WO2018163710A1 - Touch sensor - Google Patents

Abstract

This touch sensor is provided with a sensor body, a cover member secured to the upper surface of the sensor body by a plurality of cover-securing parts, and a flexible wiring board electrically connected to the sensor body. The sensor body has a plurality of electrode parts arrayed with intervals provided therebetween along a peripheral edge part on the upper surface of the sensor body. The flexible wiring board has a flexible substrate and a plurality of connection parts that is provided to the distal-end part of the flexible substrate, secured to the upper surface of the sensor body, and electrically connected to the plurality of electrode parts, respectively. The plurality of cover-securing parts is arranged in alternating fashion with respect to the plurality of connection parts along the peripheral edge part on the upper surface of the sensor body. In this touch sensor, it is possible to stabilize the connection state of the flexible wiring board with respect to the sensor body.

Description

Touch sensor

The present invention relates to a touch sensor including a sensor body to which a flexible wiring board is connected.

Patent Document 1 discloses a conventional touch sensor that includes a base sheet, a protective panel laminated on the base sheet, and a flexible wiring board electrically connected to the base sheet. An electrode portion is disposed on the upper surface of the peripheral edge portion of the base sheet. A connecting portion that is electrically connected to the electrode portion in a state of being fixed to the upper surface of the base sheet is provided at the distal end portion of the flexible wiring board. This touch sensor includes a fixing portion made of an anisotropic conductive resin material that fixes the connection portion to the upper surface of the peripheral portion of the base sheet.

JP 2015-18317 A

The touch sensor includes a sensor main body, a cover member fixed to the upper surface of the sensor main body with a plurality of cover fixing portions, and a flexible wiring board electrically connected to the sensor main body. The sensor main body has a plurality of electrode portions arranged at intervals on the upper surface along the peripheral edge portion. The flexible wiring board includes a flexible substrate and a plurality of connection portions that are provided at the tip of the flexible substrate and fixed to the upper surface of the sensor body and electrically connected to the plurality of electrode portions, respectively. The plurality of cover fixing portions are alternately arranged with the plurality of connection portions along the peripheral edge on the upper surface of the sensor body.

This touch sensor can stabilize the connection state of the flexible wiring board to the sensor body.

FIG. 1 is a perspective view of the touch sensor according to the first embodiment. FIG. 2 is an exploded perspective view of the touch sensor according to the first embodiment. FIG. 3 is an exploded perspective view of the sensor body of the touch panel according to the first embodiment. FIG. 4 is a partially enlarged perspective view of the sensor main body according to the first embodiment. FIG. 5 is a plan view of the sensor main body according to the first embodiment. FIG. 6 is a perspective view of the sensor main body according to the first embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII of the sensor body shown in FIG. FIG. 8 is a sectional view of the sensor body according to the first embodiment. FIG. 9 is a cross-sectional view of the sensor body according to the first embodiment. FIG. 10 is an exploded perspective view of the touch sensor according to the second embodiment. FIG. 11 is a plan view of a touch sensor according to the second embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description of each embodiment is merely illustrative in nature, and is not intended to limit the present invention, its application, or its use.

(First embodiment)
FIG. 1 is a perspective view of a touch sensor 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the touch sensor 1. The touch sensor 1 is a capacitive touch sensor type input device, for example, various devices incorporating a display device such as a liquid crystal display or an organic electroluminescence (EL) display (for example, in-vehicle devices such as a car navigation system, personal devices, etc. It is used as an input device for a computer display device, a mobile phone, a portable information terminal, a portable game machine, a copy machine, a ticket vending machine, an automatic teller machine, etc.

The touch sensor 1 includes a sensor body 3, a cover member 2 having optical transparency, and a flexible wiring board 20. The cover member 2 is made of a cover glass or a plastic cover lens. Specifically, the cover member 2 has a rectangular plate shape and is stacked on the upper surface of the sensor body 3. In addition, a frame-shaped window frame portion 2a is formed in a dark color such as black by printing or the like on the outer periphery of the lower surface of the cover member 2. A transparent translucent portion 2b is formed in an internal rectangular region surrounded by the window frame portion 2a.

The user's fingers come into contact with the upper surface of the cover member 2 in accordance with the input operation of the touch sensor 1. 1 and 2, an X axis, a Y axis, and a Z axis that are orthogonal to each other are defined. The positive direction of the Z axis is upward, and the negative direction of the Z axis is downward.

FIG. 3 is an exploded perspective view of the sensor body 3. The sensor body 3 has an upper substrate 4 and a lower substrate 5. Each of the upper substrate 4 and the lower substrate 5 is made of a resin material having optical transparency such as polyethylene terephthalate, polyethersulfone, polycarbonate, and the like. Further, each of the upper substrate 4 and the lower substrate 5 has a substantially rectangular film shape, and the thickness thereof is, for example, 50 μm to 125 μm. For example, the upper substrate 4 and the lower substrate 5 are made of a resin sheet. The sensor body 3 has a peripheral edge 3t and a peripheral edge 3s that are located in the negative direction of the Y axis and extend in the X axis direction. The peripheral edge 3s includes a peripheral edge 3t. The upper substrate 4 has a peripheral edge 4t and a peripheral edge 4s that are located in the negative direction of the Y axis and extend in the X axis direction. The peripheral edge 4s includes a peripheral edge 4t. The lower substrate 5 has a peripheral edge 5t and a peripheral edge 5s that are located in the negative direction of the Y-axis and extend in the X-axis direction. The peripheral part 5s includes a peripheral edge 5t. The peripheral portions 4s and 5s overlap the peripheral portion 3s in the Z-axis direction.

As shown in FIG. 3, two openings 4 a are formed in the peripheral portion 4 s of the upper base 4, which are cut out in a concave shape that is recessed from the peripheral portion 4 s in the positive direction of the Y-axis. The opening 4 a exposes the upper surface of the lower base material 5 toward the lower surface of the cover member 2 in a state where the upper base material 4 is laminated and disposed above the lower base material 5. In addition, a central convex portion 4b that protrudes in the negative direction of the Y-axis is formed between the openings 4a.

The sensor body 3 further includes a rectangular upper adhesive sheet 6 and a lower adhesive sheet 7. Each of the upper adhesive sheet 6 and the lower adhesive sheet 7 is made of a thermosetting resin adhesive such as acrylic, urethane, epoxy, or the like. Each of the upper adhesive sheet 6 and the lower adhesive sheet 7 has a substantially rectangular film shape, and its thickness is, for example, 25 μm to 125 μm. The upper adhesive sheet 6 has a peripheral edge 6t and a peripheral edge 6s that are located in the negative direction of the Y-axis and extend in the X-axis direction. The peripheral portion 6s includes a peripheral edge 6t. The lower adhesive sheet 7 has a peripheral edge 7t and a peripheral edge 7s that are located in the negative direction of the Y axis and extend in the X axis direction. The peripheral portion 7s includes a peripheral edge 7t. The peripheral portions 6s and 7s overlap the peripheral portions 4s and 5s in the Z-axis direction.

The upper adhesive sheet 6 is disposed between the cover member 2 and the upper base material 4. The upper base material 4 is laminated and disposed below the cover member 2 with the upper adhesive sheet 6 adhered to the lower surface of the cover member 2. An upper opening 6 a that is notched in a concave shape that is recessed in the positive direction of the Y axis is formed in the peripheral edge 6 s of the upper adhesive sheet 6. The upper opening 6a has such a length that the two openings 4a of the upper substrate 4 can be accommodated in the X-axis direction.

The lower adhesive sheet 7 is disposed between the upper base material 4 and the lower base material 5. The lower base material 5 is laminated and disposed below the upper base material 4 with the lower base material 5 adhered to the lower surface of the upper base material 4 by the lower adhesive sheet 7. Two lower openings 7 a that are notched in a concave shape that is recessed in the positive direction of the Y-axis are formed in the peripheral portion 7 s of the lower adhesive sheet 7. Each lower opening 7 a has substantially the same shape and size as each opening 4 a of the upper substrate 4. Each lower opening 7 a is disposed so as to be in the same position as each opening 4 a of the upper substrate 4 in a state where the lower adhesive sheet 7 is superimposed on the upper substrate 4.

A plurality of upper conductive layers 11 are formed on the upper surface of the upper substrate 4 by a sputter deposition method or the like. The plurality of upper conductive layers 11 extend in the Y-axis direction and are arranged at intervals in the X-axis direction. Each upper conductive layer 11 is made of a transparent conductive film having optical transparency such as indium tin oxide and tin oxide, and extends in a strip shape in the Y-axis direction. Specifically, each upper conductive layer 11 has a plurality of rhombus-shaped square portions connected in the Y-axis direction. The upper conductive layer 11 may be formed by a thin line made of a conductive metal such as copper arranged in a mesh shape. The fine wire may be formed of a conductive resin.

A plurality of lower conductive layers 12 are formed on the upper surface of the lower substrate 5 by a sputter deposition method or the like. The plurality of lower conductive layers 12 extend in the X-axis direction and are arranged at intervals in the Y-axis direction. Each lower conductive layer 12 is made of the same material as each upper conductive layer 11 and extends in a strip shape in the X-axis direction. Specifically, each lower conductive layer 12 has a plurality of rhombus-shaped square portions connected to each other in the X-axis direction. Note that the lower conductive layer 12 may also be formed by a fine wire made of a conductive metal such as copper arranged in a mesh shape. The fine wire may be formed of a conductive resin.

As shown in FIG. 3, the sensor main body 3 has a plurality of electrode portions 13. Specifically, the plurality of electrode portions 13 include an upper electrode portion 14 and a lower electrode portion 15. The upper electrode portion 14 and the lower electrode portion 15 are aggregates of a plurality of electrode wires made of, for example, silver, carbon, copper foil, and the like, and are spaced apart in the X-axis direction on the upper surface of the peripheral portion 3s of the sensor body 3. Are arranged. The plurality of electrode portions 13 may also be formed by fine wires made of a conductive metal such as copper arranged in a mesh shape. The fine wire may be formed of a conductive resin.

The upper electrode portion 14 is disposed on the upper surface of the central convex portion 4 b of the upper base material 4. One end portion of each electrode line of the upper electrode portion 14 is connected to the rear end portion of each upper conductive layer 11, and the other end portion of each electrode line is disposed on the central convex portion 4 b of the upper substrate 4. Further, the lower electrode portion 15 is disposed on the upper surface of the peripheral edge portion 5 s of the lower base material 5. One end portion of the electrode line of the lower electrode portion 15 is connected to one of end portions in opposite directions along the X axis of each lower conductive layer 12, and the other end portion of the electrode wire is connected to the lower substrate 5. The peripheral portion 5s is disposed at a position away from the center in the X-axis direction in the opposite direction along the X-axis.

FIG. 4 is a partially enlarged perspective view of the sensor body 3. As shown in FIG. 4, an anisotropic conductive resin material 23 is applied in advance to the upper surface of the peripheral edge 3 s of the sensor body 3. The anisotropic conductive resin material 23 is exposed to the upper surface of the central convex portion 4 b of the upper base material 4 and the lower base material exposed in the opening 4 a of the upper base material 4 before connecting the flexible wiring board 20 to the sensor body 3. 5 is applied to the upper surface of the peripheral portion 5s. Specifically, the anisotropic conductive resin material 23 is elongated so as to have a rod shape in the X-axis direction, and the upper electrode portion 14 and the lower electrode portion 15 on the upper surface of the peripheral portion 3 s of the sensor body 3. It is applied on top.

As shown in FIG. 2, the touch sensor 1 includes a flexible wiring board 20 having a substantially T-shape. The flexible wiring board 20 is a kind of printed circuit board called “Flexible Printed Circuits” (hereinafter referred to as “FPC”), and is flexible and can be deformed so that its electrical characteristics do not change even in the deformed state. It is configured. The flexible wiring board 20 includes a flexible substrate 20a having insulating properties, and a plurality of connection portions 21 provided at the tip of the flexible substrate 20a.

The plurality of connection portions 21 provided at the distal end portion of the flexible wiring board 20 have a convex shape protruding in the positive direction of the Y axis. In the first embodiment, the number of the plurality of connection portions 21 is three. In addition, a plurality of (two in the first embodiment) cutouts are formed in the distal end portion of the flexible printed circuit board 20a of the flexible wiring board 20 so as to be recessed in the negative direction of the Y axis from the distal end side. A notch recess 22 is formed.

FIG. 5 is a plan view of the sensor body 3 and shows a state in which the flexible wiring board 20 is attached to the sensor body 3. FIG. 6 is a perspective view of the sensor body 3, and shows a state when the connection portion 21 of the flexible wiring board 20 is thermocompression bonded to the sensor body 3. 7 is a cross-sectional view taken along line VII-VII of the sensor body 3 shown in FIG. FIG. 8 is a cross-sectional view of the sensor main body 3 and shows a state in which the connection portion 21 is thermocompression bonded to the sensor main body 3 by the crimping head H. FIG. FIG. 9 is a cross-sectional view of the sensor body 3 and shows a state in which the cover member 2 is thermocompression bonded to the sensor body 3 by the crimping head H. FIG.

As shown in FIG. 5 to FIG. 9, each connection portion 21 is electrically connected to each electrode portion 13 provided in the sensor main body 3. Specifically, the connection portion 21 disposed at the center in the X-axis direction of the flexible wiring board 20 is electrically connected to the upper electrode portion 14. On the other hand, each of the connection portions 21 arranged in the positive and negative directions of the X axis is electrically connected to each lower electrode portion 15 in a state of being accommodated in each opening 4a of the upper base material 4. Yes. As shown in FIG. 5, the plurality of cover fixing portions 40 are arranged on a straight line Lx extending alternately in the X-axis direction with the plurality of connection portions 21.

In the state where the flexible wiring board 20 is attached to the sensor main body 3, a wiring fixing portion 30 is provided below each connection portion 21. The wiring fixing part 30 is made of an anisotropic conductive resin material 23 that fixes the connection part 21 to the upper surface of the peripheral part 3 s of the sensor body 3. In addition, a plurality of cover fixing portions 40 are provided on the upper surface of the peripheral portion 3 s of the sensor body 3. The plurality of cover fixing portions 40 are made of an anisotropic conductive resin material 23 for fixing the cover member 2 to the sensor body 3. 7 to 9, each cross-sectional portion is represented by dot hatching in order to emphasize and show each of the wiring fixing portion 30 and the cover fixing portion 40.

The plurality of wiring fixing portions 30 are composed of wiring fixing portions 31 and 32. The wiring fixing part 31 is formed such that the connection part 21 located at the center in the X-axis direction among the plurality of connection parts 21 is fixed to the upper surface of the central convex part 4 b of the upper base material 4. On the other hand, each of the wiring fixing portions 32 includes the lower base material 5 in which each of the connection portions 21 located on both sides in the X-axis direction among the plurality of connection portions 21 is exposed in each of the openings 4 a of the upper base material 4. It is formed so as to be fixed to the upper surface of the peripheral portion 5s.

On the other hand, the plurality of cover fixing portions 40 are constituted by cover fixing portions 41 and 42 disposed in a predetermined region located on the side of the connecting portion 21 along the X-axis direction.

The cover adhering portions 41 are disposed so as to be paired at positions symmetrical with respect to the center line C passing through the center in the X-axis direction which is the width direction of the flexible wiring board 20. Specifically, each cover fixing portion 41 is disposed in a recess inner region A in each notch recess 22 in the flexible wiring board 20, and the cover member 2 is located in each recess inner region A. It is comprised so that it may adhere to the upper surface of the center convex part 4b. In this embodiment, since a part of the upper surface of the lower base material 5 is exposed in each opening 4a, the cover member 2 is positioned in the indented region A by each cover fixing portion 41. It is also fixed to the upper surface of the substrate 5.

The cover adhering portions 42 are arranged so as to be paired at positions symmetrical with respect to the center line C. Specifically, each cover fixing portion 42 is disposed in the outer region B located outside either one of the left and right connection portions 21, and the cover member 2 is positioned in the outer region B by each cover fixing portion 42. It is fixed to the upper surface of the peripheral portion 5s of the lower base material 5 to be performed.

As described above, before the flexible wiring board 20 is attached to the sensor body 3, the anisotropic conductive resin material 23 has a substantially rod shape extending in the X-axis direction (see FIG. 4). Therefore, after the anisotropic conductive resin material 23 is thermocompression bonded, each of the cover fixing portions 41 and 42 is integrally formed to be continuous with each wiring fixing portion 30. Specifically, as shown in FIG. 9, the cover fixing portion 41 is continuous with the wiring fixing portions 31 and 32, respectively, while each cover fixing portion 42 is continuous with the corresponding wiring fixing portion 32.

Next, a method for manufacturing the touch sensor 1 will be described.

First, the upper substrate 4 and the lower substrate 5 are bonded by the lower adhesive sheet 7. Thereafter, an anisotropic conductive resin material 23 is applied to the upper surface of the peripheral portion 3s of the sensor body 3 over a predetermined range (see FIG. 4). After applying the anisotropic conductive resin material 23, as shown in FIG. 6 to FIG. 8, each connection portion 21 of the flexible wiring board 20 is placed on the upper surface of the peripheral portion 3s of the sensor body 3, and Each crimping head H is pressed from above. Thereby, the part arrange | positioned in the position corresponding to each connection part 21 among the anisotropic conductive resin materials 23 fuse | melts. And the wiring adhering parts 31 and 32 are formed in a predetermined position by solidifying the anisotropically conductive resin material 23 after melting. The connection portions 21 are bonded to the upper surface of the peripheral edge portion 3 s of the sensor body 3 by the wiring fixing portions 31 and 32.

After each connecting portion 21 is bonded to the upper surface of the peripheral portion 3 s of the sensor body 3, the cover member 2 is bonded to the sensor body 3 by the upper adhesive sheet 6. After the adhesion, as shown in FIG. 9, the plurality of pressure-bonding heads H are pressed against the lower base material 5 from the lower side of the lower base material 5 toward the positions corresponding to the in-recess area A and the outer area B. Thereby, the portion of the anisotropic conductive resin material 23 at a position corresponding to the cover fixing portions 41 and 42 is melted. And the cover adhering parts 41 and 42 are formed in a predetermined position by solidifying the anisotropically conductive resin material 23 after melting. By the cover fixing portions 41 and 42, the cover member 2 is bonded to the sensor main body 3 in the inner region A and the outer region B located on the side of each connecting portion 21.

(Operational effects of the first embodiment)
In the touch sensor disclosed in Patent Document 1, since the connecting portion of the flexible wiring board is merely bonded to the upper surface of the peripheral portion of the base sheet by the fixing portion, the electrode disposed on the upper surface of the peripheral portion of the base sheet. The connection strength between the part and the connection part is weak, and the connection state of the flexible wiring board to the base sheet becomes unstable. For example, when an external force acts on the touch sensor when the touch sensor is assembled to an external device, the load due to the external force affects the connection state between the electrode unit and the connection unit, and as a result, poor contact between the electrode unit and the connection unit. There is a risk that problems such as these may occur.

In the touch sensor 1 according to the first embodiment, the cover member 2 is formed on the upper surface of the peripheral portion 3 s of the sensor body 3 in the recessed portion inner region A and the outer region B located on the side of each connection portion 21 by the plurality of cover fixing portions 40. It is fixed. Therefore, the connection portion 21 is protected in a state of being covered between the cover member 2 and the peripheral portion 3 s of the sensor body 3, and the state where the electrode portion 13 is connected to the connection portion 21 is maintained. Thereby, for example, even if some external force acts on the touch sensor 1 when the touch sensor 1 is assembled to an external device, the load due to the external force does not greatly affect the connection state between the electrode portion 13 and the connection portion 21. As a result, the action of the external force on the connection portion 21 of the flexible wiring board 20 is suppressed, and problems such as poor contact between the electrode portion 13 and the connection portion 21 are reduced. Therefore, in the touch sensor 1 according to the first embodiment, the connection state of the flexible wiring board 20 to the sensor body 3 can be stabilized.

Further, the cover fixing portion 41 disposed in the indented region A can fix the cover member 2 to the upper surface of the peripheral portion 3s of the sensor body 3 located between the two connection portions 21. Become. As a result, the connection state between the connection portion 21 and the electrode portion 13 located in the indented region A can be appropriately protected between the cover member 2 and the peripheral portion 3 s of the sensor main body 3.

Further, the cover fixing portion 42 disposed in the outer region B allows the cover member 2 to be fixed to the upper surface of the peripheral portion 3s of the sensor body 3 located outside the flexible wiring board 20. As a result, the connection state between the connection portion 21 and the electrode portion 13 located in the outer region B can be appropriately protected between the cover member 2 and the peripheral portion 3 s of the sensor body 3.

A plurality of wiring fixing portions 30 made of anisotropic conductive resin material 23 for fixing each connecting portion 21 to the upper surface of the peripheral edge 3 s of the sensor body 3 are provided below each connecting portion 21. Each of the cover fixing portions 41 and 42 is made of an anisotropic conductive resin material 23 that is continuous with each wiring fixing portion 30. That is, the materials of the cover fixing portions 41 and 42 and the plurality of wiring fixing portions 30 are shared by the anisotropic conductive resin material 23. Thereby, it is possible to prevent the number of constituent members of the touch sensor 1 from increasing while ensuring the conductivity between the electrode portion 13 and the connection portion 21. Furthermore, since each of the cover fixing portions 41 and 42 and each wiring fixing portion 30 are continuous with each other, the fixing structure between the flexible wiring board 20 and the sensor body 3 and the fixing structure between the cover member 2 and the sensor body 3 are obtained. The connection strength between the electrode portion 13 and the connection portion 21 can be further enhanced as a unit.

Further, the cover fixing portion 41 can fix the upper base material 4 disposed at a position closer to the lower surface of the cover member 2 to the cover member 2. And the connection part 21 fixed to the center convex part 4b of the upper base material 4 by the wiring fixing | fixed part 31 is firmly clamped between the cover member 2 and the peripheral part 4s of the upper base material 4. FIG. Thereby, the connection intensity | strength of the electrode part 14 (13) and the connection part 21 fixed to the upper base material 4 can be raised further.

Also, the lower base material 5 arranged at a position farther from the lower surface of the cover member 2 can be fixed to the cover member 2 by the cover fixing portion 42. Since the cover fixing part 41 and the cover fixing part 42 are continuous with each other via the wiring fixing part 32, the connection state between the electrode part 15 (13) and the connection part 21 corresponding to the position of the wiring fixing part 32 Can be maintained appropriately.

Furthermore, the two cover fixing portions 41 are arranged so as to be paired at positions symmetrical with respect to the center line C. Similarly, the two cover fixing portions 42 are arranged so as to be paired at positions symmetrical with respect to the center line C. As a result, the fixing structure between the cover member 2 and the sensor body 3 can be evenly strengthened in the width direction (X-axis direction) of the distal end portion of the flexible wiring board 20. For this reason, for example, even when an external force that twists the tip of the flexible wiring board is applied when the touch sensor 1 is assembled to an external device, the electrode portion 13 and the connection portion 21 are prevented from receiving a load due to the external force. The connection state can be further stabilized.

As described above, the touch sensor 1 includes the sensor main body 3, the cover member 2 fixed to the upper surface of the sensor main body 3 with the plurality of cover fixing portions 40, and the flexible wiring board 20 electrically connected to the sensor main body 3. With. The sensor body 3 has a plurality of electrode portions 13 arranged at intervals on the upper surface of the sensor body 3 along the peripheral edge 3 s of the sensor body 3. The flexible wiring board 20 includes a flexible substrate 20a, a plurality of connection portions 21 that are provided at the tip of the flexible substrate 20a, are fixed to the upper surface of the sensor body 3, and are electrically connected to the plurality of electrode portions 13, respectively. Have The plurality of cover fixing portions 40 are alternately arranged with the plurality of connection portions 21 on the upper surface of the sensor body 3 along the peripheral edge 3 s of the sensor body 3.

The notch recessed part 22 which is located in the front-end | tip part of the flexible substrate 20a between the connection parts 21 mutually adjacent among the some connection parts 21, and opens at the front-end | tip of the flexible board | substrate 20a may be formed. In this case, the plurality of cover fixing portions 40 include a cover fixing portion 41 disposed in the indented region A in the notch recess 22.

The plurality of cover fixing portions 40 are disposed in one outer region B of the two outer regions B outside the plurality of connection portions 21 arranged along the peripheral edge 3 s on the upper surface of the sensor body 3. The fixing part 42 may be further included.

The anisotropic conductive resin material 23 fixes the cover member 2 and the flexible wiring board 20 to the upper surface of the sensor body 3. The plurality of connection portions 21 are fixed to the upper surface at the peripheral edge portion 3 s of the sensor body 3 in the plurality of wiring fixing portions 30. The anisotropic conductive resin material 23 extends continuously over the plurality of cover fixing portions 40 and the plurality of wiring fixing portions 30.

The sensor main body 3 includes an upper base material 4 disposed on the lower surface of the cover member 2 and constituting the upper surface of the sensor main body 3, and a lower base material 5 disposed below the upper base material 4. The plurality of connection portions 21 include a connection portion 21 that is fixed to the upper base material 4 and a connection portion 21 that is fixed to the lower base material 5. The upper base 4 is provided with an opening 4 a that exposes the upper surface of the lower base 5 toward the cover member 2 from the upper base 4 and accommodates the connection portion 21. The plurality of wiring fixing portions 30 include a wiring fixing portion 31 where the connection portion 21 is fixed to the upper base material 4, and a wiring fixing portion 32 where the connection portion 21 is fixed to the lower base material 5 through the opening 4 a of the upper base material 4. including.

The wiring fixing part 32 is located between the cover fixing part 41 and the cover fixing part 42. The cover fixing part 41 is located between the wiring fixing part 31 and the wiring fixing part 32.

The notch recessed part 22 which is located in the front-end | tip part of the flexible substrate 20a between the connection parts 21 mutually adjacent among the some connection parts 21, and opens at the front-end | tip of the flexible board | substrate 20a may be formed. In this case, the plurality of cover fixing portions 40 are the other of the cover fixing portion 41 disposed in the recess inner region A in the notch recess 22 and the two outer regions B outside the plurality of connecting portions 21. And a cover fixing portion 42 disposed in the outer region B. The plurality of connection portions 21 further include a connection portion 21 that is fixed to the upper base material 4 and a connection portion 21 that is fixed to the lower base material 5. The upper base 4 is provided with an opening 4 a that exposes the upper surface of the lower base 5 toward the cover member 2 from the upper base 4 and accommodates the connection portion 21. The plurality of wiring fixing portions 30 include a wiring fixing portion 31 where the connection portion 21 is fixed to the upper base material 4, and a wiring fixing portion 32 where the connection portion 21 is fixed to the lower base material 5 through the opening 4 a of the upper base material 4. Further included.

The two cover fixing portions 41 are symmetrical with respect to the center line C passing through the center of the flexible wiring board 20 in the direction in which the plurality of cover fixing portions 40 and the plurality of wiring fixing portions 30 are arranged. The two cover fixing portions 42 are in symmetrical positions with respect to the center line C.

The plurality of cover fixing portions 40 may be arranged on a straight line Lx extending alternately with the plurality of connection portions 21 in the X-axis direction.

(Second Embodiment)
FIG. 10 is an exploded perspective view of the touch sensor 1a according to the second embodiment. FIG. 10 is a plan view of the touch sensor 1a. In this embodiment, the configurations of the upper base material 4 and the lower base material 5 in the first embodiment are replaced with each other. 10 and 11, the same reference numerals are given to the same portions as those of the touch sensor 1 according to the first embodiment shown in FIGS.

As shown in FIG. 10, in the upper base material 4, the opening 4 a is formed at the center of the peripheral edge portion 4 s of the upper base material 4 in the X-axis direction. On the other hand, the lower opening 7 a of the lower adhesive sheet 7 is disposed so as to be in the same position as the opening 4 a of the upper substrate 4 in a state where the lower adhesive sheet 7 is superimposed on the upper substrate 4. .

Further, in the upper base material 4, the plurality of upper conductive layers 11 extend in the X-axis direction and are arranged at intervals from each other in the Y-axis direction. One end portion of the plurality of electrode lines of the upper electrode portion 14 is connected to one end portion of each upper conductive layer 11, and the other end portion of the electrode line is from the center in the X-axis direction of the peripheral edge portion 4 s in the upper base material 4. They are arranged at positions separated in the positive and negative directions of the X axis.

In the lower substrate 5, the plurality of lower conductive layers 12 extend in the Y-axis direction and are arranged at intervals in the X-axis direction. One end portion of the electrode line of each lower electrode portion 15 is connected to the rear end portion of each lower conductive layer 12, and the other end portion of the electrode wire is disposed at the center position in the X-axis direction of the lower substrate 5. ing.

As shown in FIG. 11, in the flexible wiring board 20, each of the connection portions 21 arranged on both sides of the positive and negative directions of the X axis is electrically connected to each upper electrode portion 14. In addition, the connection portion 21 disposed in the center in the X-axis direction is electrically connected to the lower electrode portion 15 while being accommodated in the opening 4 a of the upper base material 4.

The wiring fixing part 31 is configured such that the connection parts 21 located on both sides of the positive direction and the negative direction of the X axis are fixed to the upper surface of the peripheral edge part 4 s of the upper base material 4. On the other hand, the wiring fixing portion 32 is configured such that the connection portion 21 located in the center in the X-axis direction is fixed to the upper surface of the peripheral portion 5s of the lower base material 5 exposed in the opening 4a of the upper base material 4. Has been.

The cover fixing part 41 is configured such that the cover member 2 is fixed to the upper base material 4 located in the outer region B. On the other hand, the cover fixing portion 42 is configured so that the cover member 2 is fixed to the upper surface of the lower base material 5 located in the indented region A. The cover fixing part 41 is continuous with the wiring fixing part 31. On the other hand, the cover fixing part 42 is continuous with the wiring fixing parts 31 and 32, respectively.

As described above, in the touch sensor 1a, the wiring fixing portion 31 is located between the cover fixing portion 41 and the cover fixing portion 42. The cover fixing part 42 is located between the wiring fixing part 31 and the wiring fixing part 32.

(Operational effect of the second embodiment)
As described above, in this embodiment, the cover fixing portion 41 can fix the upper base material 4 disposed at a position closer to the lower surface of the cover member 2 to the cover member 2. And the connection part 21 fixed to the upper surface of the peripheral part 4s of the upper base material 4 by the wiring fixed part 31 is firmly clamped between the cover member 2 and the peripheral part 4s of the upper base material 4. Thereby, the connection strength between the upper electrode portion 14 and the connection portion 21 fixed to the upper base material 4 can be further increased.

Also, the cover fixing part 42 makes it possible to fix the lower substrate 5 located in the indented region A and at a position far from the back surface of the cover member 2 to the cover member 2. Since the wire fixing portion 32 and each cover fixing portion 42 are continuous with each other, the connection state between the lower electrode portion 15 and the connection portion 21 corresponding to the position of the wiring fixing portion 32 can be appropriately maintained. it can.

(Other embodiments)
In the touch sensors 1 and 1a according to the above-described embodiments, the sensor body 3 has the upper base material 4 and the lower base material 5, but the present invention is not limited thereto. For example, the sensor body 3 includes one base material and the upper adhesive sheet 6, the upper conductive layer 11 and the upper electrode portion 14 are formed on the upper surface of the base material, and the lower conductive layer 12 and the lower side are formed on the lower surface of the base material. The form in which the electrode part 15 was formed may be sufficient. The upper conductive layer 11, the upper electrode part 14, the lower conductive layer 12, and the lower electrode part 15 may be configured on the same surface with respect to one base material.

As mentioned above, although embodiment about this invention was described, this invention is not limited only to the above-mentioned embodiment, A various change is possible within the scope of the invention.

In the embodiment, terms indicating directions such as “upper surface”, “upper”, “upper base material”, and “lower base material” indicate relative directions determined only by the relative positional relationship of the components of the touch sensor 1, It does not indicate an absolute direction such as a vertical direction.

DESCRIPTION OF SYMBOLS 1 Touch sensor 2 Cover member 3 Sensor main body 4 Upper base material 4a Opening part 4b Center convex part 5 Lower base material 6 Upper adhesive sheet 7 Lower adhesive sheet 11 Upper conductive layer 12 Lower conductive layer 14 Upper electrode part 15 Lower electrode part 20 flexible wiring board 21 connection portion 22 notch recess 23 anisotropic conductive resin material 30 wiring fixing portion 31 wiring fixing portion (first wiring fixing portion)
32 Wiring fixing part (second wiring fixing part)
40 Cover fixing part 41 Cover fixing part (first cover fixing part, second cover fixing part, third cover fixing part, fourth cover fixing part)
42 Cover fixing part (first cover fixing part, second cover fixing part, third cover fixing part, fourth cover fixing part)
A Recessed area B Outer area

Claims (10)

A sensor body;
A cover member fixed to the upper surface of the sensor body with a plurality of cover fixing portions;
A flexible wiring board electrically connected to the sensor body;
With
The sensor body has a plurality of electrode portions arranged at intervals on the upper surface of the sensor body along the peripheral edge of the sensor body,
The flexible wiring board includes a flexible substrate and a plurality of connection portions that are provided at a front end portion of the flexible substrate and are fixed to the upper surface of the sensor body and electrically connected to the plurality of electrode portions, respectively. Have
The plurality of cover fixing portions are arranged alternately with the plurality of connection portions on the upper surface of the sensor body along the peripheral edge of the sensor body. The touch sensor according to claim 1,
In the tip portion of the flexible substrate, a first notch recess is formed that is located between adjacent connection portions of the plurality of connection portions and opens at the tip of the flexible substrate,
The plurality of cover fixing portions include a first cover fixing portion disposed in a first recess inner region in the first notch recess. The touch sensor according to claim 2,
The plurality of cover fixing portions are disposed in one outer region of two outer regions outside the plurality of connection portions arranged along the peripheral edge portion on the upper surface of the sensor body. The touch sensor further including a cover fixing part. The touch sensor according to claim 3,
An anisotropic conductive resin material for fixing the cover member and the flexible wiring board to the upper surface of the sensor body;
The plurality of connection portions are respectively fixed to the upper surface at the peripheral portion of the sensor body in a plurality of wiring fixing portions,
The anisotropically conductive resin material is a touch sensor that extends continuously across the plurality of cover fixing portions and the plurality of wiring fixing portions. The touch sensor according to claim 4,
The sensor body is
An upper substrate disposed on the lower surface of the cover member and constituting the upper surface of the sensor body;
A lower substrate disposed below the upper substrate;
Have
The plurality of connection portions include a first connection portion that is fixed to the upper base material, and a second connection portion that is fixed to the lower base material,
The upper base material is provided with a first opening that exposes the upper surface of the lower base material from the upper base material toward the cover member and accommodates the second connection portion,
The plurality of wiring fixing portions are:
A first wiring fixing portion in which the first connection portion is fixed to the upper substrate;
A second wiring fixing portion in which the second connection portion is fixed to the lower base material through the first opening of the upper base material;
Including touch sensor. The touch sensor according to claim 5,
The second wiring fixing part is located between the first cover fixing part and the second cover fixing part,
The touch sensor, wherein the first cover fixing part is located between the first wiring fixing part and the second wiring fixing part. The touch sensor according to claim 5,
The first wiring fixing part is located between the first cover fixing part and the second cover fixing part,
The touch sensor, wherein the first cover fixing part is located between the first wiring fixing part and the second wiring fixing part. The touch sensor according to any one of claims 5 to 7,
The front end portion of the flexible substrate is formed with a second notch recess that is located between adjacent connection portions of the plurality of connection portions and opens at the front end of the flexible substrate. ,
The plurality of cover fixing portions are:
A third cover fixing portion disposed in a second recess inner region in the second notch recess;
A fourth cover fixing portion disposed in the other outer region of the two outer regions outside the plurality of connecting portions;
Further including
The plurality of connection portions further include a third connection portion that is fixed to the upper base material, and a fourth connection portion that is fixed to the lower base material,
The upper base material is provided with a second opening that exposes the upper surface of the lower base material toward the cover member from the upper base material and accommodates the fourth connection portion,
The plurality of wiring fixing portions are:
A third wiring fixing portion where the third connection portion is fixed to the upper base material;
A fourth wiring fixing portion in which the fourth connection portion is fixed to the lower base material through the opening of the upper base material;
A touch sensor. The touch sensor according to claim 8,
The first cover fixing portion and the third cover fixing portion are mutually connected with respect to a center line passing through the center of the flexible wiring board in the direction in which the plurality of cover fixing portions and the plurality of wiring fixing portions are arranged. In a symmetrical position,
The second cover fixing part and the fourth cover fixing part are symmetric with respect to the center line. The touch sensor according to any one of claims 1 to 9,
The plurality of cover fixing portions are arranged in a straight line alternately with the plurality of connection portions.

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