[go: up one dir, main page]

WO2018018637A1 - Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile - Google Patents

Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile Download PDF

Info

Publication number
WO2018018637A1
WO2018018637A1 PCT/CN2016/092430 CN2016092430W WO2018018637A1 WO 2018018637 A1 WO2018018637 A1 WO 2018018637A1 CN 2016092430 W CN2016092430 W CN 2016092430W WO 2018018637 A1 WO2018018637 A1 WO 2018018637A1
Authority
WO
WIPO (PCT)
Prior art keywords
bottom plate
heat sink
section
heat
condensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/092430
Other languages
English (en)
Chinese (zh)
Inventor
唐尹
杨飞虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SZ DJI Technology Co Ltd
Original Assignee
SZ DJI Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SZ DJI Technology Co Ltd filed Critical SZ DJI Technology Co Ltd
Priority to CN201680005174.4A priority Critical patent/CN107114000B/zh
Priority to PCT/CN2016/092430 priority patent/WO2018018637A1/fr
Publication of WO2018018637A1 publication Critical patent/WO2018018637A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present invention relates to a heat sink and an image pickup apparatus using the same, an unmanned aerial vehicle using the image pickup apparatus, and a movable apparatus.
  • an electronic device such as a camera or a camera that is set on the unmanned aerial vehicle to shoot.
  • These electronic devices such as cameras, require an imaging sensor to acquire image data, but the imaging sensor emits a large amount of heat during operation, and if the heat is not dissipated in time, the temperature of the imaging sensor will rise, resulting in the imaging. The image quality of the sensor is reduced, which affects the camera's shooting.
  • the imaging sensor is generally used to dissipate heat from a heat sink in the prior art. However, since the heat sink is usually disposed inside the camera, even if heat is transferred to the heat sink, heat is still collected inside the camera, thereby affecting heat dissipation efficiency.
  • a heat sink includes a bottom plate and a heat pipe in thermal contact with the bottom plate, the heat pipe including an evaporation section and a condensation section, the condensation section protruding from the bottom plate to be in thermal contact with other external components.
  • An image acquisition device includes a body and a sensor module mounted in the body, the image acquisition device further includes a heat sink, and the heat sink is installed in the body to face the sensor module
  • the group performs heat dissipation, and the heat sink includes:
  • the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, the evaporation section being in thermal contact with the sensor module, the condensation section protruding from the bottom plate and the machine Hot contact.
  • a heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section, at least two connection sections connected to an end of the evaporation section, and condensation connected to each connection section And a segment extending from a corresponding one end of the evaporation section toward a direction away from the bottom plate, each condensation section protruding from the bottom plate at a predetermined angle to be in thermal contact with other external components.
  • a movable device wherein the movable device is provided with an image acquisition device, the image acquisition device includes a body and a heat sink as described above, the heat sink is installed in the body, the heat sink The condensation section is in thermal contact with the fuselage.
  • An unmanned aerial vehicle is provided with an image acquisition device as described above.
  • a movable device wherein the movable device is provided with an image acquisition device, the image acquisition device includes a body and a heat sink as described above, the heat sink is installed in the body, the heat sink The condensation section is in thermal contact with the fuselage.
  • the heat sink described above by providing a heat pipe protruding from the bottom plate to facilitate thermal contact of the condensation section of the heat pipe with other external components, enables heat conducted to the heat pipe to be quickly conducted through the evaporation section to the condensation section and through the condensation section Thermal contact with other external components directly transfers heat to other external components, reducing heat buildup near the heat sink and improving heat dissipation efficiency.
  • FIG. 1 is a three-dimensional assembly diagram of a heat sink mounting sensor module according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing another perspective of the heat sink mounting sensor module shown in FIG. 1 .
  • FIG. 3 is a schematic view showing the splitting of the heat sink and the sensor module shown in FIG. 1.
  • FIG. 4 is a schematic view of another angle of the heat sink and the sensor module shown in FIG. 3.
  • FIG. 5 is a schematic exploded view of the heat sink shown in FIG. 1 installed in an image acquisition device.
  • Fig. 6 is a schematic view showing another angle of the image pickup apparatus shown in Fig. 5.
  • FIG. 7 is an assembled view of the image acquisition device shown in FIG. 5 installed in a pan/tilt of a mobile device.
  • FIG. 8 is a schematic diagram of splitting of the image acquisition device shown in FIG. 5 in a pan/tilt of a mobile device.
  • a component when a component is said to be “thermally contacted” with another component, it can be in direct contact with another component to conduct heat or a component that is centered can be thermally conductive.
  • a component When a component is referred to as being “fixed” to another component, it can be directly on the other component or the component can be in the middle.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • the invention provides a heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section and a condensation section, the condensation section protruding from the bottom plate to be in thermal contact with other external components .
  • the invention also provides a heat sink comprising a bottom plate and a heat pipe, the heat pipe being in thermal contact with the bottom plate, the heat pipe comprising an evaporation section, at least two connecting sections connected to the end of the evaporation section, and connected to each a condensation section of the connecting section, each connecting section extending from a corresponding one end of the evaporation section toward a direction away from the bottom plate, each condensation section protruding at a predetermined angle to the bottom plate to be in thermal contact with other external components .
  • an embodiment of the present invention provides a heat sink 100 for dissipating heat from a heat-generating electronic component.
  • the heat sink 100 is applied to an image acquisition device 200 (shown in FIG. 5), and the image acquisition device 200 is disposed on a movable device, such as an unmanned aerial vehicle (not shown).
  • the aerial mission is performed during the flight of the unmanned aerial vehicle.
  • the heat sink 100 includes a bottom plate 11 and a heat pipe 12. Specifically in the illustrated embodiment, the heat pipe 12 is in thermal contact with the bottom plate 11.
  • the bottom plate 11 is substantially a rectangular plate including opposite first side faces 111 and second side faces 112. In the present embodiment, the first side faces 111 and the second side faces 112 are parallel to each other.
  • the bottom plate 11 is made of a metal material such as copper, aluminum or the like which has good thermal conductivity or an alloy thereof.
  • the heat pipe 12 includes an evaporation section 121, a condensation section 122, and a connection section 123 connected between the evaporation section 121 and the condensation section 122.
  • the manner in which the heat pipe 12 is in thermal contact with the bottom plate 11 is not limited to one.
  • the evaporation section 121 of the heat pipe 12 is directly attached to the first side surface 111 of the bottom plate 11 through the evaporation section 121.
  • the direct contact with the bottom plate 11 realizes the exchange of heat between the two; or a thermal paste is added between the two to accelerate the conduction of heat between the two through the thermal paste.
  • the evaporation section 121 of the heat pipe 12 is directly embedded in the bottom plate 11.
  • the first side surface 111 of the bottom plate 11 is recessed inwardly to embed the evaporation section 121 of the heat pipe 12 from the first side surface 111 in the bottom plate 11 at a position where the evaporation section 121 is buried.
  • the first side surface 111 of the bottom plate 11 is outwardly raised to a certain height so that the evaporation section 121 is completely buried in the bottom plate 11.
  • the plane in which the evaporation section 121 is located is parallel to the plane in which the bottom plate 11 is located.
  • the center of the first side surface 111 of the bottom plate 11 further forms a bump 113.
  • the protrusion 113 is substantially rectangular and can be integrally formed with the bottom plate 11. The provision of the bumps 113 enables the distance between the bottom plate 11 and the heat-generating electronic components that dissipate heat to be reduced, thereby making heat conduction closer to the heat-generating electronic components.
  • the number of the condensation sections 122 is at least one segment, and may of course be two segments, three segments, four segments, and the like. In the present embodiment, the number of the condensation sections 122 is two.
  • the two-stage condensation section 122 is respectively located at two ends of the evaporation section 121, and each of the condensation sections 122 is connected to a corresponding one end of the evaporation section 121 through a corresponding one of the connection sections 123. At least one of the two sections of condensation section 122 protrudes from the bottom plate 11 so as to be in thermal contact with other external components.
  • the distribution of the condensation sections 122 may be evenly spaced apart from each other and connected to the evaporation section 121, or may be distributed according to actual needs.
  • the manner in which the condensation section 122 protrudes from the bottom plate 11 is not limited to one.
  • the condensation section 122 continues to extend beyond the boundary of the bottom plate 11 in the plane in which the evaporation section 121 is located. Thereby protruding from the bottom plate 11; in other embodiments, the condensation section 122 forms a predetermined angle with the plane in which the evaporation section 121 is located so as to protrude from the bottom plate 11.
  • the plane in which at least one of the two sections of the condensation section 122 is located is at a predetermined angle to the plane in which the evaporation section 121 is located.
  • At least one of the two sections of the condensation section 122 is located in a plane that is not parallel to the plane in which the evaporation section 121 is located, but has the predetermined angle between the plane in which the evaporation section 121 is located.
  • the predetermined angle may be greater than 0 degrees and less than 180 degrees such that the condensation section 122 protrudes from the bottom plate 11.
  • the predetermined angle is 90°.
  • the two sections of the condensation section 122 are perpendicular to the bottom plate 11 to protrude from the bottom plate 11 and thus in thermal contact with other external components.
  • Each connecting section 123 is arcually connected between the evaporation section 121 and the corresponding condensation section 122.
  • the evaporation section 121 of the heat pipe 12 is substantially located at the center of the bottom plate 11, and the evaporation section 121 is substantially parallel to the opposite sides of the bottom plate 11 (perpendicular to the other two opposite sides), thereby The evaporation section 121 located at the center position is in thermal contact with the heat generating electronic component as much as possible. Both ends of the evaporation section 121 are gradually curved to extend to the edge position of the bottom plate 11, so that the two sections of the condensation section 122 are respectively located at the edge positions of the bottom plate 11.
  • the bottom plate 11 is further provided with a plurality of heat dissipation fins 13.
  • the heat dissipation fins 13 and the evaporation section are disposed on both sides of the bottom plate 11 .
  • Each of the heat dissipation fins 13 is spaced apart from the adjacent heat dissipation fins 13 , and each of the heat dissipation fins 13 faces from a second side 112 of the bottom plate 11 toward a side away from the heat pipe 12 .
  • Vertically protruding Further, a flange is formed at the same position of each of the heat dissipation fins 13, and the flanges are overlapped with each other to fix the heat dissipation fins 13 to each other.
  • the direction of each of the heat dissipation fins 13 on the bottom plate 11 is at a predetermined angle to the direction of the evaporation section 121 on the bottom plate 11.
  • the direction of the heat dissipation fins 13 on the bottom plate 11 is substantially perpendicular to the direction of the evaporation section 121 at the central position, so that the heat conducted to the central position of the evaporation section 121 can be exhausted. It may be quickly dissipated to a central heat concentration away from the bottom plate 11.
  • the heat sink 100 further includes a heat sink bracket 14 fixedly coupled to the first side surface 111 of the bottom plate 11, that is, the bottom plate 11 is disposed on a side of the heat pipe 12, the heat sink A heat generating component is interposed between the bracket 14 and the bottom plate 11.
  • the heat generating electronic component is the sensor module 23.
  • the heat sink bracket 14 has a substantially rectangular plate shape, and is connected to the bottom plate 11 in a detachable manner.
  • the periphery of the heat sink bracket 14 is convexly formed to form three bosses 141, and the three bosses 141 are fixed to the bottom plate 11 by threading screws.
  • the heat sink bracket 14 and the bottom plate 11 can also be fixedly connected by other detachable means.
  • the heat pipe 12 of the heat sink 100 in an embodiment of the present invention has a condensation section 122 protruding from the bottom plate 11 to facilitate thermal contact of the condensation section 122 with other external components, thereby enabling conduction to the heat pipe
  • the heat of 12 is rapidly conducted through the evaporation section 121 to the condensation section 122, and is in thermal contact with other external components through the condensation section 122 to directly conduct heat to other external components, reducing heat accumulation near the heat sink 100, and improving heat dissipation. effectiveness.
  • condensation section 122 in the embodiment of the present invention protrudes perpendicularly from the bottom plate 11, the condensation section 122 can be thermally contacted with other external components by means of plugging, without using other auxiliary components for fixed connection. Condensation section 122 and other external components.
  • an embodiment of the present invention provides an image acquisition device 200 for acquiring an image.
  • the image acquisition device 200 is a camera.
  • the image acquisition device 200 includes a lens 21 , a body 22 , a sensor module 23 mounted in the body 22 , a main board 24 , and the heat sink 100 described above.
  • the lens 21 is mounted on one side of the body 22.
  • the sensor module 23 is an imaging sensor for acquiring image data.
  • the sensor module 23 is interposed in the heat sink 100.
  • the main board 24 is mounted on the other side of the body 22 together with the sensor module 23 and the heat sink 100.
  • the image obtaining apparatus 200 further includes a back cover 25 and a rear cover garnish 26 which are sequentially mounted on the body 22.
  • the rear cover 25 connects the main board 24 and the heat sink. 100 covers the fuselage 22, and the rear cover trim 26 covers the back cover 25 therein.
  • the sensor module 23 includes a chip 231 and a circuit board 232 .
  • the chip 231 is a sensor chip.
  • the chip 231 is fixed and electrically connected to the circuit board 232.
  • a seal ring 233 is surrounded around the chip 231.
  • the sensor module 23 is interposed between the heat sink bracket 14 of the heat sink 100 and the bottom plate 11 .
  • the circuit board 232 is provided with a through hole 234, and the through hole 234 is located at the center of the circuit board 232.
  • the through hole 234 is substantially rectangular and has a size smaller than that of the chip 231 such that the chip 231 completely covers the through hole 234.
  • the through hole 234 can receive the protrusion 113 protruding from the bottom plate 11 of the heat sink 100, so that the protrusion 113 can penetrate into the through hole 234, and further with the sensor module 23
  • the chip 231 is close.
  • the bumps 113 are directly attached to the chip 231 through the through holes 234.
  • the through hole 234 is filled with a thermal conductive paste (not shown), and the chip 231 and the heat sink 100 are thermally contacted by the thermal conductive paste. Specifically, the chip 231 and the bump 113 in the center of the bottom plate 11 of the heat sink 100 accelerate heat conduction through the thermal grease to improve heat dissipation efficiency.
  • the body 22 is another external component that is in thermal contact with the heat pipe 12 of the heat sink 100.
  • the body 22 is made of a metal material, and may be, for example, a metal such as copper or aluminum having good thermal conductivity or an alloy thereof.
  • a recess 221 is defined in the fuselage 22, and the position, number and shape of the recess 221 are adapted to the condensation section 122 of the heat pipe 12 of the heat sink 100.
  • the number of the grooves 221 is two, and both are opened along the axial direction of the fuselage 22 to facilitate the insertion of the condensation section 122.
  • the recess 221 is filled with a thermal conductive paste (not shown), and the condensation section 122 inserted into the recess 221 is in thermal contact with the fuselage 22 through the thermal paste.
  • the chip 231 is first mounted on the circuit board 232, and the sealing ring 233 is sleeved around the chip 231 to form the sensor module 23, and the hole 234 is formed in the circuit board 232.
  • the condensation section 122 of the heat sink 100 is inserted into the recess 221 of the body 22, and the heat sink 100 equipped with the sensor module 23 is fixedly mounted to the image acquisition apparatus.
  • the fuselage 22 of 200 In the fuselage 22 of 200.
  • a plurality of elastic members such as a spring 235, are disposed between the heat sink 100 and the body 22 for adjusting the mounting height of the heat sink 100 in the body 22. . Then, after the heat sink 100, the main board 24, the back cover 25 and the back cover garnish 26 are sequentially mounted on the body 22 and mounted on the other side of the body 22.
  • the lens 21 is provided.
  • the image acquisition device 200 in the embodiment of the present invention is provided with the heat sink 100, and the heat sink 100 is provided with a heat pipe 12 protruding from the bottom plate 11 to facilitate the condensation section 122 of the heat pipe 12 and the image acquisition device 200.
  • the fuselage 22 is in direct thermal contact so that heat conducted to the heat pipe 12 can be quickly conducted through the evaporation section 121 to the condensation section 122, and the heat is directly transmitted by the condensation section 122 to the fuselage 22 to directly conduct heat.
  • the fuselage 22 is further distributed to the outside of the image pickup device 200, reducing the accumulation of heat in the vicinity of the heat sink 100, and improving the heat dissipation efficiency.
  • the image acquisition device may be a camera, but is not limited to a camera, but may be any device that can implement image acquisition, such as a video camera.
  • the heat sink 100 is also not limited to dissipating heat for the sensor module 23, and can dissipate heat to other heat-generating electronic components.
  • the invention also provides an unmanned aerial vehicle (not shown), the unmanned aerial vehicle comprising a pan/tilt head 300.
  • the UAV is used to carry an aerial photographing operation by carrying a load such as the image capturing apparatus 200 described above.
  • the image acquisition device 200 is installed on the unmanned aerial vehicle through the pan/tilt head 300.
  • the unmanned aerial vehicle is a rotor unmanned aerial vehicle, and is used for carrying an aerial photography operation by a camera, a camera, or the like. It can be understood that the UAV can also be used for map mapping, disaster investigation and rescue, air monitoring, transmission line inspection and the like. It will also be appreciated that the UAV may also be a fixed wing unmanned aerial vehicle.
  • the heat sink is not limited to the application in the unmanned aerial vehicle, and can also be applied to other mobile devices or remote control mobile devices such as unmanned vehicles and unmanned ships. Narration.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

On décrit un dispositif de dissipation thermique (100) comprenant une plaque de base (11) et un caloduc (12). Le caloduc (12) forme un contact thermique avec la plaque de base (11). Le caloduc (12) comprend une section d'évaporation (121) et une section de condensation (122). La section de condensation (122) fait saillie à partir de la plaque de base (11) pour former un contact thermique avec un autre composant externe.
PCT/CN2016/092430 2016-07-29 2016-07-29 Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile Ceased WO2018018637A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680005174.4A CN107114000B (zh) 2016-07-29 2016-07-29 散热器、无人飞行器和可移动设备
PCT/CN2016/092430 WO2018018637A1 (fr) 2016-07-29 2016-07-29 Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/092430 WO2018018637A1 (fr) 2016-07-29 2016-07-29 Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile

Publications (1)

Publication Number Publication Date
WO2018018637A1 true WO2018018637A1 (fr) 2018-02-01

Family

ID=59676366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/092430 Ceased WO2018018637A1 (fr) 2016-07-29 2016-07-29 Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile

Country Status (2)

Country Link
CN (1) CN107114000B (fr)
WO (1) WO2018018637A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019071538A1 (fr) * 2017-10-12 2019-04-18 深圳市大疆灵眸科技有限公司 Structure de dissipation de chaleur, caméra et plateforme mobile
CN107656348A (zh) * 2017-10-20 2018-02-02 深圳市道通合创软件开发有限公司 镜头模组及具有此镜头模组的摄像组件和无人飞行器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus
CN2757329Y (zh) * 2004-01-16 2006-02-08 佛山市顺德区汉达精密电子科技有限公司 散热装置
CN201491444U (zh) * 2009-08-06 2010-05-26 鈤新科技股份有限公司 多热管蒸发部的并列固定结构及具有该固定结构的散热器
CN102238847A (zh) * 2010-04-28 2011-11-09 富准精密工业(深圳)有限公司 散热装置
CN102454966A (zh) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 散热装置及应用该散热装置的发光二极管灯具
CN103140111A (zh) * 2011-11-25 2013-06-05 富瑞精密组件（昆山）有限公司 散热模组

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2757329Y (zh) * 2004-01-16 2006-02-08 佛山市顺德区汉达精密电子科技有限公司 散热装置
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus
CN201491444U (zh) * 2009-08-06 2010-05-26 鈤新科技股份有限公司 多热管蒸发部的并列固定结构及具有该固定结构的散热器
CN102238847A (zh) * 2010-04-28 2011-11-09 富准精密工业(深圳)有限公司 散热装置
CN102454966A (zh) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 散热装置及应用该散热装置的发光二极管灯具
CN103140111A (zh) * 2011-11-25 2013-06-05 富瑞精密组件（昆山）有限公司 散热模组

Also Published As

Publication number Publication date
CN107114000A (zh) 2017-08-29
CN107114000B (zh) 2019-05-28

Similar Documents

Publication Publication Date Title
JP6727889B2 (ja) デジタル・ビデオ・カメラ
JP7329757B2 (ja) 撮像装置、および撮像装置に対して取り付け可能な外付け冷却ユニット
WO2020220166A1 (fr) Ensemble de dissipation de chaleur et caméra de mouvement
WO2016029456A1 (fr) Module de capture d'image
US12052483B2 (en) Photographing device and communication device
WO2017070911A1 (fr) Dispositif de commande de vol et aéronef sans pilote comprenant celui-ci
CN208013643U (zh) 一种云台相机、云台组件及拍摄设备
CN211061064U (zh) 一种红外机芯内置风冷的散热装置及红外探测器
WO2021149404A1 (fr) Dispositif d'imagerie
WO2018018637A1 (fr) Dispositif de dissipation thermique, véhicule aérien sans pilote, et dispositif mobile
WO2019119365A1 (fr) Caméra, dispositif de photographie et véhicule aérien sans pilote
JP2019087775A (ja) 監視カメラ
WO2017028274A1 (fr) Dispositif et tête à berceau portatifs et élément électronique mettant en œuvre le dispositif portatif
CN217088511U (zh) 一种相机模组及拍摄组件
CN220067542U (zh) 图像获取装置以及电子设备
WO2022099505A1 (fr) Ensemble multi-vue monté sur véhicule, procédé d'assemblage et véhicule
CN212163453U (zh) 图像传感模块、摄像模组、终端设备及模具
US20250287084A1 (en) Image capturing apparatus
CN218450324U (zh) 相机
CN218920854U (zh) 一种具有散热效果的监控设备
CN221101242U (zh) 全景相机用散热结构
CN219676422U (zh) 航摄相机及无人机
JPS633198Y2 (fr)
CN222638543U (zh) 一种应用于消防物联网的物联网关
CN222978937U (zh) 一种成像彩色亮度计

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16910217

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16910217

Country of ref document: EP

Kind code of ref document: A1