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WO2018168287A1 - Dispositif terminal d'informations - Google Patents

Dispositif terminal d'informations Download PDF

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Publication number
WO2018168287A1
WO2018168287A1 PCT/JP2018/004739 JP2018004739W WO2018168287A1 WO 2018168287 A1 WO2018168287 A1 WO 2018168287A1 JP 2018004739 W JP2018004739 W JP 2018004739W WO 2018168287 A1 WO2018168287 A1 WO 2018168287A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
circuit board
ssd
flexible circuit
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/004739
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English (en)
Japanese (ja)
Inventor
眞一 廣瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Client Computing Ltd
Original Assignee
Fujitsu Client Computing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Client Computing Ltd filed Critical Fujitsu Client Computing Ltd
Publication of WO2018168287A1 publication Critical patent/WO2018168287A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements

Definitions

  • This application relates to information terminal devices.
  • SSD Solid State Drive
  • NAND flash memory NAND flash memory
  • the SSD provided in the information terminal device is provided with a temperature sensor in the vicinity of the NAND flash memory. This temperature sensor is provided so that when the SSD reaches a predetermined temperature or higher, the processing speed is automatically reduced so that a thermal runaway state called thermal throttling does not occur.
  • HDD hard disk drive
  • the CPU measures the temperature uniquely measured by the SSD. Information cannot be obtained. If the CPU can acquire the temperature information of the SSD, before the SSD goes into a thermal runaway state, the amount of heat generated can be reduced by increasing the amount of air blown by the cooling fan or decreasing the frequency of the CPU itself. You can take action.
  • the object is to measure the temperature of a temperature measurement object without increasing wiring.
  • a temperature measurement object for measuring temperature there are a flexible circuit board arranged so as to straddle the temperature measurement object, and a temperature sensor for measuring the temperature of the temperature measurement object, which is flexible
  • the temperature sensor is provided in a portion of the circuit board across the temperature measurement object and connected to a part of the wiring of the flexible circuit board, and the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected.
  • a processing device that receives and processes the temperature information of the temperature measurement object measured in step (1).
  • the temperature of the temperature measurement object can be measured without providing separate wiring.
  • FIG. 1 is a perspective view showing a notebook personal computer which is the disclosed information terminal device.
  • FIG. 2A is a plan view showing the inside of an information terminal device body as a comparative technique.
  • 2B is a cross-sectional view of the information terminal device main body taken along line B2-B2 in a state in which the upper surface cover is attached to the information terminal device main body shown in FIG. 2A.
  • FIG. 3A is a plan view showing the inside of the disclosed information terminal device main body.
  • FIG. 3B is a cross-sectional view of the information terminal device main body taken along line B3-B3 in a state where the upper surface cover is attached to the information terminal device main body shown in FIG. 3A.
  • FIG. 4A is a plan view showing a first embodiment of a flexible circuit board provided in the disclosed information terminal device body.
  • 4B is a cross-sectional view taken along line B4-B4 of FIG. 4A.
  • FIG. 5 is a perspective view showing a part of the first embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 6A is a plan view showing a second embodiment of the flexible circuit board provided in the disclosed information terminal device main body. 6B is a cross-sectional view taken along line B6-B6 of FIG. 6A.
  • FIG. 7 is a perspective view showing a part of the second embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 8A is a plan view showing a third embodiment of the flexible circuit board provided in the disclosed information terminal device main body.
  • FIG. 8B is a sectional view taken along line B8-B8 in FIG. 8A.
  • FIG. 9 is a perspective view showing a part of a third embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 10 is a plan view showing a fourth embodiment of the flexible circuit board provided in the disclosed information terminal device body.
  • FIG. 11A is a plan view showing a fifth embodiment of the flexible circuit board provided in the disclosed information terminal device main body.
  • FIG. 11B is a sectional view taken along line B11-B11 in FIG. 11A.
  • FIG. 12 is a flowchart showing a flow of processing in which the CPU of the information terminal device controls the operation of the SSD based on temperature information from the temperature sensor.
  • FIG. 1 is a perspective view showing a notebook personal computer 1 which is an example of the information terminal device of the present embodiment.
  • the notebook computer 1 includes a terminal body 10 and a display 11 that is opened and closed at the rear end of the terminal body 10 via a hinge.
  • FIG. 1 shows a state in which the display 11 is opened.
  • the terminal body 10 houses a circuit board on which electronic components such as a CPU and an SSD are mounted.
  • Input devices such as a keyboard and a touch panel are provided on the upper surface of the terminal body 10.
  • FIG. 2A is a plan view showing the internal structure of the terminal main body 110 of the notebook computer of the comparative technique, and shows a state in which the upper cover of the casing 120 of the terminal main body 110 is removed.
  • FIG. FIG. 6 is a sectional view taken along line B2-B2.
  • the terminal main body 110 includes a housing 120, a main circuit board 121 and a sub circuit board 122 provided in the housing 120, a battery 140, and a cooling fan 124.
  • a CPU 123 as a processing device
  • an SSD 125 as a storage device
  • the SSD 125 is connected to the main circuit board 121 by a connector 135a.
  • terminals for connecting to an external device are mounted on the sub circuit board 122.
  • the main circuit board 121 and the sub circuit board 122 are connected by a flexible circuit board 129 via connectors 135b and 135c provided respectively.
  • a flexible circuit substrate 129 is used as means for transmitting a signal of one substrate (main circuit substrate 121) to the other substrate (sub circuit substrate 122).
  • connectors 135b and 135c are provided so that the flexible circuit board 129 protruding from the end of one board is connected to the end of the other board so that the length of the flexible circuit board 129 becomes shorter.
  • the battery 140 is a power source for operating the CPU 123 and the SSD 125.
  • the CPU 123 mounted on the main circuit board 121 is provided with a CPU heat radiation plate 131. Then, the cooling fan 124 rotates according to the instruction of the CPU 123, whereby cooling air flows, and the CPU heat dissipation plate 131 is cooled, so that the CPU 123 in contact with it is cooled.
  • the housing 120 is provided with a suction port 136 for taking in outside air and a discharge port 137 for discharging air taken in the vicinity of the cooling fan 124.
  • the SSD 125 is an example of a storage device mounted on an information terminal device, and includes an SSD substrate 128, a plurality of NAND flash memories 126 mounted on the SSD substrate 128, and an SSD temperature sensor that measures the temperature of the SSD 125. 127.
  • the SSD 125 is connected to the main circuit board 121 via the connector 135a.
  • a heat radiating plate 130 for cooling the SSD 125 is disposed between the SSD 125 and the main circuit board 121. Since the SSD temperature sensor 127 is not connected to the CPU 123 on the main circuit board 121, the CPU 123 cannot monitor and control the temperature of the NAND flash memory 126 mounted on the SSD 125. Therefore, the heat radiating plate 130 is disposed as a physical heat radiating measure.
  • the SSD 125 determines that the SSD 125 is in a thermal runaway state when the temperature obtained by the SSD temperature sensor exceeds a predetermined value. And since the SSD 125 itself lowers the operating speed of the SSD 125 itself, it leads to a decrease in the performance of the information terminal device. Also, the operation of the SSD 125 during a thermal runaway is different for each manufacturer and is not unified. For example, when there is a thermal runaway, there are things that gradually lower the performance, and those that lower the performance at once.
  • the CPU 123 of the information terminal device directly monitors the state of the SSD 125 and controls the operation of the SSD 125 and the cooling fan 124 to prevent the performance of the information terminal device from being deteriorated due to the unpredictable operation of the SSD 125. It was done.
  • the arrangement of the NAND flash memory and the temperature sensor in the SSD differs depending on the manufacturer and the generation in which it is manufactured. For this reason, even if different NAND flash memories for different manufacturers are arranged at different locations, a temperature sensor capable of appropriately measuring the temperatures is required.
  • FIG. 3A The information terminal device of the present invention will be described with reference to FIGS. 3A to 12.
  • FIG. 3A The information terminal device of the present invention will be described with reference to FIGS. 3A to 12.
  • FIG. 3A is a plan view showing the internal structure of the terminal body 10 of the notebook personal computer 1 which is an example of the information processing terminal according to the present invention, and shows a state in which the top cover of the casing 20 of the terminal body 10 is removed. It is.
  • FIG. 3B is a cross-sectional view taken along line B3-B3 of FIG. 3A and shows a state where the top cover is covered.
  • the terminal body 10 is similar to the terminal body 110 of the notebook computer of the comparative technique shown in FIG. 2, the housing 20, the main circuit board 21 and the sub circuit board 22 provided inside the housing 20, the battery 40, And a cooling fan 24.
  • the SSD 25 is connected to the main circuit board 21 by a connector 35a.
  • terminals for connecting to an external device are mounted on the sub circuit board 22.
  • the CPU 23 mounted on the main circuit board 21 is provided with a CPU heat radiation plate 31.
  • the cooling fan 24 rotates in response to an instruction from the CPU 23 and can cool the CPU 23 by cooling the CPU heat radiation plate 31 with cooling air. Further, the cooling fan 24 rotates, so that the SSD 25 provided on the main circuit board 21 can also be cooled.
  • the housing 20 is formed with a suction port 36 for taking in outside air and a discharge port 37 for discharging the taken outside air.
  • an SSD 25 (an example of a temperature measurement object) is mounted as a storage device, similarly to the information terminal device of the comparative technique.
  • the SSD 25 includes an SSD substrate 28, a plurality of NAND flash memories 26 mounted on the SSD substrate 28, and an SSD temperature sensor 27 that measures the temperature of the SSD 25.
  • the SSD 25 is connected to the main circuit board 21 via the connector 35a. Further, a heat dissipation plate 30 for cooling the SSD 25 is disposed between the SSD 25 and the main circuit board 21.
  • a flexible circuit board 29 that connects the main circuit board 21 and the sub circuit board 22 is disposed so as to straddle the SSD 25.
  • One end of the flexible circuit board 29 is connected to the connector 35 b of the main circuit board 21, and the other end is connected to the connector 35 c of the sub circuit board 22.
  • the flexible circuit board 29 has a plurality of wirings 34 passing therethrough, and the main circuit board 21 is connected via connectors 35b and 35c provided on the main circuit board 21 and the sub circuit board 22, respectively.
  • the sub circuit board 22 transmit and receive signals.
  • a temperature sensor 32 that measures the temperature of the SSD 25 is provided above the portion where the flexible circuit board 29 straddles the SSD 25. As shown in FIGS. 4B and 5, the temperature sensor 32 is connected to two of the plurality of wirings 34 of the flexible circuit board 29. Since the wiring 34 is close to the SSD 25, the temperature sensor 32 can measure the temperature of the SSD 25. One of the wirings connected to the temperature sensor 32 is connected to the CPU 23, and the temperature information measured by the temperature sensor 32 can be sent to the CPU 23 via the wiring 34. That is, the CPU 23 receives the temperature information of the SSD 25 measured by the temperature sensor 32 via a part of the wiring 34 connected to the temperature sensor 32. In addition, the wiring 34 which connects CPU23 and the temperature sensor 32 uses the wiring which is not used for the communication of the signal of board
  • the flexible circuit board 29 is a thin plate, if it is arranged on the SSD 25 of the temperature measurement object that generates heat, the flexible circuit board 29 and the back side thereof also have substantially the same heat. Therefore, if the temperature sensor 32 is arranged on the flexible circuit board 29, the temperature of the SSD 25 can be measured.
  • the temperature sensor 32 may be disposed at any location on the flexible circuit board 29 as long as it can be connected to the wiring 34. Further, as shown in FIG. 3B, a fixing cushion 39 is disposed between the inner wall of the housing 20 and the flexible circuit board 29 so that the flexible circuit board 29 and the SSD 25 as the temperature measurement object are in close contact with each other. Also good.
  • the flexible circuit board 29a includes a metal pattern 33 for assisting temperature detection instead of arranging the wiring 34 in a portion straddling the SSD 25.
  • the metal pattern 33 is provided by enlarging the width of a part of the wiring of the flexible circuit board 29.
  • the metal pattern 33 of the second embodiment is made of copper, the metal pattern 33 may be made of another material, such as aluminum, as long as it is made of a metal having good thermal conductivity.
  • the flexible circuit board 29a is wider than the case where the normal wiring 34 is used, and can contact the SSD 25 in a wider range. That is, although the arrangement of the NAND flash memory 26 differs depending on the manufacturer, it is possible to perform measurement by contacting the NAND flash memory 26 by providing the wide metal pattern 33.
  • the flexible circuit board 29b shows a flexible circuit board 29b according to the third embodiment.
  • the wide metal pattern 33 is arranged like the flexible circuit board 29a of the second embodiment, the area through which the wiring 34 passes is reduced, and the number of the wirings 34 is reduced.
  • the width of the metal pattern 33b is made equal to the width of the flexible circuit board 29b, and The number of wirings 34 can be maintained. If the width of the SSD 25 and the width of the metal pattern 33b of the flexible circuit board 29b are substantially the same size, the metal pattern 33b can remove the heat of the NAND flash memory 26 no matter how the NAND flash memory 26 is arranged. Can receive.
  • FIG. 10 shows a flexible circuit board 29c according to the fourth embodiment.
  • the inside of the flexible circuit board 29b has two layers, and the wiring 34 and the metal pattern 33b are arranged.
  • the metal pattern 33 is arranged at the center of the flexible circuit board 29 with a single layer, and the width of the flexible circuit board 29 where the metal pattern 33 is arranged is not arranged. It is wider than the width.
  • wirings 34 are arranged on both sides of the metal pattern 33. By arranging the metal patterns 33 and the wirings 34 in this manner, the number of the wirings 34 can be maintained, and a wider metal pattern 33 can be provided.
  • FIG. 11A and FIG. 11B show a flexible circuit board 29d according to the fifth embodiment.
  • the metal pattern 33 is separately prepared and provided on the flexible circuit board 29 in advance.
  • a temperature detection assisting metal pattern is formed by connecting some of the wirings 34 of all the wirings 34.
  • the plurality of wirings 34 are preferably connected in the vicinity of the end portion of the SSD 25 when the flexible circuit board 29 d covers the SSD 25.
  • the plurality of wirings 34 can be connected by forming a hole penetrating the coating of the flexible circuit board and providing a connecting metal 38 such as a metal tape outside the coating through the hole.
  • the temperature sensor 32 can acquire temperature information from the SSD 25 via a plurality of wires 34.
  • step S ⁇ b> 101 the CPU 23 receives temperature information from the temperature sensor 32 and detects the temperature of the SSD 25.
  • step S102 the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a predetermined temperature (specified value).
  • the CPU 23 determines that there is no danger that the SSD 25 is in a thermal runaway state, and the SSD 25 is not sent to the temperature sensor 32 without performing any particular processing on the SSD 25. Continue to detect the temperature.
  • the temperature of the SSD 25 is not lower than the specified value (in the case of NO)
  • the SSD 25 may be in a thermal runaway state, so the CPU 23 executes a process for cooling the SSD 25.
  • the CPU 23 performs a process of increasing the rotational speed of the cooling fan 24 (rotational speed UP), increasing the air volume, or decreasing the operating speed (operating frequency) of the CPU 23 (Clock Down).
  • the CPU 23 After executing the process of cooling the SSD 25, the CPU 23 detects the temperature of the SSD 25 again based on the temperature information received from the temperature sensor 32 (step S104). Then, the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a specified value (step S105). If it falls below the specified value (in the case of YES), it is determined that there is no longer a possibility of a thermal runaway state. Then, the rotation speed of the cooling fan 24 is decreased (rotation speed DOWN) to reduce the air volume, or the operation speed (operation frequency) of the CPU 23 is increased (Clock Up) (step S106).
  • step S104 If it does not fall below the specified value (in the case of NO), the process of cooling the SSD 25 is continued as it is, and the process returns to step S104 so as to continue detecting the temperature of the SSD 25.
  • the temperature detection is continued until the information terminal device 1 is turned off (step S107). If the power is not turned off in step S107 (in the case of NO), the process returns to step S101, and the CPU 23 detects the temperature of the SSD 25 and continues monitoring so as not to be in a thermal runaway state.
  • the CPU 23 can control the SSD 25 so that it does not go into a thermal runaway state.
  • the intended performance of the information terminal device 1 can be controlled.
  • the temperature information of the SSD 25 can be obtained only by changing the arrangement of the flexible circuit board 29, no additional wiring is required. Therefore, the number of parts such as wiring provided on the circuit board does not increase, and the number of operations for incorporating wiring and the like does not increase.
  • the SSD 25, which is a temperature measurement object is an M.M. It may be a 2 (M dot toe) type SSD.
  • the SSD 25 may be an SSD with SATA connection.
  • the temperature measurement object is not limited to SSD, but a device that can generate heat, for example, HDD, memory for desktop personal computer (DIMM), memory used in notebook personal computer (SO.DIMM), etc. It may be.
  • (Appendix 1) A temperature measurement object whose temperature is measured; A flexible circuit board arranged to straddle the temperature measurement object; A temperature sensor that measures the temperature of the temperature measurement object, the temperature sensor being provided in a portion of the flexible circuit board that straddles the temperature measurement object, and connected to a part of the wiring of the flexible circuit board; , An information terminal comprising: a processing device that receives and processes temperature information of the temperature measurement object measured by the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected. apparatus. (Additional remark 2) The said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected to the said temperature sensor, The said metal pattern is expanded and provided in the width
  • the information terminal device is an information terminal device of Additional remark 1 or 2 which controls operation
  • the said metal pattern is an information terminal device of Additional remark 2 provided with the width
  • the said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected with the said temperature sensor, and the said metal pattern is arrange
  • the information terminal device according to attachment 1.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

L'invention concerne un dispositif terminal d'informations comportant un capteur de température qui mesure une température d'un objet de mesure de température sans qu'il soit nécessaire d'augmenter séparément les fils. Un dispositif terminal 1 d'informations comporte: un objet 25 de mesure de température, dont la température doit être mesurée; une carte 29 à circuit souple qui est disposée en travers de l'objet de mesure de température; un capteur 32 de température qui mesure la température de l'objet de mesure de température et est placé sur une partie de la carte à circuit souple qui se trouve en travers de l'objet de mesure de température, le capteur de température étant relié à une partie de câblage de la carte à circuit souple; et un dispositif 23 de traitement qui reçoit des informations de température sur l'objet de mesure de température mesurées par le capteur de température via la partie du câblage de la carte à circuit souple à laquelle est relié le capteur de température, le dispositif de traitement traitant ensuite les informations de température. Par conséquent, le fonctionnement ou la température de l'objet de mesure de température sont régulés.
PCT/JP2018/004739 2017-03-14 2018-02-09 Dispositif terminal d'informations Ceased WO2018168287A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017048890A JP2018151314A (ja) 2017-03-14 2017-03-14 情報端末装置
JP2017-048890 2017-03-14

Publications (1)

Publication Number Publication Date
WO2018168287A1 true WO2018168287A1 (fr) 2018-09-20

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PCT/JP2018/004739 Ceased WO2018168287A1 (fr) 2017-03-14 2018-02-09 Dispositif terminal d'informations

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WO (1) WO2018168287A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7292873B2 (ja) * 2018-12-26 2023-06-19 キヤノン株式会社 画像形成装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07296786A (ja) * 1994-04-22 1995-11-10 Matsushita Electric Ind Co Ltd 電池ケース
JP2002124618A (ja) * 2000-10-18 2002-04-26 Unisia Jecs Corp 半導体装置
JP2008084019A (ja) * 2006-09-27 2008-04-10 Toshiba Corp 電子機器
JP2014011385A (ja) * 2012-07-02 2014-01-20 Nec Access Technica Ltd 電子デバイス、電子機器、および電子デバイスの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07296786A (ja) * 1994-04-22 1995-11-10 Matsushita Electric Ind Co Ltd 電池ケース
JP2002124618A (ja) * 2000-10-18 2002-04-26 Unisia Jecs Corp 半導体装置
JP2008084019A (ja) * 2006-09-27 2008-04-10 Toshiba Corp 電子機器
JP2014011385A (ja) * 2012-07-02 2014-01-20 Nec Access Technica Ltd 電子デバイス、電子機器、および電子デバイスの製造方法

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