[go: up one dir, main page]

WO2018032393A1 - Structure de dissipation de chaleur pour banque de mémoire - Google Patents

Structure de dissipation de chaleur pour banque de mémoire Download PDF

Info

Publication number
WO2018032393A1
WO2018032393A1 PCT/CN2016/095638 CN2016095638W WO2018032393A1 WO 2018032393 A1 WO2018032393 A1 WO 2018032393A1 CN 2016095638 W CN2016095638 W CN 2016095638W WO 2018032393 A1 WO2018032393 A1 WO 2018032393A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat sink
metal heat
metal
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/095638
Other languages
English (en)
Chinese (zh)
Inventor
陈玮彤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/CN2016/095638 priority Critical patent/WO2018032393A1/fr
Publication of WO2018032393A1 publication Critical patent/WO2018032393A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to the field of computer technology, and more particularly to a memory module heat dissipation structure.
  • the memory module is an indispensable part of the computer. Most of the computers currently used do not have a structure for dissipating heat from the memory module. The memory is prone to instability after running in a hot chassis, which affects the use of the computer. Peer affects the life of the memory stick.
  • the technical problem to be solved by the present invention is to provide a memory strip heat dissipation structure in view of the above-mentioned drawbacks of the prior art.
  • a memory strip heat dissipation structure is configured, including a main board and a memory slot disposed on the main board; wherein, the two sides of the memory slot are respectively rotatably connected with a first metal heat sink and a second metal heat sink;
  • the first metal heat sink is fixedly disposed with a first silicone heat sink, and the upper end is rotatably connected with a fixing rod, and the fixing rod end is connected with an L-shaped fixing buckle;
  • the second metal heat sink is fixedly disposed at the side
  • the second silicone heat sink has an upper end provided with a bayonet that cooperates with the fixed buckle.
  • the memory strip heat dissipation structure of the present invention wherein the two sidewalls of the memory slot are respectively provided with a first cavity engaged with the first metal heat sink and a second metal heat sink The second cavity.
  • the heat dissipation structure of the memory module of the present invention wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation holes.
  • the heat dissipation structure of the memory module of the present invention wherein the first metal heat sink and the surface of the second metal heat dissipation sheet are provided with a plurality of heat dissipation strips.
  • the beneficial effects of the present invention are: the heat dissipation of the memory module is required, the first metal heat sink and the second metal heat sink are rotated, so that the first silicone heat sink and the second silicone heat sink are attached to the memory strip, and then Rotating the fixing rod, the fixing buckle and the bayonet are fastened to achieve the heat dissipation effect on the memory strip; the overall structure is simple and the cost is low.
  • FIG. 1 is a schematic structural view of a heat dissipation structure of a memory module according to a preferred embodiment of the present invention.
  • the heat dissipation structure of the memory module of the preferred embodiment of the present invention includes a main board 1 and a memory slot 10 disposed on the main board 1.
  • the first side of the memory slot 10 is rotatably connected to the first metal heat sink. 100 and the second metal heat sink 101;
  • the first metal heat sink 100 is fixedly disposed on the side of the first silicone heat sink 102, the upper end is rotatably connected with a fixing rod 103, and the end of the fixing rod 103 is connected with an L-shaped fixing buckle 104;
  • the second metal heat sink 101 is fixedly disposed with a second silicone heat sink 105, and the upper end is provided with a bayonet 106 matched with the fixed buckle 104.
  • the heat dissipation of the memory strip 2 is required to rotate the first metal heat sink 100 and the second metal.
  • the heat sink 101 is configured such that the first silicone heat sink 102 and the second silicone heat sink 105 are attached to the memory stick 2, and then the fixing rod 103 is rotated, and the fixing buckle 104 and the bayonet 106 are fastened to achieve a heat dissipation effect on the memory strip 2;
  • the overall structure is simple and the cost is low.
  • the two sidewalls of the memory slot 10 are respectively provided with a first recess that cooperates with the first metal heat sink 100.
  • the cavity 107 and the second cavity 108 mated with the second metal fin 101 occupy less space.
  • a plurality of heat dissipation holes are disposed on the surfaces of the first metal heat sink 100 and the second metal heat sink 101, and the heat dissipation effect is good.
  • a plurality of heat dissipation strips 109 are disposed on the surface of the first metal heat sink and the second metal heat sink, and the heat dissipation effect is good.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Une structure de dissipation de chaleur pour une banque de mémoire, comprenant une carte mère (1) et une fente de mémoire (10) disposée sur la carte mère (1). Deux surfaces latérales de la fente de mémoire (10) sont reliées de manière rotative à une première pièce de dissipation de chaleur métallique (100) et à une seconde pièce de dissipation de chaleur métallique (101), respectivement ; une surface latérale de la première pièce de dissipation de chaleur métallique (100) est pourvue de manière fixe d'une première pièce de dissipation de chaleur en silicone (102), son extrémité supérieure est reliée de manière rotative à une tige de fixation (103), et la partie d'extrémité de la tige de fixation (103) est reliée à un joint à encliquetage de fixation en forme de L (104); une surface latérale de la seconde pièce de dissipation de chaleur métallique (101) est pourvue de manière fixe d'une seconde pièce de dissipation de chaleur en silicone (105), et son extrémité supérieure est pourvue d'une baïonnette (106) correspondant au joint à encliquetage de fixation (104); lorsqu'une banque de mémoire (2) nécessite une dissipation de chaleur, la première pièce de dissipation de chaleur métallique (100) et la seconde pièce de dissipation de chaleur métallique (101) sont tournées de telle sorte que la première pièce de dissipation de chaleur en silicone (102) et la seconde pièce de dissipation de chaleur en silicone (105) sont fixées à la banque de mémoire (2), puis la tige de fixation (103) est tournée de telle sorte que le joint à encliquetage de fixation (104) s'encliquète sur la baïonnette (106), de manière à obtenir un effet de dissipation de chaleur de la banque de mémoire (2). La structure de dissipation de chaleur pour une banque de mémoire est simple en termes de structure globale et présente de faibles coûts.
PCT/CN2016/095638 2016-08-17 2016-08-17 Structure de dissipation de chaleur pour banque de mémoire Ceased WO2018032393A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/095638 WO2018032393A1 (fr) 2016-08-17 2016-08-17 Structure de dissipation de chaleur pour banque de mémoire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/095638 WO2018032393A1 (fr) 2016-08-17 2016-08-17 Structure de dissipation de chaleur pour banque de mémoire

Publications (1)

Publication Number Publication Date
WO2018032393A1 true WO2018032393A1 (fr) 2018-02-22

Family

ID=61196255

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/095638 Ceased WO2018032393A1 (fr) 2016-08-17 2016-08-17 Structure de dissipation de chaleur pour banque de mémoire

Country Status (1)

Country Link
WO (1) WO2018032393A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101414206A (zh) * 2007-10-18 2009-04-22 鸿富锦精密工业（深圳）有限公司 内存条散热装置
US20090277616A1 (en) * 2008-05-06 2009-11-12 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
CN101997194A (zh) * 2009-08-11 2011-03-30 冯林 一种内存防护装置和计算机
CN203455762U (zh) * 2013-08-21 2014-02-26 张艳梅 计算机内存条防尘散热装置
CN205176783U (zh) * 2015-12-07 2016-04-20 南阳医学高等专科学校 一种计算机内存条散热装置
CN106292961A (zh) * 2016-08-17 2017-01-04 陈玮彤 一种内存条散热结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101414206A (zh) * 2007-10-18 2009-04-22 鸿富锦精密工业（深圳）有限公司 内存条散热装置
US20090277616A1 (en) * 2008-05-06 2009-11-12 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
CN101997194A (zh) * 2009-08-11 2011-03-30 冯林 一种内存防护装置和计算机
CN203455762U (zh) * 2013-08-21 2014-02-26 张艳梅 计算机内存条防尘散热装置
CN205176783U (zh) * 2015-12-07 2016-04-20 南阳医学高等专科学校 一种计算机内存条散热装置
CN106292961A (zh) * 2016-08-17 2017-01-04 陈玮彤 一种内存条散热结构

Similar Documents

Publication Publication Date Title
TWM441311U (en) Casing formed with heat sink combination
US20140116656A1 (en) Heat dissipation module and electronic device with the same
TWM496156U (zh) 行動電子裝置散熱結構
WO2018032393A1 (fr) Structure de dissipation de chaleur pour banque de mémoire
CN103838311A (zh) 固定架及运用此固定架的电子装置
CN206178632U (zh) 一种高效电脑散热器
CN205247266U (zh) 一种计算机主板结构
CN204392738U (zh) 散热装置
TWM560170U (zh) 冷卻裝置
CN203279449U (zh) 电子装置
CN201479525U (zh) 枢接单元及其支架结构
CN208509491U (zh) 一种移动终端用散热背夹
TWM383765U (en) Fast disassemble heat sink clip
CN201766794U (zh) 散热装置及应用其的电子运算系统
CN212164023U (zh) 一种fmc接口板卡散热器
CN201667775U (zh) 散热器固定结构
CN207351279U (zh) 一种散热器扣片结构
CN206775553U (zh) 一种带有微型散热机构的手机后壳
CN106292961A (zh) 一种内存条散热结构
CN202796912U (zh) 一种散热器
CN201638130U (zh) 散热装置及应用其的电子运算系统
CN205263739U (zh) 一种连接刀片服务器机箱做整体散热的cpu散热器
CN202142002U (zh) 一种强散热电脑电源
TWI758095B (zh) 適用於一電子元件的散熱結構及散熱模組
CN103700637B (zh) 一种带绝缘装置的换热器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16913153

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16913153

Country of ref document: EP

Kind code of ref document: A1