[go: up one dir, main page]

WO2018155115A1 - Procédé de mesure de déformation, dispositif de mesure de déformation et programme associé - Google Patents

Procédé de mesure de déformation, dispositif de mesure de déformation et programme associé Download PDF

Info

Publication number
WO2018155115A1
WO2018155115A1 PCT/JP2018/003297 JP2018003297W WO2018155115A1 WO 2018155115 A1 WO2018155115 A1 WO 2018155115A1 JP 2018003297 W JP2018003297 W JP 2018003297W WO 2018155115 A1 WO2018155115 A1 WO 2018155115A1
Authority
WO
WIPO (PCT)
Prior art keywords
sample
load
strain
applying
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/003297
Other languages
English (en)
Japanese (ja)
Inventor
慶華 王
志遠 李
浩 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Advanced Industrial Science and Technology AIST filed Critical National Institute of Advanced Industrial Science and Technology AIST
Priority to JP2019501174A priority Critical patent/JP6753592B2/ja
Publication of WO2018155115A1 publication Critical patent/WO2018155115A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general

Definitions

  • the present invention relates to a deformation measuring method, a deformation measuring apparatus, and a program thereof.
  • moire methods include scanning microscope moire method (MicroscopeMicroscanning moire method), moire interferometry, CCD or CMOS moire method (hereinafter simply referred to as “CCD moire method”), digital over It is classified into four methods of lap moire method (Digital / overlapped moiremethod).
  • the scanning microscope moire method includes an electronic scanning moire and a laser scanning moire. These moire methods use moire fringe centering technology.
  • phase shift method is introduced to obtain phase distribution of moire fringe (temporal) phase shift moire method (Temporal phase-shifting moire method) and (spatial) sampling moire method (Sampling moiremethod) There is.
  • the scanning microscope moire method has been reported to be applied to the measurement of residual stress and residual strain in composite materials, and the moire interferometry method has been applied to the measurement of residual stress and residual strain in electronic component packages and composite materials.
  • Patent Document 1 is a method for measuring a thermal expansion coefficient based on a strain of a sample caused by a temperature difference, and a secondary electron generation amount, a reflected electron amount, and a reflection when a particle beam or an energy beam is irradiated on a sample body.
  • moire fringes such as line moire fringes, CCD moire fringes, laser scanning moire fringes, etc.
  • Japanese Patent Laid-Open No. 2004-228688 generates moire fringes using a regular striped pattern, a cosine wave or rectangular wave pattern with a black-and-white ratio of 1: 1, analyzes the phase information of the moire fringes, and analyzes the moire fringes before and after deformation.
  • the conventional method of sampling moire method that can measure minute displacement distribution by calculating the phase difference distribution is not suitable for nano-micro materials and large structures, and has regularity with any repetition of 2 cycles or more.
  • it has a one-dimensional or two-dimensional repetition artificially created on the object surface or pre-existing on the object surface. It has been proposed to use phase information at a higher frequency or a plurality of frequency components of a moire fringe generated using an arbitrary regular pattern.
  • Non-Patent Document 1 relates to a method for measuring strain distribution and stress distribution of a structural material, by forming a fine model lattice on the surface of a sample to be measured by electron beam lithography, and mastering electron beam scanning by a scanning electron microscope. Used as a grid. Electron beam moire fringes are generated by scanning the model lattice with an electron beam, and the strain distribution and stress distribution are obtained by analyzing the moire fringes.
  • Non-Patent Document 2 relates to a method for mechanically releasing residual stress, and in particular, a recent optical residual stress detection method and a recent residual stress release method including a drilling method combined therewith. Introducing.
  • the scanning microscope moire method using the moire fringe centering technique only uses information on the center line of the moire fringes, and the measurement accuracy of deformation is low. Moreover, since it is necessary to manually correct the center line of the moire fringes during measurement, it is difficult to perform batch deformation automatic processing.
  • the (temporal) phase shift moire method can improve the measurement accuracy of deformation, but it requires a phase shift device, takes time to record multiple images, and is not suitable for dynamic analysis. is there.
  • the moire fringes become very dense and cannot be recorded when the deformation becomes large. For this reason, an area that cannot be analyzed is generated when the deformation becomes large. As an example, there is a corner of a mold in a flip chip mounting component. In such a region, the underfill is rapidly deformed and cannot be measured by the moire interferometry.
  • the present invention has been made in view of the above-mentioned and other problems, and one object thereof is an x-direction strain, y-direction strain, shear strain, and Deformation measurement method and deformation measurement, which can accurately measure various strain distributions including main strain and residual strain distribution from periodic patterns acquired in a single shot, even when the sample to be measured is greatly deformed.
  • an apparatus and a program thereof To provide an apparatus and a program thereof.
  • One aspect of the present invention for solving the above and other problems is a deformation measuring method for measuring deformation of a sample, and measuring deformation generated in the sample when a load is applied to the sample.
  • An image of a periodic pattern existing on the surface of a sample is recorded by the image recording means before and after applying a load to the sample for the first time after the sample is created, and each recorded period Moiré fringes are generated based on the image of the target pattern, the phase of the moire fringes before the load is first applied to the sample, and the phase of the moire fringes after the load is applied to the sample is calculated.
  • the phase difference of the moire fringes before and after applying a load to the sample is acquired, and the displacement distribution and strain distribution of the sample are calculated by applying a two-dimensional simultaneous analysis to the phase difference. Furthermore, when measuring the residual strain, also record the lattice image after releasing the residual stress, generate the moire fringe, obtain the phase difference between the moire fringe after releasing the residual stress and the moire fringe before applying the load first, The residual strain distribution of the sample is calculated by applying a two-dimensional simultaneous phase analysis to the phase difference.
  • another aspect of the present invention includes a deformation measuring device and a program for executing the above deformation measuring method.
  • various strain distributions and residual strain distributions including an x-direction strain, a y-direction strain, a shear strain, and a main strain generated by applying a load are measured by a two-dimensional phase simultaneous analysis moire method. Even when a large deformation occurs, it can be accurately measured from a periodic pattern acquired in a single shot.
  • FIG. 1 is a diagram showing the principle of measuring strain distribution and residual strain distribution using a periodic pattern (lattice).
  • FIG. 2 is a diagram showing the geometric relationship of the two-dimensional lattice before and after deformation.
  • FIG. 3 is a diagram showing the principle of the sampling moire method for calculating the phase from the inclined grating.
  • FIG. 4 is a diagram showing the principle of a two-dimensional phase simultaneous analysis moire method for measuring strain and residual strain.
  • FIG. 5 is a diagram illustrating a flowchart of the deformation measuring method according to the present invention.
  • FIG. 6 is a diagram illustrating a process for measuring two-dimensional displacement, strain, and residual strain from a tilted two-dimensional lattice.
  • FIG. 1 is a diagram showing the principle of measuring strain distribution and residual strain distribution using a periodic pattern (lattice).
  • FIG. 2 is a diagram showing the geometric relationship of the two-dimensional lattice before and after deformation.
  • FIG. 3 is a diagram showing the
  • FIG. 7 is a diagram illustrating a process for measuring one-dimensional displacement, strain, and residual strain from a one-dimensional lattice.
  • FIG. 8 is a diagram illustrating a configuration example of a deformation measuring apparatus according to an embodiment of the present invention.
  • FIG. 9 is a diagram illustrating a flowchart example of deformation measurement processing by the deformation measurement apparatus of FIG.
  • FIG. 10 is a diagram showing a process of measuring two-dimensional displacement and strain from a two-dimensional lattice having an intersection angle of 10 degrees.
  • FIG. 11 is a diagram showing the two-dimensional strain measurement result by the two-dimensional phase simultaneous analysis of the present invention and the conventional one-dimensional phase analysis in comparison with the theoretical value by the crossing angle of the lattice.
  • FIG. 12 is a diagram showing the relative error of the two-dimensional strain measured by the two-dimensional phase simultaneous analysis of the present invention and the conventional one-dimensional phase analysis in comparison with the theoretical value by the crossing angle of the lattice.
  • FIG. 13 is a view showing the measurement result of the two-dimensional residual strain by the method of the present invention in comparison with the theoretical value by the crossing angle of the lattice.
  • FIG. 14 is a diagram showing the relative error and standard deviation of the measured two-dimensional residual strain compared with the theoretical value by the crossing angle of the lattice.
  • FIG. 15 shows a case in which the lattice is converted by applying strain and residual strain when the crossing angle of the lattice is 10 degrees and random noise having a standard deviation ⁇ of 2% with respect to the amplitude of the lattice exists in the lattice. It is a figure which shows a mode.
  • FIG. 16 is a diagram showing the relationship between the absolute error, the relative error, and the standard deviation of the two-dimensional strain measured by the method of the present invention, and the theoretical strain.
  • FIG. 17 is a diagram showing the relationship between the absolute error, relative error, and standard deviation of the two-dimensional residual strain measured by the method of the present invention, and the theoretical residual strain.
  • FIG. 18 is a diagram showing an example of a mechanical load application device including a size of a titanium alloy sample and a tension jig used under a scanning laser microscope.
  • FIG. 19 is a diagram illustrating a measurement target region on the sample surface and a lattice formed with a pitch of 3 ⁇ m.
  • FIG. 20 is a diagram illustrating a lattice on a sample at a load of 0, 225, 604, and 660 MPa, and moire fringes in the x and y directions.
  • FIG. 21 is a diagram showing the phases of moire fringes in the x and y directions on the sample at loads of 0, 225, 604, and 660 MPa.
  • FIG. 22 is a diagram showing the strain in the x direction, the strain in the y direction, and the shear strain distribution of the sample at loads 225, 604, and 660 MPa.
  • FIG. 23 is a diagram showing the maximum and minimum principal strain distributions of the sample at loads 225, 604, and 660 MPa.
  • FIG. 24 is a diagram showing a partial distribution of a lattice image and shear strain of a sample under loads 660, 682, 669, and 683 MPa.
  • a two-dimensional phase simultaneous analysis moire method capable of accurately measuring in-plane deformation and in-plane residual deformation by combining sampling moire (spatial phase shift) method, two-dimensional phase analysis, and inverse problem analysis thereof. Propose.
  • This moire method is related to fields such as packaging of electronic components, optical measurement, and experimental mechanics.
  • the 2D phase analysis moiré method is useful for measuring the distribution of various materials, structural deformations, strains, residual strains, and residual stresses in various industrial fields. Its industrial fields range from aerospace, automobiles, electronic component packaging, biopharmaceuticals, and material manufacturing. Examples of applications include metals, polymers, ceramics, semiconductors, composite materials, porous material hybrid structures, and thin films.
  • the moire method can be widely applied from nanoscale to metric scale. Various forms such as mechanical, electrical, magnetic, thermal, fatigue, thermomechanical, thermoelectric, electromagnetic, and thermomagnetic loads can be assumed as loads applied to materials and structures. .
  • Typical applications in the industrial field are as follows. ⁇ Visualization of stress concentration, dislocation generation, slip formation ⁇ Prediction of crack generation position, crack growth path, and delamination position ⁇ Evaluation of internal stress or residual stress for analysis of buckling, instability, and defect generation mechanism Evaluation of deformation level to give guidance on material strengthening, evaluation of deformation distribution characteristics for optimal design of boundary surface, monitoring of strain and residual strain state for production quality control, infrastructure, micro electro mechanical system Structural health monitoring
  • a two-dimensional periodic pattern (hereinafter, the periodic pattern is abbreviated as “grating”) can be considered as a combination of two one-dimensional gratings, an X grating and a Y grating.
  • the pitch of the lattice X in the x direction (horizontal right direction) and the y direction (vertically upward direction) is set to p Xx , p Xy , the x direction of the lattice Y (horizontal right direction), y
  • the pitch in the direction (vertical upward direction) is p Yx and p Yy .
  • a X and A Y are the modulated amplitudes of the grating X and the grating Y, respectively, and B includes the luminance information of the background and higher order components.
  • the two-dimensional lattice can be separated into a lattice X and a lattice Y.
  • the luminances of the grid X and the grid Y can be expressed by equations (2) and (3), respectively.
  • B X is the luminance information of the background and higher order components of the grid X
  • B Y is the luminance information of the background and higher order components of the grid Y
  • ⁇ X and ⁇ Y are the grid X and the grid Y, respectively. Represents the phase.
  • FIG. 2 schematically shows how the lattices X and Y change at this time.
  • a ′ X and A ′ Y are the modulated amplitudes of the gratings X ′ and Y ′, respectively, and B ′, B ′ X and B ′ Y are the two-dimensional grating, the grating X ′, and the grating after applying the load, respectively.
  • the luminance information of the background and higher order components of Y ′ is shown.
  • ⁇ ′ X and ⁇ ′ Y indicate the phases of the grating X ′ and the grating Y ′, respectively.
  • the spatial phase shift moire fringes in the x direction can be generated by downsampling and luminance interpolation image processing with the thinning-out number as Tx.
  • the generation process is schematically shown in FIG.
  • the luminance of the Tx step phase shift moire fringes before and after the load application can be expressed by the equations (9) and (10), respectively.
  • ⁇ X, mx and ⁇ ′ X, mx are the phase values of the moire fringes in the x direction before and after the load application, respectively.
  • spatial phase shift moire fringes in the y direction can be generated by downsampling and luminance interpolation image processing with the thinning number as Ty.
  • the luminances of the phase shift moire fringes at the Ty step before and after the load application can be expressed by equations (11) and (12), respectively.
  • ⁇ Y, my, ⁇ 'Y , my is the phase value of the moire fringes for each of the front and rear load application y direction.
  • the phases ⁇ X, mx , ⁇ ′ X, mx , ⁇ Y, my and ⁇ ′ Y, my of the moiré fringes in the equations (9) to (12) are obtained from the phase shift method using the discrete Fourier transform algorithm ( 13).
  • FIG. 4 schematically shows the measurement principle regarding thermal deformation and thermal strain.
  • the phase difference of the moire fringes in the x direction is equal to the phase difference of the grating X, and can be determined from Expression (14).
  • the phase difference of the moire fringes in the y direction is equal to the phase difference of the grating Y and can be determined from the equation (15).
  • the phase difference between the moire fringes in the x direction and the y direction is equal to the phase difference between the grating X and the grating Y, respectively. Therefore, based on the equations (18) and (19), the relationship between the phase difference of the moire fringes and the deformation of the sample can be obtained as in the equation (20).
  • M represents a matrix having four pitch components of the lattice X and the lattice Y in the x direction and the y direction.
  • strains in different directions are partial differentials of displacement
  • the x-direction strain, the y-direction strain, and the shear strain can be expressed by the following formula (22).
  • the pitch and angle of the lattice X are p X and ⁇ X
  • the pitch and angle of the lattice Y are p Y and ⁇ Y , respectively.
  • the angles ⁇ X and ⁇ Y are counterclockwise from the x direction. Is defined as positive.
  • the matrix M in equations (21) and (22) can also be expressed as equation (23).
  • the displacement and strain at any load with respect to the load applied can be obtained. If the internal stress and strain of the sample are zero when the material is manufactured, in other words, before applying the load to the material for the first time, the internal strain generated under the other conditions is the residual strain (that is, external force). It is called a strain that exists in the material even after the external load is removed.
  • the strain or thermal strain in the x direction in the residual strain state (Ff) after releasing the residual stress due to application, drilling, slot processing, etc. is expressed as in equation (27) from the relationship between the lattice pitches. be able to.
  • Equation (27) the residual normal strain when a load is applied to the no-residual strain state during material production can also be expressed by a change in pitch. Therefore, the residual strain in the x direction due to the application of the load can be obtained from Equation (28) from the strain in the x direction when the load F is applied and in the no residual strain state Ff.
  • the residual strain in the y direction when the load F is applied can be obtained from the vertical strain in the y direction when the load F is applied and in the non-residual strain state Ff using Equation (29).
  • the shear strain in the residual strain state Ff can be expressed by equations (30) and (31), respectively.
  • the residual shear strain when the load F is applied to the non-residual strain state Ff can also be obtained from the angle change. Therefore, the residual shear strain after the load F is applied can be obtained from the shear strain in the no residual strain state Ff when the load F is applied using the equation (32).
  • the x-direction residual strain, the y-direction residual strain, and the residual shear strain when an arbitrary load is applied can be obtained using equations (28), (29), and (32).
  • the strain in the residual strain state Ff that is, ⁇ xx (F) , ⁇ yy (F) , ⁇ xy (F) , ⁇ xx (Ff) , ⁇ yy (Ff) , and ⁇ xy ( Ff) can be calculated from Equation (22) or Equation (26).
  • the residual principal stress can be calculated as follows according to Hooke's law.
  • E and ⁇ are Young's modulus and Poisson's ratio of the sample to be measured, respectively.
  • FIG. 5 shows an example of a flowchart of the two-dimensional phase simultaneous analysis moire method related to the measurement of strain or residual strain.
  • the two-dimensional phase simultaneous analysis moire method is executed, if a periodic pattern does not exist on the surface of the sample after the start of processing (S501), a lattice is first created on the sample (S502). Next, the created lattice image is recorded by image recording means such as a microscope or an image sensor (S503). This image recording is performed under a load different from that before the load is applied. When measuring the residual strain, the lattice image after releasing the residual stress is also recorded.
  • the recorded lattice image is down-sampled at a pitch that approximates the pitch of the sample lattice.
  • the pitch may be an integral multiple or a fraction of an integer of the sample lattice.
  • luminance interpolation is performed on the recorded lattice image to generate moiré fringes (x direction, y direction) of the sample (S504).
  • the phase of the moire fringes before deformation is calculated by spatial phase shift using a Fourier transform algorithm (S505).
  • Moire fringe phase after sample is deformed by external load (mechanical, electrical, magnetic, thermal, thermomechanical, thermoelectric, thermomagnetic, mechanical electrical load, etc.) by the same procedure Can also be obtained.
  • the displacement distribution and strain distribution can be measured by two-dimensional phase simultaneous analysis (S507).
  • the residual strain distribution after the release of the residual stress can be obtained from the inverse problem analysis (S508).
  • the two-dimensional simultaneous phase analysis moire method is completed by the above series of processes (S509).
  • FIG. 6 illustrates in detail a procedure for obtaining a two-dimensional displacement, strain, and residual strain from a two-dimensional lattice.
  • FIG. 6 schematically shows the processing procedure described with reference to FIG. 5.
  • A Creation of a two-dimensional lattice
  • B Separation of x and y components of the lattice
  • c Generation of moire fringes
  • (f) calculation of displacement, strain and residual strain due to deformation of the sample is schematically shown.
  • FIG. 7 is a schematic diagram corresponding to FIG. 6 for a one-dimensional lattice.
  • FIG. 8 shows a configuration example of the deformation measuring apparatus 1.
  • the deformation measuring apparatus 1 includes a lattice image recording apparatus 10 and a computer 20, and has a function of measuring the degree of deformation of a sample that is deformed by being loaded by a load applying apparatus 30.
  • the lattice image recording apparatus 10 includes a microscope, an image sensor, and the like, and has a function of temporarily recording an optically acquired lattice image as digital data in a memory and supplying the digital image to the computer 20.
  • the computer 20 is an information processing apparatus that includes an appropriate processor 21 such as an MPU or CPU, and a storage device 22 such as a ROM, RAM, or NVRAM, and includes an input device 23 such as a keyboard and an output device 24. ing.
  • the output device 24 is an appropriate type of monitor / display, but may be another output device such as a printer.
  • the computer 20 is provided with a communication module that can be connected to an external communication network, and can be configured to be able to communicate with other information processing apparatuses.
  • the storage device 22 of the computer 20 stores functional units such as a moire fringe generation unit 221, a phase processing unit 222, and a deformation calculation unit 223.
  • the moiré fringe generation unit 221, the phase processing unit 222, and the deformation calculation unit 223 can be configured as computer programs, respectively, and can be configured to be appropriately read from the storage device 22 by the processor 21 and executed.
  • the trigger for executing the program can be given by an instruction from the input device 23.
  • the load application device 30 deforms various samples on which a lattice is created as a measurement target by applying a load such as a mechanical load, an electrical load, or a thermal load.
  • a load such as a mechanical load, an electrical load, or a thermal load.
  • an appropriate configuration can be adopted according to the type of load such as a mechanical load and a magnetic load.
  • the lattice image recording apparatus 10 records the degree of deformation of the sample as an image of a lattice formed on the sample and supplies the image to the computer 20.
  • the image data is taken into the computer 20 through an appropriate storage device such as a USB memory or an appropriate communication interface.
  • FIG. 9 shows a processing flow example of the sample displacement, strain, and residual strain measurement processing.
  • lattice image data is fetched from the lattice image recording device 10, and analysis parameters for analysis processing are input from the input device 23 (S902).
  • the analysis parameters are parameters necessary for the above-described simultaneous two-dimensional phase analysis processing of the present invention, such as the grating pitch p and the angle ⁇ shown in FIG.
  • the Young's modulus and Poisson's ratio of the measurement object are required as physical property values.
  • the moire fringe generation unit 221 searches for lattice images of the same size from the same region of the sample surface to be measured (S903).
  • the moire fringe generation unit 221 generates a phase shift moire fringe after filtering the lattice image (S904).
  • the filtering process is a process of separating the lattice into the x direction and the y direction, and is omitted in the case of a one-dimensional moire fringe, for example.
  • the phase processing unit 222 calculates the wrap phase of the generated moire fringes, and obtains the phase difference from the non-wrap or wrap phase before and after the deformation of the sample (S905, S906).
  • the deformation calculation unit 223 calculates a displacement distribution and a strain distribution by two-dimensional phase analysis using the acquired phase difference (S907). In S908, it is determined whether it is necessary to continue calculating the residual strain. If it is determined that it is not necessary (S908, No), the deformation calculation unit 223 outputs the calculated displacement distribution and strain distribution to the output device 24 for processing. Is terminated (S910, S911). If it is determined in S908 that the residual strain needs to be calculated (S908, Yes), the deformation calculation unit 223 calculates the residual strain distribution (S909), and outputs the displacement distribution and strain distribution to the output device 24 for processing. End (S910, S911).
  • Example 1 Comparison of the proposed method for the x-direction strain, y-direction strain, and shear strain with the conventional method
  • the proposed method and the conventional method are compared with each other in order to compare the proposed method with the conventional method.
  • the accuracy of the two-dimensional deformation measurement was verified.
  • a 10-pixel pitch grid was rotated at different angles in both the x and y directions to obtain a series of tilted grids.
  • the size of the grid image was 480 ⁇ 400 pixels. These tilted lattices were deformed by applying theoretical x-direction strain, y-direction strain, and shear strain. The deformation was measured by the method proposed in the present application.
  • FIG. 10 shows an example of deformation measurement when the inclination of the grating is 10 °.
  • the lattice image is first converted into two one-dimensional lattices shown in FIG. 10B by two low-pass filters in the x and y directions.
  • a spatial phase shift sampling moire fringe is generated, and two phase maps are calculated for the moire fringes before deformation in the x and y directions shown in FIG. 10D.
  • a phase map in two directions after deformation can be obtained for the moire fringes after deformation.
  • FIG. 10 shows an example of deformation measurement when the inclination of the grating is 10 °.
  • the phase difference of moire fringes resulting from deformation is obtained in the x direction and the y direction.
  • the two-dimensional displacement and strain distribution are measured as shown in FIG.
  • the average values of the x direction, the y direction, and the shear strain were 0.01138, ⁇ 0.00354, and 0.00543, respectively. These values were almost equal to the theoretical values of 0.01152, -0.00352, and 0.00547, respectively.
  • the average values of the x-direction, y-direction, and shear strain are 0.01186, -0.00402, and 0.00280, respectively. The result that the deviation from the value was remarkable was obtained.
  • the crossing angle of the two-dimensional lattice is set to 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 13, 16, 19, 22,
  • the average values of the measured strain values by the two-dimensional phase analysis according to the present invention and the conventional one-dimensional phase analysis moire method were respectively compared with the theoretical strain values.
  • FIG. 11B shows the comparison results of the x-direction strain and the y-direction strain
  • FIG. 11C shows the comparison results of the residual strain when the crossing angle of the two-dimensional lattice is different.
  • the measurement result according to the present invention shows a much better approximation to the theoretical value than the measurement result of the conventional method.
  • FIG. 12 shows the relative error of the measured strain value with respect to the theoretical value.
  • Example 2 Simulation Verification for Two-Dimensional Residual Strain Measurement of the Present Invention
  • the lattice used is the same as in Example 1.
  • the theoretical value of the residual strain was obtained from the residual strain circle of Mohr.
  • FIG. 14 (a) plots the relative error of the assumed residual strain value with respect to the theoretical value.
  • FIG. 14B shows the standard deviation of the residual strain measurement value with respect to the lattice intersection angle. The relative error was within 1.2% and the standard deviation was less than 0.0015. Thus, it can be seen that the two-dimensional residual strain measurement according to the present invention can achieve high accuracy.
  • Example 3 Simulation Verification Using a Grating with Random Noise Regarding Measurement of Two-Dimensional Strain and Residual Strain of the Present Invention
  • the inclined grating can be separated into a grating X and a grating Y that are orthogonal to each other.
  • the inclination angle of the lattice Y from the x direction and the inclination angle of the lattice X from the y direction are 10 °.
  • the grid pitches of the grid X in the x direction and y direction were 10.1543 pixels and 57.5877 pixels, respectively, and the grid pitches of the grid Y in the x direction and y direction were 57.5877 pixels and 10.1543 pixels, respectively.
  • the size of the grid image was 480 ⁇ 400 pixels, and random noise with a standard deviation ⁇ of 2% with respect to the grid amplitude was added to the tilted grid.
  • the grid of the load F 1 was deformed into a grid of the load F 2 by applying an x-direction strain, a y-direction strain, and a shear strain.
  • the grid when the load F 2 is applied is, x-direction, residual strain in the y-direction, and by applying the residual shear strain, it was possible to convert the grid upon application of a load F 1.
  • Table 1 shows values of applied theoretical strain and theoretical residual strain.
  • FIG. 16 shows the absolute error, relative error, and standard deviation of the measured strain value with respect to the theoretical strain value.
  • the absolute error was in the range of -0.00014 to 0
  • the relative error was in the range of -1.2% to 0.6%
  • the standard deviation was less than 0.0015. This indicates that the method of the present invention can perform strain measurement with high accuracy even when there is random noise in the tilted grating.
  • FIG. 17 shows the absolute error, relative error, and standard deviation of the residual strain measurement value with respect to the theoretical strain value.
  • the absolute error was in the range of 0 to 0.00013
  • the relative error was in the range of -1.1% to 0.5%
  • the standard deviation was less than 0.0015.
  • Example 4 Two-dimensional strain measurement of titanium alloy by the method of the present invention for the purpose of visualizing the concentration of minute strains in a tensile test
  • FIG. 18 shows the shape and dimension of the sample to be measured in this example and the mechanical load application device used for the measurement.
  • the sample thickness and minimum width were 1 mm and 1.8 mm, respectively.
  • An orthogonal lattice with a lattice spacing of 3 ⁇ m was formed in the range of 1.8 ⁇ 15 mm 2 on the surface of this sample by UV nanoimprint lithography.
  • the angle formed by one lattice line and the axial direction (x direction) of the sample is 2 °.
  • FIG. 20 shows a typical lattice image and 4-pixel down-sampling moire fringes in the x and y directions when the nominal stress is changed to 0, 225, 604, and 660 MPa.
  • FIG. 21 shows the calculated phases of these moire fringes in the x and y directions. From the phase difference with respect to the phase at 0 MPa, distributions of strain in the x direction, y direction, and shear strain at 225, 604, and 660 MPa were measured. The measurement results are shown in FIG. Further, the maximum and minimum principal strains in the nominal stress are determined and shown in FIG.
  • the distribution of x-direction strain, y-direction strain, shear strain, and main strain can be accurately measured collectively.
  • the moire method of the present embodiment is suitable for dynamic deformation measurement, and can display the measurement result in real time.
  • the deformation measuring method, deformation measuring apparatus, and program thereof according to the present invention can be applied to fields such as aerospace, automobiles, electronic component packaging, medicine, and material manufacturing.
  • the method of the present invention is useful for defect analysis, residual stress measurement, nanometer to meter level material strength improvement, optimal interface design, production quality control, structural health monitoring, and the like.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

L'invention concerne un procédé de mesure de déformation pour mesurer une déformation générée dans un échantillon lorsqu'une charge est appliquée à l'échantillon, consistant à : enregistrer des images d'un motif cyclique sur une surface de l'échantillon à l'aide d'un moyen d'enregistrement d'image avant et après l'application de charge pour la première fois sur l'échantillon après préparation de l'échantillon ; générer des franges de moiré sur la base des images enregistrées du motif cyclique ; calculer la phase des franges de moiré avant l'application de charge pour la première fois à l'échantillon ; calculer la phase des franges de moiré après l'application de charge pour la première fois à l'échantillon ; obtenir la différence de phase entre les franges de moiré avant et après l'application de charge sur l'échantillon ; et calculer une distribution de déformation et d'une distribution de contrainte de l'échantillon par l'application d'une analyse simultanée de phase bidimensionnelle à la différence de phase. Dans un cas où la contrainte résiduelle est mesurée, même une image de réseau après la libération de la contrainte résiduelle est enregistrée, des franges de moiré sont générées, la différence de phase entre les franges de moiré après libération de la contrainte résiduelle et des franges de moiré avant l'application de charge pour la première fois est obtenue et une distribution de contrainte résiduelle de l'échantillon est calculée par l'application d'une analyse simultanée de phase bidimensionnelle à la différence de phase.
PCT/JP2018/003297 2017-02-23 2018-01-31 Procédé de mesure de déformation, dispositif de mesure de déformation et programme associé Ceased WO2018155115A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019501174A JP6753592B2 (ja) 2017-02-23 2018-01-31 変形測定方法、変形測定装置、及びそのプログラム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017032645 2017-02-23
JP2017-032645 2017-02-23

Publications (1)

Publication Number Publication Date
WO2018155115A1 true WO2018155115A1 (fr) 2018-08-30

Family

ID=63252738

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/003297 Ceased WO2018155115A1 (fr) 2017-02-23 2018-01-31 Procédé de mesure de déformation, dispositif de mesure de déformation et programme associé

Country Status (2)

Country Link
JP (1) JP6753592B2 (fr)
WO (1) WO2018155115A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018136273A (ja) * 2017-02-23 2018-08-30 国立研究開発法人産業技術総合研究所 残留熱ひずみ測定方法、残留熱ひずみ測定装置、及びそのプログラム
CN110887594A (zh) * 2019-12-06 2020-03-17 哈尔滨工业大学 一种陶瓷/金属异质钎焊接头残余应力的表征方法
WO2022059080A1 (fr) * 2020-09-16 2022-03-24 三菱電機株式会社 Dispositif d'estimation de rupture et procédé d'estimation de rupture
CN115266262A (zh) * 2022-07-06 2022-11-01 苏州热工研究院有限公司 一种重组紧凑拉伸试样的制备方法
US20230349779A1 (en) * 2021-11-11 2023-11-02 China University Of Mining And Technology, Beijing System and method for testing stress strain of porous rock under fluid-solid coupling effects
CN118654801A (zh) * 2024-08-19 2024-09-17 中国科学院武汉岩土力学研究所 基于分布式光纤监测立方体岩样三维应力场的装置及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111721458B (zh) * 2020-06-24 2021-12-28 北京航空航天大学 一种基于图像识别的残余应力检测方法与装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731391B1 (en) * 1998-05-13 2004-05-04 The Research Foundation Of State University Of New York Shadow moire surface measurement using Talbot effect
JP2005010003A (ja) * 2003-06-18 2005-01-13 National Institute For Materials Science 複合材料における残留ひずみおよび残留応力の測定方法
JP2009264852A (ja) * 2008-04-23 2009-11-12 Wakayama Univ 格子画像の位相解析方法およびそれを用いた物体の変位測定方法ならびに物体の形状測定方法
WO2015008404A1 (fr) * 2013-07-18 2015-01-22 独立行政法人産業技術総合研究所 Procédé et dispositif de mesure de distribution de décalage au moyen d'un motif régulier et programme associé auxdits procédé et dispositif
JP2015152535A (ja) * 2014-02-18 2015-08-24 藤垣　元治 重み付けを用いた格子画像の位相解析方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731391B1 (en) * 1998-05-13 2004-05-04 The Research Foundation Of State University Of New York Shadow moire surface measurement using Talbot effect
JP2005010003A (ja) * 2003-06-18 2005-01-13 National Institute For Materials Science 複合材料における残留ひずみおよび残留応力の測定方法
JP2009264852A (ja) * 2008-04-23 2009-11-12 Wakayama Univ 格子画像の位相解析方法およびそれを用いた物体の変位測定方法ならびに物体の形状測定方法
WO2015008404A1 (fr) * 2013-07-18 2015-01-22 独立行政法人産業技術総合研究所 Procédé et dispositif de mesure de distribution de décalage au moyen d'un motif régulier et programme associé auxdits procédé et dispositif
JP2015152535A (ja) * 2014-02-18 2015-08-24 藤垣　元治 重み付けを用いた格子画像の位相解析方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018136273A (ja) * 2017-02-23 2018-08-30 国立研究開発法人産業技術総合研究所 残留熱ひずみ測定方法、残留熱ひずみ測定装置、及びそのプログラム
CN110887594A (zh) * 2019-12-06 2020-03-17 哈尔滨工业大学 一种陶瓷/金属异质钎焊接头残余应力的表征方法
CN110887594B (zh) * 2019-12-06 2021-04-02 哈尔滨工业大学 一种陶瓷/金属异质钎焊接头残余应力的表征方法
WO2022059080A1 (fr) * 2020-09-16 2022-03-24 三菱電機株式会社 Dispositif d'estimation de rupture et procédé d'estimation de rupture
JPWO2022059080A1 (fr) * 2020-09-16 2022-03-24
CN116134303A (zh) * 2020-09-16 2023-05-16 三菱电机株式会社 龟裂推测装置以及龟裂推测方法
JP7351020B2 (ja) 2020-09-16 2023-09-26 三菱電機株式会社 亀裂推定装置および亀裂推定方法
US20230349779A1 (en) * 2021-11-11 2023-11-02 China University Of Mining And Technology, Beijing System and method for testing stress strain of porous rock under fluid-solid coupling effects
US12169147B2 (en) * 2021-11-11 2024-12-17 China University Of Mining And Technology, Beijing System and method for testing stress strain of porous rock under fluid-solid coupling effects
CN115266262A (zh) * 2022-07-06 2022-11-01 苏州热工研究院有限公司 一种重组紧凑拉伸试样的制备方法
CN118654801A (zh) * 2024-08-19 2024-09-17 中国科学院武汉岩土力学研究所 基于分布式光纤监测立方体岩样三维应力场的装置及方法

Also Published As

Publication number Publication date
JP6753592B2 (ja) 2020-09-09
JPWO2018155115A1 (ja) 2019-11-07

Similar Documents

Publication Publication Date Title
JP6753592B2 (ja) 変形測定方法、変形測定装置、及びそのプログラム
JP6718160B2 (ja) 残留熱ひずみ測定方法、残留熱ひずみ測定装置、及びそのプログラム
JP6583761B2 (ja) 周期模様を利用した三次元形状・変位・ひずみ測定装置、方法およびそのプログラム
Zhao et al. The state of the art of two‐dimensional digital image correlation computational method
JP5818218B2 (ja) 高次元輝度情報を用いた縞画像の位相分布解析方法、装置およびそのプログラム
Sutton et al. Recent advances and perspectives in digital image correlation
Hild et al. CorreliQ4: A software for finite element displacement field measurements by digital image correlation
JP6983402B2 (ja) 汚れの影響を受けにくいひずみ分布測定方法とそのプログラム
Lee et al. Full-field optical measurement of curvatures in ultra-thin-film–substrate systems in the range of geometrically nonlinear deformations
JP2017146202A (ja) モアレ法による高速変位・ひずみ分布測定方法及び測定装置
Chen et al. Orthogonal sampling moiré method and its application in microscale deformation field measurement
Li et al. Fabrication of heat-resistant grids and their application to deformation measurements using a sampling moiré method
Pang Digital image correlation
Wang et al. Micro/nano-scale strain distribution measurement from sampling Moiré fringes
Ri Accurate and fast out-of-plane displacement measurement of flat objects using single-camera based on the sampling moiré method
Farahani et al. Electronic Speckle Pattern Interferometry for fatigue crack monitoring
Wang et al. Wide-view and accurate deformation measurement at microscales by phase extraction of scanning moiré pattern with a spatial phase-shifting technique
Ma et al. Two modified coherent gradient sensing methods for slope measurement of reflective surfaces
WO2016001986A1 (fr) Procédé de mesure, dispositif de mesure, programme de mesure et support d'enregistrement lisible par ordinateur enregistrant un programme de mesure
JP2016142726A (ja) 二次モアレ縞による顕微鏡走査ゆがみの影響を受けない変形測定方法
CN112487688A (zh) 用于应力场偏振参数动态成像的结构与光场联合仿真方法
Li et al. Center Atom Model for Strain Mapping of Void and Crack of Atomic Lattice Image
Ma et al. Elastic modulus measurement of quartz glass using digital speckle pattern interferometry based on tensile test
Aebischer et al. Measurement of the nanometric deformation field in metallic microbars with microscopical ESPI
Ri et al. Two-dimensional sampling Moiré method for fast and accurate phase analysis of single fringe pattern

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18757346

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019501174

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18757346

Country of ref document: EP

Kind code of ref document: A1