WO2018164470A1 - Device handler and device pick-and-place method - Google Patents

Abstract

The present invention relates to a device handler and, more specifically, to a device handler which withdraws a device then inserts a new device into a board having a plurality of device sockets mounted thereon. Disclosed is a device handler capable of more quickly performing device withdrawal and insertion operations by comprising: a first board table (210) for moving a board (20) for device withdrawal in a Y-axis direction; and a second board table (220) for moving the board (20) for device insertion, in which a DC test was performed, in the Y-axis direction by receiving the board (20), from which the device (10) is withdrawn, from the first board table (210).

Description

Device handlers and device pick and place methods

The present invention relates to a device handler, and more particularly, to a device handler for picking up and placing a device and a device handler for inserting a new device after withdrawing the device to a board provided with a plurality of device sockets.

Semiconductor devices (hereinafter referred to as "devices") undergo various tests such as electrical properties, heat or pressure reliability tests after the packaging process.

Among the tests for such a semiconductor device, there is a device operation test such as a burn-in test, in which a plurality of devices are inserted into the device socket 21 of the burn-in board, and the burn-in test is carried out. It is a test to determine if a defect occurs in the device after being stored in the device and subjected to heat or pressure for a predetermined time.

In general, the device handler for burn-in test classifies (unloads) the device into each tray according to the classification criteria given according to the inspection result for each device such as good or bad from the burn-in board that loads the device that has undergone the burn-in test. It is a device that inserts (loads) a new device to perform burn-in test again in an empty place (socket) of burn-in board where the device is located.

On the other hand, the performance of the device handler as described above is evaluated as the number of units per hour (UPH), UPH is the time required for the transfer of the device, the burn-in board transfer between the components constituting the device handler Is determined.

Therefore, it is necessary to improve the structure and arrangement of each component in order to increase the UPH, which is the performance of the device handler.

As the device handler for increasing the UPH as described above, Patent Document 1), Korean Patent No. 10-1177319 (Patent Document 2), Korean Patent Publication No. 10-2016-48628 (Patent Document 3) and the like.

Meanwhile, mass production is expanding in line with the market expansion of standardized devices such as SD RAM and NAND flash memory.

In addition, in the mass production of devices, the inspection demand for the devices also increases, and as the number of device handlers for the devices is installed as a post-process, the device footprint varies according to the logistics supply structure for the device handlers. The supply structure of the tray and board for the device is a very important factor in the arrangement of the device.

Furthermore, the device to be handled is in the trend of miniaturization and thinning, and in particular, a plurality of terminals are formed on the bottom surface for connection with external terminals, and the pitch between the terminals is also decreasing, and thus the performance that can sufficiently cope with this trend is expected. Should have

(Patent Document 1) KR10-1133188 B

(Patent Document 2) KR10-1177319 B

(Patent Document 3) KR1020160048628 A

(Patent Document 4) KR10-0805655 B

(Patent Document 5) KR10-1177319 B

(Patent Document 6) KR10-1216359 B

(Patent Document 7) KR1020150122031 A

(Patent Document 8) KR1020130099783 A

SUMMARY OF THE INVENTION An object of the present invention is to provide a device handler capable of more quickly performing device withdrawal and device insertion for a board on which device sockets are installed by recognizing the above problems and trends.

Another object of the present invention is to provide a device pickup and place method capable of picking up and placing a device efficiently with respect to devices of various standards in a device handler.

The present invention was created in order to achieve the object of the present invention as described above, the present invention, the board 20 is provided with a plurality of device sockets 21 is inserted into the device 10 from the board loader 800 A first board table 210 which is transferred and moves in the Y-axis direction so that the elements 10 inserted into the element socket 21 can be drawn out; It is installed on one side of the first board table 210 and according to the device unloading position UL1 received from the board 20 located in the first board table 210 and the classification criteria set in advance An element sorting position UL2 for classifying and stacking the elements 10 is set in the Y-axis direction, and an unposition for alternately positioning the plurality of trays 30 into the element unloading position UL1 and the element sorting position UL2. A loading buffer unit 310; The unloading transfer tool which draws the element 10 from the board 20 located in the first board table 210 and transfers the element 10 to the tray 30 located at the element unloading position UL1. 510; A sorting tray unit 320 in which a plurality of trays 30 are positioned in accordance with a classification level preset in the X-axis direction adjacent to the element sorting position UL2 of the unloading buffer unit 310; An element sorting tool 520 for rearranging the elements 10 according to a preset classification level in each of the tray 30 located at the element sorting position UL2 and the trays 30 located at the sorting tray part 320. )and; Receiving the board 20 completed the device withdrawal in the X-axis direction from the first board table 210 to move in the Y-axis direction so that new devices 10 can be inserted into the device socket 21 of the board 20 A second board table 220; A DC test unit 230 installed adjacent to the second board table 220 and disposed with DC test sockets 231 for DC test of the device 10 in the X-axis direction; A loading transfer tool 530 which pulls out the device 10 inspected as good from the DC test unit 230 and inserts the device 10 into the device socket 21 of the second board table 220; A loading tray unit 110 installed adjacent to the DC test unit 230 and having at least one tray 30 for supplying the device 10 to the DC test unit 230; In the X-axis direction with respect to the loading tray unit 110 adjacent to the DC test unit 230 so that the device 10 is classified and loaded according to the inspection result inspected as non-goods by the DC test unit 230. A DC defective tray unit 120 in which at least one tray 30 is disposed; One or more device loading tools 540 for device transfer from the loading tray unit 110 to the DC test unit 230 and for device transfer from the DC test unit 230 to the DC bad tray unit 120. A device handler is disclosed.

In the device handler, the first board transfer line BL1 is set in the X-axis direction in order to transfer the board 20 from the board loader 800 to the first board table 210, and the second board table. In order to transfer the board 20 from the 210 to the board loader 800, the second board transfer line BL2 is set in the X-axis direction, and the second board transfer line BL2 is the first board. In order to prevent interference with the transfer line BL1, the first board transfer line BL1 may be positioned below the first board transfer line BL1.

The unloading buffer unit 310 may include a pair of trays 30 alternately positioned at an element unloading position UL1 and an element sorting position UL2, and the pair of trays 30 may be formed in the element unloading position. It may include a tray transfer unit 311 for moving the tray 30 to be alternately positioned to the loading position (UL1) and the element sorting position (UL2).

The unloading transfer tool 510 photographs an image of the device socket 21 after the device 10 is drawn out to check the position of the connection terminal in each device socket 21 on the board 20. The image acquisition unit 519 may be combined.

The loading transfer tool 530 is an image for taking an image of the device socket 21 after the withdrawal of the device 10 to confirm the position of the connection terminal of each device socket 21 on the board 20 Acquisition unit 539 may be combined.

The present invention also provides a device for picking up elements 10 by means of a transfer tool in which k pickers are arranged at a pitch interval x from a first loading portion in which m elements 10 are arranged at a first pitch interval x1. A device pick-and-place method in which n loading grooves into which (10) is inserted are placed into a second loading portion disposed at a second pitch interval (x2) different from the first pitch interval (x1), wherein the first pitch interval (x1). ) Is smaller than a preset size with respect to the second pitch interval x2, the pitch interval x of the transfer tool is twice the first pitch interval x1 at the first loading portion. A first pick-up step of picking up the elements 10 by jumping from one loading portion; Pickers failing to pick up the device 10 in the first pick-up step are twice as large as the first pitch interval x1 in the first loading part, so that the devices 10 are picked up one by one from the first loading part. A second pickup step of performing; Place the element 10 in each of the loading grooves of the second loading portion while the transfer tool moves to the second loading portion and the third pitch interval x is the second pitch interval x2. Disclosed is a device pick and place method comprising the steps of:

It is preferable that the number of pickers of the transfer tool and the number of loading grooves of the second loading part are the same.

The first loading part is a tray 30 used for the burn-in sorter, the second loading part is a DC test part 230 provided in the burn-in sorter, and the transfer tool is defective in the DC test part 230. One or more dummy pickers for picking up the checked device 10 may be additionally installed.

The device handler according to the present invention includes a first board table 210 for moving the board 20 for device withdrawal in the Y-axis direction, and a board 20 from which the device 10 is withdrawn from the first board table 210. The second board table 220 moves the board 20 for the device insertion in which the DC test has been performed in the Y-axis direction, and thus the device withdrawal and the device insertion work can be performed more quickly.

The device handler according to the present invention is connected to the device unloading tool 5 (210) for withdrawing the device from the board 20, and further coupled with the device acquisition and image acquisition unit 519 for photographing the device socket 21 By acquiring an image of the socket 21, there is an advantage in that the loading of the device in the second board table 220 can be performed more accurately.

In particular, the pitch spacing is very small on the bottom surface of the device 10 due to the miniaturization and integration of the device 10. Therefore, the device 10 needs to be positioned more accurately on the board 20. By correcting the loading state of the device 10 there is an advantage that the device 10 can be more accurately positioned on the board (20).

1 is a plan view showing an example of an element handler according to the present invention.

2 is a conceptual diagram illustrating a process of loading and unloading a board in the device handler of FIG. 1.

3 is a side view illustrating an example of a configuration of an unloading buffer unit in the device handler of FIG. 1.

FIG. 4 is a conceptual diagram illustrating a pick and place process of a device from a device handler of FIG. 1 to a loading tray unit-> DC test unit-> burn-in board.

5A and 5B are conceptual views showing a process of picking up an element on a tray in the loading tray unit to transfer the element from the loading tray unit to the DC test unit as a variation of the conceptual diagram shown in FIG. 4.

FIG. 6 is a plan view illustrating a process of transferring a device from a loading tray unit to a DC test unit during transfer of the device illustrated in FIG. 4.

FIG. 7 is a diagram illustrating an example of an unloading transfer tool and a loading transfer tool used in the device handler of FIG. 1.

FIG. 8 is a diagram illustrating an example of a device loading tool used in the device handler of FIG. 1.

Hereinafter, a device handler and a device pick and place method according to the present invention will be described with reference to the accompanying drawings.

In the device handler according to the present invention, as shown in FIG. 1, the device socket 21 receives a board 20 provided with a plurality of device sockets 21 into which the device 10 is inserted from the board loader 800. A first board table 210 that moves in the Y-axis direction so that the elements 10 inserted in the device can be drawn out; It is installed on one side of the first board table 210 and according to the device unloading position UL1 received from the board 20 located in the first board table 210, the element (10) and a predetermined classification criteria ( 10) The element sorting position UL2 for classifying and loading the stacks is set in the Y-axis direction, and the unloading buffer for alternately positioning the plurality of trays 30 into the element unloading position UL1 and the element sorting position UL2. Section 310; The unloading transfer tool 510 which draws the element 10 from the board 20 positioned on the first board table 210 and transfers the element 10 to the tray 30 located at the element unloading position UL1. )and; A sorting tray unit 320 in which a plurality of trays 30 are positioned in accordance with a classification level preset in the X-axis direction adjacent to the element sorting position UL2 of the unloading buffer unit 310; An element sorting tool 520 for rearranging the elements 10 according to a predetermined classification level in each of the tray 30 located in the element sorting position UL2 and the trays 30 located in the sorting tray part 320; ; Receiving the board 20 completed the device withdrawal in the X-axis direction from the first board table 210 to move in the Y-axis direction so that new devices 10 can be inserted into the device socket 21 of the board 20 A second board table 220; A DC test unit 230 installed adjacent to the second board table 220 and arranged with DC test sockets 231 for DC testing of the device 10 in the X-axis direction; A loading transfer tool 530 which pulls out the element 10 inspected by the DC test unit 230 and inserts the element 10 into the element socket 21 of the second board table 220; A loading tray unit 110 installed adjacent to the DC test unit 230 and having at least one tray 30 for supplying the device 10 to the DC test unit 230; One or more trays in the X-axis direction with respect to the loading tray unit 110 adjacent to the DC test unit 230 so that the device 10 is classified and loaded according to the inspection result that is inspected as non-defective product in the DC test unit 230. DC defective tray unit 120 is disposed; One or more device loading tools 540 for device transfer from the loading tray unit 110 to the DC test unit 230 and for device transfer from the DC test unit 230 to the DC defective tray unit 120.

The device 10 to be handled by the device handler according to the present invention may be a memory semiconductor, a central processing unit (CPU), a graphics processing unit (GPU), a system large scale integration (LSI), or the like.

Particularly, the device 10 may be any device that is inserted into the device socket 210 of the board 20 and performs a predetermined test such as an electrical test.

For example, the device 10 may be a BGA device having ball-shaped external terminals formed on a bottom surface thereof.

The board 20 is a board in which the device socket 21 into which the device 10 is inserted for device inspection is installed, and various configurations are possible according to the type of inspection for devices such as a burn-in board.

Meanwhile, the board 20 is continuously supplied by the board loader 800, as shown in FIG.

The board loader 800 is configured to load and load the boards 20 into which the elements 10 are inserted, and to sequentially load and discharge the boards 20 into which the elements 10 are inserted, that is, the first As a configuration for continuously supplying the board table 210 and the board 20, various configurations such as a board loader disclosed in Patent Documents 1 to 5 are possible.

For example, the board loader 800 may include a plurality of boards 20 arranged in a rack in an introduction direction of the board 20, for example, in the right direction to the left direction in FIG. 1, that is, in the -X axis direction. Introduced / discharged in a stacked state and withdrawing the board 20 loaded in the rack on the other side to transfer the board 20 to the first board table 210 to be described later, the board 20 from the board table 220 to be described later Can be reloaded into the rack.

On the other hand, the board loader 800, the board 20 to the first board table 210 in the moving direction of the board 20 by the first board table 210, that is, the X-axis direction perpendicular to the Y-axis to be described later To pass.

To this end, in the device handler according to the present invention, as shown in FIGS. 1 and 2, the first board transfer line BL1 is set in the X-axis direction.

The first board transfer line BL1 serves as a transfer line of the board 20 set up to transfer the board 20 from the board loader 800 to the first board table 210. Any configuration may be set as long as the board 20 may be transferred from the board 800 to the first board table 210.

The first recognition is installed on a path from the board loader 800 to the first board table 210 to obtain information about the board 20 and the elements 10 inserted into the board 20. The unit 610 may be installed.

The first recognition unit 610 is installed on the path from the board loader 800 to the first board table 210 to the board 20 and the elements 10 inserted into the board 20. As a configuration for acquiring information, various configurations such as a camera are possible.

The first recognition unit 610 may be configured in various ways such as photographing the entire board 20 or recognizing a separate mark such as a QR code separately displayed on the board 20 according to the information acquisition form.

The first board table 210 receives a board 20 provided with a plurality of device sockets 21 into which the device 10 is inserted from the board loader 800, and then inserts the device 10 into the device socket 21. Various configurations are possible as the configuration to move in the Y-axis direction to withdraw).

Specifically, the first board table 210 receives the board 20 from the board loader 800 via the first board transfer line BL1.

In addition, the first board table 210 is configured to move in the Y-axis direction while fixing the board 20 to enable device withdrawal by the unloading transfer tool 510 to be described later.

To this end, the first board table 210, the fixing means for fixing the board 20, and the first linear board transfer unit for moving the fixing means for fixing the board 20 in the Y-axis direction (not shown) ) May be included.

In addition, a third recognition unit 670 may be installed on the first board table 210 to recognize movement of the board 20 in the Y-axis direction.

The third recognition unit 670 may be installed on the first board table 210 to recognize the movement of the board 20 in the Y-axis direction and may be installed as a camera.

In this case, the third recognition unit 670 recognizes the element socket 21 itself of the board 20, or recognizes a mark that is separately displayed on the board 20, and moves in the Y-axis direction of the board 20. Any configuration can be used as long as it can recognize the configuration.

On the other hand, at the position where the element 10 is drawn out by the unloading transfer tool 510, a socket press for pressing the element socket 21 upward from the board 20 to allow the element 10 to be drawn out. ) Is installed.

The socket press is configured to press the element socket 21 upward from the board 20 so that the element 10 can be withdrawn from the board 20 at the position where the element 10 is drawn out by the unloading transfer tool 510. Configuration is possible.

Meanwhile, the socket press may be installed to be replaced automatically or manually so as to correspond to the size of the device 10, the distance between the device sockets 21, and the like.

In addition, the socket press may be configured such that an interval between the socket press units (not shown) corresponding to each element socket 21 is varied in response to a change in the interval between the element sockets 21.

In addition, the socket press may be configured such that the size of the opening corresponding to each of the device sockets 21 also varies so as to correspond to the size of the device 10, the spacing between the device sockets 21, and the like.

The unloading buffer unit 310 is installed at one side of the first board table 210 and receives the device 10 from the board 20 located in the first board table 210. ) And an element sorting position UL2 for classifying and stacking the elements 10 according to a predetermined sorting criterion is set in the Y-axis direction, and the plurality of trays 30 are placed in the element unloading position UL1 and the element sorting position ( Various configurations are possible as configurations alternately positioned with UL2).

For example, as shown in FIGS. 1 and 3, the unloading buffer unit 310 has a pair of trays 30 alternately positioned at the element unloading position UL1 and the element sorting position UL2. And a tray transfer unit 311 for moving the tray 30 so that the pair of trays 30 are alternately positioned at the element unloading position UL1 and the element sorting position UL2.

The tray conveying unit 311 is configured to move the tray 30 so as to alternately position the pair of trays 30 in the element unloading position UL1 and the element sorting position UL2. Various configurations such as a driving unit are possible.

On the other hand, the tray 30 of the unloading buffer unit 210, the tray of the sorting tray unit 320, the tray of the loading tray unit 110 to be described later is preferably used.

In addition, the tray 30 of the unloading buffer unit 210 may be installed to be replaced according to the standard of the device 10.

The unloading transfer tool 510 extracts the element 10 from the board 20 positioned on the first board table 210 and moves the element 10 to the tray 30 located at the element unloading position UL1. Various configurations are possible as a structure for conveying the).

For example, the unloading transfer tool 510 may include at least one picker 511 and a picker 511 having an adsorption head at the end, which sucks the element 10 by vacuum pressure in the XZ, YZ or XYZ directions. It can be configured to include a picker transfer device for movement, preferably in the XZ direction.

In particular, the unloading transfer tool 510 may include pickers 511 arranged in a line or in various forms such as 8 × 1 and 8 × 2.

In particular, the unloading transfer tool 510, as shown in FIG. 7, has an X-axis direction of the element socket 21 on the board 20 so that the device 10 can be pulled out of the entire row on the board 20. The pickers 511 of the number and arrangement corresponding to 1 / N of the batch number (N is a natural number) may be provided.

In addition, the unloading transfer tool 510 may include a picker for picking up the element 10 because the pitch of the element sockets 21 on the board 20, that is, the pitch of the element stacking pitches on the tray 30 may be different from each other. 511 may be configured to enable the pitch adjustment between.

In order to insert the element 10 into the element socket 21 of the board 20 while the size of the element 10 is small or the pitch between terminals such as ball grids formed on the bottom surface of the element 10 becomes fine. Precise positional movement of 10 is important.

Therefore, it is preferable to determine the exact position of the connection terminals formed in the device socket 21 on the board 20 in the process of withdrawing the device 10 from the board 20 by the unloading transfer tool 510.

To this end, the unloading transfer tool 510, as shown in FIG. 7, pulls out the element 10 and checks the position of each element socket 21 on the board 20. ) May be combined with an image acquisition unit 519 for taking an image.

The image acquisition unit 519 is coupled to the unloading transfer tool 510 and moved together to withdraw the element 10 to check the position of the connection terminals formed in each element socket 21 on the board 20. As a configuration for photographing the image on the device socket 21 after, may be configured as a camera.

On the other hand, the image acquisition unit 519 can recognize the mark to confirm the size, size, etc. of the board 20, it is possible to determine the position of each device socket 21 on the board (20).

For example, the mark for confirming the size, size, etc. of the board 20 may be various forms, such as consisting of four marks displayed at each vertex of the rectangular board.

In addition, the position of each device socket 21 on the board 20 obtained by the image acquisition unit 519 is a second board table (all the elements 10 are drawn out from the first board table 210 and described later) ( After the transfer to the 220 and the fixed to the second board table 220 in the state of each device socket 21 on the board 20 is utilized as the location information of the device 10 by the loading transfer tool 530 to be described later The loading operation can be performed more quickly and accurately.

On the other hand, by utilizing a mark for confirming the size, size, etc. of the board 20, the pin 20 of the board 20 and the respective device sockets 21 on the board 20 in a fixed state You can check the location.

The sorting tray unit 320 is a configuration in which a plurality of trays 30 are positioned in accordance with a classification level preset in the X-axis direction adjacent to the element sorting position UL2 of the unloading buffer unit 310. ), Various configurations are possible depending on the arrangement of the tray and the transfer of the tray 30.

For example, the sorting tray unit 320 may be arranged in a plurality of sorting classes BIN1, BIN2, BIN3, and BIN4 in the X-axis direction adjacent to the element sorting position UL2 of the unloading buffer unit 310. The trays 30 may be arranged in the X-axis direction.

Here, at least one of the trays 30 of the sorting tray part 320, preferably a tray BIN 4, is initially positioned as received by the tray 30 of the unloading buffer part 310 as it is. Can be.

Then, the tray 30 located at the element sorting position UL2 of the unloading buffer unit 310 is transferred to the tray 30 corresponding to the preset classification grades BIN1, BIN2, BIN3, and BIN4, except for good products. Then, the good is taken out from the tray 30 transferred to the sorting tray unit 320 and loaded in an empty place among the trays 30 located at the element sorting position UL2.

Then, the tray 30 located at the element sorting position UL2 filled with good products is transferred to the tray unloading unit 920 separately installed, and the tray is placed at the element sorting position UL2 of the unloading buffer unit 310. A new empty tray 30 is located where the device 10 is not filled by a transfer device (not shown).

The element sorting tool 520 is configured to classify the elements 10 according to a classification class set in advance in each of the tray 30 located at the element sorting position UL2 and the trays 30 located at the sorting tray unit 320. Various configurations are possible as the configuration to be rearranged.

By way of example, the element sorting tool 520 may move one or more pickers and pickers in the XZ, YZ and XYZ directions, preferably in the XYZ directions, each having at least one picker head having an adsorption head for adsorbing the element 10 by vacuum pressure. In addition, it may be configured to include a pickup device for moving.

In particular, the device sorting tool 520 may be arranged in a row, or in various forms such as 8 × 1, 10 × 1, 8 × 2, and the like.

The second board table 220 receives the board 20 on which device drawing is completed, from the first board table 210 in the X-axis direction, and new devices 10 are placed in the device socket 21 of the board 20. Various configurations are possible as the configuration to move in the Y-axis direction to be inserted.

In detail, the second board table 220 receives the board 20 on which the device drawing is completed, from the first board table 210 in the X-axis direction.

At this time, the second board table 220, unlike the first board table 210 that requires a relatively low precision, the device 10 must be accurately loaded on the device socket 21.

Accordingly, on the transfer path of the board 20 from the first board table 210, a second recognition unit 620 for acquiring information about the board 20 and the elements 10 inserted into the board 20 is provided. Can be installed.

The second recognition unit 620 is installed on the board 20 transmission path from the first board table 210 to provide information about the board 20 and the elements 10 inserted into the board 20. Various configurations, such as a camera, are possible as a structure for acquiring.

The second recognition unit 620 may be configured in various ways such as photographing the entire board 20 or recognizing a separate mark such as a QR code separately displayed on the board 20 according to the information acquisition form.

In addition, unlike the first board table 210, the second board table 220 may be configured to be movable in the X-Y axis direction so that the device 10 may be accurately loaded on the device socket 21.

To this end, the second board table 220, a fixing means for fixing the board 20, and a second linear board transfer unit for moving the fixing means for fixing the board 20 in the XY axis direction (not shown) ) May be included.

In addition, a fourth recognition part 680 may be installed on the second board table 220 to recognize movement of the board 20 in the X-Y axis direction.

The fourth recognition unit 680 may be installed on the second board table 220 and installed as a camera to recognize the movement of the board 20 in the X-Y axis direction.

In this case, the fourth recognition unit 680 recognizes the element socket 21 itself of the board 20, or recognizes a mark separately displayed on the board 20, and the like. Any configuration can be used as long as it can recognize the configuration.

Meanwhile, at the position where the element 10 is inserted by the loading transfer tool 530, a socket press for pressing the element socket 21 upward from the upper side so that the element 10 can be inserted into the board 20. ) Is installed.

The socket press, the element socket 21 from the upper side to enable the insertion of the element 10 in the element socket 21 of the board 20 at the position where the element 10 is inserted by the loading transfer tool 530. Various configurations are possible as a structure to pressurize.

Meanwhile, the socket press may be installed to be replaceable to correspond to the size of the device 10, the distance between the device sockets 21, and the like.

In addition, the socket press may be configured such that an interval between the socket press units (not shown) corresponding to each element socket 21 is varied in response to a change in the interval between the element sockets 21.

In addition, the socket press may be configured such that the size of the opening corresponding to each of the device sockets 21 also varies so as to correspond to the size of the device 10, the spacing between the device sockets 21, and the like.

On the other hand, the board 20 which has completed the insertion of the element 10 in the second board table 220 is moved to the lower side, that is, in the Z-axis direction and then moved in the X-axis direction is transferred to the board loader 800.

To this end, in the device handler according to the present invention, as shown in FIGS. 1 and 2, the second board transfer line BL2 is set in the X-axis direction.

The second board transfer line BL2 is configured to transfer the board 20 from the second board table 210 to the board loader 800 and transfers the board 20 as a transfer line of the board 20. Any configuration can be set as long as the board 20 can be transferred from the table 210 to the board loader 800.

On the other hand, the second board transfer line BL2, as shown in FIG. 2 to prevent the interference with the first board transfer line BL1 described above, as shown in Figure 2, than the first board transfer line BL1 It is preferably located below.

If the second board transfer line BL2 is located below the first board transfer line BL1, the loading and unloading process of the board 20 is smooth, and further, the size of the device can be minimized. .

The DC test unit 230 is installed adjacent to the second board table 220, the DC test socket 231 for the DC test of the device 10 in the X-axis direction is arranged as a variety of configurations are possible. .

The DC test unit 230 may be configured in a variety of configurations, such as a plurality of sockets 231 to which the elements 10 may be electrically connected. Preferably, the DC socket 230 of the device socket 21 on the board 20 is provided. It may be composed of a number and an array corresponding to 1 / N (N is a natural number) of the X-axis arrangement number.

On the other hand, according to the test result of each device 10 of the DC test unit 230, the device 10 that is inspected as non-defective is used as data for sorting by the device loading tool 540 to be described later. .

In addition, the DC test unit 230, as shown in Figure 1, so as to respond to changes in the standard of the device 10, for example, the size of the device 10, the distance between the device socket 21, etc. Other types of DC test unit 232 may be installed to be replaced automatically or manually.

The loading transfer tool 530 is configured to pull out the device 10 inspected as good by the DC test unit 230 and insert the device 10 into the device socket 21 of the second board table 220. Various configurations are possible.

For example, the loading transfer tool 530 may include one or more pickers 531 and a picker 531 having an adsorption head at the end, which absorbs the element 10 by vacuum pressure, as shown in FIG. 7. And a picker feed device for moving in the XZ, YZ or XYZ direction, preferably in the XYZ-θ direction.

In this case, the loading transfer tool 530 corrects a horizontal rotation error (θ rotation error) of the device 10 during the pickup and transfer process of the device 10 in the DC test unit 230. To this end, each of the pickers 531 is preferably installed to be able to rotate horizontally, that is, in a θ direction.

In order to correct the horizontal rotational error (theta-direction rotational error) with respect to the element 10 picked up by the picker 531, the pickers 531 should be finely rotated, and the element 10 picked up by the picker 531 In rotating the plurality of pickers 531, a variety of configurations are possible, such as rotating the respective pickers 531.

In addition, the measurement of the horizontal rotational error (θ-direction rotational error) of the device 10 during the pickup and transfer process of the device 10 in the DC test unit 230, the image installed on the movement path of the loading transfer tool 530 It may be performed by the acquirer 641.

The image acquisition unit 641 is configured to measure the horizontal rotational error (θ rotational error) of the device 10 during the pickup and transfer process of the device 10 in the DC test unit 230 as a loading transfer tool ( Various configurations are possible according to the structure and pickup method of the 530.

In addition, the loading transfer tool 530, the pickers may be arranged in a line, or may be arranged in a variety of forms, such as 8 × 1, 10 × 1, 8 × 2.

In particular, the loading transfer tool 530, 1 / N of the X-axis arrangement number of the element socket 21 on the board 20 to enable the insertion of the element 10 in the entire row on the board 20 (N is Number and array of pickers 531 corresponding to a natural number).

In addition, the loading transfer tool 530 is a picker 531 that picks up the element 10 because the spacing of the element sockets 21 on the board 20, that is, the pitch of the element stacking pitches on the tray 30 may be different. It may be configured to enable pitch adjustment between the).

However, it is preferable that the sockets of the DC test unit 230 be disposed at the same interval as the spacing of the element sockets 21 on the board 20. In this case, pitch adjustment between pickers picking up the element 10 is required. It is not.

In order to insert the element 10 into the element socket 21 of the board 20 while the size of the element 10 is small or the pitch between terminals such as ball grids formed on the bottom surface of the element 10 becomes fine. Precise positional movement of 10 is important.

Therefore, in the process of loading the device 10 onto the board 20 by the loading transfer tool 530, it is preferable to determine the exact position of the connection terminals formed on the device socket 21 on the board 20.

To this end, as described above, an image acquisition unit 512 is installed in the unloading transfer tool 510 to acquire and utilize an image for each device socket 21 or at the same time or alternatively, the loading transfer tool ( 530, as shown in FIG. 7, acquires an image of capturing an image of the device socket 21 after the device 10 is drawn out in order to confirm the location of each device socket 21 on the board 20. The portion 539 may be combined.

The image acquisition unit 539 is configured to take an image of the device socket 21 after withdrawal of the device 10 in order to confirm the position of the connection terminals formed in each device socket 21 on the board 20. As a camera, it can be comprised.

On the other hand, the image acquisition unit 539 also recognizes the mark to confirm the size, size, etc. of the board 20, it is possible to determine the position of each device socket 21 on the board (20).

For example, the mark for confirming the size, size, etc. of the board 20 may be various forms, such as consisting of four marks displayed at each vertex of the rectangular board.

And the position of each device socket 21 on the board 20 obtained by the image acquisition unit 539, the second board table (all the elements 10 are drawn out from the first board table 210) After the transfer to the 220 and the fixed to the second board table 220 in the state of each device socket 21 on the board 20 is utilized as the location information of the device 10 by the loading transfer tool 530 to be described later The loading operation can be performed more quickly and accurately.

On the other hand, by utilizing a mark for confirming the size, size, etc. of the board 20, the pin 20 of the board 20 and the respective device sockets 21 on the board 20 in a fixed state You can check the location.

The loading tray unit 110 is installed adjacent to the DC test unit 230 and may be configured in various ways as one or more trays 30 are provided to supply the device 10 to the DC test unit 230. Do.

For example, the loading tray 110 includes two or more trays 30 disposed in the X-axis direction adjacent to the DC test unit 230 to supply the device 10 to the DC test unit 230. Can be.

The reason why two or more trays 30 are disposed in the loading tray unit 110 is that any one tray 30 is a DC test unit 230 by the device loading tool 540 to be described later. If all of the elements are delivered, the elements 10 are transferred from the adjacent tray 30 to the DC test unit 230 so that the elements 10 may be transferred to the DC test unit 230 without a break even though the tray 30 is empty. Can be delivered.

On the other hand, when the tray 30 of the loading tray unit 110 is empty all the elements 10 are delivered to the DC test unit 230, the empty tray 30, the bin tray unit 130 is set separately by the tray transfer unit Can be delivered and loaded.

In addition, the tray 30 of the loading tray unit 110 may also be transferred to the unloading buffer unit 310, the sorting tray unit 320, and the like described above by the tray transfer unit.

In addition, a new tray 30 loaded with elements 10 is supplied from a tray loading unit 910 separately installed at a position where the tray 30 is removed from the loading tray unit 110.

The DC defective tray unit 120 is adjacent to the DC test unit 230 so that the device 10 is classified and loaded according to the inspection result inspected as non-defective product in the DC test unit 230, the loading tray unit 110. As a configuration in which one or more trays 30 are arranged in the X-axis direction, various configurations are possible.

For example, the DC defective tray unit 120 may have a configuration and arrangement similar to the sorting tray unit 320 described above.

Meanwhile, the loading tray 110, the DC bad tray 120, the bin tray 130, and the sorting tray 320 may be smoothly moved by one tray transfer unit. Tray 30 may be arranged in a row in the X-axis direction so that the tray 30 can be transported.

In addition, the supply of the tray 30 to the loading tray unit 110, the withdrawal of the tray 30 in which the element 10 is filled from the DC defective tray unit 120, and the tray 30 to the empty tray unit 130 are provided. The loading tray unit 110, the DC defective tray unit 120, and the bin tray unit 130 to enable the supply and / or withdrawal of the tray 30 filled with the elements 10 in the sorting tray unit 320. And tray loading parts 140 corresponding to the sorting tray part 320 may be installed.

The tray loading part 140 is located at the lower or upper part of the main body constituting the device, the supply of the tray 30 to the loading tray part 110, the element 10 in the DC defective tray part 120. Loading tray to enable withdrawal of the filled tray 30, supply and / or withdrawal of the tray 30 to the bin tray 130, and withdrawal of the tray 30 filled with the elements 10 in the sorting tray 320. Corresponding to the unit 110, the DC bad tray unit 120, the bin tray unit 130, and the sorting tray unit 320, the tray 30 may be stacked in various configurations.

On the other hand, the external supply and export of the tray 30 to the device handler according to the present invention can be implemented by a variety of methods.

The at least one device loading tool 540 may be configured as a device for device transfer from the loading tray unit 110 to the DC test unit 230 and for device transfer from the DC test unit 230 to the DC defective tray unit 120. Configuration is possible.

By way of example, the device loading tool 540 moves at least one picker and picker in the XZ, YZ or XYZ direction, preferably XYZ-, having an adsorption head at the end having an adsorption head for adsorbing the element 10 by vacuum pressure. It can be configured to include a picker transfer device for moving in the θ direction.

Here, the device loading tool 540, as shown in FIGS. 4 to 8, picks up the device 10 from the tray 30 and inserts it into the socket 231 of the DC test unit 230. The horizontal rotation error (θ rotation error) of the device 10 may be generated. In order to compensate for this, each of the pickers 541 may be installed so as to be rotated in a horizontal rotation, that is, in the θ direction.

In addition, the device loading tool 540, the pickers 541 may be arranged in a line, or may be arranged in a variety of forms, such as 8 × 1, 8 × 2.

In addition, the device loading tool 540 performs both device transfer from the loading tray unit 110 to the DC test unit 230 and device transfer from the DC test unit 230 to the DC defective tray unit 120, or 2 It can consist of two dogs.

Meanwhile, the unloading transfer tool 510, the device sorting bull 520, the loading transfer tool 530, and the device loading tool 540 are configured to include a plurality of pickers as described above.

In addition, the pickers may be detachably coupled to the suction head at the end to pick up the device by vacuum pressure.

In addition, the adsorption head (pad), it is preferable that the new adsorption head is configured to be replaced when there is a change in device specifications, such as the size of the element 10 to be picked up, or if there is damage due to long-term use.

To this end, at least one of the unloading transfer tool 510, the element sorting bull 520, the loading transfer tool 530, and the element loading tool 540 may include an adsorption pad exchanger 810 provided on the movement path. 820, 830, and 840 may be moved by horizontal movement and vertical movement to be automatically replaced with a new adsorption head.

The suction pad exchanger 810, 820, 830, and 840 may include at least one movement path among the unloading transfer tool 510, the element sorting tool 520, the loading transfer tool 530, and the element loading tool 540. Any configuration may be used as long as the adsorption head can be automatically replaced so that the adsorption head can be automatically replaced with a new adsorption head that is moved by horizontal movement and vertical movement.

For example, the structure and the exchange method of the adsorption pad exchanger 810, 820, 830, 840 and the adsorption head may have various structures such as those shown in FIGS. 9A to 11B of Patent Document 8 and the like. Do.

In addition, at least one image acquisition unit 611, 621, 641 may be installed to check the state of the adsorption head coupled to the picker in the exchange of the adsorption head by the adsorption pad exchanger 810, 820, 830, 840. Can be.

On the other hand, the insertion of the device 10 into the board 20 and / or the insertion of the device 10 into the DC test unit 230, it is necessary to precisely position the device 10 in order to perform the accurate test.

However, there is a problem that an error and a rotational error of the horizontal position of the device 10 are generated due to the pick-up process of the picker, replacement of the suction head, and the like.

To this end, the loading transfer tool 530 and / or device loading tool 540 needs to be configured to enable more precise control in the insertion, that is, the loading process of the device 10.

The loading transfer tool 530 and / or the device loading tool 540 may have a configuration of the transfer tool disclosed in Patent Documents 1 to 8.

In particular, the loading transfer tool 530 and / or the device loading tool 540 may have a configuration of the transfer tool shown in Figures 5a to 7 of Patent Document 7.

In addition, the loading transfer tool 530 and / or the device loading tool 540, the picker of the picker in order to correct the horizontal rotation error (θ direction error) of the device 10 in the pickup state of the device 10; It is preferable that it is comprised so that rotation in (theta) direction which made the longitudinal direction the rotation axis.

In particular, when the loading transfer tool 530 and / or the device loading tool 540 has a configuration of the transfer tool shown in Figures 5a to 7 of Patent Document 7 by the camera 80 forming a part of the transfer tool Measure the horizontal rotational error (θ direction error) of the element 10 in the state of picking up the element 10 and insert the element, i.e., rotation of an adsorption head for picking up the element 10, or rotation of the entire transfer tool. By this, the horizontal rotation error (θ direction error) can be corrected.

Here, the rotation of the adsorption head, etc., by rotating the adsorption head to pick up the element 10 by a rotational restraining member or the like separately installed while fixing the rod constituting the picker can correct the horizontal rotation error (θ direction error) have.

Meanwhile, the loading transfer tool 530 and / or the device loading tool 540 may pick up the device according to whether or not correction of the horizontal rotational error (θ direction error) occurs depending on the pitch of the terminals formed on the bottom surface of the device 10. And place method may vary.

For example, when correction of the horizontal rotational error (θ direction error) is unnecessary, the loading transfer tool 530 and / or the device loading tool 540 may allow a plurality of pickers to pick up the elements 10 at a time. After that, one place may be placed on the DC test unit 230 or the board 20 at a time.

When correction of the horizontal rotational error (θ direction error) is required, correction of the rotational error of each device 10 is required. After a plurality of pickers pick up the devices 10 at a time, Each device 10 may be placed on the DC test unit 230 or the board 20 (n place; n is the number of pickers picking up the device 10).

In this case, when the individual rotation of each picker is possible for the correction of the rotational error, after the correction of the rotational error due to the individual rotation of each picker, it may be loaded (one place) on the DC test unit 230 or the board 20 at a time. Of course.

On the other hand, as described above, an error in the horizontal center position of the picker may occur due to the replacement of the suction head, etc., and it is necessary to correct this.

Thus, the loading transfer tool 530 and / or the device loading tool 540 is installed on the movement path to obtain the bottom image for each picker, that is, the bottom image of the suction head to calculate the center of the suction head by By calculating the deviation from the center of the adsorption head before replacement after replacement of the adsorption head, the error in the horizontal center position of the picker due to the replacement of the adsorption head can be corrected.

To this end, a movement path of the loading transfer tool 530 and / or the device loading tool 540, for example, is installed in the vicinity of the DC test unit 230, and the loading transfer tool 530 and / or the device loading from below. A camera 649 may be installed to acquire a bottom image of the pickers that make up the tool 540.

On the other hand, the pick-up of the device 10 by the loading transfer tool 530 and the insertion of the device 10 into the board 20 and / or the pick-up and DC test unit of the device 10 by the device loading tool 540 ( The insertion speed of the device 10 into the 230 may depend on the size of the device 10.

Specifically, the tray 30 of the loading tray unit 110 according to the size of the device 10 according to the size of the device 10, such as 6 rows, 7 rows, 8 rows, 10 rows, 12 columns, etc. ), The first pitch interval x1 of the pickers 541 of the device loading tool 540 for picking up the device may be different.

In addition, the second pitch interval x2 of the device insertion groove (socket, 231) of the DC test unit 230 may vary according to the design and specification of the device handler.

In addition, the third pitch interval x3 of the device insertion groove (socket) 21 on the board 20 may vary according to the design and specification of the device handler.

Accordingly, the loading transfer tool 530 and the device loading tool 540 picking up the device 10 are generally configured such that the pitch interval x formed by the pickers is variable.

However, when the pitch intervals formed by the pickers are variable to correspond to the specifications of all the elements 10, the positional error of each picker is increased due to the wide range of variable distances, making it difficult to control and the size of the transfer tool is complicated. Control also has a difficult problem.

Accordingly, the present invention is a novel device pick-up and place method, wherein the loading grooves of the tray 30 in which the number of pickers of the device loading tool 540 and the pitch interval x3 formed by the pickers are arranged in rows corresponding to the number of pickers. Slightly smaller value than the first pitch interval (x1)-hereinafter the reference pitch of (21) as the minimum pitch value, slightly smaller than the second pitch interval (x2) of the device insertion groove 231 of the DC test section 230 It is preferable to be configured so that a large value is made into the maximum pitch value.

When the first pitch interval x1 of the loading grooves 21 of the tray 30 is smaller than the reference pitch, the device loading tool 540 skips the elements 10 on the tray 30 one by one. Pickers failing to pick up element 10 after picking up (10) may be configured to pick up element 10 by jumping across element 10 on tray 30 one by one.

Here, the device loading 540 having completed the device pick-up may load the device 10 in the DC test unit 230 with a small pitch variation.

That is, according to the present invention, as a novel device pickup and place method, as shown in FIGS. 4, 5A, and 5B, m elements (m is a natural number of two or more) have a first pitch interval x1. ) By a transfer tool (element loading tool 540) in which k (k is two or more natural numbers) pickers are arranged at a pitch interval x from the first loading portion arranged, for example, tray 20. A second loading part in which n loading grooves into which the element 10 is inserted and the elements 10 are inserted are arranged at a second pitch interval x2 different from the first pitch interval x1, for example. For example, as a device pick-and-place method for the DC test unit 230, when the first pitch interval x1 is smaller than a predetermined size for the second pitch interval x2, the pitch interval x of the transfer tool is adjusted. A first pick-up step of picking up the elements 10 from the first load part one by one at twice the first pitch interval x1 in the first load part; A second pick-up step in which pickers failing to pick up the device 10 are picked up by skipping the elements 10 one by one from the first loading part at twice the first pitch interval x1 at the first loading part; And a place step of placing the element 10 in each of the loading grooves of the second loading portion with the tool moving to the second loading portion and the third pitch interval x being the second pitch interval x2. A device pick and place method is disclosed.

Preferably, the number of pickers of the transfer tool and the number of loading grooves of the second loading part are the same.

The first loading part may be a tray 30 used for the burn-in sorter, and the second loading part may be a DC test part 230 installed in the burn-in sorter.

Meanwhile, the transfer tool, as the device loading tool 540, may be additionally provided with one or more dummy pickers 542 for picking up the device 10 inspected as defective in the DC test unit 230.

The dummy picker 542 is included in the device loading tool 540 and configured to pick up the device 10 that is inspected as defective in the DC test unit 230.

In particular, the dummy picker 542 picks up the device 10 that is inspected as defective in the DC test unit 230, and then, in the device transfer process between the tray 30 and the DC test unit 230, the DC bad tray described above. The device 10 may be loaded into the tray 30 of the unit 120.

Herein, the number of devices 10 inspected as defective in the DC test unit 230 due to the improvement of the semiconductor process may be very small, such as one or two pickers.

Meanwhile, the dummy picker 542 may be configured to be identical to or similar to the picker constituting the device loading tool 540 by only picking up the device 10 checked as defective in the DC test unit 230.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

Claims (8)

Y-axis direction so that the board 20 provided with a plurality of device sockets 21 into which the device 10 is inserted is received from the board loader 800 and withdraws the devices 10 inserted into the device socket 21. A first board table 210 for moving to; It is installed on one side of the first board table 210 and according to the device unloading position UL1 received from the board 20 located in the first board table 210 and the classification criteria set in advance An element sorting position UL2 for classifying and stacking the elements 10 is set in the Y-axis direction, and an unposition for alternately positioning the plurality of trays 30 into the element unloading position UL1 and the element sorting position UL2. A loading buffer unit 310; The unloading transfer tool which draws the element 10 from the board 20 located in the first board table 210 and transfers the element 10 to the tray 30 located at the element unloading position UL1. 510; A sorting tray unit 320 in which a plurality of trays 30 are positioned in accordance with a classification level preset in the X-axis direction adjacent to the element sorting position UL2 of the unloading buffer unit 310; An element sorting tool 520 for rearranging the elements 10 according to a preset classification level in each of the tray 30 located at the element sorting position UL2 and the trays 30 located at the sorting tray part 320. )and; Receiving the board 20 completed the device withdrawal in the X-axis direction from the first board table 210 to move in the Y-axis direction so that new devices 10 can be inserted into the device socket 21 of the board 20 A second board table 220; A DC test unit 230 installed adjacent to the second board table 220 and disposed with DC test sockets 231 for DC test of the device 10 in the X-axis direction; A loading transfer tool 530 which pulls out the device 10 inspected as good from the DC test unit 230 and inserts the device 10 into the device socket 21 of the second board table 220; A loading tray unit 110 installed adjacent to the DC test unit 230 and having at least one tray 30 for supplying the device 10 to the DC test unit 230; In the X-axis direction with respect to the loading tray unit 110 adjacent to the DC test unit 230 so that the device 10 is classified and loaded according to the inspection result inspected as non-goods by the DC test unit 230. A DC defective tray unit 120 in which at least one tray 30 is disposed; One or more device loading tools 540 for device transfer from the loading tray unit 110 to the DC test unit 230 and for device transfer from the DC test unit 230 to the DC bad tray unit 120. Device handler, characterized in that. The method according to claim 1, In order to transfer the board 20 from the board loader 800 to the first board table 210, a first board transfer line BL1 is set in the X-axis direction, In order to transfer the board 20 from the second board table 210 to the board loader 800, a second board transfer line BL2 is set in the X-axis direction, The second board transfer line BL2 is positioned below the first board transfer line BL1 in order to prevent interference with the first board transfer line BL1. The method according to claim 1, The unloading buffer unit 310, A pair of trays 30 alternately positioned at the element unloading position UL1 and the element sorting position UL2, And a tray transfer part 311 which moves the tray 30 so that the pair of trays 30 are alternately positioned at the element unloading position UL1 and the element sorting position UL2. Handler. The method according to claim 1, The unloading transfer tool 510, In order to check the position of the connection terminal in each device socket 21 on the board 20, the image acquisition unit 519 for taking out the image of the device socket 21 after taking out the device 10 is coupled Element handler. The method according to claim 1, The loading transfer tool 530, In order to check the position of the connection terminal of each device socket 21 on the board 20, the image acquisition unit 539 for taking an image of the device socket 21 after the withdrawal of the device 10 is coupled Element handler. The elements 10 are picked up by the transfer tool in which k pickers are arranged at the pitch interval x from the first loading portion in which the m elements 10 are arranged at the first pitch interval x1. A device pick-and-place method in which n loading grooves to be inserted are placed into a second loading portion disposed at a second pitch interval x2 different from the first pitch interval x1. When the first pitch interval x1 is smaller than a preset size with respect to the second pitch interval x2, the pitch interval x of the transfer tool is the first pitch interval x1 in the first loading portion. A first pick-up step of picking up by skipping elements 10 one by one from the first loading part at twice the value of? Pickers failing to pick up the device 10 in the first pick-up step are twice as large as the first pitch interval x1 in the first loading part, so that the devices 10 are picked up one by one from the first loading part. A second pickup step of performing; Place the element 10 in each of the loading grooves of the second loading portion while the transfer tool moves to the second loading portion and the third pitch interval x is the second pitch interval x2. Device pick and place method comprising the step of. The method according to claim 6, And the number of pickers of said transfer tool and the number of loading grooves of said second loading portion are the same. The method according to claim 1, The first loading portion is a tray 30 used for burn-in sorter, The second loading unit is a DC test unit 230 installed in the burn-in sorter, The transfer tool, device pick-and-place method, characterized in that one or more dummy pickers for picking up the device (10) inspected as defective in the DC test unit 230 is installed.

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