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WO2018012730A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2018012730A1
WO2018012730A1 PCT/KR2017/005393 KR2017005393W WO2018012730A1 WO 2018012730 A1 WO2018012730 A1 WO 2018012730A1 KR 2017005393 W KR2017005393 W KR 2017005393W WO 2018012730 A1 WO2018012730 A1 WO 2018012730A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
rigid substrate
rigid
flexible substrate
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/005393
Other languages
English (en)
Korean (ko)
Inventor
천아현
김용이
이창훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2018012730A1 publication Critical patent/WO2018012730A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present disclosure relates to an electronic device.
  • the present disclosure relates to an electronic device for expanding a ground area of a circuit board provided in an ultra-small electronic device.
  • an electronic device refers to an electronic device that performs a specific function according to an embedded program such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, a vehicle navigation device, and the like. Means the device. For example, such electronic devices may output stored information as sound or an image.
  • an embedded program such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, a vehicle navigation device, and the like.
  • Such electronic devices may output stored information as sound or an image.
  • various functions have been installed in one mobile communication terminal. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, calendar management or electronic wallet, etc. It is.
  • miniaturized wearable electronic devices have been proposed that can be worn on a body to implement various functions while increasing portability.
  • an HRM sensor that can measure biometric information such as an antenna module, a memory for storing sound sources, or a user's heart rate according to the wearing of the ear jack.
  • Various modules such as Mic for call, input device such as button or touch to control ear jack may be built in.
  • an electronic device such as a jack must be formed very small in order to be worn at a specific position of the body, the necessity of a structure that can be equipped with a variety of modules to implement a variety of functions in the electronic device having a limited space
  • an electronic device such as an ear jack may be used to measure biometric information such as a user's heart rate as well as a memory module for storing a sound source, as well as a Bluetooth module for connecting with a mobile terminal.
  • An HRM sensor, a Mic for a call, and an input device such as a button or a touch for controlling an ear jack can be mounted, and the size of the ear jack needs to be minimized.
  • an electronic device having a structure that enables the electronic device to be miniaturized and highly integrated may be provided.
  • an electronic device for connecting a plurality of substrates in which various functions are integrated to a flexible substrate is provided.
  • the substrates and the flexible substrates connecting them have different stacking structures, and it is difficult to sufficiently secure a ground region in the flexible substrate.
  • the ground level of the entire internal circuit board is not constant, and the structure has a weak structure in terms of antenna radiation performance and noise.
  • a circuit circulating structure is formed through the expansion of the flexible board in the structure of the circuit board, thereby reinforcing the ground connection between the board and the board, thereby sufficiently securing the ground area of the flexible board. It is possible to maintain a constant ground level of an entire circuit board, and to provide an electronic device capable of having a structure resistant to antenna radiation performance or noise through such a structure.
  • a second rigid substrate on which at least one second module is mounted
  • a first flexible substrate electrically connecting the first rigid substrate and the second rigid substrate
  • a second flexible substrate electrically connecting the second rigid substrate and the third rigid substrate
  • the first rigid substrate and the third rigid substrate may be electrically connected to each other through a third flexible substrate.
  • An electronic device may allow a plurality of rigid substrates to be connected through a flexible substrate, and a plurality of rigid substrates may be arranged in a stacked state in a housing by bending of the flexible substrates. This can be useful for integrating various functions into a miniaturized electronic device.
  • an electronic device may include a stacked structure of layers of a plurality of rigid substrates, and a stacked structure of layers of flexible substrates connecting the substrates.
  • FIG. 1 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure.
  • FIG. 2 is a diagram illustrating an electronic device according to various embodiments of the present disclosure.
  • FIG. 3 is a diagram illustrating an internal structure of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is a diagram illustrating a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is a diagram illustrating another surface of a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • FIG. 6 is a diagram schematically illustrating stacking of layers of a substrate portion and stacking of layers of a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • FIG. 7 is a diagram illustrating a structure in which a board unit and a connecting board unit are disposed in a housing in an electronic device according to various embodiments of the present disclosure.
  • FIG. 8 is a diagram schematically illustrating a structure in which a board unit and a connecting board unit are disposed in a housing in an electronic device according to various embodiments of the present disclosure.
  • FIG. 9 is a view schematically illustrating a connection structure of a substrate unit and a connection board unit in an electronic device according to various embodiments of the present disclosure.
  • FIG. 10 is a view illustrating a connection structure of a third rigid substrate and a third flexible substrate in an electronic device according to various embodiments of the present disclosure.
  • FIG. 11 is a diagram illustrating another direction of the electronic device in the electronic device according to various embodiments of the present disclosure.
  • FIG. 12 is a diagram illustrating a process of forming a third flexible substrate in an electronic device according to various embodiments of the present disclosure.
  • FIG. 13 is a view illustrating a process of assembling a substrate part and a connection board part to a housing in an electronic device according to various embodiments of the present disclosure.
  • any (eg first) component is said to be “connected (functionally or communicatively)” or “connected” to another (eg second) component
  • the other component is said other It may be directly connected to the component or may be connected through another component (for example, the third component).
  • the expression “device configured to” may mean that the device “can” together with other devices or components.
  • processor configured (or configured to) perform A, B, and C may be implemented by executing a dedicated processor (eg, an embedded processor) to perform its operation, or one or more software programs stored in a memory device. It may mean a general purpose processor (eg, a CPU or an application processor) capable of performing the corresponding operations.
  • An electronic device may be, for example, a smartphone, a tablet PC, a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a PDA, a PMP. It may include at least one of a portable multimedia player, an MP3 player, a medical device, a camera, or a wearable device. Wearable devices may be accessory (e.g. watches, rings, bracelets, anklets, necklaces, eyeglasses, contact lenses, or head-mounted-devices (HMDs), textiles or clothing integrated (e.g.
  • HMDs head-mounted-devices
  • an electronic device may comprise, for example, a television, a digital video disk (DVD) player, Audio, Refrigerator, Air Conditioner, Cleaner, Oven, Microwave Oven, Washing Machine, Air Purifier, Set Top Box, Home Automation Control Panel, Security Control Panel, Media Box (e.g. Samsung HomeSync TM , Apple TV TM , or Google TV TM ) , A game console (eg, Xbox TM , PlayStation TM ), an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.
  • DVD digital video disk
  • the electronic device may include a variety of medical devices (e.g., various portable medical measuring devices such as blood glucose meters, heart rate monitors, blood pressure meters, or body temperature meters), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), Computed tomography (CT), cameras or ultrasounds), navigation devices, global navigation satellite systems (GNSS), event data recorders (EDRs), flight data recorders (FDRs), automotive infotainment devices, ship electronics (E.g., various portable medical measuring devices such as blood glucose meters, heart rate monitors, blood pressure meters, or body temperature meters), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), Computed tomography (CT), cameras or ultrasounds), navigation devices, global navigation satellite systems (GNSS), event data recorders (EDRs), flight data recorders (FDRs), automotive infotainment devices, ship electronics (E.g.
  • various portable medical measuring devices such as blood glucose meters, heart rate monitors, blood pressure meters, or body temperature meters
  • MRA magnetic resonance angiography
  • an electronic device may be a part of a furniture, building / structure or automobile, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, water, electricity, Gas, or a radio wave measuring instrument).
  • the electronic device may be flexible or a combination of two or more of the aforementioned various devices.
  • Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices.
  • the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) that uses an electronic device.
  • FIG. 1 is a block diagram illustrating an electronic device 20 according to various embodiments of the present disclosure.
  • the electronic device 20 may include one or more processors (eg, an AP) 21, a communication module 22, a subscriber identification module 22g, a memory 23, a sensor module 24, an input device 25, and a display ( 26, an interface 27, an audio module 28, a camera module 29a, a power management module 29d, a battery 29e, an indicator 29b, and a motor 29c.
  • the processor 21 may control, for example, a plurality of hardware or software components connected to the processor 21 by running an operating system or an application program, and may perform various data processing and operations.
  • the processor 21 may be implemented with, for example, a system on chip (SoC).
  • SoC system on chip
  • the processor 21 may further include a graphic processing unit (GPU) and / or an image signal processor.
  • the processor 21 may include at least some of the components illustrated in FIG. 1 (eg, the cellular module 22a).
  • the processor 21 may load and process instructions or data received from at least one of the other components (eg, nonvolatile memory) into the volatile memory, and store the result data in the nonvolatile memory.
  • the communication module 22 may include, for example, a cellular module 22a, a WiFi module 22b, a Bluetooth module 22c, a GNSS module 22d, an NFC module 22e, and an RF module 22f. have.
  • the cellular module 22a may provide, for example, a voice call, a video call, a text service, or an internet service through a communication network.
  • the cellular module 22a may perform identification and authentication of the electronic device 20 in the communication network using the subscriber identification module (eg, the SIM card) 22g.
  • the cellular module 22a may perform at least some of the functions that the processor 21 may provide.
  • the cellular module 22a may include a communication processor (CP).
  • CP communication processor
  • the cellular module 22a, WiFi module 22b, Bluetooth module 22c, GNSS module 22d, or NFC module 22e may be one integrated chip. (IC) or in an IC package.
  • the RF module 22f may transmit / receive, for example, a communication signal (for example, an RF signal).
  • the RF module 22f may include, for example, a transceiver, a power amp module (PAM), a frequency filter, a low noise amplifier (LNA), an antenna, or the like.
  • At least one of the cellular module 22a, the WiFi module 22b, the Bluetooth module 22c, the GNSS module 22d, or the NFC module 22e may transmit and receive an RF signal through a separate RF module.
  • Subscriber identification module 22g may include, for example, a card or embedded SIM that includes a subscriber identification module, and may include unique identification information (such as an integrated circuit card identifier (ICCID)) or subscriber information (such as IMSI). (international mobile subscriber identity)).
  • ICCID integrated circuit card identifier
  • IMSI international mobile subscriber identity
  • the memory 23 may include, for example, an internal memory 23a or an external memory 23b.
  • the internal memory 23a may be, for example, volatile memory (for example, DRAM, SRAM, or SDRAM), nonvolatile memory (for example, one time programmable ROM (OTPROM), PROM, EPROM, EEPROM, mask ROM, flash ROM). It may include at least one of a flash memory, a hard drive, or a solid state drive (SSD)
  • the external memory 23b may be a flash drive, for example, a compact flash (CF), a secure digital (SD). ), Micro-SD, Mini-SD, extreme digital (xD), multi-media card (MMC), memory stick, etc.
  • the external memory 23b may be functionally connected to the electronic device 20 through various interfaces. Or physically connected.
  • the sensor module 24 may measure a physical quantity or detect an operation state of the electronic device 20, and convert the measured or detected information into an electrical signal.
  • the sensor module 24 includes, for example, a gesture sensor 24a, a gyro sensor 24b, an air pressure sensor 24c, a magnetic sensor 24d, an acceleration sensor 24e, a grip sensor 24f, and a proximity sensor ( 24g), color sensor 24h (e.g., red (green, blue) sensor), biometric sensor 24i, temperature / humidity sensor 24j, illuminance sensor 24k, or UV (ultra violet) ) May include at least one of the sensors 24l.
  • a gesture sensor 24a e.g., a gyro sensor 24b, an air pressure sensor 24c, a magnetic sensor 24d, an acceleration sensor 24e, a grip sensor 24f, and a proximity sensor ( 24g), color sensor 24h (e.g., red (green, blue) sensor), biometric sensor 24i, temperature / humidity sensor 24j, illuminance
  • sensor module 24 may comprise, for example, an e-nose sensor, an electromyography (EMG) sensor, an electrocardiogram (EEG) sensor, an electrocardiogram (ECG) sensor, Infrared (IR) sensors, iris sensors and / or fingerprint sensors.
  • the sensor module 24 may further include a control circuit for controlling at least one or more sensors belonging therein.
  • the electronic device 20 further includes a processor configured to control the sensor module 24, as part of or separately from the processor 21, while the processor 21 is in a sleep state, The sensor module 24 can be controlled.
  • the input device 25 may include, for example, a touch panel 25a, a (digital) pen sensor 25b, a key 25c, or an ultrasonic input device 25d.
  • the touch panel 25a may use, for example, at least one of capacitive, resistive, infrared, or ultrasonic methods.
  • the touch panel 25a may further include a control circuit.
  • the touch panel 25a may further include a tactile layer to provide a tactile response to the user.
  • the (digital) pen sensor 25b may be, for example, part of a touch panel or may include a separate sheet for recognition.
  • the key 25c may include, for example, a physical button, an optical key, or a keypad.
  • the ultrasonic input device 25d may detect ultrasonic waves generated by an input tool through a microphone (for example, a microphone 28d) and check data corresponding to the detected ultrasonic waves.
  • Display 26 may include panel 26a, hologram device 26b, projector 26c, and / or control circuitry to control them.
  • the panel 26a may be implemented to be flexible, transparent, or wearable, for example.
  • the panel 26a may be configured with the touch panel 25a and one or more modules.
  • panel 26a may include a pressure sensor (or force sensor) capable of measuring the strength of the pressure on the user's touch.
  • the pressure sensor may be integrated with the touch panel 25a or may be implemented with one or more sensors separate from the touch panel 25a.
  • the hologram device 26b may show a stereoscopic image in the air by using interference of light.
  • the projector 26c may display an image by projecting light onto a screen.
  • the screen may be located inside or outside the electronic device 20.
  • the interface 27 may include, for example, an HDMI 27a, a USB 27b, an optical interface 27c, or a D-subminiature 27d. Additionally or alternatively, interface 27 may include, for example, a mobile high-definition link (MHL) interface, an SD card / multi-media card (MMC) interface, or an infrared data association (IrDA) compliant interface.
  • MHL mobile high-definition link
  • MMC multi-media card
  • IrDA infrared data association
  • the audio module 28 may bidirectionally convert, for example, sound and electrical signals.
  • the audio module 28 may process sound information input or output through, for example, a speaker 28a, a receiver 28b, an earphone 28c, a microphone 28d, or the like.
  • the camera module 29a is, for example, a device capable of capturing still images and moving images.
  • the camera module 29a may include one or more image sensors (eg, a front sensor or a rear sensor), a lens, and an image signal processor (ISP). Or flash (eg, LED or xenon lamp, etc.).
  • the power management module 29d may manage power of the electronic device 20, for example.
  • the power management module 29d may include a power management integrated circuit (PMIC), a charger IC, or a battery or fuel gauge.
  • PMIC power management integrated circuit
  • the PMIC may have a wired and / or wireless charging scheme.
  • the wireless charging method may include, for example, a magnetic resonance method, a magnetic induction method, an electromagnetic wave method, or the like, and may further include additional circuits for wireless charging, such as a coil loop, a resonance circuit, a rectifier, and the like. have.
  • the battery gauge may measure, for example, the remaining amount of the battery 29e, the voltage, the current, or the temperature during charging.
  • the battery 29e may include, for example, a rechargeable battery and / or a solar cell.
  • the indicator 29b may display a specific state of the electronic device 20 or a part thereof (for example, the processor 21), for example, a booting state, a message state, or a charging state.
  • the motor 29c may convert electrical signals into mechanical vibrations, and may generate vibrations or haptic effects.
  • the electronic device 20 may be, for example, a mobile TV supporting device capable of processing media data according to a standard such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or mediaFlo TM . : GPU).
  • DMB digital multimedia broadcasting
  • DVD digital video broadcasting
  • mediaFlo TM . : GPU mediaFlo TM .
  • Each of the components described in this document may be composed of one or more components, and the name of the corresponding component may vary according to the type of electronic device.
  • the electronic device eg, the electronic device 20
  • FIG. 2 is a diagram illustrating an electronic device according to various embodiments of the present disclosure.
  • FIG. 3 is a diagram illustrating an internal structure of an electronic device according to various embodiments of the present disclosure.
  • the electronic device 100 may include a housing 110, a rigid substrate unit 120, and a flexible connection substrate unit 130.
  • the substrate 120 may be electrically connected to each other by the connecting substrate 130 to have a closed loop cyclic connection structure.
  • the housing 110 may include a first surface 110a and a second surface 110b in a direction different from the first surface 110a, and the first surface 110a and the second surface 110b. It may have a third surface (110c) in between. In addition, an internal space along the third surface 110c may be formed between the first surface 110a and the second surface 110b, and a power supply device such as a battery may be mounted in the interior space.
  • the first surface 110a may be a bottom surface of the housing 110
  • the second surface 110b may be an upper surface of the housing 110
  • the third surface 110c may be a housing. It may be a side of 110.
  • an upper surface of the housing 110 is disposed between the second rigid substrate 122 and the third rigid substrate 123 disposed on the upper surface side of the housing 110, and the third rigid substrate 123 is removed.
  • the support housing 111 may be further provided while being spaced apart from the 2 rigid substrates 122.
  • FIG. 4 is a diagram illustrating a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • 5 is a diagram illustrating another surface of a substrate portion and a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • the substrate unit 120 may include a plurality of rigid substrates 121-123 provided in the housing 110 and stacked in the same direction.
  • Rigid substrates 121 to 123 according to an embodiment of the present invention has been described with an example of being stacked in the same direction, but is not limited to this, it is stacked with each other having a predetermined distance from each other As long as the structure, the form or shape of the stack can be changed. It may have a structure that is not parallel, and stacked so that each other is inclined to each other.
  • the substrate unit 120 may include a first rigid substrate 121, a second rigid substrate 122, and a third rigid substrate 123.
  • the first rigid substrate 121 and the third rigid substrate 123 may be disposed on the outermost side of the housing 110, for example, the bottom and the top of the housing 110.
  • the first rigid substrate 121 may be disposed on the first surface 110a of the housing 110, and at least one first module 121a may be mounted.
  • the first flexible substrate 131 is connected to one side of the first rigid substrate 121 to be connected to the second rigid substrate 122, and the third flexible substrate 133 is provided on the tile side of the first rigid substrate 121. ) May be connected to be connected to the third rigid substrate 123.
  • the second rigid substrate 122 is provided adjacent to the first rigid substrate 121, and is disposed between the first rigid substrate 121 and the third rigid substrate 123, which will be described later, to form the first rigid substrate 121.
  • One end of the second rigid substrate 122 and a tile end of the second rigid substrate 122 may be electrically connected to each of the third rigid substrate 123.
  • the second rigid substrate 122 may be stacked on the second surface 110b of the housing 110, and the second rigid substrate 122 may be different from the module 121a mounted on the first rigid substrate 121. At least one module 122a having a function may be mounted.
  • the first flexible substrate 131 is connected to the tile side of the second rigid substrate 122 to be connected to the first rigid substrate 121, and the second rigid substrate 122 is formed at one side of the second rigid substrate 122.
  • the connection may be provided to be connected to the third rigid substrate 123.
  • the third rigid substrate 123 may be disposed farthest from the first rigid substrate 121, may be provided adjacent to the second rigid substrate 122, and may be stacked spaced apart from the second rigid substrate 122. . At least one module 123a having a different function from the modules 121a and 122a provided in the first rigid substrate 121 and the second rigid substrate 122 may be mounted on the third rigid substrate 123. . The tile side of the third rigid substrate 123 may be connected to the second rigid substrate 122 and the second flexible substrate 132 so as to be connected to the second rigid substrate 122, and the third rigid substrate 123 may be provided. A ground connection pad 123b to which the third flexible substrate 133 may be connected may be provided at a predetermined position of the substrate.
  • a third flexible substrate provided in the first rigid substrate 121 may be bent to be electrically connected to the ground connection pad 123b provided in the third rigid substrate 123.
  • the connection board unit 130 may include a plurality of flexible substrates 131-133, and may be provided to electrically connect one end of the rigid substrates 121-123 to the tile end.
  • the rigid substrates 121 to 123 described below are manufactured to be electrically connected to each other by being disposed adjacent to each other at ends of each other, and then the rigid substrates 121 to 123 are face-to-face when mounted on the housing 110. As it is arranged to be stacked in the connection substrate 130 may be provided to be flexible to bend.
  • FIG. 6 is a diagram schematically illustrating stacking of layers of a substrate portion and stacking of layers of a connection substrate portion in an electronic device according to various embodiments of the present disclosure.
  • the substrate 120 and the connection substrate 130 may have a structure in which at least two layers are stacked.
  • the connection board unit 130 should be provided to be flexible so as to be bent, and the board unit 120 may be rigidly provided so that various modules may be mounted and electrically connected. Accordingly, the number of layers 139 of the connection substrate 130 may be reduced compared to the number of layers 129 of the substrate 120.
  • the connection substrate 130 may have a structure in which two layers 139 are stacked.
  • Rigid substrates 121-124 according to an embodiment of the present invention can be described as a structure in which the six layers 129 are stacked, for example, the connection substrate 130 with two layers 139. An example having a stacked structure can be described.
  • FIG. 7 is a diagram illustrating a structure in which a board unit and a connecting board unit are disposed in a housing in an electronic device according to various embodiments of the present disclosure.
  • FIG. 8 is a diagram schematically illustrating a structure in which a board unit and a connecting board unit are disposed in a housing in an electronic device according to various embodiments of the present disclosure.
  • FIG. 9 is a view schematically illustrating a connection structure of a substrate unit and a connection board unit in an electronic device according to various embodiments of the present disclosure.
  • connection substrate units 130 including the plurality of connection substrates are not adjacent to each other.
  • Electrically connecting the 121-123 may be provided to have an electrical connection structure in a closed loop shape.
  • connection substrate 130 may include a first flexible substrate 131, a second flexible substrate 132, and a third flexible substrate 133.
  • the first flexible substrate 131 may be provided between the first rigid substrate 121 and the second rigid substrate 122 provided adjacent to the first rigid substrate 121 to electrically connect them. .
  • the first flexible substrate 131 may be provided to electrically connect one side of the first rigid substrate 121 and a tile side of the second rigid substrate 122.
  • the first flexible substrate 131 may be provided to be flexible to be bent. Accordingly, the first rigid substrate 121 and the second rigid substrate 122 are disposed in a state where the first rigid substrate 121 and the second rigid substrate 122 are disposed adjacent to each other through the first flexible substrate 131.
  • the first flexible substrate 131 When laminated to the housing 110 in a face-to-face manner, the first flexible substrate 131 is bent so that the first rigid substrate 121, the first flexible substrate 131, and the second rigid substrate 122 are folded. It may be provided in a 'shape.
  • the second flexible substrate 132 may be provided between the second rigid substrate 122 and the third rigid substrate 123 provided adjacent to the second rigid substrate 122 to electrically connect them. .
  • the second flexible substrate 132 may be provided to electrically connect one side of the second rigid substrate 122 and the tile side of the third rigid substrate 123.
  • the second flexible substrate 132 may be provided to be flexible to bend.
  • the second rigid substrate 122 and the third rigid substrate 123 are face-to-face in a state in which the second rigid substrate 122 and the third rigid substrate 123 are disposed adjacent to each other through the second flexible substrate 132.
  • the second flexible substrate 132 is bent so that the second rigid substrate 122, the second flexible substrate 132, and the third rigid substrate 123 have a ' ⁇ ' shape. It may be provided as.
  • the third flexible substrate 133 is provided to electrically connect substrates which are not adjacent to each other.
  • the housing It may be provided to directly connect the substrate located at the top of the 110 and the substrate located at the bottom.
  • the third flexible substrate 133 may be provided to electrically connect the first rigid substrate 121 and the three substrates.
  • the third flexible substrate 133 may be provided to be flexible so as to be bent when the first rigid substrate 121 and the third rigid substrate 123 stacked on a face-to-face are connected.
  • the first end of the third flexible substrate 133 may be manufactured to be connected to the tile side of the first rigid substrate 121, and the first rigid substrate 121 and the first flexible substrate 131 may be formed.
  • the second rigid substrate 122, the second flexible substrate 132, and the third rigid substrate 123 are bent on the tile side of the first rigid substrate 121 in a state where the 'R' shape is arranged to be the third rigid.
  • the second end of the third flexible substrate 133 may be electrically connected to the ground connection pad 123b provided at a predetermined position of the substrate 123.
  • FIG. 10 is a view illustrating a connection structure of a third rigid substrate and a third flexible substrate in an electronic device according to various embodiments of the present disclosure.
  • a connection terminal 133a may be provided at an end portion of the third flexible substrate 133 to be electrically connected to the ground connection pad 123b.
  • the connection terminal 133a may be formed with an opening 133b that is open to concave inside the connection terminal 133a.
  • a coupling support part 133c protruding and extending in the vertical direction of the third flexible substrate 133 may be further formed around the opening 133b. That is, the engagement support 133c (see also FIGS. 4 and 5 together) may be formed in a 'T' shape around the opening 133b.
  • connection terminal 133a when the connection terminal 133a is placed on the ground connection pad 123b, by pressing the coupling support part 133c, no damage is caused to the ground connection pad or the connection terminal 133a.
  • the coupling support 133c may work in a pressurized state, thereby increasing the ease of electrical coupling.
  • connection terminal 133a When the connection terminal 133a is placed on the ground connection pad 123b, space is generated as much as the opening 133b in the ground connection pad 123b, and the reliability of the electrical connection state can be ensured during the electrical connection assembly process, for example, soldering. Will be. As described above, the connection terminal 133a and the ground connection pad 123b may be fixed while being electrically connected through soldering.
  • the substrate part 120 and the connection board part 130 of the present invention are manufactured on the same surface, and the substrates 121-123 are mutually formed according to the bending of the connection board part 130 when assembled to be mounted on the housing 110. It may be spaced apart and stacked on a face-to-face.
  • the substrate unit 120 and the connection substrate unit 130 may include a first rigid substrate 121, a first flexible substrate 131, a second rigid substrate 122, a second flexible substrate 132, and a third rigid substrate.
  • the substrate 123 and the third flexible substrate 133 may be manufactured in a line form in order.
  • the first rigid substrate 121 is disposed on the first surface 110a which is the bottom of the housing 110
  • the second rigid substrate 122 is disposed on the second surface 110b of the housing 110.
  • the first flexible substrate 131 is bent while being connected to one side of the first rigid substrate 121 and the tile side of the second rigid substrate 122 to be disposed on the third surface 110c of the housing 110.
  • the third rigid substrate 123 may be stacked on a face-to-face with the second rigid substrate 122 spaced apart from the second rigid substrate 122.
  • the second flexible substrate 132 may be bent while being connected to one side of the second rigid substrate 122 and the tile side of the third rigid substrate 123.
  • the predetermined part of one side of the first rigid substrate 121, the first flexible substrate 131, the second rigid substrate 122, and the second flexible substrate 132 are electrically connected to each other through the third flexible substrate 133.
  • the third rigid substrate 123 and the third flexible substrate 133 may have a circular connection structure in a closed loop shape.
  • FIG. 11 is a diagram illustrating another direction of the electronic device in the electronic device according to various embodiments of the present disclosure.
  • the third flexible substrate 133 may further include a fourth rigid substrate 124 having a sensing sensor.
  • the fourth rigid substrate 124 may be further provided between the third rigid substrate 123 and the first rigid substrate 121, and the fourth rigid substrate 124 may be formed through the fourth flexible substrate 134.
  • 3 may be provided to be connected to the rigid substrate 123, and the third flexible substrate 133 may be provided to electrically connect the fourth rigid substrate 124 and the first rigid substrate 121.
  • the fourth rigid substrate 124 may be located on the third surface 110c of the housing 110.
  • first flexible substrate 131, the second flexible substrate 132, and the third flexible substrate 133 are positioned to the side of the third surface 110c and the support housing 111 of the housing 110, Fixing parts 112, 113, and 114 for fixing the first flexible substrate 131, the second flexible substrate 132, and the third flexible substrate 133 to the third surface 110c of the housing 110 are provided.
  • Fixing parts 112, 113, and 114 for fixing the first flexible substrate 131, the second flexible substrate 132, and the third flexible substrate 133 to the third surface 110c of the housing 110 are provided.
  • the fixing parts 112, 113, and 114 may include a fixing surface 112, a first seating part 113, and a second seating part 114 (see FIG. 8 together).
  • the fixing surface 112 is a component provided to fix the above-mentioned third flexible substrate 133 to the third surface 110c of the housing 110.
  • the fixing surface 112 is provided to fix the sensing sensor provided at a predetermined position of the third flexible substrate 133 to fix the third flexible substrate 133 to the third surface 110c of the housing 110.
  • the fixing surface 112 may protrude inclined from the third surface 110c of the housing 110 to face the first surface 110a. When the sensor is mounted on the inclined fixed surface 112, the sensor is attached obliquely on the third surface 110c of the housing 110, so that the user moves the electronic device 100, especially the ear jack, into the user's ear.
  • the detection sensor When installed, the detection sensor may be in contact with the inside of the user's ear to detect the presence or absence of the ear jack.
  • the fixing surface 112 is disposed on the third surface 110c, but has been described with an inclination in the direction toward the first surface 110a, for example, but is not limited thereto.
  • the position, shape, structure, and the like of the fixed surface 112 may be changed or modified depending on where the electronic device 100 is worn on the user's body.
  • the first seating part 113 may include a first flexible substrate 131 connected to the first rigid substrate 121 by bending at one side and a tile side of the second rigid substrate 122 to the third surface 110c of the housing 110. It may be provided to be fixed to.
  • the first seating portion 113 forms a structure for fixing the first flexible substrate 131, for example, a space in which the first flexible substrate 131 is seated on the third surface 110c of the housing 110. It may be provided to form a locking ring protruding from each other.
  • the third surface 110c of the housing 110 may be provided in a '[]' shape.
  • the first seating part may be formed of an adhesive member between the first flexible substrate 131 and the third surface 110c of the housing 110.
  • the second seating part 114 may include a second flexible substrate 132 connected to the second rigid substrate 122 by bending at one side and a tile side of the third rigid substrate 123 to the third surface 110c of the housing 110. It may be provided to be fixed to.
  • the second seating part 114 may be provided as the third surface 110c of the support housing 111.
  • the second seating portions face each other while forming a structure for fixing the second flexible substrate 132, for example, a space in which the second flexible substrate 132 is seated on the third surface 110c of the support housing 111. It may be provided to form a protruding locking ring. For example, it may be provided in a '[]' shape on the third surface 110c of the support housing 111.
  • the second mounting part 114 may be formed of an adhesive member between the second flexible substrate 132 and the third surface 110c of the support housing 111.
  • FIG. 12 is a diagram illustrating a process of forming a third flexible substrate in an electronic device according to various embodiments of the present disclosure.
  • FIG. 13 is a view illustrating a process of assembling a substrate part and a connection board part to a housing in an electronic device according to various embodiments of the present disclosure.
  • the substrate unit 120 and the connection substrate unit 130 may include a third rigid substrate 123, a second flexible substrate 132, a second rigid substrate 122, and a second flexible substrate 132. ),
  • the first rigid substrate 121 and the third flexible substrate 133 may be arranged in a row in order.
  • the third flexible substrate 133 is formed as an extension substrate 136.
  • the extension substrate 136 extends from the third flexible substrate 133 connected to the tile side of the first rigid substrate 121, and the hole 135 and the third flexible substrate 133 having an elliptic shape at the center side thereof. It may be formed as an extension 134.
  • the third flexible substrate 133 is connected to the tile side of the first rigid substrate 121 by cutting the central portion of the hole 135.
  • the connection terminal 133a having the opening 133b of the 133 can be formed.
  • the third rigid substrate 123, the second flexible substrate 132, the second rigid substrate 122, the second flexible substrate 132, the first rigid substrate 121, and the third flexible substrate 133 may be assembled in a 'l' shape in the housing 110 implementing the microelectronic device 100.
  • the first rigid substrate 121 may be disposed on the first surface 110a of the housing 110 (S1). According to the bending of the first flexible substrate 131, the first flexible substrate 131 may be fixed to the first seating portion 113 formed on the third surface 110c of the housing 110 (S11).
  • the second rigid substrate 122 may be disposed between the housing 110 and the support housing 111 as the second surface 110b of the housing 110 (S2). According to the bending of the second flexible substrate 132, the second flexible substrate 132 may be formed on the third surface 110c of the housing 110, specifically, the second seat 114 formed on the side of the support housing 111. Can be fixed (S12). For example, the third rigid substrate 123 may be disposed on the upper surface of the support housing 111 so as to be spaced apart from the second rigid substrate 122 by the second surface 110b of the housing 110 (S3). ).
  • the first rigid substrate 121 disposed on the first surface 110a of the housing 110 and the third rigid substrate 123 disposed on the housing 110, specifically, the upper surface of the support housing 111. Is connected through the third flexible substrate 133 (S13). That is, the third flexible substrate 133 connected to the other side of the first rigid substrate 121 is bent to connect the connection terminal 133a of the third flexible substrate 133 to the ground connection pad of the third rigid substrate 123. 123b).
  • the fourth rigid substrate 124 may be attached and fixed to the fixing surface 112 as the fourth rigid substrate 124 having a sensing sensor is provided at a predetermined position of the third flexible substrate 133. (S13).
  • the position of the opening 133b of the connection terminal 133a may be seated at a predetermined position of the ground connection pad 123b through the coupling support 133c protruding around the connection terminal 133a. If the connection terminal 133a is soldered while being placed on the ground connection pad 123b, the third rigid substrate 123 may be electrically connected to the first rigid substrate 121. Therefore, the substrate unit 120 and the connection substrate unit 130 of the present invention may be assembled to have a circular connection structure in a closed loop shape. That is, the first rigid substrate 121 is connected to the third rigid substrate 123 through the first flexible substrate 131 and the third flexible substrate 133, and the second rigid substrate 122 is the first flexible substrate.
  • the first rigid substrate 121 and the third rigid substrate 123 are connected to each other through the 131 and the second flexible substrate 132, and the third rigid substrate 123 is connected to the second flexible substrate 132 and the third flexible substrate 123.
  • the flexible substrate 133 may be connected to the first rigid substrate 121 and the second rigid substrate 122 to have a closed loop electrical connection structure in which each other is electrically connected to each other.
  • the electronic device 100 may describe the ear jack as an example.
  • a plurality of substrates are connected to the housing 110 by electrically connecting rigid substrates 121-123 on which various functions are mounted, through flexible bands 131-133 that can be banded.
  • the fields 121 to 123 may be stacked to be stacked on each other, and thus, the substrates 121 to 123 having various functions may be mounted in a narrow space.
  • the flexible substrates 131-133 have a smaller number of layers than the rigid substrates 121-123, and thus, there is a lack of ground area, as well as the entire substrate member (substrate 120 and the connection substrate). 130 and the ground level of the configuration that includes the (130) is not constant, the noise of the modules 121a, 122a, 123a that can be mounted on the substrate portion 120, or degradation of antenna radiation performance may occur, As the substrates 121-123 and the substrates 131-133 are all connected to each other in a closed loop shape, in particular, the first rigid substrate 121 and the third rigid through the third flexible substrate 133. As the substrate 123 can be electrically connected to extend and reinforce the ground area, the entire ground level of the substrate member can be kept constant, thereby making it possible to stabilize the antenna radiation performance and to easily discharge noise. Have structure It will be possible.
  • the antenna emission performance and the reception sensitivity according to the presence or absence of the third flexible substrate 133 are measured in the same electronic device 100, for example, the same ear jack, the measurement may be performed as shown in Table 1 below. Accordingly, it can be seen that due to the third flexible substrate, the performance of the average total radiated power (TRP) and the total isotropic sensitivity (TIP) of the antenna are generally improved.
  • TRP average total radiated power
  • TIP total isotropic sensitivity

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Telephone Set Structure (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Selon divers modes de réalisation, la présente invention concerne un dispositif électronique qui inclut : un premier substrat rigide sur lequel est monté au moins un premier module ; un deuxième substrat rigide sur lequel est monté au moins un deuxième module ; un premier substrat flexible connectant électriquement le premier substrat rigide au deuxième substrat rigide ; un troisième substrat rigide sur lequel est monté au moins un troisième module ; et un deuxième substrat flexible connectant électriquement le deuxième substrat rigide au troisième substrat rigide. Le premier substrat rigide peut être électriquement connecté au troisième substrat rigide par un troisième substrat flexible. Le dispositif électronique susmentionné peut varier selon les modes de réalisation.
PCT/KR2017/005393 2016-07-14 2017-05-24 Dispositif électronique Ceased WO2018012730A1 (fr)

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KR1020160089479A KR102628512B1 (ko) 2016-07-14 2016-07-14 전자 장치
KR10-2016-0089479 2016-07-14

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WO2023171937A1 (fr) * 2022-03-11 2023-09-14 삼성전자 주식회사 Dispositif électronique comprenant un moteur d'entraînement

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708568A (en) * 1996-06-17 1998-01-13 Sundstrand Corporation Electronic module with low impedance ground connection using flexible circuits
US20040171914A1 (en) * 2001-06-18 2004-09-02 Dov Avni In vivo sensing device with a circuit board having rigid sections and flexible sections
KR20090078124A (ko) * 2008-01-14 2009-07-17 한국광기술원 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법
US8320133B1 (en) * 2006-12-05 2012-11-27 Raytheon Company Rigid/flexible circuit board
US20130293997A1 (en) * 2012-05-03 2013-11-07 Transtector Systems, Inc. Rigid flex electromagnetic pulse protection device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102110886B1 (ko) * 2014-04-24 2020-05-14 삼성전자주식회사 기판 탑재형 방사체를 구비한 휴대용 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708568A (en) * 1996-06-17 1998-01-13 Sundstrand Corporation Electronic module with low impedance ground connection using flexible circuits
US20040171914A1 (en) * 2001-06-18 2004-09-02 Dov Avni In vivo sensing device with a circuit board having rigid sections and flexible sections
US8320133B1 (en) * 2006-12-05 2012-11-27 Raytheon Company Rigid/flexible circuit board
KR20090078124A (ko) * 2008-01-14 2009-07-17 한국광기술원 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법
US20130293997A1 (en) * 2012-05-03 2013-11-07 Transtector Systems, Inc. Rigid flex electromagnetic pulse protection device

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