 8 and / or the thermochemical storage material can be divided into an array of chambers 9.
  • the chambers 9 are preferably formed in the direction of the overall width 12 uninterrupted.
  • the receiving area 7 for the PCM and / or TCM is preferably arranged side by side in the direction of the length of the substrate holder 1 (conveying direction of the substrate holder 1 through the coating installation, ie perpendicular to the viewing plane of FIG. 3) Chambers 9 divided.
  • chambers 9 it may be provided that the phase change material 8 and / or the thermochemical storage material is accommodated in a metal sponge. In general, it is advantageous if the receiving area 7 or the chambers 9 a larger
  • phase change material 8 has volume, as the volume contained therein of the phase change material 8 or the thermochemical storage material in the solid state. It can thus be a pressure build-up in the receiving area 7 and the chambers 9 are avoided, the result of the heat input into the phase change material 8 or the thermochemi see storage material and the associated volume increase arises. It is furthermore generally advantageous if the available mass of phase change material 8 is greater than the mass that would correspond to the expected thermal energy to be absorbed. The latter can be determined by the skilled person based on simple experiments without undue burden. By means of this design variant, it is achieved that a portion of the phase change material 8 remains solid at any rate and is available as seed crystals for the melt during cooling. It can thus better prevent overcooling of the melt.
  • the holding device 3 for the component 2 may be formed according to the prior art, for example with clamping jaws.
  • the substrate holder 1 with the exception of the cooling device 5 and / or heating device, can be designed according to the state of the art.
  • the substrate holder 1 can be used in all PVD (physical vapor deposition) systems, such as sputtering machines.
  • the substrate holder 1 is preferably used in electron beam vapor deposition systems, in particular in electron beam vapor deposition systems by the continuous process.
  • the substrate holder 1 is preferably used in coating systems with an (evacuated) coating chamber having a length of at least 10 m or in coating plants with a plurality of deposition chambers arranged one behind the other, wherein in the latter case the deposition chambers each have a length of at least 1 m to 2 m have.
  • a sequence of a coating process according to the invention preferably has the following method steps:
  • phase change materials used are available from PCM Products Ltd.
  • the exemplary embodiments show possible embodiments of the substrate holder 1, wherein it should be noted at this point that various combinations of the individual design variants are also possible with one another.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un procédé de revêtement d'un composant (2), ledit composant (2) étant disposé sur un support de substrat (1) et étant revêtu sur le support substrat (1) dans une plage de températures prédéfinie. Pour maintenir la température dans cette plage de températures, on utilise un support de substrat (1) qui est pourvu d'un matériau à changement de phase (8) et/ou d'un matériau accumulateur thermochimique. L'invention concerne en outre un support de substrat correspondant.
PCT/AT2017/060323 2016-12-07 2017-12-05 Procédé de revêtement d'un composant Ceased WO2018102843A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA51115/2016 2016-12-07
ATA51115/2016A AT519112B1 (de) 2016-12-07 2016-12-07 Verfahren zum Beschichten eines Bauteils

Publications (1)

Publication Number Publication Date
WO2018102843A1 true WO2018102843A1 (fr) 2018-06-14

Family

ID=61131860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2017/060323 Ceased WO2018102843A1 (fr) 2016-12-07 2017-12-05 Procédé de revêtement d'un composant

Country Status (2)

Country Link
AT (1) AT519112B1 (fr)
WO (1) WO2018102843A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589000A (en) * 1995-09-06 1996-12-31 Minnesota Mining And Manufacturing Company Fixture for deposition
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US20160318061A1 (en) * 2015-05-01 2016-11-03 Linco Technology Co., Ltd. Film Deposition System Having a Substrate Carrier and a Cooling Device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004050822A1 (de) * 2004-10-19 2006-04-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Kühlen plattenförmiger Substrate
US20100096255A1 (en) * 2008-10-22 2010-04-22 Applied Materials, Inc. Gap fill improvement methods for phase-change materials
DE102012013726B4 (de) * 2012-07-11 2021-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Kühlen bandförmiger Substrate
US9771649B2 (en) * 2015-05-05 2017-09-26 Linco Technology Co., Ltd. Substrate carrier unit for a film deposition apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589000A (en) * 1995-09-06 1996-12-31 Minnesota Mining And Manufacturing Company Fixture for deposition
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US20160318061A1 (en) * 2015-05-01 2016-11-03 Linco Technology Co., Ltd. Film Deposition System Having a Substrate Carrier and a Cooling Device

Also Published As

Publication number Publication date
AT519112A4 (de) 2018-04-15
AT519112B1 (de) 2018-04-15

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