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WO2018186207A1 - Unité d'imagerie et endoscope - Google Patents

Unité d'imagerie et endoscope Download PDF

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Publication number
WO2018186207A1
WO2018186207A1 PCT/JP2018/011659 JP2018011659W WO2018186207A1 WO 2018186207 A1 WO2018186207 A1 WO 2018186207A1 JP 2018011659 W JP2018011659 W JP 2018011659W WO 2018186207 A1 WO2018186207 A1 WO 2018186207A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing resin
recess
imaging unit
height
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/011659
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English (en)
Japanese (ja)
Inventor
石川　真也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2018566323A priority Critical patent/JP6486584B2/ja
Publication of WO2018186207A1 publication Critical patent/WO2018186207A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Definitions

  • the present invention relates to an imaging unit and an endoscope that are provided at a distal end of an insertion portion of an endoscope that is inserted into a subject and images the inside of the subject.
  • a medical endoscope apparatus incises a subject by inserting an elongated flexible insertion portion having an imaging element at the tip into the body cavity of the subject such as a patient. Without being able to acquire an in-vivo image inside the body cavity, and further, it is possible to perform a therapeutic treatment by projecting the treatment tool from the distal end of the insertion portion as necessary.
  • an imaging unit including an imaging element and a circuit board on which electronic components such as a capacitor and an IC chip constituting a drive circuit of the imaging element are mounted is fitted.
  • the reliability of the electronic component is improved by sealing the periphery of the electronic component surrounded by the peripheral wall with a sealing resin.
  • the height of the peripheral wall is increased.
  • the sealing resin is likely to protrude out of the peripheral wall, thereby increasing the diameter of the imaging device.
  • the filling amount of the sealing resin is reduced so that the sealing resin does not protrude, the connection reliability is lowered.
  • the present invention has been made in view of the above, and an object thereof is to provide an imaging unit and an endoscope that are excellent in connection reliability while reducing the diameter.
  • an imaging unit includes an imaging element that generates an electrical signal by receiving light incident from an optical system and performing photoelectric conversion,
  • a semiconductor package having a connection electrode formed on the back surface, a plurality of electronic components, a rectangular plate shape, a first electrode on which the imaging element is mounted is formed on the front surface, and a plurality of the electronic components on the back surface
  • a circuit board having a recess formed with a second electrode on which is mounted, and a sealing resin filled around the plurality of electronic components mounted in the recess, and facing the recess The electronic component and the sealing resin do not protrude from the recess to the back side of the circuit board.
  • the imaging unit according to the present invention is characterized in that, in the above invention, the stepped portion is formed on all wall surfaces of the concave portion.
  • the imaging unit according to the present invention is characterized in that, in the above invention, the sealing resin is filled so that a maximum height from a bottom surface of the concave portion is higher than a height of the stepped portion.
  • the imaging unit according to the present invention is characterized in that, in the above invention, the sealing resin is filled so as to form a spherical surface from a corner portion of the stepped portion to an opening portion side of the recessed portion.
  • the height of the stepped portion is 60 to 140% of the mounting height of the plurality of electronic components.
  • the height of the stepped portion is 50 to 90% of the height of the concave portion.
  • an endoscope according to the present invention is characterized in that the imaging unit according to any one of the above is provided with an insertion portion provided at a distal end.
  • the filling amount of the sealing resin filled in the recess can be easily controlled, and leakage from the recess can occur. Since the necessary amount can be transferred without taking out, it is possible to obtain an imaging unit and an endoscope excellent in connection reliability while maintaining downsizing.
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an imaging unit arranged at the distal end portion of the endoscope shown in FIG.
  • FIG. 3 is a bottom view of the imaging unit shown in FIG. 4 is a cross-sectional view taken along line AA in FIG.
  • FIG. 5 is a cross-sectional view showing the filling of the sealing resin in the recess of the prior art.
  • FIG. 6 is a cross-sectional view showing the filling of the sealing resin in the recess of the prior art.
  • FIG. 7 is a cross-sectional view showing filling of the sealing resin in the recess according to Modification 1 of the embodiment of the present invention.
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an imaging unit arranged at the distal end portion of the endoscope shown in FIG
  • FIG. 8 is a cross-sectional view showing filling of the sealing resin in the recess according to the second modification of the embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing the filling of the sealing resin in the recess according to the third modification of the embodiment of the present invention.
  • FIG. 10 is a cross-sectional view showing the filling of the sealing resin in the recess according to Modification 4 of the embodiment of the present invention.
  • FIG. 11 is a bottom view of a circuit board according to Modification 5 of the embodiment of the present invention.
  • FIG. 12 is a cross-sectional view around the recess of a conventional circuit board.
  • FIG. 13 is a bottom view of the concave portion of the circuit board according to Modification 6 of the embodiment of the present invention.
  • 14 is a cross-sectional view of FIG.
  • an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to an embodiment of the present invention.
  • an endoscope system 1 according to the present embodiment is introduced into a subject, an endoscope 2 that images the inside of the subject and generates an image signal in the subject, An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information processing And a display device 5 that displays an image of an image signal after image processing by the device 3.
  • the endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.
  • the insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like.
  • the insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b.
  • the distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.
  • the operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment instrument insertion portion 7b in which a treatment instrument such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3.
  • a plurality of switch units 7c for operating peripheral devices such as the light source device 4, the air supply device, the water supply device, and the gas supply device.
  • the treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.
  • the universal cord 8 is configured using illumination fibers, cables, and the like.
  • the universal cord 8 is branched at the base end, one end of the branch is the connector 8a, and the other base end is the connector 8b.
  • the connector 8a is detachable from the connector of the information processing apparatus 3.
  • the connector 8b is detachable from the light source device 4.
  • the universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber. Further, the universal code 8 transmits an image signal picked up by an image pickup unit described later to the information processing apparatus 3 via a cable and a connector 8a.
  • the information processing apparatus 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.
  • the light source device 4 includes a light source that emits light, a condensing lens, and the like.
  • the light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.
  • the display device 5 is configured by using a display using liquid crystal or organic EL (Electro Luminescence).
  • the display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize a desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.
  • FIG. 2 is a perspective view of the imaging unit 10 disposed at the distal end portion of the endoscope 2 shown in FIG.
  • FIG. 3 is a bottom view of the imaging unit 10 shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. 2 and 3, illustration of the sealing resin 60 filled in the recess 32 is omitted for the understanding of the present invention.
  • the prism 40 is not shown.
  • the imaging unit 10 includes a prism 40 that collects and reflects incident light, and an imaging element 21 that receives the light incident from the prism 40 and performs photoelectric conversion to generate an electrical signal, and is connected to the back surface f4.
  • a semiconductor package 20 having electrodes formed thereon, a plurality of electronic components 50, a rectangular plate shape, a first electrode (not shown) on which the imaging element 21 is mounted on the front surface f5, and an electronic component on the back surface f6
  • the circuit board 30 having the recess 32 in which the second electrode 35 on which the 50 is mounted is formed, and the sealing resin 60 filled around the electronic component 50 mounted in the recess 32.
  • the semiconductor package 20 has a structure in which a glass 22 is attached to the image sensor 21.
  • the light incident from the f1 surface of the prism 40 and reflected by the f2 surface enters the f0 surface (light receiving surface) of the imaging element 21 including the light receiving unit via the glass 22.
  • a connection electrode (not shown) and a bump 23 made of solder or the like are formed on the back surface f4 of the image pickup device 21, a connection electrode (not shown) and a bump 23 made of solder or the like are formed.
  • the semiconductor package 20 is a CSP (Chip Size Package) in which an image pickup device chip in a wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the image pickup device chip becomes the size of the semiconductor package. ) Is preferable.
  • the semiconductor package 20 is a so-called horizontal type in which the f0 surface that is the light receiving surface of the image sensor 21 is horizontally mounted.
  • a protrusion 31 is formed on the surface f5 of the circuit board 30, and the upper surface of the protrusion 31 and the proximal end side from the protrusion 31 (the side to which the image sensor 21 is connected and the opposite side across the protrusion 31) Cable connection electrodes for connecting cables (not shown) are formed.
  • the circuit board 30 is a ceramic substrate, glass epoxy substrate, glass substrate, silicon substrate, or the like. From the viewpoint of improving the reliability of connection with the semiconductor package 20, a material formed from a material having the same thermal expansion coefficient as that of the semiconductor package 20, for example, a silicon substrate or a ceramic substrate is preferable.
  • the back surface f6 of the circuit board 30 has a recess 32 in which a second electrode 35 on which the electronic component 50 is mounted is formed on the side on which the first electrode (not shown) on which the imaging element 21 is mounted is formed, An inspection terminal 34 is formed on the base end side. Stepped portions 33 are formed on the four wall surfaces of the recess 32.
  • the height h3 of the stepped portion 33 from the bottom surface of the concave portion 32 can be appropriately determined according to the electronic component 50 to be used. 60% to 140% of the height h2 from the bottom surface of the recess 32 when mounted on the electrode 35, and preferably the same as the mounting height h2 of the electronic component 50.
  • the height h3 of the stepped portion 33 is preferably 50% to 90% of the height h1 of the concave portion 32.
  • the stepped portion 33 in the recess 32 By providing the stepped portion 33 in the recess 32, it can be used as a marker when the sealing resin 60 is filled in the recess 32. Normally, the sealing resin 60 is filled in the concave portion 32 while being visually recognized by a camera or the like. However, the filling amount can be easily controlled by filling with the step portion 33 as a marker.
  • 5 and 6 are cross-sectional views showing filling of the sealing resin 60 in the recess 32 of the prior art.
  • the maximum height h4 of the sealing resin 60 is equal to or higher than the height h1 of the recess 32, as shown in FIG.
  • the sealing resin 60 when the sealing resin 60 is filled so as not to protrude from the recess 32, the filling amount is reduced as shown in FIG. In the present embodiment, since the sealing resin 60 is filled using the stepped portion 33 as a marker, the filling operation is facilitated. Further, even when the sealing resin 60 is filled beyond the height h3 of the stepped portion 33, the sealing resin 60 is opened from the corner portion of the stepped portion 33 to the opening of the concave portion 32 by surface tension as shown in FIG. Since the sealing resin 60 does not protrude from the recess 32 (without protruding from the recess 32 to the back surface f6 side of the circuit board 30), the electronic component 50 is filled with a smaller filling amount. Can be sealed with a sealing resin 60.
  • the sealing resin 60 a semiconductor material having a small linear thermal expansion coefficient, for example, an epoxy resin-based sealing resin can be used.
  • the imaging unit 10 is sealed with a sealing resin when used in the endoscope 2. Due to the expansion and contraction of the sealing resin, a stress is applied to the connection portion, and the connection portion may be broken. Therefore, the connection reliability is improved by sealing with the sealing resin 60 so as to cover the connection part of the electronic component 50 and the circuit board 30 and the periphery of the electronic component 50 with the sealing resin 60 having a low thermal expansion coefficient. can do.
  • the sealing resin 60 is preferably filled up to the mounting height h2 of the electronic component 50 and not more than the height h1 of the recess 32.
  • the maximum height h4 of the sealing resin 60 is set to be equal to or higher than the mounting height h2 of the electronic component 50, substantially the entire area around the electronic component 50 can be covered with the sealing resin 60, and connection reliability can be maintained. This is because it can. Further, by setting the maximum height h4 of the sealing resin 60 to be equal to or less than the height h1 of the concave portion 32, it is possible to prevent the imaging unit 10 from increasing in diameter.
  • the maximum height h4 of the sealing resin 60 is If the filling is performed such that the maximum height h4 from the bottom surface of the recess 32 is equal to or higher than the height h3 of the stepped portion 33, both the diameter reduction of the imaging unit 10 and the connection reliability can be satisfied.
  • FIG. 8 is a cross-sectional view showing filling of the sealing resin 60 in the recess 32 according to Modification 2 of the embodiment of the present invention.
  • the sealing resin 60 may be filled beyond the corners of the stepped portion 33.
  • the stepped portion 33 is In addition to functioning as a marker, it is possible to prevent the sealing resin 60 from protruding outside the recess 32.
  • the sealing resin 60 is outside the recess 32 depending on the types of the electronic component 50 and the sealing resin 60 to be used, the height h1 of the recess 32, the height h2 of the electronic component 50, and the height h3 of the step 33. It may stick out. Even in such a case, it is preferable to provide the step portion 33 because the maximum height h4 (average) of the sealing resin 60 can be made smaller than when the step portion 33 is not provided.
  • FIG. 9 is a cross-sectional view showing filling of the sealing resin 60 in the recess 32 according to Modification 3 of the embodiment of the present invention.
  • the concave portion 32 has a tapered shape in which the bottom surface side becomes smaller, and the stepped portion 33 is a wall surface extending in the vertical direction.
  • the interface between the concave portion 32 and the stepped portion 33 functions as a liquid stopper for the marker and the sealing resin 60, prevents the sealing resin 60 from protruding from the concave portion 32, and can improve connection reliability. .
  • FIG. 10 is a cross-sectional view showing filling of the sealing resin 60 in the recess 32 according to Modification 4 of the embodiment of the present invention.
  • the stepped portion 33 is formed so as to penetrate the wall surface on the bottom surface side of the recessed portion 32, and the corner between the stepped portion 33 and the recessed portion 32 serves as a liquid stopper for the marker and the sealing resin 60. It functions, prevents the sealing resin 60 from protruding from the recess 32, and improves connection reliability.
  • FIG. 11 is a bottom view of a circuit board 30A according to Modification 5 of the embodiment of the present invention.
  • the stepped portion 33 is formed on the wall surface m1 on the distal end side of the recess 32 and the wall surface m3 on the proximal end side, and the stepped portion 33 is not formed on the wall surfaces m2 and m4.
  • the stepped portion 33 formed by the two opposing wall surfaces m1 and m3 functions as a liquid stopper for the marker and the sealing resin 60, preventing the sealing resin 60 from protruding from the recess 32, Connection reliability can be improved.
  • the two wall surfaces which oppose may be sufficient, and the level
  • FIG. 12 is a cross-sectional view around the recess of a conventional circuit board.
  • FIG. 13 is a bottom view of the recess 32 of the circuit board according to Modification 6 of the embodiment of the present invention.
  • 14 is a cross-sectional view of FIG.
  • the sealing resin 60 when there is a difference between the distance Lb1 from the side surface of the recess 32 to the adjacent electronic component 50 and the distance Lp1 between the adjacent electronic components 50, the sealing resin 60 hardly flows out from a narrow place. There may be a bias in the amount of the sealed. As shown in FIGS. 13 and 14, the distance Lb ⁇ b> 1 (lateral direction) from the side surface of the recess 32 to the adjacent electronic component 50, the distance Lp ⁇ b> 1 (lateral direction) between the adjacent electronic components 50, and the side surface of the recess 32.
  • the bias of the sealing resin 60 can be prevented, and sealing The protrusion of the resin 60 from the recess 32 can be suppressed. Thereby, the connection reliability of the electronic component 50 can be improved and the diameter of the imaging unit can be reduced.
  • the imaging unit of the present invention is useful for an endoscope system that requires a high-quality image and a thin tip.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
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  • Signal Processing (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Endoscopes (AREA)
  • Studio Devices (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)

Abstract

L'invention concerne : une unité d'imagerie qui est étroite et qui présente également une excellente fiabilité de connexion, et un endoscope. Cette unité d'imagerie (10) est caractérisée : en ce qu'elle comprend un boîtier de semi-conducteur (20) qui possède un élément d'imagerie (21) et qui possède une électrode de connexion formée sur sa surface arrière, une pluralité de composants électroniques (50), une carte de circuit rectangulaire et tabulaire (30) qui possède une première électrode formée sur sa surface supérieure ainsi qu'un renfoncement (32) formé dans sa surface arrière à l'intérieur duquel est formée une seconde électrode (35) sur laquelle la pluralité de composants électroniques (50) sont montés, et une résine d'étanchéité (60) qui remplit l'intérieur du renfoncement (32) ; en ce que deux surfaces de paroi opposées du renfoncement (32) ont un décrochement (33) ; et en ce que les composants électroniques (50) et la résine d'étanchéité (60) ne font pas saillie à partir du renfoncement (32) vers le côté de surface arrière de la carte de circuit (30).
PCT/JP2018/011659 2017-04-06 2018-03-23 Unité d'imagerie et endoscope Ceased WO2018186207A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018566323A JP6486584B2 (ja) 2017-04-06 2018-03-23 撮像ユニット、および内視鏡

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-075849 2017-04-06
JP2017075849 2017-04-06

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WO2018186207A1 true WO2018186207A1 (fr) 2018-10-11

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PCT/JP2018/011659 Ceased WO2018186207A1 (fr) 2017-04-06 2018-03-23 Unité d'imagerie et endoscope

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Publication number Priority date Publication date Assignee Title
JP7430294B2 (ja) 2021-06-25 2024-02-09 オリンパスメディカルシステムズ株式会社 撮像ユニット、内視鏡、および、撮像ユニットの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012183330A (ja) * 2012-05-14 2012-09-27 Olympus Medical Systems Corp 撮像装置
WO2012137739A1 (fr) * 2011-04-05 2012-10-11 オリンパスメディカルシステムズ株式会社 Appareil d'imagerie
WO2016092986A1 (fr) * 2014-12-08 2016-06-16 オリンパス株式会社 Unité d'imagerie, module d'imagerie et système d'endoscope

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012137739A1 (fr) * 2011-04-05 2012-10-11 オリンパスメディカルシステムズ株式会社 Appareil d'imagerie
JP2012183330A (ja) * 2012-05-14 2012-09-27 Olympus Medical Systems Corp 撮像装置
WO2016092986A1 (fr) * 2014-12-08 2016-06-16 オリンパス株式会社 Unité d'imagerie, module d'imagerie et système d'endoscope

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JPWO2018186207A1 (ja) 2019-04-18

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