WO2018034096A1 - Electric connection device and probe support - Google Patents

Abstract

An electric connection device 1 is provided with: a probe substrate 16; a probe 20 including a linear body part 21 having a leading end 20a that comes into contact with an object to be inspected and having a base end 20b that is in contact with the probe substrate; and a plate-like guide part 30 that is disposed on the object side of the probe substrate 16 and that has a guide hole 30a through which the probe is inserted between the leading end 20a and the base end 20b. A locking part 40 for locking, to the guide part 30, the body part 21 inserted in the guide hole 30a, is provided. The locking part 40 is made of an elastic member having a wide section wider than the diameter of the guide hole 30a.

Description

Electrical connection device and probe support

The present invention relates to an electrical connection device and a probe support used for electrical inspection of an object to be examined.

A large number of integrated circuits built in a semiconductor wafer are generally subjected to an electrical test to determine whether or not they have performance according to specifications before being cut and separated from the wafer. There exists a probe card provided with a some probe as an electrical connection apparatus used for this kind of test | inspection (for example, refer patent document 1).

In the probe card, each probe is inserted into each guide hole formed in the plate-shaped guide portion. As a result, each probe is guided from the probe substrate located above the thickness direction of the plate-shaped guide portion toward the object to be examined located below the thickness direction.

Further, in the probe card, the plate-like guide portion is pressed against the probe substrate side by a predetermined pressure contact member. The base end portion of the probe extending upward from the plate-like guide portion maintains a pressure contact state in which the probe is pressed against the connection pad of the probe substrate with a predetermined load (so-called preload). Thereby, the probe and the probe substrate are electrically connected.

Here, the probe includes a main body portion made of a linear metal member, and a locking portion in which a part of the main body portion is formed wider than the diameter of the guide hole is disposed on the main body portion. (For example, refer to Patent Document 2).

The locking portion functions as a stopper for locking the probe to the plate-shaped guide portion, and presses the proximal end portion of the probe against the probe substrate in a state where the probe is locked to the guide portion by the locking portion. As a result, the above-described pressure contact state is maintained.

Japanese Utility Model Publication No. 7-29838 Japanese Patent Laid-Open No. 2003-185677

By the way, as a method for forming the above-described locking portion, a method of melting and thickening a metal member constituting the main body portion of the probe, or a method of crushing and thickening the main body portion of the probe is employed.

However, since the locking portions provided in the probe are ultrafine, it is difficult to form the respective locking portions provided in the plurality of probes in the same size, and in the thickness direction of the plate-shaped guide portion, Variations occur in the length of the locking portion. In addition, due to this variation, in the plurality of probes, the extension length from the guide portion to the proximal end portion of the probe also varies.

When multiple probes with different extension lengths are used and the base end of each probe is pressed against the connection pad of the probe board, the load is concentrated on the probe with a long extension length. Is strongly pressed against the probe substrate. In addition, since the material of the locking part is a hard material made of the same metal member as that of the probe body, the connection pad of the probe board may be distorted or cracked when pressed strongly, resulting in a connection failure between the probe and the probe board. May be incurred.

On the other hand, in a probe with a short extension length, the distance between the guide portion and the probe substrate is limited by another probe with a long extension length. Therefore, there is a risk of causing an electrical connection failure.

The present invention has been made in view of such problems, and it is an object of the present invention to provide an electrical connection device and a probe support capable of preventing a connection failure between a probe and a probe substrate.

In order to achieve the above object, a first feature of the electrical connecting device according to the present invention is that a probe substrate and a linear main body having a distal end portion in contact with an object to be inspected and a proximal end portion in contact with the probe substrate. A probe having a portion, a plate-like guide portion disposed on the inspected object side of the probe substrate, having a guide hole for inserting the probe between the distal end portion and the base end portion, and the guide hole A locking portion that locks the inserted main body portion with the guide portion, and the locking portion is formed of an elastic member having a wide portion wider than the diameter of the guide hole.

A second feature of the electrical connection device according to the present invention is related to the above feature, wherein the locking portion has a width of an end portion on the guide hole side smaller than a diameter of the guide hole, The width of the end is a shape larger than the diameter of the guide hole.

A first feature of the probe support according to the present invention is that a probe having a linear main body portion with a distal end portion in contact with an object to be inspected and a proximal end portion in contact with a probe substrate, and the inspection of the probe substrate. A plate-shaped guide portion that is disposed on the body side and has a guide hole for inserting the probe between the distal end portion and the proximal end portion, and the main body portion that is inserted through the guide hole is locked to the guide portion. And the locking portion is made of an elastic member having a wide portion wider than the diameter of the guide hole.

According to the electrical connection device according to the present invention, it is possible to provide an electrical connection device and a probe support that can prevent a connection failure between the probe and the probe substrate.

It is a schematic side view which shows the electrical connection apparatus which is Embodiment 1 of this invention. It is a partially expanded sectional view which shows schematically a part of electrical connection apparatus which is Embodiment 1 of this invention. It is a partially expanded sectional view which shows roughly a part of probe which is Embodiment 1 of this invention. It is a partially expanded perspective view which shows roughly a part of probe which is Embodiment 1 of this invention. (A) It is explanatory drawing which shows roughly the preparation process of the manufacturing method of the probe which is Embodiment 1 of this invention, and a latching | locking part. (B) It is explanatory drawing which shows roughly the insertion process of the manufacturing method of the probe which is Embodiment 1 of this invention, and a latching | locking part. (C) It is explanatory drawing which shows roughly the filling process of the manufacturing method of the probe which is Embodiment 1 of this invention, and a latching | locking part. (D) It is explanatory drawing which shows schematically the formation process of the manufacturing method of the probe which is Embodiment 1 of this invention, and a latching | locking part. It is a partially expanded sectional view which shows roughly a part of electrical connection apparatus which is a prior art. (A) It is a partially expanded sectional view which shows roughly a part of electrical connection apparatus which is Embodiment 1 of this invention. (B) It is a partially expanded sectional view which shows roughly a part of electrical connection apparatus which is Embodiment 1 of this invention. It is a partial expanded sectional view which shows roughly the probe which is a modification of Embodiment 1 of this invention, and a part of latching | locking part.

Hereinafter, an electrical connection device according to an embodiment of the present invention will be described in detail with reference to the drawings. Further, the embodiment described below exemplifies an apparatus or the like for embodying the technical idea of the present invention, and the technical idea of the present invention is to arrange the components and the like as follows. Not specific. The technical idea of the present invention can be variously modified within the scope of the claims.

(Embodiment 1)
FIG. 1 is a side view showing a schematic configuration of an electrical connection apparatus 1 according to Embodiment 1 of the present invention.

As shown in FIG. 1, the electrical connection device 1 according to Embodiment 1 of the present invention is called a vertical operation type probe card, and is held on a frame (not shown) above a vertically movable chuck 12. A semiconductor wafer 14 is held on the chuck 12 as an example of an object to be inspected. A large number of integrated circuits are incorporated in the semiconductor wafer 14.

The semiconductor wafer 14 is disposed on the chuck 12 with a large number of electrode pads 14a facing upward for electrical inspection of the integrated circuit.

The electrical connection device 1 includes a probe substrate 16 and a probe support 18.

The probe board 16 is made of, for example, a circular rigid wiring board. The lower end portion of the probe substrate 16 is connected to the proximal end portion 20 b (upper end portion) of the probe 20.

A large number of tester lands 16b serving as connection ends to a tester (not shown) are provided on the periphery of one surface (the upper surface shown in FIG. 1) of the probe substrate 16. Each tester land 16 b is connected to a wiring 16 a provided on the probe substrate 16.

Further, for example, a metal reinforcing plate 26 for reinforcing the probe substrate 16 is provided on one surface (the upper surface shown in FIG. 1) of the probe substrate 16. The reinforcing plate is disposed in the central portion excluding the peripheral portion where the tester land 16b of the probe substrate 16 is provided. A probe support 18 is arranged on the other surface (the lower surface shown in FIG. 1) of the probe substrate 16.

The probe support 18 is held on the probe substrate 16. The probe support 18 has a plurality of probes 20. The probe support 18 prevents the probes 20 from interfering with each other when the tip 20 a (lower end) of the probe 20 is pressed against the semiconductor wafer 14.

In the probe 20, the distal end portion 20 a of the probe 20 contacts the semiconductor wafer 14, and the proximal end portion 20 b of the probe 20 contacts the probe substrate 16.

The tip 20a of the probe 20 is connected to the electrode pad 14a on the semiconductor wafer 14 facing the probe 20 while being guided by the probe support 18.

The proximal end portion 20b of the probe 20 is in contact with a connection pad 16c (see FIG. 2 described later) provided corresponding to the probe substrate 16 in a pressure contact state.

The proximal end portion 20b of the probe 20 is connected to the connection pad 16c (see FIG. 2) while being guided by the probe support 18. Thereby, the probe 20 is electrically connected to the corresponding tester land 16b through the connection pad 16c and the wiring 16a.

Next, the configuration of the probe support 18 and the probe 20 will be described in detail with reference to FIGS. FIG. 2 is a partially enlarged cross-sectional view in which a part of the electrical connection device 1 according to the first embodiment of the present invention is enlarged. FIG. 3 is a partially enlarged cross-sectional view in which a part of the probe 20 according to the first embodiment of the present invention is enlarged. FIG. 4 is a partially enlarged perspective view in which a part of the probe 20 according to the first embodiment of the present invention is enlarged.

For the sake of explanation, in the drawings, the vertical direction is defined as the thickness direction Y, and the horizontal direction is defined as the orthogonal direction X orthogonal to the thickness direction Y.

2, the probe support 18 includes a plate-shaped guide portion 30, a probe 20, and a locking portion 40. The probe support 18 is also provided with another guide part arranged in parallel with the guide part 30 below the thickness direction Y of the guide part 30, but the description thereof is omitted here.

The guide portion 30 is formed of, for example, a ceramic plate or a polyimide synthetic resin plate. The guide portion 30 is arranged at a predetermined interval on the probe substrate 16 while being supported by the spacer member 34.

The guide part 30 is arranged in parallel to the probe substrate 16 on the semiconductor wafer 14 side of the probe substrate 16. The guide portion 30 has a guide hole 30a through which the probe 20 is inserted between the distal end portion 20a of the probe 20 and the proximal end portion 20b of the probe 20.

The guide hole 30a formed in the guide portion 30 penetrates in the thickness direction Y, and guides the base end portion 20b of each probe 20 to the connection pad 16c arranged corresponding to the wiring 16a of the probe substrate 16.

The base end portion 20b of the probe 20 guided to the connection pad 16c by the guide hole 30a may be fixed to the connection pad 16c using, for example, solder.

As shown in FIG. 2, the probe 20 has a curved portion 20z. The bending portion 20z is formed so as to be elastically deformed in the same shape and posture in each probe 20.

For example, in the electrical inspection of the semiconductor wafer 14, the tip 20a of the probe 20 corresponding to the electrode pad 14a is pushed upward in the thickness direction Y by the raising of the chuck 12. Then, the tip portion 20a of the probe 20 moves linearly in the thickness direction Y while being guided by the guide hole 30a of the guide portion 30 by this push-up.

Further, since the proximal end portion 20b of the probe 20 is prevented from moving by the probe substrate 16, the curved portion 20z of the probe 20 is bowed in one direction of the orthogonal direction X by pushing up the distal end portion 20a of the probe 20. Large elastic deformation.

Since the tip 20a of each probe 20 is pressed against the corresponding electrode pad 14a by the appropriate flexibility due to the elasticity of the probe 20, it is securely connected to the electrode pad 14a. Thereby, each electrode pad 14a is electrically connected to a tester (not shown) through the corresponding tester land 16b of the probe substrate 16, and the semiconductor wafer 14 is electrically inspected.

Further, as shown in FIG. 3, the probe 20 includes a main body 21. The main body 21 is made of a linear metal member. The metal member may be tungsten, for example.

The main body 21 is inserted into the guide hole 30a of the guide 30. The upper end of the main body 21 in the thickness direction Y is the base end 20 b of the probe 20, and the lower end is the distal end 20 a of the probe 20.

The locking portion 40 is fixed to the main body portion 21 of the probe 20. The locking portion 40 locks the main body portion 21 of the probe 20 inserted through the guide hole 30 a to the guide portion 30. The locking portion 40 has a wide portion wider than the diameter W1 of the guide hole 30a, and the wide portion functions as a stopper that prevents the main body portion 21 from being pulled into the guide hole 30a.

The width W2 in the orthogonal direction X of the locking part 40 is larger than the diameter W1 in the orthogonal direction X of the guide hole 30a of the guide part 30. Moreover, as shown in FIG. 4, the latching | locking part 40 is formed in the column shape, and has the wide part of the width W2 over the whole thickness direction Y. As shown in FIG.

Moreover, the latching | locking part 40 consists of elastic members. The elastic member is, for example, a rubber member. Since the locking portion 40 is made of an elastic member, when the base end portion 20 b is compressed downward in the thickness direction Y by the probe substrate 16, it is compressed and deformed in the thickness direction Y. Note that the elastic member is not limited to the rubber member as long as it has elasticity and can be compressed and deformed, and other members may be applied.

<Method for manufacturing probe and locking portion>
Next, the manufacturing method of the probe 20 and the latching | locking part 40 which are Embodiment 1 of this invention is demonstrated. The manufacturing method includes a preparation process, an insertion process, a filling process, and a molding process. FIGS. 5A to 5D are conceptual diagrams for explaining a method for manufacturing the probe 20 and the locking portion 40. FIG.

First, in the preparation process, as shown in FIG. The mold frame 200 includes a hole 210 for arranging the main body portion 21 of the probe 20 and a forming chamber 220 connected to the hole 210 to form the locking portion 40. In addition, it is preferable that a release material is formed on the inner surfaces of the hole 210 and the forming chamber 220 in order to facilitate removal of the completed probe 20.

Next, in the insertion step, the main body 21 is inserted into the hole 210 of the mold 200 as shown in FIG.

Next, in the filling step, as shown in FIG. 5C, the forming chamber 220 is filled with a liquid elastic member 40w. For example, a liquid rubber member is filled. After filling, the process waits until the elastic member 40w is sufficiently cured.

Then, in the molding process, as shown in FIG. 5 (d), a locking portion 40 whose length is adjusted by removing a part of the cured elastic member is molded. As a method of removing a part of the elastic member, the elastic member may be burned by irradiating a laser, or the elastic member may be dissolved using a chemical solution.

<Effect of Embodiment 1 of the Present Invention>
Next, the effect of the electrical connection apparatus 1 which is Embodiment 1 of this invention is demonstrated.

Here, FIG. 6 is a partially enlarged cross-sectional view schematically showing a part of an electrical connection device according to the prior art. In the prior art, the locking part 140 of the probe 120 employs a technique in which a part of the main body part 121 is dissolved and thickened, or a part of the main body part 121 is crushed and thickened.

Therefore, due to the length of the locking portion 140 in the thickness direction Y (pressure contact direction), the extension length from the guide portion 30 to the proximal end portion 120b of the probe 120 has varied.

For example, as shown in FIG. 6, a plurality of probes 120 include a probe 120 having an extension length L1 (hereinafter, right probe 120) and a probe 120 having an extension length L2 longer than the extension length L1 (hereinafter, “probe 120”). , Probe left side 120).

Therefore, when the guide portion 30 is pressed against the probe substrate 16 and the proximal end portions 120b of the right and left probes 120 are pressed against the connection pads 16c of the probe substrate 16 as shown by the arrow 50a in FIG. Since the load is concentrated, the base end portion 120b of 120 is pressed strongly. For this reason, the connection pad 16c of the probe board 16 is distorted or cracked, which may cause a connection failure between the left probe 120 and the probe board 16.

Furthermore, in the right probe 120 with the extension length L1 shorter than the extension length L2, the distance between the guide portion 30 and the probe substrate 16 is limited by the probe with the extension length L2, and thus a sufficient pressure contact state cannot be secured. In addition, there is a risk of causing a connection failure between the right probe 120 and the probe substrate 16.

On the other hand, FIGS. 7A to 7B are partially enlarged cross-sectional views schematically showing a part of the electrical connection device 1 according to the first embodiment of the present invention. In the electrical connection device 1 according to the first embodiment of the present invention, the locking portion 40 fixed to the main body portion 21 of the probe 20 is made of an elastic member.

For this reason, as shown in FIG. 7A, in the plurality of probes 20, the probe 20 having an extension length L1 (hereinafter, right probe 20) and the probe 20 having an extension length L2 (hereinafter, left probe 20). ), When the guide portion 30 is pressed against the probe substrate 16 as shown by an arrow 50a in FIG. 7A, the guide portion 30 is fixed to the main body portion 21 of the probe 20 having the extended length L2. The locking portion 40 having the length Ha is compressed and deformed in the thickness direction Y.

And as shown in FIG.7 (b), the length Ha of the latching | locking part 40 reduces to length Hb, and the base end part 20b of the left probe 20 which has the latching | locking part 40 of the extension length L2 is the following. It is pushed downward in the thickness direction Y. Thereby, the extension length from the guide part 30 of each probe 20 to the base end part 20b of the probe 20 is easily made uniform by the extension length L1.

As described above, in the electrical connection device 1 according to the first embodiment of the present invention, the proximal end portion 20b of each probe 20 can be kept in a pressure contact state in which the base end portion 20b of the probe substrate 16 is in good contact with the connection pad 16c. An electrical connection failure with the probe substrate 16 can be prevented.

(Modification)
Next, the structure of the electrical connection apparatus 1 which is a modification of Embodiment 1 of this invention is demonstrated. FIG. 8 is a partially enlarged cross-sectional view in which a part of the electrical connection device 1 which is a modification of the first embodiment of the present invention is enlarged.

Here, in the first embodiment of the present invention described above, the case where the locking portion 40 has a certain cylindrical shape with the width W2 has been described as an example.

In the modification of the first embodiment of the present invention, the locking portion 40 has a width W3 of the end portion 40b on the guide hole 30a side smaller than a diameter W1 of the guide hole 30a, and a width W2 of the end portion 40a on the probe substrate 16 side. Is larger than the diameter W1 of the guide hole 30a. That is, the locking part 40 has a tapered shape.

Specifically, as shown in FIG. 8, the locking portion 40 is formed in a truncated cone shape with the main body portion 21 extending in the thickness direction Y as the central axis. As shown in FIG. 8, the locking portion 40 has a trapezoidal shape in a cross section along the orthogonal direction X and the thickness direction Y.

Further, the width W3 of the end portion 40b of the locking portion 40 is set to be smaller than the diameter W1 of the guide hole 30a. On the other hand, the width W2 of the upper end portion 40a in the thickness direction Y of the locking portion 40 is set to be larger than the diameter W1 of the guide hole 30a. That is, the locking part 40 has a wide part wider than the diameter W1 of the guide hole 30a at least in the end part 40a above the thickness direction Y.

As described above, in the electrical connection device 1 that is a modification of the first embodiment of the present invention, the locking portion 40 has the width W3 of the end portion 40b on the guide hole 30a side smaller than the diameter W1 of the guide hole 30a. The width W2 of the end 40a on the probe substrate 16 side is larger than the diameter W1 of the guide hole 30a.

As a result, when the guide portion 30 is pressed against the probe substrate 16 and the base end portion 20 b of the probe 20 is pressed against the connection pad 16 c of the probe substrate 16, the end portion 40 b of the locking portion 40 is It becomes easy to fit into the guide hole 30a.

Here, when the base end portion 20b of the probe 20 is brought into pressure contact with the connection pad 16c of the probe substrate 16, the base end portion 20b of the probe 20 having a long extension length is the base end portion 20b of the probe 20 having a short extension length. Since the contact portion 40 is more strongly pressed, the engaging portion 40 is easily fitted into the guide hole 30a while being further compressed and deformed. For this reason, since the base end part 20b of the probe 20 with a long extension length is pushed deeper in the lower part in the thickness direction Y, the extension length of each probe 20 can be easily made uniform.

Therefore, in the plurality of probes 20, since the base end portion 20b of each probe 20 can be kept in a pressure contact state in which the probe 20 is in good pressure contact with the connection pad 16c, an electrical connection failure between the probe 20 and the probe substrate 16 can be prevented. More can be prevented.

Further, since the locking portion 40 is easily fitted into the guide hole 30a, the extension length of each probe 20 can be made uniform even if the locking portion 40 has some variation in shape. Therefore, manufacture of the probe 20 to which the locking portion 40 is attached is facilitated and productivity can be improved.

Although FIG. 8 shows the case where the locking portion 40 has a truncated cone shape, the present invention is not limited to this. The locking part 40 may be formed in a conical shape, for example. That is, the locking portion 40 may have a triangular shape in a cross section along the orthogonal direction X and the thickness direction Y.

[Other Embodiments of the Present Invention]
Although the present invention has been described in detail using the above-described embodiment, it is obvious for those skilled in the art that the present invention is not limited to the embodiment described in the present specification.

For example, in the above-described embodiment, as illustrated in FIG. 4, the shape of the locking portion 40 has been described as an example of a columnar shape, but may be a polygonal column shape, for example, a quadrangular column It may be a shape or a hexagonal prism shape. As described above, various shapes can be applied to the locking portion 40 as long as it has a wide portion wider than the diameter W1 of the guide hole 30a.

In the above-described embodiment, the electrical connection device 1 is described as an example of a vertically-operated probe card. However, the present invention is not limited to this and is applicable to probe cards having various types of needle shapes. it can.

In the above-described embodiment, the case where the probe 20 includes the curved portion 20z has been described as an example. However, the probe 20 does not necessarily include the curved portion 20z.

As described above, the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiments. For example, some components may be deleted from all the components shown in the embodiment.

DESCRIPTION OF SYMBOLS 1 Electrical connection apparatus 14 Semiconductor wafer 14a Electrode pad 16 Probe board 16a Wiring 16b Tester land 16c Connection pad 18 Probe support 20, 120 Probe 20a Tip part 20b Base end part 21 Body part 40 Locking part 30 Guide part 30a Guide hole

Claims (3)

A probe substrate;
A probe having a linear main body portion with a distal end portion in contact with an object to be inspected and a proximal end portion in contact with the probe substrate;
A plate-like guide portion disposed on the inspected object side of the probe substrate and having a guide hole for inserting the probe between the distal end portion and the base end portion;
A locking portion for locking the main body portion inserted into the guide hole to the guide portion,
The electrical connection device according to claim 1, wherein the locking portion is made of an elastic member having a wide portion wider than the diameter of the guide hole. The locking portion has a shape in which the width of the end portion on the guide hole side is smaller than the diameter of the guide hole, and the width of the end portion on the probe board side is larger than the diameter of the guide hole. The electrical connection device according to claim 1. A probe having a linear main body part in which a distal end part abuts on an object to be inspected and a proximal end part abuts on a probe substrate;
A plate-like guide portion disposed on the inspected object side of the probe substrate and having a guide hole for inserting the probe between the distal end portion and the base end portion;
A locking portion for locking the main body portion inserted into the guide hole to the guide portion,
The probe support according to claim 1, wherein the locking portion is made of an elastic member having a wide portion wider than the diameter of the guide hole.

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