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WO2018171093A1 - Tête d'impression thermique - Google Patents

Tête d'impression thermique Download PDF

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Publication number
WO2018171093A1
WO2018171093A1 PCT/CN2017/093268 CN2017093268W WO2018171093A1 WO 2018171093 A1 WO2018171093 A1 WO 2018171093A1 CN 2017093268 W CN2017093268 W CN 2017093268W WO 2018171093 A1 WO2018171093 A1 WO 2018171093A1
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WO
WIPO (PCT)
Prior art keywords
layer
infrared radiation
thermal printhead
infrared
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/093268
Other languages
English (en)
Chinese (zh)
Inventor
吕高仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Postek Electronics Co Ltd
Original Assignee
Postek Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Postek Electronics Co Ltd filed Critical Postek Electronics Co Ltd
Publication of WO2018171093A1 publication Critical patent/WO2018171093A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates

Definitions

  • the present invention relates to the field of printing equipment, and in particular to a thermal print head for thermal and thermal transfer printing
  • thermal printing and thermal transfer printing methods use a thermal printhead to heat the surface of a printing consumable to achieve printing.
  • the thermal printing method does not use a ribbon, and the thermal head directly heats the surface of the thermal printing medium to heat the sensitive components of the surface to print the corresponding pattern. Therefore, there is only one type of printing material for the thermal printing method. It is a thermal print medium with a heat sensitive material on its surface.
  • the ribbon is placed on the printing medium, and the heating element of the thermal head is pressed against the ribbon and the ribbon is pressed against the printing medium.
  • the heating element of the thermal head is heated, The ribbon is heated to melt or sublimate the ink on the ribbon and transfer it to the print media to print durable, durable prints. Therefore, thermal transfer printing supplies include ribbon and printing. medium.
  • Thermal printheads of the prior art typically use a "thermal conduction" approach to transfer thermal energy to the printing consumables.
  • a thermal print head comprising a metal substrate, a glass heat storage layer, a resistance layer, a conductive layer and a protective layer, and the metal substrate is attached with a thermal conductive adhesive.
  • a glass heat storage layer a vacuum sputtering resistance layer on the glass heat storage layer, a vacuum sputtering sputtering conductive layer on the resistance layer, a conductive layer is formed in the resistance layer portion to form a heating element, and a non-etched portion forms a conductive layer at both ends, in the heating body
  • the vacuum sputtering protection layer is connected to the common bus bar at one end, and the driving IC is connected to one end, and the ON and OFF states of the heating points are controlled by the IC.
  • heat conduction is essentially caused by the thermal motion of a large number of molecules, atoms, and free electrons in a substance colliding with each other, and transferring energy from a high temperature portion of the object to a low temperature portion, or from a high temperature object to a low temperature object. process.
  • the microscopic process of heat conduction is: In the high temperature part, the particle vibration energy of the object is large. In the low temperature part, the particle vibration kinetic energy is small. Because the vibration of the particles interacts, so The thermal energy inside the object is transmitted from a portion with a large kinetic energy to a portion having a small kinetic energy.
  • thermal printhead of the prior art has at least the following disadvantages due to the limitation of heat transfer mode:
  • the temperature of the heating element is much higher than the temperature of the heat-sensitive component in the thermal printing medium or the temperature required for the ribbon ink to melt or sublimate and then transfer from the base film of the ribbon to the printing medium.
  • the color temperature of thermal paper is about 70 °C; the melting or sublimation temperature of the ribbon is usually 65 ° C ⁇ 85 ° C.
  • the thermal print head works, and the temperature of the heating element usually reaches a high temperature of several hundred degrees to transfer the thermal energy layer to heat the printing consumable to its corresponding color, melt or sublimation temperature. Therefore, its heating efficiency is low, affecting the printing speed, and the same energy is wasted.
  • the technical problem to be solved by the present invention is that the thermal print head of the prior art has a slow printing speed, high printing energy consumption, large print head wear, and a print head due to the transfer of thermal energy to the printing consumables by the "heat conduction" method.
  • the problem of high manufacturing cost is difficult, and a new thermal print head is provided, which can transfer heat energy to the printing consumables by infrared radiation, thereby effectively improving the printing speed and greatly reducing the printing speed.
  • the present invention provides a thermal printhead comprising an infrared radiation layer, the infrared radiation layer being composed of an infrared radiation material for radiating heat to the printing consumable in a manner of heat radiation.
  • the thermal printhead further includes a substrate, an electrode layer and a protective layer, wherein
  • the infrared radiation layer is formed on the substrate and has a plurality of infrared radiators arranged at intervals, each of the infrared radiators including a radiation portion located at a middle portion and a guide portion at both ends of the radiation portion Connection
  • the electrode layer is partially attached to a plurality of guiding portions of the infrared radiator
  • the protective layer covers the electrode layer and the radiation portion of the infrared radiation layer.
  • the thermal printhead further includes a substrate, a resistive layer and an electrode layer, wherein
  • the resistance layer is formed on the substrate, and has a plurality of resistor heating elements arranged at intervals, each of the resistance heating elements including a heat generating portion located at a middle portion and a guide at both ends of the heat generating portion [0019] the electrode layer is partially attached to the conductive portion of the plurality of resistance heating elements;
  • the infrared radiation layer covers a plurality of heat generating portions of the resistance heating element.
  • the thermal printhead further includes a substrate, an electrode layer and a protective layer, wherein
  • the electrode layer is formed on the substrate and has a plurality of electrodes spaced apart from each other;
  • the infrared radiation layer has a plurality of guiding segments respectively attached to the plurality of electrodes and a plurality of radiating segments connecting the two adjacent guiding portions;
  • the protective layer covers the electrode layer and the infrared radiation layer.
  • the thermal printhead further includes a substrate, a resistive layer and an electrode layer, wherein
  • the electrode layer is formed on the substrate and has a plurality of electrodes spaced apart from each other; [0027] the resistance layer has a plurality of conduction segments respectively attached to the plurality of electrodes and a plurality of heating segments connecting the two adjacent conduction segments;
  • the infrared radiation layer covers a heat generating segment of the resistance layer.
  • the thermal printhead further includes a protective layer made of an infrared permeable material, and the protective layer covers the infrared ray layer and the electrode layer. .
  • the infrared radiation material has electrical conductivity.
  • the infrared radiation material has insulation properties.
  • the substrate includes a base layer and an insulating heat insulating layer formed on the base layer, and the insulating heat insulating layer is made of an insulating heat insulating material.
  • the thermal print head includes an infrared radiation layer, and the infrared radiation layer is composed of an infrared radiation material, and is used for The heat is radiated to the printing medium in the form of heat radiation. Therefore, the thermal print head can heat the printing consumable by means of infrared radiation, so that the infrared radiant heating has strong penetrating power, can be heated internally and externally, has a fast heating speed, and does not require heat transfer medium to be transferred.
  • the thermal efficiency is good, and the infrared absorption rate of the object to be heated is sufficiently high.
  • the heated object can reach the temperature close to the infrared radiation source in the short space, effectively improving the printing speed and greatly reducing the printing energy consumption, the print head. Mechanical wear and manufacturing difficulty and cost of the printhead.
  • FIG. 1 is a partial top plan view of a thermal printhead according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
  • FIG. 3 is a partial top plan view of a thermal printhead according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
  • FIG. 5 is a partial top plan view of a thermal printhead according to a third embodiment of the present invention.
  • FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;
  • FIG. 7 is a partial top plan view of a thermal printhead according to Embodiment 4 of the present invention
  • 8 is a schematic cross-sectional view taken along line AA of FIG. 7.
  • This embodiment provides a thermal printhead.
  • X represents the main scanning direction
  • Y represents the sub-scanning direction
  • Z represents the vertical direction from the XY plane.
  • the print head includes a substrate 1, an infrared radiation layer 2, an electrode layer 4, and a protective layer 5.
  • a protective layer 5 For the sake of easy understanding, only the structure in the XY plane of the infrared radiation layer 2 and the electrode layer 4 is illustrated in Fig. 1.
  • the substrate 1 is a rectangular flat plate extending in the main scanning direction X.
  • the substrate 1 package
  • the base layer 11, the metal layer and the insulating and heat insulating layer 12 are included.
  • the base layer 11 is formed of an alumina ceramic; a metal material (for example, Au or Cu, etc.) is plated on the base layer 11 to form the metal layer, and the metal layer can reduce the infrared radiation layer 2 to the Energy loss caused by radiation in the direction of the base layer 11; then an insulating heat insulating material is adhered to the metal layer by thick film printing and sintering to form the insulating and heat insulating layer 12, the insulating and heat insulating layer 12 The heat radiation of the infrared radiation layer 2 can be well avoided.
  • the infrared radiation layer 2 is formed on the substrate 1 with an infrared radiation material, and is composed of a plurality of strip-shaped infrared radiators 21 arranged at intervals.
  • an infrared radiation material for example, a composite of carbon or Sn0 2 having good electrothermal performance and high infrared radiance is attached to the insulating and heat insulating layer 12 by vapor deposition.
  • the initial layer of infrared radiation is formed, and the initial layer of the infrared radiation is further divided into strips by a photolithography technique to form a plurality of the strip-shaped infrared radiators 21.
  • Each of the infrared radiators 21 includes a radiation portion 211 located at a middle portion and a first guide portion 212 and a second guide portion 213 at both ends of the radiation portion 211, when the first guide is in the infrared radiator
  • the junction portion 212 and the second junction portion 213 are loaded with a current ⁇ , and the surface temperature of the radiation portion 211 increases approximately linearly with an increase in the load current, and the infrared radiance of the radiation portion 211 also rises. To a higher level.
  • the electrode layer 4 is attached to the first guiding portion 212 and the second guiding portion 21 3 of the plurality of the infrared radiators 21. Specifically, first, a metal material (for example, A1 or the like) is deposited on the infrared radiation layer 2 (that is, a plurality of the infrared radiation bodies 21) by magnetron sputtering to form an initial layer of the electrode, and then photolithography is employed. The initial layer of the electrode is prepared into a desired circuit pattern to form the electrode layer 4 such that the radiation portion 211 of the infrared radiator 21 is exposed to the electrode layer 4.
  • the electrode layer 4 includes a common electrode 4a and a plurality of independent electrodes 4b.
  • the common electrode 4a includes a plurality of first connecting ends respectively attached to the plurality of the first guiding portions 212, and A plurality of the common ends of the first connection ends are connected to each other; and the plurality of the independent electrodes 4b are respectively attached to the plurality of the second guiding portions 213.
  • the radiation portion 211 of the infrared radiator 21 is exposed between the common electrode 4a and the individual electrode 4b.
  • the independent electrode 4b can be selectively turned on by the control system. When the electrode 4b is turned on, current flows through the radiation portion 211 of the infrared radiator 21, causing the radiation portion 211 to generate heat and radiate infrared rays. , Heating the printing supplies to complete the printing action.
  • the protective layer 5 covers the electrode layer 4 and the radiation portion 211 of the infrared radiation layer 2, the protection Layer 5 is made of materials with high temperature resistance, wear resistance, corrosion resistance, low friction coefficient and infrared penetrability.
  • silicon nitride for example, silicon nitride or glass, etc.
  • silicon nitride Si 3 N 4
  • the protective layer 5 serves to protect the infrared radiator 21 and the electrode layer 4.
  • This embodiment provides a thermal printhead, see FIG. 3 and FIG. 4, in the coordinate system, X represents the main scanning direction, Y represents the sub-scanning direction, and Z represents the vertical direction from the XY plane.
  • the thermal printhead includes a substrate 1, a resistive layer 3, an electrode layer 4, an infrared radiation layer 2, and a protective layer 5.
  • a protective layer 5 For the sake of easy understanding, only the structures in the XY plane of the resistive layer 3 and the electrode layer 4 are shown in Fig. 3.
  • the substrate 1 is a rectangular flat plate extending in the main scanning direction X.
  • the substrate 1 includes a base layer 11 and an insulating and heat insulating layer 12.
  • the base layer 11 is formed of an alumina ceramic; a layer of insulating and heat insulating material is adhered to the base layer 11 by thick film printing and sintering to form the insulating and heat insulating layer 12, and the insulating and heat insulating layer 12 may be It is good to avoid the heat dissipation of the resistive layer 3 during operation, thereby facilitating heat storage.
  • the resistor layer 3 is formed on the substrate 1 and is composed of a plurality of strip-shaped resistor heating elements 31 arranged at intervals.
  • a layer of ⁇ Ta-based resistive material is adhered to the insulating and heat insulating layer 12 by magnetron sputtering to form an initial layer of resistance, and then the initial layer of the resistor is separated into spaced strips by photolithography.
  • a plurality of the strip-shaped resistance heating elements 31 are formed.
  • Each of the resistance heating elements 31 includes a heat generating portion 311 located at a middle portion and a first conductive portion 312 and a second conductive portion 313 located at both ends of the heat generating portion 311.
  • the electrode layer 4 is attached to the first conductive portion 312 and the second conductive portion 313 of the plurality of the resistance heating elements 31. Specifically, first, a metal material (for example, A1 or the like) is deposited on the resistance layer 3 (that is, a plurality of the resistance heating elements 31) by magnetron sputtering to form an initial layer of electrodes, and then lithography is used.
  • the electrode initial layer is prepared in a desired circuit pattern to form the electrode layer 4 such that the heat generating portion 311 of the resistance heat generating body 31 is exposed to the electrode layer 4.
  • the electrode layer 4 includes a common electrode 4a and a plurality of independent electrodes 4b.
  • the common electrode 4a includes a plurality of first connection ends respectively attached to the plurality of the first conductive portions 312, and The plurality of the independent electrodes 4b are respectively connected to the plurality of the second conductive portions 313.
  • the heat generating portion 311 of the resistance heat generating body 31 is exposed between the common electrode 4a and the individual electrode 4b.
  • the individual electrode 4b can be selectively controlled by the control system When the electrode 4b is turned on, a current flows through the heat generating portion 311 of the resistance heating body 31 to cause the heat generating portion 311 to generate heat.
  • the infrared radiation layer 2 covers the heat generating portions 311 of the plurality of the resistance heating elements 31. Specifically, a metal oxide having a high infrared radiance and not conducting (for example, a composite of ZrO 2 , SiO 2 ) is deposited on the resistance layer 3 and the heat generating portion 311 of the electrode layer 4 to form the infrared radiation. Layer 2.
  • the heat generating portion 311 of the resistance heat generating body 31 generates heat, the temperature of the portion of the infrared radiation layer 2 adhering to the heat generating portion 311 rises, and the infrared ray is efficiently radiated, thereby heating the printing consumable to complete the printing. action.
  • the infrared radiation layer 2 has a certain protective effect on the resistance heating body 31 and the electrode layer 4 due to the material properties used.
  • the protective layer 5 covers the infrared radiation layer 2 and the electrode layer 4, and the protective layer 5 is provided with high temperature resistance, wear resistance, corrosion resistance, low friction coefficient, and infrared penetrability.
  • the material for example, silicon nitride or glass, etc.
  • silicon nitride Si 3 N 4
  • the protective layer 5 serves to protect the infrared radiation layer 2 and the electrode layer 4.
  • This embodiment provides a thermal printhead.
  • X represents the main scanning direction
  • Y represents the sub-scanning direction
  • Z represents the vertical direction from the XY plane.
  • the thermal printhead includes a substrate 1, an electrode layer 4, an infrared radiation layer 2, and a protective layer 5.
  • a protective layer 5 For the sake of easy understanding, only the structure in the XY plane of the electrode layer 4 and the infrared radiation layer 2 is illustrated in Fig. 5.
  • the substrate 1 is a rectangular flat plate extending in the main scanning direction X.
  • the substrate 1 includes a base layer 11, a metal layer, and an insulating and heat insulating layer 12.
  • the base layer 11 is formed of an alumina ceramic; a metal material (for example, Au or Cu, etc.) is plated on the base layer 11 to form the metal layer, and the metal layer can reduce the infrared radiation layer 2 to the Energy loss caused by radiation in the direction of the base layer 11; then an insulating heat insulating material is adhered to the metal layer by thick film printing and sintering to form the insulating and heat insulating layer 12, the insulating and heat insulating layer 12 The heat radiation of the infrared radiation layer 2 can be well avoided.
  • the electrode layer 4 is formed on the substrate 1 and has a plurality of electrodes spaced apart from each other. Specifically, the electrode layer 4 is formed by performing thick film printing on the insulating and heat insulating layer 12 from an Au paste, followed by sintering.
  • the electrode layer 4 has a common electrode 4c and a plurality of independent electrodes 4d arranged in the main scanning direction X . As shown in FIG. 5, the common electrode 4c has a plurality of sub-bands arranged in a strip shape spaced apart in the main scanning direction X, and a master tape connecting the plurality of sub-bands, each of the individual electrodes 4d.
  • a part of the sub-scanning direction Y extends into the gap between two adjacent sub-bands of the common electrode 4c, and the common electrode 4c and the individual electrode 4d do not contact each other, and do not constitute a circuit loop.
  • the individual electrode 4d can be selectively turned on by the control system.
  • the infrared radiation layer 2 has a plurality of guiding segments 23 respectively attached to the plurality of electrodes and a plurality of radiating segments 22 connecting the two adjacent guiding portions.
  • the infrared radiation layer 2 is formed of a material having good electrothermal performance and a high infrared radiance (for example, a composite of carbon or Sn0 2 ).
  • a thick film printing is used for re-sintering.
  • An elongated strip-shaped conductive carbon film extending in the main scanning direction X is attached to the electrode layer 4 to form the infrared radiation layer 2.
  • the infrared radiation layer 2 and the common electrode 4c and all of the individual electrodes 4d have overlapping portions.
  • the portion of the infrared radiation layer 2 that overlaps the common electrode 4c and the individual electrode 4d is the guiding portion 23, and the portion between the two adjacent guiding segments 23 is Radiation section 22.
  • the individual electrode 4d When the individual electrode 4d is turned “on”, current flows through the radiant section 22, causing the radiant section 22 to generate heat and radiate infrared rays, and heating the printing consumable to complete the printing action.
  • the protective layer 5 covers the electrode layer 4 and the infrared radiation layer 2 for protecting the infrared radiation layer 2 and the electrode layer 4.
  • the protective layer 5 is composed of a material (e.g., silicon nitride or glass) having properties such as high temperature resistance, abrasion resistance, corrosion resistance, low friction coefficient, and infrared penetrability.
  • the protective layer 5 is formed by performing thick film printing on the electrode layer 4 and the infrared ray layer 2 on an amorphous glass (glass paste material), followed by sintering.
  • This embodiment provides a thermal printhead.
  • X represents the main scanning direction
  • Y represents the sub-scanning direction
  • Z represents the vertical direction from the XY plane.
  • the thermal printhead includes a substrate 1, an electrode layer 4, a resistive layer 3, an infrared radiation layer 2, and a protective layer 5.
  • a protective layer 5 For the sake of easy understanding, only the structure in the XY plane of the electrode layer 4 and the resistance layer 3 is shown in Fig. 7.
  • the substrate 1 is a rectangular flat plate extending in the main scanning direction X.
  • the substrate 1 includes a base layer 11 and an insulating and heat insulating layer 12.
  • the base layer 11 is formed of an alumina ceramic; a layer of insulating and heat insulating material is attached to the base layer 11 by thick film printing and sintering to form the insulating and heat insulating layer 12,
  • the insulating and insulating layer 12 can well prevent the heat dissipation of the resistive layer 3 during operation, thereby facilitating heat storage.
  • the electrode layer 4 is formed on the substrate 1 and has a plurality of electrodes spaced apart from each other. Specifically, the electrode layer 4 is formed by performing thick film printing on the insulating and heat insulating layer 12 from an Au paste, followed by sintering.
  • the electrode layer 4 has a common electrode 4c and a plurality of individual electrodes 4d spaced apart in the main scanning direction X. As shown in FIG. 7, the common electrode 4c has a plurality of sub-bands arranged in a strip shape spaced apart in the main scanning direction X and a master tape connecting the plurality of sub-bands, each of the individual electrodes 4d.
  • a part of the sub-scanning direction Y extends into the gap between two adjacent sub-bands of the common electrode 4c, and the common electrode 4c and the individual electrode 4d do not contact each other, and do not constitute a circuit loop.
  • the individual electrode 4d can be selectively turned on by the control system.
  • the resistive layer 3 has a plurality of conductive segments 33 respectively attached to the plurality of electrodes and a plurality of heat generating segments 32 connecting the two adjacent conductive segments 33.
  • the resistive layer 3 is formed of a material having a large resistivity (for example, yttrium oxide or the like).
  • a layer of printing along the main scanning direction is attached to the electrode layer 4 by thick film printing and sintering.
  • An elongated strip-shaped film of yttrium oxide material extending from X forms the resistive layer 3.
  • the resistive layer 3 overlaps with the common electrode 4c and all of the individual electrodes 4d.
  • the portion of the resistive layer 3 that overlaps the common electrode 4c and the individual electrode 4d is the conductive segment 33, and the portion between the two adjacent conductive segments 33 is the heat.
  • Paragraph 3 2 When the individual electrode 4d is turned “on”, a current flows through the heat generating portion 32, causing the heat generating portion 32 to generate heat.
  • the infrared radiation layer 2 covers the heat generating section 32 of the resistance layer 3. Specifically, a ceramic material having a high infrared radiance is attached to the electrode layer 4 and the resistive layer 3 by a thick film printing and sintering method to form the infrared ray layer 2.
  • the heat generating section 32 is heated, the temperature of the portion of the infrared radiation layer 2 adhering to the heat generating section 32 rises, and the infrared rays are efficiently radiated, thereby heating the printing consumables to complete the printing operation.
  • the infrared radiation layer 2 has a certain protective effect on the resistance heating element 31 and the electrode layer 4 due to the material properties used.
  • the protective layer 5 covers the infrared radiation layer 2 and the electrode layer 4 for protecting the infrared radiation layer 2 and the electrode layer 4.
  • the protective layer 5 is composed of a material (for example, silicon nitride or glass) having high temperature resistance, abrasion resistance, corrosion resistance, low friction coefficient, and infrared ray penetrability.
  • the protective layer 5 is made of amorphous glass (glass paste material) on the electrode layer 4 and the infrared radiation. After the thick film printing is performed on the layer 2, it is formed by sintering.
  • the thermal print heads provided in Examples 1, 2, 3, and 4 all include an infrared radiation layer 2 composed of an infrared radiation material, thereby performing thermal processing using the thermal print head.
  • the thermal print head can heat the printing consumables by means of infrared radiation.
  • the infrared radiation heating method has the following advantages: 1) has penetrating power, can be heated internally and externally, and has a fast heating speed; 2) no heat transfer medium is required, and the heat efficiency is good; 3) the infrared absorption rate of the heated object is sufficient Sorghum, the heated object can reach a temperature close to the infrared radiation source in the short squat.
  • the thermal print heads provided by the first, second, third and fourth embodiments will bring the following advantages:
  • the thermal print head transfers heat energy by means of infrared radiation, and after heating the printing consumables, the radiated infrared rays can directly heat the printing consumables, and the thermal print head does not need to be pressed in the printing consumables for uploading. Heat. Thereby, the thermal print head is effectively prevented from being worn by the printing consumables.
  • the thermal print head transfers heat energy by means of infrared radiation, and after heating the printing consumable, the thermal print head only needs to reach a color slightly higher than that of the thermal print medium in thermal printing.
  • the temperature required for the transfer of the ribbon ink in temperature or thermal transfer printing ensures that the printing process is completed smoothly. Therefore, the manufacturing process of the thermal print head is simpler and the manufacturing cost is also lower. Peer-to-peer also reduces energy consumption during printing.
  • the thermal print head uses infrared radiation to transfer thermal energy. Since the efficiency of infrared radiation heating is much higher than that of the heat conduction method, the thermal print head can be quickly heated after the printing consumable is heated. The printing consumables are heated to increase the printing speed.
  • the present invention provides a thermal printhead that overcomes the deficiencies of prior art thermal printheads that transfer heat in a thermally conductive manner.

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Abstract

L'invention concerne une tête d'impression thermique, comprenant une couche de rayonnement infrarouge (2) constituée d'un matériau de rayonnement infrarouge et destinée à rayonner de la chaleur vers des supports d'impression dans le mode de rayonnement thermique. Par conséquent, la tête d'impression thermique peut chauffer des consommables d'impression dans le mode de rayonnement infrarouge. Le chauffage par rayonnement infrarouge ne nécessite aucun support de transfert thermique, et présente une pénétrabilité élevée, la capacité de chauffage interne et externe simultané, et une vitesse de chauffage rapide. De plus, le taux d'absorption infrarouge d'un objet chauffant est suffisamment élevé, et l'objet chauffant peut atteindre une température proche de celle d'une source de rayonnement infrarouge en peu de temps. La tête d'impression thermique ainsi conçue améliore efficacement la vitesse d'impression, et réduit considérablement la consommation d'énergie d'impression ainsi que la perte mécanique, la difficulté de fabrication et les coûts de la tête d'impression.
PCT/CN2017/093268 2017-03-20 2017-07-18 Tête d'impression thermique Ceased WO2018171093A1 (fr)

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