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WO2018180847A1 - Câble électrique isolé - Google Patents

Câble électrique isolé Download PDF

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Publication number
WO2018180847A1
WO2018180847A1 PCT/JP2018/011304 JP2018011304W WO2018180847A1 WO 2018180847 A1 WO2018180847 A1 WO 2018180847A1 JP 2018011304 W JP2018011304 W JP 2018011304W WO 2018180847 A1 WO2018180847 A1 WO 2018180847A1
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WIPO (PCT)
Prior art keywords
insulating layer
resin
conductor
insulated wire
film thickness
Prior art date
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Ceased
Application number
PCT/JP2018/011304
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English (en)
Japanese (ja)
Inventor
槙弥 太田
雅晃 山内
吉田　健吾
田村　康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Wintec Inc filed Critical Sumitomo Electric Industries Ltd
Priority to JP2019509639A priority Critical patent/JP7214625B2/ja
Publication of WO2018180847A1 publication Critical patent/WO2018180847A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/06—Insulation of windings

Definitions

  • the present invention relates to an insulated wire.
  • This application claims priority based on Japanese Patent Application No. 2017-069028 filed on Mar. 30, 2017, and incorporates all the description content described in the above Japanese application.
  • an electric device having a high applied voltage for example, a motor used at a high voltage
  • a high voltage is applied to an insulated wire constituting the electric device, and partial discharge (corona discharge) is likely to occur on the surface of the insulating layer.
  • partial discharge corona discharge
  • dielectric breakdown occurs at an early stage, and the life of the insulated wire and thus the electrical equipment is shortened.
  • an insulated wire used for an electric device having a high applied voltage is required to improve the corona discharge start voltage.
  • the dielectric constant of the insulating layer As a device for increasing the corona discharge starting voltage, it is effective to lower the dielectric constant of the insulating layer.
  • the methods for reducing the dielectric constant there is a method of forming pores in the insulating layer.
  • a method for forming pores in the insulating layer As a method for forming pores in the insulating layer, a method using a foaming agent such as azobisisobutyronitrile or a heat-expandable microcapsule (see Japanese Patent Laid-Open Nos. 5-20928 and 8-77849), and A method using a solvent of a thermosetting resin, a mixed solvent of a solvent having a boiling point higher than that of the solvent and a bubble forming agent has been proposed.
  • a foaming agent such as azobisisobutyronitrile or a heat-expandable microcapsule
  • An insulated wire according to an aspect of the present invention is an insulated wire including a linear conductor and an insulating layer coated on an outer peripheral surface of the conductor, the insulating layer including a plurality of pores, and the insulating layer
  • the porosity of the insulating wire is 20 volume% or more and 65 volume% or less, and the thickness of the insulating layer at 8 points is measured for each cross section at 30 cross sections at 50 cm intervals in the longitudinal direction of the insulated wire.
  • the variation ratio of the following formula (1) calculated from the measured value is 25% or less.
  • Variation ratio (%) (4 ⁇ / average film thickness) ⁇ 100 (1) (In the above formula (1), the average film thickness indicates the average value of each measurement value, and ⁇ indicates the standard deviation of each measurement value.)
  • the dielectric constant can be lowered by increasing the porosity of the insulating layer.
  • the insulating layer formed by the above-described conventional technology it is difficult to control the foaming ratio of the foaming agent, or a plurality of solvents having different volatilization rates are used. Becomes non-uniform around the conductor cross section. Further, the thickness of the insulating layer has a great influence on the insulation and strength of the insulated wire, and there is a possibility that the insulation and strength are insufficient particularly in a portion where the insulating layer is thin.
  • the present invention has been made based on the above circumstances, and an object thereof is to provide an insulated wire excellent in insulation and strength while achieving a low dielectric constant of an insulating layer.
  • the insulated wire of the present invention is excellent in insulation and strength while achieving a low dielectric constant of the insulating layer.
  • An insulated wire according to an aspect of the present invention is an insulated wire including a linear conductor and an insulating layer coated on an outer peripheral surface of the conductor, the insulating layer including a plurality of pores, and the insulating layer
  • the porosity of the insulating wire is 20 volume% or more and 65 volume% or less, and the thickness of the insulating layer at 8 points is measured for each cross section at 30 cross sections at 50 cm intervals in the longitudinal direction of the insulated wire.
  • the variation ratio of the following formula (1) calculated from the measured value is 25% or less.
  • Variation ratio (%) (4 ⁇ / average film thickness) ⁇ 100 (1) (In the above formula (1), the average film thickness indicates the average value of each measurement value, and ⁇ indicates the standard deviation of each measurement value.)
  • the insulated wire includes pores in the insulating layer, and by setting the porosity of the insulating layer within the above range, it is possible to achieve a low dielectric constant of the insulating layer.
  • the insulated wire can reduce the minimum film thickness by increasing the uniformity of the film thickness by setting the variation rate of the film thickness of the insulating layer to the above value or less, and as a result, the corona discharge starting voltage is improved.
  • it has excellent insulating properties and excellent strength.
  • porosity means the percentage of the volume of the pores with respect to the volume including the pores of the insulating layer.
  • the average film thickness of the insulating layer is preferably 60 ⁇ m or more.
  • the insulated wire can improve insulation and intensity
  • the conductor is preferably a rectangular conductor having a rectangular cross section. In general, even in the case of a rectangular conductor in which it is difficult to make the thickness of the insulating layer uniform, it is possible to reduce the dielectric constant of the insulating layer and to provide an insulated wire excellent in insulation and strength.
  • the insulated wire in FIG. 1 includes a linear conductor 1 and an insulating layer 2 that covers the outer peripheral surface of the conductor 1.
  • the insulating layer 2 includes a plurality of pores 3.
  • the cross-sectional shape of the conductor 1 examples include a circular shape, an elliptical shape, a racetrack shape, a hexagonal shape, a triangular shape, a polygonal shape such as a square shape such as a square, and a rectangle.
  • the conductor 1 is preferably a square conductor with a square cross section or a flat conductor with a rectangular cross section.
  • the conductor 1 may be a stranded wire obtained by twisting a plurality of strands.
  • the material of the conductor 1 is preferably a metal having high electrical conductivity and high mechanical strength.
  • metals include copper, copper alloys, aluminum, nickel, silver, soft iron, steel, and stainless steel.
  • the insulating layer 2 includes a plurality of pores 3 as shown in FIG.
  • the lower limit of the porosity of the insulating layer 2 is 20% by volume, preferably 25% by volume, and more preferably 30% by volume.
  • the upper limit of the porosity of the insulating layer 2 is 65% by volume, preferably 60% by volume, and more preferably 55% by volume.
  • the porosity (volume%) of the insulating layer 2 is the same as the mass W1 when there is no pore determined by multiplying the apparent volume V1 calculated from the outer shape of the insulating layer 2 by the density ⁇ 1 of the material of the insulating layer 2, and the insulating layer 2 This is a value obtained from the actual mass W2 of the layer 2 by the formula of (W1-W2) ⁇ 100 / W1.
  • the lower limit of the average film thickness of the insulating layer 2 is preferably 10 ⁇ m, more preferably 60 ⁇ m, further preferably 80 ⁇ m, and particularly preferably 100 ⁇ m.
  • the upper limit of the average film thickness of the insulating layer 2 is preferably 300 ⁇ m, and more preferably 200 ⁇ m. If the average film thickness of the insulating layer 2 is less than the above lower limit, the insulating layer 2 may be torn and insulation of the conductor 1 may be insufficient. On the contrary, when the average film thickness of the insulating layer 2 exceeds the upper limit, the volume efficiency of a coil or the like formed using the insulated wire may be lowered.
  • the upper limit of the film thickness variation ratio of the insulating layer 2 is 25%, preferably 20%, more preferably 15%, still more preferably 12%, and particularly preferably 10%.
  • the lower limit of the variation ratio of the film thickness of the insulating layer 2 is preferably 1% and more preferably 5%. If the variation ratio of the film thickness of the insulating layer 2 exceeds the above upper limit, the insulation and strength of the insulated wire may be insufficient.
  • the variation ratio of the thickness of the insulating layer 2 is determined by measuring the thickness of the insulating layer at 8 points for each cross section at 30 sections at intervals of 50 cm in the longitudinal direction of the insulated wire. Calculated according to (1).
  • Variation ratio (%) (4 ⁇ / average film thickness) ⁇ 100 (1) (In the above formula (1), the average film thickness indicates the average value of each measurement value, and ⁇ indicates the standard deviation of each measurement value.)
  • the lower limit of the average diameter of the pores 3 is preferably 0.1 ⁇ m, and more preferably 1 ⁇ m.
  • the upper limit of the average diameter of the pores 3 is preferably 10 ⁇ m, more preferably 8 ⁇ m.
  • the average diameter of the pores 3 is less than the lower limit, the generation of corona discharge in the insulating layer 2 may not be sufficiently suppressed.
  • the average diameter of the pores 3 exceeds the upper limit, it is difficult to make the distribution of the pores 3 uniform, and there is a risk that the distribution of the dielectric constant is likely to be biased.
  • the insulating layer 2 is formed of an insulating resin composition and pores 3 scattered in the resin composition. This insulating layer 2 is formed by applying and baking varnish on the outer peripheral surface of the conductor 1 described later.
  • thermosetting resin such as polyamideimide or thermosetting polyimide
  • thermoplastic resin such as polyetherimide, polyphenylene ether, polyethersulfone or thermoplastic polyimide.
  • the “main component” is a component having the largest content, for example, a component contained in an amount of 50% by mass or more.
  • the resin composition which forms the insulating layer 2 contain a hardening
  • Curing agents include titanium-based curing agents, isocyanate compounds, blocked isocyanates, urea and melamine compounds, amino resins, alicyclic acid anhydrides such as methyltetrahydrophthalic anhydride, aliphatic acid anhydrides, and aromatic acid anhydrides. Etc. are exemplified. These curing agents are appropriately selected according to the type of resin contained in the resin composition to be used. For example, in the case of polyamideimide, imidazole, triethylamine and the like are preferably used as the curing agent.
  • examples of the titanium-based curing agent include tetrapropyl titanate, tetraisopropyl titanate, tetramethyl titanate, tetrabutyl titanate, and tetrahexyl titanate.
  • isocyanate compounds include aromatic diisocyanates such as tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), p-phenylene diisocyanate, naphthalene diisocyanate, hexamethylene diisocyanate (HDI), 2,2,4-trimethylhexane diisocyanate, C3-C12 aliphatic diisocyanate such as lysine diisocyanate, 1,4-cyclohexane diisocyanate (CDI), isophorone diisocyanate (IPDI), 4,4′-dicyclohexylmethane diisocyanate (hydrogenated MDI), methylcyclohexane diisocyanate, isopropylidene Dicyclohexyl-4,4'-diisocyanate, 1,3-diisocyanatomethylcyclohexane (hydrogenated XDI , Hydrogenated TDI
  • Examples thereof include aliphatic diisocyanates having an aromatic ring such as 5-18 alicyclic isocyanate, xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI), and modified products thereof.
  • Examples of the blocked isocyanate include diphenylmethane-4,4′-diisocyanate (MDI), diphenylmethane-3,3′-diisocyanate, diphenylmethane-3,4′-diisocyanate, diphenylether-4,4′-diisocyanate, and benzophenone-4,4.
  • melamine compound examples include methylated melamine, butylated melamine, methylolated melamine, and butyrololized melamine.
  • the method of manufacturing the insulated wire includes diluting a resin that forms the insulating layer 2 and particles (thermally decomposable resin-containing particles) containing a thermally decomposable resin that thermally decomposes at a temperature lower than the baking temperature of the resin. (Varnish preparation process), the process of applying the varnish to the outer peripheral surface of the conductor 1 (varnish application process), and the process of removing the thermally decomposable resin in the thermally decomposable resin-containing particles by heating (heating) Step).
  • the resin forming the insulating layer 2 and the thermally decomposable resin-containing particles are diluted with a solvent to prepare a varnish.
  • the heat decomposable resin contained in the heat decomposable resin-containing particles is not particularly limited as long as the resin has a heat decomposition temperature lower than the baking temperature of the resin forming the insulating layer 2.
  • the baking temperature of the resin forming the insulating layer 2 is appropriately set according to the type of the resin, but is usually about 200 ° C. or higher and 350 ° C. or lower. Therefore, 200 degreeC is preferable as a minimum of the thermal decomposition temperature of the said thermally decomposable resin, and 300 degreeC is preferable as an upper limit.
  • the thermal decomposition temperature means a temperature at which the temperature is increased from room temperature to 10 ° C./min in a nitrogen atmosphere and the mass reduction rate becomes 50%.
  • the thermal decomposition temperature can be determined, for example, by measuring the thermogravimetry using a thermogravimetry-differential thermal analyzer (“TG / DTA” manufactured by SII Nano Technology).
  • the thermally decomposable resin is not particularly limited.
  • the thermally decomposable resin can be evenly distributed as an island phase of fine particles in the sea phase of the resin forming the insulating layer 2 in that independent pores can be formed. Therefore, the thermally decomposable resin is preferably a resin that is excellent in compatibility with the resin forming the insulating layer 2 and can be collected into a spherical shape, and specifically, a crosslinked resin.
  • the above-mentioned crosslinked poly (meth) acrylic polymer can be obtained by polymerizing, for example, a (meth) acrylic monomer and a polyfunctional monomer by emulsion polymerization, suspension polymerization, solution polymerization or the like.
  • the (meth) acrylic monomer acrylic acid, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, t-butyl acrylate, dodecyl acrylate, stearyl acrylate, acrylic acid 2 -Ethylhexyl, tetrahydrofurfuryl acrylate, diethylaminoethyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, n-octyl methacrylate , Dodecyl methacrylate, 2-ethylhexyl methacrylate, stearyl methacrylate, diethylaminoethyl methacrylate and the like.
  • examples of the polyfunctional monomer include divinylbenzene, ethylene glycol di (meth) acrylate, trimethylolpropane triacrylate and the like.
  • (meth) acrylic monomer and multifunctional monomer may be used as the constituent monomer of the crosslinked poly (meth) acrylic polymer.
  • Other monomers include glycol esters of (meth) acrylic acid such as ethylene glycol mono (meth) acrylate and polyethylene glycol mono (meth) acrylate, alkyl vinyl ethers such as methyl vinyl ether and ethyl vinyl ether, vinyl acetate and vinyl butyrate Vinyl esters, N-alkyl substituted (meth) acrylamides such as N-methylacrylamide, N-ethylacrylamide, N-methylmethacrylamide and N-ethylmethacrylamide, nitriles such as acrylonitrile and methacrylonitrile, styrene, p -Styrene monomers such as methylstyrene, p-chlorostyrene, chloromethylstyrene, ⁇ -methylstyrene, and the like.
  • the heat-decomposable resin-containing particles are preferably spherical.
  • the lower limit of the average particle size of the thermally decomposable resin-containing particles is preferably 0.1 ⁇ m, more preferably 0.5 ⁇ m, and even more preferably 1 ⁇ m.
  • the upper limit of the average particle size of the thermally decomposable resin-containing particles is preferably 100 ⁇ m, more preferably 50 ⁇ m, further preferably 30 ⁇ m, and particularly preferably 10 ⁇ m.
  • the thermally decomposable resin-containing particles form pores in portions where they were thermally decomposed when the resin forming the insulating layer 2 was baked.
  • the average particle size of the thermally decomposable resin-containing particles means a particle size showing the highest content ratio in the particle size distribution measured with a laser diffraction particle size distribution measuring device.
  • the lower limit of the content of the thermally decomposable resin in the varnish is preferably 5 parts by mass, more preferably 10 parts by mass, and even more preferably 15 parts by mass with respect to 100 parts by mass of the resin forming the insulating layer 2.
  • the upper limit of the content of the thermally decomposable resin in the varnish is preferably 350 parts by weight, more preferably 150 parts by weight, and still more preferably 90 parts by weight with respect to 100 parts by weight of the resin forming the insulating layer 2. . If the content of the thermally decomposable resin is less than the lower limit, the dielectric constant of the insulating layer 2 may not be sufficiently reduced. Conversely, if the content of the thermally decomposable resin exceeds the upper limit, the insulated wire may not be able to ensure sufficient strength.
  • the diluting solvent a known organic solvent conventionally used for insulating varnish can be used. Specifically, polar organic solvents such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, tetramethylurea, hexaethylphosphoric triamide, ⁇ -butyrolactone and the like are used.
  • ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, esters such as methyl acetate, ethyl acetate, butyl acetate, diethyl oxalate, diethyl ether, ethylene glycol dimethyl ether, diethylene glycol monomethyl ether, ethylene glycol monobutyl ether (butyl cellosolve) ), Ethers such as diethylene glycol dimethyl ether and tetrahydrofuran, hydrocarbons such as hexane, heptane, benzene, toluene and xylene, dichloro Examples include halogenated hydrocarbons such as methane and chlorobenzene, phenols such as cresol and chlorophenol, and tertiary amines such as pyridine. These organic solvents are used alone or in admixture of two or more. It is done.
  • the upper limit of the resin solid content concentration of the varnish is preferably 50% by mass, and more preferably 28% by mass.
  • the resin solid content concentration of the varnish is less than the lower limit, the amount of application at one time when applying the varnish decreases, and therefore the number of repetitions of the varnish application step for forming the insulating layer 2 having a desired thickness is reduced. There is a risk that the time for the varnish application process will be increased.
  • the resin solid content concentration of the varnish exceeds the above upper limit, the varnish thickens, so that the storage stability of the varnish may be deteriorated and the adhesion at the time of varnish application may be deteriorated.
  • the heat-decomposable resin-containing particles may be particles composed only of the heat-decomposable resin, but a core having the heat-decomposable resin as a main component and a thermal decomposition temperature of the heat-decomposable resin.
  • Core-shell particles having a shell mainly composed of a resin having a high thermal decomposition temperature are preferred.
  • the main component resin of the shell a resin having a low dielectric constant and high heat resistance is preferable.
  • the main resin of the shell include polystyrene, silicone, fluororesin, and polyimide.
  • silicone is preferable in that elasticity is imparted to the shell and insulation and heat resistance are easily improved.
  • the “fluororesin” is a fluorine atom or an organic group in which at least one hydrogen atom bonded to a carbon atom constituting the repeating unit of the polymer chain has a fluorine atom (hereinafter also referred to as “fluorine atom-containing group”). ).
  • the fluorine atom-containing group is a group in which at least one hydrogen atom in a linear or branched organic group is substituted with a fluorine atom, and examples thereof include a fluoroalkyl group, a fluoroalkoxy group, and a fluoropolyether group. Can do.
  • a metal may be contained in a shell in the range which does not impair insulation.
  • the same kind of resin as the resin forming the insulating layer 2 may be used as the main resin of the shell, or a different one may be used.
  • the thermal decomposition temperature is higher than that of the thermally decomposable resin. Since the main component resin is difficult to be thermally decomposed, the effect of suppressing the communication of the pores 3 can be obtained.
  • the insulated wire formed of such a varnish may not be able to confirm the presence of a shell even when observed with an electron microscope.
  • the shell can be made difficult to be integrated with the insulating layer 2 by using a resin different from the resin forming the insulating layer 2 as the main resin of the shell, the same kind of resin as the resin forming the insulating layer 2 can be used. Compared to the case of using a resin, the effect of suppressing the communication of the pores 3 is easily obtained.
  • the upper limit of the average thickness of the shell is preferably 0.5 ⁇ m, and more preferably 0.4 ⁇ m. If the average thickness of the shell is less than the above lower limit, the effect of suppressing the communication of the pores 3 may not be sufficiently obtained. On the contrary, if the average thickness of the shell exceeds the above upper limit, the volume of the pores 3 becomes too small, so that the porosity of the insulating layer 2 may not be increased beyond a predetermined level.
  • the shell may be formed of one layer or a plurality of layers. When the shell is formed of a plurality of layers, the average of the total thickness of the plurality of layers may be within the range of the thickness.
  • the upper limit of the CV value of the thermally decomposable resin-containing particles is preferably 30%, more preferably 20%.
  • the upper limit of the CV value of the thermally decomposable resin-containing particles is preferably 30%, more preferably 20%.
  • the insulating layer 2 is deteriorated due to the concentration of electric charges in the pores caused by the difference in pore size, and the strength of the insulating layer 2 is decreased due to the concentration of processing stress. Can be suppressed.
  • grain For example, it is 1%.
  • the “CV value” means a variable defined in JIS-Z8825 (2013).
  • ⁇ Varnish application process> In the varnish application step, after the varnish prepared in the varnish preparation step is applied to the outer peripheral surface of the conductor 1, the application amount of the varnish of the conductor 1 is adjusted and the applied varnish surface is smoothed by an application die.
  • the coating die has an opening, and when the conductor 1 coated with the varnish passes through the opening, the excess varnish is removed and the coating amount of the varnish is adjusted. Thereby, as for the said insulated wire, the thickness of the insulating layer 2 becomes more uniform, and the insulation and the intensity
  • the heating step the conductor 1 coated with the varnish is passed through a baking furnace, and the varnish is baked to form the insulating layer 2 on the surface of the conductor 1.
  • the thermally decomposable resin of the thermally decomposable resin-containing particles contained in the varnish is gasified and removed by thermal decomposition.
  • pores 3 derived from the thermally decomposable resin-containing particles are formed in the insulating layer 2.
  • the heating process also serves as a varnish baking process.
  • the insulating layer 2 includes the pores 3 and the porosity of the insulating layer 2 is within the above range, whereby the dielectric constant of the insulating layer 2 can be reduced.
  • the insulated wire can reduce the minimum film thickness by reducing the variation ratio of the film thickness of the insulating layer to the above value or less, thereby improving the corona discharge start voltage. In addition, it has excellent insulating properties and excellent strength.
  • the insulated wire in which one insulating layer is laminated on the outer peripheral surface of the conductor has been described, but an insulated electric wire in which a plurality of insulating layers are laminated on the outer peripheral surface of the conductor may be used. That is, one or a plurality of insulating layers may be laminated between the conductor 1 in FIG. 1 and the insulating layer 2 including the pores 3, and one or more insulating layers 2 including the pores 3 in FIG. A plurality of insulating layers may be stacked, or one or a plurality of insulating layers may be stacked on both the outer peripheral surface and the inner peripheral surface of the insulating layer 2 including the pores 3 in FIG.
  • an additional layer such as a primer treatment layer may be provided between the conductor and the insulating layer.
  • a primer process layer is a layer provided in order to improve the adhesiveness between layers, for example, can be formed with a well-known resin composition.
  • the resin composition forming this primer treatment layer is, for example, one or more kinds of resins selected from polyimide, polyamideimide, polyesterimide, polyester and phenoxy resin. It is good to include.
  • the resin composition forming the primer treatment layer may contain an additive such as an adhesion improver.
  • the resin composition forming the primer treatment layer may contain other resins such as an epoxy resin, a phenoxy resin, a melamine resin and the like together with the above resin.
  • the lower limit of the average thickness of the primer treatment layer is preferably 1 ⁇ m, and more preferably 2 ⁇ m.
  • an upper limit of the average thickness of a primer process layer 30 micrometers is preferable and 20 micrometers is more preferable. There exists a possibility that sufficient adhesiveness with a conductor cannot be exhibited as the average thickness of a primer process layer is less than the said minimum. Conversely, if the average thickness of the primer-treated layer exceeds the above upper limit, the insulated wire may be unnecessarily increased in diameter.
  • the insulated wire shown in 1 was manufactured as follows. First, polyimide as a resin for forming an insulating layer was diluted with N-methyl-2-pyrrolidone as a solvent. Next, the core as the thermally decomposable resin-containing particles is PMMA (polymethyl methacrylate resin) particles and the shell is a core-shell particle having an average particle diameter of 3 ⁇ m of silicone, and the calculated porosity is 30 volumes of the insulating layer. The varnish was prepared by dispersing in an amount of%.
  • PMMA polymethyl methacrylate resin
  • the insulated wire shown in 2 was manufactured as follows. First, polyimide as a resin for forming an insulating layer was diluted with N-methyl-2-pyrrolidone as a solvent. Next, core-shell particles having an average particle diameter of 3 ⁇ m, in which the core as the thermally decomposable resin-containing particles is PMMA particles and the shell is silicone, are dispersed in an amount such that the calculated porosity of the insulating layer is 30% by volume. A varnish was prepared. Using this varnish, using a vertical coating equipment, after immersing a square conductor with a cross section of 2 mm x 2 mm, a die having an opening similar to the conductor is passed at a speed of 6 m / min and baked. It was passed through a furnace and baked at 350 ° C. for 1 minute to form an insulating film. This varnish application, die passing and baking were repeated 15 times to produce an insulated wire (No. 2) having a polyimide resin coating as an insulating layer.
  • the insulated wire shown in 3 was manufactured as follows. First, polyimide as a resin for forming an insulating layer was diluted with N-methyl-2-pyrrolidone as a solvent. Next, core-shell particles having an average particle diameter of 3 ⁇ m, in which the core as the thermally decomposable resin-containing particles is PMMA particles and the shell is silicone, are dispersed in an amount such that the calculated porosity of the insulating layer is 30% by volume. A varnish was prepared. Using this varnish, using a vertical coating equipment, after immersing a square conductor with a cross section of 2 mm x 2 mm, a die having an opening similar to the conductor is passed at a speed of 6 m / min and baked.
  • the insulated wire shown in 4 was manufactured as follows. First, polyimide as a resin for forming an insulating layer was diluted with N-methyl-2-pyrrolidone as a solvent. Next, core-shell particles having an average particle diameter of 3 ⁇ m whose core as the thermally decomposable resin-containing particles is PMMA particles and whose shell is silicone are dispersed in an amount such that the calculated porosity of the insulating layer is 55% by volume. A varnish was prepared. Using this varnish, using a vertical coating equipment, after immersing a square conductor with a cross section of 2 mm x 2 mm, a die having an opening similar to the conductor is passed at a speed of 6 m / min and baked.
  • the insulated wire shown in 5 was manufactured as follows. First, polyimide as a resin for forming an insulating layer was diluted with N-methyl-2-pyrrolidone as a solvent. Next, an azo-based thermally expandable microcapsule particle as a pore-forming material was dispersed in an amount such that the calculated porosity of the insulating layer was 30% by volume to prepare a varnish. Using this varnish, using a vertical coating equipment, after immersing a square conductor with a cross section of 2 mm x 2 mm, a die having an opening similar to the conductor is passed at a speed of 6 m / min and baked. It was passed through a furnace and baked at 350 ° C. for 1 minute to form an insulating film. Application of this varnish, passing through a die, and baking were repeated 15 times to produce an insulated wire (No. 5) having a polyimide resin coating as an insulating layer.
  • FIG. 3 is a schematic diagram for explaining a dielectric constant measurement method.
  • a silver sample P was applied to three places on the surface of an insulated wire, and a measurement sample was prepared in which the conductor 1 was exposed by peeling off the insulating layer 2 on one end side of the insulated wire.
  • the coating length in the longitudinal direction of the insulated wire of the silver paste P applied to the three places on the surface of the insulated wire was 10 mm, 100 mm, and 10 mm in order along the longitudinal direction.
  • the two silver pastes P applied with a length of 10 mm are grounded, and the electrostatic capacity between the silver paste P with a length of 100 mm applied between these two silver pastes and the exposed conductor 1 is determined. Measured with LCR meter M.

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Abstract

La présente invention concerne un câble électrique isolé pourvu d'un conducteur linéaire et d'une couche isolante revêtue sur la surface périphérique externe dudit conducteur, la couche isolante comportant une pluralité de pores, la porosité de la couche isolante se situant dans la plage de 20 % en volume à 65 % en volume (inclus), l'épaisseur de film de la couche isolante étant mesurée en 8 points sur des sections transversales à 30 emplacements à intervalles de 50 cm dans le sens de la longueur du câble isolant, et le rapport de variabilité selon la formule (1) calculé à partir de ces mesures ne dépassant pas 25 %. Formule (1) : rapport de variabilité (%) = (4σ/épaisseur moyenne de film) × 100 (dans la formule (1), l'épaisseur moyenne de film représente une valeur moyenne de différentes mesures et σ représente l'écart type des différentes mesures)
PCT/JP2018/011304 2017-03-30 2018-03-22 Câble électrique isolé Ceased WO2018180847A1 (fr)

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JP2019509639A JP7214625B2 (ja) 2017-03-30 2018-03-22 絶縁電線

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JP7332000B1 (ja) 2022-07-22 2023-08-23 株式会社プロテリアル 絶縁電線および絶縁電線の製造方法
JP2025025847A (ja) * 2023-08-10 2025-02-21 Ｓｗｃｃ株式会社 エナメル線の製造方法

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WO2023153063A1 (fr) * 2022-02-08 2023-08-17 住友電気工業株式会社 Fil électrique isolé et procédé de fabrication de fil électrique isolé
JP7332000B1 (ja) 2022-07-22 2023-08-23 株式会社プロテリアル 絶縁電線および絶縁電線の製造方法
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JP2025025847A (ja) * 2023-08-10 2025-02-21 Ｓｗｃｃ株式会社 エナメル線の製造方法

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