[go: up one dir, main page]

WO2018168250A1 - Light sensor - Google Patents

Light sensor Download PDF

Info

Publication number
WO2018168250A1
WO2018168250A1 PCT/JP2018/003732 JP2018003732W WO2018168250A1 WO 2018168250 A1 WO2018168250 A1 WO 2018168250A1 JP 2018003732 W JP2018003732 W JP 2018003732W WO 2018168250 A1 WO2018168250 A1 WO 2018168250A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light receiving
receiving element
intensity
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/003732
Other languages
French (fr)
Japanese (ja)
Inventor
純 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of WO2018168250A1 publication Critical patent/WO2018168250A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/04Optical or mechanical part supplementary adjustable parts
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors

Definitions

  • This disclosure relates to a light sensor.
  • an optical sensor including a substrate on which a plurality of light receiving elements are formed, and a light shielding film that is disposed above the substrate and defines a traveling direction of incident light with respect to each light receiving element is disclosed in, for example, Patent Document 1. Proposed in The light shielding film has a plurality of openings corresponding to the respective light receiving elements. Each opening is provided such that the traveling direction of incident light incident on each light receiving element is different.
  • each light receiving element receives not only direct light directly incident from the opening but also indirect light incident after being reflected from the substrate and the light shielding film after being incident from the opening. For this reason, the light receiving component has a broad characteristic including an indirect component of indirect light. That is, the direct component of direct light cannot be obtained with high accuracy from the light receiving component.
  • the present disclosure is intended to provide a light sensor that can acquire indirect components with high accuracy by removing indirect components contained in light receiving components.
  • the light sensor includes a first light receiving element that outputs the first detection signal corresponding to the intensity of light that is exposed on the first surface and the first light receiving surface. And a second light receiving element that outputs a second detection signal corresponding to the intensity of light incident on the second light receiving surface while exposing the second light receiving surface to one surface.
  • the light sensor has an opening that allows light to pass through, and includes a light shielding portion made of metal that is disposed above one surface of the substrate.
  • the light sensor includes a calculation unit that receives the first detection signal and the second detection signal and performs calculation processing based on the first intensity and the second intensity.
  • the first light receiving element at least part of the first light receiving surface is directly irradiated with light that passes through the opening of one surface and is not reflected by the reflecting surface on one surface side of the light shielding portion.
  • the first detection signal corresponding to the first intensity of the light including the light is output.
  • the second light receiving element is provided on the substrate so that the entire second light receiving surface is located in the second region of the one surface excluding the first region, and the second detection signal corresponding to the second intensity of the indirect light. Is output.
  • the calculation unit receives the first detection signal and the second detection signal, and calculates the difference between the first intensity and the second intensity, thereby removing the indirect light component included in the first intensity.
  • the second light receiving element since the second light receiving element is provided in the second region of the substrate where direct light does not reach, the second light receiving element acquires only indirect light components that do not include direct light components. Can do. For this reason, the indirect light component included in the first intensity can be removed by removing the indirect light component included in the light receiving component of the first light receiving element by the arithmetic unit. Therefore, the direct light component can be obtained with high accuracy.
  • FIG. 1 is a diagram illustrating a configuration of a light sensor according to a first embodiment of the present disclosure.
  • FIG. 2 is a diagram for explaining components of direct light obtained by calculation of the calculation unit
  • FIG. 3 is a diagram for explaining a calculation result of a comparative example in which the indirect light component is not canceled
  • FIG. 4 is a diagram illustrating a configuration of a light sensor according to the second embodiment of the present disclosure.
  • FIG. 5 is a diagram illustrating a configuration of a light sensor according to the third embodiment of the present disclosure.
  • the light sensor according to the present embodiment is applied to, for example, an auto light system that automatically turns on and off a headlight and a taillight of a vehicle.
  • the light sensor includes a substrate 10, a light shielding unit 20, an insulating layer 30, and a calculation unit 40.
  • the substrate 10 has one surface 11.
  • the one surface 11 can also be referred to as a surface.
  • the substrate 10 is an n-type silicon substrate, for example.
  • the substrate 10 includes a first light receiving element 12 and a second light receiving element 13.
  • Each of the light receiving elements 12 and 13 is configured as a photodiode that detects the intensity of received light.
  • each p-type region corresponds to each light receiving portion of each light receiving element 12, 13.
  • the first light receiving surface 14 of the first light receiving element 12 and the second light receiving surface 15 of the second light receiving element 13 are exposed on the one surface 11 of the substrate 10.
  • each of the light receiving elements 12 and 13 outputs the light intensity as a voltage value intensity signal.
  • the first light receiving element 12 outputs a first detection signal corresponding to the intensity of light incident on the first light receiving surface 14.
  • the second light receiving element 13 outputs a second detection signal corresponding to the intensity of light incident on the second light receiving surface 15.
  • the light shielding unit 20 is a metal part disposed above the one surface 11 of the substrate 10.
  • the light shielding portion 20 is formed as a metal film such as aluminum, for example.
  • the light shielding unit 20 has an opening 21 that guides light to the one surface 11 of the substrate 10 through light.
  • the insulating layer 30 is provided between the one surface 11 of the substrate 10 and the light shielding part 20, on the opening part 21 of the light shielding part 20, and on the light shielding part 20 and the opening part 21.
  • the insulating layer 30 has a property of allowing light to pass therethrough and has a function of preventing oxidation of the metal light shielding portion 20.
  • the insulating layer 30 is an interlayer insulating film such as BPSG (Boron Phosphorate Silicate Glass).
  • the substrate 10, the light shielding unit 20, and the insulating layer 30 are configured as one semiconductor chip.
  • the calculation unit 40 is a circuit unit that inputs the first detection signal of the first light receiving element 12 and the second detection signal of the second light receiving element 13 and performs calculation processing based on the first intensity and the second intensity.
  • the calculation unit 40 calculates the difference between the first intensity and the second intensity, thereby canceling the light-receiving component having the second intensity included in the first intensity.
  • the calculation unit 40 may be formed on the substrate 10 or may be formed on a semiconductor chip different from the substrate 10.
  • the above is the overall configuration of the light sensor according to the present embodiment.
  • the light sensor includes a case (not shown), and is packaged by accommodating the above-described components.
  • the light sensor is mounted on, for example, a vehicle dashboard.
  • the light passing through the opening 21 of the light shielding part 20 in the one surface 11 of the substrate 10 is never reflected by the one surface 11 of the substrate 10 and the reflecting surface 22 on the one surface 11 side of the light shielding part 20. This is the area that is directly irradiated.
  • the range of the first region 16 is determined by the refractive index of the insulating layer 30, the size of the opening 21, the position of the light shielding unit 20 with respect to the one surface 11 of the substrate 10, and the like.
  • the second region 17 is a region of the one surface 11 of the substrate 10 excluding the first region 16. That is, the second region 17 is a region where light that has passed through the opening 21 of the light shielding unit 20 is not directly irradiated.
  • the first light receiving element 12 is provided on the substrate 10 such that a part of the first light receiving surface 14 is located in the first region 16.
  • the first light receiving element 12 has either direct light directly incident on the first light receiving surface 14 through the opening 21 of the light shielding unit 20 and one surface 11 of the substrate 10 or the reflection surface 22 of the light shielding unit 20 or It receives light including indirect light that is reflected and indirectly incident by both.
  • the indirect light may reflect the surface 11 and the reflecting surface 22 many times. Accordingly, the first light receiving element 12 outputs a first detection signal corresponding to the first intensity of light including direct light and indirect light.
  • the second light receiving element 13 is provided on the substrate 10 so that the entire second light receiving surface 15 is located in the second region 17. Thereby, the second light receiving element 13 receives the light reflected by the one surface 11 of the substrate 10 or the reflecting surface 22 of the light shielding portion 20. That is, the second light receiving element 13 receives light that does not include direct light. Accordingly, the second light receiving element 13 outputs a second detection signal corresponding to the second intensity of the indirect light.
  • the second light receiving element 13 has the entire second light receiving surface 15 provided in the second region 17 on the outer periphery of the first region 16. That is, the second light receiving element 13 is disposed close to the first light receiving element 12. Accordingly, the second light receiving element 13 can receive substantially the same indirect light as the indirect light received by the first light receiving element 12.
  • the calculation unit 40 inputs the first detection signal and the second detection signal from each of the light receiving elements 12 and 13 at any time or at a predetermined timing. And the calculating part 40 calculates the difference of 1st intensity
  • the first intensity PD1 includes components of direct light and indirect light
  • the component of direct light is buried in the component of indirect light.
  • the second intensity PD2 does not include a direct light component, but includes only an indirect light component. Therefore, the light component can be directly extracted from the first intensity PD1 by the calculation of PD1-PD2.
  • the light receiving surfaces 14 and 15 of the light receiving elements 12 and 13 have the same size.
  • a configuration in which two openings 21 are provided in the light shielding part 20 and two light receiving elements corresponding to the respective openings 21 are provided in the substrate 10 can be considered.
  • One light receiving element is disposed in the first region 16 in which at least a part of the light receiving surface is set by the one opening 21. The same applies to the other light receiving element.
  • the direct light component of the light received by each light receiving element is different, and the indirect light component is also different.
  • the third intensity received by one of the light receiving elements is PD3
  • the third intensity PD3 includes a direct light component ⁇ and an indirect light component ⁇ .
  • the fourth intensity received by the other light receiving element is PD4
  • the fourth intensity PD4 includes a direct light component ⁇ and an indirect light component ⁇ . Even if PD3-PD4 is calculated to cancel the indirect light component of each light receiving element, the indirect light component remains without being canceled.
  • the PD3-PD4 components have a broad characteristic in which the components of indirect light remain. Therefore, in the configuration in which the output of each light receiving element corresponding to each opening 21 is calculated as in the comparative example, the indirect light component cannot be canceled with high accuracy.
  • the second light receiving element 13 is provided in the second region 17 of the substrate 10 where direct light does not reach.
  • the component of indirect light which does not contain the component of direct light by the 2nd light receiving element 13 is acquirable.
  • the component of the indirect light included in the first intensity can be removed by the calculation process of the calculation unit 40. Therefore, the direct light component can be obtained with high accuracy.
  • a region excluding the light receiving surfaces 14 and 15 of the light receiving elements 12 and 13 may be configured as a metal surface. Thereby, it is possible to reduce the influence of attenuation of the indirect light component due to the distance of the light traveling in the surface direction of the one surface 11 of the substrate 10.
  • the light shielding unit 20 includes a first opening 23 and a second opening 24 as the opening 21. Each opening 23, 24 is separated.
  • the 1st light receiving element 12 is provided in the board
  • the entire second light receiving surface 15 is provided in the second region 17 on the outer periphery of the first region 16 set by the second opening 24.
  • the light receiving elements 12 and 13 may be arranged on the substrate 10 in association with the different openings 23 and 24 without being related to the first region 16 set by the one opening 21.
  • the first light receiving element 12 may be provided on the substrate 10 such that the entire first light receiving surface 14 is located in the first region 16. Thereby, the 1st light receiving element 12 can receive direct light reliably.
  • the configuration of the light sensor described in each of the above embodiments is merely an example, and the present disclosure is not limited to the configuration described above, and other configurations that can realize the present disclosure may be employed.
  • the insulating layer 30 may not be formed on the light shielding unit 20.
  • a configuration in which a plurality of first light receiving elements 12 are provided on the substrate 10 and one second light receiving element 13 is provided on the substrate 10 may be employed. That is, the second light receiving element 13 may be commonly used for the plurality of first light receiving elements 12. A plurality of sets of the first light receiving element 12 and the second light receiving element 13 may be provided on the substrate 10. On the other hand, a plurality of second light receiving elements 13 may be provided for one first light receiving element 12.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

This light sensor comprises: a substrate (10) having one surface (11), a first light-receiving element (12), and a second light-receiving element (13); a metallic light-shielding part (20); and a calculation unit (40) which performs a calculation process. The first light-receiving element is provided to the substrate such that at least a part of a first light-receiving surface is positioned in a first region (16), of the one surface, which is directly irradiated with light having passed through an opening but not having been reflected at all by the one surface or a reflection surface (22) on the one surface side of the light-shielding part, and the first light-receiving element outputs a first detection signal in accordance with a first intensity of light composed of: direct light that is directly incident on the first light-receiving surface through the opening; and indirect light that is indirectly incident thereon after being reflected by either one or both of the one surface and the reflection surface (22). The second light-receiving element is provided to the substrate such that the entirety of a second light-receiving surface is positioned in a second region (17), of the one surface, which excludes the first region, and the second light-receiving element outputs a second detection signal in accordance with a second intensity of the indirect light. A calculation unit eliminates a component of the indirect light that is included in the first intensity.

Description

ライトセンサLight sensor 関連出願の相互参照Cross-reference of related applications

 本出願は、2017年3月14日に出願された日本国特許出願2017-48563号に基づくものであり、ここにその記載内容を参照により援用する。 This application is based on Japanese Patent Application No. 2017-48563 filed on March 14, 2015, the contents of which are incorporated herein by reference.

 本開示は、ライトセンサに関する。 This disclosure relates to a light sensor.

 従来より、複数の受光素子が形成された基板と、基板の上方に配置されていると共に各受光素子に対する入射光の進行方向を規定する遮光膜と、を備えた光センサが、例えば特許文献1で提案されている。遮光膜は、各受光素子に対応する複数の開口部を有している。各開口部は、各受光素子に入射する入射光の進行方向がそれぞれ異なるように設けられている。 2. Description of the Related Art Conventionally, an optical sensor including a substrate on which a plurality of light receiving elements are formed, and a light shielding film that is disposed above the substrate and defines a traveling direction of incident light with respect to each light receiving element is disclosed in, for example, Patent Document 1. Proposed in The light shielding film has a plurality of openings corresponding to the respective light receiving elements. Each opening is provided such that the traveling direction of incident light incident on each light receiving element is different.

JP2016-161458 AJP2016-161458 A

 従来の技術では、各受光素子は、開口部から直接入射する直接光だけでなく、開口部から入射した後に基板や遮光膜で反射して入射する間接光も受光する。このため、受光成分は間接光の間接成分を含んだブロードの特性になってしまう。すなわち、受光成分から直接光の直接成分を精度良く取得することができない。 In the conventional technology, each light receiving element receives not only direct light directly incident from the opening but also indirect light incident after being reflected from the substrate and the light shielding film after being incident from the opening. For this reason, the light receiving component has a broad characteristic including an indirect component of indirect light. That is, the direct component of direct light cannot be obtained with high accuracy from the light receiving component.

 本開示は、受光成分に含まれる間接成分を除去して直接成分を精度良く取得することができるライトセンサを提供することを目的とする。 The present disclosure is intended to provide a light sensor that can acquire indirect components with high accuracy by removing indirect components contained in light receiving components.

 本開示の一態様によれば、ライトセンサは、一面と、第1受光面が一面に露出すると共に第1受光面に入射する光の強度に応じた第1検出信号を出力する第1受光素子と、第2受光面が一面に露出すると共に第2受光面に入射する光の強度に応じた第2検出信号を出力する第2受光素子と、を有する基板を備えている。 According to one aspect of the present disclosure, the light sensor includes a first light receiving element that outputs the first detection signal corresponding to the intensity of light that is exposed on the first surface and the first light receiving surface. And a second light receiving element that outputs a second detection signal corresponding to the intensity of light incident on the second light receiving surface while exposing the second light receiving surface to one surface.

 ライトセンサは、光を通す開口部を有し、基板の一面の上方に配置された金属製の遮光部を備えている。ライトセンサは、第1検出信号及び第2検出信号を入力し、第1強度及び第2強度に基づいて演算処理を行う演算部を備えている。 The light sensor has an opening that allows light to pass through, and includes a light shielding portion made of metal that is disposed above one surface of the substrate. The light sensor includes a calculation unit that receives the first detection signal and the second detection signal and performs calculation processing based on the first intensity and the second intensity.

 第1受光素子は、第1受光面の少なくとも一部が、一面のうち、開口部を通過する光が一面及び遮光部のうち一面側の反射面で一度も反射せずに直接照射される第1領域に位置するように基板に設けられ、開口部を介して第1受光面に直接入射する直接光と一面及び反射面のいずれか一方または両方で反射して間接的に入射する間接光とを含んだ光の第1強度に応じた第1検出信号を出力する。 In the first light receiving element, at least part of the first light receiving surface is directly irradiated with light that passes through the opening of one surface and is not reflected by the reflecting surface on one surface side of the light shielding portion. Direct light incident directly on the first light-receiving surface via the opening and indirect light reflected indirectly on either one or both of the reflection surface and the first light-receiving surface provided on the substrate so as to be located in one region; The first detection signal corresponding to the first intensity of the light including the light is output.

 第2受光素子は、第2受光面の全体が、一面のうち、第1領域を除いた第2領域に位置するように基板に設けられ、間接光の第2強度に応じた第2検出信号を出力する。 The second light receiving element is provided on the substrate so that the entire second light receiving surface is located in the second region of the one surface excluding the first region, and the second detection signal corresponding to the second intensity of the indirect light. Is output.

 演算部は、第1検出信号及び第2検出信号を入力し、第1強度と第2強度との差分を演算することにより第1強度に含まれる間接光の成分を除去する。 The calculation unit receives the first detection signal and the second detection signal, and calculates the difference between the first intensity and the second intensity, thereby removing the indirect light component included in the first intensity.

 この構成によれば、第2受光素子は基板のうち直接光が届かない第2領域に設けられているので、第2受光素子によって直接光の成分を含まない間接光のみの成分を取得することができる。このため、演算部によって第1受光素子の受光成分に含まれる間接光の成分を除去することで、第1強度に含まれる間接光の成分を除去することができる。したがって、直接光の成分を精度良く取得することができる。 According to this configuration, since the second light receiving element is provided in the second region of the substrate where direct light does not reach, the second light receiving element acquires only indirect light components that do not include direct light components. Can do. For this reason, the indirect light component included in the first intensity can be removed by removing the indirect light component included in the light receiving component of the first light receiving element by the arithmetic unit. Therefore, the direct light component can be obtained with high accuracy.

 本開示についての上記および他の目的、特徴や利点は、添付図面を参照した下記詳細な説明から、より明確になる。添付図面において、
図1は、本開示の第1実施形態に係るライトセンサの構成を示した図であり、 図2は、演算部の演算によって得られる直接光の成分を説明するための図であり、 図3は、間接光の成分がキャンセルされない比較例の演算結果を説明するための図であり、 図4は、本開示の第2実施形態に係るライトセンサの構成を示した図であり、 図5は、本開示の第3実施形態に係るライトセンサの構成を示した図である。
The above and other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. In the accompanying drawings,
FIG. 1 is a diagram illustrating a configuration of a light sensor according to a first embodiment of the present disclosure. FIG. 2 is a diagram for explaining components of direct light obtained by calculation of the calculation unit, FIG. 3 is a diagram for explaining a calculation result of a comparative example in which the indirect light component is not canceled, FIG. 4 is a diagram illustrating a configuration of a light sensor according to the second embodiment of the present disclosure. FIG. 5 is a diagram illustrating a configuration of a light sensor according to the third embodiment of the present disclosure.

 以下、本開示の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、図中、同一符号を付してある。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

 (第1実施形態)
 以下、本開示の第1実施形態について図を参照して説明する。本実施形態に係るライトセンサは、例えば、車両のヘッドライト及びテールライトを自動点消灯させるオートライトシステムに適用されるものである。
(First embodiment)
Hereinafter, a first embodiment of the present disclosure will be described with reference to the drawings. The light sensor according to the present embodiment is applied to, for example, an auto light system that automatically turns on and off a headlight and a taillight of a vehicle.

 図1に示されるように、ライトセンサは、基板10、遮光部20、絶縁層30、及び演算部40を備えている。 As shown in FIG. 1, the light sensor includes a substrate 10, a light shielding unit 20, an insulating layer 30, and a calculation unit 40.

 基板10は、一面11を有している。なお、一面11は、表面とも呼ばれうる。基板10は、例えばn型シリコン基板である。また、基板10は、第1受光素子12及び第2受光素子13を有している。各受光素子12、13は、受光した光の強度を検出するフォトダイオードとして構成されている。 The substrate 10 has one surface 11. The one surface 11 can also be referred to as a surface. The substrate 10 is an n-type silicon substrate, for example. The substrate 10 includes a first light receiving element 12 and a second light receiving element 13. Each of the light receiving elements 12 and 13 is configured as a photodiode that detects the intensity of received light.

 具体的には、基板10の表層部に複数のp型領域が形成されており、各p型領域が各受光素子12、13の各受光部に対応している。第1受光素子12の第1受光面14及び第2受光素子13の第2受光面15は、基板10の一面11に露出している。 Specifically, a plurality of p-type regions are formed in the surface layer portion of the substrate 10, and each p-type region corresponds to each light receiving portion of each light receiving element 12, 13. The first light receiving surface 14 of the first light receiving element 12 and the second light receiving surface 15 of the second light receiving element 13 are exposed on the one surface 11 of the substrate 10.

 また、基板10の裏面には図示しないカソード電極が形成されていると共に、各p型領域には図示しないアノード電極が設けられている。このような構成により、各受光素子12、13は、光の強度を電圧値の強度信号として出力する。第1受光素子12は、第1受光面14に入射する光の強度に応じた第1検出信号を出力する。第2受光素子13は、第2受光面15に入射する光の強度に応じた第2検出信号を出力する。 Further, a cathode electrode (not shown) is formed on the back surface of the substrate 10, and an anode electrode (not shown) is provided in each p-type region. With such a configuration, each of the light receiving elements 12 and 13 outputs the light intensity as a voltage value intensity signal. The first light receiving element 12 outputs a first detection signal corresponding to the intensity of light incident on the first light receiving surface 14. The second light receiving element 13 outputs a second detection signal corresponding to the intensity of light incident on the second light receiving surface 15.

 遮光部20は、基板10の一面11の上方に配置された金属製の部品である。遮光部20は、例えばアルミニウム等の金属膜として形成されている。また、遮光部20は、光を通すことで基板10の一面11に光を導く開口部21を有している。 The light shielding unit 20 is a metal part disposed above the one surface 11 of the substrate 10. The light shielding portion 20 is formed as a metal film such as aluminum, for example. In addition, the light shielding unit 20 has an opening 21 that guides light to the one surface 11 of the substrate 10 through light.

 絶縁層30は、基板10の一面11と遮光部20との間、遮光部20の開口部21、及び遮光部20及び開口部21の上に設けられている。絶縁層30は光を通過させる性質を有し、金属製の遮光部20の酸化を防止する等の機能を有している。絶縁層30は、例えばBPSG(Boron Phosphor Silicate Glass)等の層間絶縁膜である。基板10、遮光部20、及び絶縁層30は、一つの半導体チップとして構成されている。 The insulating layer 30 is provided between the one surface 11 of the substrate 10 and the light shielding part 20, on the opening part 21 of the light shielding part 20, and on the light shielding part 20 and the opening part 21. The insulating layer 30 has a property of allowing light to pass therethrough and has a function of preventing oxidation of the metal light shielding portion 20. The insulating layer 30 is an interlayer insulating film such as BPSG (Boron Phosphorate Silicate Glass). The substrate 10, the light shielding unit 20, and the insulating layer 30 are configured as one semiconductor chip.

 演算部40は、第1受光素子12の第1検出信号及び第2受光素子13の第2検出信号を入力し、第1強度及び第2強度に基づいて演算処理を行う回路部である。演算部40は、第1強度と第2強度との差分を演算することにより、第1強度に含まれる第2強度の受光成分をキャンセルする。演算部40は、基板10に形成されていても良いし、基板10とは別の半導体チップに形成されていても良い。 The calculation unit 40 is a circuit unit that inputs the first detection signal of the first light receiving element 12 and the second detection signal of the second light receiving element 13 and performs calculation processing based on the first intensity and the second intensity. The calculation unit 40 calculates the difference between the first intensity and the second intensity, thereby canceling the light-receiving component having the second intensity included in the first intensity. The calculation unit 40 may be formed on the substrate 10 or may be formed on a semiconductor chip different from the substrate 10.

 以上が、本実施形態に係るライトセンサの全体構成である。ライトセンサは、図示しないケースを備え、上記各構成を収容することでパッケージ化されている。また、ライトセンサは、例えば車両のダッシュボード等に搭載される。 The above is the overall configuration of the light sensor according to the present embodiment. The light sensor includes a case (not shown), and is packaged by accommodating the above-described components. The light sensor is mounted on, for example, a vehicle dashboard.

 次に、基板10における各受光素子12、13の配置について説明する。まず、基板10の一面11には、第1領域16と第2領域17とがある。 Next, the arrangement of the light receiving elements 12 and 13 on the substrate 10 will be described. First, there is a first region 16 and a second region 17 on one surface 11 of the substrate 10.

 第1領域16は、基板10の一面11のうち、遮光部20の開口部21を通過する光が基板10の一面11及び遮光部20のうち一面11側の反射面22で一度も反射せずに直接照射される領域である。第1領域16の範囲は、絶縁層30の屈折率、開口部21のサイズ、基板10の一面11を基準とした遮光部20の位置等によって決まる。 In the first region 16, the light passing through the opening 21 of the light shielding part 20 in the one surface 11 of the substrate 10 is never reflected by the one surface 11 of the substrate 10 and the reflecting surface 22 on the one surface 11 side of the light shielding part 20. This is the area that is directly irradiated. The range of the first region 16 is determined by the refractive index of the insulating layer 30, the size of the opening 21, the position of the light shielding unit 20 with respect to the one surface 11 of the substrate 10, and the like.

 一方、第2領域17は、基板10の一面11のうち、第1領域16を除いた領域である。つまり、第2領域17は、遮光部20の開口部21を通過した光が直接照射されない領域である。 On the other hand, the second region 17 is a region of the one surface 11 of the substrate 10 excluding the first region 16. That is, the second region 17 is a region where light that has passed through the opening 21 of the light shielding unit 20 is not directly irradiated.

 そして、第1受光素子12は、第1受光面14の一部が第1領域16に位置するように基板10に設けられている。これにより、第1受光素子12は、遮光部20の開口部21を介して第1受光面14に直接入射する直接光と基板10の一面11及び遮光部20の反射面22のいずれか一方または両方で反射して間接的に入射する間接光とを含んだ光を受光する。間接光は、一面11及び反射面22を何度も反射する場合もある。したがって、第1受光素子12は、直接光と間接光とを含んだ光の第1強度に応じた第1検出信号を出力する。 The first light receiving element 12 is provided on the substrate 10 such that a part of the first light receiving surface 14 is located in the first region 16. As a result, the first light receiving element 12 has either direct light directly incident on the first light receiving surface 14 through the opening 21 of the light shielding unit 20 and one surface 11 of the substrate 10 or the reflection surface 22 of the light shielding unit 20 or It receives light including indirect light that is reflected and indirectly incident by both. The indirect light may reflect the surface 11 and the reflecting surface 22 many times. Accordingly, the first light receiving element 12 outputs a first detection signal corresponding to the first intensity of light including direct light and indirect light.

 第2受光素子13は、第2受光面15の全体が第2領域17に位置するように基板10に設けられている。これにより、第2受光素子13は、基板10の一面11あるいは遮光部20の反射面22で反射した光を受光する。つまり、第2受光素子13は、直接光を含まない光を受光する。したがって、第2受光素子13は、間接光の第2強度に応じた第2検出信号を出力する。 The second light receiving element 13 is provided on the substrate 10 so that the entire second light receiving surface 15 is located in the second region 17. Thereby, the second light receiving element 13 receives the light reflected by the one surface 11 of the substrate 10 or the reflecting surface 22 of the light shielding portion 20. That is, the second light receiving element 13 receives light that does not include direct light. Accordingly, the second light receiving element 13 outputs a second detection signal corresponding to the second intensity of the indirect light.

 また、本実施形態では、第2受光素子13は、第2受光面15の全体が第1領域16の外周の第2領域17に設けられている。すなわち、第2受光素子13は、第1受光素子12に近接配置されている。これにより、第2受光素子13は、第1受光素子12が受光する間接光とほぼ同じ間接光を受光することができる。 In the present embodiment, the second light receiving element 13 has the entire second light receiving surface 15 provided in the second region 17 on the outer periphery of the first region 16. That is, the second light receiving element 13 is disposed close to the first light receiving element 12. Accordingly, the second light receiving element 13 can receive substantially the same indirect light as the indirect light received by the first light receiving element 12.

 続いて、演算部40の作動について説明する。演算部40は、随時あるいは所定のタイミングで各受光素子12、13から第1検出信号及び第2検出信号を入力する。そして、演算部40は、第1強度と第2強度との差分を演算する。第1強度をPD1とし、第2強度をPD2とすると、演算部40はPD1-PD2を演算する。これにより、第1強度に含まれる間接光の成分が除去される。  Subsequently, the operation of the calculation unit 40 will be described. The calculation unit 40 inputs the first detection signal and the second detection signal from each of the light receiving elements 12 and 13 at any time or at a predetermined timing. And the calculating part 40 calculates the difference of 1st intensity | strength and 2nd intensity | strength. If the first intensity is PD1 and the second intensity is PD2, the calculation unit 40 calculates PD1-PD2. Thereby, the component of the indirect light included in the first intensity is removed. *

 図2に示されるように、第1強度PD1は直接光及び間接光の各成分を含んでいるので、直接光の成分が間接光の成分に埋もれている。しかし、第2強度PD2は直接光の成分を含まず、間接光の成分のみで構成されている。したがって、PD1-PD2の演算によって第1強度PD1から直接光の成分を取り出すことができる。なお、間接光のキャンセルの精度を高めるために、各受光素子12、13の各受光面14、15のサイズは同じであることが好ましい。 As shown in FIG. 2, since the first intensity PD1 includes components of direct light and indirect light, the component of direct light is buried in the component of indirect light. However, the second intensity PD2 does not include a direct light component, but includes only an indirect light component. Therefore, the light component can be directly extracted from the first intensity PD1 by the calculation of PD1-PD2. In order to improve the accuracy of indirect light cancellation, it is preferable that the light receiving surfaces 14 and 15 of the light receiving elements 12 and 13 have the same size.

 比較例として、遮光部20に2つの開口部21が設けられ、各開口部21に対応した2つの受光素子が基板10に設けられた構成が考えられる。一方の受光素子は、受光面の少なくとも一部が一方の開口部21によって設定される第1領域16に配置される。他方の受光素子についても同様である。 As a comparative example, a configuration in which two openings 21 are provided in the light shielding part 20 and two light receiving elements corresponding to the respective openings 21 are provided in the substrate 10 can be considered. One light receiving element is disposed in the first region 16 in which at least a part of the light receiving surface is set by the one opening 21. The same applies to the other light receiving element.

 このような比較例の構成では、各受光素子が受光する光の直接光の成分が異なると共に、間接光の成分も異なる。一方の受光素子が受光する第3強度をPD3とすると、第3強度PD3は直接光の成分αと間接光の成分βを含んでいる。他方の受光素子が受光する第4強度をPD4とすると、第4強度PD4は直接光の成分γと間接光の成分σを含んでいる。各受光素子の間接光の成分をキャンセルするためにPD3-PD4を演算したとしても、間接光の成分はキャンセルされずに残ってしまう。 In the configuration of such a comparative example, the direct light component of the light received by each light receiving element is different, and the indirect light component is also different. When the third intensity received by one of the light receiving elements is PD3, the third intensity PD3 includes a direct light component α and an indirect light component β. If the fourth intensity received by the other light receiving element is PD4, the fourth intensity PD4 includes a direct light component γ and an indirect light component σ. Even if PD3-PD4 is calculated to cancel the indirect light component of each light receiving element, the indirect light component remains without being canceled.

 図3に示されるように、PD3-PD4の成分は、間接光の成分が残されたブロードの特性になっている。したがって、比較例のように各開口部21に対応した各受光素子の出力を演算する構成では、間接光の成分を精度良くキャンセルすることはできない。 As shown in FIG. 3, the PD3-PD4 components have a broad characteristic in which the components of indirect light remain. Therefore, in the configuration in which the output of each light receiving element corresponding to each opening 21 is calculated as in the comparative example, the indirect light component cannot be canceled with high accuracy.

 比較例に対し、本実施形態では、基板10のうち直接光が届かない第2領域17に第2受光素子13が設けられた構成になっている。これにより、第2受光素子13によって直接光の成分を含まない間接光のみの成分を取得することができる。このため、演算部40の演算処理によって第1強度に含まれる間接光の成分を除去することができる。したがって、直接光の成分を精度良く取得することができる。 In contrast to the comparative example, in the present embodiment, the second light receiving element 13 is provided in the second region 17 of the substrate 10 where direct light does not reach. Thereby, only the component of indirect light which does not contain the component of direct light by the 2nd light receiving element 13 is acquirable. For this reason, the component of the indirect light included in the first intensity can be removed by the calculation process of the calculation unit 40. Therefore, the direct light component can be obtained with high accuracy.

 変形例として、基板10の一面11は、各受光素子12、13の各受光面14、15を除いた領域が金属面として構成されていても良い。これにより、基板10の一面11の面方向に進む光の距離によって間接光の成分が減衰する影響を低減することができる。 As a modification, on one surface 11 of the substrate 10, a region excluding the light receiving surfaces 14 and 15 of the light receiving elements 12 and 13 may be configured as a metal surface. Thereby, it is possible to reduce the influence of attenuation of the indirect light component due to the distance of the light traveling in the surface direction of the one surface 11 of the substrate 10.

 (第2実施形態)
 本実施形態では、第1実施形態と異なる部分について説明する。図4に示されるように、遮光部20は、開口部21として、第1開口部23及び第2開口部24を有している。各開口部23、24は離されている。
(Second Embodiment)
In the present embodiment, parts different from the first embodiment will be described. As shown in FIG. 4, the light shielding unit 20 includes a first opening 23 and a second opening 24 as the opening 21. Each opening 23, 24 is separated.

 そして、第1受光素子12は、第1受光面14の一部が、第1開口部23によって設定された第1領域16に位置するように基板10に設けられている。一方、第2受光素子13は、第2受光面15の全体が、第2開口部24によって設定された第1領域16の外周の第2領域17に設けられている。 And the 1st light receiving element 12 is provided in the board | substrate 10 so that a part of 1st light-receiving surface 14 may be located in the 1st area | region 16 set by the 1st opening part 23. FIG. On the other hand, in the second light receiving element 13, the entire second light receiving surface 15 is provided in the second region 17 on the outer periphery of the first region 16 set by the second opening 24.

 このように、各受光素子12、13は、一つの開口部21によって設定された第1領域16に関連せず、異なった開口部23、24に関連づけて基板10に配置されていても良い。 As described above, the light receiving elements 12 and 13 may be arranged on the substrate 10 in association with the different openings 23 and 24 without being related to the first region 16 set by the one opening 21.

 (第3実施形態)
 本実施形態では、第1、第2実施形態と異なる部分について説明する。図5に示されるように、第1受光素子12は、第1受光面14の全体が第1領域16に位置するように基板10に設けられていても良い。これにより、第1受光素子12は直接光を確実に受光することができる。
(Third embodiment)
In the present embodiment, parts different from the first and second embodiments will be described. As shown in FIG. 5, the first light receiving element 12 may be provided on the substrate 10 such that the entire first light receiving surface 14 is located in the first region 16. Thereby, the 1st light receiving element 12 can receive direct light reliably.

 (他の実施形態)
 上記各実施形態で示されたライトセンサの構成は一例であり、上記で示した構成に限定されることなく、本開示を実現できる他の構成とすることもできる。例えば、絶縁層30は、遮光部20の上に形成されていなくても良い。
(Other embodiments)
The configuration of the light sensor described in each of the above embodiments is merely an example, and the present disclosure is not limited to the configuration described above, and other configurations that can realize the present disclosure may be employed. For example, the insulating layer 30 may not be formed on the light shielding unit 20.

 また、第1受光素子12が基板10に複数設けられ、第2受光素子13が基板10に一つ設けられる構成でも良い。すなわち、複数の第1受光素子12に対して第2受光素子13を共通利用しても良い。また、第1受光素子12と第2受光素子13との組が基板10に複数設けられていても良い。他方、1つの第1受光素子12に対し、複数の第2受光素子13が設けられていても良い。 Alternatively, a configuration in which a plurality of first light receiving elements 12 are provided on the substrate 10 and one second light receiving element 13 is provided on the substrate 10 may be employed. That is, the second light receiving element 13 may be commonly used for the plurality of first light receiving elements 12. A plurality of sets of the first light receiving element 12 and the second light receiving element 13 may be provided on the substrate 10. On the other hand, a plurality of second light receiving elements 13 may be provided for one first light receiving element 12.

以上、本開示の一態様に係るライトセンサの実施形態、構成、態様を例示したが、本開示に係る実施形態、構成、態様は、上述した各実施形態、各構成、各態様に限定されるものではない。例えば、異なる実施形態、構成、態様にそれぞれ開示された技術的部を適宜組み合わせて得られる実施形態、構成、態様についても本開示に係る実施形態、構成、態様の範囲に含まれる。
 
As mentioned above, although the embodiment, configuration, and aspect of the light sensor according to one aspect of the present disclosure have been illustrated, the embodiment, configuration, and aspect according to the present disclosure are limited to the above-described embodiments, configurations, and aspects. It is not a thing. For example, embodiments, configurations, and aspects obtained by appropriately combining technical sections disclosed in different embodiments, configurations, and aspects are also included in the scope of the embodiments, configurations, and aspects according to the present disclosure.

Claims (5)

 一面(11)と、第1受光面(14)が前記一面に露出すると共に前記第1受光面に入射する光の強度に応じた第1検出信号を出力する第1受光素子(12)と、第2受光面(15)が前記一面に露出すると共に前記第2受光面に入射する光の強度に応じた第2検出信号を出力する第2受光素子(13)と、を有する基板(10)と、
 光を通す開口部(21)を有し、前記基板の前記一面の上方に配置された金属製の遮光部(20)と、
 前記第1検出信号及び前記第2検出信号を入力し、前記第1強度及び前記第2強度に基づいて演算処理を行う演算部(40)と、
 を備え、
 前記第1受光素子は、前記第1受光面の少なくとも一部が、前記一面のうち、前記開口部を通過する光が前記一面及び前記遮光部のうち前記一面側の反射面(22)で一度も反射せずに直接照射される第1領域(16)に位置するように前記基板に設けられ、前記開口部を介して前記第1受光面に直接入射する直接光と前記一面及び前記反射面(22)のいずれか一方または両方で反射して間接的に入射する間接光とを含んだ光の第1強度に応じた前記第1検出信号を出力し、
 前記第2受光素子は、前記第2受光面の全体が、前記一面のうち、前記第1領域を除いた第2領域(17)に位置するように前記基板に設けられ、前記間接光の第2強度に応じた前記第2検出信号を出力し、
 前記演算部は、前記第1検出信号及び前記第2検出信号を入力し、前記第1強度と前記第2強度との差分を演算することにより前記第1強度に含まれる前記間接光の成分を除去するライトセンサ。
A first light receiving element (12) that outputs a first detection signal corresponding to an intensity of light incident on the first light receiving surface while the first surface (11) and the first light receiving surface (14) are exposed on the one surface A substrate (10) having a second light receiving element (13) for exposing a second light receiving surface (15) to the one surface and outputting a second detection signal corresponding to the intensity of light incident on the second light receiving surface. When,
A light-shielding portion (20) made of metal having an opening (21) for transmitting light and disposed above the one surface of the substrate;
A calculation unit (40) for inputting the first detection signal and the second detection signal and performing a calculation process based on the first intensity and the second intensity;
With
In the first light receiving element, at least a part of the first light receiving surface is such that light passing through the opening of the one surface is once reflected on the one surface and the reflecting surface (22) on the one surface side of the light shielding portion. The direct light directly incident on the first light receiving surface through the opening, the one surface, and the reflecting surface are provided on the substrate so as to be positioned in the first region (16) that is directly irradiated without being reflected. (22) outputting the first detection signal corresponding to the first intensity of the light including the indirect light that is indirectly reflected and reflected by either or both of (22),
The second light receiving element is provided on the substrate so that the entire second light receiving surface is located in a second region (17) of the one surface excluding the first region, Outputting the second detection signal corresponding to two intensities;
The calculation unit inputs the first detection signal and the second detection signal, and calculates a difference between the first intensity and the second intensity, thereby calculating a component of the indirect light included in the first intensity. Light sensor to be removed.
 前記遮光部は、前記開口部として、第1開口部(23)及び第2開口部(24)を有し、
 前記第1受光素子は、前記第1受光面の少なくとも一部が、前記第1開口部によって設定された前記第1領域に位置するように前記基板に設けられ、
 前記第2受光素子は、前記第2受光面の全体が、前記第2開口部によって設定された前記第1領域の外周の前記第2領域に設けられている請求項1に記載のライトセンサ。
The light-shielding portion has a first opening (23) and a second opening (24) as the opening,
The first light receiving element is provided on the substrate so that at least a part of the first light receiving surface is located in the first region set by the first opening,
2. The light sensor according to claim 1, wherein the second light receiving element is provided in the second region of the outer periphery of the first region set by the second opening.
 前記第2受光素子は、前記第2受光面の全体が、前記開口部によって設定された前記第1領域の外周の前記第2領域に設けられている請求項1に記載のライトセンサ。 The light sensor according to claim 1, wherein the second light receiving element is provided in the second region on the outer periphery of the first region set by the opening.  前記一面は、前記第1受光面及び前記第2受光面を除いた領域が金属面として構成されている請求項1ないし3のいずれか1つに記載のライトセンサ。 The light sensor according to any one of claims 1 to 3, wherein an area of the one surface excluding the first light receiving surface and the second light receiving surface is configured as a metal surface.  前記第1受光素子は、前記第1受光面の全体が前記第1領域に位置するように前記基板に設けられている請求項1ないし4のいずれか1つに記載のライトセンサ。 The light sensor according to any one of claims 1 to 4, wherein the first light receiving element is provided on the substrate so that the entire first light receiving surface is located in the first region.
PCT/JP2018/003732 2017-03-14 2018-02-05 Light sensor Ceased WO2018168250A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-048563 2017-03-14
JP2017048563A JP6760152B2 (en) 2017-03-14 2017-03-14 Light sensor

Publications (1)

Publication Number Publication Date
WO2018168250A1 true WO2018168250A1 (en) 2018-09-20

Family

ID=63522075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/003732 Ceased WO2018168250A1 (en) 2017-03-14 2018-02-05 Light sensor

Country Status (2)

Country Link
JP (1) JP6760152B2 (en)
WO (1) WO2018168250A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03216523A (en) * 1990-01-22 1991-09-24 Olympus Optical Co Ltd Photometry circuit
JPH04276589A (en) * 1991-03-05 1992-10-01 Hamamatsu Photonics Kk Pyroelectric object detector
JPH11337405A (en) * 1998-03-27 1999-12-10 Denso Corp Optical sensor
JP2008076344A (en) * 2006-09-25 2008-04-03 Epson Imaging Devices Corp Light detector, electro-optic device, and electronic apparatus
WO2014041884A1 (en) * 2012-09-11 2014-03-20 シャープ株式会社 Sensor, display device, mobile telephone, and digital camera
US20160041035A1 (en) * 2014-08-05 2016-02-11 Maxim Integrated Products, Inc. System and method of estimating spectral contributions in ambient light and correcting field of view errors
JP2016161458A (en) * 2015-03-03 2016-09-05 株式会社デンソー Optical sensor
US20160309564A1 (en) * 2015-04-16 2016-10-20 Apple Inc. Electronic Device With Directional Ambient Light Sensor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03216523A (en) * 1990-01-22 1991-09-24 Olympus Optical Co Ltd Photometry circuit
JPH04276589A (en) * 1991-03-05 1992-10-01 Hamamatsu Photonics Kk Pyroelectric object detector
JPH11337405A (en) * 1998-03-27 1999-12-10 Denso Corp Optical sensor
JP2008076344A (en) * 2006-09-25 2008-04-03 Epson Imaging Devices Corp Light detector, electro-optic device, and electronic apparatus
WO2014041884A1 (en) * 2012-09-11 2014-03-20 シャープ株式会社 Sensor, display device, mobile telephone, and digital camera
US20160041035A1 (en) * 2014-08-05 2016-02-11 Maxim Integrated Products, Inc. System and method of estimating spectral contributions in ambient light and correcting field of view errors
JP2016161458A (en) * 2015-03-03 2016-09-05 株式会社デンソー Optical sensor
US20160309564A1 (en) * 2015-04-16 2016-10-20 Apple Inc. Electronic Device With Directional Ambient Light Sensor

Also Published As

Publication number Publication date
JP2018151294A (en) 2018-09-27
JP6760152B2 (en) 2020-09-23

Similar Documents

Publication Publication Date Title
CN106104297B (en) Optoelectronic module operable to identify spurious reflections and compensate for errors caused by spurious reflections
US10845464B2 (en) Lidar sensor including an optical filter
JP2022051782A (en) Photoelectric conversion apparatus and equipment including the same
JP2019114642A (en) Solid state image sensor, electronic equipment and transport equipment
US9425228B2 (en) Image sensor with reduced optical path
JP2008051764A (en) Ranging sensor and electronic device equipped with the ranging sensor
CN111052404B (en) Avalanche photodiode sensor and electronic device
US11054531B2 (en) Radiation detector and radiation detecting system
JP2019149475A (en) Imaging device
KR101994508B1 (en) Composite sensor and composite sensor module
WO2020202888A1 (en) Sensor chip and rangefinder device
JP6552052B2 (en) Toner adhesion amount sensor
JP2021010080A (en) Imaging apparatus and device
JP7499242B2 (en) Semiconductor package and electronic device
WO2018168250A1 (en) Light sensor
JP2008003019A (en) Photoelectric encoder
WO2023058556A1 (en) Photodetection apparatus and electronic device
JP2020145397A (en) Photoelectric conversion device and equipment including it
US10566489B2 (en) Photosensor
JP2020068359A (en) Photoelectric conversion device
KR102822328B1 (en) Lamp for automobile and automobile including the same
US20210384243A1 (en) Photoelectric conversion device, photoelectric conversion system and moving body
CN113325485B (en) Infrared measuring device
US20230034553A1 (en) Light receiving module and lidar apparatus comprising the same
US12027560B2 (en) Photoelectric conversion device, photoelectric conversion system, moving body, and method of designing photoelectric conversion device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18768203

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18768203

Country of ref document: EP

Kind code of ref document: A1