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WO2018162302A1 - Réseau de consommateurs à régulation automatique de la température et procédé - Google Patents

Réseau de consommateurs à régulation automatique de la température et procédé Download PDF

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Publication number
WO2018162302A1
WO2018162302A1 PCT/EP2018/054943 EP2018054943W WO2018162302A1 WO 2018162302 A1 WO2018162302 A1 WO 2018162302A1 EP 2018054943 W EP2018054943 W EP 2018054943W WO 2018162302 A1 WO2018162302 A1 WO 2018162302A1
Authority
WO
WIPO (PCT)
Prior art keywords
ptc
consumers
series resistors
led
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/054943
Other languages
German (de)
English (en)
Inventor
Hans Layer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conda Technik und Form GmbH
Original Assignee
Conda Technik und Form GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE202017101372.3U external-priority patent/DE202017101372U1/de
Priority claimed from DE102017105115.5A external-priority patent/DE102017105115A1/de
Application filed by Conda Technik und Form GmbH filed Critical Conda Technik und Form GmbH
Priority to EP18708961.0A priority Critical patent/EP3593595A1/fr
Publication of WO2018162302A1 publication Critical patent/WO2018162302A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/54—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a series array of LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the invention relates to a system for the automatic control of a plurality of spatially distributed electrical consumers with regard to their maximum allowable power.
  • consumers may be, in particular, LED light sources, so-called light engines.
  • the invention relates to a method for producing, in particular for printing such a system.
  • LEDs Light-generating planar or strip-shaped arrangements are known which serve for illumination by means of LEDs mounted on their surface.
  • LED's have known advantages in terms of efficiency, size, life and operating temperature over, for example, incandescent or gas discharge bulbs. LED's are also characterized by a very long life, which is disadvantageously reduced significantly at a little exceeded maximum chip temperature.
  • the LEDs are therefore usually thermally well conductive on a circuit board, which otherwise serves to power the LED's and as a mechanical support applied. The heat is then dissipated there via cooling surfaces to the environment depending on the installation situation more or less well.
  • the maximum chip temperature must be strictly adhered to, which means that it must not be exceeded at a maximum, defined ambient temperature for the built-in PCB in continuous operation at a defined performance under any circumstances.
  • the maximum permissible power of the LED and thus of the light module as a whole inevitably has to be aligned.
  • the heat transfer is proportional to the temperature difference between the LED chip and the respective local ambient temperature of the light engine, whereby the respective thermal resistances of the intermediate media add up.
  • the LED array could be operated at a correspondingly higher power, for example 40 watts, and the maximum would be
  • Chip temperature still not exceeded. It can therefore be a correspondingly higher current, due to the typical characteristic of the LED at a case otherwise hardly increased voltage, are applied, the emitted light power thereby increases approximately proportional to the applied current.
  • the LED current is regulated in accordance with the ambient temperature such that the chip temperature remains within the maximum values. This is usually done with the aid of a local thermal sensor and control electronics, which requires active components such as field effect transistors. A problem with this is the only localized detection of the temperature, assuming that this applies to the entire arrangement. The mentioned problem can also be addressed relatively easily via the ballast, which, however, often arranged relatively far away from the LED's to be monitored and therefore is even more error-prone.
  • the characteristic curve of such an automatic passive PTC control can be well adjusted by a series connection of a series resistor for limiting the maximum current and a parallel connection to the PTC for increasing the minimum current within limits.
  • the PTC responds exclusively to the temperature prevailing locally in its immediate surroundings and can however be thermally coupled to at most one of, for example, 12 LEDs connected in series, which is then monitored by way of example under the simplifying and usually erroneous assumption that all the LEDs experience the same cooling. Occurs at non-monitored location but locally a Ubertemperatur, this is not detected, the corresponding LED chip temperature is permanently exceeded and the LED fails accordingly prematurely, which leads due to the series connection to a visually negatively striking failure of the entire chain of LEDs.
  • the electrical system comprising a plurality of spatially distributed electrical consumers such as light sources, in particular semiconductor light sources such as LED's and a plurality of PTC series resistors, which are connected in series with at least a portion of the electrical loads.
  • a plurality of spatially distributed electrical consumers such as light sources, in particular semiconductor light sources such as LED's and a plurality of PTC series resistors, which are connected in series with at least a portion of the electrical loads.
  • At least a part of the plurality of PTC series resistors is arranged in each case in thermal contact with at least one part of the consumers.
  • the arrangement of the series resistors in thermal contact with at least one part of the consumers is to be understood in particular as meaning that changes in the absolute temperature in the region of a consumer within a short time, typically within a few seconds, also manifest themselves as a temperature change in the region of the respective series resistor. This can be achieved, for example, by arranging the series resistors in each case in close proximity to the respective consumer, in particular at a distance of less than 10 mm, preferably at a distance of less than 5 mm.
  • thermal contact can also be achieved by the use of heat-conducting elements, for example of heat pipes, also known as heat pipes.
  • heat pipes also known as heat pipes.
  • an immediate neighborhood of series resistor and consumer is not mandatory.
  • a thermally coupled PTC resistor is present for each LED of a series circuit.
  • the PTC series resistors can each be realized on a carrier layer as layers which contain electrically conductive printing ink with PTC properties, also referred to below as PTC printing ink.
  • the PTC printing ink may be an electrically conductive printing ink originally developed for self-regulating heating structures.
  • the heating power, which gives the printed PTC, which is used as a heating resistor, at a constant supply voltage decreases significantly with increasing temperature in the range of a typical transition temperature because of the increase in resistance of the conductive ink.
  • a largely constant temperature of, for example, 60.degree. C. is established, even with very different heat dissipation or different ambient temperature, as long as the heat dissipation does not fall below a minimum level.
  • Such a printing ink is available, for example, under the trade name LOCTITE ECI 8001 from Henkel AG & Co. KGaA.
  • the described PTC printing ink is advantageously used for regulating the electrical load, in particular an LED chain as a function of the chip temperature.
  • a jump temperature of, for example, 60 ° C. is exceeded, the resistivity of the PTC ink increases by a factor of 7, correspondingly increasing the voltage drop across the PTC series resistor.
  • the difference voltage at the consumers drops slightly in the ratio, but due to the typical LED characteristic of the current strong.
  • the temperature of the LED chips and thus also of the corresponding locally thermally coupled regions of the PTC printing ink are also reduced.
  • the PTC printing ink is advantageously applied over a large area.
  • this planar arrangement advantageously allows a detection of the temperature of all LEDs of a chain to be controlled simultaneously.
  • This arrangement results in an equivalent circuit diagram, in which a respective PTC series resistor connected in parallel with other PTC series resistors is thermally coupled adjacent to each LED.
  • the PTC series resistors in particular at a distance of less than 5 mm from the respective consumers - for example, the LED's - be arranged.
  • the PTC series resistors are arranged between the teeth of a spatially extended comb-shaped conductor structure and can in particular be realized as rectangular, in particular square, areas of applied printing ink.
  • the desired relatively low parallel resistance created by the fact that the electric current is passed over the inter-teeth of two realized as copper layers, opposing combs.
  • the teeth of the opposite combs are electrically connected exclusively by the PTC ink, which can be realized simultaneously with a simple printing process.
  • differentiate PTC series resistors are to be understood as meaning, in particular, different regions of a contiguous layer of a PTC ink. The differentiation into a plurality of different regions then results from the spatial proximity or the thermal coupling to or with a consumer.
  • the layer thickness of the printing ink may, in particular, be in a range from 15 ⁇ m to 30 ⁇ m, in particular in a range of 25 ⁇ m.
  • the PTC printing ink has a relatively high resistivity of typically 1.7 kOhm for each square at the usual printable layer thicknesses of, for example, 25 ⁇ , in order to achieve the necessarily low resistance of, for example, 1.7 ohms set forth above 1, 000 squares needed.
  • this is achieved by the above-mentioned comb-like toothing in the layout.
  • This structure is advantageously applied in parallel and as close as possible to the LEDs of the corresponding row in order to achieve the best possible thermal coupling between the corresponding areas of the PTC printing ink and the corresponding LEDs.
  • the carrier layer for example a printed circuit board
  • a very large, thermally highly conductive layer in particular a metallic layer using, for example, copper or aluminum on the thin carrier material with a thickness of, for example, 10 50 ⁇ is running.
  • Under the underside of the carrier layer is understood to be the consumer side facing away from the carrier layer.
  • This lower copper layer can advantageously be full surface and thus conduct thermally well, since it has no current-carrying function. It also compensates for any local temperature differences.
  • the above-mentioned comb structure, together with the regions of the PTC printing ink can also be arranged on the underside of the carrier layer.
  • the regions of the PTC printing ink can be arranged exactly on the side of the carrier layer opposite the consumers, so that the thermal coupling between the LED chip and PTC printing ink is optimized, thereby improving the response of the Systems should improve.
  • the conductive, for example, comb-shaped copper structure in this case can be designed geometrically such that it can additionally perform the function of heat distribution on the underside of the carrier layer.
  • the conductive, for example, comb-shaped copper structure in this case can be designed geometrically such that it can additionally perform the function of heat distribution on the underside of the carrier layer.
  • On the top side of the carrier layer only the consumers would then have to be contacted by means of suitable conductor tracks.
  • Such a solution may be advantageous, in particular, for application situations in which there is insufficient space available for the comb-like conductor structures mentioned above, for example when the electrical consumers are arranged in a single series connection one behind the other, as may be the case with LED light bands ,
  • the regions of the PTC printing ink can preferably also be electrically isolated from the latter in the layout at larger grid spacings of the consumers or the LEDs, but can be arranged only in the immediate vicinity of each consumer; only the minimum necessary current supply to the LEDs limit this arrangement.
  • flat light engines are often divided into non-continuous surfaces, for example by division by means of a punching.
  • a coherent large-area conductor structure is preferably used as the carrier layer.
  • the conductor foil may in particular have a thickness in the range of 20 ⁇ -10 ⁇ , in particular in the range of 50 ⁇ . Since the material costs are significantly reduced compared to conventional printed circuit boards, a correspondingly large surface area is available cost-effectively, which is not technically required for the basic function of a light engine for the power supply and carrier function.
  • This free area can preferably be used for the areas with PTC printing ink.
  • the additional pre- or parallel resistances in the range of typically 1... 10 ohms, which supplement the PTC regions, can preferably be generated in the layout of the copper interconnects instead of by discrete components through thin meander-shaped structures, which eliminates the need to additionally assemble them.
  • the production of layers containing PTC ink is possible simultaneously for all the chains of a light engine with only one printing operation. As a printing method is particularly but not exclusively the screen printing.
  • intaglio printing it is possible to use both conductor track structures for supplying power to the consumer in the form of, for example, silver-containing highly conductive conductive ink and layers containing the PTC ink in one pass in a plurality of printing units at the same time accurately and very quickly To Print.
  • This is particularly advantageous if one prints the structure of the invention in large areas endlessly in roll form on film.
  • Such a film must then be equipped only with the consumers such as the LEDs, more components omitted.
  • This light foil can be fed with a constant voltage supply in certain lengths, each individual parallel-connected LED chain is thermally protected against overheating by its respective printed PTC series resistors, thus significantly simpler installation conditions for such a foil can be defined.
  • the installation situation and the cooling can vary between very good and minimal, nevertheless, the maximum possible light output of the overall arrangement is achieved due to the automatic control.
  • LED's are also implemented by printing technology, such as in the case of OLEDs, so a self-regulating Lightenginefolie can advantageously be produced entirely purely printing technology, the subsequent assembly of additional electronic components deleted.
  • printing units for the different media to be printed such as the PTC ink, copper or silver for printed conductors and provide the necessary for the realization of the LED's substances.
  • the PTC inks are announced in addition to the already available version for heating purposes with 60 ° C transition temperature with other transition temperatures of 40, 80 and 100 ° C in data sheets. This results in further optimization possibilities, for example by preferably two different PTC colors being printed in parallel. This results in a transition temperature 1 reduction and ditto then at transition temperature 2 again.
  • the characteristic of the controller can preferably be better adapted.
  • PTC series resistors assigned to different consumers can be connected in series for the circuitry implementation of the solution according to the invention.
  • the PTC series resistors can also be connected between see the LEDs of the chain be arranged within the series circuit. It is also conceivable to arrange a plurality of PTC series resistors connected in parallel and spatially and thus thermally to individual loads as a common series resistor circuit in front of these consumers in the current path common to the loads.
  • the consumers can in principle be connected in series or in parallel.
  • a flat light engine which automatically adjusts to the respective ambient temperature, the maximum allowable power of the LED's and this taking into account local temperature differences, as for example by different thermally conductive ground or different air supply due to the installation position or by a poor Cooling by ventilation or the like may arise. This optimizes the otherwise massively endangered life of the LEDs in such cases or at affected locations within the light engine.
  • control factors in the range of a few percent to more than 70% can be achieved and thus optimized for a large number of applications, depending on which target is to be achieved with priority.
  • the same LED can be operated at considerably higher powers than unregulated, as long as the cooling by the environment is correspondingly effective. If the ambient temperature increases or the cooling is impaired by any influences, possibly only locally, the performance of each LED chain is automatically reduced with minimal technical effort by the PTC ink applied with only one printing process.
  • the light output of otherwise identical LED's compared to a conventional solution without control clearly increases, especially since the conventional solution must be based on the respectively defined maximum allowable ambient temperature - usually on the assumption that the local cooling is identical for all consumers, but in practice in some cases does not apply. This then leads to corresponding premature failure of individual LEDs and thus because of the series connection of the complete respective affected LED chain total to a corresponding negative effect for the user or vice versa analog increased warranty for the manufacturer, since such errors due to the inadequate operating environment very difficult are detectable.
  • An advantageous application of the solution according to the invention can be carried out in so-called retrofit fluorescent tubes.
  • an elongated printed circuit board with LED's is mounted in series in a glass tube so that the tube can be used, for example, in a lamp originally intended for a conventional fluorescent tube.
  • a spatially resolved, temperature-dependent power control makes sense.
  • Figure 1 shows an exemplary layout for the realization of the invention
  • Figure 3 shows an advantageous design concept for the realization of the invention
  • FIG. 4 shows a variant of the invention
  • FIG. 5 shows a further variant of the invention.
  • FIG. 1 illustrates the principle of the invention with reference to a schematic equivalent circuit diagram. Shown in the figure are a plurality of LED's 1 designed and connected as an LED chain between the two contact rails 3 and 4 in series electrical loads, which are electrically connected via the two series resistors Ri and R 2 with a DC voltage source not shown separately. Parallel to the series resistor R 2 and connected to one another are the PTC series resistors 2, one of which is arranged in the example shown in each case in close proximity to each one LED. It is thereby achieved that a similar temperature is established in the region of the respective PTC series resistor 2 with a certain time delay as in the region of the respective LED.
  • FIG 2 shows an exemplary layout of the invention.
  • the LEDs 1 are arranged on a thin conductor foil 5 as a carrier layer in a plurality of parallel connected, contacted by means of the first contact rail 3 and the second contact rail 4 chains.
  • Comb-shaped conductor structures 6 extend in the manner described above, between which the desired structure of parallel-connected PTC series resistors can be realized by means of the PTC printing ink already mentioned. In this way, the cheaply available space on the conductor foil 5 can be used in a particularly advantageous manner for the realization of the desired layers of PTC printing ink.
  • an advantageous design concept for realizing the invention will be explained.
  • the arithmetical squares can in particular have an edge length of 1 mm.
  • the quadratic regions can each be regarded as individual PTC series resistors connected in parallel with each other. Hatched in the figure are thermally highly conductive layers 8, which may be formed of copper and are arranged on the back of the conductor foil 5.
  • the structure shown senses the ambient temperature near the respective LED 1.
  • the printing ink does not necessarily have to be applied in individual squares; In principle, it is also conceivable to fill the gaps in the structure 6 or other conductive structures with a contiguous area of printing ink.
  • FIG. 4 shows a variant of the invention in which, compared with the first variant, a local temperature increase in the region of a consumer has a stronger effect by reducing the current through the consumers.
  • a PTC series resistor 9 is connected in series in front of the consumers, which are still connected in series, which in turn are configured as LEDs 1.
  • the parallel resistors R 2 ' serve to maintain a certain current within the chain in the event that the value of the respective PTC series resistor 9 exceeds a certain value.
  • the resistors R 2 ' for example, can be realized comparatively easily by meandering conductor tracks and, in particular, have a value of approximately 1 ohm.
  • the series resistor Ri ensures analogous to the previous example that the maximum current through the LED chain remains limited. If the PTC resistor is printed, the desired lower resistance of the individual PTC series resistors leads to a multiplication of the number of required surface elements, for example in the form of squares, given a layer thickness of the PTC color.
  • this variant is attractive due to the possibly increased space requirement of the individual PTC series resistors especially for applications in which the individual consumers have a greater distance from each other.
  • the problem of increased space requirement can be addressed alternatively or additionally by either reducing the lateral dimensions of the individual surface elements or by increasing the layer thickness in which the PTC paint is applied.
  • FIG. 5 shows an exemplary detail enlargement of the case in which two different PTC printing inks, in particular with different critical temperature, are used, as indicated in the figure by means of the two PTC series resistors 9 'and 9 ".
  • the transition temperatures With a suitable choice, in particular the transition temperatures, the desired thermal behavior of the circuit can be set in a wide range. It goes without saying that more than two different PTC series resistors can be used.
  • the principle shown in Figure 5 also be applied to other circuit variants, in particular to the embodiments shown in Figures 1 -3 with the necessary changes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un système électrique, lequel comporte une pluralité de consommateurs électriques (1) répartis dans l'espace ainsi que plusieurs résistances série PTC (2, 9), lesquelles sont montées en série avec au moins une partie des consommateurs électriques (1). Au moins une partie des nombreuses résistances série PTC (2, 9) est agencée respectivement en contact thermique avec au moins une partie des consommateurs (1). L'invention concerne en outre un procédé de fabrication, en particulier d'impression d'un système de ce type.
PCT/EP2018/054943 2017-03-10 2018-02-28 Réseau de consommateurs à régulation automatique de la température et procédé Ceased WO2018162302A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18708961.0A EP3593595A1 (fr) 2017-03-10 2018-02-28 Réseau de consommateurs à régulation automatique de la température et procédé

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEDE202017101372.3 2017-03-10
DE202017101372.3U DE202017101372U1 (de) 2017-03-10 2017-03-10 Verbraucherarray mit Temperatur-Selbstregulierung
DE102017105115.5A DE102017105115A1 (de) 2017-03-10 2017-03-10 Verbraucherarray mit Temperatur-Selbstregulierung und Verfahren
DEDE102017105115.5 2017-03-10

Publications (1)

Publication Number Publication Date
WO2018162302A1 true WO2018162302A1 (fr) 2018-09-13

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EP (1) EP3593595A1 (fr)
WO (1) WO2018162302A1 (fr)

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20080143275A1 (en) * 2006-12-19 2008-06-19 Eveready Battery Company Positive temperature coefficient light emitting diode light
DE102011114253A1 (de) * 2011-09-26 2013-03-28 e:lumix OptoSemi Industries Verwaltungs GmbH Leuchtvorrichtung
US20130193851A1 (en) * 2012-01-26 2013-08-01 Vishay Dale Electronics, Inc. Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080143275A1 (en) * 2006-12-19 2008-06-19 Eveready Battery Company Positive temperature coefficient light emitting diode light
DE102011114253A1 (de) * 2011-09-26 2013-03-28 e:lumix OptoSemi Industries Verwaltungs GmbH Leuchtvorrichtung
US20130193851A1 (en) * 2012-01-26 2013-08-01 Vishay Dale Electronics, Inc. Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications

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