[go: up one dir, main page]

WO2018001134A1 - Procédé de traitement pour boîtier, boîtier, et dispositif électronique - Google Patents

Procédé de traitement pour boîtier, boîtier, et dispositif électronique Download PDF

Info

Publication number
WO2018001134A1
WO2018001134A1 PCT/CN2017/089030 CN2017089030W WO2018001134A1 WO 2018001134 A1 WO2018001134 A1 WO 2018001134A1 CN 2017089030 W CN2017089030 W CN 2017089030W WO 2018001134 A1 WO2018001134 A1 WO 2018001134A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
metal
casing
opening
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/089030
Other languages
English (en)
Chinese (zh)
Inventor
许海平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Publication of WO2018001134A1 publication Critical patent/WO2018001134A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present invention relates to the field of electronic device housings, and more particularly to a housing processing method, a housing, and an electronic device.
  • the electronic device generally uses a metal material as a housing, including a back panel and a side frame, and the electronic device needs to be provided with various buttons on the side frame.
  • the Chinese patent document discloses a metal electronic device housing including a middle frame for mounting electronic components such as a main board and a casing, the middle frame and the casing being an integral structure, which is made of a metal material, A through hole or a card slot for fixing electronic components of the electronic device is disposed on the middle frame and/or the housing, and the middle frame is provided with an antenna breakage for avoiding a complete loop of the metal middle frame.
  • the metal casing can usually be formed by CNC forming or sheet metal forming.
  • the CNC forming structure has high strength and good quality, but the processing is relatively complicated, resulting in long production cycle and high production cost. Therefore, the production of existing products is more inclined to cost. Low-cost, fast-growing sheet metal forming.
  • An object of the present invention is to provide a method for processing a casing which can avoid multiple positioning during the process of opening the side of the press-formed casing, resulting in a technical problem that the side opening position is difficult to process accurately.
  • Another object of the present invention is to provide a housing which is low in production cost, high in efficiency, and high in positional accuracy of side opening.
  • Still another object of the present invention is to provide an electronic device which is low in production cost, high in efficiency, and high in positional accuracy of side opening.
  • a housing processing method for molding a housing, the housing having a back panel and a side frame ringing around a periphery of the back panel, and a plurality of functional openings are disposed on the side frame Providing a metal plate having a plurality of said functional openings at a periphery, the metal plate is stamped to form the casing, and the functional opening is located on the side frame formed by folding the metal plate.
  • a housing is provided that is machined using the housing processing method described above.
  • an electronic device including the above housing is provided.
  • FIG. 1 is a schematic perspective view showing the three-dimensional structure of a metal plate after punching a functional hole according to an embodiment.
  • FIG. 2 is a schematic perspective view of the housing of the embodiment.
  • Figure 3 is a partial cross-sectional view showing the housing of still another embodiment.
  • FIG. 4 is a flow chart of a metal shell processing method according to an embodiment.
  • Figure 5 is a flow chart of the first surface treatment described in the embodiment.
  • Figure 6 is a flow chart of the second surface treatment described in the embodiment.
  • a housing processing method for molding a housing having a back panel and a side frame ringing around a peripheral portion of the back panel, and a plurality of functional openings are provided on the side frame to provide a peripheral portion
  • a metal sheet having a plurality of said functional openings is stamped and formed into a stamping manner, and the functional opening is located on the side frame formed by folding the metal sheet.
  • sheet metal stamping is usually formed by stamping and forming the overall shape of the casing, and then processing various side openings provided on the side frame.
  • an electronic device with an integrated metal casing is used, and the side openings are all passed through the CNC.
  • Machining, side hole CNC machining has some shortcomings: it needs to be machined upright, and the surrounding hole machining needs to rotate different faces to process; the positioning is prone to deviation; because the aperture is small, the CNC needs small knife processing, which is time consuming.
  • the side opening of the casing is performed before the shell is stamped and formed, which can avoid multiple positioning during the side hole drilling process of the stamped molding shell, and the technical problem that the side opening position is difficult to process accurately. .
  • the casing processed by the method has low production cost, high production efficiency, and high precision of the side opening position.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • a casing processing method is used for molding a casing, the casing having a back panel 2 and a ring disposed on the back panel 2 a side frame 3 of the circumference, on which the side frame 3 is disposed a plurality of functional openings 4, comprising: first stamping to form a metal sheet 1 having a plurality of said functional openings 4 at the periphery, and then performing a second stamping to form the sheet metal 1 to turn toward the first surface of the sheet Folded metal housing.
  • the structure and the number of the functional openings 4 are also different according to the type and model of the processed casing product.
  • all of the through holes provided in the inside of the metal sheet 1 are referred to as the function opening 4
  • the periphery is surrounded by the metal sheet 1), however, in other embodiments, the functional opening 4 may be provided in any number of notches at the edge of the metal sheet 1 depending on the specific use requirements. It may also be a combination of a notch provided at the edge of the metal sheet 1 and a through hole provided inside the metal sheet 1.
  • the function opening 4 includes a power key hole, a volume key hole, a SIM card hole, a USB hole, and a headphone hole.
  • the type of the functional opening 4 and its function are not limited to the case described in this embodiment, and any functional opening 4 that is opened on the casing by a person skilled in the art to realize different functions belongs to the protection scope of the present solution.
  • the outer shape of the metal sheet 1 is separately formed from the functional opening 4, specifically, the outer contour of the metal sheet 1 is stamped to form the outer contour and then stamped to form the function. Opening 4.
  • the functional opening 4 may be stamped to form the outline of the sheet metal 1 and then stamped.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • a housing processing method is used for molding a housing, the housing having a back panel 2 and a ring disposed on a periphery of the back panel 2 a side frame 3 on the side frame 3 is provided with a plurality of functional openings 4, which are first stamped to form a metal sheet 1 having a plurality of said functional openings 4 at the periphery, and then a second stamping is used to form the sheet metal 1 a metal shell that is folded over the first surface of the sheet.
  • a plurality of the functional openings 4 are all notches provided at the edge of the metal sheet 1.
  • the functional opening 4 includes a power keyhole, a volume keyhole, a SIM card hole, a USB hole, and a headphone hole.
  • the functional opening 4 in the embodiment is a countersunk opening, and includes a first opening portion and a second opening portion that communicate with each other, and the size of the first opening portion is larger than the second opening portion. The size of the opening.
  • the outline of the metal sheet 1 is formed by the same punching as the functional opening 4.
  • the outline of the metal sheet 1 and the functional opening 4 are formed by the same stamping, so that the positional accuracy of the functional opening 4 can be more effectively ensured, and the position on the metal sheet 1 is more precise, which can improve the mounting performance of the key.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • a housing processing method is used for molding a housing, the housing having a back panel 2 and a side frame ringing on a peripheral portion of the back panel 2 3, a plurality of functional openings are arranged on the side frame 3 4.
  • the first metal sheet 1 having a plurality of said functional openings 4 is formed by stamping for the first time, and then the metal sheet 1 is formed by a second stamping to form a metal shell whose circumference is folded toward the first surface of the sheet.
  • This embodiment is basically the same as the casing processing method of the above embodiment, and the main difference is that the embodiment further includes performing the first finishing process on the metal sheet 1, and the first finishing processing is in the pair.
  • the metal sheet 1 is subjected to stamping to form an integral metal case in which the peripheral portion is folded toward the first surface of the sheet material.
  • the first finishing process includes:
  • First surface treatment T-treating the surface of the metal sheet 1 having a plurality of openings, and etching the nano-holes on the first surface of the sheet with an acid solution to form a porous structure;
  • Sand blasting the above polished surface is sandblasted to make the polished surface have a graininess and form a certain roughness.
  • the method for processing a casing according to the embodiment further includes: performing in-mold injection molding on the stamped metal shell, and forming an internal member in the interior of the metal shell, The functional opening 4 is filled with a filling block during the injection molding process.
  • the back panel 2 of the casing may be formed in a rectangular plate-like structure, and the side frame 3 may be formed in a rectangular frame structure.
  • the "rectangular” and “cuboid” as used in the present application should be understood in a broad sense, that is, a rectangular or rectangular parallelepiped in a strict sense is not required.
  • the shape of the back panel 2 shown in FIG. 2 can be understood as a rectangular shape
  • the side frame 3 shown in FIG. 2 can be understood as a rectangular parallelepiped shape.
  • a smooth transition between adjacent two side edges of the back panel 2 is achieved.
  • the adjacent two sides of the back panel 2 can be smoothly transitioned by a circular arc.
  • the line of the casing can be made smooth, the appearance is beautiful, and the use feeling of the casing is improved.
  • a smooth transition between adjacent two side walls of the side frame 3 is achieved.
  • the adjacent two side walls of the side frame 3 can smoothly transition through a circular arc.
  • the lines of the casing can be made smoother and the appearance is more beautiful.
  • At least one functional opening 4 is provided on each side wall of the side frame 3.
  • Two function openings 4. Thereby, the distribution of the functional openings 4 can be made substantially uniform, the overall structural strength of the casing can be improved, and the appearance of the casing can be further improved.
  • the cross section of the at least one functional opening 4 is formed in a circular shape. Further, the cross section of the at least one functional opening 4 is formed in an oblong shape.
  • the structure is simple and the processing is convenient.
  • a smooth transition between the side frame 3 and the back panel 2 is achieved. Thereby, the appearance and the feeling of use of the casing can be further improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Punching Or Piercing (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)

Abstract

L'invention concerne un procédé de traitement pour boîtier, qui est utilisé pour former un boîtier. Le boîtier comprend une plaque arrière (2) et un encadrement latéral (3) disposé autour de la périphérie de la plaque arrière (2). Une pluralité d'ouvertures fonctionnelles (4) est pratiquée dans l'encadrement latéral (3). Le procédé comporte les étapes consistant à: mettre en place une feuille métallique (1) dotée d'une pluralité d'ouvertures fonctionnelles (4) à sa périphérie; et effectuer une mis en forme par emboutissage sur la feuille métallique (1) pour former un boîtier, de telle façon que les ouvertures fonctionnelles (4) soient positionnées au niveau d'un encadrement latéral (3) formé suite à la déformation de la feuille métallique (1).
PCT/CN2017/089030 2016-06-27 2017-06-19 Procédé de traitement pour boîtier, boîtier, et dispositif électronique Ceased WO2018001134A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610499149.8 2016-06-27
CN201610499149.8A CN106078097B (zh) 2016-06-27 2016-06-27 壳体加工方法及壳体

Publications (1)

Publication Number Publication Date
WO2018001134A1 true WO2018001134A1 (fr) 2018-01-04

Family

ID=57213937

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/089030 Ceased WO2018001134A1 (fr) 2016-06-27 2017-06-19 Procédé de traitement pour boîtier, boîtier, et dispositif électronique

Country Status (2)

Country Link
CN (1) CN106078097B (fr)
WO (1) WO2018001134A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114131296A (zh) * 2021-12-06 2022-03-04 惠州深赛尔化工有限公司 一种高强耐腐蚀工业用品储藏罐的加工工艺
CN114433720A (zh) * 2022-01-19 2022-05-06 惠州市恒志电子科技有限公司 一种铁框产品生产工艺

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106078097B (zh) * 2016-06-27 2018-05-25 广东欧珀移动通信有限公司 壳体加工方法及壳体
CN106736304B (zh) * 2017-01-25 2019-07-16 Oppo广东移动通信有限公司 金属壳体加工工艺、金属壳体及电子设备
CN110249716B (zh) * 2017-02-16 2020-10-16 华为技术有限公司 壳体制造方法、具有u型天线的壳体及终端
CN106878508A (zh) * 2017-03-29 2017-06-20 深圳天珑无线科技有限公司 壳体及其制备方法、电子装置
CN106964664B (zh) * 2017-05-09 2019-05-07 Oppo广东移动通信有限公司 壳体加工工艺、壳体及电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070034825A (ko) * 2005-09-26 2007-03-29 주식회사 대아테크 휴대폰 단말기의 쉴드캔을 프레스 공정으로 제조하는 방법
CN202339864U (zh) * 2011-11-18 2012-07-18 汉王科技股份有限公司 一种电子设备的按键装配结构
CN104468885A (zh) * 2014-11-18 2015-03-25 广东欧珀移动通信有限公司 手机外壳及其制备方法
CN104551562A (zh) * 2014-12-16 2015-04-29 广东欧珀移动通信有限公司 一种金属中框手机壳体结构的加工方法
CN104607884A (zh) * 2015-02-13 2015-05-13 广东欧珀移动通信有限公司 具有金属光泽的手机壳加工工艺
CN104850188A (zh) * 2015-06-04 2015-08-19 上海华勤通讯技术有限公司 金属中框及其制造方法、手持终端设备及其制造方法
KR101618098B1 (ko) * 2015-12-16 2016-05-18 에스 티 (주) 단면 h형의 압출에 의한 휴대폰용 메탈케이스 및 그 제조방법
CN106078097A (zh) * 2016-06-27 2016-11-09 广东欧珀移动通信有限公司 壳体加工方法及壳体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2419651A1 (fr) * 1978-03-07 1979-10-05 Telemecanique Electrique Boitier metallique en particulier pour appareillage electrique
FR2428372A1 (fr) * 1978-06-09 1980-01-04 Merlin Gerin Coffret d'appareillage en tole pliee
CN1666841A (zh) * 2004-03-10 2005-09-14 奇菱科技股份有限公司 用于平面显示器的金属外框的制造方法
US9104066B2 (en) * 2005-08-25 2015-08-11 Nec Corporation Portable device with display unit with particular metal structure and injection molded casing
TWI317307B (en) * 2007-11-07 2009-11-21 Ichia Tech Inc Method for manufacturing metallic panel having ripple luster
US9602914B2 (en) * 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
CN102189385B (zh) * 2011-05-19 2014-06-04 戴护民 掌上终端外观件复合制造工艺及其产品
CN102857597A (zh) * 2012-09-07 2013-01-02 昆山铭佳利电子制品有限公司 一种冲压手机外壳

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070034825A (ko) * 2005-09-26 2007-03-29 주식회사 대아테크 휴대폰 단말기의 쉴드캔을 프레스 공정으로 제조하는 방법
CN202339864U (zh) * 2011-11-18 2012-07-18 汉王科技股份有限公司 一种电子设备的按键装配结构
CN104468885A (zh) * 2014-11-18 2015-03-25 广东欧珀移动通信有限公司 手机外壳及其制备方法
CN104551562A (zh) * 2014-12-16 2015-04-29 广东欧珀移动通信有限公司 一种金属中框手机壳体结构的加工方法
CN104607884A (zh) * 2015-02-13 2015-05-13 广东欧珀移动通信有限公司 具有金属光泽的手机壳加工工艺
CN104850188A (zh) * 2015-06-04 2015-08-19 上海华勤通讯技术有限公司 金属中框及其制造方法、手持终端设备及其制造方法
KR101618098B1 (ko) * 2015-12-16 2016-05-18 에스 티 (주) 단면 h형의 압출에 의한 휴대폰용 메탈케이스 및 그 제조방법
CN106078097A (zh) * 2016-06-27 2016-11-09 广东欧珀移动通信有限公司 壳体加工方法及壳体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114131296A (zh) * 2021-12-06 2022-03-04 惠州深赛尔化工有限公司 一种高强耐腐蚀工业用品储藏罐的加工工艺
CN114433720A (zh) * 2022-01-19 2022-05-06 惠州市恒志电子科技有限公司 一种铁框产品生产工艺

Also Published As

Publication number Publication date
CN106078097B (zh) 2018-05-25
CN106078097A (zh) 2016-11-09

Similar Documents

Publication Publication Date Title
WO2018001134A1 (fr) Procédé de traitement pour boîtier, boîtier, et dispositif électronique
CN105657101B (zh) 一种壳体的净空区域的加工方法、壳体和移动终端
CN104551562B (zh) 一种金属中框手机壳体结构的加工方法
CN108055376B (zh) 一种手机金属底壳的加工方法和相关产品
US10931800B2 (en) Method for manufacturing housing and mobile terminal
WO2018033053A1 (fr) Boîtier, procédé de fabrication de boîtier, et terminal mobile
CN105108966A (zh) 壳体制造方法、壳体及电子装置
CN110856384B (zh) 电子设备壳体及其制备方法和电子设备
TWI606775B (zh) 電子裝置及其製作方法
CN108900658A (zh) 壳体、电子装置和壳体的制造方法
CN105657094A (zh) 移动终端
CN205610699U (zh) 壳体和移动终端
CN205945836U (zh) 一种壳体和移动终端
TWI639373B (zh) 一種殼體的淨空區域的加工方法、殼體和移動終端
CN110640397A (zh) 操控面板制作方法、操控面板以及电子设备
CN107530841A (zh) 具有侧面凸起的壳体的加工方法和模具
CN203675428U (zh) 一种无缺口半蚀刻钢片及其联版
CN106102372A (zh) 一种壳体的净空区域的加工方法、壳体和移动终端
JP7220261B1 (ja) カバー部材の製造方法及び電子機器
KR102050588B1 (ko) 밴딩과 캠형금형을 이용한 가공으로 형성되는 휴대폰 메탈 케이스의 제조방법
CN106101310A (zh) 一种壳体的净空区域的加工方法、壳体和移动终端
CN210297785U (zh) 电子设备壳体和电子设备
CN111003929B (zh) 热弯模具、壳体、壳体组件、电子设备及壳体的制造方法
CN209218148U (zh) 手机
CN109940342A (zh) 一种设备金属外壳的成型方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17819131

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17819131

Country of ref document: EP

Kind code of ref document: A1